风华贴片电容全系列规格书
FENGHUA风华规格书
广东风华高新科技股份有限公司GUANGDONG FENGHUA ADV ANCED TECHNOLOGY HOLDING CO.，LTD.承认书APPROV AL SHEET客户名称:CUSTOMER品名：常规厚膜片式固定电阻器PARTNAME规格版本号VERSION日期DATE制造客户APPROV AL APPROV AL 拟制审核确认检验审核批准FENGHUAFENG HUA ADV ANCED TECHNOLOGY (HOLDING) CO., LTD序号 No 目 录TABLE OF CONTENTS1.0 概述Summary2.0 结构及尺寸Structure And Dimensions3.0 型号规格表示办法How To Order4.0 电气性能Performance Specification5.0 可靠性Reliability Data6.0 包装Package7.0 环保情况说明 Environmental Protection Statement 8.0 推荐使用的焊接曲线Recommended soldering profile 9.0 使用注意事项Precautions For UseRC/RS□□□□1.0概述Summary片式电阻器主要生产的型号包括01005、0201、0402、0603、0805、1206、1210、2010、2512。
其特点是：The dimension type for chip resistor including01005、 0201、0402、0603、0805、1206、1210、2010、2512, and the features are as below:*体积小、重量轻miniature and light weight*电性能稳定，可靠性高 stable electrical capability and high reliability *机械强度高、高频特性优越superior mechanical and frequency*装配成本低，并与自动贴装设备匹配low assembly cost, suit for automatic SMT *适应再流焊与波峰焊suit for re-flow and wave flow soldering .*符合ROHS指令要求Compliant with ROHS Directive*符合无卤素要求Compliant with halogen free requirement*禁止使用SS-00259中规定的1级环境管理物质*SONY指定原材料只能从绿色伙伴认定供应商处采购产品广泛应用于计算机、通讯、工业自动化、航天航空、军事、数字电视、数字音响及消费类电子等领域。
车规级贴片电阻AC系列风华原厂规格书
High Temperature Exposure (Storage)
0.5% 1% R (1.0%R 0.05 ) 2% 5% 10% R (2.0%R 0.05 )
Temperature Cycling
No mechanical damage No mechanical damage 0.5% 1% R 50 m (J ) R (0.5%R 0.05 ) R 20 m (G ) 2% 5% 10% R 10 m (F ) R (1.0%R 0.05 )
;
Biased Humidity
No mechanical damage R (3.0%R 0.05 )
No mechanical 85 85% 10% ( ) damage 1000 R 50 m (J ) 85 /85%RH. 1000 hours, Apply 10% of operating power R 20 m (G ) R 10 m (F ) (current) or limiting element voltage whichever is lower.
2% 5% 10% 10m
C
Tape & Reel
Chip No Marking Jumper
F
1/4W
06
1206
103 =10K (E-24) 1003=100K (E-96) 1R0 =1.0 (E-24) 000=0
20m 50m
Case
J
58
【南京南山—领先的片式无源器件整合供应商】
Ratings
70
Type
70 Rated Power at 70 (W)
1/16
1/10 1/8 1/ 4
风华贴片电阻规格书
常规厚膜片式固定电阻器GENERAL CHIP FIXED RESISTOR特长 Features体积小重量轻Miniature and light weight.适应再流焊与波峰焊Suit for reflow and wave flow solder.电性能稳定可靠性高Stable electrical capability, high reliability.装配成本低并与自动Low assembly cost, suit for automatic SMT装贴设备匹配equipment.机械强度高高频特性优越Superior mechanical and frequencycharacteristics.符合RoHS指令要求According with RoHS standard品名构成 Type Designation例Example200ppm/400ppm/200ppm/400ppm/100ppm/0603080512061210181220102512250ppm/Resistance Value Code三位数E-24系列前两位表示有效数字第三位表示有效数字后零的个数Three digits (E-24series): The first two digits are significant figuresand the third one denotes number of zeros.四位数E-96系列前三位表示有效数字第四位表示有效数字后零的个数Four digits (E-96series):The first three digits are significantExample103=10K E-241003=100K E-961R0=1.00.5%1%2%5%10%结构及规格尺寸Construction and dimension单位Unit: mm 型号Type L W t a b 0201 0.600.05 0.300.05 0.230.05 0.100.05 0.150.05 0402 1.000.10 0.500.10 0.300.10 0.200.10 0.250.10 0603 1.600.15 0.800.15 0.400.10 0.300.20 0.300.20 0805 2.000.20 1.250.15 0.500.10 0.400.20 0.400.20 1206 3.200.20 1.600.15 0.550.10 0.500.20 0.500.20 1210 3.200.20 2.500.20 0.550.10 0.500.20 0.500.20 1812 4.500.20 3.200.20 0.550.10 0.500.20 0.500.20 2010 5.000.20 2.500.20 0.550.10 0.600.20 0.600.20 2512 6.400.20 3.200.20 0.550.10 0.600.20 0.600.20产品外观Appearance1.电阻器表面二次玻璃体保护膜覆盖完好且难以脱落,表面平整The surface of resistor is covered with Protective Coating which hard to fade, and the surface of coating should avoid unevenness.2.电阻器引出端电极覆盖均匀镀层较难脱落且平整无裂痕针孔变色The terminal part is covered equable , the plating is hard to fade, and should avoid unevenness, flaw, pinhole and discoloration.3.电阻器芯片无裂痕标志可辨With a clear mark , the resistor body is crack-free.参考标准 Reference StandardGB/T 5729-2003GB/T 9546-1995JIS C 5223-1995JIS C 5201-1998JIS C 5202-1990负荷下降曲线Derating Curve755025使用温度范围OperatingTemperatureRange-55125环境温度Ambient temperature ()当电阻使用的环境温度超过70时其额定负荷(额定电压)按上述曲线下降For resistors operated in ambient over 70,rated load (power rating) shall be derated in accordance with the above figure.额定值 Ratings项目 Item 0201 0402 06030805 1206 1210 1812 20102512常规功率系列Normal PowerSeries1/20W 1/16W1/16W1/10W1/8W 1/4W 1/2W 1/2W1W 额定功率Power Rating提升功率系列Upgraded PowerSeries/ /1/10W1/8W1/4W1/3W/ 3/4W/最大工作电压VMax.Working Voltage25 50 50 150200 200 200 200 200最大过负荷电压VMax.Overload Voltage50 100 100 300400 400 400 400 400电阻温度系数Resistance TemperatureCoefficient10R 1M:200ppm/1R<10,1M<R10M:400ppm/10R1M:100ppm/1R<10,1M<R10M:250ppm/阻值范围Resistance Range1~10ME-24E-96系列阻值误差精度Resistance Tolerance5%10%1~10M: 1%2%5%10%10~1M:0.5%1~10M: 1%2%5%10%10~1M:0.5%1% 2% 5%10% 使用温度范围Operating Temperature Range-55~+125额定温度Rated Temperature70注额定电压=额定功率标称电阻值或最大工作电压两者中的较小值Note Rated Voltage=Power Rating Resistance Value or Max. Working Voltage , whichever is lower.特性 Characteristics项目Item标准Specifications测试方法JIS C 5202标准Test Methods (JIS C 5202)端头强度Bending Strength无可见损伤No mechanical damageR 1.0%R+0.05弯曲速度(Speed):1mm/s弯曲距离(Bending Distance):0201040206030805120612103mm1812201025121mm电阻温度系数T.C.R在规定值内within specified T.C.R测定范围-55~+125Measure between -55~+125温度循环TemperatureCycling无可见损伤No mechanical damageR 1.0%R+0.05-5530分钟~常温5分钟~12530分钟5个循环-5530min~normal temperature5min~12530min 5 cycles短时间过负载Short TimeOverload无可见损伤No mechanical damageR 2.0%R+0.052.5倍额定电压或最大过负荷电压取最小者保持5秒2.5Rated voltage or Max. Overload Voltagewhichever is lower for 5 seconds续上表稳态湿热Steady state humidity无可见损伤No mechanical damage R 3.0%R+0.1 40290~95RH 1000小时 402 90~95RH 1000h70耐久性 Load Life无可见损伤No mechanical damageR 3.0%R+0.17021000小时额定电压通1.5小时/断0.5小时7021000hRated voltage 1.5h on/0.5h off上限类别温度耐久性 Endurance atupper temperature 无可见损伤No mechanical damageR 3.0%R+0.11252 1000h 耐溶剂性Resistance toSolvent无可见损伤 No mechanical damage R 1.0%R+0.05 浸入三氯乙烯 10h 1hDip in chloroethylene for 10h 1h .绝缘电阻Insulation Resistance1000M Min在电极与基片间施加100V 直流电压,保持1分钟,然后测绝缘电阻值.Apply DC 100V between substrate and terminationfor 1 minute, then check insulation resistance .耐焊接热 Resistance toSoldering Heat无可见损伤No mechanical damageR 1.0%R+0.052605 10s 1s 可焊性Solderability 可焊面积95% 95% Cover Min2355 2s 0.5s 附着力Adhesion 外观无可见损伤 No mechanical damage 施加力5N 10s 1s Applying 5N 10s 1s包装 Packaging编带包装 Tape and reel * 纸带编带 Paper taping 020104020603080512061210单位unit: mm 型号Type A B W F E 0201 0.700.1 0.400.1 8.00.20 3.50.05 1.750.10402 1.200.1 0.700.1 8.00.20 3.50.05 1.750.10603 1.850.1 1.100.1 8.00.20 3.50.05 1.750.10805 2.350.1 1.650.1 8.00.20 3.50.05 1.750.11206 3.500.2 1.900.2 8.00.20 3.50.05 1.750.11210 3.500.2 2.800.2 8.00.20 3.50.05 1.750.1单位unit: mm 型号Type P P0 P1 ФD0 T 0201 2.00.05 4.00.1 2.00.05 1.50.1 0.5Max0402 2.00.05 4.00.1 2.00.05 1.50.1 0.6Max0603 4.00.1 4.00.1 2.00.05 1.50.1 0.600.10805 4.00.1 4.00.1 2.00.05 1.50.1 0.750.11206 4.00.1 4.00.1 2.00.05 1.50.1 0.750.11210 4.00.1 4.00.1 2.00.05 1.50.1 0.750.1*塑料带编带 Embossed taping单位unit: mm型号Type A0 B0WFEt 1812 4.800.10 3.400.10 12.000.10 5.500.10 1.750.10 0.250.05 2010 5.450.10 2.770.10 12.000.10 5.500.10 1.750.10 0.240.05 25126.730.10 3.400.10 12.000.10 5.500.10 1.750.10 0.240.05单位unit: mm型号Type PP0P1 ФD0ФD1K0 1812 4.000.10 4.000.10 2.000.05 1.550.10 1.500.10 1.000.10 2010 4.000.10 4.000.10 2.000.05 1.50+0.10/-0 1.500.10 0.840.10 25124.000.10 4.000.10 2.000.051.50+0.10/-0 1.500.100.810.10* 卷盘 Reel单位unit: mm型号Type MWTABCD0201 0402 0603 0805 1206 1210 178 2.09.5 1.012.5 1.52.0 0.513.0 0.521.0 0.558.0 2.01812 2010 2512178 2.013.0 0.515.5 1.52.0 0.513.0 0.521.0 0.557.0 2.0*塑料盒包装Bulk case单位unit:mm包装数量 Packaging quantity包装方法Packagingstyle编带Tape and reel塑料盒Bulk case塑料袋散装Bulk型号Type 020104020603080512061210181220102512020104020603 0805 12061210201018122512020104020603080512061210181220102512数量PCSQuantity10000 5000 4000 50000 25000 10000 5000 1500 1000 50000 10000 4000。
风华贴片排容规格书(Carray)
Outside Dimension
P E W L L P E
T
W
T
Type Metric British expression expression 0805 two elements 2.00 0.20 1.25
Dimension L 0.20 W
mm T 0.10 WB 0.5
0.5PF 5PF 10PF 15PF 20PF 22PF 33PF 47PF 100PF 150PF 220PF 330PF 470PF 1000PF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 22nF 33nF 47nF 68nF 100nF 220nF
119
【 南京南山半导体有限公司 — 贴片电阻选型资料】
Item Size
0502 4 COG X7R Y5V
COG
0504 X7R
2 Y5V
Rated 16V 25V 50V 16V 25V 50V 16V 25V 50V Volatage Capacitance 0.5PF 5PF 10PF 15PF 20PF 22PF 33PF 47PF 100PF 150PF 220PF 330PF 470PF 1000PF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 22nF 33nF 47nF 68nF 100nF 220nF
P
E W
P
E
T
T
W L
L
mm L
0805 0805 1206 2.00 2.00 3.20 0.20 0.20 0.30 1.25 1.00 1.25 1.00 1.60 1.00
W
0.20 0.10 0.20 0.10 0.20 0.10 0.80 0.80 0.80
风华FHD56(SOT-23)贴片式开关二极管规格书
ఎਈऔ!Switching DiodeSwitching Diode ఎਈऔFHD561DESCRIPTION & FEATURES 概述及特點 SOT-23Low forward voltage 低正向壓降Fast reverse recovery time 快恢復時間Ultra High Speed Switching Application 超高速開關應用PIN ASSIGNMENT 引腳說明PIN NUMBER 引腳序號PIN NAME 管腳符號 SOT-23 FUNCTION 功能 C 1 Cathode C 2 CathodeA 3 Anode MAXIMUM RATINGS(T a =25℃) 最大額定值CHARACTERISTIC 特性參數 Symbol 符號 Rating 額定值 Unit 單位 Continuous Reverse Voltage 連續反向電壓 V R 70 Vdc Peak Forward Current 正向峰值電流 I F 200 mAdcPeak Forward Surge Current 正向最大浪湧電流 I FM(surge) 500 mAdcTHERMAL CHARACTERISTICS 熱特性CHARACTERISTIC 特性參數 Symbol 符號Max 最大值 Unit 單位Total Device Dissipation FR-5 Board(1) T A =25℃ PD 225 mW Total Device Dissipation Alumina Substrate,(2) T A =25℃總耗散功率 氧化鋁襯底P D 300 mWJunction and Storage Temperature 結溫和儲存溫度T J ,T stg 150， -55 ~150℃ 1. FR-5=1.0×0.75×0.062in, printed-circuit board.2. Alumina=0.4×0.3×0.024in, 99.5%alumina DEVICE MARKING 打標 FHD56=A1ELECTRICAL CHARACTERISTICS 電特性(T A =25℃ unless otherwise noted 如無特殊說明，溫度為25℃)Characteristic 特性參數Symbol 符號 Test Condition測試條件Min 最小值Type 典型值 Max 最大值Unit單位V R =70Vdc — — 2.5 V R =70Vdc,T j =150℃ — — 50 Reverse Voltage LeakageCurrent 反向漏電流 I R V R =25Vdc,T j =150℃— — 30 µA Reverse Breakdown Voltage反向擊穿電壓V (BR)I BR =100μAdc 70 — — VdcI F =1mAdc — — 715 I F =10mAdc— — 855 I F =50mAdc — — 1000 Forward Voltage 正向電壓 V FI F =150mAdc— — 1250 mV Diode Capacitance 電容 C D V R =0,f=1.0MHz — — 2.0pFReverse Recovery Time 反向恢復時間 t rrI F =I R =10mAdc,R L =100Ω——6.0 nS风华直接授权代理／片式无源器件整合供应商 【南京南山】。
三星国巨、风华高科贴片电容型号对照表 选型替代必备
1 2 3 4 5 6 7
1、尺寸
2、介质种类
3、标称电容量（PF）
4、误差级别
5、工作电压
6、端头类别
7、包装方式
型号
英寸
毫米
代码
介质材料
表示方法
实际值
代码
误差
表示方法
实际电压
标记
端头材料
标记
包装
0402
0.04*0.02
1.00*0.5
CG
多层陶瓷贴片电容2尺寸介质种类4标称电容量pf5误差级别6工作电压7厚度端头类别型号英寸毫米代码介质材料表示方实际值代码误差表示方尺寸mm标记端头材040200400210005cogp2hr2hs2ht2hu2js2l1001010006030060031608101101010508050080052001251021010208090650851001206012006321616v25v35v50vx5rx7rx7sy5vx6s10208020100v200v250v350v500v630v1000v2000v3000v110125160200250320115115125135180250125国巨yageo电容多层片式陶瓷电容cc1尺寸2误差精度3包装形式4实际电压值5标称电容量型号英制型号公制代码误差表示方法实际值代码电压代码实际值0201060301pf025pf05pf12516v100101000402100525v101101010603160850v1021010208052012吸塑卷盘13inch12063216散装1210322518124532
P
10V
8
9
A
C
D
贴片电容型对照表三星国巨风华选型替代必备
风华高科电容多层片式陶瓷电容0805 CG 104 J 500 N T1 2 3 4 5 6 71、尺寸2、介质种类3、标称电容量（PF）4、误差级别5、工作电压6、端头类别7、包装方式型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记端头材料标记包装0402 0.04*0.02 1.00*0.5 CG COG和NPO 100 10*100J ±5% 6R3 6.3V S 纯银T 编带0603 0.06*0.03 1.6*0.8 101 10*101G ±2% 100 10V C 纯铜 B 散装0805 0.08*0.05 2.00*1.25 102 10*102 C ±0.25PF 250 25V N 三层电镀1206 0.12*0.06 3.2*1.6 500 50V三星电容多层片式陶瓷电容CL 10 C 101 J B 8 N N N C1 2 3 4 5 6 7 8 9 10 11CL表示：多层陶瓷贴片电容2、尺寸3介质种类4、标称电容量（PF）5、误差级别6、工作电压7、厚度8端头类别型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记尺寸(mm)标记端头材料0402 0.04*0.02 1.00*0.5 CPRSTUL COGP2HR2HS2HT2HU2JS2L100 10*100 J ±5% R 4V 3 0.3 N 三层电镀0603 0.06*0.03 1.6*0.8 101 10*101 G ±2% Q 6.3V 4 0.50805 0.08*0.05 2.00*1.25 102 10*102 C ±0.25PF P 10V 89ACD0.8 0.9 0.650.851.001206 0.12*0.06 3.2*1.6 OALB 16V 25V 35V 50VAB Y F X X5RX7RX7SY5VX6SKMZ±10%±20%+80/-20%CDEFGHIJK100V200V250V350V500V630V1000V2000V3000V国巨（YAGEO）电容多层片式陶瓷电容CC ×××× × ×NPO ×BN ×××1 2 3 4 51、尺寸2、误差精度3、包装形式4、实际电压值5、标称电容量型号英制型号公制代码误差表示方法实际值代码电压代码实际值0201 0603 BCDFGJ±0.1PF±0.25PF±0.5PF±1%±2%±5%R 纸卷盘7inch 7 16V 100 10*1000402 1005 K 吸塑卷盘7inch 8 25V 101 10*101 0603 1608 P 纸卷盘13inch 9 50V 102 10*102 0805 2012 F 吸塑卷盘13inch1206 3216 C 散装1210 32251812 4532TDK贴片电容型号TDK贴片电容的参数识别C 2012 X7R 1H 104 K T系列名称体积材料电压容量误差包装0603=0201 CH 0J=6.3V C=0.25 T=卷带1005=0402 COG 1A=10V D=0.5 B=袋装1608=0603 JB 1C=16V J=5%2012=0805 JF 1E=25V K=10%3216=1206 X7R 1H=50V M=20%3225=1210 X5R 2A=100V Z=+80-20%4532=1812 Y5V 2E=250V5650=2220 2J=630V4520=1808 3A=1KV3D=2KV3F=3KV。
风华通用型COG贴片电容器规格书_nscn
风华直接授权代理／片式无源器件整合供应商 【南京南山】
风华直接授权代理／片式无源器件整合供应商 【南京南山】
风华直接授权代理／片式无源器件整合供应商 【南京南山】
风华直接授权代理／片式无源器件整合供应商 【南京南山】
风华直接授权代理／片式无源器件整合供应商 【南京南山】
风华直接授权代理／片式无源器件整合供应商 【南京南山】
风华直接授权代理／片式无源器件整合供应商 【南京南山】
风华直接授权代理／片式无源器件整合供应商 【南京南山】
风华直接授权代理／片式无源器件整合供应商 【南京南山】
风华直接授权代理／片式无源器件整合供应商 【南京南山】
。
1nF贴片电容0603CG102J500NT《风华电容样品单》
1nF贴片电容0603CG102J500NT《风华电容样品单》【南京南山—领先的片式无源器件整合供应商】声明：2、本规格书没有足够的空间说明详细电性能参数，仅列明了标准规格，在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。
第1页共3页【南京南山—领先的片式无源器件整合供应商】|通用型贴片电容特性曲线C0G贴片电容温度系数图某7R贴片电容温度系数图Y5V贴片电容温度系数图Z5U贴片电容温度系数图贴片电容偏压特性图贴片电容器老化特性图贴片电容交流特性图第2【南京南山—领先的片式无源器件整合供应商】贴片电感样品申请单总机：技术支持：客服：传真：电邮：姓名：联络人手机：电邮：职务：□技术□采购□其他传真：网址：□生产型企业□贸易商元器件名称型号及封装申请数量备注预计生产情况预计小批量生产日期：规模生产日期：样品申请日期：样品申请流程1、请详细、全面、真实填写上列各项。
表格不够填写，可自行复制。
4、收到样品申请单并经审核通过后，南京库有现货2个工作日内发出；如需订货，交期3-4周，非常规品顺延1-2周。
5、样品免费，运费到付(一般选择顺丰快递)；样品数量：单个型号5～20pc，或根据BOM表清单按2～5套提供。
6、说明：接单后，样品小组将努力跟进，但由于原厂生产等环节存有不确定因素，我们无法保证样品数量、型号完全符合要求，也不承诺一定按期交出。
跟进记录□已中止进行□已建议生产□已发送样品/日期□客户已签收/日期□中止原因描述：第3页共3页。
风华贴片电容包形式与最小包装数量
※包装数量 Packing Quantity包装形式和数量 ( PACKAGE STYLE & QUANTITY) unit: pcs 尺寸 (SIZE) 纸带卷盘（PT ）胶带卷盘（ET ）塑料盒散装（BC ）一般散装（BP ）0402 10000 ------ 20000 5000 0603 4000 ------ 15000 5000 0805 4000 3000 10000 5000 1206 4000 T ≤1.35mm 3000 T ＞1.35mm 2000 5000 5000 1210 ------- T ≤1.80mm 2000 T ＞1.80mm 1000------- 2000 1410 ------- 2000 ------- ------- 1808 ------- 2000 ------- 2000 1812 --------T ≤1.85mm 1000 T ＞1.85mm 500-------20001825、2220、2025、2225、3035--------500-------500注意：包装的形式和数量可根据客户的要求来定。
Note ：We can choose packing style and quantity can be according to the customer’s requirement.●外包装Outer packing小包装The first package 大包装The second packageQuantity: 5 reels (Max 25000pcs) Quantity: 12 cases (Max 300000pcs) 数量： 5卷（25000pcs 最多） 数量：12盒（最多300000pcs ）贴片电容包装 MLCC PACKAGE●纸带卷盘结构 PAPER TAPING※0402纸带编带尺寸大小Dimensions of paper taping for 0402 type代号CodeW1 L1 D C B P1 P2 P0 d t 04020.65± 0.10 1.15± 0.10 8.00± 0.10 3.50± 0.05 1.75±0.102.00± 0.052.00±0.054.00±0.101.50 -0/+0.100.80Below※适合‘0603，0805，1206’常规尺寸产品的纸带尺寸 Dimensions of paper taping for 0603，0805，1206 types. 纸带运行方向面胶传送带Chip hole(Pocket) 芯片孔送带孔Feeding hole注意：表示此处对尺寸的要求非常精确。
风华中高压贴片电容规格书
MULTILAYER CHIP CERAMIC CAPACITOR(:)DC Medium-voltage MLCCDC medium-voltage MLCC has good high-voltage reliability,it is made in special design that based on the MLCC technology and equipments.It is suitable for surface-mounting ,can improve the properties of circuits.New monolithic structureThe size of the capacitor is small,yet has high electrostatic capacitance,can operate at high-voltage levels.Has good solderability.Technology Parameter (refer to the picture below):DC-DC converter.The circuit filter and vibration bell of telephone,electrograph and modem.Snubber circuit for switching power supply.FeaturesApplicationsProduct Part Number Expression1206CG100J202NTWMULTILAYER CHIP CERAMIC CAPACITORCapacitance RangeOutside DimensionWMULTILAYER CHIP CERAMIC CAPACITORMULTILAYER CHIP CERAMIC CAPACITORMULTILAYER CHIP CERAMIC CAPACITOR【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORX7R 1808 (V)10018122225200 200 200 5001000 2000 3000 4000 100 500 1000 2000 3000 4000 100 500 1000 2000 3000 4000 5000 /250 /250 /250100PF 150PF 330PF 470PF 680PF 1000PF 1nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 120nF 150nF 220nF 270nF 330nF 470nF 680nF 1 F 2.2 F 3.3 F 10 F 22 F75【 南京南山半导体有限公司 — 贴片电容选型资料】ItemX7R Medium-voltage MLCCDielectric 1808 1812 2225 Size Rated 100 200 5001000 2000 3000 4000 100 200 500 1000 2000 3000 4000 100 200 500 1000 2000 3000 4000 5000 /250 /250 Volatage(V) /250 Capacitance 100PF 150PF 330PF 470PF 680PF 1000PF 1nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 120nF 150nF 220nF 270nF 330nF 470nF 680nF 1 F 2.2 F 3.3. F 10 F 22 F76【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORY5V 0603 (V) 100 100 0805 200 250 100 1206 200 250 100 1210 200 250 100 1812 200 250 100 2225 200 2501000PF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF 1 F 2.2 3.3 10 F F F77【 南京南山半导体有限公司 — 贴片电容选型资料】ItemY5V Medium-voltage MLCC 1210 100 200 250 100 1812 200 250 100 2225 200 250Dielectric 0603 0508 1206 Size Rated Volatage(V) 100 100 200 250 100 200 250 Capacitance 1000PF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF 1 2.2 3.3 10 F F F F78【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORCOG1-551251. 2. 3. 2 4. , , , , , 105.3 4 :HP4278A 1. 2. 5 (D.F.) 3. HP4284 25 5 :30% 75% 1.0 0.2V C<1000PF,1.0 0.1MHz; C 1000PF,1.0 0.1KHZ :10( :SF2511) >500V6I.R. 500V: , 60 5>1 5 7 >1 2 >1 21000V 1000V 2000V 2000V50mA 50mA 10mA 150+0/-10 60 55S 5S 5S824 2 -55 125 25975235 5 5 2 0.5 150+0/-10 5% 0.5PF, 10 1 D.F. 24 2 265 5 24 2 25 2.5mm/ : 25 2.5mm/ 60 524510I.R.1 2100 170120 2001 179【 南京南山半导体有限公司 — 贴片电容选型资料】Middle and high Voltage COG MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -55 Standard 125 Test Method21.Good ceramic body color continuity. 2.The chips have no visual damages and must be very smooth. 3.No exposed innerelectrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. Within the specified dimensions Within the specified toleranceCr 5PF 0.56% -4 5PF Cr 50PF 1.5[(150/Cr)+7] 10 Cr 50PF 0.15%Check by using microscope10.3 4Dimensions Capacitance Dissipation Factor (DF) Insulation ResistanceUsing micrometer or vernier calipers Measuring Equipment:HP4278 capacitance meter,HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature:25 5 .Humidity: 30%~75%. 2.Measuring Voltage:1.0 0.2V. 3.Measuring Frequency:C<1000PF 1.0 0.1MHz C 1000PF 1.0 0.1KHz Measuring Equipment:Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method:Must measure at rated voltage, and if Ur>500V,then just use 500V,measure the IR within 60 1 seconds. Ur Max. Current Measuring Time 1000V 1000V 2000V 2000V 50mA 50mA 10mA 5S 5S 5S56C<10nF,IR 5 10 C>10nF,IR CR 500S10Withstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur8Must meet the capacitor Capacitance temperature coefficient Temperature requirements within the Characteristics operating temperature range. Solderability Tin coverage 75% should be of the outer electrode covered by Tin Appearance Cap. Change ratio No defects visible 5% or 0.5PF whichever is bigger Same as original standard Same as original standardFirst, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at 55~125 or 55~85 , the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution, and then dip it into 235 5 eutectic solder solution for 2 0.5 seconds. Dipping speed: 25 2.5mm/second. First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1 seconds. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minutes 1minutes9 Resistance to Soldering10DFIR80【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR1 10N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 12 55Hz10 55Hz 10Hz 2 6 123 420 mmmm3mm mm mm mmmm150+0/-10 14 24 260 524 281【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Adhesive Strength of TerminationStandard No removal of the termination or other defect shall occurTest Method Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder.Then apply a 10N force inthe direction shown as the arrowhead.The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock,etc.11Fig.1 Vibration Resistance10N,10 1s Speed:1.0mm/s Glss epoxy resin board12Appearance No defects or Solder the capacitor to the test jig (glass epoxy resin abnormities board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the Capacitance Within the frequency being varied uniformly between the specified approximate limits of 10 and 55Hz, shall be traversed tolerance range (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute.This motion shall be applied for a period of 2 DF Same as hours in each 3 mutually perpendicular directions original (total is 6 hours). standardFig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown in Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. mmmm13mmmm mmmmTemperature Cycle 14Appearance No defects or abnormitiesPre-treatment: Heat-treat the capacitor for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Perform five cycles according to the four heat treatments listed in the following table. Set it for 24 2 hours at room temperature, the measure.82【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR2.5% 0.25PF, min. 14 D.F. I.R. 10000M 1 2 3 4 2 3 30 2 30 2 3 3 3 34029095 24 2500+24/-05% 0.5PF, 15 ( ) D.F. I.R. 10000M1.5 50mA ( 5% 0.5PF, 16 .) >2000V100012 24 21.2D.F. I.R. 10000M83【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItems Temperature CycleStandard Cap. Change ratio 2.5% or 0.25PF whichever is larger Same as original standard More than 10000M Heat-treatment:Test MethodD.F. 14 I.R.Stage Temperature Time 1 lowest operating temperature 3 30 2 2 Room Temperature 3 Highes operating temperature 2 30 4 Room Temperature 2min. 3 3 3 3Humidity Steady State 15AppearanceNo defects or abnormities 5% or 0.5PF whichever is larger Same as original standard More than 10000M No defects or abnormities 5% or 0.5PF (whichever is larger) Same as original standard More than 10000MSet the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.Cap. Change ratioD.F.I.R. Life Test AppearanceCap. Change ratio 16Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.(If Ur>2000V,apply 1.2times Ur to test)D.F.I.R.84【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORX7R1-551251. 2. 3. 2 4. , , , , , 105.3 4 : HP4278A HP42845(D.F.)25010-41.255:30% 75% 2. 3. : :1.0 :1.0 0.2V 0.1KHz ( :SF2511 ) >500V , 60 56I.R.C 25nF,IR 10000M C>25nF,R C 500S 500V:>1 5 7 >1 2 >1 21000V 1000V 2000V 2000V50mA 50mA 10mA5S 5S 5S150+0/-10 24 8 25 -55 125 2605235 9 75 245 5 25 2.5mm/ 2 0.5585【 南京南山半导体有限公司 — 贴片电容选型资料】General X7R MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -55 Standard 125 Test Method21.Good ceramic body color continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of the termination width. Within the specified dimensions Within the specified tolerance 250 10-4Check by using microscope10 .3 4Dimensions Capacitance Dissipation Factor (DF)5Using micrometer or vernier calipers Measuring Equipments: HP4278 capacitance meter, HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature: 25 5 . Humidity: 30% 75%. 2.Measuring Voltage: 1.0 0.2V. 3.Measuring Frequency:1.0 0.1KHz Measuring Equipment: Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method: Must measure at rated voltage, and measure the IR within 60 1 seconds. Ur 1000V 1000V 2000V Max. Current Measuring Time 50mA 50mA 10mA 5S 5S 5SInsulation Resistance 6C 25nF,IR 10000M C>25nF,R C 500SWithstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur2000V8Capacitance Temperature CharacteristicsMust meet the capacitor character temperature coefficient requirements within the operating temperature range. 75% of the outer electrode should be covered by TinFirst, pre-heat: heat treat 60 5 minutes at 150+0/-10 ,then set it for 24 2 hours at room temperature. Measure the capacitance at -55 125 ,the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution,and then dip it into 245 5 eutectic solder solution for 2 0.5 seconds. Dipping speed:25 2.5mm/second.Solderability 986【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR150+0/-10 10% D.F. 10 I.R. 25 : 10 1 24 2 26560 5 24522.5mm/1 2100 170120 2001 1110N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 55Hz 55Hz 10Hz 1 2 12 6 1023 13 ( ) 487【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItemStandardTest Method First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1s. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minute 1minuteResistance to Appearance No defects visible Soldering Cap. Change Within 10% ratio DF 10 IR Same as original spec. Same as original spec.Adhesive Strength of TerminationNo removal of the terminations or other defect shall occur11Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboardFig.1 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. 12 Same as original spec.Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Fig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc.1388【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR20 mmmmmm13mmmmmmmmmin. 20% 1 2 14 D.F. I.R. 3 4 2 3 30 2 30 2 3 3 3 340 20% 15 ( ) D.F. I.R.29095 48 2500+24/-01.5 20% .) 16 D.F. I.R 50mA ( >2000V100012 24 21.289【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Bending ResistanceStandardTest Methodmmmmmm13mm mmmmTemperature CycleAppearanceNo defects or abnormities 20%Cap. Change Within ratio 14Stage Temperature Time min. 1 Min. Operating Temperature 3 30 3 2 Room Temperature 2 3 3 Max. Operating Temperature 2 30 3 4 Room Temperature 2 3D.F.Same as original Specification Same as original Specification No defects or abnormities 20% Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 48 2 hours at room temperature, then measure.I.R.Humidity Steady StateAppearanceCap. Change within ratio D.F.15 I.R. Life Test AppearanceSame as original Specification Same as original Specification No defects or abnonrmities 20% Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.(If Ur>2000V,apply 1.2Ur to test.)Cap. Change within ratio 16 D.F.Same as original specification Same as original specificationI.R.90【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORY5V1-25~851. 2. 3. 2 4. 5. , , , , ,103 4 : HP4278A 1. 5 (D.F.) 500 10-4HP4284 25 5 75% 0.2V 0.1kHz:30% 2. 3. : :1.0 :1.06I.R.C 25nF,IR 40000M C>25nF,R C 500S( : ,: SF2511 60 5)7>300V >400V >500V100V 200V 250V50mA 50mA 50mA5S 5S 5S150+0/-10 8 24 -25 85 2605 25975235 25 0.52455 25 2.5mm/91【 南京南山半导体有限公司 — 贴片电容选型资料】General Y5V MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -25 85 Standard Test Method21.Good ceramic body color continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. Within the specified dimensions Within the specified tolerance 500 10-4Check by using microscope10.3 4Dimensions Capacitance) Dissipation Factor (DF)Using micrometer or vernier calipers Measuring Equipments: HP4278 capacitance meter, HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature: 25 5 . Humidity: 30% 75%. 2.Measuring Voltage: 1.0 0.2V. 3.Measuring Frequency: 1.0 0.1KHz Measuring Equipment: Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method: Must measure at rated voltage, and measure the IR within 60 5seconds. Ur 1000V 1000V 2000V Max. Current Measuring Time 50mA 50mA 10mA 5S 5S 5S5Insulation Resistance 6C 25nF,IR 40000M C>25nF,R C 500SWithstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur2000VCapacitance Temperature Characteristics 8Must meet the capacitor temperature coefficient requirements within the operating temperature range.First, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at 55 125 or 55 85 ,the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution,and then dip it into 235 5 (or 245 5 leadless eutectic solder solution) eutectic solder solution hanging lead for 2 0.5seconds. Dipping speed: 25 2.5mm/second.Solderability 975% of the outer electrode should be covered by Tin92【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR150+0/-10 30% D.F. I.R. 10 60 5 24 22655 24 2 25 2.5mm/ :1011 2100 170120 200 11 110N11 10N,10 1 :1.0mm/ 11.5mm D.F. 10 55Hz 12 55Hz 10Hz 1 2 6 1023 ( 13 ) 493【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItemStandardTest Method First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1s. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minute 1minuteResistance to Appearance No defects visible Soldering Cap. Change Z5U, Y5V: within ratio DF 10 IR30%Same as original spec. Same as original spec.Adhesive Strength of TerminationNo removal of the terminations or other defects shall occur11Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboardFig.1 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. 12 Same as original spec.Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Fig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc.1394【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR20 mm mmmm13mm mmmmmm30%min. 1 2 3 4 3 2 30 2 30 2 3 3 3 3D.F. 14 I.R.40 30%29095 48 2500+24/-015()D.F. I.R.30% 16 D.F. I.R 48 21.5 50mA10001295【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Bending ResistanceStandardTest Methodmmmm13mmmmmmmmTemperature CycleAppearanceNo defects or abnonrmities 2.5Cap. Change Within ratio 14Stage Temperature Time 30 1 Min. Operating Temperature 3 2 Room Temperature 2 3 Max. Operating Temperature 2 30 4 Room Temperature 2min. 3 3 3 3D.F.Same as original spec. Same as original spec. No defects or abnonrmities Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.I.R.Humidity Steady State 15AppearanceCap. Change within 30% ratio Same as D.F. original spec. I.R. Same as original spec. No defects or abnonrmities 30%Life TestAppearanceCap. Change within ratio 16 D.F.Same as original spec. Same as original spec.Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.I.R.96。
风华高科_微波片容_规格说明书
③ 标称容量 NOMINAL CAPACITANCE
表示方式
实际值
(Express Method)
(Actual Value)
R47
0.47
0R5
0.5
1R0
1.0
101
10×101
102
10×102
…
…
单位(unit)：pF
注：头两位数字为有效数字，第三位数字为 0 的个数；R 为小数点。 Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point.
T 编带包装（Taping Package）
四、温度系数/特性 Temperature Coefficient /Characteristics
介质种类
参考温度点
标称温度系数
工作温度范围
Dielectric Reference Temperature Point Temperature Coefficient Operation Temperature Range
三、型号规格表示方法 HOW TO ORDER
1111
RF
101
J
501 N
T
①
②
③
④
⑤⑥
⑦
※说明 NOTES：
①尺寸 DIMENSIONS
尺寸规格 Size Code
0402
长×宽 (L×W)inch
0.04×0.02
长×宽 (L×W)mm
1.00×0.50
0603 0.06×0.03 1.60×0.80
⑥ 端头材料 TERMINAL MATERIAL STYLES 端头类别 （Termination Styles）
三星国巨、风华高科贴片电容型号对照表 选型替代必备
0.04*0.02
1.00*0.5
C
P
R
S
T
U
L
COG
P2H
R2H
S2H
T2H
U2J
S2L
100
10*100
J
±5%
R
4V
3
0.3
N
三层电镀
0603
0.06*0.03
1.6*0.8
101
10*101
G
±2%
Q
6.3V
4
0.5
0805
0.08*0.05
2.00*1.25
102
10*102
C
±0.25PF
风华高科电容
多层片式陶瓷电容
0805CG104J500NT
1 2 3 4 5 6 7
1、尺寸
2、介质种类
3、标称电容量（PF）
4、误差级别
5、工作电压
6、端头类别
7、包装方式
型号
英寸
毫米
代码
介质材料
表示方法
实际值
代码
误差
表示方法
实际电压
标记
端头材料
标记
包装
0402
0.04*0.02
1.00*0.5
CG
E
F
H
I
J
L
M
P
Q
S
U
V
Y
1.10
1.25
1.60
2.00
2.50
3.20
1.15
1.15
1.25
1.35
1.80
2.50
1.25
国巨（YAGEO）电容
风华射频高Q贴片电容规格书
规格型号
英制表示 公制表示
0603
1608
0805
2012
0505
1212
1111
2828
L 1.60±0.20 2.00±0.20 1.40±0.38 2.79±0.51
尺寸（mm）
W
T
0.80±0.20 0.80±0.10
1.20±0.20 0.80±0.10
1.4±0.38 0.51~1.45
0805 250V
0505 150V
射频高 Q 多层片式陶瓷电容器
50V
100V
1111 200V
300V
500V
2
射频高 Q 多层片式陶瓷电容器
●Features
*High Q，Ultra-low ESR，Ultra-low ESL
*Temperature coefficienct 0±30ppm/℃（-55℃~+125℃）
3
射频高 Q 多层片式陶瓷电容器
●Capacitance Range
Item
Size
0603
Rated Voltage
250V
Capacitance
0.1pF 0.3pF 0.5pF 1.0pF 2.2pF 3.3pF 4.7pF 5.6pF 6.8pF 10pF 22pF 33pF 47pF 68pF 100pF 220pF 470pF 680pF 1000pF
L
1.60±0.20 2.00±0.20 1.40±0.38 2.79±0.51
Dimension（mm）
W
T
0.80±0.20 1.20±0.20 1.4±0.38 2.79±0.51
0.80±0.10 0.80±0.10 0.51~1.45 0.76~2.59
贴片电容型号对照表 三星 国巨 风华 -选型替代必备
风华高科电容多层片式陶瓷电容0805 CG 104 J 500 N T1 2 3 4 5 6 71、尺寸2、介质种类3、标称电容量（PF）4、误差级别5、工作电压6、端头类别7、包装方式型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记端头材料标记包装0402 0.04*0.02 1.00*0.5 CG COG和NPO 100 10*100J ±5% 6R3 6.3V S 纯银T 编带0603 0.06*0.03 1.6*0.8 101 10*101G ±2% 100 10V C 纯铜 B 散装0805 0.08*0.05 2.00*1.25 102 10*102 C ±0.25PF 250 25V N 三层电镀1206 0.12*0.06 3.2*1.6 500 50V三星电容多层片式陶瓷电容CL 10 C 101 J B 8 N N N C1 2 3 4 5 6 7 8 9 10 11CL表示：多层陶瓷贴片电容2、尺寸3介质种类4、标称电容量（PF）5、误差级别6、工作电压7、厚度8端头类别型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记尺寸(mm)标记端头材料0402 0.04*0.02 1.00*0.5 CPRSTUL COGP2HR2HS2HT2HU2JS2L100 10*100 J ±5% R 4V 3 0.3 N 三层电镀0603 0.06*0.03 1.6*0.8 101 10*101 G ±2% Q 6.3V 4 0.50805 0.08*0.05 2.00*1.25 102 10*102 C ±0.25PF P 10V 89ACD0.8 0.9 0.650.851.001206 0.12*0.06 3.2*1.6 OALB 16V 25V 35V 50VAB Y F X X5RX7RX7SY5VX6SKMZ±10%±20%+80/-20%CDEFGHIJK100V200V250V350V500V630V1000V2000V3000V国巨（YAGEO）电容多层片式陶瓷电容CC ×××× × ×NPO ×BN ×××1 2 3 4 51、尺寸2、误差精度3、包装形式4、实际电压值5、标称电容量型号英制型号公制代码误差表示方法实际值代码电压代码实际值0201 0603 BCDFGJ±0.1PF±0.25PF±0.5PF±1%±2%±5%R 纸卷盘7inch 7 16V 100 10*1000402 1005 K 吸塑卷盘7inch 8 25V 101 10*101 0603 1608 P 纸卷盘13inch 9 50V 102 10*102 0805 2012 F 吸塑卷盘13inch1206 3216 C 散装1210 32251812 4532TDK贴片电容型号TDK贴片电容的参数识别C 2012 X7R 1H 104 K T系列名称体积材料电压容量误差包装0603=0201 CH 0J=6.3V C=0.25 T=卷带1005=0402 COG 1A=10V D=0.5 B=袋装1608=0603 JB 1C=16V J=5%2012=0805 JF 1E=25V K=10%3216=1206 X7R 1H=50V M=20%3225=1210 X5R 2A=100V Z=+80-20%4532=1812 Y5V 2E=250V5650=2220 2J=630V4520=1808 3A=1KV3D=2KV3F=3KV。
瓷介电容_风华高科规格书
产品规格表示方式Product Part Number Expression1Product Type、产品类型CC11F 253NPO 415A 63307J 8S 9P 102Voltage Code、电压代码代码Code 额定电压Rated VoltageY 400VACF50V G100V A200V K250V L500V N1KV M2KVP3KV Q4KV 3Diameter Coefficient、片径直径代码直径Code Diameter(mm)65.5-6.4…………109.5-10.41211.5-12.4…………4(EIA )、温度特性见温度系数及代码：Temperature Characteristics (Please to see temperature coefficient and EIA code):5Lead style、引线形式代号symbol12345679W 11风华高科X250VAC54.5-5.4产品类型Product Type类型代号Typ e cod eLow voltage temperature compensation capacitor High voltage temperature compensation capacitorLow voltage high dielectric constant disk ceramic capacitor High voltage high dielectric constant disk ceramic capacitor Semiconductor disk ceramic capacitor Alternating current disk ceramic capacitor低压温度补偿型高压温度补偿型低压高介电常数型高压高介电常数型半导体型电容器交流电容器CC1CC81CT1CT81CS1CT7引线形式直脚长式直脚长式()编带直脚型(b式)编带小内弯型(a式)编带大内弯型(a式)特殊直脚S 外单弯(w式)前后翘lead Style(18-28mm)b Straight lon g lead (18~28m )b Style (16-20mm)b Straight long le ad (16~20mm)b Style straight short lead(cut the feet)Tape straight lead (b Style)Tape sm all inside kink (a Style)Tape large inside kink (a Sty le)()Special Straight lead (S)Outside kink(w Style)vertical kink lead短脚切脚6Lead Spacing、脚距7Standard capacitance、标称容量1R04R7100560821102-----注：标称容量以为单位，用位数字表示。
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第1页
共 23 页
风华高科 广 东 风 华 高 新 科 技 股 份 有 限 公 司
FENGHUA Fenghua Advanced Technology (Holding) CO. , LTD
二、尺寸及结构 DIMENSIONS AND STRUCTURE
※ 尺寸 DIMENSIONS
L L
W
T
WB WB
※X7R、X5R：X7R、X5R material is a kind of material has high dielectric constant. The capacitor made of this kind material is considered as Class Ⅱ capacitor whose capacitance is higher than that of class Ⅰ. These capacitors are classified as having a semi-stable temperature characteristic and used over a wide temperature range, such in these kinds of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc.
FENGHUA Fenghua Advanced Technology (Holding) CO. , LTD
⑤ 额定电压 RATED VOLTAGE
表示方式
实际值
单位(unit)：V
(Express Method) 6R3 500 201 102 …
(Actual Value)
6.3 50×100 20×101 10×102
风华高科 广 东 风 华 高 新 科 技 股 份 有 限 公 司
FENGHUA Fenghua Advanced Technology (Holding) CO. , LTD
三、型号规格表示方法 HOW TO ORDER
0805 CG
101
J
500 N
T
①
②
③④
⑤⑥
⑦
※说明 NOTES：
①尺寸 DIMENSIONS
1808 0.18×0.08 4.50×2.00
单位（unit）：inch/ mm
1812
2220
2225
3035
0.18×0.12 0.22×0.20 0.22×0.25 0.30×0.35
4.50×3.20 5.70×5.00 5.70×6.30 7.60×9.00
mm
. ② 介质种类 DIELECTRIC STYLE
≤8.10
备注：可根据客户的特殊要求设计符合客户需求的产品。
Note：We can design according to customer special requirements
WB 0.25±0.10 0.30±0.10
0.50±0.20
0.60±0.30
0.80±0.30 0.80±0.30 0.80±0.30 1.00±0.40 1.00±0.40 1.00±0.40
型号 Type
尺寸 Dimensions (mm)
英制表示
公制表示
L
W
T
British expression Metric expression
0402
1005
1.00±0.05 0.50±0.05 0.50±0.05
0603
1608
1.60±0.10 0.80±0.10 0.80±0.10
≤0.55
纯银端头 （Silver Solderable Termination） 纯铜端头 （Copper Solderable Termination） 三层电镀端头 （Nickel Barrier Termination） ⑦ 包装方式 PACKAGE STYLES
0805
2012
2.00±0.20
1.25±0.20
0.80±0.20 1.00±0.20
1.25±0.20
0.80±0.20
1206
3216
3.20±0.30
1.60±0.30
1.00±0.20 1.25±0.20
1.60±0.30
1210
3225
3.20±0.30 2.50±0.30
ห้องสมุดไป่ตู้
≤2.80
1808
版本号：FH-2010-002
风华高科
广东风华高新科技股份有限公司
FENGHUA Fenghua Advanced Technology (Holding) CO. , LTD
一、概述
●电容器及介质种类：
※高频类： 此类介质材料的电容器为Ⅰ类电容器，包括通用型高频 COG、COH 电容器和温度补偿型高频 HG、LG、PH、RH、SH、TH、UJ、SL 电容器。其中 COG、COH 电容器电性能最稳定，几乎不随温度、 电压和时间的变化而变化，适用于低损耗，稳定性要求高的高频电路，HG、LG、PH、RH、SH、TH、UJ、 SL 电容器容量随温度变化而相应变化，适用于低损耗、温度补偿型电路中。 ※ X7R、X5R：此类介质材料的电容器为Ⅱ类电容器，具有较高的介电常数，容量比Ⅰ类电容器高，具有 较稳定的温度特性，适用于容量范围广，稳定性要求不高的电路中，如隔直、耦合、旁路、鉴频等电路中。 ※Y5V：此类介质材料的电容器为Ⅱ类电容器，是所有电容器中介电常数最大的电容器，但其容量稳定性 较差，对温度、电压等条件较敏感，适用于要求大容量，温度变化不大的电路中。 ※Z5U：此类介质材料的电容器为Ⅱ类电容器，其温度特性介于 X7R 和 Y5V 之间，容量稳定性较差，对 温度、电压等条件较敏感，适用于要求大容量，使用温度范围接近于室温的旁路，耦合等，低直流偏压的 电路中。
…
注：头两位数字为有效数字，第三位数字为 0 的个数； R 为小数点。 Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point.
⑥ 端头材料 TERMINAL MATERIAL STYLES 端头类别 （Termination Styles）
实际值
(Express Method)
(Actual Value)
0R5
0.5
1R0
1.0
102
10×102
224
22×104
…
…
单位(unit)：pF
注：头两位数字为有效数字，第三位数字为 0 的个数；R 为小数点。 Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point.
4520
4.50±0.40 2.00±0.20
≤2.20
1812
4532
4.50±0.40 3.20±0.30
≤3.50
2220
5750
5.70±0.40 5.00±0.40
≤3.50
2225
5763
5.70±0.50 6.30±0.50
≤6.20
3035
7690
7.60±0.50 9.00±0.50
SUMMARY ●Types of Dielectric Material and Capacitor
※HIGH FREQUENCY TYPE: The capacitor of this kind dielectric material is considered as ClassⅠcapacitor, including high frequency COG、COH capacitor and temperature compensating capacitor such as HG, LG, PH, RH,SH, TH, UJ, SL. The electrical properties of COG、COH capacitor are the most stable one and change invariablly with temperature, voltage and time. They are suited for applications where low-losses and high-stability are required, HG，LG，PH，RH，SH，TH，UJ，SL capacitor’s capacitance changes with temperature.They are suited for applications where low-losses and temperature compensating circuits.
尺寸规格 0402
Size Code
0603
0805
长×宽
(L×W) 0.04×0.02 0.06×0.03 0.08×0.05
inch
长×宽
(L×W) 1.00×0.50 1.60×0.80 2.00×1.25
1206 0.12×0.06 3.20×1.60
1210 0.12×0.10 3.20×2.50
Note：These capacitance tolerance B, C, D are just applicable the capacitance that equals to or less than 10pF.
第3页
共 23 页
风华高科 广 东 风 华 高 新 科 技 股 份 有 限 公 司