TC600使用说明

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百特数显表操作方法之欧阳德创编

百特数显表操作方法之欧阳德创编

百特智能数显表说明书工作状态下按SET显示LOCY→按SET输入密码18→按SET显示RAN9→按SET通过△▽选择分度号→按SET显示Poin设置小数点→按SET显示r9.00设置量程下限→按SET显示r9.FS设置量程上限工作状态下按SET→通过△▽选择COrr按SET显示old.1→按SET通过△▽修正温度值参数设定说明:Locy:菜单上锁操作入口;按SET键确认;按△▽键退出;开锁密码为18Ran9.:分度号和量程设置入口;按SET键确认;按△▽键退出010/…/y:分度号设置;按△▽键设置;按SET确认PoIn:小数点位置设置;按△▽键设置;按SET确认R9.00:量程零点设置;按△▽键设置;按SET确认R9.FS:量程满度设置;按△▽键设置;按SET确认Corr:量程迁移和滤波时间设置菜单入口;按SET 键确认;按△▽键取消Old.1:修正温度值;按△▽键设置;按SET确认按键说明:△:变更参数设定时,用于增加数值SET:参数设定确认键▽:变更参数设定时,用于减少数值常见故障处理:仪表通电不亮:供电电源未接入,正确接入仪表电源;接触不良,取出表芯确认弹片接触是否良好。

LED屏显示:broy分度号选择错,选择与输入信号相符的分度号;输入信号太大,调节与输入信号保证在仪表范围内;信号短线,正确接入信号线。

H.oFL.分度号选择错,选择与输入信号相符的分度号;输入信号太大,调节与输入信号保证在仪表范围内;仪表标定错误,选择正确标定信号重新标定。

L.Ofl.:选择与输入信号相符的分度号;输入信号太小,调节与输入信号保证在仪表范围内;仪表标定错误,选择正确标定信号重新标定昌辉SWP系列智能仪表说明书控制方式:1、正确的接线仪表卡入表盘后,请参照仪表随机接线图接妥输入、输入及电源线,并请确认无误。

2、仪表的上电本仪表与电源开关,接入电源即进入工作状态。

3、仪表设备号及版本号的显示仪表在投入电源后,可立即确认仪表设备号及版本号。

数字钳式万用表使用说明书之欧阳语创编

数字钳式万用表使用说明书之欧阳语创编

数字钳式万用表一、概述UT250、UT206是一种性能稳定,安全可靠的33/4位数数字钳形表(一下简称仪表)系列。

整机电路设计以大规模集成电路双积分A/D转换器为核心,全量程的过载保护电路,独特的外观设计使之成为性能优越的专用电工仪表。

仪表可用于测量交直流电压、交流电流、电阻、二极管、电路通断、电容、频率/占空比或温度。

二、测量操作说明1、交流电流测量(1)将功能量程快关置于1000A~交流电流测量档。

(2)按下板机,张开钳头把导线夹住两根或以上的不同电流流向导线的测量将得不到正确的测来那个结果。

(3)从显示器上读取测量结果,为正弦波有效值(平均值响应)。

2、直流电压测量(1)将红表笔插入“V”插孔,黑表笔插入“COM”插孔。

(2)将功能量程开关置于直流电压测量档,并将表笔并联到待测电源或负载上。

(3)从显示器上读取测量结果。

3、交流电压测量(1)将红表笔插入“V”插孔,黑表笔插入“COM”插孔。

(2)将功能量程开关置于交流电压测量档,并将表笔并联到待测电源或负载上。

(3)从显示器上读取测量结果,为正弦波有效值(平均值响应)。

4、电阻测量(1)将红表笔插入“HZΩ”插孔,黑表笔插入“COM”插孔。

(2)将功能量程开关置于“Ω”档(电阻测量功能为默认值),并将表笔并联到被测电阻上。

(3)从显示器上读取测量结果。

5、二极管测试(1)将红表笔插入“HZΩ”插孔,黑表笔插入“COM”插孔。

红表笔极性为“+”。

黑表笔极性为“—”。

(2)将功能量程开关置于“”测量档,再按SEECTL 键选择进入二极管测试功能,红表笔接到被测二极管的正极,黑表笔接到二极管的负极。

(3)从显示器上读取被测二极管的近似正向压降值,一般为0.5~0.8V。

6、电路通断测试(1)将红表笔插入“HZΩ”插孔,黑表笔插入“COM”插孔。

(2)将功能量程开关置于“·)))”档,再按SEECTL键选择进入电路通断测试功能,并将表笔并联到被测电路两端。

TC系列肩无疆土的温度校准设备说明书

TC系列肩无疆土的温度校准设备说明书

TC SERIESPORTABLE & ACCURATE TEMPERATURE CALIBRATION MADE EASYLike most temperature calibrators you’ll find in this catalog, the TC Series generates true thermal references, not electronically-simulated ones. The TC Series’ lightweight, compact design makes them ideal for calibrating your temperature sensors on-site. All Tek Know calibrators come with interchangeable inserts that can be drilled with single or multiple immersion chambers to meet the specifications of your sensors.Programmable in either Celsius or Fahrenheit, the two-button operation allows for easy programming. And with the TC Series, obtaining true reference temperatures has never been easier. Simply place the sensor to be tested inside the well and set the temperature. The dual line display will show both the true and set temperature; once stabilization occurs, read the temperature and recalibrate the process or sensor. Tek Know calibrators may be used for calibration of thermocouples, thermistors and RTD sensors, or complete temperature loops.• T rue CalibrationProvides true temperature references, not simulated ones• C ompact DesignMakes it highly portable and ideal for field use• C ommunications PortRS-232 interface is standard, with FREE Windows TM -based software for semi-automatic calibration• Thermal Switch Test • E asy-To-Use 2-Button Operation • A ll Kits Include:Probe inserts, thermal switch leads, calibration certificate, instruction manual, industrial strength carrying case and SC200 SoftwareFREE SOFTWARE!SC200 Temperature Calibration SoftwareThe SC200 software package is a calibration tool which allows for fully-automatic or semi-automatic calibration, as well as a calibration management database. This software is useful in creating and maintaining the extensive documentation required by ISO and QS 9000. It contains databases for storing calibration programs, last calibration date, and company information; as well as true values and deviations, both in percentages and absolute values.The software can also be used to completely automate your calibration process. Used in conjunction with our SM300 Signal Master, you can eliminate the need to watch over your calibration while it runs. Just set it up and come back later to print out the certificate.• C ommunicationsCommunicates with SM300 and TC calibrators using RS232 serial ports. Drivers available for other instruments, including Beamex and Honeywell• S torageStores calibrations and calibration setups• D isplayShows on screen settling response at each calibration point. Up to 20 points• T hree modesCan be used in manual, semi- or fully-automatic modeTC150 This calibrator can generate both an ice point reference and a boiling point reference in one portable unit, making it theoptimal choice for food, dairy and biotechnology requirements.TC400 & TC650 For higher temperature applications, in particular calibration of J and K thermocouples up to 650°C (1192°F).TC600M This calibrator can maintain high accuracy and stability under the most severe conditions, and is therefore thepopular choice for offshore rigs and leading ship owners. As the TC600M was designed for the demanding needs of the marine industry, it is also ideal for field use in power utilities, petro chemical processing and the automotive industry.TC150 TC400 TC600M TC650TEMPERATURE RANGE -40°C* to 50°C (122°F) to 50°C (122°F) to 50°C (122°F) to150°C (302°F) 400°C (752°F) 600°C (1112°F) 650°C (1202°F)ACCURACY ±0.3°C ±0.3°C 1°C ±0.5°CSTABILITY ±0.03°C ±0.03°C 0.1°C ±0.05°CRESOLUTION 0.01° 0.01° 0.01° 0.01°COOLING TIME <20 min.AMBIENT TO MINIMUMHEATING TIMEAMBIENT TO MAXIMUM <15 min. <18 min. <18 min. <20 min.THERMAL SWITCH TEST Yes Yes Yes YesWELL DIMENSIONS 3/4” x 4.4” 1” x 6” 1” x 6” 1” x 6”OUTPUT RS232 RS232 RS232 RS232WEIGHT 15 lbs. 16 lbs. 16 lbs. 16 lbs.CALIBRATOR DIMENSIONS 8” x 5” x 11.5” 8” x 5” x 11.5” 8” x 5” x 11.5” 8” x 5” x 11.5”POWER 110V or 240 VAC 110V or 240 VAC 110V or 240 VAC 110V or 240 VAC INSERT FOR O.D. PROBE 1/8” & 3/16” 1/4” & 3/16” 3/16” 1/4” & 3/16”* below ambientSPECIFICATIONSTC SERIESIncluded in standard delivery: RS-232 interface, test cable for thermostats, 2-piece insertion tube, 1/8“ & 3/16 “, (1-1/8“ insert only for TC600M) calibration certificate, carrying case, 1 pc tool for changing insertion tubes, instruction manual, mains cableTC150Temperature Calibrator TC150, -40°C below ambient to 150°C (302°F) $ 5,350 TC400Temperature Calibrator TC400, Ambient to 400°C (752°F) 3,995 TC600M Temperature Calibrator TC600M, Ambient to 600°C (1112°F) 3,995 TC650Temperature Calibrator TC650, Ambient to 650°C (1202°F) 4,495 TC-INS-H-B Insert for TC400/TC600M/TC650, undrilled 140 TC-INS-H-18Insert for TC400/TC600M/TC650, 1/8” 175 TC-INS-H-316Insert for TC400/TC600M/TC650, 3/16” 175 TC-INS-H-14Insert for TC400/TC600M/TC650, 1/4” 175 TC-INS-H-38Insert for TC400/TC600M/TC650, 3/8” 175 TC-INS-H-12Insert for TC400/TC600M/TC650, 1/2” 175 TC-INS-H-1814Insert for TC400/TC600M/TC650, 1/8” + 1/4” 250 TC-INS-H-1414Insert for TC400/TC600M/TC650, 1/4” + 1/4” 250 TC-INS-L-B Insert for TC150, undrilled 130 TC-INS-L-18Insert for TC150, 1/8” 150 TC-INS-L-316Insert for TC150, 3/16” 150 TC-INS-L-14Insert for TC150, 1/4” 150 TC-INS-L-38Insert for TC150, 3/8” 150 TC-INS-L-12Insert for TC150, 1/2” 150 TC-INS-L-1814Insert for TC150, 1/8” + 1/4” 210 TC-INS-L-1414Insert for TC150, 1/4” + 1/4” 210TC-OIL Oil kit for TC150 cooling calibrators45TC SERIES, CONTINUED。

房产信息系统说明书参考手册第三章模板

房产信息系统说明书参考手册第三章模板

第三章SHIS2.0与全站仪及外设的连接3.1 与全站仪的连接“电子平板”作业方式的重要功能是它能够联接各种全站仪,实现野外数据采集的自动输入和记录,并且可以在野外将地形图绘制出来,实现所见即所测。

本节主要介绍与全站仪联接的操作方法和注意事项。

3.1.1全站仪的联接电缆SHIS2.0能与各种不同型号的全站仪联接,进行数据的自动采集,坐标的自动计算和存储。

表3-1列出能与系统联接的全站仪名称及型号,以及联接电缆等基本信息:表3-1 全站仪的联接电缆3.1.2全站仪的通讯参数设置系统与各全站仪联机测量功能中,已设定了不同的通讯参数,一般与厂家设置的相同,但也有必要在使用前进行检查,使之与表3-2所列相符:表3-2 全站仪通讯参数3.1.3 联机测量在使用本功能项之前,请先做好测站上的准备工作。

首先将全站仪安置在测站上,整平,对中,开通全站仪电源,初始化仪器,设置参数,然后使用南方测绘仪器公司开发的配套电缆将计算机与全站仪联接,并照准定向点上的反射棱镜。

其中参数设置可在出测前做好,如未更改,不必重新设置,注意:竖盘读数天顶设为零,全站仪显示的都应是斜距,角度单位为DEG。

对于全站仪的初始设置可在室内完成。

一旦设定之后,其结果会一直保存到下次更改之前。

各种全站仪的设置参数如下:1.与宾得系列全站仪连接﹙1﹚PTS-Ⅲ05、PTS-Ⅲ10 系列●该系列全站仪的右侧壁上有一内部开关装置,为模式安置的开关。

逆时针旋转将其开关盖旋下,并使用小螺丝刀、圆珠笔或类似的东西进行调整。

注意:在调整内部开关时,应先关闭电源。

内部开关出厂时设置的状态如下:●SW1:1100100SW2:1110001SW3:000XXXX上述的数字含义是:1为ON,0为OFF,X为未定。

●系统对模式安置开关SW1、SW2的要求与宾得全站仪出厂时设置是一致的,因此用户不要随意改动。

但SW1的第1、2键(竖直角/天顶距的选择)、SW2的第8键可由用户根据需要改变。

TC600中文说明书(II)

TC600中文说明书(II)

TCH-600氧氮氢联测仪中文说明书力可公司1介绍1 介绍☐插图说明……………………………………………………..………………..…1-12 ☐保证书……..………………..………………..………………..…………………1-15 注意事项.………………….………………….………………….………………1-16 警告事项.………………….………………….………………….………………1-16 ☐警告符号.………………….………………….………………….………………1-17 ☐和其它设备的接口.………………….………………….………………….……1-18 ☐主设备及附件列表……………………………………………………..……… 1-20 ☐选用件…..………………………..……………………………..……....……… 1-21 ☐部件和附件列表…………………………………..……………………..………1-22 ☐技术规格……………………………………………………………..…………...1-26 ☐即时手册…………………………………………………………..…………...….1-282 安装☐插图说明……………………………………………………..………………..… 2-2 ☐抬举和移动仪器……………………………………………..………………..… 2-3 ☐仪器安装…………………………………………………………………..………2-4 ☐设备要求…………………………………………………………………..………2-7 ☐电源安装…………………………………………………………………..………2-9 国内电源安装……………………………………………………………..………2-9 电源选择…………………………………………………………………..…… 2-10 国际电源安装……………………………………………………………..…… 2-12 交流电缆的技术规格……………………………………………………..…… 2-12 ☐电极炉冷却系统…………………………………………………………..…… 2-13 ☐入口气体净化试剂的安装………………………………………………..…… 2-15☐分析气体净化试剂的安装………………………………………………………………2-16 ☐氧气和水分吸收试剂管的安装…………………………………………………………2-18 ☐吸尘器的安装……………………………………………………………………………2-20 ☐计算机的安装……………………………………………………………………………2-21 LECO提供的计算………………………………………………………………………2-21 用户提供的计算………………………………………………………………………… 2-23 最低的计算机配置……………………………………………………………………… 2-23 3选用件安装☐插图说明…………………………………………………………………………………3-2 ☐天平的安装………………………………………………………………………………3-3 天平的设置………………………………………………………………………………3-3 天平初始化………………………………………………………………………………3-4 天平测试…………………………………………………………………………………3-5 ☐打印机……………………………………………………………………………………3-7 4系统设置☐插图说明…………………………………………………………………………………… 4-3 ☐控制及指示………………………………………………………………………………….4-4 ☐自动传送分析结果………………………………………………………………………….4-6 ☐维护计数值设定…………………………………………………………………………….4-8 维护计数值定义…………………………………………………………………………….4-9 ☐生成分析报告……………………………………………………………………………….4-10 ☐屏幕排版…………………………………………………………………………………….4-12 工具栏……………………………………………………………………………………… 4-12 状态栏……………………………………………………………………………………… 4-12 桌面栏……………………………………………………………………………………… 4-12 ☐分析表格设定……………………………………………………………………………… 4-13 表格内容定义……………………………………………………………………………… 4-14 ☐分析方法设定……………………………………………………………………………… 4-15 分析方法定义……………………………………………………………………………… 4-17 分析参数设定………………………………………………………………………… 4-17 元素参数设定………………………………………………………………………… 4-17 气标参数设定………………………………………………………………………… 4-18 炉子参数设定………………………………………………………………………… 4-19步进分析参数设定……………………………………………………………………… 4-21 ☐样品模板…………………………………………………………………………………… 4-23创建样品模板……………………………………………………………………………… 4-23 登录使用样品模板………………………………………………………………………… 4-24 ☐标样………………………………………………………………………………………… 4-25 标样定义…………………………………………………………………………………… 4-26 ☐系统设定…………………………………………………………………………………….4-27 系统设置的定义…………………………………………………………………………… 4-29 系统设置……………………………………………………………………………….4-29 天平设置……………………………………………………………………………….4-31 ☐传送格式…………………………………………………………………………………… 4-32 定义传送内容……………………………………………………………………………… 4-33 定义传送符号……………………………………………………………………………… 4-34 串行口……………………………………………………………………………………… 4-35 串行口定义…………………………………………………………………………… 4-36 预览传送数据……………………………………………………………………………… 4-37 ☐用户设定…………………………………………………………………………………… 4-38 添加用户…………………………………………………………………………………… 4-38 添加密码…………………………………………………………………………………… 4-39 指定用户功能……………………………………………………………………………… 4-40 ☐语言选择…………………………………………………………………………………… 4-415操作☐插图说明…………………………………………………………………………………… 5-5 ☐操作指南…………………………………………………………………………………… 5-6 分析前……………………………………………………………………………………… 5-7 分析后……………………………………………………………………………………… 5-8 使用后……………………………………………………………………………………… 5-8 ☐坩埚………………………………………………………………………………………5-9 标准坩埚…………………………………………………………………………………5-10 加热坩埚…………………………………………………………………………………5-10 高温坩埚…………………………………………………………………………………5-10 ☐电极清扫刷坩埚…………………………………………………………………………5-11 ☐样品制备…………………………………………………………………………………5-12 ☐样品种类…………………………………………………………………………………5-12屑状样品……………………………………………………………………………5-12粉末样品……………………………………………………………………………5-12胶囊样品……………………………………………………………………………5-12样品尺寸……………………………………………………………………………5-12 流动试剂…………………………………………………………………………………5-13 清洗及安装镍兰……………………………………………………………………5-13超高温纯净镍兰……………………………………………………………………5-13 Windows软件菜单……………………………….……………………………………… 5-14 文件菜单…………………………………….……………………………………………5-14 打印…………………………………….……………………………………………5-14 打印预览……………………………………………………………………………5-14打印设置……………………………………………………………………………5-14输入…………………………………….……………………………………………5-15 输出…………………………………….……………………………………………5-15 退出………….……………………………………………………………………….. 5-15 编辑菜单…………………………………….……………………………………………5-16 插入…………………………………….……………………………………………5-16 填充…………………………………………………………………………………5-16 剪切…………………………………….……………………………………………5-16 复制…………………………………….……………………………………………5-16 粘贴………….………………………………………………………………………5-16 视图菜单…………………………………….……………………………………………5-17 工具栏………………………………….……………………………………………5-17 状态栏………………………………………………………………………………5-17 第一行………………………………….……………………………………………5-17 分析栏………………………………….……………………………………………5-17 上一行………….……………………………………………………………………5-17 仪表盘…………….……………………………………………………………………5-18 峰值寻找……………………………………………………………………………… 5-18 氧化物分离(OxSep)………………………………………………………………..5-18 样品菜单…………………………………….……………………………………………5-19 登录…………………………………….……………………………………………5-19 天平…………………………………………………………………………………5-19 分析…………………………………….……………………………………………5-19 终止…………………………………….……………………………………………5-19传送…………………………………………………………………………………5-20删除…………………………………….……………………………………………5-20 设置菜单…………………………………….……………………………………………5-21 校正…………………………………….……………………………………………5-21空白…………………………………………………………………………………5-21漂移校正……………………………….……………………………………………5-21标样…………………………………….……………………………………………5-22方法………….………………………………………………………………………5-22计数器………………………………….……………………………………………5-22样品模板……………………………………………………………………………5-22 系统…………………………………….……………………………………………5-22用户…………………………………….……………………………………………5-22传送格式…….………………………………………………………………………5-23语言…………………………………….……………………………………………5-23自动调宽……………………………….……………………………………………5-23显示…………………………………………………………………………………5-23 诊断菜单…………………………………….……………………………………………5-24 环境监视……………………………….……………………………………………5-24环境监视表…………………………………………………………………………5-24 开关…………………………………….……………………………………………5-24漏气检查……………………………….……………………………………………5-24电磁阀……….………………………………………………………………………5-24自动装置……………………………….……………………………………………5-25电极炉………………………………………………………………………………5-25校正…………………………………….……………………………………………5-25网络…………………………………….……………………………………………5-25 维护菜单…………………………………….……………………………………………5-26 登录…………………………………….……………………………………………5-26显示日志文件………………………………………………………………………5-26 ☐登录试样……………………………………………………………………………………5-27 试样登录定义………………………………………………………………………………5-28 天平登录……………………………………………………………………………………5-28 ☐分析试样……………………………………………………………………………………5-29 ☐删除试样……………………………………………………………………………………5-30 ☐打印样品结果………………………………………………………………………………5-31☐传送结果……………………………………………………………………………………5-33 ☐重新计算结果………………………………………………………………………………5-34 ☐校正…………………………………………………………………………………………5-35 ☐空白校正……………………………………………………………………………………5-36 ☐标样校正……………………………………………………………………………………5-37 标样校正定义…………………………………………………………………………5-39☐漂移校正……………………………………………………………………………………5-40 ☐结果管理……………………………………………………………………………………5-41 在分析表中插入数据…………………………………………………………………5-41插入分析………………………………………………………………………………5-42在选择的表格中设置相同的值………………………………………………………5-42在分析表中选择第一行………………………………………………………………5-43在分析表中选择第分析行……………………………………………………………5-43在分析表中选择上一行………………………………………………………………5-43输入样品数据…………………………………………………………………………5-43输出样品数据…………………………………………………………………………5-44输出定义………………………………………………………………………………5-46 ☐使用剪贴板……………………………………………………………..…………………..5-47 剪切数据到剪贴板…………………………………………………..………………..5-47复制数据到剪贴板…………………………………………………..………………..5-47粘贴数据到剪贴板…………………………………………………..………………..5-47 ☐分析图形设置………………………………………………………………………………5-48 显示菜单………………………………………………………………………………5-48 选择过程…………………………………………………………………………5-48 ☐峰值寻找……………………………………………………………………………………5-50 图形菜单…………………………………………………………………………….. 5-51 图形菜单定义……………………………………………………………………5-51 打印图形…………………………………………………………………………….. 5-51峰值寻找方法建立……………………………………………………………………5-52 峰值寻找方法定义………………………………………………………………5-53☐氧化物分离(OxSep)………………...…………………………………..………5-54 氧化物分离图形………………...………………...…………………..………5-54 氧化物分离图形功能…………...…………..…………………..………5-55 打印图形………………...…………….………..………………..…………5-56氧化物分离方法建立………………...……………..………………..………5-57氧化物分离方法定义…………...……………..………………..………5-58典型方法的参数………………….……………………………………5-59系统设置………………...…………………………………………………5-60数据缓冲区数据移位定义………………….…………………..………5-616维护☐插图说明…………………………………………………………………………………… 6-2 ☐维护周期表………………………………………………………………………………….6-3 ☐空气过滤器清扫…………………………………………………………………………….6-5 ☐入口催化剂充填……………………………………………………………………………6-7 ☐分析气催化剂充填………………………………………………………………………… 6-8 ☐加样器过滤器……………………………………………………………………………….6-12 ☐登录周期维护……………………………………………………………………………….6-14 ☐下电极座和O型圈的更换…………………………………………………………………6-15 ☐炉子过滤器充填…………………………………………………………………………… 6-17 ☐汽缸密封O型圈和滑块……………………………………………………………………6-19 ☐落样块O型圈和落样块……………………………………………………………………6-21 ☐次级过滤器………………………………………………………………………………… 6-23 ☐检查日志文件……………………………………………………………………………… 6-25 ☐更新维护计数器…………………………………………………………………………… 6-267工作原理☐工作原理……………………………………………………………………………………..7-3 ☐大气压力……………………………………………………………………………………..7-5 ☐校正曲线选择………………………………………………………………………………..7-7 线性校正……………………………………………………………………………………..7-8 校正技巧………………………………………………………………………………..7-8 两次曲线校正………………………………………………………………………………..7-9 校正技巧………………………………………………………………………………..7-9 三次曲线校正………………………………………………………………………………..7-10 校正技巧………………………………………………………………………………..7-10 ☐比较水平……………………………………………………………………………………..7-11 ☐分步气体分析和程序升温………………………………………………………………7-13 概述…………………………………………………………………………………………..7-13 程序升温……………………………………………………………………………………..7-14 升温方法………………………………………………………………………………..7-14温度保持-氧………………………………………………………………………….7-15温度保持-步进………………………………………………………………………..7-15 ☐红外辐射、吸收和检测……………………………………………………………………..7-16 ☐热导检测………………...………………………………..………………..……7-17 气体的热导率………………...………………………………………..……7-188诊断☐环境监测……………………………………………………………………………………..8-3 环境监测表…………………………………………………………………………………..8-4 环境监测虚拟表……………………………………………………………………………..8-5 环境监测定义…………………………………………………………………………..8-6 ☐校正………………………………………………………………………………………… 8-8 催化炉……………………………………………………………………………………… 8-8 设置大气压力……………………………………………………………………………… 8-11 设置载气流量……………………………………………………………………………… 8-12 热导池电压校准………………...…………...………………………..………… 8-13 热导池电桥电压检查………………......……………………………..……8-13设置电桥………………...…………………………….………………..……8-14 备份校正…………………………………………………………………………………… 8-15 备份校正值…………………………………………………………………………… 8-16恢复校正值…………………………………………………………………………… 8-17 网络………………………………………………………………………………………… 8-18 网络定义……………………………………………………………………………… 8-20 ☐炉子诊断……………………………………………………………………………………8-21 ☐漏气检查…………………………………………………………………………………… 8-23 ☐电磁阀……………………………………………………………………………………… 8-25 ☐开关………………………………………………………………………………………… 8-26 开关状态…………………………………………………………………………………… 8-27 泵头温度……………………………………………………………………………… 8-27泵头压力……………………………………………………………………………… 8-27冷却水温度…………………………………………………………………………… 8-27电极温度……………………………………………………………………………… 8-27变压器温度…………………………………………………………………………… 8-27 ☐自动装置…………………………………………………………………………………… 8-29 自动清扫…………………………………………………………………………………… 8-29 自动加样…………………………………………………………………………………… 8-30☐电子调整…………………………………………………………………………………… 9-310维修☐插图说明…………………………………………………………………………………… 10-2 ☐分析气路图………………………………………………………………………………… 10-3 参考气流路径……………………………………………………………………………… 10-3 测量气流路径……………………………………………………………………………… 10-4 ☐冷却水槽的排水…………………………………………………………………………… 10-5 ☐漏气故障处理……………………………………………………………………………… 10-7 旁路系统…………………………………………………………………………………… 10-7 ☐报警信息…………………………………………………………………………………… 10-8 ☐可弯曲可更换的气路管…………………………………………………………………… 10-12 气路管的部件号…………………………………………………………………………… 10-12 ☐线性化……………………………………………………………………………………… 10-13 ☐电磁阀说明表图…………………………………………………………………………… 10-1511插图目录12目录13简图和附件列表图2-1………………………TCH-600后面板图……………………………………………… 2-8图2-2………………………电压选择图示………………………………………………………2-11图2-3………………………添加冷却水图………………………………………………………2-14图2-4………………………试剂管充填图………………………………………………………2-17图2-5………………………除氧气和水分试剂管帽的拆卸图…………………………………2-19图2-6………………………除氧气和水分试剂管的拆卸图……………………………………2-20图2-7………………………吸尘器的安装图……………………………………………………2-21图3-1………………………天平控制板…………………………………………………………3-6图3-2………………………天平装置……………………………………………………………3-6图4-1………………………控制器和显示器……………………………………………………4-5图5-1………………………坩埚类型……………………………………………………………5-9图6-1………………………空气过滤器的位置图………………………………………………6-6图6-2………………………催化炉试剂管的位置图……………………………………………6-10图6-3………………………催化炉试剂管的充填图……………………………………………6-11图6-4………………………加样头过滤器的更换图……………………………………………6-13图6-5………………………下电极座和O型圈的更换图………………………………………6-16图6-6………………………微粒过滤器的更换图………………………………………………6-18图6-7………………………活塞密封O型圈和滑块图…………………………………………6-20图6-8………………………落样块图……………………………………………………………6-22图6-9………………………次过滤器图……………………………………………………… 6-24图10-1………………………冷却水槽排水图………………………………………………… 10-6图10-2………………………TCH-600气路图……………………………………………… 10-17图10-3………………………漏气检查顺序图………………………………………………… 10-18图11-1………………………红外池和热导池恒温箱………………………………………… 11-4 图11-2………………………红外池装配图…………………………………………………… 11-5图11-3………………………红外检测器装配图……………………………………………… 11-6图11-4………………………热导池装配图…………………………………………………… 11-7图11-5………………………动态流量补偿器装配图………………………………………… 11-8图11-6………………………热交换器装配图………………………………………………… 11-9图11-7………………………冷却水闭环系统图……………………………………………… 11-10图11-8………………………液-液热交换装配图…………………………………………… 11-11图11-9………………………冷却水阀装配图………………………………………………… 11-12图11-10……………………催化炉加热装配图……………………………………………… 11-13图11-11……………………分析气催化炉加热装配图……………………………………… 11-14图11-12……………………入口气体净化装配图…………………………………………… 11-15图11-13……………………恒温箱加热装配图……………………………………………… 11-16图11-14……………………上电极装配图…………………………………………………… 11-17图11-15……………………下电极装配图…………………………………………………… 11-18图11-16……………………计量阀装配图…………………………………………………… 11-19图11-17……………………变压器装配图…………………………………………………… 11-20图11-18……………………微颗粒过滤器装配图…………………………………………… 11-21图11-19……………………底板和支架装配图……………………………………………… 11-22图11-20……………………交流电源分配板………………………………………………… 11-23图11-21……………………加样头过滤器…………………………………………………… 11-24图11-22……………………电源装配图……………………………………………………… 11-25图11-23……………………质量流量控制器装配图………………………………………… 11-26图11-24……………………冷却水泵装配图………………………………………………… 11-27图11-25……………………动力气模块装配图……………………………………………… 11-28图11-26……………………除氧气和水分试剂管模块装配图……………………………… 11-29图11-27……………………加样头装配图…………………………………………………… 11-30图11-28……………………下电极座装配图………………………………………………… 11-31图11-29……………………短电极刷装配图………………………………………………… 11-32图11-30……………………长电极刷装配图………………………………………………… 11-33图11-31……………………氦气连接装配图………………………………………………… 11-34图11-32……………………动力气连接装配图……………………………………………… 11-35图11-33……………………排水管装配图…………………………………………………… 11-36图11-34……………………电极炉装配图…………………………………………………… 11-37图11-35……………………视图A…………………………………………………………… 11-38图11-36……………………视图B…………………………………………………………… 11-39图11-37……………………视图C…………………………………………………………… 11-40图11-38……………………金属气路管更换指导…………………………………………… 11-41由美国密歇根州约瑟夫街LECO公司生产的仪器保证自安装之日起六个月在材料和工艺方面的保质期。

TC600中文说明书

TC600中文说明书

8 诊断环境监测器8-3环境监测图8-4环境监测表8-5环境监测器的定义8-6校正8-8催化剂加热器8-8设置大气压力8-11设置载气流量8-12热导池电压校准8-13热导池电桥电压检查8-13设置电桥8-14校正备份8-15备份校正值8-16恢复校正值8-17网络8-18网络的定义8-20炉子8-21漏气检查8-23电磁阀8-25开关8-26开关情况8-27泵头温度8-27泵头压力8-27冷却水温度8-27电极温度8-27变压器温度8-27自动装置8-29自动清扫器8-29自动加样器8-30环境监测器环境监测器允许维修技术人员或操作者监测仪器的参数和测定它们的状态。

操作者可以选择查看环境图表或环境仪表来监测仪器的参数。

环境图表提供所有系统参数的图表,环境仪表将选定的参数以仪表的形式显示出来。

选定的参数不是由操作者选择的,它们是LECO认为重要而选定的。

关于环境图表屏幕上显示的参数和数值信息,请参阅8-6页环境监测定义。

1.点击诊断,选择图表显示环境监测图表屏幕。

2.点击需要的参数左边的复选框,图表上方将显示此参数数值的图。

按住CTRL不放,再点击参数复选框,就可以显示不止一个参数的图了。

复选框左边的黄色圆圈表明该参数的数值超出范围了。

3.把鼠标移到图上,点击鼠标右键,就可以进行复位、恢复、缩小、放大以及数值图的范围了。

参数数值显示在竖坐标、时间显示在横坐标。

图左下角的框显示了仪器打开或图复位的小时数。

24小时后该小时数复位为0。

4.点击图表复位将图表的数值和时间复位。

5.点击打印,将参数数值打印到系统打印机。

环境仪表是环境监测器的一个扩展。

它浓缩了重要的操作参数,提供操作者快速查看选定参数数值。

当查看环境仪表时,指针应该在刻度的中间,表明是正确的操作。

环境仪表屏幕上显示的参数和数值信息,请参阅8-6页环境监测参数的定义。

1.点击诊断,选择仪表显示环境监测仪表屏幕。

2.点击仪表,指针应该在刻度的中间,表明是正确的操作。

旌旗插卡预付费电表使用方法

旌旗插卡预付费电表使用方法
信息可显示6位。如果累计用电量可显示到999KWh。
6)用带有电量的用户卡可清掉当前表内最大负荷数。
5)当F1~F6后跟有一位或两位数值时,表示的是紧跟着显示的数值的高位,因此各项数字三:
断电
销售热线:
若电度表第四位数码管显示一条闪烁的短横时表示处于断电状态,每10秒显示一断电原因,若剩余电量小于报警电量则每两秒钟显示一次断电原因(此时无短横)。
时剩余电量为表中所剩电量。
2)当将无购电电量的用户卡插入电度表时,将显示“F1”和”0“,接着轮显示上述2 -6条各项内容。
3)当用户错将非本系统的卡或其它卡插入电度表时,将显示“F1”,紧接显示“-----”,然后轮显示上述2-6条各项内容。
4)只声表示插卡的是不带电量的用户卡;
响二声表示插入的是带电量的用户卡;
无声音表示插入的是错卡或用户卡没插好。
当插入带有效电量的用户卡后,电度表的4位显示窗口将显示下述内容:
1:F1…….本次购电量提示符
500…….本次购电量(kw.h)
2: F2…….剩余电量提示符
800…….剩余电量(kw.h)
3:F3…….累计用电量提示符
1.若显示c006,表示存储数据故障
2.若显示c007,表示继电器故障
出现上述情况及说明书未标出的情况时请用户及时通知维修人员处理。
五:
安装
销售热线:
1.电度表在出厂前经检验合格,并加铅封,便可安装使用
2.电度表应安装在室内使用,安装表的底板应固定在坚固防火的墙上,建议安装高度在
1."8米左右,空气中无腐蚀性气体。
旌旗牌插卡电表使用说明书
一:
购电
销售热线:
用户持购电卡到售电部门购电。售电部门的操作人员在计算上,通过专用管理软件和读写卡装置,将用户购电量、代码等数据以加密方式写入购电卡。销售热线:

MBA管理经济学-考试复习题---内参

MBA管理经济学-考试复习题---内参

MBA管理经济学-考试复习题---内参6. 使用下图回答以下问题:a. 均衡时产品价格与交易量为多少?答:PE= 60元,QE=400b. 制定限价为40元的影响是什么?答:供不应求400单位(=600-200)c. 制定支持价50元的影响是什么?支持价为70元呢?答:因为市场均衡价格为60元,高于设定的最低价格50元,所以对市场价格与产品供给量没有影响。

d. 假设消费者收入上升后,在任意价位下,消费者愿意并且能够多买100单位的商品。

画出新的需求曲线,并设为D1,当达到均衡后产品的价格与交易量是多少?PE= 65元,QE= 450e. 假设由于原材料的价格下降,在任意的价位下,厂商们愿意多提供200单位的商品。

画出新的供给曲线并表示为S1. 换一种说法,如果原材料价格下降,对任意水平的产出,商品售价下降20元结果如何?证明,在这两种情况下,新的供给曲线是完全相同的。

当供给与需求分别为S1,D1时,新的均衡价格和均衡产量是什么?答:PE= 55元,QE= 5507. A和B同题型,只考一个A. 假设你是加利福尼亚一家酒厂的经理,你认为以下事件将如何影响你对每瓶酒的定价?a. 同档次的法国酒价格下降答:替代品价格下降,需求下降,价格下降b. 加利福尼亚新出现了100家酒厂答:供给增加,价格下降c. 美国的失业率下降答:需求增加,价格上升d. 奶酪价格上升答:需求下降,价格下降e. 由于政府的防震玻璃管制,玻璃瓶的价格产生了大福度的上升答:供给下降,价格上升f. 研究人员开发了新的酿酒技术,将会降低酒的制造成本答:供给上升,价格下降g. 由葡萄汁发酵而成的一种酸葡萄酒价格上升答:供给上升,价格下降h. 消费者的平均年龄上升,而年龄大的人相对来说酒喝得少一点答:需求下降,价格下降B. Florida Citrus Mutual是一个位于佛罗里达州的柑橘种植者农业合作联合会。

发生以下事件对柑橘的产量和价格发生什么影响?a. 一股巨大的寒流摧毁了佛罗里达大片的橘林答:供给下降,价格上升b. 佛罗里达大学的一些农业拓展服务的科学家们发现了一种使每棵橘树产量翻番的方法答:供给上升,价格下降c. 美国医药协会指出,多喝橘汁有益于减少心脏病答:需求上升,价格上升d. 葡萄的价格下降答:两种情况:1)需求下降,价格下降2)供求上升,价格下降,量不确定8. 假定一个消费者消费三种商品,X,Y和Z。

TC系列大称量电子天平中文操作手册

TC系列大称量电子天平中文操作手册

一.概述TC-K系列电子天平是常熟市双杰测试仪器厂采用工业级的高精度传感器和测量电路以及“双杰”专用的单片机计算机系统精心设计和制作而成的高品质电子称重仪器,已广泛应用于各行各业的各种用途的称重测量,检测检验,对提高产品质量、经济效益及工作效率都起到了重要作用。

该系列电子天平具有以下特点:1.精度及灵敏度高,反应速度快;2.线路模式先进,选材和制作工艺精良,因而产品可靠性高,抗干扰能力强,使用寿命长,长期使用稳定性好,可以适应恶劣的使用环境并长时间连续工作。

3.交直流两用功能。

4.具有自动校正功能。

5.采用高清晰度LCD大显示器,显示清晰,读数直观,并有背光功能。

6.具有单位转换功能,可在“kg”(千克)→“lb”(磅)之间任意转换;7.天平配置有数据输出接口和打印按键,可直接连接打印机进行数据打印,更可直接与计算机接口,进行数据的采集、统计,同时,计算机也可以通过接口来控制天平的工作,对天平进行实时的远程控制。

8.天平设计有计数功能, 可方便用户对大批量的物件进行计数。

9.大容量充电电池,充满一次可以连续使用60小时以上。

10.开机显示电池电压,当电池电压不足时自动关机,保护充电电池。

11、精度等级:TC-K系列电子天平符合JB5374-91《电子天平》标准以及JJG1036-2008检定规程三级天平的要求。

二. 型号规格及技术参数型号 TC60K TC100K TC150K TC200K TC300K 最大称量 60kg 100kg 150kg 200kg 300kg分辨率 1g 1g 5g 10g 10g 检定分度值 10d 10d 10d 10d 10d去皮范围 60kg 100kg 150kg 200kg 300kg 校准重量 50kg 100kg 100kg 200kg 200kg 秤盘尺寸 520mm×420mm供电 AC 220V±10% 50Hz±1Hz DC6V/4AH/20HR 充电电池 使用温度 0-40°C使用湿度 ≤ 80% R.H型号 TC60KA TC100KA TC150KA TC300KA TC600KA 最大称量 60kg 100kg 150kg 300kg 600kg 分辨率 5g 10g 20g 50g 100g 检定分度值 10d 10d 10d 10d 10d 去皮范围 60kg 100kg 150kg 300kg 600kg 校准重量 50kg 100kg 100kg 200kg 500kg 秤盘尺寸 510mm×410mm供电 AC 220V±10% 50Hz±1Hz DC6V/4AH/20HR 充电电池使用温度 0-40°C使用湿度 ≤ 80% R.H三.使用前的准备工作和注意事项1. 请将电子天平放置于平坦坚实的地面上,并使四个调整脚都起到支撑作用;2. 避免将电子天平置于温度变化过大或者空气流动剧烈和地面有振动的场所使用,严禁将电子天平置于高温和过度潮湿的场所使用;3.请使用独立的电源插座,并且避免使用动力电源,以避免电子天平受到干扰;4.打开电源时称盘上勿放置任何物品;5.使用前请先开机预热15分钟;6.如果显示器左上角的电池符号显示,说明电池电量不足,如不及时充电,天平持续使用时间不足8小时,系统将自动关闭背光功能,继续长时间使用会使系统自动关机,以免充电电池过度放电而损坏;当电池电量不足后,对电池的充电时间应在10小时以上;7.如果长期不使用的话,应放置在干燥通风的地方,每隔三个月充电一次,再次使用时应先充电再使用或者使用时同时充电;8.严禁使电子天平淋雨或用水冲洗电子天平;9. 称量时应小心轻放,严禁任何形式的冲击和超载,否则极可能导致电子天平的永久性损坏;10.日常使用时应轻拿轻放,擦试时应用浸润中性清洗剂的湿润布条。

罗格斯公司高频材料的铜片说明说明书

罗格斯公司高频材料的铜片说明说明书

Copper Foils for High Frequency MaterialsCopper foils, for the wide range of Rogers’ high frequency circuit substrates, are designed to provide optimum performance in high reliability applications.There are various types of copper foil are offered; in a range of weights (thicknesses). Their characteristics differ, and an understanding of these differences is important to ensure the correct selection of copper foil for each application or environmental condition.Copper Foil ManufacturingStandard ED CopperIn an electrodeposited copper manufacturing process, the copper foil is deposited on a titanium rotating drum from a copper solution where it is connected to a DC voltage source. The cathode is attached to the drum and the anode is submerged in the copper electrolyte solution. When an electric field is applied, copper is deposited on the drum as it rotates at a very slow pace. The copper surface on the drum side is smooth while the opposite side is rough. The slower the drum speed, the thicker the copper gets and vice versa. The copper is attracted and accumulated on the cathode surface of the titanium drum. The matte and drum side of the copper foil go through different treatment cycles so that the copper could be suitable for PCB fabrication. The treatments enhance adhesion between the copper and dielectric interlayer during copper clad lamination process. Another advantage of the treatments is to act asanti-tarnish agents by slowing down oxidation of copper.Fig. Electrodeposited Copper Manufacturing ProcessPropertiesRolled CopperRolled copper is made by successive cold rolling operations to reduce thickness and extend length starting with a billet of pure copper. The surface smoothness depends on the rolling mill condition.Fig. Rolled Copper Manufacturing ProcessResistive CopperThe matte side of the ED copper is coated with metal or alloy that acts as a resistive layer. The next process is to roughen the resistive layer with nickel particles.Reverse Treated ED Copper and LoPro Copper FoilReverse treated foils involve the treatment of the smooth side of electrodeposited copper. Treatment layers are thin coatings that improve adhesion of the base foil to dielectrics and add corrosion resistance which makes the shiny side rougher than it was before. During the process of making circuit board panels, the treated side of copper is laminated to the dielectric material. The fact that the treated drum side is rougher than the other side constitutes a greater adhesion to the dielectric. That is the majoradvantage over the standard ED copper. The matte side doesn’t need any mechanical or chemical treatment before applyingphotoresist. It is already rough enough for good laminate resist adhesion.In case of the LoPro™ copper, a thin layer of adhesive is applied on the reverse treated side of the copper. There is a physical layer of the bond enhancement material. Just like the reverse treated electrodeposited copper, the adhesive treated side is bonded to the dielectric layer for better adhesion. Our RO4000 series material are available laminated with LoPro copper foil. Crystalline StructureElectrodeposited copper crystals tend to grow lengthwise in the Z-axis of the foil. Typically, a polished cross-section ofelectrodeposited copper foil has the appearance of a picket fence, with long crystal boundaries perpendicular to the foil plane. Rolled copper crystals are broken and crushed during the cold rolling operation. They are smaller than the electrodeposited crystals, and have irregular, spherical shapes, nearly parallel to the foil plane.Copper Foil Roughness MeasurementsSurface roughness can be measured by mechanical and optical methods. Many sources report the “Rz” (peak to valley”) profile as measured by a mechanical profilometer . However, in our experience, the Sq (RMS) profile as measured by white light interferometry of the treated side of copper foil correlates best with conductor losses. Figure 1 shows the interferometer profile of the ½ oz. ED foil used on Rogers’ PTFE and TMM laminates. Table 1 shows the types of copper foils used on Rogers’ laminate materials along with typical profile information. A recent study (reference 7) has shown that the “top side” profile has a very different structure than the treated side and has very little effect on conductor loss, even in a stripline configuration.Treated SideShiny SideFig 1. Surface topographies of ½ oz electrodeposited foil by white light interferometryAs displayed on Table 1, roughness data of electrodeposited and rolled copper foils with different thicknesses was obtained by using an optical surface profiler. It also shows for which products the individual copper foils are used at Rogers Corporation. The rolled copper with no surface treatment is typically the smoothest.Table 1: Typical Root Mean Square Roughness ValuesElectric Performance of LaminatesIt has been well-known since the earliest days of microwave engineering with wave guides that the conductor surface roughness can substantially affect the conductor loss. In 1949, S.P. Morgan (1) published results of numerical simulations that indicated that a factor of two increase in conductor loss could be caused by surface roughness. Hammerstad and Jensen (2), incorporated Morgan’s model, along with correlated data in microstrip design method. The H&J model became the “textbook” (3) method for calculating the effect of surface roughness on conductor loss. More recently, at higher frequencies and with thinner laminates,it was found that H&J significantly under predicted the increase in conductor loss with surface roughness (5,6). The “Hall-Huray” model (4), developed from a “first principles” analysis, has been recently incorporated into commercial design software.In our experience, with modest adjustments to the input parameters, the Hall Huray model can accurately predict conductor loss over a wide range of laminate thicknesses and frequencies. The Hall-Huray model has been incorporated in Rogers Corporation’s impedance and loss calculator, MWI. We are currently working to develop the best Hall-Huray input parameters for modeling Rogers’ laminates. Please check at Rogers Technical Support Hub on-line or your Rogers Sales Engineer for updates.Rogers copper foils studies (5,6,7) have also shown that the copper profile can affect the propagation constant, with higher profile foils leading to an apparent increase in the effective dielectric constant Figure 3 shows the calculated dielectric constant of 50 ohm TLs on 4 mil liquid crystal polymer (LCP) laminates clad with different foils with Sq values ranging from 0.4 to 2.8 microns. The circuit with the highest profile foil exhibits an increase in DK of nearly 10%. The effect of copper profile on phase response is not accounted for in the Hall Huray model.The effect of copper profile on insertion loss can be quite large (Fig.2). At 90 GHz, the insertion loss of a 50 ohm TL fabricated from a 0.004” thick liquid crystal polymer (LCP) laminates with RA foil (blue line), is 2.2 dB/inch and is nearly perfectly modeled as a smooth conductor. The same substrate clad with ED foil exhibiting with Sq value of 2.0 microns, exhibits an insertion loss of 3.7 dB/inch. Figure 4 shows the morphologies of the roughness treatments on the conductors used to generate the data presented in Figure 2.Fig 2. Comparisons of different copper roughness on the insertion loss of microstrip transmission linesFig 3. Comparisons of different copper roughness on the dielectric constant of microstrip transmission lines0.4 m m RMS 2.0 m m RMS2.8 m m RMSFig. 4: SEM images of 1/2 oz copper foils - Treated SideMechanical Performance of LaminatesA. Thermal Shock ResistanceUnder some extreme conditions of rapid thermal cycling, electrodeposited copper may exhibit thermal stress cracks in narrow conductors. Under similar conditions, rolled copper has significantly improved resistance to cracking. Although electrodeposited copper has greater tensile strength and elongation before breaking, rolled copper has better elastic elongation before reaching permanent deformation.B. Foil AdhesionBecause the adhesion of resin systems to metals is predominantly mechanical, bond strength is directly related to the surface roughness of the treated foil side. Typical peel strengths after thermal shock for 1 oz. copper foils toC. Bondability of Stripline Assemblies (PTFE Substrates)The SEM photographs below illustrate the differences in topography and roughness between copper types and etch dielectric surfaces. If the boards are to be adhesive bonded, then for electrodeposited copper, sodium etch or plasma etch of the dielectric surface is not necessary, provided that care is exercised to preserve the surface topography. However, for rolled copper-clad circuit boards, the surface roughness of the dielectric will give a poor mechanical bond, and surface treatment is necessary for reliable chemically bonded assemblies.PropertiesThe different manufacturing methods of the two types of foil lead to differences in the electrical andMechanical properties. The primary differences are listed in Table 2.* Values represent properties after lamination to a PTFE laminate.Rogers Statement on Resistive Foil Visual Appearance and Resistivity ExpectationsRogers Advanced Connectivity Solutions (ACS) produces upon request a select number of copper clad laminates using commercially available, subtractively processed resistive foils. Resistive foil technology enables the use of planar resistors within the circuit boards that are made from our laminate products. The availability of these resistive foils varies dependingon each particular copper clad laminate product offered by ACS. However, in general ACS uses both OhmegaPly® foil from Ohmega Technologies, Inc. (/) and TCR® foil from Ticer Technologies (/). ACS customers are encouraged to research the specific resistive foil products that are available as well as the performance and processing details from each foil supplier prior to placing orders with Rogers.(1) Typical values are mean values derived from populations of measurements involving multiple lots of the specific foil type.The information in this data sheet is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not create any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results s hown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit materials for eac h application.These commodities, technology and software are exported from the United States in accordance with the Export Administratio n regulations. Diversion contrary to U.S. law prohibited.The Rogers’ logo, XtremeSpeed RO1200, ML Series, 92ML, StaCool, AD250, AD255, AD260, AD255C-IM, AD300, AD300D-IM, AD320, AD350, AD410, AD430, AD450, AD600, AD1000, CLTE, CLTE-AT, CLTE-XT, CLTE-MW, CuClad, CuClad 217, CuClad 233, CuClad 250, DiClad, DiClad 527, DiClad 870, DiClad 880, DiClad 880-IM, IsoClad, IsoClad 917, IsoClad 933, Kappa 438, LoPro, RO1200, RO3003, RO3006, RO3010, RO3035, RO3203, RO3206, RO3210, RO4003C, RO4350B, RO4360G2, RO4533,RO4534, RO4535, RO4725JXR, RO4730JXR, RO4730G3, RO4830, RO4835, RO4835T, RT/duroid, TC350, TC600, and TMM are trademarks of Rogers Corporation or one of its subsidiaries.OhmegaPly is a registered trademark of Ohmega Technologies, Inc.TCR is a registered trademark owned by Nippon Mining & Metals Co., Ltd.Ticer Technologies is a licensee of the technology and trademark of TCR Wyko is a trademark of Veeco Instruments.© 2021 Rogers Corporation, Printed in U.S.A. All rights reserved.Revised 1530 091721 Publication #92-243References:1. S.P . Morgan, “Effect of surface roughness on eddy current losses at microwave frequencies,” J. Applied Physics, p. 352, v. 20, 19492. E. Hammerstad and O. Jensen, “Accurate models of computer aided microstrip design,” IEEE MTT-S Symposium Digest, p. 407, May 19803. D. M. Pozar, Microwave Engineering, 2nd Edition, Wiley (1998)4. P .G. Huray, O. Oluwafemi, J. Loyer, E. Bogatin, and X. Ye, “Impact of Copper Surface Texture on Loss: A model that works,” DesignCon20105. A.F. Horn III, J. W. Reynolds, P . A. LaFrance, J. C. Rautio, “ Effect of conductor profile on the insertion loss, phase constant, and dispersion of thin high frequencytransmission lines,” DesignCon20106. A. F. Horn, III, J. W. Reynolds, J. C. Rautio, “Conductor profile effects on the propagation constant of microstrip transmission line,” Microwave Symposium Digest(MTT), 2010 IEEE MTT-S International, pp 868-8717. Allen F. Horn III, Patricia A. LaFrance, Christopher J. Caisse, John P . Coonrod, Bruce B. Fitts, “Effect of conductor profile structure on propagation in transmissionlines,”. DesignCon2016。

天骄MT600(1万毫安路由器)使用说明书

天骄MT600(1万毫安路由器)使用说明书

MT600(1万毫安路由器)使用说明书一、外观与功能介绍序号名称功能说明1SIM卡座使用Micro-SIM卡,芯片朝正面,缺口朝下插入SIM卡座2开关键长按3秒开机,开机状态下长按3-5秒即可关机3R键长按5秒恢复出厂设置4数据充电口数据传输接口,充电接口,输入:5V-1.5A/2A5输出供电口对外输出供电,输出:5V-1.5A6显示屏显示网络运营商、信号、流量、开机时间、WiFi名称密码等二、使用说明2.1SIM卡的安装使用Micro-SIM卡,卡芯朝正面,缺口朝下插入SIM卡卡槽中,(插拔SIM卡时请在设备关机状态下操作,否则可能损坏您的SIM 卡或者造成设备的故障,影响正常使用设备)2.2开机长按开机键3秒,设备开机,在开机状态下长按开机键3秒设备即可关机;屏幕点亮的情况下按动开关键可以切换屏幕显示菜单(开机时间、流量统计与WiFi名称、密码间的切换)2.3WiFi的连接用手机或笔记本电脑搜索WiFi:GB3-XXXX,输入密码:1234567890点确定连接设备的WiFi42.4网关登陆在浏览器地址栏输入192.168.100.1点确定进入网关登陆页面如上图,在界面右上角可以选择语言(支持中文/英文)默认用户名、密码:admin点登陆进入管理界面。

2.5网关管理可以查看设备信息、修改个性设置(流量查看与管理,APN管理,WiFi名称、密码的修改,短息管理等)2.5-1网络——APN配置一些特殊的SIM卡需要添加APN信息之后才可以正常使用2.5-2网络——流量统计在这里可以查看流量使用记录,(运营商的流量计算方式可能与设备的流量计算方式不同,以运营商的流量使用为准)2.5-3流量——流量管理流量管理默认为关闭,可以根据个人情况开启使用流量控制。

2.5-4WLAN——WLAN管理修改设备的WiFi名称(SSID)、密码,同时连接设备的人数。

开启WPS 功能,可以免输入WiFi密码连接设备WiFi。

罗克韦尔自动化 Trusted 双信道 I O 智能插槽电缆 使用手册说明书

罗克韦尔自动化 Trusted 双信道 I O 智能插槽电缆 使用手册说明书

ICSTT-RM314J-EN-P (PD-TC600) TrustedTrusted Dual I/O SmartSlot CablesProduct OverviewThis document provides detailed information for the types of Trusted® Dual input/output (I/O) Cables (typically 60 Channel) available within the SmartSlot group. These types of cable provide connection facilities between the Trusted analogue and digital input/output modules, and Trusted Field Termination Assemblies (FTAs).The types of Trusted I/O 60 Channel SmartSlot Cables currently available are listed in Table 1 below.Cable Type DescriptionTC-601-02-xmx I/O SmartSlot, Internal, 60 Channel Input to FTATC-601-03-xmx I/O SmartSlot, Internal, 60 Channel Input to FTA (UL)TC-602-02-xmx I/O SmartSlot, Internal, 60 Channel Input to Flying LeadTC-602-03-xmx I/O SmartSlot, Internal, 60 Channel Input to Flying Lead (UL)TC-604-02-xmx I/O SmartSlot, External, 60 Channel Input to Flying LeadTC-604-03-xmx I/O SmartSlot, External, 60 Channel Input to Flying Lead (UL)Table 1 Trusted I/O 60 Channel SmartSlot CablesThe cables are manufactured to user’s requirements, therefore length and type of cable insulation must be specified. Length must be specified to the nearest 0.5 m in the format xmx, e.g. 2m0 for a cable length of 2.0 m. This detail must be added to the end of the part number. The type of cable insulation forms part of the cable part number and is denoted by 02 for Low Smoke Zero Halogen (LSZH) or 03 for UL Certified cable material. 02 is also flame retardant to IEC 60332-3 Cat A. PVC covered cables are not available. When ordering cables, it is recommended that the user supplies the details as shown in Table 1.The maximum recommended I/O cable length is 15 m. Cables longer than this may be specified if necessary but may suffer from voltage drop, offset, crosstalk and noise and will present materials handling problems.Internal cables are designed for cables where they are terminated in adjacent enclosures. If the cable needs to leave the enclosure environment, the external cable has more protection. Note that the ‘external’ cables are not armoured and are not suitable for truly external use and must still be treated with care. These cables will need protection when drawn through a cable route, and shouldTrusted ICSTT-RM314J-EN-P also not be pulled by the connector(s). They should enter cabinets through transit/compression blocks and cannot be glanded.The SmartSlot cables described in this document allow hot-swap modules to be sited in separated slots as required, linked with a SmartSlot jumper cable. For Companion Slot cables, allowinghot-swap modules to be sited in adjacent slots using a double width chassis socket, refer to Trusted Dual I/O Companion Slot Cables, publication ICSTT-RM315 (PD-TC700).This document describes cables for dual modules (typically 60 channel). For Triple Modular Redundant (TMR) modules (typically 40 channel), refer to Trusted TMR I/O SmartSlot Cables, publication ICSTT-RM313 (PD-TC500) and Trusted I/O Companion Slot Cables, publicationICSTT-RM311 (PD-TC200).For details of the TC-306 and TC-308 jumper cables, refer to Trusted Communications Cables, publication ICSTT-RM312 (PD-TC300).PREFACEIn no event will Rockwell Automation be responsible or liable for indirect or consequential damages resulting from the use or application of this equipment. The examples given in this manual are included solely for illustrative purposes. Because of the many variables and requirements related to any particular installation, Rockwell Automation does not assume responsibility or reliability for actual use based on the examples and diagrams.No patent liability is assumed by Rockwell Automation, with respect to use of information, circuits, equipment, or software described in this manual.Allen-Bradley, LISTEN. THINK. SOLVE., Rockwell Automation, TechConnect, and Trusted are trademarks of Rockwell Automation, Inc.All trademarks are acknowledged.DISCLAIMERIt is not intended that the information in this publication covers every possible detail about the construction, operation, or maintenance of a control system installation. You should also refer to your own local (or supplied) system safety manual, installation and operator/maintenance manuals.REVISION AND UPDATING POLICYThis document is based on information available at the time of its publication. The document contents are subject to change from time to time. The latest versions of the manuals are available at the Rockwell Automation Literature Library under "Product Information" information "Critical Process Control & Safety Systems".TRUSTED RELEASEThis technical manual was updated for Trusted Release 4.0.LATEST PRODUCT INFORMATIONFor the latest information about this product review the Product Notifications and Technical Notes issued by technical support. Product Notifications and product support are available at the Rockwell Automation Support Centre atAt the Search Knowledgebase tab select the option "By Product" then scroll down and select the Trusted product.Some of the Answer ID’s in the Knowledge Base require a TechConnect℠ Support Contract. For more information about TechConnect Support Contract Access Level and Features, click on the following link:https:///app/answers/detail/a_id/50871This will get you to the login page where you must enter your login details.IMPORTANT A login is required to access the link. If you do not have an account then you can create one using the "Sign Up" link at the top right of the web page.DOCUMENTATION FEEDBACKYour comments help us to write better user documentation. If you discover an error, or have a suggestion on how to make this publication better, send your comment to our technical support group at SCOPEThis manual specifies the maintenance requirements and describes the procedures to assist troubleshooting and maintenance of a Trusted system. WHO SHOULD USE THIS MANUALThis manual is for plant maintenance personnel who are experienced in the operation and maintenance of electronic equipment and are trained to work with safety systems. SYMBOLSIn this manual we will use these notices to tell you about safety considerations.SHOCK HAZARD: Identifies an electrical shock hazard. If a warning label is fitted, it can be on or inside the equipment.WARNING: Identifies information about practices or circumstances that can cause an explosion in a hazardous environment, which can cause injury or death, property damage or economic loss.ATTENTION: Identifies information about practices or circumstances that can cause injury or death.CAUTION: Identifies information about practices or circumstances that can cause property damage or economic loss.BURN HAZARD: Identifies where a surface can reach dangerous temperatures. If a warning label is fitted, it can be on or inside the equipment.This symbol identifies items which must be thought about and put in place when designing and assembling a Trusted controller for use in a Safety Instrumented Function (SIF). It appears extensively in the Trusted Safety Manual.IMPORTANTIdentifies information that is critical for successful application and understanding of the product.NOTE Provides key information about the product or service.TIP Tips give helpful information about using or setting up the equipment.WARNINGS AND CAUTIONSWARNING: EXPLOSION RISKDo not connect or disconnect equipment while the circuit is live or unless the area is known to be free of ignitable concentrations or equivalentAVERTISSEMENT - RISQUE D’EXPLOSIONNe pas connecter ou déconnecter l’équipement alors qu’il est sous tension, sauf si l’environnement est exempt de concentrations inflammables ou équivalenteMAINTENANCEMaintenance must be carried out only by qualified personnel. Failure to follow these instructions may result in personal injury.CAUTION: RADIO FREQUENCY INTERFERENCEMost electronic equipment is influenced by Radio Frequency Interference. Caution should be exercised with regard to the use of portable communications equipment around such equipment. Signs should be posted in the vicinity of the equipment cautioning against the use of portable communications equipment.CAUTION:The module PCBs contains static sensitive components. Static handling precautions must be observed. DO NOT touch exposed connector pins or attempt to dismantle a module.ISSUE RECORDIssue Date Comments5 Sep 05 Format6 Aug 06 Free wire idents7 Dec 07 Flame retardance8 Apr 16 Rebranded, reformatted and correction of typographical errors9 Feb 19 Removed information about cables that are no longer offered.Added trademarks statement.Updated document display Rockwell Automation publication numbers.10 May 19 Added information about -03 suffix (UL) cables.Page intentionally left blankTrusted Dual I/O SmartSlot Cables Table of Contents Table of Contents1.Cable Selection Guides (3)2.I/O 60-Channel SmartSlot Cable Type TC-601 (5)3.I/O 60-Channel SmartSlot Cable Type TC-602 (7)4.I/O 60-Channel SmartSlot Cable Type TC-604 (9)Table of Contents Trusted Dual I/O SmartSlot CablesPage intentionally left blankTrusted Dual I/O SmartSlot Cables 1. Cable Selection Guides 1.Cable Selection GuidesINTERNAL SMARTSLOTINPUTFTA TC-501-VFTA TC-511-Flying Lead TC-502-OUTPUTFTA TC-505-VFTA TC-509-Flying Lead TC-506-Integral Power Flying Lead TC-516- COMPANION SLOTINPUTFTA TC-201-VFTA TC-211-Flying Lead TC-202-OUTPUTFTA TC-205-VFTA TC-209-Flying Lead TC-206-Integral PowerFTA TC-215-Flying Lead TC-216-EXTERNAL SMARTSLOTINPUTFTA TC-503-VFTA TC-512-Flying Lead TC-504-OUTPUTFTA TC-507-VFTA TC-510-Flying Lead TC-508-Integral PowerFTA TC-517-Flying Lead TC-518- COMPANION SLOTINPUTFTA TC-203-VFTA TC-212-Flying Lead TC-204-OUTPUTFTA TC-207-VFTA TC-210-Flying Lead TC-208-Integral Power Flying Lead TC-218- Table 2 TMR 40 Channel Standard Cable Selection Guide1. Cable Selection Guides Trusted Dual I/O SmartSlot CablesINTERNAL SMARTSLOT INPUT FTA TC-601- COMPANION SLOT INPUT FTA TC-701-Table 3 Dual 60 Channel Standard Cable Selection GuideThe types of I/O 60 Channel SmartSlot Cables are described separately in the following sections.Trusted Dual I/O SmartSlot Cables 2. I/O 60-Channel SmartSlot Cable Type TC-6012. I/O 60-Channel SmartSlot Cable Type TC-601This type of cable, and the modules/FTAs it is used with, is shown in Figure 1 below.Figure 1 I/O 60 Channel SmartSlot Cable Type TC-601This type of Trusted I/O 60 Channel SmartSlot Cable is designed for use with analogue or digital input modules and is suitable for connecting input signals from an internal FTA to the module.The modules and FTAs are matched pairs for this cable: • T8402 uses T8802 • T8432 uses T8832• T8433 uses T8833 (non-standard connections on this module need the 60 channelcable). The chassis end of the multi-core cable is fitted with a 96-way type ‘C’ connector housed in a single-width hood (type TC-500). The other end of the cable is fitted with a 96-way type ‘R’ connector housed in a single-width hood enabling the cable to be connected to an FTA. The multi-core cable is stripped back 1.5 m at both ends, then shrouded in nylon Rilgain sheathing. The ends of the sheathing are heated or fitted with over sleeving to help preventfraying.2. I/O 60-Channel SmartSlot Cable Type TC-601 Trusted Dual I/O SmartSlot Cables At both the chassis and remote end, a sheathed braid allows the connector hood to be wired to safety earth. At the remote end, the multi-core screen drain is wired to a green wire to allow connection to screen earth.Trusted Dual I/O SmartSlot Cables 3. I/O 60-Channel SmartSlot Cable Type TC-602 3.I/O 60-Channel SmartSlot Cable Type TC-602This type of cable, and the modules/FTAs it is used with, is shown in Figure 2 below.ModuleT8402T8432T8433Figure 2 I/O 60 Channel SmartSlot Cable Type TC-602This type of Trusted I/O 60 Channel SmartSlot Cable is designed for use with analogue or digital input modules and is suitable for connecting input signals from internal terminals to the module.The chassis end of the multi-core cable is fitted with a 96-way type ‘C’ connector housed in a single-width hood (type TC-500). The other end of the cable is left as a ‘flying lead’ enabling the cable to be terminated as required, e.g. connected to conditioned field terminals.The flying leads are sleeved with identity ferrules marked CH1, CH2, CH3 etc. for channel terminations or 0 V for group reference terminations.The multi-core cable is stripped back 1.5 m at both ends, then shrouded in nylon Rilgain sheathing. The ends of the sheathing are heated or fitted with over sleeving to help prevent fraying.At the chassis end, a sheathed braid allows the connector hood to be wired to safety earth. At the remote end, the multi-core screen drain is wired to a green wire to allow connection to screen earth.3. I/O 60-Channel SmartSlot Cable Type TC-602 Trusted Dual I/O SmartSlot CablesPage intentionally left blankTrusted Dual I/O SmartSlot Cables 4. I/O 60-Channel SmartSlot Cable Type TC-604 4.I/O 60-Channel SmartSlot Cable Type TC-604This type of cable, and the modules/FTAs it is used with, is shown in Figure 3 below.ModuleT8402T8432T8433Figure 3 I/O 60-Channel SmartSlot Cable Type TC-604This type of Trusted I/O 60 Channel SmartSlot Cable is designed for use with analogue or digital input modules and is suitable for connecting input signals from external terminals to the module.The chassis end of the multi-core cable is fitted with a 96-way type ‘C’ connector housed in a single-width hood (type TC-500). The other end of the cable is left as a ‘flying lead’ enabling the cable to be terminated as required, e.g. connected to conditioned field terminals.The flying leads are sleeved with identity ferrules marked CH1, CH2, CH3 etc. for channel terminations or 0 V for group reference terminations.The multi-core cable is stripped back 1.5 m at both ends, then shrouded in nylon Rilgain sheathing. The ends of the sheathing are heated or fitted with over sleeving to help prevent fraying.At the chassis end, a sheathed braid allows the connector hood to be wired to safety earth. At the remote end, the multi-core screen drain is wired to a green wire to allow connection to screen earth.。

TC600C染色机电脑操作说明

TC600C染色机电脑操作说明

目录一、性能简介 (03)二、使用说明 (04)2.1 按键功能 (04)2.2 主界面 (05)2.3 解锁上锁 (06)三、工艺管理 (07)3.1 工艺运行 (07)3.2 新建工艺 (08)3.3 删除工艺 (11)3.4 复制工艺 (11)3.5 工艺改名 (11)3.6 修改工艺 (12)3.7各项功能简介 (12)1)主功能 (13)2)并功能 (17)四、运行工艺 (22)4.1 开始运行 (22)4.2 暂停跳步 (23)4.3在线编程 (23)五、运行状态 (23)5.1输入输出状态 (24)5.2详细信息状态 (26)5.3机械状态 (26)5.4运行状态 (26)六、信息查阅 (27)6.1日志事件 (27)6.2曲线记录 (27)6.3当前工艺 (28)6.4批次资料 (28)七、工具箱 (28)7.1参数设置 (28)7.1.1 普通参数 (28)①时间类 (29)②温度类 (30)③水位类 (31)④水量转换 (32)⑤百分比 (32)⑥温控 (32)7.1. 2 系统参数 (32)7.1. 3 输入输出 (34)①模拟量输入 (34)②模拟量输出 (34)③开关量输入 (35)④开关量输出 (35)7.2 校正设置 (36)7.3 PLC设置............................ (36)7.4 密码设置 (37)八、HG-9900与PLC通讯协议 (38)8.1三菱FX系列(适用FX1N-FX2N) (38)8.2 LG–Master-K 系列(K10S1 除外) (38)8.3台达DVP-ES 系列...... (38)九、HG-9900接线图 (40)一、性能简介HG-9900染色机控制电脑采用10.4寸TFT LCD显示和触摸屏操作,采用友好的人机界面,屏幕显示清晰度高, 屏幕宽大,显示直观。

该电脑为全自动控制电脑,可实现染色过程自动化控制,是染色行业提高产品染色质量,降低能源消耗,减轻劳动强度,提高经济效益的理想设备。

TC600使用说明

TC600使用说明

TC600 涂层测厚仪使用说明上海高致精密仪器有限公司1 概述 (3)1.1 技术参数 (3)1.2 主要功能 (4)1.3 工作原理 (4)1.4 仪器配置 (6)1.5 工作条件 (6)2 结构与外观 (7)2.1 仪器外观 (7)2.2 主机结构 (7)2.3 测头结构 (8)2.4 主显示界面 (8)2.5 键盘定义 (9)3 仪器使用 (10)3.1 测头选择 (10)3.2 仪器开、关机 (10)3.3 基本测量步骤 (10)3.4 存储功能 (11)3.5 改变单位制式 (12)3.6 背光功能 (12)3.7 电池电量指示 (13)3.8 自动关机 (13)3.9 恢复出厂设置 (13)3.10 与PC机通讯 (13)3.11 提示信息对照表 (14)4 仪器校准 (14)4.1 校准标准片 (14)4.2 基体 (15)4.3 校准方法 (15)4.3.1 零点校准 (15)4.3.2二点校准 (16)4.3.3 测头基本校准 (17)5维护及注意事项 (19)5.1一般注意事项 (19)5.2电池检查 (19)5.3 校零基体的维护 (19)5.4 机壳的清洁 (19)5.5 仪器维修 (19)附录 (20)附录1 测头参数表 (20)附录2 测头选择导引 (22)附录3 影响测量精度的因素 (24)用户须知 (27)1 概述本仪器是便携式涂(镀)层测厚仪,它能快速、无损伤、精密地进行涂层、镀层厚度的测量,也可进行薄膜厚度测量。

本仪器能广泛地应用在制造业、金属加工业、化工业、商检等检测领域,是材料保护专业必备的仪器。

本仪器符合以下标准:GB/T 4956─2003 磁性基体上非磁性覆盖层覆盖层厚度测量磁性法GB/T 4957─2003 非磁性金属基体上非导电覆盖层覆盖层厚度测量涡流法JB/T 8393─1996 磁性、涡流式覆层厚度测量仪JJG 818─2005 《磁性、电涡流式覆层厚度测量仪》1.1 技术参数●采用了磁性和涡流两种测厚方法。

罗杰斯公司产品介绍说明书

罗杰斯公司产品介绍说明书

EngineeredMaterialSolutionsFOCUSED ON INNOVATIONLeading your designchallenges to theperfect solutionChip Scale Packaging.at the local level.application needs and environments. Rogers’application anddevelopment process.already best in class, enables us to anticipatequestions and work collaborativelyto push the materialperformance envelope.Join Our TechnologySupport Hub Today& Access Online Tools:Instructional Videos• Fabricator Focused Learning Series• Coonrod’s Corner• Webinars• 5G VideosTechnical Articles• Extensive database of articles and whitepapersTools• Interactive Product Properties Tool• Resonator Calculator• Microwave Impedance Calculator• Dk Calculator• Conversion Calculator/techubContact InformationThe Americas Rogers Corporation 480-961-1382Europe/Africa Rogers BV 32-9-2353611Asia Rogers Suzhou 86-512-6258-2872© 2022 Rogers Corporation. All Rights Reserved. PUB 92-606, 1571 060722The Rogers’logo, RT/duroid, RO3000, RO4000, CLTE, CuClad, DiClad, IsoClad, RO4725JXR,MAGTREX, Radix, curamik, COOLSPAN, TC300, TC600 and TMM are trademarks of RogersCorporation or one of its subsidiaries.RF/HIGH RELIABILITY LAMINATESModern Aerospace and Defense systems rely on high performance and high reliability materials toachieve peak performance in demanding mission critical applications. Rogers is the leader in high reliability /high performance / high frequency PCB laminate solutions. • RT/duroid® 5000 and RT/duroid 6000 product families • R O3000®, CLTE™, CuClad®, DiClad® and IsoClad® PTFE based systems • R O4000® thermoset systems, including RO4725JXR™, low Dk thermoset laminate, the lowest in the industry• Cladding includes copper, and heavy metal backed options • Compatible bondply and prepreg materialsFOR MORE DETAILED INFORMATIONScan the QR code to view our Product Selector GuideRADOME & RF TRANSPARENT WINDOWSRogers is the leading supplier of low loss PTFEmaterials used in RF Transparent windows and high performance Radome systems. • A blative solutions in high speed / high velocity systems• Molded and shaped dielectric composites • Metallized options available• RF Transparent materials for use in WindowsANTENNA SOLUTIONSRogers’ advanced material developments are leading performance enhancements to many antenna solutions. Rogerssupports customers from the idea phase through production and have referencedesigns to accelerate customer design cycles. • M AGTREX® Magnetodielectric System, enables miniaturization with 6x the bandwidth• RT/duroid 5000 and RT/duroid 6000 PTFE systems• RO3000, CLTE, CuClad, DiClad and IsoClad PTFE based systems • RO4000 thermoset systems• Radix™ 3D Printable Dielectric SystemsADVANCED MATERIALSRogers curamik® product suite offers best-in-class metallized ceramic substrates that enable higher power efficiency. Our curamik substrates consist of pure copper bonded or brazed to a ceramic substrate and are designed to carry higher currents, provide higher voltage isolation and operate over a wide temperature range. • D BC (Direct Bond Copper) available on AlN, Al2O3, HPS substrate circuit solutions - curamik Thermal - curamik Power - curamik Endurance - curamik Power Plus • A MB (Active Metal Brazed) copper available on Si3N4 ceramic substrates - curamik PerformanceAdvanced materials with high reliability under extreme conditions, critical for aerospace, commercial aircraft and defense applications.For decades, design engineers have relied on Rogers’ ad-vanced materials to enable commercial aircraft and aerospace and defense systems, even in the harshest conditions. Today, our high reliability, high performance solutions can be found in the majority of the world’s commercial and military aircraft. Look to Rogers for high frequency circuit materials for radar and navigation systems, ceramic substrates and laminated busbars that improve performance and dissipate heat, and gasketing solutions for extreme sealing and protection.• Ultra Low Loss Laminates and Dielectrics • High Thermally Conductive Materials • Advanced Thermal Control Solutions• Magnetodielectric Materials for Antenna Miniaturization • Ablative and RF Transparent Materials for Radomes and Windows • 3D Additive Manufacturing Low Loss, High Dk Resin Systems • Advanced Phased Array Material Systems• Formed and Shaped Dielectric Systems with Metallization SolutionsTHERMAL MANAGEMENTThermal management is a critical element in the design and manufacturing of printed circuit boards (PCBs) for a wide range of applications. Quite simply, heat can be destructive. The more effectively heat is dissipated through and from a PCB, the better the opportunity for a long, reliable operating lifetime of that PCB. • curamik micro-channel coolers • C OOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) • T C300™ and TC600™ series high thermal conductivity PTFE solutions • R T/duroid 6035HTC and other high thermal conductivity solutionsSPECIALTY DIELECTRICSRogers’ specialty dielectrics include Radix 3D printable dielectrics and TMM® (Thermoset Microwave Material) moldable shaped thermoset materials. • R adix 3D Printable dielectric expands design windows allowing unique spatially variant dielectric constant solutions such as Lenses and Radomes • T MM systems with Dk ranges from ~3-~13. Material is moldable and shapable into unique configurations for Radome, Windows and other high frequency applications • R adix and TMM materials are compatible with various metallization solutions。

保千里夜视仪说明书

保千里夜视仪说明书

夜视仪操作指南- 1 -请先阅读“夜视仪”在本手册中称为“本机”。

操作本机以前,请仔细阅读本说明书,并妥善保存以便日后查阅。

警告◆按照激光安全国际标准,本产品属于四类激光产品(CLASS Ⅳ)。

◆当激光灯正在工作时,10米以内切勿用眼睛逆光/直视或通过光学仪器观察,以免造成伤害。

◆在激光灯工作时,切勿在距离激光灯出光口5米内有任何可燃物,以免发生火灾。

- 2 -◆在激光灯工作时,2米以内,切勿用手或身体其它部分对激光阻挡,以免发生对皮肤伤害或火灾。

◆为减少发生火灾或触电的危险,请勿让本装置淋雨或受潮。

◆为减少火灾或触电的危险,请勿在本装置上放置如花瓶等盛有液体的物体。

◆切勿将本机暴露在火或类似的极热的环境下。

注意事项1. 请勿将产品置于不稳定的平面上进行测试、安装等操作,在进行操作前要确保机器摆放平稳、装配牢固。

2.运输及保管过程中要防止重压、剧烈振动和浸泡等对产品造成的损坏。

- 3 -3.接线时必须遵守各项电气安全标准,充电时请使用本机自带的专用充电电源或车载充电器充电,使用其他品牌充电器充电造成损失的本公司不负任何责任。

4. 不要在超出温度、湿度标准的环境下使用。

摄录仪使用温度为-10℃至45℃,湿度小于 90%。

5. 本产品内部并无用户可自行维修的部件,当机器有故障时,请勿轻易对机器进行任何修理操作,应先参照说明书查出故障,查不出原因则请专业人员维修。

有关维修工作,必须由我公司授权的维修网点进行维修或邮寄回本公司进行维修。

- 4 -目录请先阅读 (2)本机参数 (8)各部品名称......................................... - 12 - 准备工作..................................................... - 18 - 检查箱内附件..................................... - 18 - 安装示意图:............................................. - 21 - 背带安装............................................. - 21 -底座安装 (22)镜头盖、遮光罩安装 (23)三脚架安装......................................... - 24 - 快速操作指南............................................. - 25 - 充电..................................................... - 25 -开关机................................................. - 28 -按键操作说明..................................... - 29 -面板显示说明..................................... - 31 -基本操作说明..................................... - 33 -工作模式介绍..................................... - 35 -- 5 -录像/播放 ................................................... - 37 - 手动录像............................................. - 37 -播放..................................................... - 39 -快进/快退 ........................................... - 40 -音量加/减 ........................................... - 41 -电脑上播放......................................... - 43 - 特种功能使用及注意事项................................. - 44 - 自定义本机 ........................................................ - 45 - 主菜单设定................................................. - 46 - 摄像机设置................................................. - 49 - 录像系统设置............................................. - 53 - 影像设定..................................................... - 54 - 画质设定............................................. - 54 - 录像设定..................................................... - 58 - 预约时间............................................. - 59 -覆盖功能............................................. - 64 -档案长度............................................. - 65 -- 6 -录像模式..................................................... - 68 - 播放与删除视频文件................................. - 70 - 系统设定..................................................... - 72 - 时间设置............................................. - 74 -格式化................................................. - 74 -记忆卡信息......................................... - 75 - 简易故障排除及维修................................. - 78 - 注意事项............................................. - 81 - 配件清单..................................................... - 82 -- 7 -本机参数- 9 -- 10 -- 11 -- 12 - 各部品名称右选择菜单/确认 向下/缩小 模式/返回 左选择 向上/放大内置麦克风显示屏充电指示灯(内置)录像回放/暂停/删除/AE 录像回放/暂停(39页)删除(42页)AE调整(44页)底座开关机手动录像录像回放脚垫- 13 -录像键/强光抑制录像:(37页)强光抑制:(44页)开关机长按3秒钟进行开关机超声波感应器左挂绳柱摄像机激光光源右挂绳柱喇叭- 14 -麦克风插孔复位按钮激光开关耳机插孔DC IN插孔左把手:外置麦克风插孔。

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1.2 主要功能 有十种测头类型可供选择,测头接触部件镀硬铬或为红宝石, 经久耐用; 通过选择相应的测头,既可测量磁性金属基体上非磁性覆盖 层的厚度,又可测量非磁性金属基体上非导电覆盖层的厚度; 具有测头零点校准、一点校准、两点校准功能, 并可用基本 校准法对测头的系统误差进行修正; 具有测量状态提示功能; 有 EL 背光显示,方便在光线昏暗环境中使用; 有剩余电量指示功能,可实时显示电池剩余电量; 具有自动休眠、自动关机等节电功能; 带有 USB1.1 通讯接口,可将测量值传输至 PC 机。 可选择配备微机软件,具有传输测量结果、测值存储管理、 测值统计分析、打印测值报告等丰富功能; 采用铝制外壳,小巧、便携、坚实耐用,适用于恶劣的操作 环境,抗振动、冲击和电磁干扰; 1.3 工作原理 本仪器采用了磁性和涡流两种测厚方法,可无损地测量磁性金 属 (如钢、铁、镍、合金和硬磁性钢等) 基体上非磁性覆盖层的厚 度(如铝、铬、铜、珐琅、橡胶、油漆等),及非磁性金属基体(如铜、 铝、不锈钢、锌、锡等)上非导电覆盖层的厚度(如:珐琅、橡胶、 油漆、塑料等)。
TC600 涂层测厚仪 使用说明 上海高致精密仪器有限公司
1 概述................................................................................. 3 1.1 技术参数............................................................. 3 1.2 主要功能............................................................. 4 1.3 工作原理............................................................. 4 1.4 仪器配置............................................................. 6 1.5 工作条件............................................................. 6 2 结构与外观..................................................................... 7 2.1 仪器外观............................................................. 7 2.2 主机结构............................................................. 7 2.3 测头结构............................................................. 8 2.4 主显示界面......................................................... 8 2.5 键盘定义............................................................. 9 3 仪器使用....................................................................... 10 3.1 测头选择........................................................... 10 3.2 仪器开、关机................................................... 10 3.3 基本测量步骤................................................... 10 3.4 存储功能........................................................... 11 3.5 改变单位制式................................................... 12 3.6 背光功能........................................................... 12 3.7 电池电量指示................................................... 13 3.8 自动关机........................................................... 13 3.9 恢复出厂设置................................................... 13 3.10 与 PC 机通讯................................................. 13 3.11 提示信息对照表............................................. 14 4 仪器校准....................................................................... 14 4.1 校准标准片....................................................... 14
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4.2 基体................................................................... 15 4.3 校准方法........................................................... 15 4.3.1 零点校准........................................................15 4.3.2 二点校准.........................................................16 4.3.3 测头基本校准................................................17 5 维护及注意事项............................................................ 19 5.1 一般注意事项.................................................... 19 5.2 电池检查............................................................ 19 5.3 校零基体的维护............................................... 19 5.4 机壳的清洁....................................................... 19 5.5 仪器维修........................................................... 19 附录....................................................................................20 附录 1 测头参数表................................................. 20 附录 2 测头选择导引............................................. 22 附录 3 影响测量精度的因素................................. 24 用 户 须 知......................................................................27
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1.4 仪器配置 序 号 标准 配置 1 2 3 4 5 6 7 8 可选 配置 9 10 11 与厂家联系。 1.5 工作条件 环境温度:操作温度-20℃~+50℃;存储温度:-30℃~+70℃ 相对湿度≤90%; 周围环境无强烈振动、无强烈磁场、无腐蚀性介质及严重粉尘。 其它类型测头 数据管理软件 USB 通讯线缆 1套 1条 根据用途选择 软件光盘 主机 F1 测头 校准片 校零基体 仪器箱 随机资料 AA(5 号)尺寸碱性电池 1台 1只 5片 1块 1只 1份 2只 根据测头选配 或 N1 测头 名称 数量 备注
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1 概述 本仪器是便携式涂(镀)层测厚仪,它能快速、无损伤、精 密地进行涂层、镀层厚度的测量,也可进行薄膜厚度测量。本仪 器能广泛地应用在制造业、金属加工业、化工业、商检等检测领 域,是材料保护专业必备的仪器。 本仪器符合以下标准:
GB/T 4956─2003 磁性基体上非磁性覆盖层 覆盖层厚度测量 磁性法 GB/T 4957─2003 非磁性金属基体上非导电覆盖层 覆盖层厚度测量 涡流法 JB/T 8393─1996 磁性、涡流式覆层厚度测量仪 JJG 818─2005 《磁性、电涡流式覆层厚度测量仪》
测头上设计有芯片,测头基本校准数据就存储于该芯片内。开 机时,仪器会自动读取该芯片,并将测头的基本校准数据下载到 仪器中。 插头插入仪器操作:使插头定位台阶对准插座定位槽,紧握插 头尾端向前适当用力推动插头滑入插座。 拔出插头操作:捏住插头滑套,适当用力向外拉动插头。 插拔测头时,应沿插头轴线用力,不可旋转测头,以免损坏测 头电缆芯线。 2.4 主显示界面 仪器开机后会自动进入显示界面,如下图所示:
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测量状态标识:该标识反映测头与被测工件接触是否良好 校准标识:对仪器进行两点校准或者基本校准时出现 测头类型:当前测头类型:F 型或者 N 型 存储标识:存储数据时,或者对仪器存储器操作时,出现该标识 单位制式:μm(公制时) ,或者 mil(英制时) 电池电量:电池剩余电量显示 测 量 值:显示厚度测量值,以及简单的操作提示信息。 2.5 键盘定义 仪器开关键 背光开关键 测头校零 单位制切换/退出键 数据存储/删除键 仪器校准 确认键 数值增加键 数值减小键
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