STM32F103C8T6最小系统
STM32F103C8T6最小系统地的构建（1）
STM32F103C8T6最小系统地的构建（1）2018年7月3日硬件学习笔记(1)一直没有做过什么系统性的笔记，导致很多知识学了忘，忘了又花很长时间去找资料重新学习。
干脆网络保存学习笔记好了，有愿相互探讨的可以邮件我。
最小系统了解过多次，但一直没有自己把最小系统构建出来，在准备做笔记的同时将最小系统解析一下，因为接触到最多的就是单片机了，而手上又还有一点32芯片，所以直接构建32的最小系统了。
网上百度了很久最小系统，不知道是不是我知识量跟不上，总有点理解不了。
直接就结合网络上的信息直接理解了。
最小系统由：电源部分，处理器部分，下载电路，时钟电路，复位电路，负载电路组成。
电源部分：给系统提供能源的，必不可少。
那如何设计输入电源呢。
我们所接触到的最小系统多数都是直接由电脑USB供电，作为学习版，这样是没问题的，不过我们能不能用电池供电呢。
这个肯定是能的，对我们来说，电池供电难以选择电池类型，电池的体积太大了，纽扣电池尽管体积小一点，但在对电路负载的控制上还是差了一点。
扯远了，不管怎么选电池，一正一负两个接口就对了，单单两个接口还是不够的，我们不确定使用人员使用多高电压电流的电源来对系统供电，于是我们需要对输入电源布置一个稳压电路来稳定输入电源。
参考了部分电路资料，查找了一下电源稳压的一些信息后，布置了以上的电源输入电路，输入电源电压可以达到一个比较高的状态也可以输出一个较稳定的5V电压。
电路上的电容都是对电源进行滤波的，两个二极管是用作防反接用途的，电源指示灯和电阻就不用多说了，电感是用作稳定直流作用的。
一般来说，最小系统可能用不上这么高压的电源，一些驱动器才会使用强电流的电源器件，控制器有5V的电源就足够了。
以上是对输入电源稳压的解析，之后再讲解稳压电源到芯片电源的转换。
智能小车控制实验报告
一、实验目的本次实验旨在通过设计和搭建一个智能小车系统，学习并掌握智能小车的基本控制原理、硬件选型、编程方法以及调试技巧。
通过实验，加深对单片机、传感器、电机驱动等模块的理解，并提升实践操作能力。
二、实验原理智能小车控制系统主要由以下几个部分组成：1. 单片机控制单元：作为系统的核心，负责接收传感器信息、处理数据、控制电机运动等。
2. 传感器模块：用于感知周围环境，如红外传感器、超声波传感器、光电传感器等。
3. 电机驱动模块：将单片机的控制信号转换为电机驱动信号，控制电机运动。
4. 电源模块：为系统提供稳定的电源。
实验中，我们选用STM32微控制器作为控制单元，使用红外传感器作为障碍物检测传感器，电机驱动模块采用L298N芯片，电机选用直流电机。
三、实验器材1. STM32F103C8T6最小系统板2. 红外传感器3. L298N电机驱动模块4. 直流电机5. 电源模块6. 连接线、电阻、电容等7. 编程器、调试器四、实验步骤1. 硬件搭建：- 将红外传感器连接到STM32的GPIO引脚上。
- 将L298N电机驱动模块连接到STM32的PWM引脚上。
- 将直流电机连接到L298N的电机输出端。
- 连接电源模块，为系统供电。
2. 编程：- 使用Keil MDK软件编写STM32控制程序。
- 编写红外传感器读取程序，检测障碍物。
- 编写电机驱动程序，控制电机运动。
- 编写主程序，实现小车避障、巡线等功能。
3. 调试：- 使用调试器下载程序到STM32。
- 观察程序运行情况，检查传感器数据、电机运动等。
- 调整参数，优化程序性能。
五、实验结果与分析1. 避障功能：实验中，红外传感器能够准确检测到障碍物，系统根据检测到的障碍物距离和方向，控制小车进行避障。
2. 巡线功能：实验中，小车能够沿着设定的轨迹进行巡线，红外传感器检测到黑线时，小车保持匀速前进；检测到白线时，小车进行减速或停止。
3. 控制性能：实验中，小车在避障和巡线过程中，表现出良好的控制性能，能够稳定地行驶。
STM32F103最小系统
1 PIU?01
PIU?024
22
24 VDD_1 36 PIU?036 VDD_2 48 PIU?048 VDD_3
PIU?09
C
PID301
9
VDDA
8
STM32F103C8T6 GND VCC3.3
GND
VCC5
POWER COPOWER USB COUSB 1 VCC PIUSB01 2 D- PIUSB02 3 D+ PIUSB03 4 GND PIUSB04 D USB GND PL2303 DPL2303 D+ 1 2 GND
PIC1102 PIC1101
PIY102 COY1 PIY10
COD2 D2
1
Y1 8M
PA8 PA9 PA10 PA11 PA12 PA13/JTMS/SWDIO PA14/JTCK/SWCLK PA15/JTDI OSC_IN/PD0 OSC_OUT/PD1
R2 10k
PIQ102
COQ1 Q1
PIU?045
CORESET RESET
PIREST02
GND
BOOT1
COD1 D1 NLRESET RESET
PID101 PID102
COR1 R1 10k
PIR101
VCC3.3
PIR102
IN1418
PIR20 COR2
B
COC10 C10
PIC1002 PIC1001
22 GND
COC11 C11
\..\STM32F103
Sheet of Drawn By: .SchDoc 4
Bill of Materials
Source Data From: Project: Variant:
基于单片机的数控直流稳压电源设计
基于单片机的数控直流稳压电源设计一、概述随着科技的飞速发展，电子设备在我们的日常生活和工业生产中扮演着越来越重要的角色。
这些设备的稳定运行离不开一个关键的组件——电源。
在各种电源类型中，直流稳压电源因其输出电压稳定、负载调整率好、效率高等优点，被广泛应用于各种电子设备和精密仪器中。
传统的直流稳压电源通常采用模拟电路设计，但这种方法存在着电路复杂、稳定性差、调整困难等问题。
为了解决这些问题，本文提出了一种基于单片机的数控直流稳压电源设计方案。
本设计采用单片机作为控制核心，通过编程实现对电源输出电压的精确控制和调整。
相比于传统的模拟电路设计，基于单片机的数控直流稳压电源具有以下优点：单片机具有强大的计算和处理能力，能够实现复杂的控制算法，从而提高电源的稳定性和精度单片机可以通过软件编程实现各种功能，具有很强的灵活性和可扩展性单片机的使用可以大大简化电路设计，降低成本，提高系统的可靠性。
本文将详细介绍基于单片机的数控直流稳压电源的设计原理、硬件电路和软件程序。
我们将介绍电源的设计原理和基本组成，包括单片机控制模块、电源模块、显示模块等我们将详细介绍硬件电路的设计和实现，包括电源电路、单片机接口电路、显示电路等我们将介绍软件程序的设计和实现，包括主程序、控制算法、显示程序等。
1. 数控直流稳压电源的应用背景与意义随着科技的快速发展，电力电子技术广泛应用于各个行业和领域，直流稳压电源作为其中的关键组成部分，其性能的稳定性和可靠性直接影响着整个系统的运行效果。
传统的直流稳压电源多采用模拟电路实现，其调节精度、稳定性以及智能化程度相对较低，难以满足现代电子设备对电源的高性能要求。
开发一种高性能、智能化的数控直流稳压电源具有重要意义。
数控直流稳压电源通过引入单片机控制技术，实现了对电源输出电压和电流的精确控制。
它可以根据实际需求，通过编程灵活调整输出电压和电流的大小，提高了电源的适应性和灵活性。
同时，数控直流稳压电源还具备过流、过压、过热等多重保护功能，有效提高了电源的安全性和可靠性。
STM32F103C8T6中文资料_引脚图_最小系统
Contents STM32F103x8,STM32F103xB Contents1Introduction (9)2Description (9)2.1Device overview (10)2.2Full compatibility throughout the family (13)2.3Overview (14)2.3.1ARM®Cortex™-M3core with embedded Flash and SRAM (14)2.3.2Embedded Flash memory (14)2.3.3CRC(cyclic redundancy check)calculation unit (14)2.3.4Embedded SRAM (14)2.3.5Nested vectored interrupt controller(NVIC) (14)2.3.6External interrupt/event controller(EXTI) (15)2.3.7Clocks and startup (15)2.3.8Boot modes (15)2.3.9Power supply schemes (15)2.3.10Power supply supervisor (15)2.3.11Voltage regulator (16)2.3.12Low-power modes (16)2.3.13DMA (17)2.3.14RTC(real-time clock)and backup registers (17)2.3.15Timers and watchdogs (17)2.3.16I²C bus (19)2.3.17Universal synchronous/asynchronous receiver transmitter(USART)..192.3.18Serial peripheral interface(SPI) (19)2.3.19Controller area network(CAN) (19)2.3.20Universal serial bus(USB) (19)2.3.21GPIOs(general-purpose inputs/outputs) (20)2.3.22ADC(analog-to-digital converter) (20)2.3.23T emperature sensor (20)2.3.24Serial wire JTAG debug port(SWJ-DP) (20)3Pinouts and pin description (21)4Memory mapping (34)2/105DocID13587Rev16STM32F103x8,STM32F103xB Contents5Electrical characteristics (35)5.1Parameter conditions (35)5.1.1Minimum and maximum values (35)5.1.2Typical values (35)5.1.3Typical curves (35)5.1.4Loading capacitor (35)5.1.5Pin input voltage (35)5.1.6Power supply scheme (36)5.1.7Current consumption measurement (37)5.2Absolute maximum ratings (37)5.3Operating conditions (38)5.3.1General operating conditions (38)5.3.2Operating conditions at power-up/power-down (39)5.3.3Embedded reset and power control block characteristics (40)5.3.4Embedded reference voltage (41)5.3.5Supply current characteristics (41)5.3.6External clock source characteristics (51)5.3.7Internal clock source characteristics (55)5.3.8PLL characteristics (57)5.3.9Memory characteristics (57)5.3.10EMC characteristics (58)5.3.11Absolute maximum ratings(electrical sensitivity) (60)5.3.12I/O current injection characteristics (61)5.3.13I/O port characteristics (62)5.3.14NRST pin characteristics (68)5.3.15TIM timer characteristics (69)5.3.16Communications interfaces (70)5.3.17CAN(controller area network)interface (75)5.3.1812-bit ADC characteristics (76)5.3.19T emperature sensor characteristics (80)6Package characteristics (81)6.1Package mechanical data (81)6.2Thermal characteristics (93)6.2.1Reference document (93)6.2.2Selecting the product temperature range (94)DocID13587Rev163/105Contents STM32F103x8,STM32F103xB7Ordering information scheme (96)8Revision history (97)4/105DocID13587Rev16STM32F103x8,STM32F103xB List of tables List of tablesT able1.Device summary (1)T able2.STM32F103xx medium-density device features and peripheral counts (10)T able3.STM32F103xx family (13)T able4.Timer feature comparison (17)T able5.Medium-density STM32F103xx pin definitions (28)T able6.Voltage characteristics (37)T able7.Current characteristics (38)T able8.Thermal characteristics (38)T able9.General operating conditions (38)T able10.Operating conditions at power-up/power-down (39)T able11.Embedded reset and power control block characteristics (40)T able12.Embedded internal reference voltage (41)T able13.Maximum current consumption in Run mode,code with data processingrunning from Flash (42)T able14.Maximum current consumption in Run mode,code with data processingrunning from RAM (42)T able15.Maximum current consumption in Sleep mode,code running from Flash or RAM (44)T able16.Typical and maximum current consumptions in Stop and Standby modes (45)T able17.Typical current consumption in Run mode,code with data processingrunning from Flash (48)T able18.Typical current consumption in Sleep mode,code running from Flash orRAM (49)T able19.Peripheral current consumption (50)T able20.High-speed external user clock characteristics (51)T able21.Low-speed external user clock characteristics (51)T able22.HSE4-16MHz oscillator characteristics (53)T able23.LSE oscillator characteristics(f LSE=32.768kHz) (54)T able24.HSI oscillator characteristics (55)T able25.LSI oscillator characteristics (56)T able26.Low-power mode wakeup timings (57)T able27.PLL characteristics (57)T able28.Flash memory characteristics (57)T able29.Flash memory endurance and data retention (58)T able30.EMS characteristics (59)T able31.EMI characteristics (59)T able32.ESD absolute maximum ratings (60)T able33.Electrical sensitivities (60)T able34.I/O current injection susceptibility (61)T able35.I/O static characteristics (62)T able36.Output voltage characteristics (66)T able37.I/O AC characteristics (67)T able38.NRST pin characteristics (68)T able39.TIMx characteristics (69)T able40.I2C characteristics (70)T able41.SCL frequency(f PCLK1=36MHz.,V DD_I2C=3.3V) (71)T able42.SPI characteristics (72)T B startup time (74)T B DC electrical characteristics (75)DocID13587Rev165/105List of tables STM32F103x8,STM32F103xBT B:Full-speed electrical characteristics (75)T able46.ADC characteristics (76)T able47.R AIN max for f ADC=14MHz (77)T able48.ADC accuracy-limited test conditions (77)T able49.ADC accuracy (78)T able50.TS characteristics (80)T able51.VFQFPN366x6mm,0.5mm pitch,package mechanical data (82)T able52.UFQFPN487x7mm,0.5mm pitch,package mechanical data (83)T able53.LFBGA100-10x10mm low profile fine pitch ball grid array packagemechanical data (85)T able54.LQPF100,14x14mm100-pin low-profile quad flat package mechanical data (87)T able55.UFBGA100-ultra fine pitch ball grid array,7x7mm,0.50mm pitch,packagemechanical data (88)T able56.LQFP64,10x10mm,64-pin low-profile quad flat package mechanical data (89)T able57.TFBGA64-8x8active ball array,5x5mm,0.5mm pitch,package mechanical data (90)T able58.LQFP48,7x7mm,48-pin low-profile quad flat package mechanical data (92)T able59.Package thermal characteristics (93)T able60.Ordering information scheme (96)T able61.Document revision history (97)6/105DocID13587Rev16STM32F103x8,STM32F103xB List of figures List of figuresFigure1.STM32F103xx performance line block diagram (11)Figure2.Clock tree (12)Figure3.STM32F103xx performance line LFBGA100ballout (21)Figure4.STM32F103xx performance line LQFP100pinout (22)Figure5.STM32F103xx performance line UFBGA100pinout (23)Figure6.STM32F103xx performance line LQFP64pinout (24)Figure7.STM32F103xx performance line TFBGA64ballout (25)Figure8.STM32F103xx performance line LQFP48pinout (26)Figure9.STM32F103xx performance line UFQFPN48pinout (26)Figure10.STM32F103xx performance line VFQFPN36pinout (27)Figure11.Memory map (34)Figure12.Pin loading conditions (36)Figure13.Pin input voltage (36)Figure14.Power supply scheme (36)Figure15.Current consumption measurement scheme (37)Figure16.Typical current consumption in Run mode versus frequency(at3.6V)-code with data processing running from RAM,peripherals enabled (43)Figure17.Typical current consumption in Run mode versus frequency(at3.6V)-code with data processing running from RAM,peripherals disabled (43)Figure18.Typical current consumption on V BAT with RTC on versus temperature at differentV BAT values (45)Figure19.Typical current consumption in Stop mode with regulator in Run mode versustemperature at V DD=3.3V and3.6V (46)Figure20.Typical current consumption in Stop mode with regulator in Low-power mode versustemperature at V DD=3.3V and3.6V (46)Figure21.Typical current consumption in Standby mode versus temperature atV DD=3.3V and3.6V (47)Figure22.High-speed external clock source AC timing diagram (52)Figure23.Low-speed external clock source AC timing diagram (52)Figure24.Typical application with an8MHz crystal (53)Figure25.Typical application with a32.768kHz crystal (55)Figure26.Standard I/O input characteristics-CMOS port (64)Figure27.Standard I/O input characteristics-TTL port (64)Figure28.5V tolerant I/O input characteristics-CMOS port (65)Figure29.5V tolerant I/O input characteristics-TTL port (65)Figure30.I/O AC characteristics definition (68)Figure31.Recommended NRST pin protection (69)Figure32.I2C bus AC waveforms and measurement circuit (71)Figure33.SPI timing diagram-slave mode and CPHA=0 (73)Figure34.SPI timing diagram-slave mode and CPHA=1(1) (73)Figure35.SPI timing diagram-master mode(1) (74)B timings:definition of data signal rise and fall time (75)Figure37.ADC accuracy characteristics (78)Figure38.Typical connection diagram using the ADC (79)Figure39.Power supply and reference decoupling(V REF+not connected to V DDA) (79)Figure40.Power supply and reference decoupling(V REF+connected to V DDA) (80)Figure41.VFQFPN366x6mm,0.5mm pitch,package outline(1) (82)Figure42.VFQFPN36recommended footprint(dimensions in mm)(1)(2) (82)DocID13587Rev167/105List of figures STM32F103x8,STM32F103xBFigure43.UFQFPN487x7mm,0.5mm pitch,package outline (83)Figure44.UFQFPN48recommended footprint (84)Figure45.LFBGA100-10x10mm low profile fine pitch ball grid array packageoutline (85)Figure46.Recommended PCB design rules(0.80/0.75mm pitch BGA) (86)Figure47.LQFP100,14x14mm100-pin low-profile quad flat package outline (87)Figure48.LQFP100recommended footprint(1) (87)Figure49.UFBGA100-ultra fine pitch ball grid array,7x7mm,0.50mm pitch,package outline (88)Figure50.LQFP64,10x10mm,64-pin low-profile quad flat package outline (89)Figure51.LQFP64recommended footprint(1) (89)Figure52.TFBGA64-8x8active ball array,5x5mm,0.5mm pitch,package outline (90)Figure53.Recommended PCB design rules for pads(0.5mm pitch BGA) (91)Figure54.LQFP48,7x7mm,48-pin low-profile quad flat package outline (92)Figure55.LQFP48recommended footprint(1) (92)Figure56.LQFP100P D max vs.T A (95)8/105DocID13587Rev16STM32F103x8,STM32F103xB Introduction 1IntroductionThis datasheet provides the ordering information and mechanical device characteristics ofthe STM32F103x8and STM32F103xB medium-density performance line microcontrollers.For more details on the whole STMicroelectronics STM32F103xx family,please refer toSection2.2:Full compatibility throughout the family.The medium-density STM32F103xx datasheet should be read in conjunction with the low-,medium-and high-density STM32F10xxx reference manual.The reference and Flash programming manuals are both available from theSTMicroelectronics website .For information on the Cortex™-M3core please refer to the Cortex™-M3T echnicalReference Manual,available from the website at the following address:/help/index.jsp?topic=/com.arm.doc.ddi0337e/2DescriptionThe STM32F103xx medium-density performance line family incorporates the high-performance ARM Cortex™-M332-bit RISC core operating at a72MHz frequency,high-speed embedded memories(Flash memory up to128Kbytes and SRAM up to20Kbytes),and an extensive range of enhanced I/Os and peripherals connected to two APB buses.Alldevices offer two12-bit ADCs,three general purpose16-bit timers plus one PWM timer,aswell as standard and advanced communication interfaces:up to two I2Cs and SPIs,threeUSART s,an USB and a CAN.The devices operate from a2.0to3.6V power supply.They are available in both the–40to+85°C temperature range and the–40to+105°C extended temperature range.Acomprehensive set of power-saving mode allows the design of low-power applications.The STM32F103xx medium-density performance line family includes devices in six differentpackage types:from36pins to100pins.Depending on the device chosen,different sets ofperipherals are included,the description below gives an overview of the complete range ofperipherals proposed in this family.These features make the STM32F103xx medium-density performance line microcontrollerfamily suitable for a wide range of applications such as motor drives,application control,medical and handheld equipment,PC and gaming peripherals,GPS platforms,industrialapplications,PLCs,inverters,printers,scanners,alarm systems,video intercoms,andHVACs.DocID13587Rev169/105TimersCommunicationDescription STM32F103x8,STM32F103xB 2.1Device overviewTable2.STM32F103xx medium-density device features and peripheral1.On the TFBGA64package only15channels are available(one analog input pin has been replaced by‘Vref+’).10/105DocID13587Rev16Peripheral STM32F103Tx STM32F103Cx STM32F103Rx STM32F103Vx Flash-Kbytes64128641286412864128SRAM-Kbytes20202020 General-purpose3333Advanced-control1111SPI12222I C1222USART2333USB1111CAN1111 GPIOs2637518012-bit synchronized ADCNumber of channels210channels210channels2(1)16channels216channels CPU frequency72MHzOperating voltage 2.0to3.6VOperating temperaturesAmbient temperatures:-40to+85°C/-40to+105°C(see Table9)Junction temperature:-40to+125°C(see Table9)Packages VFQFPN36LQFP48,UFQFPN48LQFP64,TFBGA64LQFP100,LFBGA100,UFBGA100f l a s ho b lI n t e r f a c eB u s M a t r i xA HB :F m a x =48/72M H zA PB 2:F m a x =48/72M H zA PB 1:F m a x =24/36M H zpbusPCLK2 HCLK CLOCK RTC AWUTAMPER -RTCSTM32F103x8, STM32F103xBDescriptionFigure 1. STM32F103xx performance line block diagramTRACECLKTRACED[0:3] as ASNJTRSTTRSTJTDIJTCK/SWCLK JTMS/SWDIOJTDO as AFTPIUTrace/trigSW/JTAGCortex -M3 CPUIbusF max : 7 2M Hz DbusTraceControlle rFlash 128 KB64 bitPOWERVOLT. REG. 3.3V TO 1.8V@VDDV DD = 2 to 3.6VV SSNVICSystemSRAM20 KB@VDDGP DMA7 channelsPCLK1 FCLKPLL &MANAGTXTAL OSC4-16 MHzOSC_INOSC_OUTRC 8 MHzNRST @VDDASUPPLYSUPERVISIONRC 40 kHz @VDDA@VBATIWDG Standby interfaceV BATVDDA VSSA 80AF PA[15:0] PB[15:0]POR / PDRPVDEXTIWAKEUPGPIOAGPIOBRstIntAHB2 AHB2APB2 APB1XTAL 32 kHzBackup reg Backu p i nterf ace TIM2 TIM3OSC32_IN OSC32_OUT4 Channels 4 ChannelsPC[15:0]GPIOCTIM 44 ChannelsPD[15:0]GPIOD PE[15:0] GPIOEUSART2USART3RX,TX, CTS, RTS,CK, SmartCard as AFRX,TX, CTS, RTS, CK, SmartCard as AF4 Channels3 compl. ChannelsETR and BKINMOSI,MISO, SCK,NSS as AFRX,TX, CTS, RTS,TIM1SPI12x(8x16bit)SPI2I2C1 I2C2MOSI,MISO,SCK,NSS as AFSCL,SDA,SMBA as AFSCL,SDA as AFSmartCard as AFUSART1@VDDAbxCANUSBDP/CAN_TXUSB 2.0 FSUSBDM/CAN_RX16AF V REF+ V REF -12bit ADC1 IF12bit ADC2 IFSRAM 512BWWDGTemp sensorai14390d1. T A = –40 °C to +105 °C (junction temperature up to 125 °C).2. AF = alternate function on I/O port pin.DocID13587 Rev 1611/105peripheralsIf (APB2 prescaler =1) x1 ADC /2, 4, 6, 8 ADCCLKDescriptionSTM32F103x8, STM32F103xBFigure 2. Clock treeFLITFCLKto Flash programming interface8 MHz HSI RCHSIUSBPrescaler 48 MHzUSBCLKto USB interface/2/1, 1.572 MHz maxClockHCLKto AHB bus, core, memory and DMA PLLSRCSWPLLMUL/8Enable (3 bits)to Cortex System timerFCLK Cortex..., x16 x2, x3, x4 PLLHSIPLLCLK HSESYSCLK72 MHz max AHB Prescaler /1, 2..512 APB1Prescaler/1, 2, 4, 8, 16free running clock36 MHz max PCLK1to APB1Peripheral Clock Enable (13 bits)TIM2,3, 4to TIM2, 3and 4CSSIf (APB1 prescaler =1) x1 TIMXCLKelse x2 Peripheral ClockEnable (3 bits)OSC_OUTOSC_IN4-16 MHzHSE OSCPLLXTPRE/2APB2Prescaler/1, 2, 4, 8, 16TIM1 timer 72 MHz maxPeripheral ClockEnable (11 bits) PCLK2peripherals to APB2to TIM1 TIM1CLK else x2 Peripheral ClockOSC32_INOSC32_OUTLSE OSC32.768 kHz/128LSERTCCLKto RTCPrescaler Enable (1 bit) to ADCRTCSEL[1:0]LSI RCLSIto Independent Watchdog (IWDG)40 kHzIWDGCLKLegend:HSE = high -speed external clock signalHSI = high -speed internal clock signalMCOMainClock Output/2PLLCLKHSI LSI = low -speed internal clock signal LSE = low -speed external clock signalHSESYSCLKMCOai149031. When the HSI is used as a PLL clock input, the maximum system clock frequency that can be achieved is 64 MHz.2. For the USB function to be available, both HSE and PLL must be enabled, with USBCLK running at 48 MHz.3. To have an ADC conversion time of 1 µs, APB2 must be at 14 MHz, 28 MHz or 56 MHz.12/105DocID13587 Rev 16STM32F103x8, STM32F103xBDescription2.2 Full compatibility throughout the familyThe STM32F103xx is a complete family whose members are fully pin -to -pin, software and feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are identified as low -density devices, the STM32F103x8 and STM32F103xB are referred to as medium -density devices, and the STM32F103xC, STM32F103xD and STM32F103xE are referred to as high -density devices.Low - and high -density devices are an extension of the STM32F103x8/B devices, they are specified in the STM32F103x4/6 and STM32F103xC/D/E datasheets, respectively. Low - density devices feature lower Flash memory and RAM capacities, less timers and peripherals. High -density devices have higher Flash memory and RAM capacities, and additional peripherals like SDIO, FSMC, I 2S and DAC, while remaining fully compatible with the other members of the STM32F103xx family .The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD and STM32F103xE are a drop -in replacement for STM32F103x8/B medium -density devices, allowing the user to try different memory densities and providing a greater degree of freedom during the development cycle.Moreover, the STM32F103xx performance line family is fully compatible with all existing STM32F101xx access line and STM32F102xx USB access line devices.1.For orderable part numbers that do not show the A internal code after the temperature range code (6 or 7),the reference datasheet for electrical characteristics is that of the STM32F103x8/B medium -density devices.DocID13587 Rev 16 13/105PinoutLow -density devicesMedium -density devices High -density devices 16 KB Flash 32 KB Flash (1) 64 KB Flash 128 KB Flash 256 KB Flash 384 KB Flash 512 KB Flash6 KB RAM 10 KB RAM 20 KB RAM 20 KB RAM 48 KB RAM 64 KB RAM 64 KB RAM144 5 × USART s 4 × 16-bit timers, 2 × basic timers2 3 × SPIs, 2 × I Ss, 2 × I2Cs USB, CAN, 2 × PWM timers 3 × ADCs, 2 × DACs, 1 × SDIOFSMC (100 and 144 pins) 100 3 × USART s 3 × 16-bit timers 2 2 × SPIs, 2 × I Cs, USB, CAN, 1 × PWM timer2 × ADCs 64 2 × USART s 2 × 16-bit timers 2 1 × SPI, 1 × I C, USB, CAN, 1 × PWM timer 2 × ADCs 48 36Description STM32F103x8,STM32F103xB 2.3Overview2.3.1ARM®Cortex™-M3core with embedded Flash and SRAMThe ARM Cortex™-M3processor is the latest generation of ARM processors for embeddedsystems.It has been developed to provide a low-cost platform that meets the needs of MCUimplementation,with a reduced pin count and low-power consumption,while deliveringoutstanding computational performance and an advanced system response to interrupts.The ARM Cortex™-M332-bit RISC processor features exceptional code-efficiency,delivering the high-performance expected from an ARM core in the memory size usuallyassociated with8-and16-bit devices.The STM32F103xx performance line family having an embedded ARM core,is thereforecompatible with all ARM tools and software.Figure1shows the general block diagram of the device family.2.3.2Embedded Flash memory64or128Kbytes of embedded Flash is available for storing programs and data.2.3.3CRC(cyclic redundancy check)calculation unitThe CRC(cyclic redundancy check)calculation unit is used to get a CRC code from a32-bitdata word and a fixed generator polynomial.Among other applications,CRC-based techniques are used to verify data transmission orstorage integrity.In the scope of the EN/IEC60335-1standard,they offer a means ofverifying the Flash memory integrity.The CRC calculation unit helps compute a signature ofthe software during runtime,to be compared with a reference signature generated at link-time and stored at a given memory location.2.3.4Embedded SRAMTwenty Kbytes of embedded SRAM accessed(read/write)at CPU clock speed with0waitstates.2.3.5Nested vectored interrupt controller(NVIC)The STM32F103xx performance line embeds a nested vectored interrupt controller able tohandle up to43maskable interrupt channels(not including the16interrupt lines ofCortex™-M3)and16priority levels.•Closely coupled NVIC gives low-latency interrupt processing•Interrupt entry vector table address passed directly to the core•Closely coupled NVIC core interface•Allows early processing of interrupts•Processing of late arriving higher priority interrupts•Support for tail-chaining•Processor state automatically saved•Interrupt entry restored on interrupt exit with no instruction overhead14/105DocID13587Rev16万联芯城专注电子元器件配单服务，只售原装现货库存，万联芯城电子元器件全国供应，专为终端生产，研发企业提供现货物料，价格优势明显，BOM配单采购可节省逐个搜索购买环节，只需提交BOM物料清单，商城即可为您报价，解决客户采购烦恼，为客户节省采购成本，点击进入万联芯城。
嵌入式单片机之STM32F103C8T6最小系统板电路设计参考
嵌入式单片机之STM32F103C8T6最小系统板电路设计参考。
STM32F103C8T6最小系统板电路设计
一。
电源部分
设计了一个XH插座，以便使用3.7V锂电池供电，接入电压不允许超过6V。
二。
指示灯部分
电源指示灯可以通过一个短路帽控制亮灭，以达到节电的目的。
三。
复位电路
四。
按键电路
KEY_1为用户自己定义
RST复位按键
WKUP为唤醒按键。
RST按键的作用：
程序下载的方式是SWD模式，BOOT0和BOOT1都接地，单片机一上电就会执行用户程序，所以不支持串口下载。
五。
OLED电路
支持IIC和SPI两种通信模式
六。
扩展口
七。
电源部分
TIM1的CH1和CH2输出PWM控制一个轮子的转速。
TIM1的CH3和CH4控制一个轮子的转速。
TIM4的CH1和CH2控制一个轮子的转速。
TIM4的CH3和CH4控制一个轮子的转速。
每一个轮子都可以独立的控制正转，反转和速度。
避障模块用3个引脚
寻迹模块用3个引脚
测速模块用4个引脚(定时器的捕获功能)用于检测每个轮子的转速PB10到PB15用于2.4G的无线通信模块
32.768K晶振，它的负载电容不能用12.5pF，推荐负载电容为6pF的晶振。
还是分享些相应的资料便于学习参考
（零基础电子产品设计）
从0到1，设计自己的开发板
PWM脉宽调制技术
（stm32串口应用）。
STM32最小系统电路
STM32最小系统电路原创文章，转载请注明出处:/tengjingshu1.电源供电方案● VDD = 2.0～3.6V：VDD管脚为I/O管脚和内部调压器的供电。
● VSSA，VDDA = 2.0～3.6V：为ADC、复位模块、RC振荡器和PLL的模拟部分提供供电。
使用ADC时，VDD不得小于2.4V。
VDDA和VSSA必须分别连接到VDD和VSS。
● VBAT = 1.8～3.6V：当关闭VDD时，（通过内部电源切换器）为RTC、外部32kHz振荡器和后备寄存器供电。
采用LM1117-3.3V(AMS1117)供电2.晶振STM32上电复位后默认使用内部[精度8MHz左右]晶振，如果外部接了8MHz的晶振，可以切换使用外部的8MHz晶振，并最终PLL倍频到72MHz。
3.JTAG接口在官方给出的原理图基本是结合STM32三合一套件赠送的ST-Link II给出的JTAG接口。
ST-Link IISK-STM32F学习评估套件原理图的JTAG连接很多时候为了省钱，所以很多人采用wiggler + H-JTAG的方案。
H-JTAG其实是twentyone大侠开发的调试仿真烧写软件，界面很清新很简洁。
H-JTAG界面H-JTAG软件的下载：/chinese/download.htmlH-JTAG官网：twentyone 大侠的blog：/关于STM32 H-JTAG的使用，请看下一篇博文Wiggler其实是一个并口下载方案，其实电路图有很多种，不过一些有可能不能使用，所以要注意。
你可以在taobao上买人家现成做好的这种Wiggler下载线，最简便的方法是自己动手做一条，其实很简单，用面包板焊一个74HC244就可以了。
Wiggler电路图下载：电路图中”RESET SELECT”和”RST JUMPER”不接，如果接上的话会识别不了芯片。
STM32电路中的JTAG接口，要注意的是上图HEADER10X2接头的第1和第2管脚接JTAG-VDD，其实是对应74HC244的芯片电压，如果74244采用的3.3V的低压芯片的话，这个JTAG-VDD就接3.3V。
基于STM32的智能小车寻迹避障系统硬件设计
• 196•智能小车寻迹避障系统采用STM32F103C8T6芯片做为控制器。
系统包括轨迹识别模块电路、障碍物识别模块电路、直流电机驱动模块电路、单片机最小系统等电路。
各个模块采集到的信息输送至STM32控制器，由控制器负责处理、分析采集到的数据，得到结果后，通过控制L298N 电机驱动模块控制电机输出转速，改变车辆移动状态。
引言：近年来，随着自动化技术的发展及成熟，越来越多的领域开始引入自动化技术，智能寻迹避障小车因其可以实现无人操作而得到广泛应用，对其的研究更是有有较高的应用价值，也同样具有现实意义。
基于STM32的智能小车寻迹避障系统硬件设计的研究重点包括小车的智能寻迹电路设计，复杂环境下的避障和自动扫描路径电路设计等。
系统采用STM32F103C8T6芯片做为控制器，负责处理、分析采集到的数据，得到结果后通过控制L298N 电机驱动间接改变车辆移动状态，通过线性CCD 镜头寻找轨迹，通过对返回数据进行处理分析，从而实现复杂路线的行驶。
国内外现状：现如今国内的自动化技术发展极快，无人科技方面有极大的发展空间，自动寻迹避障车更是有极大的应用范围，小到餐饮服务业，大到太空勘探，都可将其应用其中，大大提高了工作效率，节约人工成本，在国外自动寻迹避障小车已有实际的应用，相信在不久的将来会被广泛普及。
小车的图片如图8所示。
智能避障小车的控制流程：小车会在黑白线的规划下沿着黑线行驶，当路线中遇到障碍物的时候，小车会自动停车，当障碍物移除小车会继续沿着障碍物行驶。
图一 小车遇到障碍物 图二 障碍物移除1.系统总体结构系统设计目标是小车能自动延黑色轨迹延轨迹移动，遇到障碍物时停止，在障碍物离开后继续延轨迹行走。
智能小车在行驶过程中能够判断黑色轨迹和障碍物位置。
智能小车寻迹避障系统结构框图如图2所示。
系统由单片机模块、轨道识别模块、障碍物识别模块、直流电动机驱动模块等构成。
单片机采用STM32F103C8T6芯片做为控制器；轨道识别模块采用TSL1401线性CCD 传感器，用于采集轨迹信息；障碍物识别模块采用E18-B03N1漫反射式光电开关，用于采集障碍物位置信息；直流电动机驱动块模块采用L298N电机驱动模块，用于小车前进方向和速度的控制。
STM32最小系统使用手册
STM32最小系统使用手册修订历史1.STM32F103C8T6最小系统简介硬件资源：1、STM32F103C8主芯片一片2、贴片8M晶振（通过芯片内部PLL最高达72M）ST官方标准参数3、LM1117-3.3V稳压芯片，最大提供800mA电流4、一路miniUSB接口，可以给系统版供电，预留USB通讯功能5、复位按键6、标准JTAG下载口一个，支持JLink，STLink7、BOOT选择端口8、IO扩展排针20pin x 29、电源指示灯1个10、功能指示灯一个，用于验证IO口基本功能11、预留串口下载接口，方便和5V开发板连接，用串口即可下载程序12、尺寸：64mm X 36.4mm13、高性能爱普生32768Hz晶振，价格是直插晶振的10倍价格，易起振14、20K RAM，64K ROM ，TQFP48封装模块说明BOOT短路帽设置说明BOOT1=x BOOT0=0 从用户闪存启动，这是正常的工作模式。
（上电运行程序或者JTAG方式下载程序时候使用）BOOT1=0 BOOT0=1 从系统存储器启动，这种模式启动的程序功能由厂家设置。
（从固化的bootloader启动，一般用于ISP下载时候使用）BOOT1=1 BOOT0=1 从内置SRAM 启动，这种模式可以用于调试。
下载程序方法：需要TTL模块下载工具（已安装好驱动）推荐使用本店开发的CP2102 USB-TTL模块对STM32最小系统进行下载程序。
（CP2102与其他的JLINK或者STLINK比价格要便宜很多，只能用于下载，不能用于DEBUG调试程序）1.CP2102和STM32用杜邦线按照以下连接后，接在电脑USB接口TXD -----------> RX1RXD -----------> TX1GND -----------> GND2.将STM32上的BOOT选择短路帽进行设置(进入ISP下载模式)BOOT1 -----------> 0BOOT0 -----------> 13.将CP2102与电脑连接后，打开MCUISP软件，✓点击“搜索串口”，“Port”选项会有可用的COM选项。
基于STM32单片机的室内环境监测系统的研究
基于 STM32单片机的室内环境监测系统的研究摘要：STM32单片机与传统检测手段相比，其布线更加简洁、结构也更加简答，在实际应用中对室内环境监测的效果更好，目前应用比较广泛，在很大程度上促进了室内环境监测系统的优化与升级。
本文就以STM32单片机为例，对室内环境环境监测系统进行几点研究。
关键词：STM32单片机；传感器；无线通讯引言随着科技的发展和进步，室内环境监测系统也在不断完善，基于STM32单片机的室内环境监测系统，不仅具有良好的检测效果，而且操作便捷，结构简单，适用范围更加广泛，为室内环境环境监测提供巨大助力，对其系统设计与应用的深入研究也显得十分必要。
1硬件设计1. 1 STM32F103C8T6 最小系统按照单片机的组装要求，最小系统的构造需要包括STM32 单片机、电源电路、下载电路、复位电路和时钟电路。
对单片机的构成原理分析发现，其内部结构遵循集成电路芯片的构成模式，能够实现数据输入和输出的指令需求，同时利用中央处理器CPU以及相关存储系统对多种数据进行指定输入、存储、输出，从而实现微型计算机系统的构建。
随着人们对控制领域的深入研究，这类控制类的元件能够被高效利用。
1. 2 温湿度模块利用温度传感器和数字模块采集技术组合而成的DHT11 温湿度传感器，能够准确对系统运行过程中的温湿度进行测量，并可以控制测量精度。
按照不同工作电压的状况，当工作电压为3.0v-5.5v时，响应时间如果<5s，则该温湿度传感器会处于低功率运行状态，并且保持完整的信号输出和接收，此时在信号发出以后，由于接收指令的输入，DHT11 温湿度传感器会切换到高速模式，待指令输入完成后由回应单片机进行信号接收和分析。
不同的数据传输有一定的数据量限制，信号读取速度直接决定DHT11 温湿度传感器的反应速度，当完成信号接收以及转化的全部过程后，温湿度传感器则会重新回到原始工作状态，退出低速模式。
1. 3 甲醛模块利用通用型模组组合成电化学甲醛模块。
宠wuWU忧——留家宠物的饮食助手
宠wu WU忧——留家宠物的饮食助手摘要:在宠物行业不断发展的背景下，从当今饲养宠物方式以及智能化喂食器的设计理念出发，设计了留家宠物的饮食助手即基于单片机的宠物定时喂食器系统，此款宠物定时喂食系统以STM32单片机为控制核心，实现以下功能：可以通过手机APP设置定时投喂，在喂食的时候可以自主选择投喂量，通过压力检测模块监测余粮数据，并且可以通过红外模块监测宠物是否在进食，也可以监测环境温湿度，在宠物食物余量不足的时候蜂鸣器会报警同时手机APP会弹窗显示余粮不足，同时还具备了WIFI远程操作。
关键词：STM32单片机；宠物喂食；远程操控；智能化引言随着社会经济的高度发展，家庭饲养宠物的现象非常普遍，在饲养宠物的过程中，宠物的喂食和护理是主人较注重的问题，但是现在很多家庭因为工作等原因会非常忙碌，根本没有时间去照顾自己的宠物，有的人可能会因为工作或者长时间的出差无法提供定时定量的食物。
因此，宠物喂食器在当前社会是非常有必要的，设计简单方便，有较大的使用价值。
一、系统总体设计方案宠物定时喂食器系统由六个模块组成，每个模块独立的工作，负责各个部分功能的实现，同时又相互联系在一起，构成了宠物定时喂食器的整体系统，系统设计总框图如图1所示。
图1系统设计总框图其中，STM32F103C8T6单片机作为系统的主控芯片；DHT11温湿度传感器作为室内温湿度检测模块，测量室内温湿度提醒饲养者目前温湿度是否适合宠物成长环境；HX711压力检测模块来检测定时喂食器内是否还有剩余粮食；S8550有源蜂鸣器是当余粮不足时发出响声提醒用户需要加入宠物食物；TCRT5000红外反射式光电传感器作为红外检测模块，用来检测宠物是否在进食，如果在进食，手机APP会显示；舵机是用来调整其开放角度来实现喂食量的不同；ESP8266WIFI模块可以使手机APP与宠物定时喂食器之间进行数据传输，可以在任意时刻远程给宠物投放食物。
二、系统硬件设计以STM32单片机为主控芯片，使用了DHT11温湿度检测模块、HX711称重压力检测模块、S8550有源蜂鸣器模块、TCRT5000红外反射式光电模块、舵机模块、ESP8266WIFI模块。
STM32--数码管显示使用
STM32--数码管显⽰使⽤STM32 – 数码管显⽰简介1.硬件部分STM32F103C8T6 最⼩系统板 ⼀位共阴数码管2.软件部分Keil软件编程 数码管码表硬件部分数码管简介数码管，也称作辉光管，是⼀种可以显⽰数字和其他信息的电⼦设备。
玻璃管中包括⼀个⾦属丝⽹制成的阳极和多个阴极。
⼤部分数码管阴极的形状为数字。
管中充以低压⽓体，通常⼤部分为氖加上⼀些汞和/或氩。
给某⼀个阴极充电，数码管就会发出颜⾊光，视乎管内的⽓体⽽定，⼀般都是橙⾊或绿⾊。
分类数码管也称LED数码管，不同⾏业⼈⼠对数码管的称呼不⼀样，其实都是同样的产品。
按发光⼆极管单元连接⽅式可分为共阳极数码管和共阴极数码管。
共阳数码管是指将所有发光⼆极管的阳极接到⼀起形成公共阳极(COM)的数码管，共阳数码管在应⽤时应将公共极COM接到+5V，当某⼀字段发光⼆极管的阴极为低电平时，相应字段就点亮，当某⼀字段的阴极为⾼电平时，相应字段就不亮。
共阴数码管是指将所有发光⼆极管的阴极接到⼀起形成公共阴极(COM)的数码管，共阴数码管在应⽤时应将公共极COM接到地线GND上，当某⼀字段发光⼆极管的阳极为⾼电平时，相应字段就点亮，当某⼀字段的阳极为低电平时，相应字段就不亮。
1.共阳数码管共阳数码管在应⽤时应将公共极COM接到+5V，当某⼀字段发光⼆极管的阴极为低电平时，相应字段就点亮，当某⼀字段的阴极为⾼电平时，相应字段就不亮。
2.共阴数码管对于共阴极数码管来说，当某个发光⼆极管的阳极为⾼电平时，发光⼆极管点亮，相应的段被显⽰。
同样，共阳极数码管的阳极连接在⼀起，公共阳极接+5V，当某个发光⼆极管的阴极接低电平时，该发光⼆极管被点亮，相应的段被显⽰数码管码表unsigned char code smgduan[17] ={0xc0, 0xf9, 0xa4, 0xb0, 0x99, 0x92, 0x82, 0xf8,0x80, 0x90, 0x88, 0x83, 0xc6, 0xa1, 0x86, 0x8e};//共阳数码管unsigned char code smgduan[17]={0x3f,0x06,0x5b,0x4f,0x66,0x6d,0x7d,0x07,0x7f,0x6f,0x77,0x7c,0x39,0x5e,0x79,0x71};共阴数码管静态数码管硬件电路设计实物软件部分/*********************************************************************** ⽂件名：smg.c* 描述：smg 应⽤函数库* 硬件连接：-----------------* | PA0 - A |* | PA1 - B |* | PA2 - C |* | PA3 - D |* | PA4 - E |* | PA5 - F |* | PA6 - G |* | PA7 - DP |* -----------------*********************************************************************/#include "smg.h"#include "delay.h"//共阳数码管断码表u8 const smg_data[]={0xc0,0xf9,0xa4,0xb0,0x99,0x92,0x82,0xf8,0x80,0x90,0x88,0x83,0xc6,0xa1,0x86,0x8e};/** 函数名：SMG_GPIO_Config* 描述：配置数码管⽤到的I/O⼝* 输⼊：⽆* 输出：⽆*/void SMG_GPIO_Config(void){GPIO_InitTypeDef GPIO_InitStructure;RCC_APB2PeriphClockCmd( RCC_APB2Periph_GPIOA, ENABLE);GPIO_InitStructure.GPIO_Pin = GPIO_Pin_0 | GPIO_Pin_1 | GPIO_Pin_2 | GPIO_Pin_3 | GPIO_Pin_4 | GPIO_Pin_5 | GPIO_Pin_6 | GPIO_Pin_7;GPIO_InitStructure.GPIO_Mode = GPIO_Mode_Out_PP;GPIO_InitStructure.GPIO_Speed = GPIO_Speed_50MHz;GPIO_Init(GPIOA, &GPIO_InitStructure);GPIO_SetBits(GPIOA, GPIO_Pin_0 | GPIO_Pin_1 | GPIO_Pin_2 | GPIO_Pin_3 | GPIO_Pin_4 | GPIO_Pin_5 | GPIO_Pin_6 | GPIO_Pin_7); // turn o ff all led}/** 函数名：SMG_Display* 描述：驱动数码管显⽰0-F* 输⼊：⽆* 输出：⽆*/void SMG_Display(void){u8 i;for(i=0;i<16;i++){GPIO_Write(GPIOA,smg_data[i]);delay_ms(1000);}}void Display_N(u8 N){GPIO_Write(GPIOA,smg_data[N]);}smg.h#ifndef __SMG_H#define __SMG_H#include "stm32f10x.h"void SMG_GPIO_Config(void);void SMG_Display(void);void Display_N(u8 N);#endif /* __SMG_H */数码管案例（基于51单⽚机四位数码管模块（74HC595））14脚：DS（SER），串⾏数据输⼊引脚13脚：OE， 输出使能控制脚，它是低电才使能输出，所以接GND12脚：RCK，存储寄存器时钟输⼊引脚。
用keil开发STM32流程——STM23F103C8T6最小系统板
⽤keil开发STM32流程——STM23F103C8T6最⼩系统板前期准备：1.keil V5 MDK-ARM2.固件库V3.5.0（STM32F10x_StdPeriph_Lib_V3.5.0）3.STM32F103C8T6最⼩系统板4.J-Link烧写器下⾯进⾏开发环境的搭建下载固件库，进⾏解压，⼤概了解⼀下，然后关闭。
接着新建或找到⾃⼰的⼯作空间（建⽴⼯作空间的⽬的是便于储存不同开发环境下的⼯程）新建⼯程模板（名称根据⾃⼰喜好安排）在⽂件夹中新建四个⽂件夹第⼀个⽂件夹ASM。
存放与单⽚机相关的汇编⽂件，⾥⾯是与单⽚机启动相关的内容在固件库\Libraries\CMSIS\CM3\DeviceSupport\ST\STM32F10x\startup\arm根据单⽚机的情况选择，STM32F103C8T6属于中容量这⾥可以全部复制过来，在⼯程配置时选择第⼆个⽂件夹LIB。
存放固件库源码与头⽂件在固件库\Libraries\STM32F10x_StdPeriph_Driver路径下的inc和src都复制过来第三个⽂件夹System。
存放内核相关、中断⼊⼝定义、⼀些重要的头⽂件这些⽂件在固件库\Libraries\CMSIS\CM3\CoreSupport固件库\Libraries\CMSIS\CM3\DeviceSupport\ST\STM32F10x固件库\Project\STM32F10x_StdPeriph_Template第四个⽂件夹USR。
存放开发者⾃⼰的源码新建⼀个⽂本⽂档重命名为main.c如果有提⽰选择“是”到这⾥⼯程⽂件已经准备齐全，打开Keil进⾏⼯程的软件配置点击新建⼯程New uVision project选择刚才的路径\KeilMDKWorkSpace\STM32F103Project打开写上⽂件名，⼀般和⼯程的⽂件夹名⼀致。
这⾥写STM32F103Project，保存弹出器件选择提⽰框在Search快速搜索：F103C8（1）发现并没有搜索结果，说明没有安装相关器件库，继续安排（2）有搜索结果，点击此处跳转阅读。
STM32F103C8T6中文资料_引脚图_最小系统
STM32F103C8T6中⽂资料_引脚图_最⼩系统Contents STM32F103x8,STM32F103xB Contents1Introduction (9)2Description (9)2.1Device overview (10)2.2Full compatibility throughout the family (13)2.3Overview (14)2.3.1ARM?Cortex?-M3core with embedded Flash and SRAM (14)2.3.2Embedded Flash memory (14)2.3.3CRC(cyclic redundancy check)calculation unit (14)2.3.4Embedded SRAM (14)2.3.5Nested vectored interrupt controller(NVIC) (14)2.3.6External interrupt/event controller(EXTI) (15)2.3.7Clocks and startup (15)2.3.8Boot modes (15)2.3.9Power supply schemes (15)2.3.10Power supply supervisor (15)2.3.11Voltage regulator (16)2.3.12Low-power modes (16)2.3.13DMA (17)2.3.14RTC(real-time clock)and backup registers (17)2.3.15Timers and watchdogs (17)2.3.16I2C bus (19)2.3.17Universal synchronous/asynchronous receiver transmitter(USART)..192.3.18Serial peripheral interface(SPI) (19)2.3.19Controller area network(CAN) (19)2.3.20Universal serial bus(USB) (19)2.3.21GPIOs(general-purpose inputs/outputs) (20)2.3.22ADC(analog-to-digital converter) (20)2.3.23T emperature sensor (20)2.3.24Serial wire JTAG debug port(SWJ-DP) (20)3Pinouts and pin description (21)4Memory mapping (34)2/105DocID13587Rev16STM32F103x8,STM32F103xB Contents5Electrical characteristics (35)5.1Parameter conditions (35)5.1.1Minimum and maximum values (35)5.1.2Typical values (35)5.1.3Typical curves (35)5.1.4Loading capacitor (35)5.1.5Pin input voltage (35)5.1.6Power supply scheme (36)5.1.7Current consumption measurement (37)5.2Absolute maximum ratings (37)5.3Operating conditions (38)5.3.1General operating conditions (38)5.3.2Operating conditions at power-up/power-down (39)5.3.3Embedded reset and power control block characteristics (40) 5.3.4Embedded reference voltage (41)5.3.5Supply current characteristics (41)5.3.6External clock source characteristics (51)5.3.7Internal clock source characteristics (55)5.3.8PLL characteristics (57)5.3.9Memory characteristics (57)5.3.10EMC characteristics (58)5.3.11Absolute maximum ratings(electrical sensitivity) (60)5.3.12I/O current injection characteristics (61)5.3.13I/O port characteristics (62)5.3.14NRST pin characteristics (68)5.3.15TIM timer characteristics (69)5.3.16Communications interfaces (70)5.3.17CAN(controller area network)interface (75)5.3.1812-bit ADC characteristics (76)5.3.19T emperature sensor characteristics (80)6Package characteristics (81)6.1Package mechanical data (81)6.2Thermal characteristics (93)6.2.1Reference document (93)6.2.2Selecting the product temperature range (94)DocID13587Rev163/105Contents STM32F103x8,STM32F103xB7Ordering information scheme (96)8Revision history (97)4/105DocID13587Rev16STM32F103x8,STM32F103xB List of tables List of tablesT able1.Device summary (1)T able2.STM32F103xx medium-density device features and peripheral counts (10)T able3.STM32F103xx family (13)T able4.Timer feature comparison (17)T able5.Medium-density STM32F103xx pin definitions (28)T able6.Voltage characteristics (37)T able7.Current characteristics (38)T able8.Thermal characteristics (38)T able9.General operating conditions (38)T able10.Operating conditions at power-up/power-down (39)T able11.Embedded reset and power control block characteristics (40)T able12.Embedded internal reference voltage (41)T able13.Maximum current consumption in Run mode,code with data processingrunning from Flash (42)T able14.Maximum current consumption in Run mode,code with data processingrunning from RAM (42)T able15.Maximum current consumption in Sleep mode,code running from Flash or RAM (44) T able16.Typical and maximum current consumptions in Stop and Standby modes (45)T able17.Typical current consumption in Run mode,code with data processingrunning from Flash (48)T able18.Typical current consumption in Sleep mode,code running from Flash orRAM (49)T able19.Peripheral current consumption (50)T able20.High-speed external user clock characteristics (51)T able21.Low-speed external user clock characteristics (51)T able22.HSE4-16MHz oscillator characteristics (53)T able23.LSE oscillator characteristics(f LSE=32.768kHz) (54)T able24.HSI oscillator characteristics (55)T able25.LSI oscillator characteristics (56)T able26.Low-power mode wakeup timings (57)T able27.PLL characteristics (57)T able28.Flash memory characteristics (57)T able29.Flash memory endurance and data retention (58)T able30.EMS characteristics (59)T able31.EMI characteristics (59)T able32.ESD absolute maximum ratings (60)T able33.Electrical sensitivities (60)T able34.I/O current injection susceptibility (61)T able35.I/O static characteristics (62)T able36.Output voltage characteristics (66)T able37.I/O AC characteristics (67)T able38.NRST pin characteristics (68)T able39.TIMx characteristics (69)T able40.I2C characteristics (70)T able41.SCL frequency(f PCLK1=36MHz.,V DD_I2C=3.3V) (71)T able42.SPI characteristics (72)T /doc/730a8438ac51f01dc281e53a580216fc710a531c.html B startup time (74)T /doc/730a8438ac51f01dc281e53a580216fc710a531c.html B DC electrical characteristics (75) DocID13587Rev165/105List of tables STM32F103x8,STM32F103xBT /doc/730a8438ac51f01dc281e53a580216fc710a531c.html B:Full-speed electrical characteristics (75) T able46.ADC characteristics (76)T able47.R AIN max for f ADC=14MHz (77)T able48.ADC accuracy-limited test conditions (77)T able49.ADC accuracy (78)T able50.TS characteristics (80)T able51.VFQFPN366x6mm,0.5mm pitch,package mechanical data (82)T able52.UFQFPN487x7mm,0.5mm pitch,package mechanical data (83)T able53.LFBGA100-10x10mm low profile fine pitch ball grid array packagemechanical data (85)T able54.LQPF100,14x14mm100-pin low-profile quad flat package mechanical data (87)T able55.UFBGA100-ultra fine pitch ball grid array,7x7mm,0.50mm pitch,packagemechanical data (88)T able56.LQFP64,10x10mm,64-pin low-profile quad flat package mechanical data (89)T able57.TFBGA64-8x8active ball array,5x5mm,0.5mm pitch,package mechanical data (90) T able58.LQFP48,7x7mm,48-pin low-profile quad flat package mechanical data (92)T able59.Package thermal characteristics (93)T able60.Ordering information scheme (96)T able61.Document revision history (97)6/105DocID13587Rev16STM32F103x8,STM32F103xB List of figures List of figuresFigure1.STM32F103xx performance line block diagram (11)Figure2.Clock tree (12)Figure3.STM32F103xx performance line LFBGA100ballout (21)Figure4.STM32F103xx performance line LQFP100pinout (22)Figure5.STM32F103xx performance line UFBGA100pinout (23)Figure6.STM32F103xx performance line LQFP64pinout (24)Figure7.STM32F103xx performance line TFBGA64ballout (25)Figure8.STM32F103xx performance line LQFP48pinout (26)Figure9.STM32F103xx performance line UFQFPN48pinout (26)Figure10.STM32F103xx performance line VFQFPN36pinout (27)Figure11.Memory map (34)Figure12.Pin loading conditions (36)Figure13.Pin input voltage (36)Figure14.Power supply scheme (36)Figure15.Current consumption measurement scheme (37)Figure16.Typical current consumption in Run mode versus frequency(at3.6V)-code with data processing running from RAM,peripherals enabled (43)Figure17.Typical current consumption in Run mode versus frequency(at3.6V)-code with data processing running from RAM,peripherals disabled (43)Figure18.Typical current consumption on V BAT with RTC on versus temperature at different V BAT values (45)Figure19.Typical current consumption in Stop mode with regulator in Run mode versus temperature at V DD=3.3V and3.6V (46)Figure20.Typical current consumption in Stop mode with regulator in Low-power mode versus temperature at V DD=3.3V and3.6V (46)Figure21.Typical current consumption in Standby mode versus temperature atV DD=3.3V and3.6V (47)Figure22.High-speed external clock source AC timing diagram (52)Figure23.Low-speed external clock source AC timing diagram (52)Figure24.Typical application with an8MHz crystal (53)Figure25.Typical application with a32.768kHz crystal (55)Figure26.Standard I/O input characteristics-CMOS port (64)Figure27.Standard I/O input characteristics-TTL port (64)Figure28.5V tolerant I/O input characteristics-CMOS port (65)Figure29.5V tolerant I/O input characteristics-TTL port (65)Figure30.I/O AC characteristics definition (68)Figure31.Recommended NRST pin protection (69)Figure32.I2C bus AC waveforms and measurement circuit (71)Figure33.SPI timing diagram-slave mode and CPHA=0 (73)Figure34.SPI timing diagram-slave mode and CPHA=1(1) (73)Figure35.SPI timing diagram-master mode(1) (74)/doc/730a8438ac51f01dc281e53a580216fc710a531c.html B timings:definition of data signal rise and fall time (75)Figure37.ADC accuracy characteristics (78)Figure38.Typical connection diagram using the ADC (79)Figure39.Power supply and reference decoupling(V REF+not connected to V DDA) (79)Figure40.Power supply and reference decoupling(V REF+connected to V DDA) (80)Figure41.VFQFPN366x6mm,0.5mm pitch,package outline(1) (82)Figure42.VFQFPN36recommended footprint(dimensions in mm)(1)(2) (82)DocID13587Rev167/105List of figures STM32F103x8,STM32F103xBFigure43.UFQFPN487x7mm,0.5mm pitch,package outline (83)Figure44.UFQFPN48recommended footprint (84)Figure45.LFBGA100-10x10mm low profile fine pitch ball grid array packageoutline (85)Figure46.Recommended PCB design rules(0.80/0.75mm pitch BGA) (86)Figure47.LQFP100,14x14mm100-pin low-profile quad flat package outline (87)Figure48.LQFP100recommended footprint(1) (87)Figure49.UFBGA100-ultra fine pitch ball grid array,7x7mm,0.50mm pitch,package outline (88)Figure50.LQFP64,10x10mm,64-pin low-profile quad flat package outline (89)Figure51.LQFP64recommended footprint(1) (89)Figure52.TFBGA64-8x8active ball array,5x5mm,0.5mm pitch,package outline (90)Figure53.Recommended PCB design rules for pads(0.5mm pitch BGA) (91)Figure54.LQFP48,7x7mm,48-pin low-profile quad flat package outline (92)Figure55.LQFP48recommended footprint(1) (92)Figure56.LQFP100P D max vs.T A (95)8/105DocID13587Rev16STM32F103x8,STM32F103xB Introduction 1IntroductionThis datasheet provides the ordering information and mechanical device characteristics ofthe STM32F103x8and STM32F103xB medium-density performance line microcontrollers.For more details on the whole STMicroelectronics STM32F103xx family,please refer toSection2.2:Full compatibility throughout the family.The medium-density STM32F103xx datasheet should be read in conjunction with the low-,medium-and high-density STM32F10xxx reference manual.The reference and Flash programming manuals are both available from theSTMicroelectronics website /doc/730a8438ac51f01dc281e53a580216fc710a531c.html .For information on the Cortex?-M3core please refer to the Cortex?-M3T echnicalReference Manual,available from the /doc/730a8438ac51f01dc281e53a580216fc710a531c.html website at the following address:/doc/730a8438ac51f01dc281e53a580216fc710a531c.html /help/index.jsp?topic=/com.arm.doc.ddi0337e/2DescriptionThe STM32F103xx medium-density performance line family incorporates the high-performance ARM Cortex?-M332-bit RISC core operating at a72MHz frequency,high-speed embedded memories(Flash memory up to128Kbytes and SRAM up to20Kbytes),and an extensive range of enhanced I/Os and peripherals connected to two APB buses.Alldevices offer two12-bit ADCs,three general purpose16-bit timers plus one PWM timer,aswell as standard and advanced communication interfaces:up to two I2Cs and SPIs,threeUSART s,an USB and a CAN.The devices operate from a2.0to3.6V power supply.They are available in both the–40to+85°C temperature range and the–40to+105°C extended temperature range.Acomprehensive set of power-saving mode allows the design of low-power applications.The STM32F103xx medium-density performance line family includes devices in six differentpackage types:from36pins to100pins.Depending on the device chosen,different sets ofperipherals are included,the description below gives an overview of the complete range ofperipherals proposed in this family.These features make the STM32F103xx medium-density performance line microcontrollerfamily suitable for a wide range of applications such as motor drives,application control,medical and handheld equipment,PC and gaming peripherals,GPS platforms,industrialapplications,PLCs,inverters,printers,scanners,alarm systems,video intercoms,and HVACs.DocID13587Rev169/105TimersCommunicationDescription STM32F103x8,STM32F103xB 2.1Device overviewTable2.STM32F103xx medium-density device features and peripheral1.On the TFBGA64package only15channels are available(one analog input pin has been replaced by‘Vref+’).10/105DocID13587Rev16Peripheral STM32F103Tx STM32F103Cx STM32F103Rx STM32F103Vx Flash-Kbytes64128641286412864128 SRAM-Kbytes20202020 General-purpose3333Advanced-control1111SPI12222I C1222USART2333USB1111CAN1111 GPIOs2637518012-bit synchronized ADCNumber of channels210channels210channels2(1)16channels216channels CPU frequency72MHzOperating voltage 2.0to3.6VOperating temperaturesAmbient temperatures:-40to+85°C/-40to+105°C(see Table9)Junction temperature:-40to+125°C(see Table9)Packages VFQFPN36LQFP48,UFQFPN48LQFP64,TFBGA64LQFP100,LFBGA100,UFBGA100f l a s ho b lI n t e r f a c eB u s M a t r i xA HB :F m a x =48/72M H zA PB 2:F m a x =48/72M H zA PB 1:F m a x =24/36M H zpbusPCLK2 HCLK CLOCK RTC AWUTAMPER -RTCSTM32F103x8, STM32F103xBDescriptionFigure 1. STM32F103xx performance line block diagram TRACECLKTRACED[0:3] as ASNJTRSTTRSTJTDIJTCK/SWCLK JTMS/SWDIOJTDO as AFTPIUTrace/trigSW/JTAGCortex -M3 CPUIbusF max : 7 2M Hz DbusTraceControlle rFlash 128 KB64 bitPOWERVOLT. REG. 3.3V TO 1.8V@VDDV DD = 2 to 3.6VV SSNVICSystemSRAM20 KB@VDDGP DMA7 channelsPCLK1 FCLKPLL &MANAGTXTAL OSC4-16 MHzOSC_INOSC_OUTRC 8 MHzNRST @VDDASUPPLYSUPERVISIONRC 40 kHz @VDDA@VBATIWDG Standby interfaceV BATVDDA VSSA 80AF PA[15:0] PB[15:0] POR / PDRPVDEXTIWAKEUPGPIOAGPIOBRstIntAHB2 AHB2APB2 APB1XTAL 32 kHzBackup reg Backu p i nterf ace TIM2 TIM3 OSC32_IN OSC32_OUT4 Channels 4 ChannelsPC[15:0]GPIOCTIM 44 ChannelsPD[15:0]GPIOD PE[15:0] GPIOEUSART2USART3RX,TX, CTS, RTS,CK, SmartCard as AFRX,TX, CTS, RTS, CK, SmartCard as AF 4 Channels3 compl. ChannelsETR and BKINMOSI,MISO, SCK,NSS as AFRX,TX, CTS, RTS,TIM1SPI12x(8x16bit)SPI2I2C1 I2C2MOSI,MISO,SCK,NSS as AFSCL,SDA,SMBA as AFSCL,SDA as AFSmartCard as AFUSART1@VDDAbxCANUSBDP/CAN_TXUSB 2.0 FSUSBDM/CAN_RX16AF V REF+ V REF -12bit ADC1 IF12bit ADC2 IFSRAM 512BWWDGTemp sensorai14390d1. T A = –40 °C to +105 °C (junction temperature up to 125 °C).2. AF = alternate function on I/O port pin.DocID13587 Rev 1611/105peripheralsIf (APB2 prescaler =1) x1 ADC /2, 4, 6, 8 ADCCLK DescriptionSTM32F103x8, STM32F103xBFigure 2. Clock treeFLITFCLKto Flash programming interface8 MHz HSI RCHSIUSBPrescaler 48 MHzUSBCLKto USB interface/2/1, 1.572 MHz maxClockHCLKto AHB bus, core, memory and DMA PLLSRCSWPLLMUL/8Enable (3 bits)to Cortex System timer..., x16 x2, x3, x4 PLLHSIPLLCLK HSESYSCLK72 MHz max AHB Prescaler /1, 2..512 APB1 Prescaler/1, 2, 4, 8, 16free running clock36 MHz max PCLK1to APB1Peripheral Clock Enable (13 bits)TIM2,3, 4to TIM2, 3and 4CSSIf (APB1 prescaler =1) x1 TIMXCLKelse x2 Peripheral ClockEnable (3 bits)OSC_OUTOSC_IN4-16 MHzHSE OSCPLLXTPRE/2APB2Prescaler/1, 2, 4, 8, 16TIM1 timer 72 MHz maxPeripheral ClockEnable (11 bits) PCLK2peripherals to APB2to TIM1 TIM1CLK else x2 Peripheral Clock OSC32_INOSC32_OUT32.768 kHz/128LSERTCCLKto RTCPrescaler Enable (1 bit) to ADCRTCSEL[1:0]LSI RCLSIto Independent Watchdog (IWDG)40 kHzIWDGCLKLegend:HSE = high -speed external clock signalHSI = high -speed internal clock signalMCOMainClock Output/2PLLCLKHSI LSI = low -speed internal clock signal LSE = low -speed external clock signalHSESYSCLKMCOai149031. When the HSI is used as a PLL clock input, the maximum system clock frequency that can be achieved is 64 MHz.2. For the USB function to be available, both HSE and PLL must be enabled, with USBCLK running at 48 MHz.3. To have an ADC conversion time of 1 µs, APB2 must be at 14 MHz, 28 MHz or 56 MHz.12/105DocID13587 Rev 16STM32F103x8, STM32F103xBDescription2.2 Full compatibility throughout the familyThe STM32F103xx is a complete family whose members are fully pin -to -pin, software and feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are identified as low -density devices, the STM32F103x8 andSTM32F103xB are referred to as medium -density devices, and the STM32F103xC, STM32F103xD and STM32F103xE are referred to as high -density devices.Low - and high -density devices are an extension of the STM32F103x8/B devices, they are specified in the STM32F103x4/6 and STM32F103xC/D/E datasheets, respectively. Low - density devices feature lower Flash memory and RAM capacities, less timers and peripherals. High -density devices have higher Flash memory and RAM capacities, and additional peripherals like SDIO, FSMC, I 2S and DAC, while remaining fully compatible with the other members of the STM32F103xx family .The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD and STM32F103xE are a drop -in replacement for STM32F103x8/B medium -density devices, allowing the user to try different memory densities and providing a greater degree of freedom during the development cycle.Moreover, the STM32F103xx performance line family is fully compatible with all existing STM32F101xx access line and STM32F102xx USB access line devices.1.For orderable part numbers that do not show the A internal code after the temperature range code (6 or 7),the reference datasheet for electrical characteristics is that of the STM32F103x8/B medium -density devices.DocID13587 Rev 16 13/105PinoutLow -density devicesMedium -density devices High -density devices 16 KB Flash 32 KB Flash (1) 64 KB Flash 128 KB Flash 256 KB Flash 384 KB Flash 512 KB Flash6 KB RAM 10 KB RAM 20 KB RAM 20 KB RAM 48 KB RAM 64 KB RAM 64 KB RAM144 5 × USART s 4 × 16-bit timers, 2 × basic timers2 3 × SPIs, 2 × I Ss, 2 × I2Cs USB, CAN, 2 × PWM timers 3 × ADCs, 2 × DACs, 1 × SDIOFSMC (100 and 144 pins) 100 3 × USART s 3 × 16-bit timers 2 2 × SPIs, 2 × I Cs, USB, CAN, 1 × PWM timer2 × ADCs 64 2 × USART s 2 × 16-bit timers 2 1 × SPI, 1 × I C, USB, CAN, 1 × PWM timer 2 × ADCs 48 36Description STM32F103x8,STM32F103xB 2.3Overview2.3.1ARM?Cortex?-M3core with embedded Flash and SRAMThe ARM Cortex?-M3processor is the latest generation of ARM processors for embeddedsystems.It has been developed to provide a low-cost platform that meets the needs of MCUimplementation,with a reduced pin count and low-power consumption,while deliveringoutstanding computational performance and an advanced system response to interrupts.The ARM Cortex?-M332-bit RISC processor features exceptional code-efficiency,delivering the high-performance expected from an ARM core in the memory size usuallyassociated with8-and16-bit devices.The STM32F103xx performance line family having an embedded ARM core,is thereforecompatible with all ARM tools and software.Figure1shows the general block diagram of the device family.2.3.2Embedded Flash memory64or128Kbytes of embedded Flash is available for storing programs and data.2.3.3CRC(cyclic redundancy check)calculation unitThe CRC(cyclic redundancy check)calculation unit is used to get a CRC code from a32-bitdata word and a fixed generator polynomial.Among other applications,CRC-based techniques are used to verify data transmission orstorage integrity.In the scope of the EN/IEC60335-1standard,they offer a means ofverifying the Flash memory integrity.The CRC calculation unit helps compute a signature ofthe software during runtime,to be compared with a reference signature generated at link-time and stored at a given memory location.2.3.4Embedded SRAMTwenty Kbytes of embedded SRAM accessed(read/write)at CPU clock speed with0waitstates.2.3.5Nested vectored interrupt controller(NVIC)The STM32F103xx performance line embeds a nested vectored interrupt controller able tohandle up to43maskable interrupt channels(not including the16interrupt lines ofCortex?-M3)and16priority levels.Closely coupled NVIC gives low-latency interrupt processingInterrupt entry vector table address passed directly to the coreClosely coupled NVIC core interfaceAllows early processing of interruptsProcessing of late arriving higher priority interruptsSupport for tail-chainingProcessor state automatically savedInterrupt entry restored on interrupt exit with no instruction overhead14/105DocID13587Rev16万联芯城专注电⼦元器件配单服务，只售原装现货库存，万联芯城电⼦元器件全国供应，专为终端⽣产，研发企业提供现货物料，价格优势明显，BOM配单采购可节省逐个搜索购买环节，只需提交BOM物料清单，商城即可为您报价，解决客户采购烦恼，为客户节省采购成本，点击进⼊万联芯城。