SMT-技术介绍

Label Verification and Correct Kit Release on Network
关键参数
Responsibility:
MBU/制造部门
责任
7
Process Flow/工艺流程
Flow Chart
Generic Process Flow / 一般的工艺流程图
Process Description: Screen Printing / 丝印
Process Description: Pick and Place (surface mounting)表面贴装
过程描述
Key Parameter:
BOM, Loading List, Layout
关键参数
Responsibility:
QA,Eng., MBU制造部
责任
8
Process Flow/工艺流程
关键参数
Responsibility:
IQC
责任
6
Process Flow/工艺流程
Байду номын сангаас
Flow Chart
Generic Process Flow / 一般的工艺流程图
Process Description: Storage and Material Kiting / 物料存放
过程描述
Key Parameter:
过程描述 Key Parameter:
Stencil selection, Supporting jig, Paste Height, Machine Parameters, Stencil cleaning, Solder Paste
Usability
Responsibility: IPQC,Eng.,MBU,Stores
Printer
P&P
P&P
AOI
Quality control point
Reflow Oven
Quality control point
5
Process Flow/工艺流程
Flow Chart
Generic Process Flow / 一般的工艺流程图
Process Description: Receiving Material / 收料
Eng.
责任
Process Description: Post Reflow Inspection /回流后检查
过程描述 Key Parameter: 关键参数 Responsibility:
IPC-A-610, Customer BOM MBU
9
Process Flow/工艺流程
Flow Chart
Part Number, Work Order Quantity, FIFO,WIP
关键参数
Responsibility:
Stores
责任
Process Description: Label Application and board tracking / 贴标签
板的跟踪
过程描述
Key Parameter:
Flow Chart
Generic Process Flow / 一般的工艺流程图
Process Description: Reflow / 回流
过程描述
Key Parameter:
Temperature Profile to Match Specific Product
关键参数
Responsibility:
关键参数
Responsibility:
MBU
责任
Process Description: Wave soldering / 波峰焊接
过程描述
Key Parameter:
Temperature Profile , Flux, Solder bar, Wave
Generic Process Flow / 一般的工艺流程图
Process Description: Hand Insertion （PTH )/ 手插件
过程描述
Key Parameter:
Hand Insertion of Components as per
instruction / layout
OK
OK
Visual Inspection
AOT test
NG
NG
Rework
OK Visual Inspection
NG
NG
OK
FQA
Inspection
OK ICT TEST
NG
PCBA FUNCTION
TEST
Box Building
Packing
OK
FA
Function
Test
4
SMT Equipment Overview/ SMT 设备纵览 Surface Mounting Technology
2
Learning Objective
➢ 》 General Process Engineering
Introduction/一般的工艺流程介绍
➢ 》 SMT vs THT/表面贴装技术 vs 通孔装配
技术
➢ Composition/组成 ➢ Assembly Classifications/装配分类 ➢ Advantages/优点 ➢ Development Trend /发展趋势 ➢ SMT defect & Countermeasure /SMT 不良
Surface Mount Technology Introduction 表面贴装技术简介
Definition/定义
➢ SMT-Surface Mounting Technology:
SMT is a process or assembly technique by which components are soldered onto the board surface./SMT 是把零件焊接到印刷线路板表面的 工艺或装配技术.
过程描述
Key Parameter:
Part Number and Quantity
关键参数
Responsibility:
Store
责任
Process Description: Incoming Inspection / 来料检查
过程描述
Key Parameter:
Inspection on Incoming
及改善对策
3
PCBA Process Flow Chart/SMT工艺流程图
》Process flow/工艺流程图
Printing
NG Clearing PCB
Paste
OK
Inspection
Placement
Reflow solder
Wave solder
Rework
Shipping
Hand loading