GF66x8系列指纹识别芯片_datasheet_20141104_Rev.C(乐今)

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conga-SMX8-X (Prototype Revision Y.1) 快速入门指南说明书

conga-SMX8-X (Prototype Revision Y.1) Sample Distribution Set for congatec SMARC 2.0 DevelopmentQuick Start GuideRevision 1.1PrefaceThis quick start guide provides information about the contents of theconga-SMX8-X (Prototype Revision Y.1) sample distribution set and howto set it up.DisclaimerThe information contained within this quick start guide, including but notlimited to any product specification, is subject to change without notice.congatec AG provides no warranty with regard to this guide or any otherinformation contained herein and hereby expressly disclaims any impliedwarranties of merchantability or fitness for any particular purpose withregard to any of the foregoing. congatec AG assumes no liability for anydamages incurred directly or indirectly from any technical or typographicalerrors or omissions contained herein or for discrepancies between theproduct and this guide. In no event shall congatec AG be liable for anyincidental, consequential, special, or exemplary damages, whether basedon tort, contract or otherwise, arising out of or in connection with this guideor any other information contained herein or the use thereof. Intended AudienceThis guide is intended for technically qualified personnel. It is not intendedfor general audiences.Lead-Free Designs (RoHS)All congatec AG designs are created from lead-free components and arecompletely RoHS compliant.Electrostatic Sensitive DeviceAll congatec AG products are electrostatic sensitive devices. They areenclosed in static shielding bags, and shipped enclosed in secondarypackaging (protective packaging). The secondary packaging does notprovide electrostatic protection.Do not remove the device from the static shielding bag or handle it, exceptat an electrostatic-free workstation. Also, do not ship or store electronicdevices near strong electrostatic, electromagnetic, magnetic, or radioactivefields unless the device is contained within its original packaging. Be awarethat failure to comply with these guidelines will void the congatec AGLimited Warranty.Copyright NoticeCopyright © 2019, congatec AG. All rights reserved. All text, pictures andgraphics are protected by copyrights. No copying is permitted withoutwritten permission from congatec AG.congatec AG has made every attempt to ensure that the information inthis document is accurate yet the information contained within is supplied“as-is”.TrademarksProduct names, logos, brands, and other trademarks featured or referredto within this guide, or the congatec website, are the property of theirrespective trademark holders. These trademark holders are not affiliatedwith congatec AG, our products, or our website.Certificationcongatec AG is certified to DIN EN ISO 9001 standard.Warrantycongatec AG makes no representation, warranty or guaranty, express orimplied regarding the products except its standard form of limited warranty(“Limited Warranty”) per the terms and conditions of the congatec entity,which the product is delivered from. These terms and conditions canbe downloaded from . congatec AG may in its solediscretion modify its Limited Warranty at any time and from time to time.The products may include software. Use of the software is subject to theterms and conditions set out in the respective owner’s license agreements,which are available at and/or upon request.Beginning on the date of shipment to its direct customer and continuing forthe published warranty period, congatec AG represents that the productsare new and warrants that each product failing to function properly undernormal use, due to a defect in materials or workmanship or due to nonconformance to the agreed upon specifications, will be repaired orexchanged, at congatec’s option and expense.Customer will obtain a Return Material Authorization (“RMA”) numberfrom congatec AG prior to returning the non conforming product freightprepaid. congatec AG will pay for transporting the repaired or exchangedproduct to the customer.Repaired, replaced or exchanged product will be warranted for the repairwarranty period in effect as of the date the repaired, exchanged or replacedproduct is shipped by congatec, or the remainder of the original warranty,whichever is longer. This L imited Warranty extends to congatec’s directcustomer only and is not assignable or transferable.Except as set forth in writing in the Limited Warranty, congatec makes noperformance representations, warranties, or guarantees, either express orimplied, oral or written, with respect to the products, including withoutlimitation any implied warranty (a) of merchantability, (b) of fitness for aparticular purpose, or (c) arising from course of performance, course ofdealing, or usage of trade.congatec AG shall in no event be liable to the end user for collateral orconsequential damages of any kind. congatec shall not otherwise be liablefor loss, damage or expense directly or indirectly arising from the use of theproduct or from any other cause. The sole and exclusive remedy againstcongatec, whether a claim sound in contract, warranty, tort or any otherlegal theory, shall be repair or replacement of the product only.Technical Supportcongatec AG technicians and engineers are committed to providing thebest possible technical support for our customers so that our products canbe easily used and implemented. We request that you first visit our websiteat for the latest documentation, utilities and drivers,which have been made available to assist you. If you still require assistanceafter visiting our website then contact our technical support department by***************************Revision HistoryRevision Date (yyyy-mm-dd)Author Changes0.12019-02-19BEU Preliminary release for X.01.02019-04-10BEU Final release for X.01.12019-11-15BEU Update for Y.11 Hardware1.1 Sample Distribution Set ContentsThe contents of the conga-SMX8-X (Prototype Revision Y.1) sampledistribution set are listed below:Part # Description Qty007010 C.0conga-SEVAL Evaluation carrier board for standardSMARC modules based on SMARCSpecification 2.01051100 or 051103Y.1conga-SMX8-X/QXP-4GeMMC16 (Prototype)orconga-SMX8-X/QXP-2GeMMC16 (Prototype)SMARC 2.0 prototype module withNXP i.MX 8QuadXPlus applicationsprocessor, 16 GB onboard HS400eMMC, and 4 GB or 2 GB LPDDR4onboard memory.1051050X.0conga-SMX8/i-CSP-B Passive cooling for SMARC 2.0 moduleconga-SMX8. All stand-offs are borehole 2.7 mm.1011115 B.0conga-LDVI/EPI LVDS to DVI converter board for digitalflat panels with onboard EEPROM.1 033331A cab-LVDV-DAT-34-1515 cm data cable LVDS to DVI adapter1052147A cab-LVDV-PWR-10-1515 cm power cable LVDS to DVI adapter148000023A RS232 adapter cable MOLEX 6-pin PicoBlade to 2x D-SUB 9adapter110000285A MicroSDHC-Card UHS-I Kingston industrial SDCIT/EU Class 108 GB microSD card with SD card adapterand preinstalled image.1N/A 1.1Quick Start Guide conga-SMX8-X Sample Distribution SetQuick Start Guide1 1.2 conga-SMX8-XThe conga-SMX8-X (Prototype Revision Y.1) included in this sampledistribution set is a SMARC 2.0 prototype module featuring the NXPi.MX 8QuadXPlus applications processor, 16 GB HS400 onboard eMMC,and 4 GB or 2 GB LPDDR4 onboard memory.For information about the Mass Production (MP) variants, refer to thedatasheet available at .1.2.1 Pinout DescriptionThe conga-SMX8-X (Prototype Revision Y.1) pinout description is availableat the link below. The pinout description lists which signals of the NXP i.MX8QuadXPlus applications processor are routed to the SMARC connector.https:///imx8x_early_access/imx8x_sx8x_pinlistNoteContact congatec technical support to get access to this folder.1.3 conga-SEVALThe conga-SEVAL (Revision C.0) included in this sample distribution set isan evaluation carrier board based on the SMARC Specification 2.0.For information about the conga-SEVAL, refer to the User's Guide availableat .1.4 Hardware SetupFollow the steps below to assemble the hardware:1. Ensure the hardware is protected from the effects of electrostaticdischarge (ESD).2. On the carrier board, select the boot source via the DIP switches1,2:M18M17SelectedBoot Source1,2#1#2#1ON ON OFF SPI flash (default)OFF ON ON SD card4. On the carrier board, set DIP switch M12 #1 to OFF (Audio: I²S)5. Insert the included SD card into the SD card slot of the carrier board.6. Connect the RS232 adapter cable to the connector on the module.7. Connect the USB 2.0 to Serial Adapter to the RS232 adapter cable portlabeled "CONSOLE".8. Mount the cooling solution onto the module. (Final torque: 0.4 Nm)9. Mount the module onto the carrier board. (Final torque: 0.4 Nm)10. Connect the conga-LDVI/EPI as shown in the image on the right.11. Connect a Power Supply Unit (PSU)3 to the carrier board.12. To start the system, switch the PSU on4.Note1 Boot sourc e selec tion via DIP switc hes will not be implemented on MassProduction (MP) variants.2 To enable serial downloader mode, set jumper X45 to position 2-3. Fastboot iscurrently not supported.3 An AT PSU is recommended.4 If an ATX PSU is used in c ombination with a modified U-Boot, it may benecessary to push the reset button several times to start the system.2 Software2.1 Starting UpThe conga-SMX8-X uses U-Boot as standard bootloader. The bootloaderis GNU GPL open source software. A serial terminal connection is requiredin order to display the boot process and to modify the boot behavior. Theboot behavior is controlled via environment variables.The included RS232 adapter cable has two connectors. The RX/TX signalsare already crossed. Therefore, do NOT use a crossover-cable. Use theconnector labeled "Console" for the U-Boot console output. Use theunlabeled connector for the System Controller Unit Firmware (SCFW)debug output.To establish a terminal connection, a terminal program such as TeraTermor Putty can be used.Use the following communication parameters:Baud rate: Data: Parity: Stop:Flow control: 115200 8 bit none 1 bit noneThe following console output will be displayed when the system is powered on:2.2 Boot ProcessThe conga-SMX8-X boot process starts at Power On Reset (POR), wherethe hardware reset logic forces the ARM core to begin execution. The on-chip boot ROM loads the boot container which usually consists of SCFW,Security Controller (SECO) firmware, ARM Trusted Firmware (ATF) and thebootloader binary (U-Boot).After SCFW loading, the bootloader is executed and performs basic systeminitialization (serial console, etc.). Afterwards, the environment settings areparsed and the system boot continues as specified.Press any key during startup to stop autoboot and to get to U-Boot console.At the U-Boot console, the environment settings can be displayed usingthe “print” command. In addition, useful functionality is available (such asmemory dump, access to the SPI and the I2C system, etc.). The “help”command will display any command supported by the U-Boot.If autoboot is not interrupted by pressing a key, the boot process goesahead and the module boots the Linux operating system installed on theSD card.2.3 U-Boot Environment VariablesThe U-Boot environment is located in SPI flash. One of the benefits of theU-Boot bootloader is the possibility to specify its run time configurationusing environment variables.The environment variables of U-Boot can be displayed using the printenv(or the print) command.During the boot process, the bootloader evaluates the “bootcmd” variableand executes it. The boot command tries to load a bootscript or a kernelfrom the boot device. If this is successful, the script or kernel will be started,otherwise a fallback to network boot is performed. The variable “mmcdev”specifies the mmc boot device. Furthermore, the variable “mmcroot” ispassed to the kernel in order to specify the location of the root filesystem.The following environment variables are predefined for conga-SMX8-X (Prototype Revision Y.1):Name Default value Descriptionbootcmd Defines the startup command of the bootloader, i.e.how the system performs the boot processfdt_file imx8qxp-cgtsx8x.dtb The device tree blob, might be exchanged in order toenhance functionalityimage Image The name of the kernel image file that is loadedduring boot processipaddr not specified Address of the system (used for network boot) serverip not specified Address of the remote host (used for network boot) netmask not specified Netmask of the network (used for network boot) nfsroot not specified The location where the NFS root filesystem is stored(used for network boot)mmcdev"1" (external SD card)The boot device number (used for mmcboot) mmcpart"1" (first partition)The number of the bootpartiton on the bootdevice(used for mmcboot)mmcroot"/dev/mmcblk1p2 rootwaitrw" (2nd partition on device 1)The root filesystem (used for mmcboot), might also be used to extend the kernel command lineFollowing, some frequently used scripts:Name Descriptionmmcboot Boots the system from mmc (with the specified parameters for mmcboot), i.e.eMMC, SD cardmmcargs Configures the bootargs for mmcbootnetboot Boots the system from network (with the specified parameters for network boot) netargs Configures the bootargs for network bootloadbootscript Used during boot, loads an eventually existing boot scriptloadimage Used during boot, loads the kernelloadfdt Used during boot, loads the device tree blob fileThere are several commands to change the behavior of the bootloader and to customize the boot process. The help command can be used to display a list of all available commands.2.4 Updating or Fixing the Boot ContainerThe boot container of the conga-SMX8-X (Prototype Revision Y.1) is storedin SPI flash. To update or fix a corrupted boot container, boot from arecovery SD card instead of SPI flash. Follow the steps below to create arecovery SD card and update or fix the boot container:1. Flash your root filesystem image to an SD card1 ("recovery SD card"):dd if=your_rootfs.sdcard of=/dev/sdX2. Write your boot container (SD) to the recovery SD card:dd if=your_bootcontainer_sd.bin of=/dev/sdX bs=1k seek=323. Copy your boot container (SPI flash) to the recovery SD card:mkdir-p/mnt/sdmount/dev/sdX1/mnt/sdcp -avr your_bootcontainer_fspi.bin /mnt/sd/.sync; umount /mnt/sd4. Insert the recovery SD card into the SD card slot of the carrier board5. Set the DIP switches to boot from SD card (see step 2 of section 1.4)6. Start the system (see step 12 of section 1.4)7. Log in as root and enter the following commands:cd/run/media/mmcblk1p1flash_eraseall /dev/mtd0dd if=xyz_bootcontainer_fspi.bin of=/dev/mtd0poweroff8. Switch the PSU offThe boot container is updated. The recovery SD card can be removed andthe DIP switches set back to boot from SPI flash (see step 2 of section 1.4).Note1 Do not use the SD card included in the sample distribution set for this purpose.2.5 LinuxBy default, the bootloader loads the Linux operating system stored on theSD card. The operating system image is built by Yocto.Booting to the Linux desktop may take some time. To speed up the bootprocess significantly, install the root filesystem onto the onboard eMMCdevice.NoteIn order to maintain the integrity of the filesystem, it is recommended toalways shut down the system by issuing the command “poweroff” in theconsole terminal.2.6 Additional InformationThe software provided on the included SD card is based on the YoctoProject () and i.MX 8QuadXPlus specific add-onlayers provided by NXP and congatec.The conga-SMX8-X software documentation is available at:https:///imx8x_early_access/meta-fsl-bsp-releaseThe conga-SMX8-X sources required to build the root filesystem image,kernel and bootloader are available at:https:///imx8x_early_accessUsing the wrong source can cause damage to the hardware and/or loss ofdata. For the conga-SMX8-X Prototype Revision Y.1, only use sources frombranches ending with "_cgtsx8x-Y1".NoteContact congatec technical support to get access to the repositories.。

ELAN EM78F811N 8位微控制器产品规格书说明书

产品规格书版本1.5义隆电子股份有限公司2021.07商标告之:IBM 为一个注册商标，PS/2是IBM 的商标之一。

Windows 是微软公司的商标。

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义隆电子股份有限公司总公司:地址: 30076新竹科学工业园区创新一路12号电话: +886 3 563-9977 传真: +886 3 563-9966 *****************.tw http :// 香港分公司:义隆电子(香港)股份有限公司地址:九龙观塘巧明街95号世达中心19楼A 室电话: +852 2723-3376 传真: +852 2723-7780美国:Elan InformationTechnology Group (U.S.A.) 地址: 10268 Bandley Drive Suite 101 , Cupertino , CA 95014,USA 电话: +1 408 366-8225 传真: +1 408 366-8225深圳分公司:义隆电子(深圳)有限公司地址:518057深圳市南山区高新技术产业园南区高新南六道迈科龙大厦8A电话: +86 755 2601-0565 传真: +86 755 2601-0500 ******************.cn上海分公司:义隆电子(上海)有限公司地址:上海市浦东新区盛荣路88弄3号703室(盛大天地源创谷内)电话：+86 21 5080-3866 ******************.cn目录目录1 综述 (1)2 特性 (1)3 引脚配置 (2)3.1 10-Pin MSOP (2)3.2 16-Pin DIP/SOP (2)3.3 14-Pin SOP (2)4 引脚描述 (3)5 系统概述 (5)5.1 内存图 (5)5.2 模块图 (6)6 功能描述 (7)6.1 操作寄存器 (7)6.1.1 R0:IAR (间接寻址寄存器) (7)6.1.2 R1 :TCC(定时器时钟) (7)6.1.3 R2:PC (程序计数器和堆栈) (7)6.1.4 R3 :SR(状态寄存器) (10)6.1.5 R4 :RSR(RAM选择寄存器) (10)6.1.6 Bank 0 R5 ~ R6, R8 (Port 5 ~ Port 6, Port 8) (10)6.1.7 Bank 0 R9:TBLP (指令TBRD表指针寄存器) (11)6.1.8 Bank 0 RA:WUPC (唤醒控制寄存器) (11)6.1.9 Bank 0 RB:EECR (EEPROM控制寄存器) (12)6.1.10 Bank 0 RC: EEPA (128 字节 EEPROM 地址) (12)6.1.11 Bank 0 RD: EEPD (128字节EEPROM 数据) (12)6.1.12 Bank 0 RE: OMCR (模式选择寄存器) (12)6.1.13 Bank 0 RF: ISR1 (中断状态寄存器 1) (15)6.1.14 R10 ~ R3F (15)6.1.15 Bank 1 R5~R7 (16)6.1.16 Bank 1 R8 (IRC 选择寄存器) (16)6.1.17 Bank 1 R9: TM1CR1 (定时器/计数器 1控制寄存器1) (16)6.1.18 Bank 1 RA: TM1CR2(定时器/计数器 1控制寄存器 2) (17)6.1.19 Bank 1 RB: TM1DAH (定时器/计数器 1数据缓冲A高字节) (18)6.1.20 Bank 1 RC: TM1DAL (定时器/计数器 1数据缓冲A低字节) (18)6.1.21 Bank 1 RD: TM1DBH (定时器/计数器 1数据缓冲B高字节) (18)6.1.22 Bank 1 RE: TM1DBL (定时器/计数器 1数据缓冲B低字节) (18)6.1.23 Bank 1 RF: ISR2 (中断状态寄存器 2) (19)6.1.24 Bank 2 R5:AISR (ADC输入选择寄存器) (19)6.1.25 Bank 2 R6: ADCON (A/D控制寄存器) (20)6.1.26 Bank 2 R7: ADCON2 (A/D控制寄存器2) (21)6.1.27 Bank 2 R8 : ADDH (AD高 8位数据缓存) (22)6.1.28 Bank 2 R9 : ADDL (AD低4位数据缓存) (22)6.1.29 Bank 2 RA: URCR (UART控制寄存器) (22)6.1.30 Bank 2 RB: URS (UART 状态寄存器) (23)6.1.31 Bank 2 RC: URTD (UART 发送数据缓冲寄存器) (24)6.1.32 Bank 2 RD: URRDL (UART 接收数据低位缓冲寄存器) (24)目录6.1.33 Bank 2 RE: URRDH (UART 接收数据高位缓冲寄存器) (24)6.1.34 Bank 2 RF (24)6.1.35 Bank 3 R5 (24)6.1.36 Bank 3 R6 : TBHP(指令TBRD的表指针寄存器) (24)6.1.37 Bank 3 R7: CMP2CON(比较器2控制寄存器) (25)6.1.38 Bank 3 R8 ~ RC (25)6.1.39 Bank 3 RD :TC3CR (定时器3控制) (25)6.1.40 Bank 3 RE :TC3D (定时器 3 数据缓存) (27)6.1.41 Bank 3 RF (27)6.2 特殊功能寄存器 (28)6.2.1 A (累加器) (28)6.2.2 CONT (控制寄存器) (28)6.2.3 IOC5 ~ IOC6, IOC8 (I/O端口控制寄存器) (28)6.2.4 IOC7, IOC9 (28)6.2.5 IOCA:WDTCR (WDT 控制寄存器) (29)6.2.6 IOCB: P6PDCR (下拉控制寄存器2) (29)6.2.7 IOCC: P6ODCR (漏极开路控制寄存器) (30)6.2.8 IOCD: P9PHCR (上拉控制寄存器2) (30)6.2.9 IOCE:IMR2 (中断屏蔽寄存器2) (31)6.2.10 IOCF: IMR1(中断屏蔽寄存器1) (31)6.3 TCC/WDT 与预分频器 (33)6.4 I/O 端口 (34)6.4.1 使用端口6输入状态改变唤醒/中断功能 (36)6.5 复位和唤醒 (37)6.5.1 复位 (37)6.5.2 总结唤醒和中断模式操作 (39)6.5.3 寄存器初始值的总结 (42)6.5.4 状态寄存器的T和P状态 (49)6.6 中断 (50)6.7 数据EEPROM (52)6.7.1 数据EEPROM控制寄存器 (52)6.7.2 编程步骤 / 举例示范 (52)6.8 模拟数字转换器(ADC) (53)6.8.1 A/D 取样时间 (53)6.8.2 A/D 转换时间 (54)6.8.3 睡眠期间的A/D转换 (54)6.8.4 编程步骤/注意事项 (55)6.9 定时器/计数器1 (TM1) (58)6.9.1 定时器/计数器模式 (58)6.9.2 窗口模式 (59)6.9.3 捕捉模式 (60)6.9.4 可编程分频输出模式和脉冲宽度调制模式 (62)6.9.5 蜂鸣器 (63)6.10 定时器/计数器3 (63)6.11 UART (65)6.11.1 UART 模式 (66)6.11.2 发送 (67)目录6.11.3 接收 (67)6.11.4 波特率发生器 (68)6.11 .5 UART 时序 (68)6.12 比较器 (69)6.12.1 外部参考信号 (69)6.12.2 内部参考电压 (70)6.12.3 比较器输出 (70)6.12.4 中断 (70)6.12.5 从睡眠至唤醒 (70)6.12.6 比较器初始化步骤 (71)6.13 振荡器 (71)6.13.1 振荡模式 (71)6.13.2 晶振 / 陶瓷谐振器(晶体) (72)6.13.3 外部RC振荡模式 (73)6.13.4 内部 RC 振荡模式 (74)6.14 代码选项寄存器 (75)6.14.1 代码选项寄存器 (Word 0) (75)6.14.2 代码选项寄存器(Word 1) (77)6.14.3 客户ID寄存器(Word 2) (78)6.15 上电注意事项 (79)6.16 外部上电复位电路 (79)6.17 残留电压保护 (80)6.18 指令集 (81)7片上调试系统(OCDS) (84)7.1 片上调试的限制 (84)8 时序图 (85)9 绝对最大额定参数 (86)10 DC电气特性 (87)11 AC电气特性 (92)A 编码与制造信息 (93)B 封装类型 (94)C 封装结构 (95)C.1 EM78F811NMS10 (95)C.2 EM78F811NSO14 (96)C.3 EM78F811NAD16 (97)C.4 EM78F811NASO16A (98)D 品质保证和可靠性 (99)D.1 地址缺陷检测 (99)目录规格修订历史目录用户应用注意事项(使用此IC前，应注意如下描述的注意事项，它包含重要信息)1. 如果IRC频率从A频率变为B频率，MCU需要等待一些时间才可以工作。

Agilent 53131A 132A 181A计数器说明书

• 225 MHz bandwidth(optional 1.5, 3, 5, or 12.4 GHz)• 10- or 12-digit resolution with 1 s gate time • GPIB interface and IntuiLink connectivity software standard • Data transfer rate of up to 200 fully formatted measurements/secondAgilent 53131A/132A/181A CountersHigh-performance, low-cost counters simplify and speed systems and bench frequency measurementsData SheetRecommended replacement products:53200 Series RF & universal frequency counter/timers(Data sheet publication number: 5990-6283EN)A family of universal andRF counters to meet your needs Agilent Technologies 53131A/132A/181A high-performance counters give you fast, precise frequency measure-ments at an affordable price. These counters feature an intuitive user interface and one-button access to frequently used functions so you can make accurate measurements quickly and easily.Real-time digital signal processing technology is used to analyze data while simultaneously taking new read-ings, speeding measurement through-put. The technology, developed for Agilent’s high-end line of modulation domain analyzers, allows the counters to gather more data for each measure-ment, so you get higher-resolution measurements in a fraction of the time it takes other counters.The 53131A/132A/181A counters offer built-in statistics and math functions so you can scale measurements and simultaneously measure and track average, min/max and standard devia-tion. Automated limit testing lets you set upper and lower limits for any mea-surement. An analog display mode lets you see at a glance whether a mea-surement is within pass/fail limits. The counters flag out-of-limit conditions and can generate an output signal to trigger external devices when a limitis exceeded. For quick access to fre-quently used tests, a single keystroke recalls up to 20 different stored front-panel set-ups. For computer-controlled systemsapplications, each counter includesa standard GPIB interface with fullSCPI-compatible programmability anda data transfer rate of up to 200 fullyformatted measurements per second.The standard RS-232 talk-only interfaceprovides printer support or data trans-fer to a computer through a terminal-emulation program.Agilent 53131A universal counterThe two-channel 53131A counter offers10 digits per second of frequency/period resolution and a bandwidth of225 MHz. Time interval resolution isspecified at 500 ps. An optional thirdchannel provides frequency measure-ments up to 3 GHz, 5 GHz, or 12.4 GHz.Standard measurements include fre-quency, period, ratio, time interval,pulse width, rise/fall time, phaseangle, duty cycle, totalize, and peakvoltage.Agilent 53132A universal counterFor applications requiring higherresolution, the 53132A offers the samefeatures and functions as the 53131A,with up to 12 digits/sec frequency/period resolution and 150 ps timeinterval resolution. In addition, the53132A offers advanced arming modesfor time interval measurements.Agilent 53181A RF counterOptimized for RF applications, thesingle-channel 10 digit/s 53181Ameasures frequency, period and peakvoltage. A digit-blanking function letsyou easily eliminate unnecessary digitswhen you want to read measurementsquickly. For higher-frequency measure-ments, choose an optional secondchannel that provides measurementsup to 1.5 GHz, 3 GHz, 5 GHz, or 12.4 GHz.A self-guided shallow menu makes thiscounter exceptionally easy to use.Agilent IntuiLink provides easy access to the counter’s data from your PC The Agilent 53131A/132A/181A counters, capture precise frequencyand time measurements. IntuiLink software allows that data to be putto work easily. You work in a familiar environment at all times, using PC applications such as Microsoft Excel®or Word® to analyze, interpret, display, print, and document the data you get from the counter.It gives you the flexibility to configure and run tests from your PC making data gathering more convenient.Agilent IntuiLink lets you:• Configure tests, including measure-ment type, number of readings,measurement speed, and more.• Choose display modes from real-time strip chart, histogram, readout,and table mode.• Scale measurements data.• Copy captured data to otherprograms.Optional timebases offerincreased stabilityOptional timebases are availablefor 53131A/132A/181A counters toincrease measurement accuracy. Option010 provides a high stability oventimebase with aging of less than5 x 10-10 per day.1-year warrantyEach counter comes with operating,programming and service manuals,IntuiLink software, a power cord anda full 1-year warranty.Time BaseInternal time base stability (see graph 3 for timebase contribution of measurement error)Standard Medium oven High oven Ultra high oven(0° to 50°C) (Option 001) (Option 010) (Option 012 for 53132A only) Temperature stability (referenced to 25°C)< 5 x 10-6< 2 x 10-7< 2.5 x 10-9< 2.5 x 10-9Aging rate Per Day: < 4 x 10-8< 5 x 10-10< 1 x 10-10(after 30 days) Per Month: < 3 x 10-7 < 2 x 10-7< 1.5 x 10-8< 3 x 10-9Per Year: < 2 x 10-8Turn-on stability vs. time(in 30 minutes) < 2 x 10-7 < 5 x 10-9< 5 x 10-9referenced to 2 h referenced to 24 h referenced to 24 h Calibration Manual adjust Electronic Electronic ElectronicNote that power to the time base is maintained when the counter is placed in standby via the front panel switch. The internal fan will continue to operate when in standby to maintain long-term measurement reliability.Input specificationsChannel 1 & 2 (53131A, 53132A)1Channel 1 (53181A)Frequency rangedc coupled dc to 225 MHzac coupled 1 MHz to 225 MHz (50 Ω)30 Hz to 225 MHz (1 MΩ)FM tolerance 25%Voltage range and sensitivity (Sinusoid)2dc to 100 MHz 20 mVrms to ±5 V ac + dc 100 MHz 30 mVrms to ±5 V ac + dcto 200 MHz200 MHz 40 mVrms to ±5 V ac + dcto 225 MHz (all specified at 75 mVrmswith opt. rear connectors)3 Voltage range and sensitivity(Single-shot pulse)24.5 ns to 10 ns 100 mVpp to 10 Vpppulse width (150 mVpp with optionalrearconnectors)3>10 ns 50 mVpp to 10 Vpppulse width (100 mVpp with optionalrearconnectors)3Trigger level2Range ± 5.125 VAccuracy ± (15 mV + 1% of trigger level) Resolution 5mVDamage level50 Ω 5 Vrms0 to 3.5 kHz, 350 Vdc + ac pk1 MΩ3.5 kHz to 350 Vdc + ac pk linearly100 kHz, 1 MΩderated to 5 Vrms>100 kHz, 5 Vrms1 MΩ Input characteristicsChannel 1 & 2 (53131A, 53132A)1Channel 1 (53181A)Impedance 1 MΩ or 50 Ω1 MΩ 30 pFcapacitanceCoupling ac or dcLow-pass filter 100 kHz, switchable-20 dB at > 1 MHzInput Selectable between Low,sensitivity Medium,orHigh(default).Low is approximately 2xHighSensitivity.Trigger slope Positive or negativeAuto trigger levelRange 0 to 100% in 10% stepsFrequency > 100 HzInput amplitude> 100 mVpp(No amplitude modulation)AttenuatorVoltage range x10Trigger range x10Input Specifications4Channel 3 (53131A, 53132A)Channel 2 (53181A)Frequency rangeOption 015 100 MHz to 1.5 GHz(for 53181A (see Opt. 030 foronly) additionalspecs)Option 030 100 MHz to 3 GHzOption 050 200 MHz to 5 GHzOption 124 200 MHz to 12.4 GHzPower range and sensitivity (Sinusoid)Option 030 100 MHz to 2.7 GHz:-27 dBm to +19 dBm2.7 GHz to 3 GHz:-21 dBm to +13 dBmOption 050 200 MHz to 5 GHz:-23 dBm to +13 dBmOption 124 200 MHz to 12.4 GHz-23 dBm to +13 dBmDamage levelOption 030 5 VrmsOption 050 +25 dBmOption 124 +25 dBmCharacteristicsImpedance 50ΩCoupling ACVSWR <2.5:1External arm input specifications5Signal input rangeTTL compatibleTiming RestrictionsPulse width > 50 nsTransition time < 250 nsStart-to-stop time> 50 nsDamage level 10VrmsExternal arm input characteristics5Impedance 1kΩInput capacitance 17 pFStart/stop slope Positive or negativeExternal time base input specificationsVoltage range 200 mVrms to 10 VrmsDamage level 10 VrmsFrequency 1 MHz, 5 MHz, and 10 MHz(53132A 10 MHz only)Time base output specificationsOutput frequency 10 MHzVoltage > 1 Vpp into 50 Ω(centered around 0 V)1. Specifications and characteristics for Channels1 and2 are identical for both common andseparate configurations.2. Values shown are for X1 attenuator setting.Multiply all values by 10 (nominal) when usingthe X10 attenuator setting.3. When the 53131A or 53132A are ordered withthe optional rear terminals (Opt. 060), the channel1 and2 inputs are active on both front and rearof the counter. When the 53181A is ordered withthe optional rear terminal, the channel 1 input isactive on both front and rear of the counter. Forthis condition, specifications indicated for the rearconnections also apply to the front connections.4. When optional additional channels are orderedwith Opt. 060, refer to configuration table forOpt. 060 under ordering info on page 8. There isno degradation in specifications for this input,as applicable.5. Available for all measurements except peak volts.External arm is referred to as external gate forInstrument InputsFrequency (53131A, 53132A, 53181A) Channel 1 and 2 (53131A, 53132A)Channel 1 (53181A)Range 0.1 Hz to 225 MHzChannel 3 (53131A, 53132A)Channel 2 (53181A)Option 015 100 MHz to 1.5 GHz(53181 A only)Option 030 100 MHz to 3 GHzOption 050 200 MHz to 5 GHzOption 124 200 MHz to 12.4 GHz (Period 2 or 3 selectable via GPIB only)Period (53131A, 53132A, 53181A) Channel 1 and 2 (53131A, 53132A)Channel 1 (53181A)Range 4.44 ns to 10 sChannel 3 (53131A, 53132A)Channel 2 (53181A)Option 015 0.66 ns to 10 ns(53181A only)Option 030 0.33 ns to 10 nsOption 050 0.2 ns to 5 nsOption 124 80 ps to 5 nsFrequency ratio (53131A, 53132A, 53181A) Measurement is specified over the full signal range of each input.Results range 10-10 to 1011“Auto” gate time 100 msTime interval (53131A, 53132A) Measurement is specified over the full signal ranges6 of Channels 1 and 2.Results range -1 ns to 105 sLSD 500 ps (53131A)/150 ps(53132A)Phase (53131A, 53132A)Measurement is specified over thefull signal range of Channels 1 and 2.Results range -180° to +360°Duty cycle (53131A, 53132A)Measurement is specified over the fullsignal range of Channel 1. However, both thepositive and negative pulse widths must begreater than 4 ns.Results range 0 to 1 (e.g. 50% duty cyclewould be displayed as .5)Rise/fall time (53131A, 53132A)Measurement is specified over the full signalranges of Channel 1. The interval between theend of one edge and start of a similar edgemust be greater than 4 ns.Edge selection Positive or negativeTrigger D efault setting is auto triggerat 10% and 90%Results range 5 ns to 105 sLSD 500 ps (53131A)/150 ps(53132A)Pulse width (53131A, 53132A)Measurement is specified over the full signalrange of Channel 1. The width of the opposingpulse must be greater than 4 ns.Pulse selection Positive or negativeTrigger D efault setting is auto triggerat 50%Results range 5 ns to 105 sLSD 500 ps (53131A)/150 ps(53132A)Totalize (53131A, 53132A)Measurement is specified over thefull signal range of Channel 1.Results range 0 to 1015Resolution ± 1 countPeak volts (53131A, 53132A, 53181A)Measurement is specified on Channels 1 and 2for dc signals; or for ac signals of frequenciesbetween 100 Hz and 30 MHz with peak-to-peakamplitude greater than 100 mV.Results range -5.1 V to +5.1 VResolution 10mVPeak volts systematic uncertaintyfor ac signals: 25 mV + 10% of Vfor dc signals: 25 mV + 2% of VUse of the input attenuator multiplies allvoltage specifications (input range, resultsrange, resolution and systematic uncertainty)by a nominal factor of 10.Gate timeAuto mode, or 1 ms to 1000 sMeasurement throughputGPIB ASCII 200 measurements/s (maximum)Measurement armingStart Free run, manual, or externalmeasurementStop Continuous, single, external,measurement or timedTime interval 100 µs to 10 s (53131A)Delayed 100 ns to 10 s (53132A)armingArming modes(Note that not all arming modes are availablefor every measurement function.)5. Available for all measurements except peak volts.External arm is referred to as external gate for somemeasurements.6. See specifications for pulse width and rise/fall timemeasurements for additional restrictions on signaltiming characteristics.Measurement SpecificationsAuto arming: Measurements are initiated immediately and acquired as fast as possible, using a minimum number of signal edges. Timed arming: The duration of the measurement is internally timed to a user-specified value (also known as the “gate time”).Digits arming: Measurements are performedto the requested resolution (number of digits) through automatic selection of the acquisition time.External arming: An edge on the external arm Input enables the start of each measurement. Auto arming, timed arming modes or another edge on the external arm input may be used to complete the measurement.Time interval delayed arming: For time intervalmeasurements, the stop trigger condition isinhibited for a user-specified time following thestart trigger. The 53132A offers advanced timeinterval arming capabilities including use of userspecified time or Channel 2 events to delay bothstart and stop triggers.Measurement limitsLimit checking: The measurement value ischecked against user-specified limits at theend of each measurement.Display modes: The measurement result maybe displayed as either the traditional numericvalue or graphically as an asterisk movingbetween two vertical bars.Out-of-limits Indications:• The limits annunciator will light on the frontpanel display.• The instrument will generate an SRQ ifenabled via GPIB.• The limits hardware signal provided via theRS-232 connector will go low for the durationof the out-of-limit condition.• If the analog display mode is enabled, theasterisk appears outside the vertical bars,which define the upper and lower limits.Input signal frequency or timeGraph 6:Trigger level timing error(Level setting error andinput hysteresis)7. Graphs 1, 2, 4 and 5 do not reflect the effects oftrigger error. To place an upper bound on the added effect of this error term, determine the frequencyerror from the appropriate graph and add a trigger error term as follows:T r i g g e r e r r o r p e r t r i g g e r p o i n tAvailable statisticsM ean, Minimum, Maximum, Standard DeviationNumber of measurements 2 to 1,000,000. Statistics may be collected on all measurements or on only those which are between the limit bands. When the limits function is used in conjunction with statistics, N (number of measurements) refers to the number of in-limit measurements. In general, measurement resolution will improve in proportion to N,up to the numerical processing limits ofthe instrument.MeasurementsStatistics may be collected for all measurementsexcept peak volts and totalize.Measurement Statistics General Information1112Ordering Information/find/countersAgilent Email Updates/find/emailupdates Get the latest information on the products and applications you select.AdvancedTCA ® Extensions for Instrumentation and Test (AXIe) is an open standard that extends the AdvancedTCA for general purpose and semiconductor test. Agilent is a founding member of the AXIe consortium.LAN eXtensions for Instruments puts the power of Ethernet and the Web inside your test systems. Agilent is a founding member of the LXI consortium.PCI eXtensions for Instrumentation (PXI) modular instrumentation delivers a rugged, PC-based high-performance measurement and automation system.Agilent Channel Partners/find/channelpartners Get the best of both worlds: Agilent’s measurement expertise and product breadth, combined with channel partner convenience.For more information on AgilentTechnologies’ products, applications or services, please contact your local Agilent office. The complete list is available at:/find/contactus Americas Canada (877) 894 4414Brazil (11) 4197 3500Mexico01800 5064 800United States(800) 829 4444Asia Pacific Australia 1 800 629 485China 800 810 0189Hong Kong 800 938 693India 1 800 112 929Japan 0120 (421) 345Korea 080 769 0800Malaysia 1 800 888 848Singapore 180****8100Taiwan 0800 047 866Other AP Countries (65) 375 8100Europe & Middle East Belgium 32 (0) 2 404 93 40Denmark 45 70 13 15 15Finland 358 (0) 10 855 2100France 0825 010 700**0.125 €/minuteGermany 49 (0) 7031 464 6333Ireland 1890 924 204Israel 972-3-9288-504/544Italy 39 02 92 60 8484Netherlands 31 (0) 20 547 2111Spain 34 (91) 631 3300Sweden 0200-88 22 55United Kingdom 44 (0) 131 452 0200For other unlisted countries:/find/contactusRevised: June 8, 2011Product specifications and descriptions in this document subject to change without notice.© Agilent Technologies, Inc. 2006, 2011Published in USA, November 8, 20115967-6039ENAgilent Advantage Services is committed to your success throughout your equip-ment’s lifetime. To keep you competitive, we continually invest in tools andprocesses that speed up calibration and repair and reduce your cost of ownership. You can also use Infoline Web Services to manage equipment and services more effectively. By sharing our measurement and service expertise, we help you create the products that change our world./quality/find/advantageservices。

NCR-66XX系列培训内容

NCR66XX（SelfServ）培训内容一、观察66系列测试机总结：观察66XX测试机，与老机型对比，变化主要为：1.所有设备均试用USB通讯，模块使用24V直流供电；2.直流电源模块使用两组开关，可单独关闭所有模块的供电但保留主机电源；3.读卡器吞卡盒变化；（可选配件）4.全新客户打印机，可支持中文打印（可选配带回收纸；双面打印；双纸卷打印的功能型号）；5.后操作屏使用全新触摸彩色后屏（GOP），使用双DVI信号同时提供显示器与后操作面板；6.保险柜与上柜内分别增加电源集线器与USB集线器；7.显示器与shutter可从前面板或侧面拆除，显示器与shutter增加保险防拆功能。

ATM两侧，上盖都可拆除，维修TCM并不需要取出维修，可在拆除上盖后直接进行维修；8.所有控制板去除NVROM，钞参存储位置发生变化，放电跳线功能失效。

9.interlock位置变化，保险柜内增加行员开关，interlock移到点钞机滑轨右侧，打开保险柜门后，点钞机仍可动作，只有拉出点钞模块时直流与交流电机才可断电。

二、培训内容：1.可用性：✓可自动检测tcm状态，可自动重启。

延长使用时间45%。

✓更小间距的打印模式，可节省30%用纸，可2种颜色打印。

✓增加（activity counters）存在各模块中的使用次数，可检查模块使用寿命，提前更换模块，提高实用性。

2.扩展性：✓两种材质的EPP。

✓更多选择配置（全新设计的读卡器吞卡盒；打印机：双面打印，回收纸，双纸卷；存款模块；支票机等等）。

3.可控性：✓更多数据可直接上传，采用flash芯片，可远程直接刷写。

✓更多的数据可供采集，每个模块都有使用寿命（次数）统计，可上传至服务器。

4.安全性：✓更换重要模块后需要对该模块进行授权才可正常使用。

✓采用USB1.1接口使用独立驱动，与USB2.0相比USB1.1更加稳定，USB1.1全速工作时可达到1.5Mb。

5.更新的配置：✓不再使用灯管照明，采用更长寿命的LED灯组照明。

STRF6628中文资料

The Series STR-F6600 is specifically designed to satisfy the require-ments for increased integration and reliability in off-line quasi-resonant flyback converters. The series incorporates a primary control and drive circuit with discrete avalanche-rated power MOSFETs.Covering the power range from below 25 watts up to 300 watts for 100/115/230 VAC inputs, and up to 150 watts for 85 to 265 VAC universal input, these devices can be used in a range of applications,from battery chargers and set top boxes, to televisions, monitors, and industrial power supply units.Cycle-by-cycle current limiting, under-voltage lockout with hyster-esis, over-voltage protection, and thermal shutdown protects the power supply during the normal overload and fault conditions. Over-voltage protection and thermal shutdown are latched after a short delay. The latch may be reset by cycling the input supply. Low-current startup and a low-power standby mode selected from the secondary circuit completes a comprehensive suite of features. The series is provided in a five-pin overmolded TO-3P style package, affording dielectric isolation without compromising thermal characteristics.FEATURESs Flyback Operation with Quasi-Resonant Soft Switching for Low Power Dissipation and EMI s Rugged Avalanche-Rated MOSFET s Choice of MOSFET Voltage and r DS(on)s Full Over-Current Protection (no blanking)s Under-Voltage Lockout with Hysteresis s Over-Voltage Protection s Direct Voltage Feedbacks Low Start-up Current (<400 µA)s Low-Frequency, Low-Power Standby Operation s Overmolded 5-Pin PackageOFF-LINE QUASI-RESONANT FLYBACK SWITCHING REGULATORSAlways order by complete part number, e.g., STR-F6652 .Data Sheet 28102.8™Series STR-F6600INTERIM DATA SHEET(Subject to change without notice)February 22, 2000TMSeries STR-F6600OFF-LINEQUASI-RESONANT FLYBACK SWITCHING REGULATORS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000™2TM Copyright © 2000 Allegro MicroSystems, Inc.FUNCTIONAL BLOCK DIAGRAMFEEDBACK &OVER-CURRENT PROTECTIONGROUNDVSOURCEDRAIN Dwg. FK-002-61.00.60.2STARTING CHANNEL TEMPERATURE in °CN O R M A L I Z E D A L L O W A B L E A V A L A N C H E E N E R G Y i n m JDwg.0.40.8Allowable package power dissipation curvesare shown on page 10.Series STR-F6600OFF-LINEQUASI-RESONANT FLYBACK SWITCHING REGULATORS3OUTPUT MAXIMUM RATINGS at T A = +25°CPart Number V DSS (V)r DS(on) (Ω)E AS (mJ)*I D (A)†I DM (A)P OUT (W)at V IN (V rms)STR-F66244500.92204161998100130120STR-F66264500.583271626145100190120STR-F66284500.356472236225100290120STR-F6632500 2.547.49.011.23610050120STR-F6652650 2.81267.9104085-26586220STR-F6653650 1.95260 5.6145885-265120220STR-F6654650 1.153999.7189285-265190220STR-F66566500.71521162515085-265300220STR-F66729007.7163 4.6 6.425 (no heatsink )22050 (with heat sink )220STR-F6674900 4.49242 6.09.22885-26576220STR-F66769002.812757.8124485-265115220* Derate per graph, page 2† Derate per graph, page 12Series STR-F6600OFF-LINEQUASI-RESONANT FLYBACK SWITCHING REGULATORS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000™4TM ELECTRICAL CHARACTERISTICS at T A = +25°C, V IN = 18 V (unless otherwise specified).LimitsCharacteristic Symbol Test Conditions Min.Typ.Max.Units On-State Voltage V INT Turn-on, increasing V IN 14.41617.6V Under-Voltage Lockout V INQ Turn-off, decreasing V IN 9.01011V Over-Voltage ThresholdV OVP(th)Turn-off, increasing V IN 20.522.524.5V Drain-Source Breakdown Voltage V BR(DSS)I D = 300 µA V DS max ––V Drain Leakage Current I DSSAt V DS max––300µA On-State Resistance r DS(ON)V S = 10 V, I D = 0.9 A, T J = +25°C ––see tableΩMaximum Off Timet off Drain waveform high 45–55µs Minimum Pulse Duration for Input of Quasi-Resonant Signals t w(th)Drain waveform high 1–– 1.0µs Minimum Off Timet off Drain waveform high 1–– 1.5µs Feedback Threshold VoltageV FDBKDrain waveform low to high 10.680.730.78V Oscillation synchronized 21.3 1.45 1.6V Over-Current Protection/Feedback Sink CurrentI OCP/FB V OCP/FB = 1.0 V1.2 1.35 1.5mA Latch Holding Current I IN(OVP)V IN reduced from 24.5 V to 8.5 V ––400µA Latch Release Voltage V IN I IN ≤ 20 µA, V IN reduced from 24.5 V 6.6–8.4V Switching Time t f V DD = 200 V, I D = 0.9 A ––250ns Supply CurrentI IN(ON)Operating 3––30mA I IN(OFF)Increasing V IN prior to oscillation ––100µA Insulation RMS VoltageV WM(RMS)All terminals simultaneous refer-2000––Vence to a metal plate against the backsideThermal Resistance R θJM Output channel to mounting frame–– 1.75°C/W Thermal ShutdownT J140––°CNotes:Typical Data is for design information only.1. Feedback is square wave, V IM =2.2 V, t h = 1 µs, t l = 35 µs.2. For quasi-resonant operation, the input signal must be longer than t w(th) and greater than V FDBK .3. Feedback is square wave, V IM = 2.2 V, t h = 4 µs, t l = 1 µs.Series STR-F6600OFF-LINEQUASI-RESONANT FLYBACK SWITCHING REGULATORS5The voltage on the V IN terminal (pin 4) controls startup and shutdown of the Series STR-F6600 devices.Figure 1 shows a typical start up circuit. The V IN terminal voltage during startup is shown in figure 2.Functional Description and Operationcontinued, next page...Figure 1 – Start-Up CircuitV 16 V (TYP.)O P E R A T I O N S T A R TUNDER-VOLTAGE LOCKOUT (V INQ )11 V (MAX.)ON-STATE VOLTAGE (V Figure 2 – Waveform of V IN Terminal Voltageat StartupI IN (MAX.)30 mA (MAX.)100 µ(MAX.)(MIN.)V Figure 3 – Supply Terminal Current, I INAt startup, C2 is charged through the startup resistor R S .When the V IN terminal voltage reaches 16 V (typ.), the control circuit enables regulator operation. Once theregulator starts, it draws up to 30 mA from C2 causing the voltage on C2 to fall momentarily. Once the regulator output voltage is established, the drive winding D starts to charge C2 via D2. The voltage on C2 thus recovers to the nominal drive voltage (18 V).As shown in figure 3, the input current is below 100 µA (at T M = 25°C) prior to control circuit turn on. The latch circuit holding current is 400 µA (max.). To ensure latch operation, the current in R S at the lowest ac input voltage should be at least 500 µA.The value of R S thus determines the charge time of C2and thus the startup delay. R S is typicaly 68 k Ω for wide operation (90 V ac to 265 V ac) and 100 k Ω for 220 volt ac operation.The choice of C2 is a compromise between an accept-able startup delay (in conjunction with R S ) and a hold-up time sufficient to keep pin 4 above its under-voltageshutdown threshold of 11 V. Typically C2 is in the range of 47 µF to 100 µF.Series STR-F6600OFF-LINEQUASI-RESONANT FLYBACK SWITCHING REGULATORS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000™6TM Functional Description and Operation (cont’d)Figure 4 – Output Current I OUT – Terminal Voltage V INFigure 5 – Soft-Start OperationThe drive winding voltage is set such that in normal operation the C2 voltage is above the specified maximum shutdown voltage (11 V) and below the specified mini-mum over-voltage threshold (20.5 V).In applications where there is a significant variation in load current, the V IN terminal voltage may vary, as shown in figure 4. This is due to peak charging of C2. In this case, adding a resistor in the range of a few ohms to tens of ohms in series with the rectifier diode D2 will bring the voltage variation within limits.Soft Start, Quasi Resonant and Voltage Regulation Refer to the Functional Block Diagram and the Typical Application Diagram (figure 6). The internal oscillator uses the charge/discharge of an internal 4700 pF capacitor (c SS ) to generate the MOSFET drive signals.The regulator has two modes of operation:1. fixed 50 µs off time (soft start) and2. demagnetization sensing quasi-resonant mode —normal operation.In both cases, voltage regulation is achieved by taking the composite optocoupled voltage error and superimposed drain current ramp (current-mode control) and comparing this to an internal 0.73 V reference. The FBK/OCPcomparator output pre-terminates the oscillator, which turns off the MOSFET drive signal.The MOSFET is turned on again when either c SSdischarges or a quasi-resonance signal is detected on pin 1.Fixed 50 µs Off-Time: Soft-Start ModeThis is the mode of operation in the absence of a quasi-resonance signal on pin 1 (see figure 5), and occurs atstartup and in overload. It also can be commanded exter-nally to provide low-power standby operation.In the absence of a feedback signal (such as at startup,or a short circuit) the drain current ramp, sensed across R5and noise filtered by R4/C5 appears on pin 1. When the ramp voltage on C5 exceeds the 0.73 V reference signal,the FBK/OCP comparator changes state, shutting down the oscillator and turning off the MOSFET. Thus the voltage on c SS is held high (6.5 V) by the comparator. When the comparator changes state, c SS discharges via r SS ; the voltage on c SS ramps down until it reaches 3.7 V. The oscillator turns on the MOSFET. This ramp-down time is internally trimmed to 50 µs. The comparator changes state again and the cycle repeats. Thus in the absence offeedback, the current-sense resistor R5 accurately controls the MOSFET maximum current.VSeries STR-F6600OFF-LINEQUASI-RESONANT FLYBACK SWITCHING REGULATORS7Functional Description and Operation (cont’d)Figure 6 – Series STR-F6600 Typical ApplicationDwg. EK-003-5A– OUTPUTSoft Start with Voltage Feedback (refer to figure 7)Output voltage control is achieved by sensing the opto-coupled feedback current (proportional to the output voltage error signal) across resistor R4 and summing this with the drain current ramp on R5. The signal on pin 1 is therefore the opposite of the output voltage error signal and the drain current ramp. The dc bias signal across R4 is thus a function of the load. Consequently at light load, the bias signal on R4 is closer to the threshold voltage of the comparator.To eliminate the possibility of false shutdown atMOSFET turn on (when there is a current spike due to the discharge of primary capacitance), a constant-current sink of 1.35 mA is turned on, effectively lowering the input impedance on pin 1, and momentarily increasing the shutdown threshold.Series STR-F6600OFF-LINEQUASI-RESONANT FLYBACK SWITCHING REGULATORS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000™8TM Functional Description and Operation (cont’d)Figure 7 - Voltage Regulation WaveformsNormal Operation (Quasi-Resonant) Mode Refer to the Functional Block Diagram, Typical Appli-cation diagram (figure 6), and Quasi-Resonance Wave-forms (figure 8).Regulation is achieved as in fixed off-time mode but instead of having a fixed off-time, the demagnetization of the transformer is sensed by a second comparator. This comparator threshold, V th(2) is nominally 1.45 V. Quasi-resonance sensing makes use of the natural magnetizing and leakage inductances and self-capacitances of the power circuit.Figure 8 shows the drain voltage waveform, (V DS ), on pin 3 of the STR-F66xx, as well as V P , the voltage on the primary of the transformer.Once the current in the output diode stops flowing, the primary stored energy ‘rings’ as shown by V P and V DS .The resonant frequency (f r ) is determined by the magne-tizing inductance of the transformer and the capacitor C4.The addition of this capacitor sets the ringing frequency and reduces the harmonic content in the V DS waveform,lowering EMI. Also since V DS falls to a minimum during the first half-cycle of the ring this point can be sensed and used to turn on the MOSFET with minimum voltage across it. Thus the MOSFET is low voltage and zero current switched (LVS/ZCS).Figure 8 – Quasi-Resonance WaveformsDwg. GK-021Series STR-F6600OFF-LINEQUASI-RESONANT FLYBACK SWITCHING REGULATORS9Functional Description and Operation (cont’d)The voltage V OCP (pin 1) has the same form as the V DS waveform. The condition for quasi-resonant operation is given by:2.0 V < V OCP > 5.5 V for >1 µsTransformer design is exactly as for any other discon-tinuous-mode type flyback.For optimum EMI/efficiency performance, quasi-resonance turn off is achieved when the MOSFET is at zero voltage and zero current; that is, at one half cycle of the quasi-resonance frequency, f r .Over-Current Protection (OCP) Functions Refer to the Functional Block diagram and Typical Application diagram (figure 6).The regulator implements pulse-by-pulse over-current protection, which limits the maximum drain current in the MOSFET on every pulse by switching off the internal drive to the MOSFET, and the MOSFET drain current is detected across R5.Drive CircuitRefer to the Functional Block Diagram.This circuit is driven from the oscillator and provides the current drive to charge and discharge the MOSFET gate-source capacitance, thereby switching the device on and off. The basic circuit configuration is totem-pole type with an additional limiting resistor in the gate circuit at turn on. This limits the turn on speed of the MOSFET,thereby reducing EMI due to the discharge of primary capacitance. This is possible because of the low-voltage switching, zero-current switching nature of the turn on.The value of the turn-off resistance is lower, allowing the device turn-off current to be increased. This reduces the turn-off loss in the MOSFET.The gate drive voltage (8.3 V) is such that even with 0.73 V across R5 (drain current sense resistor), theMOSFET is fully enhanced, allowing full use to be made of its high current handling capacity.Latch CircuitThe latch circuit keeps the oscillator output low to inhibit operation of the regulator when over-voltageprotection (OVP) and thermal shutdown (TSD) circuits are in operation. As long as the latch hold-in current is400 µA (max., supplied via R S ) with V IN at 8.5 V (pin 4),the regulator will stay in the off state.An internal noise filter provides 10 µs of noise immu-nity to prevent spurious operation of the over-voltage protection or thermal shutdown.With the latch ‘on’, the voltage on pin 4 cycles between 16 V and 10 V as shown in figure 9. This is due to the higher current drawn when the pin 4 is at 16 V compared to that drawn close to shutdown (10 V).Pulling V IN (pin 4) below 6.5 V will reset the latch circuit, re-enabling the regulator.Thermal ShutdownThis internal feature triggers the latch if the internal frame temperature exceeds 140°C (typ.).The temperature is sensed on the control IC, but also protects against overheating of the MOSFET as theMOSFET and the control IC are mounted on the same lead frame. Additionally, protection is provided for other on-board components.V IN10 V (TYP.)Figure 9 – Example of V IN Terminal VoltageWaveform at Latch Circuit OnSeries STR-F6600OFF-LINEQUASI-RESONANT FLYBACK SWITCHING REGULATORS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000™10TM Functional Description and Operation (cont’d)Over-Voltage Protection CircuitThis feature of the STR-F66xx triggers the latch circuit when the V IN voltage (pin 4) exceeds 22.5 V (typ.).Because the voltage on pin 4 is proportional to the output voltage (they are linked by the transformer turns ratio), the regulator protects the output against over-voltage. This function is entirely independant of the output-voltage regulation loop and indeed will protect against output over-voltage should the voltage error signal be lost. The measure of over-voltage is given by:V OUT(OVP) = V OUT(NOM) x V IN(OVP)/V IN(NOM)where V IN(OVP) is the drive voltage on pin 4.In an over-voltage sensitive application, the drivevoltage can be set to close to 20 V and thus will protect the output, if it rises more than 10% above nominal.V OUTFigure 10 – Power Supply OutputOverload Characteristics40202060100140TEMP. = +1250TEMPERATURE in °CA L L O W AB L E P AC K A G E P O W E RD I S S I P A T I O Ni n W A T T SDwg. GK-04020TEMP. = +1250TEMPERATURE in °CA L L O W AB L E P AC K A G E P O W E RD I S S I P A T I O N i n W A T T SDwg. GK-0ALLOWABLE PACKAGE POWER DISSIPATIONSWITCHING REGULATORSMOSFET Safe Operating Areas (single pulse at T A = +25°C)DRAIN-SOURCE VOLTAGE in VOLTS D R A I N C U R R E N T i n A M P E R E SDwg. GKDRAIN-SOURCE VOLTAGE in VOLTSD R A I N C U R RE N T i n A M P E R E SDwg. GKDRAIN-SOURCE VOLTAGE in VOLTS D R A I N C U R R E N T i n A M P E R E SDwg. GKDRAIN-SOURCE VOLTAGE in VOLTSD R A I N C U R RE N T i n A M P E R E SDwg. GKSTR-F6652STR-F6653STR-F6654STR-F6656SWITCHING REGULATORSMOSFET Safe Operating Areas (cont)(single pulse at T A = +25°C)DRAIN-SOURCE VOLTAGE in VOLTS D R A I N C U R R E N T i n A M P E R E SDwg. GKDRAIN-SOURCE VOLTAGE in VOLTSD R A I N C U R RE N T i n A M P E R E SDwg. GKSTR-F6672STR-F66761.00.60.2FRAME TEMPERATURE in °CN O R M A L I Z E D S A F E O P E R A T I N G A R E ADwg. G0.40.80S.O.A. DeratingDrain Switching Current (I ) Derating20124.0SOURCE-TO-GROUND VOLTAGE (V 2-V 5) in VOLTSM A X I M U M S W I T C H I N G C U R R E N T (I D ) i n A M P E R E SDwg8.016SWITCHING REGULATORS100.10.001POWER PULSE DURATION in SECONDST H E R M A L I M P E D A N C E (Z θJ C ) i n °C /W0.011.00.0001100.1POWER PULSE DURATION in SECONDST H E R M A L I M P E D A N C E (Z θJ C ) i n °C /W1.0Transient Thermal ImpedanceSWITCHING REGULATORSCapacitorsElectrolytic capacitors carrying large switching fre-quency ripple currents (C1 and the output capacitors) should be capable of handling the high rms currents involved. Capacitors with low ESR are suitable. The quasi-resonance capacitor C4 should be a high-voltage ceramic type suitable for pulsed current operation.The safety critical nature of the off-line application must be considered when selecting both X and Y capaci-tors for common- and differential-mode noise filtering. Use of the low-noise quasi-resonant Series STR-F6600 will allow optimization of these capacitor values.C5, the 470 pF filtering capacitor should be a 50 V temperature-stable (COG) ceramic type.ResistorsResistor R5 carries high-frequency current, and so a low internal inductance type of 1 W rating should be used.Resistor R9 (RS) should be 2 W metal oxide.All other resistors can be 1/4 watt or 1/2 watt metal film.DiodesDiodes carrying the high-frequency flyback currents (such as the transformer rectifier diodes) should have a fast or ultrafast reverse-recovery characteristic, adequate current handing and peak reverse-voltage rating. Allegro/ Sanken supplies a range of suitable diodes, and these are described in the Allegro/Sanken short-form catalogue (AMS-127) or latest issue of Bulletin D01EC0. OptocouplerBoth Toshiba TLP 621 and Siemens SFH 610A2 or 615A2 are suitable. A current-transfer ratio of 50% to 200% is acceptable.Error AmplifierA standard TL431 transconductance amplifier or an Allegro/Sanken Series SE error-amplifier IC can be used. The Series SE is particularly well-suited to high-voltage (70 V to 140 V) power outputs.If a Series SE error-amplifier IC is used, normally phase compensation is not required. Should additional high-frequency attenuation be required, a capacitor (0.022 µF or less) can be connected across the primary side (collector-emitter) of the optocoupler, a diode to maintain quasi-resonant operation should be added in series with the phototransistor emitter.Applications InformationThe products described here are manufactured in Japan by SankenElectric Co., Ltd. for sale by Allegro MicroSystems, Inc.Sanken Electric Co., Ltd. and Allegro MicroSystems, Inc. reserve the right to make, from time to time, such departures from the detailspecifications as may be required to permit improvements in theperformance, reliability, or manufacturability of their products.Therefore, the user is cautioned to verify that the information in thispublication is current before placing any order.These products are not authorized for use as critical components in life-support appliances, devices, or systems without express writtenapproval.The information included herein is believed to be accurate andreliable. However, Sanken Electric Co., Ltd. and AllegroMicroSystems, Inc. assume no responsibility for its use; nor for anyinfringements of patents or other rights of third parties which mayresult from its use.SWITCHING REGULATORSDimensions in Inches(for reference only)Dwg. MK-003-50 inAT ROOT0.0080.132±0.0040.136±0.004Recommended mounting hardware torque: 4.34 – 5.79 lbf •ft.Recommended silicone grease: Dow Corning SC102, Toshiba YG6260, Shin-Etsu G746., or equivalentSWITCHING REGULATORSDimensions in Millimeters(controlling dimensions)Dwg. MK-003-50 mm3.35±0.13.45±0.1Recommended mounting hardware torque: 6 – 8 kg •cm or 0.588 – 0.784 Nm.Recommended silicone grease: Dow Corning SC102, Toshiba YG6260, Shin-Etsu G746., or equivalent。

LGT8F88A产品概要 v1.1.0

模块功能
调试模块，同时实现在线调试与 ISP 功能 8bit 高性能 RISC 内核时钟管理模块，产生系统需要的各种工作时钟功耗管理模块，负责管理系统工作状态之间的转换复位产生模块上电复位模块与低电压检测电路 8 通道 10 位模数转换器温度传感器模拟比较器 ADC/触摸按键输入通道 80mA 驱动能力的 NMOS I/O，可直接驱动共阴极 LED 可编程数字 I/O 看门狗复位模块
Hale Waihona Puke 系统框架32K RC
OSC
32M RC
VCC
POR
GND
LVD
ADC
Touch Key
NMOS I/O
80mA
AIO NIO
Digital I/O
PIO
LGT8F88A Diagram
CMU PMU RMU
I/O MUX
SWD LGT8XM
FLASH 4kx16
ADC Thermal Sensor
AC
PCINT21/OC0B/T1/PD5 PCINT22/OC0A/AIN0/KEY0/PD6
PCINT23/AIN1/TK1/PD7 PCINT0/CLKO/ICP1/TK2/PB0
PCINT1/OC1A/PB1 PCINT2/SPSS/OC1B/PB2 PCINT3/OC2A/MOSI/TK3/PB3 PCINT4/MISO/TK4/PB4
PCINT14/RSTN/PC6 PCINT16/RXD/PD0 PCINT17/TXD/PD1 PCINT18/INT0/PD2 PCINT19/OC2B/INT1/PD3 PCINT20/XCK/T0/PD4
VCC GND PCINT6/OSC1/PB6 PCINT7/OSC2/PB7 PCINT21/OC0B/T1/PD5 PCINT22/OC0A/AIN0/TK0/PD6 PCINT23/AIN1/TK1/PD7 PCINT0/CLKO/ICP1/TK2/PB0

i.MX 6系列处理器SABRE板的产品介绍说明书

MCIMX6SX-SDB MCIMX6SX-SDBi.MX Applications ProcessorsSABRE Board for Smart Devices Based on the i.MX 6 Series OverviewThe Smart Application Blueprint for Rapid Engineering (SABRE) board for smart devices was created to simplify product design by offering a feature-rich development platform that allows developers to work with the majority of the i.MX 6 series processor’s primary features. It provides a basic product design and serves as an example for how to layout complex, high-speed interfaces such as DDR. The SABRE board for smart devices includes complete hardware design files and board support packages (BSP) for Android™, Linux® and MQX™ (for Cortex-M4 on i.MX 6SoloX applications processors).SABRE boards enable designers to quickly get started with i.MX 6 series processors. The MCIMX6Q-SDB enables development on i.MX 6Quad and i.MX 6Dual processors, and the MCIMX6SX-SDB on i.MX 6SoloX processors. There are a number of accessory boards that work with the SABRE-SDB to provide additional capabilities such as multi-touch display and Wi-Fi connectivity. Refer to /SABRESDB for more information.SABRE Board for Smart Devices System Contents• i.MX 6Quad or 6SoloX processor-based system• Power supply• Quick start guide• Bootable SD cardFigure 1: MCIMX6Q-SDBMCIMX6Q-SDB FeaturesProcessor• Freescale i.MX 6Quad 1 GHz processor based on the ARM® Cortex®-A9 core Development for• i.MX 6Quad and i.MX 6DualMemory/storage • 1 GB DDR3 SDRAM up to 533 MHz (1066 MTPS) memory • 8 GB eMMC flashDisplay • 2x LVDS connectors• HDMI connector• LCD expansion connector (parallel, 24-bit)User interface• Power, reset, volume buttons Power management• Freescale MMPF0100Audio • Wolfson audio codec• Microphone and headphone jacksExpansion connector • Camera MIPI CSI port • I2C, SSI, SPI signalsConnectivity • Full-size SD/MMC card slots (2x)• 7-pin SATA data connector• 10/100/1000 Ethernet port• 1x USB 2.0 OTG port (micro USB)Debug • JTAG connector (20-pin)• 1x Serial-to-USB connector (for JTAG)OS support • Linux® and Android™ (Freescale)• Others supported via third party (QNX, WindowsCE)Tools support • Manufacturing tool (Freescale)• Processor Expert IOMUX tool (Freescale)Additional features • 3-axis Freescale accelerator • USB plug power supplyFor additional information, please visit /iMXSABRE Join fellow i.MX developers online at —an active community of open source developers.Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. ARM is a registered trademark of ARM Limited. ARM Cortex-A9 and Cortex-M4 are trademarks ARM Limited. © 2012, 2015 Freescale Semiconductor, Inc.Document Number: IMX6SABRESDBFS REV 1Figure 2: MCIMX6SX-SDB MCIMX6SX-SDB FeaturesProcessor• Freescale i.MX 6SoloX 1 GHz processor based on the ARM ® Cortex ®-A9 core and 200 MHz Cortex-M4 core Development for• i.MX 6SoloX Memory/storage• 1 GB DDR3L SDRAM up to 400 MHz • 32 MB x2 QSPI NOR flash Display• LVDS connector • LCD expansion connector (parallel, 24-bit)User interface• Buttons: power (sw3), reset (sw2), function1, function2• Switch: power Power management• Freescale MMPF0200 Audio• Wolfson audio codec • Microphone and headphone jacks • Board-mounted microphone Expansion connector • Parallel camera MIPI CSI port• I 2C and signalsConnectivity•Full-size SD/MMC card slots (3x)•Two gigabit Ethernet connectors •1x USB 2.0 OTG port (micro USB)•mPCIe connector •12-bit ADC connector • 2x CAN (DB-9) using Freescale MC34901 CAN transceiver Debug• JTAG connector (20-pin)• 1x Serial-to-USB connector (for JTAG) OS support• Linux ® and Android™ (Freescale), MQX (Freescale) for Cortex-M4• Others supported via third party (QNX, WindowsCE)Tools support• Manufacturing tool (Freescale)• Processor Expert IOMUX tool (Freescale)Additional features • Freescale MMA8451 three-axis digital accelerometer • Freescale MAG3110 three-axis digital magnetometer• Ambient light sensorSoftware and ToolsThe SABRE board comes with an SD card pre-installed with the Android operating system (MCIMX6Q-SDB) or the Linux operarting system (MCIMX6SX-SDB). Additional software is available from Freescale and third parties. In addition to optimized BSPs, Freescale also provides a large portfolio of optimized video, speech and audio codecs. More information is available at /SABRESDB .MCIMX6SX-SDB MCIMX6SX-SDB。

HX8660-A datasheet_v01_new form__060526

( DOC No. HX8660-A-DS )HX8660-A240 Channel TFT Gate Driver Version 01 March, 20061. General DescriptionThe HX8660-A is a 240 channel outputs gate driver used for driving the gate electrode of TFT LCD panel. It is designed for 2-level output with maximum +40V output driving voltage. This device is applicable for a wide range of panel resolution including VGA and UXGA.2. Features2-level output gate driver for TFT LCD panel 240 channel outputs + 2 pins fixed to VEE Maximum +40V output driving voltage Bi-directional data shift capability 200KHz maximum operation frequency 2.7V to 5.5V power supply voltage range High voltage CMOS process technology COG package Possible applications:Panel type Resolution Piece per panelVGA 640 × 480 2 UXGA 1600 × 1200 5 1920 × 1440 6HX8660-A240 Channel TFT Gate DriverVersion 01March, 20063. Block DiagramLevel Shifter240 bits bi-directional shiftregister/XAOOESTV1CPV L/RSTV2VGH VEEVDD VSSOUT0OUT2414. Pin DescriptionPin name I/OFunctionDescriptionCPV In Shift clock inputThis is the clock input for chip internal shift register. Datais shifted at each rising edge of this clock.L/R InShift direction control pin This pin controls the output shifting direction as listedbelow.L/R = H,STV1 OUT1 OUT2 • • • OUT240 STV2L/R = L,STV1 OUT1 OUT2 • • • OUT240 STV2STV1 STV2 I/OStart pulseinput/output pinThese two pins are the device start pulse input or output pin. The function of these two pins depends on the status of L/R pin. STV1 STV2 L/R =H input outputL/R =L outputinput OE InOutput enable control This pin is used to control the channel output. When OEinput is high, driver output is fixed to VEE levelregardless CPV. However, the internal shift register isnot cleared even if OE input is inactive./XAO In Output all high When /XAO input pin is L, all the output pins are forced to VGH level. Note that this pin has higher priority thanOE. Also it has an internal pull high resistor, keep it toVDD is preferred when unused. The chip internal shift register is not cleared when /XAO input is active.OUT1 ~ OUT240 Out Driver output pins for driving gate electrode of LCD The output voltage is either VGH or VEE for driving thegate electrode of TFT LCD panel depending on the datastored in shift register and the state of OE. OUT0, OUT241 Out Auxiliary pinsLCD panel auxiliary pins, these pins always output VEElevel. VGH In Power supply Power supply for LCM drive output High. VDD In Power supply Digital power. VSS In Power supply Digital ground. VEE In Power supply LCD driver negative power supply. PATH In Internal link Linked together internal.5. Function Description5.1 Device operationIn the condition of L/R=H, the STV1 start pulse input is sensed at the rising edge of CPV and stored in the first stage of shift register, which causes the first scan signal is outputted from the OUT1 output pin. While stored data is transferred to the next stage shift register at the rising edge of next CPV, new data of STV1 is sensed and stored simultaneously.The output pin (OUT1 to OUT240) supplies VGH voltage or VEE voltage to the LCD panel depending on the data stored in the shift register. For normal operation, a VGH voltage is outputted one by one from OUT1 to OUT240 in sync with CPV pulse.After 240 CPV rising edge are past, the STV2 goes up to high level at the 240th falling edge of CPV and goes down to low level at the 241st falling edge of CPV. This STV2 output signal becomes the STV1 start pulse input of next cascaded gate driver device.During any H state of OE, the corresponding output channels are forced to VEE level regardless of CPV. The channel output returns to normal status as soon as OE go back to L.During any L state of /XAO, all the output channels are forced to VGH regardless of CPV and OE. The channel output returns to normal status as soon as /XAO goes back to H.Example of input/output timing (L/R=H)1 2 3 4 567239240241 242CPVSTV1OE/XAOOUT1OUT2OUT3OUT4OUT5OUT6OUT240STV25.2 Relationship among L/R, and STV1/STV2Start pulseL/RInput OutputData transfer direction H STV1 STV2OUT1→OUT2→OUT3→ •••→OUT240 L STV2 STV1OUT240→OUT239→OUT238→ •••→OUT15.3 Device power supplyThe HX8660-A must be used by the following conditions. VGH - VEE = 40V (max.)Example:The input signal level of CPV, L/R, OE, STV1, /XAO and STV2 have to swing between VDD and VSS. The signal output level of start pulse (STV1 or STV2) to the next stage cascaded device is VDD for H and VSS for L.5.4 Power ON/OFF sequenceTo prevent the device damage from latch up, the power ON/OFF sequence shown below must be followed.When power on: VDD →VEE →VGH When power off: VGH →VEE →VDDVGH Logic inputVDD VSS VEE VGH VDD VSS VEEOut1 to Out2406. DC Characteristics6.1 Absolute Maximum Rating (VSS=0V)Parameter Symbol Rating UnitPower supply voltage (1) VDD -0.3 to +7.0 VPower supply voltage (2) VGH -0.3 to +32.0 VPower supply voltage (3) VEE -22.0 to +0.3 VPower supply voltage (4) VGH-VEE -0.3 to +45.0 VVVDD+0.3Input voltage V IN -0.3to+90℃toOperation temperature T OPR -40to+125 ℃Storage temperature T STG -55Note:(1) All of the voltages listed above are with respective to VSS=0V.(2) Device is subject to be damaged permanently if stresses beyond those absolute maximum ratings listed above.6.2 Recommended Operating Conditions (VSS=0V)RatingParameter Symbol Min. Typ. Max. UnitPower supply voltage (1) VDD 2.7 3.3 5.5 VPower supply voltage (2) VGH 7 - VEE+40 VPower supply voltage (3) VEE -20 - -5 VPower supply voltage (4) VGH-VEE 12 - 40 VPower supply voltage (5) VDD-VEE 6 - - VKHz200Operation frequency F CPV --Operation temperature Ta -40 - +90 ℃6.3 DC Electrical Characteristics (VSS=0V)Rating Parameter Symbol ConditionMin. Typ. Max.UnitApplicationpin Input H voltage V IH - 0.7VDD - VDD All inputInput L voltage V IL - VSS - 0.3VDD All inputOutput H voltage V OH I OH =200µA VDD-0.3- VDD STV1,2 Output L voltage V OL I OL =200µA VSS - VSS+0.3 V STV1,2 Output H resistance R OH V OUT = VGH-0.5V - - 1000 ΩOUT1 ~OUT240 Output L resistance R OLV OUT = VEE+0.5V - - 1000 ΩOUT1 ~OUT240 Input leakage current I IN - -1.0 - +1.0 µA Note (2) Pull high resistance R PU - 30 - 200 k Ω /XAO VGH Power consumption I VGH -- 100 - VEE Power consumption I VEE - - -100 - VDD Power consumptionI VDDNote (1) - - 50µA -Note:(1)Power consumption with the following condition:Output no load, VGH=20V, VEE=-10V, VDD=3.3V, F CPV =20KHz, OE =V IL . (2)All input except /XAO7. AC CharacteristicsSpecParameterSymbolConditionMin. Typ. Max.UnitCPV period t CPV - 5 - - CPV pulse width t CPVH , t CPVL 50% duty cycle 2.5 - - OE pulse width t WOE - 1 - - Data setup time t SU - 0.2 - -Data hold time t HD - 0.3 - -CPV to output delay time t PD1 CL =220pF - - 0.9 Start pulse output delay time t PD2 CL =20pF - - 0.5 OE to output delay time t PD3 CL =220pF - - 0.8 /XAO to output delay time t PD4 CL =220pF - - 10µs Note:(1)Test condition: Ta=25,℃ VGH=25V, VEE=-15V, VDD=3.3V8. WaveformCPV STV1 OUT1 OUT2 ~ OUT240 50%t CPVHt CPVL50%t SUt HD50%t PD1t PD150%t PD1t PD1CPV STV2 50%50%OUT240 50%t PD2t PD2OUT1 ~ OUT240 OE 50%t PD3t PD350%t WOEOUT1 ~ OUT240 /XAO 50%t PD4t PD450%t CPV9. Pad Coordinate9.1 HX8660-A 240 channels Gate Driver Bump LocationY X(0,0)U M M YO U T 2O U T 1O U T 0OE L/R CPV PATH STV2VGH VEE VDD VSS DUMMY247248267268X A O246245X A ODUMMYU M M Y U T 241U T 240U T 239412413392393X A O415414X A OOE L/R CPV PATHSTV1VGH VEE VDD VSS DUMMYDUMMY 1234269391DUMMY244243242241View from bump sideChip size: 8402µm x 900µm (scribe line included) Bump height: within lot 15µm + 3µmBump height deviation: within wafer <4um Bump height deviation: within chip <2umBump height roughness deviation: within bump <2um (include Rim) Bump hardness: 60Hv + 15Hv Scribe line width: 100µm9.2 Bump Outline DimensionsYX(0,0)m4m5m3244 x m3 x m4A2A3A1C1m124 x m1 x m2B1m3m6123 x m3 x m6Symbol Dimensions in µm A1 72 A2 60 A3 30 B1 60 C1 70.5 m1 50 m2 45 m3 30 m4 70 m5 95 m6 909.3 BUMP SIZETop Bump56um 80um 40um 16um60um30um70um25umAu BumpMetal PadPassivation OpeningBottom Bump80um 100um 55um 20um60um30um90umSide Bump45um 55um 70.5um35um 38um 50um72um9.4 Alignment Mark30um30um30um30um30um30um30um30um30um15um 30um30um[ Left side][ Right side]30um9.5 Bump center coordinate(Unit: µm)No. Name X Y Bump size X Y Bump size 1DUMMY367534030x7051OUT49214524530x702 OUT0 3615 340 30x7052OUT502115340 30x703 OUT1 3585 245 30x7053OUT512085245 30x704 OUT2 3555 340 30x7054OUT522055340 30x705 OUT3 3525 245 30x7055OUT532025245 30x706 OUT4 3495 340 30x7056OUT541995340 30x707 OUT5 3465 245 30x7057OUT551965245 30x708 OUT6 3435 340 30x7058OUT561935340 30x709 OUT7 3405 245 30x7059OUT571905245 30x7010 OUT8 3375 340 30x7060OUT581875340 30x7011 OUT9 3345 245 30x7061OUT591845245 30x7012 OUT10 3315 340 30x7062OUT601815340 30x7013 OUT11 3285 245 30x7063OUT611785245 30x7014 OUT12 3255 340 30x7064OUT621755340 30x7015 OUT13 3225 245 30x7065OUT631725245 30x7016 OUT14 3195 340 30x7066OUT641695340 30x7017 OUT15 3165 245 30x7067OUT651665245 30x7018 OUT16 3135 340 30x7068OUT661635340 30x7019 OUT17 3105 245 30x7069OUT671605245 30x7020 OUT18 3075 340 30x7070OUT681575340 30x7021 OUT19 3045 245 30x7071OUT691545245 30x7022 OUT20 3015 340 30x7072OUT701515340 30x7023 OUT21 2985 245 30x7073OUT711485245 30x7024 OUT22 2955 340 30x7074OUT721455340 30x7025 OUT23 2925 245 30x7075OUT731425245 30x7026 OUT24 2895 340 30x7076OUT741395340 30x7027 OUT25 2865 245 30x7077OUT751365245 30x7028 OUT26 2835 340 30x7078OUT761335340 30x7029 OUT27 2805 245 30x7079OUT771305245 30x7030 OUT28 2775 340 30x7080OUT781275340 30x7031 OUT29 2745 245 30x7081OUT791245245 30x7032 OUT30 2715 340 30x7082OUT801215340 30x7033 OUT31 2685 245 30x7083OUT811185245 30x7034 OUT32 2655 340 30x7084OUT821155340 30x7035 OUT33 2625 245 30x7085OUT831125245 30x7036 OUT34 2595 340 30x7086OUT841095340 30x7037 OUT35 2565 245 30x7087OUT851065245 30x7038 OUT36 2535 340 30x7088OUT861035340 30x7039 OUT37 2505 245 30x70 89OUT87 1005 245 30x7040 OUT38 2475 340 30x7090OUT88975340 30x7041 OUT39 2445 245 30x7091OUT89945245 30x7042 OUT40 2415 340 30x7092OUT90915340 30x7043 OUT41 2385 245 30x7093OUT91885245 30x7044 OUT42 2355 340 30x7094OUT92855340 30x7045 OUT43 2325 245 30x7095OUT93825245 30x7046 OUT44 2295 340 30x7096OUT94795340 30x7047 OUT45 2265 245 30x7097OUT95765245 30x7048 OUT46 2235 340 30x7098OUT96735340 30x7049 OUT47 2205 245 30x7099OUT97705245 30x7050 OUT48 2175 340 30x70100OUT98675340 30x70No. Name X Y Bump size X Y Bump size 101OUT9964524530x70151OUT149-85524530x70 102 OUT100 615 340 30x70152OUT150-885340 30x70 103 OUT101 585 245 30x70153OUT151-915245 30x70 104 OUT102 555 340 30x70154OUT152-945340 30x70 105 OUT103 525 245 30x70155OUT153-975245 30x70 106 OUT104 495 340 30x70156OUT154-1005 340 30x70 107 OUT105 465 245 30x70157OUT155-1035 245 30x70 108 OUT106 435 340 30x70158OUT156-1065 340 30x70 109 OUT107 405 245 30x70159OUT157-1095 245 30x70 110 OUT108 375 340 30x70160OUT158-1125 340 30x70 111 OUT109 345 245 30x70161OUT159-1155 245 30x70 112 OUT110 315 340 30x70162OUT160-1185 340 30x70 113 OUT111 285 245 30x70163OUT161-1215 245 30x70 114 OUT112 255 340 30x70164OUT162-1245 340 30x70 115 OUT113 225 245 30x70165OUT163-1275 245 30x70 116 OUT114 195 340 30x70166OUT164-1305 340 30x70 117 OUT115 165 245 30x70167OUT165-1335 245 30x70 118 OUT116 135 340 30x70168OUT166-1365 340 30x70 119 OUT117 105 245 30x70169OUT167-1395 245 30x70 120 OUT118 75 340 30x70170OUT168-1425 340 30x70 121 OUT119 45 245 30x70171OUT169-1455 245 30x70 122 OUT120 15 340 30x70172OUT170-1485 340 30x70 123 OUT121 -15 245 30x70173OUT171-1515 245 30x70 124 OUT122 -45 340 30x70174OUT172-1545 340 30x70 125 OUT123 -75 245 30x70175OUT173-1575 245 30x70 126 OUT124 -105 340 30x70176OUT174-1605 340 30x70 127 OUT125 -135 245 30x70177OUT175-1635 245 30x70 128 OUT126 -165 340 30x70178OUT176-1665 340 30x70 129 OUT127 -195 245 30x70179OUT177-1695 245 30x70 130 OUT128 -225 340 30x70180OUT178-1725 340 30x70 131 OUT129 -255 245 30x70181OUT179-1755 245 30x70 132 OUT130 -285 340 30x70182OUT180-1785 340 30x70 133 OUT131 -315 245 30x70183OUT181-1815 245 30x70 134 OUT132 -345 340 30x70184OUT182-1845 340 30x70 135 OUT133 -375 245 30x70185OUT183-1875 245 30x70 136 OUT134 -405 340 30x70186OUT184-1905 340 30x70 137 OUT135 -435 245 30x70187OUT185-1935 245 30x70 138 OUT136 -465 340 30x70188OUT186-1965 340 30x70 139 OUT137 -495 245 30x70189OUT187-1995 245 30x70 140 OUT138 -525 340 30x70190OUT188-2025 340 30x70 141 OUT139 -555 245 30x70191OUT189-2055 245 30x70 142 OUT140 -585 340 30x70192OUT190-2085 340 30x70 143 OUT141 -615 245 30x70193OUT191-2115 245 30x70 144 OUT142 -645 340 30x70194OUT192-2145 340 30x70 145 OUT143 -675 245 30x70195OUT193-2175 245 30x70 146 OUT144 -705 340 30x70196OUT194-2205 340 30x70 147 OUT145 -735 245 30x70197OUT195-2235 245 30x70 148 OUT146 -765 340 30x70198OUT196-2265 340 30x70 149 OUT147 -795 245 30x70199OUT197-2295 245 30x70 150 OUT148 -825 340 30x70200OUT198-2325 340 30x70No. Name X Y Bump size X Y Bump size 201OUT199-235524530x70251L/R-4100211.550x45202 OUT200 -2385340 30x70 252L/R -4028 211.5 50x45 203 OUT201 -2415245 30x70253CPV-4100 141 50x45204 OUT202 -2445340 30x70254CPV-4028 141 50x45205 OUT203 -2475245 30x70255PATH-4100 70.5 50x45206 OUT204 -2505340 30x70256PATH-4028 70.5 50x45207 OUT205 -2535245 30x70257STV2-4100 0 50x45208 OUT206 -2565340 30x70258STV2-4028 0 50x45209 OUT207 -2595245 30x70259VGH-4100 -70.5 50x45210 OUT208 -2625340 30x70260VGH-4028 -70.5 50x45211 OUT209 -2655245 30x70261VEE-4100 -141 50x45212 OUT210 -2685340 30x70262VEE-4028 -141 50x45213 OUT211 -2715245 30x70263VDD-4100 -211.5 50x45214 OUT212 -2745340 30x70264VDD-4028 -211.5 50x45215 OUT213 -2775245 30x70265VSS-4100 -282 50x45216 OUT214 -2805340 30x70266VSS-4028 -282 50x45217 OUT215 -2835245 30x70267DUMMY-4100 -352.5 50x45218 OUT216 -2865340 30x70268DUMMY-4028 -352.5 50x45219 OUT217 -2895245 30x70269DUMMY-3645 -330 30x90220 OUT218 -2925340 30x70270DUMMY-3585 -330 30x90221 OUT219 -2955245 30x70271DUMMY-3525 -330 30x90222 OUT220 -2985340 30x70272DUMMY-3465 -330 30x90223 OUT221 -3015245 30x70273DUMMY-3405 -330 30x90224 OUT222 -3045340 30x70274DUMMY-3345 -330 30x90225 OUT223 -3075245 30x70275DUMMY-3285 -330 30x90226 OUT224 -3105340 30x70276DUMMY-3225 -330 30x90227 OUT225 -3135245 30x70277DUMMY-3165 -330 30x90228 OUT226 -3165340 30x70278DUMMY-3105 -330 30x90229 OUT227 -3195245 30x70279DUMMY-3045 -330 30x90230 OUT228 -3225340 30x70280DUMMY-2985 -330 30x90231 OUT229 -3255245 30x70281DUMMY-2925 -330 30x90232 OUT230 -3285340 30x70282DUMMY-2865 -330 30x90233 OUT231 -3315245 30x70283DUMMY-2805 -330 30x90234 OUT232 -3345340 30x70284DUMMY-2745 -330 30x90235 OUT233 -3375245 30x70285DUMMY-2685 -330 30x90236 OUT234 -3405340 30x70286DUMMY-2625 -330 30x90237 OUT235 -3435245 30x70287DUMMY-2565 -330 30x90238 OUT236 -3465340 30x70288DUMMY-2505 -330 30x90239 OUT237 -3495245 30x70289DUMMY-2445 -330 30x90240 OUT238 -3525340 30x70290DUMMY-2385 -330 30x90241 OUT239 -3555245 30x70291DUMMY-2325 -330 30x90242 OUT240 -3585340 30x70292DUMMY-2265 -330 30x90243 OUT241 -3615245 30x70293DUMMY-2205 -330 30x90244 DUMMY -3645340 30x70294DUMMY-2145 -330 30x90245 /XAO -3946352.5 50x45295DUMMY-2085 -330 30x90246 /XAO -3874352.5 50x45296DUMMY-2025 -330 30x90247 DUMMY -4100352.5 50x45297DUMMY-1965 -330 30x90248 DUMMY -4028352.5 50x45298DUMMY-1905 -330 30x90249 OE -4100282 50x45299DUMMY-1845 -330 30x90250 OE -4028282 50x45300DUMMY-1785 -330 30x90No. Name X Y Bump size X Y Bump size 301DUMMY-1725-33030x90351DUMMY1275-33030x90 302 DUMMY -1665-330 30x90352DUMMY1335-330 30x90 303 DUMMY -1605-330 30x90353DUMMY1395-330 30x90 304 DUMMY -1545-330 30x90354DUMMY1455-330 30x90 305 DUMMY -1485-330 30x90355DUMMY1515-330 30x90 306 DUMMY -1425-330 30x90356DUMMY1575-330 30x90 307 DUMMY -1365-330 30x90357DUMMY1635-330 30x90 308 DUMMY -1305-330 30x90358DUMMY1695-330 30x90 309 DUMMY -1245-330 30x90359DUMMY1755-330 30x90 310 DUMMY -1185-330 30x90360DUMMY1815-330 30x90 311 DUMMY -1125-330 30x90361DUMMY1875-330 30x90 312 DUMMY -1065-330 30x90362DUMMY1935-330 30x90 313 DUMMY -1005-330 30x90363DUMMY1995-330 30x90 314 DUMMY -945 -330 30x90364DUMMY2055-330 30x90 315 DUMMY -885 -330 30x90365DUMMY2115-330 30x90 316 DUMMY -825 -330 30x90366DUMMY2175-330 30x90 317 DUMMY -765 -330 30x90367DUMMY2235-330 30x90 318 DUMMY -705 -330 30x90368DUMMY2295-330 30x90 319 DUMMY -645 -330 30x90369DUMMY2355-330 30x90 320 DUMMY -585 -330 30x90370DUMMY2415-330 30x90 321 DUMMY -525 -330 30x90371DUMMY2475-330 30x90 322 DUMMY -465 -330 30x90372DUMMY2535-330 30x90 323 DUMMY -405 -330 30x90373DUMMY2595-330 30x90 324 DUMMY -345 -330 30x90374DUMMY2655-330 30x90 325 DUMMY -285 -330 30x90375DUMMY2715-330 30x90 326 DUMMY -225 -330 30x90376DUMMY2775-330 30x90 327 DUMMY -165 -330 30x90377DUMMY2835-330 30x90 328 DUMMY -105 -330 30x90378DUMMY2895-330 30x90 329 DUMMY -45 -330 30x90379DUMMY2955-330 30x90 330 DUMMY 15 -330 30x90380DUMMY3015-330 30x90 331 DUMMY 75 -330 30x90381DUMMY3075-330 30x90 332 DUMMY 135 -330 30x90382DUMMY3135-330 30x90 333 DUMMY 195 -330 30x90383DUMMY3195-330 30x90 334 DUMMY 255 -330 30x90384DUMMY3255-330 30x90 335 DUMMY 315 -330 30x90385DUMMY3315-330 30x90 336 DUMMY 375 -330 30x90386DUMMY3375-330 30x90 337 DUMMY 435 -330 30x90387DUMMY3435-330 30x90 338 DUMMY 495 -330 30x90388DUMMY3495-330 30x90 339 DUMMY 555 -330 30x90389DUMMY3555-330 30x90 340 DUMMY 615 -330 30x90390DUMMY3615-330 30x90 341 DUMMY 675 -330 30x90391DUMMY3675-330 30x90 342 DUMMY 735 -330 30x90392DUMMY4028-352.5 50x45 343 DUMMY 795 -330 30x90393DUMMY4100-352.5 50x45 344 DUMMY 855 -330 30x90394VSS4028-282 50x45 345 DUMMY 915 -330 30x90395VSS4100-282 50x45 346 DUMMY 975 -330 30x90396VDD4028-211.5 50x45 347 DUMMY 1035 -330 30x90397VDD4100-211.5 50x45 348 DUMMY 1095 -330 30x90398VEE4028-141 50x45 349 DUMMY 1155 -330 30x90399VEE4100-141 50x45 350 DUMMY 1215 -330 30x90400VGH4028-70.5 50x45No. Name X Y Bump size401VGH4100-70.550x45402 STV1 4028 0 50x45403 STV1 4100 0 50x45404 PATH 4028 70.5 50x45405 PATH 4100 70.5 50x45406 CPV 4028 141 50x45407 CPV 4100 141 50x45408 L/R 4028 211.5 50x45409 L/R 4100 211.5 50x45410 OE 4028 282 50x45411 OE 4100 282 50x45412 DUMM4028 352.5 50x45413 DUMM4100 352.5 50x45414 /XAO 3874 352.5 50x45415 /XAO 3946 352.5 50x459.6 Alignment Mark center coordinateName X YL_AMK -3775 -321 R_AMK 3775 -32110. Ordering InformationPart NO. PackageHX8660-A PDxxx PD : mean COGxxx : mean chip thickness (µm) , (default 400 µm)11. Revision HistoryVersion EFF.DATE DESCRIPTION OF CHANGES2005/11/30 New setup2005/12/21 1. Revise chip size in page92. Revise alignment mark in page113. Revise 9.5 Bump center coordinate4. Revise9.6 Alignment Mark center coordinate2006/3/07 1. Revise dummy pad bump in page9.012006/5/26 1. Revise operation temperature to -40 ~ 90℃in page6。

Moxa IKS-6728 IKS-6726系列产品硬件安装指南（第二版，2012年10月）说明书

IKS-6728/IKS-6726 Series Hardware Installation GuideSecond Edition, October 20122012 Moxa Inc. All rights reserved.P/N: 1802067280011Package ChecklistThe Moxa IKS-6728/IKS-6726 Series industrial rackmount switches are shipped with the following items. If any of these items are missing or damaged, please contact your customer service representative for assistance.•IKS-6728 or IKS-6726 Switch•RJ45 to DB9 console port cable•Protective caps for unused ports• 2 rackmount ears•Documentation and software CD•Hardware Installation Guide•CD-ROM with User’s Manual and SNMP MIB file•Moxa Product Warranty StatementPanel Layouts1.Model name2.System status LEDs3.Reset button4.Serial console port5.Terminal block for relay outputB storage port7.100/1000Base SFP port status LEDs8.10/100/1000BaseT(X) or 100/1000Base SFP combo ports9.10/100BaseT(X) ports10.Fast Ethernet Interface Modules11.Power sockets for AC power inputs12.Terminal blocks for DC power inputs13.Grounding screwDimensionsUnit = mm (inch)Fast Ethernet Interface Modules (IM-6700 Series)Grounding the Moxa Industrial Rackmount Switch Grounding and wire routing help limit the effects of noise due to electromagnetic interference (EMI). Run the ground connection from the ground screw to the grounding surface prior to connecting devices.Connecting the Power InputsThe IKS-6726/6728 series of switches supports both 110/220 VAC and 24/48 VDC power supplies.AC Power InletsThe connection for PWR1 (power supply 1) and PWR2 (power supply 2) are located on the rear side (shown below). Be sure to use a standard power cord with an IEC C13 connector, which is compatible with the AC power inlet.DC Power Terminal BlocksThe connection for PWR1 (power supply 1) and PWR2 (power supply 2) are located on the rear side (shown below).STEP 1: Insert the negative/positive DC wires into the V-/V+ terminals, respectively.STEP 2: To keep the DC wires from pulling loose, use a small flat-blade screwdriver to tighten the wire-clamp screws on the front of the terminal block connector.STEP 3: Insert the plastic terminal block connector prongs into the terminal block receptor.Wiring the Relay ContactEach IKS-6726/6728 switch has one relay output.FAULT:The relay contact of the 2-pin terminal block connector is used to detect user-configured events. The two wires attached to the fault contacts form an open circuit when a user-configured event is triggered. If auser-configured event does not occur, the fault circuit remains closed. RS-232 ConnectionThe Moxa IKS-6726/6728 has one RS-232 (10-pin RJ45) console port, located on the front panel. Use either an RJ45-to-DB9 or RJ45-to-DB25 cable to connect Moxa IKS-6726/6728 console port to your PC’s COM port. You may then use a console terminal program, such as Moxa PComm Terminal Emulator, to access Moxa IKS-6726/6728’s console configuration utility.RJ45 (10-pin) Console Port PinoutsThe Reset ButtonDepress the Reset button for five continuous seconds to load the factory default settings. Use a pointed object, such as a straightened paper clip or toothpick, to depress the Reset button. When you do so, the STATE LED will start to blink about once per second. Continue to depress the STATE LED until it begins blinking more rapidly; this indicates that the button has been depressed for five seconds and you can release the Reset button to load factory default settings.NOTE DO NOT power off the switch when loading default settingsLED IndicatorsThe front panel of the IKS switch contains several LED indicators. TheSpecificationsRack Mounting Instructions1.Elevated Operating Ambient: If installed in a closed or multi-unitrack assembly, the operating ambient temperature of the rackenvironment may be greater than room ambient. Therefore,consideration should be given to installing the equipment in anenvironment compatible with the maximum ambient temperature (Tma) specified by the manufacturer.2.Reduced Air Flow: Installation of the equipment in a rack shouldbe such that the amount of air flow required for safe operation of the equipment is not compromised.3.Mechanical Loading: Mounting of the equipment in the rackshould be such that a hazardous condition is not achieved due touneven mechanical loading.4.Circuit Overloading: Consideration should be given to theconnection of the equipment to the supply circuit and the effect that overloading of the circuits might have on overcurrent protection and supply wiring. Appropriate consideration of equipment nameplate ratings should be used when addressing this concern.5.Reliable Grounding: Reliable grounding of rack-mountedequipment should be maintained. Particular attention should begiven to supply connections other than direct connections to thebranch circuit (e.g. use of power strips)."Restricted Access Locations•This equipment is intended to be used in RestrictedAccess Locations, such as a computer room, withaccess limited to SERVICE PERSONAL or USERSwho have been instructed on how to handle themetal chassis of equipment that is so hot thatspecial protection may be needed before touching it. The location should only be accessible with a key or through a security identity system.•External metal parts of this equipment are extremely hot!! Before touching the equipment, you must take special precautions to protect your hands and body from serious injury.Technical Support Contact Information/supportMoxa Americas:Toll-free: 1-888-669-2872 Tel: 1-714-528-6777 Fax: 1-714-528-6778 Moxa China (Shanghai office): Toll-free: 800-820-5036 Tel: +86-21-5258-9955 Fax: +86-21-5258-5505Moxa Europe:Tel: +49-89-3 70 03 99-0 Fax: +49-89-3 70 03 99-99 Moxa Asia-Pacific:Tel: +886-2-8919-1230 Fax:+886-2-8919-1231。

HYM4616A4 安全芯片产品说明书

山东华翼微电子技术股份有限公司HYM4616A4安全芯片产品说明书Rev.2.0 - 2020.3.19目录1. 芯片概述 (3)2. 芯片特性 (4)3. 应用领域 (5)4. 结构框图 (6)5. 引脚定义 (7)6. 极限参数 (8)7. 典型封装 (9)8. 版本信息 (10)9. 联系我们 (10)HYM4616A4芯片为山东华翼微电子技术股份有限公司自主研发的非接触CPU智能卡安全芯片，支持ISO/IEC14443 TYPEA非接触式通讯协议，集成Turbo 51微处理器（MCU指令兼容8051），ROM容量32KB，EEPROM容量16KB，XRAM容量512Bytes，IRAM容量256Bytes，搭载DES-TripleDES、国密33算法模块、国密SM1算法模块、国密SM4算法模块、M1协处理器，片上集成高安全性固件，具有良好的可靠性、稳定性和安全性。

产品提供各类智能卡操作系统（COS）定制开发，可应用于公共交通、高速公路、校园一卡通等电子支付领域，同时适用于市民卡、居住证等安全认证领域。

➢支持ISO/IEC 14443 TYPEA通信协议➢支持国密SM1算法、国密SM4算法、国密33算法➢M1协处理器➢MCU指令兼容8051➢支持国际DES/3DES算法协处理器➢32bit 随机数发生器(符合FIPS140-2和NIST SP800-22)➢2个16bit 可编程定时器/计数器➢客户应用程序32KB ROM➢数据/程序存储器16KB EEPROM➢256Bytes IRAM、512Bytes XRAM➢支持温度，光，场强等安全检测机制➢存储器(ROM、EEPROM、IRAM、XRAM)数据加密➢EEPROM 满足10 万次擦写，十年数据存储➢工作温度：-20℃~70℃➢ESD PAD对模块衬底大于2000V, 芯片PAD间大于4000V （HBM）➢COS支持标准ED/EP应用3.应用领域➢居住证➢小额支付➢公共交通➢高速公路➢居民健康卡➢市民卡➢城市一卡通➢校园一卡通➢高安全应用4.结构框图图1：结构框图5.引脚定义图2：引脚定义表1：引脚定义PAD编号PAD名称功能描述说明1 LA Antenna RF input 非接射频接口2 LB Antenna RF input 非接射频接口6.极限参数表2：模块极限参数项目符号数值单位工作温度Topr -25 ~ +70 ℃储藏温度Tstr -25 ~ +85 ℃ESD Vesd 5500 V 表3：成卡极限参数项目符号数值单位工作温度Topr -25 ~ +70 ℃储藏温度Tstr -20 ~ +70 ℃ESD Vesd 8000 V7.典型封装非接触模块可封装为标准卡和异形卡，具体天线参数请咨询山东华翼微电子技术股份有限公司。

EM610FV8系列低功耗128Kx8 SRAM说明书

Document Title128K x8 bit Super Low Power and Low Voltage Full CMOS Static RAMRevision HistoryRevision No. History Date Remark0.0-.Initial Draft May092003Preliminary0.1-.Add Pb-free part number Feb.1320040.2-.Add 45ns part specification Mar.202009-.I SB1(Typ.) changed from 0.5uA to 0.3uA-.I SB1(Max.) changed from 5uA to 1.5uA-.t CW1, t CW2, t AW changed from 45ns to 40ns with 55ns part-.t WP changed from 40ns to 30ns with 55ns part-.t WP changed from 50ns to 35ns with 70ns part-.Memory Function Guide updated in the last page1.0-.EM610FV8(KGD), EM610FV8S series, EM610FV8T seriesApr.072009Release& EM610FV8V series are unified to EM610FV8 Family-.t WHZ changed from 20ns to 25ns with 70ns part-.t CW1, t CW2, t AW changed from 40ns to 35ns with 45ns part1.1-.Change function description when CS pin is ‘L’ status Nov2120121.2-.Change 8x13 sTSOP package information Dec182012Emerging Memory & Logic Solutions Inc.2F Jeju CCI B/D, 574-1 Donam-Dong, Jeju-Si, Jeju-Do, Rep.of Korea Zip Code : 690-029Tel : +82-64-740-1700 Fax : +82-64-740-1750 / Homepage : The attached data sheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office.PRODUCT FAMILY1. “xx” represents speed.2. Typical values are measured at V CC =3.3V, T A =25o C and not 100% tested.Product FamilyOperating Temperature Vcc RangeSpeedPower DissipationPKG Type Standby (I SB1, Typ.)Operating (I CC1.Max.)EM610FV8Industrial (-40 ~ 85o C)2.7 ~3.6 V45/55/70 ns0.3 μA 2)3 mAKGDEM610FV8S - xx 1)LF 32-sTSOP1EM610FV8T - xx 1)LF 32-TSOP1 EM610FV8V - xx 1)LF32-SOPFEATURES•Process Technology : 0.18μm Full CMOS •Organization : 128K x 8 bit•Power Supply Voltage : 2.7V ~ 3.6V •Low Data Retention Voltage : 1.5V (Min)•Three state output and TTL Compatible •Package Type- 32-sTSOP1, 32-TSOP1, 32-SOPGENERAL DESCRIPTIONThe EM610FV8 families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current.FUNCTIONAL BLOCK DIAGRAMR o w S e l e c tI/O Circuit Column SelectData ContPre-charge CircuitMemory Array 1024 x 1024A1A2A3A4A5A6A7A0A8A9A10A11A12A13A14A15WE OE CS1DQ0 ~ DQ7V CCV SSControl LogicA16CS2PIN DESCRIPTIONName FunctionName FunctionCS 1, CS 2Chip Select input V CC Power Supply OE Output Enable input V SSGroundWE Write Enable input A0~A16 Address inputs DQ0~DQ7Data inputs/outputsPIN CONFIGURATIONS32 - sTSOP11 2345678A11A9910111213141516A8A13A7A15DQ0V SS 32313029282726252423222120191817V CC WE A1A2A0A3A10CS1DQ7OE CS2A4NC A16A14A12DQ1DQ2DQ3DQ4DQ5DQ6A6A51 2345678NC A16910111213141516A14A12A7A5DQ0V SS32313029282726252423222120191817V CC CS2A15WE A13A8A9A11A10CS1DQ7OE A6A4A3A2A1A0DQ1DQ2DQ3DQ4DQ5DQ632 - sTSOP1, 32 - TSOP1 : Top view32 - SOP : Top view32 - S O P32 - TSOP1ABSOLUTE MAXIMUM RATINGS 1)1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.FUNCTIONAL DESCRIPTIONNOTE : X means don’t care. (Must be low or high state)ParameterSymbol Ratings Unit Voltage on Any Pin Relative to V SS V IN , V OUT-0.2 to 4.0V Voltage on Vcc supply relative to Vss V CC -0.2 to 4.0V Power Dissipation P D 1.0WOperating TemperatureT A-40 to 85oCCS1CS2OE WE DQ0~7Mode Power H X X X High-Z Deselected Stand by X L X X High-Z Deselected Stand by L H H H High-Z Output DisabledActive L H L H Data Out Read Active LHXLData InWriteActiveRECOMMENDED DC OPERATING CONDITIONS 1)1. TA= -40 to 85o C, otherwise specified2. Overshoot: VCC +2.0 V in case of pulse width < 20ns3. Undershoot: -2.0 V in case of pulse width < 20ns4. Overshoot and undershoot are sampled, not 100% tested.CAPACITANCE 1) (f =1MHz, T A =25o C)1. Capacitance is sampled, not 100% tested.DC AND OPERATING CHARACTERISTICS1. Typical values are measured at V CC =3.3V, T A =25o C and not 100% tested.ParameterSymbol Min Typ Max Unit Supply voltage V CC 2.7 3.3 3.6V GroundV SS 000V Input high voltage V IH 2.2 -V CC + 0.22)V Input low voltageV IL-0.23)-0.6VItemSymbol Test ConditionMin Max Unit Input capacitance C IN V IN =0V -8pF Input/Ouput capacitanceC IOV IO =0V-10pFParameterSymbol Test Conditions Min Typ Max Unit Input leakage current I LI V IN =V SS to V CC-1-1μA Output leakage current I LO CS 1=V IH or CS 2=V IL or OE=V IH or WE=V IL or V IO =V SS to V CC-1-1μA Operating power supplyI CC I IO =0mA, CS 1=V IL , CS 2=WE=V IH , V IN =V IH or V IL --3mA Average operating currentI CC1Cycle time=1μs, 100% duty, I IO =0mA,CS 1<0.2V, CS 2>V CC -0.2V, V IN <0.2V or V IN >V CC -0.2V--3mAI CC2Cycle time = Min, I IO =0mA, 100% duty,CS 1=V IL , CS 2=V IH, V IN =V IL or V IH 45ns--30mA55ns --2570ns--20 Output low voltage V OL I OL = 2.1mA--0.4V Output high voltage V OH I OH = -1.0mA2.4--V Standby Current (TTL)I SBCS 1=V IH , CS 2=V IL , Other inputs=V IH or V IL --0.3mAStandby Current (CMOS)I SB1CS 1>V CC -0.2V, CS 2>V CC -0.2V (CS 1 controlled) or 0V<CS 2<0.2V (CS 2 controlled), Other inputs = 0~V CC(Typ. condition : V CC =3.3V @ 25oC) (Max. condition : V CC =3.6V @ 85o C)LL LF-0.31)1.5μAAC OPERATING CONDITIONSTest Conditions (Test Load and Test Input/Output Reference)Input Pulse Level : 0.4 to 2.2V Input Rise and Fall Time : 5nsInput and Output reference Voltage : 1.5VOutput Load (See right) : CL 1) = 100pF+ 1 TTL (70ns)CL 1) = 30pF + 1 TTL (45ns/55ns)1. Including scope and Jig capacitance 2. R 1=3070Ω, R 2=3150Ω3. V TM = 2.8V4. CL = 5pF + 1 TTL (measurement with tLZ, tOLZ, tHZ, tOHZ, tWHZ)READ CYCLE (V cc = 2.7 to 3.6V, Gnd = 0V, T A = -40o C to +85o C)WRITE CYCLE (V cc = 2.7 to 3.6V, Gnd = 0V, T A = -40o C to +85o C)ParameterSymbol45ns 55ns70nsUnitMin Max Min Max Min Max Read cycle time t RC 45-55-70-ns Address access time t AA -45-55-70ns Chip select to output t CO1, t CO2-45-55-70ns Output enable to valid output t OE -25-25-35ns Chip select to low-Z output t LZ1, t LZ210-10-10-ns Output enable to low-Z output t OLZ 5-5-5-ns Chip disable to high-Z output t HZ1, t HZ2020020025ns Output disable to high-Z output t OHZ 020020025ns Output hold from address changet OH10-10-10-nsParameterSymbol45ns 55ns70nsUnitMin Max Min Max Min Max Write cycle timet WC 45-55-70-ns Chip select to end of write t CW1, t CW235-40-60-ns Address setup time t AS 0-0-0-ns Address valid to end of write t AW 35-40-60-ns Write pulse width t WP 30-30-35-ns Write recovery time t WR 0-0-0-ns Write to ouput high-Z t WHZ 0202025nsData to write time overlap t DW 25 25 30 ns Data hold from write time t DH 0-0-0-ns End write to output low-Zt OW5-5-5-nsCL 1)V TM 3)R 12)R 22)TIMING WAVEFORM OF READ CYCLE(2) (WE = V IH )t RCAddresst AA Data Validt OHPrevious Data ValidTIMING WAVEFORM OF READ CYCLE(1) (Address Controlled, CS=OE=V IL , CS2=WE=V IH )Data OutTIMING DIAGRAMSNOTES (READ CYCLE)1. t HZ1,2 and t OHZ are defined as the outputs achieve the open circuit conditions and are not referenced to output voltage levels.2. At any given temperature and voltage condition, t HZ1,2(Max.) is less than t LZ1,2(Min.) both for a given device and from device to device interconnection.t RCAddressCS1CS2OEData Outt CO1,2t OHt OEHigh-Zt OHZData Validt OLZt LZ1,2t AAt HZ1,2TIMING WAVEFORM OF WRITE CYCLE(1)(WE Controlled)TIMING WAVEFORM OF WRITE CYCLE(2) (CS1 Controlled)t WC AddressCS1 CS2WE Data in Data outt CW12)t WR4)t AWt WP1)t DW t DH tAS3)High-Z High-ZData Validt WR4)t WCAddressCS1CS2 WE Data in Data outt CW1,22)t AWt WP1)t AS3)High-Zt DW t DHHigh-Zt OWt WHZData UndefinedData ValidTIMING WAVEFORM OF WRITE CYCLE(3)(CS2 Controlled)t WC AddressCS1CS2 WE Data in Data outt CW22)t WR4)t AWt WP1)t DW t DH High-Z High-ZData Validt AS3)NOTES(WRITE CYCLE)1. A write occurs during the overlap(t WP) of low CS1, a high CS2 and low WE. A write begins at the lastest transition among CS1 goes low, CS2 goes high and WE goes low. A write ends at the earliest transition when CS1 goes high, CS2 goes high and WE goes high. The t WP is measured from the beginning of write to the end of write.2. t CW is measured from the CS1 going low or CS2 going high to end of write.3. t AS is measured from the address valid to the beginning of write.4. t WR is measured from the end or write to the address change. t WR applied in case a write ends as CS1 or WE going high.DATA RETENTION CHARACTERISTICSNOTES1. See the I SB1 measurement condition of datasheet page 5.2. Typical values are measured at T A =25o C and not 100% tested.ParameterSymbolTest ConditionMinTyp 2)MaxUnitV CC for Data Retention V DR I SB1 Test Condition (Chip Disabled) 1)1.5- 3.6V Data Retention CurrentI DR V CC =1.5V, I SB1 Test Condition(Chip Disabled) 1)-0.25- AChip Deselect to Data Retention Time t SDR See data retention wave form0--nsOperation Recovery Timet RDRt RC--DATA RETENTION WAVE FORMt SDRt RDRData Retention ModeCS1 > Vcc-0.2VV cc 2.7V2.2V V DR CS1GNDt SDRt RDRData Retention ModeV cc 2.7V CS2V DR 0.4V GNDCS2 < 0.2VPACKAGE DIMENSIONS32Pin - sTSOP Type1Unit : millimeters/InchesPACKAGE DIMENSIONS32Pin - TSOP Type1Unit : millimeters/InchesPACKAGE DIMENSIONS32Pin - SOP Unit : millimeters/InchesMEMORY FUNCTION GUIDE1. Memory Component8. VersionBlank---------------Mother die2. Device Type A ---------------2 nd generation 6---------------Low Power SRAM B ---------------3 rd generation 7---------------STRAM C ---------------4 th generation C ---------------CellularRAM D ---------------5 th generation E ---------------6 th generation3. Density F ---------------7 th generation 1--------------- 1MG ---------------8 th generation 2--------------- 2M 4--------------- 4M 9. Package8--------------- 8M Blank---------------KGD, FBGA 16--------------- 16M S ---------------32 sTSOP132--------------- 32M T ---------------32 TSOP164--------------- 64M U ---------------44 TSOP228---------------128MV ---------------32 SOP 4. Option 10. Speed 0---------------Dual CS 45--------------- 45ns 1---------------Single CS 55--------------- 55ns 60--------------- 60ns 5. Technology 70--------------- 70ns F ---------------Full CMOS 85--------------- 85ns 90--------------- 90ns 6. Operating Voltage 10---------------100ns T ---------------5.0V 12---------------120nsV ---------------3.3V U ---------------3.0V 11. Power S ---------------2.5V LL ---------------Low Low PowerR ---------------2.0V LF ---------------Low Low Power(Pb-free & Green)P ---------------1.8V L ---------------Low PowerS ---------------Standard Power7. Organization 8--------------- X8 bit 16---------------X16 bit 32---------------X32 bitEMX XX XXX XX XX -XX XX1. EMLSI Memory2. Device Type 11. Power3. Density 10. Speed4. Function 9. Package5. Technology 8. Version6. Operating Voltage7. Organization。

GSL1686_DataSheet_Chinese_RevA3.0

o 自校准
o 大面积水和脸触控抑制 o 支持分辨率向上和向下缩放，以匹配 LCD 分辨率 o 支持 X,Y 轴镜像翻转和 90,270 度旋转模式 • 扫描速度 o 单点触摸最大可达 2KHz o 配置允许功率/速度优化 • 响应时间 o 初始延迟< 10ms，（休眠状态时第一次接触） • 传感器 o 支持 PET 或玻璃传感器，包括弯曲型材 o 支持单层或双 ITO 层 o 支持单层 ITO 镀屏蔽层或不镀屏蔽层 o 支持所有市场上所有的传感器图形
4
Silead Inc. 上海思立微电子科技有限公司-多点电容触控 IC
GSL1686 Capacitive Touchscreen Controller
4.4. 运行模式......................................................................................................................................16 4.4.1. 睡眠模式 ..............................................................................................................................16 4.4.2. 运行模式 ..............................................................................................................................16
GSL1686 Capacitive Touchscreen Controller

MEMORY存储芯片HT66F018中文规格书

Rev. 1.502016-07-01概述该单片机是8位高性能精简指令集的Flash 型单片机，具有一系列功能和特性，其Flash 存储器可多次编程的特性给用户提供了极大的方便。

存储器方面，还包含了一个RAM 数据存储器和一个可用于存储序列号、校准数据等非易失性数据的EEPROM 存储器。

在模拟特性方面，该单片机包含一个多通道12位A/D 转换器和比较器功能。

还带有多个使用灵活的定时器模块，可提供定时功能、脉冲产生功能及PWM 产生等功能。

内部看门狗定时器、低电压复位和低电压检测等内部保护特性，外加优秀的抗干扰和ESD 保护性能，确保单片机在恶劣的电磁干扰环境下可靠地运行。

该单片机提供了丰富的HXT 、LXT 、HIRC 和LIRC 振荡器功能选项，且内建完整的系统振荡器，无需外接元件。

其在不同工作模式之间动态切换的能力，为用户提供了一个优化单片机操作和减少功耗的手段。

外加时基功能、I/O 使用灵活等其它特性，使这款单片机可以广泛应用于各种产品中，例如电子测量仪器、环境监控、手持式测量工具、家庭应用、电子控制工具、马达控制等方面。

方框图Rev. 1.50HT66F018内置EEPROM 增强A/D 型单片机2016-07-01引脚图VSS&AVSS PC0/OSC1PC1/OSC2PC2PA0/TP0/ICPDA/OCDSDAPA1PA2/ICPCK/OCDSCKPA3/CXVDD&AVDD PB0/INT0/AN0/XT1PB1/INT1/AN1/XT2PB2/TCK0/AN2PA4/TCK1/AN3PA5/AN4/VREF PA6/TCK2/AN5PA7/TP1/AN6HT66F01816 NSOP-A16151413121110912345678HT66F01820 SOP-A/SSOP-AVSS&AVSS PC0/OSC1PC1/OSC2PC2PA0/TP0/ICPDA/OCDSDAPA1PA2/ICPCK/OCDSCKPA3/CX PB6/C+PB5/C-VDD&AVDD PB0/INT0/AN0/XT1PB1/INT1/AN1/XT2PB2/TCK0/AN2PA4/TCK1/AN3PA5/AN4/VREF PA6/TCK2/AN5PA7/TP1/AN6PB3/TP2/AN7PB4/CLO2019181716151413121112345678910注：1.若共用引脚同时有多种输出，“/”号右侧的引脚名具有更高的优先级。

FSC7002 datasheet v1.9

7
FINCHOS-BUS REV.A2................................................................................................................................... 24 7.1 数据传输总线 PAD(PARALLEL ADDRESS DATA BUS 并行地址数据总线) ................................................. 24 7.2 控制命令总线 PAR（PARALLEL ADDRESS REGISTER BUS 并行地址寄存器总线） ................................. 28 7.2.1 PAR 寄存器总表 ..................................................................................................................................... 29
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FMCU8KB 嵌入式微控制器 ............................................................................................................................ 41 8.1 8.2 SFR 特殊功能寄存器 ................................................................................................................................. 42 指令集 ......................................................................................................................................................... 43

EM785840中文资料(ELAN Microelectronics)中文数据手册「EasyDatasheet - 矽搜」

• 两个8位计数器：C1与COUNTER2
• 内置看门狗定时器（WDT）
• 99.9％单指令周期命令
• 三种工作模式（主时钟可以从447.829k被编程为14.3MHz内部产生来自PLL)Mode
CPU状态
主时钟
32.768kHz时钟状态
睡眠模式
关掉
关掉
关掉
绿色模式
打开
关掉
打开
普通模式开启
打开
打开
· 输入端口中断功能
SEG1 SEG0 COM3 COM2 COM1 COM0 AVDD PLLC AVSS
P67 ADR/P66
44 1
43
42
41
40
39
38
37
36
35 3433
2
32
3
31
4
30
5
29
6
28
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9
25
10
24
1112 13 14 15 16 17 18 19 20 21 2223
PC3 PC2/PWM2 PC1/PWM1 PC0 P70/INT0 P71/INT1 P72/INT2 P73/INT3 P74/SDI P75/SDO P76/SCK
__________________________________________________________________________________________________________________________________________________________________
用户应用笔记
（使用这种芯片之前,先看看下面描述说明,它包含重要信息.）

MEMORY存储芯片MT25QL01GBBB8ESF-0SIT中文规格书

Features•Stacked device (two 512Mb die)•SPI-compatible serial bus interface•Single and double transfer rate (STR/DTR)•Clock frequency–133 MHz (MAX) for all protocols in STR –90 MHz (MAX) for all protocols in DTR•Dual/quad I/O commands for increased through-put up to 90 MB/s•Supported protocols: Extended, Dual and Quad I/O both STR and DTR •Execute-in-place (XIP)•PROGRAM/ERASE SUSPEND operations•Volatile and nonvolatile configuration settings •Software reset•Additional reset pin for selected part numbers•3-byte and 4-byte address modes – enable memory access beyond 128Mb•Dedicated 64-byte OTP area outside main memory –Readable and user-lockable •Erase capability –Die Erase–Sector erase 64KB uniform granularity –Subsector erase 4KB, 32KB granularity •Erase performance: 400KB/sec (64KB sector)•Erase performance: 80KB/sec (4KB sub-sector)•Program performance: 2MB/sec •Security and write protection–Volatile and nonvolatile locking and software write protection for each 64KB sector –Nonvolatile configuration locking –Password protection–Hardware write protection: nonvolatile bits (BP[3:0] and TB) define protected area size –Program/erase protection during power-up –CRC detects accidental changes to raw data •Electronic signature–JEDEC-standard 3-byte signature (BA21h)–Extended device ID: two additional bytes identify device factory options •JESD47H-compliant–Minimum 100,000 ERASE cycles per sector –Data retention: 20 years (TYP)OptionsMarking•Voltage – 2.7–3.6V L •Density –1Gb01G •Device stacking – 2 die stacked B •Device generation B •Die revisionB •Pin configuration –HOLD#1–RESET and HOLD#8•Sector Size –64KBE •Packages – JEDEC-standard, RoHS-compliant–24-ball T-PBGA 05/6mm x 8mm (TBGA24)12–16-pin SOP2, 300 mils (SO16W,SO16-Wide, SOIC-16)SF –W-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)W9•Security features –Standard security 0•Special options –Standard S –AutomotiveA •Operating temperature range –From –40°C to +85°C IT –From –40°C to +105°C AT –From –40°C to +125°CUT找Memory 、FPGA 、二三极管、连接器、模块、光耦、电容电阻、单片机、处理器、晶振、传感器、滤波器，上深圳市美光存储技术有限公司Part Number OrderingMicron Serial NOR Flash devices are available in different configurations and densities. Verify valid part numbers by using Micron’s part catalog search at . To compare features and specifications by device type,visit /products. Contact the factory for devices not found.Figure 1: Part Number Ordering InformationProduction Status Blank = ProductionES = Engineering samples QS = Qualification samples Operating Temperature IT = –40°C to +85°C AT = –40°C to +105°C UT = –40°C to +125°CSpecial Options S = StandardA = Automotive grade AEC-Q100Security Features0 = Standard default securityPackage Codes12 = 24-ball T-PBGA, 05/6 x 8mm (5 x 5 array)14 = 24-ball T-PBGA, 05/6 x 8mm (4 x 6 array)SC = 8-pin SOP2, 150 mils SE = 8-pin SOP2, 208 mils SF = 16-pin SOP2, 300 mils W7 = 8-pin W-PDFN, 6 x 5mm W9 = 8-pin W-PDFN, 8 x 6mm 5x = WLCSP package 1Sector sizeE = 64KB sectors, 4KB and 32KB subsectorsMicron Technology Part Family 25Q = SPI NOR Voltage L = 2.7–3.6V U = 1.7–2.0V Density064 = 64Mb (8MB)128 = 128Mb (16MB)256 = 256Mb (32MB)512 = 512Mb (64MB)01G = 1Gb (128MB)02G = 2Gb (256MB)StackA = 1 die/1 S#B = 2 die/1 S#C = 4 die/1 S#Device Generation B = 2nd generation Die Revision A = Rev. A B = Rev. BPin Configuration Option 1 = HOLD# pin 3 = RESET# pin8 = RESET# and HOLD# pinMT 25Q LxxxA BA1ESF IT-SESNote: 1.WLCSP package codes, package size, and availability are density-specific. Contact the factory for availability.Device DescriptionThe MT25Q is a high-performance multiple input/output serial Flash memory device. Itfeatures a high-speed SPI-compatible bus interface, execute-in-place (XIP) functionali-ty, advanced write protection mechanisms, and extended address access. Innovative,high-performance, dual and quad input/output commands enable double or quadru-ple the transfer bandwidth for READ and PROGRAM operations.Figure 2: Block DiagramNote: 1.Each page of memory can be individually programmed, but the device is not page-eras-able.1Gb, 3V Multiple I/O Serial Flash MemoryMemory Map – 1Gb Density1Gb, 3V Multiple I/O Serial Flash MemoryStatus Register Status RegisterStatus register bits can be read from or written to using READ STATUS REGISTER orWRITE STATUS REGISTER commands, respectively. When the status register enable/disable bit (bit 7) is set to 1 and W# is driven LOW, the status register nonvolatile bitsbecome read-only and the WRITE STATUS REGISTER operation will not execute. Theonly way to exit this hardware-protected mode is to drive W# HIGH.。

ENTTEC 智能RGB LED光带数据表说明书

ENTTEC PIXEL TapesS M A R T R G B P I X E L T A P E S:30,60A N D144L E D S/M E T R E Features•Available in three different densities: 30, 60 and 144 Pixels/Metre•Designed for ENTTEC Pixie Driver•Up to 27 Watt/Metre•Up to 586 Lumens/Metre•In-built WS2812& WS2812B compatible chips into 5050 RGB LEDs •Each pixel can achieve16,777,216full colour display and scan frequency non less than 400Hz/s•3M adhesive double side tape at the back•Built-in data signal reshaping circuit•5V DC input supply voltage•Flexible construction materialPhysical Dimensions The tapes come in five metres reels, and can be cut bymetres.30 LED/Metre:60 LED/Metre:144 LED/Metre:SpecificationsDue to continuous improvements and innovations of allENTTEC products, specifications and features are subject to change without notice.Ordering InformationThe ENTTEC Pixel Tape and compatible products can be ordered from our website or through your ENTTEC dealer using the following part numbers.ENTTEC PTY LTD ENTTEC AMERICAS 17/5 Samantha Court 604A Cornerstone Ct.Knoxfield Victoria 3180 Hillsborough NC 27278 Australia USATel: +61 3 9763 5755 Tel-Fax: (888) 454-5922Fax: +61 3 9763 5688 email ****************Item8PL308PL608PL144Input Voltage (VCC)+4.5 to +5.3 VDC Data line Voltage -0.5 to VCC +0.5Watt / Metre (max.) 5.611.327Lumens / Metre (max.)122244586Beam Angle 120°Control ProtocolWS2812 & WS2812b5m Reel shipping Weight (Kg)0.3Operation Temperature 0° to 50° C Pixel mapping orderGRB (Green, Red, Blue)ItemPart Number 30 LEDS/METER Pixel tape - 1 Meter long 8PL30-130 LEDS/METER Pixel tape - 5 Meter Roll 8PL30-F 60 LEDS/METER Pixel tape - 1 Meter long 8PL60-160 LEDS/METER Pixel tape - 5 Meter Roll 8PL60-F 144 LEDS/METER Pixel tape - 1 Meter long 8PL144-1144 LEDS/METER Pixel tape – 2 Meter Roll8PL144-2。

8F5E2 Datasheet说明书

8F5E2 DatasheetDocument HistoryContentsDocument History (2)Preface (4)Disclaimer (4)Customer Support Overview (4)ESD Warning (5)Precautions (6)Limited Product Warranty (6)Introduction (7)Product Features and Specifications (8)Interface function description (11)Typical Installation (13)Recovery Mode (13)Order Information (14)Mechanical Dimensions (15)PrefaceDisclaimerThe information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.Plink assumes no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for discrepancies between the product and the user’s guide.Customer Support OverviewIf you experience any difficulties after using the product, please freely contact us directly. Our tech can help you with product installation and difficulties.Our support section is available 24 hours a day, 7 days a week on our website at: /en/Jetson.html. Our technical support is always free.ESD WarningElectronic components and circuits are very sensitive to electrostatic discharge. Although the company will do anti-static protection design for the main interface on the circuit board when designing circuit board products, it is difficult to do anti-static safety protection for all components and circuits. Therefore, it is recommended to follow ESD safety precautions when handling any circuit board component.ESD protection measures include but are not limited to the following:- During transportation or storage, place the card in an ESD bag and do not take it out until installation.- Release the static electricity before touching the board. Using a discharge grounding wrist strap.- Operate the circuit board only in electrostatic discharge safety area.- Avoiding move circuit boards in carpeted areas.- Avoiding contact with components, try to handle the board by the edges.Precautions- Before using the product, please read this manual carefully and keep it properly for future reference- Please pay attention to and follow all warnings and guidelines marked on the product- Please use the matching power adapter to ensure the stability of current and voltage - Please use this product in a cool, dry and clean place- Do not use this product in the environment of alternating cold and heat to avoid condensation and damage to internal components- Do not splash any liquid on the product. It is forbidden to use organic solvent or corrosive liquid to clean the product- Do not use this product in dusty and messy environment. If it is not used for a long time, please pack the product- Do not use it in an environment with excessive vibration. Any falling or knocking may damage the lines and components- Do not plug and unplug the core board and peripheral modules when the power is on- Do not repair or disassemble the product by yourself. If the product fails, contact the company for repair in time- Do not modify or use unauthorized accessories by yourself, and the resulting damage will not be covered by warrantyLimited Product Warranty- Warranty period -Bottom plate and core plate: 3 years (non-human damage)- Contact informationContacts: RMAAddress: Room 718, Jinrongkemao Plaza, No. 15 Shangdi Xinxi Road, Haidian District, Beijing, ChinaE-mail: sales@Telephone:+86-010-********- Mailing instructions: Please contact the sale staff of the company in advance, then arrange technicians to verify and eliminate the errors caused by misoperation as soon as possible. After verification, please mail the equipment to the company.Please attach a list of items and the reason for failure when mailing for easy verification, so as to avoid loss and damage in the process of express delivery.Introduction8F5E2 is a IPC with NVIDIA® Jetson™ AGX Xavier and AGX ORIN 32GB core modules. The main interface is designed for electrostatic safety protection, and a high-reliability power supply application scheme is adopted. The input power supply has over voltage and reverse polarity protection functions, and has a wealth of external interfaces. The internal interface devices are all wide-temperature models.8F5E2 provides multiple independent Gigabit network ports through internal M.2 ports, miniPCIe ports, which is suitable for multi-network port scenarios.8F5E2 is designed based on worse environmental conditions and has good characteristics such as anti-seismic and dust-proof, and is suitable for V2X and other fields.Product Features and Specifications- Product size：198mm×197mm×45 mm- Power requirements：+12V- Working temperature：-25~+70℃- Weight：1340g- Optional expansion:32GB ~ 1TB SSD storage- Maximum scalability 512g TF card memory- 4G and WIFI module can be extended- The initial setting can be reset and restored*Remark：when this model is equipped with AGX Xavier module, only one USB Type A supports USB3.0, Supports only one M.2Key M connector and one miniPCIe connectorPanel and interface IDSFigure 1 Ports on the front panelFigure 2 Ports on the rear panel*There is no interface on the rear panel of the standard machine. The four network interfaces on the rear panel are optional. If you need to use them, please contact the sales staff in advance.Interface function descriptionTypical Installation- Ensure power off of all external system- Install the necessary external cables.(e.g. display cable connected to HDMI monitor, power input cable supplying power to the system, USB cable connecting keyboard and mouse...)- Connect the power cord to the power supply- 8F5E2 could be set as default automatic power on or switch on. Please consult the sales and technical staff of our company for specific methods.Recovery ModeJetson core module can work in normal mode and recovery mode. It can be operated in recovery mode to file system update, kernel update, boot loader update, BCT update and other operationsStep in Recovery mode:- Turn off the system power supply- Use a Micro-USB cable to connect OTG port of the 8F5E2 with USB of the Jetson developing host- Press and hold on Recovery button (REC) to supply system power. Keep REC button for 3seconds above, then release the recovery buttonThe system enters the Recovery mode, and you can perform subsequent operations.Order InformationE-commerce direct purchaseTaobao：https:///Jingdong：https:///index-11467104.html?from=pc Alibaba：https:///Mechanical Dimensions。

渣滿壓力加热炉 441 41 1411 07说明书

80% ECM Single Stage Heating Furnace EASIER TO SELLS80% AFUES Supports two−stage cooling unitsS Flame roll−out sensors standardS Category I ventingS Blocked vent switchS Dehumidification feature in coolingS24 VAC humidifier terminalS Electronic air cleaner terminalS G8MXL model California NOx approvedS Certified to leak 2 percent or less of nominal air conditioningCFM delivered when pressurized to 1-inch Water Gauge with allpresent air inlets, air outlets, and condensate drain port(s) sealedTOUGHERS ECM blower motorS Adjustable heating blower OFF delayS Factory set blower ON delayS RPJ aluminized steel heat exchangerS High temperature limit control prevents overheatingS Direct ignition with Silicon Nitride ignitorS One piece prepainted steel cabinetQUIETERS In−shot burnersS Insulated blower compartmentEASIER TO INSTALL AND SERVICES33 1/3” (847mm) high, for ease of installationS Innovative knobs for easy door removal and secure attachment S Factory shipped for natural gas, with propanegas conversion kits availableS Four position − upflow/downflow/horizontal (left/right) installationS Three position vent elbow capabilityS Through the casing flue pipe for counterflow applications S Common venting with other Category I appliancesS Masonry chimney adapter availableS Self diagnosticsS Slide out blower assemblyWARRANTY *S1 year No Hassle Replacement t limited warrantyS20 year heat exchanger limited warrantyS5 year parts limited warranty Illustrations and photographs are only representative.Some product models may vary.Use of the AHRI Certified TM Mark indicates amanufacturer’s participation in the program. Forverification of certification for individual products,go to .−With timely registration, an additional 5 year parts limited warranty*For owner occupied, residential applications only. See warranty certificate for complete details and restrictions, including warranty coverage for other applications.Model Size Input(MBTUH)EfficiencyAFUECooling CapacityCFM range@ .5 in. w.c. (125 Pa)Dimensions H x W x DInches (Millimeters)Shipping Wt.Lbs (Kg)G8MXN G8MXL 0451408A44,00080%430 − 103533−1/3 x 14−3/16 x 29(847 x 360 x 737)104 (47) 0701716A66,00080%835 − 146033−1/3 x 17−1/2 x 29(847 x 445 x 737)126 (57) 0902116A88,00080%805 − 166533−1/3 x 21 x 29(847 x 533 x 737)140 (64) 1102120A110,00080%990 − 204033−1/3 x 21 x 29(847 x 533 x 737)152 (69) 1352420A132,00080%1125 − 207033−1/3 x 24−1/2 x 29 (847 x 622 x 737)163 (74)G8MXN, G8MXLSoftSoundä XS 80Product SpecificationsSpecifications are subject to change without notice.441 41 1411 07 3/7/14MODEL NUMBER IDENTIFICATION GUIDEDIGIT POSITION 123456,7,89,1011,121314 G= Mainline G8M X L0451412A1 N = Entry8 = 80% AFUE EFFICIENCYM = Multiposition POSITIONV = Variable Speed Blower Motor − ECMX = ECM Blower MotorS = Single−stageT = Two−stage TYPEN = StandardL = Low NOx FEATURE045 = 44,000 BTU/hr070 = 66,000 BTU/hr090 = 88,000 BTU/hr110 = 110,000 BTU/hr135 = 132,000 BTU/hr HEAT INPUT14 = 14−3/16”17 = 17−1/2”21 = 21”24 = 24−1/2”CABINET WIDTH08 = 800 CFM12 = 1200 CFM14 = 1400 CFM16 = 1600 CFM20 = 2000 CFM22 = 2200 CFM NOMINAL MAXIMUM COOLING AIRFLOW @ .5 IN. W.C.SALES (MAJOR) REVISION DIGITENGINEERING (MINOR) REVISION DIGITECM-Electronically Commutated MotorACCESSORIES PART NUMBER IDENTIFICATION GUIDEDIGIT POSITION12345, 6, 78, 910, 11N A H A00101DH N = Non−Branded BRANDINGA = Accessory PRODUCT GROUPH = Heating KIT USAGEA = OriginalB = 2nd Generation MAJOR SERIESProduct Identifier NumberPackage QuantityType of Kit (Example: DH = Draft Hood − Chimney Adapter)2441 41 1411 07Specifications subject to change without notice.PHYSICAL DATANATURAL GAS0451408A0701716A0902116A1102120A1352420AOUTPUT CAPACITY BTUH* (Nonweatherized ICS) †G8MXL Upflow, all G8MXN36,00053,00072,00090,000107,000 G8MXL Downflow/Horizontal34,00051,00069,00086,000102,000INPUT BTUH*G8MXL Upflow, all G8MXN44,00066,00088,000110,000132,000 G8MXL Downflow/Horizontal42,00063,00084,000105,000126,000AFUE † *Nonweatherized ICS80.080.080.080.080.0 TRANSFORMER (24 volt)40 VACERTIFIED TEMP RISE RANGE −_F (_C)30−60(17−33)25−55(14−31)35−65(19−36)30−60(17−33)40−70(22−39)CERTIFIED EXT STATIC PRESSURE Heating0.100.120.150.200.20 Cooling0.500.500.500.500.50AIRFLOW CFM‡Heating7351230134518901865 Cooling10351460166520402070LIMIT CONTROL SPSTHEATING BLOWER CONTROL Solid−State Time OperationBURNERS (Monoport)23456 GAS CONNECTION SIZE1/2 inch NPTGAS VALVE (Redundant) Manufacturer White−RodgersMinimum Inlet Pressure (in. w.c.) 4.5 (Natural Gas)Maximum Inlet Pressure (in. w.c.)13.6 (Natural Gas)IGNITION DEVICE Hot SurfaceCOOLING CAPACITY CFM range (.5 in. w.c.)430 − 1035835 − 1460805 − 1665990 − 20401125 − 2070 *Gas input ratings are certified for elevations to 2000 ft. (610 M). In USA, for elevations above 2000 ft. (610 M), reduce ratings 4 percent for each 1000 ft. (305 M) above sea level. Refer to National Fuel Gas Code NFPA 54/ANSI Z223.1-2009 T able F.4 or furnace Installation Instructions.†Capacity in accordance with U.S. Government DOE test procedures.‡Airflow shown is for bottom only return-air supply in comfort mode (as shipped). For air delivery above 1800 CFM, see Air Delivery T able for other options. A filter is required for each return‐air supply.ICS — Isolated Combustion SystemELECTRICAL DATAG8MXN&G8MXL VOLTS−HERTZ−PHASEOPERATINGVOLTAGE RANGE*MAXIMUMUNIT AMPSMAXIMUM WIRELENGTH FT (M)}MAXIMUM FUSEOR CKT BKRAMPS{MINIMUMWIRE GAGE Maximum Minimum0451408A115−60−11271048.134 (10)1514 0701716A115−60−112710410.826 (8)1514 0902116A115−60−112710411.425 (7)1514 1102120A115−60−112710414.231 (9)2012 1352420A115−60−112710414.231 (9)2012 * Permissible limits of the voltage range at which the unit operates satisfactorily.{ Time−delay type is recommended.}Length shown is as measured 1 way along wire path between unit and service panel for maximum 2 percent voltage drop.441 41 1411 073Specifications subject to change without notice.G8MXN&G8MXLA B C DVENTCONNECTIONSIZESHIP WTLB (KG) CABINET WIDTHIN (MM)OUTLET WIDTHIN (MM)TOP AND BOTTOMOUTLETIN (MM)BOTTOM INLETWIDTHIN (MM)0451408A14−3/16 (360)12−9/16 (319)9−5/16 (237)12−11/16 (322)4104 (47) 0701716A17−1/2 (445)15−7/8 (403)11−9/16 (294)16−1/8 (410)4126 (57) 0902116A21 (533)19−3/8 (492)13−5/16 (338)19−1/2 (495)4140 (64) 1102120A21 (533)19−3/8 (492)13−5/16 (338)19−1/2 (495)4152 (69) 1352420A24−1/2 (622)22−7/8 (581)15−1/16 (383)23 (584) 4 {163 (74) {135 Btu/h size furnaces require 5 inch (127 mm) vents. Use a 4-5 inch (102-127 mm) vent adaptor between furnace and vent stack.See installation instructions for complete installation requirements.4441 41 1411 07Specifications subject to change without notice.Specifications subject to change without notice.Venting Notes1.For common vent, vent connector sizing and vent material: United States−use the NFGC.2.Immediately increase to 5 inch (127 mm) or 6−inch (152 mm) vent connector outside furnace casing when 5 inch (127 mm) ventconnector is required, refer to Note 1 above.3.Side outlet vent for upflow and downflow installations must use Type B vent immediately after exiting the furnace, except whenDownflow Vent Guard Kit, is used in the downflow position.4.Type−B vent where required, refer to Note 1 above.5.4 inch single−wall (26 ga. min.) vent must be used inside furnace casing and when the Downflow Vent Guard Kit is used externalto the furnace.6.Accessory Downflow Vent Guard Kit, required in downflow installations with lower vent configuration.7.Chimney Adapter Kit may be required for exterior masonry chimney applications. Refer to Chimney Adapter Kit, for sizing andcomplete application details.8.Secure vent connector to furnace elbow with (2) corrosion−resistant sheet metal screws, spaced approximately 180_ apart.9.Secure all other single wall vent connector joints with (3) corrosion resistant screws spaced approximately 120_ apart. SecureType−B vent connectors per vent connector manufacturer’s recommendations.MINIMUM CLEARANCES TO COMBUSTIBLE MATERIALS FOR ALL UNITSThis forced air furnace is equipped for use with natural gas ataltitudes 0 − 10,000 ft (0 − 3,050m).An accessory kit, supplied by the manufacturer, shall be used to convert to propane gas use or may be required for some natural gas applications.This furnace is for indoor installation in a building constructed on site.The furnace may be installed on combustible flooring in alcove or closet at minimum clearance as indicated by the diagram from combustible material.This furnace may be used with a Type B−1 Vent and may be vented in common with other gas fired appliances.This furnace is approved for UPFLOW, DOWNFLOW, and HORIZONTAL installations.Downflow Positions:{Installation on non−combustible floors only.For Installation on combustible flooring only when installed on specialbase or coil assembly.18 inch front clearance required for alcove.*Indicate supply or return sides when furnace is in the horizontal position. Line contact only permissible between lines formed byintersections of the Top and two Sides of the furnace jacket, andbuilding joists, studs or framing.BLOWER PERFORMANCE DATAG8MXN & G8MXL04514080701716090211611021201352420 DIRECT-DRIVE MOTOR Hp (ECM)1/23/43/411 MOTOR FULL LOAD AMPS 6.88.88.811.511.5 RPM (Nominal) – Speeds1050−51050−51050−51050−51050−5BLOWER WHEEL DIAMETER WIDTHS − in (mm)10 x 6(254 x 152)11 x 8(279 x 203)10X10(254 x 254)11 x 11(279 x 279)11 x 11(279 x 279)PSC−Permanent Split Capacitor6441 41 1411 07Specifications subject to change without notice.AIR DELIVERY − CFM (with filter)*G8MXN&G8MX LRETURN−AIR SUPPLYSPEEDEXTERNAL STATIC PRESSURE (in. w.c.)0.10.20.30.40.50.60.70.80.910451408Bottom orSide(s)511851145111510751035980905820720580 4920880835800755720680645605540 3735685625585530490435395345295 2820765725670630580545490455405 1650595535490430390330280235−−0701716Bottom orSide(s)51625158515351495146014151365129512201125 41405136013201280124011951155111510701030 3124012001155111010651020975935895850 211901140109510501000955915870830790 110359859308858357857456956506000902116Bottom orSide(s)51845180017551710166515951500140012751105 41590154515001455141013651315127011801000 313651320127012151170112510701025955900 212251160111010601010950895830770710 1110010309608758057306455705054251102120Bottom orSide(s)52255220521502100204019851920183517351615 41600152514651400133512751210115010801015 31945189018301770171516551600154514801430 21420134012801200114010651005925865790 112801205114010559909108407606956301352420Bottom orSide(s)52295224021852125207020051925180516701545 41725166016051545146013951340128512301170 31910186518001745168516101545148514351380 21630157515101435136513001245118511301065 11430135512851200112510751015945855800*A filter is required for each return-air inlet. Airflow performance included washable filter media such as contained in factory-authorized accessory filter rack. T o determine airflow performance without this filter, assume an additional 0.1 In. W.C. available external static pressure.-- Indicates unstable operating conditions.441 41 1411 077Specifications subject to change without notice.PRODUCT SPECIFICATIONSGas Furnace: G8MXN & G8MXL8441 41 1411 06Copyright 2014 International Comfort ProductsLewisburg, Tennessee 37091 USAA C C E S S O R I E SP A R T N U M B E R D E S C R I P T I O N04514080701716090211611021201352420N A H B 00501F F E x t e r n a l B o t t o m F i l t e r R a c k , 14 i n c h (14 x 25 i n c h w a s h a b l e f i l t e r i n c l u d e d )XN A H B 00601F F E x t e r n a l B o t t o m F i l t e r R a c k , 17 i n c h (16 x 25 i n c h w a s h a b l e f i l t e r i n c l u d e d )XN A H B 00701F F E x t e r n a l B o t t o m F i l t e r R a c k , 21 i n c h (20 x 25 i n c h w a s h a b l e f i l t e r i n c l u d e d )XXN A H B 00801F F E x t e r n a l B o t t o m F i l t e r R a c k , 24 i n c h (24 x 25 i n c h w a s h a b l e f i l t e r i n c l u d e dXN A H A 00506F B †W a s h a b l e f i l t e r , 1 i n c h 16 x 25 (6 p a c k )XXN A H A 00706F B W a s h a b l e f i l t e r , 1 i n c h 24 x 25 (6 p a c k )XXXN A H A 01001F F S i d e F i l t e r R a c k 16 x 25 (n o t a d j u s t a b l e )XX XXXN A H A 01006F F S i d e F i l t e r R a c k s 16 x 25 (6 p a c k )XX XXXN A H A 01101S B C o m b u s t i b l e F l o o r B a s e (N o t r e q u i r e d w h e n e v a p o r a t o r c o i l c a s e i s u s e d f o r d o w n f l o w )XX XXXN A H B 00301V C D o w n f l o w V e n t G u a r d (N o t r e q u i r e d w h e n v e n t i s r o u t e d t h r o u g h c a b i n e t )XXXXXN A H A 00401D H C h i m n e y A d a p t e r K i t 4−i n . v e n tXXXXN A H A 00301D H C h i m n e y A d a p t e r K i t 5−i n . v e n tXN A H C 00901L P *N a t u r a l −t o −P r o p a n e C o n v e r s i o n K i tXXXXXN A H C 00901N G *P r o p a n e −t o −N a t u r a l C o n v e r s i o n K i tXXXXXN A H B 00301W L W a r n i n g L a b e l K i tXXXXXX A c c e s s o r y a v a i l a b l e †S u i t a b l e f o r s i d e r e t u r n f i l t e r r a c k a n d 17 i n c h e x t e r n a l b o t t o m f i l t e r r a c k .*F a c t o r y a u t h o r i z e d a n d f i e l d i n s t a l l e d . G a s c o n v e r s i o n k i t s a r e C S A r e c o g n i z e d .。

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汇顶科技机密信息
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2
GF66x8 系列指纹识别芯片
1. 概述
GF66x8 系列是一款专门针对移动设备，基于电容检测技术开发而成的触摸式指纹检测芯片。GF66x8 系列表面盖板采用超强硬度的蓝宝石制作，可支持 360 任意方向触摸，以及 508PPI 的高解析度，充分满足消费者方便、耐用和安全的应用需求。根据颜色不同包含 GF6618、GF6628、GT6638、GT6648 四个型号。
3.1 电路框图..................................................................................................................4
3.2 PIN 脚定义.............................................................................................................. 4
用
图 2 SPI 写时序
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乐图3 SPI读时序
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GF66x8 系列指纹识别芯片
符号 1/tc(CK) DuCy(CK) tsu(CS) th(CS) tsu(SI) th(SI)
图4 SPI时序
描述 SPI 时钟频率 SPI 时钟占空比 SPI_CS 建立时间 SPI_CS 保持时间数据输入建立时间数据输入保持时间
8.
今 7.1. 极限电气参数........................................................................................................10
7.2. 推荐工作条件........................................................................................................10 7.3. AC 特性................................................................................................................. 10 7.4. DC 特性................................................................................................................ 10 应用原理图....................................................................................................................... 11
2. 产品特点
触摸式指纹检测 360 度任意方向均可识别，无方向和角度限制蓝宝石盖板，抗刮花能力强，可靠性高不锈钢外环设计，美观耐用 Finger Flash 功能
用
分辨率：508PPI
专 FAR<0.002%；FRR<1%
可靠性：1,500,000 次通信接口：SPI 通信供电：
a) 电源电压 2.8V~3.3V，纹波(Vp-p)<50mV b) 通信电压 1.8V
今 ESD：空气——±15KV；接触——±8KV
GF66 系列产品明细
型号
形状
颜色
GF6618
长形
银色 ring 白色 cover
备注
乐GF6628
GF6638
长形长形
黑色 ring 黑色 cover
金色 ring 白色 cover
最小值
用最大值
单位135
135
60
60
% ns ns ns ns
今
乐
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6
GF66x8 系列指纹识别芯片
4. 5.
用接口与时序.........................................................................................................................5
4.1. SPI 接口时序........................................................................................................... 5 4.2. 上电时序..................................................................................................................7 工作模式............................................................................................................................. 7 5.1. 指纹扫描模式..........................................................................................................7
GF66x8 系列指纹识别芯片
用 GT66x8 系列
指纹识别芯片
Rev. C——2014 年 11 月 4 日
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乐 ====== 免责声明======
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乐 9. 尺寸与规格.......................................................................................................................12 9.1. GF66x8 规格..........................................................................................................12 9.2. 接口 Pin 脚线序.....................................................................................................12 9.3. 连接器规格............................................................................................................12 10. 版本记录...........................................................................................................................13
SPI_MISO SPI_MOSI
GND
今模组电源引脚
IO 通信电平电源，悬空为 1.8V 通讯电平，外接 1.8V ~ AVDD，则通讯电平等于外接电压 SPI 通信主机输入，电平参考 VDDIO SPI 通信主机输出，电平参考 VDDIO 模组电源地与信号地
7
SPI_CK SPI 通信时钟，电平参考 VDDIO
乐8
SPI_CS SPI 通信片选引脚，低电平有效，电平参考 VDDIO
9
RST
复位
10
INT
中断
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GF66x8 系列指纹识别芯片
4. 接口与时序
4.1. SPI 接口时序
GF66x8 系列提供 SPI 接口，仅支持模式 CPOL=0、CPHA=0。由 SPI_MOSI（从机数据输入），SPI_MISO（从机数据输出），SPI_CK（时钟），SPI_CS（片选）与主控进行通信。GF66x8 系列始终作为从设备，所有通信都是由主控发起。
2. 产品特点.............................................................................................................................3
3. 电路框图与 PIN 脚定义.................................................................................................... 4