NXP恩智浦可控硅选型
恩智浦半导体TEA2093TS GreenChip同步整流控制器产品数据手册说明书
GreenChip同步整流控制器第1版——2022年6月7日产品数据手册1 简介TEA2093TS是针对开关电源的新一代同步整流器(SR)控制器IC系列中的一员。
它包含自适应栅极驱动器，以便在任意负载下达到最高效率。
TEA2093TS是一款专门用于非对称半桥反激式和标准反激式转换器次级侧同步整流的控制器IC。
它内置用于驱动SR MOSFET的检测级和驱动器级，对次级变压器绕组的输出进行整流。
TEA2093TS可以为具有低输出电压的电池充电应用或具有高侧整流的应用生成自己的供电电压。
TEA2093TS采用绝缘硅片(SOI)工艺制成。
2 特性和优势2.1 能效特性●自适应栅极驱动器，在任意负载下达到最高效率●空载运行时的典型电源电流低于200 μA2.2 应用特性●在低至0 V的宽输出电压范围内工作●能够处理高达120 V输入电压的漏检测引脚●对低输出电压工作自供电●对不使用辅助绕组的高侧整流自供电●使用标准和逻辑电平SR MOSFET●支持USB BC、USB PD和快充应用●TSOP6封装2.3 控制特性●自适应栅极驱动器，实现导通终止时的快速关闭●带有源栅极下拉的欠压锁定(UVLO)3 应用TEA2093TS适用于反激式电源。
在此类应用中，它可以驱动外部同步整流器MOSFET，这些MOSFET取代用于对变压器次级绕组上的电压进行整流的二极管。
它可用于所有需要高效率的电源，如：●充电器●电源适配器●非对称半桥反激式电源●具有极低和/或可变输出电压的反激式电源4 订购信息表1.订购信息型号封装名称说明版本TEA2093TS/1 TSOP6 塑料小型封装；6引脚SOT4575 标示表2.标记代码型号标记代码TEA2093TS/1 TEA20936 功能框图图1. TEA2093TS 功能框图导通调节关断调节V 和I参考欠压锁定 驱动器供电节能控制使能逻辑关闭7 引脚分布信息7.1 引脚分布图2.TEA2093TS引脚分布(SOT457)7.2 引脚说明表3.引脚说明符号引脚说明CAP 1 内部供电电压的电容输入GND 2 接地XV 3 外部电源输入GATE 4 SR MOSFET的栅极驱动器输出SOURCE 5 SR MOSFET的源极检测输入DRAIN 6 SR MOSFET的漏极检测输入8 功能说明8.1 简介TEA2093TS是一款用于非对称半桥反激式和标准反激式应用中的同步整流(SR)的控制器IC。
恩智浦MIMXRT1060 1064评估板硬件用户指南说明书
NXP Semiconductors Document identifier: MIMXRT10601064EKBHUG User's Guide Rev. 0, 06/2020MIMXRT1060/1064 Evaluation Kit Board Hardware User's GuideContentsChapter 1 Introduction (3)1.1 Board overview (3)1.2 MIMXRT1060/1064 EVK contents (4)1.3 MIMXRT1060/1064 EVK board revision history (4)Chapter 2 Specifications (5)2.1 i.MX RT1060/1064 processor (7)2.2 Boot mode configurations (7)2.3 Power tree (8)2.4 SDRAM memory (11)2.5 SD card slot (11)2.6 Hyper flash (11)2.7 QSPI flash (11)2.8 Ethernet connector (12)2.9 USB PHY connector (12)2.10 Audio input/output connector (12)2.11 OpenSDA circuit (DAP-Link) (12)2.12 JTAG connector (12)2.13 Arduino expansion port (13)2.14 Camera module connector (14)2.15 User interface switch (14)2.16 Sensor (15)2.17 User interface LED indicator (15)2.18 LCD interface (15)Chapter 3 PCB information (16)Chapter 4 EVK design files (17)Chapter 5 EVK contents (18)Chapter 1IntroductionThis document describes MIMXRT1060/1064 Evaluation Kit (EVK) based on the i.MX RT1060/1064 processor from NXP Semiconductor. The document includes system setup, debugging, and provides detailed information on the overall design and usage of the EVK board from a hardware system.1.1Board overviewThis EVK board is a platform designed to showcase the commonly used features of the i.MX RT1060/1064 Processor in a small, low-cost package. The MIMXRT1060/1064 EVK board is an entry level development board that familiarizes the developer to the processor before investing on resources for specific designs.The features of the MIMXRT1060/1064 EVK board are listed in Board features.The features of the MIMXRT1060/1064 EVK board are listed in Table 1.Table 1.Board featuresProcessor NXP Processor MIMXRT1062DVL6AMIMXRT1064DVL6ADRAM Memory SDRAM 256 Mbit, 166 MHz IS42S16160J-6BLIDCDC MPS MP2144GJLDO UNION UM1550S-18UM1750S-00Mass Storage TF Card Slot64 Mbit Quad SPI flash512 Mbit Hyper flashDisplay Interface LCD connectorEthernet10/100 Mbit/s Ethernet connector. PHY chip: KSZ8081RNBUSB USB 2.0 OTG connectorUSB 2.0 host connectorAudio Connector 3.5 mm audio stereo headphone jackBoard-mounted microphoneLeft and right speaker out connectorsS/PDIF interface (unpopulated )Power Connector 5 V DC-jackDebug Connector JTAG 20-pin connector (SWD by default)OpenSDA with DAP-LinkSensor FXOS8700CQ: 6-Axis Ecompass (3-Axis Mag, 3-Axis Accel)(Some boards are unpopulated)Table continues on the next page...IntroductionTable 1.Board features (continued)Camera CMOS sensor interfaceCAN CAN bus connectorUser Interface Button ON/OFF, POR Reset, Reset, USER buttonLED Indicator Power Status, Reset, OpenSDA, USER LEDExpansion Port Arduino interfacePCB 3.937 inch x 5.9055 inch (10 cm x 15 cm), 4-layer board1.2MIMXRT1060/1064 EVK contentsThe MIMXRT1060/1064 EVK contains the following items:•MIMXRT1060/1064 EVK board•USB cable (Micro B)•Camera1.3MIMXRT1060/1064 EVK board revision historyEVK: Mass ProductChapter 2SpecificationsThis section provides detailed information about the electrical design and practical considerations of the EVK board. The document describes each block shown in Block diagram.The document describes each block shown in Figure 1.Figure 1.Block diagramThe overview of the MIMXRT1060 EVK board is shown in Figure 2 and Figure 3.Figure 2.Overview of the MIMXRT1060 EVK board (Front side)Figure 3.Overview of the MIMXRT1060 EVK board (Back side)2.1i.MX RT1060/1064 processorThe i.MX RT1060/1064 is a new processor family featuring NXP advanced implementation of the Arm Cortex-M7 Core. It provides high CPU performance and best real-time response. i.MX RT1060/1064 provides various memory interfaces, including SDRAM, Raw NAND flash, NOR flash, SD/eMMC, Quad SPI, HyperBus, and a wide range of other interfaces for connecting peripherals, such as WLAN, Bluetooth™, GPS, displays, and camera sensors. i.MX RT1060/1064 has rich audio and video features, including LCD display, basic 2D graphics, camera interface, S/PDIF, and I2S audio interface.The i.MX RT1060/1064 applications processor can be used in areas such as industrial HMI, IoT, motor control, and home appliances. The flexibility of the architecture enables it to be used in a wide variety of other general embedded applications too. The i.MX RT processor provides all interfaces necessary to connect peripherals such as WLAN, Bluetooth™, GPS, camera sensors, and multiple displays.The more detail information about i.MX RT1060/1064 can be found in the Datasheet and Reference Manual.2.2Boot mode configurationsThe device has four boot modes (one is reserved for NXP use). The boot mode is selected based on the binary value stored in the internal BOOT_MODE register.Switch (SW7-3 and SW7-4) is used to select the boot mode on the MIMXRT1060/1064 EVK board.Table 2.Boot mode pin settingsBOOT_MODE[1:0] (SW7-3 SW7-4)BOOT TypeTable continues on the next page...Table 2.Boot mode pin settings (continued)00Boot From Fuses 01Serial Downloader 10Internal Boot 11ReservedTypically, the internal boot is selected for normal boot, which is configured by external BOOT_CFG GPIOs. Table 3 shows the typical Boot Mode and Boot Device settings.Table 3.Typical boot mode and boot device settings for RT1060SW7-1SW7-2SW7-3SW7-4Boot Device OFF ON ON OFF Hyper flash OFFOFF ON OFF QSPI flash ONOFFONOFFSD cardFor more information about boot mode configuration, see the System Boot chapter of the MIMXRT1060 Reference Manual .For more information about MIMXRT1060 EVK boot device selection and configuration, see the main board schematic .Table 4.Typical boot mode and boot device settings for RT1064SW7-1SW7-2SW7-3SW7-4Boot Device OFF OFF ON OFF QSPI flash ONOFFONOFFSD card2.3Power treeA DC 5 V external power supply is used to supply the MIMXRT1060/1064 EVK board at J2, and a slide switch SW1 is used to turn the Power ON/OFF. J41 and J9 is used to supply the EVK board.Table 5 lists different J1 jumper settings for different power supply.Table 5.Jumper settings for power supply Power Supply J1 Setting J21-2J93-4J415-6The power tree is shown in the following figure.Figure 4.Power treeThe power control logic of the MIMXRT1060/1064 EVK board is shown in the Figure 5.•SNVS is powered first and then PMIC_REQ_ON is switched on to enable external DC/DC to power up other power domains.•ON/OFF button is used to switch ON/OFF PMIC_REQ_ON to control power modes.•RESET button and WDOG output are used to reset the system power.Figure 5.Power control diagramThe power rails on the board are shown in Table 6.Table 6.Power railsTable continues on the next page...Table 6.Power rails (continued)2.4SDRAM memory256 Mbit, 166 MHz SDRAM (IS42S16160J-6BLI) is used on the EVK board.2.5SD card slotThere is an SD card slot (J39) on the MIMXRT1060/1064 EVK board. J39 is the Micro SD slot for USDHC1 interface. To boot from the SD card, the boot device switch (SW7) settings should be: ON, OFF, ON, OFF, as shown in Typical boot mode and boot device settings.2.6Hyper flashOn the MIMXRT1060/1064 EVK board, there is one 512 Mbit hyper flash device. To boot from the Hyper Flash, the boot device switch (SW7) settings should be: OFF, ON, ON, OFF, as shown in Table 3. By default, this hyper flash is disabled on the EVK. To enable the onboard hyper flash, update the following settings.1.Weld resistors: R356, R361 - R366.2.Removed 0Ωresistors: R153 - R158.The boot from hyper flash only supports RT1060.2.7QSPI flashA 64 Mbit QSPI flash is used on the MIMXRT1060/1064 EVK board. If the developer wants to boot from the QSPI flash, the boot device switch (SW7) settings should be: OFF, OFF, ON, OFF, as shown in Table 3. The QSPI flash is the default onboard flash.The boot from QSPI flash only supports RT1060.2.8Ethernet connectorThere are two Ethernet Mac controllers in the MIMXRT1060/1064 processor. The Ethernet subsystem of the MIMXRT1060/1064 EVK board is provided by the KSZ8081RNB 10/100 M Ethernet Transceiver (U16) and an RJ45 (J19) with integrated magnetic.2.9USB PHY connectorMIMXRT1060/1064 contains two integrated USB 2.0 PHYs capable of connecting USB host/device systems at:•USB low-speed (LS) rate of 1.5 Mbits/s•USB full-speed (FS) rate of 12 Mbits/s•USB 2.0 high-speed (HS) rate of 480 Mbits/s2.10Audio input/output connectorThe audio codec used on the MIMXRT1060/1064 EVK board is Wolfson’s low power, high-quality stereo codec, WM8960. The MIMXRT1060/1064 EVK board includes:•one headphone interface (J12)•one onboard MIC (P1)•two speaker interfaces (J16, J17)•S/PDIF interface (J14 and J18, DNP).J12 is a 3.5 mm audio-stereo headphone jack, which supports jack detect.2.11OpenSDA circuit (DAP-Link)The OpenSDA circuit (CMSIS–DAP) is an open-standard serial and debug adapter. It bridges serial and debug communications between a USB host and an embedded target processor.CMSIS-DAP features a mass storage device (MSD) bootloader, which provides a quick and easy mechanism for loading different CMSIS-DAP applications such as flash programmers, run-control debug interfaces, serial-to-USB converters, and more.Two or more CMSIS-DAP applications can run simultaneously. For example, run-control debug application and serial-to-USB converter run in parallel to provide a virtual COM communication interface while allowing code debugging via CMSIS-DAP with single USB connection.For the MIMXRT1060/1064 EVK board, J41 is the connector between the USB host and the RT1060/1064. To update the Open SDA firmaware, press the SW8 and Power on the board. There is a disk named "MAINTENANCE". Drag/drop the new firmware to the "MAINTENANCE" and re-power the board. The firmware is updated.2.12JTAG connectorJ21 is a standard 20-pin/2.54 mm box header connector JTAG. The pin definitions are shown in Figure 6. It supports SWD by default.Figure 6.JTAG pin definitions2.13Arduino expansion portJ22 – J25 is defined as Arduino interface. Table 7 lists the pin definitions of Arduino interface. Table 7.Arduino Interface pin definitionsJ22J23UART_RX/D0A0/ADC0UART_TX/D1A1/ADC1D2/INT0A2/ADC2D3/INT1/PWM/OC2B A3/ADC3D4/T0/XCK A4/ADC4/SDAD5/TI/PWM A5/ADC5/SCLD6/AIN0/PWM/OC0AD7/AIN1/PWMJ24J25D8/CLKO/ICP1NCD9/OC1A/PWM IOREFD10/SPI_CS RESETD11/OC2A/PWM/SPI_MOSI 3.3 VD12/SPI_MISO 5 VD13/SPI_CLK GNDGND GNDAREFD14/I2C_SDAD15/I2C_SCL2.14Camera module connectori.MX RT1060/1064 supports one parallel CSI (Camera Sensor Interface). There is a camera module connector (J35) on the MIMXRT1060/1064 EVK board. The CA031C based on OV7725 and CA111C based on MT9M114 are used directly.J35 supports both MT9M114 and OV7725 camera module, but 3.3 V is a violation to MT9M114 spec 3.1 V. Itproved fine for evaluation/demo with 3.3 V supply, but in product design, it is recommended to adjust DCDC outputor add level shifter.2.15User interface switchThere are four user interface switches on the MIMXRT1060/1064 EVK board.•Power switch•ON/OFF button•Reset button•USER button2.15.1Power switchSW1 is a slide switch to control the power of the MIMXRT1060/1064 EVK board when the power supply is from J2.•Sliding the switch to the ON position connects the 5 V power supply to the evaluation board main power system.•Sliding the switch to the OFF position immediately removes all power from the board.2.15.2ON/OFF buttonSW2 is the ON/OFF button for MIMXRT1060/1064 EVK board. A short pressing in OFF mode causes the internal power management state machine to change state to ON. In ON mode, a short pressing generates an interrupt as a software-controllable power-down. An approximate 5 seconds or more pressing causes a forced OFF. However, you can disconnect both the boot mode inputs.2.15.3Reset buttonThere are two Reset buttons on the EVK board. SW3 is the power-on reset button. Pressing SW3 in the power on state forces to reset the system power except SNVS domain. The processor immediately turns off and reinitiates a boot cycle from the processor power off state. SW9 is a reset button.2.15.4USER buttonSW8 is a USER button (GPIO5-00). Pressing the USER button can produce changes in high and low levels.2.16SensorU32 on the EVK board is a 6-Axis Ecompass (3-Axis Mag, 3-Axis Accel) sensor FXOS8700CQ. The Ecompass is connected to i.MX RT1060/1064 I2C1 port.The sensor is not populated on some boards.2.17User interface LED indicatorThere are four LED status indicators on the EVK board.The functions of these LEDs include:•Main Power Supply (D3)—Green: DC 5 V main supply is normal.—Red: J2 input voltage is over 5.6 V.—Off: Board is not powered.•Reset RED LED (D21)•OpenSDA LED (D20)•USER LED (D18)2.18LCD interfaceThe enhanced Liquid Crystal Display Interface (eLCDIF) is a general-purpose display controller.The eLCDIF block supports the following:•Displays that support moving pictures and require the RGB interface mode (DOTCLK interface).The eLCDIF provides fully programmable functionality to supported interfaces:•Bus master interface to source frame buffer data for display refresh.•8/16/18/24/32 bit LCD data bus support available depending on I/O MUX options.•Programmable timing and parameters for DOTCLK LCD interfaces.To use the LCD, NXP provides an optional LCD module RK043FN02H-CT. RK043FN02H-CT has a 4.3 inches touch screen and supports a resolution of up to 480*3(RGB)*272. This module contains two FPC cables. The LCD interface is connected to J8 (A1-A40) and the CPT interface can be connected to J8 (B1-B6). You can purchase LCD modules from .PCB informationThe MIMXRT1060/1064 EVK board is uses the standard 4-layer technology. The material used is FR-4. The PCB stack-up information is shown in Table 8.Table 8.Board stack-up informationEVK design filesYou can download, the schematics, layout files, and gerber files (including Silkscreen) from /MIMXRT1060-EVK.EVK contentsThe following table lists the contents on the evaluation kit.Table 9.EVK contentsItem DescriptionEVK board EVK board with processor, memory, interfaces and so on. USB cable USB cable (Micro-B to Standard-A).Camera CA111C based on MT9M114.Power adapter, micro-SD card, and LCD module are not standard parts of the evaluation kit.How To Reach Us Home Page: Web Support: /support Information in this document is provided solely to enable system and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein.NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer's technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: / SalesTermsandConditions.While NXP has implemented advanced security features, all products may be subject to unidentified vulnerabilities. Customers are responsible for the design and operation of their applications and products to reduce the effect of these vulnerabilities on customer’s applications and products, and NXP accepts no liability for any vulnerability that is discovered. Customers should implement appropriate design and operating safeguards to minimize the risks associated with their applications and products.NXP, the NXP logo, NXP SECURE CONNECTIONS FOR A SMARTER WORLD, COOLFLUX, EMBRACE, GREENCHIP, HITAG, I2C BUS, ICODE, JCOP, LIFE VIBES, MIFARE, MIFARE CLASSIC, MIFARE DESFire, MIFARE PLUS, MIFARE FLEX, MANTIS, MIFARE ULTRALIGHT, MIFARE4MOBILE, MIGLO, NTAG, ROADLINK, SMARTLX, SMARTMX, STARPLUG, TOPFET, TRENCHMOS, UCODE, Freescale, the Freescale logo, AltiVec, C‑5, CodeTEST, CodeWarrior, ColdFire, ColdFire+, C‑Ware, the Energy Efficient Solutions logo, Kinetis, Layerscape, MagniV, mobileGT, PEG, PowerQUICC, Processor Expert, QorIQ, QorIQ Qonverge, Ready Play, SafeAssure, the SafeAssure logo, StarCore, Symphony, VortiQa, Vybrid, Airfast, BeeKit, BeeStack, CoreNet, Flexis, MXC, Platform in a Package, QUICC Engine, SMARTMOS, Tower, TurboLink, and UMEMS are trademarks of NXP B.V. All other product or service names are the property of their respective owners. AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle, Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore, Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-PLUS, ULINKpro, µVision, Versatile are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. The related technology may be protected by any or all of patents, copyrights, designs and trade secrets. All rights reserved. Oracle and Java are registered trademarks of Oracle and/or its affiliates. The Power Architecture and word marks and the Power and logos and related marks are trademarks and service marks licensed by .© NXP B.V. 2020.All rights reserved.For more information, please visit: Forsalesofficeaddresses,pleasesendanemailto:**********************Date of release: 06/2020Document identifier: MIMXRT10601064EKBHUG。
NXP选型指南
功能特性:
● ARM Cortex-M0处理器 ◎ 工作频率：50MHz ◎ 嵌套向量中断控制器 ◎ 唤醒中断控制器，支持优先中断自动唤醒 ◎ 具有三种低功耗模式：睡眠、深度睡眠和深度掉电
● 内存 ◎ 高达32KB片内Flash程序存储器 ◎ 高达8KB片内SRAM存储器
● 串行外设 ◎ UART，支持小数分频波特率产生、内部FIFO和RS-485 ◎ SPI控制器，支持FIFO和多协议功能 ◎ I2C总线接口，支持全速I2C总线规范和增强型快速模式，数 据速率高达1Mbit/s，支持多地址识别和监控模式 ◎ CAN控制器(LPC11C12/C14/C22/C24支持)，内部ROM集成 供CAN和CANOpen标准使用的初始化和通信的API函数， 用户可直接调用；兼容CAN2.0A/B，传输速率高达1Mbit/s ◎ 集成片上高速CAN收发器（仅LPC11C22/C24支持）
● 模拟外设 ◎ 8通道10位ADC，10位转换时间≥2.44μs
芯片特色:
Cortex-M0处理器性能 ● Cortex-M0微控制器可以轻松超越高端8位和16位器件的
性能水平； ● 内核额定性能为0.9DMIPS/MHz，相当于与其最接近的8位
和16位竞争产品的2至4倍。
5-02
● 其他外设 ◎ 最高42个通用高速I/O管脚，具有可配置的上拉/下拉电阻和可配 置的新型开漏工作模式 ◎ 1个引脚(P0.7)支持20mA高驱动电流 ◎ 四个通用定时器/计数器 ◎ 可编程的看门狗定时器(WDT)，带锁死功能 ◎ 系统节拍定时器 ◎ 各外功耗
● 功耗低至130μA/MHz； ● 对于同一应用，相对于8位和16位微控制器，Cortex-M0微控制器可
以将功耗减少一半或四分之一，能够以更快的速度完成任务，可在电 池模式下运行更长时间； ● Cortex-M0微控制器具有三种低功耗模式； - Sleep(睡眠)； - Deep sleep(深度睡眠)； - Deep Power Down(深度掉电)。 ● ROM内置功率配置文件(仅限LPC11xx/x02器件)，旨在保证芯片应用 性能的前提下，将有效功耗减少到合适值。
恩智浦半导体i.MX RT1060处理器数据手册说明书
恩智浦半导体数据手册：技术数据文件编号：IMXRT1060IEC第0.1版，2019年4月恩智浦保留根据需要更改生产规格细节的权利，以改进其产品设计。
MIMXRT1061CVL5AMIMXRT1061CVJ5AMIMXRT1062CVL5AMIMXRT1062CVJ5A适用于工业产品的i.MXRT1060跨界处理器封装信息塑料封装196引脚MAPBGA，10 x 10 mm，0.65 mm间距196引脚MAPBGA，12 x 12 mm，0.8 mm间距订购信息参见第6页上的表11 i.MX RT1060简介i.MX RT1060处理器属于全新的处理器系列，采用恩智浦先进的Arm®Cortex®-M7内核，运行速度高达528 MHz，可提供高CPU性能和实时响应。
i.MX RT1060处理器配备1 MB片内RAM。
其中的512 KB可以灵活配置为TCM或通用片内RAM，而另外的512 KB则是通用片内RAM。
i.MX RT1060集成了先进的电源管理模块、DCDC和LDO，可降低外部电源的复杂性并简化上下电序列。
i.MXRT1060还提供各类存储器接口，包括SDRAM、RAW NAND、闪存、NOR闪存、SD/eMMC、四通道SPI；以及各类外设连接接口，包括WLAN、Bluetooth™、GPS、显示器和摄像头传感器。
i.MXRT1060还提供丰富的音频和视频功能，包括LCD显示器、基本2D图形、摄像头接口、SPDIF和I2S音频接口。
i.MX RT1060配备模拟接口，例如ADC、ACMP和TSC。
1. i.MX RT1060简介 (1)1.1. 特性 (2)1.2. 订购信息 (6)2. 架构概述 (9)2.1. 功能框图 (9)3. 模块列表 (10)3.1. 特殊信号考量 (17)3.2. 未使用模拟接口的推荐连接 (18)4. 电气特性 (20)4.1. 芯片级条件 (20)4.2. 系统电源和时钟 (27)4.3. I/O参数 (32)4.4. 系统模块 (38)4.5. 外部存储器接口 (43)4.6. 显示和图形 (53)4.7. 音频 (56)4.8. 模拟 (59)4.9. 通信接口 (66)4.10. 定时器 (79)5. 启动模式配置 (81)5.1. 启动模式配置引脚 (81)5.2. 启动设备接口分配 (81)6. 封装信息和触点分配 (86)6.1. 10 x 10 mm封装信息 (86)6.2. 12 x 12 mm封装信息 (98)7. 修订记录 (110)i.MX RT1060简介i.MX RT1060特别适合以下应用：•工业人机界面(HMI)•电机控制•家用电器1.1 特性i.MX RT1060处理器基于Arm Cortex-M7 MPCore™平台，具有以下功能：•支持具有以下特性的单个Arm Cortex-M7 MP内核：−32 KB L1指令缓存−32 KB L1数据缓存−全功能浮点单元(FPU)，支持VFPv5架构−支持Armv7-M Thumb指令集•集成MPU，最多16个独立保护区域•紧密耦合的GPIO，工作频率与Arm相同•I-TCM和D-TCM总共达512 KB•频率为528 MHz•集成Cortex M7 CoreSight™组件用于调试•内核频率请参见22页的表10“工作范围”。
可控硅电路选型分析
一、可控硅半导体结构及其工作原理：以单向可控硅为例晶闸管(Thyristor)又叫可控硅T在工作过程中，它的阳极A和阴极K与电源和负载连接，组成晶闸管的主电路，晶闸管的门极G和阴极K与控制晶闸管的装置连接，组成晶闸管的控制电路。
晶闸管的工作条件：1. 晶闸管承受反向阳极电压时，不管门极承受和种电压，晶闸管都处于关短状态。
2. 晶闸管承受正向阳极电压时，仅在门极承受正向电压的情况下晶闸管才导通。
3. 晶闸管在导通情况下，只要有一定的正向阳极电压，不论门极电压如何，晶闸管保持导通，即晶闸管导通后，门极失去作用。
4. 晶闸管在导通情况下，当主回路电压（或电流）减小到接近于零时，晶闸管关断。
晶闸管是四层三端器件，它有J1、J2、J3三个PN结图1，可以把它中间的NP分成两部分，构成一个PNP型三极管和一个NPN型三极管的复合管图2当晶闸管承受正向阳极电压时，为使晶闸管导铜，必须使承受反向电压的PN结J2失去阻挡作用。
图2中每个晶体管的集电极电流同时就是另一个晶体管的基极电流。
因此，两个互相复合的晶体管电路，当有足够的门机电流Ig流入时，就会形成强烈的正反馈，造成两晶体管饱和导通，晶体管饱和导通。
设PNP管和NPN管的集电极电流相应为Ic1和Ic2；发射极电流相应为Ia和Ik；电流放大系数相应为a1=Ic1/Ia和a2=Ic2/Ik，设流过J2结的反相漏电电流为Ic0,晶闸管的阳极电流等于两管的集电极电流和漏电流的总和：Ia=Ic1+Ic2+Ic0 或Ia=a1Ia+a2Ik+Ic0若门极电流为Ig,则晶闸管阴极电流为Ik=Ia+Ig从而可以得出晶闸管阳极电流为：I=(Ic0+Iga2)/（1-（a1+a2））（1—1）式硅PNP管和硅NPN管相应的电流放大系数a1和a2随其发射极电流的改变而急剧变化如图3所示。
当晶闸管承受正向阳极电压，而门极未受电压的情况下，式（1—1）中，Ig=0,(a1+a2)很小，故晶闸管的阳极电流Ia≈Ic0 晶闸关处于正向阻断状态。
Z0107MN,135中文资料(nxp)中文数据手册「EasyDatasheet - 矽搜」
0.4
0
0
0.4
0.8
1.2
IT(RMS) (A)
=导通角
图 1.最大导通状态功耗为 通态电流有效值功能 ;典型值 .
10 ITSM
(A) 8
6
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2
0
1
10
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n
周期在f = 50赫兹N =数
图 2.最大允许非重复性峰值通态电流为周期正 弦电流数函数 ;典型值 .
10 ITSM (A)
10
IT/δt limit
断态泄漏电流
崛起临界率 断态电压
Z0103MA/MN/NA/NN Z0107MA/MN/NA/NN Z0109MA/MN/NA/NN
变化临界速度 整流电压
Z0103MA/MN/NA/NN Z0107MA/MN/NA/NN Z0109MA/MN/NA/NN
条件
VD = 12 V; R L = 30 ; T2+ G+; T2+ G−; T2− G−; 图9
芯片中文手册,看全文,戳
Z0103/07/09系列
双向可控硅
修订02 - 2002年9月12日
产品数据
1.产品简介
1.1简介
钝化三端双向可控硅在常规和表面安装封装.在需要高双向瞬态和阻断电压能力应 用程序供使用. 可在一个范围内栅电流灵敏度,以获得最佳性能.
产品可用性：
Z0103MA; Z0103NA; Z0107MA; Z0107NA; Z0109MA; Z0109NA在SOT54B Z0103MN; Z0103NN; Z0107MN; Z0107NN; Z0109MN; Z0109NN在SOT223.
j = 25 °C 前激增;
可控硅选型方法晶闸管选型方法
可控硅选型方法晶闸管选型方法
1．选择晶闸管的类型：晶闸管有多种类型，应根据应用电路的具体要求合理选用。
若用于交直流电压控制、可控整流、交流调压、逆变电源、开关电源保护电路等，可选用普通晶闸管。
若用于交流开关、交流调压、交流电动机线性调速、灯具线性调光及固态继电器、固态接触器等电路中，应选用双向晶闸管。
若用于交流电动机变频调速、斩波器、逆变电源及各种电子开关电路等，可选用门极关断晶闸管。
若用于锯齿波生发器、长时间延时器、过电压保护器及大功率晶体管触发电路等，可选用 BTG 晶闸管。
若用于电磁灶、电子镇流器、超声波电路、超导磁能储存系统及开关电源等电路，可选用逆导晶闸管。
若用于光电耦合器、光探测器、光报警器、光计数器、光电逻辑电路及自动生产线的运行监控电路，可选用光控晶闸管 2．选择晶闸管的主要参数晶闸管的主要参数应根据应用电路的具体要求而定。
所选晶闸管应留有一定的功率裕量，其额定峰值电压和额定电流（通态平均电流）均应高于受控电路的最大工作电压和最大工作电流 1.5~2 倍。
晶闸管的正向压降、门极触发电流及触发电压等参数应符合应用电路（指门极的控制电路）的各顶要求，不能偏高或偏低，否则会影响晶闸管的正常工作。
可控硅型号与参数表
可控硅型号与参数表描述一．可控硅简介可控硅是一种大功率电器元件，也称晶闸管。
它具有体积小、效率高、寿命长等优点。
在自动控制系统中，可作为大功率驱动器件，实现用小功率控件控制大功率设备。
它在交直流电机调速系统、调功系统及随动系统中得到了广泛的应用。
可控硅图结构、外形和图形符可控硅的三个电极分别叫阳极（A）、阴极（K）和控制极（G）。
当器件的阳极接负电位（相对阴极而言）时，从符号图上可以看出PN 结处于反向，具有类似二极管的反向特性。
当器件的阳极上加正电位时（若控制极不接任何电压），在一定的电压范围内，器件仍处于阻抗很高的关闭状态。
但当正电压大于某个电压（称为转折电压）时，器件迅速转变到低阻通导状态。
加在可控硅阳极和阴极间的电压低于转折电压时，器件处于关闭状态。
此时如果在控制极上加有适当大小的正电压（对阴极），则可控硅可迅速被激发而变为导通状态。
可控硅一旦导通，控制极便失去其控制作用。
就是说，导通后撤去栅极电压可控硅仍导通，只有使器件中的电流减到低于某个数值或阴极与阳极之间电压减小到零或负值时，器件才可恢复到关闭状态。
图3-30是可控硅的伏安特性曲线。
图中曲线I为正向阻断特性。
无控制极信号时，可控硅正向导通电压为正向转折电压（UB0）；当有控制极信号时，正向转折电压会下降（即可以在较低正向电压下导通），转折电压随控制极电流的增大而减小。
当控制极电流大到一定程度时，就不再出现正向阻断状态了。
曲线Ⅱ为导通工作特性。
可控硅导通后内阻很小，管子本身压降很低，外加电压几乎全部降在外电路负载上，并流过比较大的负载电流，特性曲线与二极管正向导通特性相似。
若阳极电压减小（或负载电阻增加），致使阳极电流小于维持电流IH时，可控硅从导通状态立即转为正向阻断状态，回到曲线I状态。
曲线Ⅲ为反向阻断特性。
当器件的阳极加以反向电压时，尽管电压较高，但可控硅不会导通（只有很小的漏电流）。
只有反向电压达到击穿电压时，电流才突然增大，若不加限制器件就会烧毁。
可控硅输出光电耦合器选型参数表
可控硅输出光电耦合器选型参数表60.6A0.9A9A 1.2AAQ-H 可控硅输出光电耦合器可控硅光耦过零非过零0.6A 型0.3A 型过零非过零过零非过零过零非过零商品名称方式类型0.9A 型 1.2A 型2.1pF （typ ）输入/输出间容量50G Ω以上输入/输出间绝缘电阻3.96.49.783.66.49.78DIP 8脚600V10mA 以下50V 以下−50V 以下−50V 以下−0.1ms 以下2.5V 以下5,000V AC −30℃〜＋85℃0.3A输出端实效导通电流2A −1.5A −1A −0.9A −0.8A −0.7A −0.6A −0.5A −100μA 以下重复峰值关闭电流重复峰值关闭电压导通电压3A 6A12A浪涌导通电流LED 触发电流动作时间备注过零电压耐电压使用环境温度−40℃〜＋125℃保存温度AQH0213AQH0223AQH1213AQH1223AQH3213AQH3223AQH2213AQH2223订购产品号50V 以下−标准P/C 板端子表面安装端子TOP VIEW50mA 6V 1A1.3V 以下(I F =20mA 时)输入端最大允许LED 电流LED 反向电压正向峰值电流LED 压降UL 、C-UL 、VDE0.56g −管装包装、盘装包装目录记载页P.40国外标准质量(重量)(约)选件7.627.626.42.542.548.31.91.52.542.542.54外形尺寸高度包括支架尺寸单位mm端子排列和印刷电路板加工图(BOTTOM VIEW )7可控硅输出光电耦合器选型参数表可控硅光耦4.3g2.7g4.3g2.7g商品名称方式类型A CD C输入端输出端安装方式最大允许负载电流20A −15A −10A −8A −5A −3A −2A −1A −负载电压漏电流浪涌导通电流额定操作电压(DC )输入阻抗(约)动作电压复位电压动作时间复位时间耐电压使用环境温度内置缓冲电路工作指示灯PC 板插入式面板安装端子排列和板料加工图(BOTTOM VIEW )国外标准质量(重量)(约)选件备注 4.524.520.54.524.513.52A 型非过零1A 型2A1A30A8A19.2〜28.8V 1.6k Ω19.2V 以下9.6〜14.4V 0.8k Ω9.6V 以下4〜6V 0.3k Ω4V 以下1ms 以下19.2〜28.8V 1.6k Ω19.2V 以下9.6〜14.4V 0.8k Ω9.6V 以下4〜6V 0.3k Ω4V 以下AQ-G 可控硅输出光电耦合器2A 型过零1A 型−75〜264V AC2A1AUL 、C-UL 、VDE插座※−−−−1.5mA 以下30A8A19.2〜28.8V 1.6k Ω19.2V 以下9.6〜14.4V 0.8k Ω9.6V 以下4〜6V0.3k Ω4V 以下19.2〜28.8V 1.6k Ω19.2V 以下9.6〜14.4V 0.8k Ω9.6V 以下4〜6V 0.3k Ω4V 以下1V 以上3,000V AC ●●−30℃〜＋80℃ 周期＋1ms 以下12/ 周期＋1ms 以下12/2.5410.167.621.24.524.520.54.524.513.5外形尺寸高度包括支架尺寸单位mm8可控硅输出光电耦合器选型参数表商品名称方式类型输入端输出端安装方式最大允许负载电流负载电压漏电流浪涌导通电流额定操作电压(DC )输入阻抗(约)动作电压复位电压动作时间复位时间耐电压使用环境温度内置缓冲电路工作指示灯PC 板插入式面板安装端子排列和板料加工图(BOTTOM VIEW )国外标准质量(重量)(约)选件备注外形尺寸高度包括支架尺寸单位mm窄长型扁平型A CD C20A-15A-10A-8A-5A-3A-2A-1A-过零※13A 型—3A5mA 以下80A4〜32V —4V 以下1.0V 以上输入和输出间：4,000V AC 输入/输出和接地间：2,500VAC10A 型75〜250V—(要散热器)10A100A●—●——26g 散热器有非过零型 周期＋1ms 以下12/ 周期＋1ms 以下12/4- 1.225.412.75.087.622- 3.54- 1.225.45.087.6212344- 1.225.410.1612.7202012.79.11026331225335426窄长型AQ1可控硅输出光电耦合器光电晶体管、可控硅光耦1A (DC 输出)型—10〜200V 1A—2A (DC 输出)型3〜60V 2A1mA 以下5A (1sec.)3〜28V 1.6k Ω3V 以下0.8V 以上0.5ms 以下2ms 以下3,000V AC −30℃〜＋80℃−30℃〜＋80℃——●——19g —19g ——4- 1.425.412.75.087.62102633102633UL 、CSA 、※TUVUL 、C-UL 、VDE..9可控硅输出光电耦合器选型参数表商品名称方式类型输入端输出端安装方式最大允许负载电流负载电压漏电流浪涌导通电流额定操作电压(DC )输入阻抗(约)动作电压复位电压动作时间复位时间耐电压使用环境温度内置缓冲电路工作指示灯PC 板插入式面板安装端子排列和板料加工图(BOTTOM VIEW )国外标准质量(重量)(约)选件备注外形尺寸高度包括支架尺寸单位mm非过零3A 型2A 型3A 型75〜125V 75〜250V75〜125V 75〜250V75〜125V 75〜250V———3A3A2A5mA 以下5mA 以下5mA 以下80A30A80A 4〜6V 4〜6V 4〜6V 0.18k Ω0.3k Ω0.3k Ω4V 以下4V 以下4V 以下0.5V 以上0.5V 以上0.5V 以上1ms 以下9.8g6.8g9.8g9.6〜14.4V 21.6〜26.4V 1.2V 以上2.4V 以上1.2V 以下2.4V 以下1.2V 以上2.4V 以上1.2V 以上2.4V 以上9.6〜14.4V 21.6〜26.4V 9.6〜14.4V 21.6〜26.4V 9.6〜14.4V 21.6〜26.4V 0.55k Ω 1.4k Ω9.6V 以下21.6V 以下0.55k Ω9.6V 以下21.6V 以下0.8k Ω 1.8k Ω9.6V 以下21.6V 以下0.8k Ω 1.8k Ω9.6V 以下21.6V 以下A CD C20A-15A-10A-8A-5A-3A-2A-1A-AQ8可控硅输出光电耦合器可控硅光耦过零2A 型75〜125V 75〜250V—2A5mA 以下30A4〜6V 0.18k Ω4V 以下0.5V 以上3,000V AC −30℃〜＋80℃●—●——UL 、CSA 、※TUV6.8g—— 周期＋1ms 以下12/ 周期＋1ms 以下12/7.62432112.7（30.48）4-0.810.165.08432112.7（27.94）4-0.8输入端子间5.08mm10.16输入端子间7.62mm924459324392445932431.4k Ω..10可控硅输出光电耦合器选型参数表商品名称方式类型输入端输出端安装方式最大允许负载电流负载电压漏电流浪涌导通电流额定操作电压(DC )输入阻抗(约)动作电压复位电压动作时间复位时间耐电压使用环境温度内置缓冲电路工作指示灯PC 板插入式面板安装端子排列和板料加工图(BOTTOM VIEW )国外标准质量(重量)(约)选件备注外形尺寸高度包括支架尺寸单位mmAQ-F 可控硅输出光电耦合器光电晶体管过零2A (AC 输出)型3A (AC 输出)型75〜250V 3〜28V 1.6k Ω3V 以下5mA 以下80A5mA 以下80A0.8V 以上2,000V AC ●−−●−＋周期1ms 以下12/＋周期1ms 以下12/2A3A35.22127.4A CD C４０A −25A −20A −15A −10A −5A −２A −１A −−UL 、CSA 32g HC 端子台、插座−1mA 以下6A2A (DC 输出)型3A (DC 输出)型3〜60V −3〜28V 1.6k Ω3V 以下1mA 以下2A3A5A0.8V 以上2,000V AC −−−●−0.5ms 以下2ms 以下35.22127.4−75〜264V172838AQ-J 可控硅输出光电耦合器可控硅光耦过零※ 15A 型10A 型25A 型−5mA 以下10A(要散热器)(要散热器)100A10〜18V 18〜28V 4〜6V 0.26k Ω4V 以下0.8k Ω10V 以下30g带输入逆连接保护功能、有非过零型1.6k Ω18V 以下4V 以下10V 以下18V 以下4V 以下10V 以下18V 以下10〜18V 18〜28V 4〜6V 0.26k Ω0.8k Ω1.6k Ω10〜18V 18〜28V 4〜6V 0.26k Ω0.8k Ω1.6k Ω5mA 以下150A5mA 以下250A1V 以上输入和输出间：3,000V AC 、输入/输出和接地间：2,500V AC●−−−●周期＋1ms 以下12/周期＋1ms 以下12/15A(要散热器)25A散热器、DIN 导轨安装板UL 、C-UL 、TUV输入端子：＃110插片输出端子：＃250插片−30℃〜＋80℃−30℃〜＋80℃−30℃〜＋80℃..11可控硅输出光电耦合器选型参数表商品名称方式类型输入端输出端安装方式最大允许负载电流负载电压漏电流浪涌导通电流额定操作电压(DC )输入阻抗(约)动作电压复位电压动作时间复位时间耐电压使用环境温度内置缓冲电路工作指示灯PC 板插入式面板安装端子排列和板料加工图(BOTTOM VIEW )国外标准质量(重量)(约)选件备注外形尺寸高度包括支架尺寸单位mm过零※AQ-J 可控硅输出光电耦合器可控硅光耦−−散热器一体型、有非过零型250g280g●(可用DIN 导轨进行安装)75〜264V5mA 以下100A250A100A 250A 1V 以上输入和输出间：3,000V AC 、输出和接地间：2,500V AC●−−−1ms 周期＋以下12/1ms 周期＋以下12/10A15A10A20AA CD C40A −25A −20A −15A −10A −5A −2A −1A −10A 型(输出构成：1a )20A 型(输出构成：1a )输入端子:＃110插片输出端子:＃250插片10A 型(输出构成：1a×2)15A 型(输出构成：1a×2)4〜6V 0.26k Ω4V 以下10〜18V 0.8k Ω10V 以下18〜28V 1.6k Ω18V 以下4〜6V 0.26k Ω4V 以下10〜18V 0.8k Ω10V 以下18〜28V 18V 以下4〜6V0.26k Ω4V 以下10〜18V 0.8k Ω10V 以下18〜28V 18V 以下4〜6V 0.26k Ω4V 以下10〜18V 0.8k Ω10V 以下18〜28V 1.6k Ω18V 以下−2- 4.6或M490±0.2611328100113281001.6k Ω 1.6k Ω−30℃〜＋80℃输入端子:＃110插片输出端子:＃250插片12可控硅输出光电耦合器选型参数表商品名称方式类型输入端输出端安装方式最大允许负载电流负载电压漏电流浪涌导通电流额定操作电压(DC )输入阻抗(约)动作电压复位电压动作时间复位时间耐电压使用环境温度内置缓冲电路工作指示灯PC 板插入式面板安装端子排列和板料加工图(BOTTOM VIEW )国外标准质量(重量)(约)选件备注外形尺寸高度包括支架尺寸单位mm过零非过零AQ-A 可控硅输出光电耦合器可控硅光耦——70g●●75〜250V10mA 以下400A150A4〜32V 250A 1V 以上4V 以下—输入和输出间：4,000V AC 、输入/输出和接地间：2,500V AC●(LED 指示灯型)—— 周期＋1ms 以下12/ 周期＋1ms 以下12/40A15A25AA CD C40A −25A −20A −15A −10A −5A −2A −1A −15A 型25A 型40A 型—新−20℃〜＋85℃散热器、DIN 安装板25.5405813可控硅输出光电耦合器选型参数表UL 、C-UL 、※TUV商品名称方式类型输入端输出端安装方式最大允许负载电流负载电压漏电流浪涌导通电流额定操作电压(DC )输入阻抗(约)动作电压复位电压动作时间复位时间耐电压使用环境温度内置缓冲电路工作指示灯PC 板插入式面板安装端子排列和板料加工图(BOTTOM VIEW )国外标准质量(重量)(约)选件备注外形尺寸高度包括支架尺寸单位mmAQ-K 可控硅输出光电耦合器可控硅光耦过零−4.5V 以下−−1002210225A 型15A 型75〜250V4.5〜30V9mA 以下/施加200V150A250A1V 以上2,500V AC/4,000V AC 周期＋1ms 以下12/ 周期＋1ms 以下12/15A25A−215g●●−−●(可用DIN 导轨安装)90.010.8A CD C40A −25A −20A −15A −10A −5A −2A −1A −−30℃〜＋80℃..14可控硅输出光电耦合器选型参数表商品名称方式类型输入端输出端安装方式最大允许负载电流负载电压漏电流浪涌导通电流额定操作电压(DC )输入阻抗(约)动作电压复位电压动作时间复位时间耐电压使用环境温度内置缓冲电路工作指示灯PC 板插入式面板安装端子排列和板料加工图(BOTTOM VIEW )国外标准质量(重量)(约)选件备注外形尺寸高度包括支架尺寸单位mmAQ-C 可控硅输出光电耦合器光电晶体管──DC 输入型−1V 以上2,500V AC —0.5ms 以下AC 输入型4〜32V −−−−10V AC 以上20ms 以下20ms 以下80V AC 以下3V 以下25mA25mA5μA 以下12.8102012.820109.6〜14.4V21.6〜26.4V9.6〜14.4V 21.6〜26.4V9.6〜14.4V 21.6〜26.4V1.2k Ω2.8k Ω9.6V 以下21.6V 以下0.8k Ω 1.8k Ω9.6V 以下21.6V 以下1.2V 以上 2.4V 以上1.2V 以上2.4V 以上9.6V 以下21.6V 以下0.8k Ω 1.8k ΩA CD C20A-15A-10A-8A-5A-3A-2A-1A-可控硅光耦过零1A (AC 输出)型75〜125V 75〜250V—1A1.1mA 以下20A4〜6V 0.3k Ω4V 以下0.5V 以上非过零1A (AC 输出)型1A 4〜6V 0.3k Ω4V 以下0.5V 以上1ms 以下●—●——4.3g—光电晶体管—1A (DC 输出)型—3〜60V1A0.1mA 以下1.5A4〜6V 0.43k Ω4V 以下0.8V 以上0.5ms 以下1ms 以下— 周期＋1ms 以下12/ 周期＋1ms 以下12/10.167.627.6212.8102012.81020UL 、CSA 、※TUV80〜250V AC3〜32V 插座、接口终端(PC 终端)0.5ms 以下−30℃〜＋80℃..15可控硅输出光电耦合器选型参数表商品名称方式类型输入端输出端安装方式最大允许负载电流负载电压漏电流浪涌导通电流额定操作电压(DC )输入阻抗(约)动作电压复位电压动作时间复位时间耐电压使用环境温度内置缓冲电路工作指示灯PC 板插入式面板安装端子排列和板料加工图(BOTTOM VIEW )国外标准质量(重量)(约)选件备注外形尺寸高度包括支架尺寸单位mm—插座13g UL 、CSA ——●●(带工作指示灯)●—−30〜＋80℃4,000V AC 5ms 以下2ms 以下5ms 以下0.5ms 以下0.8V 以上0.8V 以上0.8V 以上—过零—DC 输入模块AC 输出模块DC 输出模块—75〜125V 75〜250V —4〜15V 10〜32V—3〜60V 10〜200V2A2A15mA1A100μA 以下5mA 以下1mA 以下—30A5A （1秒間）3〜32V 3〜15、4〜15、10〜32V— 1.6、1.7、5、6 k Ω3V 以下3V(4V)以下3V(4V)以下160〜280V AC—160V AC 以下A CD C20A-15A-10A-8A-5A-3A-2A-1A-I/O 输出光电耦合器光电晶体管—AC 输入模块80〜140V AC—20ms 以下20ms 以下— 周期＋1ms 以下12/ 周期＋1ms 以下12/5- 1.210.165.085.0812.7（33.02）4- 1.210.165.0812.7（27.94）1020.543104320.51020.5431020.54380V AC 以下10V AC 以上20V AC 以上。
恩智浦半导体TEA2209T有源桥式整流器控制器产品数据手册说明书
TEA2209T有源桥式整流器控制器第1.1版——2021年5月7日产品数据手册1 总述TEA2209T是新一代有源桥式整流器控制器产品，旨在替代传统的二极管桥。
将TEA2209T与低电阻高压外部MOSFET配合使用，可消除典型整流器二极管正向传导损耗，从而显著提高功率转换器的效率。
在90 V(AC)电源电压下，效率可以提高约1.4%。
TEA2209T采用绝缘硅片(SOI)工艺设计。
2 特性和优势2.1 能效特性•消除了二极管整流器桥的正向传导损耗•极低IC功耗(2 mW)2.2 应用特性•集成高压电平转换器•直接驱动所有四个整流器MOSFET•外部零件数量很少•集成X电容放电(2 mA)•自供电•全波驱动可改善总谐波失真(THD)•S016封装2.3 控制特性•用于所有外部功率MOSFET的禁用功能•用于高端和低端驱动器的欠压锁定(UVLO)•用于所有外部功率MOSFET的漏源过压保护•用于所有外部功率MOSFET的启动时栅极下拉电流3 应用TEA2209T面向将升压型功率因数控制器作为第一级的电源。
第二级可以是谐振控制器、反激控制器或任何其他控制器拓扑。
它可用于所有需要高效率的电源：•电源适配器•台式电脑和一体机电源•电视电源•服务器电源4 订购信息表1.订购信息型号封装名称说明版本TEA2209T/1 SO16 塑料小型封装；16引脚；体宽3.9 mm SOT109-15 标示表2.标示型号标记代码TEA2209T/1 TEA2209T6 功能框图VCC VRVCCHL GATEHLL GATELL COMPVCCHRGATEHRRGATELRVCCVCC电平转换电平转换CONTROLVR电源+X电容放电1.3 V图1.功能框图COMP_POL GND7 引脚配置信息7.1 引脚配置7.2 引脚说明表3.引脚说明符号引脚说明L 1 左输入，左上方MOSFET的源极VCCHL 2 左侧高端浮动电源GATEHL 3 左侧高端栅极驱动器HVS 4 高压隔离间隔；不连接GATELL 5 左侧低端栅极驱动器VCC 6 电源电压GND 7 接地COMP_POL 8 比较器极性设置COMP 9 比较器输入GATELR 10 右侧低端栅极驱动器HVS 11 高压隔离间隔；不连接R 12 右输入，右上方MOSFET的源极VCCHR 13 右侧高端浮动电源GATEHR 14 右侧高端栅极驱动器HVS 15 高压隔离间隔；不连接VR 16 整流电源电压L VCCHLGATEHLHVSGATELLVCCGND COMP_POLVRHVSGATEHRVCCHRRHVSGATELRCOMP IC图2.引脚结构图(SOT109-1)8 功能说明8.1简介TEA2209T 是用于有源桥式整流器的控制器IC 。
可控硅选型手册
1500 2.35
1000 2.19
1500 1.44
1500 1.41
1000 1.90
1500 1.18
1500 1.92
1500 2.37
1500 1.35
3000 2.51
1500 1.20
1500 1.73
1500 2.13
3000 1.94
1500 1.07
1500 1.90
3000 2.11
1500 1.52
3000 1.50
3000 1.71
6000 3.62
3000 1.85
VTO @ TVJM V 0.93 1.20 1.20 0.85 1.04 1.15 0.94 0.98 1.03 0.87 0.92 0.87 0.80 0.93 1.15 1.22 0.87 0.90 1.12 0.86 1.08 1.20 0.96 1.15 0.92 1.10 1.18 1.05 0.86 1.30 1.15 1.02 0.96 1.00 1.40 1.26
型号
TYPE
××=VRRM/100
IT (AV) @TC=70℃
A
VDR M VRR M
V
ITSM @TVJM &10ms
kA
KP300-xx
300
1200-1600
4.3
KP300-xx
300
4400-5200
5.5
KP300-xx
300
4800-6500
4.8
KP400-××
400
600-1200
1800-2200
7.1
KP700-xx
700
400-1200
NXP_MOSFET选型手册
Package name TO-236AB TO-236AB SOT883 TSSOP6 SC-75 SOT666 SC-70 TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB TSSOP6 SC-75 SOT666 SC-70 TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB SC-70 TO-236AB TO-236AB TO-236AB TO-236AB TSOP6 TO-236AB SC-73 SC-73 SC-73 SC-73 SC-73 SC-73 SC-73 SC-73 SC-73 SC-73 SC-73 TO-236AB TO-236AB TSSOP6 SC-70 TO-236AB TSSOP6 SC-70 SOT89 TO-236AB TO-236AB SOT883 TSSOP6
RDSon [max] @ VGS = 10 V (mOhm) 5000 1600 1600 1600 1600 1600 1600 1600 3000 2000 3900 1600 1600 1600 1600 1600
RDSon [max] @ VGS = 5 V (mOhm) 2000 2000 2000 2000 2000 2000
-50 -50 -50 200 100 -50 -20 -30 -30 30 30 30 30 30 -30 -30 -30 -30 -30 60 60 60 100 20 25 20 40 55 75 100 55 55 200 55 100 75 60 200 100 150 100 25 30 300 30 55 20 30 25 200 -16 30 100 30
2000 2000 2000 2000 2000
恩智浦半导体ASL3416SHN增强型三通道LED降压驱动器产品数据手册说明书
ASL3416SHN增强型三通道第1. 简介ASL3416SHN是一款三通道降压模式LED驱动器IC，可独立于输入电压为LED提供恒定的平均直流电流。
ASL3416SHN最多支持三个输出通道。
这意味着，使用1个驱动器IC可相互独立地驱动1、2或3个LED串。
它针对汽车外部和内部照明应用提供了一款经济高效的设计解决方案。
2. 概述ASL3416SHN采用迟滞降压DC-DC拓扑结构。
输入电压范围为10 V至80 V，可最大限度地提高每个通道输出电压的灵活性，支持多达20个LED的应用。
每个通道可提供高达1.5 A以上的输出电流。
1此外，两个输出通道可以连接在一起，以提供更高的电流。
它可以利用内部稳压可调电源驱动一个外部高边N沟道MOSFET。
ASL3416SHN降压驱动器可实现灵活的系统设计，支持使用相同的架构驱动3个LED串。
ASL3416SHN提供一个SPI接口，可用于与外部微控制器进行广泛的控制和诊断通信。
ASL3416SHN提供可调迟滞功能，以便优化外部器件，并最大限度减少LED电流纹波。
此外，ASL3416SHN还提供高达70 V的输出电压，并且具有测量能力，可用于识别LED开路和短路条件。
微控制器可读取该电压，并利用该电压检测开路或短路条件。
其他诊断功能包括电流达到状态等。
其他特性包括输入欠压锁定以及ASL3416SHN结温超过+175°C时的热关断。
本器件采用非常小的HVQFN32引脚封装和外露导热垫，能够满足汽车应用的严苛要求。
它完全符合AEC Q100 1级标准要求，可以在-40°C至+125°C的汽车环境温度范围内使用。
__________________________________1 ASL3416可提供1: 12.5范围内的精确电流。
该范围可使用外部器件扩大或缩小。
输出电流最低为30 mA，可达到3 A以上，具体取决于工作条件和器件选择。
3. 特性和优势■ASL3416SHN是一款符合AEC-Q100 1级标准要求的汽车级产品■工作环境温度范围：-40°C至+125°C■宽工作输入电压范围：+10 V至+80 V■能够驱动多达20个LED，宽工作LED电压范围，在2.5 V至70 V内可调■在整个工作温度范围内，输出电流可达到1.5A以上，LED电流精度为±5%■输出电流可通过SPI接口编程■可通过SPI接口回读编程电流■两个输出电流范围，可通过SPI接口编程，精度为5%■迟滞转换器■快速栅极驱动，可实现高效率■可编程内部栅极驱动稳压器■支持逻辑电平和标准电平FET■集成式自举二极管■PWM输入，可对每个通道单独调光■低电磁辐射（EME）和高电磁干扰耐受能力（EMI）■输入电压监控和输入欠压保护■输出电压监控■通过控制信号使能器件■通过SPI监控结温■小尺寸封装HVQFN32■当EN = 0时，25°C下的低静态电流<5 μA■短路和开路输出保护4. 应用■汽车LED照明◆日行灯◆示廓灯或驻车灯◆近光灯◆远光灯◆转向指示灯◆雾灯◆转向灯◆先进的前照灯5. 订购信息表1. 订购信息6. 功能框图图1. 功能框图7. 引脚配置信息7.1 引脚配置图2. 引脚配置7.2 引脚说明表2. 引脚说明[1]表2. 引脚说明[1]...续[1] 未连接(n.c.)引脚在内部未连接，必须浮空以保持高电压隔离。
可控硅元件选型与使用
仪元公司可提供 SS 水冷系列和 SF 风冷系列以及各类非标及组件散热器 为元件配套
使用
根据元件通态额定平均电流推荐配置的标准型散热器型号见下表
元件通态额定平均电流
100A-200A 300A 400A 500A-600A 800A 1000A
推荐散热器型号
水冷
风冷
SS11
SF12
SS12
SF13 SF13 SF14
SS12 SS13
SF15
SS13
SF16
SS14
SF17
1000A-3000A
SS14
其中 SF 系列风冷散热器是指在强迫风冷(风速 6m/s)条件下的推荐配置 用户在使用
时应根据实际散热条件并考虑可靠性要求进行选择 对于 1000A 以上元件一般不推荐使用
风冷散热器 若使用风冷散热器 则元件额定电流需降额使用
m 平整度小于或等于 30 m 安装时元件台面与散热器台面应保持清洁干净无 油污等脏物 3 安装时要保证元件台面与散热器的台面完全平行 同心 安装过程中 要求通过元 件中心线施加压力以使压力均匀分布在整个接触区域 用户手工安装时 建议使用 扭矩扳手 对所有紧固螺母交替均匀用力 压力的大小要达到数据表中的要求 4 在重复使用水冷散热器时 应特别注意检查其台面是否光洁 平整 水腔内是否有 水垢和堵塞 尤其注意台面是否出现下陷情况 若出现了上述情况应予以更换
器直流输入电压为 Ud 功率因数为 cos 则
VDRM/RRM= 1.5-2 Ud / 2cos 2 元件的额定通态电流 IT AV
考虑到元件在较高频率下工作时 其开关损耗非常显著
元件的额定通态电流应按实
际流过其有效值 I 的 2-3 倍来考虑 即
NXP TEA2096DB2201同步整流器评估板用户手册说明书
UM11815TEA2096DB2201 synchronous rectifier evaluation boardRev. 1 — 19 September 2022User manualTEA2096DB2201 synchronous rectifier evaluation boardTEA2096DB2201 synchronous rectifier evaluation board 1Important notice2Safety warningThe board application is AC-mains voltage powered. Avoid touching the board whileit is connected to the mains voltage and when it is in operation. An isolated housing isobligatory when used in uncontrolled, non-laboratory environments. Galvanic isolationfrom the mains phase using a fixed or variable transformer is always recommended.Figure 1 shows the symbols on how to recognize these devices.019aab173019aab174a. Isolatedb. Not isolatedFigure 1. Isolation symbolsTEA2096DB2201 synchronous rectifier evaluation board 3IntroductionThe TEA2096DB2201 evaluation board is intended for engineers involved in theevaluation and the design of switch-mode power supplies (SMPS).This user manual contains all the information required to replace the secondary-siderectification of an existing SMPS with a resonant topology with the TEA2096DB2201evaluation board.4Finding kit resources and information on the NXP websiteNXP Semiconductors provides online resources for this user manual and its supporteddevices at https://.This design example user manual can be found at:https:///TEA2096DB2201.4.1Collaborate in the NXP communityIn the NXP community you can share ideas and tips, ask and answer technicalquestions, and receive input on just about any embedded design topic.The NXP community can be found at https://.TEA2096DB2201 synchronous rectifier evaluation board 5Getting ready5.1Box contentsThe box contains the TEA2096DB2201 evaluation board. This evaluation boardincorporates the TEA2096T in an SO-8 package and two 150 V MOSFETs in a PG-TDSON-8 package with a typical R DSon of 9.3 mΩ. Figure 2 shows the top side andbottom side of the evaluation board. The TEA2096DB2201 evaluation board is a singlelayer board with one plated-through via for improved solderability and robustness.a. Top side a. Bottom sideFigure 2. TEA2096DB2201 evaluation board photographsTEA2096DB2201 synchronous rectifier evaluation board 6Getting to know the hardware6.1OverviewThe TEA2096DB2201 evaluation board contains a TEA2096T SR controller in an SO-8package and two 150 V MOSFETs in PD-TSON-8 package.The TEA2096T is a dedicated controller IC for synchronous rectification on thesecondary side of resonant converters. It incorporates two stages for sensing and drivingthe SR MOSFETs, which rectify the outputs of the central tap secondary transformerwindings. The TEA2096T has a drain-source voltage rating of 200 V.These features make the evaluation board suitable for applications with an output voltageof up to 60 V.6.2Features•Dual synchronous rectification for resonant converters•Easy replacement of secondary-side rectifiers of an existing resonant converter•Differential inputs for sensing the drain and source voltages of each SR MOSFETindependently•Adaptive gate drive for fast turn-off at the end of conduction and maximum efficiency atany load•Regulation level of −25 mV for driving low-ohmic MOSFETs•SR control without minimum on-time•Supports 1 MHz switching frequency•Interlock function to prevent simultaneous conduction of the external MOSFETs•Wide supply voltage range from 4.75 V to 38 V•Supports 5 V supply operation with logic level SR MOSFETs•Supply current in energy save operation of 80 μA•Undervoltage lockout (UVLO) protection with active gate pull-downTEA2096DB2201 synchronous rectifier evaluation board 6.3Block diagram6.4Board descriptionThe board consists of the TEA2096T SR and two SR MOSFETs. The TEA2096T actsas a dual controlled amplifier. For each side, the input is the voltage difference betweendrain and source. The corresponding gate driver signal is the output.To ensure that the layout design for a single-sided board is easy, resistors R4 and R5are added. Keep the resistor value 0 Ω for the fastest turn-off time. Capacitor C1 is adecoupling capacitor for the VCC pin of the TEA2096T. Connect it close to the IC. Incombination with resistor R5, it acts as a simple RC filter.Provisions are made for snubbers resistor R2/capacitor C2 and resistor R3/capacitor C3.The components are not mounted. However, if high-voltage spikes are present on thedrain-source connections of the MOSFETs, they can be added.6.5Operational behavior6.5.1Turn-onWhen the drain-source voltage drops to below the turn-on threshold (−400 mV), theMOSFETs are turned on. The corresponding gate driver output turns on the externalSR MOSFET. The gate of this MOSFET is rapidly charged to a level that exceeds itsthreshold level. After the turn-on phase, the regulation phase starts. There is no minimum on-time.6.5.2Regulation mode and turn-offDuring regulation mode, the IC regulates the voltage difference between the drain andthe source sense inputs to an absolute level of 25 mV. The corresponding gate driveroutput level is adjusted accordingly. In this mode, the gate driver voltage follows theTEA2096DB2201 synchronous rectifier evaluation board waveform of the current through the external MOSFET. When the current drops to lower values, the corresponding gate driver output is discharged to a value just above the gate threshold voltage of the external MOSFET. When the current reaches zero, the discharge enables a quick turn-off of the external MOSFET.Especially at continuous conduction mode (CCM) conditions, choose a MOSFET witha sufficiently low R DSon value. It enables the discharge of the gate driver output to justabove the gate-source threshold level of the external MOSFET. When the current dropsto zero, this discharge makes a rapid switch-off possible.Rapid switch-off is very important for CCM conditions. It minimizes the reverse currentand the related voltage overshoot on the drain terminal of the external MOSFET.When the drain voltage exceeds 150 mV, the driver output voltage is actively pulled low.6.5.3Synchronous rectification waveformsTEA2096DB2201 synchronous rectifier evaluation board6.5.4Interlock functionThe TEA2096T incorporates an interlock function. The interlock function avoids the turn-on of both gate driver outputs at the same time.After one gate driver output is turned off, the IC waits maximum 200 ns (t d(interlock)) before turning on the other gate driver output.TEA2096DB2201 synchronous rectifier evaluation board 7Connecting the hardwareFigure 5 shows an example of the TEA2096DB2201 evaluation board used in a typicalresonant adapter.Figure 5. TEA2096DB2201 evaluation board connected to 240 W resonant adapter boardFigure 3 and Figure 6 show the connection of the TEA2096DB2201 evaluation boardto the secondary side of an LLC controller board. The evaluation board has fourconnections.Connect the pads SECA and SECB to the secondary outputs of the transformer. Connectthe GND pad to the power ground of the main board. Use thick wires for the SECA,SECB, and GND connections, because the currents in these tracks can be high.For output voltages up to 38 V, the XV connection can be connected to the V out of themain board. For output voltages of more than 38 V, a series regulator is required toreduce the supply voltage of the TEA2096T to below 38 V. When a series regulatoris used, a trade-off can be made between the dissipation in the regulator and thedissipation in the TEA2096T.TEA2096DB2201 synchronous rectifier evaluation boardFigure 6. Placement of evaluation board in existing resonant converterTEA2096DB2201 synchronous rectifier evaluation board 8Schematic, board layout and bill of materials8.1Schematic8.2Bill of materialsTEA2096DB2201 synchronous rectifier evaluation board 8.3Board layouta. Top copperb. Top silkscreenFigure 8. TEA2096DB2201 evaluation board layoutBelow are several important guidelines for a good layout:•Keep the trace from the DSA/B pin to the MOSFET drain pin as short as possible.•Keep the trace from the SSA/B pin to MOSFET source pin as short as possible.•Keep the area of the loop DSA/B pin-MOSFET drain-MOSFET source-SSA/B pin assmall as possible. Make sure that this loop overlaps the power drain track or powersource track as little as possible. And ensure that the two loops do not cross eachother.•Keep tracks from GATE pins to gate of MOSFETs as short as possible.•Decouple pins V CC and GND as close to the IC as possible with a small (100 nF)capacitor.•Use separate clean tracks for the V CC pin and GND.•Use a GND plane underneath the IC connected to the GND pin. It results in a betterheat dispersion.•Keep the ground and source sense tracks separated. Use separate tracks for eachsource sense connection and connect the IC ground to the ground plane on the PCB.TEA2096DB2201 synchronous rectifier evaluation board 9Abbreviations10References[1]TEA2096T data sheet—Dual synchronous rectifier controller; 2022, NXP SemiconductorsTEA2096DB2201 synchronous rectifier evaluation board 11Legal information11.1 DefinitionsDraft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may resultin modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information.11.2 DisclaimersLimited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applicationsand the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at /profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.Suitability for use in non-automotive qualified products — Unlessthis data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testingor application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warrantyof the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’standard warranty and NXP Semiconductors’ product specifications.Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecyclesto reduce the effect of these vulnerabilities on customer’s applicationsand products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsiblefor compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP.NXP has a Product Security Incident Response Team (PSIRT) (reachableat *************) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products.11.3 TrademarksNotice: All referenced brands, product names, service names, and trademarks are the property of their respective owners.NXP — wordmark and logo are trademarks of NXP B.V.GreenChip — is a trademark of NXP B.V.TEA2096DB2201 synchronous rectifier evaluation boardContents1Important notice (3)2Safety warning (3)3Introduction (4)4Finding kit resources and information onthe NXP website (4)4.1Collaborate in the NXP community (4)5Getting ready (5)5.1Box contents (5)6Getting to know the hardware (6)6.1Overview (6)6.2Features (6)6.3Block diagram (7)6.4Board description (7)6.5Operational behavior (7)6.5.1Turn-on (7)6.5.2Regulation mode and turn-off (7)6.5.3Synchronous rectification waveforms (8)6.5.4Interlock function (9)7Connecting the hardware (10)8Schematic, board layout and bill ofmaterials (12)8.1Schematic (12)8.2Bill of materials (12)8.3Board layout (13)9Abbreviations (14)10References (14)11Legal information (15)Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.。
恩智浦芯片选型表2010
fully integrated 13.56 10% & 100% ASK 106/212/424/848 yes yes yes yes yes V, f 2.5 … 3.6 2.5 … 3.6 1 1000 -25/+85 HVQFN32 n.a. yes
CL RC632 13.56 10% & 100% ASK 106/212/424 1.66/26.5/53 yes yes yes yes yes yes yes yes 5 n.a. n.a. 0/+70 CE, FCC yes
SL RC400 13.56 10% & 100% ASK 1.66/26.5/53 yes yes yes yes 5 n.a. n.a. 0/+70 CE, FCC yes
CL RC 632 13.56 10% & 100% ASK 106/212/424 1.66/26.5/53 yes yes yes yes yes yes yes yes 5 n.a. n.a. 0/+70 CE, FCC yes
Produ
SPI, I²C, RS232
Memo EEPRO OTP a Write Data R
Organ
fully integrated 13.56 100% ASK 106 yes yes yes yes V, f 5 5 2 1000 -25/+85 SO32 n.a. yes
fully integrated 13.56 100% ASK 106/212/424 yes yes yes yes V, f 3.3 or 5 5 2 1000 -25/+85 SO32 n.a. yes
ISO 18000
可控硅的主要参数
四、单向可控硅管的参数_控制极触发电流IGT
在室温下，阳极和阴极间加6V电压时，使可控硅从截止变为完全导通所需的控制极最小直流电流。
五、单向可控硅参数_断态重复峰值电压UPFV
在控制极断开和正向阻断的条件下，阳极和阴极间可重复施加的正向峰值电压。其数值规定为断态下重复峰值电压UPSM的80%。
0.8A
电压-VDRM:
≥600V
触发电流:
IGT:
5~15 uA
IGT:
30~60 uA元件.
型号MCR100-8
电流
0.8（A）
电压600（V）
触发电流10-60u（A）
结温110（℃IGT:
10~30 uA
在环境温度为+40℃及规定的散热条件、纯电阻负载、元件导通角大于己于170°电角度时，可控硅所允许的单相工频正弦半波电流在一个周期内的最大平均值。
二、单向可控硅管的参数_通态平均电压UT（AV）
在规定环境、温度散热条件下，元件通以额定通态平均电流，结温稳定时，阳极和阴极间电压平均值。三、单向可控硅参数_控制极触发电压UGT
可控硅的主要参数
可控硅的主要参数:
1额定通态电流（IT)即最大稳定工作电流，俗称电流。常用可控硅的IT一般为一安到几十安。
2反向重复峰值电压（VRRM)或断态重复峰值电压（VDRM），俗称耐压。常用可控硅的VRRM/VDRM一般为几百伏到一千伏。
3控制极触发电流（IGT)，俗称触发电流。常用可控硅的IGT一般为几微安到几十毫安。
如果通过的正向电流小于此值，可控硅就不能继续保持导通而自行截止。
参数符号说明:
三四象限可控硅驱动
飞利浦/NXP可控硅3象限与4象限的区别* Q: 你想在中国做网络会议，就应该提供一份完美的中文相关质料。
* A: 恩智浦公司是一个国际性的跨国公司，以前公司的研发部门生产部门都是在国外，所以一些资料包括DATASHEET都是一些英文版的，但是我们很重视中国这个市场，所以也做了很多本土化的工作，包括技术支持，资料的翻译都是中文的，包括我们今天用的讲义也是尽量翻译成中文，适合中国工程师使用，但是因为很多 DATASHEET里面的参数都是以业界约定的英文缩写为主的，目前对DATASHEET没有什么改动的，我们在一些宣传资料和PPT里面是用中文表示的，希望给大家更多的方便。
谢谢！* Q: NXP的三象限可控硅（3Q Triac）与四象限可控硅（4Q Triac）产品型号如何区分？如果参数基本一致，可相互带换吗？* A: 因为在我们的选型手册上面很容易的看出来，我们三象限的命名规则是除了BTA140，其它的都是以BTA开头，四象限的基本上都是以BT开头，，可以按照我们的命名规则就能够看出来，很容易的去区分，关于参数一致，可以相互替换，因为四象限相对来说，是我们早一点的型号，我们的三象限是在这个基础上面做了一些改进，所以在它的动态性能上面有了很大的提高，基本上来说，参数一致是比较少的，但是用三象限肯定比四象限的可靠性要高。
谢谢！* Q: 三象限可控硅会不会影响触发可靠？* A: 首先触发的概念跟门极有关，不管是三象限还是四象限都是用门极进行主回路的触发，但是四象限相对来说是比较早点的产品，三象限是比较新的产品，三象限比四象限的优势在于它把第四象限在工艺上给屏蔽了，因为四象限是比较容易进行误触发的，从这个角度来讲，三象限应该比四象限更可靠。
从触发灵敏度来讲，因为有些比较低的比如说一些保护电路，我们希望一些很小的电流过来的时候，我们都能够让它工作，这个时候就需要灵敏型的可控硅，另外一种情况就是我们可能希望它的免疫能力比较强，也就是说对外界杂波的干扰没有那么的敏感，希望它在比较高的电流下面进行触发，这也就是为什么我们会提供50毫安电流的产品，因此从5毫安到50，把触发的灵敏度分为好几档，就是说在不同的应用中可以选择不同的档，相对来讲，三象限的灵敏硅的可控程度，可靠性，抗干扰程度优于四象限的可控硅。
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