硅碳棒电加热温度控制器的设计

本科毕业设计

题目：硅碳棒电加热温度控制器的设计

学院：信息科学技术学院

专业：电子信息工程（微电子）

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二零一二年五月

摘要

温度是工业生产以及科学实验中的重要参数之一。温度的控制在许多领域中都有着积极的意义。在很多行业中都有大量的用电加热设备，如硅碳棒等。采用单片机对其进行控制不仅具有控制方便，简单，灵活性大等特点，而且还可以较大幅度的提高被控温度的技术指标，从而能够大大的提高产品的质量。所以，智能化的温度控制技术正在被广泛地采用。

本次课题即是针对高温控制系统-硅碳棒电加热温度控制器的设计进行的分析与设计，我们采用了以STC12C5A60S2单片机为主体，铂铑10-铂热电偶温度采集模块，温度设置模块，LCD液晶显示模块以及温度控制模块相搭配的控制系统。

本系统中单片机将采集到的温度与设定的温度进行比较，由此来判定硅碳棒上是否继续加热。此外还加入了显示模块，将采集到的温度以及设定的温度进行实时显示，使得整个设计更加完整，更加灵活。

关键词：硅碳棒单片机温度控制

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Abstract

Temperature is one of the important parameters in industrial production and scientific experiment.In many areas t emperature control have a positive significance.There are a large number of electric heating equipment in many industries, such as silicon carbide, using the micro controller to control the temperature not only has a convenient, simple, flexible features, but also can greatly improve the technical indexes of the accused temperature was charged, which can greatly improve the quality of the product.Therefore,intelligent temperature control technology is being widely adopted.

This issue is for the analysis and design of high-temperature control system-silicon carbide electric heating temperature controller design, we have adopted STC12C5A60S2micro controller as the main,platinum and rhodium- platinum thermocouple temperature acquisition module, the temperature setting module , LCD module and temperature control module with the control system.

In the system, micro controller will compare the collected t emperature and setting temperature,and thus to determine whether to continue heating the silicon carbide.In addition,the system joined the display module will be collected temperature and set temperature in real-time display,making the whole design is more complete and more flexible

Key words：S ilicon Carbide MCU Temperature Control

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目录

摘要............................................................................................................................................... １第一章前言................................................................................................................................. ５

1.1 本文研究的目的和意义................................................................................................ ５

1.2 系统实现的功能............................................................................................................ ５

1.3 设计的要求与方案........................................................................................................ ６第二章总体设计分析................................................................................................................. ７

2.1 组成框图........................................................................................................................ ７

2.2 主要功能模块的简介.................................................................................................... ７

2.2.1 传感器温度采集................................................................................................. ７

2.2.2 温度设置............................................................................................................. ８

2.2.3 LCD液晶显示..................................................................................................... ８

2.2.4 温度控制............................................................................................................. ８第三章硬件设计......................................................................................................................... ９

3.1 主控系统.................................................................................................................... １０

3.1.1 STC12C5A60S2单片机简介.......................................................................... １０

3.1.2 最小应用系统模块......................................................................................... １２

3.2 传感器温度采集模块................................................................................................ １４

3.2.1 器件选型与简介............................................................................................. １４

3.2.2 整个模块设计与分析..................................................................................... １７

3.3温度设置模块............................................................................................................. １８

3.4 LCD液晶显示模块................................................................................................. １９

3.4.1 器件选型与简介............................................................................................. １９

3.4.2 整个模块设计与分析..................................................................................... ２５

3.5 温度控制模块............................................................................................................ ２６

3.5.1 光耦器件选型与简介..................................................................................... ２６

3.5.2 可控硅器件选型及简介................................................................................. ２６

3.5.3 整个模块设计与分析..................................................................................... ２７第四章软件设计..................................................................................................................... ２８

4.1 主程序设计................................................................................................................ ２８

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