集成电路中英文对照表

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塑封集成电路封装的有关专用名词中英文对照表

塑封集成电路封装的有关专用名词中英文对照表半导体词汇BGA Ball Grid Array 焊球阵列BQFP Quad Flat Package With Bumper 带缓冲垫的四边引脚扁平封装C4 Controlled Collapsed Chip Connection 可控塌陷芯片连接CAD Computer Aided Design 计算机辅助设计CBGA Ceramic Ball Grid Array 陶瓷焊球阵列CCGA Ceramic Column Grid Array 陶瓷焊柱阵列CLCC Ceramic Leaded Chip Carrier 带引脚的陶瓷片式载体CMOS Complementary Metal-Oxide-Semiconductor 互补金属氧化物半导体COB Chip on Board 板上芯片COC Chip on Chip 叠层芯片COG Chip on Glass 玻璃板上芯片CSP Chip Size Package 芯片尺寸封装CTE Coefficient of Thermal Expansion 热膨胀系数CVD Chemical Vapor Depositon 化学汽相淀积DCA Direct Chip Attach 芯片直接安装DFP Dual Flat Package 双侧引脚扁平封装DIP Double In-Line Package 双列直插式封装DRAM Dynamic Random Access Memory 动态随机存取存贮器DSO Dual Small Outline 双侧引脚小外形封装DTCP Dual Tape Carrier Package 双载带封装3D Three-Dimensional 三维2D Two-Dimensional 二维FC Flip Chip 倒装片法FCB Flip Chip Bonding 倒装焊FCOB Flip Chip on Board 板上倒装片FP Flat Package 扁平封装FPBGA Fine Pitch Ball Grid Array 窄节距BGAFPD Fine Pitch Device 窄节距器件FPPQFP Fine Pitch Plastic QFP 窄节距塑料QFPGQFP Guard-Ring Quad Flat Package 带保护环的QFPHDMI High Density Multilayer Interconnect 高密度多层互连HIC Hybird Integrated Circuit 混合集成电路HTCC High Temperature Co-Fired Ceramic 高温共烧陶瓷HTS High Temperature Storage 高温贮存IC Integrated Circuit 集成电路IGBT Insulated Gate Bipolar Transistor 绝缘栅双极晶体管ILB Inner-Lead Bond 内引脚焊接I/O Input/Output 输入/输出IVH Inner Via Hole 内部通孔JLCC J-Leaded Chip Carrier J形引脚片式载体KGD Known Good Die 优质芯片LCC Leadless Chip Carrier 无引脚片式载体LCCC Leadless Ceramic Chip Carrier 无引脚陶瓷片式载体LCCP Lead Chip Carrier Package 有引脚片式载体封装LCD Liquid Crystal Display 液晶显示器LCVD Laser Chemical Vapor Deposition 激光化学汽相淀积LDI Laser Direct Imaging 激光直接成像LGA Land Grid Array 焊区阵列LSI Large Scale Integrated Circuit 大规模集成电路LOC Lead Over Chip 芯片上引线健合LQFP Low Profile QFP 薄形QFPLTCC Low Temperature Co-Fired Ceramic 低温共烧陶瓷MBGA Metal BGA 金属基板BGAMCA Multiple Channel Access 多通道存取MCM Multichip Module 多芯片组件MCM-C MCM with Ceramic Substrate 陶瓷基板多芯片组件MCM-D MCM with Deposited Thin Film Inteconnect Substrate 淀积薄膜互连基板多芯片组件MCM-L MCM with Laminated Substrate 叠层基板多芯片组件MCP Multichip Package 多芯片封装MELF Metal Electrode Face Bonding 金属电极表面健合MEMS Microelectro Mechanical System 微电子机械系统MFP Mini Flat Package 微型扁平封装MLC Multi-Layer Ceramic Package 多层陶瓷封装MMIC Monolithic Microwave Integrated Circuit 微波单片集成电路MOSFET Metal-Oxide-Silicon Field-Effect Transistor 金属氧化物半导体场效应晶体管MPU Microprocessor Unit 微处理器MQUAD Metal Quad 金属四列引脚MSI Medium Scale Integration 中规模集成电路OLB Outer Lead Bonding 外引脚焊接PBGA Plastic BGA 塑封BGAPC Personal Computer 个人计算机PFP Plastic Flat Package 塑料扁平封装PGA Pin Grid Array 针栅阵列PI Polymide 聚酰亚胺PIH Plug-In Hole 通孔插装PTF Plastic Leaded Chip Carrier 塑料有引脚片式载体PTF Polymer Thick Film 聚合物厚膜PWB Printed Wiring Board 印刷电路板PQFP Plastic QFP 塑料QFPQFJ Quad Flat J-leaded Package 四边J形引脚扁平封装QFP Quad Flat Package 四边引脚扁平封装QIP Quad In-Line Package 四列直插式封装RAM Random Access Memory 随机存取存贮器SBB Stud-Bump Bonding 钉头凸点焊接SBC Solder-Ball Connection 焊球连接SCIM Single Chip Integrated Module 单芯片集成模块SCM Single Chip Module 单芯片组件SLIM Single Level Integrated Module 单级集成模块SDIP Shrinkage Dual Inline Package 窄节距双列直插式封装SEM Sweep Electron Microscope 电子扫描显微镜SIP Single In-Line Package 单列直插式封装SIP System In a Package 系统级封装SMC Surface Mount Component 表面安装元件SMD Surface Mount Device 表面安装器件SMP Surface Mount Package 表面安装封装SMT Surface Mount Technology 表面安装技术SOC System On Chip 系统级芯片SOIC Small Outline Integrated Circuit 小外形封装集成电路SOJ Small Outline J-Lead Package 小外形J形引脚封装SOP Small Outline Package 小外形封装SOP System On a Package 系统级封装SOT Small Outline Transistor 小外形晶体管SSI Small Scale Integration 小规模集成电路SSIP Small Outline Single-Line Plug Package 小外形单列直插式封装SSOP Shrink Small Outline Package 窄节距小外形封装SPLCC Shrinkage Plasitc Leadless Chip Carrier 窄节距塑料无引脚片式载体STRAM Selftimed Random Access Memory 自定时随机存取存贮器SVP Surface Vertical Package 立式表面安装型封装TAB Tape Automated Bonding 载带自动焊TBGA Tape BGA 载带BGATCM Thermal Conduction Module 热导组件TCP Tape Carrier Package 带式载体封装THT Through-Hole Technology 通孔安装技术TO Transistor Outline 晶体管外壳TPQFP Thin Plastic QFP 薄形塑料QFPTQFP Tape QFP 载带QFPTSOP Thin SOP 薄形SOPTTL Transistor-Transistor Logic 晶体管-晶体管逻辑UBM Metalization Under Bump 凸点下金属化UFPD Ultra Small Pitch Device 超窄节距器件USOP Ultra SOP 超小SOPUSONF Ultra Small Outline Package Non Fin 无散热片的超小外形封装UV Ultraviolet 紫外光VHSIC Very High Speed Integrated Circuit 超高速集成电路VLSI Very Large Scale Integrated Circuit 超大规模集成电路WB Wire Bonding 引线健合WLP Wafer Level Package 晶圆片级封装WSI Wafer Scale Integration 晶圆片级规模集成IC名词解释1、什么是MRAM?MARM(Magnetic Random Access Memory) 是一种非挥发性的磁性随机存储器。

集成电路中英文对照表

集成电路中英文对照表A天线,安培BPA带通放大A.ADJ自动调整BPF带通滤波器ABC自动亮度控制BRIGHT亮度ABL自动亮度限制BRIGHTNESS亮度AC交流BROWN棕色ACC自动色度控制BUFFER缓冲器ACK自动消色BURST色同步信号ACＯＦＦ交流关机Ｂ／Ｗ黑／白ＡＤＤ地址Ｃ色度（信号），电容ＡＤＪ调节，调整ＣＡＤ计算机辅助设计ＡＥＲＩＥＬ天线,安培ＣＡＭ计算机辅助制造AFAMP音频放大器CANCELLER消除器AFC自动频率控制CASTLE沙堡AFT自动频率调整CATV天线电视AGC自动增益控制C-BAND C-波段AM调幅CCD电荷藕合器件AMP放大器CCTV闭路电视AMPLITUDE副度CD光盘APC自动相位控制,比较CENTER中央,中心AND与,与门CH频道,同道ATT衰减,衰减器CHG充电ATTENUATOR衰减器CHROMA色度信号AUDIO音频放大器CLAMP箝位AUTO自动CLAMPER箝位电路AUDIO-SLECT自动选择CLEAR消除器A V音,视频CLOCK时钟A V-IN音.视频输入COIL线圈A VR自动电压调整COIN符合B蓝色COLLECTOR集电极BAND波段COL彩色BAND-FILTER带通滤波器COLOR彩色BASE基极COLOR-DEM彩色,色度解调BASEBAND基带COMPENSATE补偿BASS低音CON对比度BASSAY加重低音CONTRASY对比度BBD斗链延迟器件CONT控制BD反相二极管CONTROL控制BDV击穿电压CONTROLLED被控,受控BEAM电子束流CONVERTER变换器BEAT差拍COR较正BEL-FILTER钟形滤波器COUNT-DOWN分频器BEMF反电动势CPU中央处理器BF反馈CRT显像管BFO反馈振荡器CTV彩色电视机BIAS偏置CUT-OFF截止,切断,关机BLACK黑色CVBS复合全电视信号BLACK-STRETCH黑电平扩展,延伸DAC数模转换器BLANKING消隐DAGC延迟式自动增益控制BLK消隐DAMPING阻尼BLUE蓝色DARK黑暗,暗的BOARD板DATA数据,资料DB分贝FM-DISCRI调频鉴频器DC直流,直接藕合FOCUS聚焦DECODE®解码器FORCED强制的DEFEAT失效,无输出FRAME帧DEFL偏转FREQUENCY频率DEGAUSSER消磁器FREQ-ADJ频率调整DELAY延迟FUNC功能,作用DEMOD解调器FSC色副载波频率DEMONSTRATE演示FUSE保险丝DEMODULATOR解调器G绿色DET检波GAIN增益DETECTOR检波器GATE门,选通DEVIDER除法器GB国标DG微分增益GENERATOR发生器DIFF微分,差动GND地DIFFER-AMP差动放大器GP门控脉冲DIP双列直插塑料封装GREEN绿色DIS放电H行.水平DISCR鉴频器HALF-TONE半色调控制D.L延迟线HAR谐波DLY延迟H.BLK行消隐DOWN向下H.COIN行同步DP微分相位H.DRIVE行推动DRAM动态随机存取存储器HEATER灯丝DRIVE激励,驱动HF高频DRIVER激励器,驱动级HFA高频放大器DY偏转线圈HF-AMP高频放大器EARTH接地,地线HFC高频扼流器ECHO混响,回声HI-Q高品质因数EHT超高压HFO高频振荡器EHV超高压H-LOCK行锁定EMITTER发射极HOLD同步,保持ENCODE编码HOLD-IN同步,保持ENCODER编码器HOR行,水平的E2PROM电可擦可编程只读存储器H.COUNTDOWN行分频器EVEN偶数HOR DRIVER行推动器,驱动器EXT外接HOR.OSC行振荡器E/W东/西(枕较)HP高通,大功率FB反馈H.PARABOLA行抛物波F频率HPF高通滤波器FAST快速HTR灯丝FBL快速消隐HUE色.色彩.色调FBP快速消隐脉冲HVPS高压电源FBT行输出变压器HW半波FEED.BACK反馈HZ赫兹FIG图IAGC瞬时动做的自动增益控制FILTER滤波器IA VC瞬时动做的自动音量控制FILP-FLOP双稳态触发器IC集成电路FLY.BACK逆程I2C>BUS I2C总线FM调频ID识别,鉴别FM.DET调频检波IDENT识别,鉴别IF中频LOCK锁定IFAMP中频放大器LOCK IN锁住,同步IFT中频变压器LOOP环路IMMR维修,修理LOOPER斩波器IMPULSE脉冲LOW低,弱的IN英寸LPF低通病滤波器INPUT输入LSO行稳定振荡器INH反时钟方向的ISP行同步脉冲INSERTION插入MAIN主板INSTL安装MAINT维修,保养INT内.内部的MANUAL手动INTERGRTON集成,积分MARK符号INTERFACE接口,接口电路MASK屏蔽掩膜INTERLACING隔行扫描MATCH匹配INTERMEDATE中间,中频MATRIX矩阵INTAG积分,集成MATRIXER矩阵变换电路INTMT间断的MAX最大INVTR变换器MBF调制器带通滤波器I/O输入,输出M-D调制_解调IQ.DEMOD IQ信号解调MEMORY记忆.存储器ISOLATOR绝缘体.隔离器MHZ兆赫兹JUMP,飞线MIC话筒,麦克风JUNC连接器.连接点MIX混频,混合JUNGLE混合式MIXER混频器K-BAND K.波段MODE模式.状态KEY键MODULATOR调制器带通滤波器KEY-BOARD键盘MODULE模块.组件KEY.CODER键盘编码器MONITOR监视器KILLER消色器MONOCHROME单色的KINE电视显像管MONOSTABLE单稳态KP键控脉冲MOS金属氧化物半导体KEY.PULSE键控脉冲MOSFET场效应管L(CH)左声道,左通道MOST晶体管LAYOUT布线.电路布局MP维修点LED发光二极管MPL维修部分清单LIGHT发光二极管MPO最大功率输出LINEAR线性MRR维护.更换LEVEL电频,水平MSB最高位L.C.R电感.电容.电阻MULTSTANDARD多制式LD激光视盘MULTI.SYSTEM多制式LFA|低频放大器MULTI-TAP多抽头,插头MUSIC音乐MUTE静音LFF|LFO低频振荡器MVB多频振荡器LIMITER限幅器MVC手动音亮调节LINEAR线.线路MVS最小视频信号LINE.WIDTH行幅.线宽NAND与非门LIST目录.一览表NB窄频带LIVC低输入变换器NBFM窄带调频LIVCR低输入变换器及稳压器NC空脚.不接LOAD负载.输入加载NEG负的.负极行NEW新的PCB印刷电路板NF负反馈PCM脉冲编码调制NOISE噪声PD电位器NORTH北方PEAK峰值NOT非PP峰峰值NOT.GATE非门PEAKED>AMP峰值放大器NR噪声抑制PEAK_DET峰值检波器NTC-UNIT负温度系数元件PEM脉冲编码调制NTSC NTSC制式PF皮法拉NTI电路杂音干扰PHASE相位O输出PHASE>DET相位检波OC开路PHASE.CONTROL相位控制OCB过载断路器PHASE.SHIFTER移相器OCL无耦合电容输出电路PHASOR彩色信息矢量OSC周期变化的彩色顺序PHILIPS飞利浦ODD奇数.单数PHONIC声音的,有声的ODD-EVEN奇偶的PIF图像中频IC集成电路资料]:专业术语常用名词缩写中英文对照A:Actuator执行器A:Amplifier放大器A:Attendance员工考勤A:Attenuation衰减AA:Antenna amplifier开线放大器AA:Architectural Acoustics建筑声学AC:Analogue Controller模拟控制器ACD:Automatic Call Distribution自动分配话务ACS:ACCess Control System出入控制系统AD:Addressable Detector地址探测器ADM:Add/Drop Multiplexer分插复用器ADPCM:Adaptive Differential ulse Code Modulation自适应差分脉冲编码调制AF:Acoustic Feedback声反馈AFR:Amplitude/Frequency Response幅频响应AGC:Automati Gain Control自动增益控制AHU:Air Handling Unit空气处理机组A-I:Auto-iris自动光圈AIS:Alarm InDICation Signal告警指示信号AITS:Acknowledged Information Transfer Service确认操作ALC:Automati Level Control自动平衡控制ALS:Alarm Seconds告警秒ALU:Analogue Lines Unit模拟用户线单元AM:Administration Module管理模块AN:ACCess Network接入网ANSI:American National Standards Institute美国国家标准学会APS:Automatic Protection Switching自动保护倒换ASC:Automati Slope Control自动斜率控制ATH:Analogue Trunk Unit模拟中继单元ATM：Asynchrous Transfer Mode异步传送方式AU-PPJE:AU Pointer Positive Justification管理单元正指针调整AU:Administration Unit管理单元AU-AIS:Administrative Unit Alarm InDICation SignalAU告警指示信号AUG:Administration Unit Group管理单元组AU-LOP:Loss of Administrative Unit Pointer AU指针丢失AU-NPJE:AU Pointer Negative Justification管理单元负指针调整AUP:Administration Unit Pointer管理单元指针AVCD:Auchio&Video Control Device音像控制装置AWG:American Wire Gauge美国线缆规格BA:Bridge Amplifier桥接放大器BAC:Building Automation&Control net建筑物自动化和控制网络BAM:Background Administration Module后管理模块BBER:Background BLOCk Error Ratio背景块误码比BCC:B-channel Connect ControlB通路连接控制BD:Building DistributorBEF:Buiding Entrance Facilities建筑物入口设施BFOC:Bayonet Fibre Optic Connector大口式光纤连接器BGN:Background Noise背景噪声BGS:Background SOund背景音响BIP-N:Bit Interleaved Parity N code比特间插奇偶校验N位码B-ISDN:Brand band ISDN宽带综合业务数字网B-ISDN:Broad band-Integrated Services Digital Network宽带综合业务数字网BMC:Burst Mode Controller突发模式控制器BMS:Building Management System智能建筑管理系统BRI:Basic Rate ISDN基本速率的综合业务数字网BS:Base Station基站BSC:Base Station Controller基站控制器BUL：Back up lighting备用照明C/S:Client/Server客户机/服务器C:Combines混合器C:Container容器CA:Call ACCounting电话自动计费系统CATV:Cable Television有线电视CC:Call Control呼叫控制CC:Coax cable同轴电缆CCD:Charge coupled devices电荷耦合器件CCF:Cluster Contril Function簇控制功能CD:Campus Distributor建筑群配线架CD:Combination detector感温，感烟复合探测器CDCA:Continuous Dynamic Channel Assign连续的动态信道分配CDDI:Copper Distributed Data合同缆分布式数据接口CDES:Carbon dioxide extinguisbing system二氧化碳系统CDMA:Code Division Multiplex ACCess码分多址CF:Core Function核心功能CFM:Compounded Frequency Modulation压扩调频繁CIS:Call Information System呼叫信息系统CISPR:Internation Special Conmittee On Radio Interference国际无线电干扰专门委员会CLNP:Connectionless Network Protocol无连接模式网络层协议CLP:Cell Loss Priority信元丢失优先权CM:Communication Module通信模块CM:Configuration Management配置管理CM:Cross-connect Matrix交叉连接矩阵CMI:Coded Mark Inversion传号反转码CMISE:Common Management Information Service公用管理信息协议服务单元CPE:Convergence protocol entity会聚协议实体CR/E:Card reader/Encoder(Ticket reader)卡读写器/编码器CRC:Cyclic Redundancy Check循环冗佘校验CRT:Cathode Ray Tabe显示器，监视器，阴极射线管CS:Convergence service会聚服务CS:Cableron Spectrum旧纳档块化技术CS:Ceiling Screen挡烟垂壁CS:Convergence Sublayer合聚子层CSC:Combined Speaker Cabinet组合音响CSCW:Computer supported collaborative work计算机支持的协同工作CSES:Continuius Severely Errored Second连续严重误码秒CSF:Cell Site Function单基站功能控制CTB:Composite Triple Beat复合三价差拍CTD：Cable Thermal Detector缆式线型感温探测器CTNR:carrier to noise ratio载波比CW:Control Word控制字D:Directional指向性D:Distortion失真度D:Distributive分布式DA:Distribution Amplifier分配的大器DBA:Database Administrator数据库管理者DBCSN:Database Control System Nucleus数据库控制系统核心DBOS:Database Organizing System数据库组织系统DBSS:Database Security System数据库安全系统DC:Door Contacts大门传感器DCC:Digital Communication Channel数字通信通路DCN:Data Communication Network数据通信网DCP-I:Distributed Control Panel-Intelligent智能型分散控制器DCS:Distributed Control System集散型控制系统DDN:Digital Data Network数字数据网DDS:Direct Dignital Controller直接数字控制器DDW:Data Describing Word数据描述字DECT:Digital Enhanced Cordless Telecommunication增强数字无绳通讯DFB:Distributed Feedback分布反馈DID:Direct Inward Dialing直接中继方式，呼入直拨到分机用户DLC:Data Link Control Layer数据链路层DLI:DECT Line InterfaceDODI:Direct Outward Dialing One一次拨号音DPH:DECT PhoneDRC:Directional Response Cahracteristics指向性响应DS:Direct SOund直正声DSP:Digital signal Processing数字信号处理DSS：Deiision Support System决策支持系统DTMF:Dual Tone Multi-Frequency双音多频DTS:Dual-Technology SenSOr双鉴传感器DWDM:Dense Wave-length Division Multiplexing密集波分复用DXC:Digital Cross-Connect数字交叉连接E:Emergency lighting照明设备E:Equalizer均衡器E:Expander扩展器EA-DFB:Electricity AbSOrb-Distributed Feedback电吸收分布反馈ECC:Embedded Control Channel嵌入或控制通道EDFA:Erbium-Doped Fiber Amplifier掺饵光纤放大器EDI:Electronic Data Interexchange电子数据交换EIC:Electrical Impedance Characteristics电阻抗特性EMC：Electro Magnetic Compatibiloty电磁兼容性EMI:Electro Magnetic Interference电磁干扰EMS:Electromagnetic Sensitibility电磁敏感性EN:Equivalent Noise等效噪声EP:Emergency Power应急电源ES:Emergency SOoket应急插座ES:Evacuation Sigvial疏散照明ESA:Error SecondA误码秒类型ＡESB:ErrorSecondB误码秒类型ＢESD:Electrostatic Discharge静电放电ESR:Errored Second Ratio误码秒比率ETDM:Electrical Time Division Multiplexing电时分复用ETSI:European Telecommunication Standards Institute欧洲电信标准协会F:Filter滤波器FAB:Fire Alarm Bell火警警铃FACU:Fire Alarm Contrlol Unit火灾自动报警控制装置FC:Failure Count失效次数FC:Frequency Converter频率变换器FCC:Fire Alarm System火灾报警系统FCS:Field Control System现场总线FCU：Favn Coil Unit风机盘管FD:Fire Door防火门FD:Flame Detector火焰探测器FD:Floor DistributorFD:Frequency Dirsder分频器FDD:Frequency Division Dual频分双工FDDI：Fiberdistributed Data Interface光纤缆分布式数据接口。

国外IC厂商中英文对照表

LM SGS-ATES SEMICONDUCTOR（意大利SGS-亚特斯半导体公司）
LM PHILIPS（荷兰菲利浦公司）
LM MOTOROLA（美国摩托罗拉半导体产品公司）
LM SAMSUNG（韩国三星电子公司）
LP NATIONAL SEMICONDUCTOR （美国国家半导体公司）
LR SHARP[日本夏普（声宝）公司]
NC33 NE540 NE541PHA NE541PHA NE555 NJM387 OM200 OM200 RC4194TK RM5015 RH-IX0212CE S572 S2743 SA532 SAA1045 SAA1070 SAA1025-01 SAA1173 SAB2024 SAB2010 SAF1032 SAK150BT SAS560 SAS6600 SAS5800 SDA5680
SE540 SE5560 SG3731 SG3524 SG2524G SH741 SI-1030 SK9199 SL624C SN75172 SN76635 SND5027 SO41E SP8735P STK040A STR4090A SW450 T1400 T1102 TA7628
TAA SIGNETICS（美国西格尼蒂克公司） TAA SIEMENS（德国西门子公司） TAA SGS-ATES SEMICONDUCTOR（意大利SGS-亚特斯半导体公司） TAA PRO ELECTRON（欧洲电子联盟） TAA PHILIPS（荷兰菲利浦公司） TAA PLESSEY（英国普利西半导体公司） TAA MULLARD（英国麦拉迪公司） TBA FAIRCHILD（美国仙童公司） TBA SIGNETICS（美国西格尼蒂克公司） TBA SGS-ATES SEMICONDUCTOR（意大利SGS-亚特斯半导体公司） TBA HITACHI（日本日立公司） TBA NEC EIECTRON（日本电气公司） TBA ITT（德ITT半导体公司） TBA AEG-TELEFUNKEN（德国德律风根公司） TBA PRO ELECTRON（欧洲电子联盟） TBA SIEMENS（德国西门子公司） TBA PLESSEY（英国普利西半导体公司） TBA NATIONAL SEMICONDUCTOR （美国国家半导体公司） TBA THOMSON-CSF（法国汤姆逊半导体公司） TBA PHILIPS（荷兰菲利浦公司） TBA MULLARD（英国麦拉迪公司） TC TOSHIBA（日本东芝公司） TCA ITT（德国ITT半导体公司） TCA SIGNETICS（美国西格尼蒂克公司） TCA SPRAGUE ELECTRIC（美国史普拉格电子公司） TCA MOTOROLA（美国摩托罗拉半导体产品公司） TCA PRO ELECTRON（欧洲电子联盟） TCA PLESSEY（英国普利西半导体公司） TCA SGS-ATES SEMICONDUCTOR（意大利SGS-亚特斯半导体公司） TCA MULLARD（英国麦拉迪公司） TCA PHILIPS（荷兰菲利浦公司） TCA AEG-TELEFUNKEN（德国德律风根公司） TCA SIEMENS（德国西门子公司） TCM TEXAS INSTRUMENTS[TI]（美国德克萨斯仪器公司） TDA SIGNETICS（美国西格尼蒂克公司） TDA SPRAGUE ELECTRIC（美国史普拉格电子公司） TDA MOTOROLA（美国摩托罗拉半导体产品公司） TDA PRO ELECTRON（欧洲电子联盟） TDA NATIONAL SEMICONDUCTOR （美国国家半导体公司） TDA PLESSEY（英国普利西半导体公司） TDA SIEMENS（德国西门子公司） TDA NEC ELECTRON（日本电气公司） TDA AEG-TELEFUNKEN（德国德律风根公司） TDA ITT（德国ITT半导体公司） TDA HITACHI（日本日立公司） TDA SGS-ATES SEMICONDUCTOR（意大利SGS-亚特斯半导体公司） TDA PROELECTRON（欧洲电子联盟）

集成电路常见名词缩写中英对照（入门篇）

集成电路常见名词缩写中英对照（入门篇）第一篇：集成电路常见名词缩写中英对照(入门篇)集成电路常见名词缩写中英对照（入门篇）SoC--------------系统化芯片SoP-----------------封装上的系统ASIC------------特定用途集成电路ADC-------------模数转换器DAC-------------数模转换器PLL--------------锁相环PMU-------------电源管理单元DSP--------------数字信号处理SRAM-----------静态处理器ROM-----------------只读存储器AFE--------------模拟前端PHY--------------物理层SATA-------------串行高级技术附件IP------------------知识产权（不指互联网协议）HDMI-------------高清晰度多媒体接口MEMS------------微机电系统RF-----------------射频LVDS-------------低压差分信号GPIO--------------通用输入输出PWB----------------印刷线路板DLL-----------------延迟锁定环GPU-----------------图形处理器CAM----------------内容可寻址存储器RSDS----------------低摆幅差分信号DVI------------------数字视频接口DDR（DDRSDRAM）------双倍速率同步动态随机存储器wafer----------------晶圆die--------------------裸片chip------------------芯片四大晶圆代工厂TSMC---------------台积电UMC-----------------联电SMIC----------------中芯国际Chartered------------特许半导体第二篇：地质常用名词缩写地质常用名词缩写:AVO：Amplitude Versus Offset 振幅随偏移距变化BSR：Bottom Siniulating Reflections似海底反射A40H：衰减电阻率ADIA：Average Borehole Diameter平均井眼直径AT10：Array Induction Two Foot Resistivity A10 阵列感应两脚电阻率DRHO：Bulk Density Correction 体积密度矫正DTCO（.US/F）：Delta-T CompressionalDTSM（.US/F）：Delta-T ShearECD：Equivalent Circulating Density 当量循环密度FLAIR：现场实时流体预测FLD：FIELD 现场geoNEXT：定量快速色谱分析HCAL（.IN）：HRCC Caliper CalibratedHSGR（.GAPI）：HNGS Standard Gamma-RayKINT（.MD）： Intrinsic PermeabilityLOC：LOCATIONMD：Measured Depth 测深；MFS：最大海泛面泥岩FS：准层序海泛面泥岩NPOR_LIM.V/V：Enhanced Thermal Neutron Porosity(matrixLimestone)热中子孔隙度P16H：相移电阻率：PIGN.V/V ：Effective Porosity, VISO, VPAR, and Bound Water Removed QDFT：定量荧光分析Rop：Rate of Penetration 钻进速度RHGA.G/C3 ：Apparent Grain DensityRHOZ（.G/C3）：HRDD Standard Resolution Formation DensitySUWI（.V/V）：Non-Clay Water Intergranular Water Saturation for Undisturbed Zone TNPH：特定岩石的热中子孔隙度TVD：True Vertical Depth 垂直深度TVDSS：水下真垂直深度=TCD-DF；VCL（.V/V）：Volume of Clay Type Material Relative to Total VolumeVCL1（.V/V）：Volume of Clay 1 Relative to Total VolumeVCLC（.V/V）：Volume of Calcite Relative to Total Volume VMHY（.V/V）：Volume of Moved Hydrocarbon Relative to Total VolumeVQUA（.V/V）：Volume of Quartz Relative to Total Volume VUGA（.V/V）：Volume of Gas in Undisturbed ZoneVUWA（.V/V）：Volume of Water in Undisturbed ZoneVXBW（.V/V）：Volume of Bound Water in Flushed ZoneVXGA（.V/V）：Volume of Gas in Flushed ZoneVXWA（.V/V）：Volume of Water in Flushed ZoneXline=crossline第三篇：新加坡常用名词,缩写等8月11日新加坡常用名词，缩写等新加坡华人在交谈中常用的字母词有：5C（career(事业)、cash(现款)、credit card(信用卡)、car(汽车)、condominium(共管公寓中的一个单位)。

芯片常用英文单词对照表

芯片常用英文单词对照表芯片（Chip）：指电子设备中用于存储和处理数据的微型电子元件。

半导体（Semiconductor）：指介于导体和绝缘体之间的材料，用于制造芯片。

集成电路（Integrated Circuit）：指由多个电子元件组成的微型电路，通常用于芯片中。

硅（Silicon）：指一种化学元素，常用于制造芯片。

晶圆（Wafer）：指制造芯片所用的圆形硅片。

蚀刻（Etching）：指在晶圆上制作微细电路的一种工艺。

光刻（Photolithography）：指在晶圆上制作微细电路的一种工艺，使用光刻机将电路图案转移到晶圆上。

掺杂（Doping）：指在半导体材料中添加杂质，以改变其电导性质。

氧化（Oxidation）：指在半导体材料表面形成一层氧化物的过程。

电镀（Electroplating）：指在芯片表面镀上一层金属的过程。

封装（Packaging）：指将芯片封装在保护壳中，以便于使用和安装。

引脚（Pin）：指芯片上的金属接点，用于与外部电路连接。

基板（Substrate）：指芯片上的底层材料，通常为硅片。

金属层（Metal Layer）：指芯片上的金属导线层，用于连接各个电子元件。

绝缘层（Insulation Layer）：指芯片上的绝缘材料层，用于隔离不同电子元件。

电源（Power Supply）：指为芯片提供电能的电源。

地线（Ground）：指芯片上的接地线，用于连接到电路的公共接地端。

时钟（Clock）：指芯片上的时钟信号，用于控制芯片内部各个电子元件的运行。

寄存器（Register）：指芯片上的存储单元，用于存储数据。

缓存（Cache）：指芯片上的高速存储器，用于存储经常使用的数据。

控制器（Controller）：指芯片上的控制单元，用于控制芯片内部各个电子元件的运行。

接口（Interface）：指芯片上的接口电路，用于与其他设备进行通信。

操作系统（Operating System）：指用于管理计算机硬件和软件资源的系统软件，通常运行在芯片上。

AD集成库部分元件中英文对照

AD集成库元件简写中英文对照表序号英文简写元件英文名元件中文名1RessemiSemiconductorResistor半导体电阻2CapsemiSemiconductorCapacitor半导体电容器3CapVarVariableorAdjustableCapacitor可变或可调电容4CapPol1PolarizedCapacitor(Radial)极化电容（径向）5CapPol2PolarizedCapacitor(Axial)极化电容（轴向）6CapCapacitor电容（径向）7CapPol3PolarizedCapacitor(SurfaceMount)极化电容（表面贴装）8CapFeedFeed-ThroughCapacitor馈通电容9Cap2Capacitor电容10ResVaristorVaristor(Voltage-SensitiveResistor)压敏电阻（电压敏感电阻）11ResTapTappedResistor抽头电阻12ResThermalThermalResistor热敏电阻13RpotPotentiometerResistor（侧调或顶调）电位器14RpotSMSquareTrimmingPotentiometer（顶调）方形电位器15ResBridgeResistorBridge电阻桥16Bridge1FullWaveDiodeBridge整流桥17Bridge2BridgeRectifier整流桥集成组件（比1封装较大）18ResAdjVariableResistor可变电阻19Res3ResistorIPC的高密度贴片电阻20DTunnel2TunnelDiode-DependentSourceModel隧道二极管-依赖源模型21DVaractorVariableCapacitanceDiode变容二极管22DSchottkySchottkyDiode肖特基二极管23Diode1N54023AmpGeneralPurposeRectifier3放大器通用整流器其中电容，cap/cap2/cappol1/cappol2的符号分别如下所示：。

电气工程常用名词中英文对照表

Part2：缩写全称中文GEN generator 发电机GIS gas-insulated metal-enclosed switch gear 全封闭组合电器GPT generator potential transformer 发电机电压互感器GRD ground 接地GRD FLT ground fault 接地故障GT grounding transformer 接地变压器HC holding coil 保持线圈HF high frequency 高频HG harmonic generator 谐波发生器HIPOT high potential test 高电压实验HLDG holding 保持HP horse power 马力HS hand switch 手动开关HT high tension 高压HTN high tension 高电压HV high voltage 高电压HV high voltage high velocity 高压：高速HVDC high voltage direct current transmission system 高压直流输电系统HVPC high voltage power supply 高电压源I/O input/output 输入/输出IC integrated circuit input circuit 集成电路：输入电路ICL incoming line 引入线IMP impedance 阻抗IMPLS impulse 脉冲、冲动INDN induction 感应INIT initial 启动、励磁INITD initiated 已励磁的、已启动的INSUL insulate 绝缘、隔热INTMT intermediate 间断的、间歇的INVR inverter 逆变器、反相器ISLN isolation 隔离开关ISOL isolation 隔离的、绝缘的JY watt transduce 有功变送器K kilo 千KW kilowatt 千瓦KWH kilowatt-hour 度L electrical power line 电线LA lightening arrester 避雷器LC load centre 负荷中心LC load center 负荷中心LDS line disconnecting switch 线路隔离开关、线路断路器LN line 线路LOC local 就地LPC linear power controller 线性功率放大器LR line relay 线性继电器LSIC large scale integrated circuit 大规模集成电路LV low voltage 低电压MAG magnet 磁铁/磁场的MAN manual 手动的MC manual control magnet contactor 人工控制：磁铁开关MCB molded case circuit breaker 模板式断路器MCC motor control centre 马达控制中心MCC motor control center 马达控制中心MCR main control room maxium capacity rating maxium continuous rating 主控室：最大额定出力：最大连续出力MDS motor disconnect switch 马达隔离开关MG motor generator 电动发电机ML mechanical loss 机械损失MNXFMR main transformor 主变压器MO motor 马达MOD motor operated disconnect 电动断开MPR motor protrelay 电机保护继电器MSTR motor starter 马达启动器MWE megawatt electric 兆瓦电MWH megawatt-hour 兆瓦小时NADVD not advanced 滞后NEG negative 阴极的、负的NET network 网络NEUT neutral 中性的NGT neutral groundong transformer 中性点接地变压器NL noload 空载、无负荷NOM nominal 额定的NRP normal rated power 额定功率O&R overhaul and repair 大小修OA operator auto mode 运行人员监控下的自动控制运行方式OL motor overload device 电机过负荷装置OP output power operating procedure 输出功率：运行规程OPER operating 操作OR operating record 停运记录OVHL overhaul 大修P.O. power output 功率输出P.U. per unit 标幺值PA power amplifier 功率放大器PAMS post-accident montoring instrumentation 事故后监测仪表PB push button 按钮开关PC power center 动力中心PCB power circuit breaker 功率继电器PCC power conditioning and control 电力调节与控制PCM pulse-code modulation 脉冲编码调制PD potenial difference power driven 电位差：电动的PE power equipment 发电综合控制PF power factor indicator 功率因数PFI power factor indicator 功率因数表PGCC power generation control complex 相位PH phase 功率输入PI power input 峰值负荷PK peak 峰值PL plate 板、极板PL peak load 峰值负荷PLD payload 有效负载PM phase midulation 调相PO power operator 电动操作POH planned outage hours 计划停运小时POOH planned overhaul outage hours 计划大修停运小时POS positive 正的、正极的POS position 位置POT potential transformer 电势、电位计PP peak power 峰值功率PPS plant protective system primary protection system 电厂保护系统：一次保护系统PS power station power supply power system 电站：电源：电力系统PSS power support stabilizer 电力系统稳定器PT potential transformer 电压互感器PT potential transformer 电压互感器PT pressure transducer 压力变送器PWR power 功率Q transistor 晶体管QA quick acting 快速动作QMQB quick-make quick-break 快通快断R rate rotor ratio 速率：转子：比率系数RA remote auto 远程自动RAM repair and maintenance 检修与维护RB run back 甩负荷RD run down 降负荷RF reserve free 备用ROT rate of turn reserve oil tank 转动速度：备用油箱RP rated power 额定功率RPM revolution per minute 转/分RPS revolution per second 转/秒RS resistor 电阻器RSV reserve 备用RTD resistance temperature device 电阻测量计RU run up 升负荷RU run up 升负荷Part3：缩写全称中文S/C short circuit 短路SC short circuit 短路SC semi-conductor 半导体SCR silicon-controlled rectifier 可控硅整流器SECT sectional 等级、分级SEN sensor 传感元件、传感器SERV service 工作、厂用SG standby generator 备用发电机SO shut-off 停机、遮断SOE sequence of events 事故顺序记录SOH scheduled outage hours 计划停机时间SOV solenoid -operated valve 电磁阀SP single pole spare 单极：备用SPC system power control 系统电源控制SPDT single-pole double-throw 单刀双掷SR speed reguletor standard rating silicon rectifier 调速器：额定容量：硅整流器SS station service 厂用SS stopping switch 停机开关SST station service transformer 厂用变压器ST starter startup transformer 启动器：启动变压器STA stationary 固定的STAT stator 定子STBY standby 备用STBY stand by 备用STR reserve station service transformer 厂用备用变压器SUBSTA substation 变点站SUPL supervisory 供电、电源SUR surge 冲击、波动SV solenoid valve 电磁阀、滑阀SW switch 开关SW switch 开关、手把SW short wave switch 短波：开关SWBD switchboard 配电SWBD switchboard 开关板、配电盘SWC surge withstand capability 冲击电压承受能力SWGR switchyard 配电装置SWYD switchyard 开关场SY synchroscope 同步指示器SYM symmetrical system 对称系统SYNC synchronize 使---同步SYNCG synchronizing 同步SYNSCP synchroscope 同步指示器SYS system 系统SYST system 系统T&D transimission and distribution 输电与配电T&M testing and maintenance electrical trip and monitoring 实验与维修：电电气跳闸与监视系统TACH tachometer 转速表TASS technique assembly 装配工艺TB therminal board 端子板、终端板TBO time between overhaul 大修间隔TC thermocouple 热电偶TD time delay 延时TD technique data time delay 技术数据：时滞、延时TDC time delay closing 延时闭合TDD time delay on deenerization 延时失励TDE time delay energization 延时激励TDO time delay opening 延时打开TE thermoelectric test equipment 热电的：测试设备TH thermal element 热电偶、热偶元件TIS test instrumentation system thermal insulation system 测试仪表系统：绝缘系统TL total loss total load time limit 总损失：总负荷：时间限制TM time monitor 时间监视器TOT total 总共TP test point time pulse 实验点、测试点：时间脉冲TPDT triple-pole double-throw 三刀双掷开关TR test run transducer 试运行：变送器TRANS transport 运输TRC transmission and reception controller 传输及接收控制器TRIAC triode altermating current switch 三极管交流开关TRU transmit-receive unit 发送接收装置TSI turbine supervisory instrument 汽轮机监视仪表TVM transistor voltmeter 晶体管电压表U unit 机组UAT unit auxiliary transformer 厂用变压器UDF unit derating factor 机组降低出力系数UDG unit derating generation 机组降低出力少发电量UDH unit derating hours 机组降低出力小时UERS unusual event recording system 异常事故记录系统UNDH unit derating hours 机组降低出力小时UNIV universal 通用UNLD unloading 无载的、空载的UO unit operator 机组操作员UOF unplanned outage factor 非计划停运系数UOH unplanned outage hour 非计划停运小时UOR unplanned outage rate 非计划停运率UPS uninterrupted power supply 不停电电源URT unit run time 设备运行时间UST unit station service transformer 厂用变压器UV under voltage 电压不足、低电压UV 电压监察V AR variable 变量V ARHM garhour meter 无功电度表VC variable capacitor voltage comparator 可变电容:电压比较器VCB vacuum circuit breaker 真空断路器VCT voltage current transformer 电压电流互感器VENT ventilator 通风VF vriable frequency 可变频率VOLTREG voltage regularor 电压调节器VR variable resistor voltage regulator 可变电阻：稳压器VT vibration testing 振动实验VT voltage time to breakdown 击穿电压时间VTVM vacuum-tube voltmeter 真空管电压表W/O without 没有WDG winding 绕组、线圈WH watt-hour 瓦特小时WHM watthour meter 有功电度表WTR water 水WV working voltage 工作电压WZJ 绝缘监察XDCR transducer 变送器XFER transfer 转换XFMR transfoormer 变压器XMSN transmission 输电XMTR transmitter 变送器XS transfer switch 转换开关YD yard 工作场。

【集成电路(IC)】电子专业术语英汉对照加注解

【集成电路(IC)】电子专业术语英汉对照加注解电子专业英语术语★rchitecture（结构）：可编程集成电路系列的通用逻辑结构。

★ASIC（Application Specific Integrated Circuit－专用集成电路）：适合于某一单一用途的集成电路产品。

★ATE（Automatic Test EQUIPment－自动测试设备）：能够自动测试组装电路板和用于莱迪思ISP 器件编程的设备。

★BGA（Ball Grid Array－球栅阵列）：以球型引脚焊接工艺为特征的一类集成电路封装。

可以提高可加工性，减小尺寸和厚度，改善了噪声特性，提高了功耗管理特性。

★Boolean Equation（逻辑方程）：基于逻辑代数的文本设计输入方法。

★Boundary Scan Test（边界扫描测试）：板级测试的趋势。

为实现先进的技术所需要的多管脚器件提供了较低的测试和制造成本。

★Cell-Based PLD（基于单元的可编程逻辑器件）：混合型可编程逻辑器件结构，将标准的复杂的可编程逻辑器件（CPLD）和特殊功能的模块组合到一块芯片上。

★CMOS（Complementary Metal Oxide Semiconductor－互补金属氧化物半导体）：先进的集成电路★加工工艺技术，具有高集成、低成本、低能耗和高性能等特征。

CMOS 是现在高密度可编程逻辑器件（PLD）的理想工艺技术。

★CPLD（Complex Programmable Logic Device－复杂可编程逻辑器件）：高密度的可编程逻辑器件，包含通过一个中央全局布线区连接的宏单元。

这种结构提供高速度和可预测的性能。

是实现高速逻辑的理想结构。

理想的可编程技术是E2CMOS?。

★Density （密度）：表示集成在一个芯片上的逻辑数量，单位是门（gate）。

密度越高，门越多，也意味着越复杂。

★Design Simulation（设计仿真）：明确一个设计是否与要求的功能和时序相一致的过程。

电子技术基本词汇中英文对照

电子技术基本词汇Chapter 7 analog signals 模拟信号digital signals 数字信号Sequential Logic Circuits 时序逻辑电路Combinatorial Logic Circuits 组合逻辑电路Chip 芯片Integrated circuits (IC) 集成电路Boolean algebra 布尔代数Boolean variables 布尔变量Synthesis of Logic Circuits组合逻辑电路综合analysis of Logic Circuits组合逻辑电路分析De Morgan’s Laws德摩根律Gate circuit 门电路Minterms 最小项Maxterms 最大项Sum-of-Products 与或表达式Product-of-Sums 或与表达式Logic diagram 逻辑电路图Logic function 逻辑函数Truth table 真值表Encoders 编码器Decoders 译码器Karnaugh Maps 卡诺图Flip-flop 触发器Clock Signal 时钟信号Synchronous 同步Asynchronous 异步positive-edge-triggered 上升沿触发negative-edge-triggered下降沿触发Shift Register 移位寄存器Counter 计数器Binary counter 二进制计数器Decimal counter十进制计数器Chapter 8 Carriers 载流子Diode 二极管Semiconductor 半导体pn junction pn结hole 空穴electron 电子Saturation current 饱和电流Thermal voltage 热电压Anode 阳极Cathode 阴极Forward/ reverse bias 前向/反向偏置Zener Diode 齐纳/稳压二极管operating point 工作点Rectifier circuits 整流电路Filter circuits 滤波电路Half-wave rectifier 半波整流电路Full-wave rectifier 全波整流电路Clipper Circuits 限幅/削波电路Clamp Circuits钳位电路Small-signal Equivalent Circuits 小信号等效电路Chapter 9 Amplifiers 放大器/放大电路Cascaded Amplifiers 级联放大器Amplitude 幅值Phase 相位Inverting amplifiers 反相放大电路Noninverting amplifiers 同相放大电路Voltage-Amplifier 电压放大电路Current-Amplifier 电流放大电路Transconductance -Amplifier 跨导放大电路Transresistance-Amplifier 互阻放大电路Gain 增益Current/voltage/power gain 电流/电压/功率增益Input/output resistance 输入/输出电阻Loading Effects 负载效应AC Coupling 交流耦合Direct Coupling 直接（直流）耦合Phase/Waveform Distortion 相位/波形失真（畸变）Transfer Characteristic 转移特性Differential Amplifiers 差分放大电路inverting input 反相输入端noninverting input 同相输入端Differential Signal 差分（模）信号Common-mode Signal 共模信号Common Mode Rejection Ratio （CMRR）共模抑制比Bias Current 偏置电流Offset Voltage 失调电压Offset Current 失调电流Complementary symmetry power amplifiers 互补对称功率放大电路Feedback 反馈Half-power Frequency 半功率频率Low frequency region 低频区Midband frequency region 中频区high frequency region 高频区Pulse Response 脉冲响应Harmonic Distortion 谐波失真Chapter 10Transistors 晶体管Field-Effect Transistors (FET) 场效应晶体管Metal-oxide-semiconductor MOSFET 金属氧化物半导体场效应晶体管n-Channel Enhancement n沟道增强型Grid 栅极Source源极Drain漏极Base 衬底Cutoff Region 截止区Triode Region 三角区/可变电阻区Saturation Region 饱和区Bias Circuits 偏置电路The Fixed- Plus Self-Bias Circuit 固定增益自偏置电路Transconductance 跨导Drain Resistance 漏极电阻Common-source Amplifiers 共源极放大电路bypass capacitor 旁通电容coupling capacitor 耦合电容Source Followers 源极跟随器CMOS 互补对称MOS管Chapter 11Bipolar Junction Transistors (BJT) 双极型晶体管Triode Tube 三极管base collector p-n junction 基集pn结（集电结）base emitter p-n junction 基射pn结（发射结）fixed base bias circuit 固定偏置电路Four-Resistor bias Circuit 四电阻偏置电路/分压偏置电路Active region 线性放大区Common-Emitter 共发射极Emitter Followers 射极跟随器nonlinear distortion 非线性畸变Chapter 12Operational Amplifiers 运算放大器Infinite gain 无穷大增益Summing-point Constraint 结点约束(加和点约束) Virtual short 虚短Virtual open 虚断negative feedback 负反馈positive feedback 正反馈Serial/parallel feedback 串联/并联反馈Bandwidth 带宽open-loop gain 开环增益closed-loop gain 闭环增益Output Voltage Swing 输出电压幅值限制Output Current Limits 输出电流限制Slew-Rate Limitation 转换速率限制Full-power bandwidth 全功率带宽Integrators 积分器Differentiators 微分器。

零部件英文缩写及零部件中英文对照

零部件英文缩写及零部件中英文对照一、零部件英文缩写1. PCB：Printed Circuit Board（印刷电路板）2. MCU：Microcontroller Unit（微控制器单元）3. IC：Integrated Circuit（集成电路）4. LED：Light Emitting Diode（发光二极管）5. LCD：Liquid Crystal Display（液晶显示器）6. motor：Electric Motor（电动机）7. sensor：Sensor（传感器）8. resistor：Resistor（电阻器）9. capacitor：Capacitor（电容器）10. inductor：Inductor（电感器）二、零部件中英文对照1. 集成电路：Integrated Circuit2. 发光二极管：Light Emitting Diode3. 液晶显示器：Liquid Crystal Display4. 电动机：Electric Motor5. 传感器：Sensor6. 电阻器：Resistor7. 电容器：Capacitor8. 电感器：Inductor9. 印刷电路板：Printed Circuit Board10. 微控制器单元：Microcontroller Unit三、更多零部件中英文对照11. 开关：Switch12. 连接器：Connector13. 插头：Plug14. 插座：Socket15. 线缆：Cable16. 变压器：Transformer17. 继电器：Relay18. 晶体管：Transistor19. 二极管：Diode20. 电池：Battery四、常用零部件英文缩写补充11. CPU：Central Processing Unit（中央处理单元）12. GPU：Graphics Processing Unit（图形处理单元）13. RAM：Random Access Memory（随机存取存储器）14. ROM：ReadOnly Memory（只读存储器）15. USB：Universal Serial Bus（通用串行总线）16. HDMI：HighDefinition Multimedia Interface（高清多媒体接口）17. VGA：Video Graphics Array（视频图形阵列）18. SATA：Serial ATA（串行高级技术附件）19. SSD：Solid State Drive（固态硬盘）20. HVAC：Heating, Ventilation, and Air Conditioning（供暖、通风及空调系统）五、扩展零部件中英文对照列表21. 振动电机：Vibration Motor22. 螺线管：Solenoid23. 伺服电机：Servo Motor24. 步进电机：Stepper Motor25. 保险丝：Fuse26. 断路器：Circuit Breaker27. 滑动轴承：Plain Bearing28. 滚动轴承：Ball Bearing29. 液压缸：Hydraulic Cylinder30. 气缸：Pneumatic Cylinder六、额外零部件英文缩写补充21. Liion：Lithiumion（锂离子）22. NiMH：NickelMetal Hydride（镍氢）23. OLED：Organic Light Emitting Diode（有机发光二极管）24. FPGA：FieldProgrammable Gate Array（现场可编程门阵列）25. DSP：Digital Signal Processor（数字信号处理器）26. GPS：Global Positioning System（全球定位系统）27. RFID：RadioFrequency Identification（射频识别）28. WiFi：Wireless Fidelity（无线保真）29. Bluetooth：蓝牙（一种无线技术标准）30. IoT：Internet of Things（物联网）。

Proteus中英文对照表

Proteus元件库元件名称及中英对照AND 与门ANTENNA 天线BATTERY 直流电源BELL 铃,钟BVC 同轴电缆接插件BRIDEG 1 整流桥(二极管) BRIDEG 2 整流桥(集成块) BUFFER 缓冲器BUZZER 蜂鸣器CAP 电容CAPACITOR 电容CAPACITOR POL 有极性电容CAPVAR 可调电容CIRCUIT BREAKER 熔断丝COAX 同轴电缆CON 插口CRYSTAL 晶体整荡器DB 并行插口DIODE 二极管DIODE SCHOTTKY 稳压二极管DIODE VARACTOR 变容二极管DPY_3-SEG 3段LEDDPY_7-SEG 7段LEDDPY_7-SEG_DP 7段LED(带小数点) ELECTRO 电解电容FUSE 熔断器INDUCTOR 电感INDUCTOR IRON 带铁芯电感INDUCTOR3 可调电感JFET N N沟道场效应管JFET P P沟道场效应管LAMP 灯泡LAMP NEDN 起辉器LED 发光二极管METER 仪表MICROPHONE 麦克风MOSFET MOS管MOTOR AC 交流电机MOTOR SERVO 伺服电机NAND 与非门NOR 或非门NOT 非门NPN NPN三极管NPN-PHOTO 感光三极管OPAMP 运放OR 或门PHOTO 感光二极管PNP 三极管NPN DAR NPN三极管PNP DAR PNP三极管POT 滑线变阻器PELAY-DPDT 双刀双掷继电器RES1.2 电阻RES3.4 可变电阻RESISTOR BRIDGE ? 桥式电阻RESPACK ? 电阻SCR 晶闸管PLUG ? 插头PLUG AC FEMALE 三相交流插头SOCKET ? 插座SOURCE CURRENT 电流源SOURCE VOLTAGE 电压源SPEAKER 扬声器SW ? 开关SW-DPDY ? 双刀双掷开关SW-SPST ? 单刀单掷开关SW-PB 按钮THERMISTOR 电热调节器TRANS1 变压器TRANS2 可调变压器TRIAC ? 三端双向可控硅TRIODE ? 三极真空管VARISTOR 变阻器ZENER ? 齐纳二极管DPY_7-SEG_DP 数码管SW-PB 开关元件名称中文名说明7407 驱动门1N914 二极管74Ls00 与非门74LS04 非门74LS08 与门74LS390 TTL 双十进制计数器7SEG 4针BCD-LED 输出从0-9 对应于4根线的BCD码7SEG 3-8译码器电路BCD-7SEG转换电路AlterNATOR 交流发电机AMMETER-MILLI mA安培计AND 与门BATTERY 电池/电池组BUS 总线CAP 电容CAPACITOR 电容器CLOCK 时钟信号源CRYSTAL 晶振Compim 串口D-FLIPFLOP D触发器FUSE 保险丝GROUND 地LAMP 灯LED-RED 红色发光二极管LM016L 2行16列液晶可显示2行16列英文字符，有8位数据总线D0-D7，RS，R/W，EN三个控制端口（共14线），工作电压为5V。

AD集成库元件简写中英文对照表

转载：/uid-25148547-id-138696.htmlAD集成库元件简写中英文对照表序号英文简写元件英文名元件中文名1Res semi Semiconductor Resistor半导体电阻2Cap semi Semiconductor Capacitor半导体电容器3Cap Var Variable or Adjustable Capacitor可变或可调电容4Cap Pol1Polarized Capacitor (Radial)极化电容（径向）5Cap Pol2Polarized Capacitor (Axial)极化电容（轴向）6Cap Capacitor电容（径向）7Cap Pol3Polarized Capacitor (Surface Mount)极化电容（表面贴装）8Cap Feed Feed-Through Capacitor馈通电容9Cap2Capacitor电容10Res Varistor Varistor (Voltage-Sensitive Resistor)压敏电阻（电压敏感电阻）11Res Tap Tapped Resistor抽头电阻12Res Thermal Thermal Resistor 热敏电阻13Rpot Potentiometer Resistor （侧调或顶调）电位器14Rpot SM Square Trimming Potentiometer（顶调）方形电位器15Res Bridge Resistor Bridge电阻桥16Bridge1Full Wave Diode Bridge整流桥17Bridge2Bridge Rectifier整流桥集成组件（比1封装较大）18Res Adj Variable Resistor可变电阻19Res3Resistor IPC的高密度贴片电阻20 D Tunnel2Tunnel Diode - Dependent Source Model隧道二极管 - 依赖源模型21 D Varactor Variable Capacitance Diode变容二极管22 D Schottky Schottky Diode肖特基二极管23Diode 1N5402 3 Amp General Purpose Rectifier3放大器通用整流器其中，cap，cap2，cap pol1和cap pol2分别如下图所示：其中，径向型电容如下图所示：轴向型电容如下所示：有极性电阻为电解电容，无极性电阻为普通电容，电解电容的容量一般比普通电容的大，在滤波时电解电容用于滤低频，普通电容用于滤高频。

半导体厂务专业名词中英文对照表

半导体厂务专业名词中英文对照表Semiconductor Factory Terminologies English-Chinese Comparison1. Semiconductor - 半导体2. Wafer - 晶圆3. Die - 芯片4. Clean Room - 净化室5. Lithography - 光刻6. Etching - 蚀刻7. Deposition - 沉积8. Patterning - 图形化9. Doping - 掺杂10. Metrology - 计量11. Inspection - 检验12. Test - 测试13. Assembly - 组装14. Packaging - 封装15. Back-End - 后端16. Front-End - 前端17. Sputtering - 粒子沉积18. Chemical Vapor Deposition (CVD) - 化学气相沉积19. Physical Vapor Deposition (PVD) - 物理气相沉积20. Thin Film - 薄膜21. Photolithography - 光刻技术22. Ion Implantation - 离子注入23. Diffusion - 扩散24. Planarization - 平坦化25. Ion Etching - 离子蚀刻26. Circuit - 电路27. Integrated Circuit (IC) - 集成电路28. Silicon - 硅29. Gallium Arsenide (GaAs) - 砷化镓30. Silicon dioxide - 二氧化硅This English-Chinese comparison table provides a comprehensive list of key terminologies used in the semiconductor industry. These terms are essential for professionals working in semiconductor manufacturing facilities to communicate effectively with their Chinese counterparts. From basic concepts like wafer and die to advanced processes such as lithography and etching, having a clear understanding of these terms in both languages is crucial for successful collaboration and operations in a semiconductor factory.。

外文翻译--集成电路（IC）外文翻译中英文对照

外文翻译--集成电路（IC）外文翻译中英文对照Integrated circuit (IC)IntroducionIntegrated circuit also called microelectronic circuit or chip an assembly of electronic components, fabricated as a single unit, in which miniaturized active devices (e.g., transistors and diodes) and passive devices (e.g., capacitors and resistors) and their interconnections are built up on a thin substrate of semiconductor material (typically silicon). The resulting circuit is thus a small monolithic “chip,” which may be as small as a few square centimetres or only a few square millimetres. The individual circuit components are generally microscopic in size.Integrated circuits have their origin in the invention of the transistor in 1947 by William B. Shockley and his team at the American Telephone and Telegraph Company's Bell Laboratories. Shockley's team (including John Bardeen and Walter H. Brattain) found that, under the right circumstances, electrons would form a barrier at the surface of certain crystals, and they learned to control the flow of electricity through the crystal by manipulating this barrier. Controlling electron flow through a crystal allowed the team to create a device that could perform certain electrical operations, such as signal amplification, that were previously done by vacuum tubes. They named this device a transistor, from a combination of the words transfer and resistor (see photograph). The study of methods of creating electronic devices using solid materials became known as solid-state electronics. Solid-state devices proved to bemuch sturdier, easier to work with, more reliable, much smaller, and less expensive than vacuum tubes.Using the same principles and materials, engineers soon learned to create other electrical components, such as resistors and capacitors. Now that electrical devices could be made so small, the largest part of a circuit was the awkward wiring between the devices.In 1958 Jack Kilby of T exas Instruments, Inc., and Robert Noyce of Fairchild Semiconductor Corporation independently thought of a way to reduce circuit size further. They laid very thin paths of metal (usually aluminum or copper) directly on the same piece of material as their devices. These small paths acted as wi res. With this technique an entire circuit could be “integrated” on a single piece of sol id material and an integrated circuit (IC) thus created. ICs can contain hundreds of thousands of individual transistors on a single piece of material the size of a pea. Working with that many vacuum tubes would have been unrealistically awkward and expensive. The invention of the integrated circuit made technologies of the Information Age feasible. ICs are now used extensively in all walks of life, from cars to toasters to amusement park rides.Basic IC typesAnalog versus digital circuitsAnalog, or linear, circuits typically use only a few components and are thus some of the simplest types of ICs. Generally, analog circuits are connected to devices that collect signals from the environment or send signals back to theenvironment. For example, a microphone converts fluctuating vocal sounds into an electrical signal of varying voltage. An analog circuit then modifies the signal in some useful way—such as amplifying it or filtering it of undesirable noise. Such a signal might then be fed back to a loudspeaker, whichwould reproduce the tones originally picked up by the microphone.Another typical use for an analog circuit is to control some device in response to continual changes in the environment. For example, a temperature sensor sends a varying signal to a thermostat, which can be programmed to turn an air conditioner, heater, or oven on and off once the signal has reached a certain value.A digital circuit, on the other hand, is designed to accept only voltages of specific given values. A circuit that uses only two states is known as a binary circuit. Circuit design with binary quantities, “on” and “off” representing 1 and 0 (i.e., true and false), uses the logic of Boolean algebra. The three basic logic functions—NOT, AND, and OR—together with their truth tables are given in the figure. (Arithmetic is also performed in the binary number system employing Boolean algebra.) These basic elements are combined in the design of ICs for digital computers and associated devices to perform the desired functions.Microprocessor circuitsMicroprocessors are the most complicated ICs. They are composed of millions of transistors that have been configured as thousands of individual digital circuits, each of which performs some specific logic function. A microprocessor is built entirely of these logic circuits synchronized to each other.Just like a marching band, the circuits perform their logic function only on direction by the bandmaster. The bandmaster in a microprocessor, so to speak, is called the clock. The clock is a signal that quickly alternates between two logic states. Every time the clock changes state, every logic circuit in the microprocessor does something. Calculations can be made very quickly,depending on the speed (“clock frequency”) of the microprocessor.Microprocessors contain some circuits, known as registers, that store information. Registers are predetermined memory locations. Each processor has many different types of registers. Permanent registers are used to store the preprogrammed instructions required for various operations (such as addition and multiplication). Temporary registers store numbers that are to be operated on and also the result. Other examples of registers include the “program counter,” the “stack pointer,” and the “address” register.Microprocessors can perform millions of operations per second on data. In addition to computers, microprocessors are common in video game systems, televisions, cameras, and automobiles.Memory circuitsMicroprocessors typically have to store more data than can be held in a few registers. This additional information is relocated to special memory circuits. Memory is composed of dense arrays of parallel circuits that use their voltage states to store information. Memory also stores the temporary sequence of instructions, or program, for the microprocessor. Manufacturers continually strive to reduce the size of memory circuits—to increase capability without increasing space. In addition, smaller components typically use less power, operate more efficiently, and cost less to manufacture.Digital signal processorsA signal is an analog waveform—anything in the environment that can be captured electronically. A digital signal is an analog waveform that has been converted into a series ofbinary numbers for quick manipulation. As the name implies, a digital signal processor (DSP) processes signals digitally, as patterns of 1s and 0s. For instance, using an analog-to-digital converter, commonly called an A-to-D or A/D converter, a recording of someone's voice can be converted into digital 1s and 0s. The digital representation of the voice can then be modified by a DSP using complex mathematical formulas. For example, the DSP algorithm in the circuit may be configured to recognize gaps between spoken words as background noise and digitally remove ambient noise from the waveform. Finally, the processed signal can be converted back (by a D/A converter) into an analog signal for listening. Digital processing can filter out background noise so fast that there is no discernible delay and the signal appears to be heard in “real time.” For instance, such processing enables “live” televisionbroadcasts to focus on a quarterback's signals in an American gridiron football game. DSPs are also used to produce digital effects on live television. For example, the yellow marker lines displayed during the football game are not really on the field; a DSP adds the lines after the cameras shoot the picture but before it is broadcast. Similarly, some of the advertisements seen on stadium fences and billboards during televised sporting events are not really there.Application-specific ICsAn application-specific IC (ASIC) can be either a digital or an analog circuit. As their name implies, ASICs are not reconfigurable; they perform only one specific function. For example, a speed controller IC for a remote control car is hard-wired to do one job and could never become a microprocessor. An ASIC does not contain any ability to follow alternateinstructions.Radio-frequency ICsRadio-frequency ICs (RFICs) are rapidly gaining importance in cellular telephones and pagers. RFICs are analog circuits that usually run in the frequency range of 900 MHz to 2.4 GHz (900 million hertz to 2.4 billion hertz). They are usually thought of as ASICs even though some may be configurable for several similar applications. Most semiconductor circuits that operate above 500 MHz cause the electronic components and their connecting paths to interferewith each other in unusual ways. Engineers must use special design techniques to deal with the physics of high-frequency microelectronic interactions.Microwave monolithic ICsA special type of RFIC is known as a microwave monolithic IC (MMIC). These circuits run in the 2.4- to 20-GHz range, or microwave frequencies, and are used in radar systems, in satellite communications, and as power amplifiers for cellular telephones.Just as sound travels faster through water than through air, electron velocity is different through each type of semiconductor material. Silicon offers too much resistance for microwave-frequency circuits, and so the compound gallium arsenide (GaAs) is often used for MMICs. Unfortunately, GaAs is mechanically much less sound than silicon. It breaks easily, so GaAs wafers are usually much more expensive to build than silicon wafers.Basic semiconductor designAny material can be classified as one of three types: conductor, insulator, or semiconductor. A conductor (such as copper or salt water) can easily conduct electricity because it has an abundance of free electrons. An insulator (such as ceramic ordry air) conducts electricity very poorly because it has few or no free electrons. A semiconductor (such as silicon or gallium arsenide) is somewhere between a conductor and an insulator. It is capable of conducting some electricity, but not much.Basic semiconductor designDoping siliconMost ICs are made of silicon, which is abundant in ordinary beach sand. Pure crystalline silicon, as with other semiconducting materials, has a very high resistance to electrical current at normal room temperature. However, with the addition of certain impurities, known as dopants, the silicon can be made to conduct usable currents. In particular, the doped silicon can be used as a switch, turning current off and on as desired.The process of introducing impurities is known as doping or implantation. Depending on a dopant's atomic structure, the result of implantation will be either an n-type (negative) or a p-type (positive) semiconductor. An n-type semiconductor results from implanting dopant atoms that have more electrons in their outer (bonding) shell than silicon, as shown in the figure. The resulting semiconductor crystal contains excess, or free, electrons that are available for conducting current. A p-type semiconductor results from implanting dopant atoms that have fewer electrons in their outer shell than silicon. The resulting crystal contains “holes” in its bonding structure where electrons would normally be located. In essence, such holes can move through the crystal conducting positive charges.Basic semiconductor designThe p-n junctionA p-type or an n-type semiconductor is not very useful on itsown. However, joining these opposite materials creates what is called a p-n junction. A p-n junction forms a barrier to conduction between the materials. Although the electrons in the n-type material are attracted to the holes in the p-type material, the electrons are not normally energetic enough to overcome the intervening barrier. However, if additional energy is provided to the electrons in the n-type material, they will be capable of crossing the barrier into the p-type material—and current will flow. This additional energy can be supplied by applying a positive voltage to the p-type material,as shown in the figure. The negatively charged electrons will then be highly attracted to the positive voltage across the junction.A p-n junction that conducts electricity when energy is added to the n material is called forward-biased because the electrons move forward into the holes. If voltage is applied in the opposite direction—a positive voltage connected to the n side of the junction—no current will flow. The electrons in the n material will still be attracted to the positive voltage, but the voltage will now be on the same side of the barrier as the electrons. In this state a junction is said to be reverse-biased. Since p-n junctions conduct electricity in only one direction, they are a type of diode. Diodes are essential building blocks of semiconductor switches.Basic semiconductor designField-effect transistorsBringing a negative voltage close to the centre of a long strip of n-type material will repel nearby electrons in the material and thus form holes—that is, transform some of the strip in the middle to p-type material. This change in polarity utilizing an electric field gives the field-effect transistor its name. (See animation.) While the voltage is being applied, there will existtwo p-n junctions along the strip, from n to p and then from p back to n. One of the two junctions will always be reverse-biased. Since reverse-biased junctions cannot conduct, current cannot flow through the strip. The field effect can be used to create a switch (transistor) to turn current off and on, simply by applying and removing a small voltage nearby in order to create or destroy reverse-biased diodes in the material.A transistor created by using the field effect is called a field-effect transistor (FET).The location where the voltage is applied is known as a gate. The gate is separated from the transistor strip by a thin layer of insulation to prevent it from short-circuiting the flow of electrons through the semiconductor from an input (source) electrode to an output (drain) electrode. Similarly, a switch can be made by placing a positive gate voltage near a strip of p-type material. A positive voltage attracts electrons and thus forms a region of n within a strip of p. This again creates two p-n junctions, or diodes. As before, one of the diodes will always be reverse-biased and will stop current from flowing. FETs are good for building logic circuits because they require only a small current during switching. No current is required for holding the transistor in an on or off state; a voltage will。

电子电路术语中英文对照

电子电路术语中英文对照AC(alternating current) 交流(电)ACPI(Advanced Configuration and Power Interface)高级配置电源界面A／D(analog to digital) 模拟／数字转换ADC(analog to digital convertor) 模拟／数字转换器ADM(adaptive delta modulation) 自适应增量调制ADPCM(adaptive differential pulse code modulation) 自适应差分脉冲编码调制ALU(arithmetic logic unit) 算术逻辑单元AM(Amplitude Modulation)调幅ASCII(American standard code for information interchange) 美国信息交换标准码ATA(Advanced Technology Attachment)高级技术附加装置AV(audio visual) 声视，视听BCD(binary coded decimal) 二进制编码的十进制数BCR(bi-directional controlled rectifier)双向晶闸管BCR(buffer courtier reset) 缓冲计数器BIOS(Basic Input Output System) 基本输入输出系统BZ(buzzer) 蜂鸣器，蜂音器C(capacitance，capacitor) 电容量，电容器CATV(cable television) 电缆电视CCD(charge-coupled device) 电荷耦合器件CCTV(closed-circuit television) 闭路电视CMOS(complementary) 互补MOSCPU(central processing unit)中央处理单元CS(control signal) 控制信号D(diode) 二极管DAST(direct analog store technology) 直接模拟存储技术DC(direct current) 直流DIP(dual in-line package) 双列直插封装DP(dial pulse) 拨号脉冲DRAM(dynamic random access memory) 动态随机存储器DTL(diode-transistor logic) 二极管晶体管逻辑DUT(device under test) 被测器件DVM(digital voltmeter) 数字电压表ECG(electrocardiograph) 心电图ECL(emitter coupled logic) 射极耦合逻辑EDI(electronic data interchange) 电子数据交换EIA(Electronic Industries Association) 电子工业联合会EIDE(Enhanced Integrated Drive Electronics)增强集成电路设备EOC(end of conversion) 转换结束EPROM(erasable programmable read only memory) 可擦可编程只读存储器EEPROM(electrically EPROM) 电可擦可编程只读存储器ESD(electro-static discharge) 静电放电FET(field-effect transistor) 场效应晶体管FS(full scale) 满量程F／V(frequency to voltage convertor) 频率／电压转换FLTA(Foreign Language Teaching Agency)上海外教网FM(frequency modulation) 调频FSK(frequency shift keying) 频移键控FSM(field strength meter) 场强计FST(fast switching shyster) 快速晶闸管FT(fixed time) 固定时间FU(fuse unit) 保险丝装置FWD(forward) 正向的GAL(generic array logic) 通用阵列逻辑GND(ground) 接地，地线GPU(Graphic Process Unit)图形处理单元/图形处理器GTO(Sate turn off thruster) 门极可关断晶体管HART(highway addressable remote transducer) 可寻址远程传感器数据公路HCMOS(high density COMS) 高密度互补金属氧化物半导体(器件)HDD(hard disk drive)硬盘驱动器HF(high frequency) 高频HIFI(High-Fidelity)高保真HTL(high threshold logic) 高阈值逻辑电路HTS(heat temperature sensor) 热温度传感器IC(integrated circuit) 集成电路ID(international data) 国际数据IDE (Integrated Drive Electronics)集成电路设备IGBT(insulated gate bipolar transistor) 绝缘栅双极型晶体管IGFET(insulated gate field effect transistor) 绝缘栅场效应晶体管I／O(input／output) 输入／输出I／V(current to voltage convertor) 电流-电压变换器IPM(incidental phase modulation) 附带的相位调制IPM(intelligent power module) 智能功率模块IR(infrared radiation) 红外辐射IRQ(interrupt request) 中断请求ISA( Industry Standard Architecture) 工业标准结构JFET(junction field effect transistor) 结型场效应晶体管LAS(light activated switch)光敏开关LASCS(light activated silicon controlled switch) 光控可控硅开关LCD(liquid crystal display) 液晶显示器LDR(light dependent resistor) 光敏电阻LED(light emitting diode) 发光二极管LRC(longitudinal redundancy check) 纵向冗余(码)校验LSB(least significant bit) 最低有效位LSI(1arge scale integration) 大规模集成电路M(motor) 电动机MCT(MOS controlled gyrator) 场控晶闸管MIC(microphone) 话筒，微音器，麦克风min(minute) 分MOS(metal oxide semiconductor)金属氧化物半导体MOSFET(metal oxide semiconductor FET) 金属氧化物半导体场效应晶体管N(negative) 负NMOS(N-channel metal oxide semiconductor FET) N 沟道MOSFETNTC(negative temperature coefficient) 负温度系数OC(over current) 过电流OCB(overload circuit breaker) 过载断路器OCS(optical communication system) 光通讯系统OR(type of logic circuit) 或逻辑电路OV(over voltage) 过电压P(pressure) 压力FAM(pulse amplitude modulation) 脉冲幅度调制PATA(Parallel Advanced Technology Attachment)串行ATAPC(pulse code) 脉冲码PCI(Peripheral Component Interconnect)外设部件互连标准PCM(pulse code modulation) 脉冲编码调制PDM(pulse duration modulation) 脉冲宽度调制PF(power factor) 功率因数PFM(pulse frequency modulation) 脉冲频率调制PG(pulse generator) 脉冲发生器PGM(programmable) 编程信号PI(proportional-integral(controller)) 比例积分(控制器)PID(proportional-integral-differential(control ler))比例积分微分(控制器)PIN(positive intrinsic-negative) 光电二极管PIO(parallel input output) 并行输入输出PLD(phase-locked detector) 同相检波PLD(phase-locked discriminator) 锁相解调器PLL(phase-locked loop) 锁相环路PMOS(P-channel metal oxide semiconductor FET) P 沟道MOSFETP-P(peak-to-peak) 峰--峰PPM(pulse phase modulation) 脉冲相位洲制PRD(piezoelectric radiation detector) 热电辐射控测器PROM(programmable read only memory) 可编只读程存储器PRT(platinum resistance thermometer) 铂电阻温度计PRT(pulse recurrent time) 脉冲周期时间PUT(programmable unijunction transistor) 可编程单结晶体管PWM(pulse width modulation) 脉宽调制R(resistance，resistor) 电阻，电阻器RAM(random access memory) 随机存储器RCT(reverse conducting thyristor) 逆导晶闸管REF(reference) 参考，基准REV(reverse) 反转R/F(radio frequency) 射频RGB(red／green／blue) 红绿蓝ROM(read only memory) 只读存储器RP(resistance potentiometer) 电位器RST(reset) 复位信号RT(resistor with inherent variability dependent) 热敏电阻RTD(resistance temperature detector) 电阻温度传感器RTL(resistor transistor logic) 电阻晶体管逻辑(电路)RV(resistor with inherent variability dependent on the voltage) 压敏电阻器SA(switching assembly) 开关组件SBS(silicon bi-directional switch) 硅双向开关，双向硅开关SCR(silicon controlled rectifier) 可控硅整流器SCS(safety control switch) 晶体管-晶体管逻辑(电路) 安全控制开关SCS(silicon controlled switch) 可控硅开关SCS(speed control system) 速度控制系统SCS(supply control system) 电源控制系统SG(spark gap) 放电器SIT(static induction transformer) 静电感应晶体管SITH(static induction thyristor) 静电感应晶闸管SP(shift pulse) 移位脉冲SPI(serial peripheral interface) 串行外围接口SR(sample realy，saturable reactor) 取样继电器，饱和电抗器SR(silicon rectifier) 硅整流器SRAM(static random access memory) 静态随机存储器SSR(solid-state relay) 固体继电器SSR(switching select repeater) 中断器开关选择器SSS(silicon symmetrical switch) 硅对称开关，双向可控硅SSW(synchro-switch) 同步开关ST(start) 启动ST(starter) 启动器STB(strobe) 闸门，选通脉冲T(transistor) 晶体管，晶闸管TACH(tachometer) 转速计转速表TP(temperature probe) 温度传感器TRIAC(triodes AC switch) 三极管交流开关TTL(Transistor-Transistor Logic) 晶体管-晶体管逻辑(电路)TV(television) 电视UART(universal asynchronous receiver transmitter) 通用异步收发器UPS(Uninterrupted Power Supply)不间断电源USB(Universal Serial Bus)通用串行接口VCO(voltage controlled oscillator) 压控振荡器VD(video decoders) 视频译码器VDR(voltage dependent resistor) 压敏电阻VF(video frequency) 视频V／F(voltage-to-frequency) 电压／频率转换V／I(voltage to current convertor) 电压-电流变换器VM(voltmeter) 电压表VS(vacuum switch) 电子开关VT(visual telephone) 电视电话VT(video terminal) 视频终端WIFI(Wireless Fidelity)802.11b标准11 / 11。

电力电子技术中英文词汇对照表

电力电子技术中英文词汇对照表中文英文词汇对照（按汉语拼音排序）A安全工作区 Safe Operating Area—SOAB半桥电路 Half Bridge Converter贝克箝位电路 Baker Clamping Circuit变频器Frequency Inverter变压变频 Variable V oltage Variable Frequency—VVVF并联谐振式逆变电路 Parallel-Resonant Inverter不间断电源 Uninterruptable Power Supply—UPSC场控晶闸管 Field Controlled Thyristor—FCT触发Trigger触发角Trigger Angle触发延迟角 Trigger Delay Angel磁心复位 Magnetic Core ResetD单端电路 Single End Converter单相半波可控整流电路 Single-phase Half-Wave Controlled Rectifier 单相半桥逆变电路 Single-Phase Half-Bridge Inverter单相桥式全控整流电路 Single-Phase Full-Bridge Controlled Rectifier 单相全波可控整流电路 Single-Phase Full-Wave Controlled Rectifier 单相全桥逆变电路 Single-Phase Full-Bridge Inverter导通角Conduction Angle电力半导体器件 Power Semicondutor Device电力变换 Power Conversion电力场效应晶体管 Power MOSFET电力二极管 Power Diode电力电子技术 Power Electronic Technology电力电子器件 Power Electronic Device电力电子系统 Power Electronic System电力电子学 Power Electronics电力晶体管 Giant Transistor—GTR(电流)断续模式 Discontinuous Conduction Mode—DCM电流可逆斩波电路 Current Reversible Chopper(电流)连续模式 Continuous Conduction Mode—CCM电气隔离 Electrical Isolation电网换流 Line Commutation电压(源)型逆变电路 V oltage Source Type Inverter—VSTI电流(源)型逆变电路 Current Source Type Inverter—CSTI断态(阻断状态) Off-State多重化Multiplex多重逆变电路 Multiplex Inverter多电平逆变电路 Multi-Level InverterE二次击穿 Second BreakdownF反激电路 Flyback Converter负载换流 Load CommutationG高压集成电路 High V oltage IC—HVIC功率变换技术 Power Conversion Technique功率集成电路 Power Integrated Circuit—PIC功率模块 Power Module功率因数 Power Factor—PF功率因数校正 Power Factor Correction—PFC关断Turn-off光控晶闸管 Light Triggered Thyristor—LTT规则采样法 Rule Sampling MethodH恒压恒频 Constant V oltage Constant Frequency—CVCF缓冲电路 Snubber Current环流Loop Current换流CommutationJ畸变功率 Distortion Power基波因数 Fundamental Factor集成门极换流晶闸管 Integrated Gate-Commutated Thyristor—IGCT 间接电流控制 Indirect Current control间接直流变换电路 Indirect DC-DC Converter降压斩波器 Buck Chopper,step down chopper交流电力电子开关 AC Power Electronic Switch交流电力控制 AC Power Control交流调功电路 AC Power Controller交流调压电路 AC V oltage Controller交交变频电路 AC/AC Frequency Converter静电感应晶闸管 Static Induction Thyristor—SITH静电感应晶体管 Static Induction Transistor—SIT静止无功补偿器 Static Var Compensator —SVC晶闸管Thyristor晶闸管控制电抗器 Thyristor Controlled Reaction—TCR晶闸管投切电容器 Thyristor Switched Capacitor—TSC矩阵式变频电路 Matrix Frequency Converter绝缘栅双极晶体管 Insulated-Gate Bipolar Transistor—IGBTK开通Turn-on开关电源 Switching Mode Power Supply开关损耗 Switching Loss开关噪声 Switching Noise可关断晶闸管 Gate Turn-Off Thyristor—GTO可控硅Silicon Controlled Rectifier—SCR控制电路 Control Circuit快恢复二极管 Fast Recovery Diode—FRD快恢复外延二极管 Fast Recovery Epitaxial Diode—FRED快速晶闸管 Fast Switching Thyristor—FST快速熔断器 Fast Acting FuseL零电流Zero Current零电压Zero V oltage零电压转换PWM电路 Zero V oltage Transition PWM Converter 零电压准谐振电路 ZVS Quasi-Resonant Converter零开关Zero Switching零转换Zero Transition漏感Leakage IndcutanceM脉冲宽度调制 Pulse-Width Modulation—PWMN逆变Inversion逆导晶闸管 Reverse Conducting Thyristor—RCTP普通二极管 General Purpose DiodeQ器件换流 Device Commutation强迫换流 Forced Commutation桥式可逆斩波电路 Bridge Reversible Chopper擎住效应 Latching Effect驱动电路 Driving Circuit全波整流电路 Full Wave Rectifier全桥电路 Full Bridge Converter全桥整流电路 Full Bridge RectifierR软开关Soft SwitchingS三相半波可控整流电路 Three-Phase Half-Wave Controlled Rectifier 三相桥式可控整流电路 Three-Phase Full-Bridge Controlled Rectifier 升降压斩波电路 Boost-Buck Chopper, Step Up & Down Chopper升压斩波电路 Boost Chooper,Step Up Chopper双端电路 Double End Converter双极结型晶体管 Bipolar Junction Transistor—BJT双向晶闸管 Triode AC Switch—TRIACT特定谐波消去PWM Seleted Harmonic Elimination PWM—SHEPWM 同步调制 Synchronous Modulation同步整流电路 Synchronous Rectifier通态(导通状态) On-State推挽电路 Push-Pull ConverterW位移因数 Displacement Factor无源逆变 Reactive InvertX吸收电路 Absorbe Circuit相控Phase Controlled肖特基二极管 Schottky Diode肖持基势垒二极管 Schottky Barrier Diode—SBD谐波Harmonics谐波电流总畸变率 Total Harmonic Distortion for i—THD谐振Resonation谐振直流环电路 Resonant DC LinkY异步调制 Asynchronous Modulation移相全桥电路 Phase Shift Controlled Full Bridge Converter 硬开关Hard Switching有源逆变 Regenerative InvertZ正激电路 Forward Converter正弦PWM Sinusoidal PWM—SPWM整流Rectification整流电路 Rectifier整流二极管 Rectifier Diode滞环比较方式 Hysteresis Comparison直交直电路 DC-AC-DC Converter直接电流控制 Direct Current Control直流—直流变换器 DC/DC Converter直流斩波 DC Chopping直流斩波电路 DC Chopping Circuit智能功率集成电路 Smart Power IC—SPIC智能功率模块 Intelligent Power Module—IPM中性点箝位型逆变电路 Neutral Point Clamped Inverter周波变流器 Cycloconvertor主电路Main Circuit, Power Circuit准谐振Quasi-Resonant自然采样法 Natural Sampling Method其他Boost变换器 Boost ConverterBuck变换器 Buck ConverterCuk斩波电路 Cuk ChopperMOS控制晶闸管 MOS Controlled Thyristor—MCTn次谐波电流含有率 Harmonic Ratio for In—HRInPWM跟踪控制 PWM Tracking controlPWM整流电路 PWM RectifierSepic斩波电路 Sepic ChopperZeta斩波电路 Zeta Chopper英文中文词汇对照AAbsorbe Circuit 吸收电路AC power control 交流电力控制AC Power Controller 交流调功电路AC Power Electronic Switch 交流电力电子开关AC V oltage Controller 交流调压电路AC/AC frequency Converter 交交变频电路Asynchronous Modulation 异步调制BBaker Clamping Circuit 贝克箝位电路Bipolar Junction Transistor—BJT 双极结型晶体管Boost Chooper, Step Up Chopper 升压斩波电路Boost Converter Boost变换器Boost-Buck Chopper, Step Up & Down Chopper 升降压斩波电路Bridge Reversible Chopper 桥式可逆斩波电路Buck Chopper, Step Down Chopper 降压斩波器Buck Converter Buck变换器CCommutation 换流Conduction Angle 导通角Constant V oltage Constant Frequency—CVCF 恒压恒频Continuous Conduction Mode—CCM (电流)连续模式Control Circuit 控制电路Cuk Chopper Cuk斩波电路Current Reversible Chopper 电流可逆斩波电路Current Source Type Inverter—CSTI 电流(源)型逆变电路Cycloconvertor 周波变流器DDC Chopping 直流斩波DC Chopping Circuit 直流斩波电路DC/DC Converter 直流—直流变换器DC-AC-DC Converter 直交直电路Device Commutation 器件换流Direct Current Control 直接电流控制Discontinuous Conduction Mode—DCM (电流)断续模式Displacement Factor 位移因数Distortion Power 畸变功率Double End Converter 双端电路Driving Circuit 驱动电路EElectrical Isolation 电气隔离FFast Acting Fuse 快速熔断器Fast Recovery Diode—FRD 快恢复二极管Fast Recovery Epitaxial Diode—FRED 快恢复外延二极管Fast Switching Thyristor—FST 快速晶闸管Field Controllded Thyristor—FCT 场控晶闸管Flyback Converter 反激电路Forced Commutation 强迫换流Forward Converter 正激电路Frequency Inverter 变频器Full Bridge Converter 全桥电路Full Bridge Rectifier 全桥整流电路Full Wave Rectifier 全波整流电路Fundamental Factor 基波因数GGate Turn-Off Thyristor—GTO 可关断晶闸管General Purpose Diode 普通二极管Giant Transistor—GTR 电力晶体管HHalf Bridge Conwerter 半桥电路Hard Switching 硬开关Harmonic Ratio for In—HRIn n次谐波电流含有率Harmonics 谐波High V oltage IC—HVIC 高压集成电路Hysteresis Comparison 滞环比较方式IIndirect Current control 间接电流控制Indirect DC-DC Converter 间接直流变换电路Insulated-Gate Bipolar Transistor—IGBT 绝缘栅双极晶体管Integrated Gate-Commutated Thyristor—IGCT 集成门极换流晶闸管Intelligent Power Module—IPM 智能功率模块Inversion 逆变LLatching Effect 擎住效应Leakage Indcutance 漏感Light Triggered Thyristor—LTT 光控晶闸管Line Commutation 电网换流Load Commutation 负载换流Loop Current 环流MMagnetic Core Reset 磁心复位Main Circuit, Power Circuit 主电路Matrix Frequency Converter 矩阵式变频电路MOS Controlled Thyristor—MCT MOS控制晶闸管Multi-Level Inverter 多电平逆变电路Multiplex 多重化Multiplex Inverter 多重逆变电路NNatural Sampling Method 自然采样法Neutral Point Clamped Inverter 中性点箝位型逆变电路OOff-State 断态(阻断状态)On-State 通态(导通状态)PParallel-Resonant Inverter 并联谐振式逆变电路Phase Controlled 相控Phase Shift Controlled Full Bridge Converter 移相全桥电路Power Conversion 电力变换Power Conversion Technique 交流技术Power Diode 电力二极管Power Electronic Device 电力电子器件Power Electronic System 电力电子系统Power Electronic Technology 电力电子技术Power Electronics 电力电子学Power Factor—PF 功率因数Power Factor Correction—PFC 功率因数校正Power Integrated Circuit—PIC 功率集成电路Power Module 功率模块Power MOSFET 电力场效应晶体管Power Semicondutor Device 电力半导体器件Pulse-Width Modulation—PWM 脉冲宽度调制Push-Pull Converter 推挽电路PWM Rectifier PWM整流电路PWM Tracking Control PWM跟踪控制QQuasi-Resonant 准谐振RReactive Invert 无源逆变Rectification 整流Rectifier 整流电路Rectifier Diode 整流二极管Regenerative Invert 有源逆变Resonant DC Link 谐振直流环电路Resonation 谐振Reverse Conducting Thyristor—RCT 逆导晶闸管Rule Sampling Method 规则采样法SSafe Operating Area—SOA 安全工作区Schottky Barrier Diode—SBD 肖持基势垒二极管Schottky Diode 肖特基二极管Second Breakdown 二次击穿Seleted Harmonic Elimination PWM—SHEPWM 特定谐波消去PWM Sepic Chopper Sepic斩波电路Silicon Controlled Rectifier—SCR 可控硅Single End Converter 单端电路Single-Phase Full-Bridge Controlled Rctifier 单相桥式全控整流电路Single-Phase Full-Bridge Inverter 单相全桥逆变电路Single-Phase Full-Wave Controlled Rectifier 单相全波可控整流电路Single-Phase Half-Bridge Inverter 单相半桥逆变电路Single-phase Half-Wave Controlled Rectifier 单相半波可控整流电路Sinusoidal PWM—SPWM 正弦PWMSmart Power IC—SPIC 智能功率集成电路Snubber Current 缓冲电路Soft Switching 软开关Static Induction Thyristor—SITH 静电感应晶闸管Static Induction Transistor—SIT 静电感应晶体管Static Var Compensator —SVC 静止无功补偿器Switching Loss 开关损耗Switching Mode Power Supply 开关电源Switching Noise 开关噪声Synchronous Modulation 同步调制Synchronous Rectifier 同步整流电路TThree-Phase Full-Bridge Controlled Rectifier 三相桥式可控整流电路Three-Phase Half-Wave Controlled Rectifier 三相半波可控整流电路Thyristor 晶闸管Thyristor Controlled Reaction—TCR 晶闸管控制电抗器Thyristor Switched Capacitor—TSC 晶闸管投切电容器Total Harmonic Distortion for i—THD 谐波电流总畸变率Trigger 触发Trigger Angle 触发角Trigger Delay Angel 触发延迟角Triode AC Switch—TRIAC 双向晶闸管Turn-off 关断Turn-on 开通UUninterruptable Power Supply—UPS 不间断电源VVariable V oltage Variable Frequency—VVVF 变压变频V oltage Source Type Inverter—VSTI 电压(源)型逆变电路ZZero Current 零电流Zero Switching 零开关Zero Transition 零转换Zero V oltage 零电压Zero V oltage Transition PWM Converter 零电压转换PWM电路Zeta Chopper Zeta斩波电路ZVS Quasi-Resonant Converter 零电压准谐振电路。

集成电路英文代码对照

集成电路英文代码及中文对照〔一〕我的文摘2021-11-21 11:32:53 阅读111 评论0 字号：大中小订阅产品名称型号规格性能说明LMLM24J 四运放(军用级)LM148J 通用四运放LM1875T 无线电控制/接收器LM224J 四运放(工业级)LM258N 别离式双电源双运放LM2901N 四电压比拟器LM2904N 四运放LM301AN 通用运算放大器LM308N 单比拟器LM311P 单比拟器LM317L 可调三端稳压器/100mALM317TLM317K 可调三端稳压器/3ALM318 高速宽带运放LM324K 通用四运放LM331N V-F/F-V转换器基准电压电路LM336 5V 基准电压电路LM337T 基准电压电路1ALM338K 可调三端稳压器5ALM339N 四比拟器LM348N 四741运放LM358N 低功耗双运放LM361N 高速差动比拟器LM386N 声频功率放大器LM3914N 十段点线显示驱动LM393N 低功耗低失调双比拟器LM399H 精细基准源(6.9)LM723CN 可调正式负稳压器LM733CN 视频放大器LM741J 单运放LM741CN 双运放NENE521 高速双差分比拟器NE5532 双运放NE5534 双运放NE555N 单运放NE555J 时基电路军品极NE556 双级型双时基电路NE564 锁相环NE565 锁相环NE567 音调译码器NE592 视频放大器OPOP07 低噪声运放OP27 超低噪声精细运放OP37 超低噪声精细运放光电耦合4N25 晶体管输出4N25MC 晶体管输出4N26 晶体管输出4N27 晶体管输出4N28 晶体管输出4N29 达林顿输出4N30 达林顿输出4N31 达林顿输出4N32 达林顿输出4N33 达林顿输出4N33MC 达林顿输出4N35 达林顿输出4N36 晶体管输出4N37 晶体管输出4N38 晶体管输出4N39 可控硅输出6N135 高速光耦晶体管输出6N136 高速光耦晶体管输出6N137 高速光耦晶体管输出6N138 达林顿输出6N139 达林顿输出MOC3020 可控硅驱动输出MOC3021 可控硅驱动输出MOC3023 可控硅驱动输出MOC3030 可控硅驱动输出MOC3040 过零触发可控硅输出MOC3041 过零触发可控硅输出MOC3061 过零触发可控硅输出MOC3081 过零触发可控硅输出TLP521-1 单光耦TLP521-2 双光耦TLP521-4 四光耦TLP621 四光耦TIL113 达林顿输出TIL117 TLL逻辑输出PC814 单光耦PC817 单光耦H11A2 晶体管输出H11D1 高压晶体管输出H11G2 电阻达林顿输出LFLF347N 宽带JFET输入四运放LF351N 宽带JFET输入运放LF353N JFET输入宽带运放LF355N JFET输入运放LF357N JFET宽带非全裣运放LF398N 采样/保持电路LF412N 低偏向飘移输入运放MCMC1377 彩色电视编码器MC1403 精细电压基准源(2.5)MC1413 周边七段驱动阵列MC1416 周边七段驱动陈列MC14409 二进制脉冲拨号器MC14433 3位半A/D转换器MC14489 多字符LED显示驱动器MC145026 编码器VD5026 编码器MC145027 译码器VD5027 译码器MC145028 译码器MC145030 编码译码器MC145106 频率合成器MC145146 4位数据总线TLTL062 低功耗JEFT输入双运放TL072 低噪声JEFTTL082TL084TL431TL494ULNULN2003 周边七段驱动陈列ULN2004 周边七段驱动陈列ULN2803 周边八段驱动陈列ULN2804 周边八段驱动陈列ICLICL7106 3位ADC/驱动LCDICL7107 3位半ADC/驱动LEDICL7109 4位半ADC/驱动LEDICL7129 4位半ADC/LCD驱动ICL7135 ADC/LCD驱动BCD输出ICL7136 3位半CMOSADC/LCD驱动ICL7218 CMOS低功耗运算放大器ICL7650 整零运放斩波ICL7652 整零运放斩波ICL7660 CMOS直流-直流转换器ICL8038 函数信号发生器ICL8049 反对数放大器CACA3140 单BIMOS运行CA3240 单BIMOS运行UCUC3842 WM电流型控制器UC3845 PWM电流型控制器DSDS12887 非易失实时时钟芯片L3845 中继接口电路SGSG3524 PWM解调调制器SG3525 PWM解调调制器20216 前置放大器MTMT8814 8x12模拟交换矩阵MT8816 8x模拟交换矩阵MT8870 综合DTMF接收器MT8870 综合DTMF接收器MT8880 综合DTMF发生接收器MIC24LC01 128x8串行EEPROM24LC02 256x8串行EEPROM24LC04 512x8串行EEPROM24LC16 2Kx8串行EEPROM93LC46 64x16串行EEPROM93LC56 256x16串行EEPROM93LC66 512x8 256x16 EEPROMPIC16C52 384x12 单片机PIC16C54 512x12 单片机PCI16C56 512x12 单片机PIC16C57 2048x12 单片机ATAT24C01 128x8串行EEPROMAT24C02 256x8串行EEPROMAT24C04 512x8串行EEPROMAT24C16 2Kx8串行EEPROMAT93C46 64x16串行EEPROMAT93C56 256x16串行EEPROMATF16V8 FLASH200门ATF20V8 FLASH300门高速ATF22V10 FLASH500门高速低电流AT28C16 2Kx8CMOS并行EEPROMAT28C17 2Kx8CMOS并行EEPROMAT28C64 8Kx8并行EEPROMAT28C256 32Kx8并行EEPROMAT28F010 128Kx8并行EEPROMA29C040 512Kx8 FLASH EEPROMHM6116 2Kx8 CMOS 静态PAMHY6264 8Kx8 CMOS 静态RAMHM6264 8Kx8 CMOS 静态RAMIS62C64 8Kx8 高速CMOS 静态RAMHY62256 32Kx8 CMOS 静态RAMHM62256 32Kx8 CMOS 静态RAMHM628128 128Kx8 CMOS 静态RAMHM628256 256Kx8 CMOS 静态RAMHM628512 512Kx8 CMOS 静态RAMHM628512 512Kx8 CMOS 静态RAM TCMTCM5087 双音调发生器MM5832 实时钟电路TCTC14433 3位半A/D转换器TC232 并行/串行接口电路TC7106 3位半ADC/LCD驱动TC7107 3位半ADC/LED驱动TC7116 3位半ADC/LCD驱动带保TC7129 4位半ADC/LCDTC7135 4位半ADC/LCD，BCD输出TC7650 整零运放斩波7575107 四差分线驱动器75174 四差分线驱动器75175 三态四差分接收器75176 差分总线接收器75188 四线驱动器75189 四线驱动器75451 双外围驱动器75452 双外围驱动器集成电路英文代码及中文对照〔二〕我的文摘2021-11-21 11:37:11 阅读191 评论0 字号：大中小订阅。

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