SOP封装工艺流程介绍

Gold wire Capillary
input
input Bond location
output
Die Al pad lead
Confidential
Molding
Purpose: Seal the product with EMC to prevent die, gold wire from being damaged, contaminated and oxygenic. Mold Machine
Confidential
Quality Control
Wire Bond
Rej 外观检查 Rej
Rej
Rej 第二焊点重叠 第二焊点偏移
Rej 线弧不良
Rej
Confidential
Quality Control
Wire Bond
推球测试
Die
拉力测试
Confidential
Quality Control
Mold thickness 1.25~1.5 1.25~1.5 1.25~1.5 2,25~2.35 2,25~2.35 2,25~2.35 2,25~2.35 1.35~1.75 1.75~1.85 0.81~0.91 0.81~0.91 0.85~0.95 0.85~0.95 0.85~0.95 0.85~0.95 0.81~0.91 0.81~0.91 1.75~1.85
Quality Control
Die Attach
Die Shear
Die
Epoxy
Lead Frame
Epoxy Void Check
Confidential
Quality Control
Die Attach
Die Location
Rej
Epoxy Thickness & Fillet Height
Confidential
Wafer Saw
Before wafer saw:
After wafer saw:
Confidential
Die Attach
Purpose: Attach the dies with epoxy on substrate for the following process
laser EMC vapoured
Before
After
Laser marking
Confidential
Post mold cure
Purpose: To let EMC react completely so that products can be protected more effectively.
Confidential
Molding
Runner Gate insert Top cull block Cavity
Top chase
Molding
Air vent
Compound Pot Leadframe Bottom cull block
Bottom chase
Plunger
Confidential
Oven
Inside
Confidential
De-junk
Purpose： Remove the dem-bar of leadframe.
Before
Working area
Laser Marking
After
Laser Marking
Confidential
Plating
Purpose: To plating Sn on the lead which will mount on board pad.
SOP ASSEMBLY PROCESS FLOW & QUALITY CONTROL INSTRUCTION
Confidential
Contents
1.Package Instruction 2.Process Flow
3.Quality Control
Confidential
Package Instruction
Pin Count 8 14 16 16 18 20 28 8 20 8 10 8 16 14 38 10 8 8
Lead Pitch 1.27mm 1.27mm 1.27mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27mm 0.65 mm 0.65mm 0.5mm 0.65mm 0.65mm 0.65mm 0.5mm 0.5mm 0.65mm 1.27mm
Trim Form
Purpose: Remove the tie-bar and lead-frame and form products to units from strips, fill them into tubes and then pass to next process.
Saw work area
LOAD
GRINGING
UNLOAD
晶圓 (未研磨)
Confidential
研磨機
晶圓 (研磨後)
Wafer Mount
Purpose: Combine the wafer with Dicing tape onto the frame for die sawing Wafer mount Machine
Output
Substrate load bond
Die bond
Confidential
Die Attach
Working flow:
Epoxy
Robber tip
Lead-frame
Confidential
Epoxy Cure
Purpose: Solidify the epoxy after D/A
Wafer
前段制程
后段制程
Molding Wafer Grinding Laser Marking Post Mold Cure Die (chip) Wafer Saw De-junk Die Attach Die on Lead frame Epoxy Cure Plating Wire Bond Trim/Form
Stand Off 0.1~0.25 0.1~0.25 0.1~0.25 0.15~0.25 0.15~0.25 0.1~0.3 0.15~0.25 0.05~0.15 0.05~0.14 0.05~0.13 0.05~0.13 0.05~0.15 0.05~0.15 0.05~0.15 0.05~0.15 0.05~0.13 0.05~0.13 0.125mm
Mount 晶元背面 Wafer Tape backside
Frame Frame
Confidential
Wafer Saw
Purpose: To separate dies from each other for die attach Machine
Monitor
Cleaning Sawing Load/Unlo ad
Laser Marking Laser Marking Laser Marking
Lead Frame Epoxy
Wafer Mount
Before
After
Packing & Shipping
Confidential
Wafer Grinding
Wafer Grinding Purpose: Grinding the wafer to Customer required thickness
Wire Bond
验证级工程确认
IMC Coverage
IMC Thickness
Crater Test
1st bond
1st bond
2nd bond
Looping
Confidential
Quality Control
Mold
外观检查
Rej
孔洞 内部气泡
Rej
缺角
Rej
上下错位
Rej
溢胶
Rej
冲线值量测
Working area
unload
unload
Confidential
Trim Form
unload
Working area unload
Lead Cut
Forming
Confidential
Quality Control
Die Saw
Rej
外观检查 Rej
切偏
Chipping
划片宽度量测
Confidential
Plating line
unload
load
Confidential
Plating
熱 D. I. 水 烘 乾
活 化 槽
電鍍槽
SOLDER
中 和 槽
收 料 區
PLATING (S/P 區) 面板 操作
ELECTRO
DEFLASH (E/D區 )
酸洗
高壓噴洗
Before
電解去膠
After
Βιβλιοθήκη Baidu
投 料 區
Confidential
Looping
Confidential
Quality Control
Plating
Rej 外观检查 镀层厚度量测 Rej
Rej
Solderability test
300 mil
SOP EP SSOP TSSOP
150mil 209 mil 118 mil
SOP EP 8L 150 mil SSOP 20L 209mil TSSOP 8L 118mil TSSOP 10L 118mil TSSOP 8L 173mil TSSOP 16L 173mil TSSOP 14L 173mil TSSOP 38L 173mil
Top chase
Molding
Air vent
Compound Pot Leadframe Bottom cull block
Bottom chase
Plunger
Lead Frame
Epoxy
After Mold
Confidential
Laser Marking
Purpose： Use laser light irradiated by CO2 or YAG to vapour the EMC to show content on the package，such as date, schedule, place of production and so on.
Inside
Oven
Confidential
Wire Bond
Purpose: Connecting the chip and the exterior circuit Theory: Use ultrasonic, thermal, force to form the intermetallic between golden wire and joint metal (Al, Au, Ag…)
Molding
Runner Gate insert Top cull block Cavity
Top chase
Molding
Air vent
Compound Pot Leadframe Bottom cull block
Bottom chase
Plunger
Confidential
Molding
Runner Gate insert Top cull block Cavity
Top chase
Molding
Air vent
Compound Pot Leadframe Bottom cull block
Bottom chase
Plunger
Confidential
Molding
Runner Gate insert Top cull block Cavity
1. SOP 2. SSOP
3. TSSOP
4. MFP
ASE
Package SOP
Body 150 mil
Description SOP 8L 150 mil SOP 14L 150mil SOP 16L 150mil SOP 16L 300mil SOP 18L 300mil SOP 20L 300mil SOP 28L 300mil
173 mil
TSSOP EP MFP
118 mil 208 mil
TSSOP EP 10L 118mil TSSOP EP 8L 118mil MFP 1.27mmL 208 mil
Confidential
Package Instruction
Confidential
ASY process flow
Body Size X*Y*Z 3.9x4.9x1.375 3.9x8.6x1.375 3.9x9.9x1.375 7.5x10.3x2.3 7.5x11.7x2.3 7.5x12.8x2.3 7.34x17.7x2.3 3.9x4.9x1.55 0.283x0.209x1.8 3x3x0.86 3x3x0.86 3x4.4x0.9 5x4.4x0.9 5x4.4x0.9 9.70x4.4x0.9 3x3x0.95 3x3x0.95 5.4x5.3x1.775