PCB印刷电路板制程介绍

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典型多层板制作流程
11. 外层线路压膜
12. 外层线路曝光
PCB Engineering Report Sheet
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典型多层板制作流程
13. 外层线路制作(显影)
14. 镀二次铜及锡铅
PCB Engineering Report Sheet
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典型多层板制作流程
15. 去干膜
16. 蚀铜(碱性蚀刻液)
1. 内层THIN CORE
2. 内层线路制作(压膜)
PCB Engineering Report Sheet
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典型多层板制作流程
3. 内层线路制作(曝光)
4. 内层线路制作(显影)
PCB Engineering Report Sheet
Leabharlann Baidu
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典型多层板制作流程
5. 内层线路制作(蚀刻)
6. 内层线路制作(去膜)
(Drill &
鋁板 墊木板
PCB Engineering Report Sheet
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12.镀通孔附着碳粉
13.外层压膜(干膜Tenting)
Photo Resist
PCB Engineering Report Sheet
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14.外层曝光(pattern plating)
15.曝光后(pattern plating)
2 0
CURE
2
2
7
6
HOLE COUNT O/S TEST/OSP
2
2
8
9
FQC
OQC
2 5 CURE
3 0 PACKING
2
2
2
2
4
3
2
1
FINAL CLEAN
V-CUT
PUNCH/NC-R
HAL/ENIG G/F
31
WARHHOUSH
32
OUTGOING
SYMBOL □:QUANTITY INSPECTION ◇:QULITY INSPECTION ▽:STORAGE ○:WORKING ▲: 100% INSPECTION
21
9.迭板
Layer 1 Layer 2 Layer 3 Layer 4
Copper Foil
Prepreg(胶片) Inner Layer Prepreg(胶片) Copper Foil
PCB Engineering Report Sheet
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10.压合(Lamination)
11.钻孔(P.T.H.或盲孔Via) Deburr)
PCB Engineering Report Sheet
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典型多层板制作流程
17. 剥锡铅
18. 防焊(绿漆)制作
PCB Engineering Report Sheet
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典型多层板制作流程
15. 浸金(喷锡……)制作
PCB Engineering Report Sheet
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干膜制作流程
9 ETCHING
5
6
DRY FILM
EXPOSURE
LAMINATING
8
7
PATTERN DEVELOPMENT PLATING
1 4
2’ST LIQULD SCREENPRINT
1 5
PRE-CURE
1
1
0
7
S/M
S/M
EXPOSURE DEVELOPMENT
1 8
POST-CURE
1 9
LEGEND PRINT
PCB Engineering Report Sheet
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16.外层显影
17.线路镀铜及锡铅
PCB Engineering Report Sheet
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18.去 膜 19.蚀 铜 (碱性蚀刻)
PCB Engineering Report Sheet
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20.剥锡铅
21.喷涂(液状绿漆)
PCB Engineering Report Sheet
PCB Engineering Report Sheet
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PCB Engineering Report Sheet
2
PCB Engineering Report Sheet
3
PCB Engineering Report Sheet
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PCB Engineering Report Sheet
5
典型多层板制作流程
基板
壓膜
壓膜後
曝光 去膜
顯影
蝕銅
PCB Engineering Report Sheet
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COMP S0LD. COMP S0LD.
典型之多层板迭板及压合结构
压合机之热板
迭合用之钢板
CpOrPePpErRegFOIL 0.5 OZ
TphrienprCeogre ,FR-4
Thin Core ,FR-4 prepreg
COPPER FOIL 0.5 OZ
.
迭合用之钢板
.
10-12层迭合
.
迭合用之钢板
CpOrPePpErRegFOIL 0.5 OZ
TprheipnreCgore ,FR-4
Thin Core ,FR-4 prepreg
COPPER FOIL 0.5 OZ 迭合用之钢板
压合机之热板
PCB Engineering Report Sheet
PCB Engineering Report Sheet
8
典型多层板制作流程
7. 迭板 8. 压合
LAYER 1 LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 6
PCB Engineering Report Sheet
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典型多层板制作流程
9. 钻孔
10. 黑孔
PCB Engineering Report Sheet
印刷电路板制程介绍
PCB Engineering Report Sheet
0
Flow Chart of PCB Process
1
2
3
IQC
TRIM
DRILL
1 3
PRE-CURE
1 2
1’ST LIQULD SCREENPRINT
1 1
S/M SURFACE CLEAN
1 0
INSPECTING
4 BLACK HOLE
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5.内层板显影
Photo Resist
6.酸性蚀刻(Power/Ground或Signal)
Photo Resist
PCB Engineering Report Sheet
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7.去干膜 ( Strip Resist) 8.黑化(Oxide Coating)
PCB Engineering Report Sheet
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1.下料裁板(Panel Size)
COPPER FOIL
2.内层板压干膜(光阻剂)
Epoxy Glass Photo Resist
PCB Engineering Report Sheet
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3.曝光 4.曝光后
光源
Artwork (底片)
Artwork (底片)
Photo Resist
PCB Engineering Report Sheet