金球推力国际标准Wire Bond Shear Test

EIA/JEDEC STANDARD

Wire Bond Shear Test Method EIA/JESD22-B116

JULY 1998

ELECTRONIC INDUSTRIES ALLIANCE

NOTICE

JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Council level and subsequently reviewed and approved by the EIA General Counsel.

JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.

JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications.

The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an EIA standard.

No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met.

Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC Solid State Technology Division, 2500 Wilson Boulevard, Arlington, VA 22201-3834, (703)907-7560/7559 or \jedec.

Published by

©ELECTRONIC INDUSTRIES ALLIANCE

Engineering Department

2500 Wilson Boulevard

Arlington, VA 22201-3834

"Copyright" does not apply to JEDEC member companies as they are

free to duplicate this document in accordance with the latest revision of

JEDEC Publication 21 "Manual of Organization and Procedure".

PRICE: Please refer to the current

Catalog of JEDEC Engineering Standards and Publications or call Global Engineering Documents, USA and Canada (1-800-854-7179), International (303-397-7956)

Printed in the U.S.A.

All rights reserved

JEDEC Standard 22-B116

Page 1

WIRE BOND SHEAR TEST

(From JEDEC Council Ballot JCB-97-64, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.)

1 Scope

This test provides a means for determining the strength of the bond between a gold ball bond on a die bonding surface or an aluminum wedge or stitch bond on a package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. This measure of bond strength is extremely important in determining two features:

1) the integrity of the metallurgical bond which has been formed.

2) the quality of gold and aluminum wire bonds to die or package bonding surfaces.

These test methods cover ball bonds made with small diameter (from 18 to 76 µm, or from 0.7 to 3 mil) wire and wedge bonds made with larger diameter (minimum of 3 mil) wire, of the type used in integrated circuits and hybrid microelectronic assemblies.

These test methods can be used only when the ball height (at least 10.16 µm or 0.4 mil) and diameter for ball bonds, or the wire height (at least 1.25 mils in height at the compressed bonded area) of the wedge bond, are large enough and adjacent interfering structures are far enough away to allow suitable placement and clearance (above the bonding pad or leadframe post and between adjacent bonds) of the shear test chisel. This test method may also apply to gold wedge or stitch bonds if the wire is thick enough to allow shearing of the wire from the bonding surface without smearing similar to a shearing skip.

The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.

2 Terms and Definitions

The terms and definitions shall be in accordance with the following paragraphs.

2.1 Ball Bond

The adhesion or welding of a thin wire, usually gold, to a die pad metallization, usually an aluminum alloy, using a thermosonic wire bond process. The ball bond includes the enlarged spherical, or nail head, portion of the wire (provided by the flame-off and first bonding operation in the thermal compression and thermosonic process, or both), the underlying bonding pad and the ball bond-bonding pad intermetallic weld interface.

2.2 Bonding Surface

Either 1) the die pad metallization or 2) the package surface metallization to which the wire is ball, wedge or stitch bonded.

Test Method B116