FINEPLACER_Pico_AMA_us--高精度贴片机

FINEPLACER®Pico AMA

Fields of Application

·Flip Chip bonding

- Thermo compression

- Thermo-sonic

- Soldering (AuSn, C4)

·Assembly of MEMS,

MOEMS, sensors and

micro-optics

- Dispensing

- Curing UV / temperature

·Chip on glass

- ACF bonding

- ACP bonding

·Bonding of laser bar, single

laser and power laser

·RFID assembly

·Precise die attach

Swivel / Bonding Force Module

Travel Range 90° + 2°

Angular Resolution3

Force Range (1)0.25 - 25 N

Force Resolution (1)0.25 N

Force Range (2)1.0 - 50 N

Force Resolution (2)0.5 N Benefits

·Vision alignment system ensures

placement acccuracy of 5 micron@3 sigma

·Automatic assembly process

·Operator independent processes

·Closed loop temperature and force control

·High flexibility due to modular concept

·Easily adaptable to different applications

·Die pick up from blue tape, flip module

·Precise non-wearing x,y planar table

·GUI based on Windows® XP

·Open data interface to assembly line

FINEPLACER® Pico AMA Optional Modules

Observing and Inspection Video Module

Heating Module with Inert Gas Chamber

Dispensing Module

Die Pick Up Module

Die Flip Module

RFID Reader

Features

Placement Accuracy 5 micron@3 Sigma

Placement Area280 x 115 mm

x, y-Travel Range380 x 155 mm

x-Extension250 mm

z-Axis Travel Range10 mm

z-Axis Resolution0.8 micron

Rotation of Placement Head360°

Rotation of Heated Pick and Place Tool180°

FINEPLACER ®

Pico AMA

Process Flow

Application Package for Laser Bar Bonding

Handling Module

Flip Module

Vision Alignment

Gently Placement

Soldered Laser Bar

Bonding Profile

Base System FINEPLACER ® Pico AMA

Automatic Laser Bar Bonding

Vision Alignment System

Heating System with Intert Gas Chamber VARIO Plus Inspection Module Die Flip Module

Substrate Handling Module

Measurement Module

RFID Reader