Vacuum Plating Deposited
沉积气压对氮化钒(VN)涂层微结构及其性能的影响
通信作者： 李助军 （１９８０—）， 男， 博士， 副教授， 主要研究方
向为机械摩擦学与表面技术． Ｅ⁃ｍａｉｌ： ２７５８８６７０７＠ ｑｑ ｃｏｍ．
随着现代加工制造技术的发展， 传统的硬质合金
和高速钢刀具难以满足现代切削技术的要求， 从而限
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２０２１ 年 ５ 月
润滑与密封
ＬＵＢＲＩＣＡＴＩＯＮ ＥＮＧＩＮＥＥＲＩＮＧ
第 ４６ 卷 第 ５ 期Ｍａｙ ２０２１来自Ｖｏｌ ４６ Ｎｏ ５
ＤＯＩ： １０ ３９６９ ／ ｊ ｉｓｓｎ ０２５４－０１５０ ２０２１ ０５ ０１１
文献引用： 刘怡飞，包改磊，李助军，等．沉积气压对氮化钒（ＶＮ）涂层微结构及其性能的影响［Ｊ］．润滑与密封，２０２１，４６（５）：６８－７４．
制其在加工领域的应用。 涂层刀具是应市场需求发展
起来刀具新产品， 具有优良的综合力学性能， 机械加
真空离子镀英文介绍
真空离子镀英文介绍Vacuum ion plating, also known as PVD (Physical Vapor Deposition), is a state-of-the-art technology widely used in various industries for the deposition of thin films on different substrates. It is considered a highly advanced and efficient process in the field of surface engineering.Vacuum ion plating is a process that takes place in a vacuum chamber where materials are evaporated and then deposited onto the substrate. The vacuum environment ensures the absence of air and other impurities that may interfere with the coating process. Unlike traditional coating methods, vacuum ion plating allows for precise control of the coating thickness and composition, resulting in high quality and uniform coatings.The process of vacuum ion plating starts with the cleaning and preparation of the substrate surface. This is crucial to ensure good adhesion of the deposited film. Once the surface is prepared, the substrate is placed inside the vacuum chamber. The chamber is then sealed and pumped down to create a high vacuum environment.Next, the material to be evaporated, known as the target, is heated using an electron beam or a resistive heating source. As the target is heated, atoms or molecules are released from its surface, forming a vapor cloud above the target. These atoms or molecules then travel to the substrate and condense on its surface to form the desired thin film.During the deposition process, the substrate can be biased with a voltage to enhance film adhesion and improve film properties. This is known as substrate biasing. By applying a voltage to the substrate, ions are attracted to its surface, bombarding it and improving the adhesion of the deposited film.One of the major advantages of vacuum ion plating is the ability to deposit various types of films with different properties. By selecting different target materials, coatings with different characteristics can be achieved. For example, by using metallic targets such as titanium or stainless steel, coatings with excellent wear resistance and corrosion resistance properties can be obtained. Alternatively, by using ceramic targets such as titanium nitride or aluminum oxide, coatings with high hardness and thermal stability can be achieved.Vacuum ion plating finds extensive applications in various industries. In the automotive industry, it is used for the deposition of decorative and protective coatings on automotive parts, such as wheels, trims, and badges. These coatings not only enhance the appearance of the parts but also provide excellent resistance to wear, corrosion, and UV radiation.In the electronics industry, vacuum ion plating is used for the deposition of thin films on semiconductor devices and electronic components. These films can be conductive, insulating, or semiconducting, depending on the specific requirements of the device. The ability to precisely control the film properties makes vacuum ion plating an ideal choice for microelectronics applications.In the aerospace industry, vacuum ion plating is employed for the deposition of coatings on aircraft components. These coatings provide protection against extreme temperatures, erosion, and oxidation,thereby improving the longevity and reliability of the components.Furthermore, vacuum ion plating also finds applications in the medical, optical, and packaging industries, where the deposition of thin films with specific properties is essential for the functionality and performance of the products.In conclusion, vacuum ion plating is a highly advanced and versatile technology used for the deposition of thin films on various substrates. It offers precise control over film thickness and composition, resulting in high-quality coatings with superior properties. Its applications can be found in numerous industries, ranging from automotive and electronics to aerospace and medical. Vacuum ion plating is continually evolving, with ongoing research and development aimed at further improving the process and expanding its capabilities.。
冶金专业英语词汇（D）_冶金专业英语词汇
d c electrode 直粮条d.l.sintering machine dl型带式烧结机dabber 捣锤dairy bronze 贮乳凄铜daltonides 道耳顿式化合物dam plate 出铁口隔渣板damascening 大马士革钢生产法damascus steel 大马士革钢damaskeening 大马士革钢生产法damp 湿气damper 闸板damping 衰减damping capacity 衰减能力damping coefficient 衰减系数damping down 休风damping factor 衰减系数dampness 湿度danaite 钴毒砂danburite 赛黄晶dancer roll 张力第辊dark field 暗视场dark glowing 暗红炽热dark gray pig iron 暗灰色生铁dark red heat 暗红热温度data 资料data handling 数据处理data logging 数据记录data processing 数据处理data processing equipment 数据处理机daubing 炉底打结dc arc welder 直羚焊机deacidification 除酸deactivation 钝化dead annealing 完全退火dead banking 长期封炉dead burning 死烧dead burnt limestone 死烧石灰石dead man 死铁dead melted steel 镇静钢dead metal region 死金属区dead pass 空轧孔型dead roasting 死烧dead soft steel 特软钢dead steam 排汽dead time 空载时间deaerated solution 去气溶液dealuminizing 脱铝debye scherrer method 粉末法decalescence 等温吸热decalescence point 吸热点decantation 倾析decanted solution 倾析溶液decanter 倾析器decarburization 脱碳decarburization depth 脱碳厚度decarburizer 脱碳剂decarburizing annealing 脱碳退火decarburizing medium 脱碳介质decay 衰变decoiler 开卷机decoiling 开卷decomposition 分解decomposition heat 分解热decomposition product 分解产物decomposition reaction 分解反应decomposition voltage 分解电压decontamination 净化decoppering 脱铜decopperized lead 除铜铅decorative alloy 装饰合金decorative coat 装饰涂覆deep drawability 深拉性deep drawing 深拉deep drawing sheet 深冲薄板deep drawing steel 深冲钢deep etch test 深腐蚀试验deep etching 深浸蚀deep penetration electrode 深熔焊条defect 缺陷defective casting 有缺陷铸件defectoscope 探伤仪deferrization 除铁deflection 挠曲deflector 导向挡板deflector roll 转向辊deflocculator 反絮凝剂defoaming 去沫deformability 可变形性deformation 变形deformation bands 变形带deformation mechanism 变形机理deformation resistance 变形阻力deformation stress 变形应力deformation temperature 变形温度deformation texture 变形织构deformation twin 变形双晶deformation zone 变形区deformed steel 异型钢degasification 脱气degasifying alloy 脱气用合金degasser 脱气器degassing 脱气degassing unit 脱气器degenerate perlite 退化珠光体degreaser 脱脂液degreasing 脱脂degreasing agent 去脂剂degreasing bath 脱脂槽degreasing fluid 脱脂液degreasing plant 脱脂装置degreasing tank 脱脂槽degree of cold work 冷加工程度degree of deformation 变形度degree of dispersion 分散度degree of dissociation 离解度degree of freedom 自由度degree of hardness 硬度degree of ionization 电离度degree of order 有序度degree of oxidation 氧化度degree of purity 纯度degree of saturation 饱和度degree of silication 硅酸度dehumidifier 脱湿器dehumidifying 脱湿dehydrating agent 脱水剂dehydration 脱水dehydrogenation 去氢delayed crack 延迟破裂delayed failure 滞后破坏delayed fracture 滞后破坏delayed yield 延迟屈服delessite 铁叶绿泥石deliquescence 潮解delivery guide 出口导板delivery side 出料侧delivery speed 出口速度delta connection 三角形接线delta ferrite 铁素体delta iron 铁delta solid solution 固溶体demagnetization 退磁demagnetization curve 去磁曲线demanganizing 脱锰demodifier 去变形剂dendrite 枝晶dendritic crystal 枝晶dendritic markings 师状痕迹dendritic powder 师状粉dendritic structure 枝晶组织dendritic zone 师状结晶区denickelification 脱镍denitriding 脱氮denitrification 脱氮dense charge 致密装料dense liquid 重液dense media separation 重介质选矿dense poling 致密插使原法dense sintering 致密烧结dense slag 致密熔渣densener 内冷铁densification 致密化densitometer 浓度计density 密度density as pressed 压粉密度density bottle 比重瓶dental alloys 牙科用合金deoxidant 脱氧剂deoxidation 脱氧deoxidized copper 脱氧铜deoxidized steel 脱氧钢deoxidizer 脱氧剂deoxidizing addition 脱氧添加物deoxidizing agent 脱氧剂deoxidizing capacity 脱氧能力dephlegmation 分凝dephlegmator 分凝器dephosphorization 脱磷dephosphorizing capacity 脱磷能力depiler 分料机depletion 贫化depolarization 去极化depolarizer 去极剂deposit 沉淀物;矿床deposit leaching 矿床浸出deposit welding 堆焊deposited metal 沉积金属deposited metal test specimen 熔敷金属试样depositing tank 沉积槽deposition 沉积deposition potential 析出电位deposition rate 熔敷速度depressant 抑制剂depressor 抑制剂depth of carburizing 渗碳深度depth of chill 冷硬深度depth of decarburized zone 脱碳深度depth of fill 充填深度depth of fusion 熔透深度depth of groove 孔型深度depth of hardening 淬火深度depth of hearth 炉床深度depth of immersion 插入深度depth of indentation 压痕深度depth of nitration 渗氮深度depth of penetration 熔透深度desanding 去砂descaler 除鳞机descaling 除氧化皮descaling jet 除鳞喷嘴descent velocity of burden 炉料下降速度descloizite 钒铅锌矿deseamer 焊瘤除器deseaming 表面缺陷清理desiccant 干燥剂desiccating agent 干燥剂desiccation 干燥desiccative 干燥剂desiccator 保干器designation of steel 钢的名称desiliconization 脱硅desiliconizing 脱硅desilter 沉淀池desilverization 脱银desilverizing 脱银deslagging 除渣deslimer 脱泥机desliming 脱泥desorption 解吸destruction 破坏destruction test 破坏试验destructive test 破坏试验desulfurization 脱硫desulfurization degree 脱硫率desulfurization rate 脱硫速度desulfurizer 脱硫剂desulfurizing 脱硫desulfurizing agent 脱硫剂desulfurizing process 脱硫过程desurfacing 除表面层detachable bottom 可换炉底detection 检定detector 探测器detergency 去垢能力detergent 洗净剂determination 测定detinning 脱锡detrimental impurity 有害杂质devanadation 脱钒酸盐处理deviation 偏差device 装置devil 加热焊料用轻便炉devitrification 透名失dew point 露点dewar flask 杜瓦瓶dewatering 脱水dewaxing 脱蜡dezincification 脱锌dezincing 脱锌dh process 真空提吸脱气法diabantite 辉绿泥石diagonal pass 对角孔型diagonal roll 斜辊diagram 线图dialysis 透析diamagnetic material 反磁材料diamagnetic substance 反磁材料diamagnetic susceptibility 抗磁磁化率diamagnetism 抗磁性diamond 金刚石;菱形孔型diamond die 金刚石拉丝模diamond pass 菱形孔型diamond pyramid hardness 维氏硬度diamond tool 金刚石工具diamond wheel 金刚石砂轮diaphragm 隔膜diaphragm electrolyzer 隔膜电解槽diaspore 水铝石dibasic acid 二碱价酸dichroism 二色性dichromate treatment 重铬酸盐处理dichromic acid 重铬酸die 模die back 模孔出口角die backer 模垫die bell 拉模入口锥die block 模块die body 模体die bolster 模座die box 拉模盒die breakthrough 模裂die carriage 模座die casting 金属型铸造;压铸造die coating 金属型涂料die entrance 拉模入口锥die entrance angle 模孔入口锥die exit angle 模孔出口角die forging 模锻die holder 模座die hole 拉模孔die insert 模衬die line 分模线die liner 模衬die lines 压模划痕die lubricant 压模润滑剂die mold 压铸模die orifice 拉模孔die plate 拉模板;阴模固定板die profile 拉模孔形状die quenching 模压淬火die reduction angle 拉模孔圆锥角die relief angle 模孔出口角die rolled section 周期断面型材die rolling 周期断面型材轧制die rolling mill 周期断面型材轧机die scratch 压模划痕die semiangle 拉模半圆锥角die set 成套模具;压型模;拉伸撂;下模定位环die shift 模具位移die slide 模座die steel 模具钢die volume 压模容积die wear 拉模磨损die welding 模锻焊dielectric 电介质材料dielectric constant 介电常数dielectric drier 高频烘干炉dielectric substance 电介质材料diescher elongator 狄舍尔轧管机diescher mill 狄舍尔轧管机diescher piercer 狄舍尔穿孔机differential dilatometer 差示热膨胀计differential flotation 优先浮选differential heating 差示加热differential manometer 差示压力计differential quenching 局部淬火differential thermal analysis 差示热分析differential thermometer 差示温度计diffraction 衍射diffraction figure 绕射图diffraction grating 衍射光栅diffraction pattern 绕射图diffraction spot 衍射斑点diffusibility 扩散能力diffusion 扩散diffusion alloying 扩散合金化diffusion annealing 扩散退火diffusion coating 扩散镀层diffusion coefficient 扩散系数diffusion couple 扩散对diffusion creep 扩散蠕变diffusion current 扩散电流diffusion equation 扩散方程式diffusion flow 扩散流diffusion front 扩散阵面diffusion layer 扩散层diffusion length 扩散长度diffusion overvoltage 扩散超电压diffusion porosity 扩散气孔diffusion potential 扩散电势diffusion pump 扩散泵diffusion saturation 扩散饱和diffusion transformation 扩散转变diffusion welding 扩散焊接diffusion zone 扩散区diffusionless transformation 非扩散转变diffusive deoxidation 扩散脱氧diffusivity 扩散系数digital control 数字控制dilatation 膨胀dilatometer 膨胀计dilatometry 膨胀测量法diluent 稀释剂dilute acid 稀酸dilute solution 稀溶液diluted solid solution 稀薄固溶体dilution 稀释dilution heat 稀释热dilution law 稀释定律dimension 因次dimensional accuracy 尺寸精度dimensional change 尺寸变化dimensional stability 尺寸稳定性dimorphism 同质二形dimpling 表面缺陷清理dioptase 透视石dioxide 二氧化物dip aluminum plating 热浸镀铝dip brazing 浸渍钎焊dip coated electrode 浸沾药皮焊条dip coating 浸镀dip galvanizing 热浸镀锌dip plating 浸入电镀dip process 浸镀法dipole moment 偶极矩dipped electrode 浸液电极dipping bath 浸浴direct annealing 直接退火direct arc furnace 直接加热电弧炉direct chlorination 直接氯化direct current arc furnace 直羚弧炉direct current arc welding machine 直羚焊机direct current electric furnace 直羚炉direct current electrode 直粮条direct extrusion 正挤压direct fired furnace 直接加热炉direct gate 顶浇口direct hardening 直接淬火direct heat treatment 直接热处理direct heating 直接加热direct iron process 直接炼铁法direct patenting 直接铅浴处理direct quenching 直接淬火direct reduction 直接还原direct reduction pellets 直接还原用球团矿direct reduction unit 直接还原装置direct sintering 直接烧结direct smelting 直接熔炼direct steam 直接蒸汽direct stress 法向应力direct welding 双面点焊directed solidification 定向性凝固direction of easy magnetization 易磁化方向direction of rope lay 钢丝绳的捻向direction of strand lay 股线捻向direction of welding 焊接方向directional crystallization 定向结晶化directional property 定向性directional solidification 定向性凝固dirt 泥渣disappearing filament pyrometer 隐丝式光学高温计discard 切头discard solution 废液discharge 出料;放电discharge pipe 排出管discharge potential 放电电位discharging 出料discharging roller table 卸料辊道discontinuity 不连续性discontinuous precipitation 不连续沉淀discontinuous sintering 间歇烧结discontinuous spectrum 不连续光谱discontinuous welding 断续焊discontinuous yielding 不连续屈服disintegrated powder 碎粉disintegration 衰变disintegrator 碎解机disk anode 圆盘阳极disk crusher 盘式破碎机disk feeder 圆盘给料器disk filter 圆盘过滤机disk granulator 圆盘式造球机disk mill 盘磨机disk screen 圆盘筛disk shaped roll 盘形辊dislocation 位错dislocation climb 位错攀位dislocation core 位错芯dislocation density 位错密度dislocation dipole 位错偶极子dislocation forest 位错林dislocation jog 位错割阶dislocation line 位错线dislocation locking 位错锁定dislocation loop 位错环dislocation network 位错网dislocation node 位错节点dislocation pipe diffusion 位错管扩散dislocation ring 位错环dislocation source 位错源dislocation structure 位错组织dislocation tangling 位错缠结dislocation theory 位错理论dislocation tree 林位错dislocation wall 位错墙dislocations strengthening 位错强化disorder 无序disordered lattice 无序晶格disordered solid solution 无序固溶体disordering 无序化disordering temperature 无序化温度disorientation 错取向disperse phase 分散相dispersion 分散dispersion agent 分散剂dispersion hardened alloy 弥散硬化合金dispersion hardening 弥散硬化dispersion particle 分散粒子dispersion strengthened alloy 弥散硬化合金dispersion strengthened material 弥散强化材料dispersity 分散度dispersoid 分散质displaced atom 移位原子displacement 移动displacement cascade 位移级联displacement law 位移法则displacement reaction 置换反应displacement spike 位移尖锋disruptive strength 破坏强度dissipation 散逸dissipation of energy 能的散逸dissociation 离解dissociation constant 离解常数dissociation energy 离解能dissociation equilibrium 离解平衡dissociation of dislocation 位错的分解dissociation pressure 离解压力dissociation temperature 离解温度dissociation tension 离解压dissolubility 可溶性dissolution 溶解dissolvability 可溶性dissolved nitrogen 溶解氮dissolved oxygen 溶解氧dissolvent 溶媒dissolving 溶解distance control 遥控disthene 蓝晶石distillate 馏分distillating still 蒸馏釜distillation 蒸馏distillation apparatus 蒸馏装置distillation column 蒸馏塔distillation flask 蒸馏瓶distillation method 蒸馏法distillation purification 蒸馏净化distillation residue 蒸馏残渣distillation tower 蒸馏塔distillatory refining 蒸馏精炼distilled water 蒸馏水distiller 蒸馏器distilling 蒸馏distilling apparatus 蒸馏装置distilling furnace 蒸馏炉distortion 扭曲distributing bell 布料钟distribution 分布distribution coefficient 分配系数distribution curve 分配曲线distribution law 分配定律distributor 分配器dithionate 连二硫酸盐dithionic acid 连二硫酸divacancy 双空位divariant system 二变系divergence 发散dividing cross 取样十字架dividing shears 切分剪division 刻度;划分divorced cementite 离异渗碳体divorced eutectic 离异共晶divorced perlite 球状珠光体dobschauite 辉砷镍矿dolerophane 褐铜矿dolerophanite 褐铜矿dolly 小车;芯棒dolomite 白云石dolomite magnesite refractory 白云石镁质耐火材料dolomite refractory 白云石质耐火材料dolomitic lime 白云石石灰dolomitic limestone 白云石灰岩dolomitic pellets 白云石球团dolomitic sinter 白云石烧结物domain 畴domain wall 布洛赫壁domestic scrap 返回废钢domeykite 砷铜矿door extractor 开门机door lifter 开门机door machine 开门机dore silver 多雷含金粗银dorr classifier 道尔型分级机dorr thickener 道尔浓缩机dosing 配料dosing bin 计量料包dot welding 填补焊double action press 双动压力机double angle iron 槽钢double annealing 双重退火double bell top 双料钟炉顶double bevel groove k 形坡口double bond 双键double carbide 复合碳化物double cascade quenching 二梯零火double chain drawbench 双链式拉拔机double coated electrode 双层药皮焊条double cone mixer 双锥混合机double contraction 双重收缩double decomposition 复分解double double iron 八叠板double duo mill 复二重式轧机double electric layer 双电层double equilibrium diagram 复平衡状态图double fillet weld 双填角焊缝double filter 双滤器double furnace bumper 炉用双联式缓冲器double hook 双吊钩double layer compact 双层压坯double quench hardening 二重淬火double quenching 二重淬火double refining 二重精炼double remelting 双联重熔double skin 重皮double slag process 双渣法double strand drawing 双线拉拔double strand drawing mill 双线拉伸机double strand mill 双线轧机double t iron 工字铁double tempering 二重回火double two high rolling mill 复二重式轧机double u groove 双 u 形对接坡口double v butt joint 双面 v 形对焊接头double v groove x 形坡口double wall tube 双层管doubler 折叠机doubling 折叠doubling machine 折叠机dovetail 燕尾dowel pin 定位销dowel plate 定位销板downcoiler 地下卷取机downcomer 降气管downcut shears 上切式剪切机downgate 直浇口downhand position 平焊位置downhand welding 平焊downhill casting 上铸downsprue 直浇口downtake 升降道dowson gas 道生半水爆气dozzle 保温帽draft 通风;壁斜度;压下率draft furnace 通风炉drafting schedule 压下规程drag 移送机drag over mill 二辊不可逆式轧机draw 拔模斜度;脱模draw block 拉丝卷筒draw carriage 拉拔机小车draw furnace 回火炉drawability 可拉拔性drawback 回火drawbench 拉伸机drawer 拉拔工drawhole 拉模孔drawing 回火drawing angle 拉模孔圆锥角drawing die 拉模;深冲模drawing down 延伸;缩径drawing drum 拉丝卷筒drawing force 拉拔力drawing mill 拉伸机drawing press 深拉压力机drawing speed 拉拔速度drawing temperature 回火温度drawing test 杯突试验drawn in scale 嵌入表面的氧化皮drawn pipe 拉制管drawn tube 拉制管drawn wire 拉制线材dressability 选矿性dresser 选矿机;精整工dressing 矫正;涂料dressing machine 矫正机;切飞边冲床dressing room 修整工段dribble 滴drier 干燥炉drift 穿孔器;弹性后效drift test 扩口试验drill pipe 钻探管drill steel 钎子钢drip feed carburizing 点滴渗碳drive 驱动driven pulley 从动轮driven roller 驱动辊driven shaft 从动轴driving pulley 织轮driving shaft 织轴drop analysis 点滴分析drop ball 落锤drop bottom 活底drop forging 落锤锻造drop hammer 落锤drop reaction 点滴反应drop strength 落下强度drop test 落下试验;冲辉验drop transfer 熔滴过渡droplet 液滴dropping characteristic 下降特性dropping electrode 滴液电极dross 浮渣dross hole 出渣口dross trap 集浮渣器drossing 撇渣drum drier 圆筒干燥机drum feeder 筒式给料机drum filter 鼓式过滤机drum furnace 鼓形炉drum granulator 圆筒造球机drum index 转鼓试验强度drum mixer 圆筒混合机drum pelletizer 圆筒造球机drum strength 转鼓强度drum test 转鼓试验drum type coiler 筒式卷取机drum type decoiler 卷筒式开卷机drum type shears 滚筒式剪切机drum vacuum filter 鼓式真空过滤机dry air blast 干燥送风dry analysis 干法分析dry assay 干式试金dry bag isostatic pressing 干袋等静压压制dry bond 干强度dry cleaning 干式净化dry concentration 干选dry cooling 干式熄焦dry copper 凹铜dry corrosion 干腐蚀dry distillation 干镏dry drawing 干法拉拔dry electrostatic precipitator 干式静电收尘器dry friction 干摩擦dry gas cleaning 干式除尘dry gas purifier 干式煤气净化器dry grinding 干磨dry ingot 过热金属锭dry milling 干磨dry molding 干砂造型dry permeability 干透气性dry process 干法dry purification 干式净化dry quenching 干法淬火dry residue 干残渣dry sand 干型砂dry sand mold 干燥砂型dry screening 干筛dry steam 干蒸汽dry strength 干强度dry weight 干重量dry zone 干燥带dryer 干燥炉drying 干燥drying chamber 干燥室drying machine 干燥机drying oven 干燥炉drying pipe 干燥管drying rolls 挤干辊drying tower 干燥塔drying unit 干燥器dual chain drawbench 双链式拉拔机dual hearth furnace 双床平炉dual phase steel 双相钢duct 导管ductile brittle transition 延性脆性转移ductile cast iron 球墨铸铁ductile crack 延性破裂ductile fracture 塑性断裂ductility 延性dull finish 消光加工dumbbell interstitial 亚铃状间隙原子dumming 粗成形;空轧通过dummy bar 引锭杆dummy bar disconnection 引锭杆分离dummy bar head 引锭头dummy bar pit 引锭杆坑dummy bar tilter 引锭杆翻转装置dummy block 挤压垫dummy pass 空轧孔型dump 堆积场dump box 翻斗dump leaching 矿堆浸出dump slag 废弃矿渣dunite 纯橄榄岩duplex nickel plating 双重镍镀层duplex process 双联法duplex structure 二相显微结构duplex tube 复合管duplexing 双联法durability 耐久性duralumin 硬铝duration of heat 加热时间;冶炼时间duroscope 携带式硬度计dust arrester 捕尘器dust bag 集尘袋dust catcher 捕尘器dust chamber 集尘室dust cleaning apparatus 除尘装置dust coal 粉煤dust collecting cyclone 旋涡收尘器dust collection 收尘dust collector 集尘器dust elimination 除尘dust emission 粉尘排放dust exhaust 除尘dust filter 滤尘器dust free gas 净煤气dust ore 粉状矿石dust pocket 贮尘室dust removal 除尘dust remover 除尘器dust separator 离尘机dustiness 含尘度dwight lioyd sintering machine dl型带式烧结机dynamic equilibrium 动态平衡dynamic load 动荷重dynamic pressure 动压力dynamic recovery 动态回复dynamic recrystallization 动态再结晶dynamic strength 动态强度dynamic stress 动力应力dynamic test 动力学试验dynamic viscosity 动态粘度dynamics 动力学dynamo 发电机dynamo sheet 电机钢板dynamo steel 电机钢dynamometer 测力计dysanalyte 钛铌铁钙矿dysprosium 镝。
真空电镀及工艺流程(Vacuumplatingandprocess)
真空电镀及工艺流程（Vacuum plating and process）真空电镀及工艺流程(Vacuum plating and process)Vacuum plating and processSource: the full update training date: 2011 09 month 22 hits: 216 Vacuum evaporation is heated in a high vacuum condition of the metal, melting, evaporation, cooling after forming a metal film on plastic surface. The commonly used metal is aluminum and other low melting point metal.A method for heating metal: the heat generated by the resistance,but also the use of electron beam.In the implementation of evaporation of plastic products, in orderto ensure that the metal cooling heat emitted by the resin to deformation, must adjust the evaporation time. In addition, the metal or alloy melting point, boiling point is too high is not suitable for evaporation.The plating metal and plated plastic products in the vacuum chamber, using certain methods of heating the plating material, the metal evaporation or sublimation, metal vapor encountered plastic surface cold condensed into a metal film.Under vacuum conditions can reduce the evaporation of materials in atomic and molecular collision to plastic products and other molecules, reduce the chemical reactivity of the molecules in a gas and steamsource between materials (such as oxidation), thus providing the filmdensity, purity, deposition rate and adhesion. Usually the vacuum evaporation film for indoorpressure equal to or less than 10-2Pa, the evaporation source andthe plated film products and high quality requirements of the occasion, requires a lower pressure (10-5Pa).The coating thickness is 0.04-0.1um, too thin, too thick, low reflectivity; poor adhesion, easy to fall off. The thickness of 0.04 reflectivity is 90%, vacuum ion plating, and vacuum coating. Vacuum plating practice now is a more popular approach, strong sense of products made out of metal and relatively high brightness. Other coating method, low cost, little pollution to the environment, is now widely used in various industries.Vacuum plating has a wide range of application, such as ABS, ABS+PC material, PC material products. At the same time because of its complex process, environment and equipment requirement is high, the price of water than electroplating expensive. This article provides a brief introduction to the process of product surface cleaning -- "to" - "-- electrostatic primer spray baking primer. Vacuum coating, spray paint, baking finish packing." -- "The general practice is in the vacuum plating material to spray a layer of primer, and then electroplating. Because the material is plastic, residual air bubbles, the injection of organic gases, and when placed in the inhalation of moisture in the air. In addition, because the plastic surface is not smooth, direct plating of the workpiecesurface is not smooth. Low gloss, poor sense of metal, and the bubble will appear, blisters and other adverse conditions. After spraying a layer of primer, will form a smooth surface, and prevent plastic itself bubble blisters, the plating effect can be demonstrated.Vacuum plating can be divided into general vacuum plating, vacuum plating, vacuum plating UV special. Process of evaporation, sputtering, gun color.For the hydropower plating process is relatively simple, from the equipment to the environmental requirements are not stringent vacuum ion plating, which is widely used. But the water electroplating have a weakness, only ABS material and ABS+PC material plating (the material plating effect is not very ideal). While the ABS material temperature is only 80 degrees, which makes the scope of application it is limited. And vacuum plating can reach 200 degrees Celsius, it can be used in high temperature treatment of electroplating parts.The wind, wind mouth mouth ring using PC material, these components are required to resist high temperature 130 degrees. On the other, the general requirements of high-temperature components, vacuum plating to do at the end of spraying a layer of UV oil, which makes the product surface luster, high temperature resistance, adhesion and guarantee.The advantages and disadvantages of two kinds of process:A, simple, vacuum plating but UV oil, its adhesion is poor, unableto 100 TEST, and the water was better than vacuum plating plating!Therefore, in order to ensure the vacuum plating adhesion required subsequent spraying treatment, the high cost of course.B water, electroplating color is monotonous, generally onlybright silver and silver and so few, for silver flash, magic blue, crack, silver drop seven on all kinds of color. But incapable of action vacuum plating can solve the problem of the color colorful.The coating material of C, the general water electroplating by "six chromium", this is not environmental protection materials. There are requirements for the "six chromium":EU: 76769EEC: prohibit the use of 9462EC:100ppm;ROHS:1000ppm so strict, some domestic manufacturers have begun totry to use "trivalent" instead of "six chromium"; and vacuum plating coating materials widely use, easy to meet the requirements of environmental protection.A simple point, is in a vacuum state will need to be coated on the surface of the product of the film materials by plasma ionization deposited on the surface of the workpiece surface processing technology.It has a vacuum evaporation deposition, sputtering, ion plating, etc., there are many ways to obtain these deposition methods: electric heating, ion beam, electron beam, DC magnetron sputtering, magnetron sputtering, sputtering and RF frequency construction, pulse sputtering, microwave plasma enhanced, arc and so on many kinds of methods, coating equipment selection can be considered according to the the demand of economic and technological conditions.Compared with the traditional wet plating, vacuum plating hasthe following advantages:1. sedimentary materials widely: low potential metal deposition of aluminum and titanium, zirconium and other wet plating cannot be deposited, the reaction gas and alloy target even more diamond coating can be deposited from the alloy to ceramics, and can be designed according to the need of coating system.2. save metal material: because the vacuum coating adhesion, density, hardness and corrosion resistance of deposited coatings can be quite good, far less than the conventional wet plating, to achieve the purpose of saving.3. no environmental pollution: because all coating materials are in vacuum environment by plasma deposition on the surface of the workpiece, no solution pollution damage to the environment, so it is quite small.But because of the availability of vacuum and plasma precision instruments and equipment is expensive, and the deposition process also lies in a few hands without a lot of technical personnel, promotion, investment and daily production cost of maintenance is expensive. But with the development of society, vacuum plating advantages will be more and more obvious, in some industries to replace the traditional wet plating is represent the general trend!Vacuum ion plating, and vacuum coating. Vacuum plating practice nowis a more popular approach, strong sense of products made out of metal and relatively high brightness. Other coatingmethod, low cost, small environmental pollution, now widely used for various industries.Vacuum plating has a wide range of application, such as ABS, ABS+PC material, PC material products.At the same time, because of its complex process, environment and equipment requirement is high, the price of water than electroplating expensive. This article provides a brief introduction to the process of product surface cleaning -- "to" - "-- electrostatic primer spray baking primer" -- vacuum coating -- "spray paint" baking finish -- "- packaging. The general practice of vacuum plating in the material to spray a layer of primer, and then electroplating. Because the material is plastic, residual air bubbles, the injection of organic gases, and when placed in the inhalation of moisture in the air. In addition, because the plastic surface is not smooth, direct plating workpiece surface is not smooth, low gloss, poor sense the metal, and the bubble will appear, blistersand other adverse conditions. After spraying a layer of primer, willform a smooth surface, and prevent plastic itself bubble blisters, the effect of electroplating To show.Vacuum plating can be divided into general vacuum plating, vacuum plating, vacuum plating UV special. Process of evaporation, sputtering, gun color.For the hydropower plating process is relatively simple, from the equipment to the environmental requirements are not stringent vacuum ionplating, which is widely used. But the water electroplating have a weakness, only ABS material andABS+PC material plating (the material plating effect is not very ideal). While the ABS material temperature is only 80 degrees, which makes the scope of application it is limited. And vacuum plating can reach 200 degrees Celsius, it can be used in high temperature treatment of electroplating parts. The wind wind mouth, mouth ring using PC material, these components are required to resist high temperature 130 degrees. On the other, the general requirements of high-temperature components, vacuum plating to do in the end spray a layer of UV oil, which makes the product surface luster, high temperature resistance, adhesion and guarantee.The advantages and disadvantages of two kinds of process:A, simple, vacuum plating but UV oil, its adhesion is poor, unable to 100 TEST, and the water was better than vacuum plating plating! Therefore, in order to ensure the vacuum plating adhesion required subsequent spraying treatment, the high cost of course.B water, electroplating color is monotonous, generally only bright silver and silver and so few, for silver flash, magic blue, crack, silver drop seven on all kinds of color. But incapable of action vacuum plating can solve the problem of the color colorful.The coating material of C, the general water electroplating by "six chromium", this is not environmental protection materials. There arerequirements for the "six chromium": EU: 76769EEC: the prohibition ofthe use of 9462EC:100ppm;ROHS:1000ppmSuch stringent requirements, some domestic manufacturers have begunto try to use "trivalent" instead of "six chromium"; and vacuum plating coating materials widely use, easy to meet the requirements of environmental protection.A simple point, is in a vacuum state will need to be coated on the surface of the product of the film materials by plasma ionization deposited on the surface of the workpiece surface processing technology.It has a vacuum evaporation deposition, sputtering, ion plating, etc., there are many ways to obtain these deposition methods: electric heating, ion beam, electron beam, DC magnetron sputtering, magnetron sputtering, sputtering and RF frequency construction, pulse sputtering, microwave plasma enhanced, arc and so on many kinds of methods, coating equipment selection can be considered according to the the demand of economic and technological conditions.Compared with the traditional wet plating, vacuum plating has the following advantages:OneThe deposited materials widely: low potential metal deposition of aluminum and titanium, zirconium and other wet plating cannot be deposited, the reaction gas and alloy target even more diamond coatingcan be deposited from the alloy to ceramics, and can be designed according to the need of coating system.2. save metal material: because the vacuum coating adhesion, density, hardness and corrosion resistance of deposited coatings can be quite good, far less than the conventional wet plating, to achieve the purpose of saving.3. no environmental pollution: because all coating materials are in vacuum environment by plasma deposition on the surface of the workpiece, no solution pollution damage to the environment, so it is quite small.But because of the availability of vacuum and plasma precision instruments and equipment is expensive, and the deposition process also lies in a few hands without a lot of technical personnel, promotion, investment and daily production cost of maintenance is expensive. But with the development of society, vacuum plating advantages will be more and more obvious, in some industries to replace the traditional wet plating is represent the general trend!Vacuum sputtering process:Give good cleaning shell injection molding, and then coated with a layer of UV primer, and then vacuum sputter plating a layer of metal film, using atomic and physical vapor deposition, after covering a layer of paint UV. The key equipment is that Taiwan vacuum sputtering machine. It is said that the value of 800W. Should be more than a little high confidential evaporation evaporation machine, with a similar boiler.Vacuum plating, the word is not exact. Not attributable toelectroplating. Of course, also called dry plating, vacuum plating is often called ion plating.We believe that the main subject, considering the mechanical properties of adhesion or metallurgical bonding coating and substrate, to expand the scope of it are referred to as vapor deposition, are classified as followsVapor depositing chemical vapor depositionPhysical vapor depositionHigh temperature and low temperature chemical vapor deposition Physical vapor deposition, ion plating...The low temperature vapor deposition is enhanced by low temperature plasma chemical vapor phase deposition. As a practical tool to strengthen the technology.。
塑胶件真空镀工艺流程
塑胶件真空镀工艺流程英文回答：Plastic Part Vacuum Plating Process Flow.Preparation:1. Cleaning: Remove contaminants such as oils, greases, and dirt from the plastic surface using ultrasonic cleaning or solvent wiping.2. Etching: Create a roughened surface on the plastic to enhance adhesion using plasma or chemical etching.3. Priming: Apply a primer to promote adhesion between the plastic and the metallized layer.Vacuum Deposition:1. Loading: Place the plastic parts into the vacuumchamber of the plating system.2. Vacuum Generation: Evacuate the chamber to a high vacuum (typically <10^-5 Torr) to remove air and moisture.3. Sputtering: Deposit a thin layer of metal onto the plastic surface using a sputtering technique, such as magnetron or ion beam sputtering. This layer provides the reflective or conductive properties desired.4. Optional: Post-Treatment: Depending on the application requirements, additional treatments such as annealing or protective coating may be applied to enhance durability or specific properties.Unloading and Inspection:1. Unloading: Remove the plated plastic parts from the vacuum chamber.2. Inspection: Conduct visual and functional inspections to ensure quality and compliance withspecifications.中文回答：塑胶件真空镀工艺流程。
五金展示架类外贸英语沟通英语句子专业词汇汇总
绿色仿大理石
Green cultured granite panel with straight edg带es直边的绿色仿大理石
keyhole on back for hanging
背部带悬挂锁孔
rubber feet on bottom
底贴橡胶脚垫
to fit in insert area on back
with customer supplied material inside the tub管e 内放客供材料
blocks will be hollow and will be filled with 两cu块st压om克er力s为up空pl心ie的r ，ma管te内ri为al客s 供材料
gold mirrored
黑色圆饼螺母及螺帽
gold wood screw
金色平头十字螺丝
Telescopic hardware Mirrored bottom
自攻螺丝 底贴镜
An Optic Crystal ball with flat mirrored botto透m 明水晶的平底处贴镜
Green cultured granite
银色钢柱 adj. 假装的；冒充的；仿造的；模仿的 adj. 抽象的，理论上的；难解的；抽象派 的；茫然的 红木 Familiar with declaration process, relevant laws and regulations, the one with declarant qualified certificate is preferred 盖帽式螺帽 支架 纹理 抛光边 仿 打埋头孔 vt. 假装，冒充；模仿；模拟；[生]拟态
汉语 透明橡胶脚垫 胡桃木效果木器 背板 挂环 光玻 板 樱桃木效果木框 透明压克力盖 绿色宝石 金属压铸奖章 白玻 喷黑色效果木器 树脂 樱桃钢琴木 樱桃木效果木器 带磁性的不锈条 蒙古黑大理石 毛丝面不锈框 中纤板 红木 镜面不锈钢板 横向毛丝面不锈钢 竖向毛丝面银色铝板 银镜 不锈钢棒 钩 圆弧边 乱纹铝板 螺杆 喷渡银色 红铜色镜面 喷乳白色 橡木 中纤板 中纤板 泡棉蕊 精雕香柏木器 贴金泊
H13_钢表面多弧离子镀CrAlN_涂层的显微硬度及耐磨性影响
第20卷第11期装备环境工程2023年11月EQUIPMENT ENVIRONMENTAL ENGINEERING·115·重大工程装备H13钢表面多弧离子镀CrAlN涂层的显微硬度及耐磨性影响袁嵩1，王帅2，方略2，张永伟2，李晓燚2，周志明3,4（1.海装驻西安地区第二军事代表室，西安 710025；2.重庆长安工业集团有限责任公司，重庆 400023；3.重庆理工大学 材料科学与工程学院，重庆 400054；4.重庆合创纳米科技有限公司，重庆 400707）摘要：目的提高H13热作模具钢表面的显微硬度及耐磨性。
方法通过多弧离子镀技术，分别对未经热处理的H13钢、淬火H13钢以及氮化H13钢的表面进行多弧离子镀沉积CrAlN涂层，并分别对这3种基体上的CrAlN涂层的显微硬度和摩擦磨损性能进行研究。
结果涂层表面均较为平整，且出现了白色小颗粒。
经过淬火和氮化处理后，H13钢CrAlN涂层的显微硬度达到3 300HV以上，达到基体的14倍多。
与基体的摩擦系数相比，淬火和氮化处理后，H13钢的摩擦系数比基体低，镀膜后的摩擦系数比基体高。
氮化H13钢表面CrAlN涂层的磨损机理主要是磨粒磨损和黏着磨损共同作用，淬火H13钢的CrAlN涂层磨损机理主要是黏着磨损；淬火和氮化后H13钢基体上CrAlN涂层的耐磨性均得到较大的提高。
关键词：H13钢；CrAlN涂层；多弧离子镀；摩擦磨损；显微硬度; 显微组织中图分类号：TG174 文献标识码：A 文章编号：1672-9242(2023)11-0115-06DOI：10.7643/ issn.1672-9242.2023.11.015Effect on the Microhardness and Wear Resistance of Multi Arc IonPlating CrAlN Coating on H13 SteelYUAN Song1, WANG Shuai2,F ANG Lue2, ZHANG Yong-wei2, LI Xiao-yi2, ZHOU Zhi-ming3,4(1. The Second Military Representative Office of Haizhuang's in Xi'an, Shaanxi Xi'an, 710025, China; 2. Chongqing Chang'anIndustrial Group Co., Ltd., Chongqing 400023, China; 3.School of Material Science and Engineering, Chongqing University of Technology, Chongqing 400054, China; 4. Chongqing Hechuang Nano Technology Co., Ltd., Chongqing4000707, China)ABSTRACT: The work aims to improve the microhardness and wear resistance of H13 steel surface by multiarc ion plating coating technology. The CrAlN coatings were separately deposited on the surfaces of untreated H13 steel, quenched H13 steel and nitrided H13 steel. The microhardness and friction and wear properties of CrAlN coatings on these three substrates were studied. The coating surface was relatively flat and white small particles appeared. The microhardness of the CrAlN coating on H13 steel after quenching and nitriding treatment reached over 3300HV, which was more than 14 times that of the substrate.Compared with the friction coefficient of the substrate, the friction coefficient of H13 steel after quenching and nitriding treat-ment was lower than that of the substrate, while the friction coefficient after coating was higher than that of the substrate. The wear mechanism of CrAlN coating on nitrided H13 steel was an interaction of adhesive wear and abrasive wear, while the wear mechanism of CrAlN coating on quenched H13 steel was mainly attributed to adhesive wear. The wear resistance of CrAlN收稿日期：2023-08-03；修订日期：2023-11-01Received：2023-08-03；Revised：2023-11-01引文格式：袁嵩, 王帅, 方略, 等. H13钢表面多弧离子镀CrAlN涂层的显微硬度及耐磨性影响[J]. 装备环境工程, 2023, 20(11): 115-120. YUAN Song, WANG Shuai, FANG Lue, et al. Effect on the Microhardness and Wear Resistance of Multi Arc Ion Plating CrAlN Coating on H13 Steel[J]. Equipment Environmental Engineering, 2023, 20(11): 115-120.·116·装备环境工程 2023年11月coating on quenched and nitridedH13 steel increases greatly.KEY WORDS: H13 steel; CrAlN coatings; multiarc ion plating; friction and wear; microhardness; microstructure多弧离子镀是提高材料表面耐磨耐蚀性的一种物理气相沉积技术[1-3]。
铝材真空电镀工艺流程
铝材真空电镀工艺流程英文回答：Aluminum vacuum plating is a process used to coat aluminum materials with a thin layer of metal, typically silver, gold, or chrome. This process is commonly used in industries such as automotive, electronics, and decorative applications. The vacuum plating process involves several steps, including surface preparation, plating, and finishing.The first step in the process is surface preparation. This involves cleaning the aluminum material to remove any dirt, grease, or oxidation. The surface must be clean and free of any contaminants to ensure proper adhesion of the plating material. This can be done through various methods such as chemical cleaning, sandblasting, or ultrasonic cleaning.After the surface preparation, the aluminum material isplaced in a vacuum chamber. The chamber is then sealed, and the air inside is removed to create a vacuum. This is important because it eliminates any air or oxygen thatcould interfere with the plating process.Once the vacuum is created, the plating material is introduced into the chamber. The plating material can be in the form of a solid metal target or a vaporized metal. The plating material is then deposited onto the aluminummaterial through a process called sputtering or evaporation.During the plating process, the aluminum material is negatively charged, while the plating material ispositively charged. This creates an electrostaticattraction between the two, causing the plating material to adhere to the aluminum surface. The thickness of theplating layer can be controlled by adjusting the voltageand deposition time.After the plating process is complete, the aluminum material is removed from the vacuum chamber. The plated aluminum is then inspected for quality and any defects. Ifnecessary, additional finishing processes such as polishing or buffing can be performed to enhance the appearance and durability of the plated surface.中文回答：铝材真空电镀是一种将铝材料镀上一层金属薄膜的工艺，通常使用银、金或铬等金属进行镀覆。
真空电镀工艺流程和原理
真空电镀工艺流程和原理英文回答：Vacuum Plating: Process and Principle.Vacuum plating is a physical vapor deposition (PVD) technique that involves vaporizing a metal or other material in a vacuum chamber and depositing it as a thin film onto a substrate. This process is commonly used in various industries, including automotive, electronics, aerospace, and decorative applications.The vacuum plating process consists of the following steps:1. Chamber Preparation: The vacuum chamber is first prepared by cleaning and removing any contaminants. The substrate is then placed inside the chamber and secured.2. Vacuum Creation: A vacuum is created inside thechamber using a vacuum pump. This reduces the pressure to a very low level, typically in the range of 10^-5 to 10^-6 Torr.3. Material Evaporation: The material to be depositedis placed in an evaporation source, which is typically a crucible or filament. The evaporation source is heated to a high temperature, causing the material to vaporize.4. Vapor Deposition: The vaporized material travels through the vacuum and condenses on the substrate, forminga thin film. The thickness and properties of the film canbe controlled by adjusting the deposition time, temperature, and pressure.5. Post-Treatment: After the deposition process is complete, the substrate may undergo post-treatment processes such as annealing, heat treatment, or chemical etching to enhance its properties.The principle behind vacuum plating is based on the phenomenon of sublimation, where a solid material directlytransforms into a gas without passing through the liquid phase. In the vacuum chamber, the evaporated material atoms or molecules travel in straight lines until they encounter the substrate, where they condense and adhere to the surface.中文回答：真空电镀工艺流程和原理。
真空双面溅镀工艺流程
真空双面溅镀工艺流程英文回答：Vacuum double-sided sputtering is a process used in the manufacturing of various electronic devices, such as solar cells, LED displays, and semiconductors. It involves depositing thin films of different materials onto both sides of a substrate using a vacuum chamber and sputtering targets.The process starts with the preparation of the substrate. The substrate can be made of various materials, such as glass or silicon. It is thoroughly cleaned to remove any impurities or contaminants that could affect the quality of the deposited films.Once the substrate is prepared, it is loaded into the vacuum chamber. The chamber is then evacuated to create a high vacuum environment. This is important to minimize the presence of any gas molecules that could interfere with thesputtering process.Next, sputtering targets are introduced into the chamber. These targets are made of the materials that will be deposited onto the substrate. For example, if the desired films are made of indium tin oxide (ITO), the sputtering targets would be made of indium and tin.The targets are bombarded with high-energy ions, typically generated by a radio frequency (RF) or direct current (DC) power source. This bombardment causes the atoms of the target material to be ejected and deposited onto the substrate.To ensure uniform deposition on both sides of the substrate, the chamber is equipped with multiple targets and the substrate is rotated during the sputtering process. This allows for a more even distribution of the deposited material.The deposition process continues until the desired thickness of the films is achieved. The thickness can becontrolled by adjusting the sputtering time and the power applied to the targets.Once the deposition is complete, the chamber is slowly vented to atmospheric pressure. The substrate is then unloaded and inspected for quality. Any defects or imperfections in the films can be identified at this stage.中文回答：真空双面溅镀是一种用于制造各种电子器件的工艺流程，例如太阳能电池、LED显示屏和半导体。
IPC-1601-印制板操作和贮存指南英文版精选全文完整版
IPC-1601 PRINTED CIRCUIT BOARD HANDLING AND STORAGEGUIDELINESStrawman Draft – September 20071 INTRODUCTION1.1 Background Historically, the printed circuit board (pcb) industry relied on military specifications and guidelines to define packaging methods to preserve the quality and reliability of pcbs and assemblies during shipment and storage. Most of these specifications and guidelines are now irrelevant, obsolete or outdated, leaving the industry without any currently effective guidelines. Additionally, the proliferation of new alternative final finishes has produced new concerns and needs. Overwhelming attendance at a panel discussion held at the IPC Fall Works meeting in Minneapolis in 2004 produced many requests to develop a guideline that our industry could use to achieve effective handling, packaging, and storage practices. This guideline is the result of those inputs.1.2 Purpose This guideline is intended to provide useful information on handling, packaging materials, environmental conditions and storage methods, for pcbs and assemblies. The scope of coverage will be from the manufacture of the bare pcb all the way to possible return of the assembled pcb for warranty repair. As a guideline, this information is to be used with, and is secondary to, established requirements in such documents as the IPC-455X (a series of documents for alternate final finishes) series of documents. Effective use of this guideline should prevent damage and maintain reliability of pcbs and assemblies.1.3 Target Audience The target audience includes all phases of pcb design, manufacture, assembly, shipping, storage, and possible warranty activities. Resources for this information include all of these functions, as well as the material and equipment suppliers.1.4 Terms and Definitions The definition of all terms used herein shall be as specified in IPC-T-50 and as defined below.2 APPLICABLE DOCUMENTS2.1 IPCIPC-T-503 BOARD FABRICATION AND PACKAGING (HANDLING)3.1 Board Materials All materials used in the manufacturing of printed boards must be protected from environmental, handling and storage damage. It is customary for manufacturers to have FOD procedures( spell out)ISO, OEM flow down to suppliers in place that outline these preventive practices. Primary areas of concern for printed board materials are:3.1.1 Bonding materials, pre-preg and foils3.1.1.1 Environmental concerns These materials are sensitive to damage from exposure to moisture and humidity. They must have a degree of protection starting from material manufacture and storage, through transportation to the using facility, and within the using facility. Typically, these materials are stored and used in a controlled environment where the temperature and humidity controlled within limits specified by the manufacturers of these materials. The normal ranges are XX-XX % humidity and XX-XX temperature. Temperature and humidity recorders are a normal part of the control process for the storage and use locations, and may also be used during the transportation of these materials. Please refer to your material manufacturer’s recommendations for guidance on your materials.3.1.1.2 Handling and processing concerns The infrastructure of the manufacturing location, as well as the equipment used to manufacture these materials, must be designed and evaluated to provide protection from damage and the introduction of foreign materials that may be detrimental to the finished product. Boxes, trays, and carts can be designed to protect these materials during transportation and use. Processing equipment must be evaluated to assure that it is capable of processing these materials reliably without causing damage to these materials or the finished product.3.2 INNER LAYER PRODUCTION CONCERNS3.2.1 Photo tooling3.2.1.1 Temperature and Humidity The temperature and humidity in the area that the photo tools are used and stored must be in the same ranges that the area that the photo tools are manufactured. This will ensure that the scaling of the imaged product matches the intended scaling of the photo tooling. Temperature and humidity recorders are typically used in these areas to assist in controlling this environment.3.2.1.2 Handling and Storage Photo tools are usually placed into protective envelopes, and stored in a manner that provides a reasonable amount of air movement around the photo tool to prevent entrapment of moisture. This moisture may degrade the photo tool prematurely. These protective envelopes also provide protection from abrasion and the introduction of foreign materials. Protective carriers may be designed to protect photo tools during transportation from the manufacturing area to the area of use where this transportation is required.3.2.2 Process Equipment3.2.2.1 Capability Equipment used for processing inner layers must be designed for handling the inner layer sizes, thicknesses, and material types used. Processing equipment must be verified capable of processing these materials without incurring damage.3.2.2.2Preventive Maintenance A preventive maintenance program should be developed and implemented to prevent the equipment from becoming in-capable of processing product reliably.3.3 Handling of the Finished Board- Assignee- Tom Kemp- Rockwell (Vegas)3.3.1 Handling during sub-processes (between facilities)3.3.2 Marking of the Board3.3.3 Handling for Bare Board Test3.3.4 ESD (Embedded Components?)3.3.5 Customer Returns4 Marking – Bare Board and/Or Packaging- Assignee- Joe Kane- BAE4.1 Lead Free/ RoHS complianceWhere required by statute or by the user, packaging shall be marked in accordance with RoHS Directive 2002/95/EC, with exceptions noted in the Annex, or other applicable statutes. This applies to PCB’s that only contain permissible levels of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers.A suitable identification symbol such as the following may be used on packaging or packaging labels:Where required by the user, surface finish and other attributes of PCB’s and packaging shall be marked in accordance with J-STD-609.4.2 ESDPackaging for ESD-sensitive PCB’s shall be marked per ANSI/ESD S20.20, including the ESD protective symbol:S8.1EOS/ESDSymbolProtective4.3 MoisturePCB’s enclosed in dry packaging may be marked with a suitable warning or moisture sensitivity caution symbol in a similar fashion to the marking requirements of J-STD-033:MoistureCautionSensitivitySymbol4.4 Not greater than 97% Tin:PCB’s that include tin (Sn) plating that is more than 97% pure tin may be at risk for developing tin whiskers. Where required by the user, packaging may include a suitable warning, such as the following:Note that tin finishes containing more than 97% tin may be considered “pure” according to some military or industry specifications for the purpose of assessing the risk of tin whisker growth, but this definition does not necessarily assure compliance with the RoHS Directive (see Paragraph 4.1).4.5 Other markingsOther markings (e.g. date codes, U.L.) shall be as specified by the user.Referenced Documents: (Move to Section 2.0?)ANSI/ESD S20.20 Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices)Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS Directive)EOS/ESD S8.1 Protection of Electrostatic Discharge Susceptible Items - Symbols - ESD AwarenessIPC/JEDEC J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount DevicesJ-STD-609 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead, Lead Free and Other Attributes5 Shipment of Bare Board – Assignee- Mike Paddack- Boeing5.1 Marking of the Package5.2 Packaging Materials/Testing (Bags, Seal Test of Bags, etc.)5.3 Packaging Methods5.3.1 Rigid Boards5.3.2 Flexible Boards (Fixturing)5.3.3 Board Cleanliness5.3.4 Baking5.3.4.1 Time5.3.4.2 Temperature5.3.4.3 Use Life5.3.4.4 Use of Vacuum5.3.5 Customer Returns6 Storage Prior to Assembly– Assignee- Don Youngblood- Honeywell6.1 Storage Conditions (Temperature, Humidity, Atmosphere)6.1.1 Storage Containers6.1.2 Storage Location6.1.3 Shelf Life6.1.4 Desiccant/Humidity Indicators (Bag Size, Number Required, etc.)7 Assembly Processes7.1 Handling Prior to Assembly – Assignee- Dave Hillman-Rockwell Collins7.1.1 Board Type Considerations7.1.2 Surface Finish Considerations7.2 Handling during Assembly7.2.1 Equipment ConsiderationsPrintersConsideration of stress, strain and ESD must be maintained at the same time as that of cleanliness. The printer and its associated stencils must be cleaned so that neither fresh solder paste or dried, old paste are deposited where not required/needed. The preventative maintenance (PM) schedule of the machine should be such that there is no danger of machine oils or greases coming in contact with the printed circuit board; the solder paste; stencil; support blocks, pins, grid, or plates (depending upon the machine type); or stencil cleaning equipment/cloth.The placement of the supporting accessories in the printer must be such as to prevent board warpage and subsequent solder paste bleed on application. The pressure of the squeegee must be such as to not exacerbate the situation.ConveyorsAll conveyor belts and conveyor edge fingers must be kept free of the above-mentioned contaminants. The PM schedule must be such to maintain the equipment in an essentially pristine condition with regards to potential contamination of the printed circuit board as it traverses the manufacturing process. Similar statements about the same types of materials can be made for the placement equipment and reflow oven.The width and parallelism of the conveyorized system must be checked regularly to make sure that the board does not fall out of the system bind or bow. In extreme cases of the latter, the potential exists, although rare, that copper traces and/or carbon inks, etc. could be cracked, resulting in intermittents or complete opens.Placement EquipmentThe placement equipment needs to be checked for two additional items: component placement force and the presence of loose components inside the machine. Excessive placement force could result in solder paste shorts, misplacement of components, component cracking, components bouncing off the board or cracking of the board itself. The latter would be an extreme case. Examples of small chip components found under larger PQFPs and array devices are embarrassing and not unheard of and can be avoided by maintaining proper machine cleanliness.Two concerns for board handling in the reflow oven have not been addressed yet. These are flux residues and orphan solder balls. Reflow ovens PMs should pre-empt cases of evaporated/sublimed solder paste flux/flux/glue/underfill material falling from the roof or ducting of the oven onto the printed circuit board. Internal oven cleanliness is especially important for convection reflow ovens. Small orphan solder balls can be ejected from the solder paste and potentially kept aloft by air/nitrogen currents in the oven. Appropriate wiping down and vacuuming (with a HEPA filter equipped vacuum) will eliminate this possible contamination problem.DepanelingSaw, routers and other depaneling equipment must be chosen for the process and maintained such that the circuit packs are not subjected to undo forces or contamination. During process qualification at the very least visual inspection of the boards excised from the panel should be completed. Better yet, acoustic microscopy inspection of chip components and the solder joints of leaded components should be done. Ideally strain gages should be used during the excising process to check that the stresses applied do not reach levels above limits set by the company and the component supplier.7.2.2 Handling during CleaningHandling of bare circuit boards and printed circuit packs can sometimes be blasé right before cleaning. Personnel may assume that the cleaning process will remove any contamination that they may have contributed to the board or the pack. However, the cleaning process may be set up to only remove a particular type or types of contaminationand may not remove the materials added by the handler. Therefore, it is strongly suggested that handling protocols used in other parts of the process by maintained.7.2.3 Cleanliness of Reusable ContainersReusable container cleanliness should be checked regularly. Three of the most important contaminants to check for are fiber glass filaments, solder balls and dirty solvents. The first could become lodged in connectors and not allow proper connector mating. Solder balls could end up on printed circuit packs, violating electrical clearest rules if the container was tipped up with one or more assemblies in the container. Closed containers, especially those with no drain holes could trap solvent containing a host of contaminants. If carriers are used with cleaning equipment, mesh type containers are recommended. 7.2.4 Handling in Test/InspectionThe company should have a schedule of cleaning protocols for the test equipment, especially for “bed of nails” testers. Preferably this should be tied to the number of circuit packs tested and not a unit of time. It is also dependent on pre-cleaning and the types of solder paste and flux used, as this will determine the amount and type of residues that could end up on the test pins.It is important to maintain cleanliness at any visual inspection stations inserted in the SMT process. This includes, but is not limited to the proper use of edge handling, gloves and clean implements (probes, tweezers, etc.).7.2.5 Handling for Conformal Coat7.2.6 Curing Storage7.2.7 ESD8 Assembly Shipping – Assignee-?8.1 Packaging for Shipping8.1.1 Cleanliness of the board assembly8.1.2 RFID8.1.3 Baking8.1.3.1 Time8.1.3.2 Temperature8.1.3.3 Use Life8.1.4 Shock Indicators9 Assembly Storage – Assignee-?9.1 Short Term (What is that?)9.2 Long Term9.3 Functional Qualification (Coupons?)10 Field Returns/Service– Assignee-11.1 Testing11.2 Evaluation/Repair。
真空专业英语
镀膜真空术语全集1.标准环境条件standard ambient condition：2.气体的标准状态standard reference conditions for gases：3.压力（压强）p pressure：4.帕斯卡Pa pascal：5.托Torr torr：6.标准大气压atm standard atmosphere：7.毫巴mbar millibar：8.分压力partial pressure：9.全压力total pressure：10.真空vacuum：11.真空度degree of vacuum：12.真空区域ranges of vacuum：13.气体gas：14.非可凝气体non-condensable gas：15.蒸汽vapor：16.饱和蒸汽压saturation vapor pressure：17.饱和度degree of saturation：18.饱和蒸汽saturated vapor：19.未饱和蒸汽unsaturated vapor：20.分子数密度n，m-3 number density of molecules：21.平均自由程ι、λ，m mean free path：22.碰撞率ψcollision rate：23.体积碰撞率χvolume collision rate：24.气体量G quantity of gas：25.气体的扩散diffusion of gas：26.扩散系数D diffusion coefficient; diffusivity：27.粘滞流viscous flow：28.粘滞系数ηviscous factor：29.泊肖叶流poiseuille flow：30.中间流intermediate flow：31.分子流molecular flow：32 克努曾数number of knudsen：33.分子泻流molecular effusion; effusive flow：34.流逸transpiration：35.热流逸thermal transpiration：36.分子流率qN molecular flow rate; molecular flux：37.分子流率密度molecular flow rate density; density of molecular flux：38.质量流率qm mass flow rare：39.流量qG throughput of gas：40.体积流率qV volume flow rate：41.摩尔流率qυmolar flow rate：42.麦克斯韦速度分布maxwellian velocity distribution：43.传输几率Pc transmission probability：44.分子流导CN,UN molecular conductance：45.流导C,U conductance：46.固有流导Ci,Ui intrinsic conductance：47.流阻W resistance：48.吸附sorption：49.表面吸附adsorption：50.物理吸附physisorption：51.化学吸附chemisorption：52.吸收absorption：53.适应系数αaccommodation factor：54.入射率υimpingement rate：55.凝结率condensation rate：56.粘着率sticking rate：57.粘着几率Ps sticking probability：58.滞留时间τresidence time：59.迁移migration：60.解吸desorption：61.去气degassing：62.放气outgassing：63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate：64.蒸发率evaporation rate：65.渗透permeation：66.渗透率φpermeability：67.渗透系数P permeability coefficient2. 1.真空泵vacuum pumps1-1.容积真空泵positive displacement pump：⑴.气镇真空泵gas ballast vacuum pump：⑵.油封（液封）真空泵oil sealed (liquid-sealed) vacuum pump：⑶.干封真空泵dry-sealed vacuum pump：⑷.往复真空泵piston vacuum pump：⑸.液环真空泵liquid ring vacuum pump：⑹.旋片真空泵sliding vane rotary vacuum pump：⑺.定片真空泵rotary piston vacuum pump：⑻.滑阀真空泵rotary plunger vacuum pump：⑼.余摆线真空泵trochoidal vacuum pump：⑽.多室旋片真空泵multi-chamber sliding vane rotary vacuum pump：⑾.罗茨真空泵roots vacuum pump：1-2.动量传输泵kinetic vacuum pump：⑴.牵引分子泵molecular drag pump：⑵.涡轮分子泵turbo molecular pump：⑶.喷射真空泵ejector vacuum pump：⑷.液体喷射真空泵liquid jet vacuum pump：⑸.气体喷射真空泵gas jet vacuum pump：⑹.蒸汽喷射真空泵vapor jet vacuum pump ：⑺.扩散泵diffusion pump ：⑻.自净化扩散泵self purifying diffusion pump：⑼.分馏扩散泵fractionating diffusion pump ：⑽.扩散喷射泵diffusion ejector pump ：⑾.离子传输泵ion transfer pump：1-3.捕集真空泵entrapment vacuum pump：⑴吸附泵adsorption pump：⑵.吸气剂泵getter pump：⑶.升华（蒸发）泵sublimation (evaporation)pump ：⑷.吸气剂离子泵getter ion pump：⑸.蒸发离子泵evaporation ion pump：⑹.溅射离子泵sputter ion pump：⑺.低温泵cryopump：2.真空泵零部件2-1.泵壳pump case：2-2.入口inlet：2-3.出口outlet：2-4.旋片（滑片、滑阀）vane; blade ：2-5.排气阀discharge valve：2-6.气镇阀gas ballast valve：2-7.膨胀室expansion chamber：2-8.压缩室compression chamber：2-9.真空泵油vacuum pump oil：2-10.泵液pump fluid：2-11.喷嘴nozzle：2-13.喷嘴扩张率nozzle expansion rate：2-14.喷嘴间隙面积nozzle clearance area ：2-15.喷嘴间隙nozzle clearance：2-16.射流jet：2-17.扩散器diffuser：2-18.扩散器喉部diffuser thoat：2-19.蒸汽导管vapor tube(pipe;chimney)：2-20.喷嘴组件nozzle assembly：2-21.下裙skirt：3.附件3-1阱trap：⑴.冷阱cold trap：⑵.吸附阱sorption trap：⑶.离子阱ion trap：⑷.冷冻升华阱cryosublimation trap：3-2.挡板baffle：3-3.油分离器oil separator：3-4.油净化器oil purifier：3-5.冷凝器condenser：4.泵按工作分类4-1.主泵main pump：4-2.粗抽泵roughing vacuum pump：4-3.前级真空泵backing vacuum pump：4-4.粗（低）真空泵roughing(low)vacuum pump：4-5.维持真空泵holding vacuum pump：4-6.高真空泵high vacuum pump：4-7.超高真空泵ultra-high vacuum pump：4-8.增压真空泵booster vacuum pump：5.真空泵特性5-1.真空泵的抽气速率（体积流率）s volume flow rate of a vacuum pump：5-2.真空泵的抽气量Q throughput of vacuum pump：。
IPC-6012专业英文词汇整理
PTH(plated-through hole)镀覆孔rigid printed board刚性印制板single-sided printed board单面印制板double-sided printed board双面印制板multilayer printed board多层印制板HDI(high density interconnect） 高密度互连distribitive capacitive planes离散电容层capacitive components埋容元器件resistive components埋阻元器件metal core printed board金属芯印制板blind via盲孔buried via埋孔procurement documentation采购文件AABUS(as agreed between user and supplier)由供需双方确定space and military avionics航天和军用设备thermal stress test热应力测试wave solder波峰焊selective solder选择性焊接hand solder assembly process 手工焊组装工艺reflow process再流焊工艺lead-free无铅customer drawing客户图纸SCP（supplier control plan)供应商控制方案final finish最终涂覆selective finish选择性涂覆VP(via protection)导通孔保护WBP(wire bondable pads)金属线键合盘AMC（active metal core） 有源金属芯NAMC（nonactive metal core)无源金属芯HF(external heat frame）外置散热框架EP(embedded passives)埋入式无源器件VIP-C(via in pad,conductive fill)盘内导通孔（导电物塞孔）VIP-N(via in pad,nonconductive fill)盘内导通孔（非导电物塞孔）Epoxy-Glass Laminate环氧玻璃布层压板Electrodeposited电解铜箔Conductor Width tolerance导体宽度公差Conductor Spacing tolerance导体间距公差Dielectric Separation介质层间隔Lateral Conductor Separation侧向导体间距Marking Ink标记油墨Solder Mask阻焊膜Solder Coating焊料涂覆层Solderability Test可焊性测试Isolation Resistance绝缘电阻Laminate Material基板材料acid copper electroplating 酸性镀铜pyrophosphate copper electroplating 焦磷酸盐镀铜additive/electroless copper加成法/化学镀铜tin-lead plate锡铅电镀S(solder coating)焊料涂层OSP(organic solderibility preservative有机可焊性保护层ENIG(Electorless Nickel Immersion Gold)化学镍/沉金IAg（Immersion silver）沉银Isn（Immersion tin)沉锡C（bare copper）裸铜interconnecting and packaging electronic circuit电子电路互连与封装micorsectioning显微剖切ionizable surface contaminants表面离子污染物tensile strength and elongation，in-house plating内部镀层的抗拉强度和延伸率测试land bond strength焊盘连接强度bow and twist弓曲和扭曲tape testmethod胶带测试法rework simulation模拟返工plated-through holes for leaded components有引线元器件的镀覆孔coefficient of thermal expansion热膨胀系数strain Gage method应变计法TDR(Time Domain Reflectometer)时域反射计法fungus resistance耐霉性moistrue 耐湿性physical shock物理冲击thermal shock热冲击vibration震动electrical insulating compound电气绝缘化合物permanent solder mask永久性阻焊膜generic standard通用标准packaging of high speed electronic circuit高速电子电路封装high speed/frequency高频/高速flexible base dielectric挠性基底介质flexible printed circuitry挠性印制电路resin coated copper foil覆树脂铜箔Embedded passive device resistor materials埋入式无源器件电阻tin-lead alloy锡铅合金test for flammability可燃性测试bonding material（prepreg)粘接材料heat sinks散热器photoimageable dielectric感光成像介质bond enhancement treatment粘接增强处理foil profile铜箔轮廓resistive metal foil电阻性金属箔master drawing布设总图substrate基材conductive coating导电涂覆层base metallic plating depositions基底金属电镀层via hole导通孔fused tin-lead plating锡铅熔融镀层solder coating焊料涂覆层vertical conductor edges导体垂直边缘electroless copper depositions化学沉积铜plating process电镀过程vacuum deposited metal真空沉积金属electroless metal 化学沉积金属electrodeposited copper电镀铜elongation延伸率fully addictive electroless copper deposition全加成法化学镀铜HASL（hot air solder leveling)热风整平eutectic tin-lead soldering coating共晶锡铅焊料涂覆层electrodeposited nickel电镀镍electrodeposited gold电镀金brittle solder joints脆性焊点XRF Spectrometry XRF光谱测定法corrosion腐蚀ENEPIG(Electroless nickel/Electroless palladium/immersion gold化学镍钯金anti-tarnish抗氧化geometries几何图形micorvias微导通孔laser激光mechanical drilling机械钻孔wet/dry etching湿/干蚀刻photo imaging光致成像conductive ink导电油墨polymer coating聚合物涂覆层fusing fluids and fluxes热熔液和助焊剂heatsink planes散热面resistor电阻visual examination目视检查diopter屈光度nicks缺口crazing微裂纹haloing penetration晕圈渗透breakaway tab分离槽口measling白斑process indicator制程警示CAF(Conductive Anodic Filament)导电阳极丝delamination/blistering分层/起泡foreign inclusions外来夹杂物particles夹杂物exposed/disrupted fibers露织物scratch/dent/tool mark划痕/压痕/加工痕迹surface void表面空洞mottle斑点pink ring粉红圈lifted lands连接盘起翘lead-free无铅press-fit component压接元器件plating adhesion镀层附着力overhang镀层突沿workmanship工艺质量flux residdue助焊剂残留物printed board periphery板外形notches槽口feature tolerance特征公差base/bilateral tolerance基准/双向公差AOI（automated optical inspection）自动光学检测hole size孔径hole pattern accuracy孔图形精度pattern feature accuracy图形要素精度finished hole size tolerance完成孔径公差nodule结瘤annular ring and breakout孔环和孔破环pits麻点dents凹痕nicks缺口pinhole针孔splay斜孔filleting填角法tear drop泪滴surface mount component表面贴装元器件conductor definition导体精度conductor imperfections导体缺陷solderable surface mount lands可焊表面贴装焊盘rectangular surface mount lands矩形表面贴装焊盘pristine area完好区域round surface mount lands(BGA PADS)圆形表面贴装焊盘（BGA焊盘）BGA（ball grid array)球栅阵列封装SMT(surface mount technology）表面安装技术ultrasonic(GWB-1)超声波压焊thermosonic(GWB-2)热压焊roughness-width cutoff粗糙度取样宽度noble metal贵金属dewetting退润湿nowetting不润湿tin/lead reflow锡铅再流exposed copper露铜cap plating of filled holes塞孔的盖覆电镀depressions/dimples凹陷/凹坑protrusions/bumps凸起/凸块structural integrity结构完整性vertical cross section垂直剖面plating integrity镀层完整性plating crack镀层裂缝plating void镀层空洞circumferential plating void环状镀层空洞laminate void层压空洞negative etchback负凹蚀etchback凹蚀wicking芯吸smear removal/desmear去钻污misregistration对位不准orthogonal cut垂直剖切plating thickness镀层厚度coating thickness涂覆层厚度glass fiber protrusions玻璃纤维突出hole wall孔壁copper wrap plating铜包覆电镀scrub磨刷dielectric spacing介质厚度simulation rework模拟返工lateral spacing侧向间距pattern skew图形偏斜land with holes带孔焊盘marking anomaly标记异常loose burr疏松毛刺aspect ratio厚径比nail heading钉头metal bumps金属凸点parallel conductor平行导体adjacent conductor相邻导体solder mask cure阻焊膜固化bubble气泡dielectric withstanding voltage介质耐压flashover火花breakdown击穿metal substrate金属基板MIR(moisture and insulation)湿热及绝缘电阻flush printed board齐平印制板resistance of solvent extract method溶液萃取法ionic离子contamination污染物oxide treatment氧化处理outgassing除气TML（total mass loss）总质量损耗CVCM(Collectible Volatile Condensable material)可收集挥发凝结物organic contamination有机污染MIR(Mulptiple internal reflectance)method多种内反射法infrared spectrophotometric analysis红外光谱分析vibration振动resonance dwell定时共振mechanical shock机械冲击CTE(Coefficient of Thermal Expansion)热膨胀系数thermal shock热冲击surface insulation resistance表面绝缘电阻DPA(destructive physical analysis)破坏性物理分析bare printed board裸板circuit repair电路维修coupon附连测试板resonance dwell循环测试geometric center几何中心appendix附录bond material粘结材料solvent extract method溶液萃取法brittle solder joints脆性焊点acceptance test验收测试sodium chloric氯化钠cycling and resonance dwell test循环扫描震动测试unsupported component hole land非支撑元器件孔焊盘L.P.T.D(lot tolerance percent defective）批次允许缺陷百分数MS Fabric扁平开纤布high spreadingFabric扁平开纤布。
电镀的基本知识
1.3鍍錫(tin plating)
镀锡生产应往高速率之连续生产方向发展,唯有使用高度自动化设备才能节省日益高 涨之连工资及能源.此种设备国内无法设计制造, 需向国外引进技术,近年来使用铝罐,铝箔, 塑料瓶罐,腊纸盒,玻璃瓶等材料越来越普遍, 占去马口铁很大的市场尤其一些锡生产的开 发国家如印度尼西亚,菲律宾,泰国,马来西亚等也开始生产马口铁,另外有逐渐代替无锡铁 皮(tin free steel)之趋势.
2.電鍍基本知識 2.1 電鍍的定義
电镀(electroplating)被定义为一种电沉积过程(electrodepos- ition process)， 是利用电极 (electrode)通过电流，使金属附着于物体表面上， 其目的是在改变物体表面之特性或尺 寸。
2.2 電鍍的目的
电镀的目的是在基材上镀上金属镀层(deposit)，改变基材表面性质或尺寸。例如赋予金 属光泽美观、物品的防锈、防止磨耗、提高 导电度、润滑性、强度、耐热性、耐候性、热 处理之防止渗碳、氮化 、尺寸错误或磨耗之另件之修补。
电镀知识（Platingknowledge）
电镀知识（Plating knowledge）1. definition and classification of electroplatingDefinition of 1-1-1. platingElectroplating is the use of electrolytic methods to deposit metal or alloy on the surface of the workpiece to form a uniform, dense and good bonding forceThe metal layer is called electroplating. A simple understanding is a physical or chemical change or combination.The application of electroplating process, we usually do the following uses:A. corrosion protectionB. protective decorationC. wear resistanceD. electrical performance: according to the work requirements of parts, provide conductive or insulation coatingE. process requirementsIntroduction of 1-1-2. common coating methodsElectroless plating (autocatalytic plating)Autocalytic platingOn the surface of the activated substrate, the metal ions in the bath are reduced to form a metal coating. This is in usMost of the process involved in a process engineering, through such a process in order to carry out late electroplating and other processingPretreatment process for plastic parts.ElectroplateElectroplatingThe process of forming uniform, dense, and well - formed deposits of metal or alloy on the surface of a workpiece by electrolysisMore complex, but it has many advantages, such as more types of metal deposition, can get the color variety, compared to similar engineeringArt is comparatively cheap.electroformingElectroformingThe process of depositing or depositing metal on a mold by electrolysis, separating the mold from the metal deposits.This method of handling is that we require the final part to have special surface effects, such as clear and distinct parting lines or special linesIn the case of an acute angle, the copper alloy is usually used as the shape of a component, and the alloy is deposited in the process by electroplatingOn the surface, usually the deposition thickness of up to tens of mm, after cavity incision, respectively to form inlaying cavity mold, injection molding,By doing so, the workpiece will have a special effect on the edges and corners and the boundaries of several surfaces to meet the design requirements, which we usually seeAfter a lot of plating, high light and etching lines, electroplating effect of clear plastic parts, quality requirements are higher, usually use such a method to setMeter. As shown in the following figure, the sharp corners of the key board in the manufacture of electroforming process, it will achieve good appearance.Figure 1-1 button plating effect 1Vacuum platingVacuum platingVacuum plating mainly includes vacuum evaporation, sputteringand ion plating. They are used in vacuum and steamA variety of metallic and non-metallic films are deposited on the plastic surface by distillation or sputtering, in such a way that a very thin surface can be obtainedThe coating has the advantages of high speed and good adhesion, but the price is higher,Fewer types of metal can be operated,A functional coating that is generally used as a high-grade product, such as an internal shield.The common process of 1-2. electroplatingIntroduction of 1-2-1. electroplating processAs far as plastic parts are concerned, our common plastics, including thermoplastic and thermosetting plastics, can be electroplated, but they need to be differentIn addition, the surface quality of the later stage is different greatly. We usually only electroplated the ABS material, and sometimes it is advantageousWith different plastic materials on the activation requirements of the different plating, two-color injection molding, and then electroplating treatment, so as a plastic materialCan be activated, and the other can not be activated, resulting in local plastic plating effect, to meet some of the designer's design requirements, the following we masterThe general process of ABS material electroplating is introduced to the process of electroplating.Through this process, the plastic coating is usually made up of the following layers:As shown in the diagram, the common coating after plating is mainly copper, nickel, chromium three kinds of metal deposition layer, under ideal condition, each layer is commonAs shown in the thickness, the overall thickness is about 0.02mm, but in our actual production, due to the substrate reasons and the surface qualityThe reason for this is usually that the thickness will be much greater than this value, but a large electroplating plant like this can be betterSample requirements.1-2-2. coating identification methodIn the identification of the technical requirements of the coating, refer to the following measures:1. the metal coating shall be indicated in the following order:For example: PL/Ep & Cu10bNi15bCr0.3Plastic, electroplated bright copper 10 mu m above, bright nickel 15 m above, ordinary chromium 0.3 mu m above, the following form is rightThe expression of some effects in the method above.1) matrix materialMaterial nameironCopper and copperalloyAluminum and itsalloyZinc and itsalloyMagnesium and itsalloyPlasticsilicateMaterial Science Other nonMetalSymbolFeCuAlZnMgPLCENM2) coating method Process nameElectroplatechemical platingElectrochemical treatmentchemical treatmentSymbolEpApEtCt3) the name of the coatingThe name of the coating is indicated by the chemical elements of the coating.4) coating thicknessThe coating thickness is m, indicating the lower limit of coating thickness. If necessary, the coating thickness range can be marked.5) coating characteristicsFeature namebrightSemi-glossdarkSatinordinaryElectric conduction insulationSymbolBSMStRCDI6) postprocessingProcessing namepassivationPhosphatingoxidationTo colorPaintingSymbolPPhOClPt2. introduction of common plating effect Introduction of 2-1. electroplating effect2-1-1. high gloss electroplatingThe realization of the effect of high light plating usually requires the good polishing of the surface of the mold and the effect of the light chrome treatment on the injection of the plastic parts.2-1-2. Matt platingThe realization of the effect of sub - plating usually requires a good polishing of the surface of the mold, and the result of the treatment of the injection of the plastic parts with sub chrome.2-1-3. pearl chromeThe realization of the effect of pearl chrome plating usually requires that the surface of the mold be well polished and the injected plastic parts are treated with pearl chromeEffect.2-1-4. etch platingThe realization of etching effect usually requires the surface of the mold to be treated with different corrosion patterns, and the injection of the plastic parts is adoptedThe effect obtained after chrome treatment.2-1-5. mixed electroplatingIn the mold processing both polishing and etching part injection plastic parts after electroplating appear high light and etch platingThe effect of mixing, highlighting certain local features.2-1-6. local platingBy using different methods, the surface of the finished part is not electroplated locally, forming a contrast with the plated partA unique design style.2-1-7. color platingBy using different plating solutions, the metal deposited on the surface of the plastic after plating will reflect different luster and form uniqueEffect。
涂镀专业英文词汇
涂镀专业英文词汇chromeplate：镀铬Bright chrome plating：镀亮铬white zinc-plating ：蓝白锌电镀color-plated zinc: 彩锌Electrophoresis:电泳 powder coated：烤漆1.电珍珠铬工艺常用语(Commonly used terminology in process for pearl chrome plating) 硫酸清洗 sulfuric acid clean超声波除蜡ultrasonic clean除油degreasing电解除油 electro clean酸浸 acid dip预镀碱铜 alkali copper焦铜 pyrophosphate copper酸铜 acid copper半光叻 semi-bright nickel氯化叻 nickel chloride珍珠叻pearl nickel电铬chromium plated 热水洗 hot water rinsing烘干 baking2. 电光铬工艺常用语(Commonly used terminology in process for bright chrome plating)三氯乙烯清洗 trichloroethylene clean上挂具 racking除蜡水洗 ultrasonic clean电解缸 electro clean酸水 acid dip预红铜电镀 copper strike电红铜 copper酸水 acid焦铜 pyrophosphate copper酸铜 acid copper半光叻 semi-bright nickel氯化叻 nickel chloride打底叻 primer nickel镍色 bright nickel电铬chromium plated烘干baking3.静电喷涂工艺常用语(Commonly used terminology in process for electrostatic coating) 合格件上挂 racking加热脱脂 hot degreasing水洗 rinsing酸洗 acid dip中和 neutralization表调 surface conditioning磷化 phosphating水洗二次 rinsing x2烘干 baking检查 inspection上挂 racking除尘 dedusting喷涂 spray painting固化curing下挂taking down包装 packaging4.静电喷粉工艺常用语(Commonly used terminology in process for electrostatic powder) 合格件上挂 racking加热脱脂 hot degreasing水洗 rinsing中和 neutralization表调 surface conditioning钝化 passivating水洗二次 rinsing x2烘干baking检查 inspection上挂 racking除尘 dedusting喷涂 spray powder固化 curing下挂 taking down包装 packaging补充词汇(Additional words)闪镀 flash/falsh plate光亮电镀 bright plating合金电镀 alloy plating多层电镀 multilayer plating金属喷镀metal spraying刷镀 brush plating挂镀 rack plating脉冲电镀 pulse plating真空镀 vacuum deposition热浸镀 hot dipping 离子镀ion plating 滚镀 barrel plating装饰性镀铬 electroplating adom-chrome镀硬铬 electroplating hard chrome钢铁发蓝/钢铁化学氧化 blueing (chemical oxide)退镀 stripping预镀 strike化学抛光 chemical polishing浸亮 bright dipping活化 activation机械抛光 mechanical polishing粗化 roughtening机械/化学粗化 machine/chemistry coarsening敏化处理 sensitizationABS塑料电镀 plastic plating processpH计 pH meter 测定溶液pH值的仪器。
表面处理制程简介
九、彩色電鍍 製程:
IQC
Primer
Color Paint
PVD
UV Hard Coat
Shipping
FQC
100% Inspection
九、彩色電鍍 產品:
陽極: Me ＋ XH2O → MeOX ＋ 2XH＋ ＋ 2Xe－ 陰極: H2O ＋ e－ → 1/2H 2＋ OH－
八、EMI方法及應用
1.金屬漆料噴塗（Conductive coating）:有許 多含有金、銅、鎳…等之導電漆料，利用傳 統之噴塗設備即可使用，然由於成形品愈來 愈具複雜性，均勻之噴塗為此法之一大問題， 另外亦會產生剝落。
E-Beam heating: The high voltage power supply provides 5 to 10KeV to accelerate the electrons from the filament to the evaporant. Most of kinetic energy of electrons is converted to heat on impingement .
六、物理氣相沉積 (Physical Vapor Deposition)
Evaporation
Reactive evaporation: Metal atoms are evaporated from an evaporant source with a partial pressure of a reactive gas present in the chamber.
机械工程英语课文翻译9-14
第九章Lapping 研磨Lapping is a finishing operation used on flat and cylindrical surfaces. The lap, shown in Fig.9.1a, is usually made of cast iron, copper, leather, or cloth.研磨是一种用于平面和圆柱面的精加工作业。
研具，如图9.1a所示，通常用铸铁、铜、皮革或布制成。
The abrasive particles are embedded in the lap, or they may be carried through slurry. Depending on the hardness of the workpiece, lapping pressures range from 7kPa to 140kPa (1 to 20 psi).研磨微粒嵌入研具内，或者可以通过液体携带。
根据工件硬度，研磨压力可在7kPa到140kPa(1到20psi)范围中取。
Lapping has two main functions. Firstly, it produces a superior surface finish with all machining marks being removed from the surface. Secondly, it is used as a method of obtaining very close fits between mating parts such as pistons and cylinders.研磨有两个主要作用。
首先，它通过去除所有机加工痕迹能产生较好的表面光洁度。
其次，它能用作获得像活塞与气缸之类配件间过盈配合的方法。
The lapped workpiece surface may look smooth but it is actually filled with microscopic peaks, valleys, scratches and pits. Few surfaces are perfectly flat. Lapping minimizes the surface irregularities, thereby increasing the available contact area.研磨后的工件表面可能看似平滑，其实布满着微观峰、谷、划痕和凹陷。
VACUUM DEPOSITION PLATING METHOD
专利名称：VACUUM DEPOSITION PLATING METHOD 发明人：ITANO SHIGEO,YAMAZAKI DAIZOU,WADA TETSUYOSHI,NAKAGAWA YOSHIKIYO申请号：JP6552578申请日：19780531公开号：JPS54155983A公开日：19791208专利内容由知识产权出版社提供摘要：PURPOSE:To carry out the title plating in a compact deposition chamber with a plurality of cheap cooling rolls of a small diameter by arranging the rolls for supporting a long-sized strip so that they form convex curvature against an evaporation surface and by cooling the strip with the rolls. CONSTITUTION:Thin steel strip 2 uncoiled by uncoiler 1 is passed through pinch rolls 3 and preliminary vacuum chambers 4, 5, 6 in order. The strip pass holes of chambers 4, 5, 6 are provided with slits 7 - 10 to control circulation of gas, and the vacuum degree of chambers 4, 5, 6 is raised in the order of 4, 5 and 6. Strip 2 enters vacuum deposition chamber 14 through pinch rolls 11, and vapor of metal 16 is deposited on strip 2. In order to prevent a temp. rise of strip 2 due to sensible heat of the metal vapor and latent heat of solidificatin of the vapor which rise causes re-evaporation of the deposited metal, strip 2 is cooled with a group of cooling rolls 30 of a small diameter.申请人：MITSUBISHI HEAVY IND LTD更多信息请下载全文后查看。
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III-V
II-VI Ta2O5
IV-VI ZnO/AlN
PbTiO3 SiO SiO2 Si3N4 Al2O3
膜 類 別 單 晶 薄 膜 製造 方法
ZnO壓電薄膜的製造
基板 溫度 材料 靶 ZnO 氣氛 氣壓 成份 Ar/O2 =1 0.5-7Pa 濺射 功率 0.1-1 W/cm2 沈積 速率 0.1-0.24 μm/h
鍍膜硬度
3500
硬度( Hv )
3000 2500 2000 1500 1000 500 0 SKH51 WC-Co TiN TiCN CrN CrCN TiAlN MeDLC
鍍膜耐氧化溫度
氧 化 溫 度 ℃
900 800 700 600 500 400 300 200 100 0
TiN
TiCN
Diamon d
~9000
機械功能鍍膜
鍍膜的機械性功能用途 功 應用產業 能 產品 噴射引擎--渦輪葉片、風扇葉片、壓縮機葉片、軸封；機體零組件會用到 鍍膜製程的，包括：需要要求高耐蝕的窗子、霜雪保護鍍膜、抗電磁干 擾等。 引擎：活塞、閥體、燃燒器頭(combustion heads)、TBC、Bond coat、Vapor phase & CVD Aluminize、Seals、Bearing、特殊Screws & fixings。 大型渦輪引擎：燃燒器(combustion)、後燃燒器 泵浦軸及plunger、渦輪轉軸、軸封、壓縮機桿 擠出機槍管及螺桿、擠出機模板、切割軸 draw rolls，finish applicator rolls，take-up rolls，heater plates，thread guides, Spinning, winding, twisting, cutting, weaving等。。 車刀、銑刀、絲攻、捨棄式刀片等鍍膜刀具 離心式壓縮機、轉輪、大型蒸氣滑輪、渦輪轉子 熱交換器
P V D 技 術
金屬化 汽車零件 燈具反射 居家部品
1980
1985
1990
內 容
真空鍍膜的方法 真空鍍膜在裝飾性的應用 真空鍍膜在機械耐磨耗的應用
鍍膜與銅合金對磨材之摩擦係數
摩 擦 係 數
1.2 1.0 0.8 0.6 0.4 0.2 0.0 MeDLC TiN TiN TiAlN CrN CrCN SKH51
0.2-2.7pa
1-15 μm/h
膜 類 別 單 晶 薄 膜 矽 DC 磁控濺射 尖晶石 製造 方法
AlN壓電薄膜的製造
基板 溫度 材料 50500C 靶 Al 氣氛 氣壓 成份 Ar/N2 =1-0 1-4Pa 濺射 功率 100-200 W/cm2 2 W/cm2 Al Ar/N2 1-4Pa 100-200 W/cm2 1.3 μm/h 沈積 速率 0.2-0.3 μm/h
Consumer Consumer
Smart Mobile Phone
Digital Camera PDA Palm PC Thin Client MP3
Computing Computing
抗電磁波干擾
電子薄膜材料的應用 高溫超導薄膜 導電薄膜 電 子 薄 膜 材 料 電阻薄膜 半導體薄膜 壓電薄膜 熱電薄膜 介電薄膜 傳輸線 電極 電阻器 積體電路 感測器 換能器 聲波體波器 表面聲波濾波器 半導體 擴散阻障 PCB 顯示器
藍寶石 400RF 二極濺射 600C RF 磁控濺射 矽 金 鉑
0.2-2.7Pa
微 晶 擇 優 取 向 薄 膜
DC 二極濺射
75350C
ZnO Ar/O2 Zn
0.5-13Pa 0.5-7pa
1-5 W/cm2
0.1-1.5 μm/h
RF 二極濺射 藍寶石 DC 磁控濺射 RF 磁控濺射 矽 GaAs
ZrN CrN DLC
~3300 ~iN具有更高的熱穩定性，適宜切削銅合金及壓鑄模 具鍍層。
<0.15
硬且具有低磨擦係數之鍍膜，在切削Al合金，銅合金 及黃銅方面有相當優越的特性，不鏽鋼的加工也比TiN 好。在任何需要低磨擦係數的使用場合如擠製模、引 擎另件(凸輪軸、搖臂桿、value geide)等，均有良好 的效果。一種黑色裝飾鍍膜。 最硬之鍍膜，適宜Al、Cu等非鐵合金及FRP之加工。光 學元件、電子元件之應用。
CrN
CrCN
TiAlN
Me-DLC
被覆層
TiN TiCN TiAlN
硬度
~2000 ~2800 ~3500 ~0.6 0.6
應
用
最普遍之鍍膜，應用於刀工具、模具及裝飾用鍍膜。 適合具有耐衝擊性場合之鍍膜，如衝棒，比TiN更具耐 磨性及高溫穩定性。 適用於高速加工，切削溫度上升的場合，特別是含碳 化物材料的切削，在加工韌性鋼材及鑄鐵方面其性質 遠優於TiN。
絕 航太工業 熱 鍍 運輸工具 層 發電機 石化工業 耐 塑膠工業 磨 鍍 紡織工業 層 切削刀具 耐 機械工業 溫 化學工業 耐 冶金工業 爐體元件的陶瓷金屬鍍膜、耐火物質的鍍膜 蝕 用途包括：人工關節(Hits, Knee等)、骨釘、生醫儀器、Catheter as brain, 抗 Ocular prosthesis, Tube for neuron regeneration, Cardiac valve, Vascular 排 生醫用途 prosthesis, Mesh for hernia repair, Tendon prosthesis, Cardiac replacement, 斥 Mammary prosthesis, Synthetic skin, Hip prosthesis等。等，
Exposure
Sputtering Al Ti TaN Photo-Resist Negative photoresist
Developing
Etching
Ta2O5 Thinfilm Capacitor Process UV Light Si Wafer Oxidation Photo Mask SiO2
裝飾性鍍膜的底材效應 底材
黃銅 不銹鋼 銅 鋅 塑膠（ＡＢＳ）
蒸鍍溫度
<2000C <2000C <2000C <1500C <600C
中間介層
不需要 不需要 Ni+Cr Cu+Ni+Cr Cu+Ni+Cr
底材
中間介層
顏色層
裝飾性鍍膜的應用—衛浴設備
PVD裝飾性鍍膜的發展歷程
TiN+Au-flash 筆 手錶 眼鏡架 門把 熱蒸鍍 (Thermal evaporation) 電子槍蒸鍍 (e-beam evaporation) 磁控濺鍍 (magnetron sputtering) 電弧蒸鍍 (Arc evaporation) 熱蒸鍍 (Thermal evaporation) 1950 1960 反應性電弧蒸鍍 (Thermal evaporation) 反應性非平衡磁控濺鍍 (reactive unbalanced magnetron sputtering) 反應性磁控濺鍍 (reactive magnetron sputtering)
50 40 30 20 10 0 10 30 50 70 90 110
刮痕荷重 (N)
內 容
真空鍍膜的方法 真空鍍膜在裝飾性的應用 真空鍍膜在機械耐磨耗的應用 真空鍍膜在3C產業的應用
3C產品 Connecting Connecting
Screen Phone Handheld TV Mobile Phone Game Console eMap Net TV FPD (LCD,PDP)
鍍膜顏色範圍
成份 TiN TiCN ZrN ZrCN Gold24K L* 77-80 66-69 86-89 79-84 88-91
顏色範圍 a* 2-5 5.5-16 -3-1 -1--3 -3.7-1
b* 33-37 21-23 23-25 17-29 27-34
裝飾鍍膜的發展目的
•顏色 •耐刮 •耐蝕
化學氣相沈積法 (CVD)
薄膜形成過程
Step 1 Creation of deposition Step 2 Transport from source to substrate Step 3 Film Growth on substrate
Me+ Me+
蒸
Me+
發
源
Me+ Me+
Me+ Me+
電漿輔助氣相沈績法( PECVD)
真空鍍膜的方法 真空鍍膜在裝飾性的應用
鍍膜顏色與硬度
成份 TiN TiCN ZrN ZrCN TiAlN TiZrN CrN CrCN HfN 顏色 金黃色 棕色、粉色 金色 棕色 金棕色、棕黑 金色 金屬色 銀色 黃綠色 硬度 Hv 2000 2400-2800 3000 3200-3400 2400-2900 2400-3000 1500 1500-2000 2750
資料來源；金屬中心 ITIS計畫整理
本校榮幸邀請到中國清華大學毛宗強教授 蒞校客座二個月時間， 特安排開設『氫能工程』一門課並開放理 工學院學生選課， 開課時段為9/22~11/17，每週一、三晚上 第十一至十三節(07:05~09:35)
光碟模具
端子衝切工具
鋁合金罐蓋成形模具
精密筒夾 機械設備零件 耐磨耗
陰極電弧離子鍍膜設備
物理蒸鍍依載入載出的方式分類
•批次式
大型化 連續式 低生產成本
•連續式鍍膜設備
Chamber1
•工件裝載 •預抽真空 •工件加熱 •電漿清潔
Chamber2
•產生高真空 •工件加熱 •離子轟擊
Chamber3