盲埋孔制作
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L3-L4 L5-L6
DRILLING
INNER LAYER IMAGE
PTH
INNER LAYER IMAGE ( L2 )
PTH
INNER LAYER IMAGE ( L7 )
SHEARING
D/F PHOTO IMAGE ( L2 , L3)
LAMINATION
LASER DRILL
CNC DRILL
PANEL PLATING
D/F PHOTO IMAGE (OUTER LAYER)
LIQUID SOLDER MASK
HOT AIR LEVELING
P 24ห้องสมุดไป่ตู้30
盲 埋 孔( IVH ) 板 製 作
L2-L3 INNER LAYER IMAGE ( L2)
LAMINATION
DRILLING ( L1-L3 )
PTH
INNER LAYER IMAGE ( L3 )
L4-L5
INNER LAYER IMAGE ( L5 )
LAMINATION
DRILLING ( L4-L6 )
PTH
INNER LAYER IMAGE ( L4 )
LAMINATION
D/F PHOTO IMAGE (OUTER LAYER)
ROUTING
PTH
CNC DRILL
LIQUID SOLDER MASK
ELECTRICAL TEST
O .Q. C.
P 17/30
盲 埋 孔( IVH ) 板 製 作
Blind Via Process
SHEARING
LAMINATION
DRILLING ( L1-L6 )
PTH
D/S PROCESS
盲 埋 孔( IVH ) 板 製 作
Blind (Buried) Via Process
P/N : 04IS22008
B-STAGE
LAYER 1 LAYER 2 LAYER 3
LAYER 4 PTH BV
4 Layers MLB with Blind Vias
- like buried-via except via layer on outside - via registration & fine line formation difficult
Blind-via : option 2 (Build-up)
- laminate,coat,form blind hole, pattern - may be repeated for multiple layers - blind hole plating difficult
CSP/μBGA
0.5
0.15 (30%)
BGA
1.0
0.4 (40%)
BGA
1.27
0.635(50%)
盲 埋 孔( IVH ) 板 製 作 P 5/30 Packages Trends
30 mm 20 mm
Type
Area
QFP 900 mm2 100%
15 mm
TAB 400 mm2 44% COB 225 mm2 25%
By Controlled depth Drilling
by CO2 Laser by PID
盲 埋 孔( IVH ) 板 製 作
Blind Via Process
SHEARING
D/F PHOTO IMAGE (INNER LAYER)
PANEL PLATING
HOT AIR LEVELING
CNC DRILL
盲 埋 孔( IVH ) 板 製 作 P 14/30 P. C. Board Structure
TH (Through Hole)
BH (Blind Hole) TH (Through Hole)
} Build-up
} Thin Core
} Build-up
BH : By Laser Drilling
10 mm
CSP 115 mm2 13%
Flip Chip 100 mm2 11%
盲 埋 孔( IVH ) 板 製 作 P 6/30
Advantage “Via In Pad” -Routability
Old way (fan out)
Via in Pad
Increase Routing Density
盲 埋 孔( IVH ) 板 製 作 P 3/30
Through Via Hole Disadvantage (全通孔之缺點)
全通孔會破壞多層板內在電壓層的完整性，使電容 蒙
受損失增加雜訊 爭奪零件組裝所需的面積。
妨礙多層板內在訊號層的佈線面積。
密集組裝迫使通孔孔徑愈來愈小，成本也愈來愈貴。
盲 埋 孔( IVH ) 板 製 作 P 4/30
100 mil
NEXT GENERATION Land Dia. 0.012” Via Dia. 0.005” Land Pitch 0.0125”
盲 埋 孔( IVH ) 板 製 作 P 10/30
Methods to Generate Vias
Mechanical Drill (傳統機械式鑽孔) Laser Ablation (雷射燒融法) Plasma (電漿法) Photo Defined (感光成像法)
E
C B
A B
A C
BURIED VIA LAY-UP
D
BLIND VIA LAY-UP
R
E S
B-STAGE
A
I
N
BLIND VIA SEQUENTIAL LAY-UP
盲 埋 孔( IVH ) 板 製 作 P 16/30 Microvia Xsections
by UV/YAG Laser
by Plasma
盲 埋 孔( IVH ) 板 製 作 P 21/30 Comparison of release film
測試項目 壓合後板面
溢膠
百弘 0.1 cm寬
廠家 華立
0.15 cm寬
杜邦 0.25 cm寬
Belt Sander 後板面溢膠
孔緣無殘膠
孔緣無殘膠
孔緣無殘膠
孔中央部份下陷 孔中央部份下陷 孔中央部份下陷
盲埋孔(IVH) 課 程 講 授 大 綱
主題(Topics) 全通孔之缺點 封裝趨勢 (Packages Trends) “Via In Pad” 之優點 盲埋孔(Blind/Buried Vias) 之優點 孔形成之製作方式(Methods to Generate Vias) 盲埋孔之選擇 盲埋孔之製作實例 盲埋孔之設計準則及製程能力 Q & A (問題與回答)
D/F PHOTO IMAGE (INNER LAYER)
LAMINATION
LASER DRILL
CNC DRILL
PANEL PLATING
D/F PHOTO IMAGE (OUTER LAYER)
LIQUID SOLDER MASK
ROUTING
ELECTRICAL TEST
HOT AIR LEVELING
Reduce weight and size
盲 埋 孔( IVH ) 板 製 作 P 9/30
Current through hole and blind via compare to next-generation blind vias
100 mil
CURRENT
Land Dia. 0.025” Via Dia. 0.014” Land Pitch 0.020”
盲 埋 孔( IVH ) 板 製 作 P 13/30
Substrates for Blind and Buried Vias
A Variety of Substrates May Be Used Copper Clad Laminate (CCL) Resin Coated Copper (RCC) Advanced Dielectric (PID,PDD……) Thermal Curable Dielectric (TCD)
Lamination
Structure of IVH
盲 埋 孔( IVH ) 板 製 作 P 20/30 Comparison of release film
GOOD
When using AFLEX restricting resin overflow
POOR
When using other films
- fabricate multilayer sub-assemblies - drill,plate,pattern, & laminate sub-assemblies
盲 埋 孔( IVH ) 板 製 作 P 12/30
Blind and Buried Vias Fabrication
Blind-via : option 1 (Lamination )
P/N : 08IB04142
Blind (Buried) Via Process
LAYER 1
LAYER 2 LAYER 3
LAYER 4 LAYER 5 LAYER 6 LAYER 7
PTH
BV
LAYER 8
8 Layers MLB with Blind Vias
L1-L2
DRILLING
L7-L8
盲 埋 孔( IVH ) 板 製 作 P 11/30
Blind and Buried Vias Fabrication
Buried-via between layer-pairs
- drill & plate innerlayer prior to lamination
Buried-via connecting many layers
填膠狀況
0.3 mil
0.16 mil
0.16 mil
盲 埋 孔( IVH ) 板 製 作 P 22/30 Price Comparison of release film
Spec.
百弘
PACOVIA IVH-2000
廠家 華立
杜邦
AFLEX 50um TMR10 SM3
UNIT PRICE
10.43元/SF
TH,BTH : By Mechanical Drilling
BTH
BH (Blind Hole)
(Buried Through Hole)
} Build-up
} Thin Core
} Build-up
BLIND VIA SEQUENTIAL LAY-UP
盲 埋 孔( IVH ) 板 製 作 P 15/30
盲 埋 孔( IVH ) 板 製 作 P 7/30
Advantage “Via In Pad” -Routability
盲 埋 孔( IVH ) 板 製 作 P 8/30
Blind/Buried Vias Advantages
Reduce layer count
Reduce board area ; increase packaging density
O .Q. C.
P 18/30
盲 埋 孔( IVH ) 板 製 作
Structure of I.V.H.
Release Film
Prepreg
Separator
None or a little overflow
P 19/30
Drilling Copper plating Black oxiding
BLIND AND BURIED VIA OPTION (盲 埋 孔 之 選 擇 )
A = THROUGH VIA HOLE (導通孔)
B = BURIED VIA HOLE (埋孔) E = VIA IN PAD (VIP) (導通孔在pad裡面)
C = BLIND VIA HOLE (盲孔 )
D = BLIND HOLE MLB VIA (多層盲孔)
15.85元/SF
3.6元/SF
客戶群
楠電,耀文 耀文,金像,欣興 耀文,燿華
盲 埋 孔( IVH ) 板 製 作 P 23/30 Blind (Buried) Via Process
P/N : 06IS23030A
L1
L2
CORE
B-STAGE
L3 L4
L5
L6
BV
PTH
6 Layers MLB with Blind Vias
WWEI IVH Introduction
PACKAING DENSITY
FAN OUT CONVENTIONAL
NO FAN OUT
Micro - vias placed in solder, -or bond pads
UPDATED ON FEB. , 14 , 2000 徐振連
盲 埋 孔( IVH ) 板 製 作 P 1/30
Package / Assembly Interactions Component Placement
Package Type Lead Pitch Placement Accuracy
mm
±mm (%)
QFP
0.4
0.04 (10%)
QFP
0.5
0.075 (15%)
QFP
0.65
0.13 (20%)
DRILLING
INNER LAYER IMAGE
PTH
INNER LAYER IMAGE ( L2 )
PTH
INNER LAYER IMAGE ( L7 )
SHEARING
D/F PHOTO IMAGE ( L2 , L3)
LAMINATION
LASER DRILL
CNC DRILL
PANEL PLATING
D/F PHOTO IMAGE (OUTER LAYER)
LIQUID SOLDER MASK
HOT AIR LEVELING
P 24ห้องสมุดไป่ตู้30
盲 埋 孔( IVH ) 板 製 作
L2-L3 INNER LAYER IMAGE ( L2)
LAMINATION
DRILLING ( L1-L3 )
PTH
INNER LAYER IMAGE ( L3 )
L4-L5
INNER LAYER IMAGE ( L5 )
LAMINATION
DRILLING ( L4-L6 )
PTH
INNER LAYER IMAGE ( L4 )
LAMINATION
D/F PHOTO IMAGE (OUTER LAYER)
ROUTING
PTH
CNC DRILL
LIQUID SOLDER MASK
ELECTRICAL TEST
O .Q. C.
P 17/30
盲 埋 孔( IVH ) 板 製 作
Blind Via Process
SHEARING
LAMINATION
DRILLING ( L1-L6 )
PTH
D/S PROCESS
盲 埋 孔( IVH ) 板 製 作
Blind (Buried) Via Process
P/N : 04IS22008
B-STAGE
LAYER 1 LAYER 2 LAYER 3
LAYER 4 PTH BV
4 Layers MLB with Blind Vias
- like buried-via except via layer on outside - via registration & fine line formation difficult
Blind-via : option 2 (Build-up)
- laminate,coat,form blind hole, pattern - may be repeated for multiple layers - blind hole plating difficult
CSP/μBGA
0.5
0.15 (30%)
BGA
1.0
0.4 (40%)
BGA
1.27
0.635(50%)
盲 埋 孔( IVH ) 板 製 作 P 5/30 Packages Trends
30 mm 20 mm
Type
Area
QFP 900 mm2 100%
15 mm
TAB 400 mm2 44% COB 225 mm2 25%
By Controlled depth Drilling
by CO2 Laser by PID
盲 埋 孔( IVH ) 板 製 作
Blind Via Process
SHEARING
D/F PHOTO IMAGE (INNER LAYER)
PANEL PLATING
HOT AIR LEVELING
CNC DRILL
盲 埋 孔( IVH ) 板 製 作 P 14/30 P. C. Board Structure
TH (Through Hole)
BH (Blind Hole) TH (Through Hole)
} Build-up
} Thin Core
} Build-up
BH : By Laser Drilling
10 mm
CSP 115 mm2 13%
Flip Chip 100 mm2 11%
盲 埋 孔( IVH ) 板 製 作 P 6/30
Advantage “Via In Pad” -Routability
Old way (fan out)
Via in Pad
Increase Routing Density
盲 埋 孔( IVH ) 板 製 作 P 3/30
Through Via Hole Disadvantage (全通孔之缺點)
全通孔會破壞多層板內在電壓層的完整性，使電容 蒙
受損失增加雜訊 爭奪零件組裝所需的面積。
妨礙多層板內在訊號層的佈線面積。
密集組裝迫使通孔孔徑愈來愈小，成本也愈來愈貴。
盲 埋 孔( IVH ) 板 製 作 P 4/30
100 mil
NEXT GENERATION Land Dia. 0.012” Via Dia. 0.005” Land Pitch 0.0125”
盲 埋 孔( IVH ) 板 製 作 P 10/30
Methods to Generate Vias
Mechanical Drill (傳統機械式鑽孔) Laser Ablation (雷射燒融法) Plasma (電漿法) Photo Defined (感光成像法)
E
C B
A B
A C
BURIED VIA LAY-UP
D
BLIND VIA LAY-UP
R
E S
B-STAGE
A
I
N
BLIND VIA SEQUENTIAL LAY-UP
盲 埋 孔( IVH ) 板 製 作 P 16/30 Microvia Xsections
by UV/YAG Laser
by Plasma
盲 埋 孔( IVH ) 板 製 作 P 21/30 Comparison of release film
測試項目 壓合後板面
溢膠
百弘 0.1 cm寬
廠家 華立
0.15 cm寬
杜邦 0.25 cm寬
Belt Sander 後板面溢膠
孔緣無殘膠
孔緣無殘膠
孔緣無殘膠
孔中央部份下陷 孔中央部份下陷 孔中央部份下陷
盲埋孔(IVH) 課 程 講 授 大 綱
主題(Topics) 全通孔之缺點 封裝趨勢 (Packages Trends) “Via In Pad” 之優點 盲埋孔(Blind/Buried Vias) 之優點 孔形成之製作方式(Methods to Generate Vias) 盲埋孔之選擇 盲埋孔之製作實例 盲埋孔之設計準則及製程能力 Q & A (問題與回答)
D/F PHOTO IMAGE (INNER LAYER)
LAMINATION
LASER DRILL
CNC DRILL
PANEL PLATING
D/F PHOTO IMAGE (OUTER LAYER)
LIQUID SOLDER MASK
ROUTING
ELECTRICAL TEST
HOT AIR LEVELING
Reduce weight and size
盲 埋 孔( IVH ) 板 製 作 P 9/30
Current through hole and blind via compare to next-generation blind vias
100 mil
CURRENT
Land Dia. 0.025” Via Dia. 0.014” Land Pitch 0.020”
盲 埋 孔( IVH ) 板 製 作 P 13/30
Substrates for Blind and Buried Vias
A Variety of Substrates May Be Used Copper Clad Laminate (CCL) Resin Coated Copper (RCC) Advanced Dielectric (PID,PDD……) Thermal Curable Dielectric (TCD)
Lamination
Structure of IVH
盲 埋 孔( IVH ) 板 製 作 P 20/30 Comparison of release film
GOOD
When using AFLEX restricting resin overflow
POOR
When using other films
- fabricate multilayer sub-assemblies - drill,plate,pattern, & laminate sub-assemblies
盲 埋 孔( IVH ) 板 製 作 P 12/30
Blind and Buried Vias Fabrication
Blind-via : option 1 (Lamination )
P/N : 08IB04142
Blind (Buried) Via Process
LAYER 1
LAYER 2 LAYER 3
LAYER 4 LAYER 5 LAYER 6 LAYER 7
PTH
BV
LAYER 8
8 Layers MLB with Blind Vias
L1-L2
DRILLING
L7-L8
盲 埋 孔( IVH ) 板 製 作 P 11/30
Blind and Buried Vias Fabrication
Buried-via between layer-pairs
- drill & plate innerlayer prior to lamination
Buried-via connecting many layers
填膠狀況
0.3 mil
0.16 mil
0.16 mil
盲 埋 孔( IVH ) 板 製 作 P 22/30 Price Comparison of release film
Spec.
百弘
PACOVIA IVH-2000
廠家 華立
杜邦
AFLEX 50um TMR10 SM3
UNIT PRICE
10.43元/SF
TH,BTH : By Mechanical Drilling
BTH
BH (Blind Hole)
(Buried Through Hole)
} Build-up
} Thin Core
} Build-up
BLIND VIA SEQUENTIAL LAY-UP
盲 埋 孔( IVH ) 板 製 作 P 15/30
盲 埋 孔( IVH ) 板 製 作 P 7/30
Advantage “Via In Pad” -Routability
盲 埋 孔( IVH ) 板 製 作 P 8/30
Blind/Buried Vias Advantages
Reduce layer count
Reduce board area ; increase packaging density
O .Q. C.
P 18/30
盲 埋 孔( IVH ) 板 製 作
Structure of I.V.H.
Release Film
Prepreg
Separator
None or a little overflow
P 19/30
Drilling Copper plating Black oxiding
BLIND AND BURIED VIA OPTION (盲 埋 孔 之 選 擇 )
A = THROUGH VIA HOLE (導通孔)
B = BURIED VIA HOLE (埋孔) E = VIA IN PAD (VIP) (導通孔在pad裡面)
C = BLIND VIA HOLE (盲孔 )
D = BLIND HOLE MLB VIA (多層盲孔)
15.85元/SF
3.6元/SF
客戶群
楠電,耀文 耀文,金像,欣興 耀文,燿華
盲 埋 孔( IVH ) 板 製 作 P 23/30 Blind (Buried) Via Process
P/N : 06IS23030A
L1
L2
CORE
B-STAGE
L3 L4
L5
L6
BV
PTH
6 Layers MLB with Blind Vias
WWEI IVH Introduction
PACKAING DENSITY
FAN OUT CONVENTIONAL
NO FAN OUT
Micro - vias placed in solder, -or bond pads
UPDATED ON FEB. , 14 , 2000 徐振連
盲 埋 孔( IVH ) 板 製 作 P 1/30
Package / Assembly Interactions Component Placement
Package Type Lead Pitch Placement Accuracy
mm
±mm (%)
QFP
0.4
0.04 (10%)
QFP
0.5
0.075 (15%)
QFP
0.65
0.13 (20%)