ipc印制电路板
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印制电路板
（Printed Circuit Boards）
IPC-M-105Rigid Printed Board Manual
刚性印制板设计手册
IPC-D-325A Documentation Requirements for Printed Boards 印制板设
计文件图册要求
IPC-PE-740A Troubleshooting for Printed Board Manufacture and
Assembly
印制板制造和组装的故障排除
IPC-MB-380Guidelines for Molded Interconnection Devices
模压互连器件导则
IPC-D-326A Information Requirements for Manufacturing Printed Circuit
Boards and Other Electronic Assemblies
印制板制造和其它电子组装的信息要求规范
IPC-6010 Series IPC-6010 Qualification and Performance Series
IPC-6010印制电路板质量标准和性能规范系列手册
IPC-6011Generic Performance Specification for Printed Boards
印制板通用性能规范
IPC-6012B Qualification and Performance Specification for Rigid Printed
Boards
刚性板的合格和性能规范要求
IPC-6015Qualification & Performance Specification for Organic
Multichip Module (MCM-L) Mounting and Interconnections
有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能
规范
IPC-6016Qualification & Performance Specification for High Density
Interconnect (HDI) Layers or Boards
高密度互连(HDI)层或印制板的鉴定与性能规范
IPC-6018A Microwave End Product Board Inspection and Tech
微波成品印制板的检验和测试
IPC-A-600G Acceptability of Printed Boards
印制板验收条件
IPC-QE-605A Printed Board Quality Evaluation Handbook
印制板质量评价
IPC-PWB-EV AL-CH Printed Circuit Board Defect Evaluation Chart
印制板缺陷评估图表
IPC-HM-860Specification for Multilayer Hybrid Circuits
多层混合电路规范
IPC-TF-870Qualification and Performance of Polymer Thick Film Printed
Boards
聚合物厚膜印制板的鉴定与性能
IPC-ML-960Qualification and Performance Specification for Mass
Lamination Panels for Multilayer printed Boards
多层印制板的鉴定与性能规范用预制内层在制板的鉴定与
性能规范
IPC-TR-481Results of Multilayer Tests Program Round Robin
多层印制板联合试验计划结果
IPC-TR-551Quality Assessment of Printed Boards Used for Mounting and
Interconnecting Electronic Components
用于电子元件安装与互连的印制板质量评价
IPC-TR-579Round Robin Reliability Evaluation of Small Diameter Plated
Through Holes in PCBs
印制板中小直径镀覆孔可靠性评价联合试验
IPC-4552Specification for Electroless Nickel/Immersion Gold(ENIG)
Plating for Printed Circuit Boards
印制电路板表面非电镀镍/沉金规范
IPC-DR-572Drilling Guidelines for Printed Boards
印制板钻孔导则
IT-95080Improvements/Alternatives to Mechanical Drilling of PCB
Vias
印制板通孔机加工方案的改进和优选手册
IPC-NC-349Computer Numerical Control Formatting for Drillers and
Routers
钻床和铣床用计算机数字控制格式
IPC-SM-839Pre & Post Solder Mask Application Cleaning Guidelines
施加阻焊前及施加后清洗导则
IPC-HDI-1High Density Interconnect Microvia Technology
Compendium
高密度(HDI)互连微通孔技术纲要
IPC/JPCA-4104Specification for High Density Interconnect (HDI) and
Microvia Materials
高密度互连(HDI)及微导通孔材料规范
IPC-6016Qualification & Performance Specification for High Density
Interconnect (HDI) Layers or Boards
高密度互连(HDI)层或印制板的鉴定与性能规范
IPC/JPCA-6801IPC/JPCA Terms & Definitions, Test Methods, and Design
Examples for Build-Up/High Density Interconnection
积层/高密度互连的术语和定义、试验方法与设计例
IPC-DD-135Qualification Testing for Deposited Organic Interlayer
Dielectric Materials for Multichip Modules
多芯片组件内层有机绝缘材料的鉴定试验