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© 1996 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to
R5
to
8.2Ω
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the HEPTAWATTTM package attaching the heatsink is very simple, a screw or a compression spring (clip) being sufficient.
0.118 0.622 0.260
0.152
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.
8172-07.EPS
8172-08.EPS - 8172-09.EPS
4/5
PACKAGE MECHANICAL DATA : 9 PINS - PLASTIC HEPTAWATT
TDA8172
PM-HEPTV.EPS
Dimensions
A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia.
VS
2
6
12kΩ
1
5
2V
7
4
V5
V7 Ra
5.6kΩ
8172-05.EPS
S1 : (a) V3L ; (b) V5L
8172-06.EPS
3/5
TDA8172
Figure 2 : AC Test Circuit
1 N4 0 0 1
VS
C1
C2
C3
0.1µF
470µF
D1
220µF
t fly
2
63
Symbol I2 I6 I1
V3L V5 V5L
V5H
Tj
Parameter Pin 2 Quiescent Current Pin 6 Quiescent Current Amplifier Input Bias Current
Pin 3 Saturation Voltage to GND Quiescent Output Voltage Output Saturation Voltage to GND
Min.
2.4 1.2 0.35 0.6 2.41 4.91 7.49 10.05
2.6 15.1
6
3.65
Millimeters Typ.
2.54 5.08 7.62
16.97 14.92 21.54 22.62
2.8 5.08
Max. 4.8 1.37 2.8 1.35 0.55 08 0.9 2.67 5.21 7.8 10.4 10.4
VREF
7
Iy
V7
GND
Vi
R1
1
to
1 0kΩ
RT1 4.7kΩ
TDA8 1 7 2
4
5 C4
0.22µF
to Ly
24.6mH
R7
R6
1 .5 Ω
330Ω Ry
R3
R4
9.6Ω
IN
1 2 kΩ
C6
8 .2 kΩ
R2
4.7µF
C5
5 .6 kΩ
2200µF
R 5 Iy
*Re comme nde d for VREF filtering
Output Saturation Voltage to Supply
Junction Temperature for Thermal Shut Down
Test Conditions I3 = 0, I5 = 0 I3 = 0, I5 = 0 V1 = 1 V, V7 = 2 V V1 = 2 V, V7 = 1 V I3 = 20 mA Vs = 35V, Ra = 39 kΩ I5 = 1.2 A I5 = 0.7 A – I5 = 1.2 A – I5 = 0.7 A
the I2C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
3 15.8 6.6
3.85
Min.
0.094 0.047 0.014 0.024 0.095 0.193 0.295 0.396
0.102 0.594 0.236
0.144
Inches Typ.
0.100 0.200 0.300
0.668 0.587 0.848 0.891
0.110 0.200
Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409
+ VS
2
6
3
FLYBACK G E NE R ATOR
1 P OWER
AMPLIFIER 7
TDA8172
4
5
THE R MAL P ROTECTION
8172-01.EPS
YOKE
8172-02.EPS
May 1996
1/5
8172-01.TBL
TDA8172
ABSOLUTE MAXIMUM RATINGS
Symbol VS
V5, V6 V3
V1, V7
Supply Voltage (pin 2) Flyback Peak Voltage Voltage at Pin 3 Amplifier Input Voltage
Parameter
Io Io Io I3 I3 Ptot Tstg, Tj
Output Peak Current (non repetitive, t = 2 ms) Output Peak Current at f = 50 or 60 Hz, t ≤ 10 µs Output Peak Current at f = 50 or 60 Hz, t > 10 µs Pin 3 DC Current at V5 < V2 Pin 3 Peak to Peak Flyback Current at f = 50 or 60 Hz, tfly ≤ 1.5 ms Total Power Dissipation at Tcase = 90 °C Storage and Junction Temperature
Figure 3 : Mounting Examples
Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces, since the tab is connected to Pin 4 which is ground.
TDA8172
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
... POWER AMPLIFIER FLYBACK GENERATOR THERMAL PROTECTION
DESCRIPTION The TDA8172 is a monolithic integrated circuit in HEPTAWATTTM package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in Color and B & W television as well as in monitors and displays.
Min.
Typ. 8 16
– 0.1 – 0.1
1 18 1 0.7 1.6 1.3 140
Max. 16 36 –1 –1 1.5
1.4 1 2.2 1.8
Unit Fig. mA 1a mA 1a µA 1a µA 1a V 1c V 1d V 1c V 1c V 1b V 1b °C
8172-02.TBL
Figure 1 c : Measurement of V3L ; V5L
VS
I3 or I5
2
6
S1
3
a
b
1 3V
5
7
4
V7
V3L
V5L
8172-03.EPS
Figure 1 b : Measurement of V5H
2
6
1 1V
7 V7
5 4
VS V5H
I5
Fຫໍສະໝຸດ Baidugure 1 d : Measurement of V5
PIN CONNECTIONS (top view)
7 6 5 4 3 2 1
Tab connected to Pin 4
BLOCK DIAGRAM
HEPTAWATT (Plastic Package) ORDER CODE : TDA8172
NON-INVERTING INPUT OUTPUT STAGE SUPPLY OUTPUT GROUND FLYBACK GENERATOR SUPPLY VOLTAGE INVERTING INPUT
8172-03.TBL
2/5
8172-04.EPS
TDA8172
Figure 1 : DC Test Circuits.
Figure 1 a : Measurement of I1 ; I2 ; I6
VS
I2
I6
2
6
5
10kΩ
7 V7
S1 a
1
4
b
I1
1V
S1 : (a) I2 and I6 ; (b) I1
Value
Unit
35
V
60
V
+ Vs
+ Vs
V
– 0.5
2.5
A
3
A
2
A
100
mA
3
A
20
W
– 40, +150
°C
THERMAL DATA
Symbol Rth (j–c)
Parameter Thermal Resistance Junction-case
Max.
Value 3
Unit °C/W
ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25oC unless otherwise specified)
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to
R5
to
8.2Ω
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the HEPTAWATTTM package attaching the heatsink is very simple, a screw or a compression spring (clip) being sufficient.
0.118 0.622 0.260
0.152
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.
8172-07.EPS
8172-08.EPS - 8172-09.EPS
4/5
PACKAGE MECHANICAL DATA : 9 PINS - PLASTIC HEPTAWATT
TDA8172
PM-HEPTV.EPS
Dimensions
A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia.
VS
2
6
12kΩ
1
5
2V
7
4
V5
V7 Ra
5.6kΩ
8172-05.EPS
S1 : (a) V3L ; (b) V5L
8172-06.EPS
3/5
TDA8172
Figure 2 : AC Test Circuit
1 N4 0 0 1
VS
C1
C2
C3
0.1µF
470µF
D1
220µF
t fly
2
63
Symbol I2 I6 I1
V3L V5 V5L
V5H
Tj
Parameter Pin 2 Quiescent Current Pin 6 Quiescent Current Amplifier Input Bias Current
Pin 3 Saturation Voltage to GND Quiescent Output Voltage Output Saturation Voltage to GND
Min.
2.4 1.2 0.35 0.6 2.41 4.91 7.49 10.05
2.6 15.1
6
3.65
Millimeters Typ.
2.54 5.08 7.62
16.97 14.92 21.54 22.62
2.8 5.08
Max. 4.8 1.37 2.8 1.35 0.55 08 0.9 2.67 5.21 7.8 10.4 10.4
VREF
7
Iy
V7
GND
Vi
R1
1
to
1 0kΩ
RT1 4.7kΩ
TDA8 1 7 2
4
5 C4
0.22µF
to Ly
24.6mH
R7
R6
1 .5 Ω
330Ω Ry
R3
R4
9.6Ω
IN
1 2 kΩ
C6
8 .2 kΩ
R2
4.7µF
C5
5 .6 kΩ
2200µF
R 5 Iy
*Re comme nde d for VREF filtering
Output Saturation Voltage to Supply
Junction Temperature for Thermal Shut Down
Test Conditions I3 = 0, I5 = 0 I3 = 0, I5 = 0 V1 = 1 V, V7 = 2 V V1 = 2 V, V7 = 1 V I3 = 20 mA Vs = 35V, Ra = 39 kΩ I5 = 1.2 A I5 = 0.7 A – I5 = 1.2 A – I5 = 0.7 A
the I2C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
3 15.8 6.6
3.85
Min.
0.094 0.047 0.014 0.024 0.095 0.193 0.295 0.396
0.102 0.594 0.236
0.144
Inches Typ.
0.100 0.200 0.300
0.668 0.587 0.848 0.891
0.110 0.200
Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409
+ VS
2
6
3
FLYBACK G E NE R ATOR
1 P OWER
AMPLIFIER 7
TDA8172
4
5
THE R MAL P ROTECTION
8172-01.EPS
YOKE
8172-02.EPS
May 1996
1/5
8172-01.TBL
TDA8172
ABSOLUTE MAXIMUM RATINGS
Symbol VS
V5, V6 V3
V1, V7
Supply Voltage (pin 2) Flyback Peak Voltage Voltage at Pin 3 Amplifier Input Voltage
Parameter
Io Io Io I3 I3 Ptot Tstg, Tj
Output Peak Current (non repetitive, t = 2 ms) Output Peak Current at f = 50 or 60 Hz, t ≤ 10 µs Output Peak Current at f = 50 or 60 Hz, t > 10 µs Pin 3 DC Current at V5 < V2 Pin 3 Peak to Peak Flyback Current at f = 50 or 60 Hz, tfly ≤ 1.5 ms Total Power Dissipation at Tcase = 90 °C Storage and Junction Temperature
Figure 3 : Mounting Examples
Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces, since the tab is connected to Pin 4 which is ground.
TDA8172
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
... POWER AMPLIFIER FLYBACK GENERATOR THERMAL PROTECTION
DESCRIPTION The TDA8172 is a monolithic integrated circuit in HEPTAWATTTM package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in Color and B & W television as well as in monitors and displays.
Min.
Typ. 8 16
– 0.1 – 0.1
1 18 1 0.7 1.6 1.3 140
Max. 16 36 –1 –1 1.5
1.4 1 2.2 1.8
Unit Fig. mA 1a mA 1a µA 1a µA 1a V 1c V 1d V 1c V 1c V 1b V 1b °C
8172-02.TBL
Figure 1 c : Measurement of V3L ; V5L
VS
I3 or I5
2
6
S1
3
a
b
1 3V
5
7
4
V7
V3L
V5L
8172-03.EPS
Figure 1 b : Measurement of V5H
2
6
1 1V
7 V7
5 4
VS V5H
I5
Fຫໍສະໝຸດ Baidugure 1 d : Measurement of V5
PIN CONNECTIONS (top view)
7 6 5 4 3 2 1
Tab connected to Pin 4
BLOCK DIAGRAM
HEPTAWATT (Plastic Package) ORDER CODE : TDA8172
NON-INVERTING INPUT OUTPUT STAGE SUPPLY OUTPUT GROUND FLYBACK GENERATOR SUPPLY VOLTAGE INVERTING INPUT
8172-03.TBL
2/5
8172-04.EPS
TDA8172
Figure 1 : DC Test Circuits.
Figure 1 a : Measurement of I1 ; I2 ; I6
VS
I2
I6
2
6
5
10kΩ
7 V7
S1 a
1
4
b
I1
1V
S1 : (a) I2 and I6 ; (b) I1
Value
Unit
35
V
60
V
+ Vs
+ Vs
V
– 0.5
2.5
A
3
A
2
A
100
mA
3
A
20
W
– 40, +150
°C
THERMAL DATA
Symbol Rth (j–c)
Parameter Thermal Resistance Junction-case
Max.
Value 3
Unit °C/W
ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25oC unless otherwise specified)