德尔福-新能源汽车高压电气系统架构
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HEV/EV Electrical System Architecture 混合动力/纯电动车 高压电气系统架构
Packard Electrical/Electronic Architecture
Agenda 目录
HEV/EV HV Electrical System:混合动力/纯电动车电气系统
– HEV-EV HV System Comparison: 混合动力和纯电动车电气系统比较和电气特性 – Technical Requirements to HV System:高压电气系统的技术要求
» » » » » Safety 安全性要求 Sealing 密封性要求 Shielding 屏蔽性要求 Thermal Requirements 耐温度性要求 Charging System 充电系统标准
Delphi technical solution:德尔福的技术解决方案
– – – – High Power AL Cable 大功率铝导线的使用 Safety 安全性 EMC(Shielding) EMC(屏蔽) Thermal Effect 温度影响
Development Trend技术发展趋势
– Delphi Products Strategy 德尔福产品发展计划 – Charging System Development 充电系统发展 – Electrical level Development 功率变化引发得电气性能变化
Delphi – Be System Develop & Service Supplier for HEV/EV 为新能源汽 车打造系统平台
Packard Electrical/Electronic Architecture
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Hybrid/Electric Vehicle Architecture Comparison 混合动力/纯电动车电气系统
MILD Hybrid 中混 Plug-In Hybrid 插电式混合动力 EV 纯电动汽车
HV DC HV AC 12V/42V DC
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HEV/EV Voltages and Currents 混合动力/纯电动车电气特性
Define load by HEV/EV working condition 根据车辆情况定义负载电气特性 Define components level load condition 根据负载电气特性定义零件
AP Market Battery Motor (3 Phase AC RMS) Inverter (DC Input) DC/DC AC PTC Charger (AC Input) B Class Vehicle Current Voltage Temp 300A 300V 150C 200A 250A 30A 30A 30A 30A 300V 300V 300V 300V 300V 220V 150C 125C 105C 105C 105C 105C C Class Vehicle Current Voltage Temp 320A 400V 150C 250A 300A 30A 40A 40A 30A 400V 400V 400V 400V 400V 220V 150C 125C 105C 105C 105C 105C
HV AC Connection
Motor/ AC/Inverter Connection System
Power PDB
Power Distribution System
Main Power Circuit Motor/ AC/Inverter Connection System
EV
Power PDB
Battery Pack Connection System
MSD
Charging Connection System
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High Power Requirements Trend for high voltage/current 高功率下的电气要求变化
Packard Electrical/Electronic Architecture
Safety Requirements 高压电气系统的技术要求
Technical Requirement – Sealing: 密封性要求
Dust protection level at least 6 防尘等级至少为6
Safety Issue caused by sealing 因密封失效导致的严重事故
IP55
IP67
IP69
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EMC/EMI Requirements 高压电气系统的技术要求
Shielding: 屏蔽
– Vehicle Level EMC Requirement:整车级EMC要求
» EMC/EMI/EMS » ISO7637/ISO10605/ISO11452 » SAEJ1113
– Components Level EMC Requirement:零部件级 EMC要求
» BCI/TEM/ALSE » 10KHZ ~ 3.2GHZ – Development: 发展趋势 » Mores focus on wireless application than regular frequency 。面对越来越多无线网络的要求
Shielding Components
Shielding Requirements
Shielding Tests
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