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EasyUI高级使用jeecg指南

EasyUI高级使用jeecg指南
权限功能:权限,角色,用户(功能直接使用) [6].Ehcache缓存机制
Ehcache缓存自定义标签(永久缓存/临时缓存) [7].报表封装
Excel简易导出工具类+Highcharts图形报表 [8].Hibernate+Spring jdbc 组合使用
Hibernate+Spring jdbc组合使用(单表操作使用Hibernate;复杂SQL采用SQL), [1]SQL设计方案:DB SQL抽离出Java代码,采用命名规范根据类名和方法名创建SQL文件,存储SQL; [2]. 程序自动读取SQL; [3].SQL读取模式:开发模式 和发布 模式[SQ L加 载内存] 。
第四步:登陆系统,用户账号:admin/admin
第五步.代码生成器工具类(生成器如何使用,请参照《第四章 : 生成器使用规则》) com.test.CodeUtil(单表模型) com.test.CodeOneToMainUtil(一对多父子模型)
项目工程目录介绍: JEECG框架:是一个以代码生成器为基础,封装了完善的基础功能模块:包括用户权限,常用共通封装(数据 字典,邮件接口,定时任务,Highcharts图像报表等..)的成熟框架, 可直接用于项目开发;
JEECG[J2EE Code Generation] J2EE智能开发框架
前言
随着WEB UI 框架(EasyUi /Jquery UI /Ext /Dwz)等的逐渐成熟,系统界面逐渐实现统一化,代码生成器也可以生成统一规范的界面! 代码生成+手工MERGE半智能开发 将是新 的趋势 ,生成 的代码 可节省50%工作量 ,快速 提高开 发效率 !!!
分区 JEECG 开发指南 的第 4 页
项目配置文件目录

eclipse3.7环境下svn的使用

eclipse3.7环境下svn的使用

Eclipse3.7环境下SVN的使用目录第一章简介 (2)第二章操作指南 (2)1、导入项目 (2)2、配置分支 (7)3、分支操作 (10)4、切换操作 (14)5、提交操作 (15)6、合并操作 (17)7、Conflict handing 冲突处理 (19)8、显示资源历史记录 (20)9、更新操作 (21)10、提示信息 (21)第三章规范说明 (23)11、命名规范 (23)12、使用规范 (23)第一章简介分支的意义先说一个例子,例如:我们在一个基础平台上进行开发,每个小组负责一个子项目,而基础平台也是有可能会继续更改的,这个时候,如果不创建分支,子项目之间会相互影响,影响最大的就是后期的测试和版本发布,子项目A已经结束,但测试却受到正在进行的子项目B的影响,测试通不过,就别说版本发布了。

所以,我们需要从目前的项目(主干trunk)中创建分支(branch),隔离子项目间的相互影响。

分支的原理创建分支,实际上就是一个版本拷贝,绝不是简单在客户端上copy一个目录,而是svn仓库中copy,文件版本号会增加。

同时两边做任何修改发生的版本变化,是一套机制。

例如:目前主干版本是100,分支版本是101,主干中增加一个文件,版本为102,分支中再增加一个文件,版本就为103了。

两边的版本号是一套,不会重复。

分支操作详见第二章分支操作。

第二章操作指南1、导入项目右键点击空白区,点击Import→Import。

通过SVN资源服务器,从SVN检出项目,点击Next。

根据是否已创建SVN资源服务器环境,选择以下两种方式,点击Next:⏹创建新的资源库位置,针对首次使用SVN资源服务器,或新的SVN资源服务器地址不在使用列表中。

⏹使用现有的资源库位置,针对已创建SVN资源服务器在使用列表中。

选择创建新的资源库位置时,在URL中输入项目在SVN资源服务器中地址,点击Next。

选择使用现有的资源库位置时,选择列表中已创建的SVN资源服务器,点击Next。

Eclipse AST(抽象语法树)使用指南

Eclipse AST(抽象语法树)使用指南
z public void preVisit(ASTNode node) 这个方法在 visit(node)之前被调用。 z public void postVisit(ASTNode node) 这个方法在 endVisit(node)之后被调用。
ASTVisitor 类提供的 preVisit 方法和 postVisit 方法的缺省实现是什么也不做。子类 可以根据需要来重新实现它们。
acceptChild(visitor, getProperty2());
} visitor.endVisit(this);
// 调用 endVisit( )执行一些节点访问后的操作
从上面的模板可以看出,如果节点包含多个属性,如 CompilationUnit 节点中有 imports
属性和 types 属性等,则按这些属性在源程序中的先后次序来依次访问;如果一个属性为序
要使用这些方法,首先需要创建 AST 类的实例: AST ast = AST.newAST(AST.JLS3);
其中,参数 AST.JLS3 指示所生成的 ast 包含处理 JLS3(Java 语言规范第 3 版)的 AST API。 JLS3 是 Java 语言所有早期版本的超集,JLS3 API 可以用来处理直到 Java SE 6(即 JDK1.6) 的 Java 程序。
在 Eclipse AST 中,与本书的课程设计相关的类主要有以下三部分: z ASTNode 类及其派生类:用于描述各种 AST 节点的类,每个 AST 节点表示一个
Java 源程序中的一个语法结构,例如,一个名字、类型、表达式、语句或声明等。 z AST 类:创建 AST 节点的工厂类,类中包含许多创建各类 AST 节点的工厂方法,

太阳PSR-2000 ECLiPSE液体光敏焊蚀屏蔽漆使用指南说明书

太阳PSR-2000 ECLiPSE液体光敏焊蚀屏蔽漆使用指南说明书

TAIYO PSR-2000 ECLiPSERevised August 2013LIQUID PHOTOIMAGEABLE SOLDER MASKScreen Print or Spray ApplicationA low-cost alternative to PSR-4000RoHS CompliantHalogen-FreeCompatible with Lead-Free ProcessingP ROCESSING P ARAMETERS FOR PSR-2000ECLiPSEPSR-2000 ECLiPSE is a two-component, alkaline developable LPI solder mask products for screen print and spray applications. The product is designed to be user friendly and flexible for today’s quick turn / prototype manufacturers. PSR-2000 ECLiPSE offers a wide processing latitudes, with excellent coating properties and good resistance to alternate metal finishes such as ENIG and immersion Tin while maintaining dams of 2 mils or less. PSR-2000 ECLiPSE was designed to be the most environmentally friendly solder mask available. All Taiyo America products comply with the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the Restriction of the use of certain Hazardous Substances (RoHS) in electrical and electronic equipment.PSR-2000 ECLiPSE C OMPONENTS:PSR-2000 ECLiPSE/ CA-25 ECLiPSEMixing Ratio 80 parts 20 partsColor Green WhiteMixed PropertiesSolids 82%Viscosity 200psSpecific Gravity 1.5M IXING PSR-2000 ECLiPSE is supplied in pre-measured containers with a mix ratio by weight of 80 parts, 0.8 kgs, PSR-2000 ECLiPSE and 20 parts,0.2 kgs, CA-25 ECLiPSE. PSR-2000 ECLiPSE can be mixed amechanical mixer at low speeds to minimize shear thinning for 10 – 15minutes. The mixed pot life is 72 hours at room temperature.P RE-C LEANING Prior to solder mask application, the printed circuit board surface needs to be cleaned. Various cleaning methods include Pumice,Aluminum Oxide, Mechanical Brush, and Chemical Clean. All of thesemethods will provide a clean surface for the application of PSR-2000ECLiPSE. Hold time after cleaning the printed circuit board should beheld to a minimum to reduce the oxidation of the copper surfaces.P ROCESSING P ARAMETERS FOR PSR-2000ECLiPSES CREEN P RINTING Method: Single Sided and Double Sided Screening•Screen Mesh: 29 – 43 threads/cm (74 – 110 tpi)•Screen Mesh Angle: 22.5° Bias•Screen Tension: 20 - 28 Newtons•Squeegee: 60 – 80 durometer•Squeegee Angle: 27 – 35°•Printing Mode: Flood / Print / Print•Flood Pressure: 20 – 30 psi•Printing Speed: 2.0 – 9.9 inches/sec•Printing Pressure: 75 – 100 psiT ACK D RY C YCLE The Tack Dry step is required to remove solvent from the solder mask film and produce a firm dry surface. The optimum dwell time and oventemperature will depend on oven type, oven loading, air circulation,exhaust rate, and ramp times. Excessive tack dry times andtemperature will result in difficulty developing solder mask fromthrough holes and a reduction in photo speed. Insufficient tack dry willresult in artwork marking and/or sticking. Typical tack dry condition forPSR-2000 ECLiPSE is as followed:•Oven Temperature:68 - 82°C (155 - 180°C)•For Single-Sided (Batch Oven)1st Side: Dwell Time: 15 - 20 minutes2nd Side: Dwell Time: 20 - 40 minutes•For Double-Sided (Conveyorized or Batch Oven)•Dwell Time: 35 - 60 minutesE XPOSURE PSR-2000 ECLiPSE requires UV exposure to define solder maskdams and features. The spectral sensitivity of PSR-2000 ECLiPSE isin the area of 365 nm. Exposure times will vary by bulb type and ageof the bulb. Below are guidelines for exposing PSR-2000 ECLiPSE.•Exposure Unit: 7 kW or higher•Stouffer Step 21: Clear 10 minimum (on metal / underphototool)•Energy: 300 mJ / cm2 minimum (under phototool)P ROCESSING P ARAMETERS FOR PSR-2000ECLiPSED EVELOPMENT PSR-2000 ECLiPSE is developed in an aqueous sodium or potassiumcarbonate solution. Developing can be done in either a horizontal orvertical machine.•Solution: 1% by wt. Sodium Carbonate or 1.2% PotassiumCarbonate•pH: 10.6 or greater•Temperature: 85 - 95°F (29 - 35°C)•Spray Pressure: 25 - 45 psi (1.7 – 3.1 bars)•Dwell Time in developing chamber: 45 - 120 seconds•Water rinse is needed to remove developer solution followed by adrying stepP RE-C URE (O PTIONAL)T his step may be required if the vias remain tented on both sides after developing due to the board design. The added drying cycle willprevent out-gassing of the vias. This phenomenon can cause thesolder mask over the vias to peel or pop and may also exhibit adegree of oozing due to the entrapped solvent. The required dryingcycle is 100 - 110°C for 40 to 60 minutes. An extended time may berequired on the higher aspect ratio.F INAL C URE PSR-2000 ECLiPSE requires a thermal cure to insure optimal final propertyperformance. Thermal curing can be done in a batch oven or conveyorizedoven.•Temperature: 275 – 300°F (135 – 149°C)•Time at Temperature: 45 – 60 minutesFor Process Optimization please contact your local Taiyo America RepresentativeF INAL P ROPERTIES FOR PSR-2000ECLiPSE IPC-SM-840D, Class H & T, Solder Mask Vendor Testing RequirementsTESTSM-840PARAGRAPHREQUIREMENT RESULTVisual 3.3.1 Uniform in Appearance Pass Curing 3.2.5.1 Ref: 3.6.1.1, 3.7.1 and 3.7.2 Pass Non-Nutrient 3.2.6 Does not contribute to biological growth Pass Pencil Hardness 3.5.1 Minimum “F” Pass – 7H Adhesion 3.5.2.1 Rigid – Cu, Ni, FR-4 Pass Adhesion 3.5.2.6 Doubled Layered Solder Mask Pass Machinability 3.5.3 No Cracking or Tearing Pass Resistance to Solventsand Cleaning Agents3.6.1.1 Table 3 Solvents PassHydrolytic Stability and Aging 3.6.2 No Change after 28 days of 95-99°Cand 90-98% RHPassSolderability 3.7.1 No Adverse Effect J-STD-003 Pass Resistance to Solder 3.7.2 No Solder Sticking Pass Resistance to Solder 3.7.3 No Solder Sticking Pass Simulation of Lead FreeReflow3.7.3.1 No Solder Sticking Pass Dielectric Strength 3.8.1 500 VDC / mil Minimum TBD Thermal Shock 3.9.3 No Blistering, Crazing or De-lamination Pass Specific Class “H” RequirementsTESTSM-840PARAGRAPHREQUIREMENT RESULTFlammability 3.6.3.1 UL 94V-0 TBD Insulation Resistance 3.8.2Before Soldering 5 x 108 ohms minimum TBD After Soldering 5 x 108 ohms minimum TBD Moisture & Insulation Resistance 3.9.1Before Soldering–In Chamber 5 x 108 ohms minimum TBD) Before Soldering–Out ofChamber5 x 108 ohms minimum TBDAfter Soldering-In Chamber 5 x 108 ohms minimum TBD After Soldering-Out of Chamber 5 x 108 ohms minimum TBDElectrochemical Migration 3.9.2 >2.0 x 106 ohms, nodendritic growthTBDSpecific Class “T” RequirementsTESTSM-840PARAGRAPHREQUIREMENT RESULTFlammability 3.6.3.2 Bellcore 02 Index – 28 minimum TBD Insulation Resistance 3.8.2Before Soldering 5 x 108 ohms minimum TBD After Soldering 5 x 108 ohms minimum TBDF INAL P ROPERTIES FOR PSR-2000 ECLiPSE Specific Class “T” RequirementsTESTSM-840 PARAGRAPH REQUIREMENT RESULT Moisture & Insulation Resistance3.9.1 Before Soldering–In Chamber5 x 108 ohms minimum TBD Before Soldering–Out of Chamber5 x 108 ohms minimum TBD After Soldering-In Chamber5 x 108 ohms minimum TBD After Soldering-Out of Chamber5 x 108 ohms minimum TBD Electrochemical Migration3.9.2 < 1 decade drop, no dendritic growth Pass Additional Tests / ResultsTESTREQUIREMENT RESULT CTI (Comparative TrackingIndex)ASTM-D-3638-07 TBD AdhesionGIP-008AA (TAIYO Internal Test Method) Cross-cut tape stripping test 100/100 Solder Heat ResistanceSolder float test: Rosin Flux 300°C/30sec., 1 cycle Pass Solvent ResistancePGM-AC dipping, temp 20°C. / 20 min, Tape peeling test Pass Acid Resistance10 vol% H 2SO 4, temp 20°C. / 20 min, Tape peeling test Pass Alkaline Resistance10 wt% NaOH, temp 20°C. / 20 min, Tape peeling test Pass Dielectric Constant JIS C C6481 values at 1MHz Humidify: 25-65°C (cycle), 90%RH, 7 daysMeasured: at room temperatureTBD Dissipation Factor JIS C C6481 values at 1MHzHumidify: 25-65°C (cycle), 90%RH, 7 daysMeasured: at room temperatureTBD Electroless Ni/Au TAIYO Internal Test MethodNi: 3 microns, Au: 0.03 micronsPass Outgassing Test; A 2 J/cm 2 UVCure was done after thermal cure ASTM E-595-90; TML ≤ 1 % andCVCM ≤ 0.10% TTaiyo America, Inc. (TAIYO) warrants its products to be free from defects in materials and workmanship for the specified warranty period (PSR-2000 ECLiPSE / CA-25 ECLiPSE Warranty period is 12 Months) provided the customer has, at all times, stored the ink at a temperature of 68o F or less. TAIYO accepts no responsibility or liability for damages, whether direct, indirect, or consequential, resulting from failure in the performance of its products. If a TAIYO product is found to be defective in material or workmanship, its liability is limited to the purchase price of the product found to be defective. TAIYO MAKES NO OTHER WARRANTY, EXPRESS OR IMPLIED, AND MAKES NO WARRANTY OF MERCHANTABILITY OR OF FITNESS FOR ANY PARTICULAR PURPOSE. TAIYO'S obligation under this warranty shall not include any transportation charges or costs of installation or any liability for direct, indirect, or consequential damages or delay. If requested by TAIYO, products for which a warranty claim is made are to be returned transportation prepaid to TAIYO'S factory. Any improper use or any alteration of TAIYO'S product by the customer, as in TAIYO'S judgment affects the product materially and adversely, shall void this limitedwarranty.。

Eclips 快捷键大全

Eclips 快捷键大全

Eclipse快捷键1.【ALT+/】提示信息2.【ctrl+o】显示类中方法和属性3.【ctro+D】删除当前行4.【ctri+M】窗口最大化和还原5.【ctrl+k】【ctrl+shift+K】向下/想上查找6.【ctrl+shift+T】在workspace中查找类文件7.【Ctrl+Shift+R】查找文件8.【Ctrl+Shift+G】查找所有使用当前方法的位置9.【Ctrl+Shift+O】引入import10.【Ctrl+Shift+F】格式化代码11.【ALT+Shift+W】12.【Ctrl+L】定位到某行13。

【Alt+←】、【Alt+→】后退历史记录和前进历史记录14.【F3】快速定位15.【F4】显示类的继承关系,并打开类继承视图。

调试快捷键1. 【Ctrl+Shift+B】:在当前行设置断点或取消设置的断点。

2. 【F11】:调试最后一次执行的程序。

3. 【Ctrl+F11】:运行最后一次执行的程序。

4. 【F5】:跟踪到方法中,当程序执行到某方法时,可以按【F5】键跟踪到方法中。

5. 【F6】:单步执行程序。

6. 【F7】:执行完方法,返回到调用此方法的后一条语句。

7. 【F8】:继续执行,到下一个断点或程序结束。

常用编辑器快捷键1. 【Ctrl+C】:复制。

2. 【Ctrl+X】:剪切。

3. 【Ctrl+V】:粘贴。

4. 【Ctrl+S】:保存文件。

5. 【Ctrl+Z】:撤销。

6. 【Ctrl+Y】:重复。

7. 【Ctrl+F】:查找。

其他快捷键1. 【Ctrl+F6】:切换到下一个编辑器。

2. 【Ctrl+Shift+F6】:切换到上一个编辑器。

3. 【Ctrl+F7】:切换到下一个视图。

4. 【Ctrl+Shift+F7】:切换到上一个视图。

5. 【Ctrl+F8】:切换到下一个透视图。

6. 【Ctrl+Shift+F8】:切换到上一个透视图。

-------------------------------------------1.【Ctrl+/】行注释/销注释2.【Ctrl+Shift+/ Ctrl+Shift+\】块注释/销注释3.【Ctrl+H Ctrl+F】查找查找替换4.【ctrl + shift + t】通过类名来查找对应的类,包括在那个包,还有提示。

Eclipse黑油模型数值模拟入门指南

Eclipse黑油模型数值模拟入门指南

Eclipse黑油模型数值模拟入门指南Eclipse黑油模型数值模拟入门指南记得上大学最早学围棋时总感觉无从入手,看身边的朋友下棋时学着聂卫平从容入定,潇洒自如的样子,很是羡慕。

后来从书店买来围棋入门指南,夜深人静时照着指南慢慢学如何吃子,如何做眼,什么是打劫,怎么样布局。

掌握了一点基本知识以后开始找水平最差的下,输了一定不能弃擂,脸皮要厚,缠着对方接着下。

赢了水平最差的人后去找中等水平的人下。

这样经过一年半载,再看以前那些学着聂卫平从容入定,潇洒自如下棋的同学,心想他们原来不过如此,赶老聂差十万八千里哪。

在这里也有许多人把我叫大师,专家,如果哪一天你觉得其实我的水平也很一般,那你就到了专业段位了。

市场上有不少关于油藏数值模拟的书,但好像没有类似围棋入门指南那样从基础开始一步一步介绍的书。

我收到不下二十个问油藏数值模拟如何入门的问题。

我尝试写一写油藏数值模拟入门指南,希望对那些刚刚开始进入油藏数值模拟领域的工作者有所帮助。

第一:从掌握一套商业软件入手。

我给所有预从事油藏数值模拟领域工作的人员第一个建议是先从学一套商业数值模拟软件开始。

起点越高越好,也就是说软件功能越强越庞大越好。

现在在市场上流通的ECLIPSE,VIP和CMG都可以。

如果先学小软件容易走弯路。

有时候掌握一套小软件后再学商业软件会有心里障碍。

对于软件的学习,当然如果能参加软件培训最好。

如果没有机会参加培训,这时候你就需要从软件安装时附带的练习做起。

油藏数值模拟软件通常分为主模型,数模前处理和数模后处理。

主模型是数模的模拟器,即计算部分。

这部分是最重要的部分也是最难掌握的部分。

它可以细分为黑油模拟器,组分模拟气,热采模拟器,流线法模拟器等。

数模前处理是一些为主模拟器做数据准备的模块。

比如准备油田的构造模型,属性模型,流体的PVT参数,岩石的相渗曲线和毛管压力参数,油田的生产数据等。

数模后处理是显示模拟计算结果以及进行结果分析。

以ECLIPSE软件为例,ECLIPSE100,ECLIPSE300和FrontSim是主模拟器。

Eclipse4.x插件开发实践02-源码使用指南

Eclipse4.x插件开发实践02-源码使用指南
1.
使用 Eclipse 插件向导完成典型示例的创建 基于典型示例初步掌握 Workbench 插件的部分关键扩展点 以“导入插件” (Import Plugins)的方式创建插件工程 快速检索 Eclipse 插件制品(Artifact) 目录
2.
3.
4.
5.
插件创建向导........................................................................................................................... 2 1.1. 背景资料....................................................................................................................... 2 1.2. 实战演练....................................................................................................................... 3 1.3. 演练小结....................................................................................................................... 7 1.4. 模板概览....................................................................................................................... 9 扩展项配置页......................................................................................................................... 11 2.1. 背景资料..................................................................................................................... 11 2.2. 实战演练..................................................................................................................... 12 2.3. 演练小结..................................................................................................................... 16 插件源码导入......................................................................................................................... 17 3.1. 背景资料..................................................................................................................... 17 3.2. 实战演练..................................................................................................................... 19 3.3. 演练小结..................................................................................................................... 23 3.4. 官方示例..................................................................................................................... 24 插件快速检索......................................................................................................................... 25 4.1. 背景资料..................................................................................................................... 25 4.2. 实战演练..................................................................................................................... 26 4.3. 演练小结..................................................................................................................... 29 结束语..................................................................................................................................... 30 5.1. 课程总结..................................................................................................................... 30 5.2. 学习建议..................................................................................................................... 30

初学者必读ECLIPSE组分数值模拟入门指南-1

初学者必读ECLIPSE组分数值模拟入门指南-1

初学者必读ECLIPSE组分数值模拟入门指南-1我一直在考虑怎么样写组分模型数值模拟入门指南。

组分模拟要涉及到状态方程(EOS),闪蒸计算,热动力方程等理论方面的知识。

在实际做组分模拟时,你并不需要完全掌握这些知识,但你至少应该有一定了解。

我在后面会做一点简单的介绍,但希望大家自己化些时间去学这部分知识。

我写的还是以应用为主(这部分内容可能是国内出版的数模书籍中最缺乏的),大家需要参考其他组分模拟理论方面的书籍。

做组分模拟前应该有很好的黑油模拟的基础。

你应该先把黑油模拟做好以后再开始做组分模拟。

在我写的过程中,我也假定你已经很好地掌握了黑油模型。

涉及到黑油方面的内容时我不会做重复介绍。

如果你有疑问,可以参照我以前写的黑油模拟入门指南。

关于组分模拟,大家首先会有下面一些疑问。

为什么要做组分模拟?在什么情况下需要做组分模拟?组分模拟与黑油模拟有什么区别?组分模拟结果是不是一定比黑油模拟好?组分模拟用多少组分比较好?我先试着回答一下这些基本问题,然后我再介绍具体如何做组分模拟。

我们都知道,地下的流体的组成实际上是非常复杂的,可能含有成百上千的组分。

地下流体以油或气相的形式存在。

对于大多数油藏,我们基本上可以把地下流体分为两个组分,及油组分和气组分。

油组分以油相的形式存在,气组分以气相的形式存在。

两个组分会发生物质交换,及气组分会溶解到油相,油组分也会从气相挥发(油和气都不会溶解于水)。

这两个组分之间的物质交换可以用溶解油气比和(或)挥发气油比来表示。

溶解油气比和挥发气油比都只是压力的函数。

地下油气相的密度可以通过地面油气相的密度,溶解油气比以及体积系数来计算。

油气相的体积系数也只是压力的函数。

同样地下油气相的粘度也是压力的函数。

这就是我们所熟悉的黑油模型。

对于大多数油藏,采用这样的处理方式计算结果是有保证的。

但并不是所有油藏都可以这样处理。

比如凝析气藏,气藏温度很靠近临界温度,在开发过程中有许多独特的特性。

中标麒麟系统上安装Java、Eclipse指南

中标麒麟系统上安装Java、Eclipse指南

中标麒麟系统上安装Java环境指南Java_NeoKylin_Install_Guide2015-01-12修订记录目录Content概述 (3)原Linux系统中JDK的卸载 (3)安装新的JDK (4)安装新的Eclipse (5)一、概述1、介绍请以root用户在系统桌面上运行。

2、用到的工具1)FTP客户端:用于在win和Linux之间FTP。

该版本麒麟操作系统已经安装。

2)麒麟系统版本:NeoKylin-Desktop-V6.0-x86-B038-2014071517283)JDK版本为:jdk-8u25-linux-i586.tar.gz(可从官网下载最新)4)Eclipse版本为:eclipse-jee-luna-SR1-linux-gtk.tar.gz(可从官网下载最新)二、原麒麟系统中JDK的卸载1、查看麒麟系统中的JDK组件JDK版本查询。

在终端输入命令为:java –version可以看到如下所示:java version "1.7.0_25"OpenJDK Runtime Environment (fedora-2.3.10.3.nk.1-i386)OpenJDK Client VM (build 23.7-b01, mixed mode, sharing)说明麒麟系统中已经预装了相关的JDK1.7的版本。

2、卸载,彻底的卸载JDK备注:安装新的JDK可以选择卸载旧的JDK,也可以保留旧的JDK。

此处为可选项。

卸载JDK的命令,用root权限在终端输入:yum -y remove java java-1.7.0-openjdk-devel.i686卸载完毕之后,在终端输入:javac 或java -version此时终端会提示:未找到命令即代表此时原来的JDK版本已经卸载了。

已经完成了对JDK的卸载。

三、安装新的的JDK1、安装JDK在终端执行(root用户),在JDK所在的目录下执行命令:tar -zxvf jdk-8u25-linux-i586.tar.gz将其安装到指定的目录下。

尼康 TE300 Eclipse 显微镜用户指南说明书

尼康 TE300 Eclipse 显微镜用户指南说明书

Nikon TE300 Eclipse BrightfieldMicroscopeUser GuideLSU Health Science Center-Shreveport Research Core FacilityUser manual for Nikon Elements software Equipment: Nikon TE300 Eclipse microscopeDS Fi2 color camera (For colored images)If the room lights are not on when you arrive to use the Nikon, check and confirm that no one is using the Zeiss two-photon microscope before you turn on the light.Check whether the floating table and the microscope is clean, if not, clean it.Sign in on the sign in sheet; please use both your given name and your surname, your department, your PI, and provide a telephone number at which you can be reached. If you do not use your lab telephone as your main contact, please provide your mobile number.Turning on/preparing microscope 1. Turn on the surge protector by pressing its power button2. Turn on the computerOnce the computer is on, please login to your own user account with the following user ID and password:User ID: lsumc-master\usernameThe password is your personal school email passwordTurn on the camera before you start the software.• Turn on the Nikon Digital Sight DS-U3 unit, which is connected to the camera via a cable. Thegreen light will come on; once it stops blinking and remains a solid green, the camera is ready to use.Digital Sight DS-U3 unitDS Fi2 color cameraOpen the NIS Elements software by double clicking on the icon .A log-in dialogue box will appear after clicking on the software icon. Log in use:User ID: nikonuser12Connecting cablePassword: corescopesIn the camera dialogue box, choose the DS-U3 color camera (Neglect the other options).1. The Nikon lamp switch on the left side of the scope should be pushed in (ON ). If not, push it in.2. Choose the correct stage insert and use the nylon screws to fasten it in place. Extra screws arein a white plastic box and the yellow screwdriver is for changing stage. You can find stage inserts in the box labeled “Nikon Wide -field stage”.3. The motorized stage joystick located to the right of the microscope has three speeds: 100%, 50%and 25%, which can be changed by pressing the switch to the left of the joystick. The switchcontinuously cycles through the speeds, so try different speeds to find the one you prefer.Nikon lamp switch Screws and screwdriver for changingstage Motorized stage joystick and focus knobSetting up for imaging (objective, plates, slides)1. Lower the objective positions with the focus wheel. The lengths of the objectives are different,and the taller objectives can easily hit the stage while you turn the objective turret. 1 2 32.Place your sample securely in the stage tray. Remember to invert slides, coverslip side down.3.The microscope objectives are engineered to work best with coverslips 0.17 mm in thickness,usually referred to as number 1.5 or 1 ½ when ordering.4.Plates and dishes should not be flipped. If possible, you may want to remove plastic lids, sinceplastic can distort imaging.Observing images through the eyepieces (light path: A)1.When viewing your sample through the eyepieces, set the selector knob on the lower right sideof the scope to A, which directs 100% of the light to the eyepieces. B & D allow light to go to the eyepieces and the camera at the same time; C directs 100% of the light to the camera.Light path selector wheel2.Rotate the objective turret manually to select an objective; please do not touch the objectivesas you rotate the turret, since those with correction collars can have the collars inadvertentlychanged.3.In the OC Panel of the software, click on the objective name corresponding to the one that youhave manually selected. Note: Clicking on objectives in the OC panel does not control the actual turning of objective turret, but it tells the software which objective is currently in place andallows the software to adjust the acquisition settings best for the selected objective. Although you have to manually choose objectives, you still need to click on the corresponding objective button in the software to ensure best imaging result. Scale bars won’t be in the correct umformat if no or wrong objective is selected.[The objectives currently mounted on the turret comprise the following: 4x, 10x, 20x, 20x, 40x dry, 40x oil. Please note that only ONE (40x oil) of these is an oil objective, requiring the use of immersion fluid; the others are all air objectives, which do not require any immersion fluid, and will in fact be damaged by oil, glycerin, or water. If needed, 60x (oil) or 100x (oil) objectives are available to be checked out.]PLEASE use ONLY the Nikon oil in the brown plastic container at the microscope station with the 40X oil objective.4. Turn on the light switch5. Look through the eyepiece with transmitted light. Find and focus on your sample.Observing live images on the computer and acquisition (light path: C)1. To view samples in the software, manually set the selector knob on the lower right side of thescope to C , which directs 100% of the light to the camera.2. Click on the3. 4. Use the fine focus knob to readjust the focus on screen, because the focus through eyepiece isnot exactly the same with the focus of the software.5. Adjust the white balance of an image using the AWB button at the top tool bar of the live viewwindow.6. Capture an image by clicking the camera button .DS Fi2 (color) Camera Settings•Mode: Normal and Binning. Default Normal.•Resolution: you will see Fast (Focus) and a drop down menu, and Quality (Capture) and another drop down menu. Below those menus is a box called High Quality Capture that can be checked or unchecked.•Exposure: Uncheck auto Exposure to manually change exposure time.•Analog Gain: software sets value•AE Compensation: software sets value•Color: Auto White button will add white balance to your image.•Scene Mode >: no action•Commands: no actionSaving an image (ND, TIFF, JPEG; folders; offline access)When you are ready to save an image, go to File and choose Save As. You will have choice in which format to save the image. Each user has a personal folder located in the Users Folder on the desktop. Images can be saved there temporarily, but should be removed in good time. The easiest way is to use a flash drive and the USB ports on computer.Save your image as a .tif file from your original image. Keep in mind that TIFF format is required for publication. JPEG images is not always accepted.To save into a TIFF file. Go to File->Save as, then set the options as below:Shutting down the equipment1.If you have used oil, make sure to clean the objective with the lens paper and cleanerprovided. Currently, this only applies to the 40x oil objective used for fluorescent imaging.2.Clean your slides with cleaner and kimwipes.3.Lower the objectives and turn the objective to 4X.4.Log off and Shut Down the computer.5.Turn off the DS Fi2 color camera by turning off the Nikon Digital Sight DS-U3 unit.6.Turn OFF the surge protector under the table.7.Replace the cover and remember to sign out on the login sheet.MiscellaneousBinning averages the grey values in pixels into various sizes of bundles, which makes the signal brighter but reduces resolution. The software allows you to set the binning range for both cameras, with None as the default. The 2x2 selection will produce a good size image for focusing. If you change the binning size, you may need to redo the Auto Exposure. Using 2x2 binning, which averages the information in 4 pixels, increases your S/N ratio by a factor of 4. This is advantageous when you have a weak fluorescent signal. The use of 2x2 binning also decreases image file size and time transfer rates for the camera. Choose No Binning or the lowest value of binning for the best resolution.Tips for Better ImagingCoverslips: It is very important that your coverslip be glass, size 1 ½, 0.17 mm thick. Some of the objectives have correction collars that adjust for differences in thickness, but some do not. The correction collars may help if you are trying to image cells in plates or flasks. However, they may not be in a position ideal for your samples.Plastic: although in general images made through plastic ware are good, it may be worth the extra money to buy optically corrected plastic.Immersion medium objectives: If you are using the 40x, 60x, or 100x oil immersion objectives, please use ONLY the Nikon immersion oil next to the microscope. Residues from different oil types on the lenscan cause aberrations in the image. Kimwipes are fine for cleaning the oil off of slides (this can be followed with lens cleaner sprayed onto a Kimwipe, then used to remove the last traces of oil). When cleaning the objective lens, which is very sensitive, use the provided lens paper and draw it gently across the objective, which allows it to soak up and remove the oil without scratching or damaging the lens.For professional quality images, each component of the microscope system should be set to the optimal position for your samples before you begin to collect images. This is especially important for brightfield images that require Kohler illumination.Equipment Specifications for PublicationMicroscope: Nikon Eclipse TE300 inverted microscope with an epi-fluorescence attachmentObjectives: there are 6 objectives mounted on the turret; the rest are available for check out。

Nsight Eclipse Plugins 安装指南说明书

Nsight Eclipse Plugins 安装指南说明书

Nsight Eclipse Plugins Installation GuideNsight Eclipse Plugins Installation GuideTable of Contents Chapter 1. Introduction (1)1.1. Install plugins using Eclipse IDE (1)1.2. Uninstall plugins using Eclipse IDE (2)1.3. Install Using Script (3)Chapter 1.IntroductionThis guide provides the procedures to install the Nsight Eclipse Edition Plugins in users own eclipse environment.Nsight Eclipse Plugins offers full-featured IDE that provides an all-in-one integrated environment to edit, build, debug and profile CUDA-C applications.1.1. Install plugins using Eclipse IDE1.You can install Nsight Eclipse plugins in your own Eclipse environment or download andinstall Eclipse IDE for C/C++ developers.unch Eclipse and go to Help > Install New Software.. menu.3.Click on the Add Button4.Enter name (ex: NsightEE) in the Name field. Choose the the zipfile(com.nvidia.cuda.repo.zip) that contains the plugins using Archive button or Enter the full path of zip file. Nsight EE plugns zip file can be found in /usr/local/cuda-11.1/ nsightee_plugins directory.5.Click OK button6.Select “Cuda Main Features” option and go to next page.7.Accept the license agreement and click on Finish button to install the plugins.8.Click OK on the “Security Warning” dialog to ignore the warning message about unsignedcontent (This warning message is displayed for all the plugins that are not signed by).9.Restart eclipse when prompted.Nsight Eclipse plugins installation is now complete.Go to Help > Installation Details.. Menu to verify the “Cuda Developer Tools” and “Cuda Remote Launch” plugins are installed1.2. Uninstall plugins using Eclipse IDEunch Eclipse and go to Help > Installation Details menu.2.Select “Cuda Developer Tools” and “Cuda Remote Launch” options from the dialog3.Click on the Uninstall button.4.Click Finish button when asked to review and confirm.5.Restart eclipse when prompted.Nsight Eclipse plugins will be uninstalled after restarting eclipse. Go to Help > Installation Details.. menu to verify.1.3. Install Using ScriptTo install or uninstall the Nsight Eclipse Plugins using the script, run the installation script provided in the bin directory of the toolkit. By default, it is located in /usr/local/cuda-11.1/ bin:The usage of the script is as follows:Usage: ./nsight_ee_plugins_manage.sh <action> <eclipse_dir><action> : 'install' or 'uninstall'<eclipse_dir> : eclipse installation directoryTo install the Nsight Eclipse Plugins, run the following command:$ /usr/local/cuda-11.1/bin/nsight_ee_plugins_manage.sh install <eclipse_dir>To uninstall the Nsight Eclipse Plugins, run the following command:$ /usr/local/cuda-11.1/bin/nsight_ee_plugins_manage.sh uninstall <eclipse_dir>NoticeThis document is provided for information purposes only and shall not be regarded as a warranty of a certain functionality, condition, or quality of a product. NVIDIA Corporation (“NVIDIA”) makes no representations or warranties, expressed or implied, as to the accuracy or completeness of the information contained in this document and assumes no responsibility for any errors contained herein. NVIDIA shall have no liability for the consequences or use of such information or for any infringement of patents or other rights of third parties that may result from its use. This document is not a commitment to develop, release, or deliver any Material (defined below), code, or functionality.NVIDIA reserves the right to make corrections, modifications, enhancements, improvements, and any other changes to this document, at any time without notice. Customer should obtain the latest relevant information before placing orders and should verify that such information is current and complete.NVIDIA products are sold subject to the NVIDIA standard terms and conditions of sale supplied at the time of order acknowledgement, unless otherwise agreed in an individual sales agreement signed by authorized representatives of NVIDIA and customer (“Terms of Sale”). NVIDIA hereby expressly objects to applying any customer general terms and conditions with regards to the purchase of the NVIDIA product referenced in this document. No contractual obligations are formed either directly or indirectly by this document.VESA DisplayPortDisplayPort and DisplayPort Compliance Logo, DisplayPort Compliance Logo for Dual-mode Sources, and DisplayPort Compliance Logo for Active Cables are trademarks owned by the Video Electronics Standards Association in the United States and other countries.HDMIHDMI, the HDMI logo, and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC.OpenCLOpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc.TrademarksNVIDIA and the NVIDIA logo are trademarks or registered trademarks of NVIDIA Corporation in the U.S. and other countries. Other company and product names may be trademarks of the respective companies with which they are associated.Copyright© -2020 NVIDIA Corporation. All rights reserved.NVIDIA Corporation | 2788 San Tomas Expressway, Santa Clara, CA 95051。

uml designer eclipse使用方法

uml designer eclipse使用方法

uml designer eclipse使用方法**UML Designer Eclipse 使用指南**统一建模语言(UML)是面向对象设计中的一种标准图形建模语言。

Eclipse 是一款流行的集成开发环境(IDE),它支持通过插件扩展功能,其中包括UML Designer。

UML Designer 是一个强大的工具,允许开发者在Eclipse 环境中创建和操作UML 图表。

以下是如何在Eclipse 中使用UML Designer 的详细指南。

### 安装UML Designer 插件1.打开Eclipse。

2.转到"Help" 菜单,选择"Install New Software..."。

3.在出现的对话框中,输入UML Designer 的更新站点地址。

4.选择要安装的UML Designer 插件。

5.遵循屏幕上的指示完成安装过程。

### 创建UML 图表1.在Eclipse 项目浏览器中,右击您的项目名称,选择"New"。

2.在"New" 菜单中选择"Other..."。

3.展开"UML" 文件夹,选择要创建的UML 图表类型,如"Class Diagram"。

4.填写图表名称,并选择合适的文件夹位置。

5.点击"Finish",一个新的UML 图表将被创建。

### 操作UML 元素1.在创建的UML 图表中,您可以通过右击图表空白处,选择"New" 来添加新的UML 元素。

2.可以添加类、接口、关联、依赖、继承等元素。

3.双击元素或使用属性视图可以编辑元素的属性。

4.拖放操作可以用于快速修改元素之间的关系。

### 导入和导出UML Designer 允许导入和导出不同格式的文件:- **导入**:右击图表,选择"Import",然后选择要导入的文件格式。

eclipse快捷键包括查找类、方法、变量

eclipse快捷键包括查找类、方法、变量

eclipse快捷键包括查找类、⽅法、变量【Ct rl+T】搜索当前接⼝的实现类1. 【ALT +/】此快捷键为⽤户编辑的好帮⼿,能为⽤户提供内容的辅助,不要为记不全⽅法和属性名称犯愁,当记不全类、⽅法和属性的名字时,多体验⼀下【ALT +/】快捷键带来的好处吧。

2. 【Ct rl+O】显⽰类中⽅法和属性的⼤纲,能快速定位类的⽅法和属性,在查找Bug时⾮常有⽤。

3. 【Ct rl+/】快速添加注释,能为光标所在⾏或所选定⾏快速添加注释或取消注释,在调试的时候可能总会需要注释⼀些东西或取消注释,现在好了,不需要每⾏进⾏重复的注释。

4. 【Ct rl+D】删除当前⾏,这也是笔者的最爱之⼀,不⽤为删除⼀⾏⽽按那么多次的删除键。

5. 【Ct rl+M】窗⼝最⼤化和还原,⽤户在窗⼝中进⾏操作时,总会觉得当前窗⼝⼩(尤其在编写代码时),现在好了,试试【Ct rl+M】快捷键。

查看和定位快捷键在程序中,迅速定位代码的位置,快速找到Bug的所在,是⾮常不容易的事,Eclipse提供了强⼤的查找功能,可以利⽤如下的快捷键帮助完成查找定位的⼯作。

1. 【Ct rl+K】、【Ct rl++Shift +K】快速向下和向上查找选定的内容,从此不再需要⽤⿏标单击查找对话框了。

2. 【Ct rl+Shift +T 】查找⼯作空间(Workspace)构建路径中的可找到类⽂件,不要为找不到类⽽痛苦,⽽且可以使⽤“*”、“?”等通配符。

3. 【Ct rl+Shift +R】查找⽂件【Ct rl+Shift +T 】查找类,查找⼯作空间(Workspace)中的所有⽂件(包括Java⽂件),也可以使⽤通配符。

4. 【Ct rl+Shift +G】查找类、⽅法和属性的引⽤。

这是⼀个⾮常实⽤的快捷键,例如要修改引⽤某个⽅法的代码,可以通过【Ctrl+Shift +G】快捷键迅速定位所有引⽤此⽅法的位置。

5. 【Ct rl+Shift +O】快速⽣成import ,当从⽹上拷贝⼀段程序后,不知道如何import 进所调⽤的类,试试【Ct rl+Shift +O】快捷键,⼀定会有惊喜。

如何使用eclipse开发android

如何使用eclipse开发android

本文示例代码下载地址:/developerworks/cn/education/ope nsource/os-eclipse-android/downloads.html简介黑莓和iPhone 都提供了受欢迎的、高容量的移动平台,但是却分别针对两个不同的消费群体。

黑莓是企业业务用户的不二选择。

但是,作为一种消费设备,它在易用性和“新奇特性” 方面难以和iPhone 抗衡。

Android 则是一个年轻的、有待开发的平台,它有潜力同时涵盖移动电话的两个不同消费群体,甚至可能缩小工作和娱乐之间的差别如今,很多基于网络或有网络支持的设备都运行某种Linux 内核。

这是一种可靠的平台:可经济有效地进行部署和提供支持,并且可直接作为面向部署的良好的设计方法。

这些设备的UI 通常是基于HTML 的,可通过PC 或Mac 浏览器查看。

但并不是每个设备都需要通过一个常规的计算设备来控制。

想象一下传统的家用电器,例如电炉、微波炉或面包机。

如果您的家用电器由Android 控制,并且有一个彩色触摸屏,会怎么样?如果电炉上有一个Android UI,那么操控者甚至可以烹饪点什么东西。

在本文中,了解Android 平台,以及如何将它用于移动和非移动应用程序。

安装Android SDK,并构建一个简单的应用程序。

下载本文中的示例应用程序的源代码。

回页首Android 简史Android 平台是Open Handset Alliance的成果,Open Handset Alliance 组织由一群共同致力于构建更好的移动电话的公司组成。

这个组织由Google 领导,包括移动运营商、手持设备制造商、零部件制造商、软件解决方案和平台提供商以及市场营销公司。

从软件开发的观点看,Android 正处在开源领域的中心位置。

市场上第一款支持Android 的手机是由HTC 制造并由T-Mobile 供应的G1。

这款设备从设想到推出花了大约一年的时间,惟一可用的软件开发工具是一些实行增量改进的SDK 发行版。

尼康D-Eclipse C1共聚焦显微镜用户指南说明书

尼康D-Eclipse C1共聚焦显微镜用户指南说明书

Nikon D-Eclipse C1 Confocal MicroscopeUser GuideUniversity of Puget Sound – Department of BiologyJune 2015Table of ContentsI. Disclaimer! (2)II. Safety Considerations (2)III. Confocal Microscopy (2)IV. Operation of the Microscope (2)A. Start-up procedures (2)B. Finding your sample with conventional microscopy (3)C. Visualizing your sample with epifluorescence (4)V. Using NIS Elements to Image Epifluorescence (4)A. Adjusting Image Appearance in NIS Elements (4)B. Capturing and Saving Epifluorescent Images (6)C. Merging Captured Epifluorescent Images in NIS Elements (7)D. Stitching Multiple Epifluorescent Images together in NIS Elements (7)E. Annotating Images in NIS Elements (8)1. Add a Scale Bar (8)2. Take Measurements (10)I. Disclaimer!Please note: this is an abbreviated guide. The actual manual for this microscope + software package is easily over 300 pages. While it is a good exercise for any student to read the user manual when beginning work on a new instrument, this User Guide can serve as a guide to general use of the instrument and may be sufficient for many uses. However, in the event that you encounter trouble, need more information, or require assistance, contact Amy (email: ************************;location:Room117H,ThompsonHall;phone:253-879-2829)orrefer to the manual for the instrument or software.II. Safety ConsiderationsThe confocal microscope utilizes high powered lasers which emit intense beams of light. Though risk is minimal since the system is enclosed, some hazards remain. Exposure to lasers may result in damage to the eyes or skin, among other hazards. For these reasons, please use the following precautions when working on the confocal microscope:∙Never look directly into any laser beam light source.∙Adhere to all safety warning labels found on the microscope and lasers.∙Notify a supervisor, faculty member, or other responsible individual immediately if a laser is malfunctioning or losing power.For additional information on laser safety associated with using the confocal microscope, consult the Nikon website at /articles/fluorescence/lasersafety.html.III. Confocal MicroscopyConfocal microscopy is an imaging technique commonly used in the biomedical and life sciences to visualize fixed or living cells and tissues, among other applications. Confocal imaging is based on principles invented by Marvin Minsky in 1957, and involves the use of point illumination and elimination of light transmitted from the out-of-focus planes via a pinhole located in front of the detector. This imaging technique provides a significant increase in optical resolution and contrast over traditional wide-field fluorescent microscopy, and thus allows for the resolution of fine structure, acquisition of 3D images, and achievement of exquisitely-fine focus.IV. Operation of the MicroscopeStudents should always have training on the microscope prior to use! To arrange to be trained, or forotherassistance,pleaseseeAmyin117HThompsonHall(****************************** 879-2829).A. Start-up proceduresThe following sequence should be used when turning on the microscope (summary located on the wall next to the microscope):1. Sign up on the online instrument calendar located on the science core facility webpage:/sciencecorefacility.2. Turn on 2) the power strip for the lasers and the epifluorescence camera. This is located in thecorner on the bench to the left of the microscope.3. Turn on 3) each laser individually, only if you are planning to do confocal microscopy. These DONOT need to be turned on if you are performing epifluorescence. Ideally, the lasers should be onfor 20-30 minutes prior to use. The time that it takes to turn everything on and set up the microscope is generally enough time for the lasers to warm up properly. However, in the case of quantitative analysis of multiple samples, be sure to wait for an appropriate amount of time (ie, 20-30 minutes) from start-up to begin collecting images and data.a. 405 nm laser: Silver control box on the back of main lasers box. Turn the key located onthe back of the laser. Key in the horizontal (o) position is off. Key in the vertical (l) positionis on.b. 488 nm laser:i. Turn the key located on the black controller box to the left of the main lasers box(key in the vertical position (o) is off, key in the horizontal position (l) is on);ii. When green light stops flashing, push down the green “laser on” button.c. 561 nm laser: Silver control box to the front of the main control lasers box. Switch in thevertical (o) position is off. Switch in the horizontal (l) position is on.4. Turn on 4) the powerstrip by the computer. This controls power to the controller and detector.5. Turn on 5) the computer and monitor.6. Open the appropriate software for imaging. EZ-C1 for confocal laser scanning or NIS Elements forepifluorescence.B. Finding your sample with conventional microscopy1. Make sure the lowest objective is in place, and stage is lowered with the course focus to reducethe risk of running the objective into the stage or slide.2. Place the slide, coverslip-down, on the platform (remember, this is an inverted microscope, so theobjective is underneath the sample).3. Be sure the port knobs (located on the right side of the microscope) is pointing to the indicator for“EYE”, the shutter is open (lever located just behind the filter turret on the right side of the microscope, pushed back to the “O” position), and the filter turret (located ju st below the objectives) is in the transmitted light position “ ”, which is used for bright field imaging to initially find your specimen before switching to fluorescence.4. Turn on the transmitted light by pressing the white button on the lower left-hand side of themicroscope. You can adjust the intensity by turning the dial just below the white button.5. Using the eyepieces, find your cells/tissues/etc., and focus using the coarse focus dial or theremote fine focus controller dial. The platform can be moved to reposition your specimen using the rod on the right side of the microscope, rather than actually manually moving your slide.Note: Depending on your tissue, it might be hard to see with bright field microscopy. If that is the case, you might find it helpful to focus on the edge of your coverslip to get you close to the plane of focus, then position where you think your sample is over the objective and continue on to the next section “Visualizing your sample with epifluorescence”.6. Start with the 10x objective, find your cells/tissue/etc., and then switch to the 20x, 60x, or 100xobjective if needed. If using the 60x WI objective, place a drop of double distilled DI water on the top of the objective before use. If using the 100x Oil objective, place a small drop of immersion oil on your slide.Note: The 100x objective is kept the shelf to the left of the microscope. You must be trained prior to use of the 100X objective. Please use it carefully, be sure to clean itcorrectly after use, and take care when mounting and unmounting it. If you need assistance, please contact Amy.C. Visualizing your sample with epifluorescence1. Once you have found and focused on your sample using bright field microscopy, turn off thetransmitted light.2. Place the filter turret (located just below the objectives) to the correct position for the fluorescenceyou wish to view. Filters are labeled as follows:∙“UV”: UV excitation, used to visualize DAPI∙“B”: blue excitation, used to visualize GFP and FITC∙“G”: green excitation, used to visualize Cy3, TRITC3. Turn the LED light source on by tapping the foot pedal located on the floor underneath the tablethe microscope is sitting on. Note: Be sure to turn off the LED light source by tapping the foot pedal again w hen you don’t need to visualize fluorescence or if you have switched to confocal microscopy. You never want your sample exposed to unnecessary light as this might quench your fluorophore, resulting in reduced fluorescence.V. Using NIS Elements to Image EpifluorescenceA. Adjusting Image Appearance in NIS Elements1. Switch to the computer view: Turn the top portal knob (on the right side of the microscope, acrossfrom the CoolSnapEZ camera) to “SIDE”.2. Open the NIS Elements software by double-clicking the icon on the desktop, select RoperScientific and click OK.3. To view the live image, click the button in the upper left hand corner of the software. You willalso need to indicate what filter you are currently using for your image to appear the correct color.There are several presets in the tool bar, one for each emission color (see image below). Once you choose the correct fluorophore the tab at the lower left corner of your live image will display the correct label (see image below).4. If you need to change the label, or if the presets have been changed, right click the tab circled inred above and choose Properties. In the Name drop-down menu you can choose from a variety of fluorophores. Sometimes you may also need to change the color of those presets. Click Close when finished.5. To adjust the brightness of the image you will first want to select “Auto Exposure” from theCoolSNAP ES Settings on the right-hand side of the screen.6. To adjust the appearance of your image you can adjust the LUTs (Lookup Tables) located on theright-hand side of the screen.∙During the imaging process, the camera collects the transmitted light and assigns a value to each pixel based on its intensity. Brighter pixels are assigned higher intensity values. The intensity values are arranged in histograms along the x-axis, with lower intensity values on the left and higher intensity values on the right. The height of the bar at a particular intensity value represents its pixel population. Higher bars indicate more pixels at that intensity value.∙How these intensity values are assigned, or ‘mapped’, greatly affects the visual appearance of the image, although it does not affect the data or quantification in any way. The curve overlaying the histogram represents how the intensity values of the data map to the available display values. Adjusting the curve changes which of the intensity values are mapped to specific display values, and whether they are mapped linearly or logarithmically.∙There are three points on the curve that can be adjusted:a. The Max Point is at the right of the curve. Moving the Max Point to the left is similar toincreasing the Contrast. As more of the intensity values are mapped to the brightestdisplay values, fluorescence becomes brighter.b. The Min Point is at the left of the curves and marks the lowest display value that is not inthe background color. Moving the Min Point to the right shades more of the lower intensityvalues to lower display values, creating a visually cleaner background.c. The middle point represents the K value. Adjusting it smoothly changes the mapping fromlinear to logarithmic. Changing to a more logarithmic mapping reduces the contrastbetween the higher and lower intensity values by applying a log scale, so higher and lowerintensity values are mapped to display values that are closer together. This ‘compression’of the intensity values may improve the appearance of the less intense bands, whileavoiding very bright bands.Min PointB. Capturing and Saving Epifluorescent Images1. To capture the image click the camera icon in the tool bar. This will open a new window with yourcaptured image.2. To save the image, go to “File” then choose “Save As” and find your folder. Note all students musthave a subfolder within their adviser’s folder.3. Give your file a name and select what kind of file type you’d like to save your image as. There arethree recommendations. NOTE: If you save your image in TIFF or JPEG formats you must include the magnification in your image name or write it down in your lab notebook in order to go back and calibrate the image to the correct scale bar or make measurements.a. ND2 Image File Format. This saves your image in the proprietary NIS Elements formatsthat allows you to keep information about the instrumentation such as instrument type andmagnification with your image. This is particularly helpful if you don’t have a file namingconvention that includes the magnification your image was acquired at. You can processyour image in this file format and then save it in one of the following formats without therisk of losing image quality.b. TIFF, Tagged Image Format. This is a powerful image format that is the standard forgraphic artists, publishing, and photography. TIFFs are a lossless formatting meaning thata TIFF image may be edited and re-saved without losing image quality. One disadvantageto TIFFs is that they can’t always be viewed on all devices.c. JPEG, Tagged Image Format. This is a particularly useful file type that can be viewed onvirtually any device. The disadvantage to using JPEGs is that image quality may be lostwhen editing and resaving your image.C. Merging Captured Epifluorescent Images in NIS ElementsIf you have a sample with more than one fluorophore you can merge together two fluorescent images and/or merge a fluorescent image with a brightfield image.1. Go to the “File” tab then click “Merge Images…”.2. In the “Merge Images” window that appears you will select the file name of the images you want tomerge from the drop down menu under the appropriately colored component or Brightfield option, then click “OK”.3. Save the image according to the instructions in section B above. If you need to annotate your imagewith text, arrows, scale bar, or make measurements see section 5E below.D. Stitching Multiple Epifluorescent Images together in NIS ElementsIf you have a large sample or piece of tissue you want to see all together at once you can capture multiple images and then stitch them together.1. Capture your images in a systematic way by always moving across in the same direction or down ina column. Also make sure you capture the image for all fluorophores or under brightfield beforemoving on to the next area. Note: Images must be saved in a file format other than .ND2, such as JPEG or TIFF in order to stitch them together.2. Go to the “File” tab then click “Stitch Larger Image from Files…”, then open your image sequenceby navigating to the folder for the images that you want to stitch together.3. Select the correct layout options so that your image is stitched together in the correct order. It’shelpful if you remember the direction you moved to obtain images and how many columns you captured. Click Stitch.E. Annotating Images in NIS Elements1. Scale Barsa. Adding a scale bari. On the right hand side of your image there will be a tool bar. To add a scale bar,select the icon that that has “µm” on it.ii. If you are adding it to a .ND2 file, a calibrated scale will be added and you canproceed with editing the scale bar properties. If you are adding it to any other filetype you will need to calibrate the scale bar from pixels to µm.iii. To calibrate your scale you will need to right click on “Uncalibrated” which is locatedon the bottom of your image window to bring up the calibration menu.iv. Select “Calibrate using Objective” and then click on the appropriate objective. Youshould not have a scale bar on your image (see example below) and proceed with editing scale bar properties.b. Edit scale bar propertiesi. To change the appearance of your scale bar, click on the small arrow to the right ofthe “µm” icon and select “Scale Properties…”ii. In the new window that opens you can select the orientation, appearance, size, and font of your scale bar, then click “OK”.c. Saving an image with a scale barIn NIS Elements, annotations act like layers (or overlays) in an image. In order to have the scale bar appear on your saved image you first need to insert the overlay by going to the “Edit” tab, then select “Insert Overlay”. You can now save the image according to theinstructions in section 5B above. Note: It is recommended to save your annotated image as a new file name so you always have your original image to go back to.2. Take Measurementsa. Annotations and Measurements toolboxi. There are a number of measurements that the NIS Elements software can do with acalibrated (correctly scaled image) that a pretty self-explanatory once you find thetools. The “Annotations and Measurements” toolbox can be found in the lower lefthand side of the screen beneath the “CoolSNAP ES Settings” and “LUTs” toolboxes.Sometimes this toolbox accidently gets closed. To view it again go to the “Measure”tab at the top of the screen and select the measurement you would like to make.ii. One nice feature of the “Annotations and Measurements” toolbox is that it will keep track of any measurements or counts that you have made in an Excel Spreadsheetacross a set of pictures. This spreadsheet can be exported and saved.b. Saving an image with annotationsRemember: In NIS Elements, annotations act like layers (or overlays) in an image. In order to have the scale bar appear on your saved image you first need to insert the overlay bygoing to the “Edit” tab, then select “Insert Overlay”. You can now save the image according to the instructions in section 5B above. Note: It is recommended to save your annotated image as a new file name so you always have your original image to go back to.。

Eclipse Model 2220 SE 箭头板操作手册及配件指南说明书

Eclipse Model 2220 SE 箭头板操作手册及配件指南说明书

REVISED OCTOBER 2010ECLIPSEMODEL 2220/SEOPERATOR ANDPARTS MANUALALLMAND BROTHERS INC.P.O. BOX 888HOLDREGE, NE 68949PART NO. 103410PHONE: (308) 995- 4495, 1- 800- 562- 1373ALLMAND FAX: (308) 995– 5887ALLMAND PARTS DEPT. FAX : (308) 995– 4883 ECLIPSE MODEL 2220/SEECLIPSE 2220/SE BLANK PAGELimited Warranty Arrowboard Addendum 4/08ARROWBOARD LIMITED WARRANTY ADDENDUMTHIS WARRANTY ADDENDUM IS IN ADDITION TO THE BASIC ALLMANDLIMITED WARRANTY OF THREE (3) YEARS AFTER DELIVERY TO THEORIGINAL PURCHASER.Subject to the foregoing the manufacturer, Allmand Bros. Inc. hereby warrants thefollowing components manufactured by Allmand Bros. Inc., to be free from defects inmaterial and workmanship from date of manufacture for the following:No representative, dealer or distributor of the company is authorized to make any changesor exceptions to this warranty unless expressly authorized in writing from themanufacturer. All warranty claims must be filed within thirty (30) days of failure.Please call the Allmand Service and Warranty Department for specific manufacturer’swarranty terms and schedules. All warranties subject to change without notice.Allmand Bros. Inc. PO Box 888 1502 West 4th Ave Holdrege, NE 68949 800-562-1373 / 308-995-4495 Fax 308-995-5887 / ECLIPSE 2220/SE BLANK PAGEREVISED APRIL 2011NOTE: NS = NOT SHOWN. WHEN ORDERING, SPECIFY THE COLOR WANTED ON PARTS CONTAINING THE LETTER “P”.NOTE: NS = NOT SHOWN. WHEN ORDERING, SPECIFY THE COLOR WANTED ON PARTS CONTAINING THE LETTER “P”.JACK STANDSECLIPSE 2220/SE 3/17/2011BOLT ON JACK STANDS (OPTIONAL)ECLIPSE 2220/SE 3/17/2011FENDERSECLIPSE 2220/SE 3/17/2011ON BOARD BATTERY CHARGER OPTIONECLIPSE 2220/SE 3/17/2011BATTERY HOOD & COVERECLIPSE 2220/SE 3/17/2011TRUNK LID & BATTERY SEPERATOR OPTIONECLIPSE 2220/SE 3/17/2011WINCHECLIPSE 2220/SE 3/17/2011 NS - 712533 CABLE ASSEMBLY 3/16 X 180TAIL LIGHTSECLIPSE 2220/SE 3/17/2011HOOD LATCH & PINSECLIPSE 2220/SE 3/17/2011SWING ARMECLIPSE 2220/SE 3/17/2011DOUBLE SOLAR PANEL LIFTECLIPSE 2220/SE 3/17/2011SIGN FRAME AND REAR PANELECLIPSE 2220/SE 3/17/2011ALT 15 LIGHT LED FRONT PANELECLIPSE 2220/SE 3/17/2011APF 25 LED FRONT PANELECLIPSE 2220/SE 3/17/2011SIGN BOARD HARDWAREECLIPSE 2220/SE 3/17/2011。

Eclipse+maven+nexus操作指南

Eclipse+maven+nexus操作指南

Eclipse + Maven + Nexus (操作手册)2010-12-21目录MA VEN (3)M AVEN简介 (3)M AVEN下载和运行 (3)M AVEN命令 (3)ECLIPSE + MA VEN (5)安装M2ECLIPSE插件 (5)配置ECLIPSE (6)NEXUS (11)N EXUS简介 (11)N EXUS下载和运行 (11)E CLIPSE +M AVEN +N EXUS (13)附录: (15)N EXUS使用指南 (15)登陆 (15)代理Maven中央仓库 (15)管理本地Maven仓库 (17)管理Maven仓库组 (18)搜索构件 (19)部署构件至Nexus (21)总结 (23)参考文献 (24)MavenMaven简介Maven是基于项目对象模型(POM),可以通过一小段描述信息来管理项目的构建,报告和文档的软件项目管理工具。

如果你已经有十次输入同样的Ant targets来编译你的代码、jar或者war、生成javadocs,你一定会自问,是否有一个重复性更少却能同样完成该工作的方法。

Maven便提供了这样一种选择,将你的注意力从作业层转移到项目管理层。

Maven项目已经能够知道如何构建和捆绑代码,运行测试,生成文档并宿主项目网页。

Maven下载和运行最新版本的Maven可在/download.html下载。

Maven只需要解压并配置环境变量即可运行。

例如,将apache-maven-2.2.1.zip解压到D盘下(D:\ apache-maven-2.2.1)。

则我们配置环境变量:添加M2_HOME值为D: \apache-maven-2.2.1,在Path下添加“%M2_HOME%\bin”即可。

要验证Maven 是否可用,可在『开始』点击『运行』键入“cmd”进入命令界面,在命令行中输入“mvn -v”,若出现Maven的版本号(如图1),则表示配置成功,可以使用Maven 了。

Eclipse插件之Spring IDE使用及spring包讲解

Eclipse插件之Spring IDE使用及spring包讲解
这个 jar 文件为 Spring 核心提供了大量扩展。能找到使用 Spring ApplicationContext 特性时所需的全 部类,JDNI 所需的全部类,UI 方面的用来和模板(Templating)引擎如 Velocity、FreeMarker、JasperReports 集成的类,及校验 Validation 方面的相关类。
除了 spring.jar 文件,Spring 还包括有其他 13 个独立的 jar 包,各自包含着对应的 Spring 组件,用户 能根据自己的需要来选择组合自己的 jar 包,而不必引入整个 spring.jar 的所有类文件。
spring-core.jar
这个 jar 文件包含 Spring 框架基本的核心工具类,Spring 其他组件要都要使用到这个包里的类,是其 他组件的基本核心,当然你也能在自己的应用系统中使用这些工具类。
相关需求
注意:为了让 Spring IDE 插件能够显示可视化的 Bean 结构图像及 Bean 之间的依赖关系,需要 Eclipse GEF(Graphical Editing Framework)的支持,自己下载并解压安装,安装技巧同上《Eclipse 使用技巧之插 件管理》。
Spring 1.2 系列当前最新的稳定版本为 1.2.8,下载时能选择包含 Spring 所依赖的一些开源包的文件 spring-framework-1.2.8-with-dependencies.zip,如果你已清晰并有了 Spring 所依赖的相关开源包,就独 立下载 spring-framework-1.2.8.zip 即可。建议下载前者。
解决方法:
Spring IDE 是 Spring 官方网站推荐的 Eclipse 插件,可提供在研发 Spring 时对 Bean 定义文件进行验 证并以可视化的方式查看各个 Bean 之间的依赖关系等。
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矿产资源开发利用方案编写内容要求及审查大纲
矿产资源开发利用方案编写内容要求及《矿产资源开发利用方案》审查大纲一、概述
㈠矿区位置、隶属关系和企业性质。

如为改扩建矿山, 应说明矿山现状、
特点及存在的主要问题。

㈡编制依据
(1简述项目前期工作进展情况及与有关方面对项目的意向性协议情况。

(2 列出开发利用方案编制所依据的主要基础性资料的名称。

如经储量管理部门认定的矿区地质勘探报告、选矿试验报告、加工利用试验报告、工程地质初评资料、矿区水文资料和供水资料等。

对改、扩建矿山应有生产实际资料, 如矿山总平面现状图、矿床开拓系统图、采场现状图和主要采选设备清单等。

二、矿产品需求现状和预测
㈠该矿产在国内需求情况和市场供应情况
1、矿产品现状及加工利用趋向。

2、国内近、远期的需求量及主要销向预测。

㈡产品价格分析
1、国内矿产品价格现状。

2、矿产品价格稳定性及变化趋势。

三、矿产资源概况
㈠矿区总体概况
1、矿区总体规划情况。

2、矿区矿产资源概况。

3、该设计与矿区总体开发的关系。

㈡该设计项目的资源概况
1、矿床地质及构造特征。

2、矿床开采技术条件及水文地质条件。

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