大规模集成电路制造执行系统IC MES

(QR)
e-Commerce (EC)
Customer Relation Management (CRM)
Supply Chain Management (SCM)
Enterprise Resource Planning (ERP)
Procurement Execution System (PES)
[Source : ITRS 2003]
Improvement for Semiconductor challenge in ITRS
Cost per unit area of silicon—Manufacturing cost per unit area of
silicon is a easure of productivity. The capital cost of a factory has grown significantly each year, from $50M US in the 1980s to over $3B US in 2003.2
CAD
CAE
CAPP
Manufacturing
CAM
MES
MCS
Quick Response
(QR)
e-Commerce (EC)
Customer Relation Management (CRM)
电子化应用系统 (III)
基础发展环境
企业智财BIC / 知识管理KM
供应面
需求面
供应链管理 SCM
企业资源规划 ERP
工程数据管理 PDM
制造执行系统 MES
顾客关系管理 CRM
电子商务平台/网站应用程序伺服软件/应用程序伺服软件 EC Platform / WEB Application Server/ Application Server
What is IC industry
IC Manufacturing Process (I)
Extendibility, Flexibility and Scalability
Reuse of factory information and control systems. Factory systems that support rapid process and technology changes.
900A
SiN 500A
SiN 300A
M2 (Cu)
900A
SiN 500A
M1 (Cu)
SiN 300A
600A
HDP PSG5.5KA
SiN 400A
M3 (3.5K) FSG 2.3KA (4.2KA)
Via2 FSG 4.9KA
M2 (3.5K) FSG 2.3KA (4.2KA)
Via1 FSG 4.9KA
产业活动
策略规划
行销
行
品 工程与研发 生产规划
政 支
质
厂区控制 工
持 与 管 理
（生产）工厂自动化
程
配送
维修与服务
产业电子化活动
供應商之 供應商
供應商
主企業
顧客
顧客之 顧客
營業
營業
營業
工程研發
工程研發
工程研發
採購 生產 配銷 採購
生產
配銷 採購 生產 配銷
行政支援
行政支援
行政支援
电子化应用系统 (I)
Factory and Process Optimization
Increased customer expectation to meet on time deliver. Increased urgency for improved factory effectiveness. High factory yield at start-up. Reduce wafer and product costs.
供應商之 供應商
供應商
EC/QR
主企業 EC/QR
顧客
顧客之 顧客
EC/QR
CE/PDM
CE/PDM
CE/PDM
PES/CSM MES SCM PES/CSM MES
SCM PES/CSM MES SCM
ERP
ERP
ERP
电子化应用系统 (II)
Knowledge Management
Quick Response
Complexity Management
Rapid changes to business needs and demands. Increasing process and product complexity. Larger wafers and carriers. Increased reliance on factory information and control systems.
Enterprise Information Management (PIM)
。 Product Data
Management (PDM)
Enterprise Document Management
(EDM)
Component & Supplier
Management (CSM)
Engineering
大规模集成电路 制造执行系统 IC MES
ENGINELEAD
OUTLINE
• 产业Operation • 产业e化架构 • Manufacturing Sequence Flow • Why MES (factory operation point of view) • Why MES (Industry point of view) • MES 定义 • MES 功能 • MES 架构 • MES 技术 • MES 与其它e 化系统的整合
Time to ramp a factory to high-volume production with high
yields—Decreasing time to ramp a factory to high volume production and high yield has more economic impact than reducing operating costs. New factories must be built and ramped to mature production at a much faster rate as reflected in Tables 86 and 89. Existing factories must be upgraded faster without impacting ongoing production.
(IMD1~6=4.5KA)
M1 (2.6K) FSG 1.7KA (2.9KA)
W-Plug
STI
IC Manufacturing Process (IV)
IC Manufacturing Process Management (1)
• 整合4M (Man, Machine, Material and Method) 以最短的时间及最少的成本产出最好质量的产品.
• Cost • Cycle Time • Yield • Productivity
IC Manufacturing Process Management (2)
• There are 30-50 basic routes for production FAB • There are 500-1000 product routes in one FAB • There are 3000 tools monitoring routes in one FAB • There are 500-1000 production tools in one FAB • There are 1K wafers start in one FAB • There are daily 80K track-in-out in one FAB • There are daily 15M transactions in one FAB • There are average daily 600 people operation in one FAB • There are daily 1-2K tool monitoring operation in one FAB • There are average 10K control/dummy wafers in one FAB • There are average 14K SPC charts used in one FAB • There are 20K real-time tool monitoring charts in one FAB • There are average 4000 tool alarms in one FAB • There are average 2K final wafer test data files generated
FILM Wafer
光阻 FILM Wafer
光阻去除
光阻去除(PR remove)
将光阻去除后就是我们所需的 图形(PATTERN)
图释
Wafer
光罩 光阻 FILM Wafer
IC Manufacturing Process (III)
AlCu 12KA
SiN 750A SiN 300A
SiN 500A SiN 300A
1.化学气相沉积(CVD) 2.金属溅镀(PVD) 3.扩散(Diffusion)
FILM Wafer
黄光(PHOTO)
1.光罩(MASK) 2.光阻(Coater) 3.曝光(Exposure) 4.显影(Development)