COB_wire_bonding原理介绍

WIRE BOND PROCESS INTRODUCTION

CONTENTS

ÂASSEMBLY FLOW OF PLASTIC IC ÂWire Bond 原理

ÂM/C Introduction

ÂWire Bond Process

ÂMaterial

ÂSPEC

ÂCalculator

ÂDEFECT

晶片Die金線Gold Wire

導線架

Wafer Grinding Die Bonding

Wafer Saw toaster

Molding Laser Mark Wire Bonding Die Surface

Coating

Wire Bond 原理

Ball Bond ( 1st Bond )Wedge Bond ( 2nd Bond )

PRESSURE

VIBRATION

GOLD BALL

Al

SiO2

Si

銲接條件

ÂHARD WELDING

ÂPressure (Force)

ÂAmplify & Frequecy

ÂWelding Time (Bond Time)ÂWelding Tempature(Heater)ÂTHERMAL BONING

ÂThermal Compressure

ÂUltrasonic Energy (Power)

Bond Head ASSY

•Low impact force

•Real time Bonding Force monitoring

•High resolution z-axis position with 2.5 micron per step resolution

•Fast contact detection

•Suppressed Force vibration

•Fast Force response

•Fast response voice coil wire clamp

X Y Table •Linear 3 phase AC Servo motor

•High power AC Current Amplifier

•DSP based control platform

•High X-Y positioning accuracy of +/-1 mm •Resolution of 0.2 mm

W/H ASSY •changeover

•·Fully programmable indexer & tracks

•·Motorized window clamp with soft close feature

•·Output indexer with leadframe jam protection feature

•Tool less conversion window clamps and top plate enables fast device

•Bonding System

•Bonding Method ÎThermosonic (TS)

•BQM Mode ÎConstant Current, Voltage, Power and Normal

(Programmable)

•Loop Type ÎNormal, Low, Square & J

•XY Resolution Î0.2 um

•Z Resolution (capillary travelling motion)Î2.5 um •Fine Pitch Capability Î35 mm pitch @ 0.6 mil wire •No. of Bonding Wires Îup to 1000

•Program Storage Î1000 programs on Hard Disk

•Multimode Transducer System Î

Programmable profile, control and vibration modes

MACHINE SPECIFICATIONS (I)

•Vision System

•Pattern Recognition Time Î70 ms / point

•Pattern Recognition Accuracy Î+ 0.37 um

•Lead Locator Detection Î12 ms / lead

(3 leads/frame)

•Lead Locator Accuracy Î+ 2.4 um

•Post Bond Inspection ÎFirst Bond, Second Bond

Wire Tracing

•Max. Die Level Different Î400 –500 um

•Facilities

•Voltage 110 VAC (optional 100/120/200/210/

•220/230/240 VAC

MACHINE SPECIFICATIONS (II)

•Material Handling System

•Indexing Speed Î200 –250 ms @ 0.5 “pitch

•Indexer Resolution Î1um

•Leadframe Position Accuracy Î+ 2 mil

•Applicable Leadframe ÎW = 17 –75 mm @ bonding area in Y = 65mm

= 17 –90 mm @ bonding area in Y = 54mm

L = 280 mm [Maximum]

T = 0.075 –0.8 mm

•Applicable Magazine ÎW = 100 mm (Maximum)

L = 140 –300 mm

H = 180 mm (Maximum)

•Magazine Pitch Î 2.4 –10 mm (0.09”–0.39 “)

•Device Changeover Î< 4 minutes

•Package Changeover Î< 5 minutes

•Number of Buffer Magazine Î3 (max. 435 mm)

MACHINE SPECIFICATIONS (III)