JESDBASolderBallShear锡球剪切力测试标准
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viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard.
by the JEDEC legal counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to
TEST METHOD B117: SOLDER BALL SHEAR
(From JEDEC Board Ballot, JCB-06-37, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.)
Printed in the U.S.A. All rights reserved
PLEASE!
DON’T VIOLATE THE LAW!
This document is copyrighted by the JEDEC Solid State Technology Association and may not be
charge for or resell the resulting material.
PRICE: Please refer to the current Catalog of JEDEC Engineering Standards and Publications online at
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.
No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met.
Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or call (703) 907-7559 or
2
Terms and definitions
shear force: The force applied to a solder ball in a direction parallel to the device planar surface. test instrument: A testing instrument used to apply shear force to a solder ball. shear tool: A rigid tool that presses directly against the solder ball during shearing (see Figure 1). The shear tool is integrated with a sensing element so that shear force can be measured. shear tool standoff: The distance between the device planar surface and the shear tool tip (see Figure 1). clamping fixture: A fixture that holds the device rigidly during solder ball shear testing (see Figure 5). shear speed: The rate at which the shear tool moves as it shears the solder ball. low speed shear: Shear speed that is typically 0.0001 – 0.0008 m/s (100 – 800 μm/s ). high speed shear: Shear speed that is typically 0.01 – 1.0 m/s, but can extend beyond this range. elapsed time after reflow: The elapsed time between solder ball shear and last reflow of solder ball. failure mode: The type or location of failure observed after the solder ball is sheared. post-stress test: Solder ball shear evaluation performed after reliability stress testing such as temperature cycling or high temperature storage
JEDEC STANDARD
Solder Ball Shear
JESD22-B117A
(Revision of JESD22-B117, July 2000) OCTOBER 2006
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
NOTICE
JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved
the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer
Test Method B117A (Revision of B117)
JEDEC Standard No. 22B117A Page 2
3
Apparatus
Hale Waihona Puke The shear force measurement equipment shall use a calibrated load cell or sensing element. Calibration shall be performed on a regular basis to ensure consistent long term accuracy. It is recommended that the maximum full scale load capability of the apparatus be at least 10% greater than the maximum measured value for ball shear on the part being tested. The apparatus can be specifically designed for solder ball shear testing, or an instrument for general load-deflection testing. The apparatus must be capable of applying and recording loads applied to the solder ball. The apparatus must be capable of applying the loads at a known displacement rate. Separate equipment may be required to perform both low and high speed shear testing.
be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting
JEDEC Solid State Technology Association 2500 Wilson Boulevard
Arlington, Virginia 22201-3834 or call (703) 907-7559
JEDEC Standard No. 22B117A Page 1
reproduced without permission.
Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact:
1
Scope
This test method applies to solder ball shear force testing prior to end-use attachment. Solder balls are sheared individually; force and failure mode data are collected and analyzed. Both low and high speed testing are covered by this document.
Published by ©JEDEC Solid State Technology Association 2006
2500 Wilson Boulevard Arlington, VA 22201-3834
This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual agrees not to
by the JEDEC legal counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to
TEST METHOD B117: SOLDER BALL SHEAR
(From JEDEC Board Ballot, JCB-06-37, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.)
Printed in the U.S.A. All rights reserved
PLEASE!
DON’T VIOLATE THE LAW!
This document is copyrighted by the JEDEC Solid State Technology Association and may not be
charge for or resell the resulting material.
PRICE: Please refer to the current Catalog of JEDEC Engineering Standards and Publications online at
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.
No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met.
Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or call (703) 907-7559 or
2
Terms and definitions
shear force: The force applied to a solder ball in a direction parallel to the device planar surface. test instrument: A testing instrument used to apply shear force to a solder ball. shear tool: A rigid tool that presses directly against the solder ball during shearing (see Figure 1). The shear tool is integrated with a sensing element so that shear force can be measured. shear tool standoff: The distance between the device planar surface and the shear tool tip (see Figure 1). clamping fixture: A fixture that holds the device rigidly during solder ball shear testing (see Figure 5). shear speed: The rate at which the shear tool moves as it shears the solder ball. low speed shear: Shear speed that is typically 0.0001 – 0.0008 m/s (100 – 800 μm/s ). high speed shear: Shear speed that is typically 0.01 – 1.0 m/s, but can extend beyond this range. elapsed time after reflow: The elapsed time between solder ball shear and last reflow of solder ball. failure mode: The type or location of failure observed after the solder ball is sheared. post-stress test: Solder ball shear evaluation performed after reliability stress testing such as temperature cycling or high temperature storage
JEDEC STANDARD
Solder Ball Shear
JESD22-B117A
(Revision of JESD22-B117, July 2000) OCTOBER 2006
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
NOTICE
JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved
the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer
Test Method B117A (Revision of B117)
JEDEC Standard No. 22B117A Page 2
3
Apparatus
Hale Waihona Puke The shear force measurement equipment shall use a calibrated load cell or sensing element. Calibration shall be performed on a regular basis to ensure consistent long term accuracy. It is recommended that the maximum full scale load capability of the apparatus be at least 10% greater than the maximum measured value for ball shear on the part being tested. The apparatus can be specifically designed for solder ball shear testing, or an instrument for general load-deflection testing. The apparatus must be capable of applying and recording loads applied to the solder ball. The apparatus must be capable of applying the loads at a known displacement rate. Separate equipment may be required to perform both low and high speed shear testing.
be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting
JEDEC Solid State Technology Association 2500 Wilson Boulevard
Arlington, Virginia 22201-3834 or call (703) 907-7559
JEDEC Standard No. 22B117A Page 1
reproduced without permission.
Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact:
1
Scope
This test method applies to solder ball shear force testing prior to end-use attachment. Solder balls are sheared individually; force and failure mode data are collected and analyzed. Both low and high speed testing are covered by this document.
Published by ©JEDEC Solid State Technology Association 2006
2500 Wilson Boulevard Arlington, VA 22201-3834
This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual agrees not to