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▪ OSC splitting functions as
Add / Drop of the OSC channel using wavelength selective couplers Splitting of monitor signals at the input and output port and at intermediate
Siemens Reliability Process Overview
Optical Components: • EDFA • VOA • GTC • Passives
Electrical Components: • Resistors • Capacitors • Transistors • ICs • etc.
hiT 7500 Multi-Haul DWDM system Product Reliability Update Processes, Status, and Measures
Sept 15, 2004 M. Chbat, S. Eberlin, M. Tochtermann, T. Juhnke
Information and Communication Networks
Predicted FIT rates vs. field return FIT rates
▪ Field return FIT rate inherently is (!) lower than predicted FIT rate
spare parts don’t contribute to FMA non-installed equipment at certain carriers low channel count for many years temperature for FIT estimation probably higher than in reality margin (e.g., due to low channel count, low PMD, BOL) can
product delivered
in production failure control field return analysis & threshold monitoring conservative data based on predicted values regular component supplier audits
Information and Communication Networks
Reliability Control and Improvement
▪ Cross-functional team established to install focused program ▪ Close interaction with the supplier for design, technology and process ▪ Early failure monitoring and feedback in development phase ▪ Extended testing including temperature cycling in production ▪ Detailed failure monitoring in production for early corrective action
Reference : Siemens standard; in agreement with international standards IEC 61709
product definition
requirements aligned with technology basis failure rate allocation to individual cards involvement of component engineering & QA
Mechanical Components: • Connectors • Boards • etc.
Negotiations with suppliers: • Modeling • Field experience • Supplier comparison
Standards: • SN 29500 • IEC 61709
measurement points
▪ Spectral shaping of the signal using a
VOA for setting the EDFA to an optimized operating point GTC for tilt compensation
▪ Optical monitor ports at input and output for signal supervision ▪ APSD circuitry ▪ Gain Control and Supervision (DSP, on-board processor) ▪ Electrical components for control and power supply ▪ Mechanics including PCB
Card FIT Rate
Standards: • SN 29500 • IEC 61709
Feedback from Field Return Rate
Information and Communication Networks
Product Reliability Assurance Process
product develFra Baidu bibliotekpment
card failure rates on basis of parts lists component rating by design new & critical components specification new components & supplier audits
mask performance degradation
Information and Communication Networks
Functional Partition of OLI
▪ Optical amplification via EDFA gain block
Pump diodes Monitor diodes EDF-Heater Internal Gain Switch
Add / Drop of the OSC channel using wavelength selective couplers Splitting of monitor signals at the input and output port and at intermediate
Siemens Reliability Process Overview
Optical Components: • EDFA • VOA • GTC • Passives
Electrical Components: • Resistors • Capacitors • Transistors • ICs • etc.
hiT 7500 Multi-Haul DWDM system Product Reliability Update Processes, Status, and Measures
Sept 15, 2004 M. Chbat, S. Eberlin, M. Tochtermann, T. Juhnke
Information and Communication Networks
Predicted FIT rates vs. field return FIT rates
▪ Field return FIT rate inherently is (!) lower than predicted FIT rate
spare parts don’t contribute to FMA non-installed equipment at certain carriers low channel count for many years temperature for FIT estimation probably higher than in reality margin (e.g., due to low channel count, low PMD, BOL) can
product delivered
in production failure control field return analysis & threshold monitoring conservative data based on predicted values regular component supplier audits
Information and Communication Networks
Reliability Control and Improvement
▪ Cross-functional team established to install focused program ▪ Close interaction with the supplier for design, technology and process ▪ Early failure monitoring and feedback in development phase ▪ Extended testing including temperature cycling in production ▪ Detailed failure monitoring in production for early corrective action
Reference : Siemens standard; in agreement with international standards IEC 61709
product definition
requirements aligned with technology basis failure rate allocation to individual cards involvement of component engineering & QA
Mechanical Components: • Connectors • Boards • etc.
Negotiations with suppliers: • Modeling • Field experience • Supplier comparison
Standards: • SN 29500 • IEC 61709
measurement points
▪ Spectral shaping of the signal using a
VOA for setting the EDFA to an optimized operating point GTC for tilt compensation
▪ Optical monitor ports at input and output for signal supervision ▪ APSD circuitry ▪ Gain Control and Supervision (DSP, on-board processor) ▪ Electrical components for control and power supply ▪ Mechanics including PCB
Card FIT Rate
Standards: • SN 29500 • IEC 61709
Feedback from Field Return Rate
Information and Communication Networks
Product Reliability Assurance Process
product develFra Baidu bibliotekpment
card failure rates on basis of parts lists component rating by design new & critical components specification new components & supplier audits
mask performance degradation
Information and Communication Networks
Functional Partition of OLI
▪ Optical amplification via EDFA gain block
Pump diodes Monitor diodes EDF-Heater Internal Gain Switch