MICRO USB SPEC 及测试资料

SPEC-USB2.0规范及测试标准

PRODUCT SPECIFICATION SPEC.NO. SPEC-USB 2.0Approved Date 02-26-2001 Name PRODUCT SPECIFICATION Amended Date 05-29-2003TYPEPLUG&RECEPTACLE Page 1 Sum To 8 PagesA&BTitle USB2.0１．SCOPEThis specification covers performance, methods and quality requirements forUniversal Serial Bus (USB) plug and receptacle connectors. These connectorsare cable mounted plug and printed circuit board mounted receptacle connectors.2. REQUIREMENTS2.1 Design and ConstructionProduct shall be of the design , construction and physical dimensions specifiedThe in applicable product drawing.2.2 Materials and PlatingThey are specified on applicable product drawing.2.3 RatingsA.Voltage: 30 VAC (rms)B.Current: 1.5A per contact, not to exceed 30℃ temperature riseC.Operating temperature: -20℃ to +85℃D.Storage temperature: -25℃ to +85℃E.Nominal Temperature Rating: +20℃2.4 Test Requirements and Procedures SummaryD Amended 05-29-2003Check Director Tab C Amended 10-17-2001A Approved 02-26-2001陈永飞Description DateItem ChangePRODUCT SPECIFICATIONSPEC.NO. SPEC-USB 2.0Approved Date 02-26-2001 NamePRODUCT SPECIFICATIONAmended Date05-29-2003Title USB2.0 A&B TYPE PLUG&RECEPTACLE Page 2 Sum To 8 PagesNote:Shall meet visual requirements ,show no physical damage ,and shall meet requiremFigure 1 (conn.)Test DescriptionRequirement ProcedureLow level contact resistance for Lower and Middle stack 30mΩ maximum initial EIA 364-23 Subject mated contacts assembled in housing to 20 mV maximum open circuit at 100 mA maximum. See figure ALow level contact resistance for Upper stack 50mΩ maximum initial EIA 364-23 Subject mated contacts assembled in housing to 20 mV maximum open circuit at 100 mA maximum. See figure AInsulation resistance 1000 MΩ minimum EIA 364 – 21 Test voltage 500±50V/DC between adjacent contacts of mated and unmated connector assemblies.Dielectric withstanding Voltage No flashover&sparkover&excess leakage&breakdownEIA 364 – 20 Test voltage 500V/AC between adjacent contacts of mated and unmated connector assemblies.Vibration , random No discontinuities of 1u s orLonger duration.See Note.EIA 364 – 28A-83 Condition V Test Letter A. Subject mated connectors to 5.35 G's rms. 15 minutes in each of three mutually perpendicular planes ,See Figure B.Physical shock No discontinuities of 1u s or Longer duration.See Note. EIA 364 – 27 Condition H. Subject mated connectors to 30 Gs half-sine shock' pulses of 11 ms duration. three shocks in each direction applied along three mutually perpendicular planes ,18 total shocks ,See Figure C first test setup.Durability Contact Resistance:10 mΩ maximum change from initial value. EIA 364 – 09. 1500cycles insertion/extraction at a maximum rate of 200cycles per hour, then see note. Solderability USB contact solder tails shall pass95% coverage after one hour steam aging as specified in category 2.EIA364--52Cable pull-out Applied a load of 40 Newtons for one minute.EIA364-38 Test condition APRODUCT SPECIFICATION SPEC.NO. SPEC-USB 2.0Approved Date 02-26-2001 Name PRODUCT SPECIFICATION Amended Date 05-29-2003 Title USB2.0A&BTYPEPLUG&RECEPTACLE Page 3 Sum To 8 Pages Test Description Requirement ProcedureMating force 35 Newtons maximumEIA 364 – 13 Measure forcenecessary to mate connector Assembliesat maximum rate of 12.5 mm/min.Unmating force 10 Newtons minimumEIA 364 – 13 Measure forcenecessary to unmate connectorassemblies at maximum rate of 12.5mm/min.Thermal shock Contact Resistance:10 mΩ maximumchange from initial value.EIA 364 –32 Test Condition I.10Cycles –55℃ and +85℃,The USBconnectors under test must be mated.Critical Dimension 8 total measurement within tolerance.EIA 364-18Humidity Life Contact Resistance:10 mΩ maximumchange from initial value. The USB connectors under test must betested in accordance with EIA 364 – 31Condition A. method Ш. 168 Hours minimum (seven complete cycles).Temperature life Contact Resistance:10 mΩ maximumchange from initial value. See NoteEIA 364 – 17A-87 Condition 2 MethodA. Subject mated connectors totemperature Life at 85℃ for 250 hoursMixed Flowing Gas See NoteEIA 364-65-92 Class II, Exposures(1)U nmated for 1 day(2)M ated for 10 dayFlammability Require its thermoplastic resin vendorto supply a detailed C of C with eachresin shipment. The C of C shallclearly show the resin’s UL listingnumber, lot number, date code, etc.UL 94 v-0Note:Shall meet visual requirements ,show no physical damage ,and shall meet requirement.Figure 1 (conn.)PRODUCT SPECIFICATION SPEC.NO. SPEC-USB 2.0Approved Date 02-26-2001 Name PRODUCT SPECIFICATION Amended Date 05-29-2003 Title USB2.0A&BTYPEPLUG&RECEPTACLE Page 4 Sum To 8 Pages Test Description Requirement ProcedureContact capacitance 2 pF maximum unmated percontact.EIA 364 –30The object of this test is to detail a standardmethod to determine the capacitance betweenconductive elements of a USB connector.Contact current rating 1.5A at 250vAC minimumwhen measured at an ambienttemperature of 25℃, withpower applied to the contacts,the temperature change shallnot exceed +30 at any point inthe USB connector under test.EIA 364 – 70—method BThe object of this test procedure is to detail astandard method to assess the currentcarrying capacity of mated USB connectorcontacts.Differential impedance 90±15%Ω(76.5~~103.5Ω)Connect the Time Domain Reflectometer(TDR). TDR is setup the differential mode.Common mode impedance 30±30%Ω(21~~39Ω)Connect the Time Domain Reflectometer(TDR). TDR is setup the differential mode.Propagation Delay 26ns(maximum for full speed cable)Connect the Time Domain Reflectometer(TDR). TDR is setup the differential mode.Propagation delay skew 100ps/cable(maximum for full speed cable)Connect the Time Domain Reflectometer (TDR). TDR is setup the differential mode.Signal pair attenuation (Maximum) 0.064 MHz 0.08 dB/Cable1. Connect the Network Analyzer output port(port1) to the input connector on theattenuation test fixture(note).2. Connect the series “A” plug of the cable obe tested to the test fixture, leaving theother end open-circuited.3.Calibrate the network analyzer andfixture using the appropriate calibrationstandards over the desired frequencyrange.0.256 MHz 0.11 dB/Cable0.512 MHz 0.13 dB/Cable0.772 MHz 0.15 dB/Cable1.000 MHz 0.20 dB/Cable4.000 MHz 0.39 dB/Cable8.000 MHz 0.57 dB/Cable12.00 MHz 0.67 dB/Cable24.00 MHz 0.95 dB/Cable48.00 MHz 1.35 dB/Cable96.00 MHz 1.90 dB/Cable200.00 MHz 3.2 dB/Cable400.00 MHz 5.8 dB/CableNote: Shall meet visual requirements ,show no physical damage ,and shall meet requirementFigure 1 (conn.)PRODUCT SPECIFICATION SPEC.NO. SPEC-USB 2.0Approved Date 02-26-2001 Name PRODUCT SPECIFICATION Amended Date 05-29-2003 Title USB2.0A&BTYPEPLUG&RECEPTACLE Page 5 Sum To 8 Pages 2.5 Product qualification test sequence:Test ExaminationTest Group (a)1 2 3 4 5 6 8Test Sequence (b)Examination 1,10 1,6 1,6 1,9 1,3 1,6 1,3 Low level contactresistance3,7 2,5 2,5Capacitance 2Critical Dimension 2 Insulation resistance 3,7DWV 4,8Vibration 5Physical shock 6Durabillity 4 3 3Mating and unmatingforce2,8Thermal shock 5Humidity 6Temperature life 4Cable pull-out 9Mixed Flowing Gas 4Solderability 2Impedance 2Attenuation 3 Propagation delay 4Skew 5Number of samplesPlug 8pcs 8pcs 8pcs 8pcs 5pcs 5pcs 8pcs socket 8pcs 8pcs 8pcs 8pcs 5pcs 5pcs8pcs3. Sample Selection:Samples shall be prepared in accordance with applicable manufacturers instructions and shall be selected at random form current productions.PRODUCT SPECIFICATIONSPEC.NO. SPEC-USB 2.0Approved Date 02-26-2001 Name PRODUCTSPECIFICATION Amended Date05-29-2003TitleUSB2.0 A&B TYPE PLUG&RECEPTACLEPage 8 Sum To 8 Pages1.0 USB connector termination data:provide the standardized contact terminating assignments by number and electricalvalue for series “A” and series “B” connectors.1.1 USB connector termination assignment:Contact numberSignal nameTypical wiring Assignment1 Vbus Red2 D- White3 D+ Green4 GND Black shell Shield Drain Wire。

Micro-USB行业标准规范

Universal Serial Bus Micro-USB Cables and ConnectorsSpecificationRevision 1.01April 4, 2007Revision HistoryDate Comment Revision Issue0.6 1/30/2006 Revisions to all sections0.7 3/24/2006 Added revised Micro-USB drawings to Rev.0.80.8 4/19/2006 Editorial changes and additions by Jan Fahllund (Nokia)Corrections to the 0.8 version (based by comments from contributors)0.8b 4/26/2006Corrections based on comments from the 0.8b version0.9 6/7/20061.0RC 8/2/2006 Added lubricant recommendation, LLRC delta change specified1.01RC 11/10/2006 Editorial changes and addition based on Oct-06 USB-IF CCWGmeeting.1.02RC 12/10/2006 Shell material thickness tolerances changed so that material can be0.25 mm or 0.3 mm; edited three pictures (Figure 4-10, 4-11 and 4-12).1.03RC 12/11/2006 Two pictures edited (Figure 4-8 and 4-9). In fig 4-8 max height to be2.8mm MAX. In fig 4-9 R0.25mm MAX to be R0.30mm MAX.1.0RC3 12/19/2006 For BoD approvalApproved1.0 1/12/20071.0 1/22/2007 Cosmetic edits for publication1.01 4/4/2007 Editorial corrections and additions to contributor list. Reinserted shelland plug material requirements as section 6.10. Clarified wording onPlating Recommendations.Copyright © 2007 USB Implementers Forum, Inc. (USB-IF).All rights reserved.A LICENSE IS HEREBY GRANTED TO REPRODUCE THIS SPECIFICATION FOR INTERNAL USEONLY. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, ISGRANTED OR INTENDED HEREBY.USB-IF AND THE AUTHORS OF THIS SPECIFICATION EXPRESSLY DISCLAIM ALL LIABILITY FOR INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, RELATING TO IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. USB-IF AND THE AUTHORS OF THISSPECIFICATION ALSO DO NOT WARRANT OR REPRESENT THATSUCH IMPLEMENTATION(S) WILL NOT INFRINGE THE INTELLECTUAL PROPERTY RIGHTS OF OTHERS.THIS SPECIFICATION IS PROVIDED "AS IS" AND WITH NO WARRANTIES, EXPRESS ORIMPLIED, STATUTORY OR OTHERWISE. ALL WARRANTIES ARE EXPRESSLY DISCLAIMED. NO WARRANTY OF MERCHANTABILITY, NO WARRANTY OF NON-INFRINGEMENT, NO WARRANTY OF FITNESS FOR ANY PARTICULAR PURPOSE, AND NOWARRANTY ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE.IN NO EVENT WILL USB-IF OR USB-IF MEMBERS BE LIABLE TO ANOTHER FOR THE COST OF PROCURING SUBSTITUTE GOODS OR SERVICES, LOST PROFITS, LOSS OF USE, LOSS OF DATA OR ANY INCIDENTAL, CONSEQUENTIAL, INDIRECT, ORSPECIAL DAMAGES, WHETHER UNDER CONTRACT, TORT, WARRANTY, OR OTHERWISE, ARISING IN ANY WAY OUT OF THE USE OF THIS SPECIFICATION, WHETHER OR NOT SUCHPARTY HAD ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.All product names are trademarks, registered trademarks, or service marks of their respective owners.ContributorsMark Rodda, (editor) Motorola Kevin Fang, Longwell ElectronicsJan Fahllund, (editor) Nokia Morgan Jair, Main Super Co.Jim Koser, (CCWG Chairman), Foxconn Tom Kawaguchi, Matsushita Electric Works Glen Chandler, Advanced-Connectek (Acon) Ron Ward, Matsushita Electric Works Charles Wang, Advanced-Connectek (Acon) Satoshi Yamamoto, Matsushita Electric Works Toshinori Sasaki, Across Techno Yasuhiko Shinohara, MitsumiMinoru Ohara, Allion Atsushi Nishio, MitsumiBrad Brown, ATL Hitoshi Kawamura, MitsumiChristopher Mattson, ATL Scott Sommers, MolexMarcus Darrington, ATL Kevin Delaney, MolexJaremy Flake, ATL Technology Kieran Wright, MolexGeorge Olear, Contech Research Padraig McDaid, MolexRoy Ting, Elka Mikko Poikselka, MolexSophia Liu, ETC Sam Liu, Newnex Technology Corp.Bill Northey, FCI Richard Petrie, NokiaTsuneki Watanabe, Foxconn Kai Silvennoinen, NokiaJim Zhao, Foxconn Panu Ylihaavisto, NokiaDavid Ko, Foxconn Arthur Zarnowitz, PalmJong Tseng, Foxconn Douglas Riemer, SMKJack Lu, Foxlink Eric Yagi, SMKTim Chang, Foxlink Abid Hussain, Summit Microelectronics Sathid Inthon, Fujikura Kaz Osada, TycoToshi Mimura, Fujijura Masaru Ueno, TycoAlan Berkema, Hewlett-Packard Yoshikazu Hirata, TycoKarl Kwiat, Hirose Ed Beeman, USB Implementers Forum Shinya Tono, Hirose Mark Paxson, USB Implementers Forum Kazu Ichikawa, HiroseRyozo Koyama, HiroseYousuke Takeuchi, HiroseTsuyoshi Kitagawa, HosidenJim Eilers, HosidenKazuhiro Saito, JAERon Muir, JAEMark Saubert, JAEYasuhira Miya, JSTTakahiro Diguchi, JSTYoichi Nakazawa, JSTTable of Contents1Introduction (6)1.1General (6)1.2Objective of the Specification (6)1.3Intended Audience/Scope (6)1.4Related Documents (6)2Acronyms and Terms (7)3Significant Features (8)3.1USB 2.0 Specification Compliance (8)3.2On-The-Go Device (8)3.3Connectors (8)3.4Compliant Cable Assemblies (8)3.5Plug Overmolds (9)4Cables and Connectors (10)4.1Introduction (10)4.2Micro-Connector Mating (10)4.3Color Coding (11)4.4Device, Cable and Adapter Delays (11)4.5Compliant Usage of Connectors and Cables (12)4.5.1Cables (12)4.5.2Overmolds (12)4.5.3Mechanical Interfaces (12)4.5.4Surface mount standard version drawings (12)4.5.5DIP-type and Midmount-type receptacles (12)4.5.6Connector Keying (12)4.5.7Right Angle Plugs (12)4.5.8Adapters (13)4.6Drawings (13)5Electrical Compliance Requirements (33)5.1Data Rates Beyond USB 2.0 (480Mb/s -->) (33)5.2Low Level Contact Resistance (33)5.3Contact Current Rating (33)5.3.1Signal Contacts Only (2, 3, and 4) (33)5.3.2With Power Applied Contacts (1 and 5) (33)6Mechanical Compliance Requirements (34)6.1Operating Temperature Range (34)6.1.1Option I (34)6.1.2Option II (34)6.2Insertion Force (34)6.3Extraction Force (34)6.4Plating (34)6.4.1Option I (35)6.4.2Option II (35)6.5Solderability (35)6.6Peel Strength (Reference Only) (35)6.7Wrenching Strength (Reference Only) (35)6.8Lead Co-Planarity (35)6.9RoHS Compliance (36)6.10Shell & Latch Materials (36)FiguresFigure 4-1 Micro-A to Micro-B Cable (14)Figure 4-2 Standard-A to Micro-B Cable (15)Figure 4-3 Micro-A to Captive Cable (16)Figure 4-4 Micro-A Plug Overmold, Straight (17)Figure 4-5 Micro-B Plug Overmold, Straight (18)Figure 4-6 Micro-A Plug Interface (19)Figure 4-7 Micro-B Plug Interface (20)Figure 4-8 Micro-A/B Plug Interface (Cut-section) (21)Figure 4-9 Micro-AB receptacle interface (22)Figure 4-10 Micro-B receptacle interface (23)Figure 4-11 Micro-AB Receptacle Design (24)Figure4-12 Micro-B Receptacle Design (25)Figure 4-13 Micro-A Plug Blockage (26)Figure 4-14 Micro-B Plug Blockage (27)Figure 4-15 Micro-A Plug, Side Right Angle (28)Figure 4-16 Micro-A Plug, Down Right Angle (29)Figure 4-17 Micro-B Plug, Side Right Angle (30)Figure 4-18 Micro-B Plug, Down Right Angle (31)Figure 4-19 Adapter, Standard-A receptacle to Micro-A plug (32)TablesTable 4-1. Plugs Accepted By Receptacles (10)Table 4-2. Micro-A Plug Pin Assignments (10)Table 4-3. Color Coding for Plugs and Receptacles (11)Table 4-4. Maximum Delay for Micro-Connector and Cable (11)Table 4-5. Maximum Delay for Standard Connector Cable (11)1 Introduction1.1 GeneralUSB has become a popular interface for exchanging data between cell phone and portable devices. Many of these devices have become so small it is impossible to use standard USB components as defined in the USB 2.0 specification. In addition the durability requirements of the Cell Phone and Portable Devices market exceed the specifications of the current interconnects. Since Cell Phones and other small Portable Devices are the largest market potential for USB, this specification is addressing this very large market while meeting all the requirements for electrical performance within the USB 2.0 specification.1.2 Objective of the SpecificationThe purpose of this document is to define the requirements and features of a Micro-USB connector that will meet the current and future needs of the Cell Phone and Portable Devices markets, while conforming to the USB 2.0 specification for performance, physical size and shape of the Micro-USB interconnect.This is not a stand-alone document. Any aspects of USB that are not specifically changed by thisspecification are governed by the USB 2.0 Specification and USB On-The-Go Supplement.1.3 Intended Audience/ScopeCell phone and Portable Devices have become so thin that the current Mini-USB does not fit well within the constraints of future designs. Additional requirements for a more rugged connector that will have durability past 10,000 cycles and still meet the USB 2.0 specification for mechanical and electrical performance was also a consideration. The Mini-USB could not be modified and remain backward compatible to the existing connector as defined in the USB OTG specification.1.4 Related DocumentsUSB 2.0USB OTG Supplement2 Acronyms and TermsThis chapter lists and defines terms and abbreviations used throughout this specification.A-Device A device with a Type-A plug inserted into its receptacle. The A-devicesupplies power to V BUS and is host at the start of a session. If the A-device is On-The-Go, it may relinquish the role of host to an On-The-GoB-device under certain conditions,Application A generic term referring to any software that is running on a device thatcan control the behavior or actions of the USB port(s) on a device.B-Device A device with a Type-B plug inserted into its receptacle. The B-device isa peripheral at the start of a session. If the B-device is OTG, it may begranted the role of host from an OTG A-device.DIP-type A connector with contact and shield solder tails that are soldered throughthe printed circuit boardFS Full Speed (max 12Mb/s)Higher than HS (480Mb/s ---> 5 Gb/s)HS High Speed (max 480 Mb/s)Host A physical entity that is attached to a USB cable and is acting in the roleof the USB host as defined in the USB Specification, Revision 2.0. Thisentity initiates all data transactions and provides periodic Start of Frames.HNP Host Negotiation ProtocolID Identification. Denotes the pin on the Micro connectors that is used todifferentiate a Micro-A plug from a Micro-B plug.LS Low Speed (max 1,5 Mb/s)Midmount-type A connector that is mounted in a cut-out in the printed circuit boardbetween the top and bottom surfaces.OTG On-The-GoOTG device A device with the host and peripheral capabilitiesPeripheral A physical entity that is attached to a USB cable and is currentlyoperating as a “device” as defined in the USB Specification, Revision 2.0.The Peripheral responds to low level bus requests from the Host.PCB Printed circuit boardUSB Universal Serial BusUSB-IF USB Implementers Forum3 Significant FeaturesThis section identifies the significant features of the Micro-USB specification. The purpose of this section is not to present all the technical details associated with each major feature, but rather to highlight itsexistence. Where appropriate, this section references other parts of the document where further details can be found.3.1 USB 2.0 Specification ComplianceAny device with Micro-USB features is first and foremost a USB peripheral that is compliant with the USB2.0 specification.3.2 On-The-Go DeviceAny OTG Micro-USB device shall conform to the OTG requirements as set forth in the On-The-GoSupplement to the USB 2.0 Specification.3.3 ConnectorsThe USB 2.0 specification defines the following connectors:•Standard-A plug and receptacle,•Standard-B plug and receptacle, and•Mini-B plug and receptacle.The Micro-USB specification defines the following additional connectors:•Micro-B plug and receptacle• Micro-AB receptacle• Micro-A plug.The Micro-AB receptacle is only allowed on OTG products. All other uses of the Micro-AB receptacle are prohibited. The Micro-AB receptacle accepts either a Micro-A plug or a Micro-B plug.It is recommended that the Micro-AB continue to support HNP as requested and support full functionality asa peripheral when a Micro-B plug is inserted.3.4 Compliant Cable AssembliesThe USB 2.0 specification defines the following cables:•Standard-A plug to Standard–B plug,•Standard-A plug to Mini-B plug, and•Captive cable with Standard-A plug.The Micro-USB specification defines the following additional cables:•Micro-A plug to Micro-B plug,•Micro-A plug to Standard-A receptacle•Micro-B plug to Standard-A plug, and•Hardwired Captive cable with Micro-A plug. (Hardwired Captive cable is a cable, connected internally to a device, which is not designed to be removed by the end user of that device.) No other types of cables are allowed by either the USB specification, or by the OTG supplement. Cables are not allowed to have receptacles on either end unless they meet the mechanical and electricalrequirements of adapters defined in this document.3.5 Plug OvermoldsThe Micro-USB specification constrains the size and the shape of the overmolds for the Micro-A and Micro-B plugs.The Micro-A plug’s overmold has a rectangular shape, and the Micro-B plug’s overmold is rectangular with chamfers. This allows easy recognition and differentiation of the two plugs by the consumer See pictures Figure 4-4 and Figure 4-5.4 Cables and Connectors4.1 IntroductionThis chapter provides the mechanical and electrical specifications for the cables, connectors and cable assemblies used to interconnect devices as well as constraints on the design of the overmolds for the Micro-A and Micro-B plugs.4.2 Micro-Connector MatingThe following table summarizes the plugs accepted by each of the receptacles.Table 4-1. Plugs Accepted By ReceptaclesReceptacle PlugsAcceptedStandard-A Standard-AStandard-B Standard-BMini-B Mini-BMicro-B Micro-BMicro-AB Micro-A or Micro-BThe usage and wiring assignments of the five pins in the Micro-A plug are defined in the following table.Table 4-2. Micro-A Plug Pin AssignmentsContact Number Signal Name Typical WiringAssignment1 VBUS Red2 D- White3 D+ Green4 ID <Ra_PLUG_ID5 GND BlackShell Shield DrainWireThe ID pin on a Micro-A plug shall be connected to the GND pin. The ID pin on a Micro-B plug is not connected or is connected to ground by a resistance of greater than Rb_PLUG_ID (100kΩ MIN). An On-The-Go device is required to be able to detect whether a Micro-A or Micro-B plug is inserted by determining if the ID pin resistance to ground is less than Ra_PLUG_ID (10Ω MAX) or if the resistance to ground is greater than Rb_PLUG_ID . Any ID resistance less than Ra_PLUG_ID shall be treated as ID = FALSE and any resistance greater than Rb_PLUG_ID shall be treated as ID = TRUE.4.3 Color CodingThe following colors are mandated for the plastic inside the Micro-USB connectors defined in thisspecification.Table 4-3. Color Coding for Plugs and ReceptaclesConnector ColorMicro-A plug WhiteMicro-B receptacle BlackMicro-B plug BlackMicro-AB receptacle Gray4.4 Device, Cable and Adapter DelaysIn Figure 7-11 of the USB 2.0 specification, four test planes are defined along the transmission path fromthe host transceivers to the peripheral transceivers. These test planes (TP) are as follows:•TP1: pins of host transceiver chip•TP2: contact points of host Standard-A receptacle•TP3: contact points of peripheral Standard-B or Micro-B receptacle•TP4: pins of peripheral transceiver chipThe maximum total delays are as follows:•On-The-Go device - TP1 to TP2: 1 ns• Adapter: 1 ns•Any cable with a Micro-A or Micro-B plug: 10 nsThe maximum delays for the two worst cases of connection are shown in the following tables.Table 4-4. Maximum Delay for Micro-Connector and CableTimeLocation DelayUSB 2.0 Compliant Host – TP1 to TP2 3 nsStandard-A receptacle to Micro-A plug adapter 1 nsMicro-A plug to Micro-B plug cable 10 nsUSB 2.0 Compliant B-device – TP3-TP4 1 nsns Total 15Table 4-5. Maximum Delay for Standard Connector CableTimeLocation DelayOn-The-Go Compliant Device – TP1 to TP2 1 nsMicro-A plug to Standard-A receptacle adapter 1 nsStandard-A plug to Standard-B plug cable 26 nsUSB 2.0 Compliant B-device – TP3 to TP4 1 nsns Total 294.5 Compliant Usage of Connectors and CablesCable assemblies and connectors not described below or not allowed by other amendments to the USB specification are not compliant with the USB specification and may not be labeled as such.4.5.1 CablesThe cables allowed by the Micro-USB specification are shown in Figure 4-1, Figure 4-2, and Figure 4-3.Cables must have a propagation delay of 10 ns or less, have a physical length of no more than 2.0 meters, and meet all other requirements of a USB cable.4.5.2 OvermoldsThe size and shape of the Micro-A and Micro-B plug overmolds must conform to the constraints shown in Figure 4-4 and Figure 4-5 .Interfaces4.5.3 MechanicalThe mechanical interface dimensions for the Micro-A and Micro-B plugs are shown in Figure 4-6 and Figure 4-7. Mechanical interface dimensions for Micro-AB and Micro-B receptacles are shown in Figure 4-9 and Figure 4-10.4.5.4 Surface mount standard version drawingsBy following these instructions, receptacles from different manufacturers can be used interchangeably on the same printed circuit board (PCB). In the case of the “surface mount standard version”, the dimensions of the contact tail and shield tail must comply with figures 4-11 and 4-12.Note: PCB-layout drawings are included for reference only.Figure 4-11 and Figure4-12 shows designs for the Micro-AB and Micro-B receptacles respectively.4.5.5 DIP-type and Midmount-type receptaclesDIP-type (contact and shield tails soldered through PCB) and Midmount-type (connector that is mounted ina cut-out in the printed circuit board between the top and bottom surfaces.) receptacle connectors are notdefined in this standards document. These mounting styles are allowed under the standard as long as all intermating conditions are met. Mechanical dimensions and mechanical durability values may vary from the Surface mount standard connector but must comply with all minimum values.4.5.6 ConnectorKeyingThis Micro connector series has been designed so as to prevent the Micro-A and Micro-B plugs from being incorrectly inserted into a receptacle. The amount of metal blocking various possible incorrect insertions is shown in Figure 4-13 and Figure 4-14, and is always greater than 0.35 mm.4.5.7 Right Angle PlugsThe overmolds for right / down angle plugs are required to comply with the same shape constraints that apply to straight plugs. Reference drawings for right / down angle plugs are shown in Figure 4-15, Figure 4-16, Figure 4-17 and Figure 4-18 .4.5.8 AdaptersRequirements:•The propagation delay of the adapter shall be less than 1 ns.•The physical length shall not exceed 150 mm.•The resistance of the adapter through V BUS and GND, including contacts, shall not exceed 70 mΩ.4.5.8.1 Standard-A receptacle to Micro-A plugThis adapter is used to connect a cable with a Standard-A plug to an On-The-Go device that has a Micro-AB receptacle. A reference drawing for this adapter is shown in Figure 4-19.4.6 DrawingsThis section contains the mechanical drawings that are referenced in the previous section.Figure 4-1 Micro-A to Micro-B CableFigure 4-2 Standard-A to Micro-B CableFigure 4-3 Micro-A to Captive CableFigure 4-4 Micro-A Plug Overmold, StraightFigure 4-5 Micro-B Plug Overmold, StraightFigure 4-6 Micro-A Plug InterfaceFigure 4-7 Micro-B Plug InterfaceFigure 4-8 Micro-A/B Plug Interface (Cut-section)Figure 4-9 Micro-AB receptacle interfaceFigure 4-10 Micro-B receptacle interfaceFigure 4-11 Micro-AB Receptacle DesignFigure4-12 Micro-B Receptacle DesignFigure 4-13 Micro-A Plug BlockageFigure 4-14 Micro-B Plug BlockageFigure 4-15 Micro-A Plug, Side Right AngleFigure 4-16 Micro-A Plug, Down Right AngleFigure 4-17 Micro-B Plug, Side Right AngleFigure 4-18 Micro-B Plug, Down Right AngleFigure 4-19 Adapter, Standard-A receptacle to Micro-A plugElectrical requirements are unchanged from the USB 2.0 specification (Chapter 6; Table 6-7) and the On-The-Go Supplement to the USB 2.0 Specification, unless otherwise specified here.5.1 Data Rates Beyond USB 2.0 (480Mb/s -->)This section will be amended as requirements for higher data rates (beyond the current USB 2.0specification) become available.5.2 Low Level Contact Resistance30mΩ(Max) initial when measured at 20mV (Max) open circuit at 100mA. Maximum change (delta) of +10 mΩafter 10,000 insertion/extraction cycles at a maximum rate of 500 cycles per hour.(When manually operated, mating speed should be below 200 cycles per hour.)5.3 Contact Current Rating5.3.1 Signal Contacts Only (2, 3, and 4)1A minimum when measured at an ambient temperature of 25 degrees Celsius. With power applied to the contacts, the delta temperature must not exceed +30degrees Celsius at any point in the USB connector under test.5.3.2 With Power Applied Contacts (1 and 5)1.8A for contacts 1 and 5 and at the same time 0.5A for contacts 2, 3 & 4, minimum when measured at anambient temperature of 25 degrees Celsius. With power applied to the contacts, the delta temperature must not exceed +30degrees Celsius at any point in the USB connector under test.The following requirements will take precedence over the requirements set forth in the USB 2.0specification (Chapter 6; Table 6-8) and the On-The-Go Supplement to the USB 2.0 Specification.6.1 Operating Temperature RangeI6.1.1 Option-30°C to +80°CII6.1.2 Option-30°C to +85°C (and above)6.2 Insertion ForceRecommendations:- It is recommend to use a non-silicon based lubricant on the latching mechanism toreduce wear. If used the lubricant may not affect any other characteristic of the system.- 35 Newton’s maximum at a maximum rate of 12.5 mm(0.492") per minute.6.3 Extraction Force- 8N (MIN) after 10000 insertion/extraction cycles (at a maximum rate of 12.5mm(0.492") per minute).- No burs or sharp edges are allowed on top of locking latches (hook surfaces which will rub against receptacle shield).- It is recommend to use a non-silicon based lubricant on the latching mechanism to reduce wear. If used the lubricant may not affect any other characteristic of the system.6.4 PlatingRecommendations:- Contact plating should be done after stamping and forming- Burrs should not be present on contact areas- Contact area as smooth as possible before plating- Use a sealing treatment to control plating porosity (contact area)I6.4.1 Option6.4.1.1 ReceptacleContact area: (Min) 0.05 µm Au + (Min) 0.75 µm Ni-Pd on top of (Min) 2.0 µm NiContact tail: (Min) 0.05 µm Au on top of (Min) 2.0 µm Ni6.4.1.2 PlugContact area: (Min) 0.05 µm Au + (Min) 0.75 µm Ni-Pd on top of (Min) 2.0 µm NiII6.4.2 Option6.4.2.1 ReceptacleContact area: (Min) 0.75 µm Au on top of (Min) 2.0 µm NiContact tail: (Min) 0.05 µm Au on top of (Min) 2.0 µm Ni6.4.2.2 PlugContact area: (Min) 0.75 µm Au on top of (Min) 2.0 µm Ni6.5 SolderabilitySolder shall cover a minimum of 95% of the surface being immersed, when soldered at temperature 255℃ +/-5℃ for immersion duration 5S (component is to be lead-free component) using Type R flux.6.6 Peel Strength (Reference Only)Minimum 150N when soldered connector is pulled up from PCB in the vertical direction.6.7 Wrenching Strength (Reference Only)Perpendicular Force Test : This test shall be performed using virgin parts. Perpendicular forces (Fp) are applied to a plug when inserted at a distance (L) of 15mm from the edge of the receptacle. Testingconditions & method should be agreed with all parties. These forces are to four direction (left, right, up, down). Compliant connectors will meet the following force thresholds with the following results :- No plug or receptacle damage: 0 - 25N- The plug can be damaged, but in such a way that the receptacle does not sustain damage: 25 - 50N 6.8 Lead Co-PlanarityCo-planarity of all SMT leads shall be within 0.08mm range.6.9 RoHS ComplianceComponent is to be RoHS compliant. Lead Free plug and receptacle materials must conform to Directive 2002/95/EC of January 27, 2003 on Restriction of Hazardous Substances (RoHS).6.10 Shell & Latch MaterialsShell and latch materials for both plug and receptacle shall be stainless steel or mechanically equivalent material.。

USB 2.0 SPEC

Keyboard Serial Sound/Game LAN Modem Port Ports Mouse Parallel SCSI Graphics Port Port Port
USB
USB
USB
Graphics Port
LAN
Architectural Overview
----- overview of the Universal Serial Bus (USB) architecture and key concepts. The USB is a cable bus that supports data exchange between a host computer and a wide range of simultaneously accessible peripherals. The attached peripherals share USB bandwidth through a hostscheduled, token-based protocol. The bus allows peripherals to be attached, configured, used, and detached while the host and other peripherals are in operation.
USB 2.0 简介
USB 2.0頻率：240Mhz USB提供了以下速度選擇：
數據速率低速全速高速 1.5Mbps 12Mbps 480Mbps 上升時間 75 to 300ns 4 to 20 ns 500ps
USB 2.0 简介
Agenda
USB Technology Overview
USB 2.0 简介

欧盟统一后的手机USB接口及其EMC测试要求

欧盟统一后的手机USB接口及其EMC测试要求2011-01-28 18:28:09 来源：摩尔实验室浏览次数：615 文字大小：【大】【中】【小】关键字：USB接口统一EMC 测试从2011年1月1日开始，所有在欧盟销售的带usb接口的手机，其接口统一为micro-B USB，手机及配套充电器的接口如下图所示:手机充电器的接口一直以来都是五花八门，从Micro-B USB到MiniUSB，甚至还有专属充电数据接口存在，这样的设计极大的不方便消费者。

很多时候我们急需充电的时候却发现充电接口不一样。

针对这一现象,欧盟委员会已经批准了14家手机品牌大厂商达成的一项协议，统一了手机usb接口为micro-B USB，并采用micro-B USB手机充电器新标准。

目前支持此项决议的手机厂商包括摩托罗拉、诺基亚、华为、LG、三星、索尼爱立信等。

此项协议实施后，消费者就不用再去为充电而烦躁，让生活更加的轻松,同时能减少充电器的产量，换手机造成的丢弃充电器行为也会大大减少，并且能节约消费者的支出，对减轻环境污染与节能减排也是一大利好。

针对以上协议，欧盟对手机充电器制定了一个新法规其标准号为ETSI EN 301 489-34 V1.1.1 (2 010-10)，此标准遵从CE指令。

也就是说，带micro-B USB口的手机充电器做CE认证，另外要符合此标准的要求。

现在我们就来了解一下这个新的法规对于micro-B USB口充电器设备在EMC测试方面都有哪些规定。

以方便大家申请欧盟CE认证。

EN301489-34是指关于无线电设备和服务的相关电磁兼容标准的第34部分，即关于移动电话的外部供电设备的特殊规定。

一．标准中规定了对设备进行供电的EPS(外部供电设备)即充电器必需要符合以下条件：设备通过使用一个micro-B的USB插头电缆的充电器进行电源供电；λ●充电电压为：5V±5 % ；λ●最大输出电流限定在500到1500MA；二. 关于EPS的测试需要注意到几个测试条件：λ●进行EPS的测试时它的直流输出端口必需要接一个能够代表它的连接设备的模拟负载。

测试指导类-USB接口指标测试指导书

USB接口指标测试指导书最小部门：（企业业务BG—企业数通产品线—企业数通研发管理部—企业数通硬件开发部）评审记录：所属产品：来源：关键词：USB接口指标；USB眼图测试；Chirp测试；Droop测试。

1、USB接口指标描述为了顺应市场的要求，目前的产品大部分都出的是的接口，而且我们产品都是作为HOST 端，一共提供3种速率，如下表。

当我们的设备是作为HOST端是，数据方向是Down Stream，其关注的指标有：1、信号质量1)眼图测试(Eye-Diagram testing)2)信号速率(Signal Rate)3)包结尾宽度(End of Packet Width)4)JK抖动(JK jitter)5)KJ抖动(KJ jitter)6)连续抖动(Consecutive jitter)7)单调性测试(Monotonic test (for HS))8)上升与下降时间(Rise and Fall times)2、Droop(电压跌落)3、Chirp (Shake Hands)2、USB接口指标测试方法（1）信号质量测试由于我们的设备都是作为HOST端，在这里只介绍HOST端的接口指标测试方法。

1)USB High Speed信号质量测试方法a)连接好被测设备(DUT)、测试夹具和示波器，具体的连接示意图如图1所示。

图 1 High Speed信号质量测试连接示意图b)DUT上电，启动USB测试包，发送测试命令，使USB端口能够发送出测试码流，具体的码流波形如图2所示。

图 2 High Speed信号质量测试波形c)运行示波器上的USB测试软件，在Analyze菜单中选择Test 启动后的界面如图3所示。

在软件的Measurements菜单中选择Select，然后选择High Speed，选择测试项，在这里可以点击Select All，将信号质量的测试项全部选上。

在这个界面上还有一个选项Config，该选项是用来初始化Monotonic Property，选择后的界面如图4所示，是用来初始化边沿的单调性是从高低电平的多少百分比开始Check。

MICRO_USB_母座规格书

目录表承认书封面目录表产品图面(第1页)产品包装规范(第2页)产品规格书(第3~7页)产品检验报告(第8页)群组测试报告(第9~11页)电镀及盐雾测试报告（第12~14页）黃卡（第15页）材质证明（第16~20页）SGS报告（第21~23页）承认书封底科宇塑胶五金有限公司ѻ ẔFIRST ARTICLE INSPECTION REPORT科宇塑胶五金有限公司PAGE 1/3Ｋｅｙｕ　Ｐｌａｓｔｉｃ　Ｈａｒｄｗａｒｅ　ＣＯ．，ＬＴＤFILE NAME: QUALIFICATION TEST REPORTPART NAME:MICRO USB CONNECTORPART NOMBER:C-1105-2100-21272/C-1105-2101-21272DATE:2007-06-041. INTRODUCTION1.1. PurposeTesting was performed on the MICRO USB connector to determine its conformance tothe requirements of Product Specification SPEC-0001 Rev A01.2. ScopeThis report covers the electrical, mechanical, and environmental performance ofMICRO USB manufactured by the Assembly Division.1.3. ConclusionMICRO USB connector meets the electrical, mechanical, and environmentalperformance requirements of Product Specification SPEC-0001 Rev A0.1.4. Product Description see specification1.5. Test SamplesThe test samples were randomly selected from normal current production lots, and thefollowing part numbers were used for test:Test Group Quantity Description1, 2,3,4,5, 5 pcs MICRO USB1.6 QUALIFICATION TEST SEQUENCE SEE SPECIFICATION SPEC-0001PAGE 2/3 1.7 TEST DATADATA NO.TEST SPEC. UNIT Mean Ӻ Max. Min. AppearanceNo Damage 5 conn OK OK OK Contact ResistanceMax 30m Ө 25 cont. 24.52 5.20 26.20 21.00 Connector Mating ForceMax 35N 5 conn 13.04 1.30 13.90 12.60 Connector Unmating Force8̚20N 5 conn. 18.80 2.30 19.00 16.70 Durability10000 Cycles 5 conn OK OK OK Connector Mating ForceMax 35N 5 conn 9.34 1.5 10.00 8.50 Connector Unmating Force8̚20N 5 conn 10.56 0.8 11.20 10.60 Contact ResistanceMax: 40m Ө 25 cont. 27.34 7.06 32.06 25.00 1 AppearanceNo Damage 5 conn. OK - OK OK AppearanceNo Damage 5 conn OK OK OK Contact ResistanceMax 30m Ө 25 cont. 24.23 4.52 26.82 22.30 Connector Mating ForceMax 35N 5 conn 12.82 0.70 13.20 12.50 Connector Unmating Force8̚20N 5 conn. 16.64 0.6 17.00 16.40 Random Vibration1 µ s Max 5 conn OK - OK OK Physical Shock1 µ s Max 5 conn OK OK OK Connector Mating ForceMax 35N 5 conn 12.76 0.36 13.00 12.64 Connector Unmating Force8̚20N 5 conn 16.52 0.27 16.90 16.36 Contact ResistanceMax: 40m Ө 25 cont. 27.84 6.90 31.50 24.60 2 AppearanceNo Damage 5 conn. OK - OK OK AppearanceNo Damage 25 cont.. OK - OK OK Insulation ResistanceMin:100Ө 25 cont. OK - OK OK Dielectric Withstanding Voltage100 VAC 1 minute 25 cont. OK - OK OK Thermal Shock-55к~85к 5cycles 5 conn. OK - OK OK Humidity25к~65к95%RH 7cycles(168Hour) 5 conn. OK - OK OK Insulation ResistanceMin:100Ө 25 cont. OK - OK OK 3 Dielectric Withstanding Voltage 100 VAC 1 minute 25 cont. OK - OK OK科宇塑胶五金有限公司Ｋｅｙｕ　Ｐｌａｓｔｉｃ　Ｈａｒｄｗａｒｅ　ＣＯ．，ＬＴＤPAGE 3/31.8. TEST RESULTPASS科宇塑胶五金有限公司Ｋｅｙｕ　Ｐｌａｓｔｉｃ　Ｈａｒｄｗａｒｅ　ＣＯ．，ＬＴＤ˖1L &X )H 0,&5286%%7<(5(&(3$&/(6+(//⏅ ⡍㊒ Ϯ 䰤 ␀䞣䤡 1L &X )HⳈ ˖ ;㎮䔌 ˖ℷ 䭧⾦ ␀䞣䭧⾦㿜ㅫ ⊩ 䴲 ԡ㛑䞣㆘ 1L &X㍅㿜䞣䊛1L>0,@ &X>0,@㿜5῭⑪³³12 1L 0, &X 0,12 1L 0, &X 0,12 1L 0, &X 0,12 1L 0, &X 0,12 1L 0, &X 0,⊼˖ XP 0,Ḍ ˖䰜⼹ҩ ⌟䆩 ˖ 䴭㒘㓪 ˖ ˖ ˖Q $X ͳ 1L ͳQ $X ͳ 1L ͳQ $X ͳ 1L ͳQ $X ͳ 1L ͳQ $X ͳ 1L ͳ;5$< ;8/0㒘㓪 ˖ 㒘㒧 ˖ ˖ ѻ ˖ $X 1L &X=Q䴦䪰˄ ͳ˅䅶䋻 ˖$X 1L;ˊ ˖ ͳ ͳ ⌟䞣䯈 V6 ͳ ͳ& 2 9 > @ 9䇏䞣 '㣗 5 ͳ ͳԢ䇏 ͳ ͳ催䇏 ͳ ͳ㒘㓪 ˖ ˖ ˖Q 6Q ͳQ 6Q ͳQ 6Q ͳQ 6Q ͳQ 6Q ͳ;5$< ;8/0㒘㓪 ˖ 㒘㒧 ˖ ˖ ѻ ˖ 6Q 1L &X=Q䴦䪰䫵 ℷ˖≵ Փ⫼ ⠛6Q;ˊ ˖ ͳ⌟䞣䯈 ˖ V6 ˖ ͳ& 2 9 > @ 9 ˖䇏䞣 Q ˖㣗 5 ˖ ͳԢ䇏 ˖ ͳ催䇏 ˖ ͳⲤ ∈ 䳒䆩偠䆄㸼 ˖2007.05.27 䖯 ˖ 䆩偠 ⷕ: 䆩偠䯈 25 16 㟇 26 16 䅵 241ˊ∃ 䩴䋼㒃䞣99.9% 2ˊ㪌佣∈ 䋼㒃 ∈ 1-2 MI/80F ΃ K 5±1% 3ˊ 䳒䞛 ˖3.1 䳒䞣3.2 䲚⒊⎆ ⏽ⱘ↨䞡 ⌧3.3PH6.7~7.2 䆺㾕⿟ 4ˊ䆩ḋ˖4.1 ⾡㉏4.2 ⢊4.34.4 Ⳃḋ5set 5ˊ 㓽ぎ⇨1Kgf/c ΃ 6ˊ䆩偠 Ⳍ ⑓7ˊ䆩偠 ⏽3 ćf ć 8ˊ Ṋ⏽47ćf ć 9ˊⲤ∈Ṋ⏽3 ćf ć10ˊ˖1.ձ ˖8H12H 16H 24H 48HĜ2ˊձ ⊩ ˖8H12H 16H 24H 48H 㒜 ˖ ҹ 䌋䆩偠 ˖ 㢅科宇塑胶五金有限公司Ｋｅｙｕ　Ｐｌａｓｔｉｃ　Ｈａｒｄｗａｒｅ　ＣＯ．，ＬＴＤCONTENS1. General physical properties of VECTRA® E130i NOTES TO USERS• All property values shown in this brochure are the typical values obtained under varying conditions prescribed by applicable standards and test method.• This brochure has been prepared based on our own experiences and laboratry test data, and therefore all data shown here are not always applicable to parts used under different conditions. We do not guarantee that these data are directly applicable to the application conditions of users and we ask each user to make his own decision on the application.• It is the users' responsibility to investigate patent rights, service life and potentiality of applications introduced in this brochure. Materials we supply are not intended for the implant applications in the medical and dental fields, and therefore are not recommended for such uses.• For all works done properly, it is advised to refer to the appropriate “Technical Catalog” for specific material processing.• For safe handling of materials we supply, it is advised to refer to the Material Safety Data Sheet “MSDS” of the proper material.• This brochure is edited based on reference literatures, information and data currently available to us. So the contents of this brochure are subject to change without notice due to new data.• Please contact our office for any questions about products we supply, descriptive literatures or any description in this brochure.*“VECTRA®”is a registered trademark of Polyplastics in Japan.“Vectra®”,“Celcon®”,“Celanex®”and“Celanese®”are registered trademarks of U.S. company Ticona LLC in the U.S. and other countriesDensity Tensile strength*Tensile elongation*Flexural strength Flexural modulus Flexural strain Charpy impact strength DTUL@1.8MPa Mold shrinkage ratio 80 mm sq ×1mmt Volume resistivity Surface resistivity Dielectric constant 1KHz 1MHz 10GHz Dielectric dissipation factor 1KHz 1MHz 10GHz Dielectric breakdown strength (1mm) (3mm)Tracking resistance Arc resistance Item Testing method E130ig/cm 3MPa %MPa MPa %kJ/m 2˚C %%Injection Pressure Ω • cm Ω(1Mhz)10×-3(1Mhz)MV/m (1Mhz)v s ISO1183ASTM D638ASTM D638ISO178ISO178ISO178ISO179/1eA ISO75-1,2Flow TD MPa IEC60093IEC60093IEC60250IEC60250IEC243-1IEC60112– 1.611752.022015,0002.3352800.020.54591.0×10161.0×10164.33.83.60.0170.0320.0074424125144Unit •All figures in this table are typical values and not minimum values of the material specifications.Note: Refer to the Y ellow Card (File No.E106764)published by UL(Underwriters Laboratories Inc.)for certified values.* The ISO 527-1, 2 test method for tensile properties is not suitable for liquid crystal polymers, so the ASTM method is adopted instead.Table General physical properties of VECTRA ® E130i1. General physical properties of VECTRA ® E130i。

MICRO USB 母座规格书

or TENSION TESTER.
Measure force necessary to mate
assemblies at maximum rate of 12.5mm (or
0.492”) per minute.
5.3.2
EIA 364-13
1).Initial : 10N min
Shall be measured with TENSION GAUGE 2).After test: 8̚20N
18 total shock
5.3.5
EIA 364-28
Random Vibration
Test Condition V Test Letter A
No discontinuities of 1 s or longer duration when mated USB connectors are subjected to 5.35 Gs RMS. 15 minutes in each of three mutually perpendicular planes.
2.3 Operation Temperature Range: -30ć to +80ć
2.4 Storage Temperature Range: -30ć to +85ć
2.5 Operation Relative Humidity: 95 % Maximum (non-condensing)
1).No discontinuities of 1m sec or longer
duration 2).Shall meet visual requirement, show no physical damage.
This document and information contained herein are the property of Keyu Plastic Hardware CO.,LTD copies are issued in strict confidence and shall not be reproduced or copied, or used as the basic of manufacture or sale of apparatus without permission

USB 3.0 A TO C 可靠性测试规范

三阶文件USB A/C数据线测试规范页数1/5 版本A/0修订履历版本修订内容日期修/制订者审核批准A/0 新制订2017-03-03 Peter Mils YANGi三阶文件USB A/C数据线测试规范页数2/5 版本A/0可靠性测试规范：Test conditionTemperature：15℃ to 35℃Air pressure ：86 to106 kPaRelative humidity：25% to 85%NO Testdescription Test procedure Performance Relatedstandard1 寿命测试EIA364-0920-30次/Min ●U SB A 3000次, 电气性能正常●T ype-C 10000次电气性能正常EIA364-092 插入力EIA364-131.插拔力测试仪器2.测试速度为12.5mm/分钟3.单位为N ●M icro USB插拔耐久测试前后：插入力大于等于6N，小于等于25N●T ype-C插拔耐久测试前后：插入力大于等于5N，小于等于20NEIA364-133 拔出力EIA364-131.插拔力测试仪器2.测试速度为12.5mm/分钟●M icro USB插拔耐久测试前后：拔出力大于等于8N，小于等于25N●M icro USB插拔耐久测试前后：拔出力大于等于8N，小于等于20NEIA364-134 抗拉脱EIA 364-38A1.轴向固定线缆PLUG；2.距离PLUG端 10cm处进行负重；3.重量40N;4.持续1分钟●线缆无开路、短路、绝缘击穿；●外背jacket无断裂；●连接器与线缆无分离；●芯线端点无脱离连接器；●电气性能正常；EIA364-38A5 端口抗弯折EIA 364-411.弯折角度水平和垂直方向各+/-90°；2.60次/分钟；3. 测试5000次（水平500次—>垂直100次为1个循环，共5个循环）4.负重200g；●测试完成后需对测试端SR处线缆进行上、下、左、右、左上角、右上角、左下角、右下角多角度检测，无开路、短路、绝缘击穿；●外背jacket无断裂；●连接器与线缆无分离；●芯线端点无脱离连接器；●电气性能正常；●导通阻抗符合规格要求，并记录实际值EIA364-416 滚筒跌落跌落高度1米，跌落次数150次，每50检查一次，跌落速度参考值10-12次/分次（以跌落●测试完成线缆无损坏，松脱；●连接器可以无明显尺寸变化；●电气性能正常三阶文件USB A/C数据线测试规范页数3/5 版本A/0在滚筒铁板中心位置为准）7 跌落测试跌落高度1.2米，按照上、下、左、右每个方向各3次跌落到水平大理石平台●测试完成线缆无损坏，松脱；●连接器可以无明显尺寸变化；●电气性能正常8 强度测试 2.5个方向各施加力量；●上下左右4个方向力量要求大于3.5Kg,不损坏；●插入方向要求大于10Kg不损坏；●测试完成后电气性能正常；●线缆无松脱，无断裂；9 强度耐久测试力：F1=F2=1kgf测试次数：2000次（往复算一次）；施力点为接口到SR处15mm（从外壳平面量起15mm。

USB接口指标测试指导书的参考学习分享

USB接口指标测试指导书1、USB接口指标描述为了顺应市场的要求，目前的产品大部分都出的是USB2.0的接口，而且我们产品都是作为HOST端，USB2.0一共提供3种速率，如下表。

数据速率上升时间Low Speed 1.5Mbps 75~300ns Full Speed 12Mbps 4~20ns High Speed 480Mbps >500ps 当我们的设备是作为HOST端是，数据方向是Down Stream，其关注的指标有：1、信号质量1)眼图测试(Eye-Diagram testing) 2)信号速率(Signal Rate) 3)包结尾宽度(End of Packet Width) 4)JK抖动(JK jitter) 5)KJ抖动(KJ jitter) 6)连续抖动(Consecutive jitter) 7)单调性测试(Monotonic test (for HS)) 8)上升与下降时间(Rise and Fall times) 2、Droop(电压跌落) 3、Chirp (Shake Hands) 2、USB接口指标测试方法（1）信号质量测试由于我们的设备都是作为HOST端，在这里只介绍HOST端的接口指标测试方法。

1)USB High Speed信号质量测试方法信号质量测试方法a)连接好被测设备(DUT)、测试夹具和示波器，具体的连接示意图如图1所示。

图 1 High Speed 信号质量测试连接示意图信号质量测试连接示意图b) DUT 上电，启动USB 测试包，发送测试命令，使USB 端口能够发送出测试码流，具体的码流波形如图具体的码流波形如图 2所示。

所示。

图 2 High Speed 信号质量测试波形信号质量测试波形c) 运行示波器上的USB 测试软件，在Analyze 菜单中选择USB2.0 Test 启动后的界面如图面如图 3所示。

在软件的Measurements 菜单中选择Select ，然后选择High Speed ，选择测试项，在这里可以点击Select All ，将信号质量的测试项全部选上。

micro usb 标准

micro usb 标准Micro USB标准。

Micro USB是一种小型USB接口标准，广泛应用于移动设备、数字相机、平板电脑等电子产品中。

它的出现极大地方便了人们的生活和工作，成为了现代科技发展中不可或缺的一部分。

首先，让我们来了解一下Micro USB的起源和发展。

Micro USB接口标准最早由USB 2.0规范引入，用于取代Mini USB接口。

Micro USB接口的小巧设计使得它可以被广泛应用于各种便携式设备中，例如智能手机、平板电脑等。

此外，Micro USB接口的可逆设计也大大方便了用户的使用，不再需要担心接口插反的问题。

其次，我们来看一下Micro USB标准的技术特点。

Micro USB接口标准采用了5针设计，包括了VCC电源、地线、数据+、数据-以及ID线。

这种设计使得Micro USB接口可以同时支持数据传输和充电功能。

此外，Micro USB接口还支持USB On-The-Go（OTG）功能，可以让设备在无需电脑的情况下直接连接外部USB设备，例如U盘、键盘、鼠标等，极大地扩展了设备的应用范围。

再者，我们来探讨一下Micro USB标准的应用场景。

Micro USB接口标准广泛应用于移动设备领域，例如智能手机、平板电脑、便携式音频设备等。

它也被广泛用于数字相机、摄像机等数码设备中。

由于其小巧的设计和可靠的性能，Micro USB接口已经成为了这些设备中的主流接口标准。

最后，让我们来看一下Micro USB标准的未来发展。

随着USB Type-C接口的逐渐普及，一些新型设备已经开始逐渐放弃Micro USB接口，转而采用USB Type-C接口。

然而，由于Micro USB接口的成本低廉、成熟稳定，以及大量现有设备的兼容性考虑，Micro USB接口在短期内仍然会保持一定的市场份额。

同时，MicroUSB接口在一些特定领域，例如低端手机、数码设备等，仍然会有一定的应用空间。

usb测试标准

在速度不超過每小時200個循環下經受1，500次插入與撥出。
Cable Pull-Out
電纜拉出
After the application of a steady state axial load of 40 N for one minute
固定后施加40N的軸向力,一分鐘。
Test Descriptio
Physical Shock
物理沖擊
No discontinuities of 1μs,or longer duration when mated USB connectors are subjected to 11ms duration 30 Gs half-sine shock pulses.Three shocks in each direction applied along three mutually perpendicular planes for a total of 18 shocks.
Flammability
The manufacturer will require its thermoplastic resin vendor to supply a detailed C of C with each resin shipment.The C of C shal clearly show the resin’s Ul listing number,lot number,date code,etc.
The dielectric must withstand 500V AC for one minute at sea level.
500VAC，一分鐘
Low Level Contact Resistance
低電平接觸電阻

最全的USB数据线接口资料全

USB 接口定义及封装USB全称 Universal Serial Bus（通用串行总线），目前 USB 2.0接口分为四种类型 A 型、B 型、Mini 型还有后来补充的 Micro 型接口，每种接口都分插头和插座两个部分，Micro 还有比较特殊的 AB 兼容型，本文简要介绍这四类插头和插座的实物及结构尺寸图，如果是做设计用途，还需要参考官方最新补充或修正说明，尽管 USB 3.0性能非常卓越，但由于USB 3.0规变化较大，真正应用起来还需假以时日，不管怎样，都已经把火线逼到末路，苹果公司极其郁闷但也爱莫能助。

1、A型 USB插头（plug）和 A型 USB插座（receptacle）引脚顺序（左侧为 Plug，右侧为 Receptacle）：引脚定义：编号1234 定义VBUSD-D+GND颜色识别Red（红色）White（白色）Green（绿色）Black（黑色）封装尺寸（单 PIN Receptacle）：2、B型 USB插头（plug）和 B型 USB插座（receptacle）引脚顺序（左侧为 Plug，右侧为 Receptacle，注意箭头所指斜口向上，USB 端口朝向自己）：引脚定义、封装尺寸均与 A 型 USB引脚说明相同。

封装尺寸（单 PIN Receptacle）：3、Mini B型 USB插头（plug）和 Mini B型 USB插座（receptacle）引脚顺序（左侧为 Plug，右侧为 Receptacle，注意宽边在上，USB 端口朝向自己）：引脚定义：编号12345封装尺寸（Receptacle）：定义VBUSD-D+IDGND颜色识别Red（红色）White（白色）Green（绿色）Not connected（未连接）Black（黑色）以上部分为 USB 2.0规容，下面的 Micro USB 实际上是在2006年才发布的补充规，由于该接口定义无法后向支持 USB 3.0协议，故仍然归于 USB 2.0协议包。

USB3.1测试规格130828

USB3.1 Revision 1.0 SPEC.(2013/07/26)USB3.0 cable & conn. Class Document Revision 1.0 Draft (2010/10/20)USB3.0 Revision 1.0 SPEC.(2008/11/12)Micro-USB Revision 1.0RC ( 2006/08/02)USB Revision 2.0 ( 2002/05/28 , 2000/04/27 ) 編號量測參數建議No. ( Parameter Measured ) 試驗條件建議規範USB 2.0 (HS) USB 3.0 (SS) GEN1 USB 3.0 (SS) GEN2 差分阻抗 90 Ω±7Ω/ 200ps(cable) 90 Ω±5Ω/ 200ps(cable)1 ( DifferentialImpedance ) TDR 90 Ω±15% / 200ps90 Ω±15Ω/ 50ps(assembly)45 Ω±3Ω/ 200ps(cable)90 Ω±10Ω/ 40ps(mated)傳輸延遲2( Propagation Delay ) TDRt5.2 ns/m26 ns/cable , 10ns/mircoN / A N / A傳輸延遲差3( Skew )TDR 100 ps/cable (max) 200ps 15 ps/m (max) 200ps 15 ps/m (max) 200ps 4 衰減 ( Attenuation ) NA 參附件參附件參附件0.9% / A , 1.8% / B1.2% / mircoTDR N / A2% / USB2.0 to 3.0 34 dB/5GHz5 近端損失(NEXT)NA N / A EIA 360-90 (364-90)TDR N / A 2% / USB2.0 to 3.06 遠端損失(FEXT)NA N / A EIA 360-90 (364-90) 30 dB/5GHz7訊號轉變Differential toCommon modeconversionNA N / A -20 dB-20 dB8 資料傳輸量( Data Rate )Max > 480Mbps Max > 5Gbps Max > 10Gbps修正版日期 : 2013/08/28USB2.0 / USB3.0/USB3.1測試規格LS ( Low speed ) max 1.5Mb/sCable Assembly Length 5MUSB2.0FS ( Full speed ) max 12Mb/sHS ( High speed ) max 480Mb/sSS( Super speed ) GEN1 max 5Gb/s Cable Assembly Length 3MUSB3.0SS( Super speed ) GEN2 max 10Gb/s Mirco cable Assembly Length 1MDifferential Insertion Loss for USB2.00.512MHz -0.13 dB/cable0.772MHz -0.15 dB/cable1MHz -0.20 dB/cable4MHz -0.39 dB/cable8MHz -0.57 dB/cable12MHz -0.76 dB/cable24MHz -0.95 dB/cable48MHz -1.35 dB/cable96MHz -1.90 dB/cable200MHz -3.2 dB/cable400MHz -5.8 dB/cableSDP Differential Insertion Loss Examples for USB3.0Frequency 34 AWG 30 AWG 28 AWG 26 AWG0.625 GHz-2.7 dB/m -1.3 dB/m -1.0 dB/m -0.9 dB/m1.25 GHz-3.3 dB/m -1.9 dB/m -1.5 dB/m -1.3 dB/m2.50 GHz-4.4 dB/m -3.0 dB/m -2.5 dB/m -1.9 dB/m5.00 GHz-6.7 dB/m -4.6 dB/m -3.6 dB/m -3.1 dB/m7.50 GHz-9.0 dB/m -5.9 dB/m -4.7 dB/m -4.2 dB/m建議長度 1.2 m↓ 2 m↓ 2.5 m↓ 3 m↓SDP Differential Insertion Loss Examples for USB3.1 GEN2 speed Frequency 34 AWG 32 AWG 30 AWG 28 AWG0.625 GHz -1.8 dB/m -0.9 dB/m -1.2 dB/m -1.0 dB/m1.25 GHz -2.5 dB/m -1.3 dB/m -1.7 dB/m -1.4 dB/m2.50 GHz -3.7 dB/m -1.9 dB/m -2.5 dB/m -2.1 dB/m5.00 GHz -5.5 dB/m -3.1 dB/m -3.9 dB/m -3.1 dB/m7.50 GHz -7.0 dB/m -4.2 dB/m -5.0 dB/m -4.1 dB/m建議長度 1.0 m↓ 1.5 m↓ 2 m↓ 2.5 m↓SDP Differential Insertion Loss Examples for USB3.1 GEN2 speed With coaxial constructionFrequency 34 AWG 32 AWG 30 AWG 28 AWG0.625 GHz -1.6 dB/m -1.3 dB/m -1.1 dB/m -1.0 dB/m1.25 GHz -2.3 dB/m -1.8 dB/m -1.5 dB/m -1.3 dB/m2.50 GHz -3.5 dB/m -2.7 dB/m -2.3 dB/m -1.9 dB/m5.00 GHz -5.3 dB/m -4.2 dB/m -3.5 dB/m -3.1 dB/m7.50 GHz -7.2 dB/m -5.5 dB/m -4.9 dB/m -4.2 dB/m建議長度 1.0 m↓ 1.5 m↓ 2 m↓ 2.5 m↓Differential Insertion Loss ( EIA 360-101『364-101』)SDD12 (100MHz,-1.5 dB) , (1.25GHz,-5 dB) , (2.5GHz,-7.5 dB) , and (7.5GHz,-25 dB)Differential NEXT Between USB3.0 pairs( EIA 360-90『364-90』)(100MHz , -27 dB) , (2.5GHz , -27 dB) , (3GHz , -23 dB) and (7.5GHz , -23 dB)Differential Between D+D- and SuperSpeed pairs ( EIA 360-90『364-90』)The Differential NEXT and FEXT Between the D+D- pairs (D+D-) and the SuperSpeed pairs (SSTX+ / SSTX- or SSRX+ / SSRX-)(100MHz , -21 dB) , (2.5GHz , -21 dB) , (3GHz , -15 dB) and (7.5GHz , -15 dB)USB2.0 LOGO USB3.0 LOGO。

Micro-USB行业标准规范

Universal Serial Bus Micro-USB Cables and ConnectorsSpecificationRevision 1.01April 4, 2007Revision HistoryDate Comment Revision Issue0.6 1/30/2006 Revisions to all sections0.7 3/24/2006 Added revised Micro-USB drawings to Rev.0.80.8 4/19/2006 Editorial changes and additions by Jan Fahllund (Nokia)Corrections to the 0.8 version (based by comments from contributors)0.8b 4/26/2006Corrections based on comments from the 0.8b version0.9 6/7/20061.0RC 8/2/2006 Added lubricant recommendation, LLRC delta change specified1.01RC 11/10/2006 Editorial changes and addition based on Oct-06 USB-IF CCWGmeeting.1.02RC 12/10/2006 Shell material thickness tolerances changed so that material can be0.25 mm or 0.3 mm; edited three pictures (Figure 4-10, 4-11 and 4-12).1.03RC 12/11/2006 Two pictures edited (Figure 4-8 and 4-9). In fig 4-8 max height to be2.8mm MAX. In fig 4-9 R0.25mm MAX to be R0.30mm MAX.1.0RC3 12/19/2006 For BoD approvalApproved1.0 1/12/20071.0 1/22/2007 Cosmetic edits for publication1.01 4/4/2007 Editorial corrections and additions to contributor list. Reinserted shelland plug material requirements as section 6.10. Clarified wording onPlating Recommendations.Copyright © 2007 USB Implementers Forum, Inc. (USB-IF).All rights reserved.A LICENSE IS HEREBY GRANTED TO REPRODUCE THIS SPECIFICATION FOR INTERNAL USEONLY. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, ISGRANTED OR INTENDED HEREBY.USB-IF AND THE AUTHORS OF THIS SPECIFICATION EXPRESSLY DISCLAIM ALL LIABILITY FOR INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, RELATING TO IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. USB-IF AND THE AUTHORS OF THISSPECIFICATION ALSO DO NOT WARRANT OR REPRESENT THATSUCH IMPLEMENTATION(S) WILL NOT INFRINGE THE INTELLECTUAL PROPERTY RIGHTS OF OTHERS.THIS SPECIFICATION IS PROVIDED "AS IS" AND WITH NO WARRANTIES, EXPRESS ORIMPLIED, STATUTORY OR OTHERWISE. ALL WARRANTIES ARE EXPRESSLY DISCLAIMED. NO WARRANTY OF MERCHANTABILITY, NO WARRANTY OF NON-INFRINGEMENT, NO WARRANTY OF FITNESS FOR ANY PARTICULAR PURPOSE, AND NOWARRANTY ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE.IN NO EVENT WILL USB-IF OR USB-IF MEMBERS BE LIABLE TO ANOTHER FOR THE COST OF PROCURING SUBSTITUTE GOODS OR SERVICES, LOST PROFITS, LOSS OF USE, LOSS OF DATA OR ANY INCIDENTAL, CONSEQUENTIAL, INDIRECT, ORSPECIAL DAMAGES, WHETHER UNDER CONTRACT, TORT, WARRANTY, OR OTHERWISE, ARISING IN ANY WAY OUT OF THE USE OF THIS SPECIFICATION, WHETHER OR NOT SUCHPARTY HAD ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.All product names are trademarks, registered trademarks, or service marks of their respective owners.ContributorsMark Rodda, (editor) Motorola Kevin Fang, Longwell ElectronicsJan Fahllund, (editor) Nokia Morgan Jair, Main Super Co.Jim Koser, (CCWG Chairman), Foxconn Tom Kawaguchi, Matsushita Electric Works Glen Chandler, Advanced-Connectek (Acon) Ron Ward, Matsushita Electric Works Charles Wang, Advanced-Connectek (Acon) Satoshi Yamamoto, Matsushita Electric Works Toshinori Sasaki, Across Techno Yasuhiko Shinohara, MitsumiMinoru Ohara, Allion Atsushi Nishio, MitsumiBrad Brown, ATL Hitoshi Kawamura, MitsumiChristopher Mattson, ATL Scott Sommers, MolexMarcus Darrington, ATL Kevin Delaney, MolexJaremy Flake, ATL Technology Kieran Wright, MolexGeorge Olear, Contech Research Padraig McDaid, MolexRoy Ting, Elka Mikko Poikselka, MolexSophia Liu, ETC Sam Liu, Newnex Technology Corp.Bill Northey, FCI Richard Petrie, NokiaTsuneki Watanabe, Foxconn Kai Silvennoinen, NokiaJim Zhao, Foxconn Panu Ylihaavisto, NokiaDavid Ko, Foxconn Arthur Zarnowitz, PalmJong Tseng, Foxconn Douglas Riemer, SMKJack Lu, Foxlink Eric Yagi, SMKTim Chang, Foxlink Abid Hussain, Summit Microelectronics Sathid Inthon, Fujikura Kaz Osada, TycoToshi Mimura, Fujijura Masaru Ueno, TycoAlan Berkema, Hewlett-Packard Yoshikazu Hirata, TycoKarl Kwiat, Hirose Ed Beeman, USB Implementers Forum Shinya Tono, Hirose Mark Paxson, USB Implementers Forum Kazu Ichikawa, HiroseRyozo Koyama, HiroseYousuke Takeuchi, HiroseTsuyoshi Kitagawa, HosidenJim Eilers, HosidenKazuhiro Saito, JAERon Muir, JAEMark Saubert, JAEYasuhira Miya, JSTTakahiro Diguchi, JSTYoichi Nakazawa, JSTTable of Contents1Introduction (6)1.1General (6)1.2Objective of the Specification (6)1.3Intended Audience/Scope (6)1.4Related Documents (6)2Acronyms and Terms (7)3Significant Features (8)3.1USB 2.0 Specification Compliance (8)3.2On-The-Go Device (8)3.3Connectors (8)3.4Compliant Cable Assemblies (8)3.5Plug Overmolds (9)4Cables and Connectors (10)4.1Introduction (10)4.2Micro-Connector Mating (10)4.3Color Coding (11)4.4Device, Cable and Adapter Delays (11)4.5Compliant Usage of Connectors and Cables (12)4.5.1Cables (12)4.5.2Overmolds (12)4.5.3Mechanical Interfaces (12)4.5.4Surface mount standard version drawings (12)4.5.5DIP-type and Midmount-type receptacles (12)4.5.6Connector Keying (12)4.5.7Right Angle Plugs (12)4.5.8Adapters (13)4.6Drawings (13)5Electrical Compliance Requirements (33)5.1Data Rates Beyond USB 2.0 (480Mb/s -->) (33)5.2Low Level Contact Resistance (33)5.3Contact Current Rating (33)5.3.1Signal Contacts Only (2, 3, and 4) (33)5.3.2With Power Applied Contacts (1 and 5) (33)6Mechanical Compliance Requirements (34)6.1Operating Temperature Range (34)6.1.1Option I (34)6.1.2Option II (34)6.2Insertion Force (34)6.3Extraction Force (34)6.4Plating (34)6.4.1Option I (35)6.4.2Option II (35)6.5Solderability (35)6.6Peel Strength (Reference Only) (35)6.7Wrenching Strength (Reference Only) (35)6.8Lead Co-Planarity (35)6.9RoHS Compliance (36)6.10Shell & Latch Materials (36)FiguresFigure 4-1 Micro-A to Micro-B Cable (14)Figure 4-2 Standard-A to Micro-B Cable (15)Figure 4-3 Micro-A to Captive Cable (16)Figure 4-4 Micro-A Plug Overmold, Straight (17)Figure 4-5 Micro-B Plug Overmold, Straight (18)Figure 4-6 Micro-A Plug Interface (19)Figure 4-7 Micro-B Plug Interface (20)Figure 4-8 Micro-A/B Plug Interface (Cut-section) (21)Figure 4-9 Micro-AB receptacle interface (22)Figure 4-10 Micro-B receptacle interface (23)Figure 4-11 Micro-AB Receptacle Design (24)Figure4-12 Micro-B Receptacle Design (25)Figure 4-13 Micro-A Plug Blockage (26)Figure 4-14 Micro-B Plug Blockage (27)Figure 4-15 Micro-A Plug, Side Right Angle (28)Figure 4-16 Micro-A Plug, Down Right Angle (29)Figure 4-17 Micro-B Plug, Side Right Angle (30)Figure 4-18 Micro-B Plug, Down Right Angle (31)Figure 4-19 Adapter, Standard-A receptacle to Micro-A plug (32)TablesTable 4-1. Plugs Accepted By Receptacles (10)Table 4-2. Micro-A Plug Pin Assignments (10)Table 4-3. Color Coding for Plugs and Receptacles (11)Table 4-4. Maximum Delay for Micro-Connector and Cable (11)Table 4-5. Maximum Delay for Standard Connector Cable (11)1 Introduction1.1 GeneralUSB has become a popular interface for exchanging data between cell phone and portable devices. Many of these devices have become so small it is impossible to use standard USB components as defined in the USB 2.0 specification. In addition the durability requirements of the Cell Phone and Portable Devices market exceed the specifications of the current interconnects. Since Cell Phones and other small Portable Devices are the largest market potential for USB, this specification is addressing this very large market while meeting all the requirements for electrical performance within the USB 2.0 specification.1.2 Objective of the SpecificationThe purpose of this document is to define the requirements and features of a Micro-USB connector that will meet the current and future needs of the Cell Phone and Portable Devices markets, while conforming to the USB 2.0 specification for performance, physical size and shape of the Micro-USB interconnect.This is not a stand-alone document. Any aspects of USB that are not specifically changed by thisspecification are governed by the USB 2.0 Specification and USB On-The-Go Supplement.1.3 Intended Audience/ScopeCell phone and Portable Devices have become so thin that the current Mini-USB does not fit well within the constraints of future designs. Additional requirements for a more rugged connector that will have durability past 10,000 cycles and still meet the USB 2.0 specification for mechanical and electrical performance was also a consideration. The Mini-USB could not be modified and remain backward compatible to the existing connector as defined in the USB OTG specification.1.4 Related DocumentsUSB 2.0USB OTG Supplement2 Acronyms and TermsThis chapter lists and defines terms and abbreviations used throughout this specification.A-Device A device with a Type-A plug inserted into its receptacle. The A-devicesupplies power to V BUS and is host at the start of a session. If the A-device is On-The-Go, it may relinquish the role of host to an On-The-GoB-device under certain conditions,Application A generic term referring to any software that is running on a device thatcan control the behavior or actions of the USB port(s) on a device.B-Device A device with a Type-B plug inserted into its receptacle. The B-device isa peripheral at the start of a session. If the B-device is OTG, it may begranted the role of host from an OTG A-device.DIP-type A connector with contact and shield solder tails that are soldered throughthe printed circuit boardFS Full Speed (max 12Mb/s)Higher than HS (480Mb/s ---> 5 Gb/s)HS High Speed (max 480 Mb/s)Host A physical entity that is attached to a USB cable and is acting in the roleof the USB host as defined in the USB Specification, Revision 2.0. Thisentity initiates all data transactions and provides periodic Start of Frames.HNP Host Negotiation ProtocolID Identification. Denotes the pin on the Micro connectors that is used todifferentiate a Micro-A plug from a Micro-B plug.LS Low Speed (max 1,5 Mb/s)Midmount-type A connector that is mounted in a cut-out in the printed circuit boardbetween the top and bottom surfaces.OTG On-The-GoOTG device A device with the host and peripheral capabilitiesPeripheral A physical entity that is attached to a USB cable and is currentlyoperating as a “device” as defined in the USB Specification, Revision 2.0.The Peripheral responds to low level bus requests from the Host.PCB Printed circuit boardUSB Universal Serial BusUSB-IF USB Implementers Forum3 Significant FeaturesThis section identifies the significant features of the Micro-USB specification. The purpose of this section is not to present all the technical details associated with each major feature, but rather to highlight itsexistence. Where appropriate, this section references other parts of the document where further details can be found.3.1 USB 2.0 Specification ComplianceAny device with Micro-USB features is first and foremost a USB peripheral that is compliant with the USB2.0 specification.3.2 On-The-Go DeviceAny OTG Micro-USB device shall conform to the OTG requirements as set forth in the On-The-GoSupplement to the USB 2.0 Specification.3.3 ConnectorsThe USB 2.0 specification defines the following connectors:•Standard-A plug and receptacle,•Standard-B plug and receptacle, and•Mini-B plug and receptacle.The Micro-USB specification defines the following additional connectors:•Micro-B plug and receptacle• Micro-AB receptacle• Micro-A plug.The Micro-AB receptacle is only allowed on OTG products. All other uses of the Micro-AB receptacle are prohibited. The Micro-AB receptacle accepts either a Micro-A plug or a Micro-B plug.It is recommended that the Micro-AB continue to support HNP as requested and support full functionality asa peripheral when a Micro-B plug is inserted.3.4 Compliant Cable AssembliesThe USB 2.0 specification defines the following cables:•Standard-A plug to Standard–B plug,•Standard-A plug to Mini-B plug, and•Captive cable with Standard-A plug.The Micro-USB specification defines the following additional cables:•Micro-A plug to Micro-B plug,•Micro-A plug to Standard-A receptacle•Micro-B plug to Standard-A plug, and•Hardwired Captive cable with Micro-A plug. (Hardwired Captive cable is a cable, connected internally to a device, which is not designed to be removed by the end user of that device.) No other types of cables are allowed by either the USB specification, or by the OTG supplement. Cables are not allowed to have receptacles on either end unless they meet the mechanical and electricalrequirements of adapters defined in this document.3.5 Plug OvermoldsThe Micro-USB specification constrains the size and the shape of the overmolds for the Micro-A and Micro-B plugs.The Micro-A plug’s overmold has a rectangular shape, and the Micro-B plug’s overmold is rectangular with chamfers. This allows easy recognition and differentiation of the two plugs by the consumer See pictures Figure 4-4 and Figure 4-5.4 Cables and Connectors4.1 IntroductionThis chapter provides the mechanical and electrical specifications for the cables, connectors and cable assemblies used to interconnect devices as well as constraints on the design of the overmolds for the Micro-A and Micro-B plugs.4.2 Micro-Connector MatingThe following table summarizes the plugs accepted by each of the receptacles.Table 4-1. Plugs Accepted By ReceptaclesReceptacle PlugsAcceptedStandard-A Standard-AStandard-B Standard-BMini-B Mini-BMicro-B Micro-BMicro-AB Micro-A or Micro-BThe usage and wiring assignments of the five pins in the Micro-A plug are defined in the following table.Table 4-2. Micro-A Plug Pin AssignmentsContact Number Signal Name Typical WiringAssignment1 VBUS Red2 D- White3 D+ Green4 ID <Ra_PLUG_ID5 GND BlackShell Shield DrainWireThe ID pin on a Micro-A plug shall be connected to the GND pin. The ID pin on a Micro-B plug is not connected or is connected to ground by a resistance of greater than Rb_PLUG_ID (100kΩ MIN). An On-The-Go device is required to be able to detect whether a Micro-A or Micro-B plug is inserted by determining if the ID pin resistance to ground is less than Ra_PLUG_ID (10Ω MAX) or if the resistance to ground is greater than Rb_PLUG_ID . Any ID resistance less than Ra_PLUG_ID shall be treated as ID = FALSE and any resistance greater than Rb_PLUG_ID shall be treated as ID = TRUE.4.3 Color CodingThe following colors are mandated for the plastic inside the Micro-USB connectors defined in thisspecification.Table 4-3. Color Coding for Plugs and ReceptaclesConnector ColorMicro-A plug WhiteMicro-B receptacle BlackMicro-B plug BlackMicro-AB receptacle Gray4.4 Device, Cable and Adapter DelaysIn Figure 7-11 of the USB 2.0 specification, four test planes are defined along the transmission path fromthe host transceivers to the peripheral transceivers. These test planes (TP) are as follows:•TP1: pins of host transceiver chip•TP2: contact points of host Standard-A receptacle•TP3: contact points of peripheral Standard-B or Micro-B receptacle•TP4: pins of peripheral transceiver chipThe maximum total delays are as follows:•On-The-Go device - TP1 to TP2: 1 ns• Adapter: 1 ns•Any cable with a Micro-A or Micro-B plug: 10 nsThe maximum delays for the two worst cases of connection are shown in the following tables.Table 4-4. Maximum Delay for Micro-Connector and CableTimeLocation DelayUSB 2.0 Compliant Host – TP1 to TP2 3 nsStandard-A receptacle to Micro-A plug adapter 1 nsMicro-A plug to Micro-B plug cable 10 nsUSB 2.0 Compliant B-device – TP3-TP4 1 nsns Total 15Table 4-5. Maximum Delay for Standard Connector CableTimeLocation DelayOn-The-Go Compliant Device – TP1 to TP2 1 nsMicro-A plug to Standard-A receptacle adapter 1 nsStandard-A plug to Standard-B plug cable 26 nsUSB 2.0 Compliant B-device – TP3 to TP4 1 nsns Total 294.5 Compliant Usage of Connectors and CablesCable assemblies and connectors not described below or not allowed by other amendments to the USB specification are not compliant with the USB specification and may not be labeled as such.4.5.1 CablesThe cables allowed by the Micro-USB specification are shown in Figure 4-1, Figure 4-2, and Figure 4-3.Cables must have a propagation delay of 10 ns or less, have a physical length of no more than 2.0 meters, and meet all other requirements of a USB cable.4.5.2 OvermoldsThe size and shape of the Micro-A and Micro-B plug overmolds must conform to the constraints shown in Figure 4-4 and Figure 4-5 .Interfaces4.5.3 MechanicalThe mechanical interface dimensions for the Micro-A and Micro-B plugs are shown in Figure 4-6 and Figure 4-7. Mechanical interface dimensions for Micro-AB and Micro-B receptacles are shown in Figure 4-9 and Figure 4-10.4.5.4 Surface mount standard version drawingsBy following these instructions, receptacles from different manufacturers can be used interchangeably on the same printed circuit board (PCB). In the case of the “surface mount standard version”, the dimensions of the contact tail and shield tail must comply with figures 4-11 and 4-12.Note: PCB-layout drawings are included for reference only.Figure 4-11 and Figure4-12 shows designs for the Micro-AB and Micro-B receptacles respectively.4.5.5 DIP-type and Midmount-type receptaclesDIP-type (contact and shield tails soldered through PCB) and Midmount-type (connector that is mounted ina cut-out in the printed circuit board between the top and bottom surfaces.) receptacle connectors are notdefined in this standards document. These mounting styles are allowed under the standard as long as all intermating conditions are met. Mechanical dimensions and mechanical durability values may vary from the Surface mount standard connector but must comply with all minimum values.4.5.6 ConnectorKeyingThis Micro connector series has been designed so as to prevent the Micro-A and Micro-B plugs from being incorrectly inserted into a receptacle. The amount of metal blocking various possible incorrect insertions is shown in Figure 4-13 and Figure 4-14, and is always greater than 0.35 mm.4.5.7 Right Angle PlugsThe overmolds for right / down angle plugs are required to comply with the same shape constraints that apply to straight plugs. Reference drawings for right / down angle plugs are shown in Figure 4-15, Figure 4-16, Figure 4-17 and Figure 4-18 .4.5.8 AdaptersRequirements:•The propagation delay of the adapter shall be less than 1 ns.•The physical length shall not exceed 150 mm.•The resistance of the adapter through V BUS and GND, including contacts, shall not exceed 70 mΩ.4.5.8.1 Standard-A receptacle to Micro-A plugThis adapter is used to connect a cable with a Standard-A plug to an On-The-Go device that has a Micro-AB receptacle. A reference drawing for this adapter is shown in Figure 4-19.4.6 DrawingsThis section contains the mechanical drawings that are referenced in the previous section.Figure 4-1 Micro-A to Micro-B CableFigure 4-2 Standard-A to Micro-B CableFigure 4-3 Micro-A to Captive CableFigure 4-4 Micro-A Plug Overmold, StraightFigure 4-5 Micro-B Plug Overmold, StraightFigure 4-6 Micro-A Plug InterfaceFigure 4-7 Micro-B Plug InterfaceFigure 4-8 Micro-A/B Plug Interface (Cut-section)Figure 4-9 Micro-AB receptacle interfaceFigure 4-10 Micro-B receptacle interfaceFigure 4-11 Micro-AB Receptacle DesignFigure4-12 Micro-B Receptacle DesignFigure 4-13 Micro-A Plug BlockageFigure 4-14 Micro-B Plug BlockageFigure 4-15 Micro-A Plug, Side Right AngleFigure 4-16 Micro-A Plug, Down Right AngleFigure 4-17 Micro-B Plug, Side Right AngleFigure 4-18 Micro-B Plug, Down Right AngleFigure 4-19 Adapter, Standard-A receptacle to Micro-A plugElectrical requirements are unchanged from the USB 2.0 specification (Chapter 6; Table 6-7) and the On-The-Go Supplement to the USB 2.0 Specification, unless otherwise specified here.5.1 Data Rates Beyond USB 2.0 (480Mb/s -->)This section will be amended as requirements for higher data rates (beyond the current USB 2.0specification) become available.5.2 Low Level Contact Resistance30mΩ(Max) initial when measured at 20mV (Max) open circuit at 100mA. Maximum change (delta) of +10 mΩafter 10,000 insertion/extraction cycles at a maximum rate of 500 cycles per hour.(When manually operated, mating speed should be below 200 cycles per hour.)5.3 Contact Current Rating5.3.1 Signal Contacts Only (2, 3, and 4)1A minimum when measured at an ambient temperature of 25 degrees Celsius. With power applied to the contacts, the delta temperature must not exceed +30degrees Celsius at any point in the USB connector under test.5.3.2 With Power Applied Contacts (1 and 5)1.8A for contacts 1 and 5 and at the same time 0.5A for contacts 2, 3 & 4, minimum when measured at anambient temperature of 25 degrees Celsius. With power applied to the contacts, the delta temperature must not exceed +30degrees Celsius at any point in the USB connector under test.The following requirements will take precedence over the requirements set forth in the USB 2.0specification (Chapter 6; Table 6-8) and the On-The-Go Supplement to the USB 2.0 Specification.6.1 Operating Temperature RangeI6.1.1 Option-30°C to +80°CII6.1.2 Option-30°C to +85°C (and above)6.2 Insertion ForceRecommendations:- It is recommend to use a non-silicon based lubricant on the latching mechanism toreduce wear. If used the lubricant may not affect any other characteristic of the system.- 35 Newton’s maximum at a maximum rate of 12.5 mm(0.492") per minute.6.3 Extraction Force- 8N (MIN) after 10000 insertion/extraction cycles (at a maximum rate of 12.5mm(0.492") per minute).- No burs or sharp edges are allowed on top of locking latches (hook surfaces which will rub against receptacle shield).- It is recommend to use a non-silicon based lubricant on the latching mechanism to reduce wear. If used the lubricant may not affect any other characteristic of the system.6.4 PlatingRecommendations:- Contact plating should be done after stamping and forming- Burrs should not be present on contact areas- Contact area as smooth as possible before plating- Use a sealing treatment to control plating porosity (contact area)I6.4.1 Option6.4.1.1 ReceptacleContact area: (Min) 0.05 µm Au + (Min) 0.75 µm Ni-Pd on top of (Min) 2.0 µm NiContact tail: (Min) 0.05 µm Au on top of (Min) 2.0 µm Ni6.4.1.2 PlugContact area: (Min) 0.05 µm Au + (Min) 0.75 µm Ni-Pd on top of (Min) 2.0 µm NiII6.4.2 Option6.4.2.1 ReceptacleContact area: (Min) 0.75 µm Au on top of (Min) 2.0 µm NiContact tail: (Min) 0.05 µm Au on top of (Min) 2.0 µm Ni6.4.2.2 PlugContact area: (Min) 0.75 µm Au on top of (Min) 2.0 µm Ni6.5 SolderabilitySolder shall cover a minimum of 95% of the surface being immersed, when soldered at temperature 255℃ +/-5℃ for immersion duration 5S (component is to be lead-free component) using Type R flux.6.6 Peel Strength (Reference Only)Minimum 150N when soldered connector is pulled up from PCB in the vertical direction.6.7 Wrenching Strength (Reference Only)Perpendicular Force Test : This test shall be performed using virgin parts. Perpendicular forces (Fp) are applied to a plug when inserted at a distance (L) of 15mm from the edge of the receptacle. Testingconditions & method should be agreed with all parties. These forces are to four direction (left, right, up, down). Compliant connectors will meet the following force thresholds with the following results :- No plug or receptacle damage: 0 - 25N- The plug can be damaged, but in such a way that the receptacle does not sustain damage: 25 - 50N 6.8 Lead Co-PlanarityCo-planarity of all SMT leads shall be within 0.08mm range.6.9 RoHS ComplianceComponent is to be RoHS compliant. Lead Free plug and receptacle materials must conform to Directive 2002/95/EC of January 27, 2003 on Restriction of Hazardous Substances (RoHS).6.10 Shell & Latch MaterialsShell and latch materials for both plug and receptacle shall be stainless steel or mechanically equivalent material.。

USB数据线硬件与可靠性测试规范图文稿

U S B数据线硬件与可靠性测试规范文件管理序列号：[K8UY-K9IO69-O6M243-OL889-F88688]常规检验标准要求硬件常规测试充电时间测试数据线可靠性试验要求与方法?1.本规范参考标准GB/T2423.1-1989电工电子产品基本环境实验规程实验A：低温试验方法GB/T2423.2-1989电工电子产品基本环境实验规程实验B：高温试验方法GB/T2423.3-1989电工电子产品基本环境实验规程实验Ca:恒定湿热实试验方法GB/T2423.8-1995电工电子产品环境实验第二部分：实验Ed:自由跌落GB/T2423.17-1993电工电子产品基本环境实验规程实验Ka:盐雾试验方法GB/T2423.29-1999电工电子产品环境实验第二部分：实验U:引出端及整体安装件强度2.概要：2.1测试条件标准：温度:+15～+35℃相对湿度:45%～75%(RH)气压:86～106kPa2.2试验前，应对样品外观和功能进行检验，发现不合格品时，应在同一批产品中随机抽取合格品替换。

同时对不合格品进行分析，找出原因，列入周期试验报告中，但不作为周期检验合格与否的依据2.3试验中发现不良时，应对不良品进行分析，并把不良情况列入周期检验报告中，且作为周期检合格与否的依据2.4试验后，样品不能作为正常产品入库使用4.5客户有特殊要求时，以客户要求为准。

3.环境可靠性要求及试验方法?3.1高温试验：3.1.1试验条件：在温度65±2℃的环境下保持24小时。

3.1.2试验方法：试验箱达到实验条件后，将产品裸露放入试验箱的内架上，试验完成，在常温下恢复2小时。

3.1.3试验后要求：金属部件无锈蚀、变形等可见损伤，注塑部件及线体无变形、发白、脱油，内芯线无外露和断线等情况发生；不干胶标贴不可翘起；使用线材测试仪测试电性能正常。

3.2低温测试：3.2.1试验条件：在温度－20±2℃的环境下保持24小时℃,低温点为-20℃，每个温度点保持60min，循环次数为12次。

usb数据线检验标准

usb数据线检验标准USB数据线检验标准。

USB数据线作为连接电子设备和充电设备的重要工具，其质量的好坏直接影响着设备的充电速度和数据传输效率。

因此，制定USB数据线检验标准，对于保障用户权益，提高产品质量具有重要意义。

首先，USB数据线的外观应当符合标准规定，线材应该柔软而有弹性，外部不应该有明显的破损或者变形。

连接头部分应该与线材连接紧密，不应该出现松动现象。

其次，USB数据线的传输性能也是检验的重点之一。

传输性能主要包括数据传输速度和充电速度。

数据传输速度应该符合USB协议规定的标准，充电速度也应该在合理范围内，不能出现充电缓慢或者充电不稳定的情况。

另外，USB数据线的耐用性也是需要检验的重点之一。

耐用性主要体现在插拔次数和弯曲次数上，合格的USB数据线应该能够经受多次的插拔和弯曲而不影响其正常使用。

除了上述几点之外，USB数据线的安全性也是需要检验的重点。

合格的USB 数据线应该符合国家相关的安全标准，不应该出现漏电、过热等安全隐患。

另外，USB数据线的防护性也是需要考虑的因素，合格的USB数据线应该具有一定的防护功能，能够防止外部环境对线材的损坏。

总的来说，USB数据线的检验标准应该包括外观检验、传输性能检验、耐用性检验、安全性检验和防护性检验等内容。

只有通过严格的检验标准，才能够保障用户的权益，提高产品的质量，推动整个行业的健康发展。

在实际生产中，制定严格的USB数据线检验标准并不是一件容易的事情，需要相关部门和企业的共同努力。

一方面，相关部门应该加强对USB数据线质量的监督和检验，建立健全的检验体系，加大对违规产品的处罚力度；另一方面，企业应该自觉遵守USB数据线的相关标准，加强内部质量管理，提高产品质量。

总之，USB数据线作为电子产品中不可或缺的配件，其质量的好坏直接关系到用户的体验和设备的使用寿命。

制定严格的USB数据线检验标准，对于保障用户权益，提高产品质量具有重要意义。

希望通过全社会的共同努力，能够建立起一套严格的USB数据线检验标准体系，为消费者提供更加优质的产品。