IPD15N06S2L-64中文资料

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2N06L64-NMOS管资料

2N06L64-NMOS管资料

0 -60 -20 20 60 100 140 180
T j [°C]
T j [°C]
11 Typ. capacitances C = f(V DS); V GS = 0 V; f = 1 MHz
12 Typical forward diode characteristicis IF = f(VSD) parameter: T j
Rev. 1.0
page 1
2006-07-18
IPD15N06S2L-64
Parameter
Symbol
Conditions min.
Values typ. max.
Unit
Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction ambient, leaded SMD version, device on PCB R thJC R thJA R thJA minimal footprint 6 cm2 cooling area2) Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D= 1 mA V GS(th) I DSS V DS=V GS, I D=14 µA V DS=55 V, V GS=0 V, T j=25 °C V DS=55 V, V GS=0 V, T j=125 °C1) Gate-source leakage current Drain-source on-state resistance Drain-source on-state resistance I GSS R DS(on) RDS(on) V GS=20 V, V DS=0 V V GS=4.5 V, I D=13 A V GS=10 V, I D=13 A 55 1.2 1.6 0.01 2.0 1 µA V 3.2 100 75 50 K/W

技术服务手册-PS篇(标准版)

技术服务手册-PS篇(标准版)
六、IP防护等级说明-----------------------------------------------------------------------------33
第一章
一、特点
1、一体化设计,位置变送器、伺服放大器内装,调校方便。
2、结构简单,体积小巧,重量轻,便于安装维护。
3、采用精密小间隙密封齿轮传动,传动效率高,噪声低,寿命长,稳定性高,无需加油。
X2:执行器电机连接端子,连线方式参考图1。
X3:控制信号输入与位置信号输出端子,该端子标有3、4号的为控制信号输入端子,标有5、6号的为位置信号输出端子,连线方式参考图1。
X5:执行器位置电位器接线端子,连接方式参考图1。在按图示连接方式连接时,应确保执行器的电位器与电机板上端子X0的连接关系如图2所示。
接线如下图:其中X5/1为电机的如下图:
公共端,X5/2为电机开方向的L1
端,X54为电机关方向的L2端。
四、独立位置变送器接线
第四章
一、 限位开关的调整
二、伺服放大板PSAP5调试说明书
1、安全事项
调试过程中不可触摸电路板上导体部分,以防触电。
确保各接线端子正确连接。
2、接线端子介绍
X1:电源端子。
PS+POT+PSMF2DC
开关(24V直流电源)动作模式,输出4--20mA反馈信号
调节型
PS+POT+MSC305+MSC308
调节动作模式,输入/出4--20mA反馈信号
PS+POT+PSAP4C
四、PS反馈齿轮的直径与行程
直径(mm)
H行程(mm)
10.8
H=25(塑料)

IEC61215 标准 (中文版)[1]

IEC61215 标准 (中文版)[1]

IEC61215 标准(中文版)美国光伏检测室( ASU-PTL)中国全权代理Solspring International Energy Group太阳普林国际能源集团(加拿大)2005年中国目的1。

决定组件的电性能和热性能。

2。

表明组件在合理的成本和时间内,能够承受长时间的气候暴露。

取样根据 IEC 60410 标准,8块用于质量测试的组件应从一批或几批产品中任意抽取。

通过的标准:1。

最大输出 (The degradation of Max. output power does not exceedthe prescribed limit after each test nor 8% after each test sequence)2。

电路 (no sample has exhibited any open-circuit during the tests)3。

目测迹象(There is no visual evidence of a major defect) 4。

绝缘性(The insulation test requirements are met after the tests)5。

湿漏电 (The wet leakage current test requirements are met at thebeginning and the end of each sequence and after the damp heat test)6。

特殊要求(Specific requirements of the individual tests are met)5kWh/m2目测,电性能,绝缘,湿漏1 12 22热循环 200电性能紫外线湿热热循环 50户外暴二极管热试验湿冻机械强度雹击热斑终端试验目测,电性能,绝缘,IEC61215 (第二版)标签每一个组件的标签都应包括以下内容且清楚可读:1. 生产厂商名字或标志。

CD74HC154M96E4,CD74HC154M96G4,CD74HC154M96,CD74HC154M96,CD74HC154M96, 规格书,Datasheet 资料

CD74HC154M96E4,CD74HC154M96G4,CD74HC154M96,CD74HC154M96,CD74HC154M96, 规格书,Datasheet 资料

67
M (SOIC) Package (Note 2). . . . . . . . . . . . . . . . . . .
46Leabharlann Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
1
芯天下--/
CD54HC154, CD74HC154, CD54HCT154, CD74HCT154
Functional Diagram
A0 23 A1 22 A2 21
20 A3
E1 18 E2 19
1 Y0
2 Y1
3 Y2
4 Y3
5 Y4
6 Y5
7 Y6
8 Y7
[ /Title (CD74 HC154 , CD74 HCT15 4) /Subject (High Speed CMOS Logic 4-to-16 Line Decod er/Dem
Features
• Two Enable Inputs to Facilitate Demultiplexing and Cascading Functions
Data sheet acquired from Harris Semiconductor SCHS152D
September 1997 - Revised June 2004
CD54HC154, CD74HC154, CD54HCT154, CD74HCT154
High-Speed CMOS Logic 4- to 16-Line Decoder/Demultiplexer

W25Q64中文资料精编版

W25Q64中文资料精编版

W25Q64BV出版日期:2010年7月8日- 1 - 版本E64M位与串行闪存双路和四路SPIW25Q64BV- 2 -目录1,一般DESCRIPTION (5)2。

FEATURES (5)3引脚配置SOIC208-MIL.......................................... .. (6)4,焊垫配置WSON8X6-MM.......................................... . (6)5,焊垫配置PDIP300-MIL.......................................... . (7)6引脚说明SOIC208密耳,PDIP300密耳和WSON8X6-MM................................ 7......7引脚配置SOIC300mil的.......................................... .. (8)8引脚SOIC封装说明300-MIL (8)8.1包装Types (9)8.2片选(/CS) (9)8.3串行数据输入,输出和IO(DI,DO和IO0,IO1,IO2,IO3)............................. 9.......8.4写保护(/WP) (9)8.5控股(/HOLD) (9)8.6串行时钟(CLK) (9)9座DIAGRAM (10)10功能DESCRIPTION (11)10.1 SPI OPERATIONS (11)10.1.1标准SPI Instructions (11)10.1.2双SPI Instructions (11)10.1.3四路SPI Instructions (11)10.1.4保持功能 (11)10.2写保护 (12)10.2.1写保护Features (12)11,控制和状态寄存器............................................ .. (13)11.1状态REGISTER (13)11.1.1 BUSY (13)11.1.2写使能锁存(WEL) (13)11.1.3块保护位(BP2,BP1,BP0)..................................... .. (13)11.1.4顶/底块保护(TB)....................................... .................................................. ..1311.1.5部门/块保护(SEC) (13)11.1.6状态寄存器保护(SRP,SRP0)....................................... . (14)11.1.7四路启用(QE) (14)11.1.8状态寄存器内存保护........................................... .. (16)11.2 INSTRUCTIONS (17)11.2.1制造商和设备标识........................................... .. (17)11.2.2指令集表1 (18)W25Q64BV11.2.3指令表2(阅读说明书)....................................... (19)出版日期:2010年7月8日- 3 - 修订版E11.2.4写使能(06h) (20)11.2.5写禁止(04h) (20)11.2.6读状态寄存器1(05H)和读状态寄存器2(35H).............................. (21)11.2.7写状态寄存器(01H)......................................... .................................................. .. (22)11.2.8读取数据(03h) (23)11.2.9快速阅读(0Bh) (24)11.2.10快速读双输出(3BH)........................................ .................................................. 0.25 11.2.11快速读四路输出(6BH)........................................ .. (26)11.2.12快速读双I / O (BBh) (27)11.2.13快速读取四I/ O (EBh) (29)11.2.14八进制字读取四I/ O(E3H)..................................... (31)11.2.15页编程(02h) (33)11.2.16四路输入页编程(32H)........................................ . (34)11.2.17扇区擦除(20H) (35)11.2.1832KB的块擦除(52H) (36)11.2.1964KB的块擦除(D8h) (37)20年2月11日芯片擦除(C7H/ 60h) (38)21年2月11日擦除挂起(75h) (39)22年2月11日擦除恢复(7Ah) (40)23年11月2日掉电(B9h) (41)24年2月11日高性能模式(A3H)......................................... (42)25年2月11日发布掉电或高性能模式/设备ID(ABH) (42)26年2月11日读制造商/设备ID(90H)....................................... . (44)27年2月11日阅读唯一的ID号(4BH)........................................ . (45)28年2月11日读JEDEC的ID (9Fh) (46)29年2月11日连续读取模式复位(FFH或FFFFH)...................................... .. (47)12,电气特性.............................................. (48)12.1绝对最大Ratings (48)12.2操作范围 (48)12.3上电时序和写抑制阈值......................................... (49)12.4直流电气Characteristics (50)12.5 AC测量条件.............................................. .. (51)12.6 AC电气Characteristics (52)12.7 AC电气特性(续)......................................... . (53)12.8串行输出Timing (54)12.9输入Timing (54)12.10持有Timing (54)13包装SPECIFICATION (55)W25Q64BV13.18引脚SOIC208密耳(包装代号SS)..................................... .. (55)- 4 -13.28引脚PDIP300密耳(封装代码DA)..................................... (56)13.38触点WSON8x6毫米(封装代码ZE)....................................... (57)13.416引脚SOIC300密耳(封装代码SF)..................................... . (58)14订货INFORMA TION (59)14.1有效的部件号和顶端标记.......................................... (60)15版本HISTORY (61)W25Q64BV出版日期:2010年7月8日- 5 - 修订版E1概述该W25Q64BV(64M位)串行Flash存储器提供了有限的系统存储解决方案空间,引脚和电源。

IPD640N06LG中文资料

IPD640N06LG中文资料

PG-TO252-3IPD640N06L GParameter Symbol Conditions Unitmin.typ.max. Thermal characteristicsThermal resistance, junction - case R thJC-- 3.2K/W SMD version, device on PCB R thJA minimal footprint--756 cm2 cooling area2)--50 Electrical characteristics, at T j=25 °C, unless otherwise specifiedStatic characteristicsDrain-source breakdown voltage V(BR)DSS V GS=0 V, I D=1 mA60--V Gate threshold voltage V GS(th)V DS=V GS, I D=16 µA 1.2 1.62Zero gate voltage drain current I DSS V DS=60 V, V GS=0 V,T j=25 °C-0.011µAV DS=60 V, V GS=0 V,T j=125 °C-1100Gate-source leakage current I GSS V GS=20 V, V DS=0 V-10100nA Drain-source on-state resistance R DS(on)V GS=10 V, I D=18 A-4764mΩV GS=4.5 V, I D=12 A-6485Gate resistance R G- 1.2-ΩTransconductance g fs |V DS|>2|I D|R DS(on)max,I D=18 A9.519-S2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air.ValuesIPD640N06L GParameterSymbol ConditionsUnitmin.typ.max.Dynamic characteristics Input capacitance C iss -350470pFOutput capacitanceC oss -94130Reverse transfer capacitance C rss -3553Turn-on delay time t d(on)-68ns Rise timet r -2538Turn-off delay time t d(off)-3248Fall timet f-3248Gate Charge Characteristics 3)Gate to source charge Q gs - 1.4 1.9nCGate charge at threshold Q g(th)-0.50.7Gate to drain charge Q gd - 3.6 5.4Switching charge Q sw - 4.5 6.5Gate charge total Q g -1013Gate plateau voltage V plateau - 4.2-V Output charge Q ossV DD =30 V, V GS =0 V -34Reverse DiodeDiode continous forward current I S --18ADiode pulse current I S,pulse --72Diode forward voltageV SDV GS =0 V, I F =18 A, T j =25 °C-0.991.3V Reverse recovery time t rr-3045nsReverse recovery charge Q rr -2030nC3)See figure 16 for gate charge parameter definitionV R =30 V, I F =I S , d i F /d t =100 A/µsT C =25 °CValues V GS =0 V, V DS =30 V, f =1 MHzV DD =30 V, V GS =10 V, I D =15 A, R G =22 ΩV DD =30 V, I D =18 A, V GS =0 to 10 V1 Power dissipation5 Typ. output characteristics9 Drain-source on-state resistance13 Avalanche characteristicsPG-TO252-3: Outline packaging:IPD640N06L GPublished byInfineon Technologies AG81726 München, Germany© Infineon Technologies AG 2006.All Rights Reserved.Attention please!The information given in this data sheet shall in no event be regarded as a guarantee of conditions ocharacteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies herebydisclaims any and all warranties and liabilities of any kind, including without limitation warranties oInformationFor further information on technology, delivery terms and conditions and prices please contact your nearesInfineon Technologies Office ().WarningsDue to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failureof that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustainand/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons maybe endangered.。

IXDR35N60BD1;中文规格书,Datasheet资料

IXDR35N60BD1;中文规格书,Datasheet资料

times versus gate resistor
10 K/W
1 ZthJC
0.1
0.01
single pulse
diode IGBT
0.001
0.0001 10-5
10-4
10-3
10-2
10-1 t
IXDR30N60BD1
100 s 101
Fig. 12 Typ. transient thermal impedance
600
V
600
V
±20
V
±30
V
38
A
24
A
48
A
ICM = 110
A
VCEK < VCES
10
µs
125
W
50
W
-55 ... +150
°C
-55 ... +150
°C
2500
V~
20...120
N
6
g
Conditions
V =0V GE
IC = 0.7 mA, VCE = VGE VCE = VCES
V = 0 V, V = ± 20 V
CE
GE
IC = 35 A, VGE = 15 V
Characteristic Values
(TJ = 25°C, unless otherwise specified) min. typ. max.
600
V
3
5V
TJ = 25°C TJ = 125°C
0.1 mA
VGE(th) ICES
I
GES
VCE(sat)
Conditions

IAP15W4K61S4单片机部分特殊功能寄存器(精品文档)_共3页

IAP15W4K61S4单片机部分特殊功能寄存器(精品文档)_共3页

PSW:位号B7B6B5B4B3B2B1B0符号CY AC F0RS1RS0OV F1P辅助寄存器AUXR(地址为8EH,复位值为01H):位号B7B6B5B4B3B2B1B0位名称T0x12T1x12UART_M0x6T2R T2_C/T T2x12EXTRAM S1ST2I/O口工作模式设置寄存器PnM1[7:0]PnM0[7:0]I/O口模式00准双向口(传统8051单片机I/O口模式)01推挽输出10仅为输入(高阻)11开漏(Open Drain),内部上拉电阻断开,要外加上拉电阻辅助寄存器AUXR1(地址为A2H,复位值为0000 0000B)和外设功能切换寄存器P_SW2(地址为BAH,复位值为xxxx xxx0B)位号寄存器B7B6B5B4B3B2B1B0AUXR1S1_S1S1_S0CCP_S1CCP_S0SPI_S1SPI_S00DPSP_SW2PWM67_S PWM2345_S S4_S S3_S S2_SCLK_DIV SYSCKO_S1SYSCKO_S0ADRJ Tx_Rx SYSCLKO_2CLKS2CLKS1CLKS0INT_CLKO EX4EX3EX2SYSCKO_S2T2CLKO T1CLKO T0CLKOTCON(地址为88H,复位值为00H)位号B7B6B5B4B3B2B1B0位名称TF1TR1TF0TR0IE1IT1IE0IT0 SCON(地址为98H,复位值为00H)位号B7B6B5B4B3B2B1B0位名称SM0/FE SM1SM2REN TB8RB8TI RIS2CON(地址为9AH,复位值为00H)位号B7B6B5B4B3B2B1B0位名称S2SM0-S2SM2S2REN S2TB8S2RB8S2TI S2RI串口3控制寄存器S3CON(地址为ACH,复位值为40H)位号B7B6B5B4B3B2B1B0位名称S3SM0S3ST3S3SM2S3REN S3TB8S3RB8S3TI S3RI串口4控制寄存器S4CON(地址为84H,复位值为00H)位号B7B6B5B4B3B2B1B0位名称S4SM0S4ST4S4SM2S4REN S4TB8S4RB8S4TI S4RI电源控制寄存器PCON(地址为87H,复位值为30H)位号B7B6B5B4B3B2B1B0位名称SMOD SMOD0LVDF POF GF1GF0PD IDL CCON(地址为D8H,复位值为00xx x000B)位号B7B6B5B4B3B2B1B0位名称CF CR---CCF2CCF1CCF0SPSTAT(地址为CDH,复位值为00xx xxxxB)位号B7B6B5B4B3B2B1B0位名称SPIF WCOL------ADC控制寄存器ADC_CONTR(地址为BCH,复位值为00H)位号B7B6B5B4B3B2B1B0位名称ADC_POWER SPEED1SPEED0ADC_FLAG ADC_START CHS2CHS1CHS0中断允许寄存器IE(地址为A8H,复位值为00H)位号B7B6B5B4B3B2B1B0位名称EA ELVD EADC ES ET1EX1ET0EX0中断允许寄存器IE2(地址为AFH,复位值为xxxx x000B)位号B7B6B5B4B3B2B1B0位名称-ET4ET3ES4ES3ET2ESPI ES2外部中断使能和时钟输出寄存器INT_CLKO(地址为8FH,复位值为x000x000B)位号B7B6B5B4B3B2B1B0位名称-EX4EX3EX2MCKO_S2T2CLKO T1CLKO T0CLKO中断优先级寄存器IP(地址为B8H,复位值为00H)位号B7B6B5B4B3B2B1B0位名称PPCA PLVD PADC PS PT1PX1PT0PX0第二中断优先级寄存器IP2(地址为B5H,复位值为xxx0 0000B)位号B7B6B5B4B3B2B1B0位名称---PX4PPWMFD PPWM PSPI PS2TMOD(地址为89H,复位值为00H)位号B7B6B5B4B3B2B1B0定时器名定时器1定时器0位名称GATE C/T M1M0GATE C/T M1M0T4和T3控制寄存器T4T3M(地址为D1H,复位值为00H)位号B7B6B5B4B3B2B1B0位名称TR4T4_C/T T4x12T4CLKO TR3T3_C/T T3x12T3CLKOT0重装值寄存器高字节TH0(地址为8CH)、T0重装值寄存器低字节TL0(地址为8AH)、T1重装值寄存器高字节TH1(地址为8DH)、T1重装值寄存器低字节TL1(地址为8BH)、T2重装值寄存器高字节TH2(地址为D6H)、T2重装值寄存器低字节TL2(地址为D7H)、T3重装值寄存器高字节TH3(地址为D4H)、T3重装值寄存器低字节TL3(地址为D5H)、T4重装值寄存器高字节TH4(地址为D2H)、T4重装值寄存器低字节TL4(地址为D3H)时钟分频寄存器CLK_DIV(地址为97H,复位值为0000 x000B)位号B7B6B5B4B3D2D1D0位名称MCKO_S1MCKO_S0ADRJ TX_RX-CLKS2CLKS1CLKS0SPI控制寄存器SPCTL(地址为CEH,复位值为0000 0100B)位号B7B6B5B4B3B2B1B0位名称SSIG SPEN DORD MSTR CPOL CPHA SPR1SPR0SPI数据寄存器SPDAT(地址为CFH,复位值为00H)位号B7B6B5B4B3B2B1B0位名称MSB LSBP1ASF(地址为9DH,复位值为00H)位号B7B6B5B4B3B2B1B0位名称P17ASF P16ASF P15ASF P14ASF P13ASF P12ASF P11ASF P10ASFA/D转换结果寄存器ADC_RES(地址为BDH,复位值为00H)和ADC_RESL(地址为BEH,复位值为00H)IAP15W4K61S4单片机的中断源及其相关控制中断源中断入口地址默认中断优先级次序号优先级设置相关位低优先级高优先级中断请求标志位中断允许控制位外部中断INT00003H0(最高)PX001IE0EX0/EA T0溢出中断000BH1PT001TF0ET0/EA 外部中断INT10013H2PX101IE1EX1/EA T1溢出中断001BH3PT101TF1ET1/EA 串口1UART10023H4PS01RI + TI ES/EA ADC002BH5PADC01ADC_FLAG EADC/EA LVD0033H6PLVD01LVDF ELVD/EAPCA003BH7PPCA01CF+CCF0+CCF1(ECF+ECCF0+ECCF1)/EA串口2UART20043H8PS201S2RI+S2TI ES2/EA SPI004BH9PSPI01SPIF ESPI/EA外部中断INT20053H100EX2/EA外部中断INT3005BH110EX3/EA T2溢出中断0063H120ET2/EA外部中断INT40083H160EX4/EA 串口3中断008BH170ES3/EA 串口4中断0093H180ES4/EA T3溢出中断009BH190ET3/EA T4溢出中断00A3H200ET4/EA 比较器中断00ABH210(PIE+NIE)/EA PWM中断00B3H22PPWM01CBIF(EPWM+ECBI)/EA PWM异常检测中断00BBH23(最低)PPWMFD01FDIF(EPWM+EFD+EFDI)/EA常用波特率与系统时钟及重装时间常数之间的关系时钟频率/MHz分频模式波特率/bit/s时间常数高字节(THn)时间常数低字节(TLn)19200FFH F4H9600FFH E8H11.059212T4800FFH D0HOCM4X8C液晶显示模块基本命令集控制引脚控制命令RS R/W E D7D6D5D4D3D2D1D0功能00100000001消除显示0010000001*地址归位(复位到0x00)001000001I/D S进入点设定00100001D C B显示状态控制0010001S/C R/L**游标或显示移位控制001001DL*RE**功能设定00101AC5AC4AC3AC2AC1AC0设置CGRAM地址0011AC6AC5AC4AC3AC2AC1AC0设置DDRAM地址011BF AC6AC5AC4AC3AC2AC1AC0读忙标志或地址101D7D6D5D4D3D2D1D0写数到内部RAM111D7D6D5D4D3D2D1D0从内部RAM读取数据表8-5 OCM4X8C液晶显示模块扩充命令集控制引脚控制命令RS R/W E D7D6D5D4D3D2D1D0功能00100000001待命模式(DDRAM填满0x20,光标复位到0x00)0010000001SR卷动地址或IRAM地址选择001000001R1R2反白选择图8-7 OCM4X8C外形图00100001SL**睡眠模式0010001*1REG0扩充功能设定00101AC5AC4AC3AC2AC1AC0设定IRAM地址或卷动地址0010AC6AC5AC4AC3AC2AC1AC0设定绘图RAM地址图8 128x64液晶串行接口方式的时序图。

24G15N 用户手册说明书

24G15N 用户手册说明书

24G15N安全 (1)标志惯例 (1)电源 (2)安装 (3)清洁 (4)其它 (5)设置 (6)物品清单 (6)安装支架和底座 (7)调整视角 (8)连接显示器 (9)Adaptive-Sync功能 (10)HDR (11)调节显示器 (12)热键 (12)OSD设定 (13)Luminance(明亮度) (14)Color Setup(颜色设置) (15)Picture Boost(窗口增亮) (16)OSD Setup(OSD设置) (17)Game Setting(游戏设置) (18)Extra(其它) (19)Exit(退出) (20)LED指示灯 (21)故障排除 (22)规格 (23)主要规格 (23)预设显示模式 (24)引脚分配 (25)即插即用版权说明.................................................................................................................................................................. ..................................................................................................................................................................2626安全标志惯例以下小节描述此文档中使用的标志惯例。

注释、注意和警告在本指南中,文本块可能带有图标并且以粗体或斜体打印。

这些文本块是注释、注意和警告,如下所示:注释:注意事项指示帮助你更好地使用你的计算机系统的重要信息。

注意:“注意”表示潜在的硬件损坏或数据丢失,并告诉您如何避免出现问题。

国电南自 PSL 641U线路保护测控装置技术说明书

国电南自 PSL 641U线路保护测控装置技术说明书

10
9
8
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6
5 4 3 2 1 序号
V1.24S V1.22 V1.10 V1.00 说明书版本号
增加计量功能 平台版本升级 改进版本 初始版本
修改摘要
PSL 641UV1.24S PSL 641UV1.22 PSL 641UV1.10 PSL 641UV1.00
软件版本号
2013.5 2011.3 2009.04 2007.04 修改日期
4 端子说明 ..............................................................................................................................................9 4.1 总端子图 .......................................................................................................................................9 4.2 交流模件端子 X1 定义...................................................................................................................9 4.3 CPU 模件端子 X2 定义 ...............................................................................................................10 4.4 计量模件端子 X3,X4 定义.........................................................................................................11 4.5 DI0 模件端子 X5 定义 .................................................................................................................12 4.6 DI0 模件端子 X6 定义 .................................................................................................................12 4.7 TRIP 模件端子 X7 定义...............................................................................................................13 4.8 TRIP 模件端子 X8 定义...............................................................................................................13

英飞凌MOS管型号

英飞凌MOS管型号

Automotive N-Channel MOSFETs Green and robust[/automotivemosfet]23OptiMOSTM –THEWELL-ESTABLISHED and continuously extended OptiMOS portfolio provides top quality,outstanding,robust and high-current capabilities.The OptiMOS devices are available in 30V,40V,55V and 75V in several packages.THE 30V OptiMOS TM -T2FAMILY includes a 2mΩ90A DPAK which can be used for reverse battery protection and bridge topologies.THE 40V OptiMOS TM -T FAMILY includes a sub-2mΩ180A D 2PAK and a 3.8mΩ90A DPAK.The 40V technology is well suited for electrical power steering,wipers,electric parking brake,fuel pump and any other PWM motor bridge topology.THE 55V OptiMOS TM -T FAMILY includes a 3mΩ100A D 2PAK and a 5mΩ90A DPAK.The 55V technology adroitly handles valves,solenoids,lighting,single-ended motors and other general purpose automotive loads.THE 100V OptiMOS TM -T FAMILY includes a 5mΩ120A D 2PAK to provide low R DS(on)MOSFET for direct diesel injection,direct gasoline injection,camless engine,boosted systems and direct injection.THE 30V OptiMOS TM -T and OptiMOS TM -T2P-CHANNEL PFET address the growing need for reverse battery protection without requiring a charge pump or ground path limitation.The PFET can be connected above the load to allow low-loss forward conduction and also prevent current flow in the event of reverse battery connection.The new OptiMOS TM -T2PFET provides 4mΩ,90A in DPAK.THE DUAL SUPER SO8PACKAGE was recently launched to provide higher levels of integration and lower system costs.The initial products launched in OptiMOS TM -T 55V technology.These products are optimized for ABS,powertrain and body control and can significantly reduce PCB area.THESE NEW MOSFET TECHNOLOGIES are optimized for low R DS(on),high current and robustness to provide the best possible balance of reliability,performance and price.4Green and robust packageAutomotive MOSFET green and robust packageIN ORDER TO cope with the new RoHS (Restriction of the use of Hazardous Substances Directive)and WEEE (Waste Electrical and Electronic Equipment)regulations,the electronics industry is moving from lead-based (Pb)to lead-free (Pb-free)Printed Circuit Board (PCB)solder.The Pb-free solders require higher solder reflow temperatures.Infineon Green and Robust MOSFETs can sustain up to 260°C peak reflow temperatures and still pass full AEC-Q101qualification.The consequence of this increased temperature stress with a standard package is delamination of the Mold compound (MC),which creates an air void between the MC and metallic interfaces (chip,lead-frame or pins).Depending on the severity,this can result in reduced lifetime or total failure.Infineon’s robust package was developed to fulfill the increased Pb-free solder reflow temperatures with increased reliability.Furthermore,Infineon’s Green and Robust package is fully compatible with existing Pb-based solder processes without any process modification.Solder the attachment:PbSnAg materialto enable increased solder reflow peak temperature up to 260°CMold compound:“Green,”without halogens and antimony III oxide to fulfill “green”material requirementsPre-mold treatment:Adhesion promoterto provide strong adhesion of Mold compound to all interfaces,even at increased solder conditions100%Sn lead finish:“Green”lead finish to fulfill “green”material requirementsRobust package5OptiMOS TM -T 55V in Dual Super SO8complete product portfolio:About the package:One Dual Super SO8package is 5.515mm 2x 6.15mm 2or ~32mm 2Single DPAK has a footprint of 6.5mm 2x 10mm 2or 65mm 2One Dual Super SO8can replace 2DPAKs so area will be reduced from 130mm 2to 32mm 24x reduction in PCB area and 2x reduction in part countDual Super SO8can replace two existing OptiMOS TM DPAK products for system level cost reduction (significant PCB area savings):2Types S/IPD 15N06S2L-64in DPAK to 1typeIPG 15N06S3L-45in TDSON-82Types S/IPD 26N06S2L-35in DPAK to 1typeIPG 20N06S3L-35in TDSON-82Types S/IPD 26N06S2L23in DPAK to 1typeIPG 20N06S3L-23in TDSON-8OptiMOS TM -T 55V in Dual Super SO8OptiMOS TM -T 55Vmax R DS(on)(mOhm)ID(A)max R thj (K/W)Package*IPG 20N06S3L-23 2 X 2320 3.38IPG 20N06S3L-35 2 X 3520 5.08IPG 15N06S3L-45 2 X 45157.08+=*See packages on page 15Freeze°C°C°C 67H-BRIDGE AND 3-PHASE MOTORS use 4or 6MOSFETs in the output stage.These motors require inrush currents 6-10times higher than run current.A 10A DC brush motor an 80A inrush current would then use 4D 2PAK MOSFETs.Changing the D 2PAKs to DPAKs would reduce the required PCB area by 50%and save significant costs.80A 80A90A90A More featuresor lower costHigher current in 1/2PCB space8All automotive MOSFETs beginning with the letter “I”are robust and green with full RoHS complianceCompany:S non Green products I Green products Device:P for Power MOSFET Package type:G for Dual TDSON-8P for TO220B for P-TO263/D 2-PAK D for D-PAK (TO252)I for I 2-PAK (TO262)Continuous drain current/I D (max)P for P-Channel N for N-ChannelBreakdown voltage divided by 10S for SIPMOS TM Planar N-Channel S2for OptiMOS TM Planar N-Channel S3for OptiMOS TM -T Trench N-Channel S4for OptiMOS TM -T2Trench N-Channel P3for OptiMOS TM -T Trench P-Channel P4for OptiMOS TM -T2P-Channel L for Logic level R DS(on)in mΩH5for 5.5mΩP D I 90N 06S3L –05Naming system9OptiMOS TM -T230V (Trench)TypeGreen max. R DS(on)[m Ω]I D [A]max. R thJC [K/W]Package*IPD 90N03S4L-02 2.290 1.13IPD 90N03S4L-03 3.090 1.63IPD 70N03S4L-04 4.370 2.23IPD 50N03S4L-06 6.050 2.73IPD 30N03S4L-099.030 3.63IPD 30N03S4L-1413.630 4.93IPP/I 80N03S4L-03 2.680 1.11,2IPP/I 80N03S4L-04 3.780 1.61,2IPP/I 22N03S4L-1514.922 4.91,2IPB 80N03S4L-02 2.380 1.14IPB 80N03S4L-03 3.480 1.64IPB 22N03S4L-1514.6224.94Automotive N-Channel MOSFETOptiMOS TM 30V (Planar)*See packages on page 15TypeGreenmax. R DS(on)[m Ω]I D [A]max. R thJC [K /W]Package*IPD 50N03S2L-06 6.450 1.13IPD 30N03S2L-07 6.730 1.13IPD 50N03S2-077.350 1.13IPD 30N03S2L-1010.030 1.53IPD 30N03S2L-2020.0302.53*See packages on page 1510Type Greenmax. R DS(on) [mΩ]I D[A]max. R thJC [K/W]Package* IPD90N04S3-04 3.690 1.13 IPD90N04S3-H4 4.390 1.23 IPD80N04S3-06 5.290 1.53 IPD70N04S3-07 6.082 1.93 IPD50N04S3-087.550 2.23 IPD50N04S3-099.050 2.33 IPP/I120N04S3-02 2.31200.51,2 IPP/I100N04S3-03 2.81000.71,2 IPP/I80N04S3-03 3.5800.81,2 IPP/I80N04S3-04 4.180 1.11,2 IPP/I80N04S3-H4 4.880 1.21,2 IPP/I80N04S3-06 5.780 1.51,2 IPP/I70N04S3-07 6.580 1.91,2 IPB180N04S3-02 1.51800.55 IPB120N04S3-02 2.01200.54 IPB160N04S3-H2 2.11600.75 IPB100N04S3-03 2.51000.74 IPB80N04S3-03 3.2800.84 IPB80N04S3-04 3.880 1.14 IPB80N04S3-H4 4.580 1.24OptiMOS TM40V(Planar)Type Green max. R DS(on) [mΩ]I D[A]max. R thJC[K/W]Package* IPP100N04S2L-03 3.31000.51IPP80N04S2L-03 3.4800.51IPP100N04S2-04 3.61000.51IPP/I80N04S2-04 3.7800.51,2IPP/I80N04S2-H44800.51,2IPB160N04S2L-03 2.71600.55IPB160N04S2-03 2.91600.55IPB100N04S2L-03 3.01000.54IPB80N04S2L-03 3.1800.54IPB100N04S2-04 3.31000.54IPB80N04S2-04 3.4800.54IPB80N04S2-H44800.54*See packages on page15 OptiMOS TM-T40V(Trench)OptiMOS TM75V(Planar)Type Green max. R DS(on) [mΩ]I D[A]max. R thJC[K/W]Package* IPD30N08S2L-2120.530 1.13 IPD30N08S2-2221.530 1.13 IPD22N08S2L-5050.022 2.03 IPP100N08S2L-07 6.81000.51 IPP100N08S2-077.11000.51 IPP80N08S2L-077.1800.51 IPP80N08S2-077.4800.51 IPB100N08S2L-07 6.51000.54 IPB100N08S2-07 6.81000.54 IPB80N08S2L-07 6.8800.54 IPB80N08S2-077.1800.54OptiMOS TM-T100VType Green max. R DS(on) [mΩ]I D[A]max. R thJC[K/W]Package* IPD70N10S3-1211.170 1.23 IPD70N10S3L-1211.570 1.23 IPD50N10S3L-161550 1.53 IPD35N10S3L-262435 2.13 IPD30N10S3L-343130 2.63 IPP/I100N10S3-05 5.11000.51,2 IPP/I70N10S3-1211.670 1.21,2 IPP/I70N10S3L-1212.170 1.21,2 IPP/I50N10S3L-1615.750 1.51,2 IPB100N10S3-05 4.81000.54 IPB70N10S3-1211.370 1.24 IPB70N10S3L-1211.870 1.24 IPB50N10S3L-1615.450 1.54Type Green max. R DS(on) [mΩ]I D[A]max. R thJC[K/W]Package* IPB80N04S3-06 5.480 1.54IPB70N04S3-07 6.280 1.94 OptiMOS TM-T40V(Trench)*See packages on page15AustraliaBayswater,Victoria 3153T (+61)3-97218888Austria9500VillachT (+43)5-177701040ViennaT (+43)1-5177711100Belgium /Luxembourg /the Netherlands 2018AntwerpT (+31)10-21768003012KM RotterdamT (+31)10-2176800Brazil01311-200São PauloT (+55)11-33729240CanadaKanata,Ontario K2K 2E2T (+1)866-951951951ChinaBeijing 100083T (+86)10-82356118Hong KongT (+852)28-320500Shanghai 201203T (+86)21-61019000Taipei 115T (+886)2-26557500Denmark 2730HerlevT (+45)44-507700Finland02601EspooT (+358)10-6808400France13400AubagneT (+33)44-282461031700BlagnacT (+33)5-3455133093527Saint-Denis CEDEX 2T (+33)1-48097200Germany90449NurembergT (+49)911-3788076229KarlsruheT (+49)72-19628071254Ditzingen /Stuttgart T (+49)7156-17919047259DuisburgT (+49)203-729871191052ErlangenT (+49)9131-97001020099HamburgT (+49)40-2351947430539HanoverT (+49)511-876562085579Neubiberg T (+49)89-234090449NurembergT (+49)911-25293059581WarsteinT (+49)2902-7640Hungary1143BudapestT (+36)1-4712824IndiaBangalore 560066T (+91)80-41392001Iran15875-4773Teheran T (+98)2-16142317Ireland Dublin 2T (+353)1-7999500IsraelTel Aviv 69710T (+972)3-7657300Italy20128MilanT (+39)2-252041JapanNagoya-shi,Aichi 460-0003T (+81)52-2231570Osaka 530-0003T (+81)6-47974460Tokyo 141-0032T (+81)3-57457100KoreaSeoul 138-734T (+82)2-34600950Seoul 153-801T (+82)2-34600880Mexico44680Guadalajara,J.AL T (+52)33-36422101Poland03-821WarsawT (+48)22-8709150Puerto RicoCarolina,PR 00982T (+1787)257-7922Russia117198MoscowT (+7)495-9565195SingaporeSingapore 349282T (+65)68-762888South Africa 2146SandtonT (+27)11-7066099Spain28290Las Rozas de Madrid,MadridT (+34)91-630572828760Tres Cantos-Madrid T (+34)91-5147155Sweden16481KistaT (+46)8-7575000Switzerland 8048ZurichT (+41)1-4978040Turkey34742Kozyatagi,Istanbul T (+90)216-4640755United Kingdom Ascot SL 58ADT (+44)1344865900Bristol BS 348HPT (+44)11-79528823U.S.A.Kokomo,IN 46902T (+1)765-4561928Lebanon,NJ 08833T (+1)908-2365621Libertyville,IL 60048T (+1)847-9960480Livonia,MI 48152T (+1)734-7795000Milpitas,CA 95035T (+1)866-9519519San Diego,CA 92130T (+1)858-5092160INFINEON TECHNOLOGIESSALES OFFICES WORLDWIDE * Product Information,September 2008,Published by Infineon Technologies AG*and representative officesOrder No.B112-H8486-G3-X-7600Printed in GermanyWS 08081.。

AD S 芯片手册 中文

AD S 芯片手册 中文
应用
直流和交流伺服电机控制 编码器仿真 电动助力转向 电动汽车 集成的启动发电机/交流发电机 汽车运动检测与控制
概述
AD2S1210是一款10位至16位分辨率旋变数字转换器,集成 片上可编程正弦波振荡器,为旋变器提供正弦波激励。
转换器的正弦和余弦输入端允许输入3.15 V p-p ± 27%、频率 为2 kHz至20 kHz范围内的信号。Type II伺服环路用于跟踪 输入信号,并将正弦和余弦输入端的信息转换为输入角度 和速度所对应的数字量。最大跟踪速率为3125 rps。
旋变-数字转换 ....................................................................... 16 故障检测电路 ......................................................................... 16 片上可编程正弦波振荡器 ................................................... 18 合成参考生成 ......................................................................... 18 AD2S1210配置............................................................................. 20 工作模式................................................................................. 20 寄存器映射................................................................................... 21 位置寄存器 ............................................................................. 21 速度寄存器 ............................................................................. 21

STP15N06L中文资料

STP15N06L中文资料

STP15N06L STP15N06LFIN -CHANNEL ENHANCEMENT MODEPOWER MOS TRANSISTORs TYPICAL R DS(on)=0.115Ωs AVALANCHE RUGGED TECHNOLOGY s 100%AVALANCHE TESTEDs REPETITIVE AVALANCHE DATA AT 100o C s LOW GATE CHARGEs LOGIC LEVEL COMPATIBLE INPUT s 175o C OPERATING TEMPERATURE sAPPLICATION ORIENTED CHARACTERIZATIONAPPLICATIONS s HIGH CURRENT,HIGH SPEED SWITCHING s SOLENOID AND RELAY DRIVERS s REGULATORS s DC-DC &DC-AC CONVERTERS s MOTOR CONTROL,AUDIO AMPLIFIERS s AUTOMOTIVE ENVIRONMENT (INJECTION,ABS,AIR-BAG,LAMPDRIVERS,Etc.)INTERNAL SCHEMATIC DIAGRAM123TO-220ISOWATT220July 1993TYPE V DSS R DS(on)I D STP15N06L STP15N06LFI60V 60V<0.15Ω<0.15Ω15A 10AABSOLUTE MAXIMUM RATINGSSymbol ParameterValueUnitSTP15N06LSTP15N06LFIV D S Drain-source Voltage (V GS =0)60V V DG R Drain-gate Voltage (R GS =20k Ω)60V V GS Gate-source Voltage±15V I D Drain Current (continuous)at T c =25o C 1510A I D Drain Current (continuous)at T c =100o C 107A I D M (•)Drain Current (pulsed)6060A P tot Total Dissipation at T c =25o C 7035W Derating Factor0.470.23W/o C V ISO Insulation Withstand Voltage (DC)2000VT stg Storage Temperature-65to 175o C T jMax.Operating Junction Temperature175oC(•)Pulse width limited by safe operating area1231/10THERMAL DATATO-220ISOWATT220R thj-cas e Thermal Resistance Junction-case Max 2.14 4.29o C/WR thj-amb R t hc-sin kT l Thermal Resistance Junction-ambient MaxThermal Resistance Case-sink TypMaximum Lead Temperature For Soldering Purpose62.50.5300o C/Wo C/Wo CAVALANCHE CHARACTERISTICSSymbol Parameter Max Value UnitI A R Avalanche Current,Repetitive or Not-Repetitive(pulse width limited by T j max,δ <1%)15AE AS Single Pulse Avalanche Energy(starting T j=25o C,I D=I AR,V D D=25V)40mJE AR Repetitive Avalanche Energy(pulse width limited by T j max,δ <1%)10mJI A R Avalanche Current,Repetitive or Not-Repetitive(T c=100o C,pulse width limited by T j max,δ <1%)10AELECTRICAL CHARACTERISTICS(T case=25o C unless otherwise specified)OFFSymbol Parameter Test Conditions Min.Typ.Max.Unit V(BR)DSS Drain-sourceBreakdown VoltageI D=250µA V G S=060VI DS S Zero Gate VoltageDrain Current(V GS=0)V DS=Max RatingV DS=Max Rating x0.8T c=125o C2501000µAµAI G SS Gate-body LeakageCurrent(V D S=0)V GS=±15V±100nA ON(∗)Symbol Parameter Test Conditions Min.Typ.Max.Unit V G S(th)Gate Threshold Voltage V DS=V GS I D=250µA1 1.6 2.5VR DS(on)Static Drain-source OnResistance V GS=5V I D=7.5AV GS=5V I D=7.5A T c=100o C0.1150.150.3ΩΩI D(on)On State Drain Current V DS>I D(on)x R D S(on)maxV GS=10V15A DYNAMICSymbol Parameter Test Conditions Min.Typ.Max.Unitg fs(∗)ForwardTransconductanceV DS>I D(on)x R D S(on)max I D=7.5A59SC iss C oss C rss Input CapacitanceOutput CapacitanceReverse TransferCapacitanceV DS=25V f=1MHz V G S=03501505050020080pFpFpFSTP15N06L/FI 2/10ELECTRICAL CHARACTERISTICS(continued)SWITCHING ONSymbol Parameter Test Conditions Min.Typ.Max.Unitt d(on) t r Turn-on TimeRise TimeV DD=25V I D=7.5AR G=50 ΩV GS=5V(see test circuit,figure3)6019090270nsns(di/dt)on Turn-on Current Slope V DD=40V I D=15AR G=50 ΩV GS=5V(see test circuit,figure5)120A/µsQ g Q gs Q gd Total Gate ChargeGate-Source ChargeGate-Drain ChargeV DD=40V I D=15A V GS=5V127418nCnCnCSWITCHING OFFSymbol Parameter Test Conditions Min.Typ.Max.Unitt r(Vof f) t ft c Off-voltage Rise TimeFall TimeCross-over TimeV DD=40V I D=15AR G=50 ΩV GS=5V(see test circuit,figure5)40601106090160nsnsnsSOURCE DRAIN DIODESymbol Parameter Test Conditions Min.Typ.Max.UnitI S D I SDM(•)Source-drain CurrentSource-drain Current(pulsed)1560AAV S D(∗)Forward On Voltage I SD=15A V G S=0 1.5Vt rr Q rr I RRM Reverse RecoveryTimeReverse RecoveryChargeReverse RecoveryCurrentI SD=15A di/dt=100A/µsV DD=25V T j=150o C(see test circuit,figure5)800.184.5nsµCA(∗)Pulsed:Pulse duration=300µs,duty cycle1.5%(•)Pulse width limited by safe operating areaSafe Operating Areas For TO-220Safe Operating Areas For ISOWATT220STP15N06L/FI3/10Thermal Impedance For TO-220 Derating Curve For TO-220 Output Characteristics Thermal Impedance For ISOWATT220 Derating Curve For ISOWATT220 Transfer CharacteristicsSTP15N06L/FI 4/10STP15N06L/FI Transconductance Static Drain-source On ResistanceGate Charge vs Gate-source Voltage Capacitance VariationsNormalized Gate Threshold Voltage vsNormalized On Resistance vs Temperature Temperature5/10STP15N06L/FITurn-on Current Slope Turn-off Drain-source Voltage SlopeCross-over Time Switching Safe Operating AreaAccidental Overload Area Source-drain Diode Forward Characteristics 6/10Fig.2:Unclamped Inductive WaveformsFig.3:Switching Times Test Circuits For Resistive LoadFig.4:Gate Charge Test CircuitFig.5:Test Circuit For Inductive Load Switching And Diode Reverse Recovery TimeFig.1:Unclamped Inductive Load Test CircuitsSTP15N06L/FI7/10DIM.mminch MIN.TYP.MAX.MIN.TYP.MAX.A 4.40 4.600.1730.181C 1.23 1.320.0480.051D 2.402.720.0940.107D1 1.270.050E 0.490.700.0190.027F 0.610.880.0240.034F1 1.14 1.700.0440.067F2 1.14 1.700.0440.067G 4.95 5.150.1940.203G1 2.4 2.70.0940.106H210.010.400.3930.409L216.40.645L413.014.00.5110.551L5 2.65 2.950.1040.116L615.2515.750.6000.620L7 6.2 6.60.2440.260L9 3.5 3.930.1370.154DIA.3.75 3.850.1470.151L6ACDED 1FGL7L2Dia.F 1L5L4H 2L9F 2G 1TO-220MECHANICAL DATAP011CSTP15N06L/FI8/10DIM.mm inch MIN.TYP.MAX.MIN.TYP.MAX.A 4.4 4.60.1730.181B 2.5 2.70.0980.106D 2.5 2.750.0980.108E 0.40.70.0150.027F 0.7510.0300.039F1 1.15 1.70.0450.067F2 1.15 1.70.0450.067G 4.95 5.20.1950.204G1 2.4 2.70.0940.106H 1010.40.3930.409L2160.630L328.630.6 1.126 1.204L49.810.60.3850.417L615.916.40.6260.645L799.30.3540.366Ø3 3.20.1180.126L2ABDEHGL6ØFL3G 1123F 2F 1L7L4ISOWATT220MECHANICAL DATAP011GSTP15N06L/FI9/10STP15N06L/FIInformation furnished is believed to be accurate and reliable.However,SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use.No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.Specificationsmentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics.©1994SGS-THOMSON Microelectronics-All Rights ReservedSGS-THOMSON Microelectronics GROUP OF COMPANIESAustralia-Brazil-France-Germany-Hong Kong-Italy-Japan-Korea-Malaysia-Malta-Morocco-The Netherlands-Singapore-Spain-Sweden-Switzerland-Taiwan-Thailand-United Kingdom-U.S.A10/10。

DW06D(二合一锂电池保护IC)

DW06D(二合一锂电池保护IC)

一、 概述DW06D 产品是单节锂离子/锂聚合物可充电电池组保护的高集成度解决方案。

DW06D 包括了先进的功率MOSFET ,高精度的电压检测电路和延时电路。

DW06D 具有非常小的SOT23-6的封装,这使得该器件非常适合应用于空间限制得非常小的可充电电池组应用。

DW06D 具有过充,过放,过流,短路等所有的电池所需保护功能,并且工作时功耗非常低。

该芯片不仅仅是为手机而设计,也适用于一切需要锂离子或锂聚合物可充电电池长时间供电的各种信息产品的应用场合。

二、 特点内部集成等效50mΩ左右的先进的功率MOSFET ;过充电流保护; 3段过流保护:过放电流1、过放电流2(可选)、负载短路电流; 充电器检测功能;延时时间内部设定; 高精度电压检测;低静态耗电流:正常工作电流3.8uA 兼容ROHS 和无铅标准。

采用SOT23-6封装形式塑封。

三、 应用单芯锂离子电池组;锂聚合物电池组。

四、 订货信息五、 引脚图及说明七、电气特性参数八、功能描述DW06D监控电池的电压和电流,并通过断开充电器或负载,保护单节可充电锂电池不会因为过充电压,过放电压,过放电流以及短路等情况而损坏。

这些功能都使可充电电池工作在制定的范围内。

MOSFET已内置,等效电阻典型值为50mΩ正常工作模式如果没有检测到任何异常情况,充电和放电过程都将自由转换。

这种情况称为正常工作模式。

过充电压情况在正常条件下的充电过程中,当电池电压高于过充检测电压(VCU),并持续时间达到过充电压检测延迟时间(tCU)或更长,DW06D将控制MOSFET以停止充电。

这种情况称为过充电压情况。

以下两种情况下,过充电压情况将被释放:1、当电池电压低于过充解除电压 (VCL), DW06D控制充电的FET导通,回到正常工作模式下。

2、当连接一个负载并且开始放电, DW06D控制充电的FET导通回到正常工作模式下。

解除机制如下:接上负载后放电电流立刻流过充电FET内部寄生二极管开始放电,BATT-电压升到0.7V, DW06D 检测到这个电压后,当电池电压等于或低于过充检测电压(VCU), DW06D 立刻恢复到正常工作模式,另外,在接上负载放电时,如果BATT-电压等于或低于过流1检测电压,芯片也不会恢复到正常状态。

IPD25N06S2-40中文资料

IPD25N06S2-40中文资料

IPD25N06S2-40Parameter Symbol Conditions Unitmin.typ.max. Thermal characteristicsThermal resistance, junction - case R thJC-- 2.2K/W Thermal resistance, junction -ambient, leadedR thJA--100SMD version, device on PCB R thJA minimal footprint--756 cm2 cooling area2)--50 Electrical characteristics, at T j=25 °C, unless otherwise specifiedStatic characteristicsDrain-source breakdown voltage V(BR)DSS V GS=0 V, I D= 1 mA55--V Gate threshold voltage V GS(th)V DS=V GS, I D=26 µA 2.1 3.0 4.0Zero gate voltage drain current I DSS V DS=55 V, V GS=0 V,T j=25 °C-0.011µAV DS=55 V, V GS=0 V,T j=125 °C1)-1100Gate-source leakage current I GSS V GS=20 V, V DS=0 V-1100nA Drain-source on-state resistance R DS(on)V GS=10 V, I D=13 A, -28.640mΩValuesParameter Symbol ConditionsUnitmin.typ.max.Dynamic characteristics 1)Input capacitance C iss -513-pFOutput capacitanceC oss -163-Reverse transfer capacitance C rss -61-Turn-on delay time t d(on)-8-nsRise timet r -20-Turn-off delay time t d(off)-18-Fall timet f-19-Gate Charge Characteristics 1)Gate to source charge Q gs - 2.94nCGate to drain charge Q gd - 6.38Gate charge total Q g -14.018Gate plateau voltage V plateau-5.7-VReverse DiodeDiode continous forward current 1)I S --29ADiode pulse current1)I S,pulse --116Diode forward voltage V SDV GS =0 V, I F =25 A, T j =25 °C -0.91.3VReverse recovery time 1)t rr V R =30 V, I F =I S , d i F /d t =100 A/µs -31-nsReverse recovery charge 1)Q rr V R =30 V, I F =I S , d i F /d t =100 A/µs-40-nC1) Defined by design. Not subject to production test.2)Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air.T C =25 °CValues V GS =0 V, V DS =25 V, f =1 MHzV DD =30 V, V GS =10 V, I D =25 A, R G =22 ΩV DD =44 V, I D =25 A, V GS =0 to 10 V1 Power dissipation5 Typ. output characteristics9 Typ. Drain-source on-state resistance13 Typical avalanche energyPublished byInfineon Technologies AGAm Campeon 1-12D-85579 Neubiberg© Infineon Technologies AG 1999All Rights Reserved.Attention please!The information herein is given to describe certain components and shall not be considered asa guarantee of characteristics.Terms of delivery and rights to technical change reserved.We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.InformationFor further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies Office ()WarningsDue to technical requirements, components may contain dangerous substances.For information on the types in question, please contact your nearest Infineon Technologies Office. Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail,it is reasonable to assume that the health of the user or other persons may be endangered.。

AD15元件中英文对照表

AD15元件中英文对照表

AD15元件中英文对照表翻转空格V+F 可视窗tool Anno……sfootprint 封装altium designerndesign rualnet 网络标号BELL 铃,钟BRIDEG 1 整流桥(二极管)BUZZER 蜂鸣器BUZZER 蜂鸣器CAP 电容DIODE 二极管INDUCTOR 电感LAMP 灯泡LED 发光二极管NPN NPN三极管PNP 三极管SW-PB 开关DPY_7-SEG_DP 数码管RES1.2 电阻b 工具条选择eea 取消所有选择状态ctrl+del 删除pw 画导线pb 画总线pu画总线分支线pn 设置网络标号________________________________________________________________ _____ ____原理图常用库文件:Miscellaneous Devices.ddbDallas Microprocessor.ddbIntel Databooks.ddbProtel DOS Schematic Libraries.ddbPCB元件常用库:Advpcb.ddbGeneral IC.ddbMiscellaneous.ddb部分分立元件库元件名称及中英对照AND 与门ANTENNA 天线BA TTERY 直流电源BELL 铃,钟BVC 同轴电缆接插件BRIDEG 1 整流桥(二极管) BRIDEG 2 整流桥(集成块) BUFFER 缓冲器BUZZER 蜂鸣器CAP 电容CAPACITOR 电容CAPACITOR POL 有极性电容CAPV AR 可调电容CIRCUIT BREAKER 熔断丝COAX 同轴电缆CON 插口CRYSTAL 晶体整荡器DB 并行插口DIODE 二极管DIODE SCHOTTKY 稳压二极管DIODE V ARACTOR 变容二极管DPY_3-SEG 3段LEDDPY_7-SEG 7段LEDDPY_7-SEG_DP 7段LED(带小数点) ELECTRO 电解电容FUSE 熔断器INDUCTOR 电感INDUCTOR IRON 带铁芯电感INDUCTOR3 可调电感JFET N N沟道场效应管JFET P P沟道场效应管LAMP 灯泡LAMP NEDN 起辉器LED 发光二极管METER 仪表MICROPHONE 麦克风MOSFET MOS管MOTOR AC 交流电机MOTOR SERVO 伺服电机NAND 与非门NOR 或非门NOT 非门NPN NPN三极管NPN-PHOTO 感光三极管OPAMP 运放OR 或门PHOTO 感光二极管PNP 三极管NPN DAR NPN三极管PNP DAR PNP三极管POT 滑线变阻器PELA Y-DPDT 双刀双掷继电器RES1.2 电阻RES3.4 可变电阻RESISTOR BRIDGE ? 桥式电阻RESPACK ? 电阻SCR 晶闸管PLUG ? 插头PLUG AC FEMALE 三相交流插头SOCKET ? 插座SOURCE CURRENT 电流源SOURCE VOL TAGE 电压源SPEAKER 扬声器SW ? 开关SW-DPDY ? 双刀双掷开关SW-SPST ? 单刀单掷开关SW-PB 按钮THERMISTOR 电热调节器TRANS1 变压器TRANS2 可调变压器TRIAC ? 三端双向可控硅TRIODE ? 三极真空管V ARISTOR 变阻器ZENER ? 齐纳二极管DPY_7-SEG_DP 数码管SW-PB 开关74系列:74LS00 TTL 2输入端四与非门74LS01 TTL 集电极开路2输入端四与非门74LS02 TTL 2输入端四或非门74LS03 TTL 集电极开路2输入端四与非门74LS122 TTL 可再触发单稳态多谐振荡器74LS123 TTL 双可再触发单稳态多谐振荡器74LS125 TTL 三态输出高有效四总线缓冲门74LS126 TTL 三态输出低有效四总线缓冲门74LS13 TTL 4输入端双与非施密特触发器74LS132 TTL 2输入端四与非施密特触发器74LS133 TTL 13输入端与非门74LS136 TTL 四异或门74LS138 TTL 3-8线译码器/复工器74LS139 TTL 双2-4线译码器/复工器74LS14 TTL 六反相施密特触发器74LS145 TTL BCD—十进制译码/驱动器74LS15 TTL 开路输出3输入端三与门74LS150 TTL 16选1数据选择/多路开关74LS151 TTL 8选1数据选择器74LS153 TTL 双4选1数据选择器74LS154 TTL 4线—16线译码器74LS155 TTL 图腾柱输出译码器/分配器74LS156 TTL 开路输出译码器/分配器74LS157 TTL 同相输出四2选1数据选择器74LS158 TTL 反相输出四2选1数据选择器74LS16 TTL 开路输出六反相缓冲/驱动器74LS160 TTL 可预置BCD异步清除计数器74LS161 TTL 可予制四位二进制异步清除计数器74LS162 TTL 可预置BCD同步清除计数器74LS163 TTL 可予制四位二进制同步清除计数器74LS164 TTL 八位串行入/并行输出移位寄存器74LS165 TTL 八位并行入/串行输出移位寄存器74LS166 TTL 八位并入/串出移位寄存器74LS169 TTL 二进制四位加/减同步计数器74LS17 TTL 开路输出六同相缓冲/驱动器74LS170 TTL 开路输出4×4寄存器堆74LS173 TTL 三态输出四位D型寄存器74LS174 TTL 带公共时钟和复位六D触发器74LS175 TTL 带公共时钟和复位四D触发器74LS180 TTL 9位奇数/偶数发生器/校验器74LS181 TTL 算术逻辑单元/函数发生器74LS185 TTL 二进制—BCD代码转换器74LS190 TTL BCD同步加/减计数器74LS191 TTL 二进制同步可逆计数器74LS192 TTL 可预置BCD双时钟可逆计数器74LS193 TTL 可预置四位二进制双时钟可逆计数器74LS194 TTL 四位双向通用移位寄存器74LS195 TTL 四位并行通道移位寄存器74LS196 TTL 十进制/二-十进制可预置计数锁存器74LS197 TTL 二进制可预置锁存器/计数器74LS20 TTL 4输入端双与非门74LS21 TTL 4输入端双与门74LS22 TTL 开路输出4输入端双与非门74LS221 TTL 双/单稳态多谐振荡器74LS240 TTL 八反相三态缓冲器/线驱动器74LS241 TTL 八同相三态缓冲器/线驱动器74LS243 TTL 四同相三态总线收发器74LS244 TTL 八同相三态缓冲器/线驱动器74LS245 TTL 八同相三态总线收发器74LS247 TTL BCD—7段15V输出译码/驱动器74LS248 TTL BCD—7段译码/升压输出驱动器74LS249 TTL BCD—7段译码/开路输出驱动器74LS251 TTL 三态输出8选1数据选择器/复工器74LS253 TTL 三态输出双4选1数据选择器/复工器74LS256 TTL 双四位可寻址锁存器74LS257 TTL 三态原码四2选1数据选择器/复工器74LS258 TTL 三态反码四2选1数据选择器/复工器74LS259 TTL 八位可寻址锁存器/3-8线译码器74LS26 TTL 2输入端高压接口四与非门74LS260 TTL 5输入端双或非门74LS266 TTL 2输入端四异或非门74LS27 TTL 3输入端三或非门74LS273 TTL 带公共时钟复位八D触发器74LS279 TTL 四图腾柱输出S-R锁存器74LS28 TTL 2输入端四或非门缓冲器74LS283 TTL 4位二进制全加器74LS290 TTL 二/五分频十进制计数器74LS293 TTL 二/八分频四位二进制计数器74LS295 TTL 四位双向通用移位寄存器74LS298 TTL 四2输入多路带存贮开关74LS299 TTL 三态输出八位通用移位寄存器74LS30 TTL 8输入端与非门74LS32 TTL 2输入端四或门74LS322 TTL 带符号扩展端八位移位寄存器74LS323 TTL 三态输出八位双向移位/存贮寄存器74LS33 TTL 开路输出2输入端四或非缓冲器74LS347 TTL BCD—7段译码器/驱动器74LS352 TTL 双4选1数据选择器/复工器74LS353 TTL 三态输出双4选1数据选择器/复工器74LS365 TTL 门使能输入三态输出六同相线驱动器74LS365 TTL 门使能输入三态输出六同相线驱动器74LS366 TTL 门使能输入三态输出六反相线驱动器74LS367 TTL 4/2线使能输入三态六同相线驱动器74LS368 TTL 4/2线使能输入三态六反相线驱动器74LS37 TTL 开路输出2输入端四与非缓冲器74LS373 TTL 三态同相八D锁存器74LS374 TTL 三态反相八D锁存器74LS375 TTL 4位双稳态锁存器74LS377 TTL 单边输出公共使能八D锁存器74LS378 TTL 单边输出公共使能六D锁存器74LS379 TTL 双边输出公共使能四D锁存器74LS38 TTL 开路输出2输入端四与非缓冲器74LS380 TTL 多功能八进制寄存器74LS39 TTL 开路输出2输入端四与非缓冲器74LS390 TTL 双十进制计数器74LS393 TTL 双四位二进制计数器74LS40 TTL 4输入端双与非缓冲器74LS42 TTL BCD—十进制代码转换器74LS352 TTL 双4选1数据选择器/复工器74LS353 TTL 三态输出双4选1数据选择器/复工器74LS365 TTL 门使能输入三态输出六同相线驱动器74LS366 TTL 门使能输入三态输出六反相线驱动器74LS367 TTL 4/2线使能输入三态六同相线驱动器74LS368 TTL 4/2线使能输入三态六反相线驱动器74LS37 TTL 开路输出2输入端四与非缓冲器74LS373 TTL 三态同相八D锁存器74LS374 TTL 三态反相八D锁存器74LS375 TTL 4位双稳态锁存器74LS377 TTL 单边输出公共使能八D锁存器74LS378 TTL 单边输出公共使能六D锁存器74LS379 TTL 双边输出公共使能四D锁存器74LS38 TTL 开路输出2输入端四与非缓冲器74LS380 TTL 多功能八进制寄存器74LS39 TTL 开路输出2输入端四与非缓冲器74LS390 TTL 双十进制计数器74LS393 TTL 双四位二进制计数器74LS40 TTL 4输入端双与非缓冲器74LS42 TTL BCD—十进制代码转换器74LS447 TTL BCD—7段译码器/驱动器74LS45 TTL BCD—十进制代码转换/驱动器74LS450 TTL 16:1多路转接复用器多工器74LS451 TTL 双8:1多路转接复用器多工器74LS453 TTL 四4:1多路转接复用器多工器74LS46 TTL BCD—7段低有效译码/驱动器74LS460 TTL 十位比较器74LS461 TTL 八进制计数器74LS465 TTL 三态同相2与使能端八总线缓冲器74LS466 TTL 三态反相2与使能八总线缓冲器74LS467 TTL 三态同相2使能端八总线缓冲器74LS468 TTL 三态反相2使能端八总线缓冲器74LS469 TTL 八位双向计数器74LS47 TTL BCD—7段高有效译码/驱动器74LS48 TTL BCD—7段译码器/内部上拉输出驱动74LS490 TTL 双十进制计数器74LS491 TTL 十位计数器74LS498 TTL 八进制移位寄存器74LS50 TTL 2-3/2-2输入端双与或非门74LS502 TTL 八位逐次逼近寄存器74LS503 TTL 八位逐次逼近寄存器74LS51 TTL 2-3/2-2输入端双与或非门74LS533 TTL 三态反相八D锁存器74LS534 TTL 三态反相八D锁存器74LS54 TTL 四路输入与或非门74LS540 TTL 八位三态反相输出总线缓冲器74LS55 TTL 4输入端二路输入与或非门74LS563 TTL 八位三态反相输出触发器74LS564 TTL 八位三态反相输出D触发器74LS573 TTL 八位三态输出触发器74LS574 TTL 八位三态输出D触发器74LS645 TTL 三态输出八同相总线传送接收器74LS670 TTL 三态输出4×4寄存器堆74LS73 TTL 带清除负触发双J-K触发器74LS74 TTL 带置位复位正触发双D触发器74LS76 TTL 带预置清除双J-K触发器74LS83 TTL 四位二进制快速进位全加器74LS85 TTL 四位数字比较器74LS86 TTL 2输入端四异或门74LS90 TTL 可二/五分频十进制计数器74LS93 TTL 可二/八分频二进制计数器74LS95 TTL 四位并行输入\\输出移位寄存器74LS97 TTL 6位同步二进制乘法器CD系列::CD4000 双3输入端或非门+单非门TICD4001 四2输入端或非门HIT/NSC/TI/GOL CD4002 双4输入端或非门NSCCD4006 18位串入/串出移位寄存器NSCCD4007 双互补对加反相器NSCCD4008 4位超前进位全加器NSCCD4009 六反相缓冲/变换器NSCCD4010 六同相缓冲/变换器NSCCD4011 四2输入端与非门HIT/TICD4012 双4输入端与非门NSCCD4013 双主-从D型触发器FSC/NSC/TOS CD4014 8位串入/并入-串出移位寄存器NSC CD4015 双4位串入/并出移位寄存器TI CD4016 四传输门FSC/TICD4017 十进制计数/分配器FSC/TI/MOTCD4018 可预制1/N计数器NSC/MOTCD4019 四与或选择器PHICD4020 14级串行二进制计数/分频器FSCCD4021 08位串入/并入-串出移位寄存器PHI/NSCCD4022 八进制计数/分配器NSC/MOTCD4023 三3输入端与非门NSC/MOT/TICD4024 7级二进制串行计数/分频器NSC/MOT/TICD4025 三3输入端或非门NSC/MOT/TICD4026 十进制计数/7段译码器NSC/MOT/TICD4027 双J-K触发器NSC/MOT/TICD4028 BCD码十进制译码器NSC/MOT/TICD4029 可预置可逆计数器NSC/MOT/TICD4030 四异或门NSC/MOT/TI/GOLCD4031 64位串入/串出移位存储器NSC/MOT/TICD4032 三串行加法器NSC/TICD4033 十进制计数/7段译码器NSC/TICD4034 8位通用总线寄存器NSC/MOT/TICD4035 4位并入/串入-并出/串出移位寄存NSC/MOT/TI CD4038 三串行加法器NSC/TICD4040 12级二进制串行计数/分频器NSC/MOT/TICD4041 四同相/反相缓冲器NSC/MOT/TICD4042 四锁存D型触发器NSC/MOT/TICD4043 4三态R-S锁存触发器("1"触发) NSC/MOT/TI CD4044 四三态R-S锁存触发器("0"触发) NSC/MOT/TI CD4046 锁相环NSC/MOT/TI/PHICD4047 无稳态/单稳态多谐振荡器NSC/MOT/TICD4048 4输入端可扩展多功能门NSC/HIT/TICD4049 六反相缓冲/变换器NSC/HIT/TICD4050 六同相缓冲/变换器NSC/MOT/TICD4051 八选一模拟开关NSC/MOT/TICD4052 双4选1模拟开关NSC/MOT/TICD4053 三组二路模拟开关NSC/MOT/TICD4054 液晶显示驱动器NSC/HIT/TICD4055 BCD-7段译码/液晶驱动器NSC/HIT/TICD4056 液晶显示驱动器NSC/HIT/TICD4059 “N”分频计数器NSC/TICD4060 14级二进制串行计数/分频器NSC/TI/MOTCD4063 四位数字比较器NSC/HIT/TICD4066 四传输门NSC/TI/MOTCD4067 16选1模拟开关NSC/TICD4068 八输入端与非门/与门NSC/HIT/TICD4069 六反相器NSC/HIT/TICD4070 四异或门NSC/HIT/TICD4071 四2输入端或门NSC/TICD4072 双4输入端或门NSC/TICD4073 三3输入端与门NSC/TICD4075 三3输入端或门NSC/TICD4076 四D寄存器CD4077 四2输入端异或非门HITCD4078 8输入端或非门/或门CD4081 四2输入端与门NSC/HIT/TICD4082 双4输入端与门NSC/HIT/TICD4085 双2路2输入端与或非门CD4086 四2输入端可扩展与或非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器NSC/MOT/ST CD4094 8位移位存储总线寄存器NSC/TI/PHI CD4095 3输入端J-K触发器CD4096 3输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器NSC/MOT/TICD4099 8位可寻址锁存器NSC/MOT/STCD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器CD40106 六施密特触发器NSC\\TICD40107 双2输入端与非缓冲/驱动器HAR\\TICD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/***CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器CD40110 十进制加/减,计数,锁存,译码驱动STCD40147 10-4线编码器NSC\\MOTCD40160 可预置BCD加计数器NSC\\MOTCD40161 可预置4位二进制加计数器NSC\\MOTCD40162 BCD加法计数器NSC\\MOTCD40163 4位二进制同步计数器NSC\\MOTCD40174 六锁存D型触发器NSC\\TI\\MOTCD40175 四D型触发器NSC\\TI\\MOTCD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) NSC\\TI CD40193 可预置4位二进制加/减计数器NSC\\TICD40194 4位并入/串入-并出/串出移位寄存NSC\\MOT CD40195 4位并入/串入-并出/串出移位寄存NSC\\MOT CD40208 4×4多端口寄存器型号器件名称厂牌备注CD4501 4输入端双与门及2输入端或非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐)CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器注:同型号的74系列、74HC系列、74LS系列芯片,逻辑功能上是一样的。

Q15N06是什么管,在电路中的作用是什么?

Q15N06是什么管,在电路中的作用是什么?

Q15N06是什么管,在电路中的作用是什么?15N06是现在较常用的一种N沟道MOS场效应管,图片中显示的管子封装为TO-252封装。

▲ TO-252封装的N沟道场效应管15N06。

这种贴片封装的功率MOS场效应管在现在的一些开关电源、锂电池充电器及小功率逆变器中使用很广。

其在电子电路中一般作为开关管驱动线圈用于升降压,或作为电子开关用于控制负载的通断。

顺便说一下,这种命名的场效应管,从型号便可以看出其主要电参数,使用很方便。

型号“15N06”中的“15”,表示该管的漏极电流ID为15A,字母“N”表示该管为N沟道场效应管(若为“P”,则表示该管为P沟道场效应管),“06”表示该管的耐压值为60V。

这种方法命名的场效应管,常用的还有以下一些型号。

▲上图为TO-92封装的N沟道场效应管1N60。

该管耐压值可达600V ,ID为1A(实际中,这种封装的管子不能在1A电流下工作,否则发热严重)。

该管可以代TO-92封装的BT169、MCR100-6等单向可控硅,并且驱动电流(≤1μA)比这些可控硅小得多。

▲ 上图为TO-251封装的1N60。

其参数与TO-92封装的1N60一样,但这种封装的带有散热片,其散热效果比TO-92封装的要好。

▲ 上图为TO-220F封装的N沟道场效应管2N60。

▲ TO-220F封装的N沟道场效应管7N60。

该管可以代替常用的IRF840场效应管。

▲ 上图为TO-252封装的P沟道场效应管30P06。

该管的ID可达30A(实际中,这种封装的管子散热不是很好,是不能在30A电流下工作的),耐压值为60V。

▲ 上图为TO-220封装的P沟道场效应管30P06。

该管与TO-252封装的30P06的参数一样,但散热效果比TO-252封装的管子好得多。

若想了解更多的电子电路知识,请关注本头条号,谢谢。

isis中英文元件名称对照

isis中英文元件名称对照

AD芯片-----TECHWELL TW6805A仿真软件里的AD0809有问题,用0808代替定时/计数器的使用方法:CLK:计数和测频状态时,数字波的输入端。

(counter enable)CE:计数使能端;通过属性设置高还是低有效。

无效暂停计数RST:复位端(RESET),可设上升沿(Low-High)或者下降沿(High-Low)有效。

4种工作方式:通过属性Operating Mode 来选择。

Default : 缺省方式,计数器方式。

Time(secs):100S定时方式,由CE和RST 控制暂停和重新开始。

Time(hms):10小时定时方式,同上。

Frequency: 测频方式,CE和RST有效时,显示CLK端数字波频率Count:计数方式。

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IPD15N06S2L-64
Parameter Symbol Conditions Unit
min.typ.max. Thermal characteristics
Thermal resistance, junction - case R thJC-- 3.2K/W Thermal resistance, junction -
ambient, leaded
R thJA--100
SMD version, device on PCB R thJA minimal footprint--75
6 cm2 cooling area2)--50 Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage V(BR)DSS V GS=0 V, I D= 1 mA55--V Gate threshold voltage V GS(th)V DS=V GS, I D=14 µA 1.2 1.6 2.0
Zero gate voltage drain current I DSS V DS=55 V, V GS=0 V,
T j=25 °C
-0.011µA
V DS=55 V, V GS=0 V,
T j=125 °C1)
-1100
Gate-source leakage current I GSS V GS=20 V, V DS=0 V-1100nA Drain-source on-state resistance R DS(on)V GS=4.5 V, I D=13 A-6185mΩDrain-source on-state resistance R DS(on)V GS=10 V, I D=13 A -4764mΩ
Values
Parameter Symbol Conditions
Unit
min.
typ.
max.
Dynamic characteristics 1)Input capacitance C iss -354-pF
Output capacitance
C oss -103-Reverse transfer capacitance C rss -38-Turn-on delay time t d(on)-4-ns
Rise time
t r -14-Turn-off delay time t d(off)-21-Fall time
t f
-
12
-
Gate Charge Characteristics 1)Gate to source charge Q gs -1 1.5nC
Gate to drain charge Q gd -45Gate charge total Q g -1113Gate plateau voltage V plateau
-
3.8
-
V
Reverse Diode
Diode continous forward current 1)I S --19A
Diode pulse current
1)
I S,pulse --76Diode forward voltage V SD
V GS =0 V, I F =15 A, T j =25 °C -
0.93
1.3
V
Reverse recovery time 1)t rr V R =30 V, I F =I S , d i F /d t =100 A/µs -34-ns
Reverse recovery charge 1)Q rr V R =30 V, I F =I S , d i F /d t =100 A/µs
-32-nC
1) Defined by design. Not subject to production test.
2)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air.
T C =25 °C
Values V GS =0 V, V DS =25 V, f =1 MHz
V DD =30 V, V GS =10 V, I D =15 A, R G =20 ΩV DD =44 V, I D =19 A, V GS =0 to 10 V
1 Power dissipation
5 Typ. output characteristics
9 Typ. Drain-source on-state resistance
13 Typical avalanche energy
Published by
Infineon Technologies AG
Am Campeon 1-12
D-85579 Neubiberg
© Infineon Technologies AG 1999
All Rights Reserved.
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