MPX5500DP;MPX5500D;中文规格书,Datasheet资料

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飞思卡尔传感器

飞思卡尔传感器飞思卡尔传感器motorola/freescale氣壓傳感器MPX10D MPX10DP MPX10GP MPX10GS MPXV10GC6U MPXV10GC7U MPX12D MPX12DP MPX12GP MPX2010D MPX2010DP MPX2010GP MPXT2010G7U MPX2050D MPX2050DP MPX2050GP MPX2050GVP MPX2050GS MPX2050GSX MPX2050GVSX MPX2053D MPX2053DP MPX2053GP MPX2100A MPX2100DP MPX2100AP MPX2100AS MPX2100ASX MPX2102A MPX2102D MPX2102DP MPX2102AP MPX2102GP MPX2102GVP MPX2200A MPX2200D MPX2200DP MPX2200AP MPX2200GP MPX2200A MPX2200D MPX2200DP MP2200AP MPX2200GP MPX21002A MPX2102D MPX2102DP MPX2102AP MPX2102GP MPX2102GVP MPX2200A MPX2200D MPX2200DP MPX2200AP MPX2200GP MPX2201GP MPX2300DT1 MPX4080D MPX4100A MPXA4100A6U MPX4100AP MPXA4100A6U MPX4100AS MPX4101A MPXA4101AC6U MPX4105A MPX4115A MPXA4115A6U MPX4115AP MPXA4115AC6U MPX4115AS MPX4200A MPX4200AP MPX4200SA MPX4200ASX MPX4250A MPX4250AP MPX4250A6U MPXA4250A6T1 MPXA4250AC6U MPXA4250AC6T1 MPX4250D MPX4250GP MPX4250DP MPX5010D MPX5010DP MPX5010GP MPX5010GS MPX5010GSX MPXV5010G6U MPXV5010G7U MPXV5010GC6U/T1 MPXV5010GC7U MPX5050D MPX5050DP MPX5050GP MPX5100A MPX5100D MPX5100DP MPX5100AP MPX5100GP MPX5100GVP MPX5100AS MPX5100GS MPX5100GVS MPX5100ASX MPX5100GSX MPX5100GVSX MPX53D MPX53GP MPX5500D MPX5500DP MPX5700D MPX5700A MPX5700DP MPX5700GP MPX5700AP MPX5700GS MPX5700AS MPX5999D飞思卡尔传感器MPXA6115A6U MPXA6115AC6U MPXA6115A MPXA6115A6T1 MPXA6115AC6T1 MPXAZ4100A6U MPXAZ4100A MPXAZ4100A6T1 MPXAZ4100AC6U MPXAZ4100AC6T1 MPXAZ4115A6U MPXZ4115A MPXAZ4115A6T1 MPXAX4115AC6U MPXAZ4115AC6T1 MPXC2011DT1 MPXM2010D MPXM2010DT1 MPXM2010GS MPXM2010GST1 MPXM2053D MPXM2053DT1 MPXM2053GS MPXM2053GST1 MPXV4006GC6U MPXV4006G6U MPXV4115V6U MPXV4115V6T1 MPXV4115VC6U MPXV5004GC6U/T1 MPXV5004G6U/T1 MPXV5004GC7U MPXV5004G7U MPXY8010 MPXY8020 MPXY8030 MPXY8040 MMA6200xxQ 低重力加速度（low-g）傳感器MPXA6115A 高溫精確集成壓力傳感器MPXAZ6115A 耐抗高溫壓力傳感器MPXH6115A 高溫精確集成壓力傳感器MP3H6115A 高溫精確集成壓力傳感器 MPXHZ6115A 媒體耐抗的高溫精確集成壓力傳感器MPXH6250A 集成壓力傳感器 MPXH6300A 壓力傳感器 MPXH6400A 集成壓力傳感器等汽車用壓力傳感器飞思卡尔传感器图片飞思卡尔传感器技术参数：参数符号最小典型最大单位压力范围Pop 10 100 100 Kpa供电电压Vs 10 16 Vdc供电电流Io 6.0 mAdc满程输出Vfss 38.5 40 41.5 mV零位偏差电压Voff -1.0 0 1.0 mV灵敏度ΔV/ΔP 0.4 mV/Kpa线性度-0.25 0.25 %Vfs压力迟滞±0.25 %Vfs温度迟滞（-40～125℃）±0.5% %Vfs满程温度系数TCVFss -1.0 1.0 %Vfs零位温度系数TCVoff -1.0 1.0 mV输入阻抗Zin 1000 2500 Ω输出阻抗Zout 1400 3000 Ω响应时间TR 1.0 Ms稳定度±0.5 %Vfss最大压力 4 FS破坏压力7 FS工作温度TA -40～125 ℃以上内容技术参数以《OIML60号国际建议》92年版为基础，最新具体变化可查看《JJG669—12 Freescale广州南创传感器事业部检定规程》。

迅达5500主板插件说明

迅达5500主板插件说明迅达5500主板是一款常见的计算机主板，下面是对其插件的说明：1. CPU插槽：迅达5500主板支持多种类型的CPU插槽，如Intel LGA 1151，用于安装处理器。

插槽上通常标有引脚的编号和方向，以确保正确插入处理器。

2. 内存插槽：迅达5500主板通常配备多个内存插槽，用于安装系统内存（RAM）。

这些插槽通常分为两组，每组支持不同类型的内存模块，如DDR4或DDR5。

每个插槽都标有容量、频率和最大支持的内存模块数量。

3. PCI插槽：迅达5500主板通常具有多个PCI插槽，用于安装扩展卡，如显卡、声卡或网卡。

这些插槽被设计为与PCI标准兼容，以便安装各种类型的扩展卡。

4. SATA插槽：迅达5500主板上通常有多个SATA插槽，用于连接硬盘驱动器、光盘驱动器、固态硬盘等存储设备。

这些插槽通常具有与SATA标准兼容的接口，用于传输数据和供电。

5. USB插槽：迅达5500主板通常配备多个USB插槽，用于连接外部设备，如鼠标、键盘、打印机、摄像头等。

插槽上标有USB标识，以便识别不同类型的USB接口，如USB 2.0或USB 3.0。

6. 声频插槽：迅达5500主板上通常有音频插槽，用于连接扬声器、耳机、麦克风等音频设备。

这些插槽通常遵循标准的音频接口规范，如3.5毫米立体声插孔。

7. 网络插槽：迅达5500主板通常具有Ethernet插槽，用于连接网络电缆，以实现有线网络连接。

这些插槽通常支持常见的网络标准，如RJ-45接口。

请注意，以上是对迅达5500主板插件的一般说明，具体的主板型号和制造商可能会有细微差异。

在安装或配置主板时，请参考相关的用户手册或官方文档，以确保正确使用插件并遵循制造商的建议。

MAX5500中文资料

General DescriptionThe MAX5500/MAX5501 integrate four low-power, 12-bit digital-to analog converters (DACs) and four precision output amplifiers in a small, 20-pin package. Each nega-tive input of the four precision amplifiers is externally accessible providing flexibility in gain configurations,remote sensing, and high output drive capacity, making the MAX5500/MAX5501 ideal for industrial-process-con-trol applications. Other features include software shut-down, hardware shutdown lockout, an active-low reset which clears all registers and DACs to zero, a user-pro-grammable logic output, and a serial-data output.Each DAC provides a double-buffered input organized as an input register followed by a DAC register. A 16-bit serial word loads data into each input register. The seri-al interface is compatible with SPI™/QSPI™/MICROWIRE™. The serial interface allows the input and DAC registers to be updated independently or simulta-neously with a single software command. The 3-wire interface simultaneously updates the DAC registers. All logic inputs are TTL/CMOS-logic compatible. The MAX5500 operates from a single +5V power supply,and the MAX5501 operates from a single +3V power supply. The MAX5500/MAX5501 are specified over the extended -40°C to +105°C temperature range.ApplicationsIndustrial Process Controls Automatic Test EquipmentMicroprocessor (µP)-Controlled Systems Motion ControlDigital Offset and Gain Adjustment Remote Industrial ControlsFeatures♦Four 12-Bit DACs with Configurable Output Amplifiers♦+5V or +3V Single-Supply Operation ♦Low Supply Current:0.85mA Normal Operation10µA Shutdown Mode (MAX5500)♦Force-Sense Outputs♦Power-On Reset Clears All Registers and DACs to Zero♦Capable of Recalling Last State Prior to Shutdown ♦SPI/QSPI/MICROWIRE Compatible♦Simultaneous or Independent Control of DACs through 3-Wire Serial Interface ♦User-Programmable Digital Output♦Guaranteed Over Extended Temperature Range (-40°C to +105°C)MAX5500/MAX5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface________________________________________________________________Maxim Integrated Products1Functional Diagram19-4368; Rev 0; 11/08For pricing, delivery, and ordering information,please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .Pin Configuration appears at end of data sheet.SPI/QSPI are trademarks of Motorola, Inc.MICROWIRE is a trademark of National Semiconductor, Corp.Ordering Information+Denotes a lead-free/RoHS-compliant package.*Future product—contact factory for availability.Note:All devices are specified over the -40°C to +105°C operating temperature range.M A X 5500/M A X 5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(MAX5500 (V DD = +5V ±10%, V REFAB = V REFCD = 2.5V), MAX5501 (V DD = +3V ±10%, V REFAB = V REFCD = 1.5V), V AGND = V DGND = 0,R= 5k Ω, C = 100pF, T = T to T , unless otherwise noted. Typical values at T = +25°C. Output buffer connected in unity-Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V DD to AGND............................................................-0.3V to +6V V DD to DGND...........................................................-0.3V to +6V AGND to DGND.....................................................-0.3V to +0.3V REFAB, REFCD to AGND...........................-0.3V to (V DD + 0.3V)OUT_, FB_ to AGND...................................-0.3V to (V DD + 0.3V)Digital Inputs to DGND.............................................-0.3V to +6V DOUT, UPO to DGND................................-0.3V to (V DD + 0.3V)Continuous Current into Any Pin.......................................±20mA Continuous Power Dissipation (T A = +70°C)20-Pin SSOP (derate 8.00mW/°C above +70°C).........640mW Operating Temperature Range .........................-40°C to +105°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CMAX5500/MAX5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(MAX5500 (V DD = +5V ±10%, V REFAB = V REFCD = 2.5V), MAX5501 (V DD = +3V ±10%, V REFAB = V REFCD = 1.5V), V AGND = V DGND = 0,M A X 5500/M A X 5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS (continued)(MAX5500 (V DD = +5V ±10%, V REFAB = V REFCD = 2.5V), MAX5501 (V DD = +3V ±10%, V REFAB = V REFCD = 1.5V), V AGND = V DGND = 0,R L = 5k Ω, C L = 100pF, T A = T MIN to T MAX , unless otherwise noted. Typical values at T A = +25°C. Output buffer connected in unity-gain configuration (Figure 9).)OUT DD Note 3:R L = ∞, digital inputs at DGND or V DD .INTEGRAL NONLINEARITY vs. REFERENCE VOLTAGEREFERENCE VOLTAGE (V)I N L (L S B )3.62.82.01.2-0.8-0.6-0.4-0.200.2-1.00.44.4INTEGRAL NONLINEARITY vs. REFERENCE VOLTAGEREFERENCE VOLTAGE (V)I N L (L S B )1.91.40.9-0.8-0.6-0.4-0.20-1.00.42.4SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)I D D (µA )1109580655035205-10-25-40860870880890900910850-55125Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)MAX5500/MAX5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface_______________________________________________________________________________________5SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)I D D (µA )1109580655035205-10-25-40740760780800820750770790810830730-55125FULL-SCALE ERRORvs. LOADLOAD (k Ω)I N L (L S B )1010.1-4-3-2-10-50.01100FULL-SCALE ERRORvs. LOADLOAD (k Ω)I N L (L S B )1010.1-4-3-2-1-50.01100SUPPLY CURRENT vs. SUPPLY VOLTAGEV DD (V)I D D (µA )5.255.004.757808008208408608809009209407604.505.50SUPPLY CURRENT vs. SUPPLY VOLTAGEV DD (V)I D D (µA )3.53.43.13.23.37847867887907927947967987823.03.6ANALOG CROSSTALK 5VMAX5500 toc0910µs/divOUTA 1V/divOUTBAC-COUPLED 10mV/divV REF = 2.5V, R L = 5k Ω, C L = 100pFDACA CODE SWITCHING FROM 00C hex TO FCC hex DACB CODE SET TO 800 hexANALOG CROSSTALK 3VMAX5500 toc1010µs/divOUTA 0.5V/divOUTBAC-COUPLED 50mV/divV REF = 1.5V, R L = 5k Ω, C L = 100pFDACA CODE SWITCHING FROM 00C hex TO FFF hex DACB CODE SET TO 800 hex DYNAMIC RESPONSE 5VMAX5500 toc1110µs/divOUTA 1V/divV REF = 2.5V, R L = 5k Ω, C L = 100pFSWITCHING FROM CODE 000 hex TO FB4 hex OUTPUT AMPLIFIER GAIN = +2Typical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)M A X 5500/M A X 5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial InterfaceDYNAMIC RESPONSE 3VMAX5500 toc1210µs/divOUTA 0.5V/divV REF = 1.5V, R L = 5k Ω, C L = 100pFSWITCHING FROM CODE 000 hex TO FB4 hex OUTPUT AMPLIFIER GAIN = +1DIGITAL FEEDTHROUGH 3V(SCLK = 100kHz)MAX5500 toc134µs/divSCLK 1V/div OUTAAC-COUPLED 10mV/divV REF = 1.5V, R L = 5k Ω, C L = 100pF V CS = V PDL = V CL = 3.3V, V DIN = 0V DACA CODE SET TO 800 hexDIGITAL FEEDTHROUGH 5V(SCLK = 100kHz)MAX5500 toc142µs/divSCLK 2V/divOUTAAC-COUPLED 10mV/divV REF = 2.5V, R L = 5k Ω, C L = 100pF V = V = V = 5V, V DIN = 0V DACA CODE SET TO 800 hexTypical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)MAX5500/MAX5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface_______________________________________________________________________________________7Detailed DescriptionThe MAX5500/MAX5501 integrate four 12-bit, voltage-output digital-to-analog converters (DACs) that are addressed through a simple 3-wire serial interface. The devices include a 16-bit data-in/data-out shift register.Each internal DAC provides a doubled-buffered input composed of an input register and a DAC register (see the Functional Diagram ). The negative input of each amplifier is externally accessible.The DACs are inverted rail-to-rail ladder networks that convert 12-bit digital inputs into equivalent analog out-put voltages in proportion to the applied reference volt-age inputs. DACs A and B share the REFAB input,while DACs C and D share the REFCD input. The two reference inputs allow different full-scale output voltage ranges for each pair of DACs. Figure 1 shows a simpli-fied circuit diagram of one of the four DACs.Reference InputsThe two reference inputs accept positive DC and AC signals. The voltage at each reference input sets the full-scale output voltage for the two corresponding DACs. The reference input voltage range is 0V to (V DD - 1.4V). The output voltages (V OUT_) are represented by a digitally programmable voltage source as:V OUT_= (V REF x NB/4096) x Gainwhere NB is the numeric value of the binary input code (0 to 4095) of the DAC. V REF is the reference voltage.Gain is the externally set voltage gain.The impedance at each reference input is code-depen-dent, ranging from a low value of 10k Ωwhen both DACs connected to the reference accept an input codeof 555 hex, to a high value exceeding giga-ohms with an input code of 000 hex. The load regulation of the ref-erence source affects the performance of the devices as the input impedance at the reference inputs is code dependent. The REFAB and REFCD reference inputs provide a 10k Ωguaranteed minimum input impedance.When the same voltage source drives the two reference inputs, the effective minimum impedance is 5k Ω. A volt-age reference with an excellent load regulation of 0.0002mV/mA, such as the MAX6033, is capable of dri-ving both reference inputs simultaneously at 2.5V.Driving REFAB and REFCD separately improves refer-ence accuracy.The REFAB and REFCD inputs enter a high-impedance state, with a typical input leakage current of 0.02µA,when the MAX5500/MAX5501 are in shutdown. The ref-erence input capacitance is also code dependent and typically ranges from 20pF with an input code of all 0s to 100pF with an input code of all 1s.Output AmplifiersAll DAC outputs are internally buffered by precision amplifiers with a typical slew rate of 0.6V/µs. Access to the inverting input of each output amplifier provides the greater flexibility in output gain setting/signal condition-ing (see the Applications Information section).With a full-scale transition at the output, the typical set-tling time to within ±0.5 LSB is 12µs when the output is loaded with 5k Ωin parallel with 100pF. A load of less than 2k Ωat the output degrades performance. See the Typical Operating Characteristics for the output dynamic responses and settling performances of the amplifiers.Power-Down ModeThe MAX5500/MAX5501 feature a software-program-mable shutdown that reduces supply current to a typi-cal value of 10µA. Drive PDL high to enable the shutdown mode. Write 1100XXXXXXXXXXXX as the input-control word to put the device in power-down mode (Table 1).In power-down mode, the output amplifiers and the ref-erence inputs enter a high-impedance state.The serial interface remains active. Data in the input registers is retained in power-down, allowing the devices to recall the output states prior to entering shut-down. Start up from power-down either by recalling the previous configuration or by updating the DACs with new data. Allow 15µs for the outputs to stabilize when powering up the devices or bringing the devices out of shutdown.Figure 1. Simplified DAC Circuit DiagramM A X 5500/M A X 5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface 8_______________________________________________________________________________________Figure 2. Connections for MICROWIRESerial-Interface ConfigurationsThe MAX5500/MAX5501s’ 3-wire serial interface is compatible with both MICROWIRE (Figure 2) and SPI/QSPI (Figure 3). The serial input word consists of two address bits and two control bits followed by 12data bits (MSB first), as shown in Figure 4. The 4-bit address/control code determines the MAX5500/MAX5501s’ response outlined in Table 1. The connec-tion between DOUT and the serial-interface port is not necessary, but may be used for data echo. Data held in the shift register can be shifted out of DOUT and returned to the µP for data verification.The digital inputs of the MAX5500/MAX5501 are double buffered. Depending on the command issued through the serial interface, the input register(s) can be loaded without affecting the DAC register(s), the DAC register(s) can be loaded directly, or all four DAC registers can be updated simultaneously from the input registers (Table 1).Serial-Interface DescriptionThe MAX5500/MAX5501 require 16 bits of serial data.Table 1 lists the serial-interface programming com-mands. For certain commands, the 12 data bits are don’t-care bits. Data is sent MSB first and can be sent in two 8-bit packets or one 16-bit word (CS must remain low until 16 bits are transferred). The serial data is com-posed of two DAC address bits (A1, A0) and two controlbits (C1, C0), followed by the 12 data bits D11–D0(Figure 4). The 4-bit address/control code determines:•The register(s) to be updated•The clock edge on which data is to be clocked out through the serial-data output (DOUT)•The state of the user-programmable logic output (UPO)•If the device is to enter shutdown mode (assuming PDL is high)•H ow the device is configured when exiting out of shutdown modeFigure 3. Connections for SPI/QSPIMAX5500/MAX5501Figure 5 shows the serial-interface timing requirements. The CS input must be low to enable the DAC’s serial interface. When CS is high, the interface control circuitry is disabled. CS must go low for at least t CSS before the rising serial clock (SCLK) edge to properly clock in the first bit. When CS is low, data is clocked into the internal shift register through the serial data input (DIN) on the rising edge of SCLK. The maximum guaranteed clock frequency is 10MHz. Data is latched into the appropriate input/DAC registers on the rising edge of CS.The programming command “load-all-dacs-from-shift-register” allows all input and DAC registers to be simul-taneously loaded with the same digital code from the input shift register. The no operation (NOP) command leaves the register contents unaffected. This feature is used in a daisy-chain configuration (see the Daisy Chaining Devices section).The command to change the clock edge on which seri-al data is shifted out of DOUT also loads data from all input registers to their respective DAC registers.Serial-Data Output (DOUT) The serial-data output, DOUT, is the internal shift regis-ter’s output. The MAX5500/MAX5501 can be pro-grammed so that data is clocked out of DOUT on the rising edge of SCLK (mode 1) or the falling edge (mode0). In mode 0, output data at DOUT lags input data atDIN by 16.5 clock cycles, maintaining compatibility with MICROWIRE, SPI/QSPI, and other serial interfaces. In mode 1, output data lags input data by 16 clock cycles.On power-up, DOUT defaults to mode 0 timing.User-Programmable Logic Output (UPO) The user-programmable logic output, UPO, allows an external device to be controlled through the MAX5500/MAX5501 serial interface (Table 1).Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface _______________________________________________________________________________________9M A X 5500/M A X 5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface 10______________________________________________________________________________________Figure 6. Detailed Serial-Interface Timing DiagramPower -Down Lockout (PDL )Drive power-down lockout, PDL , low to disable software shutdown. When in shutdown, transitioning PDL from high to low wakes up the device with the output set to the state prior to shutdown. Use PDL to asynchronously wake up the device.Daisy Chaining DevicesThe MAX5500/MAX5501 can be daisy chained by con-necting DOUT of one device to DIN of another device (Figure 7).Each DOUT output of the MAX5500/MAX5501 includes an internal active pullup. The sink/source capability of DOUT determines the time required to discharge/charge a capacitive load. See the serial-data-out V OH and V OL specifications in the Electrical Characteristics.Figure 8 shows an alternate method of connecting sev-eral MAX5500/MAX5501 devices. In this configuration,the data bus is common to all devices. Data is not shift-ed through a daisy chain. More I/O lines are required in this configuration because a dedicated chip-select input (CS ) is required for each IC.MAX5500/MAX5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface______________________________________________________________________________________11Figure 7. Daisy Chaining MAX5500/MAX5501Figure 8. Multiple MAX5500/MAX5501 Devices Sharing a Common DIN LineM A X 5500/M A X 5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface 12______________________________________________________________________________________Table 2. Unipolar Code TableTable 3. Bipolar Code TableApplications InformationUnipolar OutputFor a unipolar output, the output voltages and the refer-ence inputs are of the same polarity. Figure 9 shows the MAX5500/MAX5501 unipolar output circuit, which is also the typical operating circuit. Table 2 lists the unipo-lar output codes.See Figure 10 for rail-to-rail outputs. Figure 10 shows the MAX5500/MAX5501 with the output amplifiers con-figured with a closed-loop gain of +2 to provide 0 to 5V full-scale range with a 2.5V external reference voltage.Bipolar OutputFigure 11 shows the MAX5500/MAX5501 configured for bipolar operation.V OUT = V REF [(2NB/4096) - 1]where NB is the numeric value of the DAC’s binary input code. Table 3 shows digital codes (offset binary)and corresponding output voltages for the circuit of Figure 11.MAX5500/MAX5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface______________________________________________________________________________________13Digitally Programmable Current SourceThe circuit of Figure 12 places an npn transistor (2N3904 or similar) within the op-amp feedback loop to implement a digitally programmable, unidirectional cur-rent source. This circuit drives 4mA to 20mA current loops, which are commonly used in industrial-control applications. The output current is calculated with the following equation:I OUT = (V REF /R) x (NB/4096)where NB is the numeric value of the DAC’s binary input code and R is the sense resistor shown in Figure 12.Power-Supply ConsiderationsOn power-up, all input and DAC registers are cleared (set to zero code) and D OUT is in mode 0 (serial data is shifted out of DOUT on the clock’s falling edge).For rated MAX5500/MAX5501 performance, limit V REFAB /V REFCD to 1.4V below V DD . Bypass V DD with a 4.7µF capacitor in parallel with a 0.1µF capacitor to e short lead lengths and place the bypass capaci-tors as close as possible to the supply inputs.Grounding and Layout ConsiderationsDigital or AC transient signals between AGND and DGND create noise at the analog outputs. Connect AGND and DGND together at the DAC, and then con-nect this point to the highest-quality ground available.Good PCB ground layout minimizes crosstalk between DAC outputs, reference inputs, and digital inputs.Reduce crosstalk by keeping analog lines away from digital lines. Do not use wire-wrapped boards.Chip InformationPROCESS: BiCMOSM A X 5500/M A X 5501Low-Power, Quad, 12-BitVoltage-Output DACs with Serial Interface Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.14____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2008 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products, Inc.Package InformationFor the latest package outline information and land patterns, go to /packages .Pin Configuration。

MPX5000中文资料

Content
Board contents are described by the following parts list and the schematic in Figure 2. A pin by pin circuit description follows in the next section. Table 4. Parts List
Prepared by: Bill Lucas and Warren Schultz
A plug–in module that is part of a systems development tool set for pressure sensors is presented here. It provides an analog signal from an MPX5000 series sensor to a Motorola Sensor Development Controller, or can be used stand alone to provide power and signal connections to the sensor.
Figure 1. ASB205 — MPX5000 Series Sensor Module
REV 1
Motorola Sensor Device Data © Motorola, Inc. 1998
1
元器件交易网 AN1653
JT1 NC JT2 +5 JT3 VS1 JT4 CNTL JT5 KGND JT6 GND 1 +5 2 D1 1 RANGE R1 3 B+ TP2 5 9 4 8 3 7 2 6 1 VS2 R4 10 k 1% J1 U1 MPX5010 GND J3 RG OPEN 2 C3 0.33 mF 1 OUT GND 5 6 750 U2B + – MC33202 R2 750 C1 R5 300 2 D2 R3 300 RT1 10 k 0.33 mF C2 0.01 mF R6 47 k J4 TP3 3 2 U2A + – MC33202 1

ZCC5500 Datasheet V1.0

MHz V mA V
始能开关电压
2.0
ITRIKL VUV
涓流充电电流
VBAT<VTRIKL，RPROG= 1K 从 VCC 低至高 RPROG= 2K
●
150 5.8
VTRIKL
涓流充电门限电压 VCC 欠压闭锁门限
RPROG= 2K ，VBAT 上升
5.6
6.0
●
3.4 70
V
IBAT
C/10 终止电流门限 PROG 引脚电压
稳定输出（浮充）电压与温度关系曲线
70 60 50 40 30 20 10
8.415 8.410 8.405 8.400 8.395 8.390 8.385
RPROG=2k
ITR IKL (mA)
VBAT=4.5V
TA=25℃
RPROG=10k
0 4.0
4.5
5.0
5.5 VCC (V)
6.0
6.5
ZC C-C hin a
待机模式（充电终止） ● ● 850 μA μA ICC 输入电源电流停机模式（RPROG 未连接， VCC<VBAT，或 VCC<VUV） 0℃≤TA≤85℃， 700 700 VFLOAL 稳定输出（浮充）电压 8.32 8.4 500 8.48 V RPROG= 2K ，电流模式 RPROG= 1.4K，电流模式 ● ● ● mA mA BAT 引脚电流: VBAT=7.8V) VBAT=7.8V)
833
RPROG =
1000 （误差±10％） I BAT
６／９
无锡市至诚微电子有限公司
ZCC5500
充电终止
当充电电流在达到最终浮充电压之后降至设定值的１／１０时，充电循环被终止。该条件是

亿维自动化 X系列BD扩展板使用说明书

3.4. X-2AO-BD 产品说明书 ............................................................................................................ 19
3.4.1. 产品概述 ............................................................................................................................ 19
2.1.4. 模拟量 BD 扩展板地址对照表........................................................................................... 7
3. BD 扩展板详细参数..................................................................................................................................... 9
服务热线：4000 300 890
3.1.4. 安装及接线图 .................................................................................................................... 10
3.1.5. 应用说明 .............................................................................................................................11

基于MPX5500DP的智能数字天然气管道压力计设计

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MPXV5100DP中文资料

MPX5100Rev 10, 05/2005Freescale Semiconductor Technical Data© Freescale Semiconductor, Inc., 2005. All rights reserved.Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated, and CalibratedThe MPX5100 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachiningtechniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.Features • 2.5% Maximum Error over 0° to 85°C•Ideally suited for Microprocessor or Microcontroller-Based Systems •Patented Silicon Shear Stress Strain Gauge•Available in Absolute, Differential and Gauge Configurations •Durable Epoxy Unibody Element •Easy-to-Use Chip Carrier Option Typical Applications•Patient Monitoring •Process Control •Pump/Motor Control •Pressure Switching ORDERING INFORMATIONDevice TypeOptionsCase No.MPX Series OrderNumber Device MarkingUNIBODY PACKAGE (MPX5100 SERIES)Basic Elements Absolute 867MPX5100A MPX5100A Differential867MPX5100D MPX5100D Ported Elements Differential Dual Ports 867C MPX5100DP MPX5100DP Absolute, Single Port867B MPX5100AP MPX5100AP Gauge, Single Port 867B MPX5100GP MPX5100GP Gauge, Axial PC Mount 867F MPX5100GSX MPX5100D Gauge, Axial Port, SMT 482A MPXV5100GC6U MPXV5100G Gauge, Axial Port, DIP 482C MPX5V100GC7U MPXV5100G Gauge, Dual Port, SMT1351MPXV5100DPMPXV5100MPX5100/MPXV5100SERIESINTEGRATED PRESSURE SENSOR0 to 100 kpa (0 to 14.5 psi)15 to 115 kPa (2.2 to 16.7 psi)0.2 to 4.7 V Output PIN NUMBER (1)1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin1 is noted by the notch in the lead.1N/C 5N/C 2V S 6N/C 3GND 7N/C 4V OUT8N/CPIN NUMBER (1)1.Pins 4, 5, and 6 are internal deviceconnections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.1V OUT 4N/C 2GND 5N/C 3V S6N/CMPX5100SensorsFigure 1. Fully Integrated Pressure Sensor SchematicTABLE 1. Maximum Ratings (1)1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.RatingSymbol Value Unit Maximum Pressure (P1 > P2)P MAX 400kPa Storage Temperature T STG -40° to +125°C °C Operating TemperatureT A-40° to +125°C°CTABLE 2. Operating Characteristics (V S = 5.0 V DC , T A = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)CharacteristicSymbol Min Typ Max Unit Pressure Range (1)Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G Absolute: MPX5100A 1.0.1 kPa (kiloPascal) equals 0.145 psi.P OP015——100115kPaSupply Voltage (2)2.Device is ratiometric within this specified excitation range.V S 4.75 5.0 5.25V DC Supply CurrentI O —7.010mAdc Minimum Pressure Offset (3) (0 to 85°C)@ V S = 5.0 V 3.Offset (V OFF ) is defined as the output voltage at the minimum rated pressure.V OFF 0.0880.200.313V DC Full Scale Output (4)Differential and Absolute (0 to 85°C)@ V S = 5.0 V 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.V FSO 4.587 4.700 4.813V DC Full Scale Span (5)Differential and Absolute (0 to 85°C)@ V S = 5.0 V 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS — 4.500—V DC Accuracy (6)6.Accuracy (error budget) consists of the following:•Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled toand from the minimum or maximum operating temperature points, with zero differential pressure applied.•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimumor maximum rated pressure at 25°C.•TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.•TcOffset:Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C.•Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS at 25°C.———±2.5%V FSS Sensitivity V/P —45—mV/kPa Response Time (7)t R — 1.0—ms Output Source Current at Full Scale Output I O+—0.1—mAdc Warm-Up Time (8)——20—ms Offset Stability (9)——±0.5—%V FSSV SSensing ElementV OUTGain Stage # 2and Ground Reference Shift CircuitryPins 1 and 5 through 8 are NO CONNECTS for small outline packages GNDThin Film Temperature Compensation and Gain Stage # 1Pins 4, 5, and 6 are NO CONNECTS for unibody packagesMPX5100SensorsON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONINGFigure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0× to 85×C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range.Figure 3 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.The MPX5100 series pressure sensor operatingcharacteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensorperformance and long-term reliability. Contact the factory for information regarding media compatibility in your application.Figure 2. Output Vs. Pressure DifferentialFigure 3. Cross Sectional Diagrams (Not to Scale)Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D inputof a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.)7.Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when sugected to a specified step change in pressure.8.Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9.Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.O u t p u t V o l t a b e (V )543MAX102030405060708090100210110S p a n R a n g e (T y p )O u t p u t R a n g e (T y p )OffsetPressure (kPa)(Typ)MINTYPV out = V S *(0.009*P+0.04)± (Pressure Error * Temperature Factor * 0.009 * V S V S = 5.0 V ± 0.25 Vdc PE = 2.5TM = 1TEMP = 0 to 85°CFluorosilicone Gel Die Coat Wire BondLead FrameDieEpoxy PlasticCaseDifferential/Gauge ElementDie BondFluorosilicone GelDie Coat Wire BondLead FrameDieStainless Steel Metal CoverEpoxy PlasticCase Die BondAbsolute ElementStainless Steel Metal Cover470 pFVs+5.0 V0.01 µF GNDV OUT1.0 µFIPSOUTPUTMPX5100SensorsTransfer Function (MPX5100D, MPX5100G, MPXV5100G Nominal Transfer Value:V OUT = VS (P x 0.009 + 0.04)± (Pressure Error x Temp. Mult. x 0.009 x V S )V S = 5.0 V ±5% P kPaTemperature Error MultiplierMPX5100D/MPX5100G/MPXV5100G SeriesTemp Multiplier4.03.02.00.01.0-40-2020406014012010080- 4030 to 85°C 1+125°3Break Points Temperature in °CNote: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.Pressure Error BandPressure in kPa3.02.01.0-1.0-2.0-3.00.0020406080100120Pressure Error (max)0 to 100 kPa± 2.5 kPaE r r o r (k P a )Error Limits for PressureMPX5100D/MPX5100G/MPXV5100G SeriesMPX5100SensorsTransfer Function (MPX5100A)Nominal Transfer Value:V OUT = V S (P x 0.009 + 0.095)± (Pressure Error x Temp. Mult. x 0.009 x V S )V S = 5.0 V ±5% P kPaTemperature Error MultiplierMPX5100A Temp Multiplier 4.03.02.00.01.0-40-2020406013012010080140- 4030 to 85°C 1+125°3Break Points Temperature in °CNote: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.SeriesPressure Error BandPressure in kPa3.02.01.0-1.0-2.0-3.00.0020406080100130Pressure Error (max)15 to 115 kPa± 2.5 kPaE r r o r (k P a )Error Limits for PressureMPX5100A SeriesMPX5100SensorsPRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEFreescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The MPX pressuresensor is designed to operate with positive differential pressure applied, P1 > P2.The Pressure (P1) side may be identified by using Table 3 below.INFORMATION FOR USING THE SMALL OUTLINE PACKAGEMINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solderFigure5. Small Outline Package FootprintTABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEPart NumberCase TypePressure (P1) Side IdentifierMPX5100A, MPX5100D 867Stainless Steel Cap MPX5100DP867C Side with Part Marking MPX5100AP, MPX5100GP 867B Side with Port Attached MPX5100GSX 867F Side with Port Attached MPXV5100GC6U 482A Side with Port Attached MPXV5100GC7U 482C Side with Port Attached MPXV5100DP1351Side with Part MarkingPACKAGE DIMENSIONSCASE 482A-01ISSUE ASMALL OUTLINE PACKAGECASE 482C-03ISSUE BSMALL OUTLINE PACKAGEMPX5100 SensorsPACKAGE DIMENSIONSCASE 867-08ISSUE NUNIBODY PACKAGECASE 867B-04ISSUE FUNIBODY PACKAGEMPX5100SensorsPACKAGE DIMENSIONSCASE 867C-05ISSUE FUNIBODY PACKAGECASE 867F-03ISSUE DUNIBODY PACKAGEMPX5100SensorsPACKAGE DIMENSIONSCASE 1351-01ISSUE OSMALL OUTLINE PACKAGEMPX5100SensorsNOTESMPX5100 SensorsFreescale Semiconductor11How to Reach Us:Home Page:E-mail:support@USA/Europe or Locations Not Listed: Freescale SemiconductorTechnical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224+1-800-521-6274 or +1-480-768-2130 support@Europe, Middle East, and Africa:Freescale Halbleiter Deutschland GmbHTechnical Information CenterSchatzbogen 781829 Muenchen, Germany+44 1296 380 456 (English)+46 8 52200080 (English)+49 89 92103 559 (German)+33 1 69 35 48 48 (French)support@Japan:Freescale Semiconductor Japan Ltd.HeadquartersARCO Tower 15F1-8-1, Shimo-Meguro, Meguro-ku,Tokyo 153-0064Japan0120 191014 or +81 3 5437 9125support.japan@Asia/Pacific:Freescale Semiconductor Hong Kong Ltd.Technical Information Center2 Dai King StreetTai Po Industrial EstateTai Po, N.T., Hong Kong+800 2666 8080@For Literature Requests Only:Freescale Semiconductor Literature Distribution Center P.O. Box 5405Denver, Colorado 802171-800-441-2447 or 303-675-2140Fax: 303-675-2150 LDCForFreescaleSemiconductor@ Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners.© Freescale Semiconductor, Inc. 2005. All rights reserved.MPX5100 Rev. 10 05/2005。

MPXM2010D;MPX2010DP;MPXV2010GP;MPX2010GP;MPX2010D;中文规格书,Datasheet资料

Unit kPa kPa °C °C
Voltage Output versus Applied Differential Pressure
The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1).
Device Name
Package Options
Case No.
Small Outline Package (MPXV2010 Series)
MPXV2010GP
Tray
1369
MPXV2010DP
Tray
1351
Unibody Package (MPX2010 Series)
MPX2010D
Tray
VS 3
Figure 1. shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
Sensing Element
Thin Film Temperature Compensation and Calibration
Freescale Semiconductor
Pressure

W5500中文版数据手册V1.3

3 寄存器和内存构成 Register and Memory Organization .............................2 3.1 通用寄存器区 Common Register Block ........................................2 3.2 Socket 寄存器区 Socket Register Block .....................................2 3.3 内存 Memory ..............................................................3
2 主机接口.....................................................................8 2.1 SPI 工作模式 .............................................................9 2.2 SPI 数据帧 ...............................................................2 2.2.1 地址段 ............................................................2 2.2.2 控制段 ............................................................3 2.2.3 数据段 ............................................................5 2.3 可变数据长度模式（VDM）Variable Length Data Mode (VDM).....................2 2.3.1 写访问—VDM 模式 ...................................................2 2.3.2 读访问—VDM 模式 ...................................................2 2.4 固定数据长度模式（FDM）Fixed Length Data Mode (FDM) .......................2 2.4.1 写访问—FDM 模式 Write Access in FDM ................................2 2.4.2 读访问—FDM 模式 Read Access in FDM .................................2

Citrix Access Gateway_Datasheet

Citrix Access Gateway是一套适用于应用和桌面的领先安全接入解决方案• SmartAccess – 通过自适应应用级控制保护数据安全• 广泛的客户端支持• 可使用虚拟或物理设备进行灵活部署• 卓越的可扩展性和性能• 提高虚拟桌面和应用的速度随时随地安全便捷的应用访问Citrix® Access Gateway™是一套安全的应用接入解决方案，为管理员提供细粒度的应用层策略和行为控制能力，可保障应用和数据访问的安全，同时让用户可在任何地方开展工作。

它可为IT管理员提供单点控制、帮助确保合规性的工具和企业内外最高级别的信息安全性。

同时，它让用户可单点访问所需的企业应用和数据，单点访问功能还针对用户角色、设备和网络进行了优化。

这种独特的功能组合有助于最大程度地提高目前移动员工的生产率。

特性所有Access Gateway设备都包括针对Citrix® XenDesktop™和Citrix® XenApp™部署的安全接入功能，无任何附加费用，使其成为适合这些环境的集成程度最高、最经济高效的解决方案。

如果购买通用许可证（Universal License），还可以获得若干扩展功能，使Access Gateway 可以确保所有应用和数据类型的安全，并通过自适应策略实施强大的数据安全性。

通用许可证可单独购买，但是XenApp、XenDesktop和Citrix® NetScaler®的白金版中已经包括这一许可证。

1. 需要MPX 5500或NetScaler2. 需要Advanced Access Control服务器2特性包括的设备特性是否需要通用许可证基于场景的策略控制（SmartAccess）通过根据设备配置、位置和身份动态调整接入权限，配置最安全的数据和应用接入方式。

自适应接入控制根据端点分析结果提供针对资源的接入控制。

•虚拟托管应用和桌面的自适应接入控制为由XenDesktop和XenApp控制的应用和桌面提供自适应接入控制。

VNX5500招标参数

原厂出厂配置表及原厂中文使用说明书
原厂说明书：见附件。

技术响应表
技术服务、技术培训、售后服务的内容和措施
技术和售后服务内容：
1.安装服务：
首次安装由经EMC认证工程师提供安装调试服务。

2.保修和技术支持服务：
提供3年7*24设备保修和技术支持服务
3.培训服务
我公司注重培养用户及合作伙伴的技术力量。

我公司将根据工程的进展情况及时在设备安装过程中安排安装现场培训。

现场培训将根据系统设备的具体情况进行富有针对性的进行，此培训的主要目的是介绍系统设备的软硬件的安装、日常操作和管理维护，以及基本的故障诊断与排错技能，解决日常维护工作中可能会出现的问题。

MPX2050GP;MPX2050DP;MPX2050D;MPX2050GSX;中文规格书,Datasheet资料

Pressure Range(1) Supply Voltage(2) Supply Current
Characteristics
Symbol
Min
Typ
Max
Unit
POP
0
—
50
kPa
VS
—
10
16
Vdc
Io
—
6.0
—
mAdc
Full Scale Span(3)
VFSS
38.5
40
41.5
mV
Offset(4) Sensitivity
MPX2050 Series
0 to 50 kPa (0 to 7.25 psi) 40 mV Full Scale Span (Typical)
Application Examples
• Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Non-Invasive Blood Presescale Semiconductor
MPX2050 Rev 9, 10/2008
+ 50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors
The MPX2050 series devices are silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output, directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation.

施耐德电气SP5000系列硬件手册说明书

SP5000系列硬件手册SP5000-MM01-CS-PDF_J本文档中提供的信息包含有关此处所涉及产品之性能的一般说明和/或技术特性。

本文档并非用于 (也不代替) 确定这些产品对于特定用户应用场合的适用性或可靠性。

任何此类用户或设备集成商都有责任就相关特定应用场合或使用方面对产品执行适当且完整的风险分析、评估和测试。

Schneider Electric 或其任何附属机构或子公司 (以下简称Schneider Electric) 对于误用此处包含的信息而产生的后果概不负责。

如果您有关于改进或更正此出版物的任何建议、或者从中发现错误、请通知我们。

本手册可用于法律所界定的个人以及非商业用途。

在未获得施耐德电气书面授权的情况下，不得翻印传播本手册全部或部分相关内容、亦不可建立任何有关本手册或其内容的超文本链接。

施耐德电气不对个人和非商业机构进行非独占许可以外的授权或许可。

请遵照本手册或其内容原义并自负风险。

与此有关的所有其他权利均由施耐德电气保留。

在安装和使用本产品时、必须遵守国家、地区和当地的所有相关的安全法规。

出于安全方面的考虑和为了帮助确保符合归档的系统数据、只允许制造商对各个组件进行维修。

当设备用于具有技术安全要求的应用场合时、必须遵守有关的使用说明。

未能使用施耐德电气软件或认可的软件配合我们的硬件，则可能导致人身伤害、设备损坏或不正确的运行结果。

不遵守此信息可能导致人身伤害或设备损坏。

2SP5000 系列硬件手册目录安全信息. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7关于本书. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9第1章概述. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13型号配置 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14型号. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15装箱物品 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16认证与标准. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18联邦通讯委员会射频干扰声明 - 适用于美国. . . . . . . . . . . . . . . . . . . . . 20危险位置安装 - 适用于美国和加拿大. . . . . . . . . . . . . . . . . . . . . . . . . . 21符合欧盟 (CE) 标准 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23KC 标志. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24无线 LAN 信息. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25第2章设备连接. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29系统设计 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30附件. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32第3章部品标识及其功能. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373.1主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38标准主机模块. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39增强型主机模块. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41开放型主机模块. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43LED 指示. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453.2显示模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46精良显示 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47高级显示模块. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51LED 指示. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55第4章规格. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 574.1一般规格 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58规格电气 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59规格环境 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61结构规格 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 624.2功能规格 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65显示规格 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66存储器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67时钟. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68触摸屏 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 694.3接口规格 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70接口规格 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71接口连接 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74用于 COM1/COM2 的串行接口 (RS-232C 和 RS-422/RS-485) . . . . . 77辅助输出/扬声器输出接口 (AUX). . . . . . . . . . . . . . . . . . . . . . . . . . . . 80DVI-D 输出接口. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813第5章尺寸 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .835.1标准主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84SP-5B00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .845.2增强型主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85SP-5B10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .855.3开放型主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86SP-5B40/SP-5B41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .865.4精良显示模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87SP-5500TP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88SP-5600TP/SP-5660TP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89SP-5700TP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90SP-5700WC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91SP-5800WC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .925.5高级显示模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93SP-5400WA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .94SP-5500WA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95SP-5600WA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96SP-5600TA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .975.6主机模块和显示模块 - 组合尺寸. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .98SP-5500TP 带主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99SP-5600TP/SP-5660TP 带主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . .101SP-5700TP 带主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103SP-5700WC 带主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105SP-5800WC 带主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107SP-5400WA 带主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109SP-5500WA 带主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111SP-5600WA 带主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113SP-5600TA 带主机模块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115第6章安装和接线. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1176.1安装 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118安装步骤. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1186.2接线规则. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .130连接 DC 电源线 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .131连接电源. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133接地 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1356.3USB 电缆紧固夹. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136A 型 USB 电缆夹 (1 个端口) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .137USB 电缆夹 mini-B (1 个端口). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1396.4AUX 接头 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .141简介 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1416.5SD 卡插入/拔出 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .142简介 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143SD卡插入 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .144SD卡移除 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145SD 卡备份 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .146 4SP5000 系列硬件手册6.6CFast 卡插入/移除 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147简介. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148CFast卡插入. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149CFast卡移除. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150CFast 卡数据备份. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1516.7USB 前盖. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152打开 USB 前盖. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1526.8隔离设备和 USB/RS-422/485 转换适配器. . . . . . . . . . . . . . . . . . . . . . 154简介. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155安装到主机模块. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156第7章维护. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159定期清洁 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160定期检查事项. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161更换防水橡皮垫圈 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162更换原电池. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163更换系统卡 (SD 卡). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166更换系统卡 (CFast 卡) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168更换背光灯. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170售后服务 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171567SP5000 系列硬件手册安全信息重要信息声明在试图安装、操作、维修或维护设备之前，请仔细阅读下述说明并通过查看来熟悉设备。

BQ25601D Datasheet说明书

BQ25601D 具备 USB 充电器检测功能、用于高输入电压和窄电压直流 (NVDC) 电源路径管理的 I2C 控制型 3A 单节电池充电器1 特性•高效 1.5MHz 同步开关模式降压充电器–在 2A 电流（5V 输入）下具有 92% 的充电效率–针对 USB 电压输入 (5V) 进行了优化–用于轻负载运行的可选低功耗脉冲频率调制 (PFM) 模式•支持 USB On-The-Go (OTG)–具有高达 1.2A 输出的升压转换器–在 1A 输出下具有 92% 的升压效率–精确的恒定电流 (CC) 限制–高达 500µF 容性负载的软启动–输出短路保护–用于轻负载运行的可选低功耗 PFM 模式•单个输入，支持 USB 输入和高电压适配器–支持 3.9V 至 13.5V 输入电压范围，绝对最大输入电压额定值为 22V–可编程输入电流限制（100mA 至 3.2A，分辨率为 100mA），支持 USB 2.0、USB 3.0 标准和高电压适配器 (IINDPM)–通过高达 5.4V 的输入电压限制 (VINDPM) 进行最大功率跟踪–VINDPM 阈值自动跟踪电池电压–自动检测 USB BC1.2、SDP、CDP、DCP 以及非标准适配器•高电池放电效率，电池放电 MOSFET 为 19.5mΩ•窄 VDC (NVDC) 电源路径管理–无需电池或深度放电的电池即可瞬时启动–电池充电模式下实现理想的二极管运行•BATFET 控制，支持运输模式、唤醒和完全系统复位•灵活的自主和 I2C 模式，可实现出色的系统性能•高集成度包括所有 MOSFET、电流感测和环路补偿•17µA 低电池泄漏电流•高精度–±0.5% 充电电压调节–±5% 1.5A 充电电流调节–±10% 0.9A 输入电流调节•安全相关认证：–TUV IEC 62368 认证2 应用•智能手机•便携式互联网设备和附件3 说明BQ25601D 器件是一款适用于单节锂离子和锂聚合物电池的高度集成型 3A 开关模式电池充电管理和系统电源路径管理器件。

美国MOTOROLA MPX系列硅压力传感器说明书

美国MOTOROLA压力传感器美国MOTOROLA公司的MPX系列硅压力传感器，主要以气压测量为主，适合用于医疗器械，气体压力控制等领域，输出数字信号。

其测量方式可分为：表压（GP）、绝压（A、AP）、差压（D、DP）型。

在宽温度范围工作时需外加补偿网络和信号调整电路。

具体型号分类而定名称：MPX2010DP 名称：MPX5700DP MPX5700GP 名称：MPX2100AP名称：MPX5500DP 名称：MPX5100AP 名称：MPX5050DP名称：MPX5010DP 名称：MPX4115AP 名称：MPX2200A 名称：MPX2200AP 名称：MPXH6115A6U 名称：MPX4250DP名称：MPX4115A 名称：MPX2202DP 名称：MPX2102AP名称：MPX2053GP 名称：MPXY8300A6U 压力传感器名称：触力型压力传感器 FSG15N1A 名称：硅压力传感器 MPXH6115A 名称：MPX5700DP 硅压力传感器名称：MPX53GP 硅压力传感器名称：压力传感器FPM07 名称：轮胎压力传感器TP015 名称：轮胎压力传感器NPP301名称：Freescale 压力传感器 MPX2010DP商斯达实业传感器与智能控制分公司专门从事各种进口传感器的营销工作，代理多家欧美知名公司的产品。

涉及压力、温度、湿度、电流、液位、磁阻、霍尔、流量、称重、光纤、倾角、扭矩、气体、光电、位移、触力、红外、速度、加速度等多种产品。

广泛应用于航空航天、医疗器械（如血压计）、工业控制、冶金化工、汽车制造、教育科研等领域。

商斯达实业代理的品牌产品主要有：压力：Kulite、ACSI、Honeywell、Entran、Gems、Dwyer、SSI、Smi、Senstronics、Intersema、Motorola、 NAIS、E+H、Fujikura、Dytran、APM称重测力：Transcell、HBM、Interface、Thamesside、Philips、Entran 温湿度：Honeywell、Dwyer流量：Gems、Dwyer、Honeywell、Folwline、WorldMagnetics 液位：Honeywell、Siccom、Gems、Dwyer、Kulite、SSI 加速度：Entran、Silicondesigns、Dytran 压力开关：ACSI、Gems、Dwyer、台湾矽微航空器材：TexTech 隔音材料、Honeywell 薄膜加热片、DigirayX 射线探伤仪仪表：Honeywell、Transcell、东辉、上润、AD、东崎商斯达实业除代理上述产品外，还有几条传感器生产线，一条压力传感器组装线，可为用户提供各种用途的、特殊要求的配套产品。

pro-face sp5000系列硬件手册说明书

目录
SP5000-MM01-CS-PDF_O
安全信息 ....................................................................................................7 关于本书 ....................................................................................................8 概述......................................................................................................... 11
对于将本指南或其内容用作商业用途的行为，施耐德电气未授予任何权利或许可，但以“原样”为基础进行咨询的非独占个人许可除外。
施耐德电气的产品和设备应由合格人员进行安装、操作、保养和维护。
由于标准、规格和设计会不时更改，因此本指南中包含的信息可能会随时更改，恕不另行通知。
在适用法律允许的范围内，对于本资料信息内容中的任何错误或遗漏，或因使用此处包含的信息而导致或产生的后果，施耐德电气及其附属公司不会承担任何责任或义务。
标准主机模块 ................................................................................28 增强型主机模块............................................................................. 30 开放型主机模块............................................................................. 32 LED 指示 ......................................................................................34 显示模块 ............................................................................................35 精良显示模块 ................................................................................35 高级显示模块 ................................................................................39 LED 指示 ......................................................................................42 规格......................................................................................................... 44 一般规格 ............................................................................................44 电气规格....................................................................................... 44 环境规格....................................................................................... 46 结构规格....................................................................................... 47 功能规格 ............................................................................................49 显示规格....................................................................................... 49 存储器 ..........................................................................................51 时钟 .............................................................................................51 触摸屏 ..........................................................................................51 接口规格 ............................................................................................52 接口规格....................................................................................... 52 接口连接....................................................................................... 54 用于 COM1/COM2 的串行接口 (RS-232C 和 RS-422/RS485) .............................................................................................57 辅助输出/扬声器输出接口 (AUX) ....................................................59 DVI-D 输出接口.............................................................................60 尺寸......................................................................................................... 62 标准主机模块...................................................................................... 62 SP-5B00 ......................................................................................62 增强型主机模块 ..................................................................................63 SP-5B10 ......................................................................................63 开放型主机模块 ..................................................................................63

NM5500说明书_24位20160101

深圳市珈玛纳米电子有限公司NM5500多功能校准器使用说明书NM5500多功能校准器使用说明书深圳市珈玛纳米电子有限公司制造有限担保及责任范围深圳市珈玛纳米电子有限公司保证其每一个产品在正常使用及维护情形下，其用料和做工都是毫无瑕疵的。

保证期限是一年,并从产品寄运日起开始计算。

零件、产品修理及服务的保证期是90天。

本保证只提供给从深圳市珈玛纳米电子有限公司授权经销商处购买的原购买者或最终用户，且不包括保险丝、电池以及因误用、改变、疏忽、或非正常情况下的使用或搬运而损坏的产品。

深圳市珈玛纳米电子有限公司仅授权经销商将本保证提供给购买新的、未曾使用过的产品的最终用户。

经销商无权以深圳市珈玛纳米电子有限公司的名义来给予其它任何担保。

深圳市珈玛纳米电子有限公司的保证是有限的，在保用期间退回深圳市珈玛纳米电子有限公司的损坏产品，深圳市珈玛纳米电子有限公司有权决定采用退款、免费维修或把产品更换的方式处理。

欲取得保证服务，请与深圳市珈玛纳米电子有限公司服务中心联系，或把产品寄到深圳市珈玛纳米电子有限公司服务中心（请说明故障所在，预付邮资和保险费用）。

深圳市珈玛纳米电子有限公司不负责产品在运输上的损坏。

保用期修理以后，深圳市珈玛纳米电子有限公司会将产品寄回给购买者（预付运费）。

如深圳市珈玛纳米电子有限公司判断产品的故障是由于误用、改装、意外或非正常情况下的使用或搬运而造成，深圳市珈玛纳米电子有限公司会对维修费用作出估价，并取得购买者的同意以后才进行维修。

维修后，深圳市珈玛纳米电子有限公司会将把产品寄回给购买者（预付运费)，同时向购买者征收维修和运输的费用。

本项保证是购买者唯一及专有的补偿，凡因违反保证或根据合同、侵权行为、信赖或其它任何原因而引起的特别、间接、附带或继起的损坏或损失（包括数据的损失），深圳市珈玛纳米电子有限公司一概不予负责。

操作安全性摘要警告高压端子上可能带有致命电压，请务必遵守所有安全注意事项！为防止触电危险，操作者不应与高压输出或高压检测接线柱以及连接到这些终端的电路产生带电接触。

FARGO DTC5500LMX卡片打印机用户指南说明书

FARGO®DTC5500LMX C ARD P RINTERU SER G UIDEPLT-02496Version: 1.0December 2015December 2015Copyright© 2015 HID Global Corporation/ASSA ABLOY AB. All rights reserved.This document may not be reproduced, disseminated or republished in any form without the prior written permission of HID Global Corporation.TrademarksHID GLOBAL, HID, the HID logo, FARGO, and iCLASS, are trademarks or registered trademarks of HID Global Corporation, or its licensors, in the U.S. and other countries.MIFARE and MIFARE DESFire are registered trademarks of NXP B.V. and are used under license.ContactsFor additional offices around the world, see corporate offices.Americas and CorporateEurope, Middle East and Africa (EMEA)611 Center Ridge DriveAustin, TX 78753USAPhone:866 607 7339Fax:949 732 2120Haverhill Business Park Phoenix Road Haverhill, Suffolk CB9 7AE England Phone:44 (0) 1440 711 822Fax:44 (0) 1440 714 840 Asia PacificBrazil 19/F 625 King’s RoadNorth Point, Island EastHong KongPhone:852 3160 9833Fax:852 3160 4809Condomínio Business Center Av. Ermano Marchetti, 1435Galpão A2 - CEP 05038-001Lapa - São Paulo / SP Brazil Phone: +55 11 5514-7100HID Global Customer Support: ContentsChapter 1:Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1Regulatory Compliance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.1Agency Listings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.2United States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-21.1.3Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-21.1.4Taiwan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-21.1.5Japan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-21.1.6Korea . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-21.2Safety Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-31.2.1Safety Messages - United States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-31.2.2Safety Messages - French Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-41.2.3Safety Messages - Taiwan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-51.2.4Safety Messages - China . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-61.3Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-71.4Functional Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-81.5Printer Components: Print Ribbons. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-81.6Printer Components: Blank Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9 Chapter 2:Setup and Installation Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-12.1Selecting a Good Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12.1.1About Moisture Condensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-12.2Unpacking and Inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22.3Print Driver Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22.3.1Driver Installation Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32.4Installing the Print Ribbon. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-42.5Installing Blank Cards into the Input Card Hopper. . . . . . . . . . . . . . . . . . . . . . . . . . 2-52.6Printer Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6 Chapter 3:Printing Preferences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-13.1Card Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13.2Device Options Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33.3Image Color Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-53.3.1Advanced Image Color Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-73.4Image Calibrate Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-83.5Magnetic Encoding Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-93.5.1ISO Encoding Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-113.5.2Custom Encoding Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-113.5.3Raw Binary Encoding Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-12December 2015PLT-02496, Version: 1.03.5.4JIS II Encoding Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-123.5.5ISO Track Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-133.5.5.1Sending the Track Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-133.6Lamination Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-153.7Overlay/Print Area Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-173.7.1Define a Print Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-183.8K-Panel Resin Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-193.9Printer Info Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-20 Chapter 4:ToolBox . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-14.1Configuration Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24.2Calibrate Laminator Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34.3Calibrate Ribbon Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-44.4Clean Laminator Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-54.5Clean Printer Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-64.6Advanced Settings Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-74.6.1Settings Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-8 Chapter 5:Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-15.1System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15.1.1Sequence of Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-15.2Printer Error Buttons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25.2.1Printer Error Button and On-screen Messages . . . . . . . . . . . . . . . . . . . . . . 5-25.2.2Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25.2.3Troubleshooting with the Error Message Table . . . . . . . . . . . . . . . . . . . . .5-45.2.4Printer-Specific Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-155.2.4.1Additional Printer Specific Tools . . . . . . . . . . . . . . . . . . . . . . . . . 5-16 Chapter 6:Firmware Upgrades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-16.1Upgrade Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 Chapter 7:Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-17.1Technical Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17.1.1Reading the Serial Numbers on a FARGO Printer . . . . . . . . . . . . . . . . . . . .7-1December 2015Chapter1December 2015PLT-02496, Version: 1.0Specifications The purpose of this section is to provide specific information on the Regulatory Compliances, Agency Listings, T echnical Specifications and Functional Specifications for the HDP8500 Card Printer/Encoder.1.1Regulatory Compliance1.1.1Agency Listings AgencyRegulatory Compliance UL The Card Printer is listed under UL 60950-1 (2nd edition) Information T echnology Equipment.File Number: E145118CSA The printer manufacturer has been authorized by UL to represent the Card Printer as CSA Certified under CSA Standard C22.2 No. 60950-1-07 2nd editionFile Number: E145118FCC The Card Printer complies with the requirements in Part 15 of the FCC rules for a Class A digital device.CEThe Card Printer has been tested and complies with EN300-330-1, EN300-330-2, EN301-489-1, EN60950-1:2006 + A11:2009Note : Based on the above testing, the printer manufacturer certifies that the card printer complies with the following of the European Community and has placed the CE mark on the Card Printer.LVD 2006/95/EC, EMC 2004/108/EC, R&TTE 1999/5/EC, ROHS 2011/65/EU AgencyListing Emissions andImmunity StandardsFCC Part 15 Class A, RSS-GEN, RSS 210, CNS 13438, EN55022 Class A, EN55024, EN6100-3-2, EN6100-3-3, EN300-330-1, EN300-330-2, EN301-489-1, EN301-489-3, GB9254, GB17625Safety StandardsUL IEC 60950-1 (2nd edition), CSA C22.2 No. 60950-1-07(2nd edition), EN60950-1, GB4943, CNS14336Additional AgencyListings CCC, BSMI, KC1.1.2United StatesThis device complies with Part 15 of the FCC rules. Operation is subject to the following twoconditions:1.This device may not cause harmful interference.2.This device must accept any interference received, including interference that may causeundesired operation.Note: This equipment has been tested and found to comply with the limits for a Class A digitaldevice, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonableprotection against harmful interference when the equipment is operated in a commercialenvironment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference toradio communications. Operation of this equipment in a residential area is likely to cause harmfulinterference; in which case, correction of the interference is at the users expense.IMPORTANT: Changes or modifications to an intentional or unintentional radiator not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.1.1.3CanadaThis device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device mustaccept any interference, including interference that may cause undesired operation of the device.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillageradioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.1.1.4Taiwan經型式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之特性及功能。