TPD4E001DRLR-datasheet
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FEATURES
APPLICATIONS DESCRIPTION/ORDERING INFORMATION
IO3IO4V CC
QFN PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)IO3IO4V CC TPD4E001LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY FOR HIGH-SPEED DATA INTERFACES SLLS682C–JULY 2006–REVISED APRIL 2007•USB 2.0•ESD Protection Exceeds
•Ethernet –±15-kV Human-Body Model (HBM)
•FireWire™–±8-kV IEC 61000-4-2Contact Discharge
•Video –±15-kV IEC 61000-4-2Air-Gap Discharge
•Cell Phones •Low 1.5-pF Input Capacitance
•SVGA Video Connections •Low 1-nA (Max)Leakage Current
•Glucosemeters •Low 1-nA Supply Current
•0.9-V to 5.5-V Supply-Voltage Range
•Four-Channel Device
•Space-Saving DRL and QFN Package Options
•
Alternate 2-,3-,6-Channel Options Available:
TPD2E001,TPD3E001,and TPD6E001The TPD4E001is a low-capacitance ±15-kV ESD-protection diode array designed to protect sensitive electronics attached to communication lines.Each channel consists of a pair of diodes that steer ESD current pulses to V CC or GND.The TPD4E001protects against ESD pulses up to ±15-kV Human-Body Model (HBM),±8-kV Contact Discharge,and ±15-kV Air-Gap Discharge,as specified in IEC 61000-4-2.This device has a 1.5-pF capacitance per channel,making it ideal for use in high-speed data IO interfaces.
The TPD4E001is a quad-ESD structure designed for Ethernet and FireWire™applications.
The TPD4E001is available in DRL and thin QFN packages and is specified for –40°C to 85°C operation.
ORDERING INFORMATION
T A
PACKAGE (1)ORDERABLE PART NUMBER TOP-SIDE MARKING 1.6×1.6DRL Reel of 4000TPD4E001DRLR 2CR –40°C to 85°C
3×3QFN Reel of 1000TPD4E001DRSR ZWM (1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TI
website at .
Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Absolute Maximum Ratings (1)TPD4E001LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY FOR HIGH-SPEED DATA INTERFACES
SLLS682C–JULY 2006–REVISED APRIL 2007FUNCTIONAL BLOCK DIAGRAM
PIN DESCRIPTION
QFN/DRL NO.
NAME FUNCTION
1,2,4,5
IOx ESD-protected channel 3
GND Ground 6
V CC Power-supply input.Bypass V CC to GND with a 0.1-µF ceramic capacitor.EP EP Exposed pad.Connect to GND.over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT V CC
–0.37V V I/O
–0.3V CC +0.3V T stg
Storage temperature range –65150°C T J Junction temperature
150°C Infrared (15s)220Bump temperature (soldering)
°C Vapor phase (60s)215Lead temperature (soldering,10s)
300°C (1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied.Exposure to absolute maximum rating conditions for extended periods may affect device reliability.