MAX4427CSA-T中文资料
MAX471MAX472的中文资料大全
M A X471M A X472的中文资料大全(总4页)-本页仅作为预览文档封面,使用时请删除本页-MAX471/MAX472的特点、功能美国美信公司生产的精密高端电流检测放大器是一个系列化产品,有MAX471/MA X472、 MAX4172/MAX4173等。
它们均有一个电流输出端,可以用一个电阻来简单地实现以地为参考点的电流/电压的转换,并可工作在较宽电压内。
MAX471/MAX472具有如下特点:●具有完美的高端电流检测功能;●内含精密的内部检测电阻(MAX471);●在工作温度范围内,其精度为2%;●具有双向检测指示,可监控充电和放电状态;●内部检测电阻和检测能力为3A,并联使用时还可扩大检测电流范围;●使用外部检测电阻可任意扩展检测电流范围(MAX472);●最大电源电流为100μA;●关闭方式时的电流仅为5μA;●电压范围为3~36V;●采用8脚DIP/SO/STO三种封装形式。
MAX471/MAX472的引脚排列如图1所示,图2所示为其内部功能框图。
表1为MAX471/MAX472的引脚功能说明。
MAX471的电流增益比已预设为500μA/A,由于2kΩ的输出电阻(ROUT)可产生1V/A的转换,因此±3A时的满度值为3V.用不同的ROUT电阻可设置不同的满度电压。
但对于MAX471,其输出电压不应大于VRS+。
对于MAX472,则不能大于。
MAX471引脚图如图1所示,MAX472引脚图如图2所示。
MAX471/MAX472的引脚功能说明引脚名称功能MAX471MAX47211SHDN关闭端。
正常运用时连接到地。
当此端接高电平时,电源电流小于5μA2,3-RS+内部电流检测电阻电池(或电源端)。
“+”仅指示与SIGN输出有关的流动方向。
封装时已将2和3连在了一起-2空脚-3RG1增益电阻端。
通过增益设置电阻连接到电流检测电阻的电池端44GND地或电池负端55SIGN集电极开路逻辑输出端。
TC4427COA713;TC4427COA;TC4428COA;TC4426COA;TC4428EOA;中文规格书,Datasheet资料
DS21422D-page 2
/
© 2006 Microchip Technology Inc.
TC4426/TC4427/TC4428
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
VDD = 18V
Rise Time Fall Time Delay Time Delay Time Power Supply
tR
—
19 30 ns Figure 4-1
tF
—
19 30 ns Figure 4-1
tD1
—
20 30 ns Figure 4-1
tD2
—
40 50 ns Figure 4-1
Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ Max Units
Conditions
Input
Logic ‘1’, High Input Voltage
Supply Voltage ..................................................... +22V
Input Voltage, IN A or IN B ..................................... (VDD + 0.3V) to (GND – 5V)
Package Power Dissipation (TA ≤ 70°C) DFN .............................................................. Note 3 MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW
MAX4464EXK-T中文资料
General DescriptionThe MAX4464/MAX4470/MAX4471/MAX4472/MAX4474family of micropower op amps operate from a single +1.8V to +5.5V supply and draw only 750nA of supply current. The MAX4470 family feature ground-sensing inputs and Rail-to-Rail ®output. The ultra-low supply current, low-operating voltage, and rail-to-rail output capabilities make these operational amplifiers ideal for use in single lithium ion (Li+), or two-cell NiCd or alka-line battery systems.The rail-to-rail output stage of the MAX4464/MAX4470/ MAX4471/MAX4472/MAX4474 amplifiers is capable of driving the output voltage to within 4mV of the rail with a 100k Ωload, and can sink and source 11mA with a +5V supply. These amplifiers are available in both fully com-pensated and decompensated versions. The single MAX4470, dual MAX4471, and the quad MAX4472 are unity-gain stable. The single MAX4464 and the dual MAX4474 are stable for closed-loop gain configurations of ≥+5V/V. These amplifiers are available in space-sav-ing SC70, SOT23, µMAX, and TSSOP packages.ApplicationsFeatureso Ultra-Low 750nA Supply Current Per Amplifier o Ultra-Low +1.8V Supply Voltage Operation o Ground-Sensing Input Common-Mode Range o Outputs Swing Rail-to-Railo Outputs Source and Sink 11mA of Load Current o No Phase Reversal for Overdriven Inputs o High 120dB Open-Loop Voltage Gain o Low 500µV Input Offset Voltage o 9kHz Gain-Bandwidth Product (MAX4470/MAX4471/MAX4472)o 40kHz Gain-Bandwidth Product (MAX4464/MAX4474)o 250pF (min) Capacitive Load Capability o Available in Tiny 5-Pin SC70 and 8-Pin SOT23PackagesMAX4464/MAX4470/MAX4471/MAX4472/MAX4474Single/Dual/Quad, +1.8V/750nA, SC70,Rail-to-Rail Op Amps________________________________________________________________Maxim Integrated Products 1Pin Configurations19-2021; Rev 2; 2/03For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Ordering InformationRail-to-Rail is a registered trademark of Nippon Motorola, Ltd.Selector GuideBattery-Powered SystemsPortable Instrumentation Pagers and Cellphones Micropower ThermostatsElectrometer Amplifiers Solar-Powered Systems Remote Sensor Active Badges pH MetersM A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Single/Dual/Quad, +1.8V/750nA, SC70, Rail-to-Rail Op Amps 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V DD to V SS ...............................................................-0.3V to +6V IN_+ or IN_-......................................(V SS - 0.3V) to (V DD + 0.3V)OUT_ Shorted to V SS or V DD ......................................Continuous Continuous Power Dissipation (T A = +70°C)5-Pin SC70 (derate 3.1mW/°C above +70°C)...................247mW 5-Pin SOT23 (derate 7.1mW/°C above +70°C).................571mW 8-Pin SOT23 (derate 8.9mW/°C above +70°C).................714mW 8-Pin µMAX (derate 4.5mW/°C above +70°C)..................362mW8-Pin SO (derate 5.88mW/°C above +70°C)....................471mW 14-Pin TSSOP (derate 9.1mW/°C above +70°C)...........727mW 14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW Operating Temperature Range .........................-40°C to +85°C Junction Temperature .....................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s) ................................+300°CMAX4464/MAX4470/MAX4471/MAX4472/MAX4474Single/Dual/Quad, +1.8V/750nA, SC70,Rail-to-Rail Op Amps_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)ELECTRICAL CHARACTERISTICSM A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Single/Dual/Quad, +1.8V/750nA, SC70, Rail-to-Rail Op Amps 4_______________________________________________________________________________________Typical Operating Characteristics(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)0.20.10.50.40.30.70.80.60.91.5 3.0 3.52.0 2.5 4.0 4.5 5.0 5.5 6.0SUPPLY CURRENT PER AMPLIFIER vs.SUPPLY VOLTAGEM A X 4470–74 t o c 01SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (µA )0.20.10.50.40.30.70.80.60.9-500-25255075100SUPPLY CURRENT PER AMPLIFIER vs.TEMPERATUREM A X 4470–74 t o c 02TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )00.100.050.300.200.250.150.400.450.350.50-50-25255075100OFFSET VOLTAGE vs.TEMPERATUREM A X 4470–74 t o c 03TEMPERATURE (°C)O F F S E T V O L T A G E (m V )00.100.050.200.150.300.250.350.450.400.501.01.50.52.02.53.03.54.0OFFSET VOLTAGEvs. COMMON-MODE VOLTAGEM A X 4470-74 t o c 04COMMON-MODE VOLTAGE (V)O F F S E T V O L T A G E (m V )-400-350-150-250-200-300-50-1000-50-25255075100INPUT BIAS CURRENT vs.TEMPERATUREM A X 4470–74 t o c 05TEMPERATURE (°C)I N P U T B I A S C U R R E N T (p A )-90-70-80-40-50-60-20-10-3000 1.51.00.5 2.0 2.5 3.0 3.5 4.0INPUT BIAS CURRENT MON-MODE VOLTAGEM A X 4470–74 t o c 06COMMON-MODE VOLTAGE (V)I N P U T B I A S C U R R E N T (p A )0-1001010010k1kPOWER-SUPPLY REJECTION RATIO vs.FREQUENCY-80-90M A X 4470–74 t o c 07FREQUENCY (Hz)P S R R (d B )-60-70-40-30-50-20-1000.21.00.60.80.41.41.21.6-50-25255075100OUTPUT VOLTAGE SWING LOW vs.TEMPERATURETEMPERATURE (°C)V O L - V S S (m V )142356-500-25255075100OUTPUT VOLTAGE SWING HIGH vs.TEMPERATURETEMPERATURE (°C)V D D - V O H (m V )MAX4464/MAX4470/MAX4471/MAX4472/MAX4474Single/Dual/Quad, +1.8V/750nA, SC70,Rail-to-Rail Op Amps_______________________________________________________________________________________5-120-100-110-60-80-70-90-40-30-50-20-50-25255075100COMMON-MODE REJECTION RATIO vs.TEMPERATURETEMPERATURE (°C)C M R R (d B )00.40.20.80.61.21.01.4-5025-255075100MINIMUM SUPPLY VOLTAGEvs. TEMPERATUREM A X 4470-74 t o c 11TEMPERATURE (°C)M I N I M UM S U P P L Y V O L T A G E (V )607080901001101201301402.53.0 3.54.0 4.55.0A VOL vs. OUTPUT VOLTAGE SWINGOUTPUT VOLTAGE (Vp-p)A V O L (dB )11001k 10k10100kMAX4470/MAX4471/MAX4472GAIN AND PHASE vs. FREQUENCYFREQUENCY (Hz)G A I N (d B )P H A S E (d e g )80706050403020-60100-10-20-30-40-509045-1350-45-9011001k10k10100kMAX4470/MAX4471/MAX4472GAIN AND PHASE vs. FREQUENCYFREQUENCY (Hz)G A I N (d B )P H A S E (d e g )80706050403020-60100-10-20-30-40-501801359045-1350-45-90-40-140101001k 10k100kCROSSTALK vs. FREQUENCY-100-120FREQUENCY (Hz)C R O S S T A L K (d B )-80-6010.000.011010010k1kMAX4470/MAX4471/MAX4472TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCYM A X 4470–74 t o c 16FREQUENCY (Hz)T H D + N (%)0.101.0010k 10101k 100100k10kVOLTAGE NOISE DENSITY vs.FREQUENCYM A X 4470–74 t o c 17FREQUENCY (Hz)1001k N O I S E (n V /√H z )100k10010k100k 1MMAX4470/MAX4471/MAX4472 STABILITY vs. CAPACITIVE AND RESISTIVE LOADSRESISTIVE LOAD (Ω)1k10kC A P A C I T I V E L O AD (p F )Typical Operating Characteristics (continued)(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)500µs/divMAX4470/MAX4471/MAX4472SMALL-SIGNAL STEP RESPONSEINPUT 50mV/divOUTPUT 50mV/divV DD = +5V A V = +1V/V R L = 1M Ω C L = 250pF500µs/div MAX4470/MAX4471/MAX4472SMALL-SIGNAL STEP RESPONSEINPUT 50mV/divOUTPUT 50mV/div V DD = +5V A V = +1V/V R L = 1M Ω C L = 1000pF500µs/div MAX4470/MAX4471/MAX4472LARGE-SIGNAL STEP RESPONSEV DD = +5V A V = +1V/V R L = 1M ΩC L = 12pFINPUT 500mV/divOUTPUT 500mV/div500µs/divMAX4470/MAX4471/MAX4472LARGE-SIGNAL STEP RESPONSEINPUT 500mV/divOUTPUT 500mV/divV DD = +5V A V = +1V/V R L = 1M Ω C L = 1000pF052010152530010050150200250300MAX4470/MAX4471/MAX4472PERCENT OVERSHOOT vs. CAPACITIVE LOADC LOAD (pF)P E R C E N T O V E R S H O O T (%)3-71001k 10kMAX4470/MAX4471/MAX4472SMALL-SIGNAL GAIN vs. FREQUENCY-5-6FREQUENCY (Hz)G A I N (d B )-3-4-10-2123-71001k 100k10k MAX4470/MAX4471/MAX4472SMALL-SIGNAL GAIN vs. FREQUENCY-5-6FREQUENCY (Hz)G A I N (d B )-3-4-10-212M A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Single/Dual/Quad, +1.8V/750nA, SC70, Rail-to-Rail Op Amps 6_______________________________________________________________________________________0128416202428323640021345I OUT vs. V OUTV OUT (V)I O U T (m A )500µs/div MAX4470/MAX4471/MAX4472SMALL-SIGNAL STEP RESPONSE V DD = +5V A V = +1V/V R L = 1M ΩC L = 12pFINPUT 500mV/divOUTPUT 500mV/div Typical Operating Characteristics (continued)(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)MAX4464/MAX4470/MAX4471/MAX4472/MAX4474Single/Dual/Quad, +1.8V/750nA, SC70,Rail-to-Rail Op Amps_______________________________________________________________________________________7Typical Operating Characteristics (continued)(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)3-71001k 10k 100k MAX4470/MAX4471/MAX4472SMALL-SIGNAL GAIN vs. FREQUENCY-5FREQUENCY (Hz)G A I N (d B )-3-112-6-4-203-71001k 10k MAX4470/MAX4471/MAX4472LARGE-SIGNAL GAIN vs. FREQUENCY-5-6FREQUENCY (Hz)G A I N (d B )-3-4-10-2123-71001k 10kMAX4470/MAX4471/MAX4472LARGE-SIGNAL GAIN vs. FREQUENCY-5-6FREQUENCY (Hz)G A I N (d B )-3-4-10-2123-71001k 10kMAX4470/MAX4471/MAX4472LARGE-SIGNAL GAIN vs. FREQUENCY-5-6FREQUENCY (Hz)G A I N (d B )-3-4-10-21280-6011k 10k100k10FREQUENCY (Hz)G A I N (d B )10100MAX4464/MAX4474GAIN AND PHASE vs. FREQUENCY7060504030200-10-20-30-40-5018013590450-45-90-135P H A S E (d e g r e e s )80-6011k 10k100k10FREQUENCY (Hz)G A I N (d B )10100MAX4464/MAX4474GAIN AND PHASE vs. FREQUENCY7060504030200-10-20-30-40-5018013590450-45-90-135P H A S E (d e g r e e s )0.0011010k1k100MAX4464/MAX4474TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY100.0110.1M A X 4464 t o c 34FREQUENCY (Hz)T H D + N (%)100,00010010k100k 1MMAX4464/MAX4474STABILITY vs. CAPACITIVE AND RESISTIVE LOADSRESISTIVE LOAD (Ω)C A P A C I T I V E L O AD (p F )100010,000OUTPUT 50mV/divINPUT 10mV/divMAX4464/MAX4474SMALL-SIGNAL STEP RESPONSE500µs/divV DD = +5V A V = +5V/V R L = 1M ΩC L = 8pFM A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Single/Dual/Quad, +1.8V/750nA, SC70, Rail-to-Rail Op Amps 8_______________________________________________________________________________________OUTPUT 50mV/div INPUT 10mV/divMAX4464/MAX4474SMALL-SIGNAL STEP RESPONSEM A X 4464 t o c 37500µs/div V DD = +5V A V = +5V/V R L = 1M ΩC L = 250pFOUTPUT 50mV/div INPUT 10mV/divMAX4464/MAX4474SMALL-SIGNAL STEP RESPONSEM A X 4464 t o c 38500µs/div V DD = +5V A V = +5V/V R L = 1M ΩC L = 1000pFOUTPUT 500mV/divINPUT 100mV/divMAX4464/MAX4474LARGE-SIGNAL STEP RESPONSE500µs/divV DD = +5V A V = +5V/V R L = 1M ΩC L = 8pFOUTPUT 500mV/divINPUT 100mV/divMAX4464/MAX4474LARGE-SIGNAL STEP RESPONSE500µs/divV DD = +5V A V = +5V/V R L = 1M ΩC L = 1000pF10520152530010015050200250300MAX4464/MAX4474PERCENT OVERSHOOT vs. CAPACITIVE LOADC LOAD (pF)P E R C E N T O V E R S H O O T (%)2-7100100k10k 1k MAX4464/MAX4474SMALL-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )2-7100100k10k1kMAX4464/MAX4474SMALL-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )Typical Operating Characteristics (continued)(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)MAX4464/MAX4470/MAX4471/MAX4472/MAX4474Single/Dual/Quad, +1.8V/750nA, SC70,Rail-to-Rail Op Amps2-7100100k 10k 1k MAX4464/MAX4474LARGE-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )2-7100100k10k 1k MAX4464/MAX4474LARGE-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )2-7100100k 10k 1k MAX4464/MAX4474SMALL-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )2-7100100k10k 1k MAX4464/MAX4474LARGE-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )Typical Operating Characteristics (continued)(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)M A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Single/Dual/Quad, +1.8V/750nA, SC70, Rail-to-Rail Op Amps 10______________________________________________________________________________________Figure 2. Compensation for Feedback Node CapacitanceApplications InformationGround SensingThe common-mode input range of the MAX4470 family extends down to ground, and offers excellent common-mode rejection. These devices are guaranteed not to undergo phase reversal when the input is overdriven.Power Supplies and LayoutThe MAX4470 family operates from a single +1.8V to +5.5V power supply. Bypass power supplies with a 0.1µF ceramic capacitor placed close to the V DD pin. Ground layout improves performance by decreasing the amount of stray capacitance and noise at the op amp ’s inputs and outputs. To decrease stray capacitance, mini-mize PC board lengths and resistor leads, and place external components close to the op amps ’ pins.BandwidthThe MAX4470/MAX4471/MAX4472 are internally compensated for unity-gain stability and have a typical gain-bandwidth of 9kHz. The MAX4464/MAX4474 have a 40kHz typical gain-bandwidth and are stable for a gain of +5V/V or greater.StabilityThe MAX4464/MAX4470/MAX4471/MAX4472/MAX4474maintain stability in their minimum gain configuration while driving capacitive loads. Although this product family is primarily designed for low-frequency applica-tions, good layout is extremely important because low-power requirements demand high-impedance circuits.The layout should also minimize stray capacitance at the amplifier inputs. However some stray capacitance may be unavoidable, and it may be necessary to add a 2pF to 10pF capacitor across the feedback resistor as shown in Figure 2. Select the smallest capacitor value that ensures stability.Chip InformationMAX4470/MAX4464 TRANSISTOR COUNT: 147MAX4471/MAX4474 TRANSISTOR COUNT: 293MAX4472 TRANSISTOR COUNT: 585PROCESS: BiCMOSMAX4464/MAX4470/MAX4471/MAX4472/MAX4474Rail-to-Rail Op Amps______________________________________________________________________________________11M A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Rail-to-Rail Op AmpsS C 70, 5L .E P SPackage Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .MAX4464/MAX4470/MAX4471/MAX4472/MAX4474Rail-to-Rail Op AmpsPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .M A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Rail-to-Rail Op Amps Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses areimplied. Maxim reserves the right to change the circuitry and specifications without notice at any time.14____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.S O I C N .E P SPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .。
TC4422_中文数据手册
2006 Microchip Technology Inc.
1.0 电气特性
绝对最大值 †
供电电压............................................................... +20V 输入电压 ...........................(VDD + 0.3V) 至 (GND - 5V) 输入电流 (VIN > VDD)...................................... 50 mA 封装功耗 (TA ≤ 70°C)
80 ns 图 4-1
3
mA VIN = 3V
0.2
VIN = 0V
18
V
温度特性
电气规范:除非另外说明,否则所有参数均为 4.5V ≤ VDD ≤ 18V 条件下的值。
参数
符号 最小值 典型值 最大值 单位
条件
温度范围 规定温度范围 (商业级) 规定温度范围 (扩展级) 规定温度范围 (汽车级) 最高结温 储存温度范围 封装热阻 热阻, 5 引脚 TO-220 热阻, 8 引脚 6x5 DFN
2006 Microchip Technology Inc.
DS21420D_CN 第 3 页
TC4421/TC4422
直流特性 (在整个工作温度范围内)
电气规范:除非另外说明,否则温度超出正常工作范围,且 4.5V ≤ VDD ≤ 18V。
参数
符号
最小值 典型值 最大值 单位
条件
输入
逻辑 “1”,高输入电压 逻辑 “0”,低输入电压 输入电流 输出
VIH
2.4
—
VIL
—
Turck磁感应传感器产品说明书
T 08:30:42+02:00型号BIM-UNT-AY1X/S1139货号4685763通过速度ð 10 m/s 重复性ï ± 0.1 mm 温度漂移ð 0.1 mm 磁滞ð 1 mm环境温度-25…+70 °C 输出性能2线, NAMUR 开关频率 1 kHz电压Nom. 8.2 VDC 无激励电流损耗ð 1.2 mA 激励电流损耗ï 2.1 mA认证依据KEMA 04 ATEX 1152 X 内置 电感(L ) / 电容 (C )180 nF / 350 µH防爆标志防爆标识为II 1 G/Ex ia IIC T6/II 1 D Ex ia D 20 T95°C(最大 U = 20 V, I = 60 mA, P = 80 mW)设计方型, UNT 尺寸28 x 5 x 6 mm 外壳材料塑料, PP 感应面材料塑料, PP 紧固螺母的固定扭矩0.4 Nm 连接电缆线缆材质3 mm, 蓝, Lif9YYW, PVC, 2 m线缆横截面2 x 0.14mm 防震动性55 Hz (1 mm)防冲击性30 g (11 ms)防护等级IP67MTTF2283 years 符合SN 29500 (Ed.99) 40 °C认证安装在以下剖面.Cylindrical design E N K F 开关状态指示LED指示灯 黄可供货电缆夹sATEX 防爆认证 II组设备,设备等级1G,可用为气体危险0区sATEX 防爆认证II组设备,设备等级1D,适用于粉尘危险2区s 适于T型槽气缸,无需安装附件s 可选择附件安装于其他外型气缸上s 单手可安装s 微调装置和固定器可直接安装在传感器上s 稳固的安装s 磁阻式传感器s 2线直流, nom. 8.2 VDCs输出遵循本安型DIN EN 60947-5-6(NAMUR)标准s输出方波信号s 常开s电缆连接接线图功能原理磁感应传感器感应磁场。
440变频器使用大全
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 A B C D E F
MICROMASTER 440变频器 0.12kW - 250kW
系统参数 排障 MICROMASTER 440 的技术规格 可选件
使用大全 用户文件
电磁兼容性 MICROMASTER 440 变频器的参数表 功能框图 二进制互联连接(BiCo)功能 通讯 高级操作板( AOP ) 编码器 制动电阻
Email: techsupport@ad.siemens.de 星期一至星期五:上午 7: 00 至下午 5: 00 (当地时间) 西门子(中国)有限公司技术支持部 北京 电话: 传真: 010 – 64738566 010 – 64731096,647地址 用户可以在以下网址查到技术资料和一般信息: http:///products/sd。 联系地址: 如果您在阅读本手册时有什麽疑问或问题,请根据本手册封底的地址与西门子公司的办事处联 系。
本手册中对某些有效的功能可能未加说明。但是,在新的控制装置 中或进行服务时,并不因为西门子公司提供了这些功能而要承担任 未经书面许可,不得翻印、传播、或使用本手册及其相关内 何责任。 容。违者将对所造成的损害负法律责任。西门子公司保留一切 编审过程中,我们对本手册的内容与所述的硬件和软件的一致性进 权利,包括由专利许可、实用样机注册、或工程设计等所产生 行了审核。但是,仍然可能存在矛盾和谬误的地方,不可能保证它 的所有权利。 们完全一致。我们将定期检查本手册中涵盖的内容,并在以后修订 的版本中予以必要的修正。欢迎提出改进的建议。 © Siemens AG 2001。保留一切权利。 西门子公司的手册都是用无氯纸张印刷的,这种纸张的生产原料来 源于可持续生长的森林。打印和装订的过程中未使用化学溶剂。 MICROMASTER® 是西门子公司已注册的商标。 保留不予先通知而修改本手册的权利。
MAX4427CSA+;MAX4427ESA+;MAX4426ESA+;MAX4427CPA+;MAX4426CSA+;中文规格书,Datasheet资料
_______________________________________________________________ Maxim Integrated Products 1For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, MAX4426/MAX4427/MAX4428Dual High-Speed 1.5A MOSFET Drivers19-0132; Rev 2; 6/06Ordering Information continued on end of data sheet.*Dice are tested at T A = +25°C.**Contact factory for availability and processing to MIL-STD-883.Pin ConfigurationsTypical Operating CircuitGeneral DescriptionThe MAX4426/MAX4427/MAX4428 are dual monolithic MOSFET drivers designed to translate TTL/CMOS inputs to high voltage/current outputs. The MAX4426 is a dual inverting power MOSFET driver. The MAX4427 is a dual noninverting power MOSFET driver, and the MAX4428 contains one inverting section and one noninverting section. Delay times are nearly independent of V DD (see Typical Operating Characteristics ). High-current output drivers rapidly charge and discharge the gate capacitance of even the largest power MOSFETs to within millivolts of the supply rails. This produces the power MOSFETs' minimum on resistance. The MAX4426/MAX4427/MAX4428's high speed minimizes power loss-es in switching power supplies and DC-DC converters.ApplicationsSwitching Power Supplies DC-DC Converters Motor Controllers Pin-Diode DriversCharge-Pump Voltage InvertersFeaturesS Upgrade for TSC4426/TSC4427/TSC4428S Lower On Resistance: 4Ω vs. 7ΩS Shorter Delay Times: t D1 - 10ns vs. 30ns t D2 - 25ns vs. 50ns S 1.5A Peak Output CurrentS Fast Rise and Fall Times: Typically 20ns with 1000pF Load S Wide Operating Range: 4.5V to 18VS Low Power Consumption: 1.8mA with Logic 1 Input 200µA with Logic 0 Input S TTL/CMOS CompatibleS Latchup Protected-Withstand > 500mA Reverse Current S ESD ProtectedOrdering Information1N.C.82, 47, 5TOP VIEWINVERTINGN.C.2INA 7OUTA 3GND 6V DD 4INB5OUTBOUTA DIP/SO1N.C.82, 47, 5NONINVERTINGN.C.2INA 7OUTA 3GND 6V DD 4INB5OUTBDIP/SO1N.C.827N.C.2INA 73GND 6V DD 4INB5OUTB45DIP/SOMAX4426MAX4427MAX44284.7µF0.1µFINPUTINPUTOUTPUT*OUTPUT*ABV DD = +18VMAX4426PART TEMP RANGE PIN-PACKAGE MAX4426CPA 0N C to +70N C 8 Plastic DIP MAX4426CSA 0N C to +70N C 8 SO MAX4426C/D 0N C to +70N C Dice*MAX4426EPA -40N C to +85N C 8 Plastic DIP MAX4426ESA -40N C to +85N C 8 SO MAX4426EJA-40N C to +85N C 8 CERDIP MAX4426MJA-55N C to +125N C8 CERDIP**M A X 4426/M A X 4427/M A X 4428Dual High-Speed 1.5A MOSFET Drivers 2Supply Voltage V DD to GND ..............................................+20V Time V IL < V IN_ < V IH .........................................................50ns Input Voltage .....................................V DD + 0.3V to GND - 0.3V Continuous Power Dissipation (T A = +70°C)Plastic DIP (derate 9.09mW/°C above +70°C) ............727mW SO (derate 5.88mW/°C above +70°C) ........................471mW CERDIP (derate 8.00mW/°C above +70°C) ................640mWOperating Temperature Ranges: MAX442_C_ _ .....................................................0°C to +70°C MAX442_E_ _ ..................................................-40°C to +85°C MAX442_MJA ..............................................-550°C to +125°C Storage Temperature Range ............................-55°C to +160°C Maximum Chip Temperature ...........................................+150°C Lead Temperature (soldering, 10 sec) ...........................+300°CELECTRICAL CHARACTERISTICS(V DD = +4.5V to +18V, T A = T MIN to T MAX , unless otherwise specified.)ABSOLUTE MAXIMUM RATINGSNote 1: Switching times guaranteed by design, not tested. See Figure 1 for timing measurement circuit.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.PARAMETERSYMBOL CONDITIONSMIN TYPMAXUNITS Logic 1 Input Voltage V IH 2.4V Logic 0 Input Voltage V IL 0.8V Input Current I IN V IN = 0V to 18V -11µA Output High Voltage V OH No load V DD - 25mV Output Low VoltageV OLNo load25mVOutput Resistance R OUTV DD = 18V, I LOAD =10mAV IN = 0.8V forinverting stages, V IN = 2.4V fornoninvertingstages T A = +25N C410ωT A = T MIN to T MAX 512V IN = 2.4V for inverting stages, V IN = 0.8V fornoninvertingstages T A = +25N C410T A = T MIN to T MAX 512Peak Output Current I PKV DD = 18V 1.5APower-Supply Current I SUPPV IN = +3V for bothinputsT A = +25N C 1.8 4.5mAT A = T MIN to T MAX 2.58.0V IN = 0V for both inputs T A = +25N C 0.20.4T A = T MIN to T MAX0.30.6Rise Time (Note 1)t R T A = +25N C 2030ns T A = T MIN to T MAX 2540Fall Time (Note 1)t F T A = +25N C 2030ns T A = T MIN to T MAX 2540Delay Time (Note 1)t D1T A = +25N C 1030ns T A = T MIN to T MAX 1540t D2T A = +25N C 2550ns T A = T MIN to T MAX3060MAX4426/MAX4427/MAX4428Dual High-Speed 1.5A MOSFET Drivers3Typical Operating CharacteristicsMAX4426 OUTPUT LOW VOLTAGEvs. SOURCE CURRENTSOURCE CURRENT (mA)O U P U T V O L T A G E (V )9080607020304050100.30.600100MAX4426 OUTPUT HIGH VOLTAGEvs. SOURCE CURRENTSOURCE CURRENT (mA)(V D D - V O U T ) (V )9080607020304050100.30.600100MAX4426 SUPPLY CURRENTvs. FREQUENCYFERQUENCY (kHz)S U P P L Y C U R R E N T (m A )10010102030011000MAX4426 RISE AND FALL TIMEvs. CAPACITIVE LOADCAPACITIVE LOAD (pF)T I M E (n s )1001000101001k1010,000MAX4426 SUPPLY CURRENT vs. CAPACITIVE LOADCAPACITIVE LOAD (pF)S U P P L Y C U R R E N T (m A )1000100102030405060708001010,000MAX4426 DELAY TIME vs. TEMPERATURETEMPERATURE (°C)T I M E (n s )7525-255152535102030012550-50100MAX4426 RISE AND FALL TIMEvs. TEMPERATURETEMPERATURE (°C)T I M E (n s )7525-2510203040125500-50100MAX4426 DELAY TIME vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)T I M E (n s )151051*********6070020MAX4426 RISE AND FALL TIMEvs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)T I M E (n s )1510510203040506070020M A X 4426/M A X 4427/M A X 4428Dual High-Speed 1.5A MOSFET Drivers 4Applications InformationThe MAX4426/MAX4427/MAX4428 have easy-to-drive inputs. However, these inputs must never be allowed to stay between V IH and V IL for more than 50ns. Unused inputs should always be connected to ground to mini-mize supply current. Drivers can be paralleled on the MAX4426 or MAX4427 by tying both Inputs together and both outputs together.Supply bypassing and grounding are extremely impor-tant with the MAX4426/MAX4427/MAX4428, as the peak supply current can be as high as 3A, which is twice the peak output current. Ground drops are a form of nega-tive feedback with inverters, and hence will degrade the delay and transition time of the MAX4426/MAX4428.Suggested bypass capacitors are a 4.7µF (low ESR) capacitor in parallel with a 0.1µF ceramic capaci-tor, mounted as close as possible to the MAX4426/MAX4427/MAX4428. Use a ground plane if possible or separate ground returns for inputs and outputs. Output voltage ringing can be minimized with a 5Ω to 20Ω resis-tor in series with the output, but this will degrade output transition time. Ringing may be undesirable due to the large current that flows through capacitive loads when the voltage across these loads transitions quickly.Operation at the upper end of the supply voltage range (> 15V) requires that a capacitance of at least 50pF be present at the outputs. This prevents the supply voltage provided to the die (which can be different from that seen at the supply pin) from exceeding the 20V absolute maximum rating, due to overshoot. Since at least 50pF of gate capacitance is present in all higher power FETs, this requirement is easily met.Power DissipationThe MAX4426/MAX4427/MAX4428 power dissipation consists of input inverter losses, crowbar current through the output devices, and output current (either capacitive or resistive). The sum of these must be kept below the maximum power dissipation limit.The DC input inverter supply current is 0.2mA when both inputs are low and 2mA when both inputs are high. The crowbar current through an output device making a tran-sition is approximately 100mA for a few nanoseconds. This is a small portion of the total supply current, except for high switching frequencies or a small load capaci-tance (100pF).The MAX4426/MAX4427/MAX4428 power dissipation when driving a ground-referenced resistive load is:P = (D) (r ON(MAX)) (I LOAD 2)where D is the percentage of time the MAX4426/MAX4427/MAX4428 output pulls high, r ON(MAX) is the MAX4426/MAX4427/MAX4428 maximum on resistance, and I LOAD is the MAX4426/MAX4427/MAX4428 load current.For capacitive loads. the power dissipation is:P = (C LOAD ) (V DD 2) (FREQ)where C LOAD is the capacitive load. V DD is the MAX4426/MAX4427/MAX4428 supply voltage, and FREQ is the toggle frequency.MAX4426/MAX4427/MAX4428Dual High-Speed 1.5A MOSFET Drivers5Figure 1. Inverting and Noninverting Test CircuitOrdering Information (continued)Chip Topography*Dice are tested at T A = +25°C.**Contact factory for availability and processing to MIL-STD-883.SUBSTRATE CONNECTED TO V DD ;TRANSISTOR COUNT: 26.MAX4427/MAX4428PART TEMP RANGE PIN-PACKAGE MAX4427CPA 0N C to +70N C 8 Plastic DIP MAX4427CSA 0N C to +70N C 8 SO MAX4427C/D 0N C to +70N C Dice*MAX4427EPA -40N C to +85N C 8 Plastic DIP MAX4427ESA -40N C to +85N C 8 SO MAX4427EJA -40N C to +85N C 8 CERDIP MAX4427MJA -55N C to +125N C 8 CERDIP**MAX4428CPA 0N C to +70N C 8 Plastic DIP MAX4428CSA0N C to +70N C 8 SO MAX4428C/D 0N C to +70N C Dice*MAX4428EPA -40N C to +85N C 8 Plastic DIP MAX4428ESA -40N C to +85N C 8 SO MAX4428EJA-40N C to +85N C 8 CERDIP MAX4428MJA-55N C to +125N C8 CERDIP**M A X 4426/M A X 4427/M A X 4428Dual High-Speed 1.5A MOSFET Drivers 6Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages.)Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 7©2006 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.MAX4426/MAX4427/MAX4428Dual High-Speed 1.5A MOSFET Drivers Revision HistoryREVISION NUMBER REVISIONDATEDESCRIPTIONPAGESCHANGED26/06To clarify and illuminate an input logic level restriction—分销商库存信息:MAXIMMAX4427CSA+MAX4427ESA+MAX4426ESA+ MAX4427CPA+MAX4426CSA+MAX4427EPA+ MAX4428ESA+MAX4426CPA+MAX4428CPA+ MAX4427CSA+T MAX4426CSA+T MAX4428CSA+T MAX4428CSA+MAX4428EPA+MAX4426ESA+T MAX4428ESA+T MAX4427ESA+T MAX4427CSA MAX4427EPA MAX4427ESA。
MAX1771CSA中文资料
8 SO Dice* 8 Plastic DIP 8 SO 8 CERDIP**
* Contact factory for dice specifications. ** Contact factory for availability and processing to MIL-STD-883B.
MIN
MAX1771 (internal feedback resistors)
2.0
Input Voltage Range
MAX1771C/E (external resistors)
3.0
MAX1771MJA (external resistors)
3.1
Minimum Start-Up Voltage Supply Current
8 CS 7 GND 6 AGND 5 REF
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at .
Operating Temperature Ranges MAX1771C_ A .....................................................0°C to +70°C MAX1771E_ A ..................................................-40°C to +85°C MAX1771MJA ................................................-55°C to +125°C
ISO 4427-1-2007
ISO4427-1:2007 塑料管道系统给水用聚乙烯(PE)管和管件第一部分:总则内容前言简介1 范围2 参考标准3 术语、定义、符号和缩略语3.1 术语和定义3.2 符号3.3 缩略语4 原料4.1 混配料4.2 颜色4.3 可重复利用或可回收料的使用4.4 混配料的物理性能4.5 熔接性能4.6 分级和命名5 用于输送人类饮用水的水管对水质的影响附录A (规范性附录)压力折减系数附录B (资料性附录)耐快速裂纹扩展参考文献国际标准化组织(ISO)是由各国标准化团体(ISO成员团体)组成的世界性的联合会。
制定国际标准工作通常由ISO的技术委员会完成。
对ISO技术委员会建立的课题感兴趣的每一个会员都有权参与技术委员会工作,与ISO保持联系的国际组织(政府或非政府组织)都可参与委员会工作。
ISO 与国际电工委员会(IEC)在电工技术标准化方面保持密切合作的关系。
国际标准是依据ISO/IEC导则第2部分起草的。
技术委员会的主要任务是制定国际标准。
由技术委员会通过的国际标准草案提交各成员团体投票表决,发行国际标准需要至少75%的成员国投赞成票。
ISO 4427-1是由ISO/TC 138,输送流体用塑料管材、管件及阀门技术委员会SC2小组委员会制定了供水用塑料管材和管件。
本次是第一次修订,和ISO4427-2一起,代替ISO 4427:1996,只在其基础上做了一些技术性编辑。
ISO 4427包括下列部分:在总则标题下,塑料管系列——供水用聚乙烯管材和管件:——第一部分:总则——第二部分:管材——第三部分:管件——第五部分:系统适用性ISO 4427系列标准和规范规定了由聚乙烯制成的管材及其组成部分的要求,规定了应用水输送用管材,包括处理前水的输送及通用水输送。
关于产品引起的给水管对水质的潜在影响也包含在本标准中:a)ISO4427 未提供产品无是否限制使用的规范性文件b)现行国家规定的有关这些产品的使用性能有效。
MAX1978中文数据手册
用于Peltier模块的集成温度控制器概论MAX1978 / MAX1979是用于Peltier热电冷却器(TEC)模块的最小, 最安全, 最精确完整的单芯片温度控制器。
片上功率FET和热控制环路电路可最大限度地减少外部元件, 同时保持高效率。
可选择的500kHz / 1MHz开关频率和独特的纹波消除方案可优化元件尺寸和效率, 同时降低噪声。
内部MOSFET的开关速度经过优化, 可降低噪声和EMI。
超低漂移斩波放大器可保持±0.001°C的温度稳定性。
直接控制输出电流而不是电压, 以消除电流浪涌。
独立的加热和冷却电流和电压限制提供最高水平的TEC保护。
MAX1978采用单电源供电, 通过在两个同步降压调节器的输出之间偏置TEC, 提供双极性±3A输出。
真正的双极性操作控制温度, 在低负载电流下没有“死区”或其他非线性。
当设定点非常接近自然操作点时, 控制系统不会捕获, 其中仅需要少量的加热或冷却。
模拟控制信号精确设置TEC 电流。
MAX1979提供高达6A的单极性输出。
提供斩波稳定的仪表放大器和高精度积分放大器, 以创建比例积分(PI)或比例积分微分(PID)控制器。
仪表放大器可以连接外部NTC或PTC热敏电阻, 热电偶或半导体温度传感器。
提供模拟输出以监控TEC温度和电流。
此外, 单独的过热和欠温输出表明当TEC温度超出范围时。
片上电压基准为热敏电阻桥提供偏置。
MAX1978 / MAX1979采用薄型48引脚薄型QFN-EP 封装, 工作在-40°C至+ 85°C温度范围。
采用外露金属焊盘的耐热增强型QFN-EP封装可最大限度地降低工作结温。
评估套件可用于加速设计。
应用光纤激光模块典型工作电路出现在数据手册的最后。
WDM, DWDM激光二极管温度控制光纤网络设备EDFA光放大器电信光纤接口ATE特征♦尺寸最小, 最安全, 最精确完整的单芯片控制器♦片上功率MOSFET-无外部FET♦电路占用面积<0.93in2♦回路高度<3mm♦温度稳定性为0.001°C♦集成精密积分器和斩波稳定运算放大器♦精确, 独立的加热和冷却电流限制♦通过直接控制TEC电流消除浪涌♦可调节差分TEC电压限制♦低纹波和低噪声设计♦TEC电流监视器♦温度监控器♦过温和欠温警报♦双极性±3A输出电流(MAX1978)♦单极性+ 6A输出电流(MAX1979)订购信息* EP =裸焊盘。
MAX247中文资料
General DescriptionThe MAX220–MAX249 family of line drivers/receivers is intended for all EIA/TIA-232E and V.28/V.24 communica-tions interfaces, particularly applications where ±12V is not available.These parts are especially useful in battery-powered sys-tems, since their low-power shutdown mode reduces power dissipation to less than 5µW. The MAX225,MAX233, MAX235, and MAX245/MAX246/MAX247 use no external components and are recommended for appli-cations where printed circuit board space is critical.________________________ApplicationsPortable Computers Low-Power Modems Interface TranslationBattery-Powered RS-232 Systems Multidrop RS-232 Networks____________________________Features Superior to Bipolaro Operate from Single +5V Power Supply (+5V and +12V—MAX231/MAX239)o Low-Power Receive Mode in Shutdown (MAX223/MAX242)o Meet All EIA/TIA-232E and V.28 Specifications o Multiple Drivers and Receiverso 3-State Driver and Receiver Outputs o Open-Line Detection (MAX243)Ordering InformationOrdering Information continued at end of data sheet.*Contact factory for dice specifications.MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers________________________________________________________________Maxim Integrated Products 1Selection Table19-4323; Rev 9; 4/00Power No. of NominalSHDN RxPart Supply RS-232No. of Cap. Value & Three-Active in Data Rate Number (V)Drivers/Rx Ext. Caps (µF)State SHDN (kbps)FeaturesMAX220+52/24 4.7/10No —120Ultra-low-power, industry-standard pinout MAX222+52/2 4 0.1Yes —200Low-power shutdownMAX223 (MAX213)+54/54 1.0 (0.1)Yes ✔120MAX241 and receivers active in shutdown MAX225+55/50—Yes ✔120Available in SOMAX230 (MAX200)+55/04 1.0 (0.1)Yes —120 5 drivers with shutdownMAX231 (MAX201)+5 and2/2 2 1.0 (0.1)No —120Standard +5/+12V or battery supplies; +7.5 to +13.2same functions as MAX232MAX232 (MAX202)+52/24 1.0 (0.1)No —120 (64)Industry standardMAX232A+52/240.1No —200Higher slew rate, small caps MAX233 (MAX203)+52/20— No —120No external capsMAX233A+52/20—No —200No external caps, high slew rate MAX234 (MAX204)+54/04 1.0 (0.1)No —120Replaces 1488MAX235 (MAX205)+55/50—Yes —120No external capsMAX236 (MAX206)+54/34 1.0 (0.1)Yes —120Shutdown, three stateMAX237 (MAX207)+55/34 1.0 (0.1)No —120Complements IBM PC serial port MAX238 (MAX208)+54/44 1.0 (0.1)No —120Replaces 1488 and 1489MAX239 (MAX209)+5 and3/52 1.0 (0.1)No —120Standard +5/+12V or battery supplies;+7.5 to +13.2single-package solution for IBM PC serial port MAX240+55/54 1.0Yes —120DIP or flatpack package MAX241 (MAX211)+54/54 1.0 (0.1)Yes —120Complete IBM PC serial port MAX242+52/240.1Yes ✔200Separate shutdown and enableMAX243+52/240.1No —200Open-line detection simplifies cabling MAX244+58/104 1.0No —120High slew rateMAX245+58/100—Yes ✔120High slew rate, int. caps, two shutdown modes MAX246+58/100—Yes ✔120High slew rate, int. caps, three shutdown modes MAX247+58/90—Yes ✔120High slew rate, int. caps, nine operating modes MAX248+58/84 1.0Yes ✔120High slew rate, selective half-chip enables MAX249+56/1041.0Yes✔120Available in quad flatpack packageFor free samples & the latest literature: , or phone 1-800-998-8800.For small orders, phone 1-800-835-8769.M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/ReceiversABSOLUTE MAXIMUM RATINGS—MAX220/222/232A/233A/242/243ELECTRICAL CHARACTERISTICS—MAX220/222/232A/233A/242/243(V CC = +5V ±10%, C1–C4 = 0.1µF‚ MAX220, C1 = 0.047µF, C2–C4 = 0.33µF, T A = T MIN to T MAX ‚ unless otherwise noted.)Note 1:Input voltage measured with T OUT in high-impedance state, SHDN or V CC = 0V.Note 2:For the MAX220, V+ and V- can have a maximum magnitude of 7V, but their absolute difference cannot exceed 13V.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC )...............................................-0.3V to +6V Input VoltagesT IN ..............................................................-0.3V to (V CC - 0.3V)R IN (Except MAX220)........................................................±30V R IN (MAX220).....................................................................±25V T OUT (Except MAX220) (Note 1).......................................±15V T OUT (MAX220)...............................................................±13.2V Output VoltagesT OUT ...................................................................................±15V R OUT .........................................................-0.3V to (V CC + 0.3V)Driver/Receiver Output Short Circuited to GND.........Continuous Continuous Power Dissipation (T A = +70°C)16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)....842mW 18-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW20-Pin Plastic DIP (derate 8.00mW/°C above +70°C)..440mW 16-Pin Narrow SO (derate 8.70mW/°C above +70°C)...696mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C)......762mW 18-Pin Wide SO (derate 9.52mW/°C above +70°C)......762mW 20-Pin Wide SO (derate 10.00mW/°C above +70°C)....800mW 20-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 16-Pin CERDIP (derate 10.00mW/°C above +70°C).....800mW 18-Pin CERDIP (derate 10.53mW/°C above +70°C).....842mW Operating Temperature RangesMAX2_ _AC_ _, MAX2_ _C_ _.............................0°C to +70°C MAX2_ _AE_ _, MAX2_ _E_ _..........................-40°C to +85°C MAX2_ _AM_ _, MAX2_ _M_ _.......................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°CMAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________3Note 3:MAX243 R2OUT is guaranteed to be low when R2IN is ≥0V or is floating.ELECTRICAL CHARACTERISTICS—MAX220/222/232A/233A/242/243 (continued)(V= +5V ±10%, C1–C4 = 0.1µF‚ MAX220, C1 = 0.047µF, C2–C4 = 0.33µF, T = T to T ‚ unless otherwise noted.)M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 4_________________________________________________________________________________________________________________________________Typical Operating CharacteristicsMAX220/MAX222/MAX232A/MAX233A/MAX242/MAX243108-1051525OUTPUT VOLTAGE vs. LOAD CURRENT-4-6-8-2642LOAD CURRENT (mA)O U T P U T V O L T A G E (V )1002011104104060AVAILABLE OUTPUT CURRENTvs. DATA RATE65798DATA RATE (kbits/sec)O U T P U T C U R R E N T (m A )203050+10V-10VMAX222/MAX242ON-TIME EXITING SHUTDOWN+5V +5V 0V0V 500µs/div V +, V - V O L T A G E (V )MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________5V CC ...........................................................................-0.3V to +6V V+................................................................(V CC - 0.3V) to +14V V-............................................................................+0.3V to -14V Input VoltagesT IN ............................................................-0.3V to (V CC + 0.3V)R IN ......................................................................................±30V Output VoltagesT OUT ...................................................(V+ + 0.3V) to (V- - 0.3V)R OUT .........................................................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T OUT ......................................Continuous Continuous Power Dissipation (T A = +70°C)14-Pin Plastic DIP (derate 10.00mW/°C above +70°C)....800mW 16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)....842mW 20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW 24-Pin Narrow Plastic DIP(derate 13.33mW/°C above +70°C)..........1.07W24-Pin Plastic DIP (derate 9.09mW/°C above +70°C)......500mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C).........762mW20-Pin Wide SO (derate 10 00mW/°C above +70°C).......800mW 24-Pin Wide SO (derate 11.76mW/°C above +70°C).......941mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C) .............1W 44-Pin Plastic FP (derate 11.11mW/°C above +70°C).....889mW 14-Pin CERDIP (derate 9.09mW/°C above +70°C)..........727mW 16-Pin CERDIP (derate 10.00mW/°C above +70°C)........800mW 20-Pin CERDIP (derate 11.11mW/°C above +70°C)........889mW 24-Pin Narrow CERDIP(derate 12.50mW/°C above +70°C)..............1W24-Pin Sidebraze (derate 20.0mW/°C above +70°C)..........1.6W 28-Pin SSOP (derate 9.52mW/°C above +70°C).............762mW Operating Temperature RangesMAX2 _ _ C _ _......................................................0°C to +70°C MAX2 _ _ E _ _...................................................-40°C to +85°C MAX2 _ _ M _ _ ...............................................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°CABSOLUTE MAXIMUM RATINGS—MAX223/MAX230–MAX241ELECTRICAL CHARACTERISTICS—MAX223/MAX230–MAX241(MAX223/230/232/234/236/237/238/240/241, V CC = +5V ±10; MAX233/MAX235, V CC = 5V ±5%‚ C1–C4 = 1.0µF; MAX231/MAX239,V CC = 5V ±10%; V+ = 7.5V to 13.2V; T A = T MIN to T MAX ; unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 6_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS—MAX223/MAX230–MAX241 (continued)(MAX223/230/232/234/236/237/238/240/241, V CC = +5V ±10; MAX233/MAX235, V CC = 5V ±5%‚ C1–C4 = 1.0µF; MAX231/MAX239,V CC = 5V ±10%; V+ = 7.5V to 13.2V; T A = T MIN to T MAX ; unless otherwise noted.)MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________78.56.54.55.5TRANSMITTER OUTPUT VOLTAGE (V OH ) vs. V CC7.08.0V CC (V)V O H (V )5.07.57.46.02500TRANSMITTER OUTPUT VOLTAGE (V OH )vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES6.46.27.27.0LOAD CAPACITANCE (pF)V O H (V )1500100050020006.86.612.04.02500TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE6.05.011.09.010.0LOAD CAPACITANCE (pF)S L E W R A T E (V /µs )1500100050020008.07.0-6.0-9.04.55.5TRANSMITTER OUTPUT VOLTAGE (V OL ) vs. V CC-8.0-8.5-6.5-7.0V CC (V)V O L (V )5.0-7.5-6.0-7.62500TRANSMITTER OUTPUT VOLTAGE (V OL )vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES-7.0-7.2-7.4-6.2-6.4LOAD CAPACITANCE (pF)V O L (V )150010005002000-6.6-6.810-105101520253035404550TRANSMITTER OUTPUT VOLTAGE (V+, V-)vs. LOAD CURRENT-2-6-4-886CURRENT (mA)V +, V - (V )420__________________________________________Typical Operating CharacteristicsMAX223/MAX230–MAX241*SHUTDOWN POLARITY IS REVERSED FOR NON MAX241 PARTSV+, V- WHEN EXITING SHUTDOWN(1µF CAPACITORS)MAX220-13SHDN*V-O V+500ms/divM A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 8_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGS—MAX225/MAX244–MAX249ELECTRICAL CHARACTERISTICS—MAX225/MAX244–MAX249(MAX225, V CC = 5.0V ±5%; MAX244–MAX249, V CC = +5.0V ±10%, external capacitors C1–C4 = 1µF; T A = T MIN to T MAX ; unless oth-erwise noted.)Note 4:Input voltage measured with transmitter output in a high-impedance state, shutdown, or V CC = 0V.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC )...............................................-0.3V to +6V Input VoltagesT IN ‚ ENA , ENB , ENR , ENT , ENRA ,ENRB , ENTA , ENTB ..................................-0.3V to (V CC + 0.3V)R IN .....................................................................................±25V T OUT (Note 3).....................................................................±15V R OUT ........................................................-0.3V to (V CC + 0.3V)Short Circuit (one output at a time)T OUT to GND............................................................Continuous R OUT to GND............................................................ContinuousContinuous Power Dissipation (T A = +70°C)28-Pin Wide SO (derate 12.50mW/°C above +70°C).............1W 40-Pin Plastic DIP (derate 11.11mW/°C above +70°C)...611mW 44-Pin PLCC (derate 13.33mW/°C above +70°C)...........1.07W Operating Temperature RangesMAX225C_ _, MAX24_C_ _ ..................................0°C to +70°C MAX225E_ _, MAX24_E_ _ ...............................-40°C to +85°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering,10sec)..............................+300°CMAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________9Note 5:The 300Ωminimum specification complies with EIA/TIA-232E, but the actual resistance when in shutdown mode or V CC =0V is 10M Ωas is implied by the leakage specification.ELECTRICAL CHARACTERISTICS—MAX225/MAX244–MAX249 (continued)(MAX225, V CC = 5.0V ±5%; MAX244–MAX249, V CC = +5.0V ±10%, external capacitors C1–C4 = 1µF; T A = T MIN to T MAX ; unless oth-erwise noted.)M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 10________________________________________________________________________________________________________________________________Typical Operating CharacteristicsMAX225/MAX244–MAX24918212345TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE86416LOAD CAPACITANCE (nF)T R A N S M I T T E R S L E W R A T E (V /µs )14121010-105101520253035OUTPUT VOLTAGEvs. LOAD CURRENT FOR V+ AND V--2-4-6-88LOAD CURRENT (mA)O U T P U T V O L T A G E (V )64209.05.012345TRANSMITTER OUTPUT VOLTAGE (V+, V-)vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES6.05.58.5LOAD CAPACITANCE (nF)V +, V (V )8.07.57.06.5MAX220–MAX249Drivers/Receivers______________________________________________________________________________________11Figure 1. Transmitter Propagation-Delay Timing Figure 2. Receiver Propagation-Delay TimingFigure 3. Receiver-Output Enable and Disable Timing Figure 4. Transmitter-Output Disable TimingM A X 220–M A X 249Drivers/Receivers 12______________________________________________________________________________________ENT ENR OPERATION STATUS TRANSMITTERSRECEIVERS00Normal Operation All Active All Active 01Normal Operation All Active All 3-State10Shutdown All 3-State All Low-Power Receive Mode 11ShutdownAll 3-StateAll 3-StateTable 1a. MAX245 Control Pin ConfigurationsENT ENR OPERATION STATUS TRANSMITTERS RECEIVERSTA1–TA4TB1–TB4RA1–RA5RB1–RB500Normal Operation All Active All Active All Active All Active 01Normal Operation All Active All Active RA1–RA4 3-State,RA5 Active RB1–RB4 3-State,RB5 Active 1ShutdownAll 3-StateAll 3-StateAll Low-Power Receive Mode All Low-Power Receive Mode 11Shutdown All 3-State All 3-StateRA1–RA4 3-State,RA5 Low-Power Receive ModeRB1–RB4 3-State,RB5 Low-Power Receive ModeTable 1b. MAX245 Control Pin ConfigurationsTable 1c. MAX246 Control Pin ConfigurationsENA ENB OPERATION STATUS TRANSMITTERS RECEIVERSTA1–TA4TB1–TB4RA1–RA5RB1–RB500Normal Operation All Active All Active All Active All Active 01Normal Operation All Active All 3-State All Active RB1–RB4 3-State,RB5 Active 1ShutdownAll 3-StateAll ActiveRA1–RA4 3-State,RA5 Active All Active 11Shutdown All 3-State All 3-StateRA1–RA4 3-State,RA5 Low-Power Receive ModeRB1–RB4 3-State,RA5 Low-Power Receive ModeMAX220–MAX249Drivers/Receivers______________________________________________________________________________________13Table 1d. MAX247/MAX248/MAX249 Control Pin ConfigurationsM A X 220–M A X 249_______________Detailed DescriptionThe MAX220–MAX249 contain four sections: dual charge-pump DC-DC voltage converters, RS-232 dri-vers, RS-232 receivers, and receiver and transmitter enable control inputs.Dual Charge-Pump Voltage ConverterThe MAX220–MAX249 have two internal charge-pumps that convert +5V to ±10V (unloaded) for RS-232 driver operation. The first converter uses capacitor C1 to dou-ble the +5V input to +10V on C3 at the V+ output. The second converter uses capacitor C2 to invert +10V to -10V on C4 at the V- output.A small amount of power may be drawn from the +10V (V+) and -10V (V-) outputs to power external circuitry (see the Typical Operating Characteristics section),except on the MAX225 and MAX245–MAX247, where these pins are not available. V+ and V- are not regulated,so the output voltage drops with increasing load current.Do not load V+ and V- to a point that violates the mini-mum ±5V EIA/TIA-232E driver output voltage when sourcing current from V+ and V- to external circuitry. When using the shutdown feature in the MAX222,MAX225, MAX230, MAX235, MAX236, MAX240,MAX241, and MAX245–MAX249, avoid using V+ and V-to power external circuitry. When these parts are shut down, V- falls to 0V, and V+ falls to +5V. For applica-tions where a +10V external supply is applied to the V+pin (instead of using the internal charge pump to gen-erate +10V), the C1 capacitor must not be installed and the SHDN pin must be tied to V CC . This is because V+is internally connected to V CC in shutdown mode.RS-232 DriversThe typical driver output voltage swing is ±8V when loaded with a nominal 5k ΩRS-232 receiver and V CC =+5V. Output swing is guaranteed to meet the EIA/TIA-232E and V.28 specification, which calls for ±5V mini-mum driver output levels under worst-case conditions.These include a minimum 3k Ωload, V CC = +4.5V, and maximum operating temperature. Unloaded driver out-put voltage ranges from (V+ -1.3V) to (V- +0.5V). Input thresholds are both TTL and CMOS compatible.The inputs of unused drivers can be left unconnected since 400k Ωinput pull-up resistors to V CC are built in (except for the MAX220). The pull-up resistors force the outputs of unused drivers low because all drivers invert.The internal input pull-up resistors typically source 12µA,except in shutdown mode where the pull-ups are dis-abled. Driver outputs turn off and enter a high-imped-ance state—where leakage current is typically microamperes (maximum 25µA)—when in shutdownmode, in three-state mode, or when device power is removed. Outputs can be driven to ±15V. The power-supply current typically drops to 8µA in shutdown mode.The MAX220 does not have pull-up resistors to force the ouputs of the unused drivers low. Connect unused inputs to GND or V CC .The MAX239 has a receiver three-state control line, and the MAX223, MAX225, MAX235, MAX236, MAX240,and MAX241 have both a receiver three-state control line and a low-power shutdown control. Table 2 shows the effects of the shutdown control and receiver three-state control on the receiver outputs.The receiver TTL/CMOS outputs are in a high-imped-ance, three-state mode whenever the three-state enable line is high (for the MAX225/MAX235/MAX236/MAX239–MAX241), and are also high-impedance whenever the shutdown control line is high.When in low-power shutdown mode, the driver outputs are turned off and their leakage current is less than 1µA with the driver output pulled to ground. The driver output leakage remains less than 1µA, even if the transmitter output is backdriven between 0V and (V CC + 6V). Below -0.5V, the transmitter is diode clamped to ground with 1k Ωseries impedance. The transmitter is also zener clamped to approximately V CC + 6V, with a series impedance of 1k Ω.The driver output slew rate is limited to less than 30V/µs as required by the EIA/TIA-232E and V.28 specifica-tions. Typical slew rates are 24V/µs unloaded and 10V/µs loaded with 3Ωand 2500pF.RS-232 ReceiversEIA/TIA-232E and V.28 specifications define a voltage level greater than 3V as a logic 0, so all receivers invert.Input thresholds are set at 0.8V and 2.4V, so receivers respond to TTL level inputs as well as EIA/TIA-232E and V.28 levels.The receiver inputs withstand an input overvoltage up to ±25V and provide input terminating resistors withDrivers/Receivers 14Table 2. Three-State Control of ReceiversMAX220–MAX249Drivers/Receivers______________________________________________________________________________________15nominal 5k Ωvalues. The receivers implement Type 1interpretation of the fault conditions of V.28 and EIA/TIA-232E.The receiver input hysteresis is typically 0.5V with a guaranteed minimum of 0.2V. This produces clear out-put transitions with slow-moving input signals, even with moderate amounts of noise and ringing. The receiver propagation delay is typically 600ns and is independent of input swing direction.Low-Power Receive ModeThe low-power receive-mode feature of the MAX223,MAX242, and MAX245–MAX249 puts the IC into shut-down mode but still allows it to receive information. This is important for applications where systems are periodi-cally awakened to look for activity. Using low-power receive mode, the system can still receive a signal that will activate it on command and prepare it for communi-cation at faster data rates. This operation conserves system power.Negative Threshold—MAX243The MAX243 is pin compatible with the MAX232A, differ-ing only in that RS-232 cable fault protection is removed on one of the two receiver inputs. This means that control lines such as CTS and RTS can either be driven or left floating without interrupting communication. Different cables are not needed to interface with different pieces of equipment.The input threshold of the receiver without cable fault protection is -0.8V rather than +1.4V. Its output goes positive only if the input is connected to a control line that is actively driven negative. If not driven, it defaults to the 0 or “OK to send” state. Normally‚ the MAX243’s other receiver (+1.4V threshold) is used for the data line (TD or RD)‚ while the negative threshold receiver is con-nected to the control line (DTR‚ DTS‚ CTS‚ RTS, etc.). Other members of the RS-232 family implement the optional cable fault protection as specified by EIA/TIA-232E specifications. This means a receiver output goes high whenever its input is driven negative‚ left floating‚or shorted to ground. The high output tells the serial communications IC to stop sending data. To avoid this‚the control lines must either be driven or connected with jumpers to an appropriate positive voltage level.Shutdown—MAX222–MAX242On the MAX222‚ MAX235‚ MAX236‚ MAX240‚ and MAX241‚ all receivers are disabled during shutdown.On the MAX223 and MAX242‚ two receivers continue to operate in a reduced power mode when the chip is in shutdown. Under these conditions‚ the propagation delay increases to about 2.5µs for a high-to-low input transition. When in shutdown, the receiver acts as a CMOS inverter with no hysteresis. The MAX223 and MAX242 also have a receiver output enable input (EN for the MAX242 and EN for the MAX223) that allows receiver output control independent of SHDN (SHDN for MAX241). With all other devices‚ SHDN (SH DN for MAX241) also disables the receiver outputs.The MAX225 provides five transmitters and five receivers‚ while the MAX245 provides ten receivers and eight transmitters. Both devices have separate receiver and transmitter-enable controls. The charge pumps turn off and the devices shut down when a logic high is applied to the ENT input. In this state, the supply cur-rent drops to less than 25µA and the receivers continue to operate in a low-power receive mode. Driver outputs enter a high-impedance state (three-state mode). On the MAX225‚ all five receivers are controlled by the ENR input. On the MAX245‚ eight of the receiver out-puts are controlled by the ENR input‚ while the remain-ing two receivers (RA5 and RB5) are always active.RA1–RA4 and RB1–RB4 are put in a three-state mode when ENR is a logic high.Receiver and Transmitter EnableControl InputsThe MAX225 and MAX245–MAX249 feature transmitter and receiver enable controls.The receivers have three modes of operation: full-speed receive (normal active)‚ three-state (disabled)‚ and low-power receive (enabled receivers continue to function at lower data rates). The receiver enable inputs control the full-speed receive and three-state modes. The transmitters have two modes of operation: full-speed transmit (normal active) and three-state (disabled). The transmitter enable inputs also control the shutdown mode. The device enters shutdown mode when all transmitters are disabled. Enabled receivers function in the low-power receive mode when in shutdown.M A X 220–M A X 249Tables 1a–1d define the control states. The MAX244has no control pins and is not included in these tables. The MAX246 has ten receivers and eight drivers with two control pins, each controlling one side of the device. A logic high at the A-side control input (ENA )causes the four A-side receivers and drivers to go into a three-state mode. Similarly, the B-side control input (ENB ) causes the four B-side drivers and receivers to go into a three-state mode. As in the MAX245, one A-side and one B-side receiver (RA5 and RB5) remain active at all times. The entire device is put into shut-down mode when both the A and B sides are disabled (ENA = ENB = +5V).The MAX247 provides nine receivers and eight drivers with four control pins. The ENRA and ENRB receiver enable inputs each control four receiver outputs. The ENTA and ENTB transmitter enable inputs each control four drivers. The ninth receiver (RB5) is always active.The device enters shutdown mode with a logic high on both ENTA and ENTB .The MAX248 provides eight receivers and eight drivers with four control pins. The ENRA and ENRB receiver enable inputs each control four receiver outputs. The ENTA and ENTB transmitter enable inputs control four drivers each. This part does not have an always-active receiver. The device enters shutdown mode and trans-mitters go into a three-state mode with a logic high on both ENTA and ENTB .The MAX249 provides ten receivers and six drivers with four control pins. The ENRA and ENRB receiver enable inputs each control five receiver outputs. The ENTA and ENTB transmitter enable inputs control three dri-vers each. There is no always-active receiver. The device enters shutdown mode and transmitters go into a three-state mode with a logic high on both ENTA and ENTB . In shutdown mode, active receivers operate in a low-power receive mode at data rates up to 20kbits/sec.__________Applications InformationFigures 5 through 25 show pin configurations and typi-cal operating circuits. In applications that are sensitive to power-supply noise, V CC should be decoupled to ground with a capacitor of the same value as C1 and C2 connected as close as possible to the device.Drivers/Receivers16______________________________________________________________________________________。
Maxim产品命名规则
Maxim产品命名规则MAXIM前缀是“MAX”。
DALLAS则是以“DS”开头。
MAX×××或MAX××××说明:1后缀CSA、CWA 其中C表示普通级,S表示表贴,W表示宽体表贴。
2 后缀CWI表示宽体表贴,EEWI宽体工业级表贴,后缀MJA或883为军级。
3 CPA、BCPI、BCPP、CPP、CCPP、CPE、CPD、ACPA后缀均为普通双列直插。
举例MAX202CPE、CPE普通ECPE普通带抗静电保护MAX202EEPE 工业级抗静电保护(-45℃-85℃)说明 E指抗静电保护MAXIM数字排列分类1字头模拟器 2字头滤波器 3字头多路开关4字头放大器 5字头数模转换器 6字头电压基准7字头电压转换 8字头复位器 9字头比较器自主产品的命名规则绝大多数Maxim产品采用公司专有的命名系统,包括基础型号和后续的3个或4个字母尾缀,有时还带有其它标识符号。
例如:{MAX9722} {AETE} {+T}( A ) ( B) ( C)--------------------------------------------------------------------------------(A)是基础型号基本型号(也称为基础型号)用于区分不同的产品类型,与封装、温度及其它参量无关。
精度等级等参量通常用型号尾缀表示,有些情况下会为不同参量的器件分配一个新的基本型号。
--------------------------------------------------------------------------------(B)是3字母或4字母尾缀器件具有4个尾缀字母时,第一个尾标代表产品的等级(精度、电压规格、速率等)。
例如:MAX631ACPA中,第一个尾标"A"表示5%的输出精度。
产品数据资料中给出了型号对应的等级。
tc4427
TC4426TC4427TC44281.5A DUAL HIGH-SPEED MOSFET DRIVERSTC4426TC4427TC4428OUTPUTINPUTGNDEFFECTIVE INPUTC = 12 pF300 mV INVERTING OUTPUTSNONINVERTING OUTPUTSV DDTC4426/TC4427/TC44284.7VNOTES: 1.TC4426 has 2 inverting drivers; TC4427 has 2 noninverting drivers. 2. TC4428 has one inverting and one noninverting driver.3. Ground any unused driver input.FEATURESsHigh Peak Output Current ...............................1.5A s Wide Operating Range ..........................4.5V to 18V s High Capacitive LoadDrive Capability ............................1000 pF in 25 ns s Short Delay Time ................................<40nsec Typ s Consistent Delay Times With Changes in Supply VoltagesLow Supply Current— With Logic “1” Input ....................................4mA — With Logic “0” Input .................................400µA s Low Output Impedance.......................................7Ωs Latch-Up Protected: Will Withstand >0.5AReverse Current.................................Down to – 5V s Input Will Withstand Negative Inputss ESD Protected.....................................................4kV sPinout Same as TC426/TC427/TC428GENERAL DESCRIPTIONThe TC4426/4427/4428 are improved versions of the earlier TC426/427/428 family of buffer/drivers (with which they are pin compatible). They will not latch up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking (of either polarity) occurs on the ground pin. They can accept,without damage or logic upset, up to 500 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 4kV of electrostatic discharge.As MOSFET drivers, the TC4426/4427/4428 can easily switch 1000 pF gate capacitances in under 30 ns, and provide low enough impedances in both the ON and OFF states to ensure the MOSFET's intended state will not be affected, even by large transients.Other compatible drivers are the TC4426A/27A/28A.These drivers have matched input to output leading edge and falling edge delays, tD1 and tD2, for processing short duration pulses in the 25 nanoseconds range. They are pin compatible with the TC4426/27/28.FUNCTIONAL BLOCK DIAGRAMORDERING INFORMATIONTemperaturePart No.PackageRangeTC4426COA 8-Pin SOIC0°C to +70°C TC4426CPA 8-Pin Plastic DIP 0°C to +70°C TC4426EOA 8-Pin SOIC– 40°C to +85°C TC4426EPA 8-Pin Plastic DIP – 40°C to +85°C TC4426MJA 8-Pin CerDIP – 55°C to +125°C TC4427COA 8-Pin SOIC0°C to +70°C TC4427CPA 8-Pin Plastic DIP 0°C to +70°C TC4427EOA 8-Pin SOIC– 40°C to +85°C TC4427EPA 8-Pin Plastic DIP – 40°C to +85°C TC4427MJA 8-Pin CerDIP – 55°C to +125°C TC4428COA 8-Pin SOIC0°C to +70°C TC4428CPA 8-Pin Plastic DIP 0°C to +70°C TC4428EOA 8-Pin SOIC– 40°C to +85°C TC4428EPA 8-Pin Plastic DIP – 40°C to +85°C TC4428MJA8-Pin CerDIP– 55°C to +125°CTC4426 TC4427 TC4428ABSOLUTE MAXIMUM RATINGS*Supply Voltage.........................................................+22V Input Voltage, IN A or IN B.(V DD + 0.3V) to (GND – 5.0V) Maximum Chip Temperature.................................+150°C Storage Temperature Range................– 65°C to +150°C Lead Temperature (Soldering, 10 sec).................+300°C Package Thermal ResistanceCerDIP RθJ-A................................................150°C/W CerDIP RθJ-C..................................................50°C/W PDIP RθJ-A...................................................125°C/W PDIP RθJ-C.....................................................42°C/W SOIC RθJ-A...................................................155°C/W SOIC RθJ-C.....................................................45°C/W Operating Temperature RangeC Version...............................................0°C to +70°CE Version..........................................– 40°C to +85°CM Version.......................................– 55°C to +125°C Package Power Dissipation (T A≤ 70°C)Plastic.............................................................730mW CerDIP............................................................800mW SOIC...............................................................470mW *Static-sensitive device. Unused devices must be stored in conductive material. Protect devices from static discharge and static fields. Stresses above those listed under "Absolute Maximum Ratings" may cause perma-nent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.ELECTRICAL CHARACTERISTICS:T A = +25°C with 4.5V ≤ V DD≤ 18V, unless otherwise specified.Symbol Parameter Test Conditions Min Typ Max UnitInputV IH Logic 1 High Input Voltage 2.4——VV IL Logic 0 Low Input Voltage——0.8VI IN Input Current0V ≤ V IN≤ V DD– 1—1µA OutputV OH High Output Voltage V DD – 0.025——VV OL Low Output Voltage——0.025VR O Output Resistance V DD = 18V, I O = 10 mA—710ΩI PK Peak Output Current Duty Cycle ≤ 2%, t ≤ 30 µsec— 1.5—AI REV Latch-Up Protection Duty Cycle ≤ 2%> 0.5——AWithstand Reverse Current t ≤ 30 µsecSwitching Time (Note 1)t R Rise Time Figure 1—1930nsec t F Fall Time Figure 1—1930nsec t D1Delay Time Figure 1—2030nsec t D2Delay Time Figure 1—4050nsec Power SupplyI S Power Supply Current V IN = 3V (Both Inputs)—— 4.5mAV IN = 0V (Both Inputs)——0.4mA NOTE: 1. Switching times are guaranteed by design.TC4426TC4427TC4428ELECTRICAL CHARACTERISTICSSpecifications measured over operating temperature range with 4.5V ≤ V DD ≤ 18V, unless otherwise specified.SymbolParameterTest Conditions MinTypMaxUnitInput V IH Logic 1 High Input Voltage 2.4——V V IL Logic 0 Low Input Voltage ——0.8V I IN Input Current0V ≤ V IN ≤ V DD– 10—10µA Output V OH High Output Voltage V DD – 0.025——V V OL Low Output Voltage ——0.025V R O Output Resistance V DD = 18V, I O = 10 mA—912ΩI PK Peak Output Current Duty Cycle ≤ 2%, t ≤ 300µsec — 1.5—A I REVLatch-Up ProtectionDuty Cycle ≤ 2%> 0.5——AWithstand Reverse Currentt ≤ 300µsec Switching Time (Note 1)t R Rise Time Figure 1——40nsec t F Fall Time Figure 1——40nsec t D1Delay Time Figure 1——40nsec t D2Delay Time Figure 1——60nsec Power Supply I SPower Supply CurrentV IN = 3V (Both Inputs)——8mA V IN = 0V (Both Inputs)——0.6mANOTE:1. Switching times are guaranteed by design.Figure 1. Switching Time Test CircuitNOTE: The values on this graph represent the loss seen by both drivers in a package during one complete cycle. For a single driver, divide the stated values by 2. For a single transition of a single driver, divide the stated value by 4.20004006008001000120014001600AMBIENT TEMPERATURE (°C)M A X . P O W E R (m W )Thermal Derating CurvesCrossover Energy LossA • s e c876543210109V DDTC4426TC4427TC4428TYPICAL CHARACTERISTICSRise TIme vs Capacitive LoadT I M E (n s e c )Rise and Fall Times vs TemperatureTEMPERATURE (°C)Propagation Delay vs Supply Voltaget F A L L (n s e c )4681012141618Fall Time vs Supply Voltaget R I S E (n s e c )4681012141618Rise Time vs Supply VoltageV DD100100010,000C (pF)LOADFall TIme vs Capacitive Load100100010,00060–55–35525456585105125–15604681012141618D E L A Y T I M E (n s e c )100V DDC (pF)LOADV DD806040200100806040201008060402001008060402050403020105040302010t R I S E (n s e c )t F A L L (n s e c )TC4426TC4427TC4428TYPICAL CHARACTERISTICS (Cont.)Quiescent Supply Current vs VoltageHigh-State Output ResistanceT A (°C)4T A (°C)I Q U I E S C E N T (m A )4.03.53.02.52.0I (m A )Q U I E S C E NT 186810121416D E L A Y T I M E (n s e c )V DRIVE (V)600.1–55–35–15525456585105125Quiescent Supply Current vs TemperatureEffect of Input Amplitude on Delay TimePropagation Delay Time vs Temperature4681012141618468101214161820Low-State Output Resistance–55–35–155254565851051250246810V DDV DDV DD5040302010DE L A Y T I M E (n s e c )605040302010125151085R D S (O N ) (Ω)2025151085R D S (O N ) (Ω)TC4426TC4427TC4428SUPPLY CURRENT CHARACTERISTICS (Load on Single Output Only)Supply Current vs Capacitive Load60100100010,000I S U P P L Y (m A )Supply Current vs Capacitive Load100100010,000Supply Current vs Capacitive Load100100010,000Supply Current vs Frequency101001000FREQUENCY (kHz)Supply Current vs Frequency101001000FREQUENCY (kHz)Supply Current vs Frequency101001000FREQUENCY (kHz)C (pF)LOADC (pF)LOADC (pF)LOAD5040302010060504030201006050403020100605040302010060504030201006050403020100I S U P P L Y (m A )I S U P P L Y (m A )I S U P P L Y (m A )I S U P P L Y (m A )I S U P P L Y (m A )TC4426 TC4427 TC4428TC4426TC4427TC4428PACKAGE DIMENSIONS Cont.)Sales OfficesTelCom Semiconductor1300 Terra Bella AvenueP.O. Box 7267Mountain View, CA 94039-7267 TEL: 415-968-9241FAX: 415-967-1590E-Mail: liter@ TelCom SemiconductorAustin Product Center9101 Burnet Rd. Suite 214Austin, TX 78758TEL: 512-873-7100FAX: 512-873-8236TelCom Semiconductor H.K. Ltd.10 Sam Chuk Street, Ground FloorSan Po Kong, KowloonHong KongTEL: 852-2324-0122FAX: 852-2354-9957。
MIC4424中文资料
MIC4424中⽂资料MIC4423/4424/4425 Electrical Characteristics4.5V ≤ V S ≤ 18V; T A = 25°C, bold values indicate –40°C ≤ T A ≤ +85°C; unless noted.Symbol ParameterConditionsMinTypMaxUnitsInput V IH Logic 1 Input Voltage 2.4V V IL Logic 0 Input Voltage 0.8V I IN Input Current0V ≤ V IN ≤ V S–11µA –1010µAOutput V OH High Output Voltage V S –0.025V V OL Low Output Voltage 0.025V R OOutput Resistance HI StateI OUT = 10mA, V S = 18V2.85?V IN = 0.8V, I OUT = 10mA, V S = 18V3.78?Output Resistance LO StateI OUT = 10mA, V S = 18V3.55?V IN = 2.4V, I OUT = 10mA, V S = 18V4.38I PK Peak Output Current 3A ILatch-Up Protection>500mAWithstand Reverse CurrentSwitching Time (Note 4)t R Rise Time test Figure 1, C L = 1800pF 2335ns 2860ns t F Fall Time test Figure 1, C L = 1800pF 2535ns 3260ns t D1Delay Tlme test Ffigure 1, C L = 1800pF 3375ns 32100ns t D2Delay Timetest Figure 1, C L = 1800pF3875ns 38100nsPower Supply I S Power Supply Current V IN = 3.0V (both inputs) 1.5 2.5mA 2 3.5mA I SPower Supply CurrentV IN = 0.0V (both inputs)0.150.25mA 0.20.3mANote 1.Exceeding the absolute maximum rating may damage the device.Note 2.The device is not guaranteed to function outside its operating rating.Note 3.Devices are ESD sensitive. Handling precautions recommended. ESD tested to human body model, 1.5k in series with 100pF.Note 4.Switching times guaranteed by design.Absolute Maximum Ratings (Note 1)Supply Voltage (22)Input Voltage.................................V S + 0.3V to GND – 5V Junction Temperature ..............................................150°C Storage Temperature Range ....................–65°C to 150°C Lead Temperature (10 sec.).....................................300°C ESD Susceptability, Note 3.. (1000V)Operating Ratings (Note 2)Supply Voltage (V S )....................................+4.5V to +18V Temperature RangeC Version ..................................................0°C to +70°C B Version...............................................–40°C to +85°C Package Thermal ResistanceDIP θJA .............................................................130°C/W DIP θJC ...............................................................42°C/W Wide-SOIC θJA .................................................120°C/W Wide-SOIC θJC ...................................................75°C/W SOIC θJA ..........................................................120°C/W SOIC θJC ............................................................75°C/WApplication InformationAlthough the MIC4423/24/25 drivers have been specifically constructed to operate reliably under any practical circumstances, there are nonetheless details of usage which will provide better operation of the device.Supply BypassingCharging and discharging large capacitive loads quickly requires large currents. For example, charging 2000pF from 0 to 15 volts in 20ns requires a constant current of 1.5A. In practice, the charging current is not constant, and will usually peak at around 3A. In order to charge the capacitor, the driver must be capable of drawing this much current, this quickly, from the system power supply. In turn, this means that as far as the driver is concerned, the system power supply, as seen by the driver, must have a VERY low impedance.As a practical matter, this means that the power supply bus must be capacitively bypassed at the driver with at least 100X the load capacitance in order to achieve optimum driving speed. It also implies that the bypassing capacitor must have very low internal inductance and resistance at all frequencies of interest. Generally, this means using two capacitors, one a high-performance low ESR film, the other a low internal resistance ceramic, as together the valleys in their two impedance curves allow adequate performance over a broad enough band to get the job done. PLEASE NOTE that many film capacitors can be sufficiently inductive as to be useless for this service. Likewise, many multilayer ceramic capacitors have unacceptably highinternal resistance. Use capacitors intended for high pulse current service (in-house we use WIMA? film capacitors and AVX Ramguard? ceramics; several other manufacturers of equivalent devices also exist). The high pulse current demands of capacitive drivers also mean that the bypass capacitors must be mounted very close to the driver in order to prevent the effects of lead inductance or PCB land inductance from nullifying what you are trying to accomplish. For optimum results the sum of the lengths of the leads and the lands from the capacitor body to the driver body should total 2.5cm or less.Bypass capacitance, and its close mounting to the driver serves two purposes. Not only does it allow optimum performance from the driver, it minimizes the amount of lead length radiating at high frequency during switching, (due to the large ? I) thus minimizing the amount of EMI later available for system disruption and subsequent cleanup. It should also be noted that the actual frequency of the EMI produced by a driver is not the clock frequency at which it is driven, but is related to the highest rate of change of current produced during switching, a frequency generally one or two orders of magnitude higher, and thus more difficult to filter if you let it permeate your system. Good bypassing practice is essential to proper operation of high speed driver ICs. GroundingBoth proper bypassing and proper grounding are necessary for optimum driver operation. Bypassing capacitance only allows a driver to turn the load ON. Eventually (except in rare circumstances) it is also necessary to turn the load OFF. This requires attention to the ground path. Two things other than the driver affect the rate at which it is possible to turn a load off: The adequacy of the grounding available for the driver, and the inductance of the leads from the driver to the load. The latter will be discussed in a separate section.Best practice for a ground path is obviously a well laid out ground plane. However, this is not always practical, and a poorly-laid out ground plane can be worse than none. Attention to the paths taken by return currents even in a ground plane is essential. In general, the leads from the driver to its load, the driver to the power supply, and the driver to whatever is driving it should all be as low in resistance and inductance as possible. Of the three paths, the ground lead from the driver to the logic driving it is most sensitive to resistance or inductance, and ground current from the load are what is most likely to cause disruption. Thus, these ground paths should be arranged so that they never share a land, or do so for as short a distance as is practical.To illustrate what can happen, consider the following: The inductance of a 2cm long land, 1.59mm (0.062") wide on a PCB with no ground plane is approximately 45nH. Assuming a dl/dt of 0.3A/ns (which will allow a current of 3A to flow after 10ns, and is thus slightly slow for our purposes) a voltage of 13.5 Volts will develop along this land in response to our postulated Ι. For a 1cm land, (approximately 15nH) 4.5 Volts is developed. Either way, anyone using TTL-level input signals to the driver will find that the response of their driver has been seriously degraded by a common ground path for input to and output from the driver of the given dimensions. Note that this is before accounting for any resistive drops in the circuit. The resistive drop in a 1.59mm (0.062") land of 2oz. Copper carrying 3A will be about 4mV/cm (10mV/in) at DC, and the resistance will increase with frequency as skin effect comes into play.The problem is most obvious in inverting drivers where the input and output currents are in phase so that any attempt to raise the driver’s input voltage (in order to turn the driver’s load off) is countered by the voltage developed on the common ground path as the driver attempts to do what it was supposed to. It takes very little common ground path, under these circumstances, to alter circuit operation drastically.Output Lead InductanceThe same descriptions just given for PCB land inductance apply equally well for the output leads from a driver to its load, except that commonly the load is located much further away from the driver than the driver’s ground bus.Generally, the best way to treat the output lead inductance problem, when distances greater than 4cm (2") are involved, requires treating the output leads as a transmission line. Unfortunately, as both the output impedance of the driver and the input impedance of the MOSFET gate are at least an order of magnitude lower than the impedance of common coax, using coax is seldom a cost-effective solution. A twisted pair works about as well, is generally lower in cost, and allows use of a wider variety of connectors. The second wire of the twisted pair should carry common from as close as possibleto the ground pin of the driver directly to the ground terminal of the load. Do not use a twisted pair where the second wire in the pair is the output of the other driver, as this will not provide a complete current path for either driver. Likewise, do not use a twisted triad with two outputs and a common return unless both of the loads to be driver are mounted extremely close to each other, and you can guarantee that they will never be switching at the same time.For output leads on a printed circuit, the general rule is to make them as short and as wide as possible. The lands should also be treated as transmission lines: i.e. minimize sharp bends, or narrowings in the land, as these will cause ringing. For a rough estimate, on a 1.59mm (0.062") thick G-10 PCB a pair of opposing lands each 2.36mm (0.093") wide translates to a characteristic impedance of about 50?. Half that width suffices on a 0.787mm (0.031") thick board. For accurate impedance matching with a MIC4423/24/25 driver, on a 1.59mm (0.062") board a land width of 42.75mm (1.683") would be required, due to the low impedance of the driver and (usually) its load. This is obviously impractical under most circumstances. Generallythe tradeoff point between lands and wires comes when lands narrower than 3.18mm (0.125") would be required on a1.59mm (0.062") board.To obtain minimum delay between the driver and the load, it is considered best to locate the driver as close as possible to the load (using adequate bypassing). Using matching transformers at both ends of a piece of coax, or several matched lengths of coax between the driver and the load, works in theory, but is not optimum.Driving at Controlled RatesOccasionally there are situations where a controlled rise or fall time (which may be considerably longer than the normal rise or fall time of the driver’s output) is desired for a load. In such cases it is still prudent to employ best possible practice in terms of bypassing, grounding and PCB layout, and then reduce the switching speed of the load (NOT the driver) by adding a noninductive series resistor of appropriate value between the output of the driver and the load. For situations where only rise or only fall should be slowed, the resistor can be paralleled with a fast diode so that switching in the other direction remains fast. Due to the Schmitt-trigger action of the driver’s input it is not possible to slow the rate of rise (or fall) of the driver’s input signal to achieve slowing of the output. Input StageThe input stage of the MIC4423/24/25 consists of a single-MOSFET class A stage with an input capacitance of ≤38pF. This capacitance represents the maximum load from the driver that will be seen by its controlling logic. The drain load on the input MOSFET is a –2mA current source. Thus, the quiescent current drawn by the driver varies, depending on the logic state of the input.Following the input stage is a buffer stage which provides ~400mV of hysteresis for the input, to prevent oscillations when slowly-changing input signals are used or when noise is present on the input. Input voltage switching threshold is approximately 1.5V which makes the driver directly compatible with TTL signals, or with CMOS powered from any supply voltage between 3V and 15V.The MIC4423/24/25 drivers can also be driven directly by the SG1524/25/26/27, TL494/95, TL594/95, NE5560/61/62/68, TSC170, MIC38C42, and similar switch mode power supply ICs. By relocating the main switch drive function into the driver rather than using the somewhat limited drive capabilities of a PWM IC. The PWM IC runs cooler, which generally improves its performance and longevity, and the main switches switch faster, which reduces switching losses and increase system efficiency.The input protection circuitry of the MIC4423/24/25, in addition to providing 2kV or more of ESD protection, also works to prevent latchup or logic upset due to ringing or voltage spiking on the logic input terminal. In most CMOS devices when the logic input rises above the power supply terminal, or descends below the ground terminal, the device can be destroyed or rendered inoperable until the power supply is cycled OFF and ON. The MIC4423/24/25 drivers have been designed to prevent this. Input voltages excursions as great as 5V below ground will not alter the operation of the device. Input excursions above the power supply voltage will result in the excess voltage being conducted to the power supply terminal of the IC. Because the excess voltage is simply conducted to the power terminal, if the input to the driver is left in a high state when the power supply to the driver is turned off, currents as high as 30mA can be conducted through the driver from the input terminal to its power supply terminal. This may overload the output of whatever is driving the driver, and may cause other devices that share the driver’s power supply, as well as the driver, to operate when they are assumed to be off, but it will not harm the driver itself. Excessive input voltage will also slow the driver down, and result in much longer internal propagation delays within the drivers. T D2, for example, may increase to several hundred nanoseconds. In general, while the driver will accept this sort of misuse without damage, proper termination of the line feeding the driver so that line spiking and ringing are minimized, will always result in faster and more reliable operation of the device, leave less EMI to be filtered elsewhere, be less stressful to other components in the circuit, and leave less chance of unintended modes of operation. Power DissipationCMOS circuits usually permit the user to ignore power dissipation. Logic families such as 4000 series and 74Cxxx have outputs which can only source or sink a few milliamps of current, and even shorting the output of the device to ground or V CC may not damage the device. CMOS drivers, on the other hand, are intended to source or sink several Amps of current. This is necessary in order to drive large capacitive loads at frequencies into the megahertz range. Package power dissipation of driver ICs can easily be exceeded when driving large loads at high frequencies. Care must therefore be paid to device dissipation when operating in this domain. The Supply Current vs Frequency and Supply Current vs Load characteristic curves furnished with this data sheet aidin estimating power dissipation in the driver. Operating frequency, power supply voltage, and load all affect power dissipation.Given the power dissipation in the device, and the thermal resistance of the package, junction operating temperature for any ambient is easy to calculate. For example, the thermal resistance of the 8-pin plastic DIP package, from the datasheet, is150°C/W. In a 25°C ambient, then, using a maximum junction temperature of 150°C, this package will dissipate 960mW. Accurate power dissipation numbers can be obtained by summing the three sources of power dissipation in the device:? Load power dissipation (P L)Quiescent power dissipation (P Q)Transition power dissipation (P T)Calculation of load power dissipation differs depending on whether the load is capacitive, resistive or inductive. Resistive Load Power DissipationDissipation caused by a resistive load can be calculated as: P L = I2 R O Dwhere:I =the current drawn by the loadR O =the output resistance of the driver when theoutput is high, at the power supply voltage used(See characteristic curves)D =fraction of time the load is conducting (duty cycle) Capacitive Load Power DissipationDissipation caused by a capacitive load is simply the energy placed in, or removed from, the load capacitance by the driver. The energy stored in a capacitor is described by the equation:E = 1/2 C V2As this energy is lost in the driver each time the load is charged or discharged, for power dissipation calculations the 1/2 is removed. This equation also shows that it is good practice not to place more voltage in the capacitor than is necessary, as dissipation increases as the square of the voltage applied to the capacitor. For a driver with a capacitive load:P L = f C (V S)2where:f =Operating FrequencyC =Load CapacitanceV S =Driver Supply VoltageInductive Load Power DissipationFor inductive loads the situation is more complicated. For the part of the cycle in which the driver is actively forcing current into the inductor, the situation is the same as it is in the resistive case:P L1 = I2 R O DHowever, in this instance the R O required may be either the on resistance of the driver when its output is in the high state, or its on resistance when the driver is in the low state, depending on how the inductor is connected, and this is still only half the story. For the part of the cycle when the inductor is forcing current through the driver, dissipation is best described asP L2 = I V D (1 – D)where V D is the forward drop of the clamp diode in the driver (generally around 0.7V). The two parts of the load dissipation must be summed in to produce P LP L = P L1 + P L2Quiescent Power DissipationQuiescent power dissipation (P Q, as described in the input section) depends on whether the input is high or low. A low input will result in a maximum current drain (per driver) of ≤0.2mA; a logic high will result in a current drain of ≤2.0mA. Quiescentpower can therefore be found from:P Q = V S [D I H + (1 – D) I L]where:I H =quiescent current with input highI L =quiescent current with input lowD = fraction of time input is high (duty cycle)V S =power supply voltageTransition Power DissipationTransition power is dissipated in the driver each time its output changes state, because during the transition, for a very brief interval, both the N- and P-channel MOSFETs in the output totem-pole are ON simultaneously, and a current is conducted through them from V S to ground. The transition power dissipation is approximately:P T = f V S (A?s)where (A?s) is a time-current factor derived from Figure 2.Total power (P D) then, as previously described is justP D = P L + P Q +P TExamples show the relative magnitude for each term.EXAMPLE 1: A MIC4423 operating on a 12V supply driving two capacitive loads of 3000pF each, operating at 250kHz, with a duty cycle of 50%, in a maximum ambient of 60°C.First calculate load power loss:P L = f x C x (V S)2P L= 250,000 x (3 x 10–9 + 3 x 10–9) x 122= 0.2160WThen transition power loss:P T = f x V S x (A?s)= 250,000 ? 12 ? 2.2 x 10–9 = 6.6mWThen quiescent power loss:P Q= V S x [D x I H + (1 – D) x I L]= 12 x [(0.5 x 0.0035) + (0.5 x 0.0003)]= 0.0228WTotal power dissipation, then, is:P D= 0.2160 + 0.0066 + 0.0228= 0.2454WAssuming an SOIC package, with an θJA of 120°C/W, this will result in the junction running at:0.2454 x 120 = 29.4°Cabove ambient, which, given a maximum ambient temperature of 60°C, will result in a maximum junction temperature of 89.4°C.EXAMPLE 2: A MIC4424 operating on a 15V input, with one driver driving a 50? resistive load at 1MHz, with a duty cycle of67%, and the other driver quiescent, in a maximum ambient temperature of 40°C:P L = I2 x R O x DFirst, I O must be determined.I O = V S / (R O + R LOAD)Given R O from the characteristic curves then,I O = 15 / (3.3 + 50)I O = 0.281Aand:P L= (0.281)2 x 3.3 x 0.67= 0.174WP T= F x V S x (A?s)/2(because only one side is operating)= (1,000,000 x 15 x 3.3 x 10–9) / 2= 0.025 Wand:P Q = 15 x [(0.67 x 0.00125) + (0.33 x 0.000125) +(1 x 0.000125)](this assumes that the unused side of the driver has its input grounded, which is more efficient)= 0.015Wthen:P D= 0.174 + 0.025 + 0.0150= 0.213WIn a ceramic package with an θJA of 100°C/W, this amount of power results in a junction temperature given the maximum 40°C ambient of:(0.213 x 100) + 40 = 61.4°CThe actual junction temperature will be lower than calculated both because duty cycle is less than 100% and because the graph lists R DS(on) at a T J of 125°C and the R DS(on) at 61°C T J will be somewhat lower.DefinitionsC L =Load Capacitance in Farads.D =Duty Cycle expressed as the fraction of time the inputto the driver is high.f =Operating Frequency of the driver in HertzI H =Power supply current drawn by a driver when bothinputs are high and neither output is loaded.I L =Power supply current drawn by a driver when bothinputs are low and neither output is loaded.I D =Output current from a driver in Amps.P D =Total power dissipated in a driver in Watts.P L =Power dissipated in the driver due to the driver’s load in Watts.P Q =Power dissipated in a quiescent driver in Watts.P T=Power dissipated in a driver when the output changes states (“shoot-through current”) in Watts. NOTE: The “shoot-through” current from a dual transition (onceup, once down) for both drivers is stated in the graphon the following page in ampere-nanoseconds. Thisfigure must be multiplied by the number of repetitionsper second (frequency to find Watts).R O=Output resistance of a driver in Ohms.V S=Power supply voltage to the IC in Volts.。
中文手册
MIC4426/4427/4428麦克雷尔MIC4426/4427/4428双1.5A-Peak低侧MOSFET 驱动器一般描述该MIC4426/4427/4428 系列是高度可靠的双低边MOSFET驱动器上的BiCMOS制造/ DMOS亲cess低功耗和高效率.这些司机翻译TTL或CMOS输入逻辑电平输出内正电源电压水平摆动25mV或地面.可比双极器件是摆能力,ing只有在对供应1V的.是的MIC4426/7/8提供三种配置:双路反相,双nonin -verting,一加一相同相输出.该MIC4426/4427/4428是引脚兼容的替代品为MIC426/427/428和MIC1426/1427/1428与im- 证明了电气性能和坚固的设计(参照设备在以下页面替换清单).他们可承受高达500mA的反向电流(或极性)无闭锁和高达5V噪声尖峰(无论是极性)上地面pins.主要用于驱动功率MOSFET,MIC4426/7/8司机的驾驶(其他合适的负载电容,电阻tive,或感性),需要低阻抗,高峰值电流和快速开关时间.其他应用包括驾驶重载时钟线,同轴电缆,或压电电传感器.唯一的限制是负载总驱动器功耗不得超过该包装的限制.特点双极/ CMOS / DMOS建设闭锁反向电流保护>500mA1.5A-peak输出电流4.5V到18V工作范围低静态电源电流4mA在逻辑1输入400µA在逻辑0输入在1000pF开关25ns匹配的上升和rall倍7Ω输出阻抗< 40ns典型的延迟逻辑输入阈值与电源电压无关逻辑输入保护–5V典型的等效输入电容6pF25mV 最大.从电源输出失调或地面替换MIC426/427/428和MIC1426/1427/1428 双反转,双同相,和反相/同相配置ESD保护MOSFET的驱动器时钟线驱动器同轴电缆驱动器Piezoelectic传感器驱动MIC4426/4427/4428麦克雷尔订购信息包装8-lead SOIC8-lead SOIC8-lead MSOP8-lead塑料DIP8-lead SOIC8-lead SOIC8-lead MSOP8-pin塑料DIP8-lead SOIC8-lead SOIC8-lead MSOP8-lead塑料DIP配置双反相双反相双反相双反相双同相双同相双同相双同相反相+同相反相+同相反相+同相反相+同相MIC426/427/428设备更换已停产数MIC426CMMIC426BMMIC426CNMIC426BNMIC427CMMIC427BMMIC427CNMIC427BNMIC428CMMIC428BMMIC428CNMIC428BN更换MIC4426BMMIC4426BMMIC4426BNMIC4426BNMIC4427BMMIC4427BMMIC4427BNMIC4427BNMIC4428BMMIC4428BMMIC4428BNMIC4428BNMIC1426/1427/1428设备更换已停产数MIC1426CMMIC1426BMMIC1426CNMIC1426BNMIC1427CMMIC1427BMMIC1427CNMIC1427BNMIC1428CMMIC1428BMMIC1428CNMIC1428BN更换MIC4426BMMIC4426BMMIC4426BNMIC4426BNMIC4427BMMIC4427BMMIC4427BNMIC4427BNMIC4428BMMIC4428BMMIC4428BNMIC4428BN引脚配置MIC4426NC 1INA 2GND 3INB 48 NC7 OUTAS5 OUTB 4B52A7MIC4426 NC 1 INA 2 GND 3 INB 4 MIC4427 8 NC7 OUTA 6 VS5 OUTB 42MIC4427 NC 1A7INA 2 GND 3 B5INB 4 MIC4428 8 NC7 OUTA 6 VS5 OUTB 42MIC4428 A7B5反相双同相反相+同相引脚说明接脚号码1, 8234567引脚名称NCINAGNDINBOUTBVSOUTA引脚功能在内部没有连接控制输入 A: TTL/CMOS兼容逻辑输入. 地面控制输入 B: TTL/CMOS兼容逻辑输入. 输出B: CMOS图腾柱输出.电源输入:+4.5V到+18V输出A: CMOS图腾柱输出.MIC4426/4427/44282九月1999MIC4426/4427/4428麦克雷尔绝对最大额定值(注1)电源电压(VS) .................................................... +22V 输入电压(V中) (V)S+ 0.3V到GND – 5V结温(TJ) ........................................ 150°C存储温度............................... –65°C到+150°C焊接温度(10秒)....................................... 300°CESD 额定值,注3经营额定值(注2)电源电压(VS) ..................................... +4.5V到+18V温度范围(TA)(A) ........................................................ –55°C到+125°C(B) .......................................................... –40°C到+85°C 包装热阻PDIPθJA ............................................................ 130°C/WPDIPθJC ............................................................. 42°C/WSOICθJA ........................................................... 120°C/WSOICθJC ............................................................. 75°C/WMSOPθJC ......................................................... 250°C/W电气特性4.5V≤Vs≤18V; TA= 25°C,大胆值表明足额温度范围;除非说. 符号输入VIHVILI中输出V俄亥俄州VOLROIPKI高输出电压低输出电压输出电阻峰值输出电流闭锁保护顶住逆流>500I输出= 10mA, VS= 18V681.5VS–0.0250.0251012VVΩΩAmA输入电压的逻辑1 输入电压的逻辑0 输入电流≤V中≤VS–12.42.41.41.51.11.00.80.81VVVVµA参数条件最小Typ最大单位开关时间tRtFtD1tD2tPW电源ISIS注1.注2.注3.上升时间下降时间延迟Tlme延迟时间脉冲宽度测试图1测试图1测试Flgure 1 测试图1测试图140018201529171923273040204030405060nsnsnsnsnsnsnsnsns电源电流电源电流VINA= VINB= 3.0VVINA= VINB= 0.0V1.41.50.180.194.580.40.6mAmAmAmA超过绝对最大额定值可能会损坏设备.该设备是不能保证其经营额定值函数之外. 设备是ESD敏感.处理措施建议.九月19993MIC4426/4427/4428MIC4426/4427/4428麦克雷尔功率耗散功耗应计算,以确保该驱动器不超出其经营热额定值.静态功耗可以忽略不计.一个总的实用价值功耗是由造成的损耗总和负载和过渡功耗(PL+ PT).应用信息电源旁路需要大电流充电和放电大很快容性负载.例如,改变一个1000pF在16V 25ns负载需要从电源输入0.8A.为了保证在很宽的频率低电源阻抗范围,并联电容器被推荐为电源线上,铺设绕过.低电容与电感陶瓷MLC短引线长度(< 0.5")应该被使用.阿1.0µF电影并联电容器与一个或两个0.1µF陶瓷MLC通常提供足够的旁路电容器.接地当使用在MIC4426或MIC4428,的反相驱动器输入和输出电路或个人返回地面地面平面被推荐为最佳的开关速度.电压降之间的驱动程序的地面和发生输入信号的地面,在正常的高电流开关,将表现为负反馈,并降低开关速度.控制输入未使用的驱动器输入必须连接到逻辑高(这可VS)或地面.以最低的静态电流(< 500µA) ,未使用的输入连接到地.一个逻辑高电平信号会导致驱动器制订到9mA.该驱动器设计与控制输入海斯特100mV -esis.这提供清洁,减少输出转换当改变电流峰值阶段的国家.控制输入电压阈值约为1.5V.控制输入承认1.5V高达VS为逻辑高,消耗低于1µA在此范围内.该MIC4426/7/8驱动TL494, SG1526/7, MIC38C42, TSC170和类似开关式电源供应器集成电路.负载损耗功耗引起的连续负载电流(驱动电阻负载)通过驱动程序的输出电阻是:PL= IL2RO容性负载,在驱动器功耗为:PL= f CLVS2耗散过渡在应用在高频开关,过渡权力耗散可能会很大.在开关过程中会出现这种情况转换时,P沟道和N沟道输出FETs都进行了短暂的时刻,一个是转在另一种是关闭.PT= 2 f VSQ读取充电(Q)从以下图表:1×10-88×10-9CHARGE (Q)6×10-94×10-93×10-92×10-91×10-946810 12 14 16SUPPLY VOLTAGE (V) 18每交叉过渡的能量损。
Maxcell称重显示器使用说明书
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Maxcell
2-3-12 RS485 ID 输入 (选配功能)
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命令格式说明 ...................................................................................................................... 39
2-3-9 RS232 一般或简易输出重量 6 位或 7 位选择
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2-3-10 RTC 时间调整
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2-3-11 调整打印时年月日或日月年显示方式
2-3-3 输出格式选择
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2-3-4 传送方式设定
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使用前之准备工作
一. 请将本机放置于稳固且平坦之桌面上使用,勿放于摇动或振动之台架上。 二. 避免将本机放置于温度变化过大或空气流动剧烈之场所,如日光直射或冷气机之出风口。 三. 请使用独立之电源插座,以避免其它电器用品干扰。 四. 打开电源时,秤盘上请勿放置任何东西。 五. 产品使用时,秤物之重心须位于秤盘之中心点,且秤物不超出秤盘范围,以确保其准确度。 六. 使用本机前,请先温机 15 ~ 20 分钟。 七. 请注意当低电源警示之符号( )闪烁时,则表示须再行充电。 八. 如对本产品有任何建议,请不吝指正。
IRS4427S中文资料
Data Sheet No. PD60278Block DiagramPackagesProduct SummaryI O +/- 1.5 A / 1.5 A V OUT 6 V - 20 V t on/off (typ.)50 ns & 50 nsDUAL LOW SIDE DRIVERFeatures•Gate drive supply range from 6 V to 20 V •CMOS Schmitt-triggered inputs•Matched propagation delay for both channels • Outputs out of phase with inputs (IRS4426)• Outputs in phase with inputs (IRS4427)• OutputA out of phase with inputA andoutputB in phase with inputB (IRS4428)• RoHS compliantDescriptionsThe IRS4426/IRS4427/IRS4428 are low voltage,high speed power MOSFET and IGBT driver. Pro-prietary latch immune CMOS technologies en-able ruggedized monolithic construction. Logic inputs are compatible with standard CMOS or LSTTL outputs. The output drivers feature a high pulse current buffer stage designed for mini-mum driver cross-conduction. Propagation delays between two channels are matched.8 Lead PDIP 1IRS4426/IRS4427/IRS4428(S)PbF8-Lead SOIC 2IRS4426/IRS4427/IRS4428(S)PbFAbsolute Maximum RatingsAbsolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-eters are absolute voltages referenced to GND. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.Recommended Operating ConditionsThe input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within the recommended conditions. All voltage parameters are absolute voltages referenced to GND.DC Electrical CharacteristicsV BIAS (V S ) = 15 V, T A = 25 °C unless otherwise specified. The V IN and I IN parameters are referenced to GND and are applicable to input leads: INA and INB. The V O and I O parameters are referenced to GND and are applicable to the 3IRS4426/IRS4427/IRS4428(S)PbFDC Electrical Characteristics cont.V BIAS (V S ) = 15 V, T A = 25 °C unless otherwise specified. The V IN , and I IN parameters are referenced to GND and are applicable to input leads: INA and INB. The V O and I O parameters are referenced to GND and are applicable to the 4IRS4426/IRS4427/IRS4428(S)PbFFunctional Block Diagram IRS4426AC Electrical CharacteristicsV BIAS (V S ) = 15 V, CL = 1000 pF, T A = 25 o C unless otherwise specified.Functional Block Diagram IRS44275 6IRS4426/IRS4427/IRS4428(S)PbFFunctional Block Diagram IRS4428 7IRS4426/IRS4427/IRS4428(S)PbFV S INA GND INBINA GND INBINA GND INBOUTA V S OUTBOUTA V S OUTBOUTA V S OUTB8 Lead PDIPINA OUTA V SINA GND INBINA GND INBGND INBOUTA V S OUTBOUTA V S OUTBV S OUTB8 Lead SOICIRS4426/IRS4427/IRS4428(S)PbF INA (IRS4426, IRS4428)INB (IRS4426)INA (IRS4427)INB (IRS4427, IRS4428)OUTAOUTBFigure 1. Timing DiagramINA (IRS4426, IRS4428)INB (IRS4426)INA (IRS4427)INB (IRS4427, IRS4428)OUTA OUTBtftd2td1trFigure 2. Switching Time Waveforms8IRS4426/IRS4427/IRS4428(S)PbFSS Array IRS4428Figure 3. Switching Time Test Circuits9IRS4426/IRS4427/IRS4428(S)PbF10 11IRS4426/IRS4427/IRS4428(S)PbFIRS4426/IRS4427/IRS4428(S)PbF12IRS4426/IRS4427/IRS4428(S)PbF13IRS4426/IRS4427/IRS4428(S)PbF14IRS4426/IRS4427/IRS4428(S)PbF15IRS4426/IRS4427/IRS4428(S)PbFIRS4426/IRS4427/IRS4428(S)PbF1718IRS4426/IRS4427/IRS4428(S)PbFCLOADED TAPE FEED DIRECTIONTape & Reel 8-lead SOIC 19IRS4426/IRS4427/IRS4428(S)PbF8-Lead PDIP IRS4426PbF 8-Lead SOIC IRS4426SPbF 8-Lead PDIP IRS4427PbF 8-Lead SOIC IRS4427SPbF 8-Lead PDIP IRS4428PbF 8-Lead SOIC IRS4428SPbFORDER INFORMATIONLEADFREE PART MARKING INFORMATIONPer SCOP 200-002The SOIC-8 is MSL2 qualified.This product has been designed and qualified for the industrial level.Qualification standardscan be found at IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105Data and specifications subject to change without notice. 11/20/2006。