TL081ACJG中文资料
TL082D
June 2008 Rev 31/15TL081General purpose JFET single operational amplifiersFeatures■Wide common-mode (up to V CC +) and differential voltage range ■Low input bias and offset current ■Output short-circuit protection■High input impedance JFET input stage ■Internal frequency compensation ■Latch-up free operation ■High slew rate: 16V/µs (typ)DescriptionThe TL081, TL081A and TL081B are high-speed JFET input single operational amplifiersincorporating well matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit.The devices feature high slew rates, low input bias and offset currents, and low offset voltage temperature coefficient.Schematic diagram TL0812/151 Schematic diagramTL081Absolute maximum ratings3/152 Absolute maximum ratingsTable 1.Absolute maximum ratingsSymbol ParameterTL081I, AI, BITL081C, AC,BCUnit V CC Supply voltage (1)1.All voltage values, except differential voltage, are with respect to the zero reference level (ground) of thesupply voltages where the zero reference level is the midpoint between V CC + and V CC -.±18V V in Input voltage (2)2.The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 volts,whichever is less.±15V V id Differential input voltage (3)3.Differential voltages are the non-inverting input terminal with respect to the inverting input terminal.±30V P totPower dissipation680mWOutput short-circuit duration (4)4.The output may be shorted to ground or to either supply. Temperature and/or supply voltages must belimited to ensure that the dissipation rating is not exceeded.Infinite T stgStorage temperature range -65 to +150°CR thjaThermal resistance junction to ambient (5) (6)SO-8DIP85.Short-circuits can cause excessive heating and destructive dissipation.6.Rth are typical values.12585°C/WR thjcThermal resistance junction to case (5)(6)SO-8DIP84041°C/W ESDHBM: human body model (7)7.Human body model: 100pF discharged through a 1.5k Ω resistor between two pins of the device, done forall couples of pin combinations with other pins floating. 500V MM: machine model (8)8.Machine model: a 200pF cap is charged to the specified voltage, then discharged directly between twopins of the device with no external series resistor (internal resistor < 5Ω), done for all couples of pin combinations with other pins floating.200V CDM: charged device model (9)9.Charged device model: all pins plus package are charged together to the specified voltage and thendischarged directly to the ground.1.5kVTable 2.Operating conditionsSymbol ParameterTL081I, AI, BITL081C, AC, BC Unit V CC Supply voltage range6 to 36V T operOperating free-air temperature range-40 to +1050 to +70°C3 ElectricalcharacteristicsTable 3.V CC = ±15V, T amb = +25°C (unless otherwise specified)Symbol Parameter TL081I, AC, AI, BC,BITL081CUnit Min.Typ.Max.Min.Typ.Max.V io Input offset voltage (R s= 50Ω)T amb = +25°C TL081TL081ATL081BT min≤ T amb≤ T max TL081TL081ATL081B3311063137531013mVDV io Input offset voltage drift1010µV/°CI io Input offset current (1)T amb = +25°CT min≤ T amb≤ T max51004510010pAnAI ib Input bias current (1)T amb = +25°CT min≤ T amb≤ T max20200202040020nAA vd Large signal voltage gain (R L = 2kΩ, V o = ±10V)T amb = +25°CT min≤ T amb≤ T max50252002515200V/mVSVR Supply voltage rejection ratio (R S= 50Ω)T amb = +25°CT min≤ T amb≤ T max808086707086dBI CC Supply current, no loadT amb = +25°CT min≤ T amb≤ T max1.42.52.51.42.52.5mAV icm Input common mode voltage range±11+15-12±11+15-12VCMR Common mode rejection ratio (R S= 50Ω)T amb = +25°CT min≤ T amb≤ T max808086707086dBI os Output short-circuit currentT amb = +25°CT min≤ T amb≤ T max10104060601010406060mA±V opp Output voltage swingT amb = +25°C R L = 2kΩR L = 10kΩT min≤ T amb≤ T max R L = 2kΩR L = 10kΩ101210121213.5101210121213.5VSR Slew rate (T amb = +25°C)V in = 10V, R L = 2kΩ, C L = 100pF, unity gain816816V/µs4/155/15t r Rise time (T amb = +25°C)V in = 20mV , R L = 2k Ω, C L = 100pF , unity gain 0.10.1µs K ov Overshoot (T amb = +25°C)V in = 20mV , R L = 2k Ω, C L = 100pF , unity gain 1010%GBP Gain bandwidth product (T amb = +25°C)V in = 10mV , R L = 2k Ω, C L = 100pF , F= 100kHz 2.54 2.54MHz R i Input resistance10121012ΩTHDTotal harmonic distortion (T amb = +25°C), F= 1kHz, R L = 2k Ω,C L = 100pF , A v = 20dB,V o = 2V pp 0.010.01%e n Equivalent input noise voltage R S = 100Ω, F= 1kHz 1515∅mPhase margin4545degrees1.The input bias currents are junction leakage currents which approximately double for every 10°C increase in the junctiontemperature.Table 3.V CC = ±15V, T amb = +25°C (unless otherwise specified) (continued)SymbolParameterTL081I, AC, AI, BC,BI TL081CUnitMin.Typ.Max.Min.Typ.Max.nV Hz-----------Figure 3.Maximum peak-to-peak outputFigure 4.Maximum peak-to-peak outputFigure 6.Maximum peak-to-peak outputFigure 7.Maximum peak-to-peak output Figure 8.Maximum peak-to-peak output6/157/15Figure 9.Input bias current versus free airFigure rge signal differential voltageFigure rge signal differential voltageamplification and phase shiftFigure 12.Total power dissipation versus freeair temperatureFigure 13.Supply current per amplifier versus Figure 14.Supply current per amplifier versusFigure mon mode rejection ratioFigure 16.Equivalent input noise voltageFigure 19.Voltage follower large signal pulse8/15TL081Parameter measurement information9/154 Parameter measurement informationTypical applications TL08110/155 Typical applicationsTL081Package information11/156 Package informationIn order to meet environmental requirements, ST offers these devices in ECOPACK®packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: .Package information TL08112/156.1 DIP 8 package informationTable 4.DIP8 package mechanical dataRef.DimensionsMillimetersInches Min.Typ.Max.Min.Typ.Max.A 5.330.210A10.380.015A2 2.92 3.30 4.950.1150.1300.195b 0.360.460.560.0140.0180.022b2 1.14 1.52 1.780.0450.0600.070c 0.200.250.360.0080.0100.014D 9.029.2710.160.3550.3650.400E 7.627.878.260.3000.3100.325E1 6.106.357.110.2400.2500.280e 2.540.100eA 7.620.300eB 10.920.430L2.923.303.810.1150.1300.150TL081Package information13/156.2 SO-8 package informationTable 5.SO-8 package mechanical dataRef.DimensionsMillimetersInches Min.Typ.Max.Min.Typ.Max.A 1.750.069A10.100.250.0040.010A2 1.250.049b 0.280.480.0110.019c 0.170.230.0070.010D 4.80 4.90 5.000.1890.1930.197E 5.80 6.00 6.200.2280.2360.244E1 3.803.904.000.1500.1540.157e 1.270.050h 0.250.500.0100.020L 0.40 1.270.0160.050k 1°8°1°8°ccc0.100.004Ordering information TL08114/157 Ordering information8 Revision historyTable 6.Order codesOrder code TemperaturerangePackagePackingMarking TL081IN TL081AIN TL081BIN -40°C, +105°C DIP8T ubeTL081IN TL081AIN TL081BIN TL081ID/IDT TL081AID/AIDT TL081BID/BIDT SO-8T ube or tape & reel 081I 081AI 081BI TL081IYD/DT (1)TL081AIYD/DT (1)TL081BIYD/DT (1)1.Qualification and characterization according to AEC Q100 and Q003 or equivalent, advanced screeningaccording to AEC Q001 & Q 002 or equivalent are on-going.SO-8(Automotive grade)T ube or tape & reel081IY 081AIY 081BIY TL081CN TL081ACN TL081BCN 0°C, +70°CDIP8T ubeTL081CN TL081ACN TL081BCN TL081CD/CDT TL081ACD/ACDT TL081BCD/BCDTSO-8T ube or tape & reel081C 081AC 081BCTable 7.Document revision historyDate RevisionChanges30-Apr-20011Initial release.27-Jul-20072Added values for R thja and R thjc in Table 1: Absolute maximumratings .Added T able 2: Operating conditions .Added automotive grade part numbers in T able 6: Order codes .Format update.27-Jun-20083Removed information concerning military temperature range (TL081Mx, TL081AMx, TL081BMx).Added missing order codes for automotive grade products and updated footnote in T able 6: Order codes .TL081Please Read Carefully:Information in this document is provided solely in connection with ST products. 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JFET Input Operational
Amplifiers
These low–cost JFET input operational amplifiers combine two state–of– the–art linear technologies on a single monolithic integrated circuit. Each internally compensated operational amplifier has well matched high voltage JFET input devices for low input offset voltage. The BIFET technology provides wide bandwidths and fast slew rates with low input bias currents, input offset currents, and supply currents.
+ 10 3– 9
Inputs 3
8 Output 3
TL084 (Top View)
© Motorola, Inc. 1997
TL082IDR中文资料
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9851501Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9851501QPA ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9851503QCAACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL081ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8TBD Call TI Call TITL081ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRG4ACTIVESOICD82500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL081CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8TBD Call TI Call TITL081ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081MFKB OBSOLETE LCCC FK 20TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8TBD Call TI Call TITL082ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDE4ACTIVESOICD875Green (RoHS &CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)TL082BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPSRG4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPW ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWE4ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8TBDCall TI Call TITL082CPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDG4ACTIVESOICD875Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL082IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK 20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeTL082MJG ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL082MJGB ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL084ACD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACN ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACNSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRG4ACTIVESOICD142500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL084BCN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084BCNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free CU NIPDAU N/A for Pkg Type 23-Apr-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)(RoHS)TL084MFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MJ ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084MJB ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084QD ACTIVE SOIC D 1450TBD CU NIPDAU Level-1-220C-UNLIM TL084QDRACTIVESOICD142500TBDCU NIPDAULevel-1-220C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight inhomogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.23-Apr-2007TAPE AND REELINFORMATION3-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL081IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082ACPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082CPWR PW 8MLA 330127.0 3.6 1.6812Q1TL082IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082IDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082IPWR PW 8MLA 330127.0 3.6 1.6812Q1TL084ACDR D 14MLA 33016 6.59.0 2.1816Q1TL084ACDR D 14FMX 3300 6.59.0 2.1816Q1TL084ACNSR NS 14MLA 330168.210.5 2.51216Q1TL084BCDR D 14FMX 3300 6.59.0 2.1816Q1TL084CDR D 14FMX 3300 6.59.0 2.1816Q1TL084CNSR NS 14MLA 330168.210.5 2.51216Q1TL084CPWR PW 14MLA 330127.0 5.6 1.6812Q1TL084IDRD14FMX3306.59.02.1816Q13-May-2007TAPE AND REEL BOX INFORMATIONDevicePackagePins Site Length (mm)Width (mm)Height (mm)TL081ACDR D 8FMX 338.1340.520.64TL081BCDR D 8FMX 338.1340.520.64TL081CDR D 8FMX 338.1340.520.64TL081CPSR PS 8MLA 333.2333.228.58TL081IDR D 8FMX 338.1340.520.64TL082ACDR D 8FMX 338.1340.520.64TL082ACDR D 8MLA 338.1340.520.64TL082ACPSR PS 8MLA 333.2333.228.58TL082BCDR D 8FMX 338.1340.520.64TL082CDR D 8FMX 338.1340.520.64TL082CDR D 8MLA 338.1340.520.64TL082CPSR PS 8MLA 333.2333.228.58TL082CPWR PW 8MLA 338.1340.520.64TL082IDR D 8FMX 338.1340.520.64TL082IDR D 8MLA 338.1340.520.64TL082IPWR PW 8MLA 338.1340.520.64TL084ACDR D 14MLA 333.2333.228.58TL084ACDR D 14FMX 333.2333.228.58TL084ACNSR NS 14MLA 333.2333.228.58TL084BCDR D 14FMX 333.2333.228.58TL084CDR D 14FMX 333.2333.228.58TL084CNSR NS 14MLA 333.2333.228.58TL084CPWR PW 14MLA 338.1340.520.64TL084IDRD14FMX333.2333.228.583-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
█主要用途█外形图及引脚排列
集电极—发射极击穿电压 发射极—基极截止电流 直流电流增益
４００ ８ ６ ４
１８０
１ ４０ ３０ １ １．５ ３ １．２ １．６ １．１ ３．０ ０．７
Ｖ ｍＡ Ｖ Ｖ Ｖ Ｖ Ｖ ｐＦ μＳ μＳ
汕头华汕电子器件有限公司
NPN S I L I C O N T R A N S I S T O R
KSH13009H
█ 特性曲线Biblioteka 对应国外型号 ＦＪＡ１３００９
汕头华汕电子器件有限公司
NPN
SILICON
T RA N S I S T O R 对应国外型号 ＦＪＡ１３００９
KSH13009H
█ 特性曲线
TO-3P
1―基 极，B 2―集电极，C 3―发射极，E
IB——基极电流…………………………………………………6A
█ 电参数（Ta=25℃）
参数符号 符 号 说 明 最小值 典型值 最大值 单 位 测 试 条 件
ＢＶＣＥＯ ＩＥＢＯ ＨＦＥ（１） ＨＦＥ（２）
汕头华汕电子器件有限公司
NPN S I L I C O N T R A N S I S T O R
KSH13009H
█ 主要用途
高压快速开关
对应国外型号 ＦＪＡ１３００９
█ 外形图及引脚排列
█ 极限值（Ta=25℃）
T s t g——贮存温度………………………………… －65~150℃ T j ——结温………………………………………………… 150℃ PC——集电极耗散功率（T c =25℃）…………………… 130W VCBO ——集电极—基极电压……………………………… 700V VCEO——集电极—发射极电压…………………………… 400V VEBO ——发射极—基极电压…………………………………9V IC——集电极电流 （DC） ………………………………………12A
TL084AC中文资料
Amplifiers and Comparators
In Brief . . .
For over two decades, Motorola has continually refined and updated integrated circuit technologies, analog circuit design techniques and processes in response to the needs of the marketplace. The enhanced performance of newer operational amplifiers and comparators has come through innovative application of these technologies, designs and processes. Some early designs are still available but are giving way to the new, higher performance operational amplifier and comparator circuits. Motorola has pioneered in JFET inputs, low temperature coefficient input stages, Miller loop compensation, all NPN output stages, dual–doublet frequency compensation and analog “in–the–package” trimming of resistors to produce superior high performance operational amplifiers and comparators, operating in many cases from a single supply with low input offset, low noise, low power, high output swing, high slew rate and high gain–bandwidth product at reasonable cost to the customer. Present day operational amplifiers and comparators find applications in all market segments including motor controls, instrumentation, aerospace, automotive, telecommunications, medical, and consumer products. Page Operational Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–2 Single . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–2 Dual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–3 Quad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–4 One Volt SMARTMOS™ Rail–to–Rail Dual Operational Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–6 High Frequency Amplifiers . . . . . . . . . . . . . . . . . . . . . . . 4.1–7 AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–7 Miscellaneous Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . 4.1–8 Bipolar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–8 CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–8 Comparators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Single . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Dual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Quad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Package Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–10
TL081A中文资料
元器件交易网IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor services might be or are used.Copyright © 1995, Texas Instruments Incorporated。
TL082中文资料_数据手册_参数
TL081, TL081A, TL081B, TL082, TL082A TL082B, TL084, TL084A, TL084B
SLOS081I – FEBRUARY 1977 – ontents
1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 5
TL08xI ........................................................................ 6 6.6 Electrical Characteristics for TL08xM and TL084x ... 7 6.7 Operating Characteristics.......................................... 7 6.8 Dissipation Rating Table ........................................... 8 6.9 Typical Characteristics .............................................. 9 7 Parameter Measurement Information ................ 13 8 Detailed Description ............................................ 14 8.1 Overview ................................................................. 14
G系列塑壳断路器
更多信息请访问：
4
G系列塑壳断路器 15 - 2500A，符合UL，CSA & ICE
产品概述
标准和证书
概述
2008 年 3 月
伊顿Cutler-Hammer®塑壳断路器设计 符合下列国际标准： 澳大利亚AS 2184和AS 3947-2. ●英国EN 60947.2. ●国际电工委员会IEC 60947.2 ●日本T-Mark 标准 ●南非SABS 156 ●瑞士SEV 947.2 ●法国NFC63 -120 ●德国VDE0660
伊顿在工业领域提供了一种最全面的限 流型断路器。在相同的尺寸下，不带熔 丝保护下，标准型和高分断的工业断路 器可在480V下实现150kA的分断。
操作机构
Cutler-Hammer塑壳断路器采用了一个 具有手柄的操作机构，该手柄可以指示 断路器的工作状态：ON OFF和TRIPPED。
当断路器出现过载、短路、分励或者欠 电压脱扣器动作时，手柄将会跳至TRIPPED(脱扣)的位置，此时，如果要重新 合闸必须将手柄打到RESET的位置。
日本东芝光耦
日本东芝光耦深圳市美特光有限公司为日本东芝品牌光耦代理商。
TOSHIBA光耦中文名：东芝光耦。
东芝在日本东京都的总部大楼东芝（TOSHIBA），是日本最大的半导体制造商，亦是第二大综合电机制造商，隶属于三井集团旗下。
我司供应东芝全系列光耦合器，东芝光耦从功能分有逻辑输出，可控硅输出，光电二极管输出，固态继电器，高速输出，MOSFET输出，晶体管输出等。
高速光耦TLP115A描述：东芝光耦合器TLP115A是一个小外形耦合器，适合表面贴装。
TLP115A由一个高输出功率GAAℓAs发光二极管，光耦合到一个集成的高增益，高速光屏蔽检测器的输出是一个集电极开路肖特基钳位晶体管。
其中分capacirively加上常见的噪音到地面，提供1000V/μs的保证瞬变抗扰度规范。
特点：输入电流阈值：IF = 5mA (max.)切换速度：10MBD（典型值）共模瞬变抗扰度：± 1000V / μs (min.)最佳性能温度。
：0～70°C隔离电压：2500Vrms (min.)UL认证：UL1577, file no. E67349运用：高速，长距离隔离线路接收器微处理器系统接口数字隔离的A / D，D / A转换电脑外设接口接地回路消除参数：东芝高速光耦型号有：TLP550(F), TLP116A(E), 6N137F，TLP2166A(F), 6N136F，TLP2630(F),，TLP118(TPL,E),，TLP715(F),，TLP105(F), TLP108(F),，TLP557(F), 6N139(F), TLP719(TP,F), TLP2200F，6N138F，TLP559(IGM,F), TLP2309(E), TLP2631(F),TLP2098(F), TLP118(E), TLP558(F), TLP2601(F), TLP117(F), TLP718(F), TLP559(F), TLP2530(F), TLP2531(F), TLP2368(E), TLP512(F), TLP2105(F), TLP116(F), TLP2366(E), TLP115A(F), TLP716(F), TLP716(TP,F), TLP719(F), TLP714(F), TLP2118E(F), TLP2108(F),TLP2418(F), TLP2160(F), TLP2631TP1F TLP2168(F), TLP2355(E，TLP2362(E),TLP2200(TP1,F), 6N138(TP1,F), TLP2601(TP1,F), TLP2303(E TLP2303(TPR,ETLP109(IGM,E), TLP2468(F), TLP109(E), TLP2408(F), TLP104(E), TLP2409(F),TLP2358(E), TLP2301(TPL,E，TLP2303(TPL,E TLP555(F), TLP754(F), TLP2631(LF5,F), TLP2404(F), TLP2405(F), TLP2301(E，TLP2116(F), TLP2403(F), 6N137(TP1F),TLP116A(E，6N136(TP1F), TLP2630(TP1F), TLP2601(LF1,F), TLP104(TPR,E),TLP2362(TPR,E，TLP2531(TP1F), TLP2358(TPL,E), TLP2530(TP1F), TLP2116(TP,F), TLP2468(TP,F), 6N135(F), TLP559(IGM-TP5F), TLP2368(TPR,E，TLP2355(TPL,E，TLP751(F), TLP109(TPR,E), TLP2098(TPL,F), TLP2166A(TP,F), TLP118(TPR,E),TLP117(TPR,F), TLP2358(TPR,E), TLP2309(TPL,E), 6N139(TP1F), TLP109(IGM-TPR,E), TLP117(TPR,F),。
TL081CPSR中文资料
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9851501Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9851501QPA ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9851503QCAACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL081ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8TBD Call TI Call TITL081ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRG4ACTIVESOICD82500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL081CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8TBD Call TI Call TITL081ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081MFKB OBSOLETE LCCC FK 20TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8TBD Call TI Call TITL082ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDE4ACTIVESOICD875Green (RoHS &CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)TL082BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPSRG4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPW ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWE4ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8TBDCall TI Call TITL082CPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDG4ACTIVESOICD875Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL082IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK 20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeTL082MJG ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL082MJGB ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL084ACD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACN ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACNSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRG4ACTIVESOICD142500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL084BCN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084BCNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free CU NIPDAU N/A for Pkg Type 23-Apr-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)(RoHS)TL084MFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MJ ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084MJB ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084QD ACTIVE SOIC D 1450TBD CU NIPDAU Level-1-220C-UNLIM TL084QDRACTIVESOICD142500TBDCU NIPDAULevel-1-220C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight inhomogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.23-Apr-2007TAPE AND REELINFORMATION3-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL081IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082ACPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082CPWR PW 8MLA 330127.0 3.6 1.6812Q1TL082IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082IDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082IPWR PW 8MLA 330127.0 3.6 1.6812Q1TL084ACDR D 14MLA 33016 6.59.0 2.1816Q1TL084ACDR D 14FMX 3300 6.59.0 2.1816Q1TL084ACNSR NS 14MLA 330168.210.5 2.51216Q1TL084BCDR D 14FMX 3300 6.59.0 2.1816Q1TL084CDR D 14FMX 3300 6.59.0 2.1816Q1TL084CNSR NS 14MLA 330168.210.5 2.51216Q1TL084CPWR PW 14MLA 330127.0 5.6 1.6812Q1TL084IDRD14FMX3306.59.02.1816Q13-May-2007TAPE AND REEL BOX INFORMATIONDevicePackagePins Site Length (mm)Width (mm)Height (mm)TL081ACDR D 8FMX 338.1340.520.64TL081BCDR D 8FMX 338.1340.520.64TL081CDR D 8FMX 338.1340.520.64TL081CPSR PS 8MLA 333.2333.228.58TL081IDR D 8FMX 338.1340.520.64TL082ACDR D 8FMX 338.1340.520.64TL082ACDR D 8MLA 338.1340.520.64TL082ACPSR PS 8MLA 333.2333.228.58TL082BCDR D 8FMX 338.1340.520.64TL082CDR D 8FMX 338.1340.520.64TL082CDR D 8MLA 338.1340.520.64TL082CPSR PS 8MLA 333.2333.228.58TL082CPWR PW 8MLA 338.1340.520.64TL082IDR D 8FMX 338.1340.520.64TL082IDR D 8MLA 338.1340.520.64TL082IPWR PW 8MLA 338.1340.520.64TL084ACDR D 14MLA 333.2333.228.58TL084ACDR D 14FMX 333.2333.228.58TL084ACNSR NS 14MLA 333.2333.228.58TL084BCDR D 14FMX 333.2333.228.58TL084CDR D 14FMX 333.2333.228.58TL084CNSR NS 14MLA 333.2333.228.58TL084CPWR PW 14MLA 338.1340.520.64TL084IDRD14FMX333.2333.228.583-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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Analog Devices ADTL082A ADTL082J ADTL084J 双通道操作电路模
Rev. BInformation furnished by Analog Devices is believed to be accurate and reliable. However, noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Speci cations subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners.One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved.引脚配置OUT A1–IN A2+IN A3–V4+V8OUT B7–IN B6+IN B5ADTL082JTOP VIEW(Not to Scale)6275-1OUT A1–IN A2+IN A3–V4+V8OUT B7–IN B6+IN B5ADTL082ATOP VIEW(Not to Scale)6275-2OUT A1–IN A2+IN A3+V4OUT D14–IN D13+IN D12–V11+IN B5+IN C10–IN B6–IN C9OUT B7OUT C8ADTL084JTOP VIEW(Not to Scale)6275-3ADTL084A1234567–IN A+IN A+VOUT B–IN B+IN BOUT A141312111098–IN D+IN D–VOUT C–IN C+IN COUT DTOP VIEW(Not to Scale)6275-4低成本、JFET输入运算放大器ADTL082/ADTL084产品特性TL082/TL084兼容低输入偏置电流：10 pA(最大值)失调电压5.5 mV(最大值，ADTL082A/ADTL084A)9 mV(最大值，ADTL082J/ADTL084J)工作电压：±15 V低噪声：16 nV/√Hz宽带宽：5 MHz压摆率：20 V/μs共模抑制比(CMRR)：80 dB(最小值)总谐波失真： 0.001%电源电流：1.2 mA(典型值)单位增益稳定应用通用放大功率控制和监测有源滤波器工业/过程控制数据采集采样保持电路积分器输入缓冲图1. 8引脚SOIC_N(R-8)图2. 8引脚MSOP(RM-8)图3. 14引脚SOIC_N(R-14)图4. 14引脚TSSOP(RU-14)概述ADTL082和ADTL084均为具有业界领先性能的JFET输入放大器，其性能优于TL08x器件。
常用运放芯片实物和引脚功能图_TL081-082-084运放引脚功能及贴片封装形式
常用运放芯片实物和引脚功能图_TL081/082/084运放引脚功能及贴片封装形式（1）运放芯片的3种型号序列（部分器件有此序列）如TL081、TL082、TL084，分别为8引脚单运放；8引脚双运放；14引脚四运放集成器件。
封装型式一般为塑封双列直插和贴片双列，环列封装形式比较少见。
图1 TL081/082/084运放引脚功能及贴片封装形式而常见常用，仅为下述两种器件。
世界上有几个人？有两个人，男人和女人，不失为一个智慧的回答。
常用运放芯片有几片，只有两片，8脚和14脚的双运放和四运放集成器件（8脚封装单运放器件和环列式封装器件应用较少），把此两种芯片引脚功能记住，检修中就不需要随时去查资料了。
图2 常用运放芯片实物和引脚功能图如上图。
其封装一般为塑封双列直插DIP8/DIP14和塑封贴片工艺封装SO8/SO14两种形式，随着电子线路板小型化精密化要求的提高，贴片元件的应用占据主流，直插式器件逐渐淡出人们的视野。
但无论何种封装模式，其引脚功能、次序都是一样的，所以仅需记准8脚（双运放）和14脚（四运放）两种运放的引脚功能就够了。
（2）运放芯片的3种温度序列任何一种集成IC器件，按应用温度范围不同，都可细分为3种器件，如LM358，实际上有LM158、LM258、LM358三种型号的产品，其引脚功能、内部结构、工作原理、供电电压等等都无差别，仅仅是应用温度范围差异甚大。
LM158 适应工作温度-50℃~125℃，军工用品（1类）；LM258 适应工作温度-25℃~85℃，工业用品（2类）；LM358 适应工作温度0℃~70℃，农用品（3类）。
单看参数，似乎LM258适用于山东地区，若用于东北地区，其参数有些不足。
而LM358仅能适用于江南地区。
而事实上并非如此，如低于2类品规格参数被淘汰到3类品的器件，可能是-24℃~84℃温度范围以内的产品，仅次于2类品，比3类品的温度指标实际上要高许多的。
在家电元件市场能购到的多为3类品。
TLC084资料
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments.
TLC080 and TLC081 AVAILABLE OPTIONS PACKAGED DEVICES TA 0°C to 70°C SMALL OUTLINE (D)† TLC080CD TLC081CD TLC080ID TLC081ID TLC080AID TLC081AID SMALL OUTLINE (DGN)† TLC080CDGN TLC081CDGN TLC080IDGN TLC081IDGN — — SYMBOL xxTIACW xxTIACY xxTIACX xxTIACZ — — PLASTIC DIP (P) TLC080CP TLC081CP TLC080IP TLC081IP TLC080AIP TLC081AIP
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
D Wide Bandwidth . . . 10 MHz D High Output Drive D D D D D D D
− IOH . . . 57 mA at VDD − 1.5 V − IOL . . . 55 mA at 0.5 V High Slew Rate − SR+ . . . 16 V/µs − SR− . . . 19 V/µs Wide Supply Range . . . 4.5 V to 16 V Supply Current . . . 1.9 mA/Channel Ultralow Power Shutdown Mode IDD . . . 125 µA/Channel Low Input Noise Voltage . . . 8.5 nV√Hz Input Offset Voltage . . . 60 µV Ultra-Small Packages − 8 or 10 Pin MSOP (TLC080/1/2/3)
DAC081C081_08中文资料
March 13, 2008 DAC081C081/ DAC081C0858-Bit Micro Power Digital-to-Analog Converter with anI2C-Compatible InterfaceGeneral DescriptionThe DAC081C081 is an 8-bit, single channel, voltage-output digital-to-analog converter (DAC) that operates from a +2.7V to 5.5V supply. The output amplifier allows rail-to-rail output swing and has an 4.5µsec settling time. The DAC081C081 uses the supply voltage as the reference to provide the widest dynamic output range and typically consumes 132µA while operating at 5.0V. It is available in 6-lead TSOT and LLP packages and provides three address options (pin se-lectable).As an alternative, the DAC081C085 provides nine I2C ad-dressing options and uses an external reference. It has the same performance and settling time as the DAC081C081. It is available in an 8-lead MSOP.The DAC081C081 and DAC081C085 use a 2-wire, I2C-com-patible serial interface that operates in all three speed modes, including high speed mode (3.4MHz). An external address selection pin allows up to three DAC081C081 or nine DAC081C085 devices per 2-wire bus. Pin compatible alter-natives to the DAC081C081 are available that provide addi-tional address options.The DAC081C081 and DAC081C085 each have a 16-bit reg-ister that controls the mode of operation, the power-down condition, and the output voltage. A power-on reset circuit ensures that the DAC output powers up to zero volts. A power-down feature reduces power consumption to less than a microWatt. Their low power consumption and small packages make these DACs an excellent choice for use in battery op-erated equipment. Each DAC operates over the extended industrial temperature range of −40°C to +125°C.The DAC081C081 and DAC081C085 are each part of a fam-ily of pin compatible DACs that also provide 12 and 10 bit resolution. F or 12-bit DACs see the DAC121C081 and DAC121C085. For 10-bit DACs see the DAC101C081 and DAC101C085.Features■Guaranteed Monotonicity to 8-bits■Low Power Operation: 156 µA max @ 3.3V■Extended power supply range (+2.7V to +5.5V)■I2C-Compatible 2-wire Interface which supports standard (100kHz), fast (400kHz), and high speed (3.4MHz) modes ■Rail-to-Rail Voltage Output■Very Small PackageKey Specifications■Resolution8 bits ■INL±0.6 LSB (max)■DNL±0.1 LSB (max)■Settling Time 4.5 µs (max)■Zero Code Error+10 mV (max)■Full-Scale Error−0.7 %FS (max)■Supply Power—Normal380 µW (3V) / 730 µW (5V) typ —Power Down0.5 µW (3V) / 0.9 µW (5V) typ Applications■Industrial Process Control■Portable Instruments■Digital Gain and Offset Adjustment■Programmable Voltage & Current Sources■Test EquipmentPin-Compatible AlternativesAll devices are fully pin and function compatible. Resolution TSOT-6 and LLP-6PackagesMSOP-8 Package w/External Reference 12-bit DAC121C081DAC121C08510-bit DAC101C081DAC101C0858-bit DAC081C081DAC081C085Connection Diagrams300523013005230230052310 I2C® is a registered trademark of Phillips Corporation.© 2008 National Semiconductor DAC081C081/ DAC081C085 8-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible InterfaceOrdering InformationOrder Code Temperature Range Package Top Mark DAC081C081CIMK −40°C ≤ T A ≤ +125°C TSOTX86C DAC081C081CIMKX −40°C ≤ T A ≤ +125°C TSOT Tape-and-ReelX86C DAC081C081CISD −40°C ≤ T A ≤ +125°C LLPX89DAC081C081CISDX −40°C ≤ T A ≤ +125°C LLP Tape-and-ReelX89DAC081C085CIMM −40°C ≤ T A ≤ +125°C MSOPX92C DAC081C085CIMMX −40°C ≤ T A ≤ +125°CMSOP Tape-and-Reel X92C DAC081C08XEBEvaluation BoardBlock Diagram30052303 2D A C 081C 081/ D A C 081C 085Pin DescriptionsSymbol Type Equivalent CircuitDescriptionV OUT Analog OutputAnalog Output Voltage.V A SupplyPower supply input. For the TSOT and LLP versions, this supply is used as the reference. Must be decoupled to GND.GNDGround Ground for all on-chip circuitry.SDADigital Input/OutputSerial Data bi-directional connection. Data is clocked into or out of the internal 16-bit register relative to the clock edges of SCL. This is an open drain data line that must be pulled to the supply (V A ) by an external pull-up resistor.SCL Digital Input Serial Clock Input. SCL is used together with SDA to control the transfer of data in and out of the device.ADR0Digital Input,three levels Tri-state Address Selection Input. Sets the two Least Significant Bits (A1 & A0) of the 7-bit slave address. (see Table 1)ADR1Digital Input,three levelsTri-state Address Selection Input. Sets Bits A6 & A3 of the 7-bit slave address. (see Table 1)V REFSupplyUnbufferred reference voltage. For the MSOP-8, thissupply is used as the reference. V REF must be free of noise and decoupled to GND.PAD (LLP only)GroundExposed die attach pad can be connected to ground or left floating. Soldering the pad to the PCB offers optimal thermal performance and enhances package self-alignment during reflow.Package Pinouts Problem COL4V OUT V A GND SDA SCL ADR0ADR1V REF PAD (LLP only)TSOT 123456N/A N/A N/A LLP 654321N/A N/A 7MSOP-886543127N/ADAC081C081/ DAC081C085Absolute Maximum Ratings(Notes 1, 2)If Military/Aerospace specified devices are required,please contact the National Semiconductor Sales Office/Distributors for availability and specifications.Supply Voltage, V A−0.3V to +6.5V Voltage on any Input Pin−0.3V to +6.5VInput Current at Any Pin (Note 3)±10 mA Package Input Current (Note 3)±20 mA Power Consumption at T A = 25°C See (Note 4)ESD Susceptibility (Note 5) V A , GND, V REF , V OUT , ADR0, ADR1 pins: Human Body Model Machine ModelCharged Device Model (CDM) SDA, SCL pins:Human Body Model Machine ModelCharged Device Model (CDM) 2500V 250V 1000V 5000V 350V 1000V Junction Temperature +150°CStorage Temperature−65°C to +150°COperating Ratings (Notes 1, 2)Operating Temperature Range −40°C ≤ T A ≤ +125°CSupply Voltage, V A+2.7V to 5.5V Reference Voltage, V REFIN+1.0V to V ADigital Input Voltage (Note 7)0.0V to 5.5VOutput Load0 to 1500 pFPackage Thermal ResistancesPackage θJA 6-Lead TSOT 250°C/W 6-Lead LLP 190°C/W 8-Lead MSOP240°C/WSoldering process m ust co m ply with National Semiconductor's Reflow Temperature Profile specifications.Refer to /packaging. (Note 6)Electrical CharacteristicsValues shown in this table are design targets and are subject to change before product release.The following specifications apply for V A = +2.7V to +5.5V, V REF = V A , C L = 200 pF to GND, input code range 3 to 252. Boldface limits apply for T MIN ≤ T A ≤ T MAX and all other limits are at T A = 25°C, unless otherwise specified.SymbolParameterConditionsTypical (Note 9)Limits (Note 9)Units (Limits)STATIC PERFORMANCEResolution 8Bits (min) Monotonicity 8Bits (min)INL Integral Non-Linearity +2.2+8LSB (max)−1.5−8LSB (min)DNL Differential Non-Linearity +0.18+0.6LSB (max)−0.12−0.5LSB (min)ZE Zero Code Error I OUT = 0+1.1+10mV (max)FSE Full-Scale Error I OUT = 0−0.1−0.7%FSR (max)GE Gain ErrorAll ones Loaded to DAC register −0.2−0.7%FSR (max)ZCED Zero Code Error Drift −20µV/°C TC GEGain Error TempcoV A = 3V −0.7ppm FSR/°C V A = 5V−1.0ppm FSR/°C ANALOG OUTPUT CHARACTERISTICS (V OUT )Output Voltage Range(Note 10)DAC081C0850V REF V (min)V (max)DAC081C0810V A V (min)V (max)ZCO Zero Code Output V A = 3V, I OUT = 200 µA 1.3 mV V A = 5V, I OUT = 200 µA 7.0 mV FSO Full Scale OutputV A = 3V, I OUT = 200 µA 2.984 V V A = 5V, I OUT = 200 µA4.989 V I OSOutput Short Circuit Current (I SOURCE )V A = 3V, V OUT = 0V, Input Code = FFFh.56 mA V A = 5V, V OUT = 0V, Input Code = FFFh.69 mA 4D A C 081C 081/ D A C 081C 085Symbol Parameter Conditions Typical(Note 9)Limits(Note 9)Units(Limits)I OS Output Short Circuit Current(ISINK)VA= 3V, VOUT= 3V, Input Code = 000h.−52mAVA= 5V, VOUT= 5V, Input Code = 000h.−75mAI O Continuous OutputCurrent (Note 10)Available on the DAC output11mA (max)C L Maximum Load CapacitanceRL= ∞1500pFRL= 2kΩ1500pFZOUTDC Output Impedance7.5ΩREFERENCE INPUT CHARACTERISTICS- (DAC081C085 only)V REF Input Range Minimum0.2 1.0V (min) Input Range Maximum V A V (max) Input Impedance120kΩLOGIC INPUT CHARACTERISTICS (SCL, SDA)VIHInput High Voltage0.7 x V A V (min)VILInput Low Voltage0.3 x V A V (max)IINInput Current±1µA (max)CINInput Pin Capacitance (Note 10)3pF (max)VHYSTInput Hysteresis0.1 x V A V (min) LOGIC INPUT CHARACTERISTICS (ADR0, ADR1)VIHInput High Voltage V A- 0.5V V (min)VILInput Low Voltage0.5V (max)IINInput Current±1µA (max) LOGIC OUTPUT CHARACTERISTICS (SDA)V OL Output Low VoltageISINK= 3 mA0.4V (max)ISINK= 6 mA0.6V (max)I OZ High-Impedence OutputLeakage Current±1µA (max)DAC081C081/ DAC081C085SymbolParameterConditionsTypical (Note 9)Limits (Note 9)Units (Limits)POWER REQUIREMENTSV ASupply Voltage Minimum 2.7V (min)Supply Voltage Maximum5.5V (max)Normal -- V OUT set to midscale. 2-wire interface quiet (SCL = SDA = V A ). (output unloaded)I ST_VA-1V A DAC081C081 Supply Current V A = 2.7V to 3.6V 105156µA (max)V A = 4.5V to 5.5V 132214µA (max)I ST_VA-5V A DAC081C085 Supply Current V A = 2.7V to 3.6V 86118µA (max)V A = 4.5V to 5.5V 98152µA (max)I ST_VREF V REF Supply Current (DAC081C085 only)V A = 2.7V to 3.6V 3743µA (max)V A = 4.5V to 5.5V 5361µA (max)P STPower Consumption(V A & V REF for DAC081C085)V A = 3.0V 380µW V A = 5.0V 730µW Continuous Operation -- 2-wire interface actively addressing the DAC and writing to the DAC register. (output unloaded)I CO_VA-1V A DAC081C081 Supply Currentf SCL =400kHzV A = 2.7V to 3.6V 134220µA (max)V A = 4.5V to 5.5V 192300µA (max)f SCL =3.4MHz V A = 2.7V to 3.6V 225320µA (max)V A = 4.5V to 5.5V 374500µA (max)I CO_VA-5V A DAC081C085 Supply Currentf SCL =400kHzV A = 2.7V to 3.6V 101155µA (max)V A = 4.5V to 5.5V 142220µA (max)f SCL =3.4MHzV A = 2.7V to 3.6V 193235µA (max)V A = 4.5V to 5.5V 325410µA (max)I CO_VREFV REF Supply Current (DAC081C085 only)V A = 2.7V to 3.6V 33.555µA (max)V A = 4.5V to 5.5V 49.571.4µA (max)P COPower Consumption(V A & V REF for DAC081C085)f SCL =400kHz V A = 3.0V 480 µW V A = 5.0V 1.06 mW f SCL =3.4MHzV A = 3.0V 810 µW V A = 5.0V 2.06 mW Power Down -- 2-wire interface quiet (SCL = SDA = V A ) after PD mode written to DAC register. (output unloaded)I PD Supply Current(V A & V REF for DAC081C085)All Power Down ModesV A = 2.7V to 3.6V 0.13 1.52µA (max)V A = 4.5V to 5.5V 0.15 3.25µA (max)P PDPower Consumption(V A & V REF for DAC081C085)All Power Down ModesV A = 3.0V 0.5 µW V A = 5.0V0.9µW 6D A C 081C 081/ D A C 081C 085A.C. and Timing CharacteristicsValues shown in this table are design targets and are subject to change before product release.The following specifications apply for VA = +2.7V to +5.5V, VREF= VA, RL= Infinity, CL= 200 pF to GND. Boldface limits applyfor TMIN ≤ TA≤ TMAXand all other limits are at TA= 25°C, unless otherwise specified.Symbol Parameter Conditions (Note 13)Typical(Note 9)Limits(Notes 9,13)Units(Limits)t s Output Voltage Settling Time(Note 10)40h to C0h code changeRL= 2kΩ, CL= 200 pF3 4.5µs (max)SR Output Slew Rate1V/µs Glitch Impulse Code change from 80h to 7Fh12nV-sec Digital Feedthrough0.5nV-sec Multiplying Bandwidth(Note 12)V REF = 2.5V ± 0.1Vpp160kHzTotal Harmonic Distortion(Note 12)VREF= 2.5V ± 0.1Vppinput frequency = 10kHz70dBt WU Wake-Up TimeVA= 3V0.8µsecVA= 5V0.5µsecDIGITAL TIMING SPECS (SCL, SDA)f SCL Serial Clock FrequencyStandard ModeFast ModeHigh Speed Mode, Cb= 100pFHigh Speed Mode, Cb= 400pF1004003.41.7kHz (max)kHz (max)MHz (max)MHz (max)t LOW SCL Low TimeStandard ModeFast ModeHigh Speed Mode, Cb= 100pFHigh Speed Mode, Cb= 400pF4.71.3160320µs (min)µs (min)ns (min)ns (min)t HIGH SCL High TimeStandard ModeFast ModeHigh Speed Mode, Cb= 100pFHigh Speed Mode, Cb= 400pF4.00.660120µs (min)µs (min)ns (min)ns (min)tSU;DAT Data Setup TimeStandard ModeFast ModeHigh Speed Mode25010010ns (min)ns (min)ns (min)tHD;DAT Data Hold TimeStandard Mode3.45µs (min)µs (max)Fast Mode0.9µs (min)µs (max)High Speed Mode, Cb= 100pF70ns (min)ns (max)High Speed Mode, Cb= 400pF150ns (min)ns (max)tSU;STA Setup time for a start or a repeatedstart conditionStandard ModeFast ModeHigh Speed Mode4.70.6160µs (min)µs (min)ns (min)tHD;STA Hold time for a start or a repeated startconditionStandard ModeFast ModeHigh Speed Mode4.00.6160µs (min)µs (min)ns (min)t BUF Bus free time between a stop and startconditionStandard ModeFast Mode4.71.3µs (min)µs (min)tSU;STO Setup time for a stop conditionStandard ModeFast ModeHigh Speed Mode4.00.6160µs (min)µs (min)ns (min)DAC081C081/ DAC081C085Symbol Parameter Conditions (Note 13)Typical (Note 9)Limits (Notes 9,13)Units (Limits)t rDARise time of SDA signalStandard Mode 1000ns (max)Fast Mode20+0.1C b300ns (min)ns (max)High Speed Mode, C b = 100pF 1080ns (min)ns (max)High Speed Mode, C b = 400pF 20160ns (min)ns (max)t fDAFall time of SDA signalStandard Mode 250ns (max)Fast Mode20+0.1C b250ns (min)ns (max)High Speed Mode, C b = 100pF 1080ns (min)ns (max)High Speed Mode, C b = 400pF 20160ns (min)ns (max)t rCLRise time of SCL signalStandard Mode 1000ns (max)Fast Mode20+0.1C b300ns (min)ns (max)High Speed Mode, C b = 100pF 1040ns (min)ns (max)High Speed Mode, C b = 400pF 2080ns (min)ns (max)t rCL1Rise time of SCL signal after arepeated start condition and after an acknowledge bit.Standard Mode1000ns (max)Fast Mode20+0.1C b300ns (min)ns (max)High Speed Mode, C b = 100pF 1080ns (min)ns (max)High Speed Mode, C b = 400pF 20160ns (min)ns (max)t fCLFall time of a SCL signalStandard Mode 300ns (max)Fast Mode20+0.1C b300ns (min)ns (max)High Speed Mode, C b = 100pF 1040ns (min)ns (max)High Speed Mode, C b = 400pF2080ns (min)ns (max)C b Capacitive load for each bus line (SCLand SDA)400pF (max)t SP Pulse Width of spike suppressed (Notes 11, 10)Fast ModeHigh Speed Mode 5010ns (max)ns (max)t outzSDA output delay (see Section 1.9)Fast ModeHigh Speed Mode873827060ns (max)ns (max)Note 1:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended.Note 2:All voltages are measured with respect to GND = 0V, unless otherwise specified.Note 3:When the input voltage at any pin exceeds 5.5V or is less than GND, the current at that pin should be limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two.Note 4:The absolute maximum junction temperature (T J max) for this device is 150°C. The maximum allowable power dissipation is dictated by T J max, the junction-to-ambient thermal resistance (θJA ), and the ambient temperature (T A ), and can be calculated using the formula P D MAX = (T J max − T A ) / θJA . The values for maximum power dissipation will be reached only when the device is operated in a severe fault condition (e.g., when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).Note 5:Human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor. Machine model is a 220 pF capacitor discharged through 0 Ω. Charge device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged. 8D A C 081C 081/ D A C 081C 085Note 6:Reflow temperature profiles are different for lead-free packages.Note 7:The inputs are protected as shown below. Input voltage magnitudes up to 5.5V, regardless of V A , will not cause errors in the conversion result. For example, if V A is 3V, the digital input pins can be driven with a 5V logic device.30052304Note 8:To guarantee accuracy, it is required that V A and V REF be well bypassed.Note 9:Typical figures are at T J = 25°C, and represent most likely parametric norms. Test limits are guaranteed to National's AOQL (Average Outgoing Quality Level).Note 10:This parameter is guaranteed by design and/or characterization and is not tested in production.Note 11:Spike suppression filtering on SCL and SDA will supress spikes that are less than 50ns for standard-fast mode and less than 10ns for hs-mode.Note 12:Applies to the Multiplying DAC configuration. In this configuration, the reference is used as the analog input. The value loaded in the DAC Register will digitally attenuate the signal at Vout.Note 13:C b refers to the capacitance of one bus line. C b is expressed in pF units.Specification DefinitionsDIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB,which is V REF / 256 = V A / 256.DIGITAL FEEDTHROUGH is a measure of the energy inject-ed into the analog output of the DAC from the digital inputs when the DAC output is not updated. It is measured with a full-scale code change on the data bus.FULL-SCALE ERROR is the difference between the actual output voltage with a full scale code (FFFh) loaded into the DAC and the value of V A x 255 / 256.GAI N ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Zero and F ull-Scale Errors as GE = FSE - ZE, where GE is Gain error, FSE is Full-Scale Error and ZE is Zero Error.GLITCH IMPULSE is the energy injected into the analog out-put when the input code to the DAC register changes. It is specified as the area of the glitch in nanovolt-seconds.INTEGRAL NON-LINEARITY (INL) is a measure of the de-viation of each individual code from a straight line through the input to output transfer function. The deviation of any given code from this straight line is measured from the center of that code value. The end point method is used. INL for this product is specified over a limited range, per the Electrical Tables.LEAST SIGNIFICANT BIT (LSB) is the bit that has the small-est value or weight of all bits in a word. This value isLSB = V REF / 2nwhere V REF is the supply voltage for this product, and "n" is the DAC resolution in bits, which is 8 for the DAC081C081.MAXIMUM LOAD CAPACITANCE is the maximum capaci-tance that can be driven by the DAC with output stability maintained.MONOTONICITY is the condition of being monotonic, where the DAC has an output that never decreases when the input code increases.MOST SIGNIFICANT BIT (MSB) is the bit that has the largest value or weight of all bits in a word. Its value is 1/2 of V A .MULTIPLYING BANDWIDTH is the frequency at which the output amplitude falls 3dB below the input sine wave on V REFIN with a full-scale code loaded into the DAC.POWER EFFICIENCY is the ratio of the output current to the total supply current. The output current comes from the power supply. The difference between the supply and output cur-rents is the power consumed by the device without a load.SETTLING TIME is the time for the output to settle to within 1/2 LSB of the final value after the input code is updated.TOTAL HARMONIC DISTORTION (THD) is the measure of the harmonics present at the output of the DACs with an ideal sine wave applied to V REFIN . THD is measured in dB.WAKE-UP TIME is the time for the output to exit power-down mode. This time is measured from the rising edge of SCL during the ACK bit of the lower data byte to the time the output voltage deviates from the power-down voltage of 0V.ZERO CODE ERROR is the output error, or voltage, present at the DAC output after a code of 000h has been entered.DAC081C081/ DAC081C085Transfer Characteristic30052305FIGURE 1. Input / Output Transfer CharacteristicTiming Diagrams30052360FIGURE 2. Serial Timing Diagram 10D A C 081C 081/ D A C 081C 085Typical Performance Characteristics VREF = VA, fSCL= 3.4MHz, TA= 25°C, Input Code Range 3 to 252,unless otherwise stated.INL30052320DNL30052321INL/DNL vs Temperature at VA= 3.0V30052322INL/DNL vs Temperature at VA= 5.0V30052323INL/DNL vs VREFIN at VA= 3.0V30052324INL/DNL vs VREFINat VA= 5.0V30052325DAC081C081/ DAC081C085INL/DNL vs V A30052326Zero Code Error vs. V A30052327Zero Code Error vs. Temperature30052328Full Scale Error vs. V A30052336Full Scale Error vs. Temperature30052329Total Supply Current vs. V A30052330D A C 081C 081/ D A C 081C 085V REF Supply Current vs. V A30052331Total Supply Current vs. Temperature @ V A = 3V30052332Total Supply Current vs. Temperature @ V A = 5V300523335V Glitch Response30052334Power-On Reset30052335DAC081C081/ DAC081C0851.0 Functional Description1.1 DAC SECTIONThe DAC081C081 is fabricated on a CMOS process with an architecture that consists of switches and resistor strings that are followed by an output buffer.For simplicity, a single resistor string is shown in Figure 3.This string consists of 256 equal valued resistors with a switch at each junction of two resistors, plus a switch to ground. The code loaded into the DAC register determines which switch is closed, connecting the proper node to the amplifier. The input coding is straight binary with an ideal output voltage of:V OUT = V REF x (D / 256)where D is the decimal equivalent of the binary code that is loaded into the DAC register. D can take on any integer value between 0 and 255. This configuration guarantees that the DAC is monotonic.30052307FIGURE 3. DAC Resistor String1.2 OUTPUT AMPLIFIERThe output amplifier is rail-to-rail, providing an output voltage range of 0V to V A when the reference is V A . All amplifiers,even rail-to-rail types, exhibit a loss of linearity as the output approaches the supply rails (0V and V A , in this case). For this reason, linearity is specified over less than the full output range of the DAC. However, if the reference is less than V A ,there is only a loss in linearity in the lowest codes. The output capabilities of the amplifier are described in the Electrical Ta-bles.The output amplifiers are capable of driving a load of 2 k Ω in parallel with 1500 pF to ground or to V A . The zero-code and full-scale outputs for given load currents are available in the Electrical Characteristics Table.1.3 REFERENCE VOLTAGEThe DAC081C081 uses the supply (V A ) as the reference.With that said, V A must be treated as a reference. The Analog output will only be as clean as the reference (V A ). It is rec-ommended that the reference be driven by a voltage source with low output impedance.The DAC081C085 comes with an external reference supply pin (V REF ). For the DAC081C085, it is important that V REF be kept as clean as possible.The Applications section describes a handful of ways to drive the reference appropriately. Refer to Section 2.1 for details.D A C 081C 081/ D A C 081C 0851.4 SERIAL INTERFACEThe I2C-compatible interface operates in all three speed modes. Standard mode (100kHz) and Fast mode (400kHz) are functionally the same and will be referred to as Standard-Fast mode in this document. High-Speed mode (3.4MHz) is an extension of Standard-Fast mode and will be referred to as Hs-mode in this document. The following diagrams de-scribe the timing relationships of the clock (SCL) and data (SDA) signals. Pull-up resistors or current sources are re-quired on the SCL and SDA busses to pull them high when they are not being driven low. A logic zero is transmitted by driving the output low. A logic high is transmitted by releasing the output and allowing it to be pulled-up externally. The ap-propriate pull-up resistor values will depend upon the total bus capacitance and operating speed.1.4.1 Basic I2C ProtocolThe I2C interface is bi-directional and allows multiple devices to operate on the same bus. To facilitate this bus configura-tion, each device has a unique hardware address which is referred to as the "slave address." To communicate with a particular device on the bus, the controller (master) sends the slave address and listens for a response from the slave. This response is referred to as an acknowledge bit. If a slave on the bus is addressed correctly, it Acknowledges (ACKs) the master by driving the SDA bus low. If the address doesn't match a device's slave address, it Not-acknowledges (NACKs) the master by letting SDA be pulled high. ACKs also occur on the bus when data is being transmitted. When the master is writing data, the slave ACKs after every data byte is successfully received. When the master is reading data, the master ACKs after every data byte is received to let the slave know it wants to receive another data byte. When the master wants to stop reading, it NACKs after the last data byte and creates a Stop condition on the bus.All communication on the bus begins with either a Start con-dition or a Repeated Start condition. The protocol for starting the bus varies between Standard-Fast mode and Hs-mode. In Standard-Fast mode, the master generates a Start condi-tion by driving SDA from high to low while SCL is high. In Hs-mode, starting the bus is more complicated. Please refer to section 1.4.3 for the full details of a Hs-mode Start condition.A Repeated Start is generated to either address a different device, or switch between read and write modes. The master generates a Repeated Start condition by driving SDA low while SCL is high. Following the Repeated Start, the master sends out the slave address and a read/write bit as shown in Figure 4. The bus continues to operate in the same speed mode as before the Repeated Start condition.All communication on the bus ends with a Stop condition. In either Standard-Fast mode or Hs-Mode, a Stop condition oc-curs when SDA is pulled from low to high while SCL is high. After a Stop condition, the bus remains idle until a master generates a Start condition.Please refer to the Phillips I2C® Specification (Version 2.1 Jan, 2000) for a detailed description of the serial interface.30052311FIGURE 4. Basic Operation.1.4.2 Standard-Fast ModeIn Standard-Fast mode, the master generates a start condi-tion by driving SDA from high to low while SCL is high. The Start condition is always followed by a 7-bit slave address and a Read/Write bit. After these eight bits have been transmitted by the master, SDA is released by the master and the DAC081C081 either ACKs or NACKs the address. If the slave address matches, the DAC081C081 ACKs the master. If the address doesn't match, the DAC081C081 NACKs the master. For a write operation, the master follows the ACK by sending the upper eight data bits to the DAC081C081. Then the DAC081C081 ACKs the transfer by driving SDA low. Next, the lower eight data bits are sent by the master. The DAC081C081 then ACKs the transfer. At this point, the DAC output updates to reflect the contents of the 16-bit DAC reg-ister. Next, the master either sends another pair of data bytes, generates a Stop condition to end communication, or gener-ates a Repeated Start condition to communicate with anotherdevice on the bus.For a read operation, the DAC081C081 sends out the uppereight data bits of the DAC register. This is followed by an ACKby the master. Next, the lower eight data bits of the DAC reg-ister are sent to the master. The master then produces aNACK by letting SDA be pulled high. The NACK is followedby a master-generated Stop condition to end communicationon the bus, or a Repeated Start to communicate with anotherdevice on the bus.DAC081C081/ DAC081C085。
变频空调常用光耦
变频空调常用光耦标签：变频器空调光耦类别：变频器方案描述随着现在人们节能意识的上升，定频空调将逐渐被淘汰，变频空调则会越来越多。
对于变频空调，主要分为室内部分与室外部分，室内部分要承担控制与检测等功能，而室外要承担制冷等功能，在这些电路中光耦得到了大量的应用。
方案内容随着现在人们节能意识的上升，定频空调将逐渐被淘汰，变频空调则会越来越多。
对于变频空调，主要分为室内部分与室外部分，室内部分要承担控制与检测等功能，而室外要承担制冷等功能，在这些电路中光耦得到了大量的应用。
室内部分●开关电源在开关电路中对于电压的采样与反馈常用到晶体管输出光耦。
过零检测电路当NL间的电压小于LED导通所需的电压时，LED关闭，这时便输出一个过零信号。
若需要单向过零信号则可用普通DC输入晶体管输出光耦（常见型号TLP781，TLP785），若需要双向过零信号，便可用AC输入晶体管输出光耦（常见型号TLP620，TLP184）。
●空气清新电路电子集尘器虽然在室内，但却用高电压进行驱动，若不将其与控制端进行隔离，操作起来具有一定的危险性，因此可以用普通晶体管输出光耦(常见型号：TLP781,TLP785)将其隔离，保护用户安全。
通讯电路用户在室内操作，而室内机与室外机的通讯要通过通讯电路完成，交流电的负半周，将室内信号传输到室外，交流电的正半周，室外信号传到室内，可以看到，室内信号经单向可控硅光耦（常见型号TLP748J,TLP148J）传到室外，由晶体管光耦接受后传给CPU，室外信号也经过单向可控硅光耦传到室内，有高速光耦（常见信号TLP181，6N137）接受后传给CPU。
室外部分我们知道，空调若要工作，室外有直流风机与变频压缩机需要进行控制驱动。
室外直流风机控制电路我们可以看到此电路主要分为2部分，一为驱动电路、二为保护电路。
驱动电路：驱动电路主要由六个IGBT/MOSFET驱动光耦(常用信号HCPL3120，HCPL-316J)驱动六个MOS管。
L081资料
I TRMS =2x 300 A I TAVM =2x 190 A V RRM =800-1800 VV RSM V RRM TypeV DSM V DRM V V Version 1Version 1 900 800MCC 162-08io1MCD 162-08io113001200MCC 162-12io1MCD 162-12io115001400MCC 162-14io1MCD 162-14io117001600MCC 162-16io1MCD 162-16io119001800MCC 162-18io1MCD 162-18io1Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.IXYS reserves the right to change limits, test conditions and dimensionsFeaturesq International standard packageq Direct copper bonded Al 2O 3 -ceramic base plateq Planar passivated chips q Isolation voltage 3600 V~q UL registered, E 72873qKeyed gate/cathode twin pinsApplications q Motor control q Power converterq Heat and temperature control for industrial furnaces and chemical processesq Lighting controlqContactless switchesAdvantagesq Space and weight savings q Simple mountingqImproved temperature and power cyclingqReduced protection circuitsSymbol Test Conditions Maximum RatingsI TRMS , I FRMS T VJ = T VJM300A I TAVM , I FAVM T C = 80°C; 180° sine 190A T C = 85°C; 180° sine 181A I TSM , I FSMT VJ = 45°C;t = 10 ms (50 Hz), sine 6000A V R = 0t = 8.3 ms (60 Hz), sine 6400A T VJ = T VJM t = 10 ms (50 Hz), sine 5250A V R = 0t = 8.3 ms (60 Hz), sine 5600A òi 2dtT VJ = 45°C t = 10 ms (50 Hz), sine 180 000A 2s V R = 0t = 8.3 ms (60 Hz), sine 170 000A 2s T VJ = T VJM t = 10 ms (50 Hz), sine 137 000A 2s V R = 0t = 8.3 ms (60 Hz), sine128 000A 2s(di/dt)crT VJ = T VJM repetitive, I T = 500 A 150A/m sf =50 Hz, t P =200 m s V D = 2/3 V DRM I G = 0.5 A non repetitive, I T = 500 A 500A/m s di G /dt = 0.5 A/m s(dv/dt)cr T VJ = T VJM ;V DR = 2/3 V DRM1000V/m s R GK = ¥; method 1 (linear voltage rise)P GM T VJ = T VJM t P =30 m s 120W I T = I TAVMt P =500 m s60W P GAV 8W V RGM 10V T VJ -40...+125°C T VJM 125°C T stg -40...+125°C V ISOL 50/60 Hz, RMS t = 1 min 3000V~I ISOL £ 1 mAt = 1 s 3600V~M d Mounting torque (M6)2.25-2.75/20-25Nm/lb.in.Terminal connection torque (M6) 4.5-5.5/40-48Nm/lb.in.WeightTypical including screws125gThyristor ModulesThyristor/Diode Modules1236754MCDMCC31542元器件交易网Symbol Test ConditionsCharacteristic ValuesIRRM , I DRM T VJ = T VJM ; V R = V RRM ; V D = V DRM 10mA V T , V F I T , I F = 300 A; T VJ = 25°C1.25V V T0For power-loss calculations only (T VJ = 125°C)0.88V r T 1.15m W V GT V D = 6 V;T VJ = 25°C2.5V T VJ = -40°C 2.6V I GT V D = 6 V;T VJ = 25°C 150mA T VJ = -40°C 200mA V GD T VJ = T VJM ;V D = 2/3 V DRM0.2V I GD 10mA I L T VJ = 25°C; t P = 30 m s; V D = 6 V 300mA I G = 0.5 A; di G /dt = 0.5 A/m s I H T VJ = 25°C; V D = 6 V; R GK = ¥200mA t gd T VJ = 25°C; V D = 1/2 V DRM 2m s I G = 0.5 A; di G /dt = 0.5 A/m st q T VJ = T VJM ; I T = 300 A, t P = 200 m s; -di/dt = 10 A/m s typ.150m s V R = 100 V; dv/dt = 20 V/m s; V D = 2/3 V DRM Q S T VJ = T VJM ; I T , I F = 300 A, -di/dt = 50 A/m s 550m C I RM 235A R thJC per thyristor/diode; DC current 0.155K/W per moduleother values 0.0775K/W R thJK per thyristor/diode; DC current see Fig. 8/90.225K/W per module0.1125K/W d S Creepage distance on surface 12.7mm d A Strike distance through air9.6mm aMaximum allowable acceleration50m/s 2Optional accessories for modulesKeyed gate/cathode twin plugs with wire length = 350 mm, gate = yellow, cathode = red Type ZY 180L (L = Left for pin pair 4/5)UL 758, style 1385,Type ZY 180R (R = right for pin pair 6/7)CSA class 5851, guide 460-1-1Dimensions in mm (1 mm = 0.0394")MCC Version 1MCD Version 1Fig. 1 Gate trigger characteristicsFig. 2 Gate trigger delay timeFig. 3Surge overload currentI TSM , IFSM: Crest value, t: durationFig. 4òi2dt versus time (1-10 ms)Fig. 4a Maximum forward currentat case temperatureFig. 5Power dissipation versus on-state current and ambienttemperature (per thyristor ordiode)Fig. 6Three phase rectifier bridge:Power dissipation versus directoutput current and ambienttemperatureFig. 7Three phase AC-controller:Power dissipation versus RMS output current and ambient temperatureFig. 8Transient thermal impedancejunction to case (per thyristor or diode)Fig. 9Transient thermal impedancejunction to heatsink (per thyristor or diode)R thJC for various conduction angles d: d R thJC (K/W) DC 0.155180°0.167120°0.17660°0.19730°0.227Constants for Z thJC calculation:i R thi (K/W)t i (s)10.00720.00120.01880.0830.1290.2RthJK for various conduction angles d: d R thJK (K/W) DC 0.225180°0.237120°0.24660°0.26730°0.297Constants for Z thJK calculation:i R thi (K/W)t i (s)10.00720.00120.01880.0830.1290.240.071.0。
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IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9851501Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9851501QPA ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9851503QCAACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL081ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8TBD Call TI Call TITL081ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRG4ACTIVESOICD82500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL081CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8TBD Call TI Call TITL081ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081MFKB OBSOLETE LCCC FK 20TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8TBD Call TI Call TITL082ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDE4ACTIVESOICD875Green (RoHS &CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)TL082BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPSRG4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPW ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWE4ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8TBDCall TI Call TITL082CPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDG4ACTIVESOICD875Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL082IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK 20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeTL082MJG ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL082MJGB ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL084ACD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACN ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACNSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRG4ACTIVESOICD142500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL084BCN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084BCNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free CU NIPDAU N/A for Pkg Type 23-Apr-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)(RoHS)TL084MFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MJ ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084MJB ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084QD ACTIVE SOIC D 1450TBD CU NIPDAU Level-1-220C-UNLIM TL084QDRACTIVESOICD142500TBDCU NIPDAULevel-1-220C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight inhomogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.23-Apr-2007TAPE AND REELINFORMATION3-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL081IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082ACPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082CPWR PW 8MLA 330127.0 3.6 1.6812Q1TL082IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082IDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082IPWR PW 8MLA 330127.0 3.6 1.6812Q1TL084ACDR D 14MLA 33016 6.59.0 2.1816Q1TL084ACDR D 14FMX 3300 6.59.0 2.1816Q1TL084ACNSR NS 14MLA 330168.210.5 2.51216Q1TL084BCDR D 14FMX 3300 6.59.0 2.1816Q1TL084CDR D 14FMX 3300 6.59.0 2.1816Q1TL084CNSR NS 14MLA 330168.210.5 2.51216Q1TL084CPWR PW 14MLA 330127.0 5.6 1.6812Q1TL084IDRD14FMX3306.59.02.1816Q13-May-2007TAPE AND REEL BOX INFORMATIONDevicePackagePins Site Length (mm)Width (mm)Height (mm)TL081ACDR D 8FMX 338.1340.520.64TL081BCDR D 8FMX 338.1340.520.64TL081CDR D 8FMX 338.1340.520.64TL081CPSR PS 8MLA 333.2333.228.58TL081IDR D 8FMX 338.1340.520.64TL082ACDR D 8FMX 338.1340.520.64TL082ACDR D 8MLA 338.1340.520.64TL082ACPSR PS 8MLA 333.2333.228.58TL082BCDR D 8FMX 338.1340.520.64TL082CDR D 8FMX 338.1340.520.64TL082CDR D 8MLA 338.1340.520.64TL082CPSR PS 8MLA 333.2333.228.58TL082CPWR PW 8MLA 338.1340.520.64TL082IDR D 8FMX 338.1340.520.64TL082IDR D 8MLA 338.1340.520.64TL082IPWR PW 8MLA 338.1340.520.64TL084ACDR D 14MLA 333.2333.228.58TL084ACDR D 14FMX 333.2333.228.58TL084ACNSR NS 14MLA 333.2333.228.58TL084BCDR D 14FMX 333.2333.228.58TL084CDR D 14FMX 333.2333.228.58TL084CNSR NS 14MLA 333.2333.228.58TL084CPWR PW 14MLA 338.1340.520.64TL084IDRD14FMX333.2333.228.583-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. 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