SN54LV126AW中文资料
SN54LS256J中文资料
DUAL 4-BITADDRESSABLE LATCHThe SN54/74LS256 is a Dual 4-Bit Addressable Latch with common control inputs; these include two Address inputs (A 0, A 1), an active LOW Enable input (E) and an active LOW Clear input (CL). Each latch has a Data input (D) and four outputs (Q 0–Q 3).When the Enable (E) is HIGH and the Clear input (CL) is LOW, all outputs (Q 0–Q 3) are LOW. Dual 4-channel demultiplexing occurs when the (CL) and E are both LOW. When CL is HIGH and E is LOW, the selected output (Q 0–Q 3), determined by the Address inputs, follows D. When the E goes HIGH, the contents of the latch are stored. When operating in the addressable latch mode (E=LOW, CL=HIGH), changing more than one bit of the Address (A 0, A 1) could impose a transient wrong address. Therefore, this should be done only while in the memory mode (E=CL=HIGH).•Serial-to-Parallel Capability•Output From Each Storage Bit Available •Random (Addressable) Data Entry •Easily Expandable•Active Low Common Clear•Input Clamp Diodes Limit High Speed T ermination Effects14131211109123456716158V CC A 0CL E D b Q 3b Q 1b Q 2b Q 0b A 1D a Q 0a Q 1a Q 2a Q 3aGNDCONNECTION DIAGRAM DIP (TOP VIEW)NOTE:The Flatpak version has the same pinouts (Connection Diagram) as the Dual In-Line Package.PIN NAMES LOADING (Note a)A 0, A1Address Inputs D a , D b Data InputsE Enable Input (Active LOW)CLClear Input (Active LOW)Q 0a –Q 3a ,Q 0b –Q 3bParallel Latch Outputs (Note b)NOTES:a) 1 TTL Unit Load (U.L.) = 40 µA HIGH/1.6 mA LOW.b) The Output LOW drive factor is 2.5 U.L. for Military (54) and 5 U.L. for Commercial (74) T emperature Ranges.。
SNJ54LVTH162245WD中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9678001QXA ACTIVE CFP WD 481TBD Call TI Level-NC-NC-NC 5962-9678001VXA ACTIVE CFP WD 481TBDCall TI Level-NC-NC-NC 74LVTH162245DGGRG4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVTH162245DLRG4ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVTH162245GRDR ACTIVE LFBGA GRD 541000TBDSNPB Level-1-240C-UNLIM 74LVTH162245GRE4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVTH162245ZQLR ACTIVE VFBGA ZQL 561000Green (RoHS &no Sb/Br)SNAGCU Level-1-260C-UNLIM 74LVTH162245ZRDR ACTIVE LFBGA ZRD 541000Green (RoHS &no Sb/Br)SNAGCU Level-1-260C-UNLIM SN74LVTH162245DGGR ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245DL ACTIVE SSOP DL 4825Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245DLG4ACTIVE SSOP DL 4825Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245DLR ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245KR ACTIVE VFBGA GQL 561000TBD SNPB Level-1-240C-UNLIM SNJ54LVTH162245WDACTIVECFPWD481TBDCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in anew design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM4-Oct-2005Addendum-Page 1元器件交易网元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SNJ54LVC06AFK资料
FEATURES12345671413121110981A 1Y 2A 2Y 3A 3Y GNDV CC 6A 6Y 5A 5Y 4A 4YSN54LVC06A...J OR W PACKAGE SN74LVC06A...D, DB, DGV, NS,OR PW PACKAGE(TOP VIEW)32120199101112134567818171615146Y NC 5A NC 5Y2A NC 2Y NC 3ASN54LVC06A...FK PACKAGE(TOP VIEW)1Y 1A N C 4Y 4A6A3Y G N D N C V C C NC - No internal connectionSN74LVC06A...RGY PACKAGE(TOP VIEW)11478234561312111096A 6Y 5A 5Y 4A1Y 2A 2Y 3A 3Y1A4YV G N DC CDESCRIPTION/ORDERING INFORMATIONSN54LVC06A,SN74LVC06A HEX INVERTER BUFFERS/DRIVERSWITH OPEN-DRAIN OUTPUTSSCAS596N–OCTOBER 1997–REVISED JULY 2005•Operate From 1.65V to 3.6V •Max t pd of 3.7ns at 3.3V•Specified From –40°C to 85°C,•I off Supports Partial-Power-Down Mode –40°C to 125°C,and –55°C to 125°C Operation•Inputs and Open-Drain Outputs Accept •Latch-Up Performance Exceeds 250mA Per Voltages up to 5.5VJESD 17These hex inverter buffers/drivers are designed for 1.65-V to 3.6-V V CC operation.The outputs of the 'LVC06A devices are open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.The maximum sink current is 24mA.Inputs can be driven from either 3.3-V or 5-V devices.This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment.ORDERING INFORMATIONT APACKAGE (1)ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to 85°CQFN –RGY Reel of 1000SN74LVC06ARGYR LC06ATube of 50SN74LVC06AD SOIC –D Reel of 2500SN74LVC06ADR LVC06AReel of 250SN74LVC06ADT SOP –NSReel of 2000SN74LVC06ANSR LVC06A –40°C to 125°CSSOP –DB Reel of 2000SN74LVC06ADBR LC06A Tube of 90SN74LVC06APW TSSOP –PW Reel of 2000SN74LVC06APWR LC06A Reel of 250SN74LVC06APWT TVSOP –DGV Reel of 2000SN74LVC06ADGVR LC06ACDIP –JTube of 25SNJ54LVC06AJ SNJ54LVC06AJ –55°C to 125°CCFP –W Tube of 150SNJ54LVC06AW SNJ54LVC06AW LCCC –FKTube of 55SNJ54LVC06AFKSNJ54LVC06AFK (1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.元器件交易网DESCRIPTION/ORDERING INFORMATION (CONTINUED)AYAbsolute Maximum Ratings (1)SN54LVC06A,SN74LVC06AHEX INVERTER BUFFERS/DRIVERSWITH OPEN-DRAIN OUTPUTSSCAS596N–OCTOBER 1997–REVISED JULY 2005These devices are fully specified for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.FUNCTION TABLE (EACH INVERTER)INPUT OUTPUTA YH L LHLOGIC DIAGRAM,EACH INVERTER (POSITIVE LOGIC)over operating free-air temperature range (unless otherwise noted)MINMAX UNIT V CC Supply voltage range –0.5 6.5V V I Input voltage range (2)–0.5 6.5V V O Output voltage range –0.56.5V I IK Input clamp current V I <0–50mA I OK Output clamp current V O <0–50mA I OContinuous output current±50mA Continuous current through V CC or GND±100mAD package (3)86DB package (3)96DGV package (3)127θJAPackage thermal impedance°C/W NS package (3)76PW package (3)113RGY package (4)47T stg Storage temperature range –65150°C P tot Power dissipation (5)(6)T A =–40°C to 125°C500mW (1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3)The package thermal impedance is calculated in accordance with JESD 51-7.(4)The package thermal impedance is calculated in accordance with JESD 51-5.(5)For the D package:above 70°C the value of P tot derates linearly with 8mW/K.(6)For the DB,DGV,NS,and PW packages:above 60°C the value of P tot derates linearly with 5.5mW/K.元器件交易网Recommended Operating Conditions(1) Recommended Operating Conditions(1)SN54LVC06A,SN74LVC06A HEX INVERTER BUFFERS/DRIVERSWITH OPEN-DRAIN OUTPUTSSCAS596N–OCTOBER1997–REVISED JULY2005SN54LVC06A(2)–55°C to125°C UNITMIN MAX Operating 1.65 3.6V CC Supply voltage VData retention only 1.5V CC=1.65V to1.95V0.65×V CC V IH High-level input voltage V CC=2.3V to2.7V 1.7VV CC=2.7V to3.6V2V CC=1.65V to1.95V0.35×V CC V IL Low-level input voltage V CC=2.3V to2.7V0.7VV CC=2.7V to3.6V0.8 V I Input voltage0 5.5V V O Output voltage0 5.5VV CC=1.65V4V CC=2.3V8I OL Low-level output current mAV CC=2.7V12V CC=3V24(1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs,literature number SCBA004.(2)Product previewSN74LVC06AT A=25°C–40°C to85°C–40°C to125°C UNITMIN MAX MIN MAX MIN MAXOperating 1.65 3.6 1.65 3.6 1.65 3.6 V CC Supply voltage VData retention only 1.5 1.5 1.5V CC=1.65V to1.95V0.65×V CC0.65×V CC0.65×V CCHigh-levelV IH V CC=2.3V to2.7V 1.7 1.7 1.7V input voltageV CC=2.7V to3.6V222V CC=1.65V to1.95V0.35×V CC0.35×V CC0.35×V CC Low-levelV IL V CC=2.3V to2.7V0.70.70.7V input voltageV CC=2.7V to3.6V0.80.80.8 V I Input voltage0 5.50 5.50 5.5V V O Output voltage0 5.50 5.50 5.5VV CC=1.65V444V CC=2.3V888 Low-levelI OL mAoutput current VCC=2.7V121212V CC=3V242424(1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs,literature number SCBA004.元器件交易网Electrical CharacteristicsElectrical CharacteristicsSwitching CharacteristicsSN54LVC06A,SN74LVC06AHEX INVERTER BUFFERS/DRIVERSWITH OPEN-DRAIN OUTPUTSSCAS596N–OCTOBER 1997–REVISED JULY 2005over recommended operating free-air temperature range (unless otherwise noted)SN54LVC06A (1)PARAMETERTEST CONDITIONSV CC–55°C to 125°C UNITMIN TYP (2)MAXI OL =100µA 1.65V to 3.6V0.2I OL =4mA1.65V 0.45V OLI OL =8mA 2.3V 0.7V I OL =12mA 2.7V 0.4I OL =24mA3V 0.55I I V I =5.5V or GND 3.6V ±5µA I CC V I =V CC or GND,I O =03.6V 10µA ∆I CC One input at V CC –0.6V,Other inputs at V CC or GND 2.7V to 3.6V500µA C iV I =V CC or GND3.3V5pF (1)Product preview (2)T A =25°Cover recommended operating free-air temperature range (unless otherwise noted)SN74LVC06APARAMETERTEST CONDITIONSV CCT A =25°C –40°C to 85°C –40°C to 125°C UNITMINTYPMAX MINMAX MINMAX I OL =100µA 1.65V to 3.6V0.10.20.3I OL =4mA1.65V 0.240.450.6V OLI OL =8mA 2.3V 0.30.70.75V I OL =12mA 2.7V 0.40.40.6I OL =24mA3V 0.550.550.8I I V I =5.5V or GND 3.6V ±1±5±20µA I off V I or V O =5.5V 0±1±10±20µA I CC V I =V CC or GND,I O =0 3.6V 11040µA One input at V CC –0.6V,∆I CC 2.7V to 3.6V5005005000µA Other inputs at V CC or GND C iV I =V CC or GND3.3V5pF over recommended operating free-air temperature range (unless otherwise noted)(see Figure 1)SN54LVC06A (1)FROM TO PARAMETERV CC–55°C to 125°CUNIT(INPUT)(OUTPUT)MIN MAX 1.8V ±0.15V1.4 5.62.5V ±0.2V13.1t pdAYns 2.7V 3.93.3V ±0.3V1 3.7(1)Product preview元器件交易网Switching Characteristics Operating CharacteristicsSN54LVC06A,SN74LVC06A HEX INVERTER BUFFERS/DRIVERS WITH OPEN-DRAIN OUTPUTS SCAS596N–OCTOBER1997–REVISED JULY2005over recommended operating free-air temperature range(unless otherwise noted)(see Figure1)SN74LVC06AFROM TOPARAMETER V CC T A=25°C–40°C to85°C–40°C to125°C UNIT (INPUT)(OUTPUT)MIN TYP MAX MIN MAX MIN MAX1.8V±0.15V 1.43 5.1 1.4 5.6 1.47.62.5V±0.2V1 1.9 2.813.114t pd A Y ns2.7V1 2.43.71 3.9153.3V±0.3V1 2.2 3.51 3.715TA=25°CTESTPARAMETER V CC TYP UNITCONDITIONS1.8V2.1C pd Power dissipation capacitance per buffer/driver f=10MHz 2.5V 2.3pF3.3V 2.5元器件交易网PARAMETER MEASUREMENT INFORMATIONFrom Output Under TestLOAD CIRCUITOpen Data InputTiming InputV I0 VV I 0 V0 VInputVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSVOLTAGE WAVEFORMS PULSE DURATIONV OHV OHV OLV OLV I0 VInputOutput Waveform 1S1 at V LOAD (see Note B)Output Waveform 2S1 at V LOAD (see Note B)V OLV LOAD /20 V≈0 VV IVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLINGOutputOutputNOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω.D.The outputs are measured one at a time, with one transition per measurement.E.Since this device has open-drain outputs, t PLZ and t PZL are the same as t pd .F.t PZL is measured at V M .G.t PLZ is measured at V OL + V ∆.H.All parameters and waveforms are not applicable to all devices.Output ControlV I1.8 V ± 0.15 V2.5 V ± 0.2 V2.7 V3.3 V ± 0.3 V1 k Ω500 Ω500 Ω500 ΩV CC R L 2 × V CC 2 × V CC 6 V 6 VV LOAD C L 30 pF 30 pF 50 pF 50 pF0.15 V 0.15 V 0.3 V 0.3 VV ∆V CC V CC 2.7 V 2.7 VV I V CC /2V CC /21.5 V 1.5 VV M t r /t f ≤ 2 ns ≤ 2 ns ≤ 2.5 ns ≤ 2.5 nsINPUTt PZL (see Notes E and F)t PLZ (see Notes E and G)t PHZ /t PZHV LOAD V LOAD V LOADTESTS1V LOAD /2SN54LVC06A,SN74LVC06AHEX INVERTER BUFFERS/DRIVERSWITH OPEN-DRAIN OUTPUTSSCAS596N–OCTOBER 1997–REVISED JULY 2005(OPEN DRAIN)Figure 1.Load Circuit and Voltage Waveforms元器件交易网PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LVC06AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ADBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ADGVR ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ADGVRE4ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ADT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ADTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ANSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06APW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06APWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06APWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC06APWLE OBSOLETE TSSOP PW14TBD Call TI Call TISN74LVC06APWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06APWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06APWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06APWT ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06APWTE4ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06APWTG4ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC06ARGYR ACTIVE QFN RGY141000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part ina new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54LV00A中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LV00AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADBLE OBSOLETE SSOP DB14TBD Call TI Call TISN74LV00ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADBRG4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADGVR ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADGVRE4ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ANSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV00APWLE OBSOLETE TSSOP PW14TBD Call TI Call TISN74LV00APWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWT ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWTG4ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ARGYR ACTIVE QFN RGY141000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54LS123中文资料
RETRIGGERABLE MONOSTABLE MULTIVIBRATORSThese dc triggered multivibrators feature pulse width control by three meth-ods. The basic pulse width is programmed by selection of external resistance and capacitance values. The LS122 has an internal timing resistor that allows the circuits to be used with only an external capacitor. Once triggered, the ba-sic pulse width may be extended by retriggering the gated low-level-active (A)or high-level-active (B) inputs, or be reduced by use of the overriding clear.•Overriding Clear Terminates Output Pulse•Compensated for V CC and T emperature Variations•DC Triggered from Active-High or Active-Low Gated Logic Inputs •Retriggerable for Very Long Output Pulses, up to 100% Duty Cycle •Internal Timing Resistors on LS122SN54/74LS122 (TOP VIEW)(SEE NOTES 1 THRU 4)SN54/74LS123 (TOP VIEW)(SEE NOTES 1 THRU 4)NOTES:1.An external timing capacitor may be connected between C ext and R ext /C ext (positive).2.To use the internal timing resistor of the LS122, connect R int to V CC .3.For improved pulse width accuracy connect an external resistor between R ext /C ext and V CC with R int open-circuited.4.To obtain variable pulse widths, connect an external variable resistance between R int /C ext and V CC .R ext/CR ext/C ext 11ĂRext/2CLRC extNC Ċ NO INTERNAL CONNECTION.。
SN54LVCH245A中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54LS123J中文资料
PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.1POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 752657 POST OFFICE BOX 655303 • DALLAS, TEXAS 752658POST OFFICE BOX 655303 • DALLAS, TEXAS 752659 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-7603901VEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 5962-7603901VFAACTIVE CFP W 161None Call TI Level-NC-NC-NC 7603901EA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 7603901FA ACTIVE CFP W 161None Call TI Level-NC-NC-NC JM38510/01203BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401B2A ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC JM38510/31401BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401BFAACTIVE CFP W 161None Call TI Level-NC-NC-NC SN54122J OBSOLETE CDIP J 14None Call TI Call TISN54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN74122N OBSOLETE PDIP N 14None Call TI Call TISN74123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS122D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS122N3OBSOLETE PDIP N 14None Call TI Call TISN74LS122NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123D ACTIVE SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123DR ACTIVE SOIC D 162500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123J OBSOLETE CDIP J 16None Call TI Call TISN74LS123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS123NSR ACTIVE SO NS 162000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SNJ54122J OBSOLETE CDIP J 14None Call TI Call TISNJ54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54123W ACTIVE CFP W 161None Call TI Level-NC-NC-NC SNJ54LS123FK ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC SNJ54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54LS123WACTIVECFPW161NoneCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.PACKAGE OPTION ADDENDUM28-Feb-2005Addendum-Page 1元器件交易网OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.PACKAGE OPTION ADDENDUM 28-Feb-2005Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54LV14A中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54116资料
IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54123中文资料
PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.1POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 752657 POST OFFICE BOX 655303 • DALLAS, TEXAS 752658POST OFFICE BOX 655303 • DALLAS, TEXAS 752659 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-7603901VEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 5962-7603901VFAACTIVE CFP W 161None Call TI Level-NC-NC-NC 7603901EA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 7603901FA ACTIVE CFP W 161None Call TI Level-NC-NC-NC JM38510/01203BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401B2A ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC JM38510/31401BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401BFAACTIVE CFP W 161None Call TI Level-NC-NC-NC SN54122J OBSOLETE CDIP J 14None Call TI Call TISN54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN74122N OBSOLETE PDIP N 14None Call TI Call TISN74123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS122D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS122N3OBSOLETE PDIP N 14None Call TI Call TISN74LS122NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123D ACTIVE SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123DR ACTIVE SOIC D 162500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123J OBSOLETE CDIP J 16None Call TI Call TISN74LS123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS123NSR ACTIVE SO NS 162000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SNJ54122J OBSOLETE CDIP J 14None Call TI Call TISNJ54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54123W ACTIVE CFP W 161None Call TI Level-NC-NC-NC SNJ54LS123FK ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC SNJ54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54LS123WACTIVECFPW161NoneCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.PACKAGE OPTION ADDENDUM28-Feb-2005Addendum-Page 1元器件交易网OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.PACKAGE OPTION ADDENDUM 28-Feb-2005Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54LS365A资料
3-STATE HEX BUFFERS
These devices are high speed hex buffers with 3-state outputs. They are organized as single 6-bit or 2-bit / 4-bit, with inverting or non-inverting data (D) paths. The outputs are designed to drive 15 TTL Unit Loads or 60 Low Power Schottky loads when the Enable (E) is LOW. When the Output Enable (E) is HIGH, the outputs are forced to a high impedance “off” state. If the outputs of the 3-state devices are tied together, all but one device must be in the high impedance state to avoid high currents that would exceed the maximum ratings. Designers should ensure that Output Enable signals to 3-state devices whose outputs are tied together are designed so there is no overlap.
2
3
4
5
6
7
8 GND
TRUTH TABLE
INPUTS E1 L L H X E2 L L X H D L H X X L H (Z) (Z) OUTPUT L L H X
SN54HC126J中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。
中文芯片手册SN54LVTH16244
SN54LVTH16244A, SN74LVTH16244A3.3-V ABT 16-BIT BUFFERS/DRIVERSWITH 3-STATE OUTPUTS特征•德州仪器成员Widebus™系列•先进设备，在最先进的先进的BiCMOS技术（ABT）设计为3.3-V操作和低静态功耗•支持混合模式信号操作（5-V输入和输出电压3.3-V VCC）•支持非稳压电池工作电压可低至2.7 V•典型VOLP（输出地弹跳）<0.8 V在VCC = 3.3 V，TA = 25°C•的Ioff和上电三态支持热插入•在数据输入总线保持消除了需要外部上拉/下拉电阻•闭锁性能每JESD17超过500 mA•ESD保护超过JESD22- 2000-V人体模型（A114-A）- 200-V机型号（A115-A）描述/订购信息在‘LVTH16244A设备是16位缓冲器和专为低电压（3.3 V ）的VCC操作线路驱动器，且有能力提供一个TTL接口，一个5-V系统环境。
这些设备可被用作四个4位缓冲器，两个8位缓冲器，或一个16位缓冲器。
这些器件提供了真正的输出和对称低电平有效输出使能（OE）投入。
有源总线保持电路持有未使用或无驱动输入一个有效的逻辑状态。
不推荐使用上拉或下拉电阻与总线保持电路。
当VCC之间0和1.5 V ，在开机或关机时候，该设备是在高阻抗状态。
而且为了确保上述1.5 V高阻抗状态，OE应通过上拉电阻连接到VCC;电阻器的最低值是由驱动器的电流吸收能力来确定。
这些设备使用的Ioff和上电三态热插入应用程序完全指定。
该的Ioff电路禁止输出，防止损坏电流回流通过设备时，他们断电。
上电三态电路使输出在高阻抗状态在上电和断电，防止驱动器冲突。
SN65LV1023A中文资料
ones and six zeros switching at the input clock rate. The transmission of SYNC patterns enables the deserializer to lock to the serializer signal within a deterministic time frame. This transmission of SYNC patterns is selected via the SYNC1 and SYNC2 inputs on the serializer. Upon receiving valid SYNC1 or SYNC2 pulse (wider than 6 clock cycles), 1026 cycles of SYNC pattern are sent.
Output Latch
TCLK (10 MHz to
66 MHz)
Timing / PLL
Control
DEN
Timing / PLL
Control
REFCLK REN LOCK
SYNC1 SYNC2
Clock Recovery
RCLK_R/F
RCLK (10 MHz to 66 MHz)
functional description
17
ROUT7
16
ROUT8
15
ROUT9
description
SN54ALS136中文资料
元器件交易网SN54ALS136, SN54AS136, SN74ALS136, SN74AS136QUADRUPLE 2-INPUT EXCLUSIVE-OR GATESWITH OPEN-COLLECTOR OUTPUTSUNITUNITV OLVTEST CONDITIONS PARAMETER PARAMETER UNITnsns YY SN54ALS136, SN74ALS136QUADRUPLE 2-INPUT EXCLUSIVE-OR GATESWITH OPEN-COLLECTOR OUTPUTSSDAS162 – MARCH 1984–REVISED OCTOBER 1988元器件交易网UNITUNITTEST CONDITIONS PARAMETER PARAMETER UNITnsns YY SN54AS136, SN74AS136QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES WITH OPEN-COLLECTOR OUTPUTS元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SNJ54LV4040AFK中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LV4040AD ACTIVESOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADBR ACTIVE SSOP DB 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADBRE4ACTIVE SSOP DB 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADGVR ACTIVE TVSOP DGV 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADGVRE4ACTIVE TVSOP DGV 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040AN ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LV4040ANE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LV4040ANSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ANSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APW ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWE4ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWR ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWRE4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWRG4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWT ACTIVE TSSOP PW 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWTE4ACTIVE TSSOP PW 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ARGYR ACTIVE QFN RGY 161000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LV4040ARGYRG4ACTIVEQFNRGY161000Green (RoHS &no Sb/Br)CU NIPDAULevel-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.6-Dec-2006NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.6-Dec-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。
SN54ABT126中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74ABT126D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126DBLE OBSOLETE SSOP DB14TBD Call TI Call TISN74ABT126DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74ABT126NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74ABT126NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126PW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126PWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT126PWLE OBSOLETE TSSOP PW14TBD Call TI Call TISN74ABT126PWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126PWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126RGYR ACTIVE QFN RGY141000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
MSM54V32126A中文资料
(Ta = 0°C to 70°C)
Max.
Unit
3.6
V
0
V
3.6
V
0.3
V
Typ. — —
(VCC = 3.3 V ±0.3 V, Ta = 25°C, f = 1 MHz)
Max.
Unit
7
pF
7
pF
4/26
元器件交易网
¡ Semiconductor
MSM54V32126A
tHPC = Min.
— 150 — 140 — 135 mA 1, 2, 4
Average Power
Supply Current (CAS before RAS Refresh)
ICC5
RAS = cycling, CAS before RAS
— 140 — 130 — 110 mA 1, 2, 4
Parameter Input Capacitance Input / Output Capacitance
Symbol CIN CIO
Rating
Unit
–0.5 to 4.5
V
50
mA
1
W
0 to 70
°C
–55 to 150
°C
Min. 3.0 0 3.0 –0.3
Typ. 3.3 0 — —
Note:
Pin Name
A0 - A8 DQ0 - DQ31
RAS CAS1 - CAS4
WE OE
VCC VSS NC
Function Address Input Data Input / Data Output Row Address Strobe Column Address Strobe Write Enable Output Enable Power Supply (3.3 V) Ground (0 V) No Connection
74LV4066A中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LV4066AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066ADBRG4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066ADGVR ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066ADGVRE4ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066AN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74LV4066ANE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74LV4066ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066ANSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066APW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066APWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066APWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066APWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066APWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066APWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066APWT ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066APWTE4ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066APWTG4ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV4066ARGYR ACTIVE QFN RGY141000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LV4066ARGYRG4ACTIVE QFN RGY141000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and todiscontinue any product or service without notice. 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