PHAK - ERRATA Sheet

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蛋白纯化AKTA操作说明

蛋白纯化AKTA操作说明

AKTA pure操作说明分子筛层析操作步骤:1. 开机:打开AKTA pure开关,看指示灯,泵同步(泵内有注入液体的声音)。

2. 打开系统:打开电脑:双击Unicorn 7.0打开系统,进入log on 界面,用户名默认为Default,输入密码:default,点ok键,出现提示对话框,继续点确定,进入系统。

注意:进入系统时会弹出三个界面:System Control界面,Evaluation界面和Administration界面。

其中system Control界面为主操作窗口,所有的设置选项都是在该界面下完成:Manual---Execute Manual instructions---......;Evaluation界面为结果数据查看及处理窗口;Administration界面为Unicorn 7.0系统设置界面。

3. 洗泵:把A1泵头从20%乙醇中取出,用去离子水冲洗,放入分子筛缓冲液中,在SystemControl界面下,点击manual---Execute Manual instructions---Pumps---Pump A wash---点开inlet,选择A1---Excuse。

4. 设置系统参数:设柱压:Alams---alam systerm pressure---high alam---设置柱压---Execute;设流速:Pumps---System flow ---设置system flow(1mL/min)---Execute。

注意:流速和柱压设置参照“GE蛋白纯化柱表”,不要超出最高限制。

5. 装柱子(先上后下):接柱子的上面:拧下连接进样阀和检测器之间的线,等进样阀出口有液体流出时,拧开柱上面线头的螺帽,将它连到进样阀出口;接柱子的下面:去掉柱下端连接的注射器,连上接头,连上一段线,待液体滴出滴出液体滴到检测器上的连接口的洞里,滴满,将接头连到检测器的连接口里。

Kinetix 5500伺服驱动器用户手册说明书

Kinetix 5500伺服驱动器用户手册说明书

Kinetix 5500 伺服驱动器产品目录号 2198-H003-ERS、2198-H008-ERS、2198-H015-ERS、2198-H025-ERS、2198-H040-ERS、2198-H070-ERS、2198-H003-ERS2、2198-H008-ERS2、2198-H015-ERS2、2198-H025-ERS2、2198-H040-ERS2、2198-H070-ERS2、2198-CAPMOD-1300本手册链接到 Kinetix 5500 Servo Drive Fault Codes Reference Data (出版号: 2198-RD005),以供故障代码查询。

可下载电子表格,以便离线访问。

2罗克⻙尔⾃动化出版物 2198-UM001L-ZH-P - 2022 年 2 月Kinetix 5500 伺服驱动器⽤⼾⼿册⽤⼾重要须知在安装、配置、操作或维护本产品之前,请阅读本文档以及“其他资源”章节所列的文档,了解关于安装、配置和操作该设备的信息。

除了所有适用的条例、法律和标准的要求之外,用⼾还必须熟悉安装和接线说明。

包括安装、调整、投⼊运⾏、使用、装配、拆卸和维护等在内操作必须由经过适当培训的⼈员根据适用的操作守则来执⾏。

如果未遵照制造商所指定的方式使用该设备,将可能导致该设备提供的保护失效。

在任何情况下,对于因使用或操作该设备造成的任何间接或连带损失,罗克⻙尔⾃动化公司概不负责。

本手册中包含的示例和图表仅用于说明。

由于任何具体安装都涉及众多变数和要求,罗克⻙尔⾃动化公司对于依据这些示例和图表所进⾏的实际应用不承担任何责任和义务。

对于因使用本手册中所述信息、电路、设备或软件而引起的专利问题,罗克⻙尔⾃动化公司不承担任何责任。

未经罗克⻙尔⾃动化公司的书⾯许可,不得复制本手册的全部或部分内容。

在整本手册中,我们在必要的地方使用了以下注释,来提醒您留意安全注意事项。

设备表⾯或内部还可能贴有以下标签,而标签上给出了具体的预防措施。

东洋纺热启动rTth(DNA)试剂盒使用说明书

东洋纺热启动rTth(DNA)试剂盒使用说明书

JAPAN CHINATOYOBO CO., LTD. TOYOBO (SHANHAI) BIOTECH CO., LTD. Tel(81)-6-6348-3888 Tel(86)-21-5879-4900www.toyobo.co.jp/e/bio F1768KHot Start rTth (DNA) KitHSTTH-301 250UStore at -20°C Contents[1] Introduction[2] Components[3] Protocol1. Standard reaction setup2. Cycling conditions[4] Example[5] Related productsCAUTIONAll reagents in this kit are intended for research purposes. Do not use for diagnosis or clinical purposes. Please observe general laboratory precautions and safety while using this kit.-TaqMan® is a registered trademark of Roche Molecular Systems, Inc.1JAPAN CHINA TOYOBO CO., LTD. TOYOBO (SHANHAI) BIOTECH CO., LTD. Tel(81)-6-6348-3888 Tel(86)-21-5879-4900www.toyobo.co.jp/e/bio ********************[1] Introduction[2] ComponentsDescriptionHot Start rTth (DNA) Kit is PCR reagent based on Tth DNA Polymerase. Tth DNA Polymerase has higher amplification efficiency than Taq DNA Polymerase, which is a general-purpose enzyme, and enables amplification from low copies of template and amplification from a crude sample containing PCR inhibitors.In addition, Tth DNA Polymerase has a 5 '- 3' exonuclease activity, so it can be used for real-time PCR using probe assays such as TaqMan ® assay. This enzyme contains neutralizing antibodies, thus allowing for Hot start PCR.Features-Excellent DNA Amplification EfficiencyThe reaction composition is optimized based on Tth DNA Polymerase, enabling efficient PCR even from low copies of template.- Tolerant of PCR InhibitorsThis kit is effective for amplification from crude samples (e.g., biological samples, foodstuffs, soil extract, etc.). In the case of amplification from whole blood, sufficient amplification can be achieved by adding it directly to the reaction solution without purification of nucleic acid.- Utilization of dUTPThis kit contains dUTP instead of dTTP in 2x Buffer for rTth/ TTx (DNA). Therefore, the rate of false-positive detection can be reduced by adding uracil-N-glycosylase (UNG).*UNG is not supplied with this kit.This kit includes the following components for 250 reactions, 20 μL total reaction volume. All reagents should be stored at -20°C.2x Buffer for rTth/ TTx (DNA) 1.25 mLx 2 Hot Start rTth DNA Polymerase (4U/ μL) 62.5 μLNote:-2× Reaction Buffer contains essential components for the reaction (buffer, salts, Mg 2+, dATP, dCTP, dGTP, and dUTP, etc.). Add template DNA, primers, and attached Hot Start rTth DNA Polymerase, and adjust to 1x concentration with sterile water etc.-DNA Polymerase is a mixture of rTth DNA polymerase and hot start antibodies. Its concentration is 4U/ μL.-This kit doesn’t contain a passive reference dye (ROX). When using a passive reference dye to compensate fluorescence intensity and dispensing error between wells, please use the separately sold 50x ROX reference dye (Code No. ROX-101).2JAPAN CHINA TOYOBO CO., LTD. TOYOBO (SHANHAI) BIOTECH CO., LTD. Tel(81)-6-6348-3888 Tel(86)-21-5879-4900www.toyobo.co.jp/e/bio ********************[3] Protocol1. Standard reaction setupBefore preparing the mixture, all components should be completely thawed, except for the enzyme solution.Notes:-The recommended amount of primer should be 0.2-0.6 μM, and the amount of TaqMan ® probe should be 0.05-0.3 μM. If amplification efficiency is not good, performance may be improved by increasing the addition amount, but if it is added too much, it may cause non-specific reaction and detection sensitivity may be lowered.2. Cycling conditionsThe following cycle is recommended.Notes :[Optional] The uracil-N-glycosylase (UNG) treatment step should be added before predenature step. The indicated temperature and time are typical conditions for UNG. The conditions can be optimized according to the particular instruction manual from the supplier of UNG.- If sensitivity is not good, it may be improved by changing annealing/ extension temperature between 55 ~ 65°C.Components Volume Final Concentration PCR grade waterX µL 2x Buffer for rTth/ TTx (DNA) 10 µL 1x 10 µM Primer #1 0.6 µL 0.3 µM 10 µΜ Primer #20.6 µL 0.3 µM TaqMan ® Probe(10 μM)0.4 µL 0.2 µM Hot Start rTth DNA Polymerase 0.25 µL 1U Template DNA (Sample) Y µL Total reaction volume20 µLTemperature Time Predenature : 95°C 1 min. Denature :95°C 15 sec. Annealing/extension :60°C30 sec.40~50 cycles3JAPAN CHINA TOYOBO CO., LTD. TOYOBO (SHANHAI) BIOTECH CO., LTD. Tel(81)-6-6348-3888 Tel(86)-21-5879-4900www.toyobo.co.jp/e/bio ********************[4] Example[5] Related productsDetection of SNPsSNPs in aldehyde dehydrogenase 2 (ALDH2) gene were detected using TaqMan ® probes. 1 μLof whole blood was added to 20 μLreaction mixture as template. As a result, Taq DNA Polymerase-based reagent was inhibited by whole blood and amplification could not be confirmed. On the other hand, Hot Start rTth (DNA) Kit was able to determine SNPs from whole blood without purification.Product namePackageCode No. <High efficient DNA Polymerase for PCR and RT-PCR>Hot Start rTth DNA Polymerase10,000 U HSTTH-329 <Reaction Buffer (containg Mg 2+) for DNA amplification>2x Buffer for rTth/ TTx (DNA)100 mL 250 mL 1,000 mL QRZ-1B1 QRZ-1B2 QRZ-1B4 <Passive reference dye>50x ROX reference dye5 mLROX-101。

AKTA使用操作

AKTA使用操作

AKTA使用操作1先打开AKTA开关后再开电脑2打开软件UNICORN,进入到SytemControl3冲洗系统:泵(Pump)—Pumpwahbic—PumpA-选择On单击执行(E某ecute),立即执行指令,冲洗充满系统,之后会自动结束4设置报警:AlarmQmon—Alarmpreure---highalarm---在参数(Parameter)下面输入新的数值Mpa(根据柱子的信息设置5),单击执行(E某ecute),立即执行指令5设置流速:泵(Pump)--流量(Flow)—在参数(Parameter)下面输入数值(流速FlowRate),设置一个较小的流速,一般0.5mL/min。

单击执行(E某ecute),立即执行指令,单击关闭(Cloe)关闭对话框6接注:在冲洗状态运行中接柱子,先打开柱子上端,注满液体,先松松接入接头,去掉柱子下端堵头并接上接头,稍紧,待下接头有液体流出,充满接柱孔后旋紧,然后拧紧柱子上面接头。

7平衡:冲洗平衡柱子一个柱体积到基线稳定,期间可在接口2和6之间接上样品环,注射冲水洗干净,再用buffer冲洗并充满,注射器不拔,等待上样8上样:窗口进入到Flowpath—Injectionvalve—选择load,单击执行(E某ecute)。

取下注射器,用新的注射器吸取适量的样品(根据样品环的容量,注射器中不要带入气泡)从注射口缓慢的注入样品,注射器不可拔掉。

注射完成后,把load改为inject—inert,Alarm&Mon---AutozeroUV--inert,单击执行(E某ecute)开始上样,走4mL左右时,样品应已从样品环完全进入系统,把inject改为load,单击执行(E某ecute),等待出峰收样,同时摆好收样器的位置,准备接收管。

9收样:出峰时设置Frac---fractionation900---在参数(Parameter)下面输入数值,一般0.5mL—1mL,单击执行(E某ecute),结束收样时end结束,保存结果10:处理:洗脱样品结束后处理系统,先用水冲洗一个柱体积到基线稳定,暂停,换NaOH冲洗至少一个柱体积到基线稳定,再用水冲洗一个柱体积到基线稳定,测PH为7.0,暂停,换20%乙醇(Ethanol)冲洗至少一个柱体积到基线稳定,11:拆柱:先拆下面,取下后松接上堵头,旋松上面的接头,旋紧下面堵头,取下上面接头,柱子上端注满液体,接上端堵头。

高效液相色谱法测定麝香心脑乐软胶囊中丹酚酸B的含量

高效液相色谱法测定麝香心脑乐软胶囊中丹酚酸B的含量

高效液相色谱法测定麝香心脑乐软胶囊中丹酚酸B的含量李国勋(吉林省药物研究院,吉林长春 130061)【摘要】目的 建立测定麝香心脑乐软胶囊中丹酚酸B含量的方法。

方法 采用HPLC法,以C18为固定相,甲醇-乙腈-甲酸-水(30:10:1:62)为流动相,检测波长为286 nm,流速为1 ml/min。

结果 丹酚酸B 在0.3664~2.9312 µg范围内线性良好,平均回收率为99.9%,RSD=1.074%(n=6)。

结论所建方法可用于麝香心脑乐软胶囊中丹酚酸B的含量测定。

【关键词】高效液相色谱法;麝香心脑乐软胶囊;丹酚酸B【中图分类号】R917 【文献标识码】A 【文章编号】ISSN.2095-8242.2019.14.179.02麝香心脑乐软胶囊是由丹参、三七、红花、淫阳藿、葛根、冰片、麝香、郁金、人参茎叶总皂苷九味中药组成的片剂。

活血化瘀,开窍止痛。

用于冠心病,心绞痛,心肌梗塞,脑血栓等。

在原标准中并没有含量测定方法,我们选择处方中所占比例较大及在处方中起主要作用的丹参药材中丹酚酸B进行了含量测定,经多次试验,得到了比较满意的结果。

1 实验部分1.1 仪器和试药岛津LC 2010A HT高效液相色谱仪;菲罗门色谱柱(4.6mm×250mm 5µm);丹酚酸B对照品(购于中检所);麝香心脑乐软胶囊(本院制);乙腈、甲醇为色谱纯;水为重蒸馏水;其余为分析纯。

1.2 方法与结果1.2.1 色谱条件菲罗门Kromasil 5μC18 100A色谱柱(4.6 mm×250 mm 5 µm);检测波长为286 nm;柱温35℃;进样量为10 μl。

1.2.2 对照品溶液的制备精密称取丹酚酸B对照品,加甲醇制备成每毫升含0.1毫克的溶液。

1.2.3 供试品溶液的制备取本品装量差异项下的内容物并混匀,取0.4克,精密称定,置锥形瓶中(具塞),精密加入75%甲醇50毫升,密封塞子,称定重量,进行超声处理(频率25kHz)30分钟,冷却后再称定重量,用75%甲醇补足减少的重量,摇匀,过滤,取续滤液备用。

IGLOO2 M2GL050 (T, TS) 设备 Errata 表说明书

IGLOO2 M2GL050 (T, TS) 设备 Errata 表说明书

IGLOO2 M2GL050 (T , TS) Device ErrataER0200 v1.3 April 2016April 2016This Errata sheet contains information about known Errata specific to the IGLOO ®2 M2GL050 (T, TS) device family and provides available fixes and solutions.Table of ContentsRevision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1Revisions Released per Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1Errata for IGLOO2 M2GL050 (T, TS) All Temperature Grades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Summary of IGLOO2 M2GL050 (T,TS) Device Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Errata Descriptions and Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3Usage Guidelines for IGLOO2 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Revision 0 and Revision 1 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Revision 2 Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Product Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7Table 1: Revision HistoryDate Version ChangesApril 2016 1.3Added Errata item 19.January 20161.2Updated Table 4 and Table 5: AutoProgramming and 2 Step IAP use SC_SPI programming interface.January 2016 1.1Added the following:•Information about Revision 2 of the M2GL050 device •Errata item 18.•Table 5June 20151.0Combined all M2GL050 (T,TS) device Errata.Table 2: Revisions Released per DeviceSilicon Devices Revisions Device Status M2GL050 (T, TS)All Temperature GradesProduction2IGLOO2 M2GL050 (T, TS) Device Errata ER0200 v1.3 April 2016Errata for IGLOO2 M2GL050 (T, TS) All Temperature GradesTable 3 lists the specific device Errata and the affected IGLOO2 M2GL050 (T, TS) revisions of all temperature grade devices .Table 3: Summary of IGLOO2 M2GL050 (T, TS) Device ErrataErrata No.ErrataSilicon Revisions M2GL050 (T, TS)Software ErrataRev (0, 1)Rev 21.MDDR and FDDR AXI interface does not support exclusive access X X –2.Apply DEVRST_N after ISP programmingX ––3.AXI wrap transfers with more than 32 bytes in burst mode are not supported for MDDR and FDDRX X –4.The MDDR/FDDR controller must be used with sequential burst mode with BL = 8 and PHY = 32, or PHY = 16X X –5.HPMS may reset when ENC_DATA_AUTHENTICATION or DEVICE_INFO STAPL commands are sentX ––6.VPP must be set to 2.5 V when programming/writing the eNVM at Industrial temperature rangeX ––7.Over-voltage support on MSIOs during Flash*Freeze mode X ––8.Verification of the FPGA fabric at junction temperatures higher than 50°C erroneously indicates a failureX ––9.DDR_OUT and I/O-Reg functional Errata due to a software bug ––X 10.Dedicated differential I/O driving the reference clock of the CCC may cause a functional failure due to a software bug––X 11.NVM Ready bit in eNVM Status register can generate a false READY signalX ––12.Power-up Digest is not supportedX ––13.Programming of the eNVM must only occur as part of a bitstream also containing the FPGA fabric––X 14.Updating eNVM from the FPGA fabric requires changes in the NV_FREQRNG registerX X –15.SYSCTRL_RESET_STATUS macro is not supported X X –16.Zeroization is not supportedX X –17.PCIe Hot Reset support requires a soft reset solutionX X –18.The DDR I/Os in M2GL050 (T, TS)-FG896 are non-compliant with the DDR3 standardX X –19.For S (security) grade devices, user must not enable write protection for Protected 4 K Regions, also known as Special Sectors in the eNVMXX–Note:Contact Microsemi SoC technical support , if you have additional questions. To order a specific die, contact your localMicrosemi sales office.IGLOO2 M2GL050 (T, TS) Device ErrataER0200 v1.3 April 20163Errata Descriptions and Solutions1.MDDR and FDDR AXI interface does not support exclusive accessThe MDDR and FDDR AXI interface in the M2GL050 device is compliant with AMBA AXI Protocol Specification v1.0, except for the exclusive access functionality. The future version of the Errata will have an updated information about the exclusive access functionality for the AXI interface.2.Apply DEVRST_N after ISP programmingM2GL050 devices support device programming in JTAG, Slave SPI, and ISP programming modes. However, after ISP programming, DEVRST_N needs to be asserted to reset the device or power cycle the device to run the new design.3.AXI wrap transfers with more than 32 bytes in burst mode are not supported for MDDR and FDDRDo not use wrap transfers with more than 32 bytes.4.The MDDR/FDDR controller must be used with sequential burst mode with BL = 8 and PHY = 32, or PHY = 16Though the MDDR and FDDR controllers in the M2GL050 devices support various burst modes/ lengths and PHY settings (as specified in the UG0446: SmartFusion2 and IGLOO2 FPGA High Speed DDR Interfaces User Guide), only a subset of these settings are supported.Recommendation:Only use sequential burst mode with BL = 8 for PHY16, or PHY32 modes for the MDDR or FDDR.5.HPMS may reset when ENC_DATA_AUTHENTICATION or DEVICE_INFO STAPL commands are sentThe HPMS resets after executing one of the following STAPL actions:•ENC_DATA_AUTHENTICATION •DEVICE_INFOAdditionally, if any of these actions are executed while a SmartDebug session is active, HPMS resets are observed.6.VPP must be set to 2.5 V when programming/writing the eNVM at Industrial temperature rangeVPP can be set to 2.5 V or 3.3 V. However, when writing or programming the eNVM of the M2GL050 devices below 0°C, VPP must be set to 2.5 V.Refer to the DS0128: IGLOO2 FPGA and SmartFusion2 SoC FPGA Datasheet for VPP minimum and maximum settings. Note that the eNVM reading with VPP set to 3.3 V or 2.5 V operates as intended.7.Over-voltage support on MSIOs during Flash*Freeze modeWhen the input voltage is driven above the reference voltage for that bank, additional current can be consumed in Flash*Freeze mode.4IGLOO2 M2GL050 (T, TS) Device Errata ER0200 v1.3 April 20168.Verification of the FPGA fabric at junction temperatures higher than 50°C erroneously indicates a failureStandalone verification (STAPL VERIFY action) must run at temperatures lower than 50°C. If aVERIFY action is run at temperatures higher than 50°C, a false verify failure may be reported. Note that the Check Digest system services can be used to confirm design integrity at temperatures within the recommended operation conditions.9.DDR_OUT and I/O-Reg functional Errata due to a software bugThis Errata is applicable only if you have created or updated the design using Libero ® SoC v11.1 SP1 or v11.1 SP2.The corresponding I/O does not function properly in the silicon due to the wrong software implementation of the I/O macro, if you have one of the following in the design:•If you use DDR_OUT macro in the design•If you combine an output or output enable register with an I/O using the PDC command set_io<portName> -register yesSolution:Both Errata are fixed in Libero SoC v11.1 SP3. Migrate the design to Libero SoC v11.1 SP3 or a newer version, and re-run Compile and Layout.10.Dedicated differential I/O driving the reference clock of the CCC may cause afunctional failure due to a software bugIf the design has a dedicated differential I/O pair driving the reference clock of the CCC, the input clock may not propagate to CCC due to a software bug and the device fails during silicon testing. There are several options to drive the ref clock of the CCC. One of the options is to drive from"Dedicated Input PAD x" (x = 0 to 3); this uses hardwired routing. In this option, choose single-ended I/O or differential I/O as the ref clock. This Errata exists when you choose the differential I/O option (dedicated differential I/O is used as CCC reference clock input).This Errata cannot be detected in any functional simulation, and can only be detected in silicon testing.Solution:The Errata is fixed in the Libero SoC 11.1 SP3. Migrate the design to Libero SoC 11.1 SP3 or newer version, and re-run Compile and Layout.11.NVM Ready bit in eNVM Status register can generate a false READY signalIf you send an instruction to the eNVM controller and then start polling the READY signal (bit0 of the eNVM Status register) to check when the eNVM controller is ready for the next function, the first assertion of the READY signal occurs when the eNVM controller is not yet ready, resulting in the generation of a false READY signal. However, the immediate next assertion of the READY signal correctly indicates that the eNVM controller is ready.Workaround:Add an extra eNVM Status bit read that polls/reads the eNVM Status bit twice as READY .12.Power-up Digest is not supportedWorkaround:Use NVM Data Integrity Check System service after the device is switched ON, and check the data integrity.IGLOO2 M2GL050 (T, TS) Device ErrataER0200 v1.3 April 2016513.Programming of the eNVM must only occur as part of a bitstream alsocontaining the FPGA fabricThe Bitstream Configuration Dialog Box in the Libero SoC allows the user to program eNVM and the FPGA fabric separately. However, for the current production of IGLOO2 FPGAs, the user needs to program the eNVM along with the FPGA fabric. The fabric can be programmed separately if needed.Solution:The Errata is fixed in the Libero SoC 11.1 SP3. Migrate the design to the Libero SoC 11.1 SP3 or newer version, and re-run Compile and Layout.14.Updating eNVM from the FPGA fabric requires changes in the NV_FREQRNGregisterWhen updating the eNVM from the FPGA fabric, NV_FREQRNG register must be changed from 0x07(default) to 0x0F, eNVM reads are not affected.15.SYSCTRL_RESET_STATUS macro is not supported 16.Zeroization is not supported17.PCIe Hot Reset support requires a soft reset solutionOn the IGLOO2 devices, a PCIe ® Hot Reset requires a soft FPGA logic reset scheme which clears the sticky bits of the PCI configuration space.Workaround:The application note AC437: Implementing PCIe Reset Sequence in SmartFusion2 and IGLOO2 Devices describes the PCIe Hot Reset reset scheme. However, this reset scheme causes PCIe violations in some cases.•At Gen1 rates, there are no violations.•At Gen2 rates, there are two PCIe CV violations.–Test case 1: TD_1_7 (Advanced Error Reporting Capability)–Test case 2: TD_1_41 (LinkCap2Control2Status2 Reg)18.The DDR I/Os in M2GL050 (T, TS)-FG896 are non-compliant with the DDR3standardThe DDR controller in the M2GL050-FG896 device is non-compliant with the DDR3 standard. Contact SoC tech support for additional information.19.For S (security) grade devices, user must not enable write protection forProtected 4 K Regions, also known as Special Sectors in the eNVMFor S (security) devices, there are two or four 4 KB regions per eNVM array that can be protected for read and write, these regions are known as Protected 4 K Regions or Special Sectors. If writeprotection is enabled for any of these regions, none of the locked pages inside the same eNVM block can be unlocked.6IGLOO2 M2GL050 (T, TS) Device Errata ER0200 v1.3 April 2016Usage Guidelines for IGLOO2 DevicesMicrosemi recommends the following conditions for the IGLOO2 device usage.1. Programming SupportThere may be package dependencies that may not expose certain programming interfaces. Refer to the DS0124: IGLOO2 Pin Descriptions Datasheet for device/package specific features.2. SHA-256 System ServiceMicrosemi recommends the message required to be on byte boundary when using SHA-256 System Service for the IGLOO2 devices.3. Accessing the PCIe Bridge Register in High-speed Serial InterfaceThe PCIe Bridge registers must not be accessed before the PHY is ready. Wait for the PHY_READY signal (which indicates when PHY is ready) to be asserted before updating the PCIe Bridge registers.The PHY_READY signal is normally asserted within 200 μs after the device is powered up. Wait for 200 μs before accessing the PCIe Bridge registers.Table 4: Revision 0 and Revision 1 DevicesProgramming Mode JTAG SPI Slave AutoProgramming Auto Update2 Step IAP Programming RecoveryProgramming Interface JTAG SC_SPI SC_SPI SPI_0SC_SPI SPI_0M2GL050 (T,TS)YesYesNoNoNoNoTable 5: Revision 2 DeviceProgramming Mode JTAG SPI Slave AutoProgramming Auto Update2 Step IAP Programming RecoveryProgramming Interface JTAG SC_SPI SC_SPI SPI_0SC_SPI SPI_0M2GL050 (T,TS)YesYesYesNoYesNoIGLOO2 M2GL050 (T, TS) Device ErrataER0200 v1.3 April 20167Product SupportMicrosemi SoC Products Group backs its products with various support services, including Customer Service, Customer Technical Support Center, a website, electronic mail, and worldwide sales offices. This appendix contains information about contacting Microsemi SoC Products Group and using these support services.Customer ServiceContact Customer Service for non-technical product support, such as product pricing, product upgrades, update information, order status, and authorization.From North America, call 800.262.1060From the rest of the world, call 650.318.4460Fax, from anywhere in the world 650. 318.8044Customer Technical Support CenterMicrosemi SoC Products Group staffs its Customer Technical Support Center with highly skilled engineers who can help answer your hardware, software, and design questions about Microsemi SoC Products. The Customer Technical Support Center spends a great deal of time creatingapplication notes, answers to common design cycle questions, documentation of known Errata and various FAQs. So, before you contact us, please visit our online resources. It is very likely we have already answered your questions.Technical SupportFor Microsemi SoC Products Support, visit/products/fpga-soc/design-support/fpga-soc-supportWebsiteYou can browse a variety of technical and non-technical information on the SoC home page , at /products/fpga-soc/fpga-and-soc .Contacting the Customer Technical Support CenterHighly skilled engineers staff the Technical Support Center. The Technical Support Center can be contacted by email or through the Microsemi SoC Products Group website.EmailYou can communicate your technical questions to our email address and receive answers back by email, fax, or phone. Also, if you have design problems, you can email your design files to receive assistance. We constantly monitor the email account throughout the day. When sending your request to us, please be sure to include your full name, company name, and your contact information for efficient processing of your request.The technical support email address is **********************.My CasesMicrosemi SoC Products Group customers may submit and track technical cases online by going to My Cases .Outside the U.S.Customers needing assistance outside the US time zones can either contact technical support via email(**********************) or contact a local sales office. Visit About Us for sales office listings and corporate contacts.8IGLOO2 M2GL050 (T, TS) Device Errata ER0200 v1.3 April 2016ITAR Technical SupportFor technical support on RH and RT FPGAs that are regulated by International Traffic in ArmsRegulations (ITAR), contact us via **********************. Alternatively, within My Cases, select Yes in the ITAR drop-down list. For a complete list of ITAR-regulated Microsemi FPGAs, visit the ITAR web page.Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.Microsemi Corporate Headquarters One Enterprise, Aliso Viejo,CA 92656 USAWithin the USA : +1 (800) 713-4113 Outside the USA : +1 (949) 380-6100Sales : +1 (949) 380-6136Fax : +1 (949) 215-4996E-mail: ***************************© 2016 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks andservice marks are the property of their respective owners.Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally. Learn more at .55900200-1.3/04.16。

AKTA操作流程

AKTA操作流程

蛋白层析纯化系统FPLC:全称为快速蛋白液相色谱(Fast protein liquid chromatography)操作流程:1.打开全自动交流稳压器的电源2.打开FPLC或purifier 100的电源,系统立即进行自检3.打开电脑电源4.双击unicon4.12图标,输入用户名和密码,进入系统窗口。

ÄKTA层析软件有四个窗口:UNICORN Main Menu、Method Editor、System Control、Evaluation。

如使用程序运行,在Method Editor窗口里编方法设置各种参数(详见注意事项);如使用手工运行,在System Control窗口里设置各种参数。

5.接入层析柱。

如需低温操作,可通冷凝水6.注入样品,运行程序或手工运行7.试验结束,先用水冲洗柱子,再用20%乙醇保存柱子,然后拆除柱子,不得带入气泡。

取下后放回原位。

保存系统及层析柱8.关机:仔细检查完毕,确信用过的所有管道都已经充满20%乙醇后,退出ÄKTA层析软件各窗口,脱出UNICORN软件,关闭电脑9.关闭系统电源注意事项:技术指标注意事项:1. 报警压力参数设置:所有程序运行和手动运行中,必须首先设定报警压力(使用预装柱,编程时由软件自动设定)。

压力值参阅层析柱及填料说明书,取较小的一个最大耐受压力。

我们实验室的层析柱如XK16/70Superdex75、200、DEAE-FF等柱子的警报压力均为0.3MPa。

Sephacryl-200、Sephacryl-300的警报压力为0.2MPa。

2.紫外灯:如果只是平衡层析柱,关闭紫外灯。

FPLC通过FPLC系统主机关闭;Purifier 通过软件lamp off关闭。

一般在上样前或前15min打开紫外灯。

3.层析柱的连接:层析柱是玻璃的,一定要轻拿轻放。

层析柱特别是凝胶过滤柱不能有气泡进入,将柱子接入系统时,可在柱子一端接带有液体的注射器,用手推,将气泡排出,同时,给系统一定流速,保证没有气泡的情况下将柱子连入系统。

Vaporeta Golden Vap GX 使用手册说明书

Vaporeta Golden Vap GX 使用手册说明书

Vaporeta GoldenVap GXManual de Uso2021Características técnicasDescripción y accesoriosÍndiceVaporeta Golden Vap GXManual de usoIntroducciónPuesta en MarchaSomos Golden Vap010*******Asistencia Técnica06El generador de vapor Golden Vap es uno de los sistemas más avanzados y eficaces que existen en el mercado que le permitirá obtener excelentes resultados en limpiezas de toda índole.La fuerza del vapor de agua es suficiente paraconseguir desincrustar cualquier tipo de suciedad y potenciar el brillo de cualquier rincón por inaccesible que parezcaCon una eficacia demostrada clínicamente del 99,9% contra virus, bacterías y gérmenes , Golden Vap es también el aliado perfecto en ladesinfección gracias a la gama de accesoriosespecíficos como la Pistola de desinfección Sanix de todo tipo de espacios, tanto domésticos como profesionales.Súmate a la limpieza ecológica , respetando el medio ambiente ya que nuestro sistema nonecesita de productos químicos nocivos: Tan sólo vapor de agua.Bienvenidos a Golden VapIntroducciónVaporeta Golden Vap GX2021Caratcerísticas técnicasEstas son las prestaciones de tu máquina de vaporTensión230 VFrecuencia50 HzPotencia de caldera2000 WPotencia de plancha800WPotencia máxima total2000WCapacidad útil del deposito2,5 litrosCapacidad total del deposito4,2 litrosTemperatura máxima de caldera150 ºCTemperatura máxima plancha185 ºCInterruptor de encendido Selector de potencia Conector de accesoriosIndicador de presión de agua Potencia de vapor acumulada Tapón de seguridad Recoge cables Tapón de vaciado1.2.3.4.5.6.7.8.Panel de controlVaporeta Golden Vap GXDescripción y accesoriosEstas son las prestaciones de tu máquina de vaporDesde el año 1992, este modelo ha estado en constante evolución hasta llegar al actual modelo GX, el más avanzado y seguro.La ergonomía de su armadura externa, se ha modificado para ofrecer una mayor comodidad en su manipulación sin perder su bellezaclásica. Es moderna, robusta y segura, fabricada con materiales como el policarbonato, metales y aleaciones especiales.La caldera es de acero INOX 316 10/10 de espesor, su resistenciaeléctrica esta protegida por acero INCOLAY y su potencia de 2000W optimiza el sistema de control de temperatura. Su aislante térmico de grafito/nylon tiene propiedades únicas que lo hacen termorresistente e ignífugo, lo que permite conservar al máximo la temperatura del interior a 140ºC.Además, es totalmente respetuoso con el medio ambiente ya que no deja residuos, no es tóxico y es totalmente reciclable.La vaporeta GX incorpora tiene instalados diferentes fusibles que protegen las placas electrónicas de última generación, de manera que si se produce una subida de tensión, estas quedan protegidas y no se daña ninguno de los circuitos.Estas son las prestaciones de tu máquina de vaporEl tapón, de triple sistema, dota a nuestra máquina de la máxima seguridad ya que si se produce un exceso de presión, el tapón se bloquea, impidiendo su apertura y va liberándola poco a poco. Nuestra máquina incorpora un tapón de drenado que permite vaciar la máquina completamente, de modo que podemos eliminar los depósito de cal y suciedad. Esto nos permite, además de ofrecer unos resultados de plancha excelentes, sin restos de cal, alargar sustancialmente la vida útil de la caldera.La nueva manguera de limpieza incorpora un sistema de seguridad que junto con una segunda asa mucho mas ergonómica, hacen que todos los accesorios sean mucho mas ligeros y fáciles de utilizar, tanto en altura como en suelo.La plancha, que incorpora, es el modelo Black Iron, ligera, ergonómica y con suela súper deslizante.Además el modelo GX incorpora un recoge-cables para guardar de manera cómoda y segura el cable eléctrico.Abrir el tapón de seguridadCon una leve presióndesbloquearemos el sistema de seguridad del tapón de nuestra máquina para, posteriormente,desenroscarlo por completo.Puesta en marchaTe explicamos paso a paso como poner en marcha tu VaporetaRellena de agua tu VaporetaPara hacerlo de forma segura,utiliza el biberón suministrado con los accesorios de tu máquinaEnchufa la máquinaEs en este momento cuando debes enchufar tu vaporeta a una fuente de corriente.Enciende la máquinaPresiona los botones de encendido de tu máquina y espera unos minutos.Luz VerdeCuando el piloto verde de tumáquina se encienda significaráque ya está lista para comenzar a ser usada.Conecta la mangueraEs el momento de conectar la manguera o flexo de limpieza al conector frontal de tu máquina.Selecciona la potenciaPara ello utiliza los interruptores provistos en tu manguera de limpieza.Conecta tu accesorioConecta el accesorio que necesites a tu manguera de limpieza.Estamos listosTu vaporeta está ahora preparada para que comiences a disfrutar de las ventajas de la limpieza convapor ¡Buen trabajo010203040506070810En Golden Vap y Asistencia Técnica Lady Vap SL llevamos más de 30 añoscomprometidos con la calidad y seguiremos garantizando las reparaciones de su máquina de vapor de por vida.Confía todas tus reparaciones a un servicio técnico oficial, desde las pequeñas averías hasta el desgaste por el paso del tiempo y de su uso, Asistencia Técnica Lady Vap S.L.conseguirá la mejor solución para su máquina de vapor.Asistencia técnicaReparaciones garantizadas de por vida010203Solicita tu revisiónSolicita una revisión de tu máquina para que siempre esté a puntoSolicita presupuesto¿Tu vaporeta no funcionacorrectamente? Nuestro Servicio Técnico se encargará de valorar su reparación sin com`p romisoReparaciones garantizadasRecambios originales y la mejor atención. En Asistencia Técnica Lady Vap SL garantizamos las reparaciones de tu máquina.Los virus pueden convertirse en un problema, por suerte el VAPOR es capaz de crear un ambiente un 99,9% libre de virus, gérmenes y bacterias sin necesidad de usar productos químicos, gracias al poder el vapor de agua a alta temperatura.Protege tu hogar y a los tuyos con los mejores generadores de vapor del mercado y obtén resultados de limpieza y desinfección inmejorables.En Golden Vap llevamos más de 35 años proporcionándote las mejores soluciones de desinfección y limpieza para tu hogar y/o negocio.Gracias por confiar en el sistema de limpiezaecológico más avanzado del mercadoPaseo de la Castellana 179 1ºizquierda 28046915716700******************Somos Golden VapMás de 35 años a tu servicioEl llamado vapor seco a más de160ºC que genera cualquiera denuestras máquinas es 100%efectivo contra virus y bacteriassin necesidad de usar agentesagresivos que puedancomprometer el bienestar de losespacios tratados.Esto convierte a nuestrasvaporetas en el aliado perfectopara infinidad de sectoressensibles , desde el médico hastala hostelería pasando por elcomercio, transportes y todosaquellos en los que la presenciay tránsito de usuarios y clienteses determinante.ÁR E A S D EA P L I C A C I ÓNR E C O M E N D A D AProtege a tus clientes y usuarios con los mejores generadores de vapor del mercado y obtén resultados de limpieza y desinfección inmejorables sin necesidad de usar productos químicos y disminuyendo así el impacto medioambiental .B E A P R OSistema VIRUCIDA efectivo contra COVID19 229Ebasado en el test UNI EN ISO 16777: 2018915716700 - 645679993Paseo de la Castellana 179 - 1º izq 28046 | Madrid。

ASHCROFT

ASHCROFT

OPERATIONThe ASHCROFT ®pressure control is a precision device which features a snap action switch.Fixed deadband is available with single or dual SPDT independently adjustable switches with various electrical ratings.Adjustable deadband is available with SPDT switch with various electrical ratings.Several wettedmaterial constructions for compatibility with pressure media may be obtained.Series LP-S switches have a fixed deadband which will be within the limits noted on the nameplate.Series LP-D switches may be set to operate simultaneously or up to 85 percent of the range apart.The deadband of each switch will be within the limits noted on the nameplate.Series LP-A switches may be set to operate with any deadband within the limits shown on the nameplate.MOUNTINGThe “L ”Series ASHCROFT snap action pressure switch has a NEMA-4 enclosure which is an epoxy coated aluminum casting.T wo holes in the integral bracket are used to surface mount the control.Location of these holes is shown on the general dimension drawings.An optional pipe mounting bracket is also available.Mount on a vibration free surface or pipe in any orien-tation.When tightening control to pressure line, always use the wrench flats or hex on the pressure connection.NEVER TIGHTEN BY TWISTING THE CASE.CONDUIT CONNECTIONSOne 3⁄4NPT hole fitted with a shipping plug, and two additional knock outs are provided.The knockouts may be removed by placing a screwdriver in the slot and rapping sharply with a hammer It is recommended that T eflon tape or other sealant be used on conduit bushings or plug threads to ensure integrity of the enclosure.ELECTRICAL CONNECTIONRemove cover, held in place by two screws.On all units except one with terminal blocks – wire directly to the switch according to circuit requirements.Units with terminal blocks – wire directly to terminal blocks as required.T erminals are marked common (C), normally open (NO) and normally closed (NC).4.126.091/2NPT MALE &1/4NPT FEMALE8psi Rangesin.H 2O RangesLEFT SWITCH RIGHT SWITCH TERMINAL BLOCKSERVICE LEADS TO THESE TERMINALSSTANDARD RANGES15, 30, 60, 100, 200, 400, 600 psi *1000, 2000, 3000 psi 30˝Hg vac.-0 psiSTANDARD RANGES 30, 60, 100, 150 in.H 2O 15 in.H 2O-15 in.H 2O2.7 lbs.3.4 lbs.SETPOINT ADJUSTMENTSSetpoints are changed by means of the setpoint adjusters The LP-S single switch has one adjuster and the LP-A adjustable deadband and LP-D dual switch each have two adjusters.On switches with two adjusters, the one on the left is referred to as “A”and the right one is referred to as “B”;see illustration.Setpoints can be adjusted from 15 to 100 percent of full range on increasing pressure.SERIES LP-S SINGLE SWITCHRemove cover.For setpoint adjustment on either increasing or decreasing pressure to within ±1% of nominal range, mount the switch on a calibration stand and use a suitable reference such as an ASHCROFT ®Duragauge or test gauge.Monitor switch with a light or meter.Pressurize the system to the required set-point pressure.If setpoint is on increasing pressure, turn adjuster so that switch operates (if common – normally closed circuit is being monitored light goes off).If setpoint is on decreasing pressure, turn adjuster so that switch resets (if common – normally closed circuit is being monitored light comes on).When the setpoint has been achieved, raise and lower the pressure to ensure that the setpoint is correct.The deadband (difference between the operate and resetpressures) may be verified at this time to be between the values noted on the nameplate label.SERIES LP-D DUAL SWITCHRemove cover.For setpoint adjustment on either increasing or decreasing pressure to within ±1% of nominal range, mount the switch on a calibration stand and use a suitable reference such as an ASHCROFT ®Duragauge or test gauge.Monitor switch with a light or meter.Pressurize the system to the required higher setpoint pressure and turn adjuster “B”until the switch operates or resets as required.See discussion of increasing or decreasing pressure setpoints and deadband verification under Series LP-S Single Switch.When the setpoint has been achieved, raise and lower the pressure to ensure that the setpoint is correct.Then reduce system pressure to the required lower setpoint pressure and turn adjuster “A”until the switch operates or resets as required.Verify this setpoint by raising and lowering pressure.Now increase system pressure to higher setpoint and make final adjustment on “B.”AB02040600204060SERIES LP-A ADJUSTABLE DEADBAND SWITCHRemove cover.Adjuster “B”controls the operating point of the switch on increasing pressure.Adjuster “A”controls the re-setpoint of the switch on decreasing pressure.For accurate setpoint adjustment, mount the switch on a calibration stand and use a suitable reference such as an ASHCROFT ®Duragauge or test gauge.Monitor switch with a light or meter.Pressurize the system to the required setpoint pressure.T urn adjuster “B”until switch operates.Then lower pressure to the re-setpoint, turn adjuster “A”until the switch resets.Now increase pressure to the operating point and make final adjustment on “B”.Raise and lower pressure to ensure that the setpoint and re-setpoint are correct.SOME PRECAUTIONS TO OBSERVEDo not loosen the screws holding the precision switch element(s)or mounting bracket in place.Nameplate PROOF pressure should not be exceeded.Inter-mittent operation up to proof pressure is permissible, however,some change of setpoint may be noted.Operation and correct setpoint actuation should be routinely tested.Note –Since vacuum models are already above setpoint atatmosphere, the Normally Open (NO) circuit will be closed as received.。

LORD 810产品安全数据表说明书

LORD 810产品安全数据表说明书

USA SAFETY DATA SHEET1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATIONProduct name:LORD 810Product Use/Class: Acrylic Adhesive, Part 1 of 2LORD Corporation111 LORD DriveCary, NC 27511-7923 USATelephone: 814 868-3180Non-Transportation Emergency: 814 763-2345Chemtrec 24 Hr Transportation Emergency No.800 424-9300 (Outside Continental U.S. 703 527-3887)EFFECTIVE DATE: 04/21/20212. HAZARDS IDENTIFICATIONGHS CLASSIFICATION:Flammable liquids Category 2Skin corrosion/irritation Category 2Serious eye damage/eye irritation Category 1Skin sensitization Category 1Respiratory sensitization Category 1Reproductive toxicity Category 2Specific target organ systemic toxicity (single exposure) Category 1 Respiratory systemSpecific target organ systemic toxicity (single exposure) Category 3Specific target organ systemic toxicity (repeated exposure) Category 1 Respiratory system, Nervous system Hazardous to the aquatic environment - acute hazard Category 3Hazardous to the aquatic environment - chronic hazard Category 3GHS LABEL ELEMENTS:Symbol(s)Signal WordD ANGERHazard StatementsHighly flammable liquid and vapor.Causes skin irritation.Causes serious eye damage.May cause an allergic skin reaction.May cause allergy or asthma symptoms or breathing difficulties if inhaled.Suspected of damaging fertility or the unborn child.Causes damage to organs.(Respiratory system)May cause respiratory irritation.May cause drowsiness or dizziness.Causes damage to organs through prolonged or repeated exposure.(Respiratory system, Nervous system)Harmful to aquatic life.Harmful to aquatic life with long lasting effects.Precautionary StatementsPrevention300001008235Keep away from heat/sparks/open flames/hot surfaces. - No smoking.Ground/Bond container and receiving equipment.Use explosion-proof electrical/ventilating/lighting equipment.Use only non-sparking tools.Take precautionary measures against static discharge.Obtain special instructions before use.Do not handle until all safety precautions have been read and understood.Wear protective gloves/protective clothing/eye protection/face protection.Use personal protective equipment as required.In case of inadequate ventilation wear respiratory protection.Do not breathe dust/fume/gas/mist/vapors/spray.Wash thoroughly after handling.Do not eat, drink or smoke when using this product.Use only outdoors or in a well-ventilated area.Contaminated work clothing should not be allowed out of the workplace.Avoid release to the environment.ResponseIn case of fire: refer to section 5 of SDS for extinguishing media.Immediately call a POISON CENTER or doctor/physician.Specific treatment (see supplemental first aid instructions on this label).IF INHALED: Remove to fresh air and keep at rest in a position comfortable for breathing.IF ON SKIN (or hair): Remove/Take off immediately all contaminated clothing. Rinse skin with water/shower.IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do.Continue rinsing.StorageStore in a well-ventilated place. Keep cool.Store in a well-ventilated place. Keep container tightly closed.Store locked up.Disposal:Dispose of contents/container in accordance with waste/disposal laws and regulations of your country or particular locality.Other Hazards:This product contains component(s) which have the following warnings; however based on the GHS classification criteria of your country or locale, the product mixture may be outside the respective category(s).Acute: Harmful if absorbed through skin. May cause central nervous system depression characterized by thefollowing progressive steps: headache, dizziness, staggering gait, confusion, unconsciousness or coma. May cause headache and nausea. May be harmful if swallowed. Ingestion is not an expected route of entry in industrial orcommercial uses.Chronic: IARC has designated carbon black as Group 2B - inadequate evidence for carcinogenicity in humans, but sufficient evidence in experimental animals. In 2006 IARC reaffirmed its 1995 finding that there is "inadequate evidence" from human health studies to assess whether carbon black causes cancer in humans. Further,epidemiological evidence from well-conducted investigations has shown no causative link between carbon black exposure and the risk of malignant or non-malignant respiratory disease in humans.withheld.FIRST AID - EYE CONTACT: Flush eyes immediately with large amount of water for at least 15 minutes holding eyelids open while flushing. Get prompt medical attention. Immediately flush eyes continuously with lukewarm, gently flowing water for at least 30 minutes. Get prompt medical attention.FIRST AID - SKIN CONTACT: Flush contaminated skin with large amounts of water while removing contaminated clothing. Wash affected skin areas with soap and water. Get medical attention if symptoms occur. Wash clothing before reuse.FIRST AID - INHALATION: Move person to fresh air. Restore and support continued breathing. If breathing is difficult, give oxygen. Get immediate medical attention.FIRST AID - INGESTION: If swallowed, do not induce vomiting. Call a physician or poison control center immediately for further instructions. Never give anything by mouth if victim is rapidly losing consciousness, unconscious or convulsing.SUITABLE EXTINGUISHING MEDIA: Carbon Dioxide, Dry Chemical, Foam, Water FogUNSUITABLE EXTINGUISHING MEDIA: Not determined for this product.SPECIFIC HAZARDS POSSIBLY ARISING FROM THE CHEMICAL: Flammable liquid and vapor. Keep containers tightly closed. Isolate from heat, electrical equipment, sparks, open flame, and other sources of ignition. Closed containers may rupture when exposed to extreme heat. Use water spray to keep fire exposed containers cool. During a fire, irritating and/or toxic gases and particulate may be generated by thermal decomposition or combustion.SPECIAL PROTECTIVE EQUIPMENT AND PRECAUTIONS FOR FIRE-FIGHTERS: Wear full firefighting protective clothing, including self-contained breathing apparatus (SCBA). Water spray may be ineffective. If water is used, fog nozzles are preferable.PERSONAL PRECAUTIONS, PROTECTIVE EQUIPMENT AND EMERGENCY PROCEDURES: Remove all sources of ignition (flame, hot surfaces, and electrical, static or frictional sparks). Avoid breathing vapors. Use self-contained breathing equipment. Avoid contact.ENVIRONMENTAL PRECAUTIONS: Do not contaminate bodies of water, waterways, or ditches, with chemical or used container.METHODS AND MATERIALS FOR CONTAINMENT AND CLEANUP: Keep non-essential personnel a safe distance away from the spill area. Notify appropriate authorities if necessary. Contain and remove with inert absorbent material and non-sparking tools. Avoid contact. Before attempting cleanup, refer to hazard caution information in other sections of the SDS form.HANDLING: Keep closure tight and container upright to prevent leakage. Ground and bond containers when transferring material. Avoid skin and eye contact. Wash thoroughly after handling. Avoid breathing of vapor or spray mists. Do not handle until all safety precautions have been read and understood. Empty containers should not be re-used. Use with adequate ventilation. Because empty containers may retain product residue and flammable vapors, keep away from heat, sparks and flame; do not cut, puncture or weld on or near the empty container. Do not smoke where this product is used or stored.STORAGE: Do not store or use near heat, sparks, or open flame. Store only in well-ventilated areas. Do not puncture, drag, or slide container. Keep container closed when not in use. Refer to OSHA 29CFR Part 1910.106 "Flammable and Combustible Liquids" for specific storage requirements.INCOMPATIBILITY: Strong acids, bases, and strong oxidizers.; AminesEngineering controls: Sufficient ventilation in pattern and volume should be provided in order to maintain air contaminant levels below recommended exposure limits. Caution: Solvent vapors are heavier than air and collect in lower levels of the work area. Sufficient ventilation (using explosion-proof equipment) should be provided to prevent flammable vapor/air mixtures from accumulating.PERSONAL PROTECTION MEASURES/EQUIPMENT:RESPIRATORY PROTECTION: Use a NIOSH approved chemical/mechanical filter respirator designed toremove a combination of particulates and organic vapor if occupational limits are exceeded. For emergencysituations, confined space use, or other conditions where exposure limits may be greatly exceeded, use an approved air-supplied respirator. For respirator use observe OSHA regulations (29CFR 1910.134) or use in accordance with applicable laws and regulations of your country or particular locality.SKIN PROTECTION: Use neoprene, nitrile, or rubber gloves to prevent skin contact. If contact with the product is prolonged or repeated, Silver Shield or Butyl rubber gloves are recommended.EYE PROTECTION: Use safety eyewear including safety glasses with side shields and chemical goggles where splashing may occur.OTHER PROTECTIVE EQUIPMENT: Use disposable or impervious clothing if work clothing contamination is likely. Remove and wash contaminated clothing before reuse.HYGIENIC PRACTICES: Wash hands before eating, smoking, or using toilet facility. Do not smoke in anychemical handling or storage area. Food or beverages should not be consumed anywhere this product is handled or stored. Wash thoroughly after handling.Typical values, not to be used for specification purposes.ODOR: Sweet VAPOR PRESSURE: N.D.APPEARANCE: Black VAPOR DENSITY: Heavier than Air PHYSICAL STATE: Paste LOWER EXPLOSIVE LIMIT: 1.6 %(V)UPPER EXPLOSIVE LIMIT: 8.8 %(V)FLASH POINT: 59 °F, 15 °C SetaflashClosed CupBOILING RANGE: N.A.EVAPORATION RATE: Faster than n-butyl-acetate.AUTOIGNITION TEMPERATURE:N.D.DENSITY: 0.96 g/cm3 (7.95 lb/gal)DECOMPOSITION TEMPERATURE:N.D. VISCOSITY, DYNAMIC: ≥85,000 mPa.s @ 25 °C ODOR THRESHOLD: N.D.VISCOSITY, KINEMATIC: ≥88,542 mm2/s @ 25 °CSOLUBILITY IN H2O: Insoluble VOLATILE BY WEIGHT: 0.03 %pH: N.A.VOLATILE BY VOLUME: 0.03 %FREEZE POINT: N.D. VOC CALCULATED: 0 lb/gal, 0 g/l0 g/lN.D.COEFFICIENT OF WATER/OILDISTRIBUTION:LEGEND: N.A. - Not Applicable, N.E. - Not Established, N.D. - Not DeterminedHAZARDOUS POLYMERIZATION: Hazardous polymerization will not occur under normal conditions. STABILITY: Product is stable under normal storage conditions.CONDITIONS TO AVOID: High temperatures. Sources of ignition.INCOMPATIBILITY: Strong acids, bases, and strong oxidizers.; AminesHAZARDOUS DECOMPOSITION PRODUCTS: Carbon monoxide, carbon dioxide, and organic or inorganic nitrogen compounds, Corrosive acid vaporsEXPOSURE PATH: Refer to section 2 of this SDS.SYMPTOMS:Refer to section 2 of this SDS.TOXICITY MEASURES:Germ cell mutagenicity: No classification proposedCarcinogenicity: No classification proposedReproductive toxicity: Category 2 - Suspected of damaging fertility or the unborn child.Components contributing to classification: Methacrylate monomer. Amine catalyst.PERSISTENCE AND DEGRADABILITY:Not determined for this product.BIOACCUMULATIVE: Not determined for this product.MOBILITY IN SOIL: Not determined for this product.OTHER ADVERSE EFFECTS: Not determined for this product.DISPOSAL METHOD: Disposal should be done in accordance with Federal (40CFR Part 261), state and local environmental control regulations. If waste is determined to be hazardous, use licensed hazardous waste transporter and disposal facility.US DOT RoadProper Shipping Name: AdhesivesHazard Class: 3SECONDARY HAZARD: NoneUN/NA Number: 1133Packing Group: IIEmergency Response Guide Number: 128IATA CargoPROPER SHIPPING NAME: AdhesivesHazard Class: 3HAZARD CLASS: NoneUN NUMBER: 1133PACKING GROUP: IIEMS: 3LIMDGPROPER SHIPPING NAME: AdhesivesHazard Class: 3HAZARD CLASS: NoneUN NUMBER: 1133PACKING GROUP: IIEMS: F-EThe listed transportation classification applies to non-bulk shipments. It does not address regulatory variations due to changes in package size, mode of shipment or other regulatory descriptors. For the most accurate shipping information, refer to your transportation/compliance department.U.S. FEDERAL REGULATIONS: AS FOLLOWS:SARA SECTION 313This product contains the following substances subject to the reporting requirements of Section 313 of Title III of the Superfund Amendment and Reauthorization Act of 1986 and 40 CFR part 372.:Chemical Name CAS Number Weight % Less ThanMethyl methacrylate80-62-640.0%TOXIC SUBSTANCES CONTROL ACT:INVENTORY STATUSThe chemical substances in this product are on the active TSCA Section 8 Inventory or exempt.EXPORT NOTIFICATIONThis product contains the following chemical substances subject to the reporting requirements of TSCA 12(B) if exported from the United States:NoneUnder HazCom 2012 it is optional to continue using the HMIS rating system. It is important to ensure employees have been trained to recognize the different numeric ratings associated with the HazCom 2012 and HMIS schemes.HMIS RATINGS - HEALTH: 2* FLAMMABILITY: 3 PHYSICAL HAZARD: 1* - Indicates a chronic hazard; see Section 2Revision: Section 2, Section 11Effective Date: 04/21/2021The information contained herein is, to the best of our knowledge and belief, accurate. However, since the conditions of handling and use are beyond our control, we make no guarantee of results, and assume no liability for damages incurred by use of this material. It is the responsibility of the user to comply with all applicable federal, state and local laws and regulations.。

塔克拉胶回收试剂盒说明书

塔克拉胶回收试剂盒说明书

塔克拉胶回收试剂盒说明书
保存方法及注意事项
本试剂盒在室温(15~25C)干燥保存,有效期见包装。

BufferB2中含有刺激性的化合物,操作过程中应穿上实验服,戴好乳胶手套,避免沾染皮肤、眼睛和衣服,防止吸入口鼻。

沾染皮肤或眼睛后,请立即用清水或生理盐水冲洗,必要时寻求医生的帮助。

产品介绍
本试剂盒适用于从TAE和TBE琼脂糖凝胶中回收100bp~10kb的DNA片段,回收效率可达80%。

该试剂盒采用特殊的吸附膜,能够有选择性地吸附核酸分子,去除其他杂质,得到高质量的DNA回收产物。

本试剂盒采用的膜结合液中不含有干扰酶活性的碘化钠,所得到的DNA可直接用于酶切、连接、测序等后续的分子生物学试验。

本试剂盒具有以下特点:
1.适用范围广,回收效率高,对于100bp~10kb之间的DNA片段回收效率在80%以上。

2.操作简单快速,整个回收过程仅须15分钟左右。

3.洗脱效率高,洗脱体积最小可低至15ul。

MR-4.6-09实验室消耗品采购申请表 (1)

MR-4.6-09实验室消耗品采购申请表 (1)
H&S 安康检测 表格编号:MR-4.6-09
实验室消耗品采购申请表
第 页
名称 酒石酸钾钠 碘化汞 丙酮 无水氯化镁 重铬酸钾 一次性吸管 量筒 口罩 手套(PE) 手套 容量瓶 容量瓶 容量瓶 容量瓶 磷酸氢二钾 磷酸二氢钾 紫外分光光度计擦镜纸 试管架 试管 试管帽 小倒管 200ml 250ml 500ml 1000ml 500g/瓶 500g/瓶 本 10*4孔 18*180 18*180 200 10 5 10 5 2 2 10 10 50 50 铁制品 铝合金 100g/瓶 500ml/瓶 500g/瓶 500g/瓶 5袋 100ml 1箱 一箱 S、M型号各一箱 3只 3M/9042 规格型号 数量 2 3 5 1 1 技术要求 AR AR AR AR GR 用途 备注
共 页
备注:1.不在《供应商一栏表》中的购置需要提提供采购渠道。 2.购买设备应将说明书等资料收集附表后提交。3.有检查性验收要求 的在“技术要求”栏内注明。 申购人签名: 张燕平 部门经理意见:
日期:2015.04.15
日期:

ASTM D6195-97

ASTM D6195-97

5.5Test Method B (using Loop Tack Tester)makes use of aspecimen strip five in.(125mm)in length.That is the onlylength specimen strip that fits properly in the loop tack tester.5.6If the adhesive is not already otherwise coated,these testmethods incorporate the use of a clear 2mil (0.05mm)polyester (PET)film backing for specimen e ofother backing materials changes performance of the specimento be tested.TEST METHOD A (Using a Tensile Tester)6.Apparatus6.1Tensile Tester —A constant rate of extension type.6.2Test Fixture (Fig.1or Fig.28)—To be mounted into thejaws of the tensile tester.A panel held by the test fixture allowsfor a 1in.2(25by 25mm)contact area of the pressure-sensitivearticle.Alternately,the test fixture may include a raised area that allows a 1in.2(25by 25mm)contact area of thepressure-sensitive article.6.2.1The panel or the raised area of the test fixture isstainless steel as specified in Specification A 666.6.3Apparatus for Cutting :6.3.1Die Cutter —A 1by 7in.(25by 175mm)rectangularmallet-type die cutter with mallet for sample preparation.6.3.2If a fixed dimension die is unavailable,substitute a1-in.(25-mm)steel bar with a double razor knife or otherapparatus suitable for cutting the specimen into the specifieddimensions to prepare the 1in.(25mm)wide specimen strips.6.4Absorbent Lint-Free Cleaning Material —Materials pro-duced from entirely virgin raw materials and containing lessthan 0.25%by weight of solvent-leechable materials.6.5Masking Tape —1in.(25mm)wide.6.62mil (0.05mm)PET Film—To be used as a supportmedium in evaluating unsupported adhesives such as transfertapes,laminating adhesives,or other free-film adhesives.6.7Reagents —Appropriate reagents include acetone,diac-etone alcohol,n-heptane and toluene,reagent or analyticalgrade,or an ethanol cleaner for water-based adhesives.7.Sample Preparation7.1Cut sample into 1by 7in.(25by 175mm)specimenstrips in the machine direction (when known)of the pressure-sensitive e of strips of other lengths may change results.Cut at least three specimen strips for each adhesive to be tested.N OTE 1—If transfer or unsupported adhesives are to be tested,these are to be laminated to 2mil (0.05mm)PET film,used as an adhesive support,prior to cutting the samples into the 1by 7in.(25by 175mm)specimen strips.7.2Condition specimens to be tested for at least 24h in a testing room at 73.46 3.6°F (2362°C)and a relative humidity of 5065%,in accordance with Specification E 171,prior to conducting the test.8.Conditioning 8.1Testing Room —Test in a standard laboratory atmo-sphere,at 73.463.6°F (2362°C)and a relative humidity of 5065%,in accordance with Specification E 171.9.Procedure 9.1Ensure that the tensile tester is calibrated according to instructions supplied by the manufacturer.9.2Set the instrument crosshead speed at 12in.(300mm)/min.9.3Place the test fixture in the lower grip of the tensile tester.It is important that the test fixture be level and straight in the lower grip.See Fig.1,Fig.2and Fig.3.9.4Set gaps for the crosshead using the minimum and maximum gap setting on the extension cycle.Set gaps 160.05in.(2561mm)(critical)and 460.1in.(10063mm)(optional)from the bottom of the upper grips to the face of the stainless steel portion of the test fixture when the test fixture is locked in the lower grips.Set the chart recorder speed for 2in.(50mm)/min.Set the chart recorder load scale to 20lb (90N)full scale.9.5Clean the stainless steel portion of the test fixture (the area the pressure-sensitive article will contact)prior to use 8Available from Chem Instruments,510Commercial Drive,Fairfield,OH45014-7593.FIG.1Loop Tack Test Fixture1FIG.2Loop Tack Test Fixture2FIG.3Loop Tack Sample DuringTestusing reagent(s)e absorbent,lint-free cleaning e a separate piece of cleaning material each time. Repeat for a total of three washes after the testfixture appears clean.Allow2min to elapse after cleaning to ensure complete evaporation of the cleaning solvent.The user must ensure that the cleaning method used removes all residue from the test fixture.The water-break test,described in Guide D2651,may be used to verify cleanliness.9.6Completely remove the release liner(if the pressure-sensitive article normally includes a release liner)from the specimen.9.7Bend the specimen completely back on itself,being careful not to crease it.The specimen forms a tear drop shaped loop with the adhesive surface facing out.9.8Fasten the ends of the loop together,using a strip of masking tape1in.(25mm)wide(Fig.4).The masking tape covers the ends of the loop,preventing contamination of the grips of the tensile tester.9.9Insert the taped end of the specimen loop into the upper grips so that the bottom edge of the masking tape is even with the bottom edges of the grips.9.10Turn on the chart recorder.Activate the tensile tester so that the crosshead moves downward.The mid-section of the specimen loop must contact the center of the stainless steel portion of the testfixture.When the crosshead reaches its minimum position,it will immediately switch direction and move upward.When the crosshead is at its minimum position, the specimen loop will completely cover the1in.(25mm)area of the stainless steel portion of the testfixture without excessive“hang-over”of the edges.N OTE2—If the tensile tester does not have automatic cycling,cycling must be done manually.9.11Record the maximum force required to remove the specimen loop from the stainless steel portion of the testfixture as well as the mode of failure.9.11.1Record the failure mode as adhesion,cohesion or transfer.9.12Repeat procedure(9.5to9.11.1)at least two additional times for each adhesive to be tested(for a minimum of three replicates).Use a fresh specimen strip for each test.9.13When testing is complete,clean the stainless steel portion of the testfixture with approved reagent.Cover with masking tape when not in use to protect the surface from scratches.TEST METHOD B(Using a Loop Tack Tester)10.Apparatus10.1Loop Tack Tester(Fig.5)8,also used in TLMI Test L-IB1.10.2Stainless Steel Test Panels—1in.(25mm)by6in. (150mm),stainless steel as specified in Specification A666.10.3Apparatus for Cutting.10.3.1Die Cutter—A1by5in.(25by125mm)rectangular mallet-type die cutter with mallet for sample preparation. 10.3.2If afixed dimension die is unavailable,substitute a1 in.(25-mm)steel bar with a double razor knife or other apparatus suitable for cutting the specimen into the specified dimensions to prepare the1in.(25mm)wide specimen strips.10.4Absorbent Lint-Free Cleaning Material—Materials produced from entirely virgin raw materials and containing less than0.25%by weight of solvent-leechable materials.10.5Masking Tape—0.5in.(12.5mm)wide.10.62mil(0.05mm)PET Film—To be used as a support medium in evaluating unsupported adhesives such as transfer tapes,laminating adhesives,or other free-film adhesives. 10.7Reagents—Appropriate reagents include acetone,diac-etone alcohol,n-heptane and toluene,reagent or analytical grade,or an ethanol cleaner for water-based adhesives.11.Sample Preparation11.1Cut the sample into1by5in.(25by125mm) specimen strips in the machine direction(when known)of the pressure-sensitive e of strips of other lengths may change results and will notfit properly in the loop tack tester. Cut at least three specimen strips for each adhesive to be tested. N OTE3—If transfer or unsupported adhesives are to be tested,these are to be laminated to2mil(0.05mm)PETfilm,used as an adhesive support, prior to cutting the samples into the1by5in.(25by125mm)specimen strips.11.2Condition the specimens to be tested for at least24h in the testing room at73.463.6°F(2362°C)and a relative humidity of5065%,in accordance with Specification E171, FIG.4Specimen Loop-Test MethodA FIG.5Loop TackTesterprior to conducting the test.12.Conditioning12.1Testing Room —Test in a standard laboratory atmo-sphere,at 74.363.6°F (2362°C)and a relative humidity of5065%,in accordance with Specification E 171.13.Procedure13.1Ensure that the loop tack tester is leveled and con-nected to electrical power.Release the upper assembly lockinglever (Fig.5(B)).13.2Turn the power switch (Fig.5(E))to “ON.”13.3Ensure the the grip is in its upward-most position.13.4Remove the stainless steel test panel by loosening thefour clamp screws (Fig.5(F)).13.5Clean the stainless steel panel prior to use usingreagent(s)from e a separate piece of cleaning materialeach time.Repeat for a total of three washes after the test panelappears clean.Allow 2min to elapse after cleaning to ensurecomplete evaporation of the cleaning solvent.The user mustensure that the cleaning method used removes all residue fromthe test fixture.The water-break test,described in GuideD 2651,may be used to verify cleanliness.13.6Reinsert the test panel and tighten the four clampscrews.13.7Completely remove the release liner (if the pressure-sensitive article normally includes a release liner)from thespecimen.13.8Bend the specimen completely back on itself,beingcareful not to crease it.The specimen forms a tear drop shapedloop with the adhesive surface facing out (Fig.6).13.9Fasten the ends of the specimen loop together,using astrip of masking tape 0.5in.(12.5mm)wide.13.10Insert the specimen loop into the specimen jaw untilit touches the guide pins near the center of the jaw.Insertingthe specimen loop in this way ensures that it is positionedproperly.13.11Zero the force gage according to instructions providedby the manufacturer.13.12Press the “Start”button (Fig.5(I))and keep itdepressed until the upper assembly starts to move downward.The upper assembly will complete one full cycle and automati-cally shut off when the force gage again reaches its startingposition.13.12.1This cycle will first move the upper assemblydownward,bringing the specimen loop into contact with thetest surface,forming a bond.13.12.2The assembly will then move upward and the force gage measures the force required to break the bond.13.12.3The cycle will end when the assembly returns to its original starting position.13.13Record the maximum force required to remove the specimen loop from the stainless steel panel as well as the mode of failure.13.13.1Record failure mode as adhesion,cohesion or trans-fer.13.14Repeat procedure (13.13to 13.13.1)at least two additional times for each adhesive to be tested (for a minimum of three replicates).Use a fresh specimen strip for each test.13.15When testing is complete,clean the stainless steel panel with approved reagent.Cover with masking tape when not in use to protect surface from scratches.14.Calculation 14.1Calculate the average peak reading in pounds (New-tons)and the standard deviation using at least three specimens for each adhesive.15.Report 15.1Report the following:15.1.1Test Method (A or B),15.1.2Identification of the adhesive,15.1.3Reagent(s)and method used for cleaning the stain-less steel portion of the test fixture,15.1.4Conditioning time for prepared specimens,15.1.5Adhesive type and coating thickness in mils (milli-metres),15.1.6Backing material used for the adhesive,15.1.7Release liner used,if any,15.1.8Crosshead speed of the tensile tester (Test Method A only),15.1.9Temperature and humidity conditions,15.1.10Average peak reading in pounds (Newtons),15.1.11Standard deviation of peak readings,15.1.12Visual mode of failure (adhesion,cohesion or trans-fer),and 15.1.13Length of specimen strip in inches (millimetres).16.Precision and Bias 16.1An interlaboratory study of loop tack precision by Test Method A was conducted in accordance with Practice E 691.Seven laboratories reported three test results on each of four adhesive tapes.The four adhesive tapes represented different adhesive chemistries as well as different levels of loop tack.For this study,a specimen length of 8in.was used rather than the 7in.specified in the test method.Similar precision results are expected with a 7in.specimen.9Results of the repeatability study are summarized in Table 1.16.2The precision information given below was calculated for the comparison of the average of three individual test determinations as specified in Test Method A.16.3The terms repeatability limit and reproducibility limit are used as specified in Practice E 177.9A research report is available from ASTM headquarters.Request RR:D14-1006.FIG.6Specimen Loop -Test MethodB16.4Repeatability :16.4.1The repeatability of this test method was an increas-ing function of the value of the test result.See Table 1.16.5Reproducibility :16.5.1The reproducibility of this test method was anincreasing function of the value of the test result.See Table 1.16.6For Test Method B,three laboratories reported resultson each of four adhesive tapes.Although the tapes were sent toeight laboratories,only three of them had access to a commer-cial loop tack tester.The commercial loop tack tester uses a 5in.test specimen.With so few test results,the standard deviations are probably underestimated.Repeatability and reproducibility standard deviation were determined accordance with Practice E 691.16.7Repeatability :16.7.1The repeatability of this test method was an increas-ing function of the value of the test result.See Table 2.16.8Reproducibility :16.8.1The reproducibility of this test method was an increasing function of the value of the test result.See Table 2.17.Keywords 17.1adhesive;loop tack;pressure-sensitive article;tack The American Society for Testing and Materials takes no position respecting the validity of any patent rights asserted in connection with any item mentioned in this ers of this standard are expressly advised that determination of the validity of any such patent rights,and the risk of infringement of such rights,are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years and if not revised,either reapproved or withdrawn.Your comments are invited either for revision of this standard or for additional standards and should be addressed to ASTM Headquarters.Your comments will receive careful consideration at a meeting of the responsible technical committee,which you may attend.If you feel that your comments have not received a fair hearing you should make your views known to the ASTM Committee on Standards,100Barr Harbor Drive,West Conshohocken,PA 19428.TABLE 1Loop Tack Precision Data (Test Method A)MaterialAverage (lb/in 2)Repeatability Standard Deviation Reproducibility Standard Deviation Repeatability Limit Reproducibility Limit A1.13270.12990.32250.36370.9030B1.89880.16220.27100.45410.7587C2.10050.30270.48930.8477 1.3699D 5.77300.33940.69080.9502 1.9343TABLE 2Loop Tack Precision Data (Test Method B)Material Average (lb/in 2)Repeatability Standard Deviation Reproducibility Standard Deviation A 1.1540.06900.1880B 2.0440.16600.3167C2.2560.31160.5681D 6.5480.27410.6283。

Waters半分析半制备液相零配件

Waters半分析半制备液相零配件

Waters高效液相色谱仪零配件部件号部件名称规格数量1860002257 色谱柱XTerra prep Rp18,19×150mm,10μm 1根186000492 色谱柱XTerra Rp18,4.6×150mm,5μm 1根186000407 色谱柱XTerra Rp8,2.1×100mm,3.5μm 1根186001180 色谱柱XTerra Phenyl,2.1×100mm,3.5μm 1根186003747 色谱柱Atlantis T3,4.6×150mm,5μm 1根WAT046910 保护柱套1个186000662 保护柱芯XTerra Rp18,5μm,2个/包1包186000663 保护柱芯XTerra Rp8,5μm,2个/包1包186001195 保护柱芯XTerra Phenyl,5μm,2个/包1包1860003761 保护柱芯Atlantis T3,5μm,2个/包1包186001036 保护柱芯XTerra prep Rp18,10μm,2个/包1包186000274 样品瓶2mL,100个/盒2盒186000307c 样品瓶盖子12×32mm,100个/包5包WAT163-12 保险丝 1.25A,250V,5×20mm,2个/包1包WAT163-15 保险丝 2.5A,250V,5×20mm,2个/包1包WAT163-17 保险丝4A,250V,5×20mm,2个/包1包WAT163-19 保险丝 6.3A,250V,5×20mm,2个/包1包WAT162-23 保险丝6A,125V,5×20mm,2个/包1包WAT072919 保险丝 2.5A 1个WAT087186 A溶剂管路标识2个/包1包WAT087187 B溶剂管路标识2个/包1包WAT060368 C溶剂管路标识2个/包1包WAT060369 D溶剂管路标识2个/包1包205000301 SEAL WASH包1包200000153 启始包1包200000221 2489UV启始包1包200000242 2707Autosampler启始包1包700002682 蒸气收集瓶接头1包200242400 2424ELS启始包1包725000142 启始包1包WAT027629 进样器注射器10mL 1个WAT077342 注射器2500mL 1个WAT025531 溶剂过滤头4支WAT025604 密封螺栓5个/包2包WAT026631 密封垫1个/包2包WAT022934 密封垫2个WAT023486 气体接头1套700002476 WFC死堵1包WAT200448 9针数据线1根WAT048918 检测器信号线3根415001070 样品盘固定螺栓48×2mL 1包410001458 气体密封头2个WAT050337 气体铜接头1个WAT025559 进样器针管1支p-470 分流阀1个410000532 三通1个WAT073633 半制备定量环50μL1个200μL1个WAT073703 定量环5mL 1支700002169 TEFLON管线1支WAT076775 TEFLON管线312×.2501 1支430000604 TEFLON管线375OD,0.25ID 1支WAT082727 TEFLON管线0.125×0.040 1支WAT024036 TEFLON管线9mm壁厚1支430001556 TEFLON管线直径3/8" 1支WAT042173 线路固定片3个410000781 直通1/8" 1个WAT025566 钢制堵头1个WAT025592 钢制管线0.62×0.2×60 1个WAT075672 钢制管线0.62×0.009×68 1个WAT026805 钢制管线0.62×0.4×120 1个备注:2010.11.24更新。

第十二章层析柱和填料

第十二章层析柱和填料
另有柱管和过滤器都由 PEEK(聚醚醚酮)制成的 Tricorn PE 柱,能抗更大的反压。
Tricorn 柱取代高分辨率柱(HR 柱),改良的设计提 供更简单的操作和更好的安全性。Tricorn 柱可以是 空的,根据您选择的填料(见 643 页)进行装填或预 装有填料的柱子。Tricorn 柱可用于广泛的蛋白质纯 化技术,包括凝胶过滤,离子交换,层析聚焦和疏 水层析。请使用下页的 Tricorn 高效层析柱选购指 南,选择最适合您研究的层析柱。每个产品的技术 参数可在选购指南中查到相应页码。
高通量筛选 ● ● ˉ
40 mg/column
ˉ
40 mg/column
ˉ
1000 µg/well

800 µg/well

750 µg/column
ˉ
N/A
ˉ
N/A
ˉ
N/A
ˉ
N/A
ˉ
N/A

N/A

N/A

微量提取 ˉ ˉ ●
ˉ ˉ ˉ ˉ ● ● ● ● ● ˉ ˉ ˉ
重力流 ˉ ˉ ˉ
● ● ˉ ˉ ˉ ˉ ˉ ˉ ˉ ˉ ˉ ˉ
填料类型
应用
色谱聚焦
基于蛋白质的不同等电点的快速纯化
色谱聚焦
基于蛋白质的不同等电点的快速纯化,非常高的分辨力,能够分辨低于
0.02 个 pH 单位
凝胶过滤 凝胶过滤
预装新型的高度交联的琼脂糖/葡聚糖填料用于分离分子量在 100- 7000 的肽 在分子量为 3000-70000(球蛋白)内实现高分辨率纯化;是纯化步骤 中精细纯化的理想选择并且容易放大。
凝胶过滤
在非常宽的分子量在(1000-300000,球蛋白)内实现高分辨率纯化; 是纯化步骤中精细纯化的理想选择

戴安离子色谱仪使用

戴安离子色谱仪使用

戴安离子色谱仪操作流程1 .打开气瓶开关压力在0.2Mpa2 打开稳压电源进样器电源色谱仪电源。

3 打开电脑右下角图标变色龙软件点开点 start4 调整淋洗液压力 5-65 打开操作软件调整淋洗液容量在左边仪器顶部白色烧杯装水,管道抽水成滴状排除。

6点Eluen Flow valve open 淋洗液阀门仪器右下角的泵打开拿针筒抽20ml淋洗液然后拧紧不要太紧拧爆了7 打开废液泵在淋洗液泵的左边点pump on20秒后关废液泵8 带泵压稳定后变化幅度小于20 设置电压 SRS 60mA on9 工具栏蓝色圆点走基线停的时候也要点。

基线页面右键 Axis 改动横坐标10 工具栏第 4 . 5 个图标切换控制页面建立样品表纯水 blank single(未测)标曲 standard single式样 unknow single编好后按保存改动后也要按保存改保留时间双击 AS9 程序文件。

左边最下边数字就是保留时间可以改动。

做样。

工具栏中间第三个键右边开始。

先按 Ready check 弹出对话框点都否再按 READY标曲工具栏 QNT 点进去峰表改保留时间。

改时间按保存数量表改浓度改浓度。

保存测完样品走30分钟基线关机先停基线关抑制器 SRS off关泵 pump off关电源关气体标曲浓度氯离子标准贮备液 1000mg/l 氯化钠 0.82395g ----500ml 亚硝酸根标准贮备液 1000mg/l 亚硝酸钠0.7500g------500ml 硝酸根标准贮备液 1000mg/l 硝酸钠 0.6855g------500ml 硫酸根标准贮备液 1000mg/l 硫酸钠 0.7396g----500ml混合水样离子浓度主窗口和浏览器图12.主窗口和浏览器启动Chromeleon将出现以上窗口,它与Windows中的资源管理器类似,具有文件检索功能,但是不能在两者之间随意复制。

2.3.2 控制面板图13.控制面板(传统型)图14.控制面板Datasource显示谱图数据储存的数据库位置。

层析系统纯化人用狂犬病疫苗PPT教案

层析系统纯化人用狂犬病疫苗PPT教案
功能: 系统控制 (全自动 Run Method,手动 Manual 或自动加手动) 在线同步监测( Run Data, Curves, Flow Scheme, Logbook) 系统设定 (系统参数默认值等设定) 校正 (流速、压力、电导、pH 等)
Evaluation 结果处理
主要功能: 文件编辑 File/ Edit (Copy, Delete, Rename, Chromatogram Layout) 积分 Integrate (Peak Integrate, Baseline, Peak Table) 曲线操作 Operations (Add, Subtract, divide, Multiply, Shift, Smooth, Normalize, Differentiate, Cut Curve, Create Curve…… )
2 使0.01M pH7.8 PBS经层析柱正冲,通过紫 外流通池进入空瓶,当一瓶0.01M pH7.8 PBS 洗完后,调低流速,最后点击Pause,换一瓶 0.01M pH7.8 PBS,平衡至电导率和紫外吸收 稳定时为止。
上样
待系统曲线稳定以后,先进行紫外校零, 在系统控制模块窗口中设定流速并点击插 入,选择上样管道点击插入,点击Execute 执行,开始上样。
Method Editor 方法编辑
功能: 编辑方法 (Method Wizard, Run Setup, Text Instruction) 编辑层析柱列表 (Column List) 编辑缓冲液配方 (BufferPrep Receipt) ……
System Control 系统控制
系统运行前准备
系统泵的清洗
1、选择所要使用的管道放入蒸馏水中,在系 统控制模块(System Control)窗口中选择 Manual 再点击Pump,选择Pump Wash explorer,选择所要清洗的管道,点击 Execute执行。

akta中文说明书

akta中文说明书

7.2
打印和生成报告........................................................................................................... 34
8
缓冲液制备........................................................................................................................... 37
2.2
AKTAexplorer 100........................................................................................................ 10
2.3
AKTAexplorer 10.......................................................................................................... 11
2.4
UNICORN 综述 .......................................................................................................... 12
2.5
帮助............................................................................................................................... 14
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FAA-H-8083-25APilot’s Handbook of Aeronautical KnowledgeDated 2009Errata1.Page 1-18, right column, 1st paragraph, last sentence; change the uniform resource locator(URL) to read: “/training_testing/testing/airmen/test_questions”.2.Page 2-13, Figure 2-19, top figure; change the green label “Altitude Indicator” to“Attitude Indicator”.3.Page 2-13, Figure 2-19, bottom figure; center the Primary Flight Display white Slip/skidindicator to match the centered ball (in-trim) indication of the Turn coordinator in the top figure.4.Page 2-13, Figure 2-19, bottom figure; the reddish brown line inadequately identifies andtags a turn rate trend vector/indicator on the HSI. Tag the blue square as the “heading bug.” Tag the green triangle as the top of the “course arrow.”5.Page 2-13, Figure 2-19, bottom figure; the green, “To-From” triangle on the CDI needleto white.6.Page 2-13, Figure 2-19, bottom figure; change the white course deviationcircles/indicators to be in a horizontal line perpendicular to the course arrow, not on top of the course arrow.7.Page 2-14, Figure 2-20, bottom figure; change the white course deviationcircles/indicators to be in a horizontal line perpendicular to the course arrow, not on top of the course arrow.8.Page 2-15, Figure 2-21, HSI depictions labeled 1 and 2; change the white coursedeviation circles/indicators to be in a horizontal line perpendicular to the course arrow, not on top of the course arrow.9.Page 3-7, left column, 3rd paragraph; change “AOA” to “angle of attack (AOA)”.10.Page 4-2, Figure 4-2; add a “Lift” label on the green upward arrow perpendicular to therelative wind. The “Lift” label indicates the green arrow represents the lift vector.Depict the Center of Lift (CL) on the wing, similar to the way the CG is depicted on the fuselage; label the “CL” on the wing similar to the way the CG is labeled on the fuselage.Depict the green arrow to originate at the Center of Lift (CL) of the wing, not at theaircraft CG.11.Page 4-6, right column, 2nd paragraph, 3rd line; change the word “life” to “lift”.12.Page 4-6, right column, 3rd paragraph, 3rd line; change “15°” to read “20°”.13.Page 4-6, Figure 4-9; delete the word “Critical” from the bottom axis label.14.Page 4-6, Figure 4-9; reposition the orange line (depicting C D). It starts correctly butshould pass through the intersection of the green and red lines. The orange line should terminate near the top of the graph as it approaches 18° Angle of Attack in an upward direction.15.Page 4-6, Figure 4-9; move the blue “Stall” tag to the right so it correctly points to thevertical 20° Angle of attack line. The existing “Stall” tag incorrectly points to the right end of the green line. The 20° Angle of attack line is the correct location for the C Lmax tag on the red C L line.16.Page 4-7, left column, 1st paragraph, 3rd line; change the word “orange” to “blue”.17.Page 4-27, figure 4-42; point the black arrow, representing propeller rotation, in theopposite direction. Point the gray arrow, representing Resultant force, in the opposite direction. Point the orange arrow, representing Yaw, in the opposite direction. The result of the depicted “Applied force” to a typical United States built airplane is a left yawing moment.18.Page 4-29, right column, paragraph between figures, 2nd sentence; insert the words“coordinated level turn at” before “60°”.19.Page 4-30, right column, last paragraph; add the following sentence to the end of theparagraph: “Operating at or below design maneuvering speed does not provide structural protection against multiple full control inputs in one axis or full control inputs in more than one axis at the same time."20.Page 4-31, left column, Load Factors and Flight Maneuvers section, 1st paragraph; addthe following two sentences to the end of the paragraph: "Full application of pitch, roll, or yaw controls should be confined to speeds below the maneuvering speed. Avoid rapid and large alternating control inputs, especially in combination with large changes inpitch, roll, or yaw (e.g., large sideslip angles) as they may result in structural failures at any speed, including below V A."21.Page 4-33, Figure 4-47; move the label reading “Never exceed speed” left to the smalldark red area bordering the yellow area.22.Page 6-18, figure 6-20; show a diode in the circuit between the top of the Batterycontactor (solenoid) and the connection to the ALT/BAT switch.23.Page 7-2, right column, top line; change “insure” to “ensure”.24.Page 7-3, figure 7-2; change the label presently reading “1,000 ft. pointer” to read “100ft. pointer”. Change the label presently reading “100 ft. pointer” to read “10,000 ft.pointer”. Change the label presently reading “10,000 ft. pointer” to read “1,000 ft.pointer”.25.Page 7-3, right column, top paragraph, last sentence; change “ASI” to “altimeter”.26.Page 7-10, left column, Other Airspeed Limitations section, 1st bullet, last sentence;change “VA” to “V A”.27.Page 7-13, figure 7-12; change the white course deviation circles/indicators to be in ahorizontal line perpendicular to the course arrow, not on top of the course arrow.28.Page 7-23, left column, 1st line; change “Figure 7-30” to “Figure 7-31”.29.Page 7-24, right column, last paragraph; delete the next to last sentence and the phrase“(and weight)” in the last sentence. No known compass manufacturer uses dip magnet compensators for aviation or weights that compensate for magnetic dip.30.Page 7-26, Eddy Current Damping section, 1st sentence; delete the sentence.31.Page 10-3, Pressure Altitude section, 3rd paragraph; change the word “either” to “any” inthe 1st sentence. Change the word “two” to “three” in the 1st sentence. Add “(See figure 10-3)” to bullet 2. Add a bullet: “3. By using a flight computer.”32.Page 10-9, right column, last paragraph; delete this duplicate paragraph.33.Page 10-17, left column, next to last paragraph, 2nd line; change the 2nd word “or” to“for”.34.Page 10-20, Figure 10-22, Wind component (knots) column; the red line is incorrect.Show the short section parallel the headwind trend lines over to 6 knots. Accordingly, adjust the right end of the line upward.35.Page 10-20, left column, 1st paragraph; based on correcting the above mistake in plottingthe red line, change the ground roll distance and distance over a 50 foot. Change theground roll distance to be 700 feet, not 600 feet. Change the total distance over a 50 foot obstacle to be 1,400 feet, not 1,200 feet.36.Page 10-25, Figure 10-31, figures in the green column; change “59°” to “50°”.37.Page 10-26, Figure 10-32, Outside air temperature column and Weight column; the redline is incorrect. Show the left vertical stopping at 4,000 feet Pressure altitude thenturning right to the Reference line. In the Weight column, show the red line left section so it is parallel to the trend lines over to 2,400 pounds. Accordingly, adjust the othersections of the red line to match these corrections.38.Page 10-26, left column, 1st paragraph, last sentence; change the total ground roll to 975feet. Change the total distance over a 50 foot obstacle to 1,500 feet.39.Page 12-10, right column, subparagraph number 4; change the paragraph to read “Validperiod dates and times, either 24 hours or 30 hours. The first two digits of EACH four digit number indicate the date of the valid period; the final two digits indicate the time. 40.Page 12-11, left column, TAF Example; change the first 2 lines under “TAF” to read:KPIR 111130Z 1112/1212TEMPO 1112/111441.Page 12-16, Figure 12-15; change the next to the last Wind Speed and Direction Plotlabel to read “W/50 kts”.42.Page 13-2, left column, Nontowered Airport section, 1st word; change “An” to “A”.43.Page 13-3, right column, Notices to Airmen (NOTAMs) section, 1st paragraph, 3rdsentence; change the word “three” to “four”.44.Page 13-3, right column, Notices to Airmen (NOTAMs) section; 1st paragraph, 4thsentence; replace the sentence with this sentence: “See Chapter 5 of the AIM for adescription of the Notice to Airmen (NOTAM) System.”45.Page 13-8, Figure 13-10; on the right side reverse the “Pulsating red” label with the“Steady red” label.46.Page 15-5, Figure 15-5; change the time shown in the Eastern Standard time zone from“13:00 PM” to “1:00 PM”.47.Page 15-6, Figure 15-6; change the right side number (between “12” and “6”) from “15”to “9”.48.Page 15-12, Fuel Consumption section, 1st line; insert the word “frequently” between “is”and “computed”.49.Page 15-19, Figure 15-26, Pilot’s Planning Sheet; change the column label above “7° E”from “WCA R+ L-” to “Mag Var W+ E-”.50.Page 15-19, Figure 15-26; show an additional column labeled “Altitude” on both thePilot’s Planning Sheet and the Visual Flight Log.51.Pages 15-30 through 15-32, Loran-C Navigation section; delete the section. The Loran-Csystem is no longer in use.52.Page 16-8, Figure 16-8, label at bottom; change “Impairement” to “Impairment”.53.Page 17-6, right column, bullet number 6; change it to read “Emotion – Am I emotionallyupset?”54.Page 17-26, Figure 17-18, top right electronic flight display depiction; change the whitecourse deviation circles/indicators to be in a horizontal line perpendicular to the course arrow, not on top of the course arrow.55.Page 17-28, Figure 17-19, bottom portion; change the white course deviationcircles/indicators to be in a horizontal line perpendicular to the course arrow, not on top of the course arrow.56.Page G-18, Maneuvering speed (V A); replace the last sentence with these sentences: “Thedesign maneuvering speed. Operating at or below design maneuvering speed does not provide structural protection against multiple full control inputs in one axis or full control inputs in more than one axis at the same time."57.Page G-31, Tropopause; change “mesosphere” to “stratosphere”.58.Page G-32, V A definition; delete the last sentence. Replace it with this sentence:“Operating at or below design maneuvering speed does not provide structural protection against multiple full control inputs in one axis or full control inputs in more than one axis at the same time."59.Page I-7, Spins; change “4-32” to “4-31”.。

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