Hi3560 Brief Datasheet(产品简介)
日立HCP-3560介绍文件
日立HCP-3560X介绍主要技术指标技术LCD技术成像器件0.63＂多晶硅有源矩阵TFT液晶面板物理分辨率1024×768亮度（IS021118标准）3500流明标准对比度动态光圈技术，2000：1(实测大于4000：1) 兼容计算机VGA,SVGA,XGA,SXGA,UXGA,MAC16＂灯泡210UHP（飞利浦灯）音频（扬声器）16W机身重量 3.6kg特色功能1、动态光圈技术，高对比度（业界最高）2、光机防尘技术；双通道独立风路；“AWS”空气墙防尘系统；双层防尘过滤系统（最长5000小时免维护）3、完善防盗系统（开机画面自定义PIN锁定、投影机位置检测防盗PIN 锁定、一体化防盗杆技术等软硬件结合）4、分辨率自动兼容宽屏电脑型号，并可自行改变投影机分辨率5、白天/黑板模式（对应强光环境）6、便捷维护：A、OSD菜单；B、顶部灯泡更换；C、自动垂直梯形校正；D、过滤网最长5000小时除尘（带智能提醒功能）7、其他特色：A、自动开关机设计；B、散热风扇标准/高速旋转模式C、音频直通功能D、大功率扬声器16W(备用音响功能)E、3C、节能认证、环保认证F、多模板格式（配电子白板或手写产品用）HITACHI品牌：日立制作所由小平浪平创立于1910年，创始地为日本茨城县的日立村，99年历史；日立（HITACHI）为全球最大的工业公司之一，从大型发电机组到大型钢厂，从半导体设备到家用电器，都有卓越的表现。
日立液晶投影机产品性能价格比超群，成为美国3M、Viewsonic等投影生产厂家的OEM首选，以HCP为代表的新品更是新世纪科学技术的杰出典范。
2007年度世界500强排名：第48位销售额：112,267亿日元日立数字媒体和家用电器产品所占比例：12%目前,全球员工人数(含控股子公司)： 347424人控股子公司：910 家（日本国内418家、海外492家）日立投影机国内市场占有率排名：2006年全国第2，2007年全国第1，2008年全国第1；日立数字映像（中国）有限公司（HITACHI Digital Products ChinaCo.,Ltd.简称“HDCN”），前身为日立（福建）数字媒体有限公司，2001年6月15日由株式会社日立制作所、日立（中国）有限公司、福建省电子信息（集团）有限责任公司及Max BenefitHoldings Limited四家公司共同投资成立，注册地为福建省福州市经济技术开发区，现注册资金为1.6亿元人民币，总投资额达3.2亿元。
浪潮NP3560介绍
设备的详细配置清单货物名称部件或组件名称品牌、规格型号数量制造商（产地）对部件或组件的有关说明浪潮服务器主机浪潮NP3560 1 浪潮（山东）主要部件三年质保睿捷管理套件浪潮 1 浪潮（山东浪潮随机附送标配键盘鼠标键盘、鼠标 2 浪潮（山东服务器标配产品简介浪潮英信NP3560是一款基于“IFA+效能动三角”产品设计理念推出的性能卓越、安全可靠的部门级双路塔式（可转为5U机架式）服务器产品，采用英特尔® 至强® 处理器5500系列，性能提升高达225%。
在系统性能、功耗及噪音控制方面有显著改善，具有高扩展性、易用性、极高的性价比等特点，其灵活的按需配置既可以满足不断发展的商业应用环境，又能够降低企业整体部署TCO强大的性能：采用英特尔® 至强® 处理器5500系列，基于QPI架构,数据传输速率最高可达6.4GT/S，4-8MB的三级高速缓存；支持64位扩展、I/O加速、Turbo、超线程技术，系统应用性能较上代产品提高2.25倍；采用英特尔5500芯片组、创新的主板VR电路设计，增强型应变散热系统设计，降低功耗的同时，系统噪音降低15%；采用DDR III内存，6个内存插槽，支持DDR3 800/1066/1333MHz内存，最大可扩展24GB内存，支持三通道读取，满足用户性能需求更加节能可信：SAS机型集成8通道SAS控制器，支持RAID0，1，1E，可选支持双路SAS高性能RAID5组件，为用户提供多种数据保护方案；智能：浪潮英信服务器睿捷管理套件简化了服务器的维护与管理工作，可进行自动安装、远程数据备份、管理等功能；支持CPU温度、系统电压、风扇转速等的监控；支持AC断电恢复;弹性：SAS机型采用8通道SAS控制器，使客户可以按照业务发展需求随意配置，大大提高产品灵活度，也降低了各配置之间的切换成本；最大支持内置8块3.5寸SAS热插拔硬盘，满足不同应用的数据存储需求，也为未来业务的扩展提供了强大的数据存储空间；5个PCI扩展槽，方便您随时添加PCI设备扩展系统功能，支持PCI-E、PCI设备，同时支持PCI-E*16，兼顾工作站的需求，保护用户现有的IT设备投资，使您短期的投资获得更长期的超值回报；可转为5U机架式服务器，超强的易用性设计让用户的服务器应用部署更加方便快捷。
ICS557-01 Datasheet说明书
PCI-EXPRESS CLOCK SOURCEDescriptionThe ICS557-01 is a clock chip designed for use inPCI-Express Cards as a clock source. It provides a pair of differential outputs at 100 MHz in a small 8-pin SOIC package.Using IDT’s patented Phase-Locked Loop (PLL) techniques, the device takes a 25 MHz crystal input and produces HCSL (Host Clock Signal Level) differential outputs at 100 MHz clock frequency. LVDS signal levels can also be supported via an alternative termination scheme.Features•Supports PCI-Express TM HCSL Outputs0.7 V current mode differential pair •Supports LVDS Output Levels•Packaged in 8-pin SOIC•RoHS 5 (green ) or RoHS 6 (green and lead free) compliant packaging•Operating voltage of 3.3 V•Low power consumption•Input frequency of 25 MHz•Short term jitter 100 ps (peak-to-peak)•Output Enable via pin selection•Industrial temperature range availableBlock DiagramPin Assignment Pin DescriptionsPin NumberPinNamePinTypePin Description1OE Input Output Enable signal(H = outputs are enabled, L = outputs are disabled/tristated).Internal pull-up resistor.2X1Input Crystal or clock input. Connect to a 25 MHz crystal or single ended clock. 3X2XO Crystal Connection. Connect to a parallel mode crystal.Leave floating if clock input.4GND Power Connect to ground.5IREF Output A 475Ω precision resistor connected between this pin and groundestablishes the external reference current.6CLK Output HCSL differential complementary clock output.7CLK Output HCSL differential clock output.8VDD Power Connect to +3.3 V.Applications Information External ComponentsA minimum number of external components are required for proper operation.Decoupling CapacitorsDecoupling capacitors of 0.01 μF should be connected between VDD and the ground plane (pin 4) as close to the VDD pin as possible. Do not share ground vias between components. Route power from power source through the capacitor pad and then into IDT pin.CrystalA 25 MHz fundamental mode parallel resonant crystal with C L = 16 pF should be used. This crystal must have less than 300 ppm of error across temperature in order for theICS557-01 to meet PCI Express specifications.Crystal CapacitorsCrystal capacitors are connected from pins X1 to ground and X2 to ground to optimize the accuracy of the output frequency.C L= Crystal’s load capacitance in pFCrystal Capacitors (pF) = (C L- 8) * 2For example, for a crystal with a 16 pF load cap, each external crystal cap would be 16 pF. (16-8)*2=16.Current Source (Iref) Reference Resistor - R RIf board target trace impedance (Z) is 50Ω, then R R = 475Ω(1%), providing IREF of 2.32 mA. The output current (I OH) is equal to 6*IREF.Output TerminationThe PCI-Express differential clock outputs of the ICS557-01 are open source drivers and require an external series resistor and a resistor to ground. These resistor values and their allowable locations are shown in detail in thePCI-Express Layout Guidelines section.The ICS557-01can also be configured for LVDS compatible voltage levels. See the LVDS Compatible Layout Guidelines sectionGeneral PCB Layout RecommendationsFor optimum device performance and lowest output phase noise, the following guidelines should be observed.1. Each 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible.2. No vias should be used between decoupling capacitor and VDD pin.3. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. Distance of the ferrite bead and bulk decoupling from the device is less critical.4. An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers (any ferrite beads and bulk decoupling capacitors can be mounted on the back). Other signal traces should be routed away from the ICS557-01.This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device.PCI-Express Layout GuidelinesFigure 1: PCI-Express Device RoutingTypical PCI-Express (HCSL) WaveformLVDS Compatible Layout GuidelinesFigure: LVDS Device RoutingTypical LVDS WaveformAbsolute Maximum RatingsStresses above the ratings listed below can cause permanent damage to the ICS557-01. These ratings are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.DC Electrical CharacteristicsUnless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85°C1 Single edge is monotonic when transitioning through region.2 Inputs with pull-ups/-downs are not included.ItemRatingSupply Voltage, VDD, VDDA 5.5 VAll Inputs and Outputs-0.5 V to VDD+0.5 V Ambient Operating Temperature (commercial)0 to +70°C Ambient Operating Temperature (industrial)-40 to +85°C Storage Temperature -65 to +150°C Junction Temperature 125°C Soldering Temperature 260°CESD Protection (Input)2000 V min. (HBM)ParameterSymbolConditions Min.Typ.Max.UnitsSupply Voltage V 3.135 3.465Input High Voltage 1V IH 2.0VDD +0.3V Input Low Voltage 1V IL VSS-0.30.8V Input Leakage Current 2I IL 0 < Vin < VDD-55μA Operating Supply Current I DD With 50Ω and 2 pF load 55mA I DDOE OE =Low35mA Input Capacitance C IN Input pin capacitance 7pF Output Capacitance C OUT Output pin capacitance 6pF Pin Inductance L PIN 5nH Output Resistance Rout CLK outputs 3.0k ΩPull-up ResistorR PUPOE60k ΩAC Electrical Characteristics - CLK/CLKUnless stated otherwise, VDD=3.3 V ±5%, Ambient Temperature -40 to +85°C1 Test setup is R L =50 ohms with2 pF , R R = 475Ω (1%).2 Measurement taken from a single-ended waveform.3 Measurement taken from a differential waveform.4Measured at the crossing point where instantaneous voltages of both CLKOUT and CLKOUT are equal.5 CLKOUT pins are tri-stated when OE is low asserted. CLKOUT is driven differential when OE is high.Thermal Characteristics (8-pin SOIC)ParameterSymbolConditions Min.Typ.Max.UnitsInput Frequency 25MHz Output Frequency 100MHzOutput High Voltage 1,2V OH 660700850mV Output Low Voltage 1,2V OL-150027mV Crossing Point Voltage 1,2Absolute250350550mV Crossing Point Voltage 1,2,4Variation over all edges140mV Jitter, Cycle-to-Cycle 1,380ps Rise Time 1,2t OR From 0.175 V to 0.525 V 175332700ps Fall Time 1,2t OFFrom 0.525 V to 0.175 V175344700ps Rise/Fall Time Variation 1,2125ps Duty Cycle 1,34555%Output Enable Time 5All outputs 30µs Output Disable Time 5All outputs30µs Stabilization Time t STABLEFrom power-up VDD=3.3 V3.0ms Spread Change Timet SPREAD Settling period after spread change3.0msParameterSymbolConditionsMin.Typ.Max.UnitsThermal Resistance Junction to AmbientθJA Still air150°C/W θJA 1 m/s air flow 140°C/W θJA 3 m/s air flow120°C/W Thermal Resistance Junction to CaseθJC40°C/WMarking Diagram (ICS557M-01LF) Marking Diagram (ICS557MI-01LF)Notes:1. ###### is the lot code.2. YYWW is the last two digits of the year, and the week number that the part was assembled.3. “L ” designates Pb (lead) free packaging.4. “I” denotes industrial temperature.5. Bottom marking: (orgin). Origin = country of origin if not USA.Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95Ordering InformationPart / Order Number Marking Shipping Packaging Package Temperature 557M-01LF See Page 8Tubes8-pin SOIC0 to +70° C557M-01LFT Tape and Reel8-pin SOIC0 to +70° C557MI-01LF Tubes8-pin SOIC-40 to +85° C557MI-01LFT Tape and Reel8-pin SOIC-40 to +85° C"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.Corporate HeadquartersIntegrated Device Technology, For Sales800-345-7015408-284-8200Fax: 408-284-2775For Tech Support/go/clockhelpInnovate with IDT and accelerate your future networks. Contact:www.IDT .com。
FTP-631MCL351 352 煤化纤维热敏打印机参考手册说明书
FTP-631MCL351/352sOVERVIEWThis thermal printer (driven by VDC 24) and cutter provide high speed printing for 3- inch wide paper (85 mm). This printer is small in size, light weight, and has low power consumption. The print head is desined with open construction for easy maintenance.This printer is suitable for the variety of applications, such as POS terminals, ticket machines, label printers, measuring devices and medical equipment.In addition to the interface board, a driving LSI (MCU + Gate Array) is also available.s HIGHLIGHTS•Ultra high speed printingIt can print at 100 mm/s (800 dotlines/s) by using Fujitsu Components' unique head drive control system.•Auto cutterFull or partial cutting are available by normal or reverse rotation of the motor (command set).•Low power consumptionThe peak current for head driving is approximately 2.6 A (at 50mm/s printing speed, 50% printing ratio).•Easy head accessHead-open construction makes head maintenance easy,especially for head cleaning.•Paper auto loading functionThe thermal paper can be loaded without head-up lever operation.•High resolution8 dots/mm head provides clear print output.•Selectable paper pathsFront or rear insertion types are available.24V DRIVE, ULTRA HIGH SPEED LINE THERMAL PRINTER 3” MECHANISM, WITH AVAILABLE CUTTER FTP-631MCL351/352 shown after assembly with FTP-631CT001cutterFTP-621DCL013FTP-621CU102, FTP-633GA101s DESIGNATIONPart number Front paper insertion typeRear paper insertion typeFTP-631MCL351FTP-631MCL352FTP-631CT001FTP-621DCL013FTP-621CU102FTP-633GA101ItemPrinter mechanismMicro Controller UnitGate ArrayLSIInterface boardCutterPrinting method Thermal-sensitive line dot method Dot structure 576 dots/lineDot pitch (Horizontal)0.125 mm (8 dots/mm)—Dot density Dot pitch (Vertical)0.125 mm (8 dots/mm)—Line feed pitch Effective printing area 72 mmNumber of columns 48 columns/line (maximum)—Alphanumeric KANA Maximum printing speed 800 dot lines/s (100 mm/s) maximum JIS ANK :128International characters :130Character typesSemi-graphic :63ASCII small characters :31Download :38424 × 12 dots, (3.0 × 1.5 mm), 48 columns 32 × 16 dots, (4.0 × 2.0 mm), 36 columns 24 × 24 dots, (3.0 × 3.0 mm), 24 columns 32 × 32 dots, (4.0 × 4.0 mm), 18 columns Interface1) Centronics standard 2) Bus interface*1Cutting method Guillotine methodCutting typeFull-cut or partial cut (command set)Minimum cut length 20 mm Paper thickness65 to 150 µms GENERAL SPECIFICATIONSSpecificationsItemCharacter composition, dimensions (H ×W),Number of columns (standard)(Continued)Cutter24 VDC ± 5%, average:*20.55 (0.56) A (at 25 mm/s printing speed, 25% printing ratio)For head0.84 (1.11) A (at 50 mm/s printing speed, 25% printing ratio)3.23 (4.29) A (at 50 mm/s printing speed, 100% printing ratio)(): PeakFor motor 24 VDC ± 5%, 1.0 A maximum For logic5 VDC ± 5%, 0.5 A maximumWeight Mechanism with cutter: approx. 540 g. Interface board: approx. 100 gMechanism + cutter 132 (W) × 60 (D) × 71.0 (H) mm (Excluding connector)Interface board 140 (W) × 89 (D) × 24.0 (H) mmPulse durability :5 × 107 pulse/dot (usingFujitsu Takamisawa's standarddriving method)Wear resistance :50 km (at 12.5% printing ratio)CutterCutting life: 3 × 105 times Operating temperature +5 to +40°C*3Operating humidity 20 to 85% RH (no condensation)Storage temperature –20 to +60°C (excluding paper)Storage humidity 5 to 95% RH (no condensation)Head temperatureBy thermistor (applied energy control, abnormal temperature detection)DetectionPaper out/Mark detect By photointerrupter (command set)Head-upBy microswitch Paper width85 mm 1 ply paper in roll:FTP-030P0020SpecificationsItem(Continued)Power supplyDimensionThermal headLifeEnvironmental condition+0–1Recommended thermal sensitive paper*4*1:The data to be printed is automatically read out by the printer driver equipment memory (host system framememory). The communication is parameter transfer.*2:At 25°C, maximum applied voltage, minimum head resistance, specified paper, stable printing ratio.*3:Temperature range for guaranteed printing density. It can operate at 0 to +40°C.*4:Please contact us for other thermal papers.s DIMENSIONSInterface boards INTERFACE, COMMAND, OPTIONSPlease refer to the FTP-621DCL003/013 DATA SHEET for Interface, Command, and Options.© 2001 Fujitsu Components America, Inc. All company and product names are trademarks or registered trademarks of their respective owners. Rev. 09/2001JapanFujitsu Component Limited Gotanda-Chuo Building3-5, Higashigotanda 2-chome, Shinagawa-ku Tokyo 141, Japan Tel: (81-3) 5449-7010Fax: (81-3) 5449-2626Email:************** Web: North and South AmericaFujitsu Components America, Inc.250 E. Caribbean DriveSunnyvale, CA 94089 U.S.A.Tel: (1-408) 745-4900Fax: (1-408) 745-4970Email:*******************.com Web: EuropeFujitsu Components Europe B.V.Diamantlaan 252132 WV Hoofddorp NetherlandsTel: (31-23) 5560910Fax: (31-23) 5560950Email:***************************.com Web: Asia PacificFujitsu Components Asia Ltd.102E Pasir Panjang Road#04-01 Citilink Warehouse Complex Singapore 118529Tel: (65) 375-8560Fax: (65) 273-3021Email:*****************.com Fujitsu Components International Headquarter Offices。
MBT3560系列-技术资料
5037.5G½A ø11084Z725810087.5084Z7259150137.5084Z7260200187.5084Z7261250237.5084Z7262Temperature sensor with integrated transmitter for industrial applications, MBT 3560Data sheetFeaturesOrdering standard MBT 3560INDUSTRIAL CONTROLS IC.PD.P30.B2.02 - 520B2348• Electrical connection DIN 43650-A, Pg 9• Protection tube ∅ 8 mm• Element Pt 1000, EN 60751, Class B • Process connection G1/4AInsertion length[mm]Electrical connectionTransmitter outputTransmitter setting [C°]Extension length [mm]Code no.50 2 wire 4 to 20 mA 0 to 100None None None None None 084Z4030100084Z4031150084Z4032200084Z4033250084Z403450 2 wire 4 to 20 mA 0 to 2003333333333084Z4035100084Z4036150084Z4037200084Z4038250084Z4039• Designed for use in harsh industrialenviroments where reliable, robust andaccurate equipment is required • Acid-resistant stainless steel enclosure (AISI 316L)• Output signals: 4 - 20 mA or Ratiometric • A wide selection of process and electricalconnections• Ultra compact design• Temperature range -50 °C - +200°CPocket for MBT 3560 standard programmeMBT 3560 Insertion length [mm]Pocket insertion length [mm]Process connectionProtection tube[mm]Code no.Data sheet Temperature sensor with integrated transmitter for industrial application, MBT 35602 IC.PD.P30.B2.02 - 520B2348Main specificationsPressure connections See page 3Measuring ranges Any combinations between −50°C and +200°CMinimum span 25°COutput signals4-20 mA - RatiometricElectrical connectionsSee page 4PerformanceAccuracy< ± 0.5 % FS (typ.)< ± 1 % FS (max.)Response timesWater 0.2 m/st 0.5 = 10 sec t 0.9 = 30 secAir 1 m/st 0.5 = 95 sec t 0.9 = 310 secMax. load protection tube100 barElectrical specificationsNom. Output signal (short-circuit protected)4 to 20 mA ratiometric Supply voltage[U S ] polarity protected 10 to 30 V d.c. 4.75 to 8 V d.c.5 V d.c. (Nom.)Supply - current consumption−< 4 mA at 5 V d.c.Supply voltage dependency < ±0.05% FS/ 10 V −Current limitation 30 mA −Output impedance −< 25 ohmLoad [R L ]R L <(U S -10)/(0.02A) ohm R L > 5 kohm at 5 V d.c.Environmental conditionsMedia temperature (max. 120°C without extension length)−50°C to + 200°C Temperature on electronics 1) −40°C to +85°C Transport temperature range −50°C to 85°C EMC - Emmision EN 61000-6-3EMC - ImmunityEN 61000-6-2Vibration stability Sinusoidal 15.9 mm-pp, 5 Hz-25 Hz4 g, 25 Hz - 2 kHz Random 7.5 g ms, 5Hz - 1 kHzIEC 60068-2-6IEC 600868-2-34, IEC 60068-2-36Shock resistance Shock 500 g/ 1 msFree fallIEC 60068-2-27IEC 60068-2-32Enclosure (depending on electrical connections)See page 4Mechanical characteristicsMaterials:Wetted parts EnclosureW.no. 1.4571 (AISI 316 Ti)W.no. 1.4404 (AISI 316 L)Measuring insertfixed Weight (Depending on design)0.1 to 0.15 kg1)Temperature of the electronics depends on the media temperature, extension length, ambient temperature and air velocity.Technical dataIC.PD.P30.B2.02 - 520B2348 3Data sheet Temperature sensor with integrated transmitter for industrial application, MBT 3560Measuring rangeOutput signalAcid-proof steel, Insertion lengthOrdering,Standard versionsTransmitter setting Process connection 1/4 A 3/8 A Electrical connection= Standard programmeNon-standard build up combinations may be selected. However, minimum order quantities may apply, please contact your local Danfoss office for more informationMBT 3560-® D a n f o s s A /S 10-2005 I C -M C /m heData sheet Temperature sensor with integrated transmitter for industrial application, MBT 35604IC.PD.P30.B2.02 - 520B2348DimensionsElectrical connections。
海思半导体Hi3532 DataBrief(产品简介)
● 软件实现多协议音频编解码 安全引擎 ● 硬件实现AES/DES/3DES加解密算法 ● 数字水印 视频接口 ● 视频输入接口 − 4xBT656@108/144MHz，支持16D1/960H
实时视频输入 − 8xBT656@54/72MHz，支持16D1/960H实
时视频输入 − 8xBT656@27/36MHz，支持8D1/960H实
时视频输入 − 5xBT1120@148.5MHz，支持4路
1080P@30fps或4路720P@30/60fps视频 输入；一路用于Hi3531、Hi3532间视频 数据级联传输 − 8xMutiplexed BT656@148.5MHz，支持8 路720P@30fps视频输入 ● 视频输出接口 − 1xBT1120@148.5MHz视频输出口用于 Hi3531、Hi3532间视频数据级联传输 − 提供1层OSD，格式为RGB1555、 RGB8888可配置，最大分辨率 1920x1080 − 提供1层独立的视频PIP层，实现视频画 中画功能 音频接口 ● 5个标准I2S接口 − 4个支持输入 − 1个支持输入输出 − 每个可支持最大16路16bit音频输入 网络接口 ● 1个MAC接口 − 支持MII模式 − 支持10/100Mbit/s 全双工或半双工模式
测、周界防范、视频诊断等多种智能分析 应用 视频与图形处理 ● 支持de-interlace、图像增强、边缘增强、 3D去噪等前处理功能 ● 支持视频、图形输出抗闪烁处理 ● 支持视频1/16～8x缩放功能 ● 支持图形 1/2～2x缩放功能 ● 8个区域的编码前处理OSD叠加功能 ● 视频层、图形层Alpha叠加功能 音频编解码 ● 硬件实现多协议音频编码，支持ADPCM、 G.711、G.726
微讯VSC8484数据手册：四通道WAN LAN 背板XAUI到SFP+ KR接收器说明书
VSC8484 Datasheet Quad Channel WAN/LAN/Backplane XAUI to SFP+/KRTransceiverMicrosemi HeadquartersOne Enterprise, Aliso Viejo,CA 92656 USAWithin the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136Fax: +1 (949) 215-4996Email: *************************** ©2018 Microsemi, a wholly owned subsidiary of Microchip Technology Inc. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.About MicrosemiMicrosemi, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs andmidspans; as well as custom design capabilities and services. Learn more at .Contents1Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11.1Revision4.4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.2Revision4.3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3Revision4.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.4Revision4.1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.5Revision 4.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.6Revision2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32.1Major Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42.2Features and Benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Functional Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63.1Transmit Operation for XAUI to SFI Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73.2Receive Operation for SFI to XAUI Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83.3PMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83.3.1Supported Data Rates and Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93.3.2Rate Auto-Negotiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93.3.3Receiver (Rx) Subsection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93.3.4Variable Gain Amplifier Input Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93.3.5Rx Equalizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103.3.6Rx Clock and Data Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103.3.7Rx Data Rate Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123.3.8Rx Data Path Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.3.9External Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.3.10VScope Input Signal Monitoring Integrated Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.3.11Unity Gain Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.3.12Link Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.3.13Transmitter (Tx) Subsection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.3.14Tx Data Rate Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143.3.15Tx Data Path Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153.3.1610BASE-KR Output Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153.3.17PMA Loopback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.3.18PMA Linetime . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.3.19External Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183.3.20Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183.3.21Reference Clock Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203.3.22Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203.3.23Synchronous Ethernet Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203.3.24 1.25Gbps Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213.3.25Power Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223.3.26Clock Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223.3.27Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233.4WAN Interface Sublayer (WIS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253.4.1Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253.4.2Section Overhead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283.4.3A1, A2 (Frame Alignment) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293.4.4Loss of Signal (LOS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313.4.5Loss of Optical Carrier (LOPC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313.4.6Severely Errored Frame (SEF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323.4.7Loss of Frame (LOF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323.4.9Z0 (Reserved for Section Growth) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333.4.10Scrambling/Descrambling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333.4.11B1 (Section Error Monitoring) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333.4.12E1 (Section Orderwire) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333.4.13F1 (Section User Channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333.4.14DCC-S (Section Data Communication Channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333.4.15Reserved, National, and Unused Octets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333.4.16Line Overhead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 343.4.17B2 (Line Error Monitoring) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353.4.18K1, K2 (APS Channel and Line Remote Defect Identifier) . . . . . . . . . . . . . . . . . . . . . . . . . . . 353.4.19D4 to D12 (Line Data Communications Channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373.4.20M0 and M1 (STS-1/N Line Remote Error Indication) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373.4.21S1 (Synchronization Messaging) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373.4.22Z1 and Z2 (Reserved for Line Growth) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373.4.23E2 (Orderwire) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373.4.24SPE Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373.4.25Bit Designations within Payload Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383.4.26Pointer Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 393.4.27Pointer Adjustment Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 393.4.28Pointer Increment/Decrement Majority Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 393.4.29Pointer Interpretation States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403.4.30Valid Pointer Definition for Interpreter State Diagram Transitions . . . . . . . . . . . . . . . . . . . . . . 403.4.31Path Overhead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 413.4.32J1 (Overhead Octet) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 423.4.33B3 (STS Path Error Monitoring) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 423.4.34C2 (STS Path Signal Label and Path Label Mismatch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 433.4.35G1 (Remote Path Error Indication) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 433.4.36G1 (Path Status) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 433.4.37F2 (Path User Channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453.4.38H4 (Multiframe Indicator) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453.4.39Z3-Z4 (Reserved for Path Growth) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453.4.40N1 (Tandem Connection Maintenance/Path Data Channel) . . . . . . . . . . . . . . . . . . . . . . . . . . 453.4.41Loss of Code Group Delineation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453.4.42Reading Statistical Counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453.4.43Defects and Anomalies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473.4.44Interrupt Pins and Interrupt Masking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 483.4.45Overhead Serial Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 493.4.46Transmit Overhead Serial Interface (TOSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 493.4.47Receive Overhead Serial Interface (ROSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523.4.48Pattern Generator and Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 3.5Physical Coding Sublayer (64B/66B PCS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533.5.1Control Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 543.5.2Transmit Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 543.5.3Receive Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 553.5.4PCS Standard Test Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563.5.5PCS XGMII BIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 3.6Client/Host Interface (XAUI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 583.6.1XGMII Extender Sublayer (PHY XS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 583.6.2XAUI Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 583.6.3XAUI Receiver Equalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593.6.4XAUI Clock and Data Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593.6.5XAUI Code Group Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593.6.6XAUI Lane Deskew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603.6.710B/8B Decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613.6.88b/10b Encoder and Serializer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613.6.9XAUI Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613.6.10XAUI Transmitter Pre-Emphasis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613.6.12XAUI Failover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623.710GBASE-KR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623.7.1Auto-negotiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623.7.2Technology Ability Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 653.7.3Transmitted Nonce . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 663.7.4Role of Firmware during Auto-negotiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 663.7.5Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 673.7.6Advertised Ability Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 673.7.7Link Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 683.7.8Next Pages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 683.7.9Training . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 683.7.10Coefficient Update Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 693.7.11Status Report Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 703.7.12Training Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713.7.13Role of Hardware and Firmware during Training . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713.7.14Training Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 733.7.15Coefficient Update and Status Report . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 743.7.16BER Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 753.7.17Forward Error Correction (FEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 753.8Loopback and Bypass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763.8.1Loopback Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763.8.2Loopback A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763.8.3Loopback B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763.8.4Loopback F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763.8.5Loopback G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 773.8.6Loopback J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 773.8.7Loopback K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 773.9Low-Speed Serial Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 783.9.1MDIO Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 793.9.2Two-Wire Serial (Master) for Loading Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813.9.3Two-Wire Serial Slave Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 823.9.4UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 833.9.5JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 833.10Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 843.10.1Firmware Load Mode, EEPROM Address Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 843.10.2Default Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 853.11Loading Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 853.11.1EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 853.11.2MDIO and Two-Wire Serial Slave Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 863.12Microcontroller Activity Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 873.13Interrupt Pending Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 873.14Multipurpose GPIO Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 883.15PCS Activity Monitor LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 913.16Temperature Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 924Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .944.1Global Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 944.1.1GPIO Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 974.2Channel Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1724.3EDC Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2864.3.1Hardware DC Offset Correction Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2935Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3035.1DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3035.1.1Low-Speed Inputs and Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3035.1.3MDIO Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3045.2AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3045.2.1Receiver Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3045.2.2Transmitter Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3085.2.3Timing and Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3145.2.4Two-Wire Serial (Slave) Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3145.2.5MDIO Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3155.3Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3165.4Stress Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3186Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3206.1Pin Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3206.2Pins by Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3206.2.1General Purpose Inputs and Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3216.2.2JTAG Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3216.2.3Management Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3226.2.4Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3236.2.5Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3236.2.6Receive Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3246.2.7Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3246.2.8Clock Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3256.2.9Test and Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3256.2.10Transmit Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3266.2.11XAUI Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3266.2.12Reserved . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3297Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3307.1Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3307.2Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3317.3Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3328Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3338.1Sync-E in LAN Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3338.2Sync-E in WAN Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 334 9Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .335。
海思Hi3516 DataBrief(产品简介)
能；支持双sensor输入 ● 输出
− 支持1路CVBS输出，同时提供1个BT.656 输出
雅仪科技——【嵌入式智能互联设备】软硬件方案供应商。 专注【远程智能监控报警系统】研发设计。更多资讯浏览： 获取。
Hi3516 Full-HD IP-Cam SOC
主要特点
处理器内核 ● ARM Cortex A9@Max. 800MHz
− 32KB L1 I-Cache，32KB L1 D-Cache − 256KB L2 Cache 视频编码 ● H.264 Baseline Profile编码 ● H.264 Main Profile编码 ● H.264 High profile编码 ● MPEG4 SP编码 ● MJPEG/JPEG Baseline编码 视频编码处理性能 ● H.264编码可支持最大分辨率为1600万像素 ● H.264&JPEG多码流实时编码能力： − 1080P@30fps+D1@30fps+CIF@30fps＋
5V − DDR2/3 SDRAM接口电压为1.8/1.5V − 工作环境温度为-20℃～+70℃ ● 封装 − FC-CSP封装, 416 pin − 0.65mm管脚间距 − 15mm×15mm封装大小
雅仪科技——【嵌入式智能互联设备】软硬件方案供应商。 专注【远程智能监控报警系统】研发设计。更多资讯浏览： 获取。
QVGA@30fps+1080P JPEG抓拍1fps − 720P@60fps+D1@30fps+CIF@30fps+
GigaVUE HC系列产品数据手册说明书
GigaVUE HC SeriesScalable Traffic Intelligence for Small to Large Enterprises and Service ProvidersKey BenefitsThe GigaVUE HC series consists of three models: GigaVUE-HC1, GigaVUE-HC2, and GigaVUE-HC3.Management, Integration, and InstallationSmall footprint with low space, power and cooling needs Modular for flexibility and scalability as needs change Rapid programmatic response to detectable events Advanced integration with tools, controllers and other infrastructure systemsTraffic Forwarding for Network and Security Operations Optimize the delivery of your network traffic to your monitoring and security tools, enabling:• Eliminating contention for network data access• Targeting specific flows to specific tools with network and application awareness• Sharing traffic load across multiple tools’ instances, even for encapsulated trafficSelectively aggregate and replicate traffic at line rate Optimize the content of the delivered traffic, enabling:• Removing duplicate packets• Feeding non-packet based tools with flow and/or rich meta data• Removing unwanted/undesirable protocol headers and/or payload content• Obfuscating private or sensitive dataReuse existing tools for current and new network links Scale network coverage and tool deployment, with USB MGMT PTP CON RDY PTPPPS FAN PWRM/SSTACK STACK P/S PPS(IN)RDY POWERH/SSMT-HC3-C05C5C4C3C2C1RDYPOWERH/SPRT-HC3-X24X1/X2X3/X4X5/X6X7/X8X9/X10X11/X12X13/X14X15/X16X17/X18X19/X20X21/X22X23/X24RDY POWERH/SPRT-HC3-X24X1/X2X3/X4X5/X6X7/X8X9/X10X11/X12X13/X14X15/X16X17/X18X19/X20X21/X22X23/X24RDYC1C2C3C4C5C6C7C8POWERH/SPRT-HC3-C08Q08X1/X2RDY PWR FAN PTP PPS M/SStack/PTP Mgnt / Con G1 / G2G3 / G4USB X3/X4X5/X6X7/X8X9/X10X11/X12TAP1TAP2TAP3TAP4RDY POWER ON/OF TAP1TAP2TAP3TAP4RDYPOWER ON/OF Fan PPS RearRdy PwrM/SLockPTPIEEE 1588StackMgmt PortMgmtCon-soleGigaVUE-HC211234T A P H C 0G 100C 0RdyPwrTAP 1TAP 2TAP 3TAP 4TAP 5TAP 6TAP 7TAP 8TAP 9TAP 10TAP 11TAP 12X1X2RdyPwr S M T H C 0X 16X3X4X5X6X7X8X9X10X11X12X13X14X15X16H/SX1X2RdyPwr B P S H C 0D 25A 4GX3X4X5X6X7X8X9X10X11X12X13X14X15X16SX / SR50 umP R T H C 0Q 06Rdy Pwr Q1LNK ENA Q1LNK ENA Q1LNK ENA Q1LNK ENA Q1LNK ENA Q1LNK ENAAs a key product family within the Gigamon Visibility and Analytics Fabric™, the GigaVUE HC series enables comprehensive traffic and security intelligence at scale. These next-generation network packet brokers are an ideal choice to enhance your security and monitoring solutions.inline and out-of-band security and monitoring tools.GigaVUE HC Series is used to provide visibility for active and passive security as well as network and application monitoring.The GigaVUE HC Series Modelsacross medium-sized branch offices.GigaVUE-HC3A 3RU form factor offers trafficintelligence at scale to meet thedemands of large enterprises andservice providers.GigaVUE-HC3GigaVUE-HC3Key Features and BenefitsNetwork and Traffic Access Three modular chassis models with portspeed and media options:• 100Mb, 1000Mb and 10Gb copper• 1Gb, 10Gb, 25Gb, 40Gb and 100Gbmultimode and single-mode fiberCompatible with SFP, SFP+, QSFP+ andQSFP28 MSA-compliant transceivers,as offered by Gigamon • Scale from low to high density systems:–Cost-effective for only whatis needed–Increased flexibilityPort configurability:• Full flexibility in selecting ports as ingress, intermediate, interconnect or egress functions• Unidirectional and bi-direction ports • Tunneling (e.g. L2GRE, ERSPAN, TCP, VXLAN)• Enable agile response to changes in monitoring infrastructure and monitoring needs• Facilitate passive out-of-band and active inline monitoring via the same HC node• Allow virtualized traffic to be accessed, or backhauled between locations, over an IP network – and with reliable delivery (using TCP)Core Intelligence Flow Mapping®:• Aggregation and replication–Selective any-to-any port mapping• Filtering–Layer 2 to 7 rules–Ingress aggregate and egress• Load-balancing–Layers 2 to 4 hashing criteria–Session stickiness • Access traffic from any link to any tool, even for different link rates• Remove issues with asymmetric routing and link aggregation (LAG)• Optimize tools by forwarding only traffic of interest or dropping traffic not of interest• Spread load across multiple tool instances of same typeInline Bypass:• Optional physical bypass for100M/1G/10G/25G/40G/100G link rates and copper/fiber (multimode, single mode) media types• Aggregate multiple network segments • Filter and load-balance towards inline applications/tools• Easily configure simple and complex tool chains• Customizable heartbeat packets for positive (through-path) and negative (block) tests • Remove multiple points of network failure• Provide full visibility for each inline security tool type (e.g. IPS, WAF)• Easily deploy security in layers solutions, for both active and passive scenarios• Seamlessly migrate tools from passive out-of-band to active inline mode • Reduce likelihood of network impact due to malfunctioning active inline toolsVLAN port tagging• Pinpoint source of traffic Clustering and Fabric Mapping• Enable resilient traffic forwarding• Manage up to 32 nodes in a cluster asa single virtual node• Enact end-to-end Flow Mapping,across clusters, scaling to hundredsof nodesTraffic Intelligence Adaptive packet filtering, Advancedload-balancing, Deduplication, Headerstripping, Masking, NetFlow generation,Slicing, SSL/TLS decryption, Advancedtunneling, Advanced flow slicing Refer to the GigaSMART® datasheet found hereApplication Intelligence Application Filtering, ApplicationMetadata, Video Data Records Refer to the GigaSMART datasheet found hereSubscriber Intelligence Flow Sampling, GTP Correlation,SIP/RTP Correlation, 5G & CUPScorrelation, Subscriber-aware Metadata*Refer to the GigaSMART datasheet found hereNetwork Detection ThreatINSIGHT Sensor Refer to the GigaSMART datasheetfound hereManagement Local and remote management using:• Command line interface (CLI)(T elnet/SSH)• Web GUI (HTTP/HTTPS)• XML API (HTTP/HTTPS)• Fabric Manager (HTTP/HTTPS)• SNMP (v1, v2, v3)• Syslog • Easy to manage via a web GUI or via CLI for users already familiarwith Cisco• Easy integration with applications using CLI or RESTful API• Support SDN paradigm• Manage and orchestrate from single pane of glass• Alerts can be received by any Syslog server or SNMP managerUser access:• Role-based Access Control (RBAC) –Multi-tenant user access–Flexible user/role definedprivileges, screen viewsand access• AAA security with local and remote authentication (LDAP, RADIUS, TACACS+)• Adhere to corporate IT security policies• Meet corporate IT authentication policySystem Field replaceable hardware:• Port modules• AC and DC power supplies• Fan trays• Control card • Achieve five nines highly available uptime• Without needing to replace or remove the chassis, you can:–Scale as needs change–Upgrade features and capabilitiesMetrics and statistics:• Management CPU resources • Switching ASIC resources • Port utilization• Flow map throughput • Facilitate troubleshooting• Guide capacity planning and traffic forward rules* Available with 5.11 releaseChassis Maximum CapabilitiesATTRIBUTE GIGAVUE-HC1GIGAVUE-HC2GIGAVUE-HC3 Size Small (1RU)Medium (2RU)Large (3RU) Throughput604Gbps960Gbps 6.4Tbps No. of port modules244No. of GigaSMART modules 3 (2 front, 1 built-in) 5 (4 front, 1 rear) 4 (front) No. of GigaSMART engines358 (2 per module) No. of ports and speeds10/100Mb20 (4 built-in UTP)72***-1Gb40 (12 built-in SFP+ and 4built-in UTP)96-10Gb36 (12 built-in SFP+)9612825Gb--12840Gb82464100Gb-8‡64Physical bypass options10/100/1000Mb copper,1/10Gb SX/SR Fiber 10/100/1000Mb copper,1/10Gb SX/SR Fiber,1/10Gb LX/LR Fiber,40Gb SR4 Fiber40/100Gb SR4 Fiber,10/25Gb SR Fiber(using breakout),40/100Gb LR4 Fiber*** Using module with SKU TAP-HCO-G100C0Field Swappable Port and GigaSMART ModulesPRODUCT DESCRIPTIONGigaVUE-HC1 Modules PRT-HC1-X1212 x 1Gb/10Gb (SFP/SFP+) portsPRT-HC1-Q04X08* 4 x 40Gb (QSFP+) & 8 x 1Gb/10Gb (SFP/SFP+) ports• QSFP+ Port Modes: 1 x 40Gb or 4 x 10GbBPS-HC1-D25A241Gb/10Gb Bypass combo module• 2 pairs of SX/SR 50/125μm Bypass + 4 x 10Gb/1Gb(SFP+/SFP) ports• 100Mb/1000Mb embeddedTAP-HC1-G10040TAP and Bypass module• 4 pairs of copper (RJ-45) TAP or Bypass• Each pair can be individually configured as TAPor Bypass• 100Mb/1000Mb embeddedSMT-HC1-S Third generation GigaSMART front module with:• One GigaSMART engine• No front portsRefer to the GigaSMART datasheet found here formore informationGigaVUE-HC2 Modules PRT-HC0-X2424 x 10Gb/1Gb (SFP+/SFP) ports modulePRT-HC0-Q06 6 x 40Gb (QSFP+) ports modulePRT-HC0-C02 2 x 100Gb (QSFP28) ports module• Supports 100GBASE-SR4• PRT-HC0-C02 requires Control Card Version 2• 40Gb Bypass and 1Gb/10GbBPS-HC0-Q25A28Combo module• 2 pairs of 40G SR4 Bypass + 8 x 10Gb/1Gb (SFP+/SFP)ports• 1Gb/10Gb BypassBPS-HC0-D25A4G Combo module• 4 pairs of SX/SR 50/125μm Bypass + 16 x 10Gb/1Gb(SFP+/SFP) ports• 1Gb/10Gb BypassBPS-HC0-D35C4G Combo module• 4 pairs of LX/LR single-mode Bypass + 16 x 10Gb/1Gb(SFP+/SFP) ports• 1Gb/10Gb Bypass* Available with 5.11 releaseGigaVUE-HC2 Modules TAP-HC0-D25AC0TAP module• 12 x SX/SR 50/125μm TAP pair• 50/50 split ratio• 1Gb/10Gb embeddedTAP-HC0-D25BC0TAP module• 12 x SX/SR 62.5/125μm TAP pair• 50/50 split ratio• 1Gb/10Gb embeddedTAP-HC0-D35CC0TAP module• 12 x LX/LR TAP pair• 50/50 split ratio• 1Gb/10Gb embeddedTAP-HC0-G100C0TAP and Bypass module• 12 x copper (RJ-45) TAP or Bypass pair• Each pair can be individually configured as TAP or Bypass• 100Mb/1000Mb embeddedSMT-HC0-Q02X081Second generation GigaSMART front module with:• One GigaSMART engine• 2 x 40Gb (QSFP+), 8 x 10Gb/1Gb (SFP+/SFP) portsRefer to the GigaSMART datasheet found here formore informationSMT-HC0-X16First generation GigaSMART front module with:• One GigaSMART engine• 16 x 10Gb/1Gb (SFP+/SFP) portsRefer to the GigaSMART datasheet found here formore informationSMT-HC0-R First generation GigaSMART rear module with:• One GigaSMART engine• No portsRefer to the GigaSMART datasheet found here formore information1 SMT-HC0-Q02X08 requires Control Card Version2 (CTL-HC0-002)GigaVUE-HC3 Modules PRT-HC3-C16216 x 100Gb/40Gb (QSFP28/QSFP+) ports module• Port Modes: 1 x 100Gb/40Gb, 4 x 25Gb1 or 4 x 10Gb1PRT-HC3-C08Q088 x 100Gb QSFP28 ports module• Port Modes: 1 x 100Gb, 2 x 40Gb, 4 x 25Gb1, 2 or4 x 10Gb1PRT-HC3-X2424 x 25Gb2/10Gb (SFP28/SFP+) ports module• Port Modes: 1 x 25Gb/10GbBPS-HC3-C25F2G100Gb/40Gb/25Gb/10Gb Bypass combo module• 2 x 100Gb/40Gb SR4 Bypass pairs• Up to 8 x 10Gb SR Bypass pairs• 16 x 25Gb2/10Gb (SFP28/SFP+) portsBPS-HC3-Q35C2G40Gb/25Gb/10Gb Bypass combo module• 2 x 40Gb LR4 Bypass pairs• 16 x 25Gb2/10Gb (SFP28/SFP+) portsBPS-HC3-C35C2G100Gb/40Gb/25Gb/10Gb Bypass combo module• 2 x 100Gb LR4 Bypass pairs• 16 x 25Gb2/10Gb (SFP28/SFP+) portsSMT-HC3-C05GigaSMART front module with:• Two GigaSMART engines• 5 x 100Gb QSFP ports• Port Modes: 1 x 100Gb, 1 x 40Gb, 4 x 25Gb1, 2 or4 x 10Gb1Refer to the GigaSMART® datasheet found here formore information.1 Requires MPO-to-4xLC breakout cable or the PNL-M341 or PNL-M343 modules for G-TAP M Series2 Requires Control Card Version 2 (CTL-HC3-002)Physical Dimensions and WeightsPRODUCT NAME HEIGHT WIDTH DEPTH WEIGHTGigaVUE-HC1GigaVUE-HC1base chassis(includes built-insecond generationGigaSMART engine)1.75in (4.5cm)17.26in (43.85cm)without ears19.5in (495mm)With PSU handleand card ejector:20.92in (53.18 cm)20.88lbs (9.47kg)With ears: 21.12lbs(9.58kg)PRT-HC1-X12 1.6in (4.10cm) 4.65in (11.8cm)10.13in (24.98cm) 1.50lbs (0.68kg) PRT-HC1-Q04X08 1.6in (4.10cm) 4.65in (11.8cm)10.13in (24.98cm) 1.50lbs (0.68kg) BPS-HC1-D25A24module1.6in (4.10cm) 4.65in (11.80cm)10.13in (24.98cm)2.2lb (0.99kg)TAP-HC1-G10040module1.6in (4.10cm) 4.65in (11.8cm)10.13in (24.98cm) 1.50lbs (.68kg) SMT-HC1-S* 1.6in (4.10cm) 4.65in (11.80cm)10.13in (24.98cm)2.54lb (1.15kg)GigaVUE-HC2GigaVUE-HC2base chassis 2RU3.5in (8.9cm)17.26in (43.85cm)without ears24.2in (61.6cm)without cablemanagement27.0in (68.6cm)with cablemanagement36.8lbs (16.7kg)PRT-HC0-X24module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm)2.12lbs (0.96kg)PRT-HC0-Q06module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm)2.40lbs (1.09kg)PRT-HC0-C02module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm)2.30lbs (1.09kg)BPS-HC0-Q25A28 module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.14lbs (1.42kg)BPS-HC0-D25A4G module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.60lbs (1.63kg)BPS-HC0-D25B4G module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.60lbs (1.63kg)BPS-HC0-D35C4G module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.60lbs (1.63kg)TAP-HC0-D25AC0 module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.50lbs (1.59kg)TAP-HC0-D25BC0 module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.50lbs (1.59kg)TAP-HC0-D35CC0 module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.50lbs (1.59kg)TAP-HC0-G100C0module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.20lbs (1.45kg) * Available with 5.10 releasePRODUCT NAME HEIGHT WIDTH DEPTH WEIGHT GigaVUE-HC2SMT-HC0-Q02X08module1.6in (4.1cm)8.0in (20.3cm)10.2in (26.0cm) 4.1lbs (1.86kg)SMT-HC0-X16module1.6in (4.1cm)8.0in (20.3cm)10.2in (26.0cm) 4.40lbs (2.00kg)SMT-HC0-Rmodule1.6in (4.1cm)9.3in (23.5cm)13.2in (33.6cm) 4.40lbs (2.00kg)0GigaVUE-HC3GigaVUE-HC3base chassis 3RU5.25in (13.34cm)17.26in (43.85cm)without ears29.1in (74.0cm)without cablemanagement33.5in (85.0cm)with cablemanagement88.0lbs (40.00kg)PRT-HC3-C16module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.00lbs (2.72kg)PRT-HC3-C08Q08 module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm)2.40lbs (1.09kg)PRT-HC3-X24module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm)2.12lbs (0.96kg)BPS-HC3-C25F2Gmodule1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.40lbs (2.90kg)BPS-HC3-Q35C2G module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.05lbs (2.74kg)BPS-HC3-C35C2G module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.05lbs (2.74kg)SMT-HC3-C05module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 4.40lbs (2.00kg) Power SpecificationsPRODUCT LINE COMPONENT SPECIFICATIONSGivaVUE-HC1Power Configurations• 1 + 1 Power: 2 Power Supply ModulesMax power consumption/heat output • 212 Watts; 722.9 BTU/hr• Fully populated system with all ports at 100 percent traffic loadAC power supply modules • Min/max voltage: 100V–127V AC, 200V–240V AC, 50/60Hz • Max PSM input current: 5.8A @ 100V, 2.9A @ 200VDC power supply modules • Min/max voltage: -40.5V to -60V DC • MaxPSMinputcurrent:**********PRODUCT LINE COMPONENT SPECIFICATIONS GivaVUE-HC2Power configurations• 1 + 1 power: 2 power supply modulesMax power consumption/heat output • 960 Watts; 3276 BTU/hr (Control Card Version s 1 and 2)• Fully populated system with all ports at 100 percent traffic loadAC power supply modules• Min/max voltage: 100V–240V AC, 50/60Hz, 8.4A @ 200 V• Max PSM input current: 14.0A @ 100VDC power supply modules• Min/max voltage: -36V to -72V DC• Max PSM input current: 35A @ -36VGivaVUE-HC3Power configurations• 1 + 1 power: 2 power supply modules• 2 + 2 power: 4 power supply modulesMax power consumption/heat output • 1850 Watts; 6312.4 BTU/hr (Control Card Version 1)• 2000 Watts; 6824.3 BTU/hr (Control Card Version 2)• Fully populated system with all ports at 100 percent traffic loadAC power supply modules • Min/max voltage: 100V–115V AC, 200V–240V AC, 50/60Hz • Max PSM input current: 14A @ 100V, 10A @ 200VDC power supply modules• Min/max voltage: -40V to -72V DC• Max PSM input current: 48A @ -40VEnvironmental SpecificationsASPECT SPECIFICATIONSOperating temperature32.F to 104.F (0.C to 40.C)Operating relative humidity20–80 percent, non-condensing Recommended storage temperature-4.F to 158.F (-20.C to 70.C) Recommended storage relative humidity15–85 percent, non-condensing Altitude Systems: Up to 13,000 ft (3.96km)Power Supply Modules: Up to 10,000 ft (3.05km)Standards and ProtocolsTYPE STANDARDSProtocols IEEE 802.3-2012, IEEE 802.1Q VLAN, IEEE 802.3 10BASE-T, IEEE 802.3u 100BASE-TX, IEEE 802.3ab 1000BASE-T, IEEE 802.3z 1000BASE-X, IEEE 802.3ae 10000BASE-X, IEEE 802.3ba, RFC 783 TFTP, RFC 791IP, RFC 793 TCP, RFC 826 ARP, RFC 854 T elnet, RFC 768 UDP, RFC 792 ICMP, SNMP v1/v2c & v3, RFC 2131DHCP client, RFC 1492 TACACS+, and support for IPv4 and IPv6ComplianceASPECT GIGAVUE STANDARDSafety HC1UL 60950-1; CSA C22.2 EN 60950-1; IEC-60950-1:2005(2nd Edition) + Am 1:2009 +Am 2:2013HC2UL 60950-1; CSA C22.2 EN 60950-1; IEC-60950-1HC3UL 60950-1, 2nd Edition; CAN/CSA C22.2 No. 60950-1-07, 2nd Edition;EN 60950-1:2006/ A11:2009/ A1:2010/A12:2011/A2:2013; IEC 60950-1:2005(2nd Edition) + Am 1:2009 + Am 2:2013Emissions HC1FCC Part 15, Class A; VCCI Class A; EN55022/CISPR-22 Class A; Australia/New ZealandAS/NZS CISPR-22 Class A: RCM; EU: CE Mark EN 55022 Class A, China CCC, TaiwanBSMI, Korea KCC, Russia EACHC2FCC Part 15, Class A; VCCI Class A; EN55022/CISPR-22 Class A; Australia/New ZealandAS/NZS CISPR-22 Class A; CE Mark EN 55022 Class A, China CCC, Taiwan BSMI,Korea KCC, Russia EACHC3FCC Part 15, Class A; VCCI Class A; EN55022/CISPR-22 Class A; Australia/New ZealandAS/NZS CISPR-22 Class A; EU:CE Mark EN 55022 Class A; Taiwan BSMI, Korea KCC,Russia EACImmunity HC1ETSI EN300 386 V1.3.2, EN61000-4-2, EN 61000-4-3, 61000-4-4, EN 61000-4-5, EN61000-4-6, EN 61000-3-2HC2HC3ETSI EN300 386 V1.6.1:2012; EN61000-3-2; EN61000-3-3; EN61000-4-2; EN61000-4-3; EN61000-4-4; EN61000-4-5; EN61000-4-6; EN61000-4-8; EN61000-4-11 Environment HC1RoHS 6: EU directive 2002/95/ECHC2HC3EU RoHS 6, EU Directive 2011/65/EU; 2006/1907/EC (REACH); ISTA 2ANEBS HC1Level 3 (GVS-HC102/2)HC2Level 3 (GVS-HC2A1/2)HC3Level 3 (GVS-HC301/2)Security HC1FIPS 140-2HC2FIPS 140-2, UC APL, Common CriteriaHC3FIPS 140-2PRODUCT CATEGORY PART NUMBER DESCRIPTIONBase Hardware GVS-HC101GigaVUE-HC1 node, 12 1G/10G cages, 4 10/100/1000M copper, fan tray,2 power supplies, AC powerGVS-HC102 GigaVUE-HC1 node, 12 1G/10G cages, 4 10/100/1000M copper, fan tray,2 power supplies, DC powerBPS-HC1-D25A24Bypass Combo Module, GigaVUE-HC1, 2 SX/SR 50/125 BPS pairs,4 10G cagesTAP-HC1-G10040TAP and Bypass module, GigaVUE-HC1, 10/100/1000M copper,4 TAPs or BPC pairsPRT-HC1-X12Port Module, GigaVUE-HC1, 12x10G/1G SFP+/SFPPRT-HC1-Q04X08*Port Module, GigaVUE-HC1, 4x40G QSFP+ and 8x10G SFP+ cagesSMT-HC1-S GigaSMART, HC Series, Front Module w/o ports (includesSlicing, Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW) Licenses-Refer to the GigaSMART® datasheet found here for more information.Fan and Power Supplies FAN-TAXQ0GigaVUE-TA10, TA40, HC1 fan assembly, each (2 required on TA10,3 on TA40 and HC1)PWR-TAXQ1Power Supply Module, GigaVUE-TA10, TA40, or HC1, AC, each PWR-TAXQ2Power Supply Module, GigaVUE-TA10, TA40, or HC1 DC, each* Available with 5.11 releasePRODUCT CATEGORY PART NUMBER DESCRIPTIONBase Hardware GVS-HC2A1GigaVUE-HC2 base unit with chassis, Control Card Version 2, 1 fan Tray, CLI,2 power supplies, AC powerGVS-HC2A2GigaVUE-HC2 base unit with chassis, Control Card Version 2, 1 fan tray, CLI,2 power supplies, DC powerCTL-HC0-002Control Card Version 2, GigaVUE-HC2PRT-HC0-X24Port Module, HC Series, 24x10GPRT-HC0-Q06Port Module, HC Series, 6x40GPRT-HC0-C02Port Module, HC Series, 2x100G QSFP28 cages. Requires Control CardVersion 2BPS-HC0-D25A4G Bypass Combo Module, HC Series, 4 SX/SR 50/125 BPS pairs, 16 10G cagesBPS-HC0-D25B4G Bypass Combo Module, HC Series, 4 SX/SR 62.5/125 BPS pairs,16 10G cagesBPS-HC0-D35C4G Bypass Combo Module, HC Series, 4 LX/LR BPS pairs, 16 10Gb cagesBPS-HC0-Q25A28Bypass Combo Module, GigaVUE-HC2, 2 40G SR4 BPS pairs, 8 10G cagesTAP-HC0-D25AC0TAP module, HC Series, SX/SR Internal TAP module 50/125, 12 TAPsTAP-HC0-D25BC0TAP module, HC Series, SX/SR Internal TAP module 62.5/125, 12 TAPsTAP-HC0-D35CC0TAP module, HC Series, LX/LR Internal TAP module, 12 TAPsTAP-HC0-G100C0TAP and Bypass Module, HC Series, copper, 12 TAP or BPS pairsSMT-HC0-Q02X08GigaSMART, HC Series, Front Module, 2 40Gb, 8 10Gb cages (includesSlicing, Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW) SMT-HC0-R GigaSMART, HC Series, Rear Module (includes Slicing, Masking, Source Portand GigaVUE Tunneling De-Encapsulation SW)SMT-HC0-X16GigaSMART, HC Series, Front Module, 16 10Gb cages (includes Slicing,Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW) Licenses-Refer to the GigaSMART® datasheet found here for more information.Fan and Power Supplies FAN-HC200GigaVUE-HC2 fan assembly, each (1 required) PWR-HC201Power supply module, GigaVUE-HC2, AC PWR-HC202Power supply module, GigaVUE-HC2, DC© 2019-2021 Gigamon. All rights reserved. Gigamon and the Gigamon logo are trademarks of Gigamon in the United States and/or other countries. Gigamon trademarks can be found at /legal-trademarks . All other trademarks are the trademarks of their respective owners. Gigamon reserves the right to change, modify, transfer, or otherwise revise this publication without notice.Worldwide Headquarters 3300 Olcott Street, Santa Clara, CA 95054 USA +1 (408) 831-4000 | PRODUCT CATEGORY PART NUMBERDESCRIPTION Base HardwareGVS-HC301GigaVUE-HC3 base unit with chassis, Control Card, 5 fan modules, CLI, 2 power supplies, AC power GVS-HC302GigaVUE-HC3 base unit with chassis, Control Card, 5 fan modules, CLI, 2 power supplies, DC power GVS-HC3A1GigaVUE-HC3 base unit with chassis, Control Card v2, 5 fan modules, CLI, 2 power supplies, AC power GVS-HC3A2GigaVUE-HC3 base unit with chassis, Control Card v2, 5 fan modules, CLI, 2 power supplies, DC power CTL-HC3-002Control Card Version 2, GigaVUE-HC3, each PRT-HC3-C16Port Module, GigaVUE-HC3, 16x100G QSFP28 cages PRT-HC3-C08Q08Port Module, GigaVUE-HC3, 8x100G QSFP28 cages and 8x40G QSFP+ cages PRT-HC3-X24Port Module, GigaVUE-HC3, 24x10G BPS-HC3-C25F2GBypass Combo Module, GigaVUE-HC3, 2 40/100Gb SR4 BPS pairs, 16 10G cages BPS-HC3-Q35C2GBypass Combo Module, GigaVUE-HC3, 2 40Gb LR BPS pairs, 16 10G cages BPS-HC3-C35C2GBypass Combo Module, GigaVUE-HC3, 2 100Gb LR BPS pairs, 16 10G cages SMT-HC3-C05GigaSMART, GigaVUE-HC3, 5x100G QSFP28 cages(includes Slicing, Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW)Licenses -Refer to the GigaSMART® datasheet found here for more information.Fan and Power Supplies FAN-HC300GigaVUE-HC3 fan assembly, each (5 required)PWR-HC301Power supply module, GigaVUE-HC3, AC (each)PWR-HC302Power supply module, GigaVUE-HC3, DC (each)Support and ServicesGigamon offers a range of support and maintenance services. For details regarding the Gigamon Limited Warranty and our product support and software maintenance programs, visit /support-and-services/overview-and-benefits . For More InformationFor more information about the Gigamon Platform or to contact your local representative, please visit: .Learn more or get a demo: /contact-us。
HIH6130-021-001;HIH6131-021-001;中文规格书,Datasheet资料
Total Error Band should not be confused with “Accuracy”, which is actually a component of Total Error Band. Many competitors simply specify the accuracy of their device; however, the specification may exclude hysteresis and temperature effects, and may be calculated over a very narrow range, at only one point in the range, or at their absolute best accuracy level. It is then up to the customer to calibrate the device to make sure it has the accuracy needed for the life of the application. Honeywell’s industry-leading Total Error Band provides the following benefits to the customer: Eliminates individually testing and calibrating every sensor, which can increase their manufacturing time and process Supports system accuracy and warranty requirements Helps to optimize system uptime Provides excellent sensor interchangeability—the customer can remove one sensor from the tape, remove the next sensor from the tape, and there is no part-to-part variation in accuracy For more information about Total Error Band, please see the related Technical Note “Explanation of the Total Error Band Specification for Honeywell’s Digital Humidity/Temperature Sensors.”
广州爱普电子技术有限公司产品说明书
Typical Features◆Wide input voltage range:85-265VAC/120-380VDC◆No-load power consumption≤≤0.5W◆Transfer efficiency（typ.87%）◆Switching frequency:65KHz◆Protection:Short Circuit,Over Current◆Isolation voltage:2500Vac◆Plastic case,conform to UL94V-0Class◆PCB mountingApplication FieldFA24-220SXXG3N3Series-----a compact size,high efficient power converter offered by Aipu.It features universal input voltage,DC and AC dual-use,low ripple,low temperature rise,low power consumption, high efficiency,high reliability,safer isolation,with good EMC performance.EMC and Safety standard meet international EN55032,IEC/EN61000.It widely used in power,industrial,instrument,smart home applications.For harsh EMC environment,the application circuit in the datasheet is strongly recommended.Typical Product ListPart No.Output SpecificationMax.Capacitive LoadRipple&Noise20MHz（Max）Efficiency@Full Load220Vac(Typical) Power Voltage1Current1Voltage2Current2（W）Vo1（V）Io1（m A）Vo2（V）Io2（m A）u F mVp-p%FA24-220S12G3N32412.02000--200015085 FA24-220S15G3N32415.01600--20008086 FA24-220S24G3N324241000--80010087 Note1:Ripple&Noise of FA24-220S15G3N3,FA24-220S24G3N3should be tested with EMC solution recommended circuit,please see photo1at back.Note2:Due to space limitations,above is only a part of our product list,please contact our sales team for more items.Note3:.”*”is model under developing.Note4:The typical output efficiency is based on that product is full loaded and burned-in after half an hour.Note5:The fluctuation range of full load efficiency(%,TYP)is±2%,full load output efficiency=total output power/module’s input power.Input SpecificationItem Operating Condition Min.Typ.Max.UnitInput Voltage Range AC Input85220265VAC DC Input120310380VDCInput Frequency Range-475063HzInput Current 115VAC//250mA 220VAC//150Surge Current 115VAC//10 220VAC//20Leakage Current-0.5mA TYP/230VAC/50HzExternal fuserecommended value-2A-5A/250VAC slow-fusing Hot plug-UnavailableRemote control terminal-UnavailableOutput SpecificationItem Operating Condition Min.Typ.Max.UnitVoltage Accuracy Full input voltagerangeAny loadVo1--±2.0%Vo2---%Line Regulation Nominal Load Vo1--±2.0% Vo2---%Load RegulationNominal inputVoltage20%~100%loadVo1--±2.0%Vo2---%No load power consumption Input115VAC--0.5W Input220VAC--Minimum loadSingle Output0--% Positive Negative Dualoutput commongrounded---% Positive Negative Dualoutput isolated---Turn-on Delay Time Nominal input voltage,fullload-300-mSPower-off Holding Time Input115VAC(full load)-65-mS Input220VAC(full load)--Output Overshooting Full input voltage range(full load)--10%Dynamic Response 25%~50%~25%50%~75%~50%Overshoot range（%）：≤±5%%Recovery time（mS）：≤5.0mS mSShort Circuit Protection Input full voltage range Continuous,Self-recovery Hiccup Drift Coefficient--±0.03%-%/℃Over Current Protection Input220VAC≥120%Io,Self-recovery HiccupRipple&Noise Vo=12.0V≤150mV Vo=15.0V≤80mVVo=24.0V≤100Note:Ripple&Noise is tested by Twisted Pair Method,details please see Ripple&Noise Test at back. General SpecificationsItem Operating Condition Min.Typ.Max.Unit Switching Frequency-606570KHz Operating Temperature--40-+75℃Storage Temperature--40-+85Relative Humidity-10-90%RHIsolation Voltage Input-Output,Test1min,leakage current≤5mA2500--VACInsulation Resistance Input-Output@DC500V100--MΩMTBF-≥300,000H@25℃Vibration-10-55Hz,10G,30Min,alongX,Y,ZClass of Case Material-UL94V-0EMC CharacteristicsTotal Item Sub Item Test Standard ClassEMC EMICE CISPR22/EN55032CLASS B（see recommended circuit Photo2）RE CISPR22/EN55032CLASS B（see recommended circuit Photo2）EMSRS IEC/EN61000-4-310V/m Perf.Criteria BCS IEC/EN61000-4-63Vr.m.s Perf.Criteria BESD IEC/EN61000-4-2Contact±4KV/Air±8KV Perf.Criteria BSurge IEC/EN61000-4-5±1KV Perf.Criteria B（see recommendedcircuit Photo2）EFT IEC/EN61000-4-4±2KV Perf.Criteria BVoltage dips,shortinterruptions and voltagevariations immunityIEC/EN61000-4-110%~70%Perf.Criteria BPacking DimensionPacking Code L x W x HG339.0x25.0x22.0mmPin DefinitionPin-out12345Single（S）AC(N)AC(L)GND NP+VoNote:If the definition of pin is not in accordance with the model selection manual,please refer to the label on actual item. Ripple&Noise Test:(Twisted Pair Method20MHZ bandwidth)Test Method:(1)12#twisted pair to connect,Oscilloscope bandwidth set as20MHz,100M bandwidth probe,terminated with0.1uFpolypropylene capacitor and10uF high frequency lowresistance electrolytic capacitor in parallel,oscilloscope set asSample pattern.(2)Input terminal connect to power supply,output terminalconnect to electronic load through jig plate,Use30cm±2cmsampling line.Power line selected from correspondingdiameter wire with insulation according to the flow of outputcurrent.Product Characteristic CurveNote1:Input Voltage should be derated base on Input Voltage Derating Curve when it is85~100VAC/240~265VAC/120~140VDC/340~380VDC.2:Our product is suitable to use under natural air cooling environment,if use it under closed condition,please contact with us. Typical EMC Circuit and Recommended Spec1.Typical Application CircuitPart No.CE1L1CE2TVS1FA24-220S12G3N3NC2uH470uF/16V SMBJ14.0AFA24-220S15G3N3220uF/25V5uH220uF/25V SMBJ17.0A*FA24-220S24G3N3220uF/35V5uH220uF/35V SMBJ26.0ANote:Output filter capacitor C2is electrolytic capacitor,recommend high frequency low resistor electrolytic capacitor,for capacity and current low,please refer to the technical specifications provided by each manufacturer.C2capacitor withstand voltage should derate to80%,capacitor C1is ceramic capacitor,to filter high frequency noise,recommended0.1uF/50V/1206.TVS1tube is a recommend component to protect post-circuit if converter fails.Recommend to external FUSE,Model:3.15A/250V, slow fusing.2.EMC solution recommended circuitPhoto2,EMC for higher requirement circuitComponent Products Module ValueFUSE 3.15A/250Vac 3.15A/250Vac,slow-fusing,necessaryNTC5D-95D-9MOV10D561K10D561KCX10.47uF/275Vac0.47uF/275VacL1 6.8uH/3.0A 6.8uH/3.0A H inductorLF2UU9.830mH min30mH/3.0ANote:1.The product should be used under the specification range,otherwise it will cause permanent damage to it.2.Product’s input terminal should connect to fuse;3.If the product is not worked under the load range(below the minimum load or beyond the load range),we cannot ensure that the performance of product is in accordance with all the indexes in this manual;4.Unless otherwise specified,data in this datasheet are tested under conditions of Ta=25℃,humidity<75%when inputting nominal voltage and outputting rated load(pure resistance load);5.All index testing methods in this datasheet are based on our Company’s corporate standards6.The performance indexes of the product models listed in this manual are as above,but some indexes of non-standard model products will exceed the above-mentioned requirements,please directly contact our technician for specific information;7.We can provide customized product service;8.The product specification may be changed at any time without prior notice.。
IXGR32N60CD1;中文规格书,Datasheet资料
© 2004 IXYS All rights reservedG = Gate, C = Collector,E = Emitter,TAB = CollectorDS98631D(06/04)SymbolTest ConditionsCharacteristic Values(T J = 25°C, unless otherwise specified)min.typ.max.V GE(th)I C = 250 µA, V CE = V GE2.55.0V I CES V CE = 600V T J = 25°C 200µA V GE = 0 VT J = 125°C3mA I GES V CE = 0 V, V GE = ±20 V ±100nA V CE(sat)I C = I T, V GE = 15 V 2.32.7VNote 1Symbol Test Conditions Maximum Ratings V CES T J = 25°C to 150°C600V V CGR T J = 25°C to 150°C; R GE = 1 M Ω600V V GES Continuous ±20V V GEM Transient ±30V I C25T C = 25°C 45A I C90T C = 90°C 28A I CMT C = 25°C, 1 ms120A SSOA V GE = 15 V, T VJ = 125°C, R G = 10 Ω I CM = 64A (RBSOA)Clamped inductive load, L = 100 µH @ 0.8 V CESP C TC = 25°C140W T J -55 ... +150°C T JM 150°C T stg-55 ... +150°C Maximum Lead and Tab temperature for soldering 300°C 1.6 mm (0.062 in.) from case for 10 s V ISOL 50/60 Hz, RMSt = 1 min leads-to housing2500V~Weight5gHiPerFAST TM IGBT with Diode ISOPLUS247TM(Electrically Isolated Backside)Featuresz DCB Isolated mounting tabz Meets TO-247AD package Outline z High current handling capabilityz Latest generation HDMOS TM process zMOS Gate turn-on -drive simplicityApplicationsz Uninterruptible power supplies (UPS)zSwitched-mode and resonant-mode power supplieszAC motor speed control z DC servo and robot drives zDC choppersAdvantagesz Easy assembly z High power densityzVery fast switching speeds for high frequency applicationsIXGR 32N60CD1V CES = 600 V I C25= 45 A V CE(SAT)= 2.7 V t fi(typ)= 55 nsPreliminary data sheet* Patent pendingISOPLUS 247TM (IXGR)GCIsolated backside*E 153432EIXYS reserves the right to change limits, test conditions, and dimensions.SymbolTest ConditionsCharacteristic Values(T J = 25°C, unless otherwise specified)min.typ.max.g fs I C = I T ; V CE = 10 V,25S Pulse test, t ≤ 300 µs, duty cycle ≤ 2 %C ies 2700pF C oes V CE = 25 V, V GE = 0 V, f = 1 MHz240pF C res 50pF Q g 110nC Q ge I C = I T , V GE = 15 V, V CE = 0.5 V CES 22nC Q gc 40nC t d(on)25ns t ri 20ns t d(off)85170ns t fi 55nsE off 0.320.75mJt d(on)25ns t ri 25ns E on 1mJ t d(off)110ns t fi 100ns E off 0.85mJ R thJC 0.90K/WR thCK0.15K/WReverse Diode (FRED)Characteristic Values(T J = 25°C, unless otherwise specified)Symbol Test Conditionsmin.typ.max.V F I F = I T , VGE = 0 V, Pulse test T J = 150°C 1.6V t ≤ 300 µs, duty cycle d ≤ 2 % T J = 25°C 2.5V I RM I F = I T , V GE = 0 V, -di F /dt = 100 A/µs 6A t rr V R = 100 V T J = 100°C 100ns I F = 1 A; -di/dt = 100 A/µs; V R = 30 V T J = 25°C25nsR thJC1.15K/WInductive load, T J = 25°C I C = I T , V GE = 15 V, L = 100 µH,V CE = 0.8 V CES , R G = R off = 4.7 ΩRemarks: Switching times mayincrease for V CE (Clamp) > 0.8 • V CES ,higher T J or increased R G Inductive load, T J = 125°C I C = I T , V GE = 15 V, L = 100 µH V CE = 0.8 V CES , R G = R off = 4.7 ΩRemarks: Switching times mayincrease for V CE (Clamp) > 0.8 • V CES ,higher T J or increased R GNote: 1. I T = 32AIXYS MOSFETs and IGBTs are covered by 4,835,5924,931,8445,049,9615,237,4816,162,6656,404,065 B16,683,3446,727,585one or moreof the following U.S. patents:4,850,0725,017,5085,063,3075,381,0256,259,123 B16,534,3436,710,405B24,881,1065,034,7965,187,1175,486,7156,306,728 B16,583,5056,710,463Fig. 5. Admittance Curves Fig. 6. Capacitance Curves © 2004 IXYS All rights reservedFig. 11. Transient Thermal ResistanceIXYS reserves the right to change limits, test conditions, and dimensions.Fig. 18.Transient thermal resistance junction to case © 2004 IXYS All rights reserved分销商库存信息: IXYSIXGR32N60CD1。
B39431B3743H110;中文规格书,Datasheet资料
—
0.5
2.0 dB
—
0.8
3.0 dB
Relative attenuation (relative to αmin) αrel
10.00 ... 380.00 MHz
55
60
— dB
380.00 ... 414.00 MHz
50
56
— dB
414.00 ... 427.00 MHz
46
52
— dB
B3743 433.92 MHz
Maximum ratings
Operable temperature range T
Storage temperature range Tstg
DC voltage
VDC
Source power
PS
–45/+125 ˚C
–45/+125 ˚C
6
V
10 dBm
source impedance 50 Ω
B3743 433.92 MHz
Features
s Package size 3.0 x 3.0 x 1.0 mm3 s Package code DCC6E s RoHS compatible s Approximate weight 0.037 g s Package for Surface Mount Technology
SAW Components
SAW filter
Short range devices
Series/type: Ordering code:
Date: Version:
B3743 B39431B3743H110
December 16, 2009 2.3
HMS3560用户手册
NETZON
HMS 3560
1
目
录
1.设备简介 ............................................................................................................................................... 4 1.1 应用特征 ................................................................................................................................... 4 1.2 型号、特殊配备和耗材............................................................................................................ 5 1.3 功能描述 ................................................................................................................................... 6 1.4 HMS 3560 的技术数据............................................................................................................... 7 2.调整和连接 .................................................................
cisco3560参数
表2 Cisco Catalyst 3560系列交换机硬件描述规格性能∙32Gbps转发带宽∙基于64字节分组的转发速率：38.7Mpps（Cisco Catalyst 3560G-48TS和Cisco Catalyst 3560G-48PS，以及Cisco Catalyst 3560G-24TS和CiscoCatalyst 3560G-24PS）；13.1Mpps（Cisco Catalyst 3560-48TS和Cisco Catalyst 3560-48PS）；和6.6Mpps（Cisco Catalyst 3560-24TS和Cisco Catalyst3560-24PS）∙128MB DRAM∙32MB闪存（Cisco Catalyst 3560G-24TS和Cisco Catalyst 3560G-24PS，以及Cisco Catalyst 3560G-48TS和Cisco Catalyst 3560G-48PS）；和16MB闪存（Cisco Catalyst 3560-48PS和Cisco Catalyst 3560-24PS）∙最多可以配置12000 个MAC地址∙最多可以配置11000 个单播路由∙最多可以配置1000 个IGMP群组和组播路由∙可配置的最大传输单元（MTU）为9000字节，最大以太网帧为9018字节（大型帧），用于千兆位以太网端口上的桥接；最大1546字节，用于10/100端口上多协议标签交换（MPLS）标记帧的桥接连接器和布线∙10BASE-T端口：RJ-45连接器；两对3、4或者5类非屏蔽双绞线（UTP）电缆∙10BASE-T以太网供电端口：RJ-45连接器；两对3、4或者5类UTP电缆，电源引脚1，2（负极）和3，6（正极）∙100BASE-TX端口：RJ-45连接器；两对5类UTP电缆∙100BASE-TX以太网供电端口：RJ-45连接器；两对3、4或者5类UTP 电缆，电源引脚1，2（负极）和3，6（正极）∙1000BASE-T端口：RJ-45连接器；两对5类UTP电缆∙基于SFP的1000BASE-T端口：RJ-45连接器；两对5类UTP电缆∙基于SFP的1000BASE-SX、-LX/LH、-ZX和CWDM 端口：LC光纤连接器（单模或多模光纤）∙Cisco Catalyst 3560 SFP互联电缆：两对屏蔽电缆，50厘米∙管理控制台端口：用于PC连接的RJ-45到DB9 电缆；对终端连接，使用RJ-45到DB25凹式数据终端设备（DTE）适配器（可单独从思科订购，产品编号为ACS-DSBUASYN=）电源连接器客户可以利用内部电源或者Cisco RPS 675，为交换机提供电力。
6223N-SRD Module Datasheet说明书
6223N-SRDWi-Fi Single-band 1X1 + Bluetooth 4.2 Combo Module DatasheetOffice: 6 Floor, Building U6, Junxiang U8 Park,Hangcheng Avenue, Bao'an District,Shenzhen City, CHINAFactory: No.8, Litong Road, Liuyang Economic & TechnicalDevelopment Zone, Changsha, Hunan, CHINATEL: +86-755-2955-8186Website: Customer Approval :CompanyTitleSignatureDateFn-Link6223N-SRD Revision HistoryVersion Date Revision Content Draft Approvedversion fcNew1.0 2020/11/9CONTENTS1 Overview (1)1.1 Introduction (1)1.2 Features (1)1.3 General Specification (2)1.4 Recommended Operating Rating (2)2 General Specification (3)2.1 Wi-Fi RF Specifications (3)2.2 BT RF Specifications (3)3 Pin Assignments (5)3.1 Pin Outline (5)3.2 Pin Definition (5)4 Dimensions (7)4.1 Module Picture (7)4.2 Marking Description (7)4.3 Module Physical Dimensions (8)4.4 Layout Reference (9)6 Host Interface Timing Diagram (10)6.1 SDIO Pin Description (10)6.2 SDIO Default Mode Timing Diagram (11)6.3 SDIO Power-on sequence (11)6.4 UART Interface Characteristics (12)6.5 UART Interface Power-on Sequence (12)7 Reference Design (12)8 Ordering Information (14)9 The Key Material List (14)10 Environmental Requirements (15)10.1 Recommended Reflow Profile (15)10.2 Patch Wi-Fi/BT modules installed before the notice (15)11 Package (17)11.1 Reel (17)11.2 Packaging Detail (17)1 Overview1.1 Introduction6223N-SRD is a highly integrated and excellent performance Wireless LAN (WLAN) and BT. It provides SDIO interface for Wi-Fi to connect with host processor and high speed UART interface for BT. High-speed wireless connection up to 150 Mbps and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2. It can be easily manufactured on SMT process.This WLAN Module design is based on Realtek RTL8723DS-CG QFN484.4X4.4mm(Realtek).It combines a MAC, a 1T1R capable baseband, and RF in a single chip. It is designed to provide excellent performance with low power Consumption and enhance the advantages of robust system and cost-effective.6223N-SRD integrates whole Wi-Fi/BT function blocks into a chip, such asSDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB.This compact module is a total solution for a combination of Wi-Fi + BT technologies. The module is specifically developed for Smart phones and Portable devices.1.2 Features●Operate at ISM frequency bands (2.4GHz)●CMOS MAC, Baseband PHY, and RF in a single chip for 802.11b/g/n compatibleWLAN●Wi-Fi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbpsdownstream and 150 Mbps upstream PHY rates●SDIO for Wi-Fi and UART for Bluetooth●Fully Qualified for Bluetooth 2.1+EDR specification including both 2Mbps and 3Mbpsmodulation mode●Fully qualified for Bluetooth 3.0●Fully qualified for Bluetooth 4.2 Dual mode●Full_speed Bluetooth operation with Piconet and Scatternet supportBlock Diagram:1.3 General SpecificationModel Name 6223N-SRDProduct Description Support Wi-Fi/BT functionalitiesDimension L x W x T: 23 x 21 x 4.8 (typical) mmBT Interface Support UARTWi-Fi Interface Support SDIO 2.0Operating temperature 0°C to 70°CStorage temperature -40°~125°1.4 Recommended Operating RatingUnitMax.Typ.Min.Operating Temperature 0 25 70 deg.CV VBAT 3.03.63.3VDDIO 1.7 1.8 or 3.3 3.6 V6223N-SRD2 General Specification2.1 Wi-Fi RF SpecificationsFeature DescriptionWLAN Standard IEEE 802.11b/g/n, Wi-Fi compliantFrequency Range 2412MHz-2462MHzChannels 2.4GHz:CH1~CH11Output Power 802.11b /11Mbps:17dBm ± 1.5dB@EVM<=-10dB 802.11g /54Mbps:14dBm ± 1.5dB@EVM<=-25dB 802.11n/MCS7@HT20:13dBm ± 1.5dB@EVM<=-28dB 802.11n/MCS7@HT40:13dBm ± 1.5dB@EVM<=-28dBSpectrum Mask IEEE compliantFreq. Tolerance ±15 ppmReceive Sensitivity(11b) @8% PER802.11b/11Mbps: PER@≤-76 Receive Sensitivity(11g) @10% PER802.11g/54Mbps: PER@≤-65 Receive Sensitivity(11n,20MHz) @10% PER802.11n/MCS7@HT20: PER@≤-64 Receive Sensitivity(11n,40MHz) @10% PER802.11n/MCS7@HT40: PER@≤-612.2 Bluetooth SpecificationFeature DescriptionGeneral SpecificationBluetooth Standard Bluetooth V4.2 of 1, 2 and 3 Mbps.Host Interface UARTFrequency Band 2402 MHz ~ 2480 MHzNumber of Channels 79 channelsModulation GFSK,π/4-DQPSK and 8DPSKRF SpecificationMin. Typical. Max. Output Power (Class 1.5) 6dBmOutput Power (Class 2) 2dBmSensitivity @ BER=0.1%for GFSK (1Mbps)-86dBm Sensitivity @ BER=0.01%for π/4-DQPSK (2Mbps)-86dBm Sensitivity @ BER=0.01%for 8DPSK (3Mbps)-80dBmMaximum Input Level GFSK (1Mbps): -20dBmπ/4-DQPSK (2Mbps) : -20dBm 8DPSK (3Mbps) : -20dBmSensitive @PER=30.8% FOR BLE-90dBm3 Pin Assignments3.1 Pin Outline<TOP>3.2 Pin DefinitionNO. Name Type Description Voltage1 UART-CTS UART-CTS VDDIO2 UART-RTS UART-RTS VDDIOconnections3 GND Groundconnections4 GND Groundconnections5 GND Groundoutput VDDIO6 UART-OUT O UART7 UART-IN I UARTinput VDDIO3.3V 3.3V8 VBAT P Supply9 NC Floating (Don’t connected toground)10 VDDIO PI/O Voltage supply input 1.8V to3.3V 1.8V ~ 3.3V11 GND Ground connections12 CHIP_EN I chip enable pin, default pull high 3.3V 13 WL_WAKE_HOSTI/O WLAN device wake-up host1.8V ~ 3.3V 14 SD_D2 I/O SDIO Data line 2 1.8V ~ 3.3V 15 SD_D3 I/O SDIO Data line 3 1.8V ~ 3.3V 16 SD_CMD I/O SDIO Command Input 1.8V ~ 3.3V 17 SD_CLK I SDIO Clock Input 1.8V ~ 3.3V 18 SD_D0 I/O SDIO Data line 0 1.8V ~ 3.3V 19 SD_D1 I/O SDIO Data line 11.8V ~ 3.3V20 GNDGround connections 21 BT_HOST_WAKE BT host wake-up device VDDIO 22BT_WAKE_HOSTBT device wake-up host VDDIO23 GND Ground connections 24 GND Ground connections 25 GNDGround connections26 WIFI_DIS#Pull high: ON , Pull low: OFFExternal pull low can disable WL 27 BT_DIS#Pull high: ON , Pull low: OFFExternal pull low can disable BTP:POWER I:INPUT O:OUTPUT6223N-SRD 4 Dimensions4.1 Module PictureL x W : 23 x 21 (+0.3/-0.1) mmH: 4.8 (±0.2) mmWeight 1.65g4.2 Marking Description4.3 Module Physical Dimensions (unit: mm )(TOP)4.4 Layout Reference(unit: mm )TOP6 Host Interface Timing Diagram6.1 SDIO Pin DescriptionThe module supports SDIO version 2.0 for all 1.8V 4-bit UHSI speeds: SDR12(25 Mbps), and SDR25(50Mbps) in addition to the 3.3V default speed(25MHz) and high speed (50 MHz). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided.SDIO Pin DescriptionSD 4-Bit ModeDATA0 Data Line 0DATA1 Data Line 1 or InterruptDATA2 Data Line 2 or Read WaitDATA3 Data Line 3CLK ClockLineCMD Command6.2 SDIO Default Mode Timing DiagramClockInputOutputSDIO Interface Timing ParametersSDIO Interface Timing6.3 SDIO Power-on sequenceSymbolMinTypicalMaxUnitT 33ramp0.2 - No Limit msT off 250 500 1000 ms T 33ramp 0.2 0.5 2.5 ms T 12ramp 0.1 0.5 1.5 ms T POR 2 2 8 ms T non_rdy 12 10 ms6.4 UART Interface CharacteristicsThe RTL8723DS UART interface is a standard 4-wire interface with RX,TX,CTS and RTS. The interface supports the Bluetooth 2.0 UART HCI H4 and H5 specifications. The default baud rate is 115.2K baud. In order to support high and low speed baud rate,the RTL8723DS provides multiple UART clocks.6.5 UART Interface Power-on Sequence7 Reference DesignNote:1. BAT_EN could not use for module power off, please switch the 3.3V power for module on/off.2.please keep the antenna on no metal area.8 Ordering Information Part No. DescriptionFG6223NSRD-00 RTL8723DS,b/g/n,wifi1T1R,21*23.21mm,SDIO+UART,with metal antenna.9 The Key Material ListMain Shieldingcover6223NSRD V1.0 Shielding cover no insulation layer14.8X11mm-full height of 1.4 copper, no positioning pin(信太)Alternative Shieldingcover6223NSRD V1.0 Shielding cover no insulation layer14.8X11mm-full height of 1.4 copper, no positioning pin (精力通)Main Crystal3225 24MHZ CL=12pF, ±10ppm (东晶) Alternative Crystal 3225 24MHZ CL=12pF, ±10ppm (泰晶) Alternative Crystal 3225 24MHZ CL=12pF, ±10ppm (晶威特) Alternative Crystal 3225 24MHz CL=12pF ±10ppm (鸿星) Alternative Crystal 3225 24MHz CL=12pF ±10ppm (TXC) Main TVS 0201 5V 0.05pF 15KV TVS (Murata) Alternative TVS 0201 5V 0.05pF 15KV TVS (Sunlord) Alternative TVS 0201 5V 0.05pF 15KV TVS (维安)MainMainChipsetRTL8723DS-CG QFN48 4.4X4.4mm (Realtek)Main antenna 6223N-SRD metal antenna.Main PCB6223N-SRD-V1.0,FR4,green,21X23X0.8mm (翔宇) Alternative PCB 6223N-SRD-V1.0,FR4,green,21X23X0.8mm（广东科翔）Alternative PCB 6223N-SRD-V1.0,FR4,green,21X23X0.8mm（顺络）Alternative PCB 6223N-SRD-V1.0,FR4,green,21X23X0.8mm（深联）10 Environmental Requirements10.1 Recommended Reflow ProfileReferred to IPC/JEDEC standard.Peak Temperature : <250°CNumber of Times : ≤2 times10.2 Patch Wi-Fi/BT modules installed before the noticeWi-Fi/BT module installed note:1.Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil.2.Take and use the WIFI/BT module, please insure the electrostatic protective measures.3.Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃for the MID motherboard. About the module packaging, storage and use of matters needing attention are as follows:1.The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h.2.The module vacuum packing once opened, time limit of the assembly:6223N-SRD Card:1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.2.) factory environmental temperature humidity control: ≦ -30 ℃, ≦ 60% r.h..3). Once opened, the workshop the preservation of life for 168 hours.3. Once opened, such as when not used up within 168 hours:1). The module must be again to remove the module moisture absorption.2). The baking temperature: 125 ℃, 8 hours.3). After baking, put the right amount of desiccant to seal packages.6223N-SRDFN-LINK TECHNOLOGY LIMITEDProprietary & Confidential1711 Package11.1 ReelTBD11.2 Packaging DetailTBDFCC StatementFCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247Integral antenna with antenna gain 2dBiThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:—Reorient or relocate the receiving antenna.—Increase the separation between the equipment and receiver.—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.—Consult the dealer or an experienced radio/TV technician for help.FCC Radiation Exposure StatementThe modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device if without further certify for example C2PC with SAR.This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body.If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AATL-6223N-SRD Or Contains FCC ID: 2AATL-6223N-SRD”When the module is installed inside another device, the user manual of the host must contain below warning statements;1.This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:(1)This device may not cause harmful interference;(2)This device must accept any interference received, including interference that may cause undesired operation.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:—Reorient or relocate the receiving antenna.—Increase the separation between the equipment and receiver.—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.2.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product.Any company of the host device which install this modular with modular approval should perform the test of radiated & conducted emission and spurious emission, etc. according to FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement，then the host can be sold legally.。
Hi3536V100
Hi3536 H.265 Decoder Processor Brief Data SheetIssue 03Date 2015-04-19Copyright © HiSilicon Technologies Co., Ltd. 2014. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of HiSilicon Technologies Co., Ltd.Trademarks and Permissions, , and other HiSilicon icons are trademarks of HiSilicon Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders.NoticeThe purchased products, services and features are stipulated by the contract made between HiSilicon and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied.The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.HiSilicon Technologies Co., Ltd.Address: Huawei Industrial BaseBantian, LonggangShenzhen 518129People's Republic of ChinaWebsite: Email: support@Hi3536 Key SpecificationsProcessor Corez ARM Cortex A17 quad-core@maximum 1.4 GHz −32 KB L1 I-cache, 32 KB L1 D-cache− 1 MB L2 cache−Main control processor for running peripheral driversand applicationsz ARM Cortex A7 single-core@maximum 900 MHz −32 KB L1 I-cache, 32 KB L1 D-cache−128 KB L2 cache−Video-related module controlVideo Decoding Standardsz H.265 Main Profile L5.1z H.264 Baseline/Main/High profile L5.0z MPEG4 SP L0–3/ASP L0–5z MJPEG/JPEG baselineVideo Encoding Standardsz H.264 Baseline/Main/High profile L5.1z MJPEG/JPEG baselineVideo Encoding/Decodingz H.265/H.264&JPEG encoding and decoding of multiple streams:−4-channel 4K x 2K (3840 x 2160)@30 fpsH.265/H.264 decoding+2x1080p@30 fps H.264encoding+4-channel 4K x 2K@2 fps JPEG encoding −16x1080p@30 fps H.265/H.264decoding+2x1080p@30 fps H.264encoding+16x1080p@2 fps JPEG encoding−9x1080p@30 fps H.265/H.264 decoding+4K x2K@30 fps H.264 encoding+9x1080p@2 fps JPEGencoding−32x720p@30 fps H.265/H.264 decoding+4x720p@30 fps H.264 encoding+32x720p@2 fps JPEG encoding −64xD1@30 fps H.265/H.264 decoding+8xD1@30 fpsH.264 encoding+64xD1@2 fps JPEG encoding−9x720p@30 fps JPEG decodingz CBR or VBR, ranging from 16 kbit/s to 40 Mbit/sz Encoding frame rate ranging from 1 fps to 60 fpsz ROI encodingz Color-to-gray encodingGPUz Integrated Mali-T720 GPUz OpenGL ES3.1/2.0/1.1z OpenCL 1.2/1.1/1.0z Up to 63 MTris/s triangle filling ratez Double-precision FP64 and anti-aliasingIntelligent Video Analysisz Integrated IVE 2.0, supporting various intelligent analysis applications:−Motion detection−Video diagnosis−Perimeter protection Video and Graphic Processingz3D denoising, deinterlacing, edge smoothing, dynamic contrast enhancement and sharpeningz Anti-flicker for output videos and graphicsz1/8x to 16x video scalingz1/2x to 2x graphic scalingz Four cover regionsz OSD overlaying of eight regionsVideo Interfacesz VI interfaces−One BT.1120 HD input port−One video input channel for dual-chip cascading−SDR and DDR modes−Maximum input of 1080p@60 fps in SDR mode−Maximum input of 3840 x 2160@30 fps in DDRmodez VO interfaces−One HDMI 2.0 ultra-HD output interface, supportoutput up to 3840 x 2160@60 fps−One VGA HD output interface, support output up to2560 x 1600@60 fps−One BT.1120 HD output port, supporting themaximum output of 1080p@60 fps in SDR mode or3840 x 2160@30 fps in DDR mode−Two independent HD output channels (DHD0 andDHD1), output from any HD interface (HDMI, VGA,and BT.1120)−64-picture output for DHD0, maximum 3840 x2160@60 fps output−32-picture output for DHD1, maximum 1080p@60fps output−One CVBS SD output interface−Three full-screen GUI graphics layers in RGB1555or RGB8888 format, used by two HD channels andone SD channel−Two hardware cursor layers in RGB1555, RGB4444or RGB8888 format, with the maximum resolution of256 x 256Audio Interfacesz One integrated audio CODECz Three unidirectional I2S/PCM interfaces−One input, supporting 16 multiplexed inputs−Two outputsz16-bit audio input and outputEthernet Portsz Two gigabit Ethernet ports−RGMII, RMII, and MII modes−10/100 Mbit/s full-duplex or half-duplex−1000 Mbit/s full-duplex−TOE for reducing the CPU usageSecurity Enginez AES, DES, 3DES algorithmsz HASH abstract algorithmRAID Acceleration Enginez XOR accelerationz Up to nine data sources for XORz DMA, up to 16 MB data blockz Memory initialization (configurable initial value)z Descriptor linked listPeripheral Interfacesz Two SATA 3.0 interfaces−PM−eSATAz One PCIe 2.0/SATA 3.0 interfaces−Two PCIe interfaces, one PCIe interface+one SATAinterface, or two SATA interfaces−RC and EP supported as the PCIe 2.0 interface−eSATA supported as the SATA 3.0 interfacez Two USB 2.0 host ports, supporting hubz One USB 3.0 host port, supporting hubz Two SDIO interfaces−SD 2.0, SDIO 2.0, MMC 4.4.1, and SDXC (only 3.3V mode) cards supported for SDIO0 and SDIO1−Only eMMC 4.5 card supported for SDIO1−Multiplexing between SDIO0 and BT.1120 outputpins−Multiplexing between SDIO1 and NAND flashinterface pinsz Four UART interfaces, two of which supporting four wiresz One IR interfacez One I2C interfacez Multiple GPIO interfacesz One low-speed ADC interfaceMemory Interfacesz Two 32-bit DDR3/4 SDRAM interfaces−Maximum frequency of 933 MHz (1.866 Gbit/s)−Dual channels−ODT−Maximum capacity of 3 GBz SPI NOR/NAND flash interface−1-/2-/4-bit SPI NOR/NAND flash−Two CSs−Maximum 32 MB for each CS (for only the NORflash)−Maximum 8 GB for each CS (for only the NANDflash)−2 KB/4 KB page size (for only the NAND flash)−8-bit/1 KB and 24-bit/1 KB ECC (for only theNAND flash)z NAND flash interface−8-bit NAND flash−Two CSs−SLC or MLC−8-/24-/40-/64-bit ECC based on the 1 KB data block z Embedded 64 KB BOOTROM and 88 KB SRAM RTC with an Independent Power Supplyz Independent battery for supplying power to the RTC Boot Modesz Booting from the BOOTROMz Booting from the SPI NOR flashz Booting from the SPI NAND flashz Booting from the NAND flashz Booting from the eMMCz Booting the slave chip over the PCIe interfaceSDKz Linux 3.10-based SDKz Audio encoding and decoding libraries complying with various protocolsz High-performance H.265/H.264 PC decoding library Physical Specificationsz Power consumption−Typical power consumption of 4.3 W−Multi-level power-saving controlz Operating voltages−0.9 V core voltage−1.0 V CPU voltage (or decreased to 0.9 V)−3.3 V I/O voltage−1.5/1.2 V DDR3/4 SDRAM interface voltagez Package−RoHS, EDHS-PBGA−Ball pitch of 0.8 mm (0.02 in.)−Body size of 27 mm x 27 mm (1.06 in. x 1.06 in.) z Operating temperature ranging from 0°C (32°F) to 70°C (158°F)Functional Block DiagramThe Hi3536 is a professional high-end SoC targeted for the multi-channel HD or D1 NVR. The Hi3536 provides a high-performance A 17 processor, a video decoding engine (a maximum of 16x1080p decoding complying with various protocols), a high-performance video/graphics processing engine (various complicated graphics processing algorithms), and dual-channel HD outputs. These features enable the Hi3536 to provide high-quality images. In addition, the Hi3536 integrates various peripheral interfaces to meet differentiated customer requirements for functionality, features, and image quality, while reducing the eBOM cost.NVRs (Each with a Hi3536)16x1080p NVRz32x1080p@10 Mbit/s streamsz16x1080p real-time decoding (16-channel polling previewing)z2x1080p real-time encodingz1080p@32 fps JPEG snapshotz HDMI 4K x 2K@30 fps 16-picture ultra-HD output32x720p NVRz64x720p@5 Mbit/s streamsz32x720p real-time decoding (32-channel polling previewing)z4x720p real-time encodingz 720p@64 fps JPEG snapshotzHDMI+VGA 1080p@60 fps HD dual 16-picture output 64xD1 NVRz 128x D1@2.5 Mbit/s streamsz 64xD1 real-time decoding (64-channel real-time previewing) z 8xD1 real-time encoding z D1@128 fps JPEG snapshotzHDMI 4K x 2K@30 fps 64-picture ultra-HD outputGMACVGAHDMIGMAC0IP cameraLAN/WANBT.1120DDR CtrlI 2SGE PHY port multiplierHDMI PHY...Acronyms and Abbreviationsdataencryption standard3DES triplestandardencryptionAES advancedCBR constant bit rateselectCS chipvideo broadcast signalCVBS compositerateDDR double-datastandardencryptionDES dataDMA direct memory accessECC error correcting codeEP endpointadvanced technology attachmentserialeSATA externalinput/output GPIO general-purposeGUI graphical user interfaceHD high-definitionHDMI high-definition multimedia interfaceI2C inter-integratedcircuitI2S inter-ICsoundIR infraredenginevideoIVE intelligentMII media independent interfacecellMLC multi-levelNVR network video recorderterminationODT on-diedisplayOSD on-screenPBGA plastic ball grid arraycomponent interconnect expressPCIe peripheralPM portmultiplexerRAID redundant array of independent diskscomplexRC rootRGMII reduced gigabit media independent interfaceRMII reduced media independent interfaceRoHS restriction of the use of certain hazardous substances ROI region of interestclockRTC real-timetechnology attachmentadvancedSATA serialSD standard-definitionSDR single data rateSDK software development kitSDRAM synchronous dynamic random access memorySHA secure hash algorithmcellSLC single-levelSMMU system memory management unitSoC system-on-chipSP simpleprofileinterfaceperipheralSPI serialSRAM static random access memoryoffloadengineTOE TCP/IPUART universal asynchronous receiver transmitterVBR variable bit rateVGA video graphics arrayoutputVO video。
美国爱立信公司CA05305004E产品说明书
January 2009ContentsP h o t o e l e c t r i c S e n s o r sDescriptionPage Photoelectric SensorsIntelliView � Series. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2NanoView � Series. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19Note: Supplement to Publication No. CA05305002E and CA05305003E — T ab 5.IntelliView and NanoView Photoelectric SensorsJanuary 2009IntelliView� SeriesPhotoelectric SensorsContentsOverview. . . . . . . . . . . . . . . . . . . . . .2 Model Selection, Sensors. . . . . . . .3 Model Selection, Cables . . . . . . . . .7 Model Selection, Accessories. . . . .8 Wiring Diagrams . . . . . . . . . . . . . . .9 Dimensions. . . . . . . . . . . . . . . . . . .10 Detection Diagrams. . . . . . . . . . . .12 Specifications. . . . . . . . . . . . . . . . .14 The IntelliView Series from Eaton is a family of compact, high performance specialty photoelectric sensorsdesigned to solve a wide array of sensing challenges.IntelliView encompasses a variety of new sensing technologies: color, contrast and luminescence sensing; field-adjustable foreground and background suppression sensing; short-range distance sensing with analog outputs; and long-range, high-precision laser distance sensing with analog outputs.T o fit into your application, IntelliView sensors are available in industry-standard M18 flat-tubular and compact rectangular package sizes. For ease of installation and replacement, all models are available with micro connectors. Approvals�UL Listed�C-UL ListedFor the most current information on this product, visit our web site: New Cutting-Edge Sensors Detect Color, Contrast, Luminescence and Distance with High PrecisionProduct Features�New Sensing T echnologies — Now, Eaton has solutions for sensing color, contrast, luminescence and distance with great accuracy�Small Size, Big Solutions — IntelliView sensors come in either compact rectangular or flat-tubular package sizes, both rugged sealed enclosures�Simple “T each In” Installation — Most models include a teach mode, allowing for quick and simple installation and setup�Adjustable Background Suppression — For the first time, Eaton offers a fully field-adjustable background suppression photoelectric sensor capable of detecting targets as far as 3.9 ft. (1.9 m) away�LED Indicators and Pushbuttons — Multiple LEDs communicateoutput and power status while built-in pushbuttons and adjustmentpotentiometers simplify the teaching of sensor settings�C-UL Listed and CE Approved — Accepted worldwideSensing Adjustment Potentiometers Teach Buttonsfor Quick, EasySensor SetupVisible Sensing Beams toSimplify AlignmentM12 MicroConnectorson AllModelsFlat Tubular Body CanBe Mounted UsingThreads or Flat Againsta SurfaceFor Customer Service in the U.S. call 1-877-ETN CARE (386-2273),in Canada call 1-800-268-3578.For Application Assistance in the U.S. and Canadacall 1-800-426-9184.January 2009Overview — Adjustable Foreground/Background Suppression Models�Ignores nuisance foreground or background objects �Field-adjustable sensing ranges�Compact 50x50mm rectangular package size �M12 micro connector termination with 90- and 180-degree rotation options�Sensing ranges up to 47.2 in. (120 cm)Foreground/Background Sensing BasicsForeground/background suppression sensors allow the user to precisely set the minimum and maximum detection distance. T his allows detection of a target only when it is inside a given area, avoiding the interference of objects lying before (foreground) and behind(background). T his type of sensor is ideal for suppressing the detection of box edges and bottoms, sending an output only upon the presence of goods actually contained in the box.Model Selection — Adjustable Foreground/Background Suppression Models�For compatible connector cables, see Page 7.Voltage RangeOutput TypeConnectionAdjustable Sensing RangeCatalog NumberBackground Suppression Models Compact Rectangular (50 x 50 x 18 mm)10 – 30V DCLight Operate or Dark Operate (Selectable), PNP4-Pin Micro Connector � 3 –10 cm (1.2 – 4.0 in.)E75-PPA010P-M123 – 25 cm (1.2 – 9.8 in.)E75-PPA025P-M1210 – 50 cm (4.0 – 19.7 in.)E75-PPA050P-M12Extended Range Background Suppression Compact Rectangular (50 x 50 x 18 mm)10 – 30V DCLight Operate or Dark Operate (Selectable), PNP4-Pin Micro Connector � 6 – 120 cm (2.4 – 47.2 in.)E75-PP1MP-M12Foreground/Background Suppression Models Compact Rectangular (50 x 50 x 18 mm)10 – 30V DCLight Operate or Dark Operate (Selectable), PNP4-Pin Micro Connector �Foreground:5 – 20 cm (2.0 – 7.9 in.)Background:12 – 110 cm (4.7 – 43.3 in.)E75-PPA110P-M12January 2009Overview — Distance Sensing Models with Analog Outputs�When within the effective range of the sensor, outputs a 0 – 10V signal proportional to the target’s distance from the sensor face�Class II laser emitter detects objects from 0.3 to 4 m (1 to 13.1 ft.) away�Two additional PNP outputs can be programmed to switch at predetermined ranges�Simple three-step teach routine to program range cutoffs�Unmatched accuracy and resolution at long sensing distances�When within the effective range of the sensor, outputs a 0 – 10V signal proportional to the target’s distance from the sensor face�Visible red LED emitter detects objects from 5 to 10 cm (1.9 to 3.9 in.)�Two indicator LEDs communicate sensor status: a yellow LED with light intensity proportional to the target's distance within the sensor's range, and a red LED that activates when the target is beyond maximum sensing range�Flat tubular package can be mounted using the body threads or flat against a surfaceDistance Sensing ExplainedDistance sensors output a 0 – 10V analog signal in pro-portion to the measurement of the distance between the sensor and target. Optical triangulation, a technology similar to that used in Eaton’s Perfect Prox � or diffuse sensors, is used for short- to mid-range distancesensing applications that do not require a high degree of accuracy. T ime-of-flight technology, a method of measuring the time it takes for the emitted beam to bounce off the target and return to the detector, is used for longer range distance sensing applications. T ime-of-flight is highly accurate with precise resolution over long sensing distances.Model Selection — Distance Sensing Models with Analog Outputs�For complete connector cables, see Page 7.�This sensor is a Class II laser device. Eye irradiation for over 0.25 seconds is dangerous. Refer to the Class II Standard (EN60825-1) for additional safety information.Long-Range, High-Precision Laser Distance Measurement SensorShort-Range Distance SensorVoltage RangeOutput TypeAdjustable Sensing Range Connection Catalog NumberLong-Range Laser Distance Sensor with Time-of-Flight Technology Rectangular (80 x 53 x 31 mm)15 – 30V DCAnalog Output (0 – 10V),Dual Teachable PNP Outputs, Light Operate Mode0.3 – 4.0 m (1.0 – 13.1 ft.)5-Pin Micro Connector �E75-DST400A010-M12 �Short-Range Distance Sensor Flat Tubular (18 mm)18 – 30V DCAnalog Output (0 – 10V)5.0 – 10.0 cm (1.9 – 3.9 in.)4-Pin Micro Connector�E75-DST010A010-M12January 2009Overview — Color, Contrast and Luminescence Sensing ModelsColor Sensing BasicsColor sensors work by using a “chromaticity” detection algorithm. Chromaticity is determined by two characteristics: hue and saturation. Hue is determined by the reflected light’s wavelength, while saturation indicates the pureness percentage (with white representing 0%). Eaton’s color sensor goes one step further and provides an optional “chromaticity plus intensity” algorithm. T his mode provides a higher sensitivity to tone variations and is recommended for detection of different colors on the same type of material. It will also better distinguish between gray tones. The color of a target is determinedby the color components of thereflected source light. T he targetcolor is identified by analyzing thered (R), green (G) and blue (B)channels of reflected light. Forexample, yellow can be identifiedby the following reflections: R=50%,G=50%, B=0%; Orange can be identi-fied by R=75%, G=25%, B=0%; Pinkby R=50%, G=0%, B=0%. T he RGBcombinations are practically limit-less. Applications for color sensorsare common in many industries,ranging from quality and processcontrol, to automatic materialhandling for identification, toorientation and selection of objectsaccording to their color.Contrast Sensing BasicsContrast sensors (also defined ascolor mark readers, according totheir most popular application) gobeyond simple presence/absencedetection to distinguish two surfacesaccording to the contrast producedby their difference in reflectivity. Forexample, a dark reference mark (lowreflectivity) can be detected by com-paring it against the contrast of thelighter surface (high reflectivity). Awhite LED light source is used forgeneral purpose contrast sensing,enabling detection of the veryslightest of contrast variations —even those that share the samegeneral material and color. Contrastsensors are frequently used inautomated packaging applicationsfor registration mark detection toautomate the folding, cutting andsorting phases.Color Sensors Contrast Sensors Luminescence Sensors �Can be programmed torecognize three differentcolors independently�Capable of sensing targets5 – 45 mm away from thesensor face�Rectangular plastic package features a four-digit display, twoprogramming buttons and output status LEDs�Optional serial connection (RS485) allows for remote communications�Standard M12 8-pin microconnector (mating cableavailable on Page 16)�Ideal for detecting differentcolored or grayscale contrasts,such as registration marks�Capable of sensing targets out to10 mm from the sensor face�Simple three-step setup routinefor quick installation or optional“fine setup routine” for morecomplicated applications�Complementary outputs canfunction in either light operateor dark operate modes�Standard M12 4-pin microconnector (mating cableavailable on Page 17)�Perfect for the detection ofany luminescent target, evenon reflective materials suchas ceramics, metal ormirrored glass�Capable of sensing from8 – 20 mm from the sensor face�Simple three-step setup routineand optional “fine setuproutine” for more complicatedapplications�Can function in either lightoperate or dark operate mode�Standard M12 4-pin microconnector (mating cableavailable on Page 18)January 2009Luminescence Sensing BasicsLuminescence is defined as visible light emission from fluorescent or phosphorescent substances. Lumi-nescence sensors emit ultraviolet light, which is then reflected at a higher wavelength from the targetsurface. T he UV emission from the sensor is modulated and the visible light received is synchronized,resulting in immunity against exter-nal interferences such as reflections caused by shiny objects. Lumines-cence sensors are used in variousindustries to detect labels, fluores-cent marks or signs, fluorescent glues on paper, to distinguish cut-ting and sewing guides, and to check fluorescent paints or lubricants.Model Selection — Color, Contrast and Luminescence Sensing Models�Refer to Detection Diagram on Page 13.�For complete connector cables, see Page 7.�Remote sensor communications is possible using the RS485 serial interface. For additional information, see Installation Manual P52078.Voltage Range Sensing RangeConnectorOutput TypeCatalog NumberColor Sensors Rectangular (50 x 50 x 25 mm)10 – 30V DC5 – 45 mm(0.19 – 1.77 in.) �8-Pin Micro Connector � 3 N.O. PNP OutputsE76-CLRMKP-M123 N.O. NPN Outputs E76-CLRMKN-M123 N.O. NPN Outputs,RS485 Connection �E76-CLRMKRS-M12Contrast Sensors Flat Tubular (18 mm)10 – 30V DC10 mm (0.39 in.) ideal 4-Pin Micro Connector �Light Operate or Dark Operate, PNP OutputE76-CNT010P-M12Light Operate or Dark Operate, NPN OutputE76-CNT010N-M12Luminescence Sensors Flat Tubular (18 mm)10 – 30V DC8 – 20 mm (0.31 – 0.79 in.)4-Pin Micro Connector �Light Operate or Dark Operate, PNP OutputE76-UV020P-M12Light Operate or Dark Operate, NPN OutputE76-UV020N-M12January 2009Model Selection — Compatible Connector CablesVoltage Style Numberof PinsGauge Length Catalog Number PinsPVC PUR IRR PURJanuary 2009Model Selection — AccessoriesDescription SensorCompatibility CatalogNumberApproximate DimensionsMounting Bracket L-ShapedAdditional MountingJanuary 2009Wiring Diagrams — IntelliView Seriesproportionality (INV) is activated when the white wire is connected to 0V. T he white wire must always be connected.�Available only on E76-CLRMKRS-M12 with RS485 serial connection.ModelsMicro Connector Diagram (Face View Male Shown)January 2009 Approximate Dimensions — IntelliView SeriesModels DiagramApproximate Dimensions — IntelliView Series (Continued) Models DiagramDetection Diagrams — IntelliView SeriesBecause gray is less reflective than white, gray targets will typically need to come closer to the beam centerpoint to be detected. Models DiagramDetection Diagrams — IntelliView Series (Continued) Models DiagramSpecifications — Foreground/Background Suppression ModelsForeground/Background Suppression ModelsInput Voltage10 – 30V DCRipple 2 Vpp max.Outputs PNP, N.O. or N.C.;30V DC max.Output Current100 mA max.(short-circuit protected)Output Saturation Voltage< 2V max.Response Time 1 msSwitching Frequency500 HzIndicator LEDs For E75-PPA: Output LED (red), Stability LED (green)For E75-PP1: Output LED (yellow), Stability LED (green) Gain Adjustment For E75-PPA: Adjustment screw (except for E75-PPA010P)For E75-PP1: Six-turn adjustment pot with numerical indicator Operating Temperature-25 to +55°C (-13 to +131°F)Storage Temperature-25 to +70°C (-13 to +158°F)Electrical Protection Class 2Sensing Distance Varies by model, see model selection table on Page 6 Beam Type All Models Except E75-PPA010P-M12: Infrared LED 880nmE75-PPA010P-M12: Red LEDVibration Amplitude: 0.5 mmFrequency: 10 – 55 Hz for every axis (EN60068-2-6)Shock Resistance Half sine, 30 g n, 11 ms, 3 axesHousing Material ABSLenses PMMAEnclosure Ratings For E75-PPA...: IP65For E75-PP1…: IP67Connections M12 4-pin connectorWeight40g max.Specifications — Distance Sensing ModelsDistance Sensing ModelsFor E75-DST4…(Long-Range Distance Sensor)For E75-DST0…(Short-Range Distance Sensors)Input Voltage16 – 28V DC18 – 30V DCBurden Current 2 Vpp max.Current Consumption(Output Current Excluded)120 mA max.30 mA max.Outputs Analog, 0 – 10V2 PNP outputs30V DC max.Analog, 0 – 10VOutput Switching Mode Light operate (output on when target present)Output can be inverted via button Output Current100 mA max. (short-circuit protected)—Output Saturation Voltage< 2V max.—Response Time12 ms7.3 msSwitching Frequency42 Hz68 HzIndicator LEDs 2 Output LEDs (yellow)Power/Alarm LED (green)Output LED (yellow) Field LED (red)Distance Adjustment Dual buttons—Warm-Up15 min.—Operating Temperature0 to +50°C (+32 to +122°F)-10 to +55°C (+14 to +131°F) Storage Temperature-20 to +70°C (-4 to +158°F)-20 to +70°C (-4 to +158°F) Measurement Range0.3 – 4.0 m (1.0 – 13.1 ft.) 5.0 – 10.0 cm (1.9 – 3.9 in.) Linearity< 1% (24V DC, 25°C, with 90% white target)—Repeatability± 4 mm—Hysteresis20 mm—Temperature Drift< 1 mm per °C—Beam Type Red Laser (665 nm),Class 2 EN 60825-1 (1994) + A1 (2002) + A2 (2001)Red LED (630 nm)Vibration Amplitude: 0.5 mm,Frequency: 10 – 55 Hz for every axis (EN60068-2-6)Shock Resistance Half sine, 30 g n, 11 ms, 3 axesMaterial of Construction ABS PBTLenses PMMAEnclosure Ratings IP67Connections M12 5-pin micro connector M12 4-pin micro connector Weight92g max.25g max.Approvals UL, C-UL, CESpecifications — Color Sensing ModelsColor Sensing ModelsInput Voltage10 – 30V DCBurden Current2V max.Current Consumption60 mA max.(Output Current Excluded)Outputs 3 PNP outputs30V DC max. (short-circuit protected)Output Current100 mA max.Output Saturation Voltage< 2VResponse Time650 µsSwitching Frequency770 HzIndicator LEDs4-Digit Display (green),Output LED (yellow),3 Status LEDs (green)Sensing Adjustment SET, SEL buttonsOperating Temperature-10 to +55°C (+14 to +131°F)Storage Temperature-20 to +70°C (-4 to +158°F)Protection Class 2Sensing Distance20 mm (0.79 in.)Beam Spot DimensionØ 4 mmBeam Type White Light LED (400 – 700 nm)Vibration Amplitude: 0.5 mm,Frequency: 10 – 55 Hz for every axis (EN60068-2-6) Shock Resistance Half sine, 30 g n, 11 ms, 3 axesMaterial of Construction ABS ThermoplasticLens Material Glass window and lensMechanical Protection IP67Connections M12 8-pin micro connectorApprovals UL, C-UL, CESpecifications—Contrast Sensing ModelsContrast Sensing ModelsInput Voltage10 – 30V DCBurden Current2V max.Current Consumption25 mA max.(Output Current Excluded)Outputs PNP or NPN by model,NO and NC,30 Vcc max. (short-circuit protected)Output Current100 mA max.Output Saturation Voltage< 2VResponse Time185 µsSwitching Frequency 2.7 kHzIndicator LEDs Output LED (yellow)Ready/Error LED (green/red)Data Retention EEPROM non-volatile memoryOperating Mode Light operate on NO outputDark operate on NC outputOperating Temperature-10 to +55°C (+14 to +131°F)Storage Temperature-20 to +70°C (-4 to +158°F)Operating Distance10 mm ± 2 mmBeam Type White LED (400 – 700 nm)Vibration Amplitude: 0.5 mm,Frequency: 10 – 55 Hz for every axis (EN60068-2-6) Shock Resistance Half sine, 30 g n, 11 ms, 3 axesMaterial of Construction PBTLenses PMMA PlasticEnclosure Ratings IP67Connections M12 4-pin micro connector cableWeight25g max.Approvals UL, C-UL, CESpecifications — Luminescence Sensing ModelsLuminescence Sensing ModelsInput Voltage10 – 30V DCBurden Current2V max.Current Consumption25 mA max.(Output Current Excluded)Outputs PNP or NPN by model,N.O. and N.C.,30 Vcc max. (short-circuit protected)Output Current100 mA max.Output Saturation Voltage< 2VResponse Time 1.1 msSwitching Frequency445 HzIndicator LEDs Output LED (yellow)Relay/Error LED (green/red)Data Retention EEPROM non-volatile memoryOperating Mode Light operate on N.O. outputDark operate on N.C. outputOperating Temperature-10 to +55°C (+14 to +131°F)Storage Temperature-20 to +70°C (-4 to +158°F)Sensing Distance8 – 20 mm (best signal at 10 mm)Beam Type White LED (400 – 700 nm)Vibration Amplitude: 0.5 mm,Frequency: 10 – 55 Hz for every axis (EN60068-2-6) Shock Resistance Half sine, 30 g n, 11 ms, 3 axesMaterial of Construction PBTLens Material PMMA PlasticEnclosure Ratings IP67Connections M12 4-pin micro connector cableWeight25g max.Approvals UL, C-UL, CE。
Thermopatch HiQ-tape Hytex 热转印标签打印机 产品数据表
HiQ-tape/HytexHiQ胶带是专门为HiQ热转印标签打印机的Thermopatch系列设计的。
它有多种宽度和尺寸可供选择；连续卷装的胶带或模切标签。
HiQ系列的各种产品主要用于品牌工作服。
根据要求，HiQ可以预先印上标志或边界。
允许各种应用，例如为工作服的胸前口袋的姓名标签。
HiQ胶带有几种类型：HiQHiQ胶带坚固且柔软，可以预先印上商标、边框或任何颜色组合的文本。
胶带可以预先切割成各种宽度和尺寸。
结合Thermopatch配给的HiQ油墨色带，确保最佳的打印质量。
HiQ 提供以下颜色选择：显示的颜色可能与实际颜色不同。
HytexThermopatch还提供了成功的多样的HiQ胶带：Hytex.一个Hytex标签实际上来自HiQ胶带，但带有自粘层。
这一额外自粘层使标签的定位更容易，使标签在热封过程中固定位置。
Hytex还能抵抗密集的洗涤过程。
HiQ FRHiQ FR 是要求阻燃性能的工作服的正确选择。
此款胶带有HiQ相同的属性，同时符合严格的ISO标准EN ISO 11611,11612,469和14116，HiQ FR有连续卷装胶带和预切标签两种。
HiQ-Clean这个胶带有不同的热塑性粘合剂层，可将其粘贴到“阻隔织物”和类似的合成织物上。
这包括无尘室或微电子、制药和核工的专业工作服。
然而，它不适合用高压灭菌器消毒的外科手术服。
HiQ-clean 可提供连续胶带或模切标签，其尺寸与HiQ系列的其它产品相同。
所有HiQ的系列产品都通过了Oeko-Tex标准100认证，但是不能熨烫。
如果您需要熨烫，Combitex是理想的选择。
HiQ-tape/HytexHiQ-CleanHiQ-FRAvailable media for HiQ, HiQ-FR and HiQ-CleanColours HiQ: white, yellow, orange, red, pink, blue, green, high visibility yellow and mint green.HiQ FR and HiQ-Clean are only available in white.InksA black ink ribbon is supplied as standard in a boxed set.Ink is also available in red, green, and blue.Physical propertiesWash resistant up to 95 °C industrial laundry washing.High heat-sealing temperatures.Suitable for all textile which allows the thermoplastic adhesive to penetrate and bind itself to it and which is resistant to the advised heat seal application temperatures.HiQ:Thermal transfer printable top layerPolyester cotton textileThermoplastic adhesiveHiQ tapeArticle code Width CoreHiQ3030 mm50 mmHiQ3535 mm50 mmHiQ4040 mm50 mm HiQ5050 mm50 mm HiQ6060 mm50 mm HiQ7070 mm50 mm HiQ8080 mm50 mm HiQ9090 mm50 mm Other sizes available upon request.HiQ die-cut tapeArticle code Width Core HIQDC 411641 x 14,4 mm50 mm HIQDC 461946 x 19 mm50 mm HIQDC 631263 x 12,7 mm76 mm HIQDC 703870 x 38 mm76 mm HIQDC 762576 x 25 mm76 mm HIQDC 801980 x 19 mm76 mm HIQDC 803080 x 30 mm76 mm HIQDC 902590 x 25 mm76 mm HIQDC 903890 x 38 mm76 mm HIQDC 905090 x 50 mm76 mm Other sizes available upon request.HytexThermal transfer printable top layerPolyester cotton textileThermoplastic adhesivePressure sensitive adhesiveCarrier paperArticle code Width CoreHYTEX 411441 x 14,4 mm50 mmHYTEX 531953 x 19 mm50 mmHYTEX 631263 x 12,7 mm76 mmHYTEX 841484 x 14,4 mm76 mmHYTEX 842384 x 23,4 mm76 mmHYTEX 843684 x 36,1 mm76 mmHYTEX 844884 x 48,4 mm76 mmHYTEX 904890 x 48,4 mm76 mmOther sizes available upon request.HiQ CleanWash resistant up to 60 °C industrial laundry washing.Suitable for all textile which allows the thermoplastic adhesive to penetrate and bind itself to it and which is resistant to the advised heat seal application temperatures.Physical propertiesThermal transfer printable top layerPolyester textileThermoplastic adhesiveHandling and storageKeep away from oxidizing agents, from strongly alkaline en strongly acid materials.Store out of direct sunlight, in a cool and dry place.Shelf life: estimated more than 2 years under mentioned conditions.PrecautionsNo specific safety measures are required when working with this product. We advise always to ventilate well at heat-sealing activities, since vapours may occur from any material such as textiles being processed.Article code Width CoreHiQ30-CLEAN30 mm50 mmHiQ40-CLEAN40 mm50 mmHiQ50-CLEAN50 mm50 mmHiQ60-CLEAN60 mm50 mmHiQ70-CLEAN70 mm50 mmHiQ80-CLEAN80 mm50 mmHiQ90-CLEAN90 mm50 mmOther sizes available upon request.All HiQ media is supplied as a boxed set containing the following: 2 x 50 meter long rolls of label tape, 1 x 104 meter long ink ribbon, and a cleaning pad for cleaning the printhead when replacing the ink ribbon.。