TMMDB3TG;中文规格书,Datasheet资料
MB3技术说明书
一. 概述DSSY331/DTSY341型（配置号为MB3V7.0）三相电子式预付费电能表是长沙威胜电子有限公司研制生产的新一代智能型高科技电能计量产品，符合GB/T17215、GB/T17882、GB/T17883、GB/T18460和DL/T614 等电能表有关标准，采用DL/T645通信规约（有扩展）。
二. 技术特性主要技术参数如下表所示：规格：电压：三相三线：3×100V，三相四线：3×220V/380V，3×57.7V/100V电流：1.5(6)A, 1(2)A,5(20)A,0.3(1.2)A, 5(6)A,10(40)A, 15(60)A,20(80)A频率：50Hz准确度：有功电能：0.5S、1级，无功电能：2级符合标准：GB/T17215，GB/T17882、GB/T17883，GB/T18460和DL/T614工作电压范围： 0.7Un—1.3Un起动电压：单相≥0.75Un,合相≥0.6Un工作温度范围： -25℃—+55℃极限工作温度范围：-35℃—+65℃运输及储存温度： -40℃—+70℃相对湿度：30%—95%，无凝霜频率范围：50Hz±5%功耗：〈2W，10VA（实测典型值1.4W，4VA）起动： 1‰Ib(0.5S级)，2‰Ib（1级）防潜电流：1/5×（1‰Ib） (0.5S级)冲击电压：6kV交流电压：4kV电快速瞬变脉冲群：4kVMTBF：≥6×104 h设计寿命：15年时钟误差：0.3024秒/天（在－40℃~+85℃的温度范围内±3.5ppm的晶振）电池寿命：表上有两组电池：供给时钟的电池（1.0Ah锂电池，焊接电表的逻辑板上,掉电后仅有3uA功耗，但DS3231SN温补时钟芯片每 64秒进行1次温度补偿，温度补偿时最大功耗575uA，温度补偿时间最大值200ms，故平均电流为：（3×63.8+575×0.2）/64=4.7875uA)供给电表掉电后工作的电池（低功耗电池）置于电表电池盒内，在掉电后各工况下的电流如下表所示（用Fluke电流表测直流电流所得值）：拟制：陈红权2008-04-05 图号：OKRW2.702.450JS审核：费率：最大八费率。
TPS3809L30MDBVREP;TPS3809K33MDBVREP;TPS3809I50MDBVREP;中文规格书,Datasheet资料
FEATURESDBV PACKAGE (TOP VIEW)V DDDESCRIPTIONTPS3809L30-EP,TPS3809K33-EP,TPS3809I50-EP3-PIN SUPPLY VOLTAGE SUPERVISORSSGLS369A–AUGUST 2006–REVISED NOVEMBER 2006•Controlled Baseline •Precision Supply Voltage Monitor 2.5V,3V,3.3V,5V–One Assembly Site •Power-On Reset Generator With Fixed Delay –One Test SiteTime of 200ms–One Fabrication Site•Pin-for-Pin Compatible With MAX 809•Extended Temperature Performance of –55°C to 125°C•Enhanced Diminishing Manufacturing Sources (DMS)Support•Enhanced Product-Change Notification •Qualification Pedigree (1)•3-Pin SOT-23Package•Supply Current of 9µA (Typical)(1)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over anextended temperature range.This includes,but is not limited to,Highly Accelerated Stress Test (HAST)or biased 85/85,temperature cycle,autoclave or unbiased HAST,electromigration,bond intermetallic life,and mold compound life.Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.The TPS3809family of supervisory circuits provides circuit initialization and timing supervision,primarily for DSPs and processor-based systems.During power-on,RESET is asserted when the supply voltage V DD becomes higher than 1.1V.Thereafter,the supervisory circuit monitors V DD and keeps RESET active as long as V DD remains below the threshold voltage V IT .An internal timer delays the return of the output to the inactive state (high)to ensure proper system reset.The delay time,t d(typ)=200ms,starts after V DD has risen above the V IT .When the supply voltage drops below the V IT ,the output becomes active (low)again.No external components are required.All the devices of this family have a fixed-sense V IT set by an internal voltage divider.The product spectrum is designed for supply voltages of 2.5V,3V,3.3V,and 5V.The circuits are available in a 3-pin SOT-23package.The TPS3809devices are characterized for operation over a temperature range of –55°C to 125°C.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.TYPICAL APPLICATIONSD Applications Using DSPs, Microcontrollers,or MicroprocessorsD Wireless Communication Systems D Portable/Battery-Powered Equipment D Programmable Controls D Intelligent Instruments D Industrial EquipmentD Notebook/Desktop Computers DAutomotive Systems5 V30FamilyL9TPS380RDBVReel Package Nominal Supply Voltage Nominal Threshold Voltage FunctionalityORDERING INFORMATIONTemperature M EPEnhanced Plastic TPS3809L30-EP,TPS3809K33-EP,TPS3809I50-EP 3-PIN SUPPLY VOLTAGE SUPERVISORSSGLS369A–AUGUST 2006–REVISED NOVEMBER 2006AVAILABLE OPTIONST ADEVICE NAME THRESHOLD VOLTAGEMARKING TPS3809L30MDBVREP (1) 2.64V PLYM –55°C to 125°CTPS3809K33MDBVREP (1) 2.93V PLZM TPS3809I50MDBVREP (1)4.55VPMAM(1)The DBVR passive indicates tape and reel of 3000parts.V DDGNDRESETtV DD V (NOM)V IT1.1 V1tRESETTPS3809L30-EP,TPS3809K33-EP,TPS3809I50-EP3-PIN SUPPLY VOLTAGE SUPERVISORSSGLS369A–AUGUST 2006–REVISED NOVEMBER 2006FUNCTIONAL BLOCK DIAGRAMTIMING DIAGRAMAbsolute Maximum Ratings (1)Dissipation RatingsRecommended Operating ConditionsTPS3809L30-EP,TPS3809K33-EP,TPS3809I50-EP 3-PIN SUPPLY VOLTAGE SUPERVISORSSGLS369A–AUGUST 2006–REVISED NOVEMBER 2006over operating free-air temperature range (unless otherwise noted)MINMAXUNIT V DD7Supply voltage (2)V All other pins–0.37I OL Maximum low output current 5mA I OH Maximum high output current –5mA I IK Input clamp current V I <0or V I >V DD ±20mA I OK Output clamp currentV O <0or V O >V DD±20mA Continuous total power dissipation See Dissipation Rating TableT A Operating free-air temperature range –55125°C T stg Storage temperature range –65150°C Soldering temperature260°C(1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltage values are with respect to GND.For reliable operation the device should not be operated at 7V for more than t =1000h continuously.T A <25°C DERATING FACTOR T A =70°C T A =85°C PACKAGE POWER RATINGABOVE T A =25°CPOWER RATINGPOWER RATINGDBV437mW3.5mW/°C280mW227mWMINMAXUNIT V DD Supply voltage26V T AOperating free-air temperature–55125°CElectrical CharacteristicsTiming Requirements Switching Characteristics TPS3809L30-EP,TPS3809K33-EP,TPS3809I50-EP 3-PIN SUPPLY VOLTAGE SUPERVISORSSGLS369A–AUGUST2006–REVISED NOVEMBER2006over recommended operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TY MAX UNITPV DD=2.5V to6V,I OH=–500µA V DD–0.2V DD=3.3V,I OH=–2mA V DD–0.4V OH High-level output voltage VV DD=6V,I OH=–4mA V DD–0.4V DD=6V,I OH=–4mA,T A=125°C V DD–0.5V DD=2V to6V,I OL=500µA0.2V OL Low-level output voltage V DD=3.3V,I OL=2mA0.4VV DD=6V,I OL=4mA0.4 Power-up reset voltage(1)V DD≥1.1V,I OL=50µA0.2V2.58 2.6 2.7TPS3809L304 Negative-going2.87 2.9 2.99V IT–input threshold TPS3809K33V3 voltage(2)4.45 4.5 4.65TPS3809I505TPS3809L3035V hys Hysteresis TPS3809K3340mV TPS3809I5060V DD=2V,Output unconnected912I DD Supply currentµAV DD=6V,Output unconnected2025C i Input capacitance V I=0V to V DD5pF(1)The lowest supply voltage at which RESET becomes active.t r,V DD≥15µs/V.(2)To ensure best stability of the threshold voltage,a bypass capacitor(0.1-µF ceramic)should be placed near the supply terminals.RL =1MΩ,CL=50pF,TA=25°CPARAMETER TEST CONDITIONS MIN MAX UNITt w Pulse width at V DD V DD=V IT–+0.2V,V DD=V IT––0.2V3µsRL =1MΩ,CL=50pF,TA=25°CPARAMETER TEST CONDITIONS MIN TYP MAX UNITV DD≥V IT–+0.2V,t d Delay time120200280msSee timing diagramPropagation(delay)time,V IL=V IT––0.2V,t PHL V DD to RESET delay1ms high-to low-level output V IH=V IT–+0.2VTYPICAL CHARACTERISTICSLOW-LEVEL OUTPUT VOLTAGEvsLOW-LEVEL OUTPUT CURRENT0.000.250.500.751.001.251.501.752.002.252.502.75I OL − Low-Level Output Current − mAO L V − L o w -L e v e l O u t p u t V o l t a g e − VHIGH-LEVEL OUTPUT VOLTAGEvsHIGH-LEVEL OUTPUT CURRENT0.00.51.01.52.02.53.03.54.04.55.05.56.06.5I OH − High-Level Output Current − mA−10−20−30−40−50V O H − H i g h -L e v e l O u t p u t V o l t a g e − V0.9950.9960.9970.9980.9991.0001.001NORMALIZED INPUT THRESHOLD VOLTAGEvsFREE-AIR TEMPERATURE AT V DDT A − Free-Air Temperature − °C−40−20020406085N o r m a l i z e d T h r e s h o l d V o l t a g e I T V A (T ),I T V (25C )°HIGH-LEVEL OUTPUT VOLTAGEvsHIGH-LEVEL OUTPUT CURRENT0.000.250.500.751.001.251.501.752.002.252.502.753.00I OH− High-Level Output Current − mA−2−4−6−8−10V O H − H i g h -L e v e l O u t p u t V o l t a g e − VTPS3809L30-EP,TPS3809K33-EP,TPS3809I50-EP 3-PIN SUPPLY VOLTAGE SUPERVISORSSGLS369A–AUGUST 2006–REVISED NOVEMBER 2006Figure 1.Figure 2.Figure 3.Figure 4.0.00.51.01.52.02.53.03.50.00.20.40.60.8 1.0MINIMUM PULSE DURATION AT V DDvsV DD THRESHOLD OVERDRIVE VOLTAGEV DD− Threshold Overdrive Voltage − Vµs− M i n i m u m P u l s e D u r a t i o n a t V D D −t w TPS3809L30-EP,TPS3809K33-EP,TPS3809I50-EP3-PIN SUPPLY VOLTAGE SUPERVISORSSGLS369A–AUGUST 2006–REVISED NOVEMBER 2006TYPICAL CHARACTERISTICS (continued)Figure 5.PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TPS3809I50MDBVREP ACTIVE SOT-23DBV 33000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPS3809K33MDBVREP ACTIVE SOT-23DBV 33000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPS3809L30MDBVREPACTIVE SOT-23DBV 33000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM V62/06636-01XE ACTIVE SOT-23DBV 33000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM V62/06636-02XE ACTIVE SOT-23DBV 33000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM V62/06636-03XEACTIVESOT-23DBV33000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge andbelief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF TPS3809I50-EP,TPS3809K33-EP,TPS3809L30-EP :•Catalog:TPS3809I50,TPS3809K33,TPS3809L30•Automotive:TPS3809I50-Q1,TPS3809K33-Q1,TPS3809L30-Q1NOTE:Qualified Version Definitions:•Catalog-TI's standard catalog product •Automotive -Q100devices qualified for high-reliability automotive applications targeting zero defects PACKAGE OPTION ADDENDUM18-Sep-2008TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TPS3809I50MDBVREP SOT-23DBV 33000180.09.0 3.3 3.2 1.47 4.08.0Q3TPS3809K33MDBVREP SOT-23DBV 33000180.09.0 3.3 3.2 1.47 4.08.0Q3TPS3809L30MDBVREPSOT-23DBV33000180.09.03.33.21.474.08.0Q3*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) TPS3809I50MDBVREP SOT-23DBV33000182.0182.020.0 TPS3809K33MDBVREP SOT-23DBV33000182.0182.020.0 TPS3809L30MDBVREP SOT-23DBV33000182.0182.020.0分销商库存信息:TITPS3809L30MDBVREP TPS3809K33MDBVREP TPS3809I50MDBVREP。
TSM103WIDT,TSM103WIDT,TSM103WAIDT,TSM103WAIDT,TSM103WAIDT,TSM103WAID, 规格书,Datasheet 资料
April 20041/7OPERATIONAL AMPLIFIERs LOW INPUT OFFSET VOLTAGE : 0.5mV typ.s LOW SUPPLY CURRENT : 350µA/op.(@ V CC = 5V)s MEDIUM BANDWIDTH (unity gain) : 0.9MHz s LARGE OUTPUT VOLTAGE SWING : 0V to (V CC - 1.5V)s INPUT COMMON MODE VOLTAGE RANGE INCLUDES GROUNDs WIDE POWER SUPPLY RANGE : 3 to 32V ±1.5 TO ±16Vs 1.5kV ESD PROTECTION s VOLTAGE REFERENCEs FIXED OUTPUT VOLTAGE REFERENCE 2.5Vs ±0.4% OR ±0.7% VOLTAGE PRECISION s SINK CURRENT CAPABILITY : 1 to 100mA sTYPICAL OUTPUT IMPEDANCE : 0.2ΩDESCRIPTIONThe TSM103W is a monolithic IC that includes one independent op-amp and another op-amp for which the non-inverting input is wired to a 2.5V fixed Voltage Reference. This device offers both space and cost savings in many applications such as power supply management or data acquisition systems.ORDER CODEPIN CONNECTIONS (top view)Part Number TemperatureRangePackage PackagingTSM103WID -40, +105°C SO-8Tube TSM103WIDT Tape & ReeTSM103WAID Tube TSM103WAIDTTape & ReelTSM103WDual Operational Amplifier and Voltage ReferenceRevision 3TSM103W ABSOLUTE MAXIMUM RATINGS 1 ABSOLUTE MAXIMUM RATINGSSymbol Parameter Value Unit V CC Supply Voltage36V V id Differential Input Voltage Vcc + 0.6V V i Input VoltageL-0.3 to Vcc + 0.3V V T stg Storage temperature range-65 to + 150°C Ik Continuous cathode current range-100 to 150mA T j Maximum Junction Temperature150°C R thja Thermal Resistance Junction to Ambient (SO package)175°C/W T l Maximum Lead Temperature (10 seconds maximum)260°C ESD Electrostatic Discharge Protection 1.5kVOPERATING CONDITIONSSymbol Parameter Value Unit Vcc DC Supply Conditions 3 to 32VI k Vref Cathode Current 1 to 100mAT oper Operating Free-air Temperature Range-40°C, +105°C°CELECTRICAL CHARACTERISTICS TSM103W2 ELECTRICAL CHARACTERISTICSOPERATOR 2 (independent op-amp)V CC + = +5V, V CC = Ground, V o = 1.4V,T amb = 25°C (unless otherwise specified)SymbolParameterMin.Typ.Max.UnitI CCTotal Supply Current, excluding Current in the Voltage Reference Vcc+ = 5V, no load Tmin. < Tamb < Tmax.Vcc+ = 30V, no load Tmin. < Tamb < Tmax0.7 1.22mASymbolParameterMin.Typ.Max.Unit V ioInput Offset Voltage V icm = 0VTSM103WA, T amb = 25°T min. ≤ T amb ≤ T max.TSM103W, T amb = 25°T min. ≤ T amb ≤ T max.0.512345mVDV io Input Offset Voltage Drift 7µV/°CI io Input Offset Current T min. ≤ T amb ≤ T max.275150nA I ib Input Bias Current T min. ≤ T amb ≤ T max20150200nAAvd Large Signal Voltage GainV CC = 15V, R L = 2k, Vo = 1.4V to 11.4V T min. ≤ T amb ≤ T max.5025100V/mV SVR Supply Voltage Rejection Ratio V CC = 5V to 30V65100dB Vicm Input Common Mode Voltage Range V CC = +30V - see note 1T min. ≤ T amb ≤ T max.00(V CC +) -1.5(V CC +) -2V CMR Common Mode Rejection Ratio T min. ≤ T amb ≤ T max.706085dB I source Output Current SourceV CC = +15V, Vo = 2V, V id = +1V 2040mAI oShort Circuit to Ground V CC = +15V4060mAI sinkOutput Current Sink V id = -1V,V CC = +15V, V o = 2V V CC = +15V, V o = 0.2V 10122050mA µAV OHHigh Level Output Voltage V CC + = 30VT amb = 25°C, R L = 2k T min. ≤ T amb ≤ T maxT amb = 25°C, R L = 10k T min. ≤ T amb ≤ T max.262627272728VV OL Low Level Output Voltage R L = 10kT min. ≤ T amb ≤ T max.52020mVSR Slew Rate at Unity Gain V i = 0.5 to 3V, V CC = 15VR L = 2k, C L = 100pF, unity gain0.20.4V/µsTSM103WELECTRICAL CHARACTERISTICSOPERATOR 1 (op-amp with non-inverting input connected to the internal Vref)V CC + = +5V, V CC - = Ground, T amb = 25°C (unless otherwise specified)GBPGain Bandwidth ProductV CC = 30V,R L = 2k, C L = 100pF f = 100kHz, V in = 10mV 0.50.9MHzTHD Total Harmonic Distortion f = 1kHzA V = 20dB,R L = 2k, V CC = 30V C L = 100pF, V o = 2V pp0.02%e nEquivalent Input Noise Voltage f = 1kHz, Rs = 100ΩVcc = 30V50nV/√Hz1)The input common-mode voltage of either input signal voltage should not be allowed to go negative by more than 0.3V. The upper endof the common-mode voltage range is V CC + - 1.5V. Both inputs can go to Vcc+ 0.3V without damage.SymbolParameterMin.Typ.Max.UnitV io Input Offset Voltage V icm = 0VTSM103WA, T amb = 25°T min. ≤ T amb ≤ T max.TSM103W, T amb = 25°T min. ≤ T amb ≤ T max.0.512345mVDV io Input Offset Voltage Drift 7µV/°C I ib Input Bias Current negative input20nAAvdLarge Signal Voltage GainV CC = 15V, R L = 2k, Vo = 1.4V to 11.4V T min. ≤ T amb ≤ T max100V/mVSVRSupply Voltage Rejection Ratio V icm = 0VV CC + = 5V to 30V 65100dBI source Output Current Source V o = 2VV CC = +15V, V id = +1V 2040mA I oShort Circuit to Ground V CC = +15V4060mAI sinkOutput Current Sink V id = -1V,V CC = +15V, V o = 2V V CC = +15V, V o = 0.2V 10122050mA µAV OHHigh Level Output Voltage V CC + = 30VT amb = 25°C, R L = 2k T min. ≤ T amb ≤ T max.T amb = 25°C, R L = 10k T min. ≤ T amb ≤ T max.262627272728VV OLLow Level Output Voltage R L = 10kT min. ≤ T amb ≤ T max.52020mVSR Slew Rate at Unity Gain V i = 0.5 to 2V, V CC = 15VR L = 2k, C L = 100pF, unity gain0.20.4V/µsSymbol ParameterMin.Typ.Max.UnitELECTRICAL CHARACTERISTICSTSM103WVOLTAGE REFERENCEGBPGain Bandwidth ProductV CC = 30V,R L = 2k, C L = 100pF f = 100kHz, V in = 10mV 0.50.9MHzTHD Total Harmonic Distortion f = 1kHzA V = 20dB,R L = 2k, V CC = 30V C L = 100pF, V o = 2V pp0.02%Symbol ParameterMin.Typ.Max.Unit SymbolParameterMin.Typ.Max.UnitV refReference Input Voltage, Ik=10mA TSM103WA ±0.4% T amb = 25°C T min. ≤ T amb ≤ T max.TSM103W ±0.7% T amb = 25°C T min. ≤ T amb ≤ T max.2.492.482.4822.4652.52.5002.512.522.5182.535V∆V refReference Input Voltage Deviation Over Temperature RangeV KA = V ref ; I k = 10mA T min. ≤ T amb ≤ T max.730mV I min Minimum Cathode Current for Regulation V KA = V ref0.51mA|Z KA |Dynamic Impedance - note 1V KA = V ref , ∆I K = 1 to 100mA, f < 1kHz0.20.5Ω1)The dynamic impedance is defined as [Z KA | = ∆V KA /∆I KSUMMARY OF CHANGES TSM103W3 SUMMARY OF CHANGESDateRevision Description of Changes1-2First Release02-April-200431 - Vid=Vcc+0.6 modified on AMR table - page 22 - Add Ik parameter on AMR table - page 23 - Avd test condition equal on both tables Operator 1 & Operator 2 - pages 3 & 4Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners© 2004 STMicroelectronics - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Belgium - Brazil - Canada - China - Czech Repubic - Finland - France - Germany - Hong Kong - India - Israel - Italy - JapanMalaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States。
DM320003;中文规格书,Datasheet资料
/PIC32PIC32 Microcontroller Family with USB On-The-GoFall 2008Building on the heritage of Microchip Technology’s world-leading 8- and 16-bit PIC® microcontrollers, the PIC32 family delivers 32-bit performance and more memory to solve increasingly complex embedded system design challenges.More Performance & MemoryPower your RTOS, Touch Screens and Complex Applications■ 80 MHz, 1.56 DMIPS/MHz MIPS M4K Core ■ 512K Flash with pre-fetch cache■ 32K RAM for data and program execution ■ Fast interrupts and context switchCreate Scalable Products in a Consistent Environment■ Common MPLAB® development tools■ Pin & peripheral compatible with 16-bit PIC MCUs ■ Peripheral libraries compatible with 16-bit PIC MCUs ■ Common look and feel in ~500 PIC MCUsMore CompatibilityMore Cost EffectiveMore Design Options32-bit PIC®Microcontrollers 512K Flash 40 MIPS/PIC32Micr 516-bit PIC®Shorten Your Projects and Reuse Hardware, Software and Tools■ Free USB, TCP/IP , graphics and fi le system source code ■ Common Explorer 16 development platform ■ $49.99 starter kit with free C compiler ■ Hardware trace for less than $80Simplify Your System Design Through Integration■ Extensive analog and digital peripherals ■ USB device, host and On-The-Go functionality ■ Up to 6 DMA (2 USB + 4 General Purpose with CRC)■ 16-bit parallel master portSPI (2)Analog Comparators(2)RTCCI 2C ™(2)UARTs (2)16 Ch.10-bit ADCs16-bit Parallel PortOutput Compare PWM (5)16-bit Timers (5)Input Capture (5)Bus MatrixInstruction DataFlash • 80 MHz, 1.56 DMIPS/MHz • 5 Stage Pipeline, 32-bit ALUM4K 32-bit CorePrefetch Buffer CacheSRAMInterrupt ControllerGPIO (85)2-Wire DebugUSB OTGV REGShadow Set32 Core Registers JTAGTrace 32-bit HW Mul/DivPeripheral BusDMA 4 Ch.™16-bit Parallel Master Port with Programmable Wait States. Connect to SRAM, Flash, QVGA LCDs or other Peripherals.Rich integrated Analog and Digital Peripheral Set, Compatible with 16-bit PIC® Microcontrollers32-bit MIPS M4K Core,Harvard Architecture,Single Cycle Hardware MAC Fast Interrupts & Context SwitchDirect Memory Access Controller with integrated CRC module operates in Idle mode/PIC32USB On-The-Go Controller with Dedicated DMA Channel and IntegratedTransceiversSingle 2.3 to 3.6V SupplyPower-On Reset, Brown-Out Reset, Low Voltage DetectionFlexible 1:1 to 1:8 Ratio with Bus Matrix to Suit Application NeedsHigh Throughput Bus Matrix with High-speed Concurrent Access to Memories, Peripheralsand I/O512K, 128-bit wide Self-programmable Flash,Predictive Instruction Pre-fetch 256 byte CacheMPLAB® IDE,MPLAB® ICD 3 In-Circuit Debuggerand MPLAB® REAL ICE™ In-Circuit Emulator compatibleC O M I N G T O P I C 32■ Dual CAN2.0B ■ Up to 6 UART, 5 I 2C™ and 4 SPI■ BGA and QFN Packages■ 8-128 KB of RAM ■ 10/100 Ethernet MAC ■ More DMAPIC32 Starter Kit - Only $49.99USD !(DM320001)Getting started is easy with the fully integrated PIC32 Starter Kit featuring simple installation, getting started tutorial and PIC32 Starter Kit board with easy USB connection to your PC.The Starter Kit includes:MPLAB IDE and MPLAB C32 C Compiler †PIC32 Starter Board with Integrated DebuggerCode Examples, Documentation, Tutorials and Sample Projects PIC32 USB Starter Kit (DM320003) available for $55.†Student Edition has no code size limit and full optimizations. After 60 days some optimizations are disabled.PIC32 Development ToolsP(G f P T ■■■■†Microchip is the only silicon vendor with a full 8-, 16- and 32-bit microcontroller portfolio supported by a unified development environment. The MPLAB® IDE is free and easy to use./PIC32ORMPLAB ICD 3In-Circuit Debugger (DV164035)Explorer 16 Development Board (DM240001)PIC32 Plug-in Modules(MA320001)(MA320002)OR +++I/O Expansion Board(DM320002)USB Starter Board (DM320003)PIC32 Starter Board(DM320001)MPLAB REAL ICE™In-Circuit Emulation System(DV244005)Daughter Board (AC164123)Third-party Application Software and Hardware SupportIDE, C/C++ Compiler and DebuggerEmbedded RTOS SupportGraphics GUI SupportMicrochip Software Libraries/pic32librariesConnectivityMicrochip TCP/IP with SSL and BSD ZigBee ® Protocol Stack for 802.15.4*MiWi™ Protocol Stack for 802.15.4 Networks USB USB Host, Device USB OTG, Dual Role*USB Class Drivers – HID, MSD, CDC, Custom, etc.Graphics Microchip Graphics Library CAN Standalone CAN LibraryAudio Speex, ADPCM, PCM Encoding/Decoding Library EncryptionPublic Key Cryptography Library (RSA)Basic Libraries32-bit File System Library 16-bit File System Library Math LibraryPeripheral Library EEPROM Emulation DSP LibraryBootloaderSerial Port Bootloader USB Host Bootloader**Software planned for future - get the latest updates at /pic32librariesInformation subject to change. The Microchip name and logo, the Microchip logo, MPLAB and PIC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The PIC32 logo, MiWi and REAL ICE are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies. © 2008, Microchip Technology Incorporated. All Rights Reserved. Printed in the U.S.A. 10/08 DS39904F*DS39904F*/PIC32Microchip Technology Inc. • 2355 W. Chandler Blvd. • Chandler, AZ 85224-6199PurchasemicrochipDIRECT is a web-based purchasing site that gives you24-hour-a-day access toall Microchip devices andtools, including pricing, ordering, inventory and support. You can buy the products you need on an easily opened Microchip line of credit.SupportMicrochip is committed to supporting its customers in developing products faster and more efficiently. We maintain a worldwide network of field applicationsengineers and technical support ready to provide product and system assistance. In addition, the following service areas are available at :■ Support link provides a way to get questions answered fast: ■ Sample link offers free evaluation samples of any Microchip device: ■ Training link offers webinars, registration for local seminars/workshops and information on annual MASTERs events held throughout the world: /training■ Forum link provides access to knowledge base and peer help: microchipDIRECTwww.microchip AMERICAS AtlantaTel: 678-957-9614BostonTel: 774-760-0087ChicagoTel: 630-285-0071ClevelandTel: 216-447-0464DallasTel: 972-818-7423DetroitTel: 248-538-2250KokomoTel: 765-864-8360Los AngelesTel: 949-462-9523Santa ClaraTel: 408-961-6444TorontoMississauga, Ontario Tel: 905-673-0699EUROPEAustria - WelsTel: 43-7242-2244-39Denmark - Copenhagen Tel: 45-4450-2828France - ParisTel: 33-1-69-53-63-20Germany - Munich Tel: 49-89-627-144-0Italy - MilanTel: 39-0331-742611Netherlands - Drunen Tel: 31-416-690399Spain - MadridTel: 34-91-708-08-90UK - WokinghamTel: 44-118-921-5869ASIA/PACIFIC Australia - Sydney Tel: 61-2-9868-6733China - BeijingTel: 86-10-8528-2100China - ChengduTel: 86-28-8665-5511China - Hong Kong SAR Tel: 852-2401-1200China - NanjingTel: 86-25-8473-2460China - QingdaoTel: 86-532-8502-7355China - ShanghaiTel: 86-21-5407-5533China - Shenyang Tel: 86-24-2334-2829China - ShenzhenTel: 86-755-8203-2660China - WuhanTel: 86-27-5980-5300China - XiamenTel: 86-592-2388138China - XianTel: 86-29-8833-7252China - ZhuhaiTel: 86-756-3210040ASIA/PACIFIC India - BangaloreTel: 91-80-4182-8400India - New DelhiTel: 91-11-4160-8631India - PuneTel: 91-20-2566-1512Japan - Yokohama Tel: 81-45-471- 6166Korea - DaeguTel: 82-53-744-4301Korea - SeoulTel: 82-2-554-7200Malaysia - Kuala Lumpur Tel: 60-3-6201-9857Malaysia - Penang Tel: 60-4-227-8870Philippines - Manila Tel: 63-2-634-9065SingaporeTel: 65-6334-8870Taiwan - Hsin Chu Tel: 886-3-572-9526Taiwan - Kaohsiung Tel: 886-7-536-4818Taiwan - TaipeiTel: 886-2-2500-6610Thailand - Bangkok Tel: 66-2-694-13511/2/08Sales Offi ce Listing分销商库存信息: MICROCHIPDM320003。
PMEM4020APD,115;中文规格书,Datasheet资料
1.Product profile1.1General descriptionCombination of a PNP transistor with low V CEsat and high current capability and a planar Schottky barrier rectifier with an integrated guard ring for stress protection in a SOT457(SC-74) small plastic package. NPN complement: PMEM4020AND1.2FeaturesI 600 mW total power dissipation I High current capability up to 2 AI Reduces printed-circuit board area required I Reduces pick and place costs I Small plastic SMD package ITransistorN Low collector-emitter saturation voltage I DiodeN Ultra high-speed switching N Very low forward voltage N Guard ring protected1.3ApplicationsI DC-to-DC converters I Inductive load driversI General purpose load driversI Reverse polarity protection circuits IMOSFET drivers1.4Quick reference dataPMEM4020APDPNP transistor/Schottky rectifier moduleRev. 02 — 31 August 2009Product data sheetTable 1.Quick reference data Symbol ParameterConditions Min Typ Max Unit PNP transistorV CEO collector-emitter voltage open base --−40V I Ccollector current (DC)continuous;T s ≤ 55°C[1]--−2A[1]Soldering point of collector or cathode tab.2.Pinning information3.Ordering information4.Marking5.Limiting valuesSchottky barrier rectifierV R continuous reverse voltage --40V I Fcontinuous forward current--1ATable 1.Quick reference data …continued Symbol ParameterConditionsMin Typ Max Unit Table 2.Discrete pinningPin Description Simplified outline Symbol1emitter 2not connected 3cathode 4anode 5base 6collector132456sym04036145Table 3.Ordering informationType numberPackage NameDescriptionVersion PMEM4020APDSC-74plastic surface mounted package; 6 leadsSOT457Table 4.MarkingType number Marking code PMEM4020APDD3Table 5.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol ParameterConditions Min Max Unit PNP transistorV CBO collector-base voltage open emitter -−40V V CEO collector-emitter voltage open base -−40V V EBOemitter-base voltageopen collector-−5V[1]Mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint.[2]Device mounted on a printed-circuit board, single-sided copper, tin-plated, 1cm 2 mounting pad for both collector and cathode.[3]Mounted on a ceramic printed-circuit board, single-sided copper, tin-plated, standard footprint.[4]Soldering point of collector or cathode tab.I Ccollector current (DC)continuous [1]-−0.75A continuous [2]-−1A continuous [3]-−1.3A continuous;T s ≤ 55°C[4]-−2A I CM peak collector current -−3A I BM peak base current -−1A P tottotal power dissipationT amb ≤ 25°C [1]-295mW T amb ≤ 25°C [2]-400mW T amb ≤ 25°C [3]-500mW T s ≤ 55°C[4]-1000mW T j junction temperature -150°C Schottky barrier rectifierV R continuous reverse voltage -40V I F continuous forward voltage -1A I FRM repetitive peak forward currentt p ≤ 1 ms;δ≤ 0.5- 3.5A I FSM non-repetitive peak forward currentt = 8 ms; square wave -10A P tottotal power dissipationT amb ≤ 25°C [1]-295mW T amb ≤ 25°C [2]-400mW T amb ≤ 25°C [3]-500mW T s ≤ 55°C[4]-1000mW T j junction temperature [2]-150°C Combined deviceP tot total power dissipation T amb ≤ 25°C[2]-600mW T stg storage temperature −65+150°C T ambambient temperature[2]−65+150°CTable 5.Limiting values …continuedIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol ParameterConditions Min Max Unit6.Thermal characteristics[1]For Schottky barrier rectifiers thermal run-away has to be considered, as in some applications the reverse power losses P R are a significant part of the total power losses. Nomograms for determining the reverse power losses P R and I F(AV) rating will be available on request.[2]Soldering point of collector or cathode tab.[3]Mounted on a ceramic printed-circuit board, single-sided copper, tin-plated, standard footprint.[4]Device mounted on a printed-circuit board, single-sided copper, tin-plated, 1cm 2 mounting pad for both collector and cathode tab.[5]Mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint.Table 6.Thermal characteristics [1]Symbol Parameter Conditions Min Typ Max Unit Single device R th(j-s)thermal resistance from junction to soldering point in free air [2]--95K/W R th(j-a)thermal resistance from junction to ambientin free air[3]--250K/W [4]--315K/W [5]--425K/W Combined device R th(j-a)thermal resistance from junction to ambientin free air[3]--208K/W7.Characteristics[1]Pulse test: t p ≤ 300µs;δ≤ 0.02Table 7.CharacteristicsT amb = 25°C unless otherwise specified Symbol ParameterConditionsMin Typ Max Unit PNP transistorI CBOcollector-base cut-off current V CB =−40 V; I E = 0 A --−100nA V CB =−40 V; I E = 0 A;T j = 150°C--−50µA I CEO collector-emitter cut-off current V CE =−30 V; I B = 0 A --−100nA I EBO emitter-base cut-off current V EB =−5 V; I C = 0 A --−100nAh FEDC current gainV CE =−5 V; I C =−1 mA 300--V CE =−5 V; I C =−100 mA 300--V CE =−5 V; I C =−500 mA 250-900V CE =−5 V; I C =−1 A 160--V CE =−5 V; I C =−2 A[1]50--V CEsatcollector-emitter saturation voltageI C =−100 mA; I B =−1 mA --−120mV I C =−500 mA; I B =−50 mA --−145mV I C =−1 A; I B =−100 mA --−260mV I C =−2 A; I B =−200 mA--−530mV R CEsat equivalent on-resistance I C =−1 A; I B =−100 mA [1]-180280m ΩV BEsat base-emittersaturation voltage I C =−1 A; I B =−100 mA [1]--−1.1V V BEon base-emitter turn-on voltageV CE =−5 V; I C =−1 A [1]--−1.0V f T transition frequency V CE =−10 V; I C =−50 mA;f = 100 MHz150--MHz C ccollector capacitanceV CB =−10 V; I E = i e = 0 A;f = 1 MHz --10pFSchottky barrier rectifier V Fcontinuous forward voltagesee Figure 1I F = 0.1 mA [1]-95130mV I F = 1 mA [1]-155210mV I F = 10 mA [1]-220270mV I F = 100 mA [1]-295350mV I F = 1000 mA[1]-540640mV I Rreverse currentsee Figure 2V R = 10 V [1]-720µA V R = 40 V[1]-30100µA C ddiode capacitanceV R = 1 V; f = 1 MHz;see Figure 3-4348pFSchottky barrier rectifier (1)T amb =150°C (2)T amb =85°C (3)T amb =25°CSchottky barrier rectifier (1)T amb =150°C (2)T amb =85°C (3)T amb =25°CFig 1.Forward current as a function of forward voltage; typical valuesFig 2.Reverse current as a function of reverse voltage; typical valuesSchottky barrier rectifier;T amb = 25°C; f = 1 MHzPNP transistor;V CE =−5 V (1)T amb = 150°C (2)T amb = 25°C (3)T amb =−55°CFig 3.Diode capacitance as a function of reverse voltage; typical valuesFig 4.DC current gain as a function of collector current; typical values0.60.40.2010310210110−1mdb669I F (mA)V F (V)(1)(2)(3)020103040V R (V)mdb670105104103102101I R (µA)(1)(2)(3)05102010008015604020mdb671V R (V)C d (pF)012002004006008001000mhc088−10−1h FE −10−1I C (mA)−102−103−104(1)(2)(3)PNP transistor;V CE =−5 V (1)T amb =−55°C (2)T amb = 25°C (3)T amb = 150°CPNP transistor;I C /I B = 10(1)T amb = 150°C (2)T amb = 25°C (3)T amb =−55°CFig 5.Base-emitter voltage as a function of collector current; typical valuesFig 6.Collector-emitter saturation voltage as a function of collector current; typical valuesPNP transistor;I C /I B = 10(1)T amb = 150°C (2)T amb = 25°C (3)T amb =−55°CPNP transistor;V CE =−10 VFig 7.Equivalent on-resistance as a function of collector current; typical valuesFig 8.Transition frequency as a function of collector current−10−1−10−1mhc089−10−1−1−10V BE (V)I C (mA)−103−102−104(1)(2)(3)−103−102−10−1mhc090−1−10V CEsat (mV)I C (mA)−102−103−104(1)(2)(3)10110−1102mhc091−10−1−1−10R CEsat (Ω)I C (mA)−103−102−104(1)(2)(3)0−100030010020025050150−200−400f T (MHz)I C (mA)−600−800mhc0928.Application informationFig 9.DC-to-DC converterFig 10.Inductive load driver (relays, motors andbuzzers) with free-wheeling diodemgu866V OUTV INCONTROLLERmgu867V CCIN9.Package outlineFig 11.Package outline SOT457 (SC-74)REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDECJEITA SOT457SC-74w BM b pD epin 1indexAA 1L pQdetail XH EE v M AA B yscalecX13245601 2 mmPlastic surface-mounted package (TSOP6); 6 leadsSOT457UNIT A 1b p c D E H E L p Q y w v mm0.10.0130.400.253.12.70.260.101.71.3e 0.953.02.50.20.10.2DIMENSIONS (mm are the original dimensions)0.60.20.330.23A 1.10.905-11-0706-03-1610.Packing informationTable 8.Packing methodsThe indicated -xxx are the last three digits of the 12NC ordering code.[1]Type number Package Description Packing quantity300010000 PMEM4020APD SOT457 4 mm pitch, 8 mm tape and reel; T1-115-1354 mm pitch, 8 mm tape and reel; T2-125-165 [1]For further information and the availability of packing methods, see Section13.分销商库存信息: NXPPMEM4020APD,115。
TSW3003EVM;中文规格书,Datasheet资料
User's GuideSLWU029D–October2006–Revised August2007Contents1Demonstration Kit Configuration Options (3)2Block Diagrams (4)3Key Texas Instruments Components (5)4Software Installation (5)5Software Operation (5)6Board Setup (12)7Demo Kit Test Configuration (13)8Basic Test Procedure (23)9Optional Configurations (27)10Filter Specifications (29)11Bill of Materials and Schematics (30)List of Figures1System Block Diagram (4)2Demo Kit Block Diagram (4)3TSW3003Startup Screen (6)4Default CDCM7005SPI GUI (7)5TRF3761GUI-Main Menu (8)6TRF3761GUI-Advanced Menu (8)7DAC5687GUI (9)8Test System Block Diagram (13)9Single-Carrier Test Mode1WCDMA,Typical Performance With IF=30.72MHz,LO=2.14GHz (15)10Missing Middle-Carrier Test Mode1WCDMA,Typical Performance With IF=30.72MHz,LO=2.14GHz (16)11Four-Carrier Test Mode1WCDMA,Typical Performance With IF=153.6MHz,LO=2.14GHz (17)12ACPR Versus Output Power for1Carrier WCDMA (18)13ACPR Versus Output Power for2Carriers WCDMA (18)14ACPR Versus Output Power for3Carriers WCDMA (19)15ACPR Versus Output Power for4Carriers WCDMA (19)16Optimum ACPR for1Carrier WCDMA,-7-dB Pad (20)17Optimum ACPR for2Carrier WCDMA,-7-dB Pad (21)18Optimum ACPR for3Carrier WCDMA,-7-dB Pad (22)19Optimum ACPR for4Carrier WCDMA,-7-dB Pad (23)20Default DAC GUI With f DAC/8Tone From NCO (25)21Single Sideband Spectrum Output Before DAC Offset and QMC Adjustments (25)22DAC GUI With Typical Settings To Minimize LO and Sideband (26)23Sideband and LO Compensated Using QMC Settings (27)24Board Modifications for External LO (28)25Jumper Settings to Disable TRF3761 (28)26Jumper Changes for External VCXO (29)List of Tables1Frequency Bands (3)2CDCM7005Register Values (7)Windows is a trademark of Microsoft Corporation.SLWU029D–October2006–Revised August2007TSW3003Demonstration Kit1 Submit Documentation Feedback 3Jumper List (12)4Input/Output Connections (12)5Demo Kit Typical Specifications (14)6Frequency Designations (24)7Bill of Materials (30)2TSW3003Demonstration Kit SLWU029D–October2006–Revised August2007Submit Documentation Feedback1Demonstration Kit Configuration Options 1.1DAC Component1.2VComm Configuration1.3VCXO1.4LO Generation Demonstration Kit Configuration OptionsThe TSW3003Demonstration(Demo)Kit can be configured in different ways to evaluate differentcomponents in different frequency bands.This section outlines the various component configurations.Based on the configuration,testing and board setup must be altered to accommodate the givencomponents and features.The TSW3003Demo Kit is built for the DAC5687,although this Demo Kit can also support the DAC5686 because the two devices are pin compatible.The procedures outlined in this document are primarily suited for the DAC5687,but can be modified easily for the DAC5686if desired.The analog quadrature modulator requires a common-mode dc voltage of approximately3.3V.In order to use the dc-offset adjustment capabilities of the DAC5687for carrier suppression,it is imperative tomaintain a dc path from the DAC output to the modulator input.The common-mode voltage for themodulator is maintained with a passive resistor network that is designed to provide the proper operation point for the DAC5687and the TRF3703modulator.By design,in order to preserve the proper dc levels, the DAC coarse gain should be kept at the maximum(15),though deviation by a few steps is generally acceptable with no degradation in performance.The CDCM7005requires a VCXO source to derive its output clock signals.The VCXO is at referencedesignator U1.The frequency of the VCXO can be changed to operate the Demo Kit with differentclocking schemes for different modulation standards or for specific customer requirements.Denote which VCXO frequency is on the board so that the CDCM7005part can be set up properly.The followingconventions are typically used:•WCDMA:Derivatives of61.44MHz(i.e.,122.88MHz,245.76MHz,491.52MHz)•GSM:Derivatives of52MHz(i.e.,104MHz,208MHz)•CDMA2K:Derivatives of78.6432(i.e.,157.2864MHz,314.5728MHz)The integrated VCO of the TRF3761outputs the RF signal used for the LO drive on the analog quadrature modulator.The RF output frequency is contingent on the LO frequency value.The default TRF3761-Htypically has a tuning range from2028to2175MHz.Other frequency bands will require the existingTRF3761to be changed to another pin-compatible part in a different frequency ing the TRF3761 internal divider or another TRF3761part to generate frequencies outside this range requires the output terminations to be changed.Contact TI for support in this situation.The RF frequency band of the VCO must be noted in order to know how to program the TRF3761and at what frequency to measure the output RF signal from the modulator.The typical bands of operation are shown in Table1.Table1.Frequency BandsUMTS PCS GSM900DCS1800 FREQUENCY2110-2170MHz1930-1990MHz935-960MHz1805-1880MHzSLWU029D–October2006–Revised August2007TSW3003Demonstration Kit3 Submit Documentation Feedback2Block Diagrams 2.1System Block Diagram2.2Demo Kit Block DiagramBlock DiagramsThe basic radio system block diagram in Figure 1demonstrates where the TSW3003Demo Kit fits in the overall transceiver.The dash-line box components found on the TSW3003Demo Kit board.Figure 1.System Block DiagramThe basic Demo Kit block diagram is shown in Figure 2.The shaded boxes illustrate the key Texas Instruments components found on the TSW3003Demo Kit board.Figure 2.Demo Kit Block DiagramTSW3003Demonstration Kit4SLWU029D–October 2006–Revised August 2007Submit Documentation Feedback3Key Texas Instruments Components 3.1CDCM70053.2DAC56873.3TRF37033.4TRF37614Software Installation5Software Operation Key Texas Instruments ComponentsThe CDCM7005clock distribution chip is used to generate and synchronize the clock outputs to thesystem.The device has five outputs which can be either LVPECL or LVCMOS and can be divided down by1,2,3,4,6,8,and16.The divide by16can be replaced with a divide by4or8with a90degreephase shift.The DAC5687is a16-bit interpolating dual digital-to-analog converter(DAC).The device incorporates a digital modulator,independent differential offset control,and I/Q amplitude control.The device is typically used in baseband mode or in low IF mode with an analog quadrature modulator.The TRF3703is a direct upconversion IQ modulator.This device accepts a differential input voltagequadrature signal at baseband or low IF frequencies and outputs a modulated RF signal based on the LO drive frequency.The TRF3761is a family of high performance,highly integrated frequency synthesizers,optimized forwireless infrastructure applications.The TRF3761includes an integrated VCO and integer-N PLL.Different members of the TRF3761family can be chosen for application specific VCO frequency ranges.This section summarizes the installation procedures for the software required to operate the Demo Kit.Once all of the software is loaded,it is recommended to reboot the computer.This software has beenverified to be functional on Win2K and WinXP.•Execute setup.exe•Reboot computer as required by the Windows™operating system.•Power up the TSW3003EVM,and plug in the USB cable.•Allow the Windows™operating system to automatically find and install the TSW3003USB drivers.•Start the TSW3003USB Vx.x software.The following describes the use of the software required to set the TSW3003Demo Kit in the baseline configuration for the CDCM7005,TRF3761,and DAC5687.The software should be configured in theorder presented below.The first step requires starting the TSW3003software.This opens a window as shown in Figure3.The tabs on the left side of the window allow selection of different GUI controllers for the and CDCM7005.The lower left portion of the screen contains links to this user's guide as well as the data sheets for the DAC5687,TRF3761,and the CDCM7005.SLWU029D–October2006–Revised August2007TSW3003Demonstration Kit5 Submit Documentation Feedback5.1CDCM7005SoftwareSoftware OperationFigure 3.TSW3003Startup ScreenBy using the provided CDCM7005serial peripheral interface (SPI)software,the user can load settings to the CDCM7005internal registers.This must be performed every time the TSW3003Demo Kit is powered up,because the CDCM7005has default settings that are loaded at power up and the settings may be slightly different than the ones required to operate the Demo Kit.Executing the program brings up the interface seen in Figure 4.The default settings are correct for a VCXO of 491.52MHz and a 10MHz reference as on The CDCM7005GUI allows register settings to be saved and can be loaded back in afterwards.This can be accomplished with the Save and Load Settings buttons near the right side of the GUI.It is recommended that any unused output clocks be tri-stated.In this case the TSW3003only usesOUT_MUX_1to drive the DAC5687.OUT_MUX_0,OUT_MUX_2,OUT_MUX_3,OUT_MUX_4should be tri-stated unless there is a need to use the other output clocks.6TSW3003Demonstration KitSLWU029D–October 2006–Revised August 2007Submit Documentation FeedbackSoftware OperationFigure4.Default CDCM7005SPI GUIThe divider parameters,M and N,are determined according to the following equation based on theinternal reference frequency and internal VCXO frequency.F REF=(F VCXO×M)/(N×P)The p parameter is the VCXO input divider and set through the FB_MUX value.The M and N countervalues need to be adjusted depending on the board configuration.The M and N counter registers aredetermined by the reference frequency and the VCXO frequency.The OUT_MUX sets the divide ratios for the individual output clocks.The OUTSEL determines whether the output clocks will be used assingle-ended CMOS or differential LVPECL.With a10-MHz reference oscillator the CDCM7005settings are shown in Table2for a variety of common VCXO frequencies.A calculator is included in theCDCM7005to calculate the M and N values based on Ref and VCXO frequencies.Table2.CDCM7005Register ValuesVCXO Freq.(MHz)491.52245.76122.8861.44 Divider M125125125125Divider N768768768768FB_MUX8421SLWU029D–October2006–Revised August2007TSW3003Demonstration Kit7 Submit Documentation Feedback Software Operation5.2TRF3761SoftwareThe TRF3761software is used to program the internal PLL chip to lock the integrated VCO onto a desired frequency output.The main menu of the program is shown in Figure5.Figure5.TRF3761GUI-Main MenuThe options in the front panel allow the user to program the desired frequency of the VCO,the desired frequency of the PFD,the reference frequency,and the prescaler selection.The software then displays the actual VCO frequency,PFD frequency and the R,N,A,and B counter values to be programmed into the TRF3761.Hitting the Send button writes these values to the TRF3761.In default mode on a default board,only the desired VCO frequency(2028MHz to2175MHz)needs to be changed.For other VCO ranges,a different member of the TRF3761family needs to be selected and other parameters may need to be changed.The Advanced Operation button will bring up another user interface as shown in Figure6.Figure6.TRF3761GUI-Advanced MenuThis menu allows control of more register settings.For details on these settings,see the TRF3761data8TSW3003Demonstration Kit SLWU029D–October2006–Revised August2007Submit Documentation Feedback5.3DAC5687Software5.4DAC5687GUI Register Descriptions5.4.1Register ControlsSoftware OperationsheetThe register of interest in this menu is the MUXOUT CONTROL which can be used to of LED D4.This mode defaults to Digital PLL Lock Detect and causes the LED D4to light up when the PLL successfully locks.Normally,these menu settings do not need to be changed.If the divider ratios are changed,the TRF3761output termination needs to be modified to accommodate the new output frequency.Otherwise,the performance may be degraded.Contact TI in this situation.By using the provided software,the user can write and read control register information to the DAC5687.Once the Demo Kit is powered on and connected properly,then the GUI shown in Figure 7is displayed with the default settings read from the device.If there is a problem with the such as the Demo Kit is not powered on or the USB cable is not connected,an error message will be displayed instructing the user to correct the problem.Once corrected,hit the Read All button to read the default settings of the device.Figure 7.DAC5687GUIFor normal operation,the user needs only to select values and switches as desired.The values are automatically sent to the device and read back to verify their configuration.•Load Regs –Loads register values from a saved file to the DAC5687and updates the GUI.•Save Regs –Saves current GUI registers settings to a text file for future use.•Read All –Reads the current registers of the DAC5687.This is used to verify settings on the front panel.•Send All –Sends the current front panel registers to the device.This is generally only used when the Demo Kit power has recycled or the device has been reset and the user wants to load the displayed settings to the device.•Load Factory Optimization –Load default LO and sideband optimized values for the default board condition.SLWU029D–October 2006–Revised August 2007TSW3003Demonstration Kit 9Submit Documentation Feedback Software Operation5.4.2Configuration Controls•Full Bypass–When set,all filtering,QMC,and NCO functions are bypassed.•FIR Bypass–Bypass all interpolation filters.QMC INCO functional.Limited to FDAC=250MHz•FIFO Bypass–When set to bypass,the internal four sample FIFO is disabled.When cleared,the FIFO is enabled.•FIR A–A side first FIR filter in high-pass mode when set,low-pass mode when cleared.•FIR B–B side first FIR filter in high-pass mode when set,low-pass mode when cleared.•Dual Clk–Only used when the PLL is disabled.When set,two differential clocks are used to input the data to the chip;CLK1/CLK1C is used to latch the input data into the chip,and CLK2/CLK2C is usedas the DAC sample clock.•Interleave–When set,interleaved input data mode is enabled;both A and B data streams are input at the DA(15:0)input pins.•Inverse Sinc–Enables inverse sinc filter.•Half Rate Input–Enables half rate input mode.Input data for the DAC A data path is input to the chip at half speed using both the DA(15:0)and DB(15:0)input pins.•Sif–Sets sif_4-pin bit.A4-pin serial interface mode is enabled when on,3-pin mode when off.The DAC5687Demo Kit is configured for a3-pin serial interface,so setting to a4-bit serial interface makes reading registers impossible with the GUI.•Inv.PLL Lock–Only used when PLL is disabled and dual clock mode is disabled.When cleared, input data is latched into the chip on rising edges of the PLLLOCK output pin.When set,input data islatched into the chip on falling edges of the PLLLOCK output pin.•PLL Freq–Sets PLL VCO center frequency to low or high center frequency.•PLL Kv–Sets PLL VCO gain to either high or low gain.•Qflag–Sets qflag bit.When set,the QFLAG input pin operates as a B sample indicator when interleaved data is enabled.When cleared,the TXENABLE rising determines the A/B timingrelationship.•2's Comp–When set,input data is interpreted as2's complement.When cleared,input data is interpreted as offset binary.•Rev A Bus–When cleared,DA input data MSB to LSB order is DA(15)=MSB and DA(0)=LSB.When set,DA input data MSB to LSB order is reversed,DA(15)=LSB and DA(0)=MSB.•Rev B Bus–When cleared,DB input data MSB to LSB order is DB(15)=MSB and DB(0)=LSB.When set,DB input data MSB to LSB order is reversed,DB(15)=LSB and DB(0)=MSB.•USB–When set,the data to DACB is inverted to generate upper side band output.•Inv.Clk I(Q)–Inverts the DAC core sample clock when set,normal when cleared.•Sync_Phstr–When set,the internal clock divider logic is initialized with a PHSTR pin low to high transition.•Sync_cm–When set,the coarse mixer is synchronized with a PHSTR low-to-high transition.•Sync_NCO–When set,the NCO phase accumulator is cleared with a phstr low-to-high transition.•Phstr Clk Div Select–Selects the clock used to latch the PHSTR input when restarting the internal clock dividers.When set,the full rate CLK2signal latches PHSTR and when cleared,the divided down input clock signal latches PHSTR.•DAC Serial Data–When set,both DAC A and DAC B input data is replaced with fixed data loaded into the16-bit serial interface DAC Static Data.–Counter Mode–Controls the internal counter that can be used as the DAC data source:{off;all 16b;7b LSBs;5b MIDs;5b MSBs}.–DAC Static Data–When DAC Serial Data is set,both DAC A and DAC B input data is replaced with fixed data loaded with this value.Range=0-65535.•Alt.PLLLOCK Output–Can be used to determine alternate outputs on the PLLLOCK pin when using the internal PLL mode.The EXTLO pin must be open when using this mode.•NCO–When set,enables NCO.–NCO Gain–Sets NCO gain resulting in a2x increase in NCO output amplitude.Except for F s/2 and F s/4mixing NCO frequencies,this selection can result in saturation for full-scale inputs.Consider using QMC gain for lower gains.10TSW3003Demonstration Kit SLWU029D–October2006–Revised August2007Submit Documentation Feedback分销商库存信息: TITSW3003EVM。
DB3-TP;中文规格书,Datasheet资料
Featuresl The three layer, two terminal, axial lead, hermetically sealeddiacs are designed specifically for triggering thyristors.l These diacs are intended for use in thyrisitors phase control ,circuits for lamp dimming, universal motor speed control ,and heat control. Maximum Ratingsl Operating Temperature: -40oC to +110oC l Storage Temperature: -40oC to +125oCElectrical Characteristics @ 25o C Unless Otherwise SpecifiedDB3/DC34 AND DB4/DB6SILICONBIDIRECTIONALDIAComp onents 20736 Marilla Street Chatsworth! "# $ % ! "#Micro Commercial ComponentsT ype number is marked.• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates Compliant. See ordering information)• Moisture Sensitivity: Level 1 per J-STD-020C 2. Electrical characteristics applicable in both forward andNote: 1. Lead in Glass Exemption Applied, see EU Directive Annex 5.reverse directions. 3. Connected in parallel with the devices.TMMicro Commercial ComponentsMicro Commercial ComponentsOrdering InformationDevice Packing (Part Number)-TP Tape&Reel; 10Kpcs/Reel(Part Number)-AP Ammo Packing;5Kpcs/AmmoBox(Part Number)-BP Bulk;500pcs/Bag***IMPORTANT NOTICE***Micro Commercial Components Corp . reserve s the right to make changes without further notice to anyproduct herein to make corrections, modifications , enhancements , improvements , or other changes .Micro Commercial Components Corp.does not assume any liability arising out of the application oruse of any product described herein; neither does it convey any license under its patent rights ,northe rights of others . The user of products in such applications shall assume all risks of such useand will agree to hold Micro Commercial Components Corp.and all the companies whoseproducts are represented on our website, harmless against all damages.***APPLICATIONS DISCLAIMER***Products offer by Micro Commercial Components Corp.are not intended for use in Medical,Aerospace or Military Applications.分销商库存信息: MICRO-COMMERICAL-CO DB3-TP。
MMSD103T1G;中文规格书,Datasheet资料
TA = 150C
150C
TA = 25C TA = −55C 1 2 5 10 20 50 100 200 300
1
10
100
1000
FORWARD CURRENT (mA)
REVERSE VOLTAGE (V)
Figure 2. Forward Voltage
Figure 3. Reverse Leakage
Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 6
1
Publication Order Number: MMSD103T1/D
/
MMSD103T1G, SMMSD103T1G
Figure 1. Recovery Time Equivalent Test Circuit
2
/
MMSD103T1G, SMMSD103T1G
1200 FORWARD VOLTAGE (mV) REVERSE CURRENT (nA) 1000 800 600 400 200 1 TA = −55C 25C 7000 6000 5000 4000 3000 6 5 4 3 2 1 0
Features
AEC−Q101 Qualified and PPAP Capable S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements Compliant*
MAXIMUM RATINGS
Rating Continuous Reverse Voltage Peak Forward Current Peak Forward Surge Current
SDMK0340L-7-F;SDMK0340L-7;中文规格书,Datasheet资料
SURFACE MOUNT SCHOTTKY BARRIER DIODEFeatures• Low Forward Voltage Drop• Guard Ring Die Construction for Transient Protection • Ideal for Low Logic Level Applications• Low Capacitance• Lead, Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 2 and 3)Mechanical Data• Case: SOD-323• Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0• Moisture Sensitivity: Level 1 per J-STD-020D• Leads: Solderable per MIL-STD-202, Method 208• Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe).• Polarity: Cathode Band• Marking Information: See Page 3• Ordering Information: See Page 3• Weight: 0.004 grams (approximate)Top ViewMaximum Ratings@T A = 25°C unless otherwise specifiedCharacteristic Symbol Value UnitPeak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RRMV RWMV R40 VRMS Reverse Voltage V R(RMS)28 V Maximum (Peak) Forward Current I FM30 mANon-Repetitive Peak Forward Surge Current @8.3msSingle half sine-wave superimposed on rated load(JEDEC method)I FSM200 mA Thermal CharacteristicsCharacteristic Symbol Value UnitPower Dissipation P D160 mWThermal Resistance, Junction to Ambient Air RθJA625 °C/W Operating and Storage Temperature Range T J, T STG-40 to +125 °CElectrical Characteristics@T A = 25°C unless otherwise specifiedCharacteristic Symbol Min Typ Max Unit Test Condition Reverse Breakdown Voltage (Note 1) V(BR)R40 ⎯⎯V I R = 10uAForward Voltage Drop V F⎯290 370 mV I F = 1mALeakage Current (Note 1) I R⎯0.20 0.5 μA V R = 30VTotal Capacitance C T⎯ 2 ⎯pF V R = 1V f = 1.0 MHz Notes: 1. Short duration pulse test used to minimize self-heating effect.2. No purposefully added lead. Halogen and Antimony Free.3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Products manufactured prior to DateCode V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.Please click here to visit our online spice models database.I , I N S T A N T A N E O U S F O R W A R D C U R R E N T (A )F V , INSTANTANEOUS FORWARD VOLTAGE (V)Fig. 1 Typical Forward Characteristics F 100m 1m10m100µ10µ1µ1I , I N S T A N T A N E O U S R E V E R S E C U R R E N T (A )R V , INSTANTANEOUS REVERSE VOLTAGE (V)Fig. 2 Typical Reverse Characteristics R100n1n1010001015C , T O T A L C A P A C I T A N C E (p F )T V , DC REVERSE VOLTAGE (V)Fig. 3 Total Capacitance vs. Reverse Voltage R0.10.20.5152100481216202428t , RE V E R S E R E C O V E R Y T I M E (n s )r r I , FORWARD CURRENT (mA)Fig. 4 Typical Reverse Recovery Time Characteristics F500255075100125P , P O W E R D I S S I P A T I O N (m W )D T , AMBIENT TEMPERATURE (C)Fig. 5 Power Derating CurveA °100200150Ordering Information (Note 4)DevicePackaging Shipping SDMK0340L-7-FSOD-323 3000/Tape & ReelNotes: 4. For packaging details, go to our website at /datasheets/ap02007.pdf.Marking InformationSRSR = Product Type Marking CodePackage Outline DimensionsSuggested Pad LayoutIMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.SOD-323 Dim Min Max A 0.25 0.35 B 1.20 1.40 C 2.30 2.70 H 1.60 1.80 J 0.00 0.10 K 1.0 1.1 L0.20 0.40 M 0.10 0.15α0° 8°All Dimensions in mmDimensions Value (in mm)Z 3.75 G 1.05 X 0.65Y1.35C2.40分销商库存信息:DIODESSDMK0340L-7-F SDMK0340L-7。
Modicon TM3模块产品数据表说明书
i s c l a i me r : T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t ef o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i ng s u i t a b i l i t y o r r e l i a b i l i t y o f th e s e p r o d u c t s f o r s p e ci f i c u s e r a p p l i c a t i o n sMainRange of productModicon TM3Product or component typeInput/Output analog module Range compatibility Modicon M251Modicon M221Modicon M241Analogue input number 2Analogue input type Current, analogue input range: 4...20 mACurrent, analogue input range: 0...20 mAVoltage, analogue input range: 0...10 VVoltage, analogue input range: - 10...10 VThermocouple, analogue input range: - 200...1000 °C with thermocouple JThermocouple, analogue input range: - 200...1300 °C with thermocouple KThermocouple, analogue input range: 0...1760 °C with thermocouple RThermocouple, analogue input range: 0...1760 °C with thermocouple SThermocouple, analogue input range: 0...1820 °C with thermocouple BThermocouple, analogue input range: - 200...400 °C with thermocouple TThermocouple, analogue input range: - 200...1300 °C with thermocouple NThermocouple, analogue input range: - 200...800 °C with thermocouple EThermocouple, analogue input range: 0...2315 °C with thermocouple CNi 100/Ni 1000 temperature probe, analogue input range: - 60...180 °CPt 100 temperature probe, analogue input range: - 200...850 °CPt 1000 temperature probe, analogue input range: - 200...600 °CAnalogue output number 1Analogue output type4...20 mA current0...20 mA current0...10 V voltage- 10...10 V voltage ComplementaryAnalogue input resolution15 bits + sign 16 bits Permissible continuous overload13 V voltage 40 mA current Input impedance<= 50 Ohm current3.91 µA, analogue output:4...20 mA current0.1 °C thermocoupleLoad type ResistiveLoad impedance ohmic 1 kOhm voltage300 Ohm currentStabilisation time 1 msConversion time100 ms + 100 ms per channel + 1 controller cycle time for analogue input thermocouple100 ms + 100 ms per channel + 1 controller cycle time for analogue input temperature probe10 ms + 10 ms per channel + 1 controller cycle time for analogue input voltage/currentSampling duration10 ms for analogue input voltage/current100 ms for analogue input voltage/current100 ms for analogue input thermocouple100 ms for analogue input temperature probeAbsolute accuracy error+/- 1 % of full scale+/- 0.1 % of full scale at 25 °C for analogue input voltage/current+/- 0.1 % of full scale for thermocouple C+/- 0.1 % of full scale for Pt 100/Pt 1000, Ni 100/ Ni 1000 temperature probe+/- 6 °C at 0...200 °C for thermocouple R+/- 6 °C at 0...200 °C for thermocouple S+/- 0.4 % of full scale at <= 0 °C for thermocouple K+/- 0.4 % of full scale at <= 0 °C for thermocouple J+/- 0.4 % of full scale at <= 0 °C for thermocouple E+/- 0.4 % of full scale at <= 0 °C for thermocouple T+/- 0.4 % of full scale at <= 0 °C for thermocouple N+/- 0.1 % of full scale at 25 °C for analogue output voltage/currentTemperature drift+/- 0.006 %FS/°CRepeat accuracy+/-0.5 %FS for input+/- 0.4 %FS for outputNon-linearity+/- 0.01 %FS analog output+/- 0.1 %FS analog inputOutput ripple20 mVCross talk<= 1 LSB[Us] rated supply voltage24 V DCSupply voltage limits20.4...28.8 VType of cable<= 30 m twisted shielded pairs cable for input/output circuitCurrent consumption55 mA at 24 V DC (no load) via external supply55 mA at 5 V DC (no load) via bus connector60 mA at 5 V DC (full load) via bus connector80 mA at 24 V DC (full load) via external supplyLocal signalling 1 LED green for PWRElectrical connection11 x 2.5 mm² removable screw terminal block with pitch 5.08 mm adjustment for inputs, outputs andsupplyInsulation500 V AC between output and internal logic500 V AC between input and internal logic1500 V AC between input and supply1500 V AC between output and supplyMarking CESurge withstand 1 kV for power supply with common mode protection conforming to EN/IEC 61000-4-50.5 kV for power supply with differential mode protection conforming to EN/IEC 61000-4-51 kV for I/O with common mode protection conforming to EN/IEC 61000-4-50.5 kV for I/O with differential mode protection conforming to EN/IEC 61000-4-5Mounting support Top hat type TH35-15 rail conforming to IEC 60715Top hat type TH35-7.5 rail conforming to IEC 60715Plate or panel with fixing kit8 kV in air conforming to EN/IEC 61000-4-2Resistance to electromagnetic fields 10 V/m at 80 MHz...1 GHz conforming to EN/IEC 61000-4-33 V/m at 1.4 GHz...2 GHz conforming to EN/IEC 61000-4-31 V/m at2 GHz...3 GHz conforming to EN/IEC 61000-4-3Resistance to magnetic fields 30 A/m at 50...60 Hz conforming to EN/IEC 61000-4-8Resistance to fast transients 1 kV I/O conforming to EN/IEC 61000-4-4Resistance to conducted disturbances,induced by radio frequency fields 10 V at 0.15...80 MHz conforming to EN/IEC 61000-4-63 V at spot frequency (2, 3, 4, 6.2, 8.2, 12.6, 16.5, 18.8, 22, 25 MHz) conforming to Marinespecification (LR, ABS, DNV, GL)Electromagnetic emission Radiated emissions, test level: 40 dBμV/m QP class A (10 m at 30...230 MHz) conforming to EN/IEC 55011Radiated emissions, test level: 47 dBμV/m QP class A (10 m at 230 MHz...1 GHz) conforming to EN/IEC 55011Immunity to microbreaks 10 ms Ambient air temperature for operation -10...55 °C (horizontal installation)-10...35 °C (vertical installation)Ambient air temperature for storage -25...70 °C Relative humidity 10...95 % without condensation in operation10...95 % without condensation in storage IP degree of protection IP20Pollution degree 2Operating altitude 0...2000 m Storage altitude 0...3000 m Vibration resistance 3.5 mm at 5...8.4 Hz with DIN rail mounting support3 gn at 8.4...150 Hz with DIN rail mounting support Shock resistance15 gn during 11 ms Offer Sustainability Sustainable offer statusGreen Premium product RoHS (date code: YYWW)Compliant - since 1415 - Schneider Electric declaration of conformity Schneider Electric declaration of conformity REAChReference not containing SVHC above the threshold Reference not containing SVHC above the threshold Product environmental profile Available Product environmental Product end of life instructionsAvailableEnd of life manual(*)8.5 mm/0.33 in when the clamp is pulled out.Incorrect Mounting(1)Install a mounting strip Mounting Hole LayoutWiring Diagram (Current/Voltage type)(*)Type T fuse (1)Current/Voltage analog output device (2)Current/Voltage analog input deviceWiring Diagram (Thermocouple input type)(*)Type T fuse (2)Current/Voltage analog input device (3)ThermocoupleWiring Diagram (Temperature probe input type)(*)Type T fuse (2)Current/Voltage analog input device。
IM03TS中文资料
IM RelayThe Best Rela ytionSlim line AND low profile2 pole telecom/signal relay, polarizedThrough Hole Types (THT), standard versionwith 5.08 mm, narrow version with 3.2 mm between the terminal rows orSurface Mount Type (SMT)Relay types:non-latching with 1 coil latching with 1 coilFeatures-Telecom/signal relay (dry circuit, test access, ringing)-Slim line10 x 6 mm, 0.39 x 0.24 inch -Low profile 5.65 mm, 0.222 inch -Minimum board-space 60 mm 2-Switching current 2 A- 2 changeover contacts (2 form C / DPDT)-Bifurcated contacts, gold plated-High sensitivity results in low nominal power consumption 140 mW for non latching 100 mW for latching version -High surge capability (1.2/50 µs and 10/700 µs) meets Bellcore GR 1089, FCC Part 68 and ITU-T K20³1500 V between open contacts ³ 2500 V between coil and contacts -High mechanical shock resistance up to 300 G functional up to 500 G survival Typical applications:-Communications equipmentLinecard application – analog, ISDN, xDSL,PABXVoice over IP -Office and business equipment -Measurement and control equipment -Consumer electronics Set top boxes, HiFi -Medical equipment Options:Surge capability ³ 2500 V between open contactsInsulation category:Supplementary insulation according IEC/EN 60950 and UL 1950Working voltage £ 300 Vrms Mains supply voltage SMT: 250 VrmsTHT: 200 VrmsRepetitive peak voltage 2500 V Pollution degree:External: 2Internal: 1Flammability classification:V-0Maximum operating temperature:85°CCSA-C22.2 No. 14-95 File No. 169679-1079886CSA-C22.2 No. 950-95UL 508 File No. E111441UL 1950 3rd ed.QC 160501-CH0001IEC/EN60950IEC Ref. Cert. No. 1176CECC 16501-003THT VersionMounting hole layoutView onto the component side of the PCB(top view)Terminal assignmentRelay - top view Non-latching type,not energized conditionDimensionsIM THT IM THT IM SMT IM SMT StandardNarrowGull WingsJ-Legsmminchmminch mminchL 10 ±0.080.393 ±0.00310 ±0.080.393 ±0.00310 ±0.080.393 ±0.00310 ±0.080.393 ±0.003W 6 ±0.080.236 ±0.0035.7 ±0.30.224 ±0.0126 ±0.080.236 ±0.0036 ±0.080.236 ±0.003H 5.65 -0.20.222 -0.008 5.85 -0.150.230 -0.0065.65 -0.20.222 -0.0085.65 -0.20.222 -0.008T 3.20.125 3.20.125N/A N/A N/AN/AT1N/AN/AN/A N/A 7.5 ±0.30.295 ±0.0112.8 ±0.20.110 ±0.007T2 5.08±0.10.200 ±0.0043.2±0.10.126 ±0.0065.08 ±0.10.200 ±0.0045.08 ±0.10.200 ±0.004D13.2 ±0.150.126 ±0.0063.2 ±0.150.126 ±0.0063.2 ±0.150.126 ±0.0063.2 ±0.150.126 ±0.006D22.2 ±0.150.087 ±0.0062.2 ±0.150.087 ±0.0062.2 ±0.150.087 ±0.0062.2 ±0.150.087 ±0.006Tw 0.40.0150.40.0150.40.0150.40.015S 0.3 ±0.050.011 ±0.0020.3 ±0.050.011 ±0.002N/AN/A N/AN/ASMT VersionGull WingsJ LegsSolder pad layoutView onto the component side of the PCB (top view)Gull WingsJ LegsLatching type, 1 coil reset conditionStandard versionNarrow versionStandard versionNarrow version1.5 1.13 3.40.1514016IM0032.1 6.80.3014064IM014.53.1510.30.45140145IM025 3.511.40.50140178IM0364.213.70.60140257IM049 6.320.40.90140574IM05128.427.3 1.201401028IM062416.845.62.402002880IM07non-latching 1 coillatching 1 coil1.5 1.13 4.1- 1.1310023IM4032.258.1- 2.2510090IM414.53.3812.1- 3.38100203IM425 3.7513.5- 3.75100250IM4364.516.2- 4.50100360IM449 6.7524.2- 6.75100810IM45129.0032.3- 9.001001440IM462418.0041.9- 18.002002880IM47Further coil versions are available on request.Ambient temperature t amb [°C]U I =Minimum voltage at 23° C after pre-energizing with nominal voltage without contact current U II =Maximum continous voltage at 23°The operating voltage limits U I and U II depend on the temperature according to the formula:U I tamb =K I · U I 23° Cand U II tamb =K Il · U Il 23° C t amb= Ambient temperatureU I tamb = Minimum voltage at ambient temperature, t amb U II tamb = Maximum voltage at ambient temperature, t ambk I , k II= Factors (dependent on temperature), see diagram* High Dielectric Version …C“All data refers to 23° C unless otherwise specified.Recommended soldering conditionsSoldering conditions according CECC 00802Vapor Phase Soldering: Temperature/Time Profile (Lead Temperature)Infrared Soldering: Temperature/Time Profile (Lead Temperature)Time (s)Time (s)T e m p e r a t u r e °CT e m p e r a t u r e °CPacking Dimensions in mm Tube for THT version - 50 relays per tube, 1000 relays per boxIM00GR3-1462037-7 IM00JR3-1462037-9 IM00TS3-1462037-5 IM00NS1-1462038-0 IM01GR0-1462037-1 IM01CGR0-1462038-4 IM01JR4-1462037-0 IM01TS0-1462037-4 IM01NS1-1462038-1 IM02GR0-1462037-9 IM02CGR0-1462038-1 IM02JR1-1462037-1 IM02TS1-1462037-3 IM02NS1-1462038-2 IM03GR1-1462037-4 IM03CGR0-1462038-2 IM03JR1-1462037-6 IM03TS1-1462037-8 IM03NS1-1462038-3 IM04GR4-1462037-2 IM04JR4-1462037-4 IM04TS4-1462037-1 IM04NS1-1462038-4 IM05GR3-1462037-4 IM05CGR0-1462038-3 IM05JR4-1462037-5 IM05TS2-1462037-2 IM05NS1-1462038-5 IM06GR2-1462037-3 IM06CGR9-1462037-9 IM06JR4-1462037-6 IM06TS2-1462037-7 IM06NS1-1462038-6 IM07GR4-1462037-7 IM07JR4-1462037-8IM07TS3-1462037-0 IM07NS1-1462038-7 IM40GR5-1462037-1 IM40JR5-1462037-2 IM40TS5-1462037-0 IM40NS1-1462038-8 IM41GR5-1462037-4 IM41JR5-1462037-5 IM41TS5-1462037-3 IM41NS1-1462038-9 IM42GR3-1462037-1 IM42JR5-1462037-7 IM42TS5-1462037-6 IM42NS2-1462038-0 IM43GR5-1462037-9 IM43JR6-1462037-0 IM43TS5-1462037-8 IM43NS2-1462038-1 IM44GR6-1462037-2 IM44JR6-1462037-3 IM44TS6-1462037-1 IM44NS2-1462038-2 IM45GR6-1462037-4 IM45JR6-1462037-5 IM45TS3-1462037-2 IM45NS2-1462038-3 IM46GR6-1462037-7 IM46JR6-1462037-8 IM46TS6-1462037-6 IM46NS2-1462038-4 IM47GR7-1462037-0 IM47JR7-1462037-1 IM47TS6-1462037-9 IM47NS2-1462038-5Relay Code TycoPart Number Relay Code TycoPart NumberOrdering InformationIM Relays4th generation slim line – low profile polarized 2 c/o telecom relay with bifurcated contacts, available as non latching or latching relay with1 coil. Nominal voltage range from 1.5... 24 V, coil power consumption of 140... 200 mW, latching relays with 1 coil 100 mW. The IM relay is available as through hole and surface mount type (J-Legs and Gull Wings) and capable to switch loads up to 60 W/62,5 VA. Dielectric strength fulfills the Bellcore requirements according GR 1089 (2,5 kV –2 / 10 µs) and FCC part 68 (1,5 kV – 10 / 160 µs). The IM is CECC/ IECQ approved and certified in accordance with IEC/EN 60950 and UL1950. Dimensions approx. 10 x 6 mm board space and 5.65 mm height.P2 Relays3rd generation polarized 2 c/o telecom relay with bifurcated contacts, available as non latching or latching relay with 1 or 2 coils. Nominal voltage range from 3 ... 24 V, coil power consumption 140 mW, latching relays with 1 coil 70 mW. The P2 relay is available as through hole or surface mount type and capable to switch currents up to 5 A. Dielectric strength fulfills the Bellcore requirements according GR 1089 (2,5 kV – 2 / 10 µs) and FCC part 68 (1,5 kV – 10 / 160 µs). Dimensions approx. 15 x 7,5 mm board space and 10 mm height.FX Relays3rd generation polarized 2 c/o telecom relay with bifurcated contacts, available as non latching or latching relay with 1 coil. Nominal voltage range from 3 ... 48 V, coil power consumption of 80 ... 260 mW for the high sensitive version, 140... 300 mW for the standard version, latching relays with 1 coil 100 mW. The FX2 relay is available as through hole type and capable to switch loads up to 60 W/62,5 VA. Dielectric strength fulfills the Bellcore requirements according GR 1089 (2,5 kV – 2 / 10 µs) and FCC part 68 (1,5 kV – 10 / 160 µs). The FX2 is CECC/IECQ approved and certified in accordance with IEC/EN 60950 and UL1950. Dimensions approx. 15 x 7,5 mm board space and 10,7 mm height.FT2 / FU2 Relays3rd generation non polarized, non latching 2 c/o telecom relay with bifurcated contacts. Nominal voltage range from 3 ... 48 V, coil power consumption 200 ... 300 mW. Most sensitive 48 V relay. Available as through hole and surface mount type. Dielectric strength fulfills the Bellcore requirements according GR 1089 (2,5 kV – 2 / 10 µs) and FCC part 68 (1,5 kV – 10 / 160 µs). The FT2/FU2 is CECC/IECQ approved and certified in accordance with IEC/EN 60950 andUL1950. Dimensions approx. 15 x 7,5 mm board space and 10 mm height.FP2 Relays3rd generation polarized 2 c/o telecom relay with bifurcated contacts, available as non latching or latching relay with 1 or 2 coils. Nominal voltage range from 3 ... 48 V, coil power consumption of 80 ...260 mW for the high sensitive version, 140... 300 mW for the standard version, latching relays with 1 coil 100 mW.. The FP2 relay is available as through hole type and capable to switch loads up to30 W/62,5 VA. Dielectric strength fulfills FCC part 68 (1,5 kV – 10 / 160 µs). The FP2 is CECC/IECQ approved. Dimensions approx.14 x 9 mm board space and 5 mm height.MT2 / MT42nd generation non polarized, non latching 2 c/o and 4 c/o telecom and signal relay with bifurcated contacts. Nominal voltage range from 4.5 ... 48 V, coil power consumption 150/200/300/400 and550 mW, and 300 mW (MT4). Dielectric strength fulfills the requirements according FCC part 68 (1,5 kV – 10 / 160 µs) for both and the Bellcore requirements according GR 1089 (2,5 kV – 2 / 10 µs) the MT4 only.Dimensions MT2 approx. 20 x 10 mm board space and 11 mm height, MT4 approx. 20 x15 mm board space and 11 mm height.D2n Relays2nd generation non polarized 2 c/o relay for telecom and various other applications. Nominal voltage range from 3 ... 48 V, coil power consumption from 150 .... 500 mW. The D2n relay is capable to switch currents up to 3 A. Dielectric strength fulfills the requirements according FCC part 68 (1,5 kV – 10 / 160 µs). Dimensions approx.20 x10 mm board space and 11,5 mm height.P1 RelaysExtremely sensitive, polarized 1 c/o relay with bifurcated contacts for a wide range of applications, available as non latching or latching relay with 1 or 2 coils. Nominal voltage range from 3 ... 24 V, coil power consumption 65 mW, latching relays with 1 coil 30 mW. The P1 relay is available as through hole or surface mount type and capable to switch currents up to 1 A. Dielectric strength fulfills the requirements according FCC part 68 (1,5 kV – 10 / 160 µs). Dimensions approx.13 x 7,6 mm board space and 7 mm height for THT or 8 mm height for SMT version.W11 RelaysLow cost, non polarized 1 c/o relay for various applications. Nominal voltage range from 3 ... 24 V, coil power consumption 450 mW, sensitive versions 200 mW. The W11 relay is capable to switch currents up to 3 A. Dielectric strength 1000 Vrms. Dimensions approx. 15,6 x 10,6 mm board space and 11,5 mm height.Reed RelaysHigh sensitive, non polarized relay for telecom and various other applications, available with 1 n/o, 2 n/o or 1c/o contacts. Nominal voltage range from 5 ... 24 V, coil power consumption 50...280 mW for 1 n/o and 125 ... 280 mW for 2 n/o or 1 c/o versions. Reedrelays are available in DIP or SIL housing and capable to switch currents up to 0,5 A. Integrated diode and/or electrostatic shield optional. Dielectric strength 1500 Vdc. Dimensions approx. 19,3 x 7 mm board space and 5 ... 7,5 mm height for DIP or 19,8 x 5 mm board space and 7,8 mm height for SIL version.Cradle RelaysExtremely reliable and mature relay family of 1st generation for various signal switching applications. Available as non polarized, polarized / latching and relay with AC coil. The benefit is the possibility of combining various contact sets from 1 up to 6 poles, single and bifurcated contacts, different contact materials with a coil voltage range from 1,5 Vdc to 220 Vac. Cradle relays are available as dust protected and hermetically sealed versions, with plug in or solder terminals and are capable to switch currents up to 5 A. Forcibly guided (linked) contact sets optional. Dielectric strength 500 Vrms. Dimensions from approx. 19 x 24 to 19x35 mm board space and30 mm height.Other RelaysWe offer a variety of different relay families for maintenance and replacement purposes. These relays are up to 60 years old now, such as Card Relay SN (V23030 / V23031 series), Small General Purpose Relay (V23006 series), Small Polarized Relay (V23063 ... V23067 and V23163 ... V23167 series). Accessories like sockets, hold down springs, etc. optional.Tyco Electronics AXICOM Ltd.Seestrasse 295 - P.O. Box 220CH-8804 Au-Wädenswil / Switzerland Phone +41 1 782 9111Fax +41 1 782 9080E-mail: axicom@Tyco Electronics Corporation POB 3608,Harrisburg, PA 17105, USA Phone +1 800-522-6752Tyco Electronics EC Trutnov s.r.o.Komenského 821CZ-541 01 Trutnov / Czech Republic E-mail: axicom@Tyco Electronics AMP GmbH Paulsternstrasse 26D-13629 Berlin / Germany Phone +49 30 386 38260Fax +49 30 386 38569E-mail: axicom@A p r i l 2002R e v . 3.01。
NJD2873T4G;中文规格书,Datasheet资料
NJD2873T4G,NJVNJD2873T4GPower TransistorsNPN Silicon DPAK For Surface Mount ApplicationsDesigned for high−gain audio amplifier applications.Features•High DC Current Gain −h FE = 120 (Min) @ I C = 500 mA= 40 (Min) @ I C = 2 A•Low Collector−Emitter Saturation V oltage −V CE(sat) = 0.3 Vdc (Max) @ I C = 1 A•High Current−Gain − Bandwidth Product −f T = 65 MHz (Min) @ I C = 100 mA•Epoxy Meets UL 94 V−0 @ 0.125 in•ESD Ratings:♦Human Body Model, 3B > 8000 V♦Machine Model, C > 400 V•NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable•These are Pb−Free PackagesMAXIMUM RATINGSRating Symbol Value Unit Collector−Base Voltage V CB50Vdc Collector−Emitter Voltage V CEO50Vdc Emitter−Base Voltage V EB5VdcCollector Current Continuous Peak I C23AdcBase Current I B0.4AdcTotal Device Dissipation @ T C = 25°C Derate above 25°C P D150.1WW/°CTotal Device Dissipation @ T A = 25°C* Derate above 25°C P D1.680.011WW/°COperating and Storage JunctionTemperature RangeT J, T stg−65 to +175°CStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.Device Package Shipping†ORDERING INFORMATIONSILICONPOWER TRANSISTORS2 AMPERES50 VOLTS15 WATTS†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.MARKING DIAGRAMA= Assembly LocationY= YearWW= Work WeekG= Pb−Free DeviceDPAKCASE 369CSTYLE 1AYWWJ2873GNJD2873T4G DPAK(Pb−Free)2,500Units / Reel NJVNJD2873T4G DPAK(Pb−Free)2,500Units / Reel11BASE3EMITTERCOLLECTOR2,424THERMAL CHARACTERISTICSCharacteristic Symbol Max UnitThermal ResistanceJunction−to−CaseJunction−to−Ambient (Note 1)R q JCR q JA1089.3°C/W1.These ratings are applicable when surface mounted on the minimum pad sizes recommended.ELECTRICAL CHARACTERISTICS (T C = 25°C unless otherwise noted)Characteristic Symbol Min Max Unit OFF CHARACTERISTICSCollector−Emitter Sustaining Voltage (Note 2) (I C = 10 mAdc, I B = 0)V CEO(sus)50−VdcCollector Cutoff Current (V CB = 50 Vdc, I E = 0)I CBO−100nAdcEmitter Cutoff Current (V BE = 5 Vdc, I C = 0)I EBO−100nAdc ON CHARACTERISTICSDC Current Gain (Note 2)(I C = 0.5 A, V CE = 2 V)(I C = 2 Adc, V CE = 2 Vdc)(I C = 0.75 Adc, V CE = 1.6 Vdc, −40°C ≤ T J≤ 150°C)h FE1204080360−360−Collector−Emitter Saturation Voltage (Note 2) (I C = 1 A, I B = 0.05 A)V CE(sat)−0.3VdcBase−Emitter Saturation Voltage (Note 2) (I C = 1 A, I B = 0.05 Adc)V BE(sat)− 1.2VdcBase−Emitter On Voltage (Note 2)(I C = 1 Adc, V CE = 2 Vdc)(I C = 0.75 Adc, V CE = 1.6 Vdc, −40°C ≤ T J≤ 150°C)V BE(on)−−1.20.95VdcDYNAMIC CHARACTERISTICSCurrent−Gain − Bandwidth Product (Note 3)(I C = 100 mAdc, V CE = 10 Vdc, f test = 10 MHz)f T65−MHzOutput Capacitance(V CB = 10 Vdc, I E = 0, f = 0.1 MHz)C ob−80pF2.Pulse Test: Pulse Width = 300 m s, Duty Cycle [ 2%.3.f T = ⎪h fe⎪• f test.TYPICAL CHARACTERISTICS0.010.1110I C , COLLECTOR CURRENT (AMPS)V C E (s a t ), C O L L E C T O R −E M I T T E R S A T U R A T I O N V O L T A G E (V )I C , COLLECTOR CURRENT (AMPS)V B E (s a t ), B A S E −E M I T T E R S A T U R A T I O N V O L T A G E (V )10010000.010.1110I C , COLLECTOR CURRENT (AMPS)h F E , D C C U R R E N T G A I N102525Figure 1. Power DeratingT, TEMPERATURE (°C)50751001251501510520P D , P O W E R D I S S I P A T I O N (W A T T S )Figure 2. DC Current Gain Figure 3. Collector −Emitter Saturation VoltageFigure 4. Base −Emitter Saturation Voltage Figure 5. Base −Emitter VoltageI C , COLLECTOR CURRENT (AMPS)V B E (o n ), B A S E −E M I T T E R V O L T A G E (V )1.21.00.80.60.40.21.10.90.70.50.3175200Figure 6. Saturation RegionI B , BASE CURRENT (mA)V C E (s a t ), C O L L E C T O R −E M I T T E R S A T U R A T I O N V O L T A G E (V )1.00.010.11100.80.60.40.2010010000.11101001000100101Figure 7. CapacitanceV R , REVERSE VOLTAGE (V)C , C A P A C I T A N C E (p F )Figure 8. Saturation RegionI C , COLLECTOR CURRENT (mA)f t a u , C U R R E N T G A I N B A N D W I D T H P R O D U C T (M H z )1001101001000100100001101001000100101Figure 9. CapacitanceV CE , COLLECTOR EMITTER VOLTAGE (V)I C , C O L L E C T O R C U R R E N T10000t, TIME (ms)r (t ), T R A N S I E N T T H E R M A L R E S I S T A N C E (N O R M A L I Z E D )Figure 10. Thermal ResponsePACKAGE DIMENSIONSDPAK CASE 369C ISSUE DSTYLE 1:PIN 1.BASE2.COLLECTOR3.EMITTER4.COLLECTORǒmm ǓSCALE 3:1*For additional information on our Pb −Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*DIM MIN MAX MIN MAX MILLIMETERSINCHES D 0.2350.245 5.97 6.22E 0.2500.265 6.35 6.73A 0.0860.094 2.18 2.38b 0.0250.0350.630.89c20.0180.0240.460.61b20.0300.0450.76 1.14c 0.0180.0240.460.61e 0.090 BSC 2.29 BSC b30.1800.215 4.57 5.46L4−−−0.040−−− 1.01L 0.0550.070 1.40 1.78L30.0350.0500.89 1.27Z0.155−−−3.93−−−NOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: INCHES.3.THERMAL PAD CONTOUR OPTIONAL WITHIN DI-MENSIONS b3, L3 and Z.4.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLDFLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE.5.DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY .6.DATUMS A AND B ARE DETERMINED AT DATUM PLANE H.H 0.3700.4109.4010.41A10.0000.0050.000.13L10.108 REF 2.74 REF L20.020 BSC 0.51 BSC DETAIL AROTATED 90 CW 5ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at /site/pdf/Patent −Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION分销商库存信息: ONSEMINJD2873T4G。
MMBT3904-TP;中文规格书,Datasheet资料
5 of 6
2011/04/13
MCC
Micro Commercial Components
TM
Ordering Information :
Device
Part Number-TP
Packing
Tape&Reel;3Kpcs/Reel
***IMPORTANT NOTICE***
MCC
Noise Figure vs Micro Commercial Components IC = 100µ A
TM
f = 1.0kHz 1.0 10 RS - (kΩ) Current Gain 100
50
100 TA - (°C)
150
200
Contours of Constant Gain Bandwidth Product (fT) 12 10 8 VCE - (V) 6 4 2 0 0.1 hfe 100 1000
MCC
TM
Micro Commercial Components
omponents 20736 Marilla Street Chatsworth !"# $
% !"#
MMBT3904
Thermal Resistance Junction to Ambient: 385 oC/W Thermal Resistance Junction to Case: 185 oC/W
C
C B
OFF CHARACTERISTICS
V(BR)CEO V(BR)CBO V(BR)EBO ICBO ICEX Vdc Vdc Vdc nAdc nAdc
Revision: C
TGM-A3中文说明书
TGM-A3中⽂说明书TGM-A3调试⼿册⼴州三兴制磅⼚有限公司020-********020-********§⼀.技术参数1.转换原理：三积分式A/D2.输⼊信号范围：0~10mV3.A/D分辩率：1000004.A/D转换速度：40次/秒5.供桥电压：DC5V可连接4只350欧姆的传感器或8只700欧姆的传感器。
6.显⽰0.8英⼨6位LED显⽰7.分度值1/2/5/10/20/50/0.1/0.2/0.5/0.01/0.02/0.05/0.001/0.002/0.005/可选8.串⾏通讯接⼝波特率1200240048009600可选9.信号RS—232连续发送RS—485应答⽅式（增配）10.RS232输出可连接⼤屏幕11.交流电源AC220V50Hz交直流两⽤内置电池12.使⽤温度0℃~40℃13.储运温度-25℃~55℃14.相对湿度≦85﹪RH15.外型尺⼨220*140*130（mm）16.重量约2公⽄§⼆.安装连接1.传感器连接采⽤D-九芯孔插座。
请按下图连接。
2.如果使⽤四芯屏蔽电缆。
必须将+E与+R，-E与-R短接。
3.+S.–S不能接反。
4.通讯连接（D-SUB-9针）3脚：TXD(RS-232C连续输出)5脚：GND5.通讯数据格式(RS-232C连续输出)通信地址X=0；连续发送⽅式，格式为=,X1,X2,X3,X4,X5,X6,发送的X1,X2,X3,X4,X5,X6为显⽰数据,=为分隔符。
重量：100.00kg,发送:=00.001=00.001。
6.可增配RS-485应答⽅式。
§三.按键功能和指⽰灯说明【①】键:开/关键【∴】键：⼿动累加功能键【*】键：功能选择键、确认键【→】键：数字移位功能键【↑】键：数字增置键,显⽰x10倍功能键【→0←】键：置零,去除⽪重功能键§五.称量标定(最新版本将标定插头JP1插到EN 位置,标定完成后将标定如刚进⾏以上参数设定操作且没有关机可直接继续进⾏以下操作，按图表所⽰步骤进⾏称量标定；§六.查看A/D 转换内码值检查传感器连线正确与否，可以查看A/D 转换内码，插上随表附赠的短路头后，正常零位的A/D 转换内码值在：36000±5000左右.如刚进⾏以上参数设定操作且没有关机可直接继续进⾏以下操作，按图表所⽰步骤进⾏A/D 值的查看；步骤操作显⽰解释1按【*】显⽰〖CAL SP 〗秤量标定2按【*】显⽰〖-SEt-〗称量参数的设定3按【*】显⽰〖-A -d-〗A/D 转换内码值4按【→】显⽰〖37000〗进⼊A/D 值的显⽰，显⽰A/D 值为370005按【*】显⽰〖0〗返回正常称重状态§七.正常操作1.仪表开机和关机仪表后盖的电源开关打开，按【①】键，仪表开机。
Modicon TM3 扩展模块参考手册说明书
TM3AM6TM3AI4TM3AI2H TM3AQ2Modicon TM3 expansion modulesCatalogue2014Digi-Cat, a handy USB key for PCContact your local representative to get your own Digi-CatHow can you fit a 6000-page catalog in your pocket ?Schneider Electric provides you with the complete set of industrial automation catalogs all on a handyUSB key for PC or in an application for tabletse-Library, the app for tablets>Convenient to carry >Always up-to-date>Environmentally friendly >Easy-to-share format>Go to the App Store and search for e-Library >or scan the QR codeIf you have an iPad ®:>Go to the Google Play Store TM and search for eLibrary >or scan the QR codeIf you have an Android tablet:General contentsModicon TM3 expansion modulesb Range presentation..................................................................................page 2b Modicon TM3 bus expansion system......................................................page 3b Modicon TM3 digital I/O modulesSelection guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .page 4v Presentation ..............................................................................................page 5v References .................................................................................................page 6b Modicon TM3 analog I/O modulesSelection guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .page 8v Presentation ............................................................................................page 10v References ................................................................................................page 11b Modicon TM3 expert module for control TeSys motor startersv Presentation ............................................................................................page 12v References ...............................................................................................page 13b Modicon TM3 functional safety modulesSelection guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .page 14v Presentation ............................................................................................page 16v References ...............................................................................................page 17b Modicon TM3 bus expansion modulesv Presentation ............................................................................................page 18v References ...............................................................................................page 19Modicon TM3 expansion modulesPresentation of the rangeDigital I/O modulesAnalog I/O modulesExpert I/O modulesFunctional Safety modules rBus expansion modulesPresentationThe Modicon TM3 expansion module offer provides an opportunity to enhance the capabilities of Modicon M221, M241 and M251 logic controllers:v Digital I/O modules which can be used to create configurations with up to264 digital I/O (according to the controller). These modules are available with the same connections as the controllers.v Analog I/O modules which can be used to create configurations with up to114 analog I/O (according to the controller) and are designed to receive, amongst other things, position, temperature or speed sensor signals. They are also capable of controlling variable speed drives or any device equipped with a current or voltage input.v Expert modules for control of TeSys motor starters which simplify wiring up the control section due to connection with RJ45 cables.v Functional Safety modules which simplify wiring and can be configured in the SoMachine Basic software.In addition, the TM3 expansion system is flexible due to the possibility of remotely locating some of the TM3 modules in the enclosure or another cabinet (up to 5 meters (16.404 ft.) away, using a bus expansion system.The Modicon TM3 expansion system is common to the whole range of ModiconM221, M241 and M251 logic controllers, meaning that the model of controller can be revised without changing expansion module.module:v removable screw terminal blocks (1) v removable spring terminal blocks (1)v HE 10 connector, to be used with HE 10 cables/bare wires or HE 10/HE 10 and Telefast sub-bases (2)The connectors (screw terminal blocks, spring terminal blocks, HE 10 connector, RJ 45) are located on the front of the TM3 expansion modules and are therefore accessible.(1) The terminal blocks are supplied with Modicon TM3 expansion modules.(2) T elefast Modicon ABE7 pre-wired system to be ordered separately (see on our website ).r Available 2nd half of 2014.Modicon TM3 expansion modules Bus expansion system2 1554233664Embedded I/O24 V chave a locking clip on the top of their casing.v For plate or panel mounting, use the TMAM2 kit.(1) Depending on type of TM3 module used (see page 5).r Available 2nd half of 2014.Selection guide Expansion modulesModicon TM3 digital I/O modules Array––––PresentationExpansion modulesModicon TM3 digital I/O modulesPresentationThe Modicon TM3 digital I/O module offer consists of 27 modules: input modules, output modules and mixed I/O modules.These digital I/O modules complement the embedded I/O on M221, M221 Book, M241 and M251 logic controllers.v For plate or panel mounting, use the TMAM2 kit.DescriptionModicon TM3 digital I/O modules1 LED display block for the module channels and diagnostics2 TM3 bus connectors (one on each side). These are designed to provide continuity of the link between connected modules.3 Input or output channel terminal blocks (depending on model: screw terminal blocks, spring terminal blocks or HE 10 connector).45 symmetrical rail locking clip.5 Adjacent module locking latch.122345ReferencesExpansion modulesModicon TM3 digital I/O modulesSold in lots of 100.143Set of terminal blocks for connecting the I/O4 x 10-way and 4 x 11-way removable terminal blocks with screw terminals for TM3DI16, TM3DQ16R, TM3DQ16T and TM3DQ16U modulesTMAT2MSET 0.1270.280 4 x 10-way and 4 x 11-way removable terminal blocks with spring terminals for TM3DI16G, TM3DQ16RG, TM3DQ16TG and TM3DQ16UG modulesTMAT2MSETG 0.1270.280(1) Removable screw or spring-type terminal blocks, supplied.(2) Modules compatible with the Telefast Modicon ABE7 pre-wired system (on our website ).TM3DI8TM3DI8GTM3DI 8ATM3DI 32KTM3DQ16UTM3DQ16UGTM3DQ16UKTM3DQ32TKTM3DQ32UKTM3DM24RTM3DM24RGSelection guide Expansion modulesModicon TM3 analog I/O modules4 inputsVoltage/currentPresentation, descriptionExpansion modulesModicon TM3 analog I/O modulesPresentationThe Modicon TM3 analog I/O module offer consists of 18 input, output and mixed input/output modules. The input modules acquire various analog values encountered in industrial applications.These I/O modules complement the embedded I/O in Modicon M221, M221 Book and M241 logic controllers.b TM3AI pp and TM3TI pp analog input modules are used to acquire various analog values (voltage, current or temperature) encountered in industrial applications. b TM3AQ pp analog output modules are used to control preactuators in physical units, such as variable speed drives or valves and applications where process control is required.b TM3TM pp and TM3AM pp mixed modules combine voltage/current or temperature analog inputs as well as one or two voltage/current outputs in the same case. b When the controller stops, the outputs of each TM3 analog modules can beconfigured to fall back (hold the last value or a specified value). This function, when set to “hold”, is useful when debugging the application or when a fault occurs, in order not to disturb the process being controlled.Breakdown of the offer Analog I/O modulesModules with 2 to 8 analog I/O:v voltage/current or temperature inputs v voltage/current outputsFormatA single format: 23.6 x 90 x 70 (0.93 x 3.54 x 2.76 in.).ConnectionWith a wide selection of modules, uniform configurations can be created in terms of connectors:v Screw-type or spring-type connectors at intervals of 5.08 (0.2 in.) for ease of wiring: identical to the connectors on Modicon M221 (TM221C pppp ) and Modicon M241 (TM241C pppp ) logic controllers.v Screw-type or spring-type connectors at intervals of 3.81 (0.15 in.) for compact dimensions: identical to the connectors on Modicon M221 Book (TM221M16pp and TM221ME16pp ) logic controllers.Configurationv Analog I/O modules connect to Modicon M221 and M221 Book, M241 and M251 logic controllers according to the general rules for the Modicon TM3 system: 7 modules max. and 14 modules max. with use of Modicon TM3 bus expansion system (transmitter and receiver).v An external 24 V c power supply is required for each Modicon TM3 analog module.v The I/O modules are designed with isolation by an optocoupler between the internal electronics and the I/O channels.Mountingv The analog modules are mounted on a 5 symmetrical rail. v For plate or panel mounting, use the TMAM2 kit.v The TM2XMTGB grounding plate simplifies connection of the analog sensor and actuator cable shielding (shielding to be connected to the device's functional ground).DescriptionModicon TM3 analog modules1 Locking latch for the adjacent module.2 TM3 bus connectors (one on each side). These are designed to provide continuity of the link between connected modules.3 Clip for locking on 5 symmetrical rail.4 Module “Power on” LED.5 Removable spring or screw terminal blocks (depending on the model) for connecting the analog channels and the 24 V power supply.TM3AI2H, TM3AQ2, TM3AQ4, TM3TM3TM3AI4, TM3TI4, TM3AI8,TM3TI8T, TM3AM63215314254ReferencesExpansion modulesModicon TM3 analog I/O modulesTM3AM6TM2XMTGBTM3AI2HTM3AQ2TM3AQ4TM3TI4TM3TI8TTM3AI4TM3AI8TM3TM3shielding (via 6.35 connectors, not supplied) and the functional grounds (FE) 0.099Shielding connection clampsSold in lots of 25Assembly and earthing of the cable shielding.Pack of 25 clamps including 20 for Ø 4.8 (0.189 in.) cable and 5 for Ø 7.9 (0.311 in.) cableTM200RSRCEMC–Mounting kit Sold in lots of 10For mounting the analog I/O modules on a plate or panelTMAM20.065 0.143Set of I/O terminal blocks4 terminal blocks with 10 pins and 4 terminal blocks with 11 removable screw terminal pins for TM3AI4, TM3TI4, TM3AI8, TM3TI8, TM3AM6 modulesTMAT2MSET 0.1270.280 4 terminal blocks with 10 pins and 4 terminal blocks with 11 removable spring terminal pins for TM3AI4G, TM3TI4G, TM3AI8G, TM3TI8G, TM3AM6G modulesTMAT2MSETG 0.1270.280(1) Removable screw terminal blocks supplied with each module.(2) Each input can be configured independently for temperature or voltage/current.PresentationThe TM3XTYS4 expert module is a pre-wired interface for use with Modicon M221, M241 and M251 logic controllers, designed to monitor and control up to four motor starters.The TM3XTYS4 expert module is a component of TeSys Solink system that allows a simple, fast and error free wiring of the motor starter.Controlling motor starters with the TM3XTYS4 expert module Each of the four channels on the TM3XTYS4 expert module has: b Two outputs for the command of the motor starter: v direction 1 commandv direction 2 command, if reversing starter. b Three inputs for the motor starter status: v Ready v Run v FaultThe inputs are connected in series with the motor starter auxiliary contacts.Connectionsv The TM3XTYS4 Expert module is equipped with four RJ 45 connectors for connection to the motor starters.v LU9R ppp type cordsets are dedicated to the connection of TeSys motor starter and equipped with an RJ 45 connector at each end.Configurationv The expert module is connected directly to the logic controllers on the TM3 bus connector or to the bus expansion system (receiver module).v One or more expert modules can be connected to M221, M221 Book, M241 and M251 logic controllers according to the general rules for the TM3 system: 7 modules max. and 14 modules max. with the use of Modicon TM3 bus expansion system (transmitter and receiver).Mountingv The TM3XTYS4 expert module is mounted on a 5 symmetrical rail. v For plate or panel mounting, use the TMAM2 kit. FormatA single format: 23.6 x 90 x 70 mm (0.93 x 3.54 x 2.76 in.).12445589119109DescriptionTM3XTYS4 expert module1 Block with 20 LEDs displaying the status of the 12 input channels and 8 output channels.2 Four RJ 45 connectors for cordsets connecting to the motor starters.3 Screw terminal block for connecting the 24 V c power supply for the inputs and starter coils.4 5 symmetrical rail locking clip.5 TM3 bus connectors (one on each side). These are designed to provide continuity of the link between connected modules.6 Adjacent module locking latch.Sold in lots of 10expert modules0.143(1)T he TM3XTYS4 module is supplied with a screw removable terminal block for connecting the power supply.4561253TM3XTYS4PLd/Category 3 conforming toEN/ISO 13849-1SILCL2 conforming to EN/IEC 61508 andEN/IEC 62061PLe/Category 4 conforming toEN/ISO 13849-1SILCL3 conforming to EN/IEC 61508 andEN/IEC 62061PLd / Category 3 conforming to EN/ISO 13849-1SILCL2 conforming to EN/IEC 61508 and EN/IEC 62061PLe/Category 4 conforming to EN/ISO 13849-1SILCL3 conforming to EN/IEC 61508 and EN/IEC 62061 r Available 2nd half of 2014.r Available 2nd half of 2014.PresentationModicon TM3 functional safety modules r are designed using Preventa technology. They can be used to incorporate machine safety into the overall machine control. Data acquisition: control of safety productsv Emergency stop button: complementary protection measuresv Monitoring devices used in protective systems to control access to hazardous areasv Light curtains and safety mats to detect intrusion into hazardous areas Monitoring and processingv Modicon TM3 functional safety modules control the input signals from monitoring devices and act as an interface with contactors and variable speed drives, causing the machine to stop.v Modicon TM3 functional safety modules complement the embedded I/O on M221, M221 Book, M241 and M251 logic controllers.Category 4/PLe, SIL3 architectureCategory 3/PLd, SIL2 architectureCategory 4/PLe, SIL3 architectureThe safety outputs available on the 4 modules are relay type, guided byv For plate or panel mounting, use the TMAM2 kit.r Available 2nd half of 2014.Presentation, description, referencesExpansion modulesModicon TM3 functional safety modules(Powered by Preventa technology)DescriptionModicon TM3 functional safety modules 1 Adjacent module locking latch.2 TM3 bus connectors (one on each side). These are designed to provide continuity of the link between connected modules.3 5 symmetrical rail locking clip.4 Display block (6 LEDs - green, red) for the module channels and diagnostics.5 Removable spring or screw-type terminal blocks (depending on the model) forconnecting the safety channels and the power supply.Sold in lots of 10modules on a plate or panel0.143(1) R emovable terminal blocks equipped with screw terminals or spring terminals, supplied with the controller.rAvailable 2nd half of 2014.TM3SAC5RTM3SAC5RGTM3SAF5RTM3SAF5RGTM3SAFL5RTM3SAFL5RGTM3SAK6RTM3SAK6RG2553214PresentationModicon TM3 transmitter and receiver modules can be used to:v increase from 7 to 14 the number of I/O expansion modules that can be connected to an M2pp logic controllerv locate Modicon TM3 expansion modules remotely, up to 5 m (16.404 ft.) away The transmitter and receiver modules are physically linked by a VDIP184546ppp bus expansion cable.Mountingv TM3 bus expansion modules are mounted on a 5 symmetrical rail. v For plate or panel mounting, use the TMAM2 kit.DescriptionTM3XTRA1 transmitter module1 Block with2 LEDs displaying the communication status and power supply status.2 RJ 45 connector for connecting the VDIP184546ppp bus expansion cable.3 Screw terminal for the functional ground (FG) connection.45 symmetrical rail locking clip.5 TM3 bus connector providing continuity of the link with the connected module.6 Adjacent module locking latch.TM3XREC1 receiver module1 Block with2 LEDs displaying the communication status and power supply status.2 RJ 45 connector for connecting the VDIP184546ppp bus expansion cable.3 Screw terminal block for connecting the power supply.45 symmetrical rail locking clip.5 TM3 bus connector providing continuity of the link with the connected module.6Adjacent module locking latch.456321TM3XTRA1456321TM3XREC1Sold in lots of 10modules on a plate or panel0.143Set of terminal blocks for connecting the power supply8 removable terminal blocks with screw terminals TMAT2PSET 0.1270.280(1) T he TM3XREC1 module is supplied with a removable screw terminal block for connecting thepower supply.TM3XTRA1TM3XREC1Index Expansion modulesModicon TM3 expansion modulesProduct reference indexTM2XMTGB11 TM3AI2H11 TM3AI2HG11 TM3AI411 TM3AI4G11 TM3AI811 TM3AI8G11 TM3AM611 TM3AM6G11 TM3AQ211 TM3AQ2G11 TM3AQ411 TM3AQ4G11 TM3DI87 TM3DI8A7 TM3DI8G7 TM3DI167 TM3DI16G7 TM3DI16K7 TM3DI32K7 TM3DM8R7 TM3DM8RG7 TM3DM24R7 TM3DM24RG7 TM3DQ8R7 TM3DQ8RG7 TM3DQ8T7 TM3DQ8TG7 TM3DQ8U7 TM3DQ8UG7 TM3DQ16R7 TM3DQ16RG7 TM3DQ16T7 TM3DQ16TG7 TM3DQ16TK7 TM3DQ16U7 TM3DQ16UG7 TM3DQ16UK7 TM3DQ32TK7 TM3DQ32UK7 TM3SAC5R17 TM3SAC5RG17 TM3SAF5R17 TM3SAF5RG17 TM3SAFL5R17 TM3SAFL5RG17 TM3SAK6R17 TM3SAK6RG17 TM3TI411 TM3TI4G11 TM3TI8T11 TM3TI8TG11 TM3TM311 TM3TM3G11 TM3XREC119 TM3XTRA119 TM3XTYS413 TM200RSRCEMC11 TMAM2711131719TMAT2MSET711 TMAT2MSETG711 TMAT2PSET19 VDIP184******** VDIP184******** VDIP184******** VDIP184******** VDIP184********Head Office35, rue Joseph MonierF-92500 Rueil-Malmaison France Schneider Electric Industries SAS02/2014D I A 3 E D 2 1 4 0 1 0 9 E NThe information provided in this documentation contains general descriptions and/or technical characteristics of the performance of the products contained herein. This documentation is not intended as a substitute for and is not to be used for determining suitability or reliability of these products for specific user applications. It is the duty of any such user or integrator to perform the appropriate and complete risk analysis, evaluation and testing of the products with respect to the relevant specific application or use thereof. Neither Schneider Electric nor any of its affiliates or subsidiaries shall be responsible or liable for misuse of the information contained herein. Design: Schneider ElectricPhotos: Schneider ElectricTM3AM6TM3AI4TM3AI2H TM3AQ2。
TMDSPLCKIT-V3;中文规格书,Datasheet资料
Introduction Power line communications use existing power line infrastructures as a cost-effective alternative to wireless and other wired communications standards, introducing intelligent monitoring and control to industrial applications such as smart metering. With the many protocol standards and modulation schemes available, developers need a flexible development platform that simplifies design, allows for optimization to environmental conditions, supports local regulations, and can be easily adjusted to conform to evolving standards. TI Delivers Flexible Power Line Communications SolutionsGiven its ability to transfer data over the same lines used to carry power, power line communication (PLC) technology offers a cost-effective communication media for a wide range of applications. By eliminating the need to install additional wires to interconnect devices, PLC substantially reduces system cost and increases reliability while enabling efficient communications in environments that might otherwise be too expensive to network.The ability to leverage the existing power line infrastructure has positioned PLC as one ofthe leading enabling technologies for smart-grid applications. By being able to monitor electricity usage based on time of day and even by device or application, utility companies will be able to provide pricing structures that give consumers incentives to adjust their energy consumption, thus reducing peak load and avoiding the need to construct power plants. PLC also enables more intelligent management of systems, including lighting control, home and building automation of heat and air conditioning, and security.As a technology, PLC is appropriate for both high-speed broadband network connections, such as to the Internet, as well as for applications requiring narrowband control or low-bandwidth data collection where low cost and high reliability are essential. For smart metering applications, for example, narrowband PLC provides a robust alternative to wireless communication.More than 200 million electricity meters with communications capabilities are expected tobe deployed in Europe, the Middle East and Africa over the coming years. In these regions, concentrators/substations are already electrically connected to between 500 and 1,000 meters, making narrowband PLC a very attractive technology for serving as the infrastructure for the smart grid in these regions. Similarly, narrowband PLC is also gaining ground in home networking, lighting and solar applications.For applications like smart meters, implementing a low-frequency narrowband PLC technol-ogy provides an optimal fit in terms of bandwidth, power and cost requirements. Operating in the narrowband domain (frequencies up to 500 kHz) ensures data integrity while minimizing system cost. With data rates that can vary from 1.2 Kbps up to 128 Kbps based on the existing standards, narrowband PLC also provides sufficient bandwidth for applications such as remote data collection from power meters, lighting control and home automation.Ultimately, the smart grid will allow remote monitoring and control of end-user equipment using energy consumption reduction strategies based on up-to-date information accessible through the power line. These benefits extend from the home and office to the factory and other industrial applications (such as solar systems, data servers, motor control and irrigation systems). Using PLC, as long as a system is connected to a power grid network, its efficiency and operation can be intelligently managed and improved.Olivier MonnierWorldwide Metering Marketing ManagerW H I T E P A P E R2Texas InstrumentsDeveloping an efficient PLC implementation is not without its challenges. Power lines are inherently noisy and require a robust architecture to ensure data reliability. In addition, each application and operatingenvironment is different, requiring developers to optimize designs and accommodate a variety of factors.PLC implementations that are too fixed in function can only be applied in a limited number of applicationsand represent a risky design strategy as standards continue to evolve. Developers need a flexible platformthat enables them to optimize designs to the particular requirements of each application and that will allowdesigns to adapt to new standards and market opportunities as they arise. In this way, intellectual propertycan be reused across multiple applications to accelerate development and speed time to market whileexpanding market opportunities.A key part to achieving flexibility is a modular architecture in terms of hardware and software. Breakingdown complex PLC systems into a number of independent subsystems allows developers to change oneaspect of a design – such as the modulation scheme or protocol used – without having to completelyredesign the entire system.• Modulation Scheme: Flexibility at the hardware level enables developers to implement the mostefficient modulation scheme for a particular application. For example, several modulation schemes areavailable for narrowband communications, including spread frequency shift key (S-FSK) and orthogonalfrequency-division multiplexing (OFDM) modulation. With a choice of modulation schemes, developerscan evaluate the effectiveness of each before selecting one to use in a design.• Communication Protocols : For purposes of interoperability, devices may need to be compliant to aparticular protocol standard. By utilizing a flexible platform, developers can easily implement all of thepopular PLC standards – including SFSK (IEC61334), PRIME and G3, as well as keep devices up-to-dateas standards continue to evolve. Additionally, it becomes a simple process to migrate designs to newapplications – and therefore standards – without having to completely redesign hardware or firmware.Figure 1. With the Texas Instruments (TI) plcSUITE ™ developers can optimize their designs to specific requirements of an application with the assurance they can adapt to new standards and opportunities as they arise.The Power LineCommunicationsChallenge3Texas Instruments plcSUITE ™ Software FrameHost App SW referenceplcSUITE:• Open Source • Layered API • Component-Wise Certifiable • Scalable • Lego Architecture • Custom Build • Compliance to Local Regulations: Enthusiastic support for green electronics has resulted inincreasing regulation (CENELEC, FCC, ARIB, etc.), which can substantially impact smart-grid andother PLC-based applications. Developers need tools to not only ensure that devices meet suchregulations but also to help speed compliance testing and approval to minimize any delays to market.Texas Instruments (TI) eases development with its flexible PLC development platform. The PLC modemhardware tool comprises separate analog front end (AFE), MCU and docking station modules. Modularityallows developers to easily adjust a system’s hardware capabilities to match the various PLC modemspecifications without impacting other areas of the design. For example, in addition to PRIME and G3standards support, TI is supporting a proprietary, fully-programmable OFDM-based system with theFlexOFDM ™ library, which allows developers to further improve efficiency by tuning performance androbustness for specific environmental factors or, if required, quickly define a custom OFDMimplementation with configurable frequency band, number of data tones, etc. These improvements canbe made independently of protocol and application software. Once the design is completed, developerscan cost-reduce the various modules into a single hardware component.Figure 2. plcSUITE software frameThe PLC modem software (plcSUITE ™) is delivered as a powerful framework aimed at enablingdevelopers to quickly develop and test robust PLC implementations. The flexibility of the platform allowsdevelopers to separate the modulation implementation, protocol design and application development fromeach other. The platform also utilizes a graphical user interface (GUI) for easy visualization and tuning ofkey PLC modem performance parameters.Flexible DesignBy abstracting the complexity of PLC modem design, TI has lowered the entry barrier to introducing PLCto a wide range of industrial applications. The efficiency and flexibility of TI’s PLC solution enables quickdifferentiation and customization to specific application requirements and gives developers the option ofcost-effectively introducing PLC to existing designs. In addition, plcSUITE will be scalable across the entireC2000™ MCU family, allowing developers to select an ideal MCU with the right blend of processing capacityand peripherals for implementing a complete application plus PLC.With its unique modular hardware architecture and flexible software framework, the TI PLC modem isthe industry’s only PLC technology, capable of supporting multiple standards and modulation schemes witha single platform. TI’s PLC road map will also provide developers with PLC solutions for every stage of thesmart grid, from utility substations through the entire home area network.Power line communications promises to change the way we monitor and control our world. By leveragingthe existing power line infrastructure as a data link, for many applications PLC is the most cost-effectivecommunication media available.Leading the industry with the most flexible PLC solutions on the market, TI continues to invest heavily insmart-grid and smart-metering technology. TI has recently opened a worldwide PLC design center in Dallasand is a principal member of PRIME, as well as serving as a contributing member of the HomeGrid Alliance,IEEE P1901.2, ITU G.hnem and SAE/ISO-IEC. Designers can further accelerate time to market for PLC-basedproducts by leveraging TI’s extensive OFDM modulation and signal-processing expertise in industrial andanalog designs. For more information about TI’s power line communication products, visit /plc.Flexible, scalable and easy to customizeFigure 2. TI’s narrowband PLC solutionThe platform bar and E2E are trademarks of Texas Instruments.C2000, FlexOFDM and plcSUITE are trademarks of Texas Instruments.All other trademarks are the property of their respective owners.Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and conditions of sale. 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Modicon TM3产品数据表（TM3TI4模块）说明书
T h e i n f o r m a t i o n p r o v i d e d i n t h i s d o c u m e n t a t i o n c o n t a i n s g e n e r a l d e s c r i p t i o n s a n d /o r t e c h n i c a l c h a r a c t e r i s t i c s o f t h e p e r f o r m a n c e o f t h e p r o d u c t s c o n t a i n e d h e r e i n .T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n s .I t i s t h e d u t y o f a n y s u c h u s e r o r i n t e g r a t o r t o p e r f o r m t h e a p p r o p r i a t e a n d c o m p l e t e r i s k a n a l y s i s , e v a l u a t i o n a n d t e s t i n g o f t h e p r o d u c t s w i t h r e s p e c t t o t h e r e l e v a n t s p e c i f i c a p p l i c a t i o n o r u s e t h e r e o f .N e i t h e r S c h n e i d e r E l e c t r i c I n d u s t r i e s S A S n o r a n y o f i t s a f f i l i a t e s o r s u b s i d i a r i e s s h a l l b e r e s p o n s i b l e o r l i a b l e f o r m i s u s e o f t h e i n f o r m a t i o n c o n t a i n e d h e r e i n .Product data sheetCharacteristicsTM3TI4module TM3 - 4 inputs temperatureProduct availability: Stock - Normally stocked in distribution facilityMainRange of product Modicon TM3Product or component typeAnalog input module Range compatibilityModicon M221Modicon M251Modicon M241Analogue input number 4Analogue input typeCurrent, analogue input range: 4...20 mA Current, analogue input range: 0...20 mA Voltage, analogue input range: 0...10 V Voltage, analogue input range: - 10...10 VThermocouple, analogue input range: - 200...1000°C with thermocouple JThermocouple, analogue input range: - 200...1300°C with thermocouple KThermocouple, analogue input range: 0...1760 °C with thermocouple RThermocouple, analogue input range: 0...1760 °C with thermocouple SThermocouple, analogue input range: 0...1820 °C with thermocouple BThermocouple, analogue input range: - 200...400 °C with thermocouple TThermocouple, analogue input range: - 200...1300°C with thermocouple NThermocouple, analogue input range: - 200...800 °C with thermocouple EThermocouple, analogue input range: 0...2315 °C with thermocouple CNi 100/Ni 1000 temperature probe, analogue input range: - 60...180 °CPt 100 temperature probe, analogue input range: -200...850 °CPt 1000 temperature probe, analogue input range: -200...600 °CComplementaryAnalogue input resolution 15 bits + sign 16 bits Permissible continuous overload 13 V voltage 40 mA currentInput impedance<= 50 Ohm current>= 1 MOhm temperature probe >= 1 MOhm thermocouple >= 1 MOhm voltageLSB value2.44 mV, analogue input: 0...10 V voltage 4.88 mV, analogue input: - 10...10 V voltage 4.88 µA, analogue input: 0...20 mA current3.91 µA, analogue input:4...20 mA current 0.1 °C temperature probe 0.1 °C thermocoupleConversion time100 ms + 100 ms per channel + 1 controller cycle time for analogue input thermo-couple100 ms + 100 ms per channel + 1 controller cycle time for analogue input temper-ature probe10 ms + 10 ms per channel + 1 controller cycle time for analogue input volt-age/currentSampling duration10 ms for analogue input voltage/current 100 ms for analogue input voltage/current 100 ms for analogue input thermocouple100 ms for analogue input temperature probeAbsolute accuracy error+/- 0.2 % of full scale at 77 °F (25 °C) for analogue input voltage/current+/- 0.2 % of full scale at 25 °C for Pt 100/Pt 1000, Ni 100/ Ni 1000 temperatureprobe+/- 0.2 % of full scale at 25 °C for thermocouple C 0...2315 °C+/- 6 °C at 25 °C for thermocouple R, S 0...200 °C+/- 0.2 % of full scale at 25 °C for thermocouple R, S 200...1760 °C+/- 0.2 % of full scale at 25 °C for thermocouple B 300...1820 °C+/- 0.4 % of full scale at 25 °C for thermocouple K - 200...0 °C+/- 0.2 % of full scale at 25 °C for thermocouple K 0...1300 °C+/- 0.4 % of full scale at 25 °C for thermocouple J - 200...0 °C+/- 0.2 % of full scale at 25 °C for thermocouple J 0...1000 °C+/- 0.4 % of full scale at 25 °C for thermocouple E - 200...0 °C+/- 0.2 % of full scale at 25 °C for thermocouple E 0...800 °C+/- 0.4 % of full scale at 25 °C for thermocouple T - 200...0 °C+/- 0.2 % of full scale at 25 °C for thermocouple T 0...400 °C+/- 0.4 % of full scale at 25 °C for thermocouple N - 200...0 °C+/- 0.2 % of full scale at 25 °C for thermocouple N 0...1300 °CTemperature drift+/- 0.01 %FS/°CRepeat accuracy+/-0.5 %FSNon-linearity+/- 0.2 %FSCross talk<= 1 LSB[Us] rated supply voltage24 V DCSupply voltage limits20.4...28.8 VType of cable Twisted shielded pairs cable 30 m for input circuitCurrent consumption45 mA at 5 V DC via bus connector50 mA at 5 V DC via bus connector35 mA at 24 V DC via external supply40 mA at 24 V DC via external supplyLocal signalling 1 LED green PWRElectrical connection10 x 1.5 mm² removable screw terminal block with pitch 3.81 mm adjustment forinputs and supply10 x 1.5 mm² removable screw terminal block with pitch 3.81 mm adjustment forinputsInsulation500 V AC between input and internal logic1500 V AC between input and supplyMarking CESurge withstand 1 kV for power supply with common mode protection conforming to EN/IEC61000-4-50.5 kV for power supply with differential mode protection conforming to EN/IEC61000-4-51 kV for input with common mode protection conforming to EN/IEC 61000-4-5 Mounting support Top hat type TH35-15 rail conforming to IEC 60715Top hat type TH35-7.5 rail conforming to IEC 60715Plate or panel with fixing kitHeight 3.54 in (90 mm)Depth 2.76 in (70 mm)Width0.93 in (23.6 mm)Product weight0.24 lb(US) (0.11 kg)EnvironmentStandards EN/IEC 61010-2-201EN/IEC 61131-2Resistance to electrostatic discharge 4 kV on contact conforming to EN/IEC 61000-4-28 kV in air conforming to EN/IEC 61000-4-2Resistance to electromagnetic fields9.14 V/yd (10 V/m) at 80 MHz...1 GHz conforming to EN/IEC 61000-4-32.74 V/yd (3 V/m) at 1.4 GHz...2 GHz conforming to EN/IEC 61000-4-30.91 V/yd (1 V/m) at 2 GHz...3 GHz conforming to EN/IEC 61000-4-3 Resistance to magnetic fields30 A/m conforming to EN/IEC 61000-4-8Resistance to fast transients 1 kV I/O conforming to EN/IEC 61000-4-4Resistance to conducted disturbances10 V at 0.15...80 MHz conforming to EN/IEC 61000-4-63 V at spot frequency (2, 3, 4, 6.2, 8.2, 12.6, 16.5, 18.8, 22, 25 MHz) conformingto Marine specification (LR, ABS, DNV, GL)Electromagnetic emission Radiated emissions, test level: 40 dBμV/m QP class A (10 m at 30...230 MHz)conforming to EN/IEC 55011Radiated emissions, test level: 47 dBμV/m QP class A (10 m at 230...1000 MHz)conforming to EN/IEC 55011Immunity to microbreaks10 msAmbient air temperature for operation14...131 °F (-10...55 °C) (horizontal installation)-10...35 °C (vertical installation)Ambient air temperature for storage-13...158 °F (-25...70 °C)Relative humidity10...95 % without condensation in operation10...95 % without condensation in storageIP degree of protection IP20Pollution degree2Operating altitude0...6561.68 ft (0...2000 m)Storage altitude0...9842.52 ft (0...3000 m)Vibration resistance 3.5 mm at 5...8.4 Hz with DIN rail mounting support3 gn at 8.4...150 Hz with DIN rail mounting supportShock resistance15 gn during 11 msOrdering and shipping detailsCategory22533 - M2XX PLC & ACCESSORIESDiscount Schedule MSXGTIN00785901981732Nbr. of units in pkg.1Package weight(Lbs)0.47000000000000003Returnability YCountry of origin JPOffer SustainabilitySustainable offer status Green Premium productRoHS (date code: YYWW)Compliant - since 1415 - Schneider Electric declaration of conformity Schnei-der Electric declaration of conformityREACh Reference not containing SVHC above the thresholdProduct environmental profile AvailableProduct end of life instructions AvailableCalifornia proposition 65WARNING: This product can expose you to chemicals including:- - - - - - - Substance 1Lead and lead compounds, which is known to the State of California to cause can-cer and birth defects or other reproductive harm.- - - - - - - More information For more information go to Dimensions DrawingsDimensions(*)8.5 mm/0.33 in when the clamp is pulled out.Mounting and Clearance Spacing RequirementsMounting on a RailIncorrect MountingMounting on a Panel Surface(1)Install a mounting strip Mounting Hole LayoutConnections and SchemaAnalogue Input ModuleWiring Diagram (Current/Voltage type)(*)Type T fuse(1)Current/Voltage analog output deviceWiring Diagram (Thermocouple input type)(*)Type T fuse (2)ThermocoupleWiring Diagram (Temperature probe input type)(*)Type T fuse。
赛米控丹佛斯 SEMITRANS IGBT模块 SKM300GB07E3 数据表
Rev. 2.0–28.05.20191SEMITRANS ®3GBTrench IGBT ModulesSKM300GB07E3Features*•V CE(sat) with positive temperature coefficient•High short circuit capability, self limiting to 6 x Icnom•Fast & soft inverse CAL diodes•Insulated copper baseplate using DBC Technology (Direct Copper Bonding) •With integrated gate resistorTypical Applications•AC inverter drives •UPSRemarks•Case temperature limited to T c = 125°C max.•Recommended T op = -40 ... +150°C •Product reliability results valid for T j = 150°C•Use of soft R G necessaryAbsolute Maximum Ratings SymbolConditions Values UnitIGBT V CES T j =25°C 650V I C T j =175°CT c =25°C 394A T c =80°C297A I Cnom 300A I CRMI CRM = 3 x I Cnom 900A V GES -20 (20)V t psc V CC =360V V GE ≤ 15V V CES ≤ 650 V T j =150°C6µs T j -40...175°C Inverse diodeV RRM T j =25°C 650V I F T j =175°CT c =25°C 335A T c =80°C244A I Fnom 300A I FRM I FRM = 2xI Fnom600A I FSM t p =10ms, sin 180°, T j =25°C2160A T j -40...175°C Module I t(RMS)500A T stg module without TIM -40...125°C V isolAC sinus 50 Hz, t =1min4000VCharacteristics SymbolConditionsmin.typ.max.UnitIGBT V CE(sat)I C =300A V GE =15V chiplevel T j =25°C 1.45 1.90V T j =150°C 1.69 2.10V V CE0chiplevel T j =25°C 0.90 1.00V T j =150°C 0.820.90V r CE V GE =15V chiplevelT j =25°C 1.83 3.0m ΩT j =150°C2.94.0m ΩV GE(th)V GE =V CE , I C =4.8mA5.1 5.86.4V I CES V GE =0V,V CE =650V, T j =25°C 0.3mA C ies V CE =25V V GE =0Vf =1MHz 18.5nF C oes f =1MHz 1.16nF C res f =1MHz0.55nF Q G V GE =- 8 V...+ 15 V 2400nC R Gint T j =25°C 1.0Ωt d(on)V CC =300V I C =300AV GE =+15/-7.5V R G on =2ΩR G off =5.6Ωdi/dt on =6100A/µs di/dt off =4500A/µs dv/dt =1700V/µs L s =22nH T j =150°C 157ns t r T j =150°C 58ns E on T j =150°C 4.7mJ t d(off)T j =150°C 813ns t f T j =150°C 67ns E off T j =150°C 13.6mJR th(j-c)per IGBT0.15K/W R th(c-s)per IGBT (λgrease =0.81 W/(m*K))0.042K/W R th(c-s)per IGBT, pre-applied phase change material0.038K/W2Rev. 2.0–28.05.2019© by SEMIKRONSEMITRANS ®3GBTrench IGBT ModulesSKM300GB07E3Features*•V CE(sat) with positive temperature coefficient•High short circuit capability, self limiting to 6 x Icnom•Fast & soft inverse CAL diodes•Insulated copper baseplate using DBC Technology (Direct Copper Bonding) •With integrated gate resistorTypical Applications•AC inverter drives •UPSRemarks•Case temperature limited to T c = 125°C max.•Recommended T op = -40 ... +150°C •Product reliability results valid for T j = 150°C•Use of soft R G necessaryCharacteristics SymbolConditionsmin.typ.max.UnitInverse diodeV F = V EC I F =300AV GE =0V chiplevelT j =25°C 1.40 1.76V T j =150°C 1.39 1.77V V F0chiplevel T j =25°C 1.04 1.24V T j =150°C 0.850.99V r FchiplevelT j =25°C 1.19 1.76m ΩT j =150°C1.792.6m ΩI RRM I F =300A di/dt off =5400A/µs V GE =+15 /-7.5VV CC =300VT j =150°C 313A Q rr T j=150°C31.5µC E rr T j =150°C 6.4mJR th(j-c)per diode0.25K/W R th(c-s)per diode (λgrease =0.81 W/(m*K))0.044K/W R th(c-s)per diode, pre-applied phase change material0.041K/W Module L CE 15nH R CC'+EE'measured per switchT C =25°C 0.55m ΩT C =125°C0.85m ΩR th(c-s)1calculated without thermal coupling 0.01074K/W R th(c-s)2including thermal coupling, Ts underneath module (λgrease =0.81 W/(m*K))0.018K/W R th(c-s)2including thermal coupling,Ts underneath module, pre-applied phase change material 0.016K/WM s to heat sink M635Nm M t to terminals M62.55Nm Nm w325g© by SEMIKRON Rev. 2.0–28.05.201934Rev. 2.0–28.05.2019© by SEMIKRON© by SEMIKRON Rev. 2.0–28.05.20195GBThis is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, chapter IX.*IMPORTANT INFORMATION AND WARNINGSThe specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.6。
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-V
+ V
Diagram 3: Rise time measurement.
lp 90 %
- IF
10 % tr
Fig. 1: Relative variation of VBO versus junction temperature (typical values)
VBO [Tj] VBO [Tj = 25°C]
1.08
Fig. 2: Repetitive peak pulse current versus pulse duration (maximum values).
ITRM(A) 20.0 10.0
F=120Hz Tj initial=25°C
1.06
1.04
tp(µs) 40
Tj=25°C
35 30 25 20 15 10 5 0 10 20 50
10Ω 0Ω 33Ω 47Ω
68Ω
22Ω
C(nF) 200 500
100
PACKAGE MECHANICAL DATA (in millimeters) MINIMELF
A
REF.
E F
DIMENSIONS Millimeters Min. Typ. Max. Min.
Tstg Tj
- 40 to + 125
January 2001 - Ed: 2
1/4
/
TMMDB3TG
ELECTRICAL CHARACTERISTICS (Tj = 25°C unless otherwise specified) Symbol VBO Parameter Breakover voltage * Test Conditions C = 22nF ** MIN. TYP. MAX. I VBO1 - VBO2 I ∆V VO IBO tr IR Breakover voltage symmetry Dynamic breakover voltage * Output voltage * Breakover current * Rise time * Leakage current * C = 22nF ** VBO and VF at 10mA see diagram 2 (R=20Ω) C = 22nF ** see diagram 3 VR = 0.5 VBO max MAX. MIN. MIN. MAX. MAX. MAX. Value 30 32 34 ±2 9 5 15 2 10 V V V µA µs µA Unit V
1.0
1.02
Tj (°C)
1.00 25 50 75 100 125
tp(µs) 0.1 1 10 100
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http://
TMMDB3TG
Fig. 3: Time duration while current pulse is higher 50mA versus C and Rs (typical values).
3.40 1.60 0.45 1.50 3.6 1.62 0.50 0.130 0.063 0.016
Inches Typ. Max.
0.134 0.063 0.018 0.059 0.142 0.064 0.020
/ B O
A B
3.30 1.59 0.40
O /D C O / 0.05 E-F C
TMMDB3TG
Diagram 1: Voltage - current characteristic curve. Diagram 2: Test circuit.
10 kΩ 500 kΩ D.U.T Rs=0
+ IF 10mA
220 V 50 Hz
C=0.1µF Vo
I
P
T410 R=20 Ω
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分销商库存信息:
STM TMMDB3TG
C D
FOOTPRINT
2
2.5 5
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2001 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
ABSOLUTE MAXIMUM RATINGS (limiting values) Symbol ITRM Parameter Repetitive peak on-state current tp = 20 µs F= 120 Hz Storage temperature range Operating junction temperature range Value 2 Unit A °C
®
TMMDB3TG
DIAC
FEATURES
s
s
s
VBO : 32V Low breakover current: 15µA max Breakover voltage range: 30 to 34V
DESCRIPTION Functioning as a trigger diode with a fixed voltage reference, the TMMDB3TG can be used in conjunction with triacs for simplified gate control circuits or as a starting element in fluorescent lamp ballasts. MINIMELF
* Applicable to both forward and reverse directions. ** Connected in parallel to the device.
ORDERING INFORMATION
TMM
MINIMELF Diac Series
DB
3
TG
Special VBO range
Breakover voltage 3: VBO typ = 32V
OTHER INFORMATION Part Number TMMDB3TG (None) Marking Weight 0.04 g Base Quantity 2500 Packing Mode Tape & Reel
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/