SN74LVC244APWT中文资料
SN74LVC244APWR中文资料
TA –40°C to 85°C
–40°C to 125°C
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER
QFN – RGY
Reel of 1000
SN74LVC244ARGYR
VFBGA – GQN Reel of 1000
Copyright © 1992–2005, Texas Instruments Incorporated
元器件交易网
SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Undershoot) > 2 V
at VCC = 3.3 V, TA = 25°C • Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With 3.3-V VCC) • Ioff Supports Partial-Power-Down Mode Operation • Latch-Up Performance Exceeds 250 mA Per JESD 17 • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A)
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
IN74ACT244中文资料
O CTAL 3-S TATE N ONINVERTINGB UFFER/L INE D RIVER/L INE R ECEIVERHigh-Speed Silicon-Gate CMOS The IN74ACT244 is identical in pinout to the LS/ALS244, HC/HCT244. The IN74ACT244 may be used as a level converterfor interfacing TTL or NMOS outputs to High Speed CMOSinputs.designed to be used with 3-state memory address drivers, clocknoninverting outputs and two active-low output enables.•TTL/NMOS Compatible Input Levels•Outputs Directly Interface to CMOS, NMOS, and TTL•Operating Voltage Range: 4.5 to 5.5 V •Low Input Current: 1.0 µA; 0.1 µA @ 25°C •Outputs Source/Sink 24 mAORDERING INFORMATIONIN74ACT244N PlasticIN74ACT244DW SOICT A = -40° to 85° C for allpackagesFUNCTION TABLEInputs Outputs Enable A,Enable BA,B YA,YBL L LL H HH X ZX=don’t careZ = high impedanceLOGIC DIAGRAMPIN 20=V CCPIN 10 = GNDPIN ASSIGNMENTMAXIMUM RATINGS*Symbol Parameter ValueUnit V CC DC Supply Voltage (Referenced to GND) -0.5 to +7.0 VV IN DC Input Voltage (Referenced to GND) -0.5 to V CC +0.5 VV OUT DC Output Voltage (Referenced to GND) -0.5 to V CC +0.5 VI IN DC Input Current, per Pin ±20 mAI OUT DC Output Sink/Source Current, per Pin ±50 mAI CC DC Supply Current, V CC and GND Pins ±50 mAP D Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750500mWTstg Storage Temperature -65 to +150 °CT L Lead Temperature, 1 mm from Case for 10Seconds(Plastic DIP or SOIC Package)260 °C*Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°CSOIC Package: - 7 mW/°C from 65° to 125°CRECOMMENDED OPERATING CONDITIONSSymbol Parameter MinMaxUnit V CC DC Supply Voltage (Referenced to GND) 4.5 5.5 VV IN, V OUT DC Input Voltage, Output Voltage (Referenced toGND)0 V CC VT J Junction Temperature (PDIP) 140 °CT A Operating Temperature, All Package Types -40 +85 °CI OH Output Current - High -24 mAI OL Output Current - Low 24 mAt r, t f Input Rise and Fall Time * (except Schmitt Inputs) V CC=4.5 VV CC =5.5 V108.0ns/V* VINfrom 0.8 V to 2.0 VThis device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, V IN and V OUT should be constrained to the range GND≤(V IN or V OUT)≤V CC.Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC). Unused outputs must be left open.DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)V CC Guaranteed LimitsSymbol Parameter Test Conditions V 25 °C -40°C to85°CUnit V IH Minimum High-Level Input VoltageV OUT = V CC -0.1 V 4.5 5.5 2.0 2.0 2.0 2.0 VV IL Maximum Low -Level Input VoltageV OUT =0.1 V 4.5 5.5 0.8 0.8 0.8 0.8 VV OH Minimum High-Level Output VoltageI OUT ≤ -50 µA 4.5 5.5 4.4 5.4 4.4 5.4 V*V IN =V IHI OH =-24 mAI OH =-24 mA4.55.5 3.86 4.86 3.76 4.76 V OL Maximum Low-Level Output VoltageI OUT ≤ 50 µA 4.5 5.5 0.1 0.1 0.1 0.1 V*V IN =V ILI OL =24 mAI OL =24 mA4.55.5 0.36 0.36 0.44 0.44 I IN Maximum Input Leakage CurrentV IN =V CC or GND 5.5 ±0.1 ±1.0 µAI OZ Maximum Three-State Leakage Current V IN (OE)=V IL or V IH V IN =V CC or GND V OUT =V CC or GND5.5 ±0.5 ±5.0 µA∆I CCT Additional MaxI CC /InputV IN =V CC - 2.1 V 5.5 1.5 mA I OLD +Minimum Dynamic Output CurrentV OLD =1.65 V Max 5.5 75 mAI OHD +Minimum Dynamic Output CurrentV OHD =3.85 V Min 5.5 -75 mAI CC Maximum Quiescent Supply Current(per Package)V IN =V CC or GND 5.5 8.0 80 µAAll outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time.AC ELECTRICAL CHARACTERISTICS(V CC=5.0 V ± 10%, C L=50pF,Input t r=t f=3.0 ns)LimitsGuaranteedUnitSymbol Parameter 25 °C -40°C to85°CMax MinMaxMin t PLH Propagation Delay, A to YA or B to YB2.0 9.0 1.5 10.0 ns(Figure 1)2.0 9.0 1.5 10.0 nst PHL Propagation Delay, A to YA or B to YB(Figure 1)1.5 8.5 1.0 9.5 nst PZH Propagation Delay, Output Enable to YAor YB (Figure 2)t PZL Propagation Delay, Output Enable to YA2.0 9.5 1.5 10.5 nsor YB (Figure 2)2.0 9.5 1.5 10.5 nst PHZ Propagation Delay, Output Enable to YAor YB (Figure 2)2.5 10.0 2.0 10.5 nst PLZ Propagation Delay, Output Enable to YAor YB (Figure 2)C IN Maximum Input Capacitance 4.5 4.5 pFTypical @25°C,V CC=5.0VC PD Power Dissipation Capacitance 45 pFFigure 1. Switching Waveforms Figure 2. Switching Waveforms。
74act244t工作原理
74ACT244T工作原理1.简介本文将介绍74A CT244T芯片的工作原理。
74A CT244T是一种高速C M OS(互补金属氧化物半导体)非反相缓冲器/放大器,具有广泛的应用领域。
我们将深入探讨其内部构造和工作原理,以帮助读者更好地了解该芯片的功能和性能。
2.构造和功能74AC T244T芯片由多个逻辑门组成,包括六个非反相缓冲器。
每个缓冲器都能够接受输入信号并输出被放大的信号。
该芯片还具有使输入信号反相的功能。
通过连接适当的引脚,可以实现不同的逻辑功能,如缓冲、放大、反相等。
3.工作原理3.1输入与输出74AC T244T芯片有多个引脚,其中包括输入引脚(A1-A6)和输出引脚(Y1-Y6)。
输入引脚接受外部信号作为输入,输出引脚将放大后的信号输出到外部电路中。
3.2内部结构该芯片内部包含多个晶体管以及其他电子元件。
这些元件按照特定的布局和连接方式组成非反相缓冲器电路。
布线和电子元件的优化设计使得芯片在高速工作时具有出色的性能。
3.3工作过程当输入信号在某个引脚上发生变化时,该信号将进入对应的非反相缓冲器。
缓冲器通过晶体管的导通和截止来控制信号的放大和传递。
当输入信号为高电平时,输出信号也为高电平;当输入信号为低电平时,输出信号也为低电平。
3.4异常处理在使用74A CT244T芯片时,需要注意输入信号的幅值和频率范围,以确保芯片正常工作。
当输入信号超出芯片的额定范围时,可能会导致输出信号不准确或不稳定。
此外,芯片的供电电压也应符合规定,以确保其正常运行。
4.应用领域74AC T244T芯片广泛应用于数字电路设计和通信系统中。
它可用于信号放大、缓冲、逻辑电平转换等功能。
其高速工作和稳定性使其成为许多电子设备中不可或缺的部分,如计算机、通信设备、显示器等。
5.总结通过本文的介绍,我们了解了74AC T244T芯片的构造和工作原理。
该芯片通过非反相缓冲器实现信号的放大和传递,并具有反相功能。
74ls244中文资料
IOS
输出短路电流
VCC = Max (Note 3)
-40
-
-225
mA
ICC
电源电流
VCC = Max, Outputs Open
Outputs HIGH
-
13
23
mA
Outputs LOW
-
27
46
Outputs Disabled
-
32
54
74ls244中文资料
VO = 2.7V
-
-
20
μA
IOZL
输出高阻态时低电平电流
VO = 0.4V
-
-
-20
μA
II
最大输入电压时输入电流
VCC = Max
VI = 7V
-
-
0.1
mA
IIH
输入高电平电流
VCC = Max
VI = 2.7V
-
-
20
μA
IIL
输入低电平电流
VCC = Max
VI = 0.4V
-0.5
-
-200
输入钳位电压
VCC = Min, II = -18 mA
-
-
-1.5
V
HYS
Hysteresis (VT+ - VT-)
VCC = Min
0.2
0.4
-
V
VOH
输出高电平电压
VCC = Min, VIH = Min VIL = Max, IOH = -1 mA
2.7
-
-
V
VCC = Min, VIH = Min VIL = Max, IOH = -3 mA
HD74BC244A中文资料
HD74BC244AOctal Buffers/Line Drivers With 3 State OutputsADE-205-007A (Z)2nd. EditionMarch 1993 DescriptionThe HD74BC244A provides high drivability and operation equal to or better than high speed bipolar standard logic IC by using Bi-CMOS process. The device features low power dissipation that is about 1/5 of high speed bipolar logic IC, when the frequency is 10 MHz. The device has eight inverter drivers with three state outputs in a 20 pin package. This device is a non inverting buffer and has two active low enables (1G and 2G). Each enable independently controls 4 buffers.Features• Input/Output are at high impedance state when power supply is off.• Built in input pull up circuit can make input pins be open, when not used.• TTL level input• Wide operating temperature rangeTa = –40 to + 85°CFunction TableInputsG A Output YH X ZL H HL L LH:High levelL:Low levelX:ImmaterialZ:High impedanceHD74BC244A2Pin ArrangementAbsolute Maximum RatingsItemSymbol Rating Unit Supply voltage V CC –0.5 to +7.0V Input diode current I IK ±30mA Input voltage V IN –0.5 to +7.5V Output voltage V OUT –0.5 to +7.5V Off state output voltage V OUT(off)–0.5 to +5.5V Storage temperature Tstg–65 to +150°CNote:1.The absolute maximum ratings are values which must not individually be exceeded, andfurthermore, no two of which may be realized at the same time.HD74BC244A3Recommended Operating ConditionsItemSymbol Min Typ Max Unit Supply voltage V CC 4.5 5.0 5.5V Input voltage V IN 0—V CC V Output voltage V OUT 0—V CC V Operating temperature Topr –40—85°C Input rise/fall time*1t r , t f—8ns/VNote:1.This item guarantees maximum limit when one input switches.Waveform: Refer to test circuit of switching characteristics.Logic DiagramHD74BC244A4Electrical Characteristics (Ta = –40°C to +85°C)Item Symbol V CC (V)Min Max Unit Test ConditionsInput voltage V IH 2.0—V V IL —0.8V Output voltageV OH 4.5 2.4—V I OH = –3 mA 4.5 2.0—V I OH = –15 mA V OL4.5—0.5V I OL = 48 mA 4.5—0.55V I OL = 64 mA Input diode voltage V IK 4.5—–1.2V I IN = –18 mA Input currentI I5.5—–250µA V IN = 0 V 5.5— 1.0µA V IN = 5.5 V 5.5—100µA V IN = 7.0 V Short circuit output current*1I OS 5.5–100–225mA V IN = 0 or 5.5 V Off state output current I OZH 5.5—50µA V O = 2.7 V I OZL 5.5—–50µA V O = 0.5 V Supply currentI CCL 5.5—29.5mA V IN = 0 or 5.5 V All outputs is “L”I CCH 5.5—0.5mA V IN = 0 or 5.5 V All outputs is “H”I CCZ 5.5— 2.5mA V IN = 0 or 5.5 V All outputs is “Z”I CCT *25.5—1.5mAV IN = 3.4 or 0.5 V Notes :1.Not more than one output should be shorted at a time and duration of the short circuit should notexceed one second.2.When input by the TTL level, it shows I CC increase at per one input pin.HD74BC244A5Switching Test Method (C L = 50 pF)Ta = 25°C V CC = 5.0 VTa = –40 to 85°C V CC = 5.0 V ±10%ItemSymbol Min Max Min Max Unit Test Conditions Propagation delay time t PLH 3.0 6.0 3.07.0nsSee under figuret PHL 3.0 6.0 3.07.0Output enable time t ZH 3.08.0 3.010.0ns t ZL 3.08.0 3.010.0Output disable time t HZ 3.07.0 3.09.0ns t LZ 3.07.03.09.0Input capacitanse C IN 3.0(Typ)—pF V IN = V CC or GND Output capacitanceC O15.0(Typ)—pFV O = V CC or GNDTest CircuitHD74BC244A Waveforms-1Waveforms-26HD74BC244A Package DimensionsUnit: mm7Cautions1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi TowerSingapore 049318Tel: 535-2100Fax: 535-1533URLNorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.Taipei Branch Office3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbHElectronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。
74LVQ244MTR,74LVQ244TTR, 规格书,Datasheet 资料
1/12July 2004sHIGH SPEED:t PD =5.6 ns (TYP.) at V CC = 3.3 V s COMPATIBLE WITH TTL OUTPUTS sLOW POWER DISSIPATION:I CC = 4 µA (MAX.) at T A =25°C sLOW NOISE:V OLP = 0.4V (TYP .) at V CC = 3.3Vs75Ω TRANSMISSION LINE OUTPUT DRIVE CAPABILITYsSYMMETRICAL OUTPUT IMPEDANCE:|I OH | = I OL = 12mA (MIN) at V CC = 3.0 Vs PCI BUS LEVELS GUARANTEED AT 24 mA sBALANCED PROPAGATION DELAYS:t PLH ≅ t PHLsOPERATING VOLTAGE RANGE:V CC (OPR) = 2V to 3.6V (1.2V Data Retention)sPIN AND FUNCTION COMPATIBLE WITH 74 SERIES 244sIMPROVED LATCH-UP IMMUNITYDESCRIPTIONThe 74LVQ244 is a low voltage CMOS OCTAL BUS BUFFER fabricated with sub-micron silicon gate and double-layer metal wiring C 2MOStechnology. It is ideal for low power and low noise3.3V applications.G control output governs four BUS BUFFERs.This device is designed to be used with 3 state memory address drivers, etc.All inputs and outputs are equipped with protection circuits against static discharge, giving them 2KV ESD immunity and transient excess voltage.74LVQ244LOW VOLTAGE OCTAL BUS BUFFER WITH 3 STATE OUTPUTS (NON INVERTED)Figure 1: Pin Connection And Iec Logic SymbolsTable 1: Order CodesPACKAGE T & RSOP 74LVQ244MTR TSSOP74LVQ244TTRc c )d u t (s) -O bs o l e t e P r o du t (sl c c )Obs o e t ePr od u t (s) -O bs o l e t e P r o dut (s74LVQ2442/12Figure 2: Input And Output Equivalent CircuitTable 2: Pin DescriptionTable 3: Truth TableX : Don’t CareZ : High ImpedanceTable 4: Absolute Maximum RatingsAbsolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not impliedTable 5: Recommended Operating Conditions1) Truth Table guaranteed: 1.2V to 3.6V2) V IN from 0.8V to 2VPIN N°SYMBOL NAME AND FUNCTION 11G Output Enable Input 2, 4, 6, 81A1 to 1A4Data Inputs 9, 7, 5, 32Y1 to 2Y4Data Outputs 11, 13, 15,172A1 to 2A4Data Inputs 18, 16, 14,121Y1 to 1Y4Data Outputs192G Output Enable Input 10GND Ground (0V)20V CCPositive Supply VoltageINPUTSOUTPUTG An YnL L L L H H HXZ Symbol ParameterValueUnit V CC Supply Voltage -0.5 to +7V V I DC Input Voltage -0.5 to V CC + 0.5V V O DC Output Voltage -0.5 to V CC + 0.5V I IK DC Input Diode Current ± 20mA I OK DC Output Diode Current ± 20mA I O DC Output Current± 50mA I CC or I GND DC V CC or Ground Current± 400mA T stg Storage Temperature-65 to +150°C T LLead Temperature (10 sec)300°CSymbol Parameter Value Unit V CC Supply Voltage (note 1) 2 to 3.6V V I Input Voltage 0 to V CC V V O Output Voltage 0 to V CC V T op Operating Temperature-55 to 125°C dt/dvInput Rise and Fall Time V CC = 3.0V (note 2)0 to 10ns/Vl c c )Obs o e t ePr od u t (s) -O bs o l e t e P r o dut (s74LVQ2443/12Table 6: DC Specifications1) Maximum test duration 2ms, one output loaded at time2) Incident wave switching is guaranteed on transmission lines with impedances as low as 75ΩTable 7: Dynamic Switching Characteristics1) Worst case package.2) Max number of outputs defined as (n). Data inputs are driven 0V to 3.3V, (n-1) outputs switching and one output at GND.3) Max number of data inputs (n) switching. (n-1) switching 0V to 3.3V. Inputs under test switching: 3.3V to threshold (V ILD ), 0V to threshold (V IHD ), f=1MHz.SymbolParameterTest ConditionValue UnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.V IH High Level Input Voltage3.0 to 3.62.02.02.0V V IL Low Level Input Voltage0.80.80.8V V OHHigh Level Output Voltage3.0I O =-50 µA2.9 2.992.9 2.9VI O =-12 mA 2.582.48 2.48I O =-24 mA2.22.2V OLLow Level Output Voltage3.0I O =50 µA0.0020.10.10.1V I O =12 mA 00.360.440.44I O =24 mA0.550.55I I Input Leakage Current3.6V I = V CC or GND ± 0.1± 1± 1µAIozHigh Impedance Output Leakage Current3.6V I = V IH or V IL V O = V CC or GND ± 0.5± 5± 10µAI CC Quiescent Supply Current3.6V I = V CC or GND 44040µA I OLD Dynamic Output Current (note 1, 2)3.6V OLD = 0.8 V max 3625mA I OHDV OHD = 2 V min-25-25mASymbolParameterTest ConditionValueUnitV CC(V)T A = 25°C -40 to 85°C-55 to 125°C Min.Typ.Max.Min.Max.Min.Max.V OLP Dynamic Low Voltage Quiet Output (note 1, 2) 3.3C L = 50 pF0.40.8V V OLV -0.8-0.5V IHD Dynamic High Voltage Input (note 1, 3) 3.32VV ILDDynamic Low Voltage Input (note 1, 3)3.30.8Vl c c )Obs o e t ePr od u t (s) -O bs o l e t e P r o dut (s74LVQ2444/12Table 8: AC Electrical Characteristics (C L = 50 pF, R L = 500 Ω, Input t r = t f = 3ns)1) Skew is defined as the absolute value of the difference between the actual propagation delay for any two outputs of the same device switch-ing in the same direction, either HIGH or LOW (t OSLH = |t PLHm - t PLHn |, t OSHL = |t PHLm - t PHLn |)2) Parameter guaranteed by design (*) Voltage range is 3.3V ± 0.3VTable 9: Capacitive Characteristics1) C PD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. I CC(opr) = C PD x V CC x f IN + I CC /8 (per circuit)SymbolParameterTest ConditionValue UnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.t PLH t PHL Propagation DelayTime 2.7 6.61112.514ns 3.3(*) 5.6910.513t PZL t PZH Output EnableTime 2.78.313.51518ns 3.3(*) 6.81011.513t PLZ t PHZ Output DisableTime 2.77.51213.515ns 3.3(*) 6.09.010.512t OSLH t OSHLOutput To Output Skew Time (note1, 2)2.70.5 1.0 1.0 1.0ns3.3(*)0.51.01.01.0SymbolParameterTest ConditionValueUnitV CC (V)T A = 25°C -40 to 85°C-55 to 125°CMin.Typ.Max.Min.Max.Min.Max.C IN Input Capacitance 3.34pF C OUT OutputCapacitance3.38pF C PDPower Dissipation Capacitance (note 1)3.3f IN = 10MHz10pFc ) P r o dut (s74LVQ2445/12Figure 3: Test CircuitC L = 50pF or equivalent (includes jig and probe capacitance)R L = R 1 = 500Ω or equivalentR T = Z OUT of pulse generator (typically 50Ω)Figure 4: Waveform - Propagation Delays (f=1MHz; 50% duty cycle)TESTSWITCHt PLH , t PHL Open t PZL , t PLZ 2V CC t PZH , t PHZOpenl c Obs o e t ePr od u t (s) -O bs 74LVQ2446/12Figure 5: Waveform - Output Enable And Disable Time (f=1MHz; 50% duty cycle)l cu)O b s oe t eP ro dut(s)-O bs ol e te Pr o dc t(s74LVQ2447/12 DIM.mm.inchMIN.TYP MAX.MIN.TYP.MAX.A 2.35 2.650.0930.104A10.10.300.0040.012 B0.330.510.0130.020 C0.230.320.0090.013 D12.6013.000.4960.512 E7.47.60.2910.299e 1.270.050H10.0010.650.3940.419 h0.250.750.0100.030 L0.4 1.270.0160.050 k0°8°0°8°ddd0.1000.004SO-20 MECHANICAL DATA0016022Dl c u)Obs o e t ePr od u t (s) -O bs o l e t e P r o dc t(s74LVQ2448/12DIM.mm.inchMIN.TYPMAX.MIN.TYP.MAX.A 1.20.047A10.050.150.0020.0040.006A20.81 1.050.0310.0390.041b 0.190.300.0070.012c 0.090.200.0040.0079D 6.4 6.5 6.60.2520.2560.260E 6.2 6.4 6.60.2440.2520.260E1 4.34.4 4.480.1690.1730.176e 0.65 BSC0.0256 BSCK 0˚8˚0˚8˚L0.450.600.750.0180.0240.030TSSOP20 MECHANICAL DATAcEbA2AE1D1PIN 1 IDENTIFICATIONA1LK e0087225Cl cc)O b s oe t eP ro dut(s)-O bs ol e te Pr o dut(s74LVQ2449/12 DIM.mm.inchMIN.TYP MAX.MIN.TYP.MAX.A33012.992 C12.813.20.5040.519 D20.20.795N60 2.362T30.4 1.197 Ao10.8110.4250.433 Bo13.213.40.5200.528 Ko 3.1 3.30.1220.130 Po 3.9 4.10.1530.161 P11.912.10.4680.476Tape & Reel SO-20 MECHANICAL DATAl cc)O b s oe t eP ro dut(s)-O bs ol e te Pr o dut(s74LVQ24410/12DIM.mm.inchMIN.TYP MAX.MIN.TYP.MAX. A33012.992 C12.813.20.5040.519 D20.20.795N60 2.362T22.40.882 Ao 6.870.2680.276 Bo 6.97.10.2720.280 Ko 1.7 1.90.0670.075 Po 3.9 4.10.1530.161 P11.912.10.4680.476 Tape & Reel TSSOP20 MECHANICAL DATAl cc)O b s oe t eP ro dut(s)-O bs ol e te Pr o dut(s74LVQ24411/12Table 10: Revision HistoryDate Revision Description of Changes 29-Jul-20047Ordering Codes Revision - pag. 1.l c c )O b s o e t e P r o d u t (s ) -O b s o l e t e P r o d u t (s74LVQ24412/12Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is a registered trademark of STMicroelectronicsAll other names are the property of their respective owners© 2004 STMicroelectronics - All Rights ReservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America。
74LVC244A资料
1/9February 2002s 5V TOLERANT INPUTSs HIGH SPEED: t PD = 5.9ns (MAX.) at V CC = 3V sPOWER DOWN PROTECTION ON INPUTS AND OUTPUTSsSYMMETRICAL OUTPUT IMPEDANCE:|I OH | = I OL = 24mA (MIN) at V CC = 3Vs PCI BUS LEVELS GUARANTEED AT 24 mA sBALANCED PROPAGATION DELAYS:t PLH ≅ t PHLsOPERATING VOLTAGE RANGE:V CC (OPR) = 1.65V to 3.6V (1.2V Data Retention)sPIN AND FUNCTION COMPATIBLE WITH 74 SERIES 244sLATCH-UP PERFORMANCE EXCEEDS 500mA (JESD 17)sESD PERFORMANCE:HBM > 2000V (MIL STD 883 method 3015); MM > 200VDESCRIPTIONThe 74LVC244A is a low voltage CMOS OCTAL BUS BUFFER (3-STATE) fabricated with sub-micron silicon gate and double-layer metal wiring C 2MOS technology. It is ideal for 1.65 to 3.6V CC operations and low power and low noise applications.It can be interfaced to 5V signal environment for inputs in mixed 3.3/5V system.G control output governs four BUS BUFFERs.This device is designed to be used with 3 state memory address drivers, etc.It has more speed performance at 3.3V than 5V AC/ACT family, combined with a lower power consumption.All inputs and outputs are equipped with protection circuits against static discharge, giving them 2KV ESD immunity and transient excess voltage.74LVC244ALOW VOLTAGE CMOS QUAD BUS BUFFERS (3-STATE)HIGH PERFORMANCE.PIN CONNECTION AND IEC LOGIC SYMBOLSORDER CODESPACKAGE TUBE T & R SOP 74LVC244AM74LVC244AMTR TSSOP74LVC244ATTR74LVC244A2/9INPUT AND OUTPUT EQUIVALENT CIRCUITPIN DESCRIPTIONTRUTH TABLEX : Don’t careZ : High ImpedanceABSOLUTE MAXIMUM RATINGSAbsolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied1) I O absolute maximum rating must be observed 2) V O < GNDPIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2, 4, 6, 81A1 to 1A4Data Inputs 9, 7, 5, 32Y1 to 2Y4Data Outputs 11, 13, 15,172A1 to 2A4Data Inputs 18, 16, 14,121Y1 to 1Y4Data Outputs192G Output Enable Input 10GND Ground (0V)20V CCPositive Supply VoltageINPUTS OUTPUTG An Yn L L L L H H HXZSymbol ParameterValue Unit V CC Supply Voltage -0.5 to +7.0V V I DC Input Voltage-0.5 to +7.0V V O DC Output Voltage (High Impedance or V CC = 0V)-0.5 to +7.0V V O DC Output Voltage (High or Low State) (note 1)-0.5 to V CC + 0.5V I IK DC Input Diode Current- 50mA I OK DC Output Diode Current (note 2)- 50mA I O DC Output Current ± 50mA I CC or I GND DC V CC or Ground Current per Supply Pin± 100mA T stg Storage Temperature -65 to +150°C T LLead Temperature (10 sec)300°C74LVC244A3/9RECOMMENDED OPERATING CONDITIONS1) Truth Table guaranteed: 1.2V to 3.6V 2) V IN from 0.8V to 2V at V CC = 3.0VDC SPECIFICATIONSSymbol ParameterValue Unit V CC Supply Voltage (note 1) 1.65 to 3.6V V I Input Voltage0 to 5.5V V O Output Voltage (High Impedance or V CC = 0V)0 to 5.5V V O Output Voltage (High or Low State)0 to V CC V I OH , I OL High or Low Level Output Current (V CC = 3.0 to 3.6V)± 24mA I OH , I OL High or Low Level Output Current (V CC = 2.7 to 3.0V)± 12mA I OH , I OL High or Low Level Output Current (V CC = 2.3 to 2.7V)± 8mA I OH , I OL High or Low Level Output Current (V CC = 1.65 to 2.3V)± 4mA T op Operating Temperature-55 to 125°C dt/dvInput Rise and Fall Time (note 2)0 to 10ns/VSymbolParameterTest ConditionValueUnitV CC (V)-40 to 85 °C -55 to 125 °C Min.Max.Min.Max.V IHHigh Level Input Voltage 1.65 to 1.950.65V CC 0.65V CC V 2.3 to 2.7 1.7 1.72.7 to3.622V ILLow Level Input Voltage1.65 to 1.950.35V CC 0.35V CCV2.3 to 2.70.70.72.7 to3.60.80.8V OHHigh Level Output Voltage1.65 to 3.6I O =-100 µA V CC -0.2V CC -0.2V1.65I O =-4 mA 1.2 1.22.3I O =-8 mA 1.7 1.72.7I O =-12 mA 2.2 2.23.0I O =-18 mA 2.4 2.43.0I O =-24 mA 2.22.2V OLLow Level Output Voltage1.65 to 3.6I O =100 µA 0.20.2V1.65I O =4 mA 0.450.452.3I O =8 mA 0.70.72.7I O =12 mA 0.40.43.0I O =24 mA 0.550.55I I Input Leakage Current3.6V I = 0 to 5.5V ± 5± 5µA I off Power Off Leakage Current0V I or V O = 5.5V 1010µA I OZHigh Impedance Output Leakage Current3.6V I = V IH orV IL V O = 0 to 5.5V ± 5± 5µAI CCQuiescent Supply Current3.6V I = V CC or GND1010µA V I or V O = 3.6 to5.5V± 10± 10∆I CCI CC incr. per Input2.7 to3.6V IH = V CC -0.6V500500µA74LVC244A4/9DYNAMIC SWITCHING CHARACTERISTICS1) Number of output defined as "n". Measured with "n-1" outputs switching from HIGH to LOW or LOW to HIGH. The remaining output is measured in the LOW state.AC ELECTRICAL CHARACTERISTICS1) Skew is defined as the absolute value of the difference between the actual propagation delay for any two outputs of the same device switch-ing in the same direction, either HIGH or LOW (t OSLH = | t PLHm - t PLHn |, t OSHL = | t PHLm - t PHLn |2) Parameter guaranteed by designCAPACITIVE CHARACTERISTICS1) C PD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. I CC(opr) = C PD x V CC x f IN + I CC /n (per circuit)SymbolParameterTest ConditionValue UnitV CC (V)T A = 25 °C Min.Typ.Max.V OLP Dynamic Low Level Quiet Output (note 1)3.3C L = 50pFV IL = 0V, V IH = 3.3V0.8V V OLV-0.8SymbolParameterTest ConditionValueUnitV CC (V)C L (pF)R L (Ω)t s = t r (ns)-40 to 85 °C -55 to 125 °C Min.Max.Min.Max.t PLH t PHLPropagation Delay Time1.65 to 1.953010002.09.012ns2.3 to 2.730500 2.07.910.52.750500 2.5 1.5 6.98.33.0 to 3.650500 2.515.97.1t PZL t PZHOutput Enable Time 1.65 to 1.95301000 2.01114.3ns2.3 to 2.730500 2.09.612.52.750500 2.518.610.33.0 to 3.650500 2.517.69.1t PLZ t PHZOutput Disable Time 1.65 to 1.95301000 2.09.011.7ns2.3 to 2.730500 2.07.810.12.750500 2.52 6.88.23.0 to 3.6505002.526.57.8t OSLH t OSHLOutput To Output Skew Time (note1, 2)2.7 to3.611nsSymbolParameterTest ConditionValue UnitV CC (V)T A = 25 °C Min.Typ.Max.C IN Input Capacitance4pF C PDPower Dissipation Capacitance (note 1)1.8f IN = 10MHz28pF 2.5303.33474LVC244A TEST CIRCUITT OUTTEST CIRCUIT AND WAVEFORM SYMBOL VALUEV CCSymbol1.65 to 1.95V2.3 to 2.7V 2.7V3.0 to 3.6VC L30pF30pF50pF50pFR L =R11000Ω500Ω500Ω500ΩV S 2 x V CC 2 x V CC6V6VV IH V CC V CC 2.7V 2.7VV M V CC/2V CC/2 1.5V 1.5VV OH V CC V CC 3.0V 3.0VV X V OL + 0.15V V OL + 0.15V V OL + 0.3V V OL + 0.3VV Y V OH - 0.15V V OH - 0.15V V OH - 0.3V V OH - 0.3Vt r = t r<2.0ns<2.0ns<2.5ns<2.5ns5/974LVC244A6/9WAVEFORM 1: PROPAGATION DELAYS (f=1MHz; 50% duty cycle)WAVEFORM 2: OUTPUT ENABLE AND DISABLE TIME(f=1MHz; 50% duty cycle)74LVC244A Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.© The ST logo is a registered trademark of STMicroelectronics© 2002 STMicroelectronics - Printed in Italy - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.© 9/9。
74LVCH244APW中文资料
元器件交易网SO20:plastic small outline package; 20 leads; body width 7.5 mm SOT163-1SSOP20:plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1TSSOP20:plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1DefinitionsShort-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.DisclaimersLife support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.Philips Semiconductors811 East Arques AvenueP.O. Box 3409Sunnyvale, California 94088–3409Telephone 800-234-7381© Copyright Philips Electronics North America Corporation 1998All rights reserved. Printed in U.S.A.print code Date of release: 05-96。
74LVT244AD-T中文资料
IIK
input clamping current VI < 0 V
-
−50
mA
IOK
output clamping current VO < 0 V
-
பைடு நூலகம்
−50
mA
IO
output current
output in LOW-state
-
128
mA
output in HIGH-state
-
−64
mA
Tstg
2. Features
I Octal bus interface I 3-state buffers I Output capability: +64 mA and −32 mA I TTL input and output switching levels I Input and output interface capability to systems at 5 V supply I Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs I Power-up 3-state I Live insertion and extraction permitted I No bus current loading when output is tied to 5 V bus I Latch-up protection:
SOT163-1
plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
SN74AHC244PWG4中文资料
PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9678201Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9678201QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type 5962-9678201SA ACTIVE CFP W 20TBD Call TI Call TI5962-9678201VRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201VSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74AHC244DBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74AHC244DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRG4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRG4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWLEOBSOLETETSSOPPW20TBDCall TICall TI24-Sep-2007Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74AHC244PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54AHC244FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AHC244J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54AHC244WACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--TheMoisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.24-Sep-2007TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC244DBR DB 20SITE 41330168.27.5 2.51216Q1SN74AHC244DGVR DGV 20SITE 41330127.0 5.6 1.6812Q1SN74AHC244DWR DW 20SITE 413302410.813.0 2.71224Q1SN74AHC244NSR NS 20SITE 41330248.213.0 2.51224Q1SN74AHC244PWRPW20SITE 41330166.957.11.6816Q122-Sep-2007DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74AHC244DBR DB 20SITE 41346.0346.00.0SN74AHC244DGVR DGV 20SITE 41346.0346.00.0SN74AHC244DWR DW 20SITE 41346.0346.00.0SN74AHC244NSR NS 20SITE 41346.0346.00.0SN74AHC244PWRPW20SITE 41346.0346.00.022-Sep-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityRFID Telephony /telephonyLow Power /lpw Video&Imaging /videoWirelessWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
SN74LVC244A资料
FEATURES
• Operates From 1.65 V to 3.6 V • Inputs Accept Voltages to 5.5 V • Specified From –40°C to 85°C and –40°C to
125°C • Max tpd of 5.9 ns at 3.3 V • Typical VOLP (Output Ground Bounce) < 0.8 V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data s applied to any output in the high or low state(2)(3)
IIK Input clamp current
VI < 0
IOK Output clamp current
VO < 0
IO Continuous output current
19 2OE
18 1Y1
2A1 11
9 2Y1
1A2 4
16 1Y2
2A2 13
7 2Y2
1A3 6
14 1Y3
2A3 15
5 2Y3
1A4 8
12 1Y4
2A4 17
Pin numbers shown are for the DB, DGV, DW, N, NS, PW, and RGY packages.
74LVCH244A中文资料
元器件交易网SO20:plastic small outline package; 20 leads; body width 7.5 mm SOT163-1SSOP20:plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1TSSOP20:plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1DefinitionsShort-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.DisclaimersLife support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.Philips Semiconductors811 East Arques AvenueP.O. Box 3409Sunnyvale, California 94088–3409Telephone 800-234-7381© Copyright Philips Electronics North America Corporation 1998All rights reserved. Printed in U.S.A.print code Date of release: 05-96。
74VHCT244AMX中文资料
元器件交易网74VHCT244A Octal Buffer/Line Driver with 3-STATE Outputs74VHCT244A Octal Buffer/Line Driver with 3-STATE OutputsConnection DiagramPin DescriptionLogic SymbolTruth TablesH = HIGH Voltage Level L = LOW Voltage Level Z = High ImpedancePin NamesDescriptionOE 1 , OE 2 3-STATE Output Enable InputsI 0 –I 7 InputsO 0 –O 73-STATE OutputsInputs Outputs(Pins 12, 14, 16, 18)OE 1I nL L L L H H HXZInputs Outputs (Pins 3, 5, 7, 9)OE 2I nL L L L H H HXZ元器件交易网74VHCT244A Octal Buffer/Line Driver with 3-STATE OutputsAbsolute Maximum RatingsStresses exceeding the absolute maximum ratings may damage the device. The device may not function or beoperable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.Recommended Operating Conditions (5)The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings.Notes:2.HIGH or LOW state. I OUT absolute maximum rating must be observed.3.When outputs are in OFF-STATE or when V CC = 0V.4.V OUT < GND, V OUT > V CC (Outputs Active).5.Unused inputs must be held HIGH or LOW. They may not float.Symbol ParameterRatingV CC Supply Voltage –0.5V to +7.0V V IN DC Input Voltage –0.5V to +7.0V V OUTDC Output Voltage Note 2 Note 3–0.5V to V CC + 0.5V–0.5V to +7.0VI IK Input Diode Current –20mA I OK Output Diode Current (4) ±20mA I OUT DC Output Current ±25mA I CC DC V CC /GND Current ±75mAT STG Storage Temperature–65°C to +150°CT LLead Temperature (Soldering, 10 seconds)260°CSymbol ParameterRatingV CC Supply Voltage 4.5V to +5.5V V IN Input Voltage 0V to +5.5V V OUTOutput Voltage Note 2 Note 30V to V CC 0V to +5.5V T OPR Operating Temperature–40°C to +85°C t r , t fInput Rise and Fall Time, V CC =5.0V ± 0.5V0ns/V ~ 20ns/V元器件交易网74VHCT244A Octal Buffer/Line Driver with 3-STATE OutputsDC Electrical CharacteristicsNoise CharacteristicsNote:6.Parameter guaranteed by design.SymbolParameterV CC (V)Conditions T A = 25°CT A = –40°C to +85°C UnitsMin.Typ.Max.Min.Max. V IH HIGH Level Input Voltage4.5 2.0 2.0V5.5 2.02.0V IL LOW Level Input Voltage4.50.80.8V5.50.80.8V OH HIGH Level Output Voltage4.5V IN = V IH or V ILI OH = –50µA 4.40 4.50 4.40V I OH = –8mA 3.943.80V OL LOW Level Output Voltage4.5V IN = V IH or V ILI OL = 50µA 0.00.10.1V I OL = 8mA 0.360.44I OZ 3-STATE Output OFF-STATE Current 5.5V IN = V IH or V IL , V OUT = V CC or GND ±0.25±2.5µA I IN Input Leakage Current0–5.5V IN = 5.5V or GND ±0.1±1.0µA I CC Quiescent Supply Current5.5V IN = V CC or GND 4.040.0µA I CCT Maximum I CC /Input 5.5V IN = 3.4V , Other Input = V CC or GND 1.35 1.50mA I OFFOutput Leakage Current (Power Down State)0.0V OUT = 5.5V0.55.0µA SymbolParameterV CC (V)ConditionsT A = 25°CUnitsTyp.LimitsV OLP (6)Quiet Output Maximum Dynamic V OL5.0C L = 50pF 0.9 1.1V V OLV (6)Quiet Output Minimum Dynamic V OL5.0C L = 50pF –0.9–1.1V V IHD (6)Minimum HIGH Level Dynamic Input Voltage5.0C L = 50pF 2.0V V ILD (6)Maximum HIGH Level Dynamic Input Voltage5.0C L = 50pF0.8V元器件交易网74VHCT244A Octal Buffer/Line Driver with 3-STATE OutputsAC Electrical CharacteristicsNotes:7.Parameter guaranteed by design. t OSLH = |t PLH max – t PLH min |; t OSHL = |t PHL max – t PHL min |8.C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation:I CC (Opr.) = C PD • V CC • f IN + I CC / 8 (per F/F). The total C PD when n pcs. of the Octal D Flip-Flop operates can be calculated by the equation: C PD (total) = 20 + 12nSymbolParameterV CC (V)ConditionsT A = 25°CT A = –40°C to +85°CUnitsMin.Typ.Max.Min.Max.t PLH , t PHL Propagation Delay Time5.0 ± 0.5C L = 15pF 5.47.4 1.08.5nsC L = 50pF 5.98.41.09.5t PZL , t PZH 3-STATE Output Enable Time 5.0 ± 0.5R L = 1k ΩC L = 15pF 7.710.4 1.012.5ns C L = 50pF 8.211.4 1.013.5t PLZ , t PHZ3-STATE Output Disable Time5.0 ± 0.5R L = 1k ΩC L = 50pF8.811.4 1.013.0ns t OSLH , t OSHL Output to OutputSkew5.0 ± 0.5(7)1.01.0ns C IN Input Capacitance V CC = Open 41010pF C OUT Output Capacitance V CC = 5.0V9pF C PDPower Dissipation Capacitance(8)18pFFigure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" WidePackage Number M20B74VHCT244A Octal Buffer/Line Driver with 3-STATE Outputs The™TinyBoost。
SN74ACT244PW中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN74ACT244PWR
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-8776001M2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-8776001MRA ACTIVE CDIP J201TBD A42N/A for Pkg Type 5962-8776001MSA ACTIVE CFP W201TBD Call TI N/A for Pkg Type 5962-8776001SRA ACTIVE CDIP J201TBD A42N/A for Pkg Type 5962-8776001SSA ACTIVE CFP W201TBD Call TI N/A for Pkg Type SN74ACT244DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74ACT244DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DBRG4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74ACT244NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74ACT244NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244NSRG4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWG4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT244PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74ACT244PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ACT244PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54ACT244FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54ACT244J ACTIVE CDIP J201TBD A42N/A for Pkg Type SNJ54ACT244W ACTIVE CFP W201TBD Call TI N/A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54ACT244,SN54ACT244-SP,SN74ACT244:•Automotive:SN74ACT244-Q1•Enhanced Product:SN74ACT244-EPNOTE:Qualified Version Definitions:•Automotive-Q100devices qualified for high-reliability automotive applications targeting zero defects•Enhanced Product-Supports Defense,Aerospace and Medical ApplicationsTAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74ACT244DBR SSOPDB 202000330.016.48.27.5 2.512.016.0Q1SN74ACT244DWR SOICDW 202000330.024.410.813.0 2.712.024.0Q1SN74ACT244NSR SONS 202000330.024.48.213.0 2.512.024.0Q1SN74ACT244PWR TSSOP PW 202000330.016.4 6.957.1 1.68.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74ACT244DBR SSOP DB202000346.0346.033.0 SN74ACT244DWR SOIC DW202000346.0346.041.0 SN74ACT244NSR SO NS202000346.0346.041.0 SN74ACT244PWR TSSOP PW202000346.0346.033.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDLP®Products BroadbandDSP Digital ControlClocks and Timers MedicalInterface MilitaryLogic Optical NetworkingPower Mgmt SecurityMicrocontrollers TelephonyRFID Video&ImagingRF/IF and ZigBee®Solutions WirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2009,Texas Instruments Incorporated。
SN74LVTZ244PWRG4,SN74LVTZ244DBRE4,SN74LVTZ244DBRG4,SN74LVTZ244DWE4, 规格书,Datasheet 资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LVTZ244DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74LVTZ244DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DBRG4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTZ244PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74LVTZ244PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LVTZ244DBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74LVTZ244DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74LVTZ244PWRTSSOPPW202000330.016.46.957.11.68.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LVTZ244DBR SSOP DB202000367.0367.038.0 SN74LVTZ244DWR SOIC DW202000367.0367.045.0SN74LVTZ244PWR TSSOP PW202000367.0367.038.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s 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TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。
74act244scx手册解读
74act244scx手册解读74ACT244SCX是一款集成逻辑芯片,属于TTL(晶体管-晶体管逻辑)系列。
本手册将对其进行详细解读,包括芯片的功能特性、引脚功能、电气特性及应用示例等方面。
首先,让我们来了解一下74ACT244SCX芯片的功能特性。
该芯片是一个具有8个双向缓冲器的三态缓冲器,用于将一个8位数据线的逻辑电平转换为另一个8位数据线的逻辑电平。
这意味着它可以完成数据信号的转发,适用于数码信号的放大、隔离和解耦等应用。
此外,芯片还具有高噪声抵抗能力和可逆的数据传输功能。
接下来,我们来了解一下74ACT244SCX芯片的引脚功能。
该芯片共有20个引脚,包括8个输出端口(Y1-Y8)、8个输入端口(A1-A8)和一个使能端口(G)。
输入端口用于接收输入信号,输出端口用于输出经过处理后的信号,而使能端口用于控制芯片的工作状态。
在三态缓冲器(Tri-State Buffer)的应用中,使能端口(G)非常重要,它可以使输出端口(Y1-Y8)高阻抗(高阻抗状态)。
我们再来了解一下74ACT244SCX芯片的电气特性。
该芯片具有广泛的工作电压范围,可以在2V至6V的电压下正常工作。
其输入电压范围为0V至Vcc,输出电压范围为0V至Vcc,高电平输入电压范围为0.7Vcc至Vcc,低电平输入电压范围为0V至0.3Vcc。
另外,该芯片具有高速操作能力,最大时钟频率可达100MHz,非常适合高速数据传输的应用。
最后,我们来看一些74ACT244SCX芯片的应用示例。
这款芯片广泛应用于各种数据信号传输和处理电路中。
常见的应用场景包括数据总线驱动、数据信号放大、数据隔离、数据解耦等。
此外,由于其高速操作能力和可靠性,还可应用于工业领域的自动化控制系统和通信设备等。
综上所述,74ACT244SCX是一款集成逻辑芯片,具有8个双向缓冲器的三态缓冲器功能。
其引脚功能包括8个输入端口、8个输出端口和1个使能端口。
该芯片具有高噪声抵抗能力、可逆的数据传输功能和广泛的工作电压范围。
74ALVC162244资料
© 2001 Fairchild Semiconductor Corporation DS500696November 2001Revised November 200174ALVC162244 Low Voltage 16-Bit Buffer/Line Driver with 3.6V Tolerant Inputs and Outputs and 26Ω Series Resistor in Outputs74ALVC162244Low Voltage 16-Bit Buffer/Line Driver with 3.6V Tolerant Inputs and Outputs and 26Ω Series Resistor in OutputsGeneral DescriptionThe ALVC162244 contains sixteen non-inverting buffers with 3-STATE outputs to be employed as a memory and address driver, clock driver, or bus oriented transmitter/receiver. The device is nibble (4-bit) controlled. Each nibble has separate 3-STATE control inputs which can be shorted together for full 16-bit operation.The 74ALVC162244 is designed for low voltage (1.65V to 3.6V) V CC applications with I/O capability up to 3.6V. The 74ALVC162244 is also designed with 26Ω series resistors in the outputs. This design reduces line noise in applica-tions such as memory address drivers, clock drivers, and bus transceivers/transmitters.The 74ALVC162244 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain-ing low CMOS power dissipation.Featuress 1.65V to 3.6V V CC supply operation s 3.6V tolerant inputs and outputs s 26Ω series resistors in outputs s t PD3.8 ns max for 3.0V to 3.6V V CC4.3 ns max for 2.3V to 2.7V V CC 7.6 ns max for 1.65V to 1.95V V CCs Power-off high impedance inputs and outputs s Supports live insertion and withdrawal s Uses patented noise/EMI reduction circuitry s Latchup conforms to JEDEC JED78s ESD performance:Human body model > 2000V Machine model > 200Vs Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA)Note 1: To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pull-up resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.Ordering Code:Note 2: BGA package available in Tape and Reel only.Note 3: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.Order Number Package NumberPackage Description74ALVC162244GX (Note 2)BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide [TAPE and REEL]74ALVC162244T (Note 3)MTD4848-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide 274A L V C 162244Logic Symbol Connection DiagramsPin Assignment for TSSOPPin Assignment for FBGA(Top Thru View)Pin DescriptionsFBGA Pin AssignmentsTruth TablesH = HIGH Voltage Level L = LOW Voltage LevelX = Immaterial (HIGH or LOW, inputs may not float)Z = High ImpedancePin NamesDescriptionOE n Output Enable Input (Active LOW)I 0–I 15Inputs O 0–O 15Outputs NCNo Connect123456A O 0NC OE 1OE 2NC I 0B O 2O 1NC NC I 1I 2C O 4O 3V CC V CC I 3I 4D O 6O 5GND GND I 5I 6E O 8O 7GND GND I 7I 8F O 10O 9GND GND I 9I 10G O 12O 11V CC V CC I 11I 12H O 14O 13NC NC I 13I 14JO 15NCOE 4OE 3NCI 15InputsOutputs OE 1I 0–I 3O 0–O 3L L L L H H HXZ InputsOutputs OE 2I 4–I 7O 4–O 7L L L L H H HX Z InputsOutputs OE 3I 8–I 11O 8–O 11L L L L H H HX Z InputsOutputs OE 4I 12–I 15O 12–O 15L L L L H H HX Z74ALVC162244Functional DescriptionThe 74ALVC162244 contains sixteen non-inverting bufferswith 3-STATE outputs. The device is nibble (4 bits) con-trolled with each nibble functioning identically, but indepen-dent of each other. The control pins may be shorted together to obtain full 16-bit operation.The 3-STATE out-puts are controlled by an Output Enable (OE n ) input. When OE n is LOW, the outputs are in the 2-state mode. When OE n is HIGH, the standard outputs are in the high imped-ance mode but this does not interfere with entering new data into the inputs.Logic Diagram 474A L V C 162244Absolute Maximum Ratings (Note 4)Recommended Operating Conditions (Note 6)Note 4: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Rat-ings. The “Recommended Operating Conditions ” table will define the condi-tions for actual device operation.Note 5: I O Absolute Maximum Rating must be observed.Note 6: Floating or unused control inputs must be held HIGH or LOW.DC Electrical CharacteristicsSupply Voltage (V CC )−0.5V to +4.6V DC Input Voltage (V I )−0.5V to 4.6V Output Voltage (V O ) (Note 5)−0.5V to V CC +0.5VDC Input Diode Current (I IK ) V I < 0V−50 mA DC Output Diode Current (I OK )V O < 0V−50 mA DC Output Source/Sink Current (I OH /I OL )±50 mA DC V CC or GND Current per Supply Pin (I CC or GND)±100 mAStorage Temperature Range (T STG )−65°C to +150°CPower SupplyOperating 1.65V to 3.6V Input Voltage 0V to V CC Output Voltage (V O )0V to V CCFree Air Operating Temperature (T A )−40°C to +85°CMinimum Input Edge Rate (∆t/∆V)V IN = 0.8V to 2.0V, V CC = 3.0V10 ns/VSymbol ParameterConditionsV CC Min MaxUnits(V)V IHHIGH Level Input Voltage1.65 - 1.950.65 x V CCV2.3 - 2.7 1.72.7 -3.62.0V ILLOW Level Input Voltage1.65 - 1.950.35 x V CCV 2.3 - 2.70.72.7 - 3.60.8V OHHIGH Level Output VoltageI OH = −100 µA 1.65 - 3.6V CC - 0.2VI OH = −2 mA 1.65 1.2I OH = −4 mA 2.3 1.9I OH = −6 mA 2.3 1.73 2.4I OH = −8 mA 2.72I OH = −12 mA3.02V OLLOW Level Output VoltageI OL = 100 µA 1.65 - 3.60.2V I OL = 2 mA 1.650.45I OL = 4 mA 2.30.4I OL = 6 mA 2.30.5530.55I OL = 8 mA 2.70.6I OL = 12 mA30.8I I Input Leakage Current 0 ≤ V I ≤ 3.6V 3.6±5.0µA I OZ 3-STATE Output Leakage 0 ≤ V O ≤ 3.6V3.6±10µA I CC Quiescent Supply Current V I = V CC or GND, I O = 0 3.640µA ∆I CCIncrease in I CC per InputV IH = V CC − 0.6V3 - 3.6750µA74ALVC162244AC Electrical CharacteristicsCapacitanceSymbolParameterT A = −40°C to +85°C, R L = 500ΩUnitsC L = 50 pFC L = 30 pFV CC = 3.3V ± 0.3V V CC = 2.7V V CC = 2.5V ± 0.2VV CC = 1.8V ± 0.15V MinMax Min Max Min Max Min Max t PHL , t PLH Propagation Delay 1.3 3.8 1.5 4.3 1.0 3.8 1.57.6ns t PZL , t PZH Output Enable Time 1.3 4.3 1.5 5.6 1.0 5.1 1.59.8ns t PLZ , t PHZOutput Disable Time1.34.11.54.51.04.01.57.2ns Symbol ParameterConditionsT A = +25°C Units V CC Typical C IN Input Capacitance V I = 0V or V CC 3.36pF C OUT Output CapacitanceV I = 0V or V CC3.37pF C PDPower Dissipation CapacitanceOutputs Enabled f = 10 MHz, C L = 50 pF3.320pF2.520 674A L V C 162244AC Loading and WaveformsFIGURE 1. AC Test CircuitTABLE 1. Values for Figure 1 TABLE 2. Variable Matrix(Input Characteristics: f = t r = t f = 2ns; Z 0 = 50ΩFIGURE 2. Waveform for Inverting and Non-Inverting FunctionsFIGURE 3. 3-STATE Output High Enable and Disable Times for Low Voltage LogicFIGURE 4. 3-STATE Output Low Enable and Disable Times for Low Voltage LogicTEST SWITCH t PLH , t PHL Open t PZL , t PLZ V L t PZH , t PHZGNDSymbol V CC3.3V ± 0.3V2.7V 2.5V ± 0.2V 1.8V ± 0.15VV mi 1.5V 1.5V V CC /2V CC /2V mo 1.5V 1.5V V CC /2V CC /2V X V OL + 0.3V V OL + 0.3V V OL + 0.15V V OL + 0.15V V Y V OH − 0.3VV OH − 0.3VV OH − 0.15V V OH − 0.15V V L6V6VV CC *2V CC *274ALVC162244 Physical Dimensions inches (millimeters) unless otherwise noted54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm WidePackage Number BGA54A874A L V C 162244 L o w V o l t a g e 16-B i t B u f f e r /L i n e D r i v e r w i t h 3.6V T o l e r a n t I n p u t s a n d O u t p u t s a n d 26Ω S e r i e s R e s i s t o r i n O u t p u t sPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm WidePackage Number MTD48Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD ’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。
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–50 mA
±50 mA
±100 mA
70
92
58
78 °C/W
69
60
83
37
–65
150 °C
500 mW
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This octal buffer/line driver is operational at 1.5-V to 3.6-V VCC, but is designed specifically for 1.65-V to 3.6-V VCC operation.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
VFBGA – ZQN (Pb-Free)
SN74LVC244AGQNR SN74LVC244AZQNR
PDIP – N
Tube of 20
SN74LVC244AN
SOIC – DW
Tube of 25 Reel of 2000
SN74LVC244ADW SN74LVC244ADWR
SOP – NS
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.
LOGIC DIAGRAM (POSITIVE LOGIC)
19 2OE
18 1Y1
2A1 11
9 2Y1
1A2 4
16 1Y2
2A2 13
7 2Y2
1A3 6
14 1Y3
2A3 15
5 2Y3
8 1A4
12 1Y4
17 2A4
Pin numbers shown are for the DB, DGV, DW, N, NS, PW, and RGY packages.
PW package(4)
RGY package(5)
Tstg Storage temperature range Ptot Power dissipation
TA = –40°C to 125°C(6)(7)
MIN
MAX UNIT
–0.5
6.5 V
–0.5
6.5 V
–0.5
6.5 V
–0.5 VCC + 0.5 V –50 mA
Copyright © 1992–2005, Texas Instruments Incorporated
元器件交易网
SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
Reel of 2000
SN74LVC244ADGVR
TOP-SIDE MARKING LC244A LC244A SN74LVC244AN LVC244A LVC244A LC244A
LC244A
LC244A
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package.
3 2Y4
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
VCC Supply voltage range
VI
Input voltage range(2)
VO Voltage range applied to any output in the high-impedance or power-off state(2)
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The SN74LVC244A is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
VO Voltage range applied to any output in the high or low state(2)(3)
IIK Input clamp current
VI < 0
IOK Output clamp current
VO < 0
IO Continuous output current
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Continuous current through VCC or GND
DB package(4)
DGV package(4)
DW package(4)
θJA Package thermal impedance
GQN/ZQN package(4) N package(4)
NS package(4)
Reel of 2000
SN74LVC244ANSR
SSOP – DB
Reel of 2000
SN74LVC244ADBR
Tube of 70
SN74LVC244APW
TSSOP – PW
Reel of 2000
SN74LVC244APWR
Reel of 250
SN74LVC244APWT
TVSOP – DGV
SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
DB, DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW)
1OE 1 1A1 2 2Y4 3 1A2 4 2Y3 5 1A3 6 2Y2 7 1A4 8 2Y1 9 GND 10
at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Undershoot) > 2 V
at VCC = 3.3 V, TA = 25°C • Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With 3.3-V VCC) • Ioff Supports Partial-Power-Down Mode Operation • Latch-Up Performance Exceeds 250 mA Per JESD 17 • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A)
11
GND 2A1
TA –40°C to 85°C
–40°C to 125°C
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER
QFN – RGY
Reel of 1000
SN74LVC244ARGYR
VFBGA – GQN Reel of 1000
INPUTS
OE
A
L
H
L