The Limit of Nearfield Measurement for Loudspeaker
Nearfield_Antenna_Test_Theory
Only Two Approximations Necessary
• Multiple reflections small enough to neglect • Measurements made over a finite plane
Fast and Efficient Data Processing (Primarily FFT)
Copyright 2009 by NSI Page 5
AUT and Probe Properties Examples
AUT and Probe Gain, Friis Transmission Equation
PRe c ⎛ λ ⎞ = G AUT GPr obe ⎜ ⎟ PIn ⎝ 4π R ⎠
Page 15
Plane Wave Scattering Parameters
t00 = Reflection coefficient at input t01 = Receiving coefficients t10 = Transmitting coefficients t11 = Scattering coefficients, plane waves scattered into plane waves
Copyright 2009 by NSI Page 7
Two Key Concepts in Near-Field Theory
Represent the field transmitted by AUT and probe response in terms of spectrum of waves
Copyright 2009 by NSI Page 16
Development of Transmission Equation
Kingbright 蓝色LED灯的数据手册说明书
Part NumberEmitting Color (Material)Lens TypeIv (mcd) @ 20mA [2] Viewing Angle [1]Min. Typ. 2θ1/2L-7104PBC-A■ Blue (InGaN)Water Clear 400 30°900DESCRIPTIONSzThe Blue source color devices are made with InGaN on SiC Light Emitting Diodez Electrostatic discharge and power surge could damage the LEDsz It is recommended to use a wrist band oranti-electrostatic glove when handling the LEDs z All devices, equipments and machineries must be electrically groundedFEATURESzLow power consumptionz Popular T-1 diameter package z General purpose leads z Reliable and ruggedz Long life - solid state reliability z Available on tape and reel z RoHS compliantAPPLICATIONSz Status indicator z Illuminatorz Signage applicationsz Decorative and entertainment lightingzCommercial and residential architectural lightingATTENTIONObserve precautions for handlingelectrostatic discharge sensitive devicesPACKAGE DIMENSIONSL-7104PBC-AT-1 (3mm) Solid State LampSELECTION GUIDENotes:1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.2. Luminous intensity / luminous flux: +/-15%.3. Luminous intensity value is traceable to CIE127-2007 standards.Notes:1. All dimensions are in millimeters (inches).2. Tolerance is ±0.25(0.01") unless otherwise noted.3. Lead spacing is measured where the leads emerge from the package.4. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.ABSOLUTE MAXIMUM RATINGS at T A =25°CELECTRICAL / OPTICAL CHARACTERISTICS at T A =25°CNotes:1. 1/10 Duty Cycle, 0.1ms Pulse Width.2. 2mm below package base.3. 5mm below package base.4. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.Notes:1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )2. Forward voltage: ±0.1V.3. Wavelength value is traceable to CIE127-2007 standards.4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.ParameterSymbol Value Unit Power Dissipation P D 120 mW Reverse Voltage V R 5 V Junction Temperature T j 125 °C Operating Temperature T op -40 to +85 °C Storage Temperature T stg -40 to +85°C DC Forward Current I F 30 mA Peak Forward CurrentI FM [1]100 mA Electrostatic Discharge Threshold (HBM) -1000VLead Solder Temperature [2] 260°C For 3 Seconds Lead Solder Temperature [3]260°C For 5 SecondsParameterSymbol Emitting ColorValue Unit Typ. Max. Wavelength at Peak Emission I F = 20mA λpeak Blue 468 - nm Dominant Wavelength I F = 20mA λdom [1] Blue 465 - nm Spectral Bandwidth at 50% Φ REL MAX I F = 20mA Δλ Blue 21 - nm CapacitanceC Blue 100 - pF Forward Voltage I F = 20mA V F [2] Blue 3.2 4 V Reverse Current (V R = 5V)I RBlue-10uATECHNICAL DATABLUERECOMMENDED WAVE SOLDERING PROFILENotes:1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocoupleattached to the LED pins) prior to immersion in the solder wave with a maximum solder bath temperature of 260°C2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).3. Do not apply stress to the epoxy resin while the temperature is above 85°C.4. Fixtures should not incur stress on the component when mounting and during soldering process.5. SAC 305 solder alloy is recommended.6. No more than one wave soldering pass.PACKING & LABEL SPECIFICATIONSPRECAUTIONSStorage conditions1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature.2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.3. Product in the original sealed package is recommended to be assembled within 72 hours of opening. Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact. Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the internal structures and cause failure.3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB.4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 3 ,Fig. 4).5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures. Do not perform lead forming once the component has been mounted onto the PCB. (Fig. 5 )LED Mounting Method1. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement.Lead-forming may be required to insure the lead pitch matches the hole pitch.Refer to the figure below for proper lead forming procedures.Note 1-3: Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits." ○" Correct mounting method " x " Incorrect mounting methodLead Forming Procedures1. Do not bend the leads more than twice. (Fig. 6 )2. During soldering, component covers and holders should leaveclearance to avoid placing damaging stress on the LED duringsoldering.(Fig. 7)3. The tip of the soldering iron should never touch the lens epoxy.4. Through-hole LEDs are incompatible with reflow soldering.5. If the LED will undergo multiple soldering passes or face otherprocesses where the part may be subjected to intense heat,please check with Kingbright for compatibility.PRECAUTIONARY NOTES1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer tothe latest datasheet for the updated specifications.3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. Ifcustomer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threateningliabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.6. All design applications should refer to Kingbright application notes available at /application_notes。
required missing说明书
The brand new concept of EMI probesApplication NoteIndex1.Simplify the complicated EMC measurement and debugging! (3)2.The Advantages of GKT-008 EMI Near Field Probe Set (3)3.GKT-008 EMI Near Field Probe Set (3)4.Normal EMI Test on Lab (4)5.Swiftly Simplify Complicated EMI Measurement and Debugging (5)6.New Generation Probes to Accurately Find Radiation Source (6)7.Problems Facing General Near Field Probes (9)8.Practical Cases (12)rmation of Product Ordering (14)Simplify the complicated EMC measurement and debugging!As a result of faster and faster consumer electronics products, the frequency of conducting EMI tests becomes higher and higher. The continuous integration of parts in electronics products and the number of parts involved are also swiftly increasing. Besides, the demand of EMI regulations from countries and regions is getting stricter than ever. But the life cycle of electronics products is getting shorter and shorter. Hence, in order to effectively and quickly solve EMI issues at the development stage and reduce the number of times products going to the lab, a simple and easy set of tool to quickly help engineers find EMI source to greatly expedite products’ time to market is essentially required.GW Instek launches the new patent GKT-008 electromagnetic field probes, which are small and highly sensitive. GKT-008 probes can directly sense EMI signal energy unlike conventional near field probes which require using electric field probes and magnetic field probes to measure electric field and magnetic field separately. Users can save costs from product development cycles and the lab that is conducive to expedite time for product verification and product launch.The Advantages of GKT-008 EMI Near Field Probe SetThe conventional magnetic field probes are hollow loop probes. When the magneticfield is perpendicular to probe’s loop surface, the maximum measurement value canbe obtained. The maximum magnetic field value can only be measured by rotatingpr obe’s direction.GKT-008 EMI near field probe features high spatial resolution and sensitivity withoutrotating probe’s direction to measure the maximum magnetic field value so as toidentify the main radiation signal source. This probe set aims at carrying out pre-testand debug of EMI field scanner so as to effectively obtain EMI source, segmentedfrequency strength of EMI source, etc. that provides key indicators for resolving EMCissues. By this probe set, users can formulate solutions to amend failed products.GKT-008 EMI Near Field Probe SetGKT-008 EMI Near Field Probe Set comprises four probes, including PR-01, PR-02, ANT-04, and ANT-05. The antenna factors of these four probes are built in the EMC Pretest function of GSP-9300 spectrum analyzer.- ANT-04 and ANT-05 are EMI field sensor, which can maximally sustainCAT I 50Vdc. ANT-04 and ANT-05 magnetic field probes will collocatewith ADB-008 DC block to avoid damaging spectrum analyzer and theRF input terminal of DUT receiver.- PR-01 is an AC voltage probe, which can maximally sustain CAT II,300VAC. PR-01 AC voltage probe will collocate with GPL-5010 transientlimiter and BNC (M) to SMA (F) adaptor to avoid damaging spectrumanalyzer and the RF input terminal of DUT receiver.- PR-02 is an EMI source contact probe, which can maximally sustain CATI 50V DC. PR-02 electric field probe will collocate with ADB-008 DCblock to avoid damaging spectrum analyzer and the RF input terminal ofDUT receiver.Normal EMI Test on LabFor a formal EMI certification test, in either an EMI chamber or an open fieldsite, the receiving antenna will pick up the emissions with in a distance of 8 or10 meters. This means the emissions may come from anywhere within the DUT.The antenna will receive them all the emissions, they can come from the top,bottom, right or left hand side.EMI test at Open Area TestSiteEMI Test in Anechoic ChamberIn Figure, the DUT is placed on a rotatable table, the receiving antenna islocated 10 meters from the DUT, and its stature is adjustable. The antennaoutput is connected to a spectrum analyzer which is located in a shielded room.A perfect Ground is needed to ensure an isolated environment. During themeasurement, the table will rotate 360 degrees, so that the antenna canreceive the Omni directional emissions. The antenna is also vertically adjustableto catch the upward emissions.However, the EMI testing results can not distinguish where on the DUT theemissions were generated. When the emissions are too strong and fail to passregulations, the source needs to be suppressed and thus have to be identifiedfirst. The near field probe is used to find the source of emissions on the DUT.Swiftly Simplify Complicated EMI Measurement and DebuggingGeneral issues of near field measurementsUsually, engineers will use near field probes to conduct EMI tests for circuit verification. However, they will encounter same problems when carrying out the test. • Probes can not quickly identify which circuit the radiation sourcecomes from. • Engineers have to use magnetic field probes and electric field probesseparately for measurements and they have to use their experience to find the signal source. • The angle or position of magnetic field probes will complicate themeasurements.The main reason behind these problems is that near field probes in the past are distinguished by magnetic field probe and electric field probe. In fact, engineers are concerned about how signal ’s energy emits. Hence, it is very important to correctly and quickly find the major energy emission source.- Probe sizeNormally, larger near field probes are used to sense electromagnetic field. But they can not easily identify the source of radiation. On the other hand,- The difference between electricfield probe and magnetic field probeIt is very difficult to judge the real signal source by waveforms obtained from measurements of electric field probes and magnetic field probes separately. Because these waveforms are very different from each other.- The angle of probeThe positionand angle ofprobes also affect the measurement results and will lead to misjudgment.Going through these procedures to find the signal source is very time-consuming. It is very important to quickly find the real interference source and simplify the procedures.Light and compact General near field probes using larger probes to sense electromagnetic field.But they can not easily identify radiation source even though signals can beobtained due to the coverage of most circuit and parts.ANT-04 and ANT-05 of GW Instek’s GKT-008 have the characteristics of smallsize and high identification resolution.General loop magnetic probe , diameter: 6.8cm General sphere electric probe,diameter: 3cmANT-04, diameter: 2.6cm ANT-05, diameter: 1.8cmReal test comparison- setup Compare general EMI near field probes with GW Instek dedicated EMI nearfield probes ANT-04/ANT-05 via a same signal source outputing TG of GSP-9330 to produce signals of 30M ~ 1GHz, 0dBm2.Connect TG with a PCB monopole antenna to simulate EMI signalsproduced by PCB trace3.Connect different probes with spectrum’s input terminal to compare(1)sensitivity (2)directivityGW Instek’s probes are high sensitivity design The left experiment result shows ANT-05’s size is 1/9 to that of the general magnetic field probe but its sensitivity is 20dB higher.The left experiment result shows ANT-05’s sensitivity (especially for high frequency) is better than the general electric field probe to the scale of 5~15dB.Directivity difference- the angle of probeConventional magnetic field probe’s angle makes a huge differenceThe above picture shows a conventional magnetic field probe in parallel with signal. After rotating the probe 90 degree to become perpendicular to the signal, the sensitivity drops 10~20dB for medium to high bandwidth. It will be very difficult to identify emission source for a product with complicated PCB trace design.GKT-008 probes do not have angle issuesANT-04 of GKT-008 does not have angle issues because the measured energy results from the probe in parallel or vertical to PCB trace are almost the same and stable.Directivity difference-the maximum signal source A loop probe aiming at the center of PCB trace can not guarantee the maximum signal be sensedA loop probe aiming at the center of PCB trace as shown on lower left hand corner picture can not guarantee the maximum signal is sensed. The upper left hand picture shows 1cm deviating to the center obtained better sensitivity. This result is related to magnetic field probe’s operational principle. Hence, this phenomenon will result in misjudgment for electronics products with higher density.ANT-04 obtains the maximum signal when aiming at the center of EUT ANT-04 obtains more signals when aiming at the center of EUT as shown on the above picture. Weaker signals obtained when the probe was 1cm deviating from the center. This result serves engineers’ expectation of quickly finding the real emission source with no misjudgment.The major advantages of ANT-04 and ANT-05 1.Small size, high sensitivity, they can accurately identify the real radiationsource.2.They can directly sense electromagnetic wave's energy withoutconducting separate electric field and magnetic field probe tests.3.Without directivity issue.4.Simplify complicated measurement and greatly reduce EMI debuggingtime.Probes can conduct contact circuit tests GKT-008 has contact probes to directly contact circuit for tests such as PCB trace noise, IC pin noise, power supply’s noise, etc.Electromagnetic wave's energy is produced by electric field and magnetic field Maxwell's Equations explain an important phenomenon: electric field and magnetic field coexist and mutually affect each other. These Equations describe how current and time-varying electric field produce magnetic field and how time-varying magnetic field produces electric field.Maxwell's EquationsEMI signal's energy is also determined by electric field and magnetic field. If S represents energy's density, E: electric field strength, H: magnetic field strength, and Poynting theorem states S = E x H. Electromagnetic is the cross product of electric field intensity and magnetic field intensity. Therefore, it is directional.S = E x HGeneral circuit's power is the product of voltage and current. Both current and voltage are required.D: Electric displacement : Charge densityE: Electric field intensity H: Magnetic field intensityJ: Current density B: Magnetic flux density VAZPVIThe radiation near field measurement for loop antenna mainly focuses on magnetic field. Near field and far field are defined by the distance between receiver antenna and emission source. It is called near field if the distance between receiver antenna and emission source is smaller than signal's wavelength. Near field includes reactive near field area and radioactive near field area. It is called far field if the distance is greater than wavelength, as the diagram shows. For example, wavelength for a 300MHz signal wave length λis 1m, then, less than 15.9cm ( λ/2π) is reactive near field, less than 1m is radioactive near field and over 2m is far field. Tests closing to PCB are reactive near field measurement of near field. The electromagnetic wave analysis of reactivenear field is related to emission source andantenna, therefore, the analysis is verycomplicated. The following diagram elaborateswave impedance vs. distance from emissionsource. Loop antenna induces large current andlow voltage in near field electromagnetic wavecharacteristics. Its wave impedance is low;therefore, magnetic field dominates. That is whya loop magnetic field probe can sense very strongmagnetic field at a low frequency bandwidthwhen closing to PCB. But electric field strength isnot necessarily strong that can not certainlycontribute to the real strong EMI signals.Loop near field probes have directionality issue The structure of a loop magnetic field probe is shown as diagram a. If the magnetic field direction is perpendicular to loop surface (diagram b), then it can be sensed, if it is in parallel with the loop surface, then the magnetic field can not be sensed.a.LoopShieldLine bcProblems Facing General Near Field ProbesProblems occurred while using a loop antenna for PCB measurements In addition to active components, PCB trace is also the EMI emission source. Higher current passing through trace will produce higher magnetic field; trace with higher voltage such as high load impedance or open circuit trace will produce higher electric field. A probe can pick up a very strong magnetic field if two PCB traces are very close to each other despite the individual magnetic field is weak.a. Loop probe sensing magnetic field produced by current passing through PCBlayoutb. The magnetic field of multiple PCB layouts can be simultaneously sensedA probe aiming at the center of PCB layout can not guarantee the maximum magnetic field is sensed.The directivity of a loop probe is likely to cause misjudgment. Diagram a. shows a probe placed directly above PCB trace can not obtain any signals. More magnetic field will pass through and stronger signals can be obtained if slightly deviating a distance.a. A probe placed directly aboveb. A slight distance deviationfrom the centerThe following experiment result proved this phenomenon.GKT-008 has best sensitivity We used the same test conditions and device. At the same spot on the circuit,a conventional electric field probe, a conventional magnetic field probe and aGW Instek’s ANT-04 near field probe were used to conduct test.The measurement of conventional electric field probeThe measurement of conventional magnetic field probeThe measurement of GW Instek’s ANT-04 near field probeWe found that the conventional electric field and magnetic field probe have alarger difference on the measurement results and their sensitivities can notcompare with that of GW Instek’s near field probe. For smaller signals, theconventional probes will produce more errors.The correlation with the result of the lab Another practical case was to directly place EUT in a 3m anechoic chamber. A switching power supply was used in a 3m anechoic chamber. The test resulted in three larger signals. Next, a conventional electric field probe, a conventional magnetic field probe and a GW Instek’s ANT-04 near field probe were used to conduct test.The measurement result of EUT in a 3m anechoic chamberThe measurement results of electric field probe and magnetic field probetesting EUT’s EMIThe measurement result of GKT-008 has better reference.We found that the measurement results of the conventional electric field and magnetic field probe yielded big difference. For magnetic field’s high frequency measurements, the conventional probes could not find signals found in anechoic chamber. For electric field, the poor sensitivity of the conventional probes could not find concealed signals. GKT-008 can find three identical signals found in the lab.Information of Product OrderingOrdering InformationGSP-9330, 3.25 GHz Spectrum AnalyzerGKT-008, EMI Near Field Probe SetADB-008, DC Block AdapterStandard AccessoriesGSP-9330, Spectrum Analyzer Power Cord, Certificate of Calibration, CD-ROM (with User Manual, ProgrammingManual, SpectrumShot Software, SpectrumShot Quick Start Guide & IVI Driver) GKT-008, EMI Near Probe Set User ManualOptionsGSP-9330, Spectrum Analyzer Opt.01 Tracking GeneratorOpt.02 Battery PackOpt.03 GPIB InterfaceADB-008, DC Block Adapter50ohm,SMA(M) to SMA(F),0.1MHz-8GHzOptional AccessoriesGSC-009 Portable Carry CaseGRA-415 Rack PanelFree DownloadSpectrumShot Software EMI pretest and remote control software for GSP-9330 (available on GW Instek website)IVI Driver for GSP-9330 supports LabVIEW/LabWindows/CVI (available on NI website)Please do not hesitate to contact us if you have any queries on the announcement, or product information of the EMI Near Field Probe Set.Sincerely yours,Overseas Sales DepartmentGood Will Instrument Co., LtdNo. 7-1, Jhongsing Road, Tucheng Dist.,New Taipei City 23678, Taiwan R.O.CEmail:**********************.tw。
聚焦换能器声强和声功率测量方法研究
聚焦换能器声强和声功率测量方法研究于群;王月兵;曹文旭;汤卓翰【摘要】针对聚焦声场的特点,以及辐射力天平(RFB)只能获得单一功率指标的缺点,提出一种基于近场测量法的聚焦换能器声强和声功率评价方法。
通过声场测量系统对聚焦换能器预聚焦区域中两个平面上的声压扫描测量,运用声强法得到聚焦换能器的声强分布以及辐射声功率。
采用活塞换能器的远场测量法与近场测量法进行比对,两种方法得到的声功率误差不超过12%。
比较预聚焦区域声功率值和焦点处声功率值,分析声功率评价方法的准确性。
发现聚焦声场中不同位置处的声功率值一致性误差<5%,同一位置处的声功率值重复性误差<2%。
结果表明,近场测量法适用于对聚焦换能器声强和声功率的评价,可有效避免直接测量对测量设备的损坏,同时还克服双水听器声强互谱法频率上限低以及测量系统相位不匹配的缺点。
%According to the features of focused sound field and given that radiation force balance (RFB) can only obtain a single power indicator, the paper proposes a method for evaluating sound intensity and sound power of focused transducer based on near-field measurement method. Sound field measurement system is used to have scanning measurement of the sound pressure on two planes within pre-focus area of focused transducer. Sound intensity method is used to obtain the sound pressure distribution and radiant sound power of focused transducer. Comparing the near-field measurement method and far-field measurement method of piston transducer, it is found that the error rate of sound power of the two methods is less than 12%. By comparing the sound power of pre-focused area and the sound power at point of focus and analyzing the accuracy ofsound power evaluating method, it is found that the sound power consistency error at different locations in focused sound field is less than 5% and the sound power repeatability of same location is less than 2%. Results show that the near-field measurement method is suitable for evaluating sound intensity and sound power of focused transducer as it avoids the damage of measured equipment caused by direct measurement effectively and also overcomes the disadvantages of the low upper limit of frequencyin measuring the cross-spectrum density of sound pressure between two hydrophones and the unmatched phase in measurement system.【期刊名称】《中国测试》【年(卷),期】2017(043)001【总页数】6页(P27-32)【关键词】应用声学;声功率评价方法;声强法;聚焦换能器【作者】于群;王月兵;曹文旭;汤卓翰【作者单位】中国计量大学计量测试工程学院,浙江杭州 310018;中国计量大学计量测试工程学院,浙江杭州 310018;中国计量大学计量测试工程学院,浙江杭州 310018;中国计量大学计量测试工程学院,浙江杭州 310018【正文语种】中文聚焦换能器有两种常用结构[1]:单元换能器和多元换能器阵列。
Yokogawa DL系列差分探测器(Model 700924)用户手册说明书
User's ManualThank you for purchasing the Differential Probe (Model 700924) for the DL series. To ensure correct use, please read this manual thoroughly before beginning operation. After reading the manual, keep it in a convenient location for quick reference whenever a question arises during operation.IM 700924-01E IM 700924-01EModel 700924Differential Probe for the DL SeriesYOKOGAWA ELECTRIC CORPORATION, Communication & Measurement Business Headquarters Phone: (81)-422-52-67689-32, Nakacho 2-chome, Musashino-shi, Tokyo, 180-8750 JAPANYOKOGAWA CORPORATION OF AMERICA Phone: (1)-770-253-70002 Dart Road, Newnan, Ga. 30265-1094, U.S.A.YOKOGAWA EUROPE B.V. Phone: (31)-33-4641858Databankweg 20, 3821 AL, Amersfoort, THE NETHERLANDS YOKOGAWA ENGINEERING ASIA PTE. LTD. Phone: (65)-624199335 Bedok South Road, Singapore 469270, SINGAPORE7th Edition7th Edition : October 2007 (YK)All Rights Reserved, Copyright © 2007, Yokogawa Electric CorporationSafety PrecautionsMake sure to comply with the safety precautions mentioned hereafter when handling the probe.Yokogawa Electric Corporation assumes no responsibility for any consequences resulting from failure to comply with these safety precautions. Also, read the User’s Manual of the measuring instrument thoroughly so that you are fully aware of its specifications and handling, before starting to use the probe.The following symbols are used on this instrument.Warning: handle with care. Refer to the user’s manual or service manual. This symbol appears on dangerous locations on the instrument which require special instructions forproper handling or use. The same symbol appears in the corresponding place in the manual to identify those instructions. Risk of electric shockMake sure to comply with the following safety precautions in order to prevent accidents such as an electric shock which impose serious health risks to the user and damage to theGrounding of the measuring instrumentThe protective grounding terminal of the measuring instrument must be connected to ground.Earth cable of the probeMake sure to connect the earth cable of the probe to the ground (grounding potential). Do not operated with suspected failuresIf you suspect that there is damage to this probe, have it inspect by a service personnel.Observe maximum working voltageTo avoid any injury,do not use the probe above 1400 Vpeak between each input lead and earth or between the two inputs.This voltage rating applies to both 1/100 and 1/1000 settings.Must be groundedThis probe must be grounded with the BNC shell and an auxiliary grounding terminal, through the grounding conductor of the power cord of the measuring instrument or other appropriate grounding conductor. Before making connections to the input terminals of the product, ensure that the output connector is attached to the BNC connector of the measuring instrument and the auxiliary grounding terminal is connected to a proper ground, while the measuring instrument is properly grounded.Do not operate without coverTo avoid electric shock or fire hazard, do not operate this probe with the cover removed.Do not operate in wet/damp conditionsTo avoid electric shock, do not operate this probe in wet or damp conditions.Do not operate in explosive atmosphereTo aviod injury or fire hazard, do not operate this probe in an explosive atmosphere.Avoid exposed circuitryTo avoid injury, remove jewelry such as rings, watches, and other metallic objects. Do not touch exposed connections and components when power is present.CAUTIONMaximum input voltageDo not apply any voltages exceeding the maximum input voltage to the probe.Correct use of the power supplyPower the probe with either 4 AA dry cells, a 6 VDC/200 mA or 9 VDC/150 mA externalpower supply, or by connecting the probe’s power cable to a probe power supply terminal on a DL series measuring instrument or to the 700938 or 701934. Operating the probe under a power supply greater than the voltage specified above may cause damage to the instrument. Connecting the external power supply to the probeAlways turn OFF the probe’s power switch when connecting or disconnecting the external power supply. Also, do not install the dry cells when using an external power supply.Operating environment limitationsSee below for operating environment limitations.CAUTIONThis product is a Class A (for industrial environments) product. Operation of this product in a residential area may cause radio interference in which case the user is required to correct the interference.Waste Electrical and Electronic Equipment (WEEE), Directive 2002/96/EC (This directive is only valid in the EU.)This product complies with the WEEE Directive (2002/96/EC) marking requirement. This marking indicates that you must not discard this electrical/electronic product in domestic household waste.Product CategoryWith reference to the equipment types in the WEEE directive Annex 1, this product is classified as a “Monitoring and Control instrumentation” product.Do not dispose in domestic household waste. When disposing products in the EU, contact your local Yokogawa Europe B. V. office.The Following Symbols are Used in this Manual.Improper handling or use can lead to injury to the user or damage to the instrument. This symbol appears on the instrument to indicate that the user must refer to theuser’s manual for special instructions. The same symbol appears in the corresponding place in the user’s manual to identify those instructions. In the manual, the symbol is used in conjunction with the word “WARNING” or “CAUTION.”WARNING Calls attention to actions or conditions that could cause serious or fatal injury to theuser, and precautions that can be taken to prevent such occurrences.CAUTION Calls attentions to actions or conditions that could cause light injury to the user ordamage to the instrument or user’s data, and precautions that can be taken to prevent such occurrences.NoteCalls attention to information that is important for proper operation of the instrument.1 DescriptionBy using this device, oscilloscopes with single-ended input can be easily used as oscilloscopes with differential inputs.2 Appearance22 Pinchers tips3 Ground extention lead (length = 100 cm)Power cable*Pinchers tip B9852MJ Black: B9852MM, Red: B9852MN* Power can be supplied from the DL, 700938,or 701934.Optional Accessories (Sold Separately)3 Installing/Replacing the Dry CellsShift the lid at the back side of the probe and install/replace the four dry cells. The dry cells are not installed on receipt of the instrument.4 Operation1. Install four AA cells. When using an external power supply, do not install the dry cells. Supply power only through the external power supply.2. Simply plug-in the BNC output connector to the vertical input of a oscilloscope, and connect the auxiliary grounding terminal to a proper ground. If necessary, use a ground extention lead.3. Select the proper range setting. For higher resolution and less noise when measuring signals below 350V, switch the attenuation to 1/100. Otherwise, set the attenuation to 1/1000 when measuring signals above 350V.4. If the offset voltage is large, short the top of input leads, and turn the ADJUST variable resistor (DC voltage adjustment) using a flat-head screwdriver to adjust the offset voltage.• To protect against electric shock the ground side of the output cable (the shielded side of the BNC connector) must be grounded.• Make sure to avoid an electric shock when connecting the probe to the object ofmeasurement. Do not remove the probe from the measuring instrument after the object of measurement is connected.• When disconnecting the probe BNC output connector, first turn OFF the power to the circuit under measurement. Then, disconnect the probe from the high voltage parts of the circuit under measurement.• When replacing batteries or connecting an external power supply, first turn OFF the power to the circuit under measurement. Then, remove the input lead from the circuit under measurement.CAUTION• This probe is to carry out differential measurement between two points on the circuit under measurement. This probe is not for electrically insulating the circuit under measurement and the measuring instrument.• Use a soft cloth to clean the dirt. Prevent damage to the probe. Avoid immersing the probe, using abrasive cleaners, and using chemicals contains benzene or similar solvents.Note• Connect the BNC connector to the input terminal of the oscilloscope and for two pointmeasurement (differential measurement), connect both input leads. Because the performance declines in case you carry out measurements with only one input lead connected, make sure to always connect both.• Accurate measurement may not be possible near objects with strong electric fields (such as cordless equipment, transformers, or circuits with large currents).5 SpecificationsItemSpecificationsFrequency bandwidth *1DC to 100 MHz (−3 dB)Input typeBalancing difference inputAttenuation ratioswitched ratios of 100:1 and 1000:1Output offset voltage *1 *2±7.5 mVInput resistance and capacity 4 M Ω + 10 pF each side to groundDifferential allowable voltage ±1400 V (DC + ACpeak) or 1000 Vrms at 1000:1 attenuation (between + − terminal)±350 V (DC + ACpeak) or 250 Vrms at 100:1 attenuation Max common mode voltage ±1400 V (DC + ACpeak) or 1000 Vrms Max input voltage(to ground)±1400 V (DC + ACpeak) or 1000 VrmsCMRR (typical)*160 Hz: less than −80 dB; 1 MHz: less than −50 dB Output voltage *1±3.5 V (DC + ACpeak)Output impedance Using 1 M Ω input system oscilloscopeGain accuracy *1±2% (common mode voltage ≤ 400 V and ≥ −400 V)±3% (common mode voltage ≤ 1000 V and ≥ −1000 V)Operating environment 5 to 40°C, 25 to 85% (no condensation)Storage environment −30 to 60°C, 25 to 85% (no condensation)Operating altitude 2,000 m or lessPower requirements *3Internal battery: four dry cells (AA, R6)External power supply:6 VDC/200 mA or more, or 9 VDC/150 mA or more.From the DL series instrument’s probe power supply, 700938, or 701934 using the probe’s power supply cable. Cell life time In continuous duty, approx. 2 hoursDimensions 207 mm × 83 mm × 38 mm (excluding connector and cable)WeightApprox. 800 g ( excluding the dry cells)Withstanding voltage 2000 VACrms (between input terminal and BNC-ground), for 5 minutesSafety standardsComplying standards EN61010-031Measurement category III *4: 1400 V (DC + ACpeak)Pollution degree 2*5EmissionComplying standardsEN61326, EN55011, EN61000-3-2, EN61000-3-3This product is a Class A (for industrial environment) product. Operation of this product in a residential area may cause radio interference in which case the user is required to correct the interference.ImmunityComplying standards EN61326*1 When the power supply voltage from the dry cells is 5 V or more, or when using an external power supply.*2 Ambient temperature 23±5°C*3 When the capacity of dry cells goes down LED blinks. In such a case, replace the dry cells. Also, do not install the dry cells when using an external power supply.*4This equipment is for measurement category III (CAT III). Do not use it with measurement category IV (CAT IV). CAT III applies to measurement of the distribution level, that is , building wiring, fixed installations. CAT IV applies to measurement of the primary supply level, that is, overhead lines, cable systems, and so on.*5 Pollution degree applies to the degree of adhesion of a solid, liquid, or gas which deteriorates withstandvoltage or surface resistivity. Pollution degree 2 applies to normal indoor atmospheres (with only non-conductive pollution).Input voltage deratingFrequency (Hz)0.1 M1010010001400 1 M 10 M 100 M M a x i n p u t v o l t a g e (V )1981。
C680_RED_1303568_1
1. Scope 1.1 This practice provides the algorithms and calculation methodologies for predicting the heat loss or gain and surface temperatures of certain thermal insulation systems that can attain one dimensional, steady- or quasi-steady-state heat transfer conditions in field operations. 1.2 This practice is based on the assumption that the thermal insulation systems can be well defined in rectangular, cylindrical or spherical coordinate systems and that the insulation systems are composed of homogeneous, uniformly dimensioned materials that reduce heat flow between two different temperature conditions. 1.3 Qualified personnel familiar with insulation-systems design and analysis should resolve the applicability of the methodologies to real systems. The range and quality of the physical and thermal property data of the materials comprising the thermal insulation system limit the calculation accuracy. Persons using this practice must have a knowledge of the practical application of heat transfer theory relating to thermal insulation materials and systems. 1.4 The computer program that can be generated from the algorithms and computational methodologies defined in this practice is described in Section 7 of this practice. The computer program is intended for flat slab, pipe and hollow sphere insulation systems. An executable version of a program based on this standard may be obtained from ASTM. 1.5The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only. of this practice. The computer program is intended for flat slab, pipe and hollow sphere insulation systems. 1.5 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. 2. Referenced Documents 2.1 ASTM Standards: 2 C 168Terminology Relating to Thermal Insulating Materials Terminology Relating to Thermal Insulation C 177 Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded-Hot-Plate Apparatus C 335 Test Method for Steady-State Heat Transfer Properties of Horizontal Pipe Insulation C 518 Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus C 585 Practice for Inner and Outer Diameters of Rigid Thermal Insulation for Nominal Sizes of Pipe and Tubing (NPS System) C 1055 Guide for Heated System Surface Conditions Thatthat Produce Contact Burn Injuries C 1057 Practice for Determination of Skin Contact Temperature from Heated Surfaces Using a Mathematical Model and Thermesthesiometer
BacTiter-GloTM 微生物细胞活性检测操作手册英文版
Promega Corporation ·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA.Fax 608-277-2516 I.Description (1)II.Product Components and Storage Conditions (5)III.Protocol for Performing the BacTiter-Glo™ Assay (6)A.Reagent Preparation (6)B.Protocol for Measuring ATP from Bacteria (7)C.Protocol for Generating an ATP Standard Curve (optional) (7)IV.Appendix (8)A.Overview of the BacTiter-Glo™ Assay.............................................................8B.Additional Considerations..................................................................................9C.Examples of BacTiter-Glo™ Assay Applications..........................................11D.References............................................................................................................14E.Related Products.................................................................................................15I.DescriptionThe BacTiter-Glo™ Microbial Cell Viability Assay (a,b)is a homogeneous method for determining the number of viable bacterial cells in culture based on quantitation of the ATP present. ATP is an indicator of metabolically active cells.The BacTiter-Glo™ Assay is designed for either single-tube or multiwell-plate formats for high-throughput screening (HTS). The homogeneous assay procedure involves adding a single reagent (BacTiter-Glo™ Reagent) directly to bacterial cells in medium and measuring luminescence (Figure 1). Washing cells, removing culture medium and performing multiple pipetting steps are not required. The formulation of the reagent supports bacterial cell lysis and generation of a luminescent signal in a homogeneous “add, mix, measure” format. The lumine-scent signal is proportional to the amount of ATP present, which is directly proportional to the number of cells in culture (Figure 2). The BacTiter-Glo™Reagent relies on the properties of a proprietary thermostable luciferase (Ultra-Glo™ Recombinant Luciferase) and a proprietary formulation for extracting ATP from bacteria. The BacTiter-Glo™ Assay generates a “glow-type” luminescent signal, produced by the luciferase reaction shown in Figure 3, which has a signal half-life generally over 30 minutes depending on the bacterium and medium. The assay has been shown to detect a variety of bacteria, yeast and fungi (Table 1). The homogeneous format reduces pipetting errors that may be introduced during the multiple steps required by other methods of ATP measurement.BacTiter-Glo™ Microbial Cell Viability AssayAll technical literature is available on the Internet at: /tbs/ Please visit the web site to verify that you are using the most current version of this Technical Bulletin. Please contact Promega Technical Services if you have questions on useof this system. E-mail: techserv@.Advantages•Simplify your Assay:The add, mix, measure format reduces the number of handling steps to fewer than that required for similar ATP assays, with noinjectors required.•Get Results Quickly: Data can be recorded 5 minutes after adding andmixing reagent, and sensitivity allows you to detect growth sooner.•Increase your Sensitivity:Measures ATP from as few as 10 bacterial cells.•Choose your Format:Can be used with various multiwell or single-useformats. Data can be recorded by luminometer or CCD camera.•Achieve Robust Signal:Luminescent signal is stable, with a 30-minutehalf-life.Promega Corporation ·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA· 4609M ABacTiter-Glo™SubstrateBacTiter-Glo™ReagentLuminometerBacTiter-Glo™BufferFigure 1. Diagram of the BacTiter-Glo™ Microbial Cell Viability Assay protocol. The assay is suitable for single-tube or multiwell-plate formats shown here.Promega Corporation ·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA·Fax 608-277-2516 · 4608M A 101010101010S i g n a l :N o i s e Cells/Well110101010101010108Figure 2. Bacterial cell numbers correlate with luminescent signal.Four bacterial strains [Escherichia coli (ATCC25922), Staphylococcus aureus (ATCC25923),Pseudomonas aeruginosa (ATCC27853) and Bacillus cereus (ATCC10987)] were grown in Mueller Hinton II (MH II) Broth (BD Cat.# 297963; see Section IV.B for growthmedium recommendations) at 37°C overnight. The overnight culture was diluted 50-fold in fresh MH II Broth and then incubated for several hours to reach log phase.Samples of the culture were serially diluted using MH II Broth in a 96-well plate.The assay was performed according to the protocol described in Section III.The reconsituted BacTiter-Glo™ Reagent was equilibrated for 1.5 hours at roomtemperature to achieve better sensitivity (see Reagent Background in Section IV.B).Luminescence was recorded on a GloMax ®96 Microplate Luminometer (Cat.#E6501). Signals represent the mean of three replicates for each measurement.Bacterial cell numbers were determined by plate counting of colony forming units on Luria-Bertani agar plates. The signal-to-noise ratio was calculated: S:N = [mean of signal – mean of background]/standard deviation of background. There is a linear correlation between luminescent signal and the number of cells over five orders of magnitude. The limits of detection drawn from this experiment for E. coli ,S. aureus ,P. aeruginosa and B. cereus are approximately 40, 150, 70 and 10 cells, respectively.Promega Corporation ·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA· HO SN S N O SN SN O COOHFireflyLuciferaseBeetle Luciferin + ATP + O 2Oxyluciferin + AMP + PP i + CO 2 + LightMg 2+5768M A ––4607M A Time (minutes)R e l a t i v e L u m i n e s c e n c e (%)Figure 3. The luciferase reaction. Mono-oxygenation of luciferin is catalyzed byluciferase in the presence of Mg 2+, ATP and molecular oxygen.Figure 4. BacTiter-Glo™ Reagent generates a glow-type luminescent signal.E. coli cells were grown and assayed as described in Figure 2. Three media weretested: Luria-Bertani Broth, Mueller Hinton II (MH II) Broth (BD Cat.# 297963),and Trypticase Soy Broth (TSB, BD Cat.# 299113). Approximately 106E. coli cellswere used for the assay. The stability of the luminescence signal was monitoredover time. Luminescence was recorded on a GloMax ®96 Microplate Luminometer (Cat.# E6501). The half-lives of the luminescence signals in MH II, LB and TSB were 26, 28 and 68 minutes, respectively.II.Product Components and Storage ConditionsCat.#Product Size BacTiter-Glo™ Microbial Cell Viability Assay 10ml G8230For Laboratory Use. Substrate is sufficient for 100 assays at 100µl/assay in 96-well platesor 400 assays at 25µl/assay in 384-well plates. Includes:•10ml BacTiter-Glo™ Buffer• 1 vial BacTiter-Glo™ Substrate (lyophilized)•1ProtocolCat.#Product Size BacTiter-Glo™ Microbial Cell Viability Assay 10 × 10ml G8231For Laboratory Use. Each vial of substrate is sufficient for 100 assays at 100µl/assay in 96-well plates or 400 assays at 25µl/assay in 384-well plates. Includes:•10 × 10ml BacTiter-Glo™ Buffer•10 vials BacTiter-Glo™ Substrate (lyophilized)•1ProtocolCat.#Product Size BacTiter-Glo™ Microbial Cell Viability Assay 100ml G8232For Laboratory Use. Substrate is sufficient for 1,000 assays at 100µl/assay in 96-wellplates or 4,000 assays at 25µl/assay in 384-well plates. Includes:•100ml BacTiter-Glo™ Buffer• 1 vial BacTiter-Glo™ Substrate (lyophilized)•1ProtocolCat.#Product Size BacTiter-Glo™ Microbial Cell Viability Assay 10 × 100ml G8233For Laboratory Use. Each vial of substrate is sufficient for 1,000 assays at 100µl/assay in96-well plates or 4,000 assays at 25µl/assay in 384-well plates (10,000 to 40,000 totalassays). Includes:•10 × 100ml BacTiter-Glo™ Buffer•10 vials BacTiter-Glo™ Substrate (lyophilized)• 1 ProtocolStorage Conditions: For long-term storage, the lyophilized BacTiter-Glo™Substrate and BacTiter-Glo™ Buffer should be stored at –20°C. For frequentuse, the BacTiter-Glo™ Buffer can be stored at 4°C or at room temperature for48 hours without loss of activity. For optimal performance, reconstitutedBacTiter-Glo™ Reagent (buffer plus substrate) should be used within eighthours when the reagent is kept at room temperature. The reconstitutedBacTiter-Glo™ Reagent can be stored at 4°C for four days, at –20°C for oneweek or at –70°C for one month with less than 20% loss of activity.Promega Corporation·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA·Fax 608-277-2516 ·III.Protocol for Performing the BacTiter-Glo™ AssayMaterials to Be Supplied by the User•opaque-walled multiwell plates•multichannel pipette or automated pipetting station for delivering reagent•plate shaker or other device for mixing contents of multiwell plates•luminometer (e.g., GloMax ®96 Microplate Luminometer [Cat.# E6501] orGloMax ®20/20 Luminometer [Cat.# E5311]), or CCD cameracapable of reading multiwell plates•optional: ATP for generating a standard curveCaution: Skin contains ATP. Because this assay is so sensitive, we recommendwearing gloves to avoid contamination.III.A.Reagent Preparation1.Thaw the BacTiter-Glo™ Buffer and equilibrate to room temperature beforeuse. For convenience the BacTiter-Glo™ Buffer may be thawed and storedat room temperature for up to 48 hours before use.2.Equilibrate the lyophilized BacTiter-Glo™ Substrate to room temperature.3.Transfer the appropriate volume (10ml for Cat.# G8230, G8231 or 100ml forCat.# G8232, G8233) of BacTiter-Glo™ Buffer into the amber bottlecontaining BacTiter-Glo™ Substrate to reconstitute the lyophilizedenzyme/substrate mixture. This forms the BacTiter-Glo™ Reagent.4.Mix by gently vortexing, swirling or by inverting the bottle to obtain ahomogeneous solution. The BacTiter-Glo™ Substrate should go intosolution easily, in less than one minute.5.Equilibrate Reagent at room temperature for at least 15 minutes before use.To achieve maximum sensitivity, additional equilibration time may berequired. See “Reagent Background” in Section IV.B for more information.Promega Corporation ·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA·III.B.Protocol for Measuring ATP From BacteriaNote: All steps are performed at room temperature (22–25°C).1.Prepare an opaque-walled multiwell plate with microbial cells in culturemedium (e.g., 100µl for each well of a 96-well plate or 25µl for each well ofa 384-well plate).2.Prepare control wells containing medium without cells to obtain a value forbackground luminescence.3.Equilibrate the plate and its contents to room temperature.4.Add a volume of BacTiter-Glo™ Reagent equal to the volume of cellculture medium present in each well (e.g., add 100µl of reagent to 100µl ofmedium containing cells for the 96-well plate format or 25µl of reagent forthe 384-well plate format).5.Mix contents briefly on an orbital shaker and incubate for five minutes.6.Record luminescence.Note: Instrument settings depend on the manufacturer. An integration timeof 0.25–1 second per well should serve as a guideline.III.C.Protocol for Generating an ATP Standard Curve (optional)Note: All steps are performed at room temperature (22–25°C).1.Prepare 1µM ATP in culture medium (100µl of 1µM ATP solution contains10–10moles ATP).2.Prepare 10-fold serial dilutions of ATP in culture medium (1µM to 10pM;100µl volumes would contain 10–10to 10–15moles of ATP).3.Prepare a multiwell plate with varying concentrations of standard ATPsolution in 100µl medium.4.Add a volume of BacTiter-Glo™ Reagent equal to the volume of ATPstandard present in each well (1:1 ratio).5.Mix contents briefly on an orbital shaker and incubate for one minute.Since there is no lysis required to release ATP, longer incubations are notrequired.6.Record luminescence.Promega Corporation·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA·Fax 608-277-2516 ·IV.AppendixIV.A.Overview of the BacTiter-Glo™ AssayThe BacTiter-Glo™ Assay System utilizes a proprietary thermostable luciferase(Ultra-Glo™ Recombinant Luciferase) to enable extraction of ATP frombacterial cells and to support a stable “glow-type” luminescent signal.Historically, firefly luciferase purified from Photinus pyralis has been used inreagents for ATP assays (1–3). However, this enzyme has only moderatestability in vitro and is sensitive to factors such as pH and detergents, limitingits usefulness in a robust homogeneous ATP assay. Promega has successfullydeveloped a stable form of luciferase (Ultra-Glo™ Recombinant Luciferase)based on the gene from another firefly, Photuris pennsylvanica , using anapproach to select for characteristics that improve performance in ATP assays(4). In addition, we developed a proprietary formulation to achieve rapid andmore efficient extraction of ATP from a variety of microbial cells (Table 1). Thecombination of these two essential elements in the BacTiter-Glo™ Reagentenabled design of a homogeneous single-reagent system for performing ATPassays on cultured cells. The reagent is physically robust and provides asensitive and stable luminescent output.Table 1. BacTiter-Glo™ Reagent Works with a Variety of MicrobialOrganisms.*For Candida albicans a 15-minute incubation time is required for optimal signal,and the limit of dete ction is around 5 × 103cells.Promega Corporation ·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA·IV.B.Additional ConsiderationsTemperature: The intensity and rate of decay of the luminescent signal fromthe BacTiter-Glo™ Assay depend on the rate of the luciferase reaction.Environmental factors that affect the rate of the luciferase reaction will resultin a change in the intensity of light output and the stability of the luminescentsignal. Temperature is one factor that affects the rate of this enzymatic assayand thus the light output. For consistent results, equilibrate assay plates toroom temperature before performing the assay. Insufficient equilibration mayresult in a temperature gradient effect between the wells in the center and onthe edge of the plates.Growth Medium: Growth medium is another factor that could contribute tothe background luminescence and affect the luciferase reaction in terms ofsignal level and signal stability (Figure 4). We have used MH II Broth (cation-adjusted Mueller Hinton Broth; Becton, Dickinson and Company Cat.# 297963)for all our experiments unless otherwise stated. It supports growth of mostcommonly encountered aerobic and facultative anaerobic bacteria and isselected for use in food testing and antimicrobial susceptibility testing by theFood and Drug Administration and the National Committee for ClinicalLaboratory Standards (NCCLS) (5,6). MH Medium has low luminescencebackground and good batch-to-batch reproducibility.Chemicals: The chemical environment of the luciferase reaction will affect theenzymatic rate and thus luminescence intensity. Solvents used for the variouschemical compounds tested for their antimicrobial activities may interfere withthe luciferase reaction and thus the light output from the assay. Interferencewith the luciferase reaction can be determined by assaying a parallel set ofcontrol wells containing medium without cells. Dimethylsulfoxide (DMSO),commonly used as a vehicle to solubilize organic chemicals, has been tested atfinal concentrations up to 2% in the assay and has little effect on light output(<5% loss of activity).Plate and Tube Recommendations:The BacTiter-Glo™ Assay is suitable formultiwell-plate or single-tube formats. Standard opaque-walled multiwellplates suitable for luminescence measurements are recommended for use.Opaque-walled plates with clear bottoms allowing microscopic visualizationof cells also may be used; however, these plates will have diminished signalintensity and greater cross-talk between wells. Opaque white tape may beused to reduce luminescence loss and cross-talk. For single-tube assays, thestandard tube accompanying the luminometer used should be suitable.Cellular ATP Content: Different bacteria have different amounts of ATP percell, and values reported for the ATP level in cells vary considerably (7,8).Factors that affect the ATP content of cells such as growth phase, medium, andpresence of metabolic inhibitors, may affect the relationship between cellnumber and luminescence (7).Promega Corporation·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA·Fax 608-277-2516 ·Mixing: Optimum assay performance is achieved when the BacTiter-Glo™Reagent is completely mixed with the sample of cultured cells. For all the bacteria we tested, maximum luminescence signals were observed after efficiently mixing and incubating for 1–5 minutes. However, complete extraction of ATP from certain bacteria, yeast or fungi may take longer. Automated pipetting devices using a greater or lesser force of fluid delivery may affect the degree of subsequent mixing required. Ensure complete reagent mixing in 96-well plates by using orbital plate shaking devices built into many luminometers. We recommend considering these factors when performing the assay and determining whether a mixing step and/or longer incubation is necessary.Reagent Background: Despite the rigorous ATP-free manufacturing process, a trace amount of ATP is still present in the BacTiter-Glo™ Substrate and Buffer. In addition, ATP could be introduced by the user during the reconstitution step. When the BacTiter-Glo™ Substrate and Buffer are mixed together to reconstitute BacTiter-Glo™ Reagent, a background luminescence signal is generated that decreases over time as the ATP is being consumed. This process is referred to as “burn-off.” Complete burn-off to the lowest achievable background could take up to two hours. However, this is only necessary when the maximum sensitivity is required (e.g., detection of very low numbers of microorganisms).IV.C.Examples of BacTiter-Glo™ Assay ApplicationsThe BacTiter-Glo™ Assay provides a simple and robust way to quantify bacteria with superb sensitivity and dynamic range. Some examples of its applications are shown below.Screening for Antimicrobial CompoundsWe used the BacTiter-Glo™ Assay to screen one rack of Library ofPharmacologically Active Compounds from Sigma (LOPAC, #8, enzyme inhibitors, total of 80 compounds) for antimicrobial activity againstStaphylococcus aureus . The results are shown in Figure 5. All positive controls of standard antibiotics (boxed points) and three LOPAC compounds (circled points) exhibited signficant anti-S. aureus activity. The three LOPAC hits were D6, emodin; D11, sanguinarine chloride; and H7, minocycline. The anti-S. aureus activities of these compounds have been reported in theliterature (9–11).Promega Corporation ·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA·Fax 608-277-2516 ·4615M A10101010 L u m i n e s c e n c e (R L U )Sample Number20406080100Figure 5. Screening for antimicrobial compounds using the BacTiter-Glo™ Assay.S. aureus ATCC 25923 strain was grown in Mueller Hinton II (MH II) Broth (BD Cat.#297963; see Section IV.B for growth medium recommendations) at 37°C overnight. The overnight culture was diluted 100-fold in fresh MH II Broth and used as inoculum for the antimicrobial screen. Working stocks (50X) of LOPAC compounds and standard antibiotics were prepared in DMSO. Each well of the 96-well multiwell platecontained 245µl of the inoculum and 5µl of the 50X working stock. The multiwell plate was incubated at 37°C for 5 hours. One hundred microliters of the culture was taken from each well, and the BacTiter-Glo™ Assay was performed according to the protocol described in Section III. Luminescence was measured using a GloMax ®96Microplate Luminometer (Cat.# E6501). The samples and concentrations are: Wells 1–4and 93–96, negative control of 2% DMSO; wells 5–8 and 89–92, positive controls of 32µg/ml standard antibiotics tetracycline, ampicillin, gentamicin, chloramphenicol,oxacillin, kanamycin, piperacillin, and erythromycin; wells 9–88, LOPAC compounds at 10µM.Evaluating Antimicrobial Compound ActivityWe examined the dosage effects of oxacillin on S. aureus using theBacTiter-Glo™ Assay. The results are shown in Figure 6. Oxacillin showedanti-S. aureus activity in a dosage-dependent fashion. The reported and observed minimal inhibitory concentration (MIC) values for oxacillin on S. aureus ATCC 25923 in cation-adjusted MH II Broth are 0.125–0.5µg/ml (6), corresponding to approximately IC 75–IC 90values on the dosage curve determined using the BacTiter-Glo™ Assay.4614M A% R L U v s . N o -D r u g C o n t r o l0.51.01.52.0Oxacillin (µg/ml)Figure 6. Evaluating antimicrobial compounds using the BacTiter-Glo™ Assay. S. aureus ATCC 25923 strain and oxacillin were prepared as described in Figure 5and incubated at 37°C; the assay was performed after 19 hours of incubation asrecommended for MIC determination by NCCLS (6). The relative percentage of RLU compared to the no-oxacillin control is shown. Luminescence was recorded on a GloMax ®96 Microplate Luminometer (Cat.# E6501).Examining Bacterial Growth with Extended Sensitivity and Range We examined the growth of E. coli using either the BacTiter-Glo™ Assay or optical density (O.D.) measurement. The results are shown in Figure 7. The extended sensitivity and range of the BacTiter-Glo™ Assay allows users to monitor E. coli growth immediately after inoculation. When measuring growth by O.D., the first significant measurement (0.025) did not occur until 5 hours after inoculation. The growth curve determined by the BacTiter-Glo™ Assay has a dynamic range over six orders of magnitude compared to the growth curve determined by O.D. measurement, which only has a range of about two orders of magnitude. The increased dynamic range allows researchers to moreeasily monitor slow-growing bacteria.Promega Corporation ·2800 Woods Hollow Road ·Madison, WI 53711-5399 USA·Fax 608-277-2516 ·4616M A10102103104105106107108109L u m i n e s c e n c e (R L U )Time (hours)Figure 7. Evaluating bacterial growth using the BacTiter-Glo™ Assay. E. coli ATCC 25922 strain was grown in Mueller Hinton II (MH II) Broth (B.D. Cat.# 297963; see Section IV.B for growth medium recommendations) at 37°C overnight. The overnight culture was diluted 1:106in 50ml of fresh MH II Broth and incubated at 37°C with shaking at 250rpm. Samples were taken at various time points, and the BacTiter-Glo™Assay was performed according to the protocol described in Section III. Luminescence was recorded on a GloMax ®96 Microplate Luminometer. Optical density was measured at 600nm (O.D.600) using a Beckman DU650 spectrophotometer. Diluted samples were used when readings of RLU and O.D. exceeded 108and 1, respectively.IV.D.References1.DeLuca, M.A. and McElroy, W.D. (1978) Purification and properties of fireflyluciferase. Methods. Enzymol. 57, 3–15.2.McElroy, W.D. and DeLuca, M.A. (1983) Firefly and bacterial luminescence: Basicscience and applications.J. Applied Biochem. 5, 197–209.3.Lundin, A. and Thore, A. (1975) Analytical information obtained by evaluation of thetime course of firefly bioluminescence in the assay of ATP. Anal. Biochem.66, 47–63.4.Hall, M.P.et al. (1998) Stabilization of firefly luciferase using directed evolution. In:Bioluminescence and Chemiluminescence, Perspectives for the 21st Century.Roda, A.,Pazzagli, M., Kricka, L.J. and Stanley, P.E. (eds) New York: John Wiley & Sons, 392–5.5.Association of Official Analytical Chemists. (1995) Bacteriological Analytical Manual,8th ed. AOAC International, Gaithersburg, MD.6.National Committee for Clinical Laboratory Standards (2000) Methods for DilutionAntimicrobial Susceptibility Tests for Bacteria that Grow Aerobically; approved standard-fifth edition M7-A5. National Committee for Clinical Laboratory Standards, Wayne,PA.7.Stanley, P.E. (1986) Extraction of adenosine triphosphate from microbial and somaticcells. Methods. Enzymol.133, 14–22.8.Hattori, N. et al. (2003) Enhanced microbial biomass assay using mutant luciferaseresistant to benzalkonium chloride. Anal. Biochem.319, 287–95.9.Hatano, T.et al. (1999) Phenolic constituents of Cassia seeds and antibacterial effect ofsome napthalenes and anthraquinones on methicillin-resistant Staphylococcus aureus.Chem. Pharm. Bull.47, 1121–7.10.Godowski, K.C. et al. (1995) Whole mouth microbiota effects following subgingivaldelivery of sanguinarium.J. Periodontol.66, 870–7.11.Raad, I. et al. (2003) In vitro and ex vivo activities of minocycline and EDTA againstmicroorganisms embedded in biofilm on catheter surfaces. Antimicrob. 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Nos. 6,602,677 and 7,241,584, Australian Pat. No. 754312 and European Pat. No. 1131441 have been issued to Promega Corporation for thermostable luciferases and methods of production. Other patents are pending.(b)The method of recombinant expression of Coleoptera luciferase is covered by U.S. Pat. Nos. 5,583,024, 5,674,713 and5,700,673.© 2004–2007 Promega Corporation. All Rights Reserved.Apo-ONE, Caspase-Glo, CellTiter 96, CellTiter-Blue, CellTiter-Glo and GloMax are registered trademarks of Promega Corporation. BacTiter-Glo, CytoTox-Fluor, CytoTox-ONE, Proteasome-Glo and Ultra-Glo are trademarks of Promega Corporation.Products may be covered by pending or issued patents or may have certain limitations. Please visit our Web site for more information.All prices and specifications are subject to change without prior notice.Product claims are subject to change. 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Wayne Kerr 6500B系列精密电阻分析仪技术数据表说明书
Precision Impedance Analyzers6505B 5 MHz 6510B 10 MHz6515B 15 MHz 6520B 20 MHz6530B 30 MHz 6550B 50 MHz65120B 120 MHz•Precise high frequency impedance measurements •Characterize components to 120 MHz (65120B) •0.05% basic measurement accuracy•Easy to use with large TFT 8.4” touch screen •Clear graphic displays•Fully programmable over GPIB or LAN •Competitively priced•Equivalent Circuit Analysis function (/E option) •Calculate Permittivity and Permeability (/K option) •Test programs in Multi Measurement Mode (/M) •Polar/Complex Plots (/Y option)•Unipolar (/D1) and bipolar (/D2) DC Bias optionsThe 6500B series of Precision Impedance Analyzers provide precise and fast testing of devices at frequencies up to 120 MHz. Basic measurement accuracy is ±0.05% making the instruments the best in their class.The accuracy and versatility makes these precision instruments the ideal choice for many different tasks and applications including passive component design, dielectric material testing and resonant frequency characterisation. Engineers need to evaluate component characteristics at high frequencies with very high levels of accuracy. The 65120B 120MHz Precision Impedance Analyzer is therefore ideal for many demanding tasks, combining accuracy and ease of use at an affordable price. If a maximum frequency less than 120MHz is required, other models are available in this range.AC Measurement parameters•Impedance (Z)•Phase Angle (θ)•Capacitance (C)•Dissipation Factor (D)•Inductance (L)•Quality Factor (Q)•Resistance (R)•Reactance (X)•Conductance (G)•Susceptance (B)•Admittance (Y)High measurement accuracyCapacitance, inductance and impedance basic accuracy are all an excellent ±0.05%. Dissipation factor accuracy is±0.0005 and the quality factor accuracy is ±0.05%.Technical data sheetGraphical sweep of componentsThe 6500B series of Precision Impedance Analyzers are highlyaccurate high frequency component analyzers with a host of useful features.Graphical sweep of two measured parameters is available and displayed on the large clear colour display. Swept parameters are frequency, drive level and DC bias (option).Display formats available include series or parallel equivalent circuit. Polar and Complex plots can also be displayed when the /Y firmware option is installed.An Equivalent Circuit Analysis function is available as the /E firmware option. This allows modelling and curve fitting to various models of equivalent circuits. 4 types of 3-component model and 1 type of 4-component model can be selected. The instrument will calculate the nearest equivalent circuit parameters for the measurement traces and revise the results for the different models instantly. Alternatively the parameters can be entered by the user and the instrument will plot the resulting frequency characteristics and revise the plot between the various models instantly.For single frequency measurements a meter mode is available.Variable drive and bias levelsAC drive levels up to 1V or 20 mA can be selected to evaluate components in realistic operating environments. /D1 DC bias option provides 0 to +40V dc bias voltage and 0 to +100mA dc bias current. /D2 option provides -40V to +40V dc bias voltage.External controlThe GPIB interface is used to control the instrument and read back measured values for applications such as quality control or for archiving purposes.An Ethernet interface similarly allows the instrument to be controlled and to send out data, allowing it to be integrated into many test environments.Wide range of interfacesAn external monitor or projector may be connected to the instrument’s VGA output. The ability to provide a large screen display of measurement results is invaluable in production environments or for teaching and training.Instrument control from both a keyboard and mouse is available. Any keyboard or mouse, with either a PS/2 or USB interface, can simply be connected to provide an alternative method of instrument control and operation.Data storage and retrievalAll measurement and setup data can be stored using the Ethernet interface or a USB memory (supplied as standard).Setup DataUp to 20 instrument setups may be locally stored for each mode. Additional setups can be stored to the USB memory stick which is supplied with each unit as standard.Bin handling option/B1 option (non-isolated 5V) or /B2 option (isolated 24V) signals are available through a 25-way D-type connector. 10 bins can be set using absolute or percentage limits.Printer outputsHard copy printouts can be obtained using an HP-PCL compatible graphics printer. A networked HP-PCL compatible printer may also be used via the Ethernet connection.Component connectionsFour front panel BNC connectors permit three or four terminal connections with the screens at ground potential.The 1J1011 Component Fixture, supplied as standard, ensures optimum performance when measuring a wide range of leaded components and devices.1J1012 (2-terminal), 1J1014 (4-terminal) and 1J1024 (2-terminal small body DUT) SMD Fixtures allow connection to surface mount devices.Protection against charged capacitorsHigh precision measuring instruments can be damaged by All the models in the range incorporate protectionagainst charged capacitors.Simultaneous plot of impedance and phase displayed against frequency on a clear colour displayTechnical data sheetTechnical specificationsMeasurement parametersAny two of the following parameters can be measured and displayed at the same time:AC functionsImpedance (Z) Phase Angle (θ)Capacitance (C) Dissipation Factor (D)Inductance (L) Quality Factor (Q)Resistance (R) Reactance (X)Conductance (G) Susceptance (B)Admittance (Y)Display formatSeries or parallel equivalent circuit – all parameters3 and 4-element models (/E option)Test conditionsFrequency range6505B 20 Hz to 5 MHz6510B 20 Hz to 10 MHz6515B 20 Hz to 15 MHz6520B 20 Hz to 20 MHz6530B 20 Hz to 30 MHz6550B 20 Hz to 50 MHz65120B 20 Hz to 120 MHzFrequency step size: 1 mHzAccuracy of set frequency ±0.005%AC drive level10mV to 1Vrms*200µA to 20mArms**Varies with frequencySignal source impedance: 50Ω nominalDC biasD1 option0 to +100 mAdc bias current; 0 to +40 V dc bias voltageD2 option-40 V to +40 V dc bias voltageBinning (optional)10 bins with absolute and percentage limits.25 way D-type interface connector.Option /B1 (non-isolated)Common 0 V. Bin outputs 0 to 5 V(nominal) with >10 mA current sink capability.Option /B2 (isolated)Common 24 V input. Outputs 0 to 24 V with >10 mA current source capability.Mode of operationAnalysis Mode (Graphical Sweep)Allows graphical sweep of any two measurement parameters Swept parameters: frequency, drive level or DC bias Materials Test (/K option)Calculates Complex Relative Permittivity, ε*r when using 1020 Material Test Fixture and Complex Permeability, μ* Setup DataUp to 20 instrument setups can be locally stored for each mode. Additional setups can be stored on USB memory. Equivalent Circuit Analysis (/E option)4 types of 3-component model and 1 type of 4-component model.Polar/Complex Plots (/Y option)Polar Plots:1. Z (Impedance & Angle)2. Y (Admittance & Angle)Complex Plots:1. Rs/Xs (Series Resistance against Series Reactance)2. Gp/Bp (Parallel Conductance against Parallel Susceptance)3. Z’/Z” (Real Impedance against Imaginary Impedance) Measurement connectionsFour front panel BNC connectors in 4-terminal pair configuration permits three or four terminal connections with the screens at ground potential.Measurement accuracyDissipation factor±0.0005 (1+D2)*Quality factor±0.05 %( Q+1/Q)*Capacitance / Inductance / Impedance±0.05%**Varies with frequency, drive level and measured impedance GeneralPower SupplyInput voltage 90 VAC to 264 VAC (Autoranging)Mains frequency47 Hz to 63 HzDisplay8.4″ VGA (640 x 480) colour TFT with touch screenWayne Kerr’s policy is one of continuous development and consequently the product may vary in detail from the description and specification in this publication.Technical data sheetLocal PrinterHP-PCL compatible graphics printingCentronics / parallel printer port, Epson compatible text / ticket printingNetwork PrinterHP-PCL compatible graphics printingGPIB interfaceExternal instrument control. 24 pin IEEE 488 connectorRemote triggerRear panel BNC with internal pull-up, operates on logic low or contact closureUSB interfaceTwo Universal Serial Bus Interfaces USB 1.1 compliantVGA interface15-way D-type connector to drive an external monitor in addition to the instrument displayLAN interface10/100-BASE-TX Ethernet controller. RJ45 connectorKeyboard interfaceStandard USB or PS/2 keyboard port. Instrument front panel remains active with keyboard plugged inMouse interfaceStandard USB or PS/2 mouse port. Touch screen remains enabled when the mouse is connected.Bin handler (option)/B1 option (non-isolated 5V) or /B2 option (isolated 24V). 25-way D-type connectorEnvironmental conditionsThis equipment is intended for indoor use only in a non-explosive and non-corrosive atmosphereTemperature rangeStorage -20°C to 60°COperating 0°C to 40°C Full Accuracy 18°C to 28°CRelative humidityUp to 80% non-condensingAltitudeUp to 2000 mInstallation categoryII in accordance with IEC664SafetyComplies with the requirements of EN61010-1EMCComplies with EN61326 for emissions and immunityMechanicalHeight 190 mm (7.5″) Depth 525 mm (20.5″) Width 440 mm (17.37″)Weight 14.5 kg (32 lb)Order codesDescriptionOrder code6505B 1J6505B 5 MHz Precision Impedance Analyzer 6510B 1J6510B 10 MHz Precision Impedance Analyzer 6515B 1J6515B 15 MHz Precision Impedance Analyzer 6520B 1J6520B 20 MHz Precision Impedance Analyzer 6530B 1J6530B 30 MHz Precision Impedance Analyzer 6550B 1J6550B 50 MHz Precision Impedance Analyzer65120B 1J65120B120 MHz Precision Impedance Analyzer with any two firmware options and either /D1 or /D2 option as standardAll models supplied with:- User manual AC power cable 2-terminal component fixture (1J1011) USB memoryHardware OptionsDescriptionOrder codeBin handler (non-isolated) /B1 Bin handler (isolated 24V)/B2 DC Bias (0 to +40V, 0 to +100mA) /D1 DC Bias (-40V to +40V)/D2Firmware OptionsDescriptionOrder codeEquivalent Circuit Analysis /E Material Test /K Multi-Measurement Mode /M Polar Complex Plots /Y。
2005-A global Malmquist productivity index
A global Malmquist productivity indexJesu ´s T.Pastor a ,C.A.Knox Lovell b ,TaCentro de Investigacio ´n Operativa,Universidad Miguel Herna ´ndez,03206Elche (Alicante),SpainbDepartment of Economics,University of Georgia,Athens,GA 30602,USA Received 2June 2004;received in revised form 24January 2005;accepted 16February 2005Available online 23May 2005AbstractThe geometric mean Malmquist productivity index is not circular,and its adjacent period components can provide different measures of productivity change.We propose a global Malmquist productivity index that is circular,and that gives a single measure of productivity change.D 2005Elsevier B.V .All rights reserved.Keywords:Malmquist productivity index;Circularity JEL classification:C43;D24;O471.IntroductionThe geometric mean form of the contemporaneous Malmquist productivity index,introduced by Caves et al.(1982),is not circular.Whether this is a serious problem depends on the powers of persuasion of Fisher (1922),who dismissed the test,and Frisch (1936),who endorsed it.The index averages two possibly disparate measures of productivity change.Fa ¨re and Grosskopf (1996)state sufficient conditions on the adjacent period technologies for the index to satisfy circularity,and to average the same measures of productivity change.When linear programming techniques are used to compute and decompose the index,infeasibility can occur.Whether this is a serious problem depends on0165-1765/$-see front matter D 2005Elsevier B.V .All rights reserved.doi:10.1016/j.econlet.2005.02.013T Corresponding author.Tel.:+17065423689;fax:+17065423376.E-mail address:knox@ (C.A.K.Lovell).Economics Letters 88(2005)266–271/locate/econbasethe structure of the data.Xue and Harker(2002)provide necessary and sufficient conditions on the datafor LP infeasibility not to occur.We demonstrate that the source of all three problems is the specification of adjacent periodtechnologies in the construction of the index.We show that it is possible to specify a base periodtechnology in a way that solves all three problems,without having to impose restrictive conditions oneither the technologies or the data.Berg et al.(1992)proposed an index that compares adjacent period data using technology from a baseperiod.This index satisfies circularity and generates a single measure of productivity change,but it paysfor circularity with base period dependence,and it remains susceptible to LP infeasibility.Shestalova(2003)proposed an index having as its base a sequential technology formed from data ofall producers in all periods up to and including the two periods being compared.This index is immune toLP infeasibility,and it generates a single measure of productivity change,but it fails circularity and itprecludes technical regress.Thus no currently available Malmquist productivity index solves all three problems.We propose anew global index with technology formed from data of all producers in all periods.This index satisfiescircularity,it generates a single measure of productivity change,it allows technical regress,and it isimmune to LP infeasibility.In Section2we introduce and decompose the circular global index.Its efficiency change componentis the same as that of the contemporaneous index,but its technical change component is new.In Section3we relate it to the contemporaneous index.In Section4we provide an empirical illustration.Section5concludes.2.The global Malmquist productivity indexConsider a panel of i=1,...,I producers and t=1,...,T time periods.Producers use inputs x a R N+toproduce outputs y a R P+.We define two technologies.A contemporaneous benchmark technology isdefined as T c t={(x t,y t)|x t can produce y t}with k T c t=T c t,t=1,...,T,k N0.A global benchmarktechnology is defined as T c G=conv{T c1v...v T c T}.The subscript b c Q indicates that both benchmark technologies satisfy constant returns to scale.A contemporaneous Malmquist productivity index is defined on T c s asM scx t;y t;x tþ1;y tþ1ÀÁ¼D scx tþ1;y tþ1ðÞD scx t;y tðÞ;ð1Þwhere the output distance functions D c s(x,y)=min{/N0|(x,y//)a T c s},s=t,t+1.Since M c t(x t,y t,x t+1, y t+1)p M c t+1(x t,y t,x t+1,y t+1)without restrictions on the two technologies,the contemporaneous index is typically defined in geometric mean form as M c(x t,y t,x t+1,y t+1)=[M c t(x t,y t,x t+1,y t+1)ÂM c t+1(x t,y t,x t+1, y t+1)]1/2.A global Malmquist productivity index is defined on T c G asM Gcx t;y t;x tþ1;y tþ1ÀÁ¼D Gcx tþ1;y tþ1ðÞD Gcx t;y tðÞ;ð2Þwhere the output distance functions D c G(x,y)=min{/N0|(x,y//)a T c G}.J.T.Pastor,C.A.K.Lovell/Economics Letters88(2005)266–271267Both indexes compare (x t +1,y t +1)to (x t ,y t ),but they use different benchmarks.Since there is only one global benchmark technology,there is no need to resort to the geometric mean convention when defining the global index.M cGdecomposes as M G c x t ;y t ;x t þ1;f y t þ1ÀÁ¼D t þ1c x t þ1;y t þ1ðÞD t c x t ;y t ðÞÂD G c x t þ1;y t þ1ðÞD t þ1c x t þ1;y t þ1ðÞÂD t cx t ;y t ðÞD Gc x t ;y t ðÞ&'¼TE t þ1c x t þ1;y t þ1ðÞTE t c x t ;y t ðÞÂD G c Àx t þ1;y t þ1=D t þ1c x t þ1;y t þ1ðÞÁD G c x t ;y t =D t cx t ;y t ðÞÀÁ()¼EC c ÂBPG G ;t þ1cx t þ1;y t þ1ðÞBPG cx t ;y tðÞ()¼EC c ÂBPC c ;ð3Þwhere EC c is the usual efficiency change indicator and BPG c G,s V 1is a best practice gap between T c Gand T c s measured along rays (x s ,y s),s =t ,t +1.BPC c is the change in BPG c ,and provides a new measure of technical change.BPC c f 1indicates whether the benchmark technology in period t +1in the region[(x t +1,y t +1/D ct +1(x t +1,y t +1))]is closer to or farther away from the global benchmark technology than is the benchmark technology in period t in the region [(x t ,y t /D ct (x t ,y t ))].M c G has four virtues.First,like any fixed base index,M cGis circular,and since EC c is circular,so is BPC c .Second,each provides a single measure,with no need to take the geometric mean of disparate adjacent period measures.Third,but not shown here,the decomposition in (3)can be extended to generate a three-way decomposition that is structurally identical to the Ray and Desli (1997)decomposition of the contemporaneous index.M cGand M c share a common efficiency change component,but they have different technical change and scale components,and so M c Gp M c without restrictions on the technologies.Finally,the technical change and scale components of M c Gare immune to the LP infeasibility problem that plagues these components of M c .paring the global and contemporaneous indexes The ratioM G c =M c¼M G c =M t þ1cÀÁÂM G c =M t cÀÁÂÃ1=2¼D G cx t þ1;y t þ1=D t þ1c x t þ1;y t þ1ðÞÀÁD G c x t ;y t =D t þ1c x t ;y t ðÞÀÁ"#ÂD G c x t þ1;y t þ1=D t c x t þ1;y t þ1ðÞÀÁD G c x t ;y t =D t c x t ;y t ðÞÀÁ"#()1=2¼BPG G ;t þ1cx t þ1;y t þ1ðÞBPG G ;t þ1cx t ;y tðÞ"#ÂBPG G ;t c xt þ1;y t þ1ðÞBPG G ;t c x t ;y tðÞ"#()1=2ð4Þis the geometric mean of two terms,each being a ratio of benchmark technology gaps along differentrays.M c G /M c f 1as projections onto T c t and T c t +1of period t +1data are closer to,equidistant from,orfarther away from T c G than projections onto T c t and T ct +1of period t data are.J.T.Pastor,C.A.K.Lovell /Economics Letters 88(2005)266–271268J.T.Pastor,C.A.K.Lovell/Economics Letters88(2005)266–271269 Table1Electricity generation data,annual means1977198219871992 Output(000MW h)13,70013,86016,18017,270 Labor(#FTE)1373179719952021 Fuel(billion BTU)1288144116671824 Capital(To¨rnqvist)44,756211,622371,041396,386 M c G=M c if BPG c G,s(x t+1,y t+1)=BPG c G,s(x t,y t),s=t,t+1.From the first equality in(4),this condition is equivalent to the condition M c G=M c s,s=t,t+1.If this condition holds for all s,it is equivalent to the condition M c t=M c1for all t.Althin(2001)has shown that a sufficient condition for base period independence is that technical change be Hicks output-neutral(HON).Hence HON is also sufficient for M c G=M c.4.An empirical illustrationWe summarize an application intended to illustrate the behavior of M c G,and to compare its performance with that of M c.We analyze a panel of93US electricity generating firms in four years (1977,1982,1997,1992).The firms use labor(FTE employees),fuel(BTUs of energy)and capital(a multilateral To¨rnqvist index)to generate electricity(net generation in MW h).The data are summarized in Table1.Electricity generation increased by proportionately less than each input did.The main cause of the rapid increase in the capital input was the enactment of environmental regulations mandating the installation of pollution abatement equipment.We are unable to disaggregate the capital input into its productive and abatement components.Empirical findings are summarized in Table2.The first three rows report decomposition(3)of M c G, and the final three rows report M c and its two adjacent period components.Columns correspond to time periods.M c G shows a large productivity decline from1977to1982,followed by weak productivity growth. Cumulative productivity in1992was25%lower than in1977.M c G calculated using1992and1977data generates the same value,verifying that it is circular.The efficiency change component EC c of M c G(and M c)is also circular,and cumulates to an18% improvement.Best practice change,BPC c,is also circular,and declined by35%.Capital investment in Table2Global and contemporaneous Malmquist productivity indexes1977–19821982–19871987–1992Cumulative productivity1977–1992 M c G0.685 1.064 1.0390.7570.757EC c 1.163 1.0890.929 1.176 1.176 BPC c0.5890.977 1.1180.6440.644M c0.4310.895 1.0390.4000.592M c t0.7130.902 1.0530.678 1.333M c t+10.2600.887 1.0240.2360.263pollution abatement equipment generated cleaner air but not more electricity.Consequently catching up with deteriorating best practice was relatively easy.Turning to the contemporaneous index M c reported in the final three rows,the story is not so clear.Cumulative productivity in 1992was 60%lower than in 1977.However calculating M c using 1992and 1977data generates a smaller 40%decline,verifying that M c is not circular.Neither figure is close to the25%decline reported by M cG,verifying that technical change was not HON,but (pollution abatement)capital-using.The lack of circularity is reflected in the frequently large differences between M ct and M c t +1,which give conflicting signals when computed using 1992and 1977data,with M c tsignaling productivitygrowth and M ct +1signaling productivity decline.Although not reported in Table 2,we have calculated three-way decompositions of M cG and M c .All three components of M c G are circular,and LP infeasibility does not occur.In contrast,the technical change and scale components of M c are not circular,and infeasibility occurs for 13observations.The circular global index M cGtells a single story about productivity change,and its decomposition is intuitively appealing in light of what we know about the industry during the cking circularity,M c and its two adjacent period components tell different stories that are often contradictory.Thedifferences between M cGand M c are a consequence of the capital-using bias of technical change,which was regressive due to the mandated installation of pollution abatement equipment,augmented perhaps by the rate base padding that was prevalent during the period.5.ConclusionsThe contemporaneous Malmquist productivity index is not circular,its adjacent period components can give conflicting signals,and it is susceptible to LP infeasibility.The global Malmquist productivity index and each of its components is circular,it provides single measures of productivity change and its components,and it is immune to LP infeasibility.The global index decomposes into the same sources of productivity change as the contemporaneous index does.A sufficient condition for equality of the two indexes,and their respective components,is Hicks output neutrality of technical change.The global index must be recomputed when a new time period is incorporated.Diewert’s (1987)assertion that b ...economic history has to be rewritten ...Q when new data are incorporated is the base period dependency problem revisited.The problem can be serious when using base periods t =1and t =T ,but it is likely to be benign when using global base periods {1,...,T }and {1,...,T +1}.While new data may change the global frontier,the rewriting of history is likely to be quantitative rather than qualitative.ReferencesAlthin,R.,2001.Measurement of productivity changes:two Malmquist index approaches.Journal of Productivity Analysis 16,107–128.Berg,S.A.,Førsund,F.R.,Jansen,E.S.,1992.Malmquist indices of productivity growth during the deregulation of Norwegian banking,1980–89.Scandinavian Journal of Economics 94,211–228(Supplement).Caves,D.W.,Christensen,L.R.,Diewert,W.E.,1982.The economic theory of index numbers and the measurement of input output,and productivity.Econometrica 50,1393–1414.J.T.Pastor,C.A.K.Lovell /Economics Letters 88(2005)266–271270J.T.Pastor,C.A.K.Lovell/Economics Letters88(2005)266–271271 Diewert,W.E.,1987.Index numbers.In:Eatwell,J.,Milgate,M.,Newman,P.(Eds.),The New Palgrave:A Dictionary of Economics,vol.2.The Macmillan Press,New York.Fa¨re,R.,Grosskopf,S.,1996.Intertemporal Production Frontiers:With Dynamic DEA.Kluwer Academic Publishers,Boston. Fisher,I.,1922.The Making of Index Numbers.Houghton Mifflin,Boston.Frisch,R.,1936.Annual survey of general economic theory:the problem of index numbers.Econometrica4,1–38.Ray,S.C.,Desli,E.,1997.Productivity growth,technical progress,and efficiency change in industrialized countries:comment.American Economic Review87,1033–1039.Shestalova,V.,2003.Sequential Malmquist indices of productivity growth:an application to OECD industrial activities.Journal of Productivity Analysis19,211–226.Xue,M.,Harker,P.T.,2002.Note:ranking DMUs with infeasible super-efficiency in DEA models.Management Science48, 705–710.。
tpo40三篇托福阅读TOEFL原文译文题目答案译文背景知识
tpo40三篇托福阅读TOEFL原文译文题目答案译文背景知识阅读-1 (2)原文 (2)译文 (5)题目 (8)答案 (17)背景知识 (17)阅读-2 (20)原文 (20)译文 (23)题目 (25)答案 (35)背景知识 (35)阅读-3 (38)原文 (38)译文 (41)题目 (44)答案 (53)背景知识 (54)阅读-1原文Ancient Athens①One of the most important changes in Greece during the period from 800 B.C. to 500 B.C. was the rise of the polis, or city-state, and each polis developed a system of government that was appropriate to its circumstances. The problems that were faced and solved in Athens were the sharing of political power between the established aristocracy and the emerging other classes, and the adjustment of aristocratic ways of life to the ways of life of the new polis. It was the harmonious blending of all of these elements that was to produce the classical culture of Athens.②Entering the polis age, Athens had the traditional institutions of other Greek protodemocratic states: an assembly of adult males, an aristocratic council, and annually elected officials. Within this traditional framework the Athenians, between 600 B.C. and 450 B.C., evolved what Greeks regarded as a fully fledged democratic constitution, though the right to vote was given to fewer groups of people than is seen in modern times.③The first steps toward change were taken by Solon in 594 B.C., when he broke the aristocracy's stranglehold on elected offices by establishing wealth rather than birth as the basis of office holding, abolishing the economic obligations of ordinary Athenians to the aristocracy, and allowing the assembly (of which all citizens were equal members) to overrule the decisions of local courts in certain cases. The strength of the Athenian aristocracy was further weakened during the rest of the century by the rise of a type of government known as a tyranny, which is a form of interim rule by a popular strongman (not rule by a ruthless dictator as the modern use of the term suggests to us). The Peisistratids, as the succession of tyrants were called (after the founder of the dynasty, Peisistratos), strengthened Athenian central administration at the expense of the aristocracy by appointing judges throughout the region, producing Athens’ first national coinage, and adding and embellishing festivals that tended to focus attention on Athens rather than on local villages of the surrounding region. By the end of the century, the time was ripe for more change: the tyrants were driven out, and in 508 B.C. a new reformer, Cleisthenes, gave final form to the developments reducing aristocratic control already under way.④Cleisthenes' principal contribution to the creation of democracy at Athens was to complete the long process of weakening family and clanstructures, especially among the aristocrats, and to set in their place locality-based corporations called demes, which became the point of entry for all civic and most religious life in Athens. Out of the demes were created 10 artificial tribes of roughly equal population. From the demes, by either election or selection, came 500 members of a new council, 6,000 jurors for the courts, 10 generals, and hundreds of commissioners. The assembly was sovereign in all matters but in practice delegated its power to subordinate bodies such as the council, which prepared the agenda for the meetings of the assembly, and courts, which took care of most judicial matters. Various committees acted as an executive branch, implementing policies of the assembly and supervising, for instance, the food and water supplies and public buildings. This wide-scale participation by the citizenry in the government distinguished the democratic form of the Athenian polis from other less liberal forms.⑤The effect of Cleisthenes’ reforms was to establish the superiority of the Athenian community as a whole over local institutions without destroying them. National politics rather than local or deme politics became the focal point. At the same time, entry into national politics began at the deme level and gave local loyalty a new focus: Athens itself. Over the next two centuries the implications of Cleisthenes’ reforms were fully exploited.⑥During the fifth century B.C. the council of 500 was extremely influential in shaping policy. In the next century, however, it was the mature assembly that took on decision-making responsibility. By any measure other than that of the aristocrats, who had been upstaged by the supposedly inferior "people", the Athenian democracy was a stunning success. Never before, or since, have so many people been involved in the serious business of self-governance. It was precisely this opportunity to participate in public life that provided a stimulus for the brilliant unfolding of classical Greek culture.译文古雅典①在公元前800年到公元前500年期间,希腊最重要的变化之一是城邦的崛起,并且每个城邦都发展了适合其情况的政府体系。
Hybrid Slip Model for Near-Field Ground Motion Estimation Based on Uncertainty of Source Paramet
Trans.Tian jin Un iv.2010,16:061-067DOI 10.1007/s 12209-010-0012-7Accepted date:2008-11-07.*Supported by National Natural Science Foundation of China (No.50778058and No.90715038),National Key Technology Research and Development f (N 6B 3B )M j S B R D f (“3”,N B 5)SUN X ,,f ,SUN X ,@6H ybrid Slip Model for Near-F ield Groun d Motion EstimationBased on Uncertainty of Source Parameters *SUN X ia oda n (孙晓丹)1,TAO X ia xin (陶夏新)1,2,TANG Aiping (汤爱平)1,LU Jia nb o (路建波)1(1.School of Civil Engineering,Harbin Institute of Technology,Harbin 150090,China ;2.Institute of Engineering Mechanics,China Earthquake Administration,Harbin 150080,China)Tianjin University and Springer-Verlag Berlin Heidelberg 2010Ab stract :The hybrid slip model used to generate a finite fault model for near-field ground motion estimation and seismic hazard assessment was improved to express the uncertainty of the source form of a future earthquake.In this process,source parameters were treated as normal random variables,and the Fortran code of hybrid slip model was modified by adding a random number generator so that the code could generate many finite fault models with different dimensions and slip distributions for a given magnitude.Furthermore,a simple method to choose an optimal one from these generated models was proposed.The 1994Northridge earthquake was taken as an example to demonstrate the procedure of the application of the improved model.Three rock stations,LV3,MCN and PCD,in near-field were used to compare the simulated ground motion from the improved model and optimal model with the observed one.The agreement between them in the periods of interest indicates that the improved model and the method to choose the optimal model are available for the engineering practice of ground motion estimation.Keyword s :hybrid slip model;uncertainty of source parameters;optimal finite fault model;near-field ground motion estimationIt is common to characterize the source by a rupture plane,known as finite fault model,in the near field or for large earthquakes in order to simulate the rupture direc-tivity effect and hanging wall effect [1].The seismic field is then modeled by subdividing the fault plane into subelements and summing their contributions at the ob-servation point.Up to date,it is still difficult to estimate exactly the inhomogeneous slip distribution on the rup-ture plane before an earthquake.Many methods address-ing this problem have been proposed either by random method or by inversion method [2-14].Particularly,Hisede combined the two methods for the Kobe earthquake [15],in which the slip for wave number lower than the Nyquist wave number of sub-source is from inversion method,while the slip for wave number higher than the Nyquist wave number is from random method.As an extension,Wang developed a hybrid slip model [16]in which an asperity model and a k squaremodel [5]were employed to generate slip distributions in long and short wave length respectively.The method to generate a finite fault model by the hybrid slip model issimple,which begins with a target moment magnitude M W from earthquake risk assessment.Based on M W ,global source parameters (i.e.,dimension and average slip of the fault)and local source parameters (i.e.,loca-tion,dimension and average slip of asperity)are easy to be calculated by empirical relations from statistics.Then the whole fault plane is divided into subelements (1km ×1km).For the subelements in the area of asperity,the deterministic slip could be computed byasp aspasp asp11i jij M N i jiji j D A D A ζ===ζ∑∑(1)where ij D and asp D are the average slip on the thij subelement and the whole asperity;ij A and as p A are the area of the th ij subelement and the whole asperity;asp M and as p N are the number of subelements along strike and down dip respectively;i jζis a random number uniformly distributed in (0,1).Eq.(1)can be also used to assign slip to the subelement in the non-asperity area by replac-ing asp D ,asp A ,as p M ,asp N with the corresponding values.Program o China o.200AC 102and a or tate asic esearch evel opment Program o China 97Program o.2008C 42802.iaodan born in 1980emale doctorate student.Correspondence to iaodan E-mail:vshermione .Transactions of Tianjin University V ol.16No.12010—6—With the whole fault plane being assigned with determi-nistic slips,the fault plane is discretized into 22M N ×meshes,and the slip on the fault is transferred from spa-tial domain into wave number domain where a 2D slip model [17]will be used to generate the random slip for wave number higher than corner wave number:(),222(,)e1x yi k k x y y x cxcyDLW D k k k k k k Φ=++(2)where cx k and cy k are corner wave numbers along strike and down dip;(,)x y k k Φis phase spectrum ;D is the average slip on the fault;L and W are the length and width of the fault.Finally,two parts of slip from Eq.(1)and Eq.(2)are superposed in wave number domain and transferred back into spatial domain.1Uncertainties of source paramet ersThe hybrid slip model mentioned above is obviously a convenient method.However,empirical relations in the model can only represent a mean level of data used in statistics,which leads to the fact that parameters derived from these relations cannot describe the large scatter of statistical data.For a given moment magnitude,the hy-brid slip model will result in a fixed finite fault form no matter where the event is,which is practically impossi-ble.In fact,any data used in statistics is a possible pa-rameter for future earthquake since it is still impossible so far to tell the precise source form before an earthquake happens.Thus in seismic hazard study ,the uncertainties of source should be sufficiently considered.The hybrid slip model should be improved to make it possible to obtain many different finite fault models for a given magnitude.For this purpose,source parameters were treated as normal random variables,and Fortran code of hybrid slip model was modified by adding a sub-routine to generate a normal random series ξwith zero mean and unit standard deviation.Then the value of source parameter X is given bylg ()()lg (1,2,,)X X X v i i i n ξσμ=+="(3)where n is the number of finite fault models;()X v i de-notes the value of parameter X of the ith finite faultmodel;X μis the mean of X determined by the empirical relation;X σis the standard deviation.To demonstrate the detailed steps,the Northridge q x T magnitude is 6.7[18]and n in Eq.(3)is 30.Two asperities were presumed to exist on the fault plane according to the work of Wald et al [19]and Wang [16],the bigger one is named maximum asperity and the smaller one the other asperity.First,30groups of global source parameters (S ,L ,D ,cx k ,cy k )were computed by Eq.(3).The correspond-ing relations and deviations for these parameters were chosen from the work of Wang [16]as listed in Tab.1to-gether with the derived means.The same series ξwas used for all these global parameters to ensure that the parameters in one group can match each other,i.e.,the group with larger rupture area will have larger length.Note that rupture area S has an inversely proportional trend with D (according to the concept of seismic mo-ment,0M SD μ=),therefore X σshould be multiplied by –1when Eq.(3)was employed for D to ensure that the group with larger S can have smaller D .In addition,W should be obtained from dividing S by L instead of us-ing Eq.(3)because Wis limited by the regional thickness of seismogenic zone,W may not reach some large value generated by Eq.(3)if W is treated as a variable too.Meanwhile,this operation can avoid the inequality be-tween S and the product of L and W from treating S ,L and W all as random variables.The similar operation was also taken when computing the width of asperity.Second,the local source parameters for the 30fault models were computed in turn.The corresponding rela-tions and deviations were specified in Tab.2[16],and Eq.(3)was also employed for each local source parame-ter,but this time,n should be 1.The mean of each local source parameter is not listed because it is not a fixed value.The mean of local source parameters depends on the corresponding global parameters in the same group.The blanks in the column of σmean that no deviation is available for these parameters because there is no empiri-cal relation [16].These parameters need to be computed based on other parameters.Particularly,the dimension and location of the other asperity were simply determined by those of the maximum asperity with a random number ζuniformly distributed in (0,1).The slip distributions in the 30fault models can then be generated by the approach mentioned above,as shown in Fig.1,the fault length and fault width are in km.From Fig.1,one can observe the large differences in the 30models.Hence,the acceleration response spectra at three rock stations (LV3,MCN and PCD)from the 30models 2earth uake was taken as an e ample.he target moment and their mean were worked out with a damping constantSUN X iaodan et al:Hybrid Slip Model for Near-Field Ground Motion Estimation Based on Uncertainty of Source Parameters—63—of 5%,as shown in Fig.2.The synthesis was preformed using stochastic finite fault modeling procedure [20].The parameters for synthesis were chosen according to the work of Motazedian and Atkinson [20]and listed in Tab.3.In Fig.2,a large scatter compared to the mean exists at each station,so the mean spectrum actually represents a general level of estimated ground motion.The mean spectrum and the acceleration-time history whose spec-trum fits the mean spectrum best were taken as the input for a seismic analysis.Fig.3shows the comparisons be-tween the mean spectrum,the best-fitted acceleration-time history and the record at each station.Tab.1Relation,mean and deviation of global source parametersGlobal source parameters Relation μσRupture area S/km 2W lg 4.05S M =436.520.29Fault length L /km Wlg 0.5 1.9L M =27.860.18Fault width W/km/W S L =——Average slip on the fault D /cm W lg 0.5 1.35D M =98.86-0.29Corner wave number along strike cx k W lg 1.890.5cx k M =0.0350.18Corner wave number down dip cyk W lg 2.180.5cy k M =0.0680.16Tab.2Relation and deviation of local source parametersLocal source parametersRelation σThe whole area of asperities all S /km 2all lg log 0.67S S =0.16Area of the maximu m asperity m S /km 2m lg log 0.83S S =0.18Area of the other asperity o S /km2o all m S S S =—Length of the maximum as perity m L /km m lg lg 0.44L L=0.15Width of the maximum asperity m W /km m m m /W S L =—Length of the other asperity o L /km o m L L ζ= —Width of the other asperity o W /kmo o o /W S L =—Relative coordinate of the maximum asp erity center along strike m X /km m lg lg 0.53X L =0.18Relative coordinate of the maximum asperity center down dip m Y /km m lg lg 0.3Y W =0.2Relative coordinate of the other asperity center along strike o X /km ()o mm 0.5X LX L ζ=—Relative coordinate of the other asperity center down dip o Y /km o Y W ζ=—Relative coordinate of rupture s tart point along strike s X /k m s lg lg 0.37X L =0.24Relative coordinate of rupture s tart point down dip s Y /km s lg lg 0.09Y W=0.17Average s lip on the maximum asperity m D /cm m lg lg 0.34D D =+0.07Average slip on the other asperity o D /cm o lg lg 0.28D D =+0.06Average slip on the rest area r D /cmm m o o r moD SD S D S D SS S =—Tab.3Parameters for stochastic synthesisParameters ValuesParametersValues Fault orientation strike 122°,dip 40°Kappa0.03Fault depth /km 5Crustal shear-wave velocity/(km s -1)3.7Subfault dimension1km ×1km Crustal density /(g cm –3)2.8()Q f 0.74333f Pulsing area percentage50%Windowing function Saragoni-HartStress drop/MPa 5Geometric s preadingmodel()()()0.51/70km 1/70km 130km 1/130km R R RR R R <<≤≥Local amplificationWestern North Americageneric rock site [21]Transactions of Tianjin University V ol.16No.12010—6—F T y f f f N q 4ig.1h irt inite au lt mod els or the 1994or thr idge ear th u akeSUN X iaodan et al:Hybrid Slip Model for Near-Field Ground Motion Estimation Based on Uncertainty of Source Parameters—65—(a)LV3(b)MCN (c)PCDFig.2Response spectra from 30models and their means at threestations(a)LV3(b)MCN (c)PCDFig.3Mean spectrum,best-fitted acceleration-time history and records at three stations2Optim al finite fault m odelThe best-fitted acceleration-time histories at LV3,MCN and PCD in Fig.3were from different models of the 30fault models.If applying the same approach to a large field with thousands of points,the best-fitted time history at each point will also be from different fault models,this results in the distortion of the spatial pattern of the estimated ground motion field.Therefore,one fi-nite fault model,namely the optimal finite fault model,needs to be chosen to best estimate the general level of the estimated ground motion field.The optimal fault model can be generated by thefollowing process:(1)Choose some trial sites based on the geographic and geological characteristics of the work-ing area and the possible distribution manner of ground motion field,such as the hanging wall,footwall,areas where the rupture propagates forward or backward,and areas where the local site condition is obviously different from its vicinity;(2)Synthesize the ground motions on these trial sites from all finite fault models and then evaluate all the fault models by211(()())(1,2,,300)m kn nij i j i j R ST S T n ====∑∑"(4)where ()i j S T denotes the amplitude at period j of themean response spectrum on trial site i from the 30fault models,while ()ni j S T is that of the response spectrum onTransactions of Tianjin University V ol.16No.12010—66—trial site i from the nth fault model.After Min 12(,,,R R "30)R ,the fault model with the minimum R is the optimal finite fault model.For example,stations LV3,MCN and PCD were taken as trial sites,and the response spectra in Fig.2were used for Eq.(4).Finally,the optimal fault model was determined to be No.13,which is shown in Fig.4.Time-histories from the optimal fault model at the three stations were compared with the observed accelero-grams in Fig.5,in which good agreements can be ob-served at stations LV3and PCD.A small underestima-tion exists at station MCN for periods less than 1s.For longer periods (more than 1s),the response spectra atthe three stations are all overestimated more or less,which may result from the natural discrepancy of sto-chastic synthesis in long period motionsimulation.Fig.4Optimal finite fault model for the 1994Northridgeearthquake(a)LV3(b)MCN (c)PCDFig.5Estimated and observed ground motion at the three stations3ConclusionsIn this paper,a hybrid slip model used to generate finite fault model is presented.Uncertainties of source parameters are taken into account to improve the hybrid slip model.The procedure of the application of the im-proved model is demonstrated based on the 1994North-ridge earthquake.A simple method to choose the optimal fault model in the analysis of ground motion field is pre-sented.Validations at three near-field stations (LV3,MCN and PCD)show satisfactory agreements in the pe-riods of interest,which indicates the accuracy of the im-y The improved model in this paper describes the mul-tiple possibility of the source of a future earthquake,thus the mean ground motion from the improved model repre-sents a general level of the effects from the future earth-quake.The improved model has been successfully ap-plied to two cities of China,Zhangzhou [22]and Lan-zhou [23],and the applications show the availability of the model to the seismic hazard study.Our improvement is just a primary attempt to describe the uncertainty of source.The improvement is still not enough to fully characterize the large uncertainty of source,but it con-tributes an idea to the improvement on source models based on statistical empirical relations.Further studies y f proved h brid slip model and the optimal model.ma ollow these directions:considering more sourceSUN X iaodan et al:Hybrid Slip Model for Near-Field Ground Motion Estimation Based on Uncertainty of Source Parameters—6—parameters such as stress drop,rise time,phase angle and rupture velocity,looking for a better method to choose the optimal finite fault model,or using other source mod-els instead of the hybrid slip model to validate the feasi-bility of the improvement.Acknowledgem entThe authors benefit a lot from the discussion with Dr.Igor Beresnev,Dr.Dariush Motazedian.The proce-dure of ground motion synthesis from Dr.Dariush Mo-tazedian is especially appreciated.Refer ences[1]T ao X X,Anderson J G .Near field strong ground motionsimulation[C].In:Proceedings of ICA NCEER.Harbin,China,2002.[2]Mikuno T,Miyatake T.Dynamical rupture process on athree-dimensional fault with non-uniform frictions and near-field seismic waves[J].Geophys J R A str Soc,1978,54(2):417-438.[3]Andrews D J.A stochastic fault model(Ⅰ):Static case[J].J Geophys Res,1980,85(B7):3867-3877.[4]Andrews D J.A stochastic fault model(Ⅱ):Time-dependent case[J].J Geophys Res,1981,86(B11):10821-10834.[5]Herrero A,Bernard P.A kinematic self-similar ruptureprocess for earthquakes[J].Bull Seism Soc A m,1994,84(4):1216-1228.[6]Bernard P,Herrero A,Berge C.Modeling directivity ofheterogeneous earthquake ruptures[J].Bull Seism Soc A m,1996,86(4):1149-1160.[7]Zeng Y H,Aderson J G ,Guang Y .A composite sourcemodel for computing realistic synthetic strong ground mo-tions reference[J].Geophys Res Lett,1994,21(8):725-728.[8]Olson A H,Apsel R J.Finite faults and inverse theory withapplications to the 1979Imperial Valley earthquake[J].Bull Seism Soc Am,1982,72(6):1969-2001.[9]Harzell S H,Heaton T H.Inversion of strong ground mo-tion and teleseismic waveform data for the fault rupture history of the 1879Imperial V alley,California,earth-quake[J].Bull Seism Soc A m,1983,73(6):1553-1583.[10]Fukuyama E,Irikura K.Rupture progress of the 1983Ja-pan Sea (Akita-Oki)earthquake using a waveform inver-sion method[J].Bull Seism Soc Am,1986,76(6):1623-6[11]T akeo M.An inversion method to analyze the ruptureprocesses of earthquakes using near-field seismograms[J].Bull Seism Soc Am,1987,77(2):490-513.[12]Lay T,Kanamori H.An asperity model of large earthquakesequences[C].In:Earthquake Prediction.An International Review .Symposium on Earthquake Prediction.Washington DC,USA,1981.579-592.[13]T sai P C C.Ground motion modeling for seismic hazardanalysis in the near-source regime:An asperity model[J].Pure A ppl Geophys,1997,149(2):265-297.[14]Somerville P G ,Irikura K,Graves R W et al.Characteriz-ing crustal earthquake slip models for the prediction of strong ground motion[J].Seismic Res Lett,1999,70(1):59-80.[15]Hisade Y .A theoretical Omega-square model consideringthe spatial variation in slip and rupture velocity.(Part 2):Case for a two-dimensional source model[J].Bull Seism Soc A m,2001,91(4):651-666.[16]W ang Haiyun.Finite Fault Model Source Model for Pre-dicting Near-Field Strong Ground Motion[D].Harbin In-stitute of Engineering Mechanics,China Earthquake Ad-ministration,2004(in Chinese).[17]Gallovic F,Brokesove J.On strong ground motion synthe-sis with k -2slip distributions[J].J Seismo,2004,8(2):211-224.[18]http://peer.berkeley .edu/products/nga_flatfiles_dev.html.2006.[19]W ald D J,Heaton T H,Hudnut K W.The slip history of the1994Northridge,California,earthquake determined from strong-motion,teleseismic,GPS and leveling data[J].Bull Seism Soc A m,1996,86(1):S49-S70.[20]Motazedian D,Atkinson G M.Stochastic finite-fault mod-eling based on a dynamic corner frequency[J].Bull Seism Soc A m,2005,95(3):995-1010.[21]Boore D M,Joyner W B.Site amplifications for genericrock sites[J].Bull SeismSoc Am,1997,87(2):327-341.[22]T ao Xiaxin,Sun Xiaodan.Prediction of Strong GroundMotion of Zhangzhou Basin and Its V icinity Caused by a W M 6.0Strong Earthquake on the Jiulongjiang Fault[R].Harbin Institute of T echnology,Harbin,China,2007(in Chinese).[23]T ao Xiaxin,Sun Xiaodan.Seismic Hazard Assessment ofA ctive F aults in Lanz hou City[R].Harbin Institute ofT echnology,Harbin,2007(in Chinese).7140.。
POWERDENSITY功率密度计算
POWERDENSITY功率密度计算POWER DENSITYRadio Frequency (RF) propagation is defined as the travel of electromagnetic waves through or along a medium. For RF propagation between approximately 100 MHz and 10 GHz, radio waves travel very much as they do in free space and travel in a direct line of sight. There is a very slight difference in the dielectric constants of space and air. The dielectric constant of space is one. The dielectric constant of air at sea level is 1.000536. In all but the highest precision calculations, the slight difference is neglected.From chapter 3, Antennas, an isotropic radiator is a theoretical, lossless, omnidirectional (spherical) antenna. That is, it radiates uniformly in all directions. The power of a transmitter that is radiated from an isotropic antenna will have a uniform power density (power per unit area) in all directions. The power density at any distance from an isotropic antenna is simply the transmitter power divided by the surface area of a sphere (4πR2) at that distance. The surface area of the sphere increases by the square of the radius, therefore the power density, P D, (watts/square meter) decreases by the square of the radius.[1]P t is either peak or average power depending on how PD is to be specified.Radars use directional antennas to channel most of the radiated power in a particular direction. The Gain (G) of an antenna is the ratio of power radiated in the desired direction as compared to the power radiated from an isotropic antenna, or:The power density at a distant point from a radar with an antenna gain of G t is the power density from an isotropic antenna multiplied by the radar antenna gain. Power density from radar, [2]Pt is either peak or average power depending on how PD is to be specified.Another commonly used term is effective radiated power (ERP), and is defined as: ERP = P t G tA receiving antenna captures a portion of this power determined by it's effective capture Area (A e). The received power available at the antenna terminals is the power density times the effective capture area (A e) of the receiving antenna.e.g. If the power density at a specified range is one microwatt per square meter and the antenna's effective capture area is onesquare meter then the power captured by the antenna is one microwatt.毫⽶波太赫兹功率计产品:sales@,135 **** ****.For a given receiver antenna size the capture area is constant no matter how far it is from the transmitter, as illustrated in Figure 1. Also notice from Figure 1 that the received signal power decreases by 1/4 (6 dB) as the distance doubles. This is due to the R2 term in the denominator of equation [2].Sample Power Density Calculation - Far Field (Refer to Section 3-5 for the definition of near field and far field)Calculate the power density at 100 feet for 100 watts transmitted through an antenna with a gain of 10.Given: P t = 100 watts G t = 10 (dimensionless ratio) R = 100 ftThis equation produces power density in watts per square range unit.For safety (radiation hazard) and EMI calculations, power density is usually expressed in milliwatts per square cm. That's nothing more than converting the power and range to the proper units.100 watts = 1 x 102 watts = 1 x 105 mW100 feet = 30.4785 meters = 3047.85 cm.However, antenna gain is almost always given in dB, not as a ratio. It's then often easier to express ERP in dBm.ERP (dBm) = P t (dBm) + G t (dB) = 50 + 10 = 60 dBmTo reduce calculations, the graph in Figure 2 can be used. It gives ERP in dBm, range in feet and power density in mW/cm2. Follow the scale A line for an ERP of 60 dBm to the point where it intersects the 100 foot range scale. Read the power density directly from the A-scale x-axis as 0.0086 mW/cm2 (confirming our earliercalculations).Figure 2. Power Density vs Range and ERPExample 2When antenna gain and power (or ERP) are given in dB and dBm, it's necessary to convert back to ratios in order to perform the calculation given in equation [2]. Use the same values as in example 1 except for antenna gain.Suppose the antenna gain is given as 15 dB: G t (dB) = 10 Log (G t)Follow the 65 dBm (extrapolated) ERP line and verify this result on the A-scale X-axis.Example 3 - Sample Real Life ProblemAssume we are trying to determine if a jammer will damage the circuitry of a missile carried onboard an aircraft and we cannot perform an actual measurement. Refer to the diagram at the right.Given the following:Jammer power: 500 W (P t = 500)Jammer line loss and antenna gain:3 dB (G t = 2)Missile antenna diameter: 10 inMissile antenna gain: UnknownMissile limiter protection (maximum antenna power input): 20 dBm (100mW) average and peak.The power density at the missile antenna caused by the jammer is computed as follows:The maximum input power actually received by the missile is either:P r = P D A e (if effective antenna area is known) orP r = P D G mλ / 4π (if missile antenna gain is known)To cover the case where the missile antenna gain is not known, first assume an aperture efficiency of 0.7 for the missile antenna (typical). Then:P r = P D Aη = 8.56 W/m2 (π)[ (10/2 in)(.0254 m/in)]2 (0.7) = 0.3 wattsDepending upon missile antenna efficiency, we can see that the power received will be about 3 times the maximum allowable and that either better limiter circuitry may be required in the missile or a new location is needed for the missile or jammer. Of course if the antenna efficiency is 0.23 or less, then the power will not damage the missile's receiver.If the missile gain were known to be 25 dB, then a more accurate calculation could be performed. Using the given gain of the missile (25 dB= numeric gain of 316), and assuming operation at 10 GHz (λ = .03m)P r = P D G mλ2 / 4π = 8.56 W/m (316)(.03) / 4π = .19 watts (still double the allowable tolerance。
计量经济学中英文词汇对照
Controlled experiments Conventional depth Convolution Corrected factor Corrected mean Correction coefficient Correctness Correlation coefficient Correlation index Correspondence Counting Counts Covaห้องสมุดไป่ตู้iance Covariant Cox Regression Criteria for fitting Criteria of least squares Critical ratio Critical region Critical value
Asymmetric distribution Asymptotic bias Asymptotic efficiency Asymptotic variance Attributable risk Attribute data Attribution Autocorrelation Autocorrelation of residuals Average Average confidence interval length Average growth rate BBB Bar chart Bar graph Base period Bayes' theorem Bell-shaped curve Bernoulli distribution Best-trim estimator Bias Binary logistic regression Binomial distribution Bisquare Bivariate Correlate Bivariate normal distribution Bivariate normal population Biweight interval Biweight M-estimator Block BMDP(Biomedical computer programs) Boxplots Breakdown bound CCC Canonical correlation Caption Case-control study Categorical variable Catenary Cauchy distribution Cause-and-effect relationship Cell Censoring
MM fiber
Traditional LED “LED” mode FP sub-threshold SLED FP Laser VCSEL
Coupled Power Ratio Testing
CPR Categories
NOTES:
•The source category for network applications can be very different from the category that is best for switch production.
How Many Modes?
Total Number of Modes, Nm: Nm = V2/2 Step Index Fiber Nm = V2/4 Graded Index Fiber
Number of Mode Groups, Ng (All modes in a group have same propagation constant):
•Under filled can reduce modal dispersion for networks. •Overfilled sources will support best switch productions due to higher alignment sensitivity. (see next slide)
Typical MM Fiber Specifications
MM Fibers with Different Sources
Overfilled Launch (LED)
•Power distributed over entire fiber core •Limited Bandwidth due to high Modal Dispersion and Chromatic Dispersion
Sound,structures,andtheirinteraction
Sound, Structures, and Their InteractionMiguel C. Junger and David FeitPublished in 1993; Originally Published in 1972CONTENTSPreface to the Second Edition1. Statement of the Problem1.1 Introduction1.2 Assumptions1.3 Formulation of the Structural Response1.4 Formulation of the Acoustic Pressure Field1.5 The Integral Equation of the Structure-FluidInteraction1.6 Historical Development of Structural Acoustics2. The Wave Equation and Its Elementary Solutions 2.1 Coupled Space and Time Dependence of Sound 2.2 The One-Dimensional Wave Equation for PlaneWaves2.3 Harmonic Time Variation2.4 Steady-State Plane Waves2.5 The Three-Dimensional Wave Equation2.6 The Uniformly Pulsating Spherical Source2.7 Specific Acoustic Impedance of Spherical Waves 2.8 The Pressure Field Inside a Fluid-FilledPulsatingSphere2.9 An Elementary Interaction Problem: Liquid- Filled ElasticWaveguides2.10 Cylindrical Waveguides: An Introduction toTwo-Dimensional Pressure Fields3. Applications of the Elementary Acoustic Solutions 3.1 Introduction3.2 The Point Source3.3 Rigid and "Pressure-Release" Boundaries3.4 The Image Source Simulating a RigidBoundary;Directivity3.5 The "Pressure-Release" Boundary3.6 Linear Arrays of Point Sources3.7 Far-Field Conditions3.8 Acoustic Power and Intensity3.9 The Pulsating Gas Bubble3.10 Dispersion and Attenuation: SoundPropagation in Bubble Swarms4. The Pressure Field of Arbitrary Source Configurations4.1 General Formulation of the Radiation Problem4.2 The Free-Space Green's Function4.3 The Helmholtz Integral Equation4.4 The Sommerfeld Radiation Condition4.5 Physical Interpretation of the Helmholtz Integral 4.6 Approaches to the Solution of the HelmholtzIntegral Equation4.7 Analytical Solution of the Helmholtz IntegralEquation4.8 Rayleigh's Formula for Planar Sources4.9 The Scattered Field5. Planar Sound Radiators5.1 Source Geometry and Analytical Formulations 5.2 Pressure Field of the Circular Piston UsingRayleigh's Formulation5.3 The Transform Formulation of AxisymmetricPressureFields5.4 The Transform Solution of the Circular Piston 5.5 The Far-Field of Rectangular RadiatorsEvaluated by Rayleigh's Formula; the Rigid Piston5.6 The Transform Solution of Rectangular Sound Radiators5.7 Equivalence of Rayleigh's and the Stationary-Phase Formulations of the Far-Field5.8 The Far-Field of Rectangular RadiatorsDisplaying a Sinusoidal AccelerationDistribution5.9 Physical Interpretation of This Solution;Coincidence5.10 Other Standing-Wave Configurations ofRectangularRadiators5.11 The Infinite Planar Radiator with a SinusoidalAcceleration Distribution5.12 The Radiating Strip of Infinite Length and Finite Width5.13 Acoustic Resistance of Circular Pistons andof Surface-Radiating Rectangular SourceConfigurations with Sinusoidal Acceleration Distributions5.14 Acoustic Resistance of Edge-RadiatingRectangular Source Configurations withSinusoidal Acceleration Distributions5.15 The Resistance of Corner-RadiatingRectangular Source Configurations withSinusoidal Source Configurations6. Convex Sound Radiators6.1 Characteristics of Convex Boundaries6.2 The Green's Function for the SphericalRadiator6.3 The Pressure Field of a Spherical Radiator6.4 Circular Piston and Point Sources on aSpherical Baffle6.5 The Radiation Loading of Spherical Radiators 6.6 Concentrated Force Applied to the AcousticMedium6.7 Cylindrical Radiators with Spatially PeriodicConfigurations6.8 Radiation Loading of Infinite Cylinders withStanding-WaveConfigurations6.9 Transform Formulation of the Pressure Fieldof Cylindrical Radiators6.10 Stationary-Phase Approximation to the Far-Field of Cylindrical Radiators6.11 Piston in a Cylindrical Baffle6.12 Far-Field of Cylinders with Standing-WaveConfigurations of Finite Axial Extent6.13 Comparison of Planar and CylindricalStanding-Wave Radiators; Specific AcousticResistance6.14 Nodal Planes and Acoustic Intensity in a Three-Dimensional Pressure Field6.15 Far-Field of Slender Bodies of Revolution7. Vibration of Beams, Plates, and Shells7.1 Introduction7.2 Longitudinal Vibrations of an Elastic Bar7.3 Flexural Vibrations in an Elastic Bar7.4 Group Velocity7.5 Rotatory Inertia and Transverse Shear Effects:Timoshenko Beam Equation7.6 Forced Vibrations of an Infinite Elastic Beam7.7 Vibrations of a Finite Elastic Beam7.8 Flexural Vibrations of Thin Elastic Plates7.9 Point Excitation of an Infinite Plate7.10 Flexural Vibrations of Finite Elastic Plates7.11 Thick-Plate Theory; Timoshenko-Mindlin Plate Theory7.12 Introduction to the in Vacuo Vibration of Shells 7.13 Equations of Motion for Cylindrical Shells7.14 Planar Vibrations of a Thin Cylindrical Shell7.15 Forced Planar Vibrations of a Cylindrical Shell 7.16 Nonplanar Vibrations of a Cylindrical Shell7.17 Spherical Shells; Equations of Motion7.18 Free Axisymmetric Nontorsional Vibrations ofa Spherical Shell7.19 Forced Vibrations of a Spherical Shell8. Sound Radiation from Submerged Plates8.1 Coincidence Frequency8.2 Phase Velocity of Flexural Waves in aSubmerged Plate8.3 Effectively Infinite Locally Excited Plates8.3.1 The Plate Response8.3.2 The Pressure Field in Response to aPoint Force8.3.3 Pressure Maximum; Effect of StructuralDamping8.4 Infinite Line-Driven Elastic Plate8.4.1 The Plate Response to a Line Force8.4.2 Response Green's function for a Line- LoadedPlate8.4.3 Scattering of Flexural Wave by a Plate Discontinuity8.5 Pressure and Power Radiated by an InfinitePlate Driven by Distributed Loads8.5.1 Transform Solutions8.5.2 Examples of Load Distributions8.6 Power Radiated by Plates8.7 Sound Radiation from Rectangular Plates8.7.1 Plate Response8.7.2 Far-Field Sound Pressure8.8 Low-impedance Layers 9. Sound Radiation by Shells at Low and MiddleFrequencies9.1 Introduction9.2 Characteristic Equation of the SubmergedSpherical Shell9.3 Natural Frequencies, Modal Configurations,and Radiation Damping of SubmergedSphericalShells9.4 Response and Pressure Field of Point-ExcitedSubmerged Spherical Shells9.5 Normal Modes of Fluid-Filled Spherical Shells 9.6 Normal Modes of the Infinite, SubmergedCylindrical Shell9.7 Natural Frequencies of Infinite SubmergedCylindricalShells9.8 Intermodal Fluid Coupling in the SubmergedFinite Cylindrical Shell9.9 Approximations to the Radiation Loading ofFinite Cylindrical Shells9.10 The Far-Field of Point-Excited Cylindrical Shells9.10.1 The Simply Supported Shell9.10.2 Interpretation of the Far-Field Results9.10.3 Low-Frequency Sound Radiation byFree-Free Cylindrical Shells9.10.4 Low-Frequency Sound Field of FreelyFloating Noncylindrical Shells ofRevolution9.11 The Effect of Structural Damping on SoundRadiation9.12 Uncoupled Modes in a Submerged Structure10. Scattering of Sound by Rigid Boundaries10.1 Scattering and Echo Formation10.2 Formulation of the Scattering Problem10.3 The Infinite Plane Reflector10.4 The Spherical Scatterer10.5 The Infinite Cylindrical Scatterer10.6 The Cylindrical Scatterer of Finite Length10.7 Asymptotic Formulation of the Scattered Field ofSlender Bodies of Revolution10.8 Nature of the Kirchhoff Approximation; Surface Pressure10.9 Kirchhoff Scattering from Cylinders andSpheres; Fresnel Zones10.10 Reflection form a Rectangular Baffle10.11 The Helmholtz Reciprocity Principle11. Elastic Scatterers and Waveguides11.1 The Effect of Scatterer Elasticity11.2 Sound Reflection by an Infinite Elastic Plate 11.3 Sound Transmission through an Infinite Elastic Plate11.4 Sound Transmission through Finite Plates;Reciprocity11.5 The Spherical Shell as an Acoustic Scatterer 11.6 The Scattering Action of the "Pressure-Release"Sphere11.7 Structure-Acoustic Medium ReciprocityRelation Illustrated for the Spherical Shell 11.8 Rayleigh Scattering by Compressible,Movable Spheres11.9 Extension of the Rayleigh ScatteringFormulation to Slender Bodies of Revolution 11.10 The Cylindrical Shell as a Scatterer11.11 Sound Sources Located on an Elastic Baffle11.11.1 Sound Source Located on a PlanarElasticBaffle11.11.2 Sources on Elastic Spherical andCylindricalBaffles11.12 Sound Propagation in Fluid-Filled ElasticWaveguides11.12.1 Dispersion Relations for CylindricalWaveguides11.12.2 Elastic Cylindrical Hoses and Shells as Waveguides11.12.3 Modal Amplitudes and Impedance in Waveguides 12. High-Frequency Formulation of Acoustic and Structural Vibration Problems12.1 Watson's Creeping Wave Formulation of theDiffracted Field12.2 Point Source on a Rigid Spherical Baffle12.3 High-Frequency Response of a Spherical Shell 12.4 The Point-Excited Spherical Shell in Vacuo 12.5 The Submerged Spherical Shell12.6 The Point Source on a Cylindrical Surface 12.7 Cylindrical Shells12.7.1 Cylindrical Shell in Vacuo12.8 Pressure Radiated by a Point-ExcitedCylindrical Shell12.9 Spherical Shell Radiated FieldGlossaryIndexErrataPreface to the Second EditionLike the 1972 (first) edition, this text is intended for the applied physicist and engineer acquainted with the mathematical tools found in graduate textbooks. A familiarity with elementary theory of vibrations and strength of materials is desirable. No prior acquaintance with acoustics is expected from the reader.The primary difference between this book and more familiar texts is the space assigned to the effect of radiation loading exerted by the ambient fluid on the vibrations of elastic structures and the resulting modification of radiated and scattered pressures. Unlike the standard modern acoustic texts, this book returns to the tradition of Raleigh's Theory of Sound by covering the vibrations of elastic shells. The presentation of plate vibrations includes the Timoshenko-Mindlin correction required to generate meaningful high frequency results. The chapters dealing with acoustics are self-contained. They address primarily sound radiation and scattering, to the exclusion of numerical solutions, statistical techniques, and consequently flow-related phenomena and other broad-band excitations.Even though the original title has been retained as being still appropriate to the material covered, there are substantial differences from the 1972 edition. To retain the manageable size of the original edition, the theories of plates and shells have been combined into a single chapter and the chapter dealing with acoustic transients has been dropped. There is an increased emphasis on asymptotic solutions. Acoustics in the first edition was limited to rigorously tractable geometries: the plane, the cylinder, and the sphere. Had we wanted to discuss radiation and scattering by slender bodies of revolution, we would have had to use prolate spheroidal wave harmonics where applicable, and for nonspheroidal geometries we would have referred readers to papers using numerical methods. These configurations are covered in this new edition, but in preference to rigorous formulations, the pressure fields are computed asymptotically by means of simple mathematical models that are solvable in terms of familiar cylinder functions. The chapter on sound radiation by submerged plates has been extensively rewritten to incorporate some of the new results in this area developed over the past decade--in particular, a closer examination of the near-field, the effect of stiffeners and compliant layers, and the relation of load distribution to far-field directivity and acoustic power. The more concise analytical treatment of sound radiation by simply supported cylindrical shells has been supplemented with a study of low-frequency radiation by free-floating, not necessarily cylindrical shells of revolution. Other new subjects covered in this second edition are the acoustics of bubble swarms, the propagation of sound waves in elastic pipes, and the insertion loss of finite panels. Both Rayleigh and Kirchhoff scattering receive more extensive treatment. Sound radiation by a source placed in a planar elastic baffle is used to illustrate the reciprocity principle, which is then used to analyze the far-field of sources located on elastic spherical and cylindrical baffles. The introductory chapter has been supplemented with a historical review of the development of structural acoustics.Except for the extensive bibliography associated with that historical section, references listed at the end of each chapter are intended to supplement the material in this text either by providing the point of departure for the analysis presented here or by extending the analysis to areas not covered. Since, with the exception of the mathematical foundation, the development is relatively self-contained (the required knowledge of acoustics and theory of structures being derived or restated in the text), the references cited at the outset of an analysis are primarily mathematical in nature, thus sparing the reader the task of correlating the notations used in different texts on acoustics and plate and shell theory.While our main goal is to present the underlying theories, we illustrate their application by means of problems selected for their practical interest. We hope to provide readers with the analytical tools for studying practical problems of interest to them. If an apology is needed for not having included those particular problems, we gladly accept the reproach that Shakespeare has Hamlet address to Horatio: "There are more things on heaven and earth, Horatio, than are dreamt of in your philosophy."We are happy to acknowledge the moral and financial support of individuals and agencies within the U.S. Navy that enabled us to generate much of the material that is not part of the acoustician's stock in trade. Finally, it is with pleasure that we acknowledge the consistent helpfulness and patience displayed by our respective coworkers: J.M. Garrelick, J.E. Cole, III, and Rudolph Martinez at Cambridge Acoustical Associates, Inc., and numerous staff members at the David W. Taylor Naval Ship Research and Development Center.Miguel C. Junger, Cambridge, MassachusettsDavid Feit, Bethesda, MarylandSeptember 1985© Acoustical Society of America。
准远场天线测量修正方法研究
2020年6月第40卷 第3期宇航计测技术JournalofAstronauticMetrologyandMeasurementJun ,2020Vol 40,No 3文章编号:1000-7202(2020)03-0051-05DOI:10.12060/j issn.1000-7202.2020.03.11准远场天线测量修正方法研究邝浩欣1 王晓飞1 栗 曦2 陈海英1 蔡洪伟1(1.北京航天长征飞行器研究所,北京100076;2.西安电子科技大学天线与电磁散射研究所,陕西西安710071)摘 要 远场测量是获得天线辐射特性的一种常用方法。
然而对于一维电尺寸大,另一维电尺寸小的天线,如基站天线,由于场地因素的限制,往往不能满足远场测量条件,用近场测量又费时费力。
在这种准远场条件下,天线测量结果与远场情况下的测量结果有较大差异。
本文基于柱面波展开,给出了一种由准远场距离上测得的方向图计算远场的理论计算方法,经过该算法补偿后的结果与理论计算结果吻合很好,从而验证了算法的正确性。
关键词 天线测量 基站天线 准远场 修正算法中图分类号:TN820文件标识码:AResearchonCorrectionMethodofQuasi far fieldAntennaTestKUANGHao xin1 WANGXiao fei1 LIXi2 CHENHai ying1 CAIHong wei1(1.BeijingInstituteofSpaceLongMarchVehicle,Beijing100076,China;2.KeyLaboratoryofAntennasandMicrowaveTechnology,XidianUniversity,Xi’an710071,China)Abstract Far fieldantennameasurementisacommonmethodtoobtainantennaradiationcharacteristics.However,fortheantennawithlargeonedimensionandsmallonedimension,suchasthebasestationantenna,itisoftenunabletomeetthefar fieldtestconditionsduetothelimitationofsitefactors,andthenear fieldmeasurementistime consumingandlaborious.InthisQuasi far fieldcondition,theantennatestresultsarequitedifferentfromthoseinthefar fieldcondition.Thispaperpresentsatheoreticalcalculationmethodforcalculatingthefar fieldpatternfromthepatternmeasuredonthedistanceoftheQuasi farfieldbasedoncylindricalwaveexpansion.Theresultsofthealgorithmareingoodagreementwiththeresultsofthetheoreticalcalculation,andthecorrectnessofthealgorithmisverified.Keywords Antennatest Basestationantenna Quasi farfield Correctionalgorithm收稿日期:2020-04-30,修回日期:2020-06-11作者简介:邝浩欣(1978.12-),男,高级工程师,硕士,主要研究方向:微波实验及天线测量技术。
568-B铜缆双绞线6类标准
test specifications defined in the most recent draft of the ―Transmission Performance Specifications for 4-pair 100 ? Category 6 Cabling‖ under development by the Telecommunications Industry Association (TIA). At the time of this writing, PN-3727 TIA/EIA Draft Standard – Draft 7, dated August 23, 2000 represents the most recent version. This document will be referred to as the ―TIA Cat 6 Draft Standard.‖ 2. The installed twisted-pair horizontal links shall be tested from the IDF in the telecommunications room to the telecommunication wall outlet in the work area against the ―Permanent Link ‖ performance limits specification as defined in the TIA Cat 6 Draft Standard. 3. 100% of the installed cabling links must be tested and must pass the requirements of the standards mentioned in I.A.2 above and as further detailed in Section I.B. Any failing link must be diagnosed and corrected. The corrective action shall be followed with a new test to prove that the corrected link meets the performance requirements. The final and passing result of the tests for all links shall be provided in the test results documentation in accordance with Section I.C below. 4. Trained technicians who have successfully attended an appropriate training program and have obtained a certificate as proof thereof shall execute the tests. Appropriate training programs include but are not limited to installation certification programs provided by BiCSi or the ACP (Association of Cabling Professionals). 5. The test equipment (tester) shall comply with the accuracy requirements for the proposed level III field testers as defined in the TIA Cat 6 Draft Document. The tester including the appropriate interface adapter must meet the specified accuracy requirements. The accuracy requirements for the permanent link test configuration (baseline accuracy plus adapter contribution) are specified in Table B.2 of Annex B of the TIA Cat 6 Draft Standard. (Table B.3 in this TIA document specifies the accuracy requirements for the Channel configuration.) 6. The tester shall be within the calibration period recommended by the vendor in order to achieve the vendor-specified measurement accuracy. 7. The tester interface adapters must be of high quality and the cable shall not show any twisting or kinking resulting from coiling and storing of the tester interface adapters. In order to deliver optimum accuracy, preference is given to a permanent link interface adapter for the tester that can be calibrated to extend the reference plane of the Return Loss measurement to the permanent link interface. The contractor shall provide proof that the interface has been calibrated within the
异物致损高速铁路车轴的缺陷演化及疲劳性能评估
Outlines
➢ External damages in railway axles √ ➢ FOD preparation for alloy steel axles ➢ Results and discussions
► Experiments ► Simulations
➢ Summary and on-going works
Southwest Jiaotong University
异物致损高速铁路车轴的缺陷演化及 疲劳性能评估
吴圣川 研究员
State Key Laboratory of Traction Power Southwest Jiaotong University, Chengdu, China
SELF-ASSESSMENT REPORT FOR THE ASSESSMENT OF UNDERGRADUATE TEACHING
Typical shapes from rotated solid cube during flying process are acquired at
the same flying speed SELF-ASSESSMENT REPORT FOR THE ASSESSMENT OF UNDERGRADUATE TEACHING
Smooth specimens
Experimental mode
ε
β
Clot
Rotating bending
0.863
0.90
1
SELF-ASTSrEaSSnMsEfNeTraRbEPilOiRtyT FbOeRtTwHEeAeSnSEsScSaMlEeNdT sOpF eUcNiDmEReGnRsADaUnAdTEfTuElAl-CsHcINaGle axle
电磁场分析仪EHP-200A EHP-200AC说明书
EHP200A/AC-BEN-01002Subject to change without notice1Powerful receiver for selective and widebandmeasurements in all 3 spatial directions Isotropic measurementsin the 9 kHz to 30 MHz range EHP-200Ain the 3 kHz to 30 MHz range EHP-200AC Electric Fieldsfrom 0.02 to 1000 V/mMagnetic Fieldsfrom 0.6 mA/m to 300 A/m EHP-200Afrom 6 mA/m to 1000 A/m EHP-200AC Built-in Frequency Spectrum Analysis Built-in rechargeable Li-Ion batteryOptical interface for remote control and result display avoids distortion of the field under testControl and display using a PC or the 8053 DISPLAY Broadband Field MeterSelective and broadbandhigh frequency field analysisProvided by: (800)404-ATECAdvanced Test Equipment Corp .®Rentals • Sales • Calibration • ServiceEHP200A/AC-BEN-01002Subject to change without notice2The E-H field analyzer EHP-200 was designed for accurate isotropic measurements of both electric and magnetic fields in the 3 kHz - 30 MHz frequency range,with no or minimum perturbation of the fields to be measured.Field sensors and electronic measuring circuitry are fitted into robust housing,only 92 x 92 x 109 mm in size.Separate 3 axis and total values (actual and average)are measured with exceptional flatness and linearity of 0.5 dB. Results are expressed in V/m, A/m, μT, mW/cm2,mG, W/m2, Ohm, % (percentage of the selected limit).When the auxiliary input is selected measurement results are expressed in mV or dBm.The EHP-200 features built-in spectrum analysis with maximum BW resolution of 1 kHz for detailed measurements of E and H field intensity vs. frequency,with dynamic range of 80 dB. The built-in rechargeable Li-Ion battery provides up to 12 hours of continuous operation.The EHP-200 is controlled by the PC through the optical fibre link, and measurements are displayed in real time. Additional input is available to measure the frequency spectrum of external signals.APPLICATIONSSafety in occupational environmentsAccording to several safety regulations worker exposure should not exceed specified limits.Emission from several industrial machines operating in the high frequency range could be potentially dangerous to the operator.In the near field region near that kind of apparatusaccurate measurements of both electric and magnetic fields should be taken to demonstrate compliance to safety standards.EHP-200, equipped with both electric and magnetic field sensors within a small housing, is the ideal solution to perform accurate measurements and spectrum analysis.Broadcasting SurveillanceThe EHP-200 is particularly useful in measuring the actual fields generated by long, medium and short wave broadcast transmitters, to ensure safety around the sites of large antennas, to control power transmitted in the radiation direction, to test transmitting antenna functions and identify borders between near and far field regions.Wave impedanceAs a unique feature, the PC program calculates field wave impedance by dividing the total value of the E-field by that of the H-field. This method is particularly suitable for evaluating the non-linear, scattered near-field region of large broadcast antenna systems.Fields generated by metal detectors and RFID’s Fields generated by a number of devices using RF todetect the presence of metals, to identify objects, anti-theft systems etc. can now be measured easily and accurately.E&H FIELD ANALYZEREHP200-TS APPLICATION SOFTWAREThe developed EHP200-TS software allows theuser to control analyzers such as EHP-200 through a personal computer. The optical cable coming from the analyzer (Max lenght: 40m) can be easily connected tothe PC by the provided optical to USB converter USB-OC. If longer distance is required the optional 8053-OCoptical to RS232 converter can be used for optical fibrelength up to 80m.A user friendly graphical interface includes commands toset all parameters.For intuitive operation, controls are grouped in fiveselectable sections while the spectrum measurement is continuously displayed and updated. Both electric and magnetic field spectrum measurements can be displayed on the same graph.Sweep, Mode, Limit and Appearance sections are usedto set all measurement and display parameters while Data section, with the Marker controls, shows numerical results like field strength and frequency at the marker and highest peak positions.A wideband measurement is displayed too, including all contributions within the spectrum shown.Several units, as well as percentage of limit, can be selected to display measurement results which, along with user comments, can be saved as either bitmap or text files to be easily imported in other software applications like spreadsheets or word processor.Following the so called precautionary principle, many countries adopted their own reference limits. Besides having ICNIRP limits already available, EHP200-TS allows the user to create and save custom limits which may reflect local regulations as well as user specific needs. All values of the selected limit are always included, for reference, in any.bmp or .txt saved file. Availability of lightweight devices equipped with Windows TM operating system like Ultra Mobile PC and similar, makes EHP200-TS software the ideal solution to perform accurate on-site spectrum analysis with minimum effort and light equipment.Limit value can be shown at Marker frequency. Data section shows numerical results. It includes Marker controlsand Save buttonsSpectrum graph can be shown as percentage of selected limit. Mode section allows to select different acquisition modes as well as range, unit and linear or logarithmic frequency scale.Power density spectrum is calculated over real electricand magnetic field measurement and therefore applicableto both far and near field conditions.EHP200A/AC-BEN-01002Subject to change without notice3EHP200A/AC-BEN-01002Subject to change without notice4EHP200A/AC-BEN-01002Subject to change without notice5EHP200A/AC-BEN-01002Subject to change without notice6Names and Logo are registered trademarks of Narda Safety Test Solutions GmbH and L3Harris Technologies, Inc. – Trade names are trademarks of the ownersNarda Safety Test Solutions Srl Via Rimini 2220142 Milano - ITALY Phone: +39 02 581881Fax: +39 02 58188273E-mail:****************************www.narda-sts.itNarda Safety Test Solutions 435 Moreland RoadHauppauge, NY 11788, USA Phone: +1 631 231-1700Fax: +1 631 231-1711********************* Narda Safety Test Solutions GmbH Sandwiesenstrasse 772793 Pfullingen, Germany Phone: +49 (0) 7121-97 32-0**************************Narda Safety Test Solutions GmbH Beijing Representative OfficeXiyuan Hotel, No. 1 Sanlihe Road, Haidian 100044 Beijing, China Phone +86 10 6830 5870********************。
DWYER INSTRUMENTS Series IR2 红外无接触温度计说明书
TheSeries IR2 Infrared Temperature Thermometer allows users to economically take accurate measurements in hard to reach areas.Measurements can be taken at a safe distance with a 12:1 Distance to Target Ratio. The IR2 easily takes measurements within 2% accuracy using a built-in laser sighting. The fixed emissivity of 0.95 is perfect for measuring surface temperatures of concrete, asphalt, rubber, or oxidized metals. Besides reading the process temperature, the back lit display will also read the maximum temperature captured during scan.SPECIFICATIONSMeasurement Range:-76 to 932°F (-60 to 500°C).Accuracy: 2% of reading or 4°F (2°C) whichever is greater.Emissivity:0.95 fixed.Distance to Target:12:1.Resolution:0.1°F/0.1°C.Response Time: 1 sec.Operating Range:32 to 122°F (0 to 50°C).Average Battery Life:180 hours of continuous use, (2) AAA batteries included.Weight: 3.61 oz (179 g).Dimensions: 6.90 x 1.54 x 2.83 in (175.2 x 39.0 x 71.9 mm).OPERATING INSTRUCTIONSSimply aim thermometer at the target and press the “MEAS” key to display the surface temperature.°C or °F: Press the “MODE” key to switch between °F and °C.Backlight: LCD Backlight always on.Laser: Class II Laser: always enable while measuring.Error MessagesThe thermometer incorporates visual diagnostics messages as follows.“Er2”: Displays when the thermometer is exposed to rapid changes in the ambient temperature.“Er3”: Displays when the ambient temperature exceeds 32°F (0°C) or 122°F (50°C). The thermometer should be allowed plenty of time (minimum 30 minutes) to stabilize to the working/room temperature.For all other error messages it is necessary to reset the thermometer. To reset it, turn the instrument off, remove the battery and wait for a minimum of one minute, reinsert the battery and turn it on. If the error message remains please contact the Dwyer Customer Service department for further assistance.Batteries:The thermometer incorporates visual low battery indication as follows.Battery OK:Measurements are possible.Battery Low:Batteryneeds to be replaced, measurements are still possible.Battery Exhausted: Measurements are not possible. When the low battery icon indicates the battery is low, the batteries should be replaced immediately with AAA, 1.5V batteries.Please Note:It is important to turn the thermometer off before replacing the battery otherwise the thermometer may malfunction. Dispose of used battery promptly and keep away from children.CAUTION1.When device is in use, do not look directly into the laser beam - Permanent eye damage may result.e extreme caution when operating the laser.3.Never point the device towards anyone’s eyes.4.Keep out of reach of all children.EMC/RFIReadings may be affected if the unit is operated within radio frequency electromagnetic field strength of approximately 3 volts per meter, but the performance of the instrument will not be permanently affected. ** Note:under the electromagnetic field of 3V/m from 350 to 550 MHz, the maximum error is 14.4°F (8°C).MAINTENANCEA periodic check of the system calibration is recommended. The Series IR2 is not field serviceable and should be returned if repair is needed (field repair should not be attempted and may void warranty). Be sure to include a brief description of the problem plus any relevant application notes. Contact customer service to receive a return goods authorization number before shipping.Storage and CleaningThe sensor lens is the most delicate part of the thermometer. The lens should be kept clean at all times, care should be taken when cleaning the lens using only a soft cloth or cotton swab with water or medical alcohol.Allowing the lens to fully dry before using the thermometer. Do not submerge any part of the thermometer. The thermometer should be stored at room temperature between -4 and 149ºF (-20 to 65ºC).page 2©Copyright 2014 Dwyer Instruments, Inc.Printed in U.S.A. 5/14FR # R7-443519-00 Rev.2。
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The Limit of Nearfield Measurement
Near-field measurement means that we put the microphone very near to the loudspeaker and then do measurement. This kind of measurement gives highest signal to noise ratio since the microphone is very near to the source and the reflected sound and noise can be ignored.
However, loudspeaker is not a point source which radiates sound on a surface. This causes inaccuracy in frequency response measurement at high frequency when Near-field technique is used. Assume a woofer with diameter 12 inch is reproducing a 1 kHz sound. The sound radiated from the middle and the sound radiated from the edge of woofer will travel to the microphone and summed up (see figure 1). As distance d2 is longer than d1, there will be a phase difference between 2 signals. Thus, the amplitude is different from 2 sound wave radiate from a point source. Since different frequency will have different phase shift, the measured frequency response will be distorted.
Figure 1. Sound radiation.
In actual case, there are more than 2 radiating wave and the calculation is more complicated. Here, I would like to derive the equation on the accuracy of Near-field measurement:
- Assume the loudspeaker is a flat, circular non-vibrating plane.
- Assume the radiation loss of all sound waves are the same
- Take the sound wave radiated at the middle as reference signal.
- Assume the microphone is 2 cm in front of the middle of loudspeaker.
time delay = t d = (d2– d1) / v s (1)
d2 = √(r2+d12) (2)
phase shift = p = (2πt d)(frequency of sound) (3)
total received signal power= s1 = 2π∫sin(wt+p)dr (4)
where
p is the phase shift
t d is the time delay
v s is the velocity of sound
w is the frequency of radiated sound
for r, d1 and d2, please see Figure 1.
In ideal case, there should be no phase shift in all radiated sound:
total received signal power in ideal case = s2= 2π∫sin(wt)dr (5)
Then,
Percentage error = (s2 – s1)/ s2 (6)
Where
s1 is the total received signal energy
s2 is the total received signal energy in ideal case
In order to find out the maximum frequency available for Near-field measurement, a MATLAB program was written to calculate the percentage error in measured amplitude at different frequency:
%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%% function [frequency error] = Nearfield(diameter,distance)
clc;
Rmax = diameter/2/100; %radius of loudspeaker
d1 = distance/100; % distance between the mic and loudspeaker in meter
vs = 340; % velocity of sound
frequency = logspace(1,5,300);
error=0;
for k=1:300
t = 0:1/frequency(k)/100:1/frequency(k); %100 sampling point in each frequency
w = 2*pi*frequency(k); %angular frequency of the signal
signal_2 = sin(w*t); %the ideal signal without phase shift
s1=0;s2=0; %initialize s1 and s2
for r=0:0.001:Rmax
td = (sqrt(r^2 + d1^2)-d1)/vs; %time delay
phase = 2*pi*td*frequency(k); %phase shift
signal_1 = sin(w*t - phase); %shifted signal
s1 = s1 + 2*pi*r*signal_1;
s2 = s2 + 2*pi*r*signal_2;
end
error(k) = 100*((rms(s2)-rms(s1))/rms(s2));
end %%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%
Results with different driver’s diameter have been simulated as follow:
Figure 2. Percentage error of sound power with 2 cm driver.
Figure 3. Percentage error of sound power with 4 cm driver.
Figure 4. Percentage error of sound power with 10 cm driver.
Figure 5. Percentage error of sound power with 15 cm driver.
Figure 6. Percentage error of sound power with 20 cm driver.
Figure 7. Percentage error of sound power with 25 cm driver.
Figure 8. Percentage error of sound power with 30 cm driver.
By comparing these figures, we can see that Nearfield measurement introduce more error with increasing driver diameter. As discussed in the first example, if a driver with 12 inch (30 cm) diameter is measured by a microphone which is 2 cm apart from the middle of driver, there will be approximately 11% error in measured power at 1k Hz.
The above figures and MATLAB program can be used to estimate the limit of Nearfield measurement under different situations and requirement.
Author: Alvis Chan
Email: alvischan900@。