pcb英文缩写及术语

Comments:註釋,評論
Supplier:供應商
Customer:客戶
Performance:成績,績效
Support:支持,支援
Call Help:求救,尋求幫助
Important:重要/重大
Document:文件,公文
Human Resources:人力資源
Modify:更改,修改
Agenda:議程
pcb英文缩写及术语
一.企業常用縮寫部分
FCST:預估(Forecast) PO/SO:訂單(Purchase Order/Sales Order) BP:營運計劃(Business Plan) MRP:物料需求規劃 (Material Requirement Planning) PR:採購申請Purchase Request BOM:物料清單 (Bill Of Material) IQC:進料品質管制 (Incoming Quality Control) IPQC:製程品質管制 (In-Process Quality Control) FQC:成品品質管制 (Finish or Final Quality Control) OQC:出貨品質管制 (Out-going Quality Control) QA:品質保證(Quality Assurance) QC:品質管制(Quality Control) QCC:品管圈 (Quality Control Circle)
N. 雷射鑽孔(Laser Drilling) n-1 雷射鑽Tooling孔 (Laser ablation Tooling Hole) n-2 雷射曝光對位孔(Laser Ablation Registration Hole) n-3 雷射Mask製作(Laser Mask) n-4 雷射鑽孔(Laser Ablation) n-5 AOI 檢查及VRS ( AOI Inspection & Verified & Repaired) n-6 Blaser AOI (after Desmear and Microetching) n-7 除膠渣 (Desmear) n-8 微蝕 (Microetching )
B. 鑽孔 (Drilling) b-1 內鑽 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射鑽孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔鑽孔 (Blind & Buried Hole Drilling)
二. 專業術語部分
System:系統
Standard:作業標準/規範
System in:系統化
Design in:設計化
Excursion:突發性異常
Chronic:長期異常
Current Status:現況
Gap Analysis:原因分析
Root Cause:根本原因
Correct Action:糾正措施
h-5 預烤 (Precure) h-6 曝光 (Exposure) h-7 顯影 (Develop) h-8 後烘烤 (Postcure) h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 噴砂 ( Pumice)(Wet Blasting) h-12 印可剝離防焊 (Peelable Solder Mask)
c-7 初檢 ( Touch-up)
c-8 化學前處理,化學研磨 ( Chemical Milling )
c-9 選擇性浸金壓膜 (Selective Gold Dry Film Lamination)
c-10 顯 影(Developing ) c-11 去膜(Stripping )
DES
D. 壓 合 Lamination d-1 黑 化 (Black Oxide Treatment) d-2 微 蝕 (Microetching)
Containment Plan:圍堵措施
Closure Plan:改進措施
Confirm:確認
Review:檢查/審核/檢討
Get Approve:核准
Audit:稽核
Common Sense:常識
Target:目標
Project:專案
Subjec up:趕上
Warning:警告,預先通知
ISO:國際標準組織 (International Organization for Standardization) JIT:即時管理 (Just In Time) PDCA:PDCA管理循環 (Plan-Do-Check-Action) PE:製前(Pre-Process<Front End>) ME:製工(Manufacturing Engineering) PM:生產(Product Manufacturing) PQE:品管(Product Quality Engineer) MA:工務(Maintenance Administrative) SF:平方英尺(Square Feet) G/F:客戶資料(Gerber File),金手指(Gold Finger) PP:膠片(Prepreg) SOP:標準操作程序(Standard Operating Procedure) 5W1H:Who,When,Where,What,Why,How 4M1E:Men,Materiel,Machine,Method,Environment
Defect:缺點
Weekly Report:週報
Monthly Report:月報
Lead Free:無鉛製程
Halogen Free:無鹵素
Run Card:工單
二. 專業術語部分
* Process Module 說明 :
A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料發料 (Panel)(Shear material to Size)
I . 鍍金 Gold plating i-1 金手指鍍鎳金 ( Gold Finger ) i-2 電鍍軟金 (Soft Ni/Au Plating) i-3 浸鎳金 ( Immersion Ni/Au) (Electroless Ni/Au)
J. 噴錫 (Hot Air Solder Leveling) j-1 水平噴錫 (Horizontal Hot Air Solder Leveling) j-2 垂直噴錫 ( Vertical Hot Air Solder Leveling) j-3 超級焊錫 (Super Solder ) j-4 印焊錫突點 (Solder Bump)
Survey:調查/視察
Effective:有效的
Checklist:查檢表
Self-check:自我檢查
Loss Rate:漏失率
Rough:粗略
Detail:詳述,細節
Stack height:疊板高度
Technology Roadmap/Process Ability:製程能力
Summary:總結,概括
L. 短斷路測試 (Electrical Testing/Continuity & Insulation Testing) l-1 AOI 光學檢查 ( AOI Inspection) l-2 VRS 目檢 (Verified & Repaired) l-3 汎用型治具測試 (Universal Tester)
C. 乾膜製程 ( Photo Process(D/F))
c-1 前處理 (Pretreatment)
c-2 壓 膜 (Dry Film Lamination)
c-3 曝 光 (Exposure)
c-4 顯 影 (Developing)
c-5 蝕銅 (Etching)
c-6 去膜 (Stripping)
d-3 鉚釘組合 (eyelet ) d-4 疊板 (Lay up) d-5 壓 合 (Lamination) d-6 後處理 (Post Treatment) d-7 黑氧化 ( Black Oxide Removal ) d-8 銑靶 (spot face) d-9 去溢膠 (resin flush removal)
G. 塞孔 (Plug Hole) g-1 印刷 ( Ink Print ) g-2 預烤 (Precure) g-3 表面刷磨 (Scrub) g-4 後烘烤 (Postcure)
H. 防焊(綠漆): (Solder Mask) h-1 C面印刷 (Printing Top Side) h-2 S面印刷 (Printing Bottom Side) h-3 靜電噴塗 (Spray Coating) h-4 前處理 (Pretreatment)
E. 減銅 (Copper Reduction) e-1 薄化銅(Copper Reduction)
F. 電鍍 (Horizontal Electrolytic Plating) f-1 水平電鍍 (Horizontal Electro-Plating) (Panel Plating) f-2 錫鉛電鍍 ( Tin-Lead Plating ) (Pattern Plating) f-3 低於 1 mil ( Less than 1 mil Thickness ) f-4 高於 1 mil ( More than 1 mil Thickness) f-5 砂帶研磨 (Belt Sanding) f-6 剝錫鉛 ( Tin-Lead Stripping) f-7 微切片 ( Microsection)
l-4 專用治具測試 (Dedicated Tester) l-5 飛針測試 (Flying Probe)
M. 終檢 ( Final Visual Inspection) m-1 壓板翹 ( Warpage Remove) m-2 X-OUT 印刷 (X-Out Marking) m-3 包裝 及出貨 (Packing & shipping) m-4 目檢 ( Visual Inspection) m-5 清洗 及烘烤( Final Clean & Baking) m-6 護銅劑 (ENTEK Cu-106A)(OSP) m-7 離子殘餘量測試 (Ionic Contamination Test /Cleanliness Test) m-8 冷熱衝擊試驗 (Thermal cycling Testing) m-9 焊錫性試驗 ( Solderability Testing )
QIT:品質改善小組(Quality Improvement Team) QE:品質工程(Quality Engineering) SFC:現場控制 (Shop Floor Control) TPM:全面生產管理Total Production Management TQC:全面品質管制 (Total Quality Control) TQM:全面品質管理 (Total Quality Management) WIP:在製品 (Work In Process) P/N:料號(Part Number) PNL:小型版面(Panel) S/M:防焊(Solder Mask) PDM:產品資料管理系統 (Product Data Management) ECD:預計完成日期(Estimate completion Date) SCH:時間表/計劃表(Schedule) KLM:負責人(Key Line Manager) A/W:底片(Artwork)
K. 成型 (Profile)(Form) k-1 撈型 (N/C Routing ) (Milling) k-2 模具沖 (Punch) k-3 板面清洗烘烤 (Cleaning & Backing) k-4 V型槽 ( V-Cut)(V-Scoring) k-5 金手指斜邊 ( Beveling of G/F)
Alarm:警報器
Incoming:進料
Internal Audit:內部稽核
Outside Audit:外部稽核
Evidance:證據
Update/Revise:更新,進版,修訂 Function:功能,職責
二. 專業術語部分
Second Source:第二資源 Cost Down/Reduction:降低成本