LTC6101AIS5中文资料
LTC1867LCGN中文资料
LTC1863L/LTC1867L
WU
DY A IC ACCURACY VDD = 3V, external VREF = 1.25V (Note 5)
SYMBOL THD
PARAMETER Total Harmonic Distortion Peak Harmonic or Spurious Noise Channel-to-Channel Idwidth
, LTC and LT are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
BLOCK DIAGRA
11 CS/CONV
10 VREF
INTERNAL 1.25V REF
9 REFCOMP
1863L7L BD
INL (LSB)
Integral Nonlinearity vs Output Code (LTC1867L)
2.0 VDD = 2.7V
1.5 fSAMPLE = 175ksps
1.0 0.5
Supply Voltage (VDD) ................................... –0.3V to 6V Analog Input Voltage
CH0-CH7/COM (Note 3) .......... – 0.3V to (VDD + 0.3V) VREF, REFCOMP (Note 4)......... – 0.3V to (VDD + 0.3V) Digital Input Voltage (SDI, SCK, CS/CONV) (Note 4) .................................................– 0.3V to 10V Digital Output Voltage (SDO) ....... – 0.3V to (VDD + 0.3V) Power Dissipation .............................................. 500mW Operating Temperature Range LTC1863LC/LTC1867LC/LTC1867LAC .... 0°C to 70°C LTC1863LI/LTC1867LI/LTC1867LAI .. – 40°C to 85°C Storage Temperature Range ................. – 65°C to 150°C Lead Temperature (Soldering, 10 sec).................. 300°C
LT6101 touch key 触摸按键IC datasheet
低功耗触摸按键控制芯片 LT6101C 概述LT6101是一款具有极低功耗的自电容式触摸按键控制芯片。
该芯片采用本公司专利的电容式触摸按键信息检测技术，能够实现非常低的动态功耗和高的触摸信号检测精度，适合于对功耗要求苛刻的电子产品触摸按键应用。
LT6101可以作为外部控制器的从机运行，也可以作为主机独立运行。
作为从机时，芯片在SPI时钟信号同步下工作，以正常按键刷新速率，典型工作电流仅16uA。
作为主机独立运行时，LT6101在内部振荡器产生的时钟信号（也可选择使用外部时钟信号）同步下工作，循环查询各个触摸按键的状态，并在发现了指定触摸事件后，以中断方式激活外部控制器。
主机模式下，使用内部振荡器产生的时钟工作，典型芯片工作电流仅4.5uA；当使用外部时钟输入时，典型工作电流仅1.3uA。
LT6101的主机运行模式，使得触摸按键的查询无需外部控制器的干预，特定触摸事件的识别在芯片内部自动完成，无触摸事件时，外部控制器可进入深度休眠，从而大大节省整个系统功耗。
LT6101内部集成11位逐次逼近型电容量化电路，可以检测到最小9fF触摸按键电容变化量。
芯片支持直接数字化的电容量化结果输出和是否触摸的判定结果输出，主机模式下，支持内部按键信号多次测量滤波。
LT6101支持多种触摸模式中断信号产生，并可灵活调节按键触发的时间长度。
LT6101同时支持最多4按键二进制密码图形中断触发，可以大大减小系统误触发的概率。
LT6101采用QFNWB5X5-32L和QFNWB3X3-16L两种封装。
特点z极低的待机和工作电流（从机模式典型工作电流16uA，主机模式典型工作电流4.5uA和1.3uA）z同时支持主机工作模式和从机工作模式z极高的信号检测精度（最小9fF自电容变化量分辨率）z内置11位逐次逼近型电容量化器z多种方式的触摸事件自动识别及中断触发z支持最多4按键二进制密码图形中断触发z主机触摸事件自动循环查询z工作电压2.7V~5.5V.z可配置offset消除。
LTC3415资料
For more information on lead free part marking, go to: /leadfree/ For more information on tape and reel specifications, go to: /tapeandreel/
SYMBOL
PARAMETER
CONDITIONS
MIN TYP MAX UNITS
SVIN
Signal Input Voltage Range
2.375
5.5
V
VFB
Regulated Feedback Voltage
(Note 3)
l 0.590 0.596 0.602
V
ΔVFB
Reference Voltage Line Regulation
Storage Temperature.............................. –65°C to 125°C
PIN CONFIGURATION
TOP VIEW
CLKOUT RUN PVIN PVIN SVIN ITHM ITH
NC 1 SGND 2 PLLLPF 3
bw6101中文规格书
bw6101中文规格书全文共四篇示例，供您参考第一篇示例：BW6101是一款广泛应用于工业领域的高性能传感器，具有稳定的性能和广泛的适用范围。
该传感器在市场上享有很高的声誉，受到了广大用户的信赖和好评。
以下是对BW6101传感器的详细规格介绍。
一、外观和材质BW6101传感器外观精致，采用高强度金属材质制造，表面经过特殊处理，具有防水、防尘、耐腐蚀的特性。
外壳颜色为黑色，外观设计简洁大方，符合工业产品的实用风格。
二、工作原理BW6101传感器采用先进的电子技术，通过内部的传感器元件对周围环境进行实时监测和分析，能够准确地检测目标物体的位置、速度、温度、压力等参数，并将数据传输至控制系统进行处理。
三、性能参数1. 测量范围：根据不同的应用场景和需求，BW6101传感器的测量范围可在一定范围内进行调整，满足不同工况下的需求。
2. 精度：BW6101传感器具有高精度的测量性能，能够实现对目标物体的精准测量，误差范围小，保证了测量数据的准确性。
3. 响应时间：BW6101传感器响应速度快，能够在极短的时间内对目标物体进行识别和测量，适用于对速度和频率要求较高的应用场景。
4. 工作温度：BW6101传感器适用于较宽的工作温度范围，能够在恶劣环境下稳定工作，确保了传感器的稳定性和可靠性。
四、功能特点1. 多种接口：BW6101传感器具有多种接口选择，能够与不同类型的控制系统进行兼容，提高了其应用的灵活性和通用性。
2. 高抗干扰性：BW6101传感器内部集成了高性能的抗干扰技术，能够在复杂的电磁环境下保持稳定的工作表现，减小了外界干扰对传感器的影响。
3. 长寿命：BW6101传感器采用高品质的材料和先进的制造工艺，具有较长的使用寿命，降低了维护成本和更换频率，提高了设备的可靠性。
五、应用领域BW6101传感器广泛应用于工业自动化控制、智能制造、机器人技术、仓储物流等领域，为这些领域的设备和系统提供了稳定可靠的测量数据，发挥了重要作用。
BT153B-1200T-A 自动洗车机器人电源模块说明书
BT153B-1200T-AAutomotive Grade SCRRev.01 - 25 July 2019Product data sheet1. General description2. Features and benefits• High junction operating temperature capability (T j(max) = 150 °C)• AEC-Q101 compliant• Planar passivated for voltage ruggedness and reliability • High voltage capacity• Very high current surge capability • Surface mountable package3. Applications• Automotive battery charger, On Board Charger & Off Board Charger • DC motor control • Power converter• Solid State Relay (SSR)• Uninterruptible Power Supply (UPS)4. Quick reference dataPlanar passivated Silicon Controlled Rectifier (SCR) in a TO-263 surface mountable plastic package intended for use in applications requiring very high inrush current capability and high bidirectional blocking voltage capability. This product is qualified toAEC-Q101 standard for use in automotive applications.RoHS5. Pinning information6. Ordering information7. Marking8. Limiting valuesTable 5. Limiting values-5005010015001224364860T mb (°C)I T(RMS)(A)clfh4-001119°C10-210-111045495357616569surge duration (s)I T(RMS)(A)clfh4-002Fig. 1. RMS on-state current as a function of mounting base temperature; maximum values f = 50 Hz; T mb = 119 °C Fig. 2. RMS on-state current as a function of surgeduration; maximum values9. Thermal characteristics10. Characteristics-500501001500123T j (°C)clfh4-009I LI L (25°C)-500501001500123T j (°C)clfh4-010I HI H (25°C)00.51 1.521632486480V T (V)I T(A)clfh4-010(1)(3)(2)-500501001500.40.81.21.6T j (°C)clfh4-012V GTV GT (25°C)Fig. 9. Normalized latching current as a function of junction temperatureV o = 1.039 V; R s = 0.0089 Ω(1) T j = 150 °C; typical values (2) T j = 150 °C; maximum values (3) T j = 25 °C; maximum valuesFig. 11. On-state current as a function of on-state voltageFig. 12. Normalized gate trigger voltage as a function of junction temperatureFig. 10. Normalized holding current as a function of junction temperature11. Package outline12. Legal informationData sheet status[1lease consult the most recently issued document before initiating or completing a design.[2]The term 'short data sheet' is explained in section "Definitions".[3]The product status of device(s) described in this document may havechanged since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL .DefinitionsDraft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local WeEn Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between WeEn Semiconductors and its customer, unless WeEn Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the WeEn Semiconductors productis deemed to offer functions and qualities beyond those described in the Product data sheet.DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, WeEn Semiconductors does notgive any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors takes no responsibility for the content in this document if provided by an information source outside of WeEn Semiconductors.In no event shall WeEn Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.Notwithstanding any damages that customer might incur for any reason whatsoever, WeEn Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of WeEn Semiconductors.Right to make changes — WeEn Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use — WeEn Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-criticalor safety-critical systems or equipment, nor in applications where failureor malfunction of an WeEn Semiconductors product can reasonablybe expected to result in personal injury, death or severe property or environmental damage. WeEn Semiconductors and its suppliers accept no liability for inclusion and/or use of WeEn Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. WeEn Semiconductors makesno representation or warranty that such applications will be suitable for the specified use without further testing or modification.Customers are responsible for the design and operation of their applications and products using WeEn Semiconductors products, and WeEn Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the WeEn Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.WeEn Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using WeEn Semiconductors products in order to avoid a default of the applicationsand the products or of the application or use by customer’s third party customer(s). WeEn does not accept any liability in this respect.Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.Non-automotive qualified products — Unless this data sheet expressly states that this specific WeEn Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. WeEn Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without WeEn Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond WeEn Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies WeEn Semiconductors forany liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond WeEn Semiconductors’ standard warranty and WeEn Semiconductors’ product specifications.]PTranslations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.TrademarksNotice: All referenced brands, product names, service names and trademarks are the property of their respective owners.WeEn Semiconductors BT153B-1200T-AAutomotive Grade SCRBT153B-1200T-A Product data sheet All information provided in this document is subject to legal disclaimers.© WeEn Semiconductors Co.,Ltd.2019All rights reserved25 July 201911 / 1113. Contents1. General description (1)2. Features and benefits (1)3. Applications (1)4. Quick reference data (1)5. Pinning information (2)6. Ordering information (2)7. Marking (2)8. Limiting values (3)9. Thermal characteristics (5)10. Characteristics (6)11. Package outline (8)12. Legal information (9)13. Contents (11)© WeEn Semiconductors Co., Ltd. 2019. All rights reservedFor more information, please visit: Forsalesofficeaddresses,pleasesendanemailto:**************************** Date of release: 25 July 2019。
XC6101A549资料
1/26XC6101_07_XC6111_17 ETR0207_009Preliminary◆CMOS Voltage Detector◆Manual Reset Input ◆Watchdog Functions ◆Built-in Delay Circuit ◆Detect Voltage Range: 1.6~5.0V, ± 2% ◆Reset Function is Selectable V DFL (Low When Detected) V DFH (High When Detected)■GENERAL DESCRIPTION The XC6101~XC6107, XC6111~XC6117 series aregroups of high-precision, low current consumption voltage detectors with manual reset input function and watchdog functions incorporating CMOS process technology. The series consist of a reference voltage source, delay circuit, comparator, and output driver.With the built-in delay circuit, the XC6101 ~ XC6107, XC6111 ~ XC6117 series’ ICs do not require any external components to output signals with release delay time. Moreover, with the manual reset function, reset can be asserted at any time. The ICs produce two types of output; V DFL (low when detected) and V DFH (high when detected).With the XC6101 ~ XC6105, XC6111 ~ XC6115 series’ ICs, the WD pin can be left open if the watchdog function is not used. Whenever the watchdog pin is opened, the internal counter clears before the watchdog timeout occurs. Since the manual reset pin is internally pulled up to the V IN pin voltage level, the ICs can be used with the manual reset pin left unconnected if the pin is unused.The detect voltages are internally fixed 1.6V ~ 5.0V in increments of 100mV, using laser trimming technology. Six watchdog timeout period settings are available in a range from 6.25msec to 1.6sec. Seven release delay time 1 are available in a range from 3.13msec to 1.6sec.■APPLICATIONS●Microprocessor reset circuits●Memory battery backup circuits ●System power-on reset circuits ●Power failure detection■TYPICAL APPLICATION CIRCUIT* Not necessary with CMOS output products.■FEATURESDetect Voltage Range: 1.6V ~ 5.0V, +2% (100mV increments)Hysteresis Range : V DF x 5%, TYP .(XC6101~XC6107)V DF x 0.1%, TYP .(XC6111~XC6117)Operating Voltage Range : 1.0V ~ 6.0V Detect Voltage Temperature Characteristics : +100ppm/O C (TYP .) Output Configuration : N-channel open drain,CMOSWatchdog Pin : Watchdog inputIf watchdog input maintains ‘H’ or ‘L’ within the watchdog timeout period, a reset signal is output to the RESET output pinManual Reset Pin : When driven ‘H’ to ‘L’levelsignal, the MRB pin voltage asserts forced reset on theoutput pin.Release Delay Time : 1.6sec, 400msec, 200msec,100msec, 50msec, 25msec, 3.13msec (TYP .) can be selectable.Watchdog Timeout Period : 1.6sec, 400msec, 200msec,100msec, 50msec,6.25msec (TYP .) can be selectable.■TYPICAL PERFORMANCE CHARACTERISTICS ●Supply Current vs. Input Voltage* ‘x’ represents both ‘0’ and ‘1’. (ex. XC61x1⇒XC6101 and XC6111)2/26XC6101~XC6107, XC6111~XC6117 SeriesPIN NUMBERXC6101, XC6102 XC6103 XC6104, XC6105XC6106, XC6107XC6111, XC6112 XC6113 XC6114, XC6115XC6116, XC6117SOT-25 USP-6C SOT-25 USP-6C SOT-25 USP-6C SOT-25USP-6CPIN NAMEFUNCTION1 4 - - 1 4 1 4 R ESETB Reset Output(V DFL : Low Level When Detected)2 5 2 5 2 5 2 5 V SSGround3 2 3 2 - -4 1 M RB ManualReset 4 1 4 1 4 1 - - WDWatchdog5 6 5 6 5 6 5 6 V IN Power Input - - 1 4 3 2 3 2 RESETReset Output (V DFH: High Level When Detected)■PIN CONFIGURATION SOT-25 (TOP VIEW)MRBV IN WD RESETBV SSMRBWD RESETV SSV IN RESETWD RESETBV SS V IN SOT-25 (TOP VIEW)RESETMRB RESETBV SS V IN SOT-25 (TOP VIEW) ■PIN ASSIGNMENT●SOT-25XC6101, XC6102 SeriesXC6111, XC6112 SeriesSOT-25 (TOP VIEW)XC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 Series●USP-6CXC6101, XC6102 Series XC6111, XC6112 SeriesXC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 SeriesUSP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)* The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS pin.3/26XC6101 ~ XC6107, XC6111~ XC6117SeriesRESET OUTPUTSERIES WATCHDOGMANUAL RESET V DFL (RESETB)V DFH (RESET)XC6101 XC6111 Available Available CMOS - XC6102XC6112AvailableAvailableN-channel open drain-XC6103 XC6113 Available Available - CMOS XC6104 XC6114 Available Not AvailableCMOS CMOS XC6105 XC6115 Available Not Available N-channel open drain CMOS XC6106 XC6116 Not Available AvailableCMOSCMOS XC6107XC6117Not AvailableAvailableN-channel open drainCMOSDESIGNATORDESCRIPTIONSYMBOLDESCRIPTION0 : V DF x 5% (TYP .) with hysteresis ① Hysteresis Range1 : V DF x 0.1% (TYP .) without hysteresis② Functions and Type of Reset Output1 ~ 7: Watchdog and manual functions, and reset output type as per Selection Guide in the above chartA : 3.13msec (TYP .)B : 25msec (TYP .) C: 50msec (TYP .) D : 100msec (TYP .) E : 200msec (TYP .) F : 400msec (TYP .) ③ Release Delay Time * H : 1.6sec (TYP .)0 : No WD timeout period forXC6106, XC6107, XC6116, XC6117 Series 1: 6.25msec (TYP .) 2 : 50msec (TYP .) 3 : 100msec (TYP .) 4 : 200msec (TYP .) 5 : 400msec (TYP .) ④ Watchdog Timeout Period6: 1.6sec (TYP .) ⑤⑥ Detect Voltage 16 ~ 50: Detect voltageex.) 4.5V: ⑤⇒4, ⑥⇒5M : SOT-25 ⑦ Package E : USP-6C R : Embossed tape, standard feed ⑧ Device OrientationL: Embossed tape, reverse feed* Please set the release delay time shorter than or equal to the watchdog timeout period. ex.) XC6101D427MR or XC6101D327MR■PRODUCT CLASSIFICATION ●Selection Guide ●Ordering Information XC61①②③④⑤⑥⑦⑧4/26XC6101~XC6107, XC6111~XC6117 Series■PACKAGING INFORMATION●SOT-25●USP-6C5/26XC6101 ~ XC6107, XC6111~ XC6117Series④ Represents production lot number0 to 9 and A to Z and inverted 0 to 9 and A to Z repeated. (G, I, J, O, Q, W expected.) * ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)■MARKING RULE●SOT-25①②③④SOT-25 (TOP VIEW)6/26XC6101~XC6107, XC6111~XC6117 Series① Represents product series② Represents release delay time MARK RELEASE DELAY TIME PRODUCT SERIES A 3.13msec XC61XxAxxxxx B 25msec XC61XxBxxxxx C 50msec XC61XxCxxxxx D 100msec XC61XxDxxxxx E 200msec XC61XxExxxxx F 400msec XC61XxFxxxxx H 1.6sec XC61XxHxxxxx③ Represents watchdog timeout period MARK WATCHDOG TIMEOUT PERIOD PRODUCT SERIES 0 XC61X6, XC61X7 series XC61Xxx0xxxx 1 6.25msec XC61Xxx1xxxx 2 50msec XC61Xxx2xxxx 3 100msec XC61Xxx3xxxx 4 200msec XC61Xxx4xxxx 5 400msec XC61Xxx5xxxx 6 1.6sec XC61Xxx6xxxx④⑤ Represents detect voltage MARK④ ⑤DETECT VOLTAGE (V)PRODUCT SERIES3 3 3.3 XC61Xxxx33xx 5 0 5.0XC61Xxxx50xx⑥ Represents production lot number0 to 9 and A to Z repeated. (G, I, J, O, Q, W excepted.)* No character inversion used. ** ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)MARK PRODUCT SERIES MARK PRODUCT SERIES 3 XC6101xxxxxx 8 XC6111xxxxxx 4 XC6102xxxxxx 9 XC6112xxxxxx 5 XC6103xxxxxx A XC6113xxxxxx 6 XC6104xxxxxx B XC6114xxxxxx 7 XC6105xxxxxx C XC6115xxxxxx 3 XC6106xxxxxx 8 XC6116xxxxxx 4 XC6107xxxxxx 9 XC6117xxxxxx■MARKING RULE (Continued)●USP-6CUSP-6C (TOP VIEW)7/26XC6101 ~ XC6107, XC6111~ XC6117Series■BLOCK DIAGRAMS●XC6101, XC6111 Series●XC6102, XC6112 Series●XC6103, XC6113 Series8/26XC6101~XC6107, XC6111~XC6117 Series■BLOCK DIAGRAMS (Continued)●XC6107, XC6117 Series●XC6106, XC6116 Series●XC6105, XC6115 Series●XC6104, XC6114 Series9/26XC6101 ~ XC6107, XC6111~ XC6117SeriesPARAMETERSYMBOL RATINGSUNITSV INV SS -0.3 ~ 7.0 VM RBV SS -0.3 ~ V IN +0.3 VInput Voltage WD V SS -0.3 ~ 7.0V Output Current I OUT 20 mACMOS Output RESETB/RESET V SS -0.3 ~ V IN +0.3Output Voltage N-ch Open Drain Output RESETB V SS -0.3 ~ 7.0VSOT-25 250Power Dissipation USP-6C Pd 100mWOperational Temperature Range Topr -40 ~ +85 OCStorage Temperature Range Tstg -40 ~ +125 OC■ABSOLUTE MAXIMUM RATINGSTa = 25O C10/26XC6101~XC6107, XC6111~XC6117 SeriesNOTE:*1: XC6101~XC6107 (with hysteresis) *2: XC6111~XC6117 (without hysteresis)*3: ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111) *4: V DF(T): Setting detect voltage*5: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).PARAMETERSYMBOLCONDITIONSMIN.TYP .MAX. UNITS CIRCUITDetect Voltage V DFL V DFHV DF(T)× 0.98V DF(T) V DF(T)× 1.02 V 1 Hysteresis Range XC6101~XC6107 (*1) V HYS V DF × 0.02V DF × 0.05 V DF× 0.08 V 1Hysteresis Range XC6111~XC6117 (*2) V HYS 0 V DF × 0.001 V DFx 0.01V 1V IN =V DF(T)×0.9V - 5 11 V IN =V DF(T)×1.1V- 10 16 XC61X1/XC61X2/XC61X3XC61X4/XC61X5 (*3)(The MRB & the WD Pin: No connection) V IN =6.0V - 1218 V IN =V DF(T)×0.9V - 4 10 V IN =V DF(T)×1.1V - 8 14 Supply Current I SS XC61X6/XC61X7 (*3)(The MRB Pin: No connection)V IN = 6.0V - 1016 µA 2Operating Voltage V IN 1.0 - 6.0 V 1VIN = 1.0V 0.15 0.5 -V IN =2.0V (V DFL(T)> 2.0V) 2.0 2.5 - V IN =3.0V (V DFL(T) >3.0V) 3.0 3.5 -N-ch.V DS = 0.5V V IN =4.0V (V DFL(T) >4.0V) 3.5 4.0 - 3 V DFL Output Current (RESETB) I RBOUTCMOS,P-chV DS = 0.5V V IN = 6.0V - - 1.1 -0.8 mA 4 N-chV DS = 0.5VV IN =6.0V 4.4 4.9 - 3V IN =1.0V - - 0.08 - 0.02 V IN =2.0V (V DFH(T)> 2.0V)- - 0.50 - 0.30 V IN =3.0V (V DFH(T)>3.0V)- - 0.75 - 0.55V DFHOutput Current (RESET) I ROUT P-ch. V DS = 0.5V V IN =4.0V (V DFH(T)>4.0V)- - 0.95 - 0.75 mA 4Temperature Characteristics △V DF / △Topr ・V DF -40OC < Topr < 85 O C - +100 - ppm / O C12 3.13 5 13 25 3825 50 75 60 100 140 120 200 280 240 400 560Release Delay Time(V DF <1.8V)T DR Time until V IN is increased from1.0V to2.0Vand attains to the release time level,and the Reset output pin inverts.960 1600 2240 ms 5 2 3.13 5 13 25 38 25 50 7560 100 140 120 200 280 240 400 560 Release Delay Time(V DF >1.9V)T DRTime until V IN is increased from1.0V to (V DF x1.1V) and attains to the releasetime level,and the Reset output pin inverts. 960 1600 2240ms 5 Detect Delay Time T DFTime until V IN is decreased from 6.0V to 1.0V and attains to the detect voltage level, and the Reset output pin detectswhile the WD pin left opened.- 3 30 µs 5V DFL /V DFH CMOS Output Leak CurrentI LEAK V IN =6.0V, RESETB=6.0V (V DFL ) V IN =6.0V, RESET=0V (V DFH )- 0.01 - µA 3V DFL N-ch Open DrainOutput Leak CurrentI LEAKV IN =6.0V, RESETB=6.0V-0.010.10µA 3■ELECTRICAL CHARACTERISTICS●XC6101~XC6107, XC6111~XC6117 SeriesTa = 25O CSeriesPARAMETERSYMBOL CONDITIONS MIN.TYP . MAX. UNITS CIRCUIT3.13 6.25 9.38 25 50 7560 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF <1.8V)T WDTime until V IN increases form1.0V to2.0V andthe Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 3.13 6.25 9.38 25 50 75 60 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF >1.9V)T WDTime until V IN increases form1.0V to (V DF x1.1V)and the Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 WatchdogMinimum Pulse Width T WDIN V IN =6.0V,Apply pulse from 6.0V to 0Vto the WD pin. 300 - - ns 7 Watchdog High Level VoltageV WDH V IN =V DF x 1.1V ~ 6.0V V IN x 0.7- 6 V 7 Watchdog Low Level Voltage V WDL V IN =V DF x 1.1V ~ 6.0V0 - V IN x 0.3 V 7 V IN =6.0V, V WD =6.0V (Avg. when peak )- 12 19Watchdog Input Current I WD V IN =6.0V, V WD =0V (Avg. when peak) - 19 -12 -µA 8 Watchdog Input ResistanceR WDV IN =6.0V, V WD =0V, R WD =V IN / |I WD |315500880k Ω8PARAMETERSYMBOL CONDITIONS MIN.TYP . MAX.UNITS CIRCUITMRBHigh Level VoltageV MRH V IN =V DF x1.1V ~ 6.0V 1.4 - V IN 9MRBLow Level VoltageV MRL V IN =V DF x1.1V ~ 6.0V-0.35 V9MRBPull-up Resistance R MR V IN =6.0V, MRB=0V, R MR =V IN / |I MRB | 1.6 2.4 3.0 M Ω 10 MRB Minimum Pulse Width (*3) XC6101~XC6105 XC6111~XC6115 T MRINV IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin 2.8 - -MRB Minimum Pulse Width (*4) XC6106, XC6107 XC6116, XC6117T MRIN V IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin1.2 - -µs11●XC6101 ~ XC6103, XC6106 ~ XC6107, XC6111 ~ XC6113, XC6116 ~ XC6117 Series NOTE:*1: V DF(T): Setting detect voltage *2: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected). *3: Watchdog function is available. *4: Watchdog function is not available.Ta = 25O CTa = 25O C ■ELECTRICAL CHARACTERISTICS (Continued)●XC6101~XC6105, XC6111~XC6115 Series■OPERATIONAL EXPLANATIONThe XC6101~XC6107, XC6111~XC6117 series compare, using the error amplifier, the voltage of the internal voltage reference source with the voltage divided by R1, R2 and R3 connected to the V IN pin. The resulting output signal from the error amplifier activates the watchdog logic, manual reset logic, delay circuit and the output driver. When the V IN pin voltage gradually falls and finally reaches the detect voltage, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type ICs.<RESETB / RESET Pin Output Signal>* V DFL (RESETB) type - output signal: Low when detected.The RESETB pin output goes from high to low whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESETB pin remains low for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the RESETB pin output remains low for the release delay time (T DR), and thereafter the RESET pin outputs high level signal. * V DFH (RESET) type – output signal: High when detected.The RESET pin output goes from low to high whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESET pin remains high for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the V OUT pin output remains high for the release delay time (T DR), and thereafter the RESET pin outputs low level signal.<Hysteresis>When the internal comparator output is high, the NMOS transistor connected in parallel to R3 is turned ON, activating the hysteresis circuit. The difference between the release and detect voltages represents the hysteresis range, as shown by the following calculations:V DF (detect voltage) = (R1+R2+R3) x Vref(R2+R3)V DR (release voltage) = (R1+R2) x Vref(R2)V HYS (hysteresis range)=V DR-V DF (V)V DR > V DF* Detect voltage (V DF) includes conditions of both V DFL (low when detected) and V DFH (high when detected).* Please refer to the block diagrams for R1, R2, R3 and Vref.Hysteresis range is selectable from V DF x 0.05V (XC6101~XC6107) or V DF x 0.001V (XC6111~XC6117).<Watchdog (WD) Pin>The XC6101~XC6107, XC6111~XC6117 series use a watchdog timer to detect malfunction or “runaway” of the microprocessor. If neither rising nor falling signals are applied from the microprocessor within the watchdog timeout period, the RESETB/RESET pin output maintains the detection state for the release delay time (T DR), and thereafter the RESET/RESETB pin output returns to the release state (Please refer to the FUNCTION CHART). The timer in the watchdog is then restarted. Six watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 6.25msec.<MRB Pin>Using the MRB pin input, the RESET/RESETB pin signal can be forced to the detection state. When the MRB pin is driven from high to low, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type. Even after the MRB pin is driven back high, the RESET/RESETB pin output maintains the detection state for the release delay time (T DR). Since the MRB pin is internally pulled up to the V IN pin voltage level, leave the MRB pin open if unused (Please refer to the FUNCTION CHART). A diode, which is an input protection element, is connected between the MRB pin and V IN pin. Therefore, if the MRB pin is applied voltage that exceeds V IN, the current will flow to V IN through the diode. Please use this IC within the stated maximum ratings (V SS -0.3 ~ V IN+0.3) on the MRB pin.<Release Delay Time>Release delay time (T DR) is the time that elapses from when the V IN pin reaches the release voltage, or when the watchdog timeout period expires with no rising signal applied to the WD pin, until the RESET/RESETB pin output is released from the detection state. Seven release delay time (T DR) watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 25msec, 3.13msec.<Detect Delay Time>Detect Delay Time (T DF) is the time that elapses from when the V IN pin voltage falls to the detect voltage until the RESET/ RESETB pin output goes into the detection state.Series■TIMING CHARTS●CMOS Output●T DF (CMOS Output)VINVDFL LevelGNDVIN Level VDFL Level GNDVIN x 0.1V■NOTES ON USE1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device.2. When a resistor is connected between the V IN pin and the input, the V IN voltage drops while the IC is operating and a malfunction may occur as a result of the IC’s through current. For the CMOS output products, the V IN voltage drops while the IC is operating and malfunction may occur as a result of the IC’s output current. Please be careful with using the XC6111~XC6117 series (without hysteresis).3. In order to stabilize the IC’s operations, please ensure that the V IN pin’s input frequency’s rise and fall times are more than 1 µ sec/V.4. Noise at the power supply may cause a malfunction of the watchdog operation or the circuit. In such case, please strength the line between V IN and the GND pin and connect about 0.22µF of a capacitor between the V IN pin and the GND pin.5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900µsec at maximum.GNDGNDGNDVIN Pin Wave FormWD Pin Wave FormRESETB Pin Wave Form (VDFL)SeriesPIN NAMELOGIC CONDITIONSH V IN >V DF +V HYS V IN L V IN <V DF H MRB>1.40V MRBL MRB<0.35V H When keeping W D >V WDH more than T WD L When keeping W D <V WDL more than T WD L → H V WDL → V WDH , T WDIN >300nsec WDH → L V WDH →V WDH , T WDIN >300nsecV IN MRB WD RESETB (*2) H HH LRepeat detect and release (H →L →H)H OpenH L → HH H or Open H → L H HLL *1 LV IN MRB WD RESETB (*3) H HH LRepeat detect and release (L →H →L)H OpenH L → HH H or Open H → L L HLL *1 HV IN WD RESETB (*2) RESET (*3) H HH L Repeat detect and release (H →L →H)Repeat detect and release (L →H →L)H OpenH L → HH H → L H L HL*1 L HV IN MRB RESETB (*2)RESET (*3)H H or Open H LH LL L H■PIN LOGIC CONDITIONSNOTE:*1: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).*2: For the details of each parameter, please see the electrical characteristics. V DF : Detect VoltageV HYS : Hysteresis RangeV WDH : WD High Level Voltage V WDL: WD Low Level Voltage T WDIN : WD Pulse Width T WD : WD Timeout Period■FUNCTION CHART●XC6103/XC61113 Series●XC6104/XC61114, XC6105/XC6115 Series●XC6106/XC61116, XC6107/XC6117 Series●XC6101/XC61111, XC6102/6112 Series*1: Including all logic of WD (WD=H, L, L →H, H →L, OPEN). *2: When the RESETB is High, the circuit is in the release state. When the RESETB is Low, the circuit is in the detection state. *3: When the RESET is High, the circuit is in the release state. When the RESET is Low, the circuit is in the detection state.■TEST CIRCUITSCircuit 1Circuit 2Circuit 3Circuit 4Series ■TEST CIRCUITS (Continued)Circuit 5Circuit 6Circuit 7■TEST CIRCUITS (Continued)Circuit 8Circuit 9Circuit 10Circuit 11Series■TYPICAL PERFORMANCE CHARACTERISTICS(1.1) Supply Current vs. Input Voltage(1.2) Supply Current vs. Input Voltage■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(2) Detect, Release Voltage vs. Ambient Temperature(1.2) Supply Current vs. Input Voltage (Continued)Series■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3-1) Output Voltage vs. Input Voltage (V DFL ) (3.1) Detect, Release Voltage vs. Input Voltage (V DFL )(3.2) Detect, Release Voltage vs. Input Voltage (V DFH )■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(4) N-ch Driver Output Current vs. V DSSeries(6) P-ch Driver Output Current vs. Input Voltage 1■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(8) Release Delay Time vs. Ambient Temperature(7) P-ch Driver Output Current vs. Input Voltage 2■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Release Delay Time vs. Input Voltage(11) Watchdog Timeout Period vs. Input VoltageSeries■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(14) MRB Low Level Voltage vs. Ambient Temperature(15) MRB High Level Voltage vs. Ambient Temperature* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)。
简易型高电压电流检测终得实现
简易型高电压电流检测终得实现凌力尔特公司Brendan Whelan、Glen Brisebois、Albert Lee和Jon Munson高电压承受能力、灵活性和准确度LT6100和LTC6101是高电压、精准、高压侧电流检测放大器。
它们所采用的简单架构使其具备了灵活性和易用性，而精心的设计则令其可靠且坚固。
主要特点包括高电源范围、用户可配置增益、低输入电流、高PSRR和低失调电压。
这些特点使得LT6100和LTC6101成为精准的工业和汽车感测应用以及电流过载保护电路的完美选择。
LT6100的工作电压可高达48V，其使用较之LTC6101更为简单，几乎不需要外部元件，吸取的功率极少，并可承受诸如分离输入、断电和电池反向等多种异常条件。
LTC6101是这两款器件中速度较高的一个，工作电压可高达70V，而且在灵活性上更胜一筹，并具有用于设置增益的外部电阻器。
这两款器件均可采用多种小型封装。
电流检测的工作原理实现电流检测的常用方法有两种。
一种方法利用的是磁性原理，其结构是采用磁导材料来把磁场耦合至一个线圈或霍尔效应（Hall-effect）传感器而形成的。
不必直接插入被测电路，而线圈型捡拾法固有地无法提供任何的DC信息（但采用特殊的“磁通量闸门”技术是可以的），而且，对于大多数DC测量而言，霍尔传感器在准确度和灵敏度上往往有所欠缺。
另一种方法是在负载通路上布设一个已知的“检测”电阻，由此产生一个与负载电流成正比的小幅压降。
一般来说，检测电阻器的优选连接方法是将其布设在电路的电源侧，这样就能够保持常用的接地法并检测负载故障。
在正电源电位的场合，这种连接方式通常被称作“高压侧”检测配置，如图1所示。
这意味着从检测放大器的角度来看，检测电压就是一个大共模信号上的小差分信号，这就对实现方案提出了独特的要求，旨在保持准确度和动态范围。
图1：典型的高压侧电流检测电路传统“自成体系”式的解决方案采用的是运算放大器或仪表放大器，但这些放大器常常在工作的电压范围上存在一定的局限性和/或需要采用许多附加元件来执行电压变换功能以产生一个以地为基准的读出信号。
6101A资料
NOTE 1: Each Diode NOTE 2: Pulsed: PW = 100 ms max; duty cycle <20% NOTE 3: Derate at 2.4 mA/oC above +25oC NOTE 4: Derate at 4.8 mW/oC above +25oC
ELECTRICAL CHARACTERISTICS (Per Diode) @ 25oC unless otherwise specified
• 16-PIN Ceramic DIP • Weight 2.09 grams (approximate) • Marking: Logo, part number, date code • Pin #1 to the left of the indent on top of
package • Carrier Tubes; 25 pcs (standard)
(PIN TO PIN)
Ct
VR = 0 V F = 1 MHz
pF
4.0
MAXIMUM FORWARD RECOVERY
TIME
tfr
IF = 100 mA ns
15
MAXIMUM REVERSE RECOVERY TIME
trr
IF = IR = 10 mAdc
irr = 1 mAdc
RL = 100 ohms ns
PART NUMBER
6101A
MAXIMUM FORWARD VOLTAGE
VF1
IF = 100 mA (Note 1) V
1
MAXIMUM REVERSE CURRENT
IR1 VR = 40 V
常用开关电源芯片大全之欧阳育创编
常用开关电源芯片大全第1章DC-DC电源转换器/基准电压源1.1 DC-DC电源转换器1.低噪声电荷泵DC-DC电源转换器AAT3113/AAT31142.低功耗开关型DC-DC电源转换器ADP30003.高效3A开关稳压器AP15014.高效率无电感DC-DC电源转换器FAN56605.小功率极性反转电源转换器ICL76606.高效率DC-DC电源转换控制器IRU30377.高性能降压式DC-DC电源转换器ISL64208.单片降压式开关稳压器L49609.大功率开关稳压器L4970A10.1.5A降压式开关稳压器L497111.2A高效率单片开关稳压器L497812.1A高效率升压/降压式DC-DC电源转换器L597013.1.5A降压式DC-DC电源转换器LM157214.高效率1A降压单片开关稳压器LM1575/LM2575/LM2575HV15.3A降压单片开关稳压器LM2576/LM2576HV16.可调升压开关稳压器LM257717.3A降压开关稳压器LM259618.高效率5A开关稳压器LM267819.升压式DC-DC电源转换器LM2703/LM270420.电流模式升压式电源转换器LM273321.低噪声升压式电源转换器LM275022.小型75V降压式稳压器LM500723.低功耗升/降压式DC-DC电源转换器LT107324.升压式DC-DC电源转换器LT161525.隔离式开关稳压器LT172526.低功耗升压电荷泵LT175127.大电流高频降压式DC-DC电源转换器LT176528.大电流升压转换器LT193529.高效升压式电荷泵LT193730.高压输入降压式电源转换器LT195631.1.5A升压式电源转换器LT196132.高压升/降压式电源转换器LT343333.单片3A升压式DC-DC电源转换器LT343634.通用升压式DC-DC电源转换器LT346035.高效率低功耗升压式电源转换器LT346436.1.1A升压式DC-DC电源转换器LT346737.大电流高效率升压式DC-DC电源转换器LT378238.微型低功耗电源转换器LTC175439.1.5A单片同步降压式稳压器LTC187540.低噪声高效率降压式电荷泵LTC191141.低噪声电荷泵LTC3200/LTC3200-542.无电感的降压式DC-DC电源转换器LTC325143.双输出/低噪声/降压式电荷泵LTC325244.同步整流/升压式DC-DC电源转换器LTC340145.低功耗同步整流升压式DC-DC电源转换器LTC340246.同步整流降压式DC-DC电源转换器LTC340547.双路同步降压式DC-DC电源转换器LTC340748.高效率同步降压式DC-DC电源转换器LTC341649.微型2A升压式DC-DC电源转换器LTC342650.2A两相电流升压式DC-DC电源转换器LTC342851.单电感升/降压式DC-DC电源转换器LTC344052.大电流升/降压式DC-DC电源转换器LTC344253.1.4A同步升压式DC-DC电源转换器LTC345854.直流同步降压式DC-DC电源转换器LTC370355.双输出降压式同步DC-DC电源转换控制器LTC373656.降压式同步DC-DC电源转换控制器LTC377057.双2相DC-DC电源同步控制器LTC380258.高性能升压式DC-DC电源转换器MAX1513/MAX151459.精简型升压式DC-DC电源转换器MAX1522/MAX1523/MAX152460.高效率40V升压式DC-DC电源转换器MAX1553/MAX155461.高效率升压式LED电压调节器MAX1561/MAX159962.高效率5路输出DC-DC电源转换器MAX156563.双输出升压式DC-DC电源转换器MAX1582/MAX1582Y64.驱动白光LED的升压式DC-DC电源转换器MAX158365.高效率升压式DC-DC电源转换器MAX1642/MAX164366.2A降压式开关稳压器MAX164467.高效率升压式DC-DC电源转换器MAX1674/MAX1675/MAX167668.高效率双输出DC-DC电源转换器MAX167769.低噪声1A降压式DC-DC电源转换器MAX1684/MAX168570.高效率升压式DC-DC电源转换器MAX169871.高效率双输出降压式DC-DC电源转换器MAX171572.小体积升压式DC-DC电源转换器MAX1722/MAX1723/MAX172473.输出电流为50mA的降压式电荷泵MAX173074.升/降压式电荷泵MAX175975.高效率多路输出DC-DC电源转换器MAX180076.3A同步整流降压式稳压型MAX1830/MAX183177.双输出开关式LCD电源控制器MAX187878.电流模式升压式DC-DC电源转换器MAX189679.具有复位功能的升压式DC-DC电源转换器MAX194780.高效率PWM降压式稳压器MAX1992/MAX199381.大电流输出升压式DC-DC电源转换器MAX61882.低功耗升压或降压式DC-DC电源转换器MAX62983.PWM升压式DC-DC电源转换器MAX668/MAX66984.大电流PWM降压式开关稳压器MAX724/MAX72685.高效率升压式DC-DC电源转换器MAX756/MAX75786.高效率大电流DC-DC电源转换器MAX761/MAX76287.隔离式DC-DC电源转换器MAX8515/MAX8515A88.高性能24V升压式DC-DC电源转换器MAX872789.升/降压式DC-DC电源转换器MC33063A/MC34063A90.5A升压/降压/反向DC-DC电源转换器MC33167/MC3416791.低噪声无电感电荷泵MCP1252/MCP125392.高频脉宽调制降压稳压器MIC220393.大功率DC-DC升压电源转换器MIC229594.单片微型高压开关稳压器NCP1030/NCP103195.低功耗升压式DC-DC电源转换器NCP1400A96.高压DC-DC电源转换器NCP140397.单片微功率高频升压式DC-DC电源转换器NCP141098.同步整流PFM步进式DC-DC电源转换器NCP142199.高效率大电流开关电压调整器NCP1442/NCP1443/NCP1444/NCP1445100.新型双模式开关稳压器NCP1501101.高效率大电流输出DC-DC电源转换器NCP1550102.同步降压式DC-DC电源转换器NCP1570103.高效率升压式DC-DC电源转换器NCP5008/NCP5009 104.大电流高速稳压器RT9173/RT9173A105.高效率升压式DC-DC电源转换器RT9262/RT9262A106.升压式DC-DC电源转换器SP6644/SP6645107.低功耗升压式DC-DC电源转换器SP6691108.新型高效率DC-DC电源转换器TPS54350109.无电感降压式电荷泵TPS6050x110.高效率升压式电源转换器TPS6101x111.28V恒流白色LED驱动器TPS61042112.具有LDO输出的升压式DC-DC电源转换器TPS6112x 113.低噪声同步降压式DC-DC电源转换器TPS6200x114.三路高效率大功率DC-DC电源转换器TPS75003115.高效率DC-DC电源转换器UCC39421/UCC39422116.PWM控制升压式DC-DC电源转换器XC6371117.白光LED驱动专用DC-DC电源转换器XC9116118.500mA同步整流降压式DC-DC电源转换器XC9215/XC9216/XC9217119.稳压输出电荷泵XC9801/XC9802120.高效率升压式电源转换器ZXLB16001.2 线性/低压差稳压器121.具有可关断功能的多端稳压器BAXXX122.高压线性稳压器HIP5600123.多路输出稳压器KA7630/KA7631124.三端低压差稳压器LM2937125.可调输出低压差稳压器LM2991126.三端可调稳压器LM117/LM317127.低压降CMOS500mA线性稳压器LP38691/LP38693128.输入电压从12V到450V的可调线性稳压器LR8129.300mA非常低压降稳压器（VLDO）LTC3025130.大电流低压差线性稳压器LX8610131.200mA负输出低压差线性稳压器MAX1735132.150mA低压差线性稳压器MAX8875133.带开关控制的低压差稳压器MC33375134.带有线性调节器的稳压器MC33998135.1.0A低压差固定及可调正稳压器NCP1117136.低静态电流低压差稳压器NCP562/NCP563137.具有使能控制功能的多端稳压器PQxx138.五端可调稳压器SI-3025B/SI-3157B139.400mA低压差线性稳压器SPX2975140.五端线性稳压器STR20xx141.五端线性稳压器STR90xx142.具有复位信号输出的双路输出稳压器TDA8133143.具有复位信号输出的双路输出稳压器TDA8138/TDA8138A144.带线性稳压器的升压式电源转换器TPS6110x145.低功耗50mA低压降线性稳压器TPS760xx146.高输入电压低压差线性稳压器XC6202147.高速低压差线性稳压器XC6204148.高速低压差线性稳压器XC6209F149.双路高速低压差线性稳压器XC64011.3 基准电压源150.新型XFET基准电压源ADR290/ADR291/ADR292/ADR293151.低功耗低压差大输出电流基准电压源MAX610x152.低功耗1.2V基准电压源MAX6120153.2.5V精密基准电压源MC1403154.2.5V/4.096V基准电压源MCP1525/MCP1541155.低功耗精密低压降基准电压源REF30xx/REF31xx156.精密基准电压源TL431/KA431/TLV431A第2章AC-DC转换器及控制器1.厚膜开关电源控制器DP104C2.厚膜开关电源控制器DP308P3.DPA-Switch系列高电压功率转换控制器DPA423/DPA424/DPA425/DPA4264.电流型开关电源控制器FA13842/FA13843/FA13844/FA138455.开关电源控制器FA5310/FA53116.PWM开关电源控制器FAN75567.绿色环保的PWM开关电源控制器FAN76018.FPS型开关电源控制器FS6M07652R9.开关电源功率转换器FS6Sxx10.降压型单片AC-DC转换器HV-2405E11.新型反激准谐振变换控制器ICE1QS0112.PWM电源功率转换器KA1M088013.开关电源功率转换器KA2S0680/KA2S088014.电流型开关电源控制器KA38xx15.FPS型开关电源功率转换器KA5H0165R16.FPS型开关电源功率转换器KA5Qxx17.FPS型开关电源功率转换器KA5Sxx18.电流型高速PWM控制器L499019.具有待机功能的PWM初级控制器L599120.低功耗离线式开关电源控制器L659021.LINK SWITCH TN系列电源功率转换器LNK304/LNK305/LNK30622.LINK SWITCH系列电源功率转换器LNK500/LNK501/LNK52023.离线式开关电源控制器M51995A24.PWM电源控制器M62281P/M62281FP25.高频率电流模式PWM控制器MAX5021/MAX502226.新型PWM开关电源控制器MC4460427.电流模式开关电源控制器MC4460528.低功耗开关电源控制器MC4460829.具有PFC功能的PWM电源控制器ML482430.液晶显示器背光灯电源控制器ML487631.离线式电流模式控制器NCP120032.电流模式脉宽调制控制器NCP120533.准谐振式PWM控制器NCP120734.低成本离线式开关电源控制电路NCP121535.低待机能耗开关电源PWM控制器NCP123036.STR系列自动电压切换控制开关STR8xxxx37.大功率厚膜开关电源功率转换器STR-F665438.大功率厚膜开关电源功率转换器STR-G865639.开关电源功率转换器STR-M6511/STR-M652940.离线式开关电源功率转换器STR-S5703/STR-S5707/STR-S570841.离线式开关电源功率转换器STR-S6401/STR-S6401F/STR-S6411/STR-S6411F 442.开关电源功率转换器STR-S651343.离线式开关电源功率转换器TC33369～TC3337444.高性能PFC与PWM组合控制集成电路TDA16846/TDA1684745.新型开关电源控制器TDA1685046.“绿色”电源控制器TEA150447.第二代“绿色”电源控制器TEA150748.新型低功耗“绿色”电源控制器TEA153349.开关电源控制器TL494/KA7500/MB375950.Tiny SwitchⅠ系列功率转换器TNY253、TNY254、TNY25551.Tiny SwitchⅡ系列功率转换器TNY264P～TNY268G52.TOP Switch（Ⅱ）系列离线式功率转换器TOP209～TOP22753.TOP Switch-FX系列功率转换器TOP232/TOP233/TOP23454.TOP Switch-GX系列功率转换器TOP242～TOP25055.开关电源控制器UCX84X56.离线式开关电源功率转换器VIPer12AS/VIPer12ADIP57.新一代高度集成离线式开关电源功率转换器VIPer53第3章功率因数校正控制/节能灯电源控制器1.电子镇流器专用驱动电路BL83012.零电压开关功率因数控制器FAN48223.功率因数校正控制器FAN75274.高电压型EL背光驱动器HV8265.EL场致发光背光驱动器IMP525/IMP5606.高电压型EL背光驱动器/反相器IMP8037.电子镇流器自振荡半桥驱动器IR21568.单片荧光灯镇流器IR21579.调光电子镇流器自振荡半桥驱动器IR215910.卤素灯电子变压器智能控制电路IR216111.具有功率因数校正电路的镇流器电路IR216612.单片荧光灯镇流器IR216713.自适应电子镇流器控制器IR252014.电子镇流器专用控制器KA754115.功率因数校正控制器L656116.过渡模式功率因数校正控制器L656217.集成背景光控制器MAX8709/MAX8709A18.功率因数校正控制器MC33262/MC3426219.固定频率电流模式功率因数校正控制器NCP165320.EL场致发光灯高压驱动器SP440321.功率因数校正控制器TDA4862/TDA486322.有源功率因数校正控制器UC385423.高频自振荡节能灯驱动器电路VK05CFL24.大功率高频自振荡节能灯驱动器电路VK06TL第4章充电控制器1.多功能锂电池线性充电控制器AAT36802.可编程快速电池充电控制器BQ20003.可进行充电速率补偿的锂电池充电管理器BQ20574.锂电池充电管理电路BQ2400x5.单片锂电池线性充电控制器BQ2401xB接口单节锂电池充电控制器BQ2402x7.2A同步开关模式锂电池充电控制器BQ241008.集成PWM开关控制器的快速充电管理器BQ29549.具有电池电量计量功能的充电控制器DS277010.锂电池充电控制器FAN7563/FAN756411.2A线性锂/锂聚合物电池充电控制器ISL629212.锂电池充电控制器LA5621M/LA5621V13.1.5A通用充电控制器LT157114.2A恒流/恒压电池充电控制器LT176915.线性锂电池充电控制器LTC173216.带热调节功能的1A线性锂电池充电控制器LTC173317.线性锂电池充电控制器LTC173418.新型开关电源充电控制器LTC198019.开关模式锂电池充电控制器LTC400220.4A锂电池充电器LTC400621.多用途恒压/恒流充电控制器LTC400822.4.2V锂离子/锂聚合物电池充电控制器LTC405223.可由USB端口供电的锂电池充电控制器LTC405324.小型150mA锂电池充电控制器LTC405425.线性锂电池充电控制器LTC405826.单节锂电池线性充电控制器LTC405927.独立线性锂电池充电控制器LTC406128.镍镉/镍氢电池充电控制器M62256FP29.大电流锂/镍镉/镍氢电池充电控制器MAX150130.锂电池线性充电控制器MAX150731.双输入单节锂电池充电控制器MAX1551/MAX155532.单节锂电池充电控制器MAX167933.小体积锂电池充电控制器MAX1736B接口单节锂电池充电控制器MAX181135.多节锂电池充电控制器MAX187336.双路输入锂电池充电控制器MAX187437.单节锂电池线性充电控制器MAX189838.低成本/多种电池充电控制器MAX190839.开关模式单节锂电池充电控制器MAX1925/MAX192640.快速镍镉/镍氢充电控制器MAX2003A/MAX200341.可编程快速充电控制器MAX712/MAX71342.开关式锂电池充电控制器MAX74543.多功能低成本充电控制器MAX846A44.具有温度调节功能的单节锂电池充电控制器MAX8600/MAX860145.锂电池充电控制器MCP73826/MCP73827/MCP7382846.高精度恒压/恒流充电器控制器MCP73841/MCP73842/MCP73843/MCP73844 647.锂电池充电控制器MCP73861/MCP7386248.单节锂电池充电控制器MIC7905049.单节锂电池充电控制器NCP180050.高精度线性锂电池充电控制器VM7205。
LT1568中文手册
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TDA6101资料
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TDA6101Q
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Voltages measured with respect to GND (pin 4); currents as specified in Fig.1; unless otherwise specified. SYMBOL VDDH VDDL VI VIdm Vom Voc Vfb Iin,Iip IocsmL IocsmH Ptot Tstg Tj Ves PARAMETER high level supply voltage low level supply voltage input voltage differential mode input voltage measurement output voltage cathode output voltage feedback output voltage input current low non-repetitive peak cathode output current high non-repetitive peak cathode output current total power dissipation storage temperature junction temperature electrostatic handling human body model (HBM) machine model (MM) HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices” ). QUALITY SPECIFICATION Quality specification “SNW-FQ-611 part E” is applicable, except for ESD Human body model see Chapter “Limiting values”, and can be found in the “Quality reference handbook” (ordering number 9398 510 63011). THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-c Note 1. External heatsink not required. PARAMETER(1) thermal resistance from junction to ambient in free air thermal resistance from junction to case VALUE 56 12 UNIT K/W K/W − − > 1500 > 400 V V flashover discharge = 100 µC flashover discharge = 100 nC CONDITIONS 0 0 0 −6 0 VDDL VDDL 0 0 0 0 −55 −20 MIN. MAX. 250 14 VDDL +6 VDDL VDDH VDDH 1 5 10 1.9 +150 +150 V V mA A A W °C °C V V V V UNIT
bc417蓝牙模块中文资料
bc417蓝牙模块中文资料BC417蓝牙模块中文资料概述BC417是一款高性能蓝牙2.1+EDR（增强数据速率）模块，由台湾艾睿电子公司（AITRUE）生产。
作为一款蓝牙无线通信模块，BC417具有广泛的应用领域，例如无线数据传输、音频传输、远程控制等。
主要特性1. 蓝牙2.1+EDR标准：BC417采用最新的蓝牙2.1+EDR标准，支持高速数据传输，提供更稳定和高效的连接。
2. 支持多种蓝牙协议：BC417支持多种蓝牙协议，包括串口协议（SPP）、音频传输协议（A2DP）、人机接口协议（HID）等，可以满足不同应用场景下的需求。
3. 高度集成的射频电路：BC417集成了高度集成的射频电路，具有较低的功耗和敏感度，可实现稳定的无线通信。
4. 强大的处理能力：BC417搭载了高性能的处理器，具有强大的计算和处理能力，可以处理复杂的蓝牙通信任务。
5. 丰富的接口：BC417提供了丰富的接口，包括UART、I2C、SPI 等，方便与主控设备进行通信和控制。
6. 简化开发流程：BC417提供了丰富的软件开发包（SDK），开发者可以基于SDK进行快速开发，简化开发流程。
应用领域1. 无线数据传输：BC417可以实现设备之间的无线数据传输，例如手机与电脑之间的文件传输、打印机与电脑之间的数据传输等。
2. 音频传输：BC417支持音频传输协议（A2DP），可以实现高质量的音频传输，例如将手机上的音乐通过蓝牙模块传输到汽车音响系统。
3. 远程控制：BC417可以与其他设备进行远程控制，例如将手机与智能家居设备连接，通过手机控制灯光、空调等。
4. 无线鼠标和键盘：BC417支持人机接口协议（HID），可以实现将蓝牙模块与鼠标、键盘等设备连接，实现无线控制。
5. 传感器数据采集：BC417可以与传感器设备连接，实现无线数据采集和传输，例如温度传感器、湿度传感器等。
总结BC417蓝牙模块是一款功能强大且广泛应用的蓝牙模块，具有高性能、低功耗、稳定可靠的特点。
LTC1867中文资料
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XC6111B642资料
1/26XC6101_07_XC6111_17 ETR0207_009Preliminary◆CMOS Voltage Detector◆Manual Reset Input ◆Watchdog Functions ◆Built-in Delay Circuit ◆Detect Voltage Range: 1.6~5.0V, ± 2% ◆Reset Function is Selectable V DFL (Low When Detected) V DFH (High When Detected)■GENERAL DESCRIPTION The XC6101~XC6107, XC6111~XC6117 series aregroups of high-precision, low current consumption voltage detectors with manual reset input function and watchdog functions incorporating CMOS process technology. The series consist of a reference voltage source, delay circuit, comparator, and output driver.With the built-in delay circuit, the XC6101 ~ XC6107, XC6111 ~ XC6117 series’ ICs do not require any external components to output signals with release delay time. Moreover, with the manual reset function, reset can be asserted at any time. The ICs produce two types of output; V DFL (low when detected) and V DFH (high when detected).With the XC6101 ~ XC6105, XC6111 ~ XC6115 series’ ICs, the WD pin can be left open if the watchdog function is not used. Whenever the watchdog pin is opened, the internal counter clears before the watchdog timeout occurs. Since the manual reset pin is internally pulled up to the V IN pin voltage level, the ICs can be used with the manual reset pin left unconnected if the pin is unused.The detect voltages are internally fixed 1.6V ~ 5.0V in increments of 100mV, using laser trimming technology. Six watchdog timeout period settings are available in a range from 6.25msec to 1.6sec. Seven release delay time 1 are available in a range from 3.13msec to 1.6sec.■APPLICATIONS●Microprocessor reset circuits●Memory battery backup circuits ●System power-on reset circuits ●Power failure detection■TYPICAL APPLICATION CIRCUIT* Not necessary with CMOS output products.■FEATURESDetect Voltage Range: 1.6V ~ 5.0V, +2% (100mV increments)Hysteresis Range : V DF x 5%, TYP .(XC6101~XC6107)V DF x 0.1%, TYP .(XC6111~XC6117)Operating Voltage Range : 1.0V ~ 6.0V Detect Voltage Temperature Characteristics : +100ppm/O C (TYP .) Output Configuration : N-channel open drain,CMOSWatchdog Pin : Watchdog inputIf watchdog input maintains ‘H’ or ‘L’ within the watchdog timeout period, a reset signal is output to the RESET output pinManual Reset Pin : When driven ‘H’ to ‘L’levelsignal, the MRB pin voltage asserts forced reset on theoutput pin.Release Delay Time : 1.6sec, 400msec, 200msec,100msec, 50msec, 25msec, 3.13msec (TYP .) can be selectable.Watchdog Timeout Period : 1.6sec, 400msec, 200msec,100msec, 50msec,6.25msec (TYP .) can be selectable.■TYPICAL PERFORMANCE CHARACTERISTICS ●Supply Current vs. Input Voltage* ‘x’ represents both ‘0’ and ‘1’. (ex. XC61x1⇒XC6101 and XC6111)2/26XC6101~XC6107, XC6111~XC6117 SeriesPIN NUMBERXC6101, XC6102 XC6103 XC6104, XC6105XC6106, XC6107XC6111, XC6112 XC6113 XC6114, XC6115XC6116, XC6117SOT-25 USP-6C SOT-25 USP-6C SOT-25 USP-6C SOT-25USP-6CPIN NAMEFUNCTION1 4 - - 1 4 1 4 R ESETB Reset Output(V DFL : Low Level When Detected)2 5 2 5 2 5 2 5 V SSGround3 2 3 2 - -4 1 M RB ManualReset 4 1 4 1 4 1 - - WDWatchdog5 6 5 6 5 6 5 6 V IN Power Input - - 1 4 3 2 3 2 RESETReset Output (V DFH: High Level When Detected)■PIN CONFIGURATION SOT-25 (TOP VIEW)MRBV IN WD RESETBV SSMRBWD RESETV SSV IN RESETWD RESETBV SS V IN SOT-25 (TOP VIEW)RESETMRB RESETBV SS V IN SOT-25 (TOP VIEW) ■PIN ASSIGNMENT●SOT-25XC6101, XC6102 SeriesXC6111, XC6112 SeriesSOT-25 (TOP VIEW)XC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 Series●USP-6CXC6101, XC6102 Series XC6111, XC6112 SeriesXC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 SeriesUSP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)* The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS pin.3/26XC6101 ~ XC6107, XC6111~ XC6117SeriesRESET OUTPUTSERIES WATCHDOGMANUAL RESET V DFL (RESETB)V DFH (RESET)XC6101 XC6111 Available Available CMOS - XC6102XC6112AvailableAvailableN-channel open drain-XC6103 XC6113 Available Available - CMOS XC6104 XC6114 Available Not AvailableCMOS CMOS XC6105 XC6115 Available Not Available N-channel open drain CMOS XC6106 XC6116 Not Available AvailableCMOSCMOS XC6107XC6117Not AvailableAvailableN-channel open drainCMOSDESIGNATORDESCRIPTIONSYMBOLDESCRIPTION0 : V DF x 5% (TYP .) with hysteresis ① Hysteresis Range1 : V DF x 0.1% (TYP .) without hysteresis② Functions and Type of Reset Output1 ~ 7: Watchdog and manual functions, and reset output type as per Selection Guide in the above chartA : 3.13msec (TYP .)B : 25msec (TYP .) C: 50msec (TYP .) D : 100msec (TYP .) E : 200msec (TYP .) F : 400msec (TYP .) ③ Release Delay Time * H : 1.6sec (TYP .)0 : No WD timeout period forXC6106, XC6107, XC6116, XC6117 Series 1: 6.25msec (TYP .) 2 : 50msec (TYP .) 3 : 100msec (TYP .) 4 : 200msec (TYP .) 5 : 400msec (TYP .) ④ Watchdog Timeout Period6: 1.6sec (TYP .) ⑤⑥ Detect Voltage 16 ~ 50: Detect voltageex.) 4.5V: ⑤⇒4, ⑥⇒5M : SOT-25 ⑦ Package E : USP-6C R : Embossed tape, standard feed ⑧ Device OrientationL: Embossed tape, reverse feed* Please set the release delay time shorter than or equal to the watchdog timeout period. ex.) XC6101D427MR or XC6101D327MR■PRODUCT CLASSIFICATION ●Selection Guide ●Ordering Information XC61①②③④⑤⑥⑦⑧4/26XC6101~XC6107, XC6111~XC6117 Series■PACKAGING INFORMATION●SOT-25●USP-6C5/26XC6101 ~ XC6107, XC6111~ XC6117Series④ Represents production lot number0 to 9 and A to Z and inverted 0 to 9 and A to Z repeated. (G, I, J, O, Q, W expected.) * ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)■MARKING RULE●SOT-25①②③④SOT-25 (TOP VIEW)6/26XC6101~XC6107, XC6111~XC6117 Series① Represents product series② Represents release delay time MARK RELEASE DELAY TIME PRODUCT SERIES A 3.13msec XC61XxAxxxxx B 25msec XC61XxBxxxxx C 50msec XC61XxCxxxxx D 100msec XC61XxDxxxxx E 200msec XC61XxExxxxx F 400msec XC61XxFxxxxx H 1.6sec XC61XxHxxxxx③ Represents watchdog timeout period MARK WATCHDOG TIMEOUT PERIOD PRODUCT SERIES 0 XC61X6, XC61X7 series XC61Xxx0xxxx 1 6.25msec XC61Xxx1xxxx 2 50msec XC61Xxx2xxxx 3 100msec XC61Xxx3xxxx 4 200msec XC61Xxx4xxxx 5 400msec XC61Xxx5xxxx 6 1.6sec XC61Xxx6xxxx④⑤ Represents detect voltage MARK④ ⑤DETECT VOLTAGE (V)PRODUCT SERIES3 3 3.3 XC61Xxxx33xx 5 0 5.0XC61Xxxx50xx⑥ Represents production lot number0 to 9 and A to Z repeated. (G, I, J, O, Q, W excepted.)* No character inversion used. ** ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)MARK PRODUCT SERIES MARK PRODUCT SERIES 3 XC6101xxxxxx 8 XC6111xxxxxx 4 XC6102xxxxxx 9 XC6112xxxxxx 5 XC6103xxxxxx A XC6113xxxxxx 6 XC6104xxxxxx B XC6114xxxxxx 7 XC6105xxxxxx C XC6115xxxxxx 3 XC6106xxxxxx 8 XC6116xxxxxx 4 XC6107xxxxxx 9 XC6117xxxxxx■MARKING RULE (Continued)●USP-6CUSP-6C (TOP VIEW)7/26XC6101 ~ XC6107, XC6111~ XC6117Series■BLOCK DIAGRAMS●XC6101, XC6111 Series●XC6102, XC6112 Series●XC6103, XC6113 Series8/26XC6101~XC6107, XC6111~XC6117 Series■BLOCK DIAGRAMS (Continued)●XC6107, XC6117 Series●XC6106, XC6116 Series●XC6105, XC6115 Series●XC6104, XC6114 Series9/26XC6101 ~ XC6107, XC6111~ XC6117SeriesPARAMETERSYMBOL RATINGSUNITSV INV SS -0.3 ~ 7.0 VM RBV SS -0.3 ~ V IN +0.3 VInput Voltage WD V SS -0.3 ~ 7.0V Output Current I OUT 20 mACMOS Output RESETB/RESET V SS -0.3 ~ V IN +0.3Output Voltage N-ch Open Drain Output RESETB V SS -0.3 ~ 7.0VSOT-25 250Power Dissipation USP-6C Pd 100mWOperational Temperature Range Topr -40 ~ +85 OCStorage Temperature Range Tstg -40 ~ +125 OC■ABSOLUTE MAXIMUM RATINGSTa = 25O C10/26XC6101~XC6107, XC6111~XC6117 SeriesNOTE:*1: XC6101~XC6107 (with hysteresis) *2: XC6111~XC6117 (without hysteresis)*3: ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111) *4: V DF(T): Setting detect voltage*5: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).PARAMETERSYMBOLCONDITIONSMIN.TYP .MAX. UNITS CIRCUITDetect Voltage V DFL V DFHV DF(T)× 0.98V DF(T) V DF(T)× 1.02 V 1 Hysteresis Range XC6101~XC6107 (*1) V HYS V DF × 0.02V DF × 0.05 V DF× 0.08 V 1Hysteresis Range XC6111~XC6117 (*2) V HYS 0 V DF × 0.001 V DFx 0.01V 1V IN =V DF(T)×0.9V - 5 11 V IN =V DF(T)×1.1V- 10 16 XC61X1/XC61X2/XC61X3XC61X4/XC61X5 (*3)(The MRB & the WD Pin: No connection) V IN =6.0V - 1218 V IN =V DF(T)×0.9V - 4 10 V IN =V DF(T)×1.1V - 8 14 Supply Current I SS XC61X6/XC61X7 (*3)(The MRB Pin: No connection)V IN = 6.0V - 1016 µA 2Operating Voltage V IN 1.0 - 6.0 V 1VIN = 1.0V 0.15 0.5 -V IN =2.0V (V DFL(T)> 2.0V) 2.0 2.5 - V IN =3.0V (V DFL(T) >3.0V) 3.0 3.5 -N-ch.V DS = 0.5V V IN =4.0V (V DFL(T) >4.0V) 3.5 4.0 - 3 V DFL Output Current (RESETB) I RBOUTCMOS,P-chV DS = 0.5V V IN = 6.0V - - 1.1 -0.8 mA 4 N-chV DS = 0.5VV IN =6.0V 4.4 4.9 - 3V IN =1.0V - - 0.08 - 0.02 V IN =2.0V (V DFH(T)> 2.0V)- - 0.50 - 0.30 V IN =3.0V (V DFH(T)>3.0V)- - 0.75 - 0.55V DFHOutput Current (RESET) I ROUT P-ch. V DS = 0.5V V IN =4.0V (V DFH(T)>4.0V)- - 0.95 - 0.75 mA 4Temperature Characteristics △V DF / △Topr ・V DF -40OC < Topr < 85 O C - +100 - ppm / O C12 3.13 5 13 25 3825 50 75 60 100 140 120 200 280 240 400 560Release Delay Time(V DF <1.8V)T DR Time until V IN is increased from1.0V to2.0Vand attains to the release time level,and the Reset output pin inverts.960 1600 2240 ms 5 2 3.13 5 13 25 38 25 50 7560 100 140 120 200 280 240 400 560 Release Delay Time(V DF >1.9V)T DRTime until V IN is increased from1.0V to (V DF x1.1V) and attains to the releasetime level,and the Reset output pin inverts. 960 1600 2240ms 5 Detect Delay Time T DFTime until V IN is decreased from 6.0V to 1.0V and attains to the detect voltage level, and the Reset output pin detectswhile the WD pin left opened.- 3 30 µs 5V DFL /V DFH CMOS Output Leak CurrentI LEAK V IN =6.0V, RESETB=6.0V (V DFL ) V IN =6.0V, RESET=0V (V DFH )- 0.01 - µA 3V DFL N-ch Open DrainOutput Leak CurrentI LEAKV IN =6.0V, RESETB=6.0V-0.010.10µA 3■ELECTRICAL CHARACTERISTICS●XC6101~XC6107, XC6111~XC6117 SeriesTa = 25O CSeriesPARAMETERSYMBOL CONDITIONS MIN.TYP . MAX. UNITS CIRCUIT3.13 6.25 9.38 25 50 7560 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF <1.8V)T WDTime until V IN increases form1.0V to2.0V andthe Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 3.13 6.25 9.38 25 50 75 60 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF >1.9V)T WDTime until V IN increases form1.0V to (V DF x1.1V)and the Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 WatchdogMinimum Pulse Width T WDIN V IN =6.0V,Apply pulse from 6.0V to 0Vto the WD pin. 300 - - ns 7 Watchdog High Level VoltageV WDH V IN =V DF x 1.1V ~ 6.0V V IN x 0.7- 6 V 7 Watchdog Low Level Voltage V WDL V IN =V DF x 1.1V ~ 6.0V0 - V IN x 0.3 V 7 V IN =6.0V, V WD =6.0V (Avg. when peak )- 12 19Watchdog Input Current I WD V IN =6.0V, V WD =0V (Avg. when peak) - 19 -12 -µA 8 Watchdog Input ResistanceR WDV IN =6.0V, V WD =0V, R WD =V IN / |I WD |315500880k Ω8PARAMETERSYMBOL CONDITIONS MIN.TYP . MAX.UNITS CIRCUITMRBHigh Level VoltageV MRH V IN =V DF x1.1V ~ 6.0V 1.4 - V IN 9MRBLow Level VoltageV MRL V IN =V DF x1.1V ~ 6.0V-0.35 V9MRBPull-up Resistance R MR V IN =6.0V, MRB=0V, R MR =V IN / |I MRB | 1.6 2.4 3.0 M Ω 10 MRB Minimum Pulse Width (*3) XC6101~XC6105 XC6111~XC6115 T MRINV IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin 2.8 - -MRB Minimum Pulse Width (*4) XC6106, XC6107 XC6116, XC6117T MRIN V IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin1.2 - -µs11●XC6101 ~ XC6103, XC6106 ~ XC6107, XC6111 ~ XC6113, XC6116 ~ XC6117 Series NOTE:*1: V DF(T): Setting detect voltage *2: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected). *3: Watchdog function is available. *4: Watchdog function is not available.Ta = 25O CTa = 25O C ■ELECTRICAL CHARACTERISTICS (Continued)●XC6101~XC6105, XC6111~XC6115 Series■OPERATIONAL EXPLANATIONThe XC6101~XC6107, XC6111~XC6117 series compare, using the error amplifier, the voltage of the internal voltage reference source with the voltage divided by R1, R2 and R3 connected to the V IN pin. The resulting output signal from the error amplifier activates the watchdog logic, manual reset logic, delay circuit and the output driver. When the V IN pin voltage gradually falls and finally reaches the detect voltage, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type ICs.<RESETB / RESET Pin Output Signal>* V DFL (RESETB) type - output signal: Low when detected.The RESETB pin output goes from high to low whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESETB pin remains low for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the RESETB pin output remains low for the release delay time (T DR), and thereafter the RESET pin outputs high level signal. * V DFH (RESET) type – output signal: High when detected.The RESET pin output goes from low to high whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESET pin remains high for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the V OUT pin output remains high for the release delay time (T DR), and thereafter the RESET pin outputs low level signal.<Hysteresis>When the internal comparator output is high, the NMOS transistor connected in parallel to R3 is turned ON, activating the hysteresis circuit. The difference between the release and detect voltages represents the hysteresis range, as shown by the following calculations:V DF (detect voltage) = (R1+R2+R3) x Vref(R2+R3)V DR (release voltage) = (R1+R2) x Vref(R2)V HYS (hysteresis range)=V DR-V DF (V)V DR > V DF* Detect voltage (V DF) includes conditions of both V DFL (low when detected) and V DFH (high when detected).* Please refer to the block diagrams for R1, R2, R3 and Vref.Hysteresis range is selectable from V DF x 0.05V (XC6101~XC6107) or V DF x 0.001V (XC6111~XC6117).<Watchdog (WD) Pin>The XC6101~XC6107, XC6111~XC6117 series use a watchdog timer to detect malfunction or “runaway” of the microprocessor. If neither rising nor falling signals are applied from the microprocessor within the watchdog timeout period, the RESETB/RESET pin output maintains the detection state for the release delay time (T DR), and thereafter the RESET/RESETB pin output returns to the release state (Please refer to the FUNCTION CHART). The timer in the watchdog is then restarted. Six watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 6.25msec.<MRB Pin>Using the MRB pin input, the RESET/RESETB pin signal can be forced to the detection state. When the MRB pin is driven from high to low, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type. Even after the MRB pin is driven back high, the RESET/RESETB pin output maintains the detection state for the release delay time (T DR). Since the MRB pin is internally pulled up to the V IN pin voltage level, leave the MRB pin open if unused (Please refer to the FUNCTION CHART). A diode, which is an input protection element, is connected between the MRB pin and V IN pin. Therefore, if the MRB pin is applied voltage that exceeds V IN, the current will flow to V IN through the diode. Please use this IC within the stated maximum ratings (V SS -0.3 ~ V IN+0.3) on the MRB pin.<Release Delay Time>Release delay time (T DR) is the time that elapses from when the V IN pin reaches the release voltage, or when the watchdog timeout period expires with no rising signal applied to the WD pin, until the RESET/RESETB pin output is released from the detection state. Seven release delay time (T DR) watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 25msec, 3.13msec.<Detect Delay Time>Detect Delay Time (T DF) is the time that elapses from when the V IN pin voltage falls to the detect voltage until the RESET/ RESETB pin output goes into the detection state.Series■TIMING CHARTS●CMOS Output●T DF (CMOS Output)VINVDFL LevelGNDVIN Level VDFL Level GNDVIN x 0.1V■NOTES ON USE1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device.2. When a resistor is connected between the V IN pin and the input, the V IN voltage drops while the IC is operating and a malfunction may occur as a result of the IC’s through current. For the CMOS output products, the V IN voltage drops while the IC is operating and malfunction may occur as a result of the IC’s output current. Please be careful with using the XC6111~XC6117 series (without hysteresis).3. In order to stabilize the IC’s operations, please ensure that the V IN pin’s input frequency’s rise and fall times are more than 1 µ sec/V.4. Noise at the power supply may cause a malfunction of the watchdog operation or the circuit. In such case, please strength the line between V IN and the GND pin and connect about 0.22µF of a capacitor between the V IN pin and the GND pin.5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900µsec at maximum.GNDGNDGNDVIN Pin Wave FormWD Pin Wave FormRESETB Pin Wave Form (VDFL)SeriesPIN NAMELOGIC CONDITIONSH V IN >V DF +V HYS V IN L V IN <V DF H MRB>1.40V MRBL MRB<0.35V H When keeping W D >V WDH more than T WD L When keeping W D <V WDL more than T WD L → H V WDL → V WDH , T WDIN >300nsec WDH → L V WDH →V WDH , T WDIN >300nsecV IN MRB WD RESETB (*2) H HH LRepeat detect and release (H →L →H)H OpenH L → HH H or Open H → L H HLL *1 LV IN MRB WD RESETB (*3) H HH LRepeat detect and release (L →H →L)H OpenH L → HH H or Open H → L L HLL *1 HV IN WD RESETB (*2) RESET (*3) H HH L Repeat detect and release (H →L →H)Repeat detect and release (L →H →L)H OpenH L → HH H → L H L HL*1 L HV IN MRB RESETB (*2)RESET (*3)H H or Open H LH LL L H■PIN LOGIC CONDITIONSNOTE:*1: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).*2: For the details of each parameter, please see the electrical characteristics. V DF : Detect VoltageV HYS : Hysteresis RangeV WDH : WD High Level Voltage V WDL: WD Low Level Voltage T WDIN : WD Pulse Width T WD : WD Timeout Period■FUNCTION CHART●XC6103/XC61113 Series●XC6104/XC61114, XC6105/XC6115 Series●XC6106/XC61116, XC6107/XC6117 Series●XC6101/XC61111, XC6102/6112 Series*1: Including all logic of WD (WD=H, L, L →H, H →L, OPEN). *2: When the RESETB is High, the circuit is in the release state. When the RESETB is Low, the circuit is in the detection state. *3: When the RESET is High, the circuit is in the release state. When the RESET is Low, the circuit is in the detection state.■TEST CIRCUITSCircuit 1Circuit 2Circuit 3Circuit 4Series ■TEST CIRCUITS (Continued)Circuit 5Circuit 6Circuit 7■TEST CIRCUITS (Continued)Circuit 8Circuit 9Circuit 10Circuit 11Series■TYPICAL PERFORMANCE CHARACTERISTICS(1.1) Supply Current vs. Input Voltage(1.2) Supply Current vs. Input Voltage■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(2) Detect, Release Voltage vs. Ambient Temperature(1.2) Supply Current vs. Input Voltage (Continued)Series■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3-1) Output Voltage vs. Input Voltage (V DFL ) (3.1) Detect, Release Voltage vs. Input Voltage (V DFL )(3.2) Detect, Release Voltage vs. Input Voltage (V DFH )■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(4) N-ch Driver Output Current vs. V DSSeries(6) P-ch Driver Output Current vs. Input Voltage 1■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(8) Release Delay Time vs. Ambient Temperature(7) P-ch Driver Output Current vs. Input Voltage 2■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Release Delay Time vs. Input Voltage(11) Watchdog Timeout Period vs. Input VoltageSeries■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(14) MRB Low Level Voltage vs. Ambient Temperature(15) MRB High Level Voltage vs. Ambient Temperature* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)。
XC6103B626资料
1/26XC6101_07_XC6111_17 ETR0207_009Preliminary◆CMOS Voltage Detector◆Manual Reset Input ◆Watchdog Functions ◆Built-in Delay Circuit ◆Detect Voltage Range: 1.6~5.0V, ± 2% ◆Reset Function is Selectable V DFL (Low When Detected) V DFH (High When Detected)■GENERAL DESCRIPTION The XC6101~XC6107, XC6111~XC6117 series aregroups of high-precision, low current consumption voltage detectors with manual reset input function and watchdog functions incorporating CMOS process technology. The series consist of a reference voltage source, delay circuit, comparator, and output driver.With the built-in delay circuit, the XC6101 ~ XC6107, XC6111 ~ XC6117 series’ ICs do not require any external components to output signals with release delay time. Moreover, with the manual reset function, reset can be asserted at any time. The ICs produce two types of output; V DFL (low when detected) and V DFH (high when detected).With the XC6101 ~ XC6105, XC6111 ~ XC6115 series’ ICs, the WD pin can be left open if the watchdog function is not used. Whenever the watchdog pin is opened, the internal counter clears before the watchdog timeout occurs. Since the manual reset pin is internally pulled up to the V IN pin voltage level, the ICs can be used with the manual reset pin left unconnected if the pin is unused.The detect voltages are internally fixed 1.6V ~ 5.0V in increments of 100mV, using laser trimming technology. Six watchdog timeout period settings are available in a range from 6.25msec to 1.6sec. Seven release delay time 1 are available in a range from 3.13msec to 1.6sec.■APPLICATIONS●Microprocessor reset circuits●Memory battery backup circuits ●System power-on reset circuits ●Power failure detection■TYPICAL APPLICATION CIRCUIT* Not necessary with CMOS output products.■FEATURESDetect Voltage Range: 1.6V ~ 5.0V, +2% (100mV increments)Hysteresis Range : V DF x 5%, TYP .(XC6101~XC6107)V DF x 0.1%, TYP .(XC6111~XC6117)Operating Voltage Range : 1.0V ~ 6.0V Detect Voltage Temperature Characteristics : +100ppm/O C (TYP .) Output Configuration : N-channel open drain,CMOSWatchdog Pin : Watchdog inputIf watchdog input maintains ‘H’ or ‘L’ within the watchdog timeout period, a reset signal is output to the RESET output pinManual Reset Pin : When driven ‘H’ to ‘L’levelsignal, the MRB pin voltage asserts forced reset on theoutput pin.Release Delay Time : 1.6sec, 400msec, 200msec,100msec, 50msec, 25msec, 3.13msec (TYP .) can be selectable.Watchdog Timeout Period : 1.6sec, 400msec, 200msec,100msec, 50msec,6.25msec (TYP .) can be selectable.■TYPICAL PERFORMANCE CHARACTERISTICS ●Supply Current vs. Input Voltage* ‘x’ represents both ‘0’ and ‘1’. (ex. XC61x1⇒XC6101 and XC6111)2/26XC6101~XC6107, XC6111~XC6117 SeriesPIN NUMBERXC6101, XC6102 XC6103 XC6104, XC6105XC6106, XC6107XC6111, XC6112 XC6113 XC6114, XC6115XC6116, XC6117SOT-25 USP-6C SOT-25 USP-6C SOT-25 USP-6C SOT-25USP-6CPIN NAMEFUNCTION1 4 - - 1 4 1 4 R ESETB Reset Output(V DFL : Low Level When Detected)2 5 2 5 2 5 2 5 V SSGround3 2 3 2 - -4 1 M RB ManualReset 4 1 4 1 4 1 - - WDWatchdog5 6 5 6 5 6 5 6 V IN Power Input - - 1 4 3 2 3 2 RESETReset Output (V DFH: High Level When Detected)■PIN CONFIGURATION SOT-25 (TOP VIEW)MRBV IN WD RESETBV SSMRBWD RESETV SSV IN RESETWD RESETBV SS V IN SOT-25 (TOP VIEW)RESETMRB RESETBV SS V IN SOT-25 (TOP VIEW) ■PIN ASSIGNMENT●SOT-25XC6101, XC6102 SeriesXC6111, XC6112 SeriesSOT-25 (TOP VIEW)XC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 Series●USP-6CXC6101, XC6102 Series XC6111, XC6112 SeriesXC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 SeriesUSP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)* The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS pin.3/26XC6101 ~ XC6107, XC6111~ XC6117SeriesRESET OUTPUTSERIES WATCHDOGMANUAL RESET V DFL (RESETB)V DFH (RESET)XC6101 XC6111 Available Available CMOS - XC6102XC6112AvailableAvailableN-channel open drain-XC6103 XC6113 Available Available - CMOS XC6104 XC6114 Available Not AvailableCMOS CMOS XC6105 XC6115 Available Not Available N-channel open drain CMOS XC6106 XC6116 Not Available AvailableCMOSCMOS XC6107XC6117Not AvailableAvailableN-channel open drainCMOSDESIGNATORDESCRIPTIONSYMBOLDESCRIPTION0 : V DF x 5% (TYP .) with hysteresis ① Hysteresis Range1 : V DF x 0.1% (TYP .) without hysteresis② Functions and Type of Reset Output1 ~ 7: Watchdog and manual functions, and reset output type as per Selection Guide in the above chartA : 3.13msec (TYP .)B : 25msec (TYP .) C: 50msec (TYP .) D : 100msec (TYP .) E : 200msec (TYP .) F : 400msec (TYP .) ③ Release Delay Time * H : 1.6sec (TYP .)0 : No WD timeout period forXC6106, XC6107, XC6116, XC6117 Series 1: 6.25msec (TYP .) 2 : 50msec (TYP .) 3 : 100msec (TYP .) 4 : 200msec (TYP .) 5 : 400msec (TYP .) ④ Watchdog Timeout Period6: 1.6sec (TYP .) ⑤⑥ Detect Voltage 16 ~ 50: Detect voltageex.) 4.5V: ⑤⇒4, ⑥⇒5M : SOT-25 ⑦ Package E : USP-6C R : Embossed tape, standard feed ⑧ Device OrientationL: Embossed tape, reverse feed* Please set the release delay time shorter than or equal to the watchdog timeout period. ex.) XC6101D427MR or XC6101D327MR■PRODUCT CLASSIFICATION ●Selection Guide ●Ordering Information XC61①②③④⑤⑥⑦⑧4/26XC6101~XC6107, XC6111~XC6117 Series■PACKAGING INFORMATION●SOT-25●USP-6C5/26XC6101 ~ XC6107, XC6111~ XC6117Series④ Represents production lot number0 to 9 and A to Z and inverted 0 to 9 and A to Z repeated. (G, I, J, O, Q, W expected.) * ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)■MARKING RULE●SOT-25①②③④SOT-25 (TOP VIEW)6/26XC6101~XC6107, XC6111~XC6117 Series① Represents product series② Represents release delay time MARK RELEASE DELAY TIME PRODUCT SERIES A 3.13msec XC61XxAxxxxx B 25msec XC61XxBxxxxx C 50msec XC61XxCxxxxx D 100msec XC61XxDxxxxx E 200msec XC61XxExxxxx F 400msec XC61XxFxxxxx H 1.6sec XC61XxHxxxxx③ Represents watchdog timeout period MARK WATCHDOG TIMEOUT PERIOD PRODUCT SERIES 0 XC61X6, XC61X7 series XC61Xxx0xxxx 1 6.25msec XC61Xxx1xxxx 2 50msec XC61Xxx2xxxx 3 100msec XC61Xxx3xxxx 4 200msec XC61Xxx4xxxx 5 400msec XC61Xxx5xxxx 6 1.6sec XC61Xxx6xxxx④⑤ Represents detect voltage MARK④ ⑤DETECT VOLTAGE (V)PRODUCT SERIES3 3 3.3 XC61Xxxx33xx 5 0 5.0XC61Xxxx50xx⑥ Represents production lot number0 to 9 and A to Z repeated. (G, I, J, O, Q, W excepted.)* No character inversion used. ** ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)MARK PRODUCT SERIES MARK PRODUCT SERIES 3 XC6101xxxxxx 8 XC6111xxxxxx 4 XC6102xxxxxx 9 XC6112xxxxxx 5 XC6103xxxxxx A XC6113xxxxxx 6 XC6104xxxxxx B XC6114xxxxxx 7 XC6105xxxxxx C XC6115xxxxxx 3 XC6106xxxxxx 8 XC6116xxxxxx 4 XC6107xxxxxx 9 XC6117xxxxxx■MARKING RULE (Continued)●USP-6CUSP-6C (TOP VIEW)7/26XC6101 ~ XC6107, XC6111~ XC6117Series■BLOCK DIAGRAMS●XC6101, XC6111 Series●XC6102, XC6112 Series●XC6103, XC6113 Series8/26XC6101~XC6107, XC6111~XC6117 Series■BLOCK DIAGRAMS (Continued)●XC6107, XC6117 Series●XC6106, XC6116 Series●XC6105, XC6115 Series●XC6104, XC6114 Series9/26XC6101 ~ XC6107, XC6111~ XC6117SeriesPARAMETERSYMBOL RATINGSUNITSV INV SS -0.3 ~ 7.0 VM RBV SS -0.3 ~ V IN +0.3 VInput Voltage WD V SS -0.3 ~ 7.0V Output Current I OUT 20 mACMOS Output RESETB/RESET V SS -0.3 ~ V IN +0.3Output Voltage N-ch Open Drain Output RESETB V SS -0.3 ~ 7.0VSOT-25 250Power Dissipation USP-6C Pd 100mWOperational Temperature Range Topr -40 ~ +85 OCStorage Temperature Range Tstg -40 ~ +125 OC■ABSOLUTE MAXIMUM RATINGSTa = 25O C10/26XC6101~XC6107, XC6111~XC6117 SeriesNOTE:*1: XC6101~XC6107 (with hysteresis) *2: XC6111~XC6117 (without hysteresis)*3: ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111) *4: V DF(T): Setting detect voltage*5: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).PARAMETERSYMBOLCONDITIONSMIN.TYP .MAX. UNITS CIRCUITDetect Voltage V DFL V DFHV DF(T)× 0.98V DF(T) V DF(T)× 1.02 V 1 Hysteresis Range XC6101~XC6107 (*1) V HYS V DF × 0.02V DF × 0.05 V DF× 0.08 V 1Hysteresis Range XC6111~XC6117 (*2) V HYS 0 V DF × 0.001 V DFx 0.01V 1V IN =V DF(T)×0.9V - 5 11 V IN =V DF(T)×1.1V- 10 16 XC61X1/XC61X2/XC61X3XC61X4/XC61X5 (*3)(The MRB & the WD Pin: No connection) V IN =6.0V - 1218 V IN =V DF(T)×0.9V - 4 10 V IN =V DF(T)×1.1V - 8 14 Supply Current I SS XC61X6/XC61X7 (*3)(The MRB Pin: No connection)V IN = 6.0V - 1016 µA 2Operating Voltage V IN 1.0 - 6.0 V 1VIN = 1.0V 0.15 0.5 -V IN =2.0V (V DFL(T)> 2.0V) 2.0 2.5 - V IN =3.0V (V DFL(T) >3.0V) 3.0 3.5 -N-ch.V DS = 0.5V V IN =4.0V (V DFL(T) >4.0V) 3.5 4.0 - 3 V DFL Output Current (RESETB) I RBOUTCMOS,P-chV DS = 0.5V V IN = 6.0V - - 1.1 -0.8 mA 4 N-chV DS = 0.5VV IN =6.0V 4.4 4.9 - 3V IN =1.0V - - 0.08 - 0.02 V IN =2.0V (V DFH(T)> 2.0V)- - 0.50 - 0.30 V IN =3.0V (V DFH(T)>3.0V)- - 0.75 - 0.55V DFHOutput Current (RESET) I ROUT P-ch. V DS = 0.5V V IN =4.0V (V DFH(T)>4.0V)- - 0.95 - 0.75 mA 4Temperature Characteristics △V DF / △Topr ・V DF -40OC < Topr < 85 O C - +100 - ppm / O C12 3.13 5 13 25 3825 50 75 60 100 140 120 200 280 240 400 560Release Delay Time(V DF <1.8V)T DR Time until V IN is increased from1.0V to2.0Vand attains to the release time level,and the Reset output pin inverts.960 1600 2240 ms 5 2 3.13 5 13 25 38 25 50 7560 100 140 120 200 280 240 400 560 Release Delay Time(V DF >1.9V)T DRTime until V IN is increased from1.0V to (V DF x1.1V) and attains to the releasetime level,and the Reset output pin inverts. 960 1600 2240ms 5 Detect Delay Time T DFTime until V IN is decreased from 6.0V to 1.0V and attains to the detect voltage level, and the Reset output pin detectswhile the WD pin left opened.- 3 30 µs 5V DFL /V DFH CMOS Output Leak CurrentI LEAK V IN =6.0V, RESETB=6.0V (V DFL ) V IN =6.0V, RESET=0V (V DFH )- 0.01 - µA 3V DFL N-ch Open DrainOutput Leak CurrentI LEAKV IN =6.0V, RESETB=6.0V-0.010.10µA 3■ELECTRICAL CHARACTERISTICS●XC6101~XC6107, XC6111~XC6117 SeriesTa = 25O CSeriesPARAMETERSYMBOL CONDITIONS MIN.TYP . MAX. UNITS CIRCUIT3.13 6.25 9.38 25 50 7560 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF <1.8V)T WDTime until V IN increases form1.0V to2.0V andthe Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 3.13 6.25 9.38 25 50 75 60 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF >1.9V)T WDTime until V IN increases form1.0V to (V DF x1.1V)and the Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 WatchdogMinimum Pulse Width T WDIN V IN =6.0V,Apply pulse from 6.0V to 0Vto the WD pin. 300 - - ns 7 Watchdog High Level VoltageV WDH V IN =V DF x 1.1V ~ 6.0V V IN x 0.7- 6 V 7 Watchdog Low Level Voltage V WDL V IN =V DF x 1.1V ~ 6.0V0 - V IN x 0.3 V 7 V IN =6.0V, V WD =6.0V (Avg. when peak )- 12 19Watchdog Input Current I WD V IN =6.0V, V WD =0V (Avg. when peak) - 19 -12 -µA 8 Watchdog Input ResistanceR WDV IN =6.0V, V WD =0V, R WD =V IN / |I WD |315500880k Ω8PARAMETERSYMBOL CONDITIONS MIN.TYP . MAX.UNITS CIRCUITMRBHigh Level VoltageV MRH V IN =V DF x1.1V ~ 6.0V 1.4 - V IN 9MRBLow Level VoltageV MRL V IN =V DF x1.1V ~ 6.0V-0.35 V9MRBPull-up Resistance R MR V IN =6.0V, MRB=0V, R MR =V IN / |I MRB | 1.6 2.4 3.0 M Ω 10 MRB Minimum Pulse Width (*3) XC6101~XC6105 XC6111~XC6115 T MRINV IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin 2.8 - -MRB Minimum Pulse Width (*4) XC6106, XC6107 XC6116, XC6117T MRIN V IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin1.2 - -µs11●XC6101 ~ XC6103, XC6106 ~ XC6107, XC6111 ~ XC6113, XC6116 ~ XC6117 Series NOTE:*1: V DF(T): Setting detect voltage *2: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected). *3: Watchdog function is available. *4: Watchdog function is not available.Ta = 25O CTa = 25O C ■ELECTRICAL CHARACTERISTICS (Continued)●XC6101~XC6105, XC6111~XC6115 Series■OPERATIONAL EXPLANATIONThe XC6101~XC6107, XC6111~XC6117 series compare, using the error amplifier, the voltage of the internal voltage reference source with the voltage divided by R1, R2 and R3 connected to the V IN pin. The resulting output signal from the error amplifier activates the watchdog logic, manual reset logic, delay circuit and the output driver. When the V IN pin voltage gradually falls and finally reaches the detect voltage, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type ICs.<RESETB / RESET Pin Output Signal>* V DFL (RESETB) type - output signal: Low when detected.The RESETB pin output goes from high to low whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESETB pin remains low for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the RESETB pin output remains low for the release delay time (T DR), and thereafter the RESET pin outputs high level signal. * V DFH (RESET) type – output signal: High when detected.The RESET pin output goes from low to high whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESET pin remains high for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the V OUT pin output remains high for the release delay time (T DR), and thereafter the RESET pin outputs low level signal.<Hysteresis>When the internal comparator output is high, the NMOS transistor connected in parallel to R3 is turned ON, activating the hysteresis circuit. The difference between the release and detect voltages represents the hysteresis range, as shown by the following calculations:V DF (detect voltage) = (R1+R2+R3) x Vref(R2+R3)V DR (release voltage) = (R1+R2) x Vref(R2)V HYS (hysteresis range)=V DR-V DF (V)V DR > V DF* Detect voltage (V DF) includes conditions of both V DFL (low when detected) and V DFH (high when detected).* Please refer to the block diagrams for R1, R2, R3 and Vref.Hysteresis range is selectable from V DF x 0.05V (XC6101~XC6107) or V DF x 0.001V (XC6111~XC6117).<Watchdog (WD) Pin>The XC6101~XC6107, XC6111~XC6117 series use a watchdog timer to detect malfunction or “runaway” of the microprocessor. If neither rising nor falling signals are applied from the microprocessor within the watchdog timeout period, the RESETB/RESET pin output maintains the detection state for the release delay time (T DR), and thereafter the RESET/RESETB pin output returns to the release state (Please refer to the FUNCTION CHART). The timer in the watchdog is then restarted. Six watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 6.25msec.<MRB Pin>Using the MRB pin input, the RESET/RESETB pin signal can be forced to the detection state. When the MRB pin is driven from high to low, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type. Even after the MRB pin is driven back high, the RESET/RESETB pin output maintains the detection state for the release delay time (T DR). Since the MRB pin is internally pulled up to the V IN pin voltage level, leave the MRB pin open if unused (Please refer to the FUNCTION CHART). A diode, which is an input protection element, is connected between the MRB pin and V IN pin. Therefore, if the MRB pin is applied voltage that exceeds V IN, the current will flow to V IN through the diode. Please use this IC within the stated maximum ratings (V SS -0.3 ~ V IN+0.3) on the MRB pin.<Release Delay Time>Release delay time (T DR) is the time that elapses from when the V IN pin reaches the release voltage, or when the watchdog timeout period expires with no rising signal applied to the WD pin, until the RESET/RESETB pin output is released from the detection state. Seven release delay time (T DR) watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 25msec, 3.13msec.<Detect Delay Time>Detect Delay Time (T DF) is the time that elapses from when the V IN pin voltage falls to the detect voltage until the RESET/ RESETB pin output goes into the detection state.Series■TIMING CHARTS●CMOS Output●T DF (CMOS Output)VINVDFL LevelGNDVIN Level VDFL Level GNDVIN x 0.1V■NOTES ON USE1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device.2. When a resistor is connected between the V IN pin and the input, the V IN voltage drops while the IC is operating and a malfunction may occur as a result of the IC’s through current. For the CMOS output products, the V IN voltage drops while the IC is operating and malfunction may occur as a result of the IC’s output current. Please be careful with using the XC6111~XC6117 series (without hysteresis).3. In order to stabilize the IC’s operations, please ensure that the V IN pin’s input frequency’s rise and fall times are more than 1 µ sec/V.4. Noise at the power supply may cause a malfunction of the watchdog operation or the circuit. In such case, please strength the line between V IN and the GND pin and connect about 0.22µF of a capacitor between the V IN pin and the GND pin.5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900µsec at maximum.GNDGNDGNDVIN Pin Wave FormWD Pin Wave FormRESETB Pin Wave Form (VDFL)SeriesPIN NAMELOGIC CONDITIONSH V IN >V DF +V HYS V IN L V IN <V DF H MRB>1.40V MRBL MRB<0.35V H When keeping W D >V WDH more than T WD L When keeping W D <V WDL more than T WD L → H V WDL → V WDH , T WDIN >300nsec WDH → L V WDH →V WDH , T WDIN >300nsecV IN MRB WD RESETB (*2) H HH LRepeat detect and release (H →L →H)H OpenH L → HH H or Open H → L H HLL *1 LV IN MRB WD RESETB (*3) H HH LRepeat detect and release (L →H →L)H OpenH L → HH H or Open H → L L HLL *1 HV IN WD RESETB (*2) RESET (*3) H HH L Repeat detect and release (H →L →H)Repeat detect and release (L →H →L)H OpenH L → HH H → L H L HL*1 L HV IN MRB RESETB (*2)RESET (*3)H H or Open H LH LL L H■PIN LOGIC CONDITIONSNOTE:*1: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).*2: For the details of each parameter, please see the electrical characteristics. V DF : Detect VoltageV HYS : Hysteresis RangeV WDH : WD High Level Voltage V WDL: WD Low Level Voltage T WDIN : WD Pulse Width T WD : WD Timeout Period■FUNCTION CHART●XC6103/XC61113 Series●XC6104/XC61114, XC6105/XC6115 Series●XC6106/XC61116, XC6107/XC6117 Series●XC6101/XC61111, XC6102/6112 Series*1: Including all logic of WD (WD=H, L, L →H, H →L, OPEN). *2: When the RESETB is High, the circuit is in the release state. When the RESETB is Low, the circuit is in the detection state. *3: When the RESET is High, the circuit is in the release state. When the RESET is Low, the circuit is in the detection state.■TEST CIRCUITSCircuit 1Circuit 2Circuit 3Circuit 4Series ■TEST CIRCUITS (Continued)Circuit 5Circuit 6Circuit 7■TEST CIRCUITS (Continued)Circuit 8Circuit 9Circuit 10Circuit 11Series■TYPICAL PERFORMANCE CHARACTERISTICS(1.1) Supply Current vs. Input Voltage(1.2) Supply Current vs. Input Voltage■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(2) Detect, Release Voltage vs. Ambient Temperature(1.2) Supply Current vs. Input Voltage (Continued)Series■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3-1) Output Voltage vs. Input Voltage (V DFL ) (3.1) Detect, Release Voltage vs. Input Voltage (V DFL )(3.2) Detect, Release Voltage vs. Input Voltage (V DFH )■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(4) N-ch Driver Output Current vs. V DSSeries(6) P-ch Driver Output Current vs. Input Voltage 1■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(8) Release Delay Time vs. Ambient Temperature(7) P-ch Driver Output Current vs. Input Voltage 2■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Release Delay Time vs. Input Voltage(11) Watchdog Timeout Period vs. Input VoltageSeries■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(14) MRB Low Level Voltage vs. Ambient Temperature(15) MRB High Level Voltage vs. Ambient Temperature* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)。
LTC6101ACS5#TRMPBF资料
5.5V 5V
VOUT
0.5V 0V
TA = 25°C V+ = 12V RIN = 100 ROUT = 5k VSENSE+ = V+ IOUT = 100μA
IOUT = 0
500ns/DIV
6101 TA01b
6101fg
1
元器件交易网
LTC6101/LTC6101HV
LTC6101C/LTC6101HVC.......................– 40°C to 85°C
LTC6101I/LTC6101HVI......................... –40°C to 85°C LTC6101H/LTC6101HVH ................... –40°C to 125°C Specified Temperature Range (Note 2) LTC6101C/LTC6101HVC........................... 0°C to 70°C LTC6101I/LTC6101HVI......................... –40°C to 85°C LTC6101H/LTC6101HVH ................... –40°C to 125°C Storage Temperature Range.................. –65°C to 150°C Lead Temperature (Soldering, 10 sec) ................. 300°C
XC6113B539资料
1/26XC6101_07_XC6111_17 ETR0207_009Preliminary◆CMOS Voltage Detector◆Manual Reset Input ◆Watchdog Functions ◆Built-in Delay Circuit ◆Detect Voltage Range: 1.6~5.0V, ± 2% ◆Reset Function is Selectable V DFL (Low When Detected) V DFH (High When Detected)■GENERAL DESCRIPTION The XC6101~XC6107, XC6111~XC6117 series aregroups of high-precision, low current consumption voltage detectors with manual reset input function and watchdog functions incorporating CMOS process technology. The series consist of a reference voltage source, delay circuit, comparator, and output driver.With the built-in delay circuit, the XC6101 ~ XC6107, XC6111 ~ XC6117 series’ ICs do not require any external components to output signals with release delay time. Moreover, with the manual reset function, reset can be asserted at any time. The ICs produce two types of output; V DFL (low when detected) and V DFH (high when detected).With the XC6101 ~ XC6105, XC6111 ~ XC6115 series’ ICs, the WD pin can be left open if the watchdog function is not used. Whenever the watchdog pin is opened, the internal counter clears before the watchdog timeout occurs. Since the manual reset pin is internally pulled up to the V IN pin voltage level, the ICs can be used with the manual reset pin left unconnected if the pin is unused.The detect voltages are internally fixed 1.6V ~ 5.0V in increments of 100mV, using laser trimming technology. Six watchdog timeout period settings are available in a range from 6.25msec to 1.6sec. Seven release delay time 1 are available in a range from 3.13msec to 1.6sec.■APPLICATIONS●Microprocessor reset circuits●Memory battery backup circuits ●System power-on reset circuits ●Power failure detection■TYPICAL APPLICATION CIRCUIT* Not necessary with CMOS output products.■FEATURESDetect Voltage Range: 1.6V ~ 5.0V, +2% (100mV increments)Hysteresis Range : V DF x 5%, TYP .(XC6101~XC6107)V DF x 0.1%, TYP .(XC6111~XC6117)Operating Voltage Range : 1.0V ~ 6.0V Detect Voltage Temperature Characteristics : +100ppm/O C (TYP .) Output Configuration : N-channel open drain,CMOSWatchdog Pin : Watchdog inputIf watchdog input maintains ‘H’ or ‘L’ within the watchdog timeout period, a reset signal is output to the RESET output pinManual Reset Pin : When driven ‘H’ to ‘L’levelsignal, the MRB pin voltage asserts forced reset on theoutput pin.Release Delay Time : 1.6sec, 400msec, 200msec,100msec, 50msec, 25msec, 3.13msec (TYP .) can be selectable.Watchdog Timeout Period : 1.6sec, 400msec, 200msec,100msec, 50msec,6.25msec (TYP .) can be selectable.■TYPICAL PERFORMANCE CHARACTERISTICS ●Supply Current vs. Input Voltage* ‘x’ represents both ‘0’ and ‘1’. (ex. XC61x1⇒XC6101 and XC6111)2/26XC6101~XC6107, XC6111~XC6117 SeriesPIN NUMBERXC6101, XC6102 XC6103 XC6104, XC6105XC6106, XC6107XC6111, XC6112 XC6113 XC6114, XC6115XC6116, XC6117SOT-25 USP-6C SOT-25 USP-6C SOT-25 USP-6C SOT-25USP-6CPIN NAMEFUNCTION1 4 - - 1 4 1 4 R ESETB Reset Output(V DFL : Low Level When Detected)2 5 2 5 2 5 2 5 V SSGround3 2 3 2 - -4 1 M RB ManualReset 4 1 4 1 4 1 - - WDWatchdog5 6 5 6 5 6 5 6 V IN Power Input - - 1 4 3 2 3 2 RESETReset Output (V DFH: High Level When Detected)■PIN CONFIGURATION SOT-25 (TOP VIEW)MRBV IN WD RESETBV SSMRBWD RESETV SSV IN RESETWD RESETBV SS V IN SOT-25 (TOP VIEW)RESETMRB RESETBV SS V IN SOT-25 (TOP VIEW) ■PIN ASSIGNMENT●SOT-25XC6101, XC6102 SeriesXC6111, XC6112 SeriesSOT-25 (TOP VIEW)XC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 Series●USP-6CXC6101, XC6102 Series XC6111, XC6112 SeriesXC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 SeriesUSP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)* The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS pin.3/26XC6101 ~ XC6107, XC6111~ XC6117SeriesRESET OUTPUTSERIES WATCHDOGMANUAL RESET V DFL (RESETB)V DFH (RESET)XC6101 XC6111 Available Available CMOS - XC6102XC6112AvailableAvailableN-channel open drain-XC6103 XC6113 Available Available - CMOS XC6104 XC6114 Available Not AvailableCMOS CMOS XC6105 XC6115 Available Not Available N-channel open drain CMOS XC6106 XC6116 Not Available AvailableCMOSCMOS XC6107XC6117Not AvailableAvailableN-channel open drainCMOSDESIGNATORDESCRIPTIONSYMBOLDESCRIPTION0 : V DF x 5% (TYP .) with hysteresis ① Hysteresis Range1 : V DF x 0.1% (TYP .) without hysteresis② Functions and Type of Reset Output1 ~ 7: Watchdog and manual functions, and reset output type as per Selection Guide in the above chartA : 3.13msec (TYP .)B : 25msec (TYP .) C: 50msec (TYP .) D : 100msec (TYP .) E : 200msec (TYP .) F : 400msec (TYP .) ③ Release Delay Time * H : 1.6sec (TYP .)0 : No WD timeout period forXC6106, XC6107, XC6116, XC6117 Series 1: 6.25msec (TYP .) 2 : 50msec (TYP .) 3 : 100msec (TYP .) 4 : 200msec (TYP .) 5 : 400msec (TYP .) ④ Watchdog Timeout Period6: 1.6sec (TYP .) ⑤⑥ Detect Voltage 16 ~ 50: Detect voltageex.) 4.5V: ⑤⇒4, ⑥⇒5M : SOT-25 ⑦ Package E : USP-6C R : Embossed tape, standard feed ⑧ Device OrientationL: Embossed tape, reverse feed* Please set the release delay time shorter than or equal to the watchdog timeout period. ex.) XC6101D427MR or XC6101D327MR■PRODUCT CLASSIFICATION ●Selection Guide ●Ordering Information XC61①②③④⑤⑥⑦⑧4/26XC6101~XC6107, XC6111~XC6117 Series■PACKAGING INFORMATION●SOT-25●USP-6C5/26XC6101 ~ XC6107, XC6111~ XC6117Series④ Represents production lot number0 to 9 and A to Z and inverted 0 to 9 and A to Z repeated. (G, I, J, O, Q, W expected.) * ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)■MARKING RULE●SOT-25①②③④SOT-25 (TOP VIEW)6/26XC6101~XC6107, XC6111~XC6117 Series① Represents product series② Represents release delay time MARK RELEASE DELAY TIME PRODUCT SERIES A 3.13msec XC61XxAxxxxx B 25msec XC61XxBxxxxx C 50msec XC61XxCxxxxx D 100msec XC61XxDxxxxx E 200msec XC61XxExxxxx F 400msec XC61XxFxxxxx H 1.6sec XC61XxHxxxxx③ Represents watchdog timeout period MARK WATCHDOG TIMEOUT PERIOD PRODUCT SERIES 0 XC61X6, XC61X7 series XC61Xxx0xxxx 1 6.25msec XC61Xxx1xxxx 2 50msec XC61Xxx2xxxx 3 100msec XC61Xxx3xxxx 4 200msec XC61Xxx4xxxx 5 400msec XC61Xxx5xxxx 6 1.6sec XC61Xxx6xxxx④⑤ Represents detect voltage MARK④ ⑤DETECT VOLTAGE (V)PRODUCT SERIES3 3 3.3 XC61Xxxx33xx 5 0 5.0XC61Xxxx50xx⑥ Represents production lot number0 to 9 and A to Z repeated. (G, I, J, O, Q, W excepted.)* No character inversion used. ** ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)MARK PRODUCT SERIES MARK PRODUCT SERIES 3 XC6101xxxxxx 8 XC6111xxxxxx 4 XC6102xxxxxx 9 XC6112xxxxxx 5 XC6103xxxxxx A XC6113xxxxxx 6 XC6104xxxxxx B XC6114xxxxxx 7 XC6105xxxxxx C XC6115xxxxxx 3 XC6106xxxxxx 8 XC6116xxxxxx 4 XC6107xxxxxx 9 XC6117xxxxxx■MARKING RULE (Continued)●USP-6CUSP-6C (TOP VIEW)7/26XC6101 ~ XC6107, XC6111~ XC6117Series■BLOCK DIAGRAMS●XC6101, XC6111 Series●XC6102, XC6112 Series●XC6103, XC6113 Series8/26XC6101~XC6107, XC6111~XC6117 Series■BLOCK DIAGRAMS (Continued)●XC6107, XC6117 Series●XC6106, XC6116 Series●XC6105, XC6115 Series●XC6104, XC6114 Series9/26XC6101 ~ XC6107, XC6111~ XC6117SeriesPARAMETERSYMBOL RATINGSUNITSV INV SS -0.3 ~ 7.0 VM RBV SS -0.3 ~ V IN +0.3 VInput Voltage WD V SS -0.3 ~ 7.0V Output Current I OUT 20 mACMOS Output RESETB/RESET V SS -0.3 ~ V IN +0.3Output Voltage N-ch Open Drain Output RESETB V SS -0.3 ~ 7.0VSOT-25 250Power Dissipation USP-6C Pd 100mWOperational Temperature Range Topr -40 ~ +85 OCStorage Temperature Range Tstg -40 ~ +125 OC■ABSOLUTE MAXIMUM RATINGSTa = 25O C10/26XC6101~XC6107, XC6111~XC6117 SeriesNOTE:*1: XC6101~XC6107 (with hysteresis) *2: XC6111~XC6117 (without hysteresis)*3: ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111) *4: V DF(T): Setting detect voltage*5: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).PARAMETERSYMBOLCONDITIONSMIN.TYP .MAX. UNITS CIRCUITDetect Voltage V DFL V DFHV DF(T)× 0.98V DF(T) V DF(T)× 1.02 V 1 Hysteresis Range XC6101~XC6107 (*1) V HYS V DF × 0.02V DF × 0.05 V DF× 0.08 V 1Hysteresis Range XC6111~XC6117 (*2) V HYS 0 V DF × 0.001 V DFx 0.01V 1V IN =V DF(T)×0.9V - 5 11 V IN =V DF(T)×1.1V- 10 16 XC61X1/XC61X2/XC61X3XC61X4/XC61X5 (*3)(The MRB & the WD Pin: No connection) V IN =6.0V - 1218 V IN =V DF(T)×0.9V - 4 10 V IN =V DF(T)×1.1V - 8 14 Supply Current I SS XC61X6/XC61X7 (*3)(The MRB Pin: No connection)V IN = 6.0V - 1016 µA 2Operating Voltage V IN 1.0 - 6.0 V 1VIN = 1.0V 0.15 0.5 -V IN =2.0V (V DFL(T)> 2.0V) 2.0 2.5 - V IN =3.0V (V DFL(T) >3.0V) 3.0 3.5 -N-ch.V DS = 0.5V V IN =4.0V (V DFL(T) >4.0V) 3.5 4.0 - 3 V DFL Output Current (RESETB) I RBOUTCMOS,P-chV DS = 0.5V V IN = 6.0V - - 1.1 -0.8 mA 4 N-chV DS = 0.5VV IN =6.0V 4.4 4.9 - 3V IN =1.0V - - 0.08 - 0.02 V IN =2.0V (V DFH(T)> 2.0V)- - 0.50 - 0.30 V IN =3.0V (V DFH(T)>3.0V)- - 0.75 - 0.55V DFHOutput Current (RESET) I ROUT P-ch. V DS = 0.5V V IN =4.0V (V DFH(T)>4.0V)- - 0.95 - 0.75 mA 4Temperature Characteristics △V DF / △Topr ・V DF -40OC < Topr < 85 O C - +100 - ppm / O C12 3.13 5 13 25 3825 50 75 60 100 140 120 200 280 240 400 560Release Delay Time(V DF <1.8V)T DR Time until V IN is increased from1.0V to2.0Vand attains to the release time level,and the Reset output pin inverts.960 1600 2240 ms 5 2 3.13 5 13 25 38 25 50 7560 100 140 120 200 280 240 400 560 Release Delay Time(V DF >1.9V)T DRTime until V IN is increased from1.0V to (V DF x1.1V) and attains to the releasetime level,and the Reset output pin inverts. 960 1600 2240ms 5 Detect Delay Time T DFTime until V IN is decreased from 6.0V to 1.0V and attains to the detect voltage level, and the Reset output pin detectswhile the WD pin left opened.- 3 30 µs 5V DFL /V DFH CMOS Output Leak CurrentI LEAK V IN =6.0V, RESETB=6.0V (V DFL ) V IN =6.0V, RESET=0V (V DFH )- 0.01 - µA 3V DFL N-ch Open DrainOutput Leak CurrentI LEAKV IN =6.0V, RESETB=6.0V-0.010.10µA 3■ELECTRICAL CHARACTERISTICS●XC6101~XC6107, XC6111~XC6117 SeriesTa = 25O CSeriesPARAMETERSYMBOL CONDITIONS MIN.TYP . MAX. UNITS CIRCUIT3.13 6.25 9.38 25 50 7560 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF <1.8V)T WDTime until V IN increases form1.0V to2.0V andthe Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 3.13 6.25 9.38 25 50 75 60 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF >1.9V)T WDTime until V IN increases form1.0V to (V DF x1.1V)and the Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 WatchdogMinimum Pulse Width T WDIN V IN =6.0V,Apply pulse from 6.0V to 0Vto the WD pin. 300 - - ns 7 Watchdog High Level VoltageV WDH V IN =V DF x 1.1V ~ 6.0V V IN x 0.7- 6 V 7 Watchdog Low Level Voltage V WDL V IN =V DF x 1.1V ~ 6.0V0 - V IN x 0.3 V 7 V IN =6.0V, V WD =6.0V (Avg. when peak )- 12 19Watchdog Input Current I WD V IN =6.0V, V WD =0V (Avg. when peak) - 19 -12 -µA 8 Watchdog Input ResistanceR WDV IN =6.0V, V WD =0V, R WD =V IN / |I WD |315500880k Ω8PARAMETERSYMBOL CONDITIONS MIN.TYP . MAX.UNITS CIRCUITMRBHigh Level VoltageV MRH V IN =V DF x1.1V ~ 6.0V 1.4 - V IN 9MRBLow Level VoltageV MRL V IN =V DF x1.1V ~ 6.0V-0.35 V9MRBPull-up Resistance R MR V IN =6.0V, MRB=0V, R MR =V IN / |I MRB | 1.6 2.4 3.0 M Ω 10 MRB Minimum Pulse Width (*3) XC6101~XC6105 XC6111~XC6115 T MRINV IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin 2.8 - -MRB Minimum Pulse Width (*4) XC6106, XC6107 XC6116, XC6117T MRIN V IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin1.2 - -µs11●XC6101 ~ XC6103, XC6106 ~ XC6107, XC6111 ~ XC6113, XC6116 ~ XC6117 Series NOTE:*1: V DF(T): Setting detect voltage *2: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected). *3: Watchdog function is available. *4: Watchdog function is not available.Ta = 25O CTa = 25O C ■ELECTRICAL CHARACTERISTICS (Continued)●XC6101~XC6105, XC6111~XC6115 Series■OPERATIONAL EXPLANATIONThe XC6101~XC6107, XC6111~XC6117 series compare, using the error amplifier, the voltage of the internal voltage reference source with the voltage divided by R1, R2 and R3 connected to the V IN pin. The resulting output signal from the error amplifier activates the watchdog logic, manual reset logic, delay circuit and the output driver. When the V IN pin voltage gradually falls and finally reaches the detect voltage, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type ICs.<RESETB / RESET Pin Output Signal>* V DFL (RESETB) type - output signal: Low when detected.The RESETB pin output goes from high to low whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESETB pin remains low for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the RESETB pin output remains low for the release delay time (T DR), and thereafter the RESET pin outputs high level signal. * V DFH (RESET) type – output signal: High when detected.The RESET pin output goes from low to high whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESET pin remains high for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the V OUT pin output remains high for the release delay time (T DR), and thereafter the RESET pin outputs low level signal.<Hysteresis>When the internal comparator output is high, the NMOS transistor connected in parallel to R3 is turned ON, activating the hysteresis circuit. The difference between the release and detect voltages represents the hysteresis range, as shown by the following calculations:V DF (detect voltage) = (R1+R2+R3) x Vref(R2+R3)V DR (release voltage) = (R1+R2) x Vref(R2)V HYS (hysteresis range)=V DR-V DF (V)V DR > V DF* Detect voltage (V DF) includes conditions of both V DFL (low when detected) and V DFH (high when detected).* Please refer to the block diagrams for R1, R2, R3 and Vref.Hysteresis range is selectable from V DF x 0.05V (XC6101~XC6107) or V DF x 0.001V (XC6111~XC6117).<Watchdog (WD) Pin>The XC6101~XC6107, XC6111~XC6117 series use a watchdog timer to detect malfunction or “runaway” of the microprocessor. If neither rising nor falling signals are applied from the microprocessor within the watchdog timeout period, the RESETB/RESET pin output maintains the detection state for the release delay time (T DR), and thereafter the RESET/RESETB pin output returns to the release state (Please refer to the FUNCTION CHART). The timer in the watchdog is then restarted. Six watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 6.25msec.<MRB Pin>Using the MRB pin input, the RESET/RESETB pin signal can be forced to the detection state. When the MRB pin is driven from high to low, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type. Even after the MRB pin is driven back high, the RESET/RESETB pin output maintains the detection state for the release delay time (T DR). Since the MRB pin is internally pulled up to the V IN pin voltage level, leave the MRB pin open if unused (Please refer to the FUNCTION CHART). A diode, which is an input protection element, is connected between the MRB pin and V IN pin. Therefore, if the MRB pin is applied voltage that exceeds V IN, the current will flow to V IN through the diode. Please use this IC within the stated maximum ratings (V SS -0.3 ~ V IN+0.3) on the MRB pin.<Release Delay Time>Release delay time (T DR) is the time that elapses from when the V IN pin reaches the release voltage, or when the watchdog timeout period expires with no rising signal applied to the WD pin, until the RESET/RESETB pin output is released from the detection state. Seven release delay time (T DR) watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 25msec, 3.13msec.<Detect Delay Time>Detect Delay Time (T DF) is the time that elapses from when the V IN pin voltage falls to the detect voltage until the RESET/ RESETB pin output goes into the detection state.Series■TIMING CHARTS●CMOS Output●T DF (CMOS Output)VINVDFL LevelGNDVIN Level VDFL Level GNDVIN x 0.1V■NOTES ON USE1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device.2. When a resistor is connected between the V IN pin and the input, the V IN voltage drops while the IC is operating and a malfunction may occur as a result of the IC’s through current. For the CMOS output products, the V IN voltage drops while the IC is operating and malfunction may occur as a result of the IC’s output current. Please be careful with using the XC6111~XC6117 series (without hysteresis).3. In order to stabilize the IC’s operations, please ensure that the V IN pin’s input frequency’s rise and fall times are more than 1 µ sec/V.4. Noise at the power supply may cause a malfunction of the watchdog operation or the circuit. In such case, please strength the line between V IN and the GND pin and connect about 0.22µF of a capacitor between the V IN pin and the GND pin.5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900µsec at maximum.GNDGNDGNDVIN Pin Wave FormWD Pin Wave FormRESETB Pin Wave Form (VDFL)SeriesPIN NAMELOGIC CONDITIONSH V IN >V DF +V HYS V IN L V IN <V DF H MRB>1.40V MRBL MRB<0.35V H When keeping W D >V WDH more than T WD L When keeping W D <V WDL more than T WD L → H V WDL → V WDH , T WDIN >300nsec WDH → L V WDH →V WDH , T WDIN >300nsecV IN MRB WD RESETB (*2) H HH LRepeat detect and release (H →L →H)H OpenH L → HH H or Open H → L H HLL *1 LV IN MRB WD RESETB (*3) H HH LRepeat detect and release (L →H →L)H OpenH L → HH H or Open H → L L HLL *1 HV IN WD RESETB (*2) RESET (*3) H HH L Repeat detect and release (H →L →H)Repeat detect and release (L →H →L)H OpenH L → HH H → L H L HL*1 L HV IN MRB RESETB (*2)RESET (*3)H H or Open H LH LL L H■PIN LOGIC CONDITIONSNOTE:*1: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).*2: For the details of each parameter, please see the electrical characteristics. V DF : Detect VoltageV HYS : Hysteresis RangeV WDH : WD High Level Voltage V WDL: WD Low Level Voltage T WDIN : WD Pulse Width T WD : WD Timeout Period■FUNCTION CHART●XC6103/XC61113 Series●XC6104/XC61114, XC6105/XC6115 Series●XC6106/XC61116, XC6107/XC6117 Series●XC6101/XC61111, XC6102/6112 Series*1: Including all logic of WD (WD=H, L, L →H, H →L, OPEN). *2: When the RESETB is High, the circuit is in the release state. When the RESETB is Low, the circuit is in the detection state. *3: When the RESET is High, the circuit is in the release state. When the RESET is Low, the circuit is in the detection state.■TEST CIRCUITSCircuit 1Circuit 2Circuit 3Circuit 4Series ■TEST CIRCUITS (Continued)Circuit 5Circuit 6Circuit 7■TEST CIRCUITS (Continued)Circuit 8Circuit 9Circuit 10Circuit 11Series■TYPICAL PERFORMANCE CHARACTERISTICS(1.1) Supply Current vs. Input Voltage(1.2) Supply Current vs. Input Voltage■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(2) Detect, Release Voltage vs. Ambient Temperature(1.2) Supply Current vs. Input Voltage (Continued)Series■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3-1) Output Voltage vs. Input Voltage (V DFL ) (3.1) Detect, Release Voltage vs. Input Voltage (V DFL )(3.2) Detect, Release Voltage vs. Input Voltage (V DFH )■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(4) N-ch Driver Output Current vs. V DSSeries(6) P-ch Driver Output Current vs. Input Voltage 1■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(8) Release Delay Time vs. Ambient Temperature(7) P-ch Driver Output Current vs. Input Voltage 2■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Release Delay Time vs. Input Voltage(11) Watchdog Timeout Period vs. Input VoltageSeries■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(14) MRB Low Level Voltage vs. Ambient Temperature(15) MRB High Level Voltage vs. Ambient Temperature* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)。
士兰微SC6131X说明书
AMP
SDCARD
I2C
CP Chip
产品规格分类
产品名称 SC6131A SC6131B 封 装 LQFP-64-10×10-0.5 LQFP-48-7×7-0.5 打印名称 SC6131A SC6131B 材料 无卤 无卤 包装 料盘 料盘
内部框图
SPI Flash SD card
杭州士兰微电子股份有限公司
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版本号：0.2 共 14 页 第3页
SC6131X 说明书
（耳机连接:CAPLESS 采样率:48KHz
参 信噪比 动态范围 @-60dB 失真度 @-7dB 通道隔离度 通道不平衡度 DAC 工作电流 DAC 静态电流 输出功率@ 32Ω 输入频率@1kHz 输入频率@1kHz 数
电气参数(Tamb=25C，VDD33=3.3V，VDD18=1.2V，OSC=12MHz)
参 电源电压 静态电流 工作电流 外部时钟频率 高电平输入电压 低电平输入电压 高电平输出电压 低电平输出电压 输入漏电流 输出漏电流 数 符 号 VDD33 VDD ICCS ICC OSC VIH VIL VOH VOL ILI ILO 测 试 工作正常 工作正常 系统处于待机状态 正常工作，MCU Clk=12MHz ---IOH=2mA IOL=2mA VDD33=3.6V VDD33=3.6V 条 件 最小值 2.97 1.08 ---2.4 -3.04 0.25 --典型值 3.3 1.2 500 30 12 ------最大值 3.63 1.32 ----0.8 ----单位 V V A mA MHz V V V V A
Speaker
PWM
GPIO
UART
External DAC/ ADC
LTC1068中文资料
摘要：介绍LTC1068型低噪声、高精...LTC1068型滤波器在机械振动信号调理电路中的应用15380减小字体增大字体作者：赵艳菊黄伟志邓辉王太勇来源：国外电子元器件发布时间：2007-10-9 19:38:53摘要：介绍LTC1068型低噪声、高精度通用滤波器的功能特点、引脚功能及工作模式，给出LTC1068在机械振动信号调理电路中的应用实例。
关键词：LTC1068 信号调理高通滤波器1 引言随着现代数据采集系统的不断发展，对高精度信号调理技术的要求也越来越高。
由于传感器输出的信号往往存在温漂、信号比较小及非线性等问题，因此它的信号通常不能被控制元件直接接收，这样一来，信号调理电路就成为数据采集系统中不可缺少的一部分，并且其电路设计的优化程度直接关系到数据采集系统的精度和稳定性。
笔者设计的ICP传感器调理电路采用了一种LTC1068型通用滤波器，可对传感器输出的信号进行高精度的滤波调理，减小了温漂和直流偏置，从而满足了采集系统高精度和高稳定性的要求。
2 LTC1068简介LTC1068是Linear公司生产的4通道通用滤波器，它有很低的失调电流、漂移电流和偏置电流，并且具有很高的动态范围，达到截至频率的200倍时无混叠现象。
工作电压为+1.5V～+5V。
2．1 LTC1068的引脚功能LTC1068采用24引脚PDIP和28引脚SSOP二种封装，引脚排列如图1所示。
各个引脚的功能如下所述：V+、V-：滤波器电源正负输入端。
通常情况下在该引脚与模拟地之间接一个0.1μF的旁路电容器以抗击干扰。
滤波器的供电电源必须与其他数字或模拟电路的高电压电源分离开。
有双端和单端二种供电方式，建议使用低噪声线性电源。
AGND：模拟地。
滤波器的性能很大程度上取决于模拟信号地的质量，单端供电方式时，AGND引脚必须接一个至少0.47μF的旁路电容器。
CLK：时钟信号输入端。
任何TTL或CMOS占空比为50%的方波时钟信号源都可以作为时钟信号的输入。
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TOP VIEW
5 V+ 4 +IN
S5 PACKAGE 5-LEAD PLASTIC TSOT-23 TJMAX = 150°C, θJA = 250°C/ W
ORDER PART NUMBER MS8 PART MARKING* ORDER PART NUMBER
S5 PART MARKING*
APPLICATIONS
n Current Shunt Measurement n Battery Monitoring n Remote Sensing n Power Management
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. ThinSOT is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners.
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Total Supply Voltage (V+ to V–) LTC6101............................................................... 70V LTC6101HV ........................................................ 105V
Minimum Input Voltage (–IN Pin).................... (V+ – 4V) Maximum Output Voltage (Out Pin) ............................9V Input Current....................................................... ±10mA Output Short-Circuit Duration (to V–).............. Indefinite Operating Temperature Range
The wide operating supply range and high accuracy make the LTC6101 ideal for a large array of applications from automotive to industrial and power management. A maximum input sense voltage of 500mV allows a wide range of currents to be monitored. The fast response makes the LTC6101 the perfect choice for load current warnings and shutoff protection control. With very low supply current, the LTC6101 is suitable for power sensitive applications.
LTC6101ACMS8 LTC6101AIMS8 LTC6101AHMS8 LTC6101HVACMS8 LTC6101HVAIMS8 LTC6101HVAHMS8
LTBSB LTBSB LTBSB LTBSX LTBSX LTBSX
LTC6101ACS5 LTC6101AIS5 LTC6101AHS5 LTC6101BCS5 LTC6101CCS5 LTC6101BIS5 LTC6101CIS5 LTC6101BHS5 LTC6101CHS5 LTC6101HVACS5 LTC6101HVAIS5 LTC6101HVAHS5 LTC6101HVBCS5 LTC6101HVCCS5 LTC6101HVBIS5 LTC6101HVCIS5 LTC6101HVBHS5 LTC6101HVCHS5
a 5V Output Step) n Gain Configurable with 2 Resistors n Low Input Bias Current: 170nA Max n PSRR: 118dB Min n Output Current: 1mA Max n Low Supply Current: 250μA, VS = 12V n Operating Temperature Range: –40°C to 125°C n Low Profile (1mm) SOT-23 (ThinSOT™) Package
LTC6101/LTC6101HV
High Voltage, High-Side Current Sense
Amplifier in SOT-23
DESCRIPTION
The LTC®6101/LTC6101HV are versatile, high voltage, high side current sense amplifiers. Design flexibility is provided by the excellent device characteristics; 300μV Max offset and only 375μA (typical at 60V) of current consumption. The LTC6101 operates on supplies from 4V to 60V and LTC6101HV operates on supplies from 5V to 100V.
The LTC6101 is available in 5-lead SOT-23 and 8-lead MSOP packages.
TYPICAL APPLICATION
16-Bit Resolution Unidirectional Output into LTC2433 ADC
ILOAD
VSENSE
–+ +–
+IN
L O
V–
A
D
RIN 100Ω
–IN
V+
5V TO 105V
5V
1μF
LTC6101HV
OUT VOUT
ROUT 4.99k
LTC2433-1
TO μP
VOUT
=
ROUT RIN
•
VSENSE
=
49.9VSENSE
6101 TA01
Step Response
VSENSE– ΔVSENSE– = 100mV
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grades and parametric grades are identified by a label on the shipping container.
LTC6101C/LTC6101HVC.......................– 40°C to 85°C
LTC6101I/LTC6101HVI......................... –40°C to 85°C LTC6101H/LTC6101HVH ................... –40°C to 125°C Specified Temperature Range (Note 2) LTC6101C/LTC6101HVC........................... 0°C to 70°C LTC6101I/LTC6101HVI......................... –40°C to 85°C LTC6101H/LTC6101HVH ................... –40°C to 125°C Storage Temperature Range.................. –65°C to 150°C Lead Temperature (Soldering, 10 sec) ................. 300°C
ELECTRICAL CHARACTERISTICS (LTC6101) The ● denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C, RIN = 100Ω, ROUT = 10k, VSENSE+ = V+ (see Figure 1 for details), 4V ≤ VS ≤ 60V unless otherwise noted.
5.5V 5V
VOUT
0.5V 0V
TA = 25°C V+ = 12V RIN = 100 ROUT = 5k VSENSE+ = V+ IOUT = 100μA
IOUT = 0
500ns/DIV6101 TA1b6101fg1
元器件交易网
LTC6101/LTC6101HV
PACKAGE/ORDER INFORMATION
TOP VIEW
–IN 1 NC 2 NC 3 OUT 4
8 +IN 7 V+ 6 NC 5 V–
MS8 PACKAGE 8-LEAD PLASTIC MSOP TJMAX = 150°C, θJA = 300°C/ W
OUT 1 V– 2
–IN 3
Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF Lead Free Part Marketing: /leadfree/