LPS331APTR;中文规格书,Datasheet资料

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Schneider Electric Preventa模块XPSUAT33A3AP产品数据表说明书

T h e i n f o r m a t i o n p r o v i d e d i n t h i s d o c u m e n t a t i o n c o n t a i n s g e n e r a l d e s c r i p t i o n s a n d /o r t e c h n i c a l c h a r a c t e r i s t i c s o f t h e p e r f o r m a n c e o f t h e p r o d u c t s c o n t a i n e d h e r e i n .T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n s .I t i s t h e d u t y o f a n y s u c h u s e r o r i n t e g r a t o r t o p e r f o r m t h e a p p r o p r i a t e a n d c o m p l e t e r i s k a n a l y s i s , e v a l u a t i o n a n d t e s t i n g o f t h e p r o d u c t s w i t h r e s p e c t t o t h e r e l e v a n t s p e c i f i c a p p l i c a t i o n o r u s e t h e r e o f .N e i t h e r S c h n e i d e r E l e c t r i c I n d u s t r i e s S A S n o r a n y o f i t s a f f i l i a t e s o r s u b s i d i a r i e s s h a l l b e r e s p o n s i b l e o r l i a b l e f o r m i s u s e o f t h e i n f o r m a t i o n c o n t a i n e d h e r e i n .Product data sheetCharacteristicsXPSUAT33A3APPreventa module Cat.4 features XPSUAK +delayed outputs 48-240vac/dc screwMainRange of product Preventa Safety automation Product or component typePreventa safety module Safety module name XPSUATSafety module applicationMonitoring antivalent contactsFor emergency stop, guard and light curtain monitoringMonitoring of pressure-sensitive 4-wire protective devicesFunction of moduleEmergency stop button with 2 NC contacts Guard monitoring with 1 or 2 limit switches Monitoring 2 PNP sensors Magnetic switch monitoring Light curtain monitoring RFID switchMonitoring of electro-sensitive protection equipment (ESPE)Sensing mat/edgesProximity sensor monitoringMonitoring 1 PNP + 1 NPN sensorSafety levelCan reach PL e/category 4 for normally open relay contact ISO 13849-1Can reach SILCL 3 for normally open relay contact IEC 62061Can reach SIL 3 for normally open relay contact IEC 61508Can reach PL c/category 1 for normally closed relay contact ISO 13849-1Can reach SILCL 1 for normally closed relay contact IEC 62061Can reach SIL 1 for normally closed relay contact IEC 61508Safety reliability dataMTTFd > 30 years ISO 13849-1Dcavg >= 99 % ISO 13849-1PFHd = 1.47E-09 for SS0 ISO 13849-1PFHd = 1.48E-09 for SS1 ISO 13849-1HFT = 1 IEC 62061PFHd = 1.47E-09 for SS0 IEC 62061PFHd = 1.48E-09 for SS1 IEC 62061SFF > 99% IEC 62061HFT = 1 IEC 61508-1PFHd = 1.47E-09 for SS0 IEC 61508-1PFHd = 1.48E-09 for SS1 IEC 61508-1SFF > 99% IEC 61508-1Type = B IEC 61508-1Electrical circuit typeNC pair PNP pairAntivalent pair OSSD pairConnections - terminalsRemovable screw terminal block, 0.2...2.5 mm² solid or flexibleRemovable screw terminal block, 0.25...2.5 mm²flexible with ferrule single conductorRemovable screw terminal block, 0.2...1.5 mm² solid or flexible twin conductorRemovable screw terminal block, 2 x 0.25...1 mm²flexible with ferrule without cable end, with bezel Removable screw terminal block, 2 x 0.5...1.5 mm²flexible with ferrule with cable end, with bezel [Us] rated supply voltage48...240 V AC/DC - 10...10 %ComplementarySynchronisation time between inputs0.5 s2 s4 sType of start Automatic/manual/monitoredPower consumption in W4 W 48 V DCPower consumption in VA10 VA 240 V AC 50/60 HzInput protection type Internal, electronicSafety outputs 3 NO3 NO1 NCSafety inputs21Maximum wire resistance500 OhmTime delay range0...900 sInput compatibility Normally closed circuit ISO 14119XC limit switch ISO 14119Mechanical contact ISO 14119Normally closed circuit ISO 13850Antivalent pair ISO 14119OSSD pair IEC 61496-1-23-wire proximity sensors PNPOutput type Relay output, 250 V ACRelay output, 250 V ACRelay output, 24 V DCRelay output, 24 V DC[Ie] rated operational current5 A AC-13 A AC-155 A DC-13 A DC-133 A AC-11 A AC-153 A DC-11 A DC-13Control outputs 4 pulsed outputInput/output type Pulsed output for diagnostics Z1, 20 mASemiconductor output Z2, 20 mA[Ith] conventional free air thermal current16 AAssociated fuse rating10 A gG NO relay output circuit IEC 60947-1 Minimum output current20 mA relay outputMinimum output voltage24 V relay outputMaximum response time on input open20 ms[Ui] rated insulation voltage250 V 2)EN/IEC 60947-1[Uimp] rated impulse withstand voltage4 kV II EN/IEC 60947-1Local signalling Power ON LED green)Error LED red)Start LED yellow)Safety output instantaneous LED yellow)Safety output delayed LED yellow)Safety input S12 LED yellow)Safety input S22 LED yellow)Safety input S32 LED yellow)Mounting support35 mm symmetrical DIN railMaximum Depth 4.72 in (120 mm)Maximum Height 3.94 in (100 mm)Maximum Width 1.77 in (45 mm)Net Weight0.77 lb(US) (0.350 kg)EnvironmentStandards IEC 60947-5-1IEC 61508-1 functional safety standardIEC 61508-2 functional safety standardIEC 61508-3 functional safety standardIEC 61508-4 functional safety standardIEC 61508-5 functional safety standardIEC 61508-6 functional safety standardIEC 61508-7 functional safety standardISO 13849-1 functional safety standardIEC 62061 functional safety standardProduct certifications TÜVCULusIP degree of protection IP54 mounting area)EN/IEC 60947-1IP40 housing)EN/IEC 60947-1IP20 terminals)EN/IEC 60947-1Ambient air temperature for storage-13…185 °F (-25…85 °C)Relative humidity5…95 % non-condensingOrdering and shipping detailsCategory22477 - SAFETY MODULES (PREVENTA)Discount Schedule SAF2GTIN03606489601713Nbr. of units in pkg.1Package weight(Lbs)1 lb(US) (0.45 kg)Returnability YesPacking UnitsUnit Type of Package 1PCEPackage 1 Height 2.56 in (6.5 cm)Package 1 width 5.39 in (13.7 cm)Package 1 Length 6.10 in (15.5 cm)Unit Type of Package 2BB1Number of Units in Package 21Package 2 Weight16.23 oz (460 g)Package 2 Height 2.52 in (6.4 cm)Package 2 width 5.24 in (13.3 cm)Package 2 Length 6.02 in (15.3 cm)Unit Type of Package 3S03Number of Units in Package 316Package 3 Weight17.31 lb(US) (7.853 kg)Package 3 Height11.81 in (30 cm)Package 3 width11.81 in (30 cm)Package 3 Length15.75 in (40 cm)Offer SustainabilitySustainable offer status Green Premium productEU RoHS Directive Pro-active compliance (Product out of EU RoHS legal scope)EU RoHSDeclarationMercury free YesRoHS exemption information YesChina RoHS Regulation China RoHS DeclarationEnvironmental Disclosure Product Environmental ProfileCircularity Profile End Of Life InformationWEEE The product must be disposed on European Union markets following specificwaste collection and never end up in rubbish bins.PVC free YesDimensions DrawingsDimensionsFront and Side Views(A) :Product drawing(B) :Screw clamp terminal (C) :Side view(1) :Removable terminal blocks, top (2) :Removable terminal blocks, bottom (3) :LED indicators(4) :Start function selector (5) :Function selector (6) :Delay factor selector (7) :Delay base selector(8) :Connector for optional output extension module (lateral)(9) :Sealable transparent coverMounting and Clearance Mounting to DIN railScrew-mountingConnections and SchemaWiring Drawing(1) :A1-A2 (Power supply)(2) :S11-S12-S21-S22-S31-S32 (Single-channel safety input)(3) :Y1-Y2 (Start)13-23-33-47-57-67-75-14-24-34-48-58-68-76 :OutputEXT :Connector for optional extension module B2 :Common ground terminalZ1 :Pulsed output for diagnostics, not safety-related Z2 :Solid state output, not safety-related。

PVZ3G331C01R00;PVZ3G155C01R00;PVZ3G224C01R00;PVZ3G225C01R00;PVZ3G332C01R00;中文规格书,Datasheet资料

Humidity Exposure Load Life
Humidity Load Life Temperature Cycling Rotational Life Vibration Soldering Heat Resistance
(Note 4) Concentrated Contact Resistance = (Note 5) R12 Setting Stability = r13 r12 R13 R12 R23 R13 r12 r13 X 100 (%)
2. Murata Part Number
PVZ3GC01B00 PVZ3GC01R00 PVZ3GC01R02 Bulk : 1000pcs./bag Taping (Standard) : 2500pcs./reel Taping (Option) : 2500pcs./reel
3. Outline Dimensions and Markings
Please see 9. Outline Dimensions.
4. Characteristics
4.1 Electrical characteristics
ITEM SPECIFICATION TEST METHOD -
Standard Resistance Range 220 ohm to 2.2M ohm Standard Resistance Tolerance ±30% of nominal total resistance value Taper B (Linear) • 50% position of effective rotational angle - 40 to 60% • Jump or reverse (except extreme end) - 5% max. • Jump or reverse (at the extreme end of #1 or #3) - 5% max. Power Power Rating 50°C – 1/10W 100% 85°C - 0W *In case that the ambient temperature exceed 50°C, the derating curve is as Fig 1. 0 50°C 85°C However, in case of partial load, power rating Ambient Temperature reduces in proportion to the rotational angle (Fig 1) of wiper. E=(P㨯R)^1/2 E: Voltage rating (V) Voltage Rating P: Power rating (W) R: Nominal total resistance value (ohm) *However, in case that voltage rating exceed max. working voltage, the max. working voltage should be applied as voltage rating. Max. Working Voltage 50Vdc Operating Temperature Range -25°C to +85°C 220 ohm<=R<470 ohm : 10 ohm max. of nominal total resistance value Residual Resistance 470 ohm<=R<=2.2M ohm: 2% max. of nominal total resistance value Contact Resistance Variation 5% max. of nominal total resistance value Temperature Coefficient ±500ppm/°C max. of Resistance

ACPL-331J CN的中文资料

ACPL-331J 1.5A电流输出的IGBT门极驱动光耦集成的（Vce）饱和度检测，欠压锁定，故障状态反馈和有源米勒钳位综述:ACPL - 331J是一种先进的1.5 A的输出电流，方便易用的智能化的门极驱动器使得IGBT的Vce的故障保护更加紧凑，价格合理，且易于实现功能，如集成的Vce检测，欠压锁定（UVLO），IGBT的“软”关断，隔离的集电极开路故障反馈和有源米勒钳位提供最大的设计灵活性和保护电路。

ACPL - 331J包含了一个GaAsP的LED。

通过该LED完成光电信号的耦合。

ACPL-331J非常适合用于驱动电机控制领域的功率IGBT和MOSFET。

这些光耦的电压、电流供给使其非常适用用于直接驱动1200V 100A以下的IGBT。

对于更高功率等级的IGBT，ACPL-331J通常被用来驱动由分离器件构成的IGBT门极驱动器。

ACPL-331J具备一个峰值为891V的绝缘电压。

结构框图：产品特点：z滞后的欠压封锁功能z饱和度侦测z米勒钳位z隔离的开路集电极故障反馈z IGBT软关断z IGBT下个开通周期的故障复位z提供SO - 16封装z安规认证详细说明：z 1.5A的最大输出峰值电流z 1.0A的最小输出峰值电流z温度范围内最大250nS的传输延时z100nS最大脉冲宽度失真z在V CM = 1500 V时，最小15 kV/µs的共模抑制能力z最大供电电流I CC(max) < 5 mAz温度范围内工作电压可达15V-30Vz1A的米勒钳位。

该脚不用时必须同VEE短接z宽的工作温度范围：–40°C to 100°C应用：z IGBT和功率MOSFET的驱动z交流和直流无刷电机驱动z变频器和UPS引脚功能介绍订货信息ACPL-331J 经过3750 Vrms 1分钟测试，符合UL1577标准。

备注表面符合IEC / EN产品编号符合ROHS 标准封装方式安装卷带装 DIN EN 60747-5-2 数量-000E SO-16 X X 45/管ACPL-331J -500E X X X 850/卷订购时，从产品编号列表中选择产品编号，并结合其他所需的选项形成定单输入。

VISIONPLUS EC 331 导航指南说明书

Operation Manual MODEL EC331Microcomputer Based Conductivity /Resistivity& Temperature PocketMeterEC331CONTENTSINITIAL INSPECTION AND ASSEMBLY (2)VISIONPLUS EC331 OVERVIEW (2)A. Meter Description (2)B. LCD Display (2)OPERATION MODES AND KEYPAD OPERATIONS (3)A. Operation Modes (3)B. Keypad Operations (3)BEFORE YOUR FIRST USE (4)A. Insert Batteries (4)B. Soak the Electrode.... .. (4)C. Preparing Standard Solutions (4)D. Setup and Calibrate the Electrode and Meter (5)USING VISIONPLUS EC331 (5)A. Power on/off (5)B. Calibrate Conductivity (5)C. Measure (5)D. Hold Data (5)REPLACE ELECTRODE (6)REPLACE THE OLD BATTERIES (6)ERROR DISPLAYS AND TROUBLESHOOTING (7)SPECIFICATIONS (8)WARRANTY (9)Carefully unpack the instrument and accessories. Inspect for damages made in shipment. If any damage is found, notify your Jenco representative immediately. All packing materials should be saved until satisfactory operation is confirmed.A. Meter Description1. Battery cover2.LCD screen3.Keypad4. Electrode collar5.Electrode & ATC assembly (Electrode cap is not shown.)B. LCD Display1. LOW BATTERY indicator2. CALIBRATION mode indicator3. MEASURE mode indicator4.HOLD mode indicator23455. CONDUCTIVITY/RESISTIVITY mode indicator6. CONDUCTIVITY/RESISTIVITY unit indicator7. CONDUCTIVITY/ RESISTIVITY reading8. TEMPERATURE reading9. TEMPERATURE unit indicatorA. Operation ModesVisionPlus EC331 meter has 3 operation modes:1. Measure Mode. Measure Mode is used to make allconductivity or resistivity and temperature measurements.2. Calibration Mode. Calibration Mode is used to perform onepoint calibration.3. Hold Mode. Hold Mode is used to display the lockedreading for increased ease of use.B. Keypad OperationsA. Insert Batteriesat the top of the unit.2. Insert the set of batteries(included) ensuring correctpolarities.3. Securely replace batterycover.B. Soak the Electrode1. Remove the electrode cap covering the VisionPlus EC331meter.2. Soak the electrode in distilled water for 10 minutes beforefirst use or after storage.C. Preparing Standard SolutionsSuitable conductivity standards are available commercially or the user can prepare them using research grade reagents.Here is the 147.0uS standard solution the user can prepare to calibrate the probe of the model EC331.Standard solution of 147.0uS at 25℃: Accurately measure 100mL of the 1413uS conductivity standard solution. Dilute with 900ml of distilled water.(Standard solution of 1413uS at 25℃: Accurately weight out 0.746 grams of research grade dried Potassium Chloride (KCL). Dissolve in 1000ml of distilled water.)[Note: You can store the remaining solution in a plastic container for one week but the air space between the cap and the solution must be kept to an absolute minimum. Storing the excess solution below 4℃can increase the storage life. If you have any doubt of the accuracy of the stored solution, a fresh batch should beprepared.]D. Setup and Calibrate the Electrode and Meter VisionPlus EC331 must be setup and calibrated before yourfirst use. Please follow the instructions detailed in section.A. Power On/OffPress “On/Off ” key to turn the unit on. If the unit is running then you can press ”On/Off “key to turn the unit off. The unit will automatically turn off after 10 minutes of no key activity. [Note: The unit will not automatically shut off if it is still immersed in solution even after 10 minute of no key activity.]B. Calibrate Conductivity1. Rinse the electrode & ATC assembly in distilled water andimmerse them in the standard solution of 147uS. Thetemperature displayed is the solution temperature.2. Press “C al” key to initiate calibration. The “CAL” icon willappear when the main display shows “147.0”. Calibrationis now complete. The “MEAS” icon will appear. The unit isnow ready to measure.C. MeasureI n the “Measure Mode”, dip the meter into the test solution. Measuring for Conductivity (℃) commences. Press “Mode” key to select: Conductivity(℃), Conductivity(℉), Resistivity (℃) and Resistivity (℉).[Note: If the “CAL” icon does not appear during measuring, it means the unit has not been calibrated. Repeat the calibration procedure.]D. Hold Data1. When the Conductivity or Resistivity reading is stable,press “Hold” key once to lock the reading.2. Press “Hold” key again to unlock reading and the unit willreturn to “Measure Mode”. The unit is now ready foranother measurement.1. Unscrew the electrode collar to remove the electrode &ATC assembly as shown in the right figure.2. Remove the old electrodefrom the meter.3. Insert a new electrode,make sure the electrode fitback into the metercorrectly.4. Screw back the electrode collar.5. Soak the electrode in distilled water for 10 minutes andrecalibrate the EC331 following the instructions detailed insectionReplace the battery when the blinking low battery indicator “”appears on the upper left corner of the LCD screen. The instrument can operate within specifications for approximately 2~3 hours after low battery indicator appears.1. Take off the battery cover.2. Remove all of the old batteries and insert a new set ofbatteries ensuring the polarities are correct.[Note: Calibration of the unit is required after replacement of batteries.]ConductivityResistivityTemperatureConductivityTemperature compensation Temperature Coefficient Reference temperature AUTO 0.0°C to 60.0 °C 1.91%/°C25°CTemperatureTemperature sensor Thermistor, 10 kΩat 25°C Temperature unit °C and °FGeneralPower: LR44 x 4Battery life: >100 HoursAmbient temperature range0.0 to 50.0 °CCase IP67 water-tight case Weight 105 gJenco warrants this product to be free from significant deviations in material and workmanship for a period of 1 year from date of purchase. If repair or adjustment is necessary and has not been the result of abuse or misuse, within the year period, please return-freight-prepaid and the correction of the defect will be made free of charge. If you purchased the item from our Jenco distributors and it is under warranty, please contact them to notify us of the situation. Jenco Service Department alone will determine if the product problem is due to deviations or customer misuse.Out-of-warranty products will be repaired on a charge basis. RETURN OF ITEMSAuthorization must be obtained from one of our representatives before returning items for any reason. When applying for authorization, have the model and serial number handy, including data regarding the reason for return. For your protection, items must be carefully packed to prevent damage in shipment and insured against possible damage or loss. Jenco will not be responsible for damage resulting from careless or insufficient packing. A fee will be charged on all authorized returns.NOTE:Jenco reserves the right to make improvements in design, construction and appearance of our products without notice.Jenco Instruments, Inc.7968 Arjons Drive, Suite CSan Diego, CA 92126 USATEL: 858-578-2828FAX: 858-578-2886E-Mail:********************;**************** Website: Jenco Electronics Inc.1F., No.11, Lane 370, Sec. 6, Zhongxiao E. Rd. Nangang Dist., Taipei City 115,TaiwanTaipei, TaiwanTEL: 886-2-2782-3226FAX: 886-2-2782-3234Shanghai Jenco Instruments, Ltd.18 Wang Dong Zhong RoadSijing Town, SongjiangShanghai, China 201601TEL: 86-021-5761-9599FAX: 86-021-5761-9598E-Mail:****************.cnWebsite: 10。

KA331中文资料

©2001 Fairchild Semiconductor CorporationRev. 1.0.0Features•Guaranteed linearity: 0.01% max.•Low power dissipation: 15mW at 5V•Wide range of full scale frequency: 1Hz to 100KHz •Pulse output compatible with all logic forms•Wide dynamic range: 100dB min at 10KHz full scale frequencyDescriptionThis voltage to frequency converter provides the output pulse train at a frequency precisely proportional to the applied input voltage. The KA331 can operate at power supplies as low as 4.0V and be changed output frequency from 1Hz to 100KHz. It is ideally suited for use in simple low-cost circuit for analog-to digital conversion, long term integration, linear frequency modulation or demodulation,frequency-to-voltage conversion, and many other functions.Internal Block DiagramKA331V-F Converter8-DIP1KA3312Absolute Maximum Ratings (T A = 25°C)Electrical CharacteristicsParameterSymbol Value Unit Supply Voltage V CC 40V Input VoltageV I -0.2 ~ + V CC V Operating Temperature Range T OPR 0 ~ +70°C Power DissipationP D500mWParameterSymbol Conditions Min.Typ.Max.Unit VFC Non-LinearityVFCNL 4.5 ≤ V CC ≤ 20V -±0.003±0.01% Full-Scale Conversion Accuracy Scale Factor ACCUR V I = -10V, R S = 14K Ω0.901.00 1.10KHz/V Chang Of Gain With V CC V CC ∆G/V CC4.5V ≤ V CC ≤ 10V -0.010.1%/V10V ≤ V CC ≤ 40V -0.0060.06 Rated Full - Scale Frequency fV I = -10V10.0--KHz INPUT COMPARATOR Offset Voltage V IO 0°C ≤ T A ≤ +70°C-±3±10mV Bias Current I BIAS ---80-300nA Offset Current I IO --±8±100nA Common-Mode Range V CM0°C ≤ T A ≤ +70°C-0.2-V CC -2.0VTIMER (PIN 5)Timer Threshold Voltage V TH -0.630.6670.701×V CC Input Bias CurrentI BIASV CC = 15V, 0V ≤ V 5 ≤ 9.9V -±10±100nA V 5 = 10V-2001000nA Saturation VoltageV SATI = 5mA-0.220.5VCURRENT SOURCE (PIN 1) Output Current I O R S = 14K Ω, V 1 = 0V 116136156µA Change with Voltage ∆I O /∆V 1 0V ≤ V 1≤ 10V-0.2 1.0µA Current Source Off Leakage I LKG--0.0210.0nAREFERENCE VOLTAGE (PIN 2) Reference Voltage V REF - 1.70 1.89 2.08V DC Stability vs Temperature ST T --±60-ppm/°C Stability vs Time, 1000Hours ST T--±0.1-%LOGIC OUTPUT (Pin 3) Saturation Voltage V SAT I = 5mA -0.150.50V I = 3.2mA-0.100.40 Off Leakage I LKG--±0.051.0µASUPPLY CURRENT Supply CurrentI CCV CC = 5V 1.5 3.0 6.0mAV CC = 40V2.04.08.0KA3313Typical ApplicationsFigure 1.Precision Voltage-to-Frequency Converter, 100KHz Full-ScaleFigure 2.Simple Frequency-to-Voltage Converter, 10KHz Full-ScaleFigure 3.Light Intensity to Frequency ConverterKA331Mechanical DimensionsPackageDimensions in millimeters8-DIP4KA331 Ordering InformationProduct Number Package Operating TemperatureKA3318-DIP0 ~ + 70°C5KA3315/22/01 0.0m 001Stock#DSxxxxxxxx2001 Fairchild Semiconductor CorporationLIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can bereasonably expected to result in a significant injury of the user.2. A critical component in any component of a life supportdevice or system whose failure to perform can bereasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANYLIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.。

ACPL-331J中文注

ACPL-331J1.5 Amp Output Current IGBT Gate Driver Optocoupler with Integrated (V CE ) Desaturation Detection, UVLO, Fault Status Feedback and Active Miller ClampingDescriptionThe ACPL-331J is an advanced 1.5 A output current, easy-to-use, intelligent gate driver which makes IGBT VCE fault protection compact, affordable, and easy-to implement. Features such as integrated V CE detection, under voltage lockout (UVLO), “soft” IGBT turn-off, isolated open collector fault feedback and active Miller clamping provide maximum design flexibility and circuit protec-tion.The ACPL-331J contains a GaAsP LED. The LED is optically coupled to an integrated circuit with a power output stage. ACPL-331J is ideally suited for driving power IGBTs and MOSFETs used in motor control inverter applications. The voltage and current supplied by these optocouplers make them ideally suited for directly driving IGBTs with ratings up to 1200 V and 100 A. For IGBTs with higher ratings, the ACPL-331J can be used to drive a discrete power stage which drives the IGBT gate. The ACPL-331J has an insulation voltage of V IORM = 891 V PEAK .Block DiagramFeatures• Under Voltage Lock-Out Protection (UVLO) with Hysteresis • Desaturation Detection • Miller Clamping• Open Collector Isolated fault feedback • “Soft” IGBT Turn-off• Fault Reset by next LED turn-on (low to high) after fault mute period • Available in SO-16 package• Safety approvals: UL approved, 3750 V RMS for 1 minute, CSA approved, IEC/EN/DIN-EN 60747-5-2 approved V IORM = 891 V PEAKSpecifications• 1.5 A maximum peak output current • 1.0 A minimum peak output current • 250 ns maximum propagation delay over temperature range• 100 ns maximum pulse width distortion (PWD)• 15 kV/µs minimum common mode rejection (CMR) at V CM = 1500 V • I CC(max) < 5 mA maximum supply current • Wide V CC operating range: 15 V to 30 V over temperature range • 1.0 A Miller Clamp. Clamp pin short to V EE if not used • Wide operating temperature range: –40°C to 105°CApplications• Isolated IGBT/Power MOSFET gate drive • AC and brushless DC motor drives• Industrial inverters and Uninterruptible Power Supply (UPS)CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.ECC2OUT CLAMP EELEDPin DescriptionPinSymbolDescription1V S Input Ground2V CC1Positive input supply voltage. (4.5 V to 5.5 V)3FAULTFault output. FAULT changes from a high impedance state to a logic low output within 5 µs of the voltage on the DESAT pin exceeding an internal reference voltage of 6.5 V. FAULT output is an open collector which allows the FAULT outputs from all ACPL-331J in a circuit to be connected together in a “wired OR” forming a single fault bus for inter-facing directly to the micro-controller.4V S Input Ground 5CATHODE Cathode 6ANODE Anode 7ANODE Anode 8CATHODE Cathode9V EE Output supply voltage.10V CLAMP Miller clamp11V OUT Gate drive voltage output 12V EE Output supply voltage.13V CC2Positive output supply voltage14DESATDesaturation voltage input. When the voltage on DESAT exceeds an internal reference voltage of 6.5 V while the IGBT is on, FAULT output is changed from a high impedance state to a logic low state within 5 µs.15V LEDLED anode. This pin must be left unconnected for guaran-teed data sheet performance. (For optical coupling testing only)16V ECommon (IGBT emitter) output supply voltage.12345678161514131211109V E V LED DESAT V CC2V EE V OUT V CLAMPV EEV S V CC1FAULT V SCATHODE ANODE ANODE CATHODEOrdering InformationACPL-331J is UL Recognized with 3750 Vrms for 1 minute per UL1577.Part numberOptionPackageSurface MountTape& ReelIEC/EN/DIN EN 60747-5-2QuantityRoHS CompliantACPL-331J-000E SO-16X X 45 per tube -500EXXX850 per reelTo order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example 1:ACPL-331J-500E to order product of SO-16 Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant.Example 2:ACPL-331J-000E to order product of SO-16 Surface Mount package in tube packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval and RoHS compliant.Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and RoHS compliant option will use ‘-XXXE‘.Dimensions in inches (millimeters)Notes: Initial and continued variation in the color of the ACPL-331J’s white mold compound is normal and does note affect device performance or reliability.Floating Lead Protrusion is 0.25 mm (10 mils) max.ACPL-331J 16-Lead Surface Mount PackagePackage Outline Drawings0.050TYPE NUMBER DATE CODELAND PATTERN RECOMMENDATIONSolder Reflow Thermal ProfileRecommended Pb-Free IR ProfileNote: Non-halide flux should be used.TIME (SECONDS)T E M P E R A T U R E (°C )ROOM Note: Non-halide flux should be used.NO TES:THE TIME FROM 25°C to PEAK TEMPERATURE = 8 MINUTES MAX.T smax = 200 °C, T smin = 150°CTable 1. IEC/EN/DIN EN 60747-5-2 Insulation Characteristics*DescriptionSymbol CharacteristicUnitInstallation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 150 V rms for rated mains voltage ≤ 300 V rms for rated mains voltage ≤ 600 V rms I – IV I – IV I – III Climatic Classification55/100/21Pollution Degree (DIN VDE 0110/1.89)2Maximum Working Insulation VoltageV IORM 891V peak Input to Output Test Voltage, Method b**,V IORM x 1.875=V PR , 100% Production Test with t m =1 sec, Partial discharge < 5 pCV PR1670V peakInput to Output Test Voltage, Method a**,V IORM x 1.5=V PR , Type and Sample Test, t m =60 sec, Partial discharge < 5 pC V PR 1336V peak Highest Allowable Overvoltage (Transient Overvoltage t ini = 10 sec)V IOTM6000V peakSafety-limiting values – maximum values allowed in the event of a failure Case Temperature T S 175°C Input Current I S, INPUT 400mA Output PowerP S, OUTPUT 1200mW Insulation Resistance at T S , V IO = 500 VR S>109W* Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. Surface mount classification is class A in accordance with CECCOO802.** Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a detailed description of Method a and Method b partial discharge test profiles.Dependence of Safety Limiting Values on Temperature. (take from DS AV01-0579EN Pg.7)Regulatory InformationThe ACPL-331J is approved by the following organizations:ULApproval under UL 1577, component recognition program up to VISO = 3750 VRMS. File E55361.CSAApproval under CSA Component Acceptance Notice #5, File CA 88324.IEC/EN/DIN EN 60747-5-2Approval under:IEC 60747-5-2 :1997 + A1:2002 EN 60747-5-2:2001 + A1:2002DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01S P - P O W E R - m W0ST - CASE TEMPERATURE - °C 120080014004002006001000Table 2. Insulation and Safety Related SpecificationsParameterSymbolACPL-331JUnitsConditionsMinimum External Air Gap (Clearance)L(101)8.3Mm Measured from input terminals to output terminals, shortest distance through air.Minimum External Tracking (Creepage)L(102)8.3Mm Measured from input terminals to output terminals, shortest distance path along body.Minimum Internal Plastic Gap (Internal Clearance)0.5MmThrough insulation distance conductor to conductor, usually the straight line distance thickness between the emitter and detector.Tracking Resistance (Comparative Tracking Index)CTI>175VDIN IEC 112/VDE 0303 Part 1(<1 µs pulse width, 300pps)F(TRAN)Table 4. Recommended Operating ConditionsParameterSymbolMin.Max.UnitsNoteOperating Temperature T A- 40105°C 2Total Output Supply Voltage (V CC2 - V EE )1530V 7Negative Output Supply Voltage (V E - V EE )015V 4Positive Output Supply Voltage (V CC2 - V E )1530 - (V E - V EE )V Input Current (ON)I F(ON)812mA Input Voltage (OFF)V F(OFF)- 3.60.8VUnless otherwise noted, all typical values at T A = 25°C, V CC2 - V EE = 30 V, V E - V EE = 0 V;all Minimum/Maximum specifications are at Recommended Operating Conditions.ParameterSymbolMin.Typ.Max.UnitsTest ConditionsFig.NoteFAULT Logic Low Output Voltage V FAULTL 0.10.4V I FAULT = 1.1 mA, V CC1 = 5.5V 0.10.4V I FAULT = 1.1 mA, V CC1 = 3.3V FAULT Logic High Output Current I FAULTH 0.020.5µA V FAULT = 5.5 V, V CC1 = 5.5V 0.0020.3µA V FAULT = 3.3 V, V CC1 = 3.3V High Level Output Current I OH -0.3-0.75A V O = V CC2 – 44, 185-1.0A V O = V CC2 – 153Low LevelOutput CurrentI OL 0.30.75A V O = V EE + 2.55, 1951.0AV O = V EE + 153Output Voltage OH CC CC O 2023Low LevelOutput Voltage V OL 0.170.5V I O = 100 mA3, 5, 21Clamp Pin Threshold Voltage V tClamp 2.0VUnless otherwise noted, all typical values at T A = 25°C, V CC2 - V EE = 30 V, V E - V EE = 0 V;all Minimum/Maximum specifications are at Recommended Operating Conditions.Duty Cycle = 50%,I F = 10 mA, V CC2 = 30 V13, 26Propagation Delay Time t PHL 100180250ns 14, 17PHL PLH 17, 16R Fall Timet F50ns DESAT Sense to 90% VO Delayt DESAT(90%)0.150.3µsC DESAT = 100pF, R F =2.1kΩ, R g = 20 W , C g = 5 nF, V CC2 = 30 V14, 27, 3419DESAT Sense to 10% VO Delay t DESAT(10%) 1.1 1.5µsC DESAT = 100pF, R F =2.1kΩ , R g = 20 W , C g = 5 nF, V CC2 = 30 V 15, 16, 17, 27, 34DESAT Sense to Low Level FAULT Signal Delayt DESAT(FAULT)0.250.5µsC DESAT = 100pF, R F = 2.1 k W ,R g = 20 W , C g = 5 nF, V CC2 = 30 V27, 3418DESAT Sense to DESAT Low Propagation Delayt DESAT(LOW)0.25µs C DESAT = 100pF, R F = 2.1 k W ,R g = 20 W , C g = 5 nF, V CC2 = 30 V27, 3419DESAT Input Mute t DESAT(MUTE)5µs 3420RESET to High Level FAULT Signal Delayt RESET(FAULT)0.312.0µsC DESAT = 100pF,R F = 2.1 k W ,Rg = 20 W , Cg = 5 nF,V CC1 = 5.5V, V CC2 = 30 V 0.8 1.5 2.5µsC DESAT = 100pF, R F = 2.1 k W ,Rg = 20 W , Cg = 5 nF,V CC1 = 3.3V, V CC2 = 30 V Mode Transient ImmunityL A F V CM = 1500 V, V CC2 = 30 V30, 31Notes:1. Derate linearly above 70°C free air temperature at a rate of 0.3 mA/°C.2. In order to achieve the absolute maximum power dissipation specified, pins 4, 9, and 10 require ground plane connections and may requireairflow. See the Thermal Model section in the application notes at the end of this data sheet for details on how to estimate junction temperature and power dissipation. In most cases the absolute maximum output IC junction temperature is the limiting factor. The actual power dissipation achievable will depend on the application environment (PCB Layout, air flow, part placement, etc.). See the Recommended PCB Layout section in the application notes for layout considerations. Output IC power dissipation is derated linearly at 10 mW/°C above 90°C. Input IC power dissipation does not require derating.3. Maximum pulse width = 10 µs. This value is intended to allow for component tolerances for designs with IO peak minimum = 1.0 A.Derate linearly from 2.0 A at +25°C to 1.5 A at +105°C. This compensates for increased I OPEAK due to changes in V OL over temperature.4. This supply is optional. Required only when negative gate drive is implemented.5. Maximum pulse width = 50 µs.6. See the Slow IGBT Gate Discharge During Fault Condition section in the applications notes at the end of this data sheet for further details.7. 15 V is the recommended minimum operating positive supply voltage (V CC2 - V E ) to ensure adequate margin in excess of the maximum V UVLO+threshold of 12.5 V. For High Level Output Voltage testing, V OH is measured with a dc load current. When driving capacitive loads, V OH will approach V CC as I OH approaches zero units.8. Maximum pulse width = 1.0 ms.9. Once V O of the ACPL-331J is allowed to go high (V CC2 - V E > V UVLO ), the DESAT detection feature of the ACPL-331J will be the primary source ofIGBT protection. UVLO is needed to ensure DESAT is functional. Once V UVLO+ > 12.5 V, DESAT will remain functional until V UVLO- < 9.2 V. Thus, the DESAT detection and UVLO features of the ACPL-331J work in conjunction to ensure constant IGBT protection.10. See the DESAT fault detection blanking time section in the applications notes at the end of this data sheet for further details.11. This is the “increasing” (i.e. turn-on or “positive going” direction) of V CC2 - V E 12. This is the “decreasing” (i.e. turn-off or “negative going” direction) of V CC2 - V E 13. This load condition approximates the gate load of a 1200 V/75A IGBT.14. Pulse Width Distortion (PWD) is defined as |t PHL - t PLH | for any given unit.15. As measured from I F to V O .16. The difference between t PHL and t PLH between any two ACPL-331J parts under the same test conditions.17. As measured from ANODE, CATHODE of LED to V OUT18. This is the amount of time from when the DESAT threshold is exceeded, until the FAULT output goes low.19. This is the amount of time the DESAT threshold must be exceeded before VOUT begins to go low, and the FAULT output to go low. This is supplyvoltage dependent.20. Auto Reset: This is the amount of time when VOUT will be asserted low after DESAT threshold is exceeded. See the Description of Operation(Auto Reset) topic in the application information section.21. Common mode transient immunity in the high state is the maximum tolerable dV CM /dt of the common mode pulse, V CM , to assure that theoutput will remain in the high state (i.e., V O > 15 V or FAULT > 2 V). A 100 pF and a 2.1 kΩ pull-up resistor is needed in fault detection mode.22. Common mode transient immunity in the low state is the maximum tolerable dV CM /dt of the common mode pulse, V CM , to assure that theoutput will remain in a low state (i.e., V O < 1.0 V or FAULT < 0.8 V).23. To clamp the output voltage at V CC - 3 VBE , a pull-down resistor between the output and V EE is recommended to sink a static current of 650 µAwhile the output is high. See the Output Pull-Down Resistor section in the application notes at the end of this data sheet if an output pull-down resistor is not used.Figure 1. Timing Curve-2.5-2-1.5-1-0.50-40-20020406080105T A -TEMPERATURE -o C(V O H -V C C )-H I G H O U T P U T V O L T A G E D R O P -VFigure 2. V OH vs. temperatureFigure 3. V OL vs. temperatureFigure 4. V OH vs. IOH Figure 5. V OL vs. I OL28.028.529.029.530.000.20.40.60.81I OH -OUTPUT HIGH CURRENT -A(V O H -V C C )-H I G H O U T P U T V O L T A G E D R O P -V00.51 1.5I OL -OUTPUT LOW CURRENT -AV O L -O U T P U T L O W V O L T A G E -V00.050.10.150.20.25-40-20020406080105V O L -O U T P U T L OW V OL T A G E -VT A -TEMPERATURE -o CFigure 7. I CC2 vs. VCC2-0.35-0.30-0.25-0.20-40-2020406080105T A -TEMPERATURE -o CI C H -B L A N K I N G C A P A C I T O R C H A R G I N G C U R R E N T -m AFigure 8. I CHGvs. temperature 6.06.57.07.5-40-2020406080105T A -TEMPERATURE -o CV D E S A T -D E S A T T H R E S H O L D -V100150200250300-40-2020406080105T A -TEMPERATURE -oCT P -P R O P A G A T I O N D E L A Y -n sFigure 9. DESAT threshold vs. temperatureFigure 10. Propagation delay vs. temperature 10015020025030015202530Vcc - SUPPLY VOLTAGE - VT P - P R O P A G A T I O N D E L A Y - n sFigure 11. Propagation delay vs. supply voltage2.002.252.502.753.003.253.50I C C 2-O U T P U T S U P P L Y C U R R E N T -m AFigure 6. I CC2 vs. temperature 2.252.352.452.552.6515202530I C C 2 - O U T P U T S U P P L Y C U R R E N T - m AV CC2 - SUPPLY VOLTAGE - VFigure 13. Propagation delay vs. load capacitance1002003001020304050LOAD CAPACITANCE - nFT P - P R O P A G A T I O N D E L A Y - ns100150200250-40-20020406080105T A -TEMPERATURE -o C T D E S A T 90%-D E S A T S e n s e t o 90%V o D e l a y -n sFigure 14. DESAT sense to 90% V OUT delay vs. temperature-40-20020406080105T A -TEMPERATURE -o CT D E S A T 10%-D E S A T S e n s e t o 10%V o D e l a y -n sFigure 15. DESAT sense to 10% V OUTdelay vs. temperature0.01.02.03.04.01020304050LOAD RESISTANCE-ohmT D E S A T 10% - D E S A T S e n s e t o 10% V o D e l a y - n sFigure 16. DESAT sense to 10% V OUT delay vs. load resistance 0.0000.0040.0080.012010********LOAD CAPACITANCE-nFT D E S A T 10% - D E S A T S e n s et o 10% V o D e l a y - n sFigure 17. DESAT sense to 10% V OUT delay vs. load capacitance10015020025030001020304050LOAD RESISTANCE - ohmT P - P R O P A G A T I O N D E L A Y - n sFigure 12. Propagation delay vs. load resistanceFigure 18. I OH Pulsed test circuitFigure 19. I OL Pulsed test circuitFigure 20. V OH Pulsed test circuitFigure 21. V OL Pulsed test circuitFigure 22. I CC2H test circuitFigure 23. I CC2L test circuitFigure 24. I CHG Pulsed test circuitFigure 25. I DSCHG test circuitFigure 26. t PLH , t PHL , t f , t r , test circuitFigure 27. tDESAT fault test circuitFigure 28. CMR Test circuit LED2 offVV CMFigure 30. CMR Test circuit LED1 offV CMFigure 31. CMR Test Circuit LED1 onV CMApplication Information Product Overview DescriptionThe ACPL-331J is a highly integrated power control device that incorporates all the necessary components for a complete, isolated IGBT / MOSFET gate drive circuit with fault protection and feedback into one SO-16 package. Active Miller clamp function eliminates the need of negative gate drive in most application and allows the use of simple bootstrap supply for high side driver. An optically isolated power output stage drives IGBTs with power ratings of up to 100 A and 1200 V. A high speed internal optical link minimizes the propagation delays between the microcontroller and the IGBT while allowing the two systems to operate at very large common mode voltage differences that are common in industrial motor drives and other power switching applications. An output IC provides local protection for the IGBT to prevent damage during over current, and a second optical link provides a fully isolated fault status feedback signal for the microcontroller. A built in “watchdog” circuit, UVLO monitors the power stage supply voltage to prevent IGBT caused by insufficient gate drive voltages. This integrated IGBT gate driver is designed to increase the performance and reliability of a motor drive without the cost, size, and complexity of a discrete design.Two light emitting diodes and two integrated circuits housed in the same SO-16 package provide the input control circuitry, the output power stage, and two optical channels. The output Detector IC is designed manufac-tured on a high voltage BiCMOS/Power DMOS process. The forward optical signal path, as indicated by LED1, transmits the gate control signal. The return optical signal path, as indicated by LED2, transmits the fault status feedback signal.Under normal operation, the LED1 directly controls the IGBT gate through the isolated output detector IC, and LED2 remains off. When an IGBT fault is detected, the output detector IC immediately begins a “soft” shutdown sequence, reducing the IGBT current to zero in a con-trolled manner to avoid potential IGBT damage from inductive over voltages. Simultaneously, this fault status is transmitted back to the input via LED2, where the fault latch disables the gate control input and the active low fault output alerts the microcontroller.During power-up, the Under Voltage Lockout (UVLO) feature prevents the application of insufficient gate voltage to the IGBT, by forcing the ACPL-331J’s output low. Once the output is in the high state, the DESAT (V CE ) detection feature of the ACPL-331J provides IGBT pro-tection. Thus, UVLO and DESAT work in conjunction to provide constant IGBT protection.Recommended Application CircuitThe ACPL-331J has an LED input gate control, and an open collector fault output suitable for wired ‘OR’ ap-plications. The recommended application circuit shown in Figure 33 illustrates a typical gate drive implementa-tion using the ACPL-331J. The following describes about driving IGBT. However, it is also applicable to MOSFET. Depending upon the MOSFET or IGBT gate threshold re-quirements, designers may want to adjust the VCC supply voltage (Recommended V CC = 17.5V for IGBT and 12.5V for MOSFET).The two supply bypass capacitors (0.1 µF) provide the large transient currents necessary during a switching transition. Because of the transient nature of the charging currents, a low current (5mA) power supply suffices. The desaturation diode D DESAT 600V/1200V fast recovery type, t rr below 75ns (e.g. ERA34-10) and capacitor C BLANK are necessary external components for the fault detection circuitry. The gate resistor R G serves to limit gate charge current and controls the IGBT collector voltage rise and fall times. The open collector fault output has a passive pull-up resistor R F (2.1 k W ) and a 330 pF filtering capacitor, C F . A 47 k W pull down resistor R PULL-DOWN on V OUT provides a predictable high level output voltage (V OH ). In this application, the IGBT gate driver will shut down when a fault is detected and fault reset by next cycle of IGBT turn on. Application notes are mentioned at the end of this datasheet.Figure 32. Block Diagram of ACPL-331JECC2OUT CLAMP EELEDFigure 33. Recommended application circuit (Single Supply) with desaturation detection and active Miller ClampDescription of Operation Normal OperationDuring normal operation, V OUT of the ACPL-331J is con-trolled by input LED current I F (pins 5, 6, 7 and 8), with the IGBT collector-to-emitter voltage being monitored through D DESAT . The FAULT output is high. See Figure 34.Fault ConditionThe DESAT pin monitors the IGBT Vce voltage. When the voltage on the DESAT pin exceeds 6.5 V while the IGBT isFigure 34. Fault Timing diagramactivated is an internal feedback channel which brings the FAULT output low forthe purpose of notifying the micro-controller of the fault condition.Fault ResetOnce fault is detected, the output will be muted for 5 μs (minimum). All input LED signals will be ignored during the driver to completely soft + HVDC-HVDCACOutput ControlThe outputs (V OUT and FAULT) of the ACPL-331J are con-trolled by the combination of I F , UVLO and a detected IGBT Desat condition. Once UVLO is not active (V CC2 - V E > V UVLO ), V OUT is allowed to go high, and the DESAT (pin 14) detection feature of the ACPL-331J will be the primary source of IGBT protection. UVLO is needed to ensure DESAT is functional. Once V UVLO+ > 10.5V, DESAT will remain functional until V UVLO- < 11.1V. Thus, the DESAT detection and UVLO features of the ACPL-331J work in conjunction to ensure constant IGBT protection.Desaturation Detection and High Current ProtectionThe ACPL-331J satisfies these criteria by combining a high speed, high output current driver, high voltage optical isolation between the input and output, local IGBT desaturation detection and shut down, and an optically isolated fault status feedback signal into a single 16-pin surface mount package.The fault detection method, which is adopted in the ACPL-331J is to monitor the saturation (collector) voltage of the IGBT and to trigger a local fault shutdown sequence if the collector voltage exceeds a predeter-mined threshold. A small gate discharge device slowly reduces the high short circuit IGBT current to prevent damaging voltage spikes. Before the dissipated energy can reach destructive levels, the IGBT is shut off. During the off state of the IGBT, the fault detect circuitry is simply disabled to prevent false ‘fault’ signals.The alternative protection scheme of measuring IGBT current to prevent desaturation is effective if the short circuit capability of the power device is known, but this method will fail if the gate drive voltage decreases enough to only partially turn on the IGBT. By directly measuring the collector voltage, the ACPL-331J limits the power dissipation in the IGBT even with insufficient gate drive voltage. Another more subtle advantage of the desaturation detection method is that power dissipation in the IGBT is monitored, while the current sense method relies on a preset current threshold to predict the safe limit of operation. Therefore, an overly conservative over current threshold is not needed to protect the IGBT.I FUVLO (V CC2 – V E )Desat Condition Detected on Pin 14Pin 3 (FAULT) OutputV OUTX Active X X Low X X Yes Low Low OFF X X X Low ONNot ActiveNoHighHighSlow IGBT Gate Discharge during Fault ConditionWhen a desaturation fault is detected, a weak pull-down device in the ACPL-331J output drive stage will turn on to ‘softly’ turn off the IGBT. This device slowly discharges the IGBT gate to prevent fast changes in drain current that could cause damaging voltage spikes due to lead and wire inductance. During the slow turn off, the large output pull-down device remains off until the output voltage falls below V EE + 2 Volts, at which time the large pull down device clamps the IGBT gate to V EE .DESAT Fault Detection Blanking TimeThe DESAT fault detection circuitry must remain disabled for a short time period following the turn-on of the IGBT to allow the collector voltage to fall below the DESAT threshold. This time period, called the DESAT blanking time is controlled by the internal DESAT charge current, the DESAT voltage threshold, and the external DESAT capacitor.The nominal blanking time is calculated in terms of external capacitance (C BLANK ), FAULT threshold voltage (V DESAT ), and DESAT charge current (I CHG ) as t BLANK = C BLANK x V DESAT / I CHG . The nominal blanking time with the recommended 100pF capacitor is 100pF * 6.5 V / 240 µA = 2.7 µsec.The capacitance value can be scaled slightly to adjust the blanking time, though a value smaller than 100 pF is not recommended. This nominal blanking time represents the longest time it will take for the ACPL-331J to respond to a DESAT fault condition. If the IGBT is turned on while the collector and emitter are shorted to the supply rails (switching into a short), the soft shut-down sequence will begin after approximately 3 µsec. If the IGBT collector and emitter are shorted to the supply rails after the IGBT is already on, the response time will be much quicker due to the parasitic parallel capacitance of the DESAT diode. The recommended 100pF capacitor should provide adequate blanking as well as fault response times formost applications.。

HDSP-331X资料

DescriptionThis 7.62 mm (0.3 inch) LED seven-segment display uses industry standard size package and pinout. The device isavailable in either common anodeAgilent HDSP-331x/332E/333x/334x Series 7.62 mm (0.3 inch) General Purpose Seven-Segment DisplayData SheetFeatures•Industry standard size•Industry standard pinout7.62 mm (0.4 inch) character height DIP lead on 2.54 mm •Choice of colorsHigh Efficiency Red (HER), Green,AlGaAs Red, and Yellow •Excellent appearanceEvenly lighted segments gray pack-age gives optimum contrast ± 50° viewing angle •Design flexibilityCommon anode or common cathode Single digitLeft and right hand decimal point•Categorized for luminous intensityGreen and yellow categorized for color Applications•Suitable for indoor use•Not recommended for industrial application, i.e., operating temperature requirementsexceeding +85˚C or below –25˚C [1]•Extreme temperature cycling not recommendedNote:1.For additional details, please contact your local Agilent sales office or an authorized distributor.Devices HERGreenAlGaAs Red Yellow DescriptionPackage Drawing HDSP-331E HDSP-331GHDSP-331AHDSP-331YCommon Anode, Right Hand and A Left Hand DecimalHDSP-332E Common Anode, Right Hand and Left A Hand Decimal without Pin 4, 5 and 12HDSP-333E HDSP-333G HDSP-333A HDSP-333Y Common Cathode, Right Hand B DecimalHDSP-334EHDSP-334GHDSP-334AHDSP-334YCommon Cathode, Right Hand DecimalCor common cathode. The choice of colors includes High Efficiency Red (HER), Green, AlGaAs Red,and Yellow. The gray facedisplays are suitable for indoor use.Part Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]A: AlGaAs RedE: High Efficiency Red G: Green Y: YellowDevice Specific Configuration [1]Refer to Respective Datasheet Package [1]Refer to Respective Datasheet∅1.1FRONT VIEWTOP END VIEWA F GB C L.DPD E DIMENSIONS IN MILLIMETERS (INCHES)R.DPNOTE: HDSP-332E DOES NOT HAVE PIN 4, 5 AND 12.Package Drawing APackage Drawing B∅1.1FRONT VIEW TOP END VIEWAF G BCDEDIMENSIONS IN MILLIMETERS (INCHES)R.DPPackage Drawing C∅1.1FRONT VIEW TOP END VIEWAF G BCDEDIMENSIONS IN MILLIMETERS (INCHES)R.DP611310872113.14 COMPIN N0.123678910111314CONNECTION CATHODE A CATHODE F COMMON ANODE CATHODE L.DP CATHODE E CATHODE D CATHODE R.DP CATHODE C CATHODE G CATHODE B COMMON ANODEPINS 4, 5, 12: NO CONNECTION FORHDSP-331E/331G/331Y/331A AND NO PIN FOR HDSP-332EHDSP-331E/331G/331Y/331A/332E9Common AnodeCommon Cathode14138761294.12 COMPIN NO.1246789121314CONNECTION ANODE F ANODE G COMMON CATHODEANODE E ANODE D ANODE C ANODE DP COMMON CATHODEANODE B ANODE AHDSP-333E/333G/333Y/333APINS 3, 5, 10, 11: NCCommon Cathode1098524371.6 COMPIN NO.12345678910CONNECTION COMMON CATHODEANODE E ANODE G ANODE F ANODE D COMMON CATHODEANODE DP ANODE C ANODE B ANODE AHDSP-334E/334G/334Y/334APINS 11, 12, 13, 14: NCElectrical/Optical Characteristics at T A = 25˚C High Efficiency Red (HER)Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 1.15mcd I F = 5 mA 0.81.80mcd I F = 10 mA Forward Voltage V F2.05 2.40V I F = 20 mAPeak Wavelength λPEAK 635nm Dominant Wavelength λd 620nm Reverse VoltageVR5VI R = 100 µAGreen Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 0.8 2.00mcd I F = 10 mA Forward Voltage V F 2.07V I F = 10 mA 1.802.25 2.60V I F = 20 mAPeak Wavelength λPEAK 568nm Dominant Wavelength λd 573nm Reverse VoltageVR5VI R = 100 µAAbsolute Maximum Ratings at T A = 25˚C DescriptionHERGreenAlGaAs Red Yellow HDSP-33xE HDSP-33xG HDSP-33xA HDSP-33xY Units Power Dissipation Segment 65653052mW Forward Current Segment25[1]25[2]15[3]20[4]mA Peak Forward Current per Segment 1001008080mA (1/10 Duty Factor at 10 kHz)Operating Temperature Range –35 to +85–35 to +85–35 to +85–35 to +85˚C Storage Temperature Range–35 to +85–35 to +85–35 to +85–35 to +85˚C Reverse Voltage per Segment or DP5555V Wave Soldering Temperature for 3 Seconds 250250250250˚C(at 2 mm Distance from the Body)Notes:1.Derate above 25˚C at 0.33 mA/˚C.2.Derate above 25˚C at 0.33 mA/˚C.3.Derate above 25˚C at 0.2 mA/˚C.4.Derate above 25˚C at 0.27 mA/˚C.331G 333G 334G331E 332E 333E 334EYellow Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 0.71mcd I F = 5 mA 0.801.50mcd I F = 10 mA Forward Voltage V F2.15 2.60V I F = 20 mAPeak Wavelength λPEAK 595nm Dominant Wavelength λd 590nm Reverse VoltageVR5VI R = 100 µAAlGaAs Red Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 3.93mcd I F = 5 mA 2.0014.20mcd I F = 10 mA Forward Voltage V F 1.85 2.00V I F = 20 mAPeak Wavelength λPEAK 660nm Dominant Wavelength λd 643nm Reverse VoltageVR5VI R= 100 µA331Y 333Y 334Y331A 333A 334AIntensity Bin Limits (mcd at 10 mA)HER/Green/Yellow AlGaAs RedBin Name Min.[1]Max.[1]Min.[1]Max.[1]G 0.801 1.250NA NA H 1.251 2.000NA NA I 2.001 3.200 2.001 3.200J NA NA 3.201 5.050KNA NA5.0518.000Note:1.Tolerance for each bin limit is ± 10%.Color Bin Limits (nm at 10 mA)Dominant Wavelength (nm)Color Bin Min.Max.Note:1.Tolerance for each bin limit is 1 nm.Figure 1. Maximum allowable average or DC current vs. ambient temperature.Figure 2. Forward current vs. forward voltage.Figure 3. Relative luminous intensity vs. DC forward current.High Efficiency Red (HER)Figure 4. Relative efficiency (luminousintensity per unit current) vs. peak current.020*********T A – AMBIENT TEMPERATURE – °C M A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A2.52.01.51.00.50510********IF – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )35R E L A T I V E EF F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )1.4005101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2Figure 7. Relative luminous intensity vs. DC forward current.Figure 8. Relative efficiency (luminous intensity per unit current) vs. peak current.Figure 5. Maximum allowable average or DC current vs. ambient temperature.Figure 6. Forward current vs. forward voltage.Green30T A – AMBIENT TEMPERATURE – °CM A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A3.02.52.01.51.00.500510********I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )35R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )05101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2Figure 9. Maximum allowable average or DC current vs. ambient temperature.Figure 10. Forward current vs. forward voltage.Figure 11. Relative luminous intensity vs. DC forward current.Figure 12. Relative efficiency (luminous intensity per unit current) vs. peak current.AlGaAs RedT A – AMBIENT TEMPERATURE – °C M A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A3.02.52.01.51.00.500510********I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )35R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )05101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2Figure 13. Maximum allowable average or DC current vs. ambient temperature.Figure 14. Forward current vs. forward voltage.Figure 15. Relative luminous intensity vs. DC forward current.Figure 16. Relative efficiency (luminous intensity per unit current) vs. peak current.YellowT A – AMBIENT TEMPERATURE – °C M A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A3.52.52.01.51.00.50051015202530I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )353.0R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )1.4005101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2/semicon-ductorsFor product information and a complete list of distributors, please go to our web site. For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152(Domestic/ International), or 0120-61-1280(Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Obsoletes 5988-2971ENJuly 17, 20045988-9421EN。

IRMCK311TR;中文规格书,Datasheet资料

Data Sheet No. PD60338IRMCK311 Dual Channel Sensorless Motor Control IC forAppliancesFeaturesMCE TM (Motion Control Engine) - Hardware based computation engine for high efficiency sinusoidal sensorless control of permanent magnet AC motor Integrated Power Factor Correction controlSupports both interior and surface permanent magnet motorsBuilt-in hardware peripheral for single shunt current feedback reconstructionNo external current or voltage sensing operational amplifier requiredDual channel three/two-phase Space Vector PWM Three-channel analog output (PWM)Embedded 8-bit high speed microcontroller (8051) for flexible I/O and man-machine controlJTAG programming port for emulation/debugger Two serial communication interface (UART)I2C/SPI serial interfaceWatchdog timer with independent analog clockThree general purpose timers/countersTwo special timers: periodic timer, capture timer Internal ‘One-Time Programmable’ (OTP) memory and internal RAM for final production usagePin compatible with IRMCF311 RAM version1.8V/3.3V CMOS Product SummaryMaximum crystal frequency 60 MHz Maximum internal clock (SYSCLK) frequency 128 MHz Maximum 8051 clock frequency 33 MHz Sensorless control computation time 11 μsec typ MCE TM computation data range 16 bit signed 8051 OTP Program memory 56K bytes MCE program and Data RAM 8K bytes GateKill latency (digital filtered) 2 μsec PWM carrier frequency counter 16 bits/ SYSCLK A/D input channels 6 A/D converter resolution 12 bits A/D converter conversion speed 2 μsec 8051 instruction execution speed 2 SYSCLK Analog output (PWM) resolution 8 bits UART baud rate (typ) 57.6K bps Number of I/O (max) 14 Package (lead-free) QFP64 Operating temperature -40°C ~ 85°CDescriptionIRMCK311 is a high performance OTP based motion control IC designed primarily for appliance applications. IRMCK311 is designed to achieve low cost and high performance control solutions for advanced inverterized appliance motor control. IRMCK311 contains two computation engines. One is Motion Control Engine (MCE TM) for sensorless control of permanent magnet motors; the other is an 8-bit high-speed microcontroller (8051). Both computation engines are integrated into one monolithic chip. The MCE TM contains a collection of control elements such as Proportional plus Integral, Vector rotator, Angle estimator, Multiply/Divide, Low loss SVPWM, Single Shunt IFB. The user can program a motion control algorithm by connecting these control elements using a graphic compiler. Key components of the sensorless control algorithms, such as the Angle Estimator, are provided as complete pre-defined control blocks implemented in hardware. A unique analog/digital circuit and algorithm to fully support single shunt current reconstruction is also provided. The 8051 microcontroller performs 2-cycle instruction execution (16MIPS at 33MHz). The MCE and 8051 microcontroller are connected via dual port RAM to process signal monitoring and command input. An advanced graphic compiler for the MCE TM is seamlessly integrated into the MATLAB/Simulink environment, while third party JTAG based emulator tools are supported for 8051 developments. IRMCK311 comes with a small QFP64 pin lead-free package.TABLE OF CONTENTS1 Overview (5)2 IRMCK311 Block Diagram and Main Functions (6)3 Pinout (8)4 Input/Output of IRMCK311 (9)4.1 8051 Peripheral Interface Group (10)4.2 Motion Peripheral Interface Group (10)4.3 Analog Interface Group (11)4.4 Power Interface Group (11)4.5 Test Interface (12)5 Application Connections (13)6 DC Characteristics (14)6.1 Absolute Maximum Ratings (14)6.2 System Clock Frequency and Power Consumption (14)6.3 Digital I/O DC Characteristics (15)6.4 PLL and Oscillator DC Characteristics (15)6.5 Analog I/O DC Characteristics (16)6.6 Under Voltage Lockout DC Characteristics (17)6.7 AREF Characteristics (17)7 AC Characteristics (18)7.1 PLL AC Characteristics (18)7.2 Analog to Digital Converter AC Characteristics (19)7.3 Op Amp AC Characteristics (19)7.4 SYNC to SVPWM and A/D Conversion AC Timing (20)7.5 GATEKILL to SVPWM AC Timing (21)7.6 Interrupt AC Timing (21)7.7 I2C AC Timing (22)7.8 SPI AC Timing (23)7.8.1 SPI Write AC timing (23)7.8.2 SPI Read AC Timing (24)7.9 UART AC Timing (25)7.10 CAPTURE Input AC Timing (26)7.11 JTAG AC Timing (27)7.12 OTP Programming Timing (28)8 I/O Structure (29)9 Pin List (32)Dimensions (35)10 Package11 Part Marking Information (36)Information (36)12 OrderingTABLE OF FIGURESFigure 1. Typical Application Block Diagram Using IRMCK311 (5)Figure 2. IRMCK311 Internal Block Diagram (6)Figure 3. IRMCK311 Pin Configuration (8)Figure 4. Input/Output of IRMCK311 (9)Figure 5. Application Connection of IRMCK311 (13)Figure 6. Clock Frequency vs. Power Consumption (14)Figure 7 Crystal oscillator circuit (18)Figure 8 Voltage droop of sample and hold (19)Figure 9 SYNC to SVPWM and A/D conversion AC Timing (20)Figure 10 GATEKILL to SVPWM AC Timing (21)Figure 11 Interrupt AC Timing (21)Figure 12 I2C AC Timing (22)Figure 13 SPI AC Timing (23)Figure 14 SPI Read AC Timing (24)Figure 15 UART AC Timing (25)Figure 16 CAPTURE Input AC Timing (26)Figure 17 JTAG AC Timing (27)Figure 18 OTP Programming Timing (28)Figure 19 All digital I/O except motor PWM output (29)Figure 20 RESET, GATEKILL I/O (29)Figure 21 Analog input (30)Figure 22 Analog operational amplifier output and AREF I/O structure (30)Figure 23 VPP programming pin I/O structure (30)Figure 24 VSS and AVSS pin structure (31)Figure 25 VDD1 and VDDCAP pin structure (31)Figure 26 XTAL0/XTAL1 pins structure (31)TABLE OF TABLESTable 1. Absolute Maximum Ratings (14)Table 2. System Clock Frequency (14)Table 3. Digital I/O DC Characteristics (15)Table 4. PLL DC Characteristics (15)Table 5. Analog I/O DC Characteristics (16)Table 6. UVcc DC Characteristics (17)Table 7. AREF DC Characteristics (17)Table 8. PLL AC Characteristics (18)Table 9. A/D Converter AC Characteristics (19)Table 10. Current Sensing OP Amp AC Characteristics (19)Table 11. SYNC AC Characteristics (20)Table 12. GATEKILL to SVPWM AC Timing (21)Table 13. Interrupt AC Timing (21)Table 14. I2C AC Timing (22)Table 15. SPI Write AC Timing (23)Table 16. SPI Read AC Timing (24)Table 17. UART AC Timing (25)Table 18. CAPTURE AC Timing (26)Table 19. JTAG AC Timing (27)Table 20. OTP Programming Timing (28)Table 21. Pin List (32)1 OverviewIRMCK311 is a new International Rectifier integrated circuit device primarily designed as a one-chip solution for complete inverter controlled appliance dual motor control applications. Unlike a traditional microcontroller or DSP, the IRMCK311 provides a built-in closed loop sensorless control algorithm using the unique Motion Control Engine (MCE TM) for permanent magnet motors. The MCE TM consists of a collection of control elements, motion peripherals, a dedicated motion control sequencer and dual port RAM to map internal signal nodes. IRMCK311 also employs a unique single shunt current reconstruction circuit to eliminate additional analog/digital circuitry and enables a direct shunt resistor interface to the IC. The sensorless control is the same for both motors with a single shunt current sensing capability. Motion control programming is achieved using a dedicated graphical compiler integrated into the MATLAB/Simulink TM development environment. Sequencing, user interface, host communication, and upper layer control tasks can be implemented in the 8051 high-speed 8-bit microcontroller. The 8051 microcontroller is equipped with a JTAG port to facilitate emulation and debugging tools. Figure 1 shows a typical application schematic using IRMCK311.IRMCK311 is intended for volume production purpose and contains 64K bytes of OTP (One Time Programming) ROM, which can be programmed through a JTAG port. For a development purpose use, IRMCF311 contains a 48k byte of RAM in place of program OTP to facilitate an application development work. Both IRMCF311 and IRMCK311 come in the same 64-pin QFP package with identical pin configuration to facilitate PC board layout and transition to mass productionFigure 1. Typical Application Block Diagram Using IRMCK3112 IRMCK311 Block Diagram and Main FunctionsM o t i o n C o n t r o l B u sFigure 2. IRMCK311 Internal Block DiagramIRMCK311 contains the following functions for sensorless AC motor control applications:• Motion Control Engine (MCE TM )o Proportional plus Integral block o Low pass filtero Differentiator and lag (high pass filter) o Ramp o Limito Angle estimate (sensorless control) o Inverse Clark transformation o Vector rotator o Bit latch o Peak detect o Transitiono Multiply-divide (signed and unsigned)o Divide (signed and unsigned)o Addero Subtractoro Comparatoro Countero Accumulatoro Switcho Shifto ATAN (arc tangent)o Function block (any curve fitting, nonlinear function)o16-bit wide Logic operations (AND, OR, XOR, NOT, NEGATE)o MCE TM program and data memory (6K byte). Note 1o MCE TM control sequencer• 8051 microcontrollero Three 16-bit timer/counterso16-bit periodic timero16-bit analog watchdog timero16-bit capture timero Up to 36 discrete I/Oso Eleven-channel 12-bit A/DFive buffered channels (0 – 1.2V input)One unbuffered channel (0 – 1.2V input)o JTAG port (4 pins)o Up to three channels of analog output (8-bit PWM)o Two UARTo I2C/SPI porto 64K byte Note 1program One-Time Programmable memoryo2K byte data RAM. Note 2Note 1: Total size of OTP memory is 64K byte, however MCE program occupiesmaximum 8K byte which will be loaded into internal RAM at a powerup/bootprocess. Therefore only 56K byte OTP memory area is usable for 8051microcontroller.Note 2: Total size of RAM is 8K byte including MCE program, MCE data, and 8051data. Different sizes can be allocated depending on applications.3 PinoutXTAL0XTAL1P1.1/RXD P1.2/TXDVDD1VSS VDD2P1.3/SYNC/SCKP1.4/CAPP 3.6/R X D 1P 3.7/T X D 1FPWMVL FPWMUL V S SV D D 2A V D DA V S SA I N 0A R E FP 2.7/A O P W M 1P 2.6/A O P W M 0CPWMUH CPWMVH CPWMWH CPWMUL CPWMVL CPWMWL CGATEKILL VDD1VSS I F B C OI F B C +I F B C -P L L V S SP L L V D DR E S E TN CT C KP 5.3/T D IP 5.2/T D OP 5.1/T M SS D A /C S 0S C L /S O -S I /V P PP 5.0/P F C G K I L LP F C P W M V S SFGATEKILL FPWMWL VAC-VAC+VACO IPFCO IPFC+IPFC-I F B F OI F B F +I F B F -P3.0/INT2/CS1C M E X TFPWMVH FPWMUHFPWMWH A I N 1P 3.2/I N T 0Figure 3. IRMCK311 Pin Configuration4 Input/Output of IRMCK311All I/O signals of IRMCK311 are shown in Figure 4. All I/O pins are 3.3V logic interface except A/D interface pins.Figure 4. Input/Output of IRMCK3114.1 8051 Peripheral Interface GroupUART InterfaceP1.1/RXD Input, Receive data to IRMCK311, can be configured as P1.1P1.2/TXD Output, Transmit data from IRMCK311, can be configured as P1.22nd channel Receive data to IRMCK311, can be configured as P3.6 P3.6/RXD1 Input,P3.7/TXD1 Output,2nd channel Transmit data from IRMCK311, can be configured as P3.7Discrete I/O InterfaceP1.3/SYNC/SCK Input/output port 1.3, can be configured as SYNC output or SPI clock P1.4/CAP Input/output port 1.4, can be configured as Capture Timer inputP3.0/INT2/CS1 Input/output port 3.0, can be configured as external interrupt 2 or SPIchip select 1P3.2/INT0 Input/output port 3.2, can be configured as external interrupt 0Analog Output InterfaceP2.6/AOPWM0 Input/output, can be configured as 8-bit PWM output 0 withprogrammable carrier frequencyP2.7/AOPWM1 Input/output, can be configured as 8-bit PWM output 1 withprogrammable carrier frequencyCrystal InterfaceXTAL0 Input, connected to crystalXTAL1 Output, connected to crystalReset InterfaceRESET Inout, system reset, needs to be pulled up to VDD1 but doesn’t requireexternal RC time constantI2C/SPI InterfaceSCL/SO-SI/VPP Output, I2C clock output, SPI SO-SII2C Data line, Chip Select 0 of SPISDA/CS0 Input/output,P3.0/INT2/CS1 Input/output port 3.0, can be configured as external interrupt 2 or SPIchip select 1P1.3/SYNC/SCK Input/output port 1.3, can be configured as SYNC output or SPI clock 4.2 Motion Peripheral Interface GroupPWMCPWMUH Output, motor 1 PWM phase U high side gate signalCPWMUL Output, motor 1 PWM phase U low side gate signalCPWMVH Output, motor 1 PWM phase V high side gate signalCPWMVL Output, motor 1 PWM phase V low side gate signalCPWMWH Output, motor 1 PWM phase W high side gate signalCPWMWL Output, motor 1 PWM phase W low side gate signalFPWMUH Output, motor 2 PWM phase U high side gate signalFPWMUL Output, motor 2 PWM phase U low side gate signal分销商库存信息: IRIRMCK311TR。

331P说明书

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功能 ........................................................................................................................................................ 1.2 熟悉您的新机器 ................................................................................................................................... 1.3

LM331中文资料_数据手册_参数

Product Folder
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LM231, LM331
SNOSBI2C – JUNE 1999 – REVISED SEPTEMBER 2015
LMx31x Precision Voltage-to-Frequency Converters
1 Hz to 100 kHz • Low-Cost
2 Applications
• Voltage to Frequency Conversions • Frequency to Voltage Conversions • Remote-Sensor Monitoring • Tachometers
LM231, LM331
SNOSBI2C – JUNE 1999 – REVISED SEPTEMBER 2015

Table of Contents
1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Description continued ........................................... 3 6 Pin Configuration and Functions ......................... 4 7 Specifications......................................................... 4

TL331中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

LM331中文资料中文手册芯片中文资料芯片中文手册

电压-频率变换器LM331LM331是美国NS公司生产的性能价格比较高的集成芯片。

LM331可用作精密的频率电压（F/V）转换器、A/D转换器、线性频率调制解调、长时间积分器以及其他相关的器件。

LM331为双列直插式8脚芯片，其引脚如图3所示。

LM331内部有（1）输入比较电路、（2）定时比较电路、（3）R-S触发电路、（4）复零晶体管、（5）输出驱动管、（6）能隙基准电路、（7）精密电流源电路、（8）电流开关、（9）输出保护点路等部分。

输出管采用集电极开路形式，因此可以通过选择逻辑电流和外接电阻，灵活改变输出脉冲的逻辑电平，从而适应TTL、DTL和CMOS 等不同的逻辑电路。

此外，LM331可采用单/双电源供电，电压范围为4～40V，输出也高达40V。

引脚1（PIN1）为电流源输出端，在f０（PIN3）输出逻辑低电平时，电流源ＩＲ输出对电容ＣＬ充电。

引脚2（PIN2）为增益调整，改变ＲＳ的值可调节电路转换增益的大小。

引脚3（PIN3）为频率输出端，为逻辑低电平，脉冲宽度由Ｒt和Ｃt决定。

引脚4（PIN4）为电源地。

引脚5（PIN5）为定时比较器正相输入端。

引脚6（PIN6）为输入比较器反相输入端。

引脚7（PIN7）为输入比较器正相输入端。

引脚8（PIN8）为电源正端。

LM331频率电压转换器V/F变换和F/V变换采用集成块LM331，LM331是美国NS公司生产的性能价格比较高的集成芯片，可用作精密频率电压转换器用。

LM331采用了新的温度补偿能隙基准电路，在整个工作温度范围内和低到4.0V电源电压下都有极高的精度。

同时它动态范围宽，可达100dB；线性度好，最大非线性失真小于0.01％，工作频率低到0.1Hz时尚有较好的线性；变换精度高，数字分辨率可达12位；外接电路简单，只需接入几个外部元件就可方便构成V/F或F/V等变换电路，并且容易保证转换精度。

图2是由LM331组成的电压频率变换电路，LM331内部由输入比较器、定时比较器、R－S触发器、输出驱动、复零晶体管、能隙基准电路和电流开关等部分组成。

DNP331中文资料

At least 3.0 mm away from resin body
1) The dip soldering process shall be 2 times maximum. 2) The product shall be cooled to normal temperature before the second dipping process.
Frequency (MHz)
Pulse Forward Voltage : VFM(V)
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DNP331
Through-hole IRED/φ3 Wide Distribution Type
Package Dimensions
(Unit: mm)
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Through-hole IRED/φ3 Wide Distribution Type
Technical Data
Spectral Distribution
Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 50mA
Condition : Ta = 25℃, tw ≦ 100μs
Forward Current IF(mA)
Forward Voltage : VF(V)
Pulse Forward Current IFRM(A)
Duty Ratio
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Through-hole IRED/φ3 Wide Distribution Type

LMX331AXK-T中文资料

General DescriptionThe LMX331/LMX393/LMX339 single/dual/quad com-parators are drop-in, pin-for-pin-compatible replace-ments for the LMV331/LMV393/LMV339. The LMX331H/LMX393H/LMX339H offer the performance of the LMX331/LMX393/LMX339 with the added benefit of inter-nal hysteresis to provide noise immunity, preventing out-put oscillations even with slow-moving input signals.Advantages of the LMX331/LMX393/LMX339 series include low supply voltage, small package, and low cost.The LMX331 is available in both 5-pin SC70 and SOT23packages, LMX393 is available in both 8-pin µMAX and smaller SOT23 packages, and the LMX339 is available in 14-pin TSSOP and SO packages. They are manufac-tured using advanced submicron CMOS technology.Designed with the most modern techniques, the LMX331/LMX393/LMX339 achieve superior performance over BiCMOS or bipolar versions on the market.The LMX331/LMX393/LMX339 offer performance advantages such as wider supply voltage range, wider operating temperature range, better CMRR and PSRR,improved response time characteristics, reduced off-set, reduced output saturation voltage, reduced input bias current, and improved RF immunity.ApplicationsMobile Communications Notebooks and PDAs Automotive Applications Battery-Powered ElectronicsGeneral-Purpose Portable DevicesGeneral-Purpose Low-Voltage ApplicationsFeatureso Guaranteed 1.8V to 5.5V Performanceo -40°C to +125°C Automotive Temperature Range o Low Supply Current (60µA/Comparator at V DD = 5.0V)o Input Common-Mode Voltage Range Includes Groundo No Phase Reversal for Overdriven Inputs o Low Output Saturation Voltage (100mV)o Internal 2mV Hysteresis(LMX331H/LMX393H/LMX339H)o 5-Pin SC70 Space-Saving Package (2.0mm ✕2.1mm ✕1.0mm)(LMX331/LMX331H)LMX331/LMX393/LMX339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack Comparators________________________________________________________________Maxim Integrated Products 1Pin Configurations19-1958; Rev 2; 1/02For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at1-888-629-4642, or visit Maxim’s website at .Ordering InformationL M X 331/L M X 393/L M X 339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack ComparatorsABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS —2.7V OPERATIONStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V DD to V SS )...................................-0.3V to +6V All Other Pins..................................(V SS - 0.3V) to (V DD + 0.3V)Continuous Power Dissipation (T A = +70°C)5-Pin SC70 (derate 3.1mW/°C above +70°C)..............247mW 5-Pin SOT23 (derate 7.1mW/°C above +70°C)............571mW 8-Pin SOT23 (derate 8.9mW/°C above +70°C)............714mW 8-Pin µMAX (derate 10.3mW/°C above +70°C)...........825mW14-Pin TSSOP (derate 9.1mW/°C above +70°C).........727mW 14-Pin SO (derate 8.3mW/°C above +70°C).............666.7mW Operating Temperature Range .........................-40°C to +125°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CAC ELECTRICAL CHARACTERISTICS —2.7V OPERATION(V DD = 2.7V, V SS = 0, V CM = 0, R L = 5.1k Ωconnected to V DD . Typical values are at T A = +25°C.) (Note 1)LMX331/LMX393/LMX339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack ComparatorsDC ELECTRICAL CHARACTERISTICS —5.0V OPERATION(V = 5V, V = 0, V = 0, R = 5.1k Ωconnected to V . Typical values are at T = +25°C.) (Note 1)AC ELECTRICAL CHARACTERISTICS —5.0V OPERATION(V DD = 5V, V SS = 0, V CM = 0, R L = 5.1k Ωconnected to V DD . Typical values are at T A = +25°C.) (Note 1)L M X 331/L M X 393/L M X 339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack Comparators 4_______________________________________________________________________________________DC ELECTRICAL CHARACTERISTICS —1.8V OPERATION(V DD = 1.8V, V SS = 0, V CM = 0, R L = 5.1k Ωconnected to V DD . Typical values are at T A = +25°C.)Note 2:Supply current when output is high.Note 3:Input overdrive is the overdrive voltage beyond the offset and hysteresis-determined trip points.AC ELECTRICAL CHARACTERISTICS —1.8V OPERATION(V DD = 1.8V, V SS = 0, V CM = 0, R L = 5.1k Ωconnected to V DD . Typical values are at T A = +25°C.)LMX331/LMX393/LMX339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack Comparators_______________________________________________________________________________________50302010405060708090100132456LMX331SUPPLY CURRENT vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (µA )40201008060160140120180132456LMX331SUPPLY CURRENT vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (µA )-1.0-0.50.51.01.5-4020-20406080100120INPUT OFFSET VOLTAGE vs. TEMPERATURETEMPERATURE (°C)I N P U T O F F S E T V O L T A G E (m V )040208060120100140OUTPUT LOW VOLTAGE vs. SINK CURRENTSINK CURRENT (mA)O U T P U T L O W V O L T A G E (m V )123460708090100110120-400-2020406080100120OUTPUT LOW VOLTAGE vs. TEMPERATURETEMPERATURE (°C)O U T P U T L O W V O L TA G E (m V )0200100400300500600040602080100120PROPAGATION DELAY vs. CAPACITIVE LOADCAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )0257550125150100175-4020-20406080100120PROPAGATION DELAY vs. TEMPERATURETEMPERATURE (°C)P R O P A G A T I O N D E L A Y (n s )015010050200250300350400450500502575100125150PROPAGATION DELAY vs. INPUT OVERDRIVE (t PLH )INPUT OVERDRIVE (mV)P R O P A G A T I O N D E L A Y (n s )060402080100120140160180200502575100125150PROPAGATION DELAY vs. INPUT OVERDRIVE (t PHL )INPUT OVERDRIVE (mV)P R O P A G A T I O N D E L A Y (n s )Typical Operating Characteristics(V DD = 5V, V SS = 0, V CM = 0, R L = 5.1k Ω, C L = 10pF, overdrive = 100mV, T A = +25°C, unless otherwise noted.)L M X 331/L M X 393/L M X 339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack Comparators 6_______________________________________________________________________________________Typical Operating Characteristics (continued)(V DD = 5V, V SS = 0, V CM = 0, R L = 5.1k Ω, C L = 10pF, overdrive = 100mV, T A = +25°C, unless otherwise noted.)00.51.01.52.02.53.0-40-2020406080100120LMX331H/LMX393H/LMX339H HYSTERESIS vs. TEMPERATUREL M X 331 t o c 10TEMPERATURE (°C)H Y S T E R E S I S (m V )13245132456LMX331H/LMX393H/LMX339H HYSTERESIS vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)H Y S T E R E S I S (m V )TIME (200ns/div)(IN-) - IN+100mV/divOUT 2V/divL M X 331 t o c 12PROPAGATION DELAY 100mV OVERDRIVETIME (200ns/div)(IN-) - IN+10mV/div OUT 2V/divL M X 331 t o c 13PROPAGATION DELAY 10mV OVERDRIVETIME (500ns/div)(IN-) - IN+100mV/divOUT 2V/divL M X 331 t o c 14500kHz RESPONSE 100mV OVERDRIVETIME (500ns/div)(IN-) - IN+10mV/divOUT 2V/divL M X 331 t o c 15500kHz RESPONSE 10mV OVERDRIVETIME (2µs/div)(IN-) - IN+100mV/div OUT 2V/divL M X 331 t o c 16100kHz RESPONSE 100mV OVERDRIVETIME (2µs/div)(IN-) - IN+10mV/divOUT 2V/divL M X 331 t o c 17100kHz RESPONSE 10mV OVERDRIVETIME (1µs/div)V DD 2V/divOUT 2V/divL M X 331 t o c 18POWER-UP RESPONSELMX331/LMX393/LMX339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack Comparators_______________________________________________________________________________________7Detailed DescriptionThe LMX331/LMX393/LMX339 are single/dual/quad,low-cost, general-purpose comparators. They have a single-supply operating voltage of 1.8V to 5V. The com-mon-mode input range extends from -0.1V below the negative supply to within 0.7V of the positive supply.They require approximately 60µA per comparator with a 5V supply and 40µA with a 2.7V supply.The LMX331H/LMX393H/LMX339H have 2mV of hys-teresis for noise immunity. This significantly reduces the chance of output oscillations even with slow-moving input signals. The LMX331/LMX393/LMX339 and LMX331H/LMX393H/LMX339H are ideal for automotive applications because they operate from -40°C to +125°C (see Typical Operating Characteristics ).Applications InformationHysteresisMany comparators oscillate in the linear region of oper-ation because of noise or undesired parasitic feed-back. This tends to occur when the voltage on one input is equal or very close to the voltage on the other input. The LMX331H/LMX393H/LMX339H have internal hysteresis to counter parasitic effects and noise.The hysteresis in a comparator creates two trip points:one for the rising input voltage and one for the fallinginput voltage (Figure 1). The difference between the trip points is the hysteresis. When the comparator's input voltages are equal, the hysteresis effectively causes one comparator input to move quickly past the other,thus taking the input out of the region where oscillation occurs. This provides clean output transitions for noisy,slow-moving input signals.Additional hysteresis can be generated with two resis-tors, using positive feedback (Figure 2). Use the follow-ing procedure to calculate resistor values:Figure 1. Threshold Hysteresis Band (Not to Scale)L M X 331/L M X 393/L M X 339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack Comparators 8_______________________________________________________________________________________1)Find output voltage when output is high:V OUT(HIGH)= V DD - I LOAD ✕R L2)Find the trip points of the comparator using theseformulas:V TH = V REF + ((V OUT(HIGH)- V REF )R2) / (R1 + R2)V TL = V REF (1 - (R2 / (R1 + R2)))where V TH is the threshold voltage at which the com-parator switches its output from high to low as V IN rises above the trip point, and V TL is the threshold voltage at which the comparator switches its output from low to high as V IN drops below the trip point.3)The hysteresis band will be:V HYST = V TH - V TL = V DD (R2 / (R1 + R2))In this example, let V DD = 5V, V REF = 2.5V, I LOAD =50nA, R L = 5.1k Ω:V OUT(HIGH)= 5.0V - (50 ✕10-9✕5.1 ✕103Ω) ≈5.0VV TH = 2.5V + 2.5V(R2 / (R1 + R2))V TL = 2.5V(1 - (R2 / (R1 + R2)))Select R2. In this example, we will choose 1k Ω.Select V HYST . In this example, we will choose 50mV.Solve for R1:V HYST = V OUT(HIGH)(R2 / (R1 + R2)) V0.050V = 5(1000 / (R1 + 1000)) Vwhere R1 ≈100k Ω, V TH = 2.525V, and V TL = 2.475V.Choose R1 and R2 to be large enough as not to exceed the amount of current the reference can supply.The source current required is V REF / (R1 + R2).The sink current is (V OUT(HIGH)- V REF ) ✕(R1 + R2).Choose R L to be large enough to avoid drawing excess current, yet small enough to supply the necessary cur-rent to drive the load. R L should be between 1k Ωand 10k Ω.Board Layout and BypassingUse 0.1µF bypass capacitors from V DD to V SS . To max-imize performance, minimize stray inductance by putting this capacitor close to the V DD pin and reduc-ing trace lengths. For slow-moving input signals (rise time > 1ms), use a 1nF capacitor between IN+ and IN-to reduce high-frequency noise.Chip InformationLMX331/LMX331H TRANSISTOR COUNT: 112LMX393/LMX393H TRANSISTOR COUNT: 211LMX339/LMX339H TRANSISTOR COUNT: 411Figure 2. Adding Hysteresis with External ResistorsLMX331/LMX393/LMX339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack ComparatorsPackage InformationL M X 331/L M X 393/L M X 339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack ComparatorsPackage Information (continued)LMX331/LMX393/LMX339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack Comparators ______________________________________________________________________________________11Package Information (continued)L M X 331/L M X 393/L M X 339General-Purpose, Low-Voltage,Single/Dual/Quad, Tiny-Pack ComparatorsMaxim cannot assume responsibility f or use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.12____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2002 Maxim Integrated Products Printed USAis a registered trademark of Maxim Integrated Products.Package Information (continued)。

威胜DSSD331产品说明书

1 综合介绍1.1 概述DSSD331/DTSD341型（配置号为MB3V7.4）三相电子式多功能电能表是威胜集团有限公司研制生产的新一代智能型高科技电能计量产品，符合GB/T17215、GB/T17882、GB/T17883 和DL/T614 等电能表有关标准，采用DL/T645通信规约（有扩展）。

1.2 工作原理简述本产品由电流互感器、集成计量芯片、微控制器、温补实时时钟、数据接口设备和人机接口设备组成。

集成计量芯片将来自电压分压，电流互感器的模拟信号转换为数字信号，并对其进行数字积分运算，从而精确地获得有功电量和无功电量，微控制器依据相应费率和需量等要求对数据进行处理。

其结果保存在数据存储器中，并随时向外部接口提供信息和进行数据交换，其原理框图如图1所示。

L C D显示器Ia+Ia-Ib+ Ib-Ic+ Ic-仪用电流互感器(CT)ia-ia+ib-ib+ic-ic+微控制器UaUb Uo Uc Uo 电压分压电路Uo uauouououbuc通信接口I C卡接口内部存储器时钟/电池脉冲输出按钮集成计量芯片停电抄表电池电源aUbUUUcn图1：工作原理简述（以三相四线表为例）1.3 技术参数项目技术要求参比电压3×220V/380V, 3×57.7V/100V, 3×100V 工作电压范围0.7Un—1.3Un电流测量范围互感器接入式：1.5(6)A,1(2)A, 5(10)A,0.3(1.2)A,5(6)A 直通式：10(40)A, 15(60)A, 20(80)A准确度等级有功0.5S级、1级无功2级工作温度-25℃～+55℃极限工作温度-35℃～+65℃相对湿度≤95%(无凝露) 频率范围(50±2.5)Hz启动电流互感器接入式：1‰Ib( 0.5S级)，2‰Ib( 1级) 直通式：4‰Ib( 1级)功耗＜2W，10V A MTBF ≥6×104 h时钟误差≤0.5 秒/天（0℃~+40℃时：±2ppm;-40℃~+85℃时：±3.5ppm）时钟频率1Hz 电池寿命10年电池连续工作时间 ≥5年脉冲输出常数出厂设置以表计面板标识为准。

AUIR3313STRL;AUIR3313STRR;AUIR3313;AUIR3313S;中文规格书,Datasheet资料

December, 10th 2010 Automotive gradeAUIR3313(S)PROGRAMMABLE CURRENT SENSE HIGH SIDE SWITCHFeaturesLoad current feedbackProgrammable over current shutdownActiveclampESD protectionInputreferenced to VccOver temperatureshutdown Reverse batteryprotectionLead Free, RoHS compliantDescriptionThe AUIR3313(S) is a fully protected 4 terminals high side switch. The input signal is referenced to Vcc. When the input voltage Vcc - Vin is higher than the specified threshold, the output power Mosfet is turned on. When the Vcc - Vin is lower than the specified Vil threshold, the output Mosfet is turned off. A current proportional to the power Mosfet current is sourced to the Ifb pin. Over current shutdown occurs when Vifb-Vin > 4.7V. The current shutdown threshold is adjusted by selecting the proper RIfb. Either over current and over temperature latches off the switch. The device is reset by pulling the input pin high. Other integrated protections (ESD, reverse battery, active clamp) make the switch very rugged in automotive environment.Vcc op. 6 to 32V Current Ratio 8800 10 to 90A Vclamp 40VTypical Connection†site /†† Exceptions to AEC-Q100 requirements are noted in the qualification report.Absolute Maximum RatingsAbsolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters150 °CkRecommended Operating Conditionsk (3) If Rifb is too high, the device may not switch on.Protection CharacteristicsRifb=1kmStatic Electrical Characteristicsmthe load current path and the input signal path can significantly affect the thresholds.(5) Rdson is measured between the tab and the Out pin, 5mm away from the package.(6) Guaranteed by designSwitching Electrical Characteristics6 90Current Sense CharacteristicsRfb=500, Iout=60A Functional Block Diagram8Figure 2 – Switching time definitionsFigure 1 – Voltages and current definitionsLead AssignmentsFigure 3 – Active clamp waveforms Figure 4 – Min. pulse and Wait functionFigure 5 – Protection Timing DiagramsVcc-VinVcc-Vin50%100%150%200%-500501001500123456-50050100150024681001020304050Figure 6 – Icc (mA) Vs Vcc-Vin (V) Vcc-Vin, supply voltage (V) I c c , s u p p l y c u r r e n t (m A )Tj, junction temperature (°C) Figure 7 – Icc off (µA) Vs Tj (°C)I c c o f f , s u p p l y l e a k a g e c u r r e n t (µA )0123456-50-250255075100125150Tj, junction temperature (°C)V i h , V i l a n d V i f b -V i n @I s d (V ) R d s (o n ), D r a i n -t o -S o u r c e O n R e s i s t a n c e (N o r m a l i z e d )Figure 8 - Normalized Rds(on) (%) Vs Tj (°C) Tj, junction temperature (°C) Figure 9 – Vih, Vil and Vifb-Vin@Isd (V) Vs Tj (°C) All curves are typical characteristics. Operation in hatched areas is not recommended. Tj=25°C, Rifb=500ohm, Vcc=14V (unless otherwise specified).102030-5050100150Figure 10 – Error (+/- A) Vs I load (A)Rifb, feedback resistor ()E r r o r (+/-A )10100100100010000Figure 11 – Ids (A) Vs Rifb ()I s d , o v e r c u r r e n t s h u t d o w n (A )I load, load current (A)Figure 12 – Max. Iout (A) Vs Tamb. (°C)M a x . o u t p u t c u r r e n t (A )Tamb., ambient temperature (°C)Figure 13 – Max. Iout (A) Vs inductance (µH)Inductance (µH)M a x . o u t p u t c u r r e n t (A )024681012141618020406080100101001010010000.010.11101001E-41E-31E-21E-11E+01E+11E+2Z t h , t r a n s i e n t t h e r m a l i m p e d a n c e (°C /W )Time (s)Figure 15 – Transient thermal impedance (°C/W)Vs time (s)1.E-011.E+001.E+011.E+021.E+03Protection response time (s)Figure 14 – Ids (A) Vs over temperature protection response time (s)/ Rth=60°C/W分销商库存信息:IRAUIR3313STRL AUIR3313STRR AUIR3313 AUIR3313S。

SS-331 LCD Desoldering Station用户手册说明书

SS-331 LCD Desoldering StationUser’s Manual1st Edtion,©2020 Copyright by Prokit’s Industries Co., Ltd.DescriptionSS-331 designed for lead free desoldering especially. The quick heating and strong power are for convenient and clear soldering / desoldering all types of DIP components.Reasonable structure, single hand operation and strong absorbing power can be easy removal of the residual solder from the one-sided or two sided of the PCB. This tool is used in the fields of electronic research, teaching and production, especially in the repairing and desoldering on the electronic appliances and communication equipments.1. Control UnitThe desoldering iron gun is controlled automatically by the micro-processor. The digital control electronics and high-quality sensor and heat exchange system guarantee precise temperature control at the soldering tip. The highest degree of temperature precision and optimal dynamic thermal behavior under load conditions is obtained by the quick and accurate recording of the measured values in a closed control circuit, and this design is especially for the lead-free production techniques.2. Desoldering Iron gun (5SS-331N-DG)Desoldering iron gun with a power of 90W and a wide spectrum of soldering tips can be used anywhere in the electronics field.The high power and gun type design make this iron gun suitable for fine desoldering work. The heating element is made of ceramic and the sensor on the desoldering tip can control the desoldering temperature quickly and accurately.Technical SpecificationModel No. SS-331B SS-331H SS-331E Voltage 220V-240V~ 50Hz 120V~ 60Hz Soldering Power 90WPower Consumption 140WTemperature 160°C ~ 480°CVacuum Pressure >600mm HgHeating Element Ceramic HeaterSleep mode Approximately 10 minutes if not useAccessories Spare tip x 3 (∅ 1.2(on the gun)∅1.0/ ∅ 1.5mm) Cleaning tool x 3 (∅0.7/∅0.9/∅ 1.2mm)Filter sponge x 4 (φ20.8x1 +φ16.8x3)Certificate CE, RoHS RoHS cTUVus, RoHS PlugStation Size (mm) 172 x 135 x 190Weight (kgs) 1.6Operating Instruction1. Place the desoldering iron gun in the holder separately. Then connect the plugto the receptacle on the station and turn clockwise to tighten the plug nut. Check that the power supply is corresponding to the specification on the type plate and the power switch is on the “OFF” position. Connect the control unit to the power supply and switch on the power. Then a self-test is carried out in which all display elements are switched on briefly. The electronic system then switches on automatically to the set temperature and displays this value.2. If not use for about 10 minutes ,the desolering station will be automatically intosleeping mode and the temperature is reduced to 200 C, this for prolonged the life of the suction nozzle and the heating element; Shake or pick up the desoldering Iron gun, can start the working again.3. The display and temperature setting①.Shows the actual temperature of the desoldering tip.②.Shows the setting temperature: Pressing the “UP” or “DOWN” button canswitch the digital display to the set point display. The set-point can bechanged for ±1℃by tapping the “UP” or “DOWN” button. Pressing thebutton will change the set-point quickly. The digital display will returnautomatically to the actual value and the iron will reach to the settingtemperature quickly.③.℃/℉display: Switching the temperature display from ℃to ℉bypressing the “ *”button and then the electronic system will display theactual temperature①and setting temperature②in ℉, and vice versa.④.When the actual temperature on the desoldering tip is less than theset-point, “HEAT ON” will display and make the desoldering tip heatingup.⑤.When the absolute offset is more than ±10℃between the actualtemperature and the set-point on the desoldering tip or the nozzle,“WAIT” will display. It means that the temperature electronic controlsystem is not in the stable situation, we should wait a moment to let the“WAIT” disappear.⑥.When “-----” & “ERROR” display, there may be a trouble on the system,or the desoldering iron gun is not connected to the control systemcorrectly.Safety Instruction1. The manufacturer assumes no liability for uses other than those described inthe operating instructions or for unauthorized alterations.2. The operating instructions and cautions should be read carefully and kept in aneasily visible location in the vicinity of the control system. Non-observance of the cautions will result in accidents, injury or risks to health.Caution1. The power cord only can be inserted in approved power sockets or adapters.2. High TemperatureWhe temperature of the desoldering tip will reach as high as around 400℃（752℉）When the power switch is on. Since mishandling may lead to burns and fire, be sure to comply with the following precautions:A. Do not touch metallic parts near the desoldering tip/ nozzle.B. Do not use this system near the flammable items.C. Advise other people in the work area that the unit can reach a very hightemperature and should be considered potentially dangerous.D. Turn off the power switch while taking breaks and when finishing using.E. Before replacing parts or storing the system, turn off the power and let itcool down to the room temperature.F. Warning: this tool must be placed on its stand when not in use.G. A fire may result if the appliance is not used with care, therefore:a) Be careful when using the appliance in places where there iscombustible material.b) Do not apply to the same place for a long time.c) Do not use in presence of an explosive atmosphere.d) Be aware heat may be conducted to combustible materials that outof sight.e) Place the appliance on its stand after use and allow it to cool downbefore storage.f) Do not leave the appliance unattended when it is switched on.3. Take care of your toolsDo not use the tools for any applications other than desoldering.Do not rap the iron against the work bench or otherwise subject the iron to severe shocks.Do not file the desoldering tip to remove the oxide, please wipe the tip on the cleaning sponge.Use only accessories or attachments which are listed in the operation manual.Use of other tools and other accessories can lead to a danger of injury.Please turn off the power before connecting or disconnecting the desoldering iron gun.4. Maintenance4.1 Before further use, safety devices or slightly damaged parts must becarefully checked for error-free and intended operation.4.2 Inspect moving parts for error-f ree operation and that they don’t bind, orwhether any parts are damaged.4.3 Damaged safety devices and parts must be repaired or replaced by aqualified technician, so long as nothing else is indicated in the operation manual.4.4 Use only accessories or attachments which are listed in the operationmanual. Use of other tools and other accessories can lead to a danger of injury.5. Keep children at a distanceWarning: this appliance is not intended for use by young children andinfirm persons unless they have been adequately supervised by aresponsible person to ensure that they can use the appliance safely.Warning: Young children should be supervised to ensure that they do not playwith the appliance.Unused desoldering station should be stored in a dry location which is out of thereach of children. Switch off all unused desoldering station.6. Protect yourself against electrical shocksAvoid touching grounded parts with your body, e.g. pipes, heating radiators andso on. The grip of antistatic designed desoldering tool is conductive.7. Work environmentDo not use the desoldering station in a moist or wet environment. Thedesoldering iron gun should be placed on the holder after finished using.8. Observe the valid safety regulations at your work place.Desoldering Gun MaintenancePush the knob up, and then pull theback holder.WARNINGS:1. To avoid injury or damage the items, do not touch the metallic parts near thenozzle, and do not use this system near the flammable items.2. Remove the power plug before performing maintenance procedure, exceptdoing the nozzle and heating element clean process.3. If the pump does not operate, immediately clean the nozzle & heating element,and replace the filter4.In the high temperature, the solder waste will get oxidized(lead free solder’s melting point is 220° C, non-lead fr ee solder’s melting point is 180° C),swelled and stuck on the inner wall tightly, If it did not clean after use, the solder wastewill block the desoldering gun, can not remove even use cleaning pin.( Cleaning pin)Please follow below steps to remove the solder waste: 1.Push the knob up, and then pull the back holder.2. Take the spring out from the glass tube ,then remove the solder wastePut the spring back to glass tube, then put glass tube back to position.Press the back holder, then the knob will bullet down and become locked automatically .INSTRUCTIONS: 1. After each operation is finished, please idling suck the desoldering gun3-5 times soon, this can clean the solder waste inside the pipe.2. If the operation interval is about 20 minutes, after idling sucking the desoldering gun, please also use the cleaning tool to clean the pipe.3. When you find the desoldering efficiency gets down, please use the cleaning Pin to clean the pipe immediately.4. If the operation interval is long, we advise to adjust the temperature to about 200° C . When you use it again, you can adjust to the working temperature,5.When the glass tube has absorbed about 1/2 solder waste, please clean it immediately. When you find the filter is getting hardened, please replace the filter immediately.Aluminum pieceGlass tubeFilterTroubleshootingFault phenomenon Failure cause solutionLCD No display Fail to connect powersource Check the power cord connection and plug in the power cord to power Jack.Fuse blown Replace fuse : 3.15A / 250VFail to Set temperature Key damage Return to dealerSuction non-action Trigger switch damage Return to dealerMotor damage Return to dealerNozzle is not hot Heating elementdamagedReturn to dealerinternal wire damage Return to dealerCan not melt solder Unreasonable setting oftemperatureReset the appropriate temperaturenozzle oxidation Replace nozzlenozzle is not hot Return to dealerSuction ability is low Blow- by Check the connection of vacuum outletCheck the installation of glass tubeExcessive solder waste storage in glass tube Removing solder waste from glass tubeFilter degradation Replacement of filter Air pump bad Return to dealerUnable to absorb solder solder hole blocked under heating condition, using cleaningpin to clean heating elementSolder meltinadequatelywhen solder is completely meltedTin absorption hole blocked, can not be dredged Solder wasteaccumulate at the end ofheating elementTake off the glass tube, use thesoldering iron to heat the steel pipeback to remove the solder waste, andthen use the cleaning pin to dredge.NutChecking the heating element:Disconnect the plug and measure the resistance value between the desoldering gunconnecting plug pins as follows.If the resistance values of 'a' and 'b' are outside the above value, replace the heating element (sensor).If the resistance values of 'd' is outside the above value ，Sleep mode was lose efficacyReplace the heating element:1）Disconnect the power plug, wait unit the desoldering gun temperature down to room temperature.2）Loosen screws and disassemble desoldering gun.3）Cut off the wire of heating element, prepare a new heating element (model no. 5SS-331N-H).as follow figure.4）Connect heating element ：Put the heating element on the black heating element holder, insert the heat shrink tube （Φ3x25mm ）and metal tube (Φ2x6mm) to the wire, connect wire and pull the metal tube to the connect position, crimping the metal tube with crimper tool, pull the heat shrink tub to the metal tube and heating.-- Long blue wire (ground) connects to the yellow wire in handle-- Two white wires (heating element) connect to the two red wire, no need to distinguish positive electrode and negative electrode.-- Two blue wires (Sensor) connect to the black and blue wire in handle, no need to distinguish positive electrode and negative electrode. -- Any one wire connect to the Sleep control sensor5）Measure the resistance value again, make sure the value is correct. Short the desoldering gun nozzle and shell of plug, and the resistance value should be 0Ω. 6）Assembly desoldering gun again, do not press the wire or put into the wrong position.Note : The color of wire for reference, color change without notice.Any repair or replacement operation by professional operatora. Between pins 1 & 2 (Sensor)50Ω±3Ω(25℃ room temperature) b. Between pins 3 & 4 (Heating Element) 2Ω±1Ω(25℃ room temperature) c. Between pin 5 & 6 0Ω (tigger on)d. Between pin 7 & 2open or 0Ω(shaking gun)SS-331数显吸焊台使用手册警告！为降低伤害风险，用户必须阅读使用手册概述SS-331 特别为无铅吸焊而设计。

PS331_Datasheet

F orS ky w o rt hEv al ua ti onO nl yDo Not Distribute Without PermissionPS331 HDMI/DVI SWITCHDatasheetVersion 0.6Aug 07, 2008NoticeAll information provided in this document on “AS IS” basis without any guarantee or warranty. Information in this document is provided in relation to Parade products and is subject to change without notice. No intellectual rights or licenses are implied.530 Lakeside Dr. Suite 230 Sunnyvale, CA 94085 USA TEL : 408-329-5540FAX : 408-329-5541Email: sales@PARADE TECHNOLOGIES INC.F orS ky wo rt hEv al ua ti on O nl yPS331 HDMI/DVI SWITCHFor Customer Internal Use Only2Parade Technologies Inc. TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@REVISION HISTORYVer0.6, 04/30/20081. Initial released draft Ver0.6, 08/01/20081. Updated PACKAGE DISSIPATION RATINGS2. Removed TQFP80 PACKAGE Ver0.6, 08/07/20081. Updated Register Definitions2. Added TQFP64 PACKAGE3. Updated PACKAGE DISSIPATION RATINGSF orS ky w o rt hEv al ua ti on O nl yPS331 HDMI/DVI SWITCHFor Customer Internal Use Only3Parade Technologies Inc. TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@KEY FEATURESy Programmable Receiver Equalization to compensate cable loss up 17dB at 2.25Gbps y Source Connection Detection for flexible system management y Integrated 50ohm Active Receiver Termination y HDMI 1.3a complianty DC or AC coupling capable receivery Supports UXGA, WUXGA, & 1080p with 8/10/12 bit deep colory Built-in side-band Signals Multiplexer with 5 V tolerance for SDAx/SCLx pins y Supports both Active DDC Buffering and Passive Multiplexing for side-band signals y Local I2C interface for flexible host control and GPIO saving y Integrated on-chip EDID shadow to save system BOM cost y Single 3.3 V Power Supplyy 0°C to 70°C Operating Temperature Range y ESD: Human Body Mode at 8kV for all pins, Machine Mode 400V, and Charged Device Mode 2kVy 64-pin QFN or TQFP RoHS PackageAPPLICATIONSy Digital TVy Digital Set-Top-Box y A/V Receivery Digital DVRy 3-to-1 HDMI/DVI Switch BoxDESCRIPTIONPS331 integrates a 3-to-1 HDMI/DVI switch to simplify system level design and reduce system level cost for applications requiring multiple HDMI/DVI input connectors and single output device in digital TV and other emerging digital appliances.TMDS inputs and corresponding DDC and HPD connection are selected by local I2C control bus . DDC I2C pins are bi-directional and HPD pins are uni-directional, SDAx/SCLx and HPD_SINK are 5 V tolerant I/O. Each TMDS channel can support data rate up to 2.25 Gbps with equalization up to 17 dB. PS331 supports both DC and AC coupling.The PS331 supports either fixed cable equalization with default setting of 10 dB at 1.65 Gbps and 12 dB at 2.25 Gbps or programmable equalization from 0 to 15 dB at 1.65 Gbps and from 0 to 17dB at 2.25 Gbps by I2C control registers.The PS331 integrated EDID shadow RAM helps reduce the BOM cost by removing three external EDID ROMs.FPS331 HDMI/DVI SWITCHFor Customer Internal Use Only4TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. FUNCTIONAL BLOCK DIAGRAMFigure1. Functional Block DiagramF orS kyyPS331 HDMI/DVI SWITCHFor Customer Internal Use Only5TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. PIN ASSIGNMENT & DESCRIPTIONV C CREXT POWDN P O W 1H P D 1B31A32B32POW3A33A 24B 24A34GND B33SCL3CEXTVCC A31B34A 22B 22H P D 2P O W 2A 23B 23A 21B 21G N DS C L 2S D A 2NC A14B14I2C_RSTVCC A13B13A11B11GND SDA1H P D _S I N KZ 1Y 1Z 3Y 3I 2C _A D D RV C CZ 2Y 2Z 4Y 4G N DS C L _C T LS D A _C T LS D A _S I N KS C L _S I N KFigure2. PS331 Pin Assignment of QFN64 Package (Top View)F orSky wo rt hEv al ua t i o n O nl yPS331 HDMI/DVI SWITCHFor Customer Internal Use Only6TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. P O W 2H P D 2S D A 2S C L 2GND B 21A 21VCCB 22A 22G N DB 23A 23V C CB 24A 24P O W 1H P D 1H P D _S I N KS D A _S I N KS C L _S I N KNC Z 1Y 1Z 2Y 2Z 3Y 3VCC Z 4Y 4GND I 2C _A D D RS C L _C T LS D A _C T LA34B34V C CA33B33A32B32A31B31G N DSCL3SDA3HPD3POW3CEXTI2C_RSTSDA1SCL1B11A11B12A12B13A13B14A14REXT POWDN12345678910111213141516171819205049484746454443424160595857565554535251212223242526272829303132333435363738394064636261POW_SINKPS331Figure3. PS331 Pin Assignment of TQFP64 Package (Top View)PS331 HDMI/DVI SWITCH FAX: 408-329-5541Email: Sales@Parade Technologies Inc. Table1. Pin DescriptionsF orS ky w o rt hEv al ua ti on O nl yPS331 HDMI/DVI SWITCHFor Customer Internal Use Only8TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. FUNCTION DESCRIPTIONSource Connection DetectionPS331 uses Source DC 5 V supplies to detect if a power-on Source is plugged into one of the ports. POW1, POW2 and POW3 are the 3.3 V input pins to be connected to the DC 5 V supplies at the HDMI connectors through 37K ohm resistors. An internal resistor at the input pin is used to level-shift the 5 V signal to 3.3 V signal to the input of 3.3 V CMOS input buffer.POW_SINK is the buffered output of the selected port POW. Each of the Source Connection Detection results is also accessible from the registers of local I2C control. Source Connection Detection can be effectively used to indicate the existence of plugged Source device for each corresponding port.All HPD outputs are gated by POW levels, that is, if no Source Connection is detected for a given port, the HPD output will not be asserted by HPD_SINK or by registers. If the Source Connection Detection is not used in the application, pins of POW1, POW2 and POW3 shall be connected to 3.3 V VCC. Source Connection Detection is operational in standby mode.Standby ModeRegister CONFIG [7] =1 sets the chip to standby mode. In standby mode, the receiving equalizers and output drivers are powered down; the EDID access, Source Connection Detection and I2C Control are still operational. I2C control is operational and registers can be accessed. Source devices can still read EDID from PS331 EDID shadow through DDC channels in standby mode.Power Down ModePin POWDN = HIGH will power down the chip. In power down mode, PS331 will be non-operational. Equalization SettingPS331’s input ports receiver equalizations can be set individually .F orSPS331 HDMI/DVI SWITCHFor Customer Internal Use Only9TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. Usage Model 1Figure4. Usage Model 1 Application DiagramDescription:In this model, POW1, POW2, and POW3 are either connected to VCC (no Source Connection Detection) or to source 5V DC supply through a 37K ohm resistor (Source Connection Detection used). I2C Control interface is used to configure PS331. The switch selection, equalization programming, etc., are all controlled by I2C control registers. Refer to the Register Table for chip configuration and programming. EDID shall be connected in front of SCLx/SDAx in this model. Pin POWDN = HIGH will power down the chip.F orS ky w oPS331 HDMI/DVI SWITCHFor Customer Internal Use Only10TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. Usage Model 2Figure5. Usage Model 2 Application DiagramDescription:In this model, POW1, POW2 and POW3 are connected to source DC 5 V supplies through 37K ohm resistors. I2C Control interface is used to configure PS331 and to load EDID into PS331 on-chip EDID shadow. The switch selection, equalization programming, etc., are all controlled by I2C control registers. Refer to the Register Table for chip configuration and programming. The EDID is written to PS331 EDID shadow by Display (TV) MPU directly from MPU memory through local I2C bus SCL_CTL/SDA_CTL.Refer to the relevant Application Note for detailed descriptions. Pin POWDN = HIGH will power down the chip.F orS ky w oPS331 HDMI/DVI SWITCHFor Customer Internal Use Only11TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. Usage Model 3Figure6. Usage Model 3 Application DiagramDescription:In this model, POW1, POW2 and POW3 are connected to source DC 5 V supplies through 37K ohm resistors. I2C Control interface is used to configure PS331 and to load EDID into PS331 on-chip EDID shadow. The switch selection, equalization programming, etc., are all controlled by I2C control registers. Refer to the Register Table for chip configuration and programming. The EDID is read by Display (TV) MPU through local I2C bus SCL_CTL/SDA_CTL from external EDID firstly, and then write into PS331 on-chip EDID shadow.Refer to the relevant Application Note for detailed descriptions. Pin POWDN = HIGH will power down the chip.F orS ky wo rt hEv al ua ti on O nl yPS331 HDMI/DVI SWITCHFor Customer Internal Use Only12TEL: 408-329-5540FAX: 408-329-5541Email: Sales@Parade Technologies Inc. Register DefinitionsTable2. Device AddressControl Register (W/R) EDID Shadow (W/R)I2C_ADDR = LOW 94/95 96/97 I2C_ADDR = HIGHB4/B5B6/B7Table3. Register DefinitionsAddress NameDescriptionNote0x00CONFIG [7:0]Device Configuration Register [7] Enable StandbyIn standby mode, TMDS equalizer and output driver are powered down. EDID Reading, Source Connection Detection, and I2C Control are still operational as in normal operation.[6:4] P ort switch controlxx1: Port 1 is selectedx10: Port 2 is selected100: Port 3 is selected000: No Port is selected[3] Enable individual port equalization setting.By enable this bit, port 1 to port 3 equalization can be set individually. Port 1 equalization is set by RCV_EQ_SET [7:4], Port 2 and port 3 equalization is set by RCV_EQ_SET2 [7:0].[2] Reserved[1] EDID shadow enable[0] ReservedRESET value:0x00 R/W0x01 RCV_EQ_SET [7:0]Receiver equalization setting[7:4] ==1.65 Gbps2.25 Gbps 0000 Æ 10 dB 12 dB 0001 Æ 15 dB 17 dB 0010 Æ 14 dB 16 dB 1000 Æ 12 dB 14 dB 1001 Æ 7 dB 9 dB 1011 Æ 5 dB 7 dB 1010 Æ 3 dB 4 dB 1101 Æ 9 dB 11 dB 1111 Æ 0 dB0 dBAll other values are reserved.RESET value: 0x00R/WParade Technologies Inc.Email: Sales@Parade Technologies Inc.FAX: 408-329-5541Email: Sales@Parade Technologies Inc.TEL: 408-329-5540FAX: 408-329-5541Email: Sales@Parade Technologies Inc.FAX: 408-329-5541Email: Sales@F orS ky wo rt hEv al ua ti on O nl yFor Customer Internal Use Only17TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc.F orSky w o rt hEv al ua ti onO nl yPS331 HDMI/DVI SWITCHFor Customer Internal Use Only18TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. ABSOLUTE MAXIMUM RATINGSParametersComments UnitSupply Voltage Range, VCC -0.5 V to 4 V Normal I/O Voltage Range-0.5 V to 4 V 5 V Safe I/O Voltage Range SCLx, SDAx, HPD_SINK -0.5 V to 6VHuman Body Model: All pins +/- 8 kV Machine Model: All pins +/- 400 V ESDCharged Device Mode: All pins+/- 2 kV ESD Standard:Human Body Mode: JESD22-A114-D Machine Mode: JESD22-A115-ACharged Device Mode: JESD22-C101-ALatch-up Standard: JEDEC STANDARD No.78A FEBRUARY 2006; Class-I; I-Test: and V-TestNORMAL OPERATING CONDITIONSParameterMinTypMaxUnitSupply Voltage, VCC 3.0 3.3 3.6 V Case Temperature, Tc 070 °CNormal Operation Supply Current, Icc 1175 mA Current in Standby, Icc 8.3mA Power down Current500uAPACKAGE DISSIPATION RATINGSPackageθJA - Junction to Ambient Thermal Resistance Still air, 4-layer PCBMaximum Power Dissipation RatingTa ≤ 25 °C Still air, 4-layer PCBMaximum Power Dissipation RatingTa = 70 °C Still air, 4-layer PCB64-pin QFN34 °C/W 2941 mW 1618 mW 64-pin TQFP31 °C/W3226 mW1774 mW1Test conditions: V IH = Vcc, V IL = Vcc – 0.4 V, REXT = 500Ω, R T = 50 Ω , AVCC = 3.3 V,225 MHz clock input and 2.25 Gbps HDMI data patternF orS ky wo rt hEv al ua ti onO nl yPS331 HDMI/DVI SWITCHFor Customer Internal Use Only19TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. DC CHARACTERISTICSParameterTest Conditions Min Typ 3Max UnitControl pins: I2C_ADDR, I2C_RST, POWDN V IH LVTTL input High-level voltage V ILLVTTL input Low-level voltage|I IH | Input High-level current |I IL | Input Low-level currentV IH = 2 V to VCC V IL = GND to 0.8 V2 GNDVCC 0.8100 55V VuA uA Status pin: HPD_SINK(input), HPDx(output) V IH LVTTL input High-level voltage V ILLVTTL input Low-level voltage|I IH | Input High-level current |I IL | Input Low-level current V OH LVTTL High-level output voltage V OL LVTTL Low-level output voltageV IH = 2 V to 5.3 V V IL = GND to 0.8 V I OH = -8 mA I OL = 8 mA2 GND2.480 155.3 0.8150 30 0.4V V uA uA V V I2C pins: SCLx, SDAx, SCL_SINK, SDA_SINK V I2Cx Input voltage of SCLx, SDAxV I2Csink Input voltage of SCL_SINK, SDA_SINK |I LK | Inputleakage current C IO Input/output capacitance with active buffer C IO Input/output capacitance with passive switch R ON Switch resistance (passive switch only)V PASS Switch output voltage (passive switch only)V LK = 0.1 VCC to 0.9 VCC V I = 0 V V I = 0 VI O = 3 mA; V O = 0.4 V I O = 100 uA; V I = 5.0 VGND GND 1.5 14 202.0 5.33.6 2 50 3.0V V uA pF pF Ω V I2C pins: SCL_CTL, SDA_CTLV I2Cx Input voltage for SCLx, SDAx I LKInput leakage currentC IO Input/output capacitanceV LK = 0.1 VCC to 0.9 VCC V I = 0 VGND 7.53.6 2V uA pFDifferential inputs: Axy, Bxy V ID Peak-to-peak differential input voltage V IC DC coupled input common mode voltageV ICAC coupled input common mode voltage(For AC common-mode GND, registersetting needed) R TInput termination resistance1002.2 45 GND 501560 VCC-0.0455mV V V ΩDifferential outputs: Yx, ZxV OD Peak-to-peak differential output swingV OH Single end high-level output voltage V OL Single end low-level output voltageAV CC = 3.3 V, R T = 50 Ω800 AVcc-10AVcc-6001200 AVcc+10 AVcc-400mV mV mV3 All typical values are measured at 25 °C and 3.3 V power supply.F orS ky w o rt hEv al ua ti onFor Customer Internal Use Only20TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc.F orS ky w o rt hEv al ua ti onO nl yPS331 HDMI/DVI SWITCHFor Customer Internal Use Only21TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. AC CHARACTERISTICSParameterTest Conditions Min Typ 4Max UnitI2C pins: SCLx, SDAx, SCL_SINK, SDA_SINK t pdPropagation delay from source to sink or from sink to source.C L = 10 pF100 nsStatus pin: HPDx, HPD_SINK t pdPropagation delay from HPD_SINK to HPDx.t pdPropagation delay from source selector to HPDx.C L = 10 pF 100100nsns Differential outputs: Yx, Zx t r differential output rise time 4t f differential output fall time 4 t sk intra-pair differential skew 4 t sk inter-pair differential skew 4t jit clock add-on peak-to-peak output jitter 4t jit data add-on peak-to-peak output jitter 4AVcc = 3.3 V, R T = 50 Ω,Ax1/Bx1 = 225 MHz clockAxy/Bxy = 2.25 Gbps datapattern, x=1, 2, 3; y=2, 3, 4Measurement setup shown inFigure 8 with 10 m HDMI cable to PS331 at default equalizationsetting. Jitter measured as the difference between TPJ3 and TPJ1.85 85125 125 25177 177 50 100 80 80ps ps ps ps ps ps4 All typical values are measured or tested at 25 °C and 3.3 V power supply.F orS kPS331 HDMI/DVI SWITCH For Customer Internal Use Only22TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc.Figure7. Definition of Key ParametersF orS ky w o rt hEv al ua ti onPS331 HDMI/DVI SWITCHFor Customer Internal Use Only23TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. MEASUREMENT INFORMATIONTPJ1TPJ2TPJ3Figure8. Measurement Setup for Differential signalsMeasurement Equipments:1. Video Pattern Generator: Tektronix DTG5334, AFG3252, DTGM30, DTGM322. Digital Oscilloscope: Tektronix TDS7704B, 7 GHz; P7313SMA Differential Probe, 13 GHz, BW3. Compliance Test Software: Tektronix RT-EyeF orS ky w o rt hEv al ua ti on O nl yPS331 HDMI/DVI SWITCHFor Customer Internal Use Only24TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. TYPICAL CHARACTERISTICS(Note: All following plots are from PS321, PS331 has the same technology as PS321. These plots are for reference only in V0.6 datasheet. Chip characterization data will be updated.)Eye Patterns: 1080p 8-bit HD TV, 1.5 Gbps Data Rate5 m Cable Length (default equalization setting)20 m Cable Length (default equalization setting)F orS ky w o rt hEv al ua ti on O nl yPS331 HDMI/DVI SWITCH For Customer Internal Use Only25TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc.Eye Patterns: 1080p 10-bit deep color HD TV, 1.85 Gbps Data Rate5 m Cable Length (default equalization setting)20 m Cable Length (default equalization setting)F orS ky w o rt hEv al ua ti on O nl yPS331 HDMI/DVI SWITCH For Customer Internal Use Only26TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc.Eye Patterns: 1080p 12-bit deep color HD TV, 2.25 Gbps Data Rate5 m Cable Length (default equalization setting)20 m Cable Length (default equalization setting)F orS ky w o rt hEv al ua ti on O nl yPS331 HDMI/DVI SWITCH For Customer Internal Use Only27TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc.LAYOUT GUIDELINES- Select proper PCB stack up and trace width for 100 ohm differential transmission line impedance for high speed differential signals - Avoid tight bend for differential signals- Match intra-pair and inter-pair traces length to and from within each differential channel - Keep uninterrupted ground plane beneath differential signals- Keep wide and shortest traces for both power and ground path to PS331- Place 0.1 uF and 0.01 uF decoupling capacitors close to each VCC power pin - Add 47K ohm 5 V pull-up resistors close to SDAx and SCLx pins- Add 47K ohm (DDC active buffer) or 1.5K ohm (DDC passive switch) 3.3 V pull-up resistors close to SCL_SINK and SDA_SINK pins- Place 500 ohm 1% precision resistor close to REXT pin and connected to GND reliably- Place 2.2 uF capacitor close to CEXT pin and connected to GND reliablyF orS ky w o rt hEv aPS331 HDMI/DVI SWITCHFor Customer Internal Use Only28TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. ORDER & PACKAGING INFORMATION64PS331Figure9. Top Side Marking of QFN64 PackageOrder InformationPS331 part number: PS331QFN64G[product name, package type, environment compliance code]Lead Finish: 100% SnF orS ky w o rt hEv al ua ti oPS331 HDMI/DVI SWITCHFor Customer Internal Use Only29TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. PS331Figure10. Top Side Marking of TQFP64 PackageOrder InformationPS331 part number: PS331TQFP64G[product name, package type, environment compliance code]Lead Finish: 100% SnF orSnl yPS331 HDMI/DVI SWITCHFor Customer Internal Use Only30TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. PHYSICAL DIMENSION OF QFN64 PACKAGENOTES:1. All dimensions are in millimeters2. The drawing is subject to change without noticeF orS ky w o rt hyPS331 HDMI/DVI SWITCH For Customer Internal Use Only31TEL: 408-329-5540 FAX: 408-329-5541Email: Sales@Parade Technologies Inc. PHYSICAL DIMENSION OF TQFP64 PACKAGENOTES:1. All dimensions are in millimeters2. The drawing is subject to change without notice。

USB3317资料

SMSC USB3317PRODUCT PREVIEWRevision 1.3 (11-02-07)Data BriefPRODUCT FEATURESUSB3317Hi-Speed USB Transceiver with 1.8V-3.3V ULPI Interface - 26MHz Reference ClockUSB-IF “Hi-Speed” compliant to the Universal Serial Bus Specification Rev 2.0Interface compliant with the ULPI Specification revision 1.1 as a Single Data Rate (SDR) PHY 1.8V to 3.3V IO Voltage (+/- 10%)SMSC flexPWR TM Technology—Low current design ideal for battery poweredapplications—“Sleep” mode tri-states all ULPI pins and places thepart in a low current stateSupports FS pre-amble for FS hubs with a LS device attached (UTMI+ Level 3)Supports HS SOF and LS keep-alive pulseIncludes full support for the optional On-The-Go (OTG) protocol detailed in the On-The-Go Supplement Revision 1.0a specificationSupports the OTG Host Negotiation Protocol (HNP) and Session Request Protocol (SRP)Allows host to turn VBUS off to conserve battery power in OTG applicationsSupport OTG monitoring of VBUS levels with internal comparators“Wrapper-less” design for optimal timing performance and design ease—Low Latency Hi-Speed Receiver (43 Hi-Speed clocksMax) allows use of legacy UTMI Links with a ULPI bridgeInternal 5V cable short-circuit protection of ID, DP and DM lines to VBUS or ground26MHz Reference Clock operation—0 to 3.6V input drive tolerant—Able to accept “noisy” clock sourcesInternal low jitter PLL for 480MHz Hi-Speed USB operationInternal detection of the value of resistance to ground on the ID pinIntegrated battery to 3.3V LDO regulator— 2.2uF bypass capacitor —100mV dropout voltageIntegrated ESD protection circuits—Up to +-15kV without any external devicesCarkit UART mode for non-USB serial data transfers Industrial Operating Temperature -40°C to +85°CPackaging Options—24 pin QFN lead-free RoHS compliant package(4 x 4 x 0.90 mm height)—25 ball VFBGA lead-free RoHS compliant package alsoavailable; (3 x 3 x 0.88mm height)ApplicationsThe USB3317 is targeted for any application where a Hi-Speed USB connection is desired and when board space, power, and interface pins must be minimized.The USB3317 is well suited for: Cell Phones PDAsMP3 PlayersGPS Personal Navigation ScannersExternal Hard DrivesDigital Still and Video Cameras Portable Media Players Entertainment Devices PrintersSet Top BoxesVideo Record/Playback Systems IP and Video Phones Gaming Consoles POS TerminalsOrder Number(s):USB3317-CP-TR FOR 24 PIN, QFN LEAD-FREE ROHS COMPLIANT PACKAGE (TAPE AND REEL)USB3317-GJ-TR FOR 25 PIN, VFBGA LEAD-FREE ROHS COMPLIANT PACKAGE (TAPE AND REEL)REEL SIZE IS 4000 PIECES.Hi-Speed USB Transceiver with 1.8V-3.3V ULPI Interface - 26MHz Reference ClockRevision 1.3 (11-02-07)2SMSC USB3317PRODUCT PREVIEW80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123Copyright © 2007 SMSC or its subsidiaries. All rights reserved.Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe propertydamage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at . SMSC is a registered trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT , INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.Hi-Speed USB Transceiver with 1.8V-3.3V ULPI Interface - 26MHz Reference ClockSMSC USB33173Revision 1.3 (11-02-07)PRODUCT PREVIEWGeneral DescriptionThe USB3317 is a highly integrated Hi-Speed USB 2.0 Transceiver (PHY) that supports systems architectures based on a 26MHz reference clock. It is designed to be used in both commercial and industrial temperature applications.The USB3317 meets all of the electrical requirements to be used as a Hi-Speed USB Host, Device,or an On-the-Go (OTG) device. In addition to the supporting USB signaling the USB3317 also provides USB UART modeUSB3317 uses the industry standard UTMI+ Low Pin Interface (ULPI) to connect the USB PHY to the Link. The industry standard ULPI interface uses a method of in-band signaling and status byte transfers between the Link and PHY , to facilitate a USB session. By using in-band signaling and status byte transfers the ULPI interface requires only 12 pins.The USB3317 uses SMSC’s “wrapper-less” technology to implement the ULPI interface. This “wrapper-less” technology allows the PHY to achieve a low latency transmit and receive time. SMSC’s low latency transceiver allows an existing UTMI Link to be reused by adding a UTMI to ULPI bridge. By adding a bridge to the ASIC the existing and proven UTMI Link IP can be reused.Figure 1 USB3317 Block DiagramThe USB3317 is designed to run with a 26MHz reference clock. By using a reference clock from the Link the USB3317 is able to remove the cost of a crystal reference from the design.The USB3317 includes a integrated 3.3V LDO regulator to generate its own supply from power applied at the VBAT pin. The voltage on the VBAT pin can range from 3.1 to 5.5V. The regulator dropout voltage is less than 100mV which allows the PHY to continue USB signaling when the voltage on VBAT drops to 3.1V. The USB transceiver will continue to operate at lower voltages, although some parameters may be outside the limits of the USB specifications. If the user would like to provide a 3.3V supply to the USB3317, the VBAT and VDD3.3 pins should be connected together.The USB3317 also includes integrated pull-up resistors that can be used for detecting the attachment of a USB Charger. By sensing the attachment to a USB Charger, a product using the USB3317 can charge its battery at more than the 500mA allowed when charging from a USB Host.Hi-Speed USB Transceiver with 1.8V-3.3V ULPI Interface - 26MHz Reference ClockRevision 1.3 (11-02-07)4SMSC USB3317PRODUCT PREVIEWUSB3317 Pin Locations and DescriptionsPackage Diagram with Pin LocationsThe pinout below is viewed from the top of the package.Figure 2 USB3317 QFN Pinout - Top ViewHi-Speed USB Transceiver with 1.8V-3.3V ULPI Interface - 26MHz Reference ClockSMSC USB33175Revision 1.3 (11-02-07)PRODUCT PREVIEWFigure 3 USB3317 VFBGA Pinout - Top ViewPin DefinitionsThe following table details the pin definitions for the figure above.Table 1 USB3317 Pin DescriptionPIN BALLNAME DIRECTION/TYPE ACTIVE LEVEL DESCRIPTION1B1IDInput,AnalogN/AID pin of the USB cable. For non-OTG applications this pin can be floated. For an A-Device ID is grounded. For a B-Device ID is floated.2C1VBUSI/O,AnalogN/A VBUS pin of the USB cable. This pin is used for the Vbus comparator inputs and for Vbus pulsing during session request protocol.3C2VBATPowerN/A Regulator input. The regulator supply can be from 5.5V to 3.1V.4D2VDD3.3PowerN/A 3.3V Regulator Output. A 2.2uF (<1 ohm ESR) bypass capacitor to ground is required for regulator stability. The bypass capacitor should be placed as close as possible to the USB3317.5D1DMI/O,Analog N/AD- pin of the USB cable.6E1DPI/O,AnalogN/A D+ pin of the USB cable.Hi-Speed USB Transceiver with 1.8V-3.3V ULPI Interface - 26MHz Reference ClockRevision 1.3 (11-02-07)6SMSC USB3317PRODUCT PREVIEW7E2CPENOutput,CMOSHighExternal 5 volt supply enable. This pin is used to enable the external Vbus power supply. The CPEN pin is low on POR. This pad uses VDD3.3 logic level.8E3DATA[7]I/O,CMOS N/A ULPI bi-directional data bus. DATA[7] is the MSB.9D3DATA[6]I/O,CMOS N/AULPI bi-directional data bus.10E4DATA[5I/O,CMOS N/AULPI bi-directional data bus.11D4DATA[4]I/O,CMOS N/AULPI bi-directional data bus.12E5CLKOUTOutput,CMOS N/A60MHz reference clock output. All ULPI signals are driven synchronous to the rising edge of this clock.13D5DATA[3]I/O,CMOS N/AULPI bi-directional data bus.14C4DATA[2]I/O,CMOS N/AULPI bi-directional data bus.15C5DATA[1]I/O,CMOS N/AULPI bi-directional data bus.16B4DATA[0]I/O,CMOS N/AULPI bi-directional data bus. DATA[0] is the LSB.17B5VDDIOPowerN/A1.8V to 3.3V ULPI interface supply voltage. This voltage sets the value of V OH for the ULPI interface.18A5NXTOutput,CMOSHigh The PHY asserts NXT to throttle the data. When the Link is sending data to the PHY , NXT indicates when the current byte has been accepted by the PHY . The Link places the next byte on the data bus in the following clock cycle.19A4DIROutput,CMOSN/AControls the direction of the data bus. When the PHY has data to transfer to the Link, it drives DIR high to take ownership of the bus. When the PHY has no data to transfer it drives DIR low and monitors the bus for commands from the Link.20A3STPInput,CMOSHighThe Link asserts STP for one clock cycle to stop the data stream currently on the bus. If the Link is sending data to the PHY , STP indicates the last byte of data was on the bus in the previous cycle.21B3VDD1.8PowerN/AExternal 1.8V Supply input pin. This pad needs to be bypassed with a 0.1uF capacitor to ground, placed as close as possible to the USB3317.Table 1 USB3317 Pin Description (continued)Hi-Speed USB Transceiver with 1.8V-3.3V ULPI Interface - 26MHz Reference ClockSMSC USB33177Revision 1.3 (11-02-07)PRODUCT PREVIEW22B2RESETBInput,CMOS,N/AWhen low, the part is suspended with all of the I/O tri-stated. When high theUSB3317 will operate as a normal ULPI device.23A2REFCLKInput,CMOS N/A 26MHz Reference Clock input.24A1RBIASAnalog,CMOS N/ARbias pin. This pin requires an 8.06k Ω (±1%) resistor to ground, placed as close as possible to the USB3317.FLAG C3GNDGroundN/AGround.QFN only: The flag should be connected to the ground plane with a via array under the exposed flag. This is the main ground for the IC.Table 1 USB3317 Pin Description (continued)Hi-Speed USB Transceiver with 1.8V-3.3V ULPI Interface - 26MHz Reference ClockRevision 1.3 (11-02-07)8SMSC USB3317PRODUCT PREVIEWApplication DiagramsFigure 4 USB3317 QFN Application DiagramHi-Speed USB Transceiver with 1.8V-3.3V ULPI Interface - 26MHz Reference ClockSMSC USB33179Revision 1.3 (11-02-07)PRODUCT PREVIEWFigure 5 USB3317 VFBGA Application Diagram。