SN7472N中文资料

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波音747技术数据

波音747技术数据

747技术数据概况波音747是美国波音公司研制的远程宽机身客机。

1965年8月,波音公司参加美国空军战略运输机(CX-HLS)计划投标落选,后来决定利用这项研究成果,研制一种载客500人的大型宽机身客机,以满足60年代末民航旅客增加的需要。

1966年4月13日宣布波音747方案之后,立即获得美国泛美航空公司的25架订货(当时的总价值为5.25亿美元)。

同年7月25日正式生产,1968年9月30日第一架波音747出厂,1969年2月9日首次试飞,同年12月30日获得美国联邦航空局型号合格证,而后开始交付使用,1970年1月22日首次投入纽约至伦敦航线飞行,截止1992年3月31日,各型波音747共获定货1168架。

1993年10月12日,第1000架747交付使用。

波音公司决定从1990年5月起只生产销售747-400型飞机。

波音747有如下型别:747-100基本型。

最初的波音747,装4台JT9D-3涡轮风扇发动机,单台推力193.2千牛(19700公斤)。

最大载客量490人。

1966年2月首次试飞,同年12月获美国联邦航空局型号合格证,1970年1月交付使用。

该型共获167架订货,全部交付完毕,已停产。

747-100B-100的改进型,载客量增加到550人。

为了适应增大的起飞总重,机翼、机身和起落架都得到加强。

1975年7月5日开始交付使用,截止1986年9月30日,该型共交付9架,后来未获得进一步订货,已停产。

747-200B-100的改进型。

增大了载油量,最大起飞总重增加到377840千克,其它特点均同于-100型。

美国总统远程专机就是该型的专机型,代替了原来的VC-137总统专机。

1970年10月11日首次试飞,1971年1月15日交付使用。

该型共获订货229架,包括“空军1号”1架和E-4 4架。

现已停产。

747SP-100B的机身缩短型。

用于低密度航线,机身缩短14.35米,可载305名或321名乘客,全经济舱布局可载400名乘客。

SN54S74中文资料

SN54S74中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)JM38510/00205BCA OBSOLETE CDIP J14TBD Call TI Call TIJM38510/00205BDA OBSOLETE CFP W14TBD Call TI Call TIJM38510/00205BDA OBSOLETE CFP W14TBD Call TI Call TIJM38510/07101BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/07101BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/07101BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/07101BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30102B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30102BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SN5474J OBSOLETE CDIP J14TBD Call TI Call TISN5474J OBSOLETE CDIP J14TBD Call TI Call TISN54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN7474DR OBSOLETE SOIC D14TBD Call TI Call TISN7474DR OBSOLETE SOIC D14TBD Call TI Call TISN7474N OBSOLETE PDIP N14TBD Call TI Call TISN7474N OBSOLETE PDIP N14TBD Call TI Call TISN7474N3OBSOLETE PDIP N14TBD Call TI Call TISN7474N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS74AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS74ADE4ACTIVE SOIC D1450Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS74ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS74AJ OBSOLETE CDIP J14TBD Call TI Call TISN74LS74AJ OBSOLETE CDIP J14TBD Call TI Call TISN74LS74AN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS74AN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS74AN3OBSOLETE PDIP N14TBD Call TI Call TISN74LS74AN3OBSOLETE PDIP N14TBD Call TI Call TISN74LS74ANE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS74ANE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS74ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ANSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ANSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74N3OBSOLETE PDIP N14TBD Call TI Call TIOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74S74N3OBSOLETE PDIP N14TBD Call TI Call TISN74S74NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5474J OBSOLETE CDIP J14TBD Call TI Call TISNJ5474J OBSOLETE CDIP J14TBD Call TI Call TISNJ5474W OBSOLETE CFP W14TBD Call TI Call TISNJ5474W OBSOLETE CFP W14TBD Call TI Call TI SNJ54LS74AFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS74AFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS74AW ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS74AW ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54S74FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S74FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCSNJ54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S74W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ54S74W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

7112号宽温航空润滑脂组成成分

7112号宽温航空润滑脂组成成分

7112号宽温航空润滑脂组成成分
(最新版)
目录
1.宽温航空润滑脂的定义与特点
2.宽温航空润滑脂的组成成分及其作用
2.1 稠化剂
2.2 基础油
2.3 添加剂与填料
正文
宽温航空润滑脂是一种在广泛的温度范围内都能保持良好润滑性能
的润滑脂。

它具有优异的耐高温性能、低温性能和抗磨损性能,适用于航空航天、军事装备、石油化工等领域的高温、低温和严寒环境。

宽温航空润滑脂主要由以下三种成分组成:
1.稠化剂:稠化剂是润滑脂的重要组分,它决定了润滑脂的结构和性能。

宽温航空润滑脂一般采用脂肪酸金属盐(皂基稠化剂)和烃类、无机类和有机类等非皂基稠化剂。

其中,皂基稠化剂分为单皂基、混合皂基和复合皂基三种。

2.基础油:基础油是润滑脂分散体系中的分散介质,它对润滑脂的性能有较大影响。

宽温航空润滑脂多采用中等粘度及高粘度的石油润滑油作为基础油,也有一些为适应在苛刻条件下工作的机械润滑及密封的需要,采用合成润滑油作为基础油,如酯类油、硅油、聚烯烃油等。

3.添加剂与填料:添加剂和填料可以提高润滑脂的性能,如抗磨、抗氧化、防锈等。

宽温航空润滑脂中常用的添加剂有磷酸酯、ZDDP、Elco 极压抗磨剂、复合剂、滴点提高剂等。

填料如石墨、二硫化钼和碳黑等,可以提高润滑脂抵抗流失和增强润滑的能力。

总之,宽温航空润滑脂凭借其优异的耐高温性能、低温性能和抗磨损性能,在航空航天、军事装备、石油化工等领域发挥着重要作用。

SN7476N3中文资料

SN7476N3中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9557501QEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 5962-9557501QFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 5962-9557501QFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 7601301EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC7601301EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC JM38510/00204BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC JM38510/00204BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN5476J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSN5476J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS76AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS76AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSN7476N OBSOLETE PDIP N16TBD Call TI Call TISN7476N OBSOLETE PDIP N16TBD Call TI Call TISN7476N3OBSOLETE PDIP N16TBD Call TI Call TISN7476N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS76AD OBSOLETE SOIC D16TBD Call TI Call TISN74LS76AD OBSOLETE SOIC D16TBD Call TI Call TISN74LS76ADR OBSOLETE SOIC D16TBD Call TI Call TISN74LS76ADR OBSOLETE SOIC D16TBD Call TI Call TISN74LS76AN OBSOLETE PDIP N16TBD Call TI Call TISN74LS76AN OBSOLETE PDIP N16TBD Call TI Call TISN74LS76AN3OBSOLETE PDIP N16TBD Call TI Call TISN74LS76AN3OBSOLETE PDIP N16TBD Call TI Call TI SNJ5476J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSNJ5476J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSNJ5476W ACTIVE CFP W161TBD Call TI Level-NC-NC-NCSNJ5476W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS76AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS76AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS76AW ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS76AW ACTIVE CFP W161TBD Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN74LVC2G74_08中文资料

SN74LVC2G74_08中文资料

FEATURESSee mechanical drawings for dimensions.DCT PACKAGE (TOP VIEW)DCU PACKAGE (TOP VIEW)YZP PACKAGE (BOTTOM VIEW)CLK D Q GNDGND Q CLR Q PRE D V CCCLKDESCRIPTION/ORDERING INFORMATIONSN74LVC2G74SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPWITH CLEAR AND PRESETSCES203M–APRIL 1999–REVISED FEBRUARY 2007•Available in the Texas Instruments •Typical V OHV (Output V OH Undershoot)NanoFree™Package>2V at V CC =3.3V,T A =25°C•Supports 5-V V CC Operation •I off Supports Partial-Power-Down Mode Operation•Inputs Accept Voltages to 5.5V •Latch-Up Performance Exceeds 100mA Per •Max t pd of 5.9ns at 3.3VJESD 78,Class II•Low Power Consumption,10-µA Max I CC •ESD Protection Exceeds JESD 22•±24-mA Output Drive at 3.3V–2000-V Human-Body Model (A114-A)•Typical V OLP (Output Ground Bounce)–200-V Machine Model (A115-A)<0.8V at V CC =3.3V,T A =25°C–1000-V Charged-Device Model (C101)This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V V CC operation.NanoFree™package technology is a major breakthrough in IC packaging concepts,using the die as the package.A low level at the preset (PRE)or clear (CLR)input sets or resets the outputs,regardless of the levels of the other inputs.When PRE and CLR are inactive (high),data at the data (D)input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse.Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse.Following the hold-time interval,data at the D input can be changed without affecting the levels at the outputs.This device is fully specified for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.ORDERING INFORMATIONT APACKAGE (1)ORDERABLE PART NUMBER TOP-SIDE MARKING (2)NanoFree™–WCSP (DSBGA)Reel of 3000SN74LVC2G74YZPR ___CP_0.23-mm Large Bump –YZP (Pb-free)SSOP –DCT Reel of 3000SN74LVC2G74DCTR C74___–40°C to 85°CReel of 3000SN74LVC2G74DCUR VSSOP –DCUC74_Reel of 250SN74LVC2G74DCUT(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.(2)DCT:The actual top-side marking has three additional characters that designate the year,month,and assembly/test site.DCU:The actual top-side marking has one additional character that designates the assembly/test site.YZP:The actual top-side marking has three preceding characters to denote year,month,and sequence code,and one following character to designate the assembly/test site.Pin 1identifier indicates solder-bump composition (1=SnPb,•=Pb-free).Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.元器件交易网QQSN74LVC2G74SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESETSCES203M–APRIL 1999–REVISED FEBRUARY 2007FUNCTION TABLEINPUTSOUTPUTSPRE CLR CLK D Q Q L H X X H L H L X X L H L L X X H (1)H (1)H H ↑H H L H H ↑L L H HHLXQ 0Q 0(1)This configuration is nonstable;that is,it does not persist when PRE or CLR returns to its inactive (high)level.LOGIC DIAGRAM (POSITIVE LOGIC)元器件交易网Absolute Maximum Ratings(1)SN74LVC2G74 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPWITH CLEAR AND PRESETSCES203M–APRIL1999–REVISED FEBRUARY2007over operating free-air temperature range(unless otherwise noted)MIN MAX UNIT V CC Supply voltage range–0.5 6.5VV I Input voltage range(2)–0.5 6.5VV O Voltage range applied to any output in the high-impedance or power-off state(2)–0.5 6.5VV O Voltage range applied to any output in the high or low state(2)(3)–0.5V CC+0.5VI IK Input clamp current V I<0–50mAI OK Output clamp current V O<0–50mAI O Continuous output current±50mAContinuous current through V CC or GND±100mADCT package220θJA Package thermal impedance(4)DCU package227°C/WYZP package102 T stg Storage temperature range–65150°C(1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operatingconditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(3)The value of V CC is provided in the recommended operating conditions table.(4)The package thermal impedance is calculated in accordance with JESD51-7.元器件交易网Recommended Operating Conditions (1)SN74LVC2G74SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESETSCES203M–APRIL 1999–REVISED FEBRUARY 2007MINMAX UNIT Operating1.65 5.5V CCSupply voltageVData retention only 1.5V CC =1.65V to 1.95V0.65×V CCV CC =2.3V to 2.7V 1.7V IHHigh-level input voltageVV CC =3V to 3.6V 2V CC =4.5V to 5.5V 0.7×V CCV CC =1.65V to 1.95V0.35×V CCV CC =2.3V to 2.7V 0.7V ILLow-level input voltageV V CC =3V to 3.6V 0.8V CC =4.5V to 5.5V0.3×V CCV I Input voltage 0 5.5V V OOutput voltage0V CC V V CC =1.65V –4V CC =2.3V–8I OHHigh-level output current–16mA V CC =3V –24V CC =4.5V –32V CC =1.65V 4V CC =2.3V8I OLLow-level output current16mA V CC =3V 24V CC =4.5V32V CC =1.8V ±0.15V,2.5V ±0.2V20∆t/∆v Input transition rise or fall rate V CC =3.3V ±0.3V 10ns/V V CC =5V ±0.5V5T A Operating free-air temperature–4085°C (1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs ,literature number SCBA004.元器件交易网Electrical Characteristics Timing Requirements Switching CharacteristicsSN74LVC2G74 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPWITH CLEAR AND PRESETSCES203M–APRIL1999–REVISED FEBRUARY2007over recommended operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS V CC MIN TYP(1)MAX UNITI OH=–100µA 1.65V to5.5V V CC–0.1I OH=–4mA 1.65V 1.2I OH=–8mA 2.3V 1.9V OH VI OH=–16mA 2.43VI OH=–24mA 2.3I OH=–32mA 4.5V 3.8I OL=100µA 1.65V to5.5V0.1I OL=4mA 1.65V0.45I OL=8mA 2.3V0.3V OL VI OL=16mA0.43VI OL=24mA0.55I OL=32mA 4.5V0.55Data orI I V I=5.5V or GND0to5.5V±5µAcontrol inputsI off V I or V O=5.5V0±10µAI CC V I=5.5V or GND,I O=0 1.65V to5.5V10µA∆I CC One input at V CC–0.6V,Other inputs at V CC or GND3V to5.5V500µAC i V I=V CC or GND 3.3V5pF(1)All typical values are at V CC=3.3V,T A=25°C.over recommended operating free-air temperature range(unless otherwise noted)(see Figure1)V CC=1.8V V CC=2.5V V CC=3.3V V CC=5V±0.15V±0.2V±0.3V±0.5V UNITMIN MAX MIN MAX MIN MAX MIN MAXf clock80175175200MHzCLK 6.2 2.7 2.72 t w Pulse duration nsPRE or CLR low 6.2 2.7 2.72Data 2.9 1.7 1.3 1.1 t su Setup time,before CLK↑nsPRE or CLR inactive 1.9 1.4 1.21 t h Hold time,data after CLK↑00.3 1.20.5nsover recommended operating free-air temperature range(unless otherwise noted)(see Figure1)V CC=1.8V V CC=2.5V V CC=3.3V V CC=5VFROM TO±0.15V±0.2V±0.3V±0.5V PARAMETER UNIT(INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAXf max80175175200MHzQ 4.813.4 2.27.1 2.2 5.9 1.4 4.1CLKt pd Q614.437.7 2.6 6.2 1.6 4.4nsPRE or CLR Q or Q 4.412.9 2.37 1.7 5.9 1.6 4.1元器件交易网Operating CharacteristicsSN74LVC2G74SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESETSCES203M–APRIL 1999–REVISED FEBRUARY 2007T A =25°CV CC =1.8VV CC =2.5VV CC =3.3VV CC =5V PARAMETERTEST CONDITIONSUNIT TYP TYP TYP TYP C pdPower dissipation capacitancef =10MHz35353740pF元器件交易网PARAMETER MEASUREMENT INFORMATIONFrom OutputUnder Test(see NoteLOAD CIRCUITOpenData InputTiming Input0 V0 V0 VInput0 VInputOutputWaveform 1S1 at V(see Note B)LOADOutputWaveform 2S1 at GND(see Note B)VOLVOH0 V»0 V OutputOutputTEST S1t/tPLH PHLOpenOutputControl1.8 V0.15 V±2.5 V0.2 V±3.3 V0.3 V±5 V0.5 V±1 k W500W500W500WVCCRL2 ×VCC2 ×VCC6 V2 ×VCCVLOADCL30 pF30 pF50 pF50 pF0.15 V0.15 V0.3 V0.3 VVD3 VVIVCC/2VCC/21.5 VVCC/2VM£2 ns£2 ns£2.5 ns£2.5 nsINPUTSt/tr fVCCVCCVCCVLOADt/tPLZ PZLGNDt/tPHZ PZHVOLTAGE WAVEFORMSENABLE AND DISABLE TIMESLOW-AND HIGH-LEVEL ENABLINGVOLTAGE WAVEFORMSPROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSNOTES: A.C includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR10 MHz, Z= 50.D.The outputs are measured one at a time, with one transition per measurement.E.t and t are the same as t.F.t and t are the same as t.G.t and t are the same as t.H.All parameters and waveforms are not applicable to all devices.LOPLZ PHZ disPZL PZH enPLH PHL pd£WVOLTAGE WAVEFORMSPULSE DURATIONVOLTAGE WAVEFORMSSETUP AND HOLD TIMESVIVIVIV/2LOADVOLVOHVIVIVOHVOLSN74LVC2G74SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPWITH CLEAR AND PRESETSCES203M–APRIL1999–REVISED FEBRUARY2007Figure1.Load Circuit and Voltage Waveforms元器件交易网PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LVC2G74DCTR ACTIVE SM8DCT 83000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCTRE4ACTIVE SM8DCT 83000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCUR ACTIVE US8DCU 83000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCURE4ACTIVE US8DCU 83000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCURG4ACTIVE US8DCU 83000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCUT ACTIVE US8DCU 8250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCUTE4ACTIVE US8DCU 8250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCUTG4ACTIVE US8DCU 8250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74YZPRACTIVEWCSPYZP83000Green (RoHS &no Sb/Br)SNAGCULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solderbumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM6-Dec-2007TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LVC2G74DCUR US8DCU83000180.09.22.253.35 1.054.08.0Q3*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LVC2G74DCUR US8DCU83000202.0201.028.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiersAudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated元器件交易网。

2N7002中文资料(Diodes)中文数据手册「EasyDatasheet - 矽搜」

2N7002中文资料(Diodes)中文数据手册「EasyDatasheet - 矽搜」

反向传输电容
(2)
C
5
pF
导通时间(2)(3)
t
关闭时间(2)(3)
t
20 ns V 30V, I =200mA 20 ns R =25Ω, R =150Ω
(1)脉冲条件下进行测定.宽度=300μS.占空比 (3)开关时间测量50Ω源阻抗和5ns上升时间脉冲发生器
辣妹参数数据可应要求提供该设备
2% (2)抽样检测.
门 - 体泄漏
零栅压漏 当前
I
10 nA V =± 20V, V =0V
I
1
µA V =48V, V =0V
500 µA V =48V, V =0V, T=125°C (2)
通态漏电流(1)
I
500
mA V =25V, V =10V
静态漏源通态
电压(1)
V
3.75 V V =10V, I =500mA
芯片中文手册,看全文,戳
SOT23 N沟道增强 模式垂直DMOS FET
ISSUE 4 – 2006年 4月
特征
* 60电压V CEO
PARTMARKING详细信息 - 702
2N7002
S D
G
绝对最大额定值.
SOT23
参数
符号
VALUE
UNIT
漏源电压
V
60
V
连续漏极电流在T
=25°C
I
115
mA
漏电流脉冲
I
800
mA
门源电压
V
± 40
V
在T功率耗散
=25°C
P
330
mW
工作和存储温度范围
T :T

74系列芯片功能介绍

74系列芯片功能介绍

74系列芯片功能介绍74系列数数字电路7400、74H00、74L00、74LS00、74S00、74HC00、74C00、74F00、74ALS00四2输入与非门Y=\AB。

7401、74LS01、74HC01、74ALS01四2输入与非门(OC)Y=\AB。

7402、74L02、74LS02、74S02、74HC02、74C02、74ALS02、74F02四2输入或非门。

Y=/A+B。

7403、74L03、74LS03、74ALS03、74S03、74HC037404、74H04、74L04、74S04、74HC04、74C04、74F04、74ALS04六反相器Y=/A。

7405、74H05、74LS05、74S05、74HC05、74F05、74ALS05六反相器(OC)Y=/A。

7406、74LS06六反相缓冲器/驱动器(OC、高压输出)Y=/A;是7405高耐压输出型,耐压30V。

7407、74LS07、74HC07六缓冲器/驱动器(OC、高压输出)Y=A; 30V耐高压输出。

7408、74LS08、74F08、74ALS08、74S08、74HC08、74C08四2输入与门Y=AB。

7409、74LS09、74F09、74ALS09、74S09、74HC09四2输入与门(OC)Y=AB。

7410、74H10、74L10、74LS10、74ALS10、74S10、74HC10、74C10 74H11、74LS11、74S11、74F11、74ALS11、74HC11三3输入与门Y=ABC。

7412、74LS12、74ALS12三3输入与非门(OC)Y=\ABC。

7413、74LS13双4输入与非门Y=\ABCD。

7414、74LS14、74HC14、74C1474H15、74LS15、74ALS15、74S15三3输入与门(OC)Y=ABC。

7416、74LS16六反相缓冲器/驱动器Y=/A;7417、74LS17六缓冲器/驱动器(OC、高压输出)Y=A;15V耐压输出。

AN7522N中文资料

AN7522N中文资料

Product SpecificationsPrepared Checked ApprovedEff. DateEff. Date Eff. Date Eff. DateAN7522NRef No.Total Page Page No.A-191Absolute Maximum Ratings A 12345678No.ItemStorage TemperatureOperating Ambient Temperature Operating Ambient Pressure Operating Constant Acceleration Operating Shock Supply V oltage Supply Current Power DissipationSymbolTstg Topr Popr Gopr Sopr Vcc Icc P DRatings-55 ~ +150-25 ~ +7014.42.01.92Unit° C ° CV A WNote11Ta=70°C21.013x105±0.61x105(1.0±0.6)Pa (atm)9,810(1000)m/s 2(G)4,900(500)m/s 2(G)Structure Appearance Application FunctionSilicon Monolithic Bipolar ICSIL-12 Pin Plastic Package (Power Type with Fin)Low Frequency AmplifierBTL 5.0W x 2ch Power Amplifierwith Standby Function and V olume FunctionOperating Supply V oltage RangeVcc 3.5V ~ 13.5VThe temperature of all items shall be Ta=25°C except storage temperature andoperating ambient temperature.At no signal input.Note 1)2)Output Offset V oltageProduct SpecificationsPrepared Checked ApprovedAN7522NRef No.Total Page Page No.B-192Electrical CharacteristicsB 1234567891011121314No Item Quiescent Circuit Current Symbol TestCir-cuit ConditionsVin=0V , V ol=0V NoteTotal Harmonic Distortion Unit max typ min Limits(Unless otherwise specified, the ambient temperature is 25°C ±2°C,Vcc=8.0V , frequency=1kHz and R L =8Ω.)I CQ THD V oltage Gain Po=0.5W, V ol=1.25V Rg=10k Ω, V ol=0V Output Noise V oltage Maximum Power Output 1Ripple Rejection Ratio Standby CurrentNote 1) For this measurement, use the BPF = 15Hz ~ 30kHz (12dB/OCT).V olumeAttenuation Ratio Channel Balance 1Channel Balance 2Middle V oltageGain Channel CrosstalkI STB V NO G V RR P O 1V off Att CB1CB2G V m CT11111111111111Vin=0V , V ol=0V Po=0.5W, V ol=1.25V THD=10%, V ol=1.25V Rg=10k Ω, V ol=0V Vr=0.5Vrms, fr=120Hz Rg=10k Ω, V ol=0V Po=0.5W, V ol=0V Po=0.5W, V ol=1.25V Po=0.5W, V ol=0.6V Po=0.5W, V ol=0.6V Po=0.5W, V ol=1.25V---31-2.44.030-25070-1-220.5404510.10330.103.05.0500850023.555100100.4350.5---250-1226.5-mA µA mVrmsdB %W W dB mV dB dB dB dB dB111Maximum Power Output 2P O 2Vcc=11VTHD=10%, V ol=1.25VChecked ApprovedAN7522NTotal Page Page No.93Electrical CharacteristicsB 123No Item Standby pin current Symbol TestCir-cuit ConditionsVin=0V , V ol=0V NoteUnit max typ min Limits(Unless otherwise specified, the ambient temperature is 25°C ±2°C,Vcc=8.0V , frequency=1kHz and R L =8Ω.)I STB2Note)I VOL 111Vin=0V , V STB =3V --1224--3025-36µA µA k Ω(Reference Data for Design)V olume pin current The above characteristics are reference values determined for IC design, but not guaranteedvalues for shipping inspection. If problems were to occur, counter measures will be sincerely discussed.Input ImpedanceZ iVin=±0.3V DC(Precautions for use)1) Make sure that the IC is free of any pin short-circuiting, ground short, and load short-circuiting.2) Ground the radiation fin so that there will be no difference in electric potential between the radiation fin and ground.3) The thermal protection circuit operates at a Tj of approximately 150°C. The thermalprotection circuit is reset automatically when the temperature drops.4) Make sure that the heat radiation design is effective enough if the Vcc is comparatively high or the IC operates high output power.5) Connect only ground pin for signal sources to the signal GND pin of the amplifier on the previous stage.6) The electric surge voltage for this IC low, therefore be extra careful when using thefollowing pin (at 200pF):Pin 5=+140V, Pin 6=+140V, Pin 9=+130V, Pin 8=+150V。

主板场效应管参数

主板场效应管参数

AP73T02GH-HF SOT-252 AP/富鼎 SMD/MOS N场 25V 57A 0.0126ΩAP83T02GH-HF SOT-252 AP/富鼎 SMD/MOS N场 25V 75A 0.006Ω2SK3918-ZK-E1-AZ/JM SOT-252 NEC SMD/MOS N场 25V 48A 0.0075Ω2SK4212-ZK-E1 SOT-252 NEC SMD/MOS N场 25V 48A 0.0078Ω2SK4213-ZK-E1 SOT-252 NEC SMD/MOS N场 25V 64A 0.006Ω2SK3919 NEC DIP/MOS N场 25V 64A 0.0056ΩSPD30N03S2L-10 SOT-252 infineon SMD/MOS N场 30V 30A 0.0104Ω2N03L10 SOT-252 infineon SMD/MOS N场 30V 30A 0.0104ΩPSMN004-25B,SOT-263,PHILIPS,SMD/MOS,N场,25V,75A,0.004ΩPHB87N03LT,SOT-263,NXP/恩智浦,SMD/MOS,N场,25V,75A,0.0095ΩFDD6680A,SOT-252,FAIRCHILD,SMD/MOS,N场,30V,56A,0.0095ΩIRL3715ZS,SOT-263,IR,SMD/MOS,20V,50A,N场,0.011Ω 全新原装正品!价格优惠!现货供应! 以优势说话IRL3715STRL,SOT-263,IR,SMD/MOS,20V,54A,N场,0.014Ω 全新原装正品!价格优惠!现货供应! 以优势说话IRL3715ZCS,SOT-263,IR,SMD/MOS,20V,50A,N场,0.011Ω 全新原装正品!价格优惠!现货供应! 以优势说话IRL3714STRR,SOT-263,IR,SMD/MOS,20V,36A,N场,0.02Ω 全新原装正品!价格优惠!现货供应! 以优势说话IRL3714ZS,SOT-263,IR,SMD/MOS,20V,36A,N场,0.016Ω 全新原装正品!价格优惠!现货供应! 以优势说话IRL2703STRL,SOT-263,IR,SMD/MOS,30V,20A,N场,0.04Ω 全新原装正品!价格优惠!现货供应! 以优势说话IRL3102STRL,SOT-263,IR,SMD/MOS,20V,61A,N场,0.015Ω 全新原装正品!价格优惠!现货供应! 以优势说话IRF3711ZS,SOT-263,IR,SMD/MOS,20V,92A,N场,0.006Ω 全新原装正品!价格优惠!现货供应! 以优势说话IRF3704STRR,SOT-263,IR,SMD/MOS,20V,77A,N场,0.009Ω 全新原装正品!价格优惠!现货供应! 以优势说话IRF3707ZS,SOT-263,IR,SMD/MOS,30V,59A,N场,0.0095Ω 全新原装正品!价格优惠!现货供应! 以优势说话IRF3709STRR,SOT-263,IR,SMD/MOS,30V,90A,N场,0.009Ω 全新原装正品!价格优惠!现货供应! 以优势说话2SK3467-ZK,2SK3467,K3467 05 NEC SOT-263 20V 80A2SK3572-ZK,2SK3572,K3572 05 NEC SOT-263 20V 80A 0.0057Ω2SK3638-ZK-E1,2SK3638,K3638 05 NEC SOT-252 20V 64A 0.0085Ω2SK3639-ZK-E1,2SK3639,K3639 06/05 NEC SOT-252 20V 64A 0.0055ΩAOB414,B414 04NPB AO SOT-263 30V 110A 0.0042ΩAOD404,D404 05NPB AO SOT-252 30V 85A 0.007ΩAOD412,D412 05NPB AO SOT-252 30V 85A 0.007ΩAOD452,D452 09 AO SOT-252 25V 55A 0.0085ΩAOD448,D448,SOT-252,AO,SMD/MOS,30V.75A.0.005ΩAP60N03S,AP60N03,60N03S,60N03 03 AP/富鼎SOT-263 30V 55A 0.0135ΩAP70L02GH,AP70L02,70L02GH,70L02 04 AP/富鼎SOT-252 25V 66AAP70T03GH,AP70T03,70T03GH,70T03 07 AP/富鼎SOT-252 30V 60AAP72T02GH 09 AP/富鼎SOT-252 25V 62A 0.009ΩAP80N03S,AP80N03,80N03,80N03S 02 AP/富鼎SOT-263 30V 80AAP85L02GH 07 AP/富鼎SOT-252 25V 85AAP85L02S 03 AP/富鼎SOT-263 25V 85AAP86T02GH 09 AP/富鼎SOT-252 25V 75A 0.006ΩBSC020N03MSG 08NPB infineon P-TDSON-8 30V 100A 0.002ΩBSC024N025SG 08NPB infineon P-TDSON-8 25V 100A 0.0024ΩBSC025N03MSG 08NPB infineon P-TDSON-8 30V 100A 0.0025ΩBSC026N02KSG 08NPB infineon P-TDSON-8 20V 100A 0.0026ΩBSC029N025SG 08NPB infineon P-TDSON-8 25V 100A 0.0029ΩBSC030N03LSG 08NPB infineon P-TDSON-8 30V 100A 0.003ΩBSC030N03MSG 09NPB infineon P-TDSON-8 30V 100A 0.003ΩBSC032N03SG 07NPB infineon P-TDSON-8 30V 100A 0.0032ΩBSC048N025SG 08NPB infineon P-TDSON-8 25V 89A 0.0048ΩBSC050N03LSG 09NPB infineon P-TDSON-8 30V 80ABSC052N03SG 05NPB infineon P-TDSON-8 30V 80A 0.0052ΩBSC080N03LSG 08NPB infineon P-TDSON-8 30V 53A 0.008ΩBSC080N03MSG 08NPB infineon P-TDSON-8 30V 53A 0.008ΩCEB71A3 03 CET/华瑞SOT-263 30V 70ACEB8030L 00 CET/华瑞SOT-263 30V 75AFDB6670AL 03 FAIRCHILD SOT-263 30V 80AFDB6676 05 FAIRCHILD SOT-263 30V 84AFDD6692 04/05 FAIRCHILD SOT-252 30V 54AFDD8880 08 FAIRCHILD SOT-252 30V 58A 0.009ΩFDD8896 07/09 FAIRCHILD SOT-252 30V 94A 0.0057ΩGFB70N03 01 通用SOT-263 30V 70AGFB75N03 03 通用SOT-263 30V 75AH7N0307LMTR 01 HIT SOT-263 30V 60AIRFR3711Z 04 IR SOT-252 20V 93AIRFU3706TRL 06 IR 252三脚反贴20V 75AIRFU3709Z 05NPB IR 252三脚反贴30V 86AIRLR7833 07 IR SOT-252 30V 140A 0.0045ΩIRLR7843PBF 07NPB IR SOT-252 30V 161A 0.0033ΩNTD110N02RTG4 06NPB ON SOT-252 24V 110ANTD4302-1 08 ON SOT-252 30V 68ANTD4810NHT4G 06NPB ON SOT-252 30V 54ANTD60N02RT4G 08 ON SOT-252 24V 62ANTD70N03RT4 05 ON SOT-252 25V 70A 0.0056ΩNTD80N02T4 06 ON SOT-252 24V 80A 0.005ΩNTD85N02RT4G 08 ON SOT-252 24V 85AP0403BDG 09 NIKO SOT-252 25V 75A 0.004ΩP75N02LDG 09 NIKO SOT-252 25V 75APFD2500 05 达晶SOT-252 25V 55A 0.009ΩPFD2502 05 达晶SOT-252 25V 83A 0.006ΩPFD2510 05 达晶SOT-252 25V 94A 0.014ΩPFD3002 04 达晶SOT-252 30V 86A 0.0075ΩPFD3008 04 达晶SOT-252 30V 76A 0.009ΩPFD3014 04 达晶SOT-252 30V 94A 0.0063ΩPFS3000 04 达晶SOT-263 30V 54A 0.0125ΩPH4830L 08NPB NXP/恩智浦SOT669 30V 84A 0.0048ΩPH7030L 05NPB PHILIPS SOT669 30V 68APHB96NQ03LT 05NPB PHILIPS SOT-263 25V 75ASDB65N03L 02 SamHop SOT-263 30V 65ASDB75N03L 07 FAIRCHILD SOT-263 30V 75ASDB85N03L 02 SamHop SOT-263 30V 85ASTB100NH02LT4 04 ST SOT-263 24V 60ASTD150NH02LT4 08NPB ST SOT-252 24V 150A 0.0035ΩSTD70N02L 07 ST SOT-252 24V 60ASUB85N03-04 04 VISHA Y SOT-263 30V 85ASUD50N024-06P 04 VISHA Y SOT-252 24V 80ASUD50N025-06P-E3 06NPB VISHA Y SOT-252 25V 78A 0.0062ΩSUD70N03-06P 04 VISHA Y SOT-252 30V 70ATM3503FD 06 TechMos SOT-252 25V 65ATPC8032-H SOP-8 TOSHIBA SMD/MOS N场30V 15A 0.0065ΩTPC8A02-H SOP-8 TOSHIBA SMD/MOS N场30V 16A 0.0056ΩTPC8020-H SOP-8 TOSHIBA SMD/MOS N场30V 13A 0.009ΩTPCS8303 TSSOP-8 TOSHIBA SMD/MOS 双P -20V -5A 0.021ΩTPCS8302 TSSOP-8 TOSHIBA SMD/MOS 双P -20V -5A 0.035ΩTPCS8208 TSSOP-8 TOSHIBA SMD/MOS 双N 20V 6A 0.017ΩTPCS8210 TSSOP-8 TOSHIBA SMD/MOS 双N 20V 5A 0.03ΩTPC8018-H SOP-8 TOSHIBA SMD/MOS 双N 30V 18A 0.0046ΩTPC8210 SOP-8 TOSHIBA SMD/MOS 双N 30V 8A 0.015ΩSUP85N03-04 TO-220 VISHA Y DIP/MOS N场30V 85A 0.0043ΩHUF76145P3 TO-220 FAIRCHILD DIP/MOS N场30V 75A 0.0045ΩHUF76143P3 TO-220 FAIRCHILD DIP/MOS N场30V 85A 0.0055ΩAO4466 SOP-8 AO SMD/MOS N场30V 9.4A 0.23ΩIPD03N03LAG SOT252 08NPB infineon SMD/MOS N场 25V 90A 0.0032ΩIPD03N03LA SOT252 08NPB infineon SMD/MOS N场 25V 90A 0.0032ΩIPD03N03 SOT252 08NPB infineon SMD/MOS N场 25V 90A 0.0032Ω03N03LAG SOT252 08NPB infineon SMD/MOS N场 25V 90A 0.0032Ω03N03LA SOT252 08NPB infineon SMD/MOS N场 25V 90A 0.0032ΩIPD03N03LBG SOT252 08NPB infineon SMD/MOS N场 30V 90A 0.0033ΩIPD03N03LB SOT252 08NPB infineon SMD/MOS N场 30V 90A 0.0033Ω03N03LBG SOT252 08NPB infineon SMD/MOS N场 30V 90A 0.0033Ω03N03LB SOT252 08NPB infineon SMD/MOS N场 30V 90A 0.0033ΩIPD06N03LBG SOT252 08NPB infineon SMD/MOS N场 30V 50A 0.0061ΩIPD06N03LB SOT252 08NPB infineon SMD/MOS N场 30V 50A 0.0061ΩIPD06N03 SOT252 08NPB infineon SMD/MOS N场 30V 50A 0.0061Ω06N03LBG SOT252 08NPB infineon SMD/MOS N场 30V 50A 0.0061Ω06N03LB SOT252 08NPB infineon SMD/MOS N场 30V 50A 0.0061Ω06N03 SOT252 08NPB infineon SMD/MOS N场 30V 50A 0.0061ΩIPP09N03LA TO220 08NPB infineon DIP/MOS N场 25V 50A 0.0092ΩIPP09N03 TO220 08NPB infineon DIP/MOS N场 25V 50A 0.0092Ω09N03LA TO220 08NPB infineon DIP/MOS N场 25V 50A 0.0092Ω09N03 TO220 08NPB infineon DIP/MOS N场 25V 50A 0.0092ΩP09N03LA TO220 08NPB infineon DIP/MOS N场 25V 50A 0.0092ΩH6N03LAG SOT252 08NPB infineon SMD/MOS N场 30V 30A 0.0062Ω 2VH9N03LAG SOT252 08NPB infineon SMD/MOS N场 25V 30A 0.0092Ω 2VH5N03LAG SOT252 08NPB infineon SMD/MOS N场 25V 50A 0.0052Ω 2V IPDH6N03LAG SOT252 08NPB infineon SMD/MOS N场 30V 30A 0.0062Ω 2VIPDH9N03LAG SOT252 08NPB infineon SMD/MOS N场 25V 30A 0.0092Ω 2V IPDH5N03LAG SOT252 08NPB infineon SMD/MOS N场 25V 50A 0.0052Ω 2V。

EN747

EN747

EN747-1-2007:家用的双层床和高床第一部分:安全,强度和耐久性要求简介:EN747 的这一部分指定家用双层床和高床的要求。

在EN747-2中包含的负载和力是基于成人单人床。

1.范围这一标准指定家用双层床和高床的安全,强度和耐久性要求。

强度和耐久性测试的负载和力应用于床基最大宽度为120CM 的床。

这一标准特别想把发生在小孩身上的事故危险缩到最小。

如果双层床或高床包跨其它产品,如桌子或储藏柜,这类产品的安全要求不涵盖在这一标准中。

2.引用标准下列参考文件对这一标准文件的使用是必需的。

对于有日期的文件,只有引用的版本适用。

对无日期的文件,应用最近的版本。

EN 747-2:2007, Furniture – Bunk beds and high beds for domestic use – Part 2: Test methods3. 术语和定义对本标准的目的,下列术语和定义适用。

3.1 双层床:一套床,一个在另一个上面3.2 高床:指床架的上端到地面的高度不低于800MM的床,不考虑床下面空间的使用。

3.3 床基:支撑床垫的结构3.4 安全栅:防止人从上床或高床上掉下的部件。

4. 安全要求4.1 材料:木头或基于木头的材料,外观上不能被侵染。

4.2 结构:易接近的边缘和角应弄圆的或倒棱的,不能有毛刺或尖点。

所有装配的孔应由厂家做好。

床的立柱超出护栏的高度小于5mm.1- Bedpost:床柱图14.3 安全栅:床的上表面到地面高度不低于800MM时,应在床周围装安全栅。

安全栅应防止意外松脱。

这一要求会被实现,根据EN747-2中的5.4.2测试如果安全栅不损坏或松拖。

在不使用工具时,安全栅要移除不掉。

安全栅的上边缘到床基上表面的距离不得少于260MM。

床垫的上表面离安全栅的上边缘应不低于160MM,床垫的最大厚度应有永久性标识,见条款5d和6b。

安全栅除了上边角以半径为85MM的弧度结束外,进入口之间的距离在300-400MM之间,床垫的最厚标识离安全栅上边缘160MM。

National LM747 数据手册

National LM747 数据手册
Output Voltage Swing
Output Short Circuit Current Common-Mode Rejection Ratio
Conditions
TA e 25 C RS s 10 kX RS s 50X RS s 50X RS s 10 kX
TA e 25 C VS e g20V
LM747A
LM747E
LM747
TA e 25 C
TA e 25 C Unity Gain
TA e 25 C
TA e 25 C VS e g20V VS e g15V
VS e g20V TA e TAMIN TA e TAMAX
VS e g20V TA e TAMIN TA e TAMAX
VS e g15V TA e TAMIN TA e TAMAX
20 200
15
g12 g10
g14 g13
25
70 90
Units
mV mV mV C mV nA
nA C nA mA MX
V
V mV V mV V mV V mV V mV
V
V mA dB
2
Electrical Characteristics (Note 3) (Continued)
Parameter
LM747 Min Typ Max
10 50
60
g15 20 200 85 500
80 500 15
03 20
g12 g13
50 200
25
g12 g10
g14 g13
25
70 90
LM747C Min Typ Max
20 60
75

747系列飞机

747系列飞机
47飞机是波音公司生产的四发(动机)远程宽机身运输机。是一种研制与销售都很成功的宽机身客机。1965年8月开始研制,1969年2月原型机试飞,1970年1月首架747交付给泛美航空公司投入航线运营,开创了宽体客机航线服务的新纪元。它的双层客舱及独特外形成为最易辨认的亚音速民航客机。当然也很不幸的成为恐怖分子的首选破坏目标。自波音747飞机投入运营以来,一直垄断着大型运输机的市场,这种情况近几年都不会改变。
共生产384架
维京大西洋航空B747-200
B747-200M/C型:
200型的客货混合两用型
B747-200SR型:
主要为日本国内短航程高客流量航线设计。
B747-200F型:
200型的货运型,可载货90吨,是目前最常见的大型货机。
日本航空B747-200F
B747-SP型:
100型的缩短型,SP意为特殊性能,机身缩短14.2米,后机身被彻底压缩,加大了航程,用于低密度远航程航线,可载客300~320人。1976年3月投入使用。
此外,还有几种特殊型号:
E-4型:由B747-200B所改装的空中指挥所型,供美国空军使用,共改装4架。
空军一号:由B747-200B改装而成,为美国总统专机,共生产两架。空军代号VC-25。
空军一号
基本数据:
常见的B747-400的数据:
翼展:64.4米
机长:70.7米
机高:19.41米
两级座舱布局载客:524人
货舱容积:170立方米
最大油箱容量:216840升
最大商载:65吨
最大起飞总重:362~395吨
最大航程:13570公里
动力装置:四台涡扇发动机
可选发动机型号:
普惠公司4000系列

美国产阀门密封脂 润滑脂 清洗液

美国产阀门密封脂 润滑脂 清洗液
强酸和碱
960
低温二合一
黄油状
桶料-46~149
软管料-46~149
天然气
脂肪流体和气体
包括:汽油
煤油
燃料和润滑油
碳氢溶剂
中性盐水和盐溶液
强酸和碱,芳族和氯化物溶解液
1033
润滑和密封合剂
绿色
棒料-29~260
桶料-40~260
软管料-40~260
一般用途的密封脂,用于液体和气体脂肪碳氢服务,适合:天然气、汽油、煤油、燃料油、粗蒸馏物、航空和喷气机燃料。
芳族溶剂,强酸碱,蒸汽
VXX
阀门清洗剂
兰色
软管料,
1夸脱桶,
5夸脱桶
VXX阀门清洗剂和净化剂
/
1045
黑色
桶料-34.5~371
软管料-34.5~371
这是一种高温密封脂,适合热碳氢气体和蒸气,水,蒸汽和水溶物
液体轻质碳氢物,芳族溶剂和硝酸。不适合食品和医药。
1200
/
/
1200,1200LT,1200HT桶装密封脂
美国产阀门密封脂、润滑脂、清洗剂(旋塞阀,闸阀,球阀)
编号
颜色
包装态/适用温度℃
适用
不适用
147
白色
棒料-6.7~51.6
桶料-46~26.7
软管料-46~26.7
酸(包括硝酸)
酒精

水溶物质
甘油
染料(酒精溶解的)

碳氢溶剂
167

棒料10~343
桶料-6.7~343
软管料-6.7~343
气体干燥器应用
水溶物,矿物酸,硝酸,水
862
更低温密封脂
淡棕色

CC0402JRNPO9BN471中文资料

CC0402JRNPO9BN471中文资料

物料编号CC0402JRNPO9BN471细参数_易容网
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波音747系列资料

波音747系列资料

波音747系列资料作者:博世Leo标签:波音747资料大飞机2009-11-23 14:19 星期一晴波音747飞机是美国波音公司研制、生产的四发动机远程宽体民用运输机,是首架宽体喷气式客机,是一型研制与销售都很成功的民航客机。

1965年8月开始研制,1969年2月原型机试飞,1970年1月首架波音747交付给泛美航空公司投入航线运营。

波音747双层客舱及独特外形成为最易辨认的民航客机。

自波音747飞机投入运营以来,一直是全球最大的民航机,一直垄断着民用大型运输机的市场,这种情况直到竞争对手空中客车A380大型客机的出现。

研制过程波音公司在1960年代中与洛克希德公司竞投美国空军喷气式大型远程运输机项目(CX-HLS)。

结果美军选择了洛克希德公司方案(C-5"银河")。

波音747原型机当时波音公司的客户——泛美航空公司希望波音能较提供一种比波音707大两倍的客机。

于是波音把原来的运输机设计加以修改。

最初的设计方案为全机双层机舱,但是不久即改为宽体机身的设计。

60年代末期的一般想法是民航即将进入超音速时代。

为慎重起见,波音将747设计将来成可改作货机用途,故此747有置于上层的驾驶室,方便作货机用时可使用「揭鼻式」前端货门。

但超音速民航最后因为燃料、飞机价格、噪音等问题而最终只成昙花一现。

波音747的销售量亦远超预期,为波音公司带来可观收入。

原本只作机员、头等休憩处的上层机舱则被加长,成为商务舱。

泛美航空公司的波音747-200型波音747的首家客户泛美航空公司在1966年订货25架订单,交货时为1970年。

这时发生一段著名的小插曲,由于波音747实在太大,令人怀疑它到底能否飞起来。

当时泛美总裁胡安·特里普(Juan Terry Trippe)担心波音747计划夭折,因此希望波音首先落实747计划才下订单;同一原因,波音有感于747计划牵涉庞大资金,而且与洛克希德公司争取美军大型运输机计划失败,假如泛美公司愿意下订单,波音公司便可以顺利执行747计划。

R5F21275SNXXXFP中文资料

R5F21275SNXXXFP中文资料
100 times
-20 to 85°C (N version) -40 to 85°C (D, J version)(2), -40 to 125°C (K version)(2) 32-pin molded-plastic LQFP
NOTES: 1. I2C bus is a trademark of Koninklijke Philips Electronics N. V. 2. Specify the D, K version if D, K version functions are to be used.
On-chip
On-chip VCC = 3.0 to 5.5 V (f(XIN) = 20 MHz) (other than K version) VCC = 3.0 to 5.5 V (f(XIN) = 16 MHz) (K version) VCC = 2.7 to 5.5 V (f(XIN) = 10 MHz) VCC = 2.2 to 5.5 V (f(XIN) = 5 MHz) (N, D version) Typ. 10 mA (VCC = 5.0 V, f(XIN) = 20 MHz) Typ. 6 mA (VCC = 3.0 V, f(XIN) = 10 MHz) Typ. 2.0 µA (VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz) Typ. 0.7 µA (VCC = 3.0 V, stop mode) VCC = 2.7 to 5.5 V
Item
Specification
CPU
Number of fundamental instructions
Minimum instruction execution time

2P4M中文资料(nec)中文数据手册「EasyDatasheet - 矽搜」

2P4M中文资料(nec)中文数据手册「EasyDatasheet - 矽搜」

DRM,
Tj = 125°C

Tj = 25°C

Tj = 125°C

dV D/dt Tj = 125°C, V DM = 2/3 V DRM
10

VTM ITM = 4 A

IGT VDM = 6 V, R L = 100 Ω,

栅极触发电压
Note
VGT VDM = 6 V, R L = 100 Ω,
1985, 2006
The revised points can be easily searched by copying an "现场:修订部分可以通过在 PDF文件中复制一个 “R”,并在 “查找内容 ”指定它可以很容易地搜索 .
芯片中文手册,看全文,戳
2P4M,2P6M
最大额定值
Note
IH VDM = 24 V, I TM = 4 A

1
3
mA 参照图9
电路改判关断时间
tq
Tj = 125°C, I TM = 500毫安,

30

μs

diR / DT = 15 A /μs, V R ≥ 25 V,
VDM = 2/3 V DRM ,DV D / dt的= 10V μ/ s
特性
符号
非重复性峰值反向电压 非重复性峰值断态电压 重复峰值反向电压 重复峰值断态电压
Note Note Note Note
VRSM VDSM VRRM VDRM
通态电流
IT (AV)
有效的通态电流 浪涌不重复通态电流 熔断电流
IT (RMS)
IT S M

i2

国际民航组织飞机型号代码国际民航组织飞机型号代码

国际民航组织飞机型号代码国际民航组织飞机型号代码

国际民航组织飞机型号代码普通旅客在航班时刻表等民航宣传品上看到的机型栏目所列机型可能并不是我们常见的机型名称,而是一些你可能不明白代码,在民航内部的航行通告、动态传递中机型也经常使用一些代码表示,这些代码实际上不是随意编写的,而是国际民航组织规定的飞机型号代码,下面就列举部分常见的、在我国空域可能出现的民航机型型号代码,更多请访问国际民航组织相关页面资料说明:飞机型号代码:1.飞机型号代码由不超过四位的数字、字母组成,尽量代表出飞机的制造厂商、型号等资料,易用被空中管制判读信息,原则上是从飞机的具体型号上抽取而来。

2.飞机型号代码一经指定,不在更改,即使生产该型号飞机的制造厂商更名、变更所有权3.某飞机机型的具体型号原则上不再指定新的代码,除非这个改进型号的性能变化较大,按原有标准判读会影响到空中管制4.“ZZZZ”:特殊代码,表示该机型尚未指定代码5.国际民航组织建议的轻型、中型、重型飞机划分标准,是在航空管制方面很重要的标准,涉及到飞机尾流对后续飞机的影响,直接关系到航空安全轻型飞机(L:Light):按相关程序批准的飞机型号合格证上,最大起飞重量7吨或以下中型飞机(M:Medium):按相关程序批准的飞机型号合格证上,最大起飞重量7吨以上,136吨以下重型飞机(H:Heavy):按相关程序批准的飞机型号合格证上,最大起飞重量136吨或以上型号代码具体型号参考译名机型特点简介制造商代码备注(本站相关)AN12An-12 安12 四发涡桨中型ANTONOVAN22An-22 /Antheus 安22 四发涡桨重型ANTONOVAN24An-24 安24 双发涡桨中型ANTONOVAN24Y-7系列、MA60 运7/新舟60双发涡桨中型XIANAN32An-32 /Sutlej/Firekiller 安32 双发涡桨中型ANTONOVAN70An-70 安70 四发涡桨中型ANTONOVAN72An-72/74 安72/74 双发涡扇中型ANTONOVA124An-124 /Ruslan 安124 四发涡扇重型ANTONOVA140An-140 安140 双发涡扇中型ANTONOVA225An-225 /Mriya 安225 六发涡扇重型ANTONOVAT43ATR42-300系列双发涡桨中型AI(R)AT44ATR42-400 双发涡桨中型AI(R)AT45ATR42-500 双发涡桨中型AI(R)AT72ATR72 双发涡桨中型AI(R)A30B A-300B2系列、C4-100 空中客车双发涡扇重型AIRBUSA30B A-300B4-100/200 双发涡扇重型AIRBUSA3ST A-300ST Beluga 双发涡扇重型AIRBUSA3ST A-300ST SuperTransporter双发涡扇重型AIRBUSA306A-300B4/C4/F4-600 双发涡扇重型AIRBUSA310A-310系列双发涡扇重型AIRBUSA318A-318 双发涡扇中型AIRBUSA319A-319、A-319 ACJ 双发涡扇中型AIRBUSA320A-320 双发涡扇中型AIRBUSA321A-321 双发涡扇中型AIRBUSA332A-330-200 双发涡扇重型AIRBUSA333A-330-300 双发涡扇重型AIRBUSA342A-340-200 四发涡扇重型AIRBUSA343A-340-300 四发涡扇重型AIRBUSA345A-340-500 四发涡扇重型AIRBUSA346A-340-600 四发涡扇重型AIRBUSB190Beech 19000 比奇双发涡桨中型BEECHBE10Beech 100 King Air 空中国王双发涡桨轻型BEECHBE20Beech 200 Super KingAir双发涡桨轻型BEECHBE30Beech 300 Super KingAir双发涡桨轻型BEECHB350Beech Super King Air350双发涡桨轻型BEECHBE99Beech 99/ Airliner 双发涡桨轻型BEECHB212Bell Anafa/212 贝尔双发涡桨直升机BELLB412Bell Arapaho/412Sentinel双发涡桨直升机BELLB214Bell 214A/B/C 双发涡桨直升机BELLB461BAe-146-100 四发涡扇中型BRITISHAEROSPACEB462BAe-146-200 四发涡扇中型BRITISHAEROSPACEB463BAe-146-300 四发涡扇中型BRITISHAEROSPACEB701707-100 波音四发涡扇中型BOEINGB703707-300 四发涡扇重型BOEINGB722727-200 三发涡扇中型BOEINGB712717-200 双发涡扇中型BOEINGB731737-100 双发涡扇中型BOEINGB732737-200/200Surveiller 双发涡扇中型BOEINGB733737-300 双发涡扇中型BOEINGB734737-400 双发涡扇中型BOEINGB735737-500 双发涡扇中型BOEINGB736737-600 双发涡扇中型BOEINGB737737-700/BBJ、BBJ 双发涡扇中型BOEINGB738737-800、BBJ2 双发涡扇中型BOEINGB739737-900 双发涡扇中型BOEINGB741747-100 四发涡扇重型BOEINGB742747-200 四发涡扇重型BOEINGB743747-300 四发涡扇重型BOEINGB744747-400 (international) 四发涡扇重型BOEINGB74D747-400 (domestic) 四发涡扇重型BOEINGB74S747SP 四发涡扇重型BOEINGB74R747SR 四发涡扇重型BOEINGBSCA747SCA Shuttle Carrier 四发涡扇重型BOEINGB752757-200 双发涡扇中型BOEINGB753757-300 双发涡扇中型BOEINGB762767-200 双发涡扇重型BOEINGB763767-300 双发涡扇重型BOEINGB764767-400 双发涡扇重型BOEINGB772777-200 双发涡扇重型BOEINGB773777-300 双发涡扇重型BOEINGC120Cessna 120 塞斯纳单发活塞轻型CESSNAC150Cessna A150 Aerobat 单发活塞轻型CESSNAC172Cessna 172/172Skyhawk单发活塞轻型CESSNAC182Cessna Skylane 单发活塞轻型CESSNAC82R Cessna Skylane RG 单发活塞轻型CESSNAC208Cessna 208Cargomaster单发活塞轻型CESSNAC525Cessna CitationJet(525)/CJ1双发涡扇轻型CESSNAC25A Cessna Citation CJ2 双发涡扇轻型CESSNAC560Cessna Citation 5 UltraEncore双发涡扇中型CESSNAC550Cessna Citation S2 双发涡扇轻型CESSNAC56X Cessna Citation Excel 双发涡扇中型CESSNAC650Cessna Citation 6/7 双发涡扇中型CESSNAC750Cessna Citation 10 双发涡扇中型CESSNACL60Challenger 600/601/604 双发涡扇中型CANADAIRCRJ1Regional Jet RJ-100 双发涡扇中型CANADAIRCRJ2Regional Jet CRJ-200 双发涡扇中型CANADAIRCRJ7Regional Jet CRJ-700 双发涡扇中型CANADAIRCRJ9Regional Jet CRJ-900 双发涡扇中型CANADAIRD228Dornier 228 双发涡桨轻型DORNIERD328Dornier 328 双发涡桨中型DORNIERDC10DC-10 三发涡扇重型MCDONNELLDOUGLASDC85DC-8-50 Jet Trader 四发涡扇轻型DOUGLASDC91DC-9-10 双发涡扇中型DOUGLASDC93DC-9-30 双发涡扇中型DOUGLASDHC4DHC-4 /CV-2Caribou 双发活塞中型DEHAVILLANDCANADADHC5C-115 /CV-7Buffalo 双发涡桨中型DEHAVILLANDCANADADHC6 DHC-6/C-138 Twin Otter 双发涡桨中型DEHAVILLANDCANADADHC7Dash 7 四发涡桨中型DEHAVILLANDCANADADH8A DHC-8-100/Dash 8 双发涡桨中型DEHAVILLANDCANADADH8B DHC-8-200/Dash 8 双发涡桨中型DEHAVILLANDCANADADH8C DHC-8-300/Dash 8 双发涡桨中型DEHAVILLANDCANADADH8D DHC-8-400/Dash 8 双发涡桨中型DEHAVILLANDCANADAE110EMB-110 Bandeirante 双发涡桨轻型EMBRAERE120EMB-120 Brasilia 双发涡桨中型EMBRAERE135EMB-135 双发涡扇中型EMBRAERE145EMB-145AEWC/LR/ER 双发涡扇中型EMBRAERE45X EMB-145XR 双发涡扇中型EMBRAERE170ERJ-170/175 双发涡扇中型EMBRAERE190ERJ-190/195 双发涡扇中型EMBRAERFA10Falcon 10 双发涡扇中型DASSAULTFA20Falcon 20 双发涡扇中型DASSAULTFA50Falcon 50 三发涡扇中型DASSAULTF900Falcon 900 三发涡扇中型DASSAULTF2TH Falcon 2000 双发涡扇中型DASSAULTF50Fokker 50 MaritimeEnforcer双发涡桨中型FOKKERF60Fokker 60 双发涡桨中型FOKKERF70Fokker 70 双发涡扇中型FOKKERF100Fokker 100 双发涡扇中型FOKKERGLF3C-20A/B/C/D/EGulfstream 3 G-1159AGulfstream 3/SRA-1双发涡扇中型GULFSTREAMGLF4C-20F/G/H Gulfstream4G-1159C Gulfstream4/SP/SRA 4双发涡扇中型GULFSTREAMGLF5C-37 Gulfstream 5G-1159D Gulfstream 5双发涡扇中型GULFSTREAMGLEX BD-700 Global Express 双发涡扇中型GULFSTREAMCL30Challenger 300 双发涡扇中型GULFSTREAMGL5T Global 5000 双发涡扇中型GULFSTREAMH25B BAe-125-700/800 双发涡扇中型BRITISHAEROSPACEIL76Il-76/78/82 四发涡扇重型ILYUSHINIL86Il-86 四发涡扇重型ILYUSHINIL96Il-96 四发涡扇重型ILYUSHINI114Il-114 双发涡桨中型ILYUSHINJ328328JET Envoy 3 双发涡扇中型FAIRCHILDDORNIERJ728728JET 双发涡扇中型FAIRCHILDDORNIERJS32Jetstream Super 31 双发涡扇中型BRITISHAEROSPACEJS41Jetstream 41 双发涡扇中型BRITISHAEROSPACEJS20Jetstream 200 双发涡扇轻型BRITISHAEROSPACELJ35Learjet 35 双发涡扇中型LEARJETLJ40Learjet 40 双发涡扇中型LEARJETLJ45Learjet 45 双发涡扇中型LEARJETLJ55Learjet 50 双发涡扇中型LEARJETLJ60Learjet 60 双发涡扇中型LEARJETL101L-1011 TriStar 三发涡扇重型LEARJETMD11MD-11 三发涡扇重型MCDONNELLDOUGLASMD81MD-81 双发涡扇中型MCDONNELLDOUGLASMD82MD-82 双发涡扇中型MCDONNELLDOUGLASMD83MD-83 双发涡扇中型MCDONNELLDOUGLASMD87MD-87 双发涡扇中型MCDONNELLDOUGLASMD88MD-88 双发涡扇中型MCDONNELLDOUGLASMD90MD-90 双发涡扇中型MCDONNELLDOUGLASRJ70RJ-70 Avroliner 四发涡扇中型BAESYSTEMSRJ85RJ-85 Avroliner 四发涡扇中型BAESYSTEMSRJ1H RJ-100 Avroliner 四发涡扇中型BAESYSTEMSSB20SAAB 2000 萨伯2000 双发涡桨中型SAABSF34SAAB 340 萨伯340 双发涡桨中型SAABT154Tu-154 图154 三发涡扇中型TUPOLEVT204Tu-204/214/224/234 图204系列双发涡扇中型TUPOLEVT334Tu-334 图334 双发涡扇中型TUPOLEVY11Y-11 运11 双发涡桨轻型HARBINY12Y-12 /Twin Panda 运12 双发涡桨轻型HARBINYK42Yak-42 雅克42 三发涡扇中型YAKOVLEV附:制造商代码说明(供参考)AI(R):Aero International (Regional) (UK/France/Italy)AIRBUS:GIE Airbus Industrie (France/Germany/UK/Spain) 空中客车:欧洲空中客车工业公司BOMBARDIER:Bombardier Inc (Canada)庞巴迪:BOEING:Boeing Aircraft Company (United States)波音:美国波音飞机公司SAAB:Saab Aircraft AB (Sweden)萨伯:瑞典萨伯飞机公司ANTONOV:Aviatsionny Nauchno-Tekhnichesky Kompleks Imeni O K Antonova (Ukraine)安东诺夫:乌克兰安东诺夫航空科学技术联合体BEECH:Beech Aircraft Corporation (United States)比奇:美国比奇飞机公司BELL:Bell Aircraft Corporation (United States)贝尔:美国贝尔飞机公司BRITISH AEROSPACE:CESSNA:Cessna Aircraft Company (United States)塞斯纳:美国塞斯纳飞机公司DASSAULT:Dassault Aviation (France)达索:法国达索航空工业公司DE HAVILLAND CANADA:Bombardier Aerospace De Havilland (Canada)德·哈维兰:加拿大庞巴迪宇航德·哈维兰公司DORNIER:Dornier GmbH (Germany)多尼尔:德国多尼尔公司DOUGLAS:Douglas Aircraft Company Inc (United States)道格拉斯:美国道格拉斯飞机公司EMBRAER:巴西航空工业公司FAIRCHILD DORNIER:Fairchild Aerospace Corporation (United States/Germany) 费尔柴尔德-多尼尔:美德费尔柴尔德宇航公司FOKKER:Fokker BV (Netherlands)福克:荷兰福克飞机公司GULFSTREAM AEROSPACE:Gulfstream Aerospace Corporation (United States) 湾流宇航:美国湾流宇航公司HARBIN:Harbin Aircraft Manufacturing Corporation (China)哈尔滨:中国哈尔滨飞机制造厂ILYUSHIN:Aviatsionnyi Kompleks Imeni S.V.Ilyushina OAO (Russia)伊留申:俄罗斯伊留申航空联合体股份公司LEARJET:Bombardier Aerospace Learjet (United States)利尔喷气:美国庞巴迪宇航利尔喷气公司LOCKHEED:Lockheed Aircraft Corporation (United States)洛克西德:美国洛克西德飞机公司MCDONNELL DOUGLAS:McDonnell Douglas Corporation (United States)麦克唐纳·道格拉斯:美国麦克唐纳·道格拉斯公司TUPOLEV:Aviatsionny Nauchno-Tekhnishesky Kompleks Imeni A N Tupoleva OAO (Russia)图波列夫:俄罗斯图波列夫航空科学技术联合体XIAN:Xian Aircraft Company (China)西安:中国西安飞机制造厂YAKOVLEV:Yakovlev Aviatsionnoye Korporatsiya OAO (Russia)雅科福列夫:俄罗斯雅科福列夫实验设计局开放型联合股份公司。

波音 747 历史

波音 747 历史

波音747 四十岁了!1969 年2 月9 日,航空史上一代传奇波音747 首飞成功,开创了民航的宽机身时代。

近40 年来,波音747 作为世界最大客机的王位一直不可动摇,直到A380 在2007 年10 月投入新加坡航空公司的航班服务,才恋恋不舍地把王冠交出。

1969 年2 月9 日,波音747 首飞成功,开创了一个40 年之久的传奇在美国历史上,有“呼啸的二十年代”的说法,火爆的经济和高涨的人气使二十年代成为三十年代大萧条前华丽的闪光。

对于航空技术来说,60 年代也是呼啸的年代,大跃进式的疯狂将超音速带入了民航。

但由于油耗和噪音等原因,超音速客机的热潮像五分钟热度,来得猛去得快。

图-144 只经过短暂的航线运行就撤出了航班服务,美国的SST 计划的口气比力气大(三倍音速,200 座以上的容量),最终嘎然而止,只有协和式惨淡经营了30 年。

另一方面,美国空军在1963 年启动巨型运输机CX-HLS 计划,要求新一代运输机的最大载重达到80 吨以上,载重52 吨时航程达到9,200 公里以上,大大超过刚开始服役的C-141的能力上限。

波音、洛克希德和道格拉斯最终获得资格竟标,通用电气、普拉特惠特尼获得对发动机的竟标资格。

波音的CX-HLS 方案,日后成为波音747 的基础洛克希德的CX-HLS 最后入选,日后成为C-5“银河”式运输机首尾可对穿装卸是CX-HLS 的重要要求,不对穿装卸时,也可以从两端同时装卸,装卸速度加倍。

人们正在从大开的艏门登机参观,尾门的“蚌壳门”已经向两侧大开,但尾跳板被机翼挡住了,看不见CX-HLS 明确要求可以从机头到机尾“对穿”装卸,便利机动车辆的上下。

为了满足这个要求,波音、道格拉斯和洛克希德都把驾驶舱移到机舱天花板以上,以容纳机艏门。

道格拉斯在机身以上设计了一个战斗机座舱一样的驾驶舱,洛克希德则是从高置的驾驶舱后拉出一条和机舱平行的长长的机脊,一直延伸到垂尾,这也作为上单翼的安装点。

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