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(完整版)罗宾斯《管理学》内容概要,中英文对照

(完整版)罗宾斯《管理学》内容概要,中英文对照

(完整版)罗宾斯《管理学》内容概要,中英文对照罗宾斯《管理学》内容概要第一篇导论1章管理者和管理1、组织组织(organization)的定义:对完成特定使命的人们的系统性安排组织的层次:操作者(operatives)和管理者(基层、中层、高层)2、管理者和管理管理者(managers)的定义:指挥别人活动的人管理(management)的定义:同别人一起或者通过别人使活动完成得更有效的过程。

管理追求效率(efficiency)和效果(effectiveness)管理职能(management functions):计划(planning)、组织(organizing)、领导(leading)、控制(controlling)管理者角色(management roles):人际关系角色(interpersonal roles)、信息角色(information roles)、决策角色(decision roles) 成功的管理者和有效的管理者并不等同,在活动时间上,有效的管理者花费了大量的时间用于沟通,而网络联系(社交等)占据了成功的管理者很大部分时间。

管理者在不同的组织中进行着不同的工作。

组织的国别、组织的类型、组织的规模以及管理者在组织中的不同层次决定了管理者的角色扮演、工作内容以及职能和作用。

2章管理的演进1、20世纪以前的管理:亚当·斯密的劳动分工理论(division of labor)产业革命(industrial revolution)2、多样化时期(20世纪):科学管理(scientific management):弗雷德里克·泰勒一般行政管理理论(general administrative theory):亨利·法约尔(principles of management)、马克斯·韦伯(bureaucracy) 人力资源方法(human resources approach):权威的接受观点(acceptance view of authority),霍桑研究,人际关系运动(卡内基、马斯洛),行为科学理论家(behavioral science theorists) 定量方法(quantitative approach)3、近年来的趋势(20世纪后期):趋向一体化过程方法(process approach)系统方法(systems approach):封闭系统和开放系统(closed systems)权变方法(contingency approach):一般性的权变变量包括组织规模、任务技术的例常性、环境的不确定性、个人差异4、当前的趋势和问题(21世纪):变化中的管理实践全球化(globalization)工作人员多样化(work force diversity)道德(morality)激励创新(innovations)和变革(changes)全面质量管理(total quality management, TQM):由顾客需要和期望驱动的管理哲学授权(delegation)工作人员的两极化(bi-modal work force)3章组织文化与环境:管理的约束力量1、组织组织文化(organizational culture)被用来指共有的价值体系。

高达SEED机体资料14

高达SEED机体资料14

概述与技术资料(General and Technical Data)中文译名:M1A异端类型:宇宙用量产型MS制造方:奥布所属方:奥布尺寸:未知重量:未知动力提供:电池能量包驾驶舱:驾驶员一名,位于驱干的标准驾驶舱装备和设计特点:无首次服役: C.E.71年固定武器:“Igelstellung”75cm自动对空巴尔干炮塔×2,连续发射,固定在头部(手部)可选武器:71-44式改狙击型光束步枪×1;70式光束剑×1,装备在左肩后,手持使用外加装备武器:无技术和历史记录(Technical and Historical Notes)本机是奥布用以防卫自国的静止轨道空间站“天之御柱”而开发的M1 Astray的宇宙战用衍生机。

首台机体于C.E.71年6月初完成,同年6月16日奥布陷落后,由萨哈克家负责“天之御柱”的管理及运用,M1A Astray的生产也在同时进行着,量产出来的部分机体也被装载在草剃号上。

由于M1A预定是在无重力及低重力情况下的宇宙空间作战而设计的,所以与M1 Astray 相比,脚部的机构被大幅简化了。

因此,在重力条件下M1A甚至连自机的重量也无法承担,相对的,它对姿态控制的对应能力则很高,AMBAC机动时的反应也提高了30%;由于增设及强化了推进器,还装备了存有推进剂和冷却材料的储藏罐,使得本机的空间机动性能大幅提高。

此外,为在防卫空间站时提高各机的配合,技术人员对M1A头部的V字型天线也进行了大型化处理,令本机在轨道上的电子通信能力进一步增强。

由于涂装相似,使本机经常与P02 Astray "Blue Frame"混同。

本机的主武器是71-44式改狙击型光束步枪,它是专为在轨道上进行超长距离射击用而开发的,载有可根据地球周边磁场来计算光束偏向差并进行瞄准补正的系统及高精度探测器,在最合适的条件下有效射程长达400千米,具有极高的命中精度。

LCD液晶屏幕行业英语专用词

LCD液晶屏幕行业英语专用词

英文专有名词介绍1. General (一般专有名词)英文专有名词中文说明(数字表示有详注)LCD (Liquid Crystal Display) 液晶显示器*注.Glass, substrate or glass substrate 玻璃基版*注.TFT(Thin Film Transistor) 薄膜晶体管*注.Panel 面板Array 排列,指在玻璃基板上做TFT的制程LCD-ArrayCell 液晶填充制程…….分为LCD-FEOL(Cell前段)LCD-BEOL(Cell后段含Cell Tester)Module 模块,指后段组装制程LCMMonitor 监视器PixelXGA: eXtended Graphics Array=1024*768Pixels SXGA: Super XGA=1280*1024Pixels 像素*注.PS. 像素越多表示分辨率越高Computer 计算机Notebook 笔记型计算机(简称为NB)RGB (Red, Green, Blue) 指红绿蓝三原色PM (Preventive Maintenance) 预防保养Quality 品质Standard 标准(指作业标准或品质指针)Material 材料Yield 良率CIM (Computer Integration Manufacturing) 计算机整合制造(指以计算机系统整合制造流程)FA (Factory Automation) 工厂自动化Exit 出口Precaution 预防措施Warning 警告Emergency 紧急Alarm 警报2. Clean Room (洁净室专有名词)英文专有名词中文说明Clean room 洁净室***注.Particle 微粒子***注.HEPA (High Efficient Particulate Air) filter 高效能粒子空气过滤网Contamination 污染Temperature (TEMP) 温度Humidity 湿度Pressure 压力UPW (Ultra-Pure Water) 超纯水DIW (De-Ionized Water) 去离子水IPA (Isopropyl Alcohol) 异丙醇Sticky mat 脚踏黏垫***注.Cleanliness 洁净度ESD (Electro-static Discharge) 静电破坏***注.Laminar flow 层流(流体力学名词)Turbulent flow 扰流(流体力学名词)Alcohol 酒精Acetone 丙酮Particle 微粒子Dust 灰尘Gowning room 换衣间***注.Raised floor (grating floor) 高架地板***注.Air shower 气浴室***注.Prohibit 禁止Clean suit (bunny suit, dust-free garment) 无尘衣***注.Glove 手套Hairnet 网帽Hood 头罩Mask 口罩Clean shoes (dust-free shoes, boots) 无尘鞋3. Factory Automation (工厂自动化专有名词)英文专有名词中文说明Vehicle 运输工具或载具AGV (Automatic Guided Vehicle) 自动搬运车MGV (Manual Guided Vehicle) 人力搬运车Clean lifter 天井传送车LIM (Linear Induction Motor) Carrier 线性感应马达传送载具OHS (Overhead Shuttle) 天车或称轨道车Stocker (clean depot) 存放Cassette(架子)的暂存区Battery 电池Bay 作业区Bumper 保险杠Charger 充电器Controller 控制器Conveyor 输送带Crane 吊车(在Stocker内)FFU (Fan Filter Unit) 风扇过滤器Host 主机I/O (Input / Output) 输入/输出Inter-bay 作业区和作业区之间Intra-bay 作业区之内IR (Infra-Red) 红外线IRIF(Infra-Red InterFace) 红外线界面Load 进料Unload 卸货Magnetic tape AGV路径所使用的磁条POSEIDON 海神生产操作系统Retrieve 【计算机】检索,撷取(数据)RTM (Rotary Transfer Machine) 旋转传送机SCARA arm AGV之传送手臂Reset 重新设定Transportation 传输*注.OPI(Operation POSEIDON Instruction)海神生产操作系统专有名词介绍英文专有名词中文说明Recipe 程序,制程参数Stock out 将Cassette取出Request 请求,要求Transfer 传送,运送Instruction 命令,指令Select 选择Cancel 取消Operation 作业,操作Support 支援Process 制程Start 开始Comp. Completion的缩写,意指完成Batch 批量Lot 指生产在线的在制品或产品,简称「货」ID (Identity) 识别码(如Lot ID or Chip ID)Sheet 片(Array区玻璃基版计数单位)***注. Chip 片(Cell区玻璃计数单位)***注. Inspection 检验Defect 缺陷Production 生产Hold 留置在当站制程(如有品质问题时)Release 将hold住的货放行,释出Equipment 设备(简称为EQP)Tool 工具,机台WIP (Work In Process) 在制品(制程在制品)Maintenance 维修保养Cassette 装在制品的架子***注.Empty 空的Reserve 预约Report 报告Scrap 报废Rework 重工Log on 登帐Log off 除帐Note 批注5. Array段制程专有名词介绍英文专有名词中文说明Material 材料Metal 金属Target 靶MoW (Moly-tungsten) 钨化钼Mo (Molybdenum) 钼ITO (Indium Tin Oxide) 铟锡氧化物Al (Aluminum) 铝AlNd(Aluminum and Neodymium Alloy) 铝和钕的合金以上皆为溅镀机金属靶的材料之一Reticle or Mask 光罩Detergent (LH-300) 界面活性剂的一种(清洗机用来清洗玻璃表面用LH-300为供货商型号)LAL-50 含NH4F与HF,为清洗机用来清洗玻璃表面氧化层的化学溶液O3(Ozone)臭氧,主要为各制程用来清除有机物的污染或残留NBA (1-butyl Acetate) 乙酸正丁酯,主要用来清洗旋转涂布光阻时残留在玻璃边缘的光阻液Resist or Photo Resist 光阻(简称PR)HMDS Hexamethyldisilazane的简写,为一种化学中间体,用以增加光阻涂布时对芯片表面之附着力AC-1 带静电防止剂(ESD-Preventer),在上光阻机内使用,防止静电产生,破坏玻璃组件TMAH (供货商型号为KTM-25) Tetra-Methyl Ammonium Hydroxide的简写,为厂内所使用之显影液Oxalic Acid (H2C2O4) 草酸,湿蚀刻机中用来蚀刻5PEP中的a-ITO膜DHF 成份为49%氢氟酸HF,主要为湿蚀刻机中用来蚀刻7PEP中的SiNx膜ITO-Etchant 成份中含盐酸HCl及硝酸HNO3,主要用来蚀刻7PEP中的Poly-ITOBHF 成份中含氟化铵NH4F及HF,主要用来蚀刻7PEP中的SiONAl-Etchant 成份中含乙酸CH3COOH、磷酸H3PO4及硝酸HNO3,主要用来蚀刻Mo/Al/Mo的沈积层IPA 异丙醇Isopropyl Alcohol的简称,主要用来作为设备擦拭液,在去光阻制程中亦用来清除玻璃基板上的有机残留物(如光阻或去光阻液)N-300 去光阻液,N-300为厂商型号,成份为单乙醇铵与单丁醚的混合物(Process) Gas (制程)气体…目前大多数种类的气体,多为提供CVD,Sputter及干蚀刻电浆源之用SiH4硅甲烷……制程气体(泄漏有爆炸危险)NH3氨……制程气体N2O 笑气……制程气体PH3磷化氢……制程气体N2氮气……制程气体,常用为破真空Vent或吹干的媒介H2氢气……制程气体NF3氟化氮……制程气体,常用为清除CVD反应室壁沈积硅Si媒介Kr 氪气……制程气体,用来轰击溅镀机上的金属靶Ar 氩气……制程气体,用来轰击溅镀机上的金属靶或常用为加热设备的热传媒介O2常用来作电浆的基本组成,BCl3氯化硼……制程气体,在干蚀刻中用以作为蚀刻AlNd的电浆源SF6氟化硫……制程气体,常用的主要干蚀刻电浆源以为提供蚀刻主原料氟的来源He 氦气……制程气体,混合在其它制程气体中,共同形成电浆源,使电浆组成分布均匀Cl2氯气……制程气体HCl 氯化氢……制程气体,蚀刻n+时的电浆源之一CF4四氟化碳……制程气体,常用的主要干蚀刻电浆源以为提供蚀刻主原料氟的来源Equipment 机台(仪器)Vender 厂商Cleaner 清洗机***注.CVD (Chemical Vapor Deposition) 化学气相沉积***注. Sputter 溅镀机***注. Coater 上光阻机***注.Pre-bake 预烘***注.Stepper 步进式曝光机***注. Exposure 曝光Backside-Exposure 背面曝光Titler 刻号机,厂内部分的显影机具有此功能,将玻璃基板的Chip ID, Glass ID及Veri-Code曝出,以为人员及机台办认之用Edge Remover 简称ER,指在旋转涂布光阻后,用NBA洗净残留在玻璃边缘的光阻Edge Exposure 边缘曝光,指在显影前将玻璃基板边缘光阻较厚的部分再曝光,以防曝光量不足,造成光阻在显影后残留Developer 显影机***注.Hard bake 硬烤***注.Etcher 蚀刻机Wet Etch 湿蚀刻***注.Dry Etch 干蚀刻***注.Plasma 电浆***注.RIE (Reactive ion etching) 反应性离子蚀刻***注. PE (Plasma Etch) 电浆蚀刻机***注ICP (Inductive Coupled Plasma) 电感偶式电浆蚀刻机***注Stripper 去光阻机***注O3 Asher 为去光阻机的模块之一,用来去除制程的有机残留**注Tester 测试机Anneal 回火***注.AMSR (Sheet Resistance) 沈积膜的电阻值测试设备ATOS (Open/Short Tester) 断短路测试机ATTG (TEG Tester or TFT DeviceMeasurement)TFT的电性测试设备ATAR (Array Tester) Array Defect的测试设备ALSR (Laser Repair) 雷射修补机ANNI (Anneal Oven) 回火设备AMGI (Particle Counter) 微粒子侦测,侦测玻璃表面微粒子数目及大小分布AMOR; AMKL (Pattern Inspection) 图案或线路检验设备; 主要在检视沈积膜后、曝光后、蚀刻后及去光阻后表面的线路图案检查(前者简称Orbo, 后者简称KLA)AMSP (Surface Profiler) 表面轮廓检查机,测量线路图案的高低分布状况,亦可藉此求得蚀刻速率(简称KLA-Tencor)AMOV (CD/Overlay) 量测设备用以测量关键线宽CD, 及藉量测Box重迭状况来检视Stepper的精度**注AMSH (Microscope) 高倍显微镜,主要在检视曝光后、蚀刻后及去光阻后表面的线路图案检查(简称Olympus)AMEL; AMOT (Film Thickness) 膜厚量测仪(前者简称Sopra, 后者简称Nano)AMVI (Visual Inspection) 目视检查机,Array段制程的最后出货前检查CJ 指高压水洗MS 指超音波水洗Conveyor 传送Spin 旋转(如Spin Dryer:高速旋干器)Chamber 反应室(如CVD, Sputter或干蚀刻)Load Lock简称LL 闭锁,为大气进入真空或真空进入大气的媒介Heat 加热Cool 冷却Probe (测试机的)探针Process 制程Spec 制程的品质标准Pin-Hole 针点小凹陷PEP (photo engraving process) 完成一次黄光制程叫做一个PEPMI 第一次沈积的(阐极)金属膜如MoWMII 第二次沈积的(源极和汲极)金属膜如MoAlMo a-Si (amorphous silicon) 非结晶硅,TFT沈积层之一n+ (或n+a-Si) 掺杂磷的非结晶硅,TFT沈积层之一SiON (应写为SiOxNy 因O,N的比例不一定)氮氧化硅,TFT沈积层之一SiNx (x为Si与N的比例) 氮化硅,TFT沈积层之一Cleaning 清洗(Cleaner的动作称为Cleaning)Brush 清洗机所使用之软刷DI; DI water; Deionized Water 去离子水UPW 超纯水Vent 破真空,真空环境下的玻璃送至LoadLock闭锁时,通入氮气平衡压力,以防止剧烈的气压变化造成破片Purge 用CF或NF系列的气体通入CVD清除器壁累积的硅Rinse 水洗Veri-Code 光学办认码**注Vacuum 真空Deposition 沉积Wet etching 湿蚀刻Dry etching 干蚀刻Plasma 电浆RIE (Reactive Ion Etching) 反应式离子蚀刻机**注ICP (Inductive Coupled Plasma) 电感偶式电浆蚀刻机**注PE (Plasma Etch) 电浆蚀刻机**注Uniformity 均匀性(类似(大-小)/平均值的概念)Etching Rate 蚀刻速率(=蚀刻厚度/时间)Anneal 回火Laser repair 雷射修补Inspection 检视Pre-bake 预烤Coating 上光阻Exposure 曝光Develop 显影Alignment 对准CD (critical dimension) 关键尺寸(线路关键处的线宽或间距)Overlay 重迭Cure 烘烤Bake 烘烤6.Cell段制程专有名词介绍英文专有名词中文说明Material 材料PI (polyimide) 聚亚醯胺CF (Color Filter) 彩色滤光片Detergent 洗剂γ- Butyrolactoneγ-丁内酯, 简称γ液, 用于清除APR版上的PIRubbing cloth 配向布, 为棉类材质, 用于rubbing机台, 使基板产生配向, 使用前须先挑除杂质, 称为挑布Seal 框胶, 功能在于围住液晶不外漏及避免水气进入, 使用前须先调配, 称为调胶Spacer 或MP(Micro Pearl) 间隙球, 功能在于维持CF与TFT两块玻璃间之间隙距离PS (Photo Spacer) 功能与普通的Spacer相同, 一般用于大尺寸产品, 且可得到较好的cell gapTransfer 或Conductive Paste 或Ag paste 银胶或称导电胶UV sealant UV 胶, 用于两块玻璃基板组合时假固定用Polyfron 均压纸, 基板压合时使用, 用于分隔基板, 可使压力均匀分布以及减少杂质所造成的损害LC (Liquid Crystal) 液晶Polarizer 偏光膜Equipment 设备CDA (Compressed Dry Air) 压缩高压干燥空气DIW, DI water 去离子水, 纯水Control box 电源控制箱Valve 阀门, 控制阀Breaker 电源开关, 继电器Chamber 槽Clean booth 洁净工作台Process 制程FEOL (Front End of Line) cell 前段BEOL (Back End of Line) cell 后段Scribe (1st scribe, 2nd scribe) 切割(有一次切割及二次切割) Break (1st break, 2nd break) 裂片(有一次裂片及二次裂片) Grind 研磨PI Print , PI coater PI 印刷PI Prebake PI 预烤PI Post-bake PI 后烤Rubbing 配向Seal Pattern, Seal dispense 框胶涂布Spacer Sprayer Spacer 散布Jig Press Jig 压合Alignment 对位, 对准Cure 键结硬化Seal Pre-bake Seal 预烤Vacuum Anneal 真空回火Injection 注射(LC-Injection:注入液晶) End Seal 封口胶Polarizer Lamination 偏光片贴合7.Module(模块)段制程专有名词英文专有名词中文说明Cell cell 完成后的在制品(货) Backlight 背光板Bezel 外框Driver IC 驱动集成电路Soldering 焊接Assembly 组装Aging 老化Packing 包装Chip 芯片Tape 胶带Screw 螺丝FPC (Flexible Printed Cable) 可挠性印刷线路PCB (Printed Circuit Board) 印刷电路板TAB (Tape Automated Bonding) 卷带式晶粒接合OLB (Outer Lead Bonding) 外引脚接合ILB (Inner Lead Bonding) 内引脚接合COG (Chip on Glass) 芯片接合在玻璃ACF (Anisotropic Conductive Film) 异方性导电膜7. 日常使用的英文名词英文专有名词中文说明Organization:ProcessManufacturing Department ManagerSection Manager SupervisorLine LeaderOperator 组织方面:制程制造部经理协理(公司中称为主任)管理者(公司中称为Coordinator)组长(公司中称为Keyman)作业员Sick Leave 病假Accident Leave 事假Take a Day off 休息一天AWOL(absence without official leave) 旷工(没有请假)Performance Evaluation:PoorFairGoodExcellentOutstandingImprove 绩效考核:表现差的普通表现好的优秀卓越有待改进Quality Control:品管:IQC=Incoming Quality Control IPQC=In-Process Quality Control OQC=Outgoing Quality Control M.R.B.=Material Review Board WaiveC.A.R.=Correct Action Report F.M.A.=Failure Mode Analysis MO=Misoperation 进料品管制程中质量管理出料品管特采改善措施报告操作错误(人为失误)。

职称中英文对照

职称中英文对照

计算机硬件Computer, Hardware高级硬件工程师 Senior Hardware Engineer硬件工程师 Hardware Engineer其他Others计算机软件Computer, Software高级软件工程师 Senior Software Engineer软件工程师 Software EngineerERP技术/开发应用 ERP Application R&D/Implementation 系统集成工程师 System Integration Engineer系统分析员 System Analyst系统工程师 System Engineer系统架构设计师 System Architecture Design数据库工程师/管理员 Database Engineer/Administrator 计算机辅助设计工程师Computer Aided Design Engineer其他Others互联网开发及应用Internet互联网软件开发工程师 Internet/E—Commerce Software Engineer多媒体/游戏开发工程师 Multimedia/Game Development Engineer网站营运经理/主管 Web Operations Manager/Supervisor 网络工程师 Network Engineer网站架构设计师 Web Architecture Design网站维护工程师 Web Maintenance Engineer系统管理员/网络管理员 System Manager/Webmaster网站策划Web Producer网站编辑 Web Editor网页设计/制作/美工 Web Designer/Production/Creative 网络信息安全工程师 Information Security Engineer智能大厦/综合布线 Intelligent Building/Structure Cabling其他OthersIT-管理IT—Management首席技术执行官CTO/首席信息官CIO Chief Technology Officer CTO/Chief Information Officer CIO技术总监/经理 Technical Director/Manager信息技术经理/主管 IT Manager/Supervisor信息技术专员 IT Specialist项目总监Project Director项目经理 Project Manager项目主管 Project Supervisor项目执行/协调人员 Project Specialist / Coordinator其他Others IT-品管、技术支持及其它IT-QA, Technical Support。

信息管理与信息系统专业 英语

信息管理与信息系统专业 英语

信息管理与信息系统专业英语英文回答:Information Management and Information Systems.Information management is the collection, storage, organization, and dissemination of information. It is a critical function for any organization, as it allows for the effective use of information to make decisions and achieve goals. Information systems are the tools and technologies used to manage information. They can range from simple spreadsheets to complex enterprise resource planning (ERP) systems.The field of information management and information systems is constantly evolving, as new technologies emerge and new ways of working are developed. This has led to a growing demand for professionals with the skills and knowledge to manage information effectively.Skills and Knowledge Required for Information Management and Information Systems Professionals.Professionals in the field of information management and information systems typically need to have the following skills and knowledge:A strong understanding of information management concepts and principles.Proficiency in a variety of information systems software applications.Excellent communication and interpersonal skills.The ability to work independently and as part of a team.A strong work ethic and a commitment to excellence.Career Opportunities for Information Management and Information Systems Professionals.There are a wide range of career opportunitiesavailable for professionals with skills and knowledge in information management and information systems. Some of the most common job titles include:Information manager.Information systems manager.Database administrator.Systems analyst.Business analyst.Project manager.Professionals in these roles can work in a variety of industries, including healthcare, finance, manufacturing, and government.Education and Training for Information Management and Information Systems Professionals.There are a variety of educational and training programs available for professionals who want to work inthe field of information management and information systems. Some of the most common programs include:Bachelor's degree in information management or information systems.Master's degree in information management orinformation systems.MBA with a concentration in information management or information systems.Certificate programs in information management or information systems.Professional Development for Information Management and Information Systems Professionals.In order to stay up-to-date on the latest trends and technologies in the field of information management and information systems, professionals should pursue ongoing professional development. This can be done through a variety of activities, such as:Attending conferences and workshops.Reading industry publications.Taking online courses.Participating in online forums and discussion groups.中文回答:信息管理与信息系统专业。

常用职称职位英文翻译

常用职称职位英文翻译

常用职称职位英文翻译董事长Board Chairman总经理General Manager副总经理Vice General Manager总经理秘书Secretary总经理助理General Manager's Assistant市场营销部经理Manager of Marketing Department 销售部经理Sales Manager餐饮部经理Food and Bererage Manager客房部经理Housekeeper康乐部经理Recreation Dept Manager财务部经理Financial Controller人事部经理Personnel Manager工程部经理Chief Engineer保安部经理Chief Security Officer办公室主任Director of Executive Office大堂副理Asst Manager物资经理Logistic & Purchasing Dept.Manager会计Accountant销售工程师Sales Engineer生产经理Production Dept.Manager销售工程师Sales Engineer工会主席Labour Union chairman操作工Operator库管员Warehouse Keeper技术工程师Technicial Engineer销售一部经理Sales Dept.Manager接待员Receiptionalist配料员Operator保洁员Purifier人事经理助理HR Assistant炊事员Canteen Worker会计Accountant质保经理QC Dept.Manager机械师Machinist工程主管Facilities Supervisor采购员Buyer车间班长Group Leader叉车司机Driver机修工Operator采购主管Purchase Manage综合管理部Colligation and Management Dep财务部部长Finance Dep.Minister市场部部长助理Market Dep.Minister's assistant生产部部长助理Produce Dep. Ministarls assistant研发工程师Develop Engineer业务主办Operation Direct计划员Programmer更夫Bellman技术服务部经理Technical Service Dept.Manager物资内勤Secretary技术服务工程师Technician Service Engineer销售二部经理Sales Dept.Manager车间主管Production Supervisor内勤Secretary出纳Cashier检验员hecker市场部经理Marketing Dept.Manager区域销售经理Regional Sales ManagerIT工程师IT Engineer研磨工Operator司机Driver清扫工Purifier人力资源部经理Human Resources Manager文员Clerk财务经理Finance Dept.Manager技术发展部经理Technical Development Dept.Manager电工Electrician送货员Deliveryman挤压工Operator行政经理Administrative Dep.Manager运输协调员Traffic Coordinator副总工程师Vice - Chief Engineer综合管理部部长Colligation and Management Dep.Minister网络主管Network Manage综合管理部总务Colligation and Management Dep.General Affair 市场部部长Market Dep.Minister市场部项目总理Market Dep.Item Manager质保部Quantity Engineer工艺员Engineer调度员Dispatcher秘书Secretary工作职能中英文对照(做名片时很有用)作者:惟一日期:2006-06-27字体大小: 小中大计算机/互联网/通讯Technology/Internet高级硬件工程师Senior Hardware Engineer硬件工程师Hardware EngineerIC设计/应用工程师IC Design/Application Engineer电子/电路工程师Electronics/Circuit Engineer系统分析员System Analyst高级软件工程师Senior Software Engineer软件工程师Software Engineer互联网软件开发工程师Internet/E-Commerce Software Engineer多媒体/游戏开发工程师Multimedia Software/Game Development Engineer 系统工程师System EngineerERP技术/应用顾问ERP Technical/Application Consultant数据库工程师/管理员Database Engineer/Administrator网站营运经理/主管Web Operations Manager/Supervisor网络工程师Network Engineer系统管理员/网络管理员System Manager/Webmaster网页设计/制作Web Designer/Production网站策划/编辑Web Planner/Editor信息技术经理/主管IT Manager/Supervisor信息技术专员IT Specialist通信技术工程师Communications Engineer数据安全工程师Information Security Engineer系统集成/支持System Integration/Support智能大厦/综合布线Intelligent Building/Structure Cabling首席技术执行官CTO/VP Engineering技术总监/经理Technical Director/Manager项目经理Project Manager项目主管Project Supervisor项目执行/协调人员Project Specialist / Coordinator技术支持经理Technical Support Manager技术支持工程师Technical Support Engineer品质经理QA Manager软件测试工程师Software QA Engineer硬件测试工程师Hardware QA Engineer测试员Test Engineer技术文员/助理Technical Clerk/Assistant其他Other销售Sales销售总监Sales Director销售经理Sales Manager销售主管Sales Supervisor商务经理Business Manager渠道/分销经理Channel/Distribution Manager渠道/分销主管Channel/Distribution Supervisor客户经理Sales Account Manager销售行政经理/主管Sales Admin. Manager/Supervisor区域销售经理Regional Sales Manager店长/卖场经理Store Manager销售代表Sales Representative / Executive电话销售Telesales经销商Distributor医药代表Pharmaceutical Sales Representative销售工程师Sales Engineer售前/售后技术服务经理Technical Service Manager售前/售后技术服务主管Technical Service Supervisor售前/售后技术服务工程师Technical Service Engineer售后/客服经理(非技术)Customer Service Manager售后/客服主管(非技术)Customer Service Supervisor售后/客服专员(非技术)Customer Service Executive销售助理Sales Assistant / Trainee商务专员/助理Business Executive/Assistant其他Others市场/公关/广告Marketing/PR/Advertising市场/广告总监Marketing/Advertising Director/VP市场/营销经理Marketing Manager市场/营销主管Marketing Supervisor市场/营销专员Marketing Executive/Communication市场助理Marketing Assistant / Trainee产品/品牌经理Product/Brand Manager产品/品牌主管Product/Brand Supervisor产品/品牌专员Product/Brand Executive市场通路经理/主管Trade Marketing Manager/Supervisor促销经理Promotion Manager促销主管/督导Promotion Supervisor促销员/导购Promotions Specialist市场分析/调研人员Market Analyst/ Research Analyst公关/会务经理Public Relations Manager公关/会务主管Public Relations 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General Information

General Information

Ceramic DC Disc, RFI and Safety CapacitorsVishay Cera-MiteIN ACCORDANCE WITH IEC RECOMMENDATIONS CERAMIC CAPACITORS ARE SUBDIVIDED INTO TWO CLASSES:•CERAMIC CLASS 1 or low-K capacitors are mainly manufactured of titanium dioxide or magnesium silicate •CERAMIC CLASS 2 or high-K capacitors contain mostly alkaline titanatesMAIN FEATURESCLASS 1CLASS 2APPLICATION For temperature compensation of frequencydiscriminating circuits and filters, coupling anddecoupling in high-frequency circuits where lowlosses and narrow capacitance tolerances aredemanded. As RFI and safety capacitors.As coupling and decoupling capacitors for suchapplication where higher losses and a reducedcapacitance stability are required.As RFI and safety capacitorsPROPERTIES Temperature Dependence Capacitance High stability of capacitance. Low dissipationfactor up to higher frequencies. Definedtemperature coefficient of capacitance, positiveor negative, linear and reversible. High insulationresistance. No voltage dependence. Highlong-term stability of electrical values.High capacitance values with small dimensions.Non-linear dependence of capacitance ontemperature.DC VOLTAGECAPACITANCE DEPENDENCENone Increasing with εDISSIPATION FACTOR TAN δmax. 0.0015 (T ypical) max. 0.035 (Typical) INSULATION RESISTANCE min. 10 000 MΩ to 200 000 MΩmin. 10 000 MΩ to 200 000 MΩCAPACITANCE TOLERANCES < 10 pF:± 0.25 pF, ± 0.5 pF, ± 1 pF≥ 10 pF:± 2 %, ± 5 %, ± 10 %, ± 20 %± 10 %, ± 20 %, (+ 50 - 20) %, (+ 80 - 20) %RATED VOLTAGE100 V DC up to 15 kV DC100 V DC up to 15 kV DCS TANDARDS AND SPECIFICATIONSGENERAL STANDARDSIEC 60062Marking codes for resistors and capacitorsIEC 60068Basic environmental testing procedures Special Standards for Ceramic CapacitorsEN 130600 and IEC 60384-8Fixed capacitors of ceramic dielectric, class 1 EN 130700 and IEC 60384-9Fixed capacitors of ceramic dielectric, class 2 Standards for Special Application PurposesUL 1414UL 1283CSA C22.2EN 132400IEC 60384-14.2IEC 60065RFI - and safety capacitorsCeramic DC Disc, RFI and Safety CapacitorsVishay Cera-MiteNote1.Climatic test conditions: Temperature 20 °C to 25 °C2.Relative humidity 50 % to 70 %Note1.E6 values preferredMEASURING AND TESTING CONDITIONSCAPACITANCE AND DISSIPATION FACTORClass 1C ≥ 1000 pF: 1 kHz, 1 to 5 V RMS C < 1000 pF: 1 MHz, 1 to 5 V RMS Class 2C ≥ 100 pF: 1 kHz, 1.0 ± 0.2 V RMS C < 100 pF: 1 MHz, 1.0 ± 0.2 V RMS INSULATION RESISTANCERated voltage< 100 V:≥ 100 V to < 500 V:≥ 500 V: measuring voltage = (10 ± 1) V measuring voltage = (100 ± 15) V measuring voltage = (500 ± 50) V 60 ± 5 sDIELECTRIC STRENGTHRated voltage≤ 500 V: > 500 V:T est time:Test voltage = 2.5 • UR Test voltage = 1.5 • UR 2 sNOMINAL VALUE SERIES ACCORDING TO IEC 60063E6 (± 20 % TOLERANCE)E12 (± 10 % TOLERANCE)E24 (± 5 % TOLERANCE)100100100110120120130150150150160180180200220220220240270270300330330330360390390430470470470510560560620680680680750820820910Vishay Cera-MiteCeramic DC Disc, RFI and Safety Capacitorsthe two digits are the significant figures of the figures of the capacitance'Divider' - Number of zeros following the Decimal point of the Number of zeros followingBasis is the Capacitance given in µFCAPACITANCE CODING SYSTEM acc. to IEC 60062CAPACITANCE VALUECODE CAPACITANCE VALUEp330.33 pF 3p3 3.3 pF 33p 33 pF 330p 330 pF n33330 pF (0.33 nF)3n33300 pF (3.3 nF)33n 33 000 pF (33 nF)330n 330 000 pF (330 nF)µ330.33 µF 3µ33.3 µFCAPACITANCE TOLERANCECODE< 10 pF: in pF≥ 10 pF: in %C ± 0.25-D ± 0.5-J ± 5K ± 10M ± 20Y + 50/- 20Z + 80/- 20P+ 100/- 0CAPACITANCE CODING SYSTEM acc. to CERA-MITE STANDARDCODE CAPACITANCE VALUE DIVIDER Q 68 e.g. 0.000068= 68 pF'Quad'= Q T 68 0.00068= 680 pF 'Triple'= T D 68 0.0068= 6800 pF 'Double'= D S 680.068= 68 000 pF'Single'= SCERAMIC DIELECTRIC CODING SYSTEMCLASS 1CLASS 2INDUSTRY CODEEIA CODE CODE LETTEREIA CODECODE LETTERP100C0K ----X5F B NP0C0G A X7R C N750U2J U X7S C N1000M3K V Y5U E N1500P3K W Y5V F N2000R3L ----Z5UEN2200R3L X N2500R3M ----N2800--------N3300S3N Y N4700T3MZCeramic DC Disc, RFI and Safety Capacitors Vishay Cera-Mite TEMPERATURE CHARACTERISTIC OF CAPACITANCE FOR CLASS 1 AND CLASS 2Vishay Cera-MiteCeramic DC Disc, RFI and Safety CapacitorsCLASS 1 CERAMIC TYPETEMPERATURE COEFFICIENT OF THE CAPACITANCEΔC = Capacitance changeα = Temperature coefficient in 10-6/°C ΔJ = Temperature change in °CVOLTAGE DEPENDENCE OF CAPACITANCENoneFREQUENCY DEPENDENCE OF CAPACITANCEsee page 8DISSIPATION FACTOR- For values greater than 50 pF: see data sheet.- For lower values the dissipation factor is calculated according to the type of ceramic (rated temperature coefficient) underconsideration of the capacitance acc. to EN 130600.- The dissipation factor as well as the measuring method to be agreed between manufacturer and user for values lower than 5 pF.Ceramic DC Disc, RFI and Safety CapacitorsVishay Cera-MiteCLASS 2 CERAMIC TYPECAPACITANCE CHANGE VS. TEMPERATURE (TYPICAL)CERAMIC DIELECTRIC: X5F AND X5RCERAMIC DIELECTRIC: Y5R AND Y5SCERAMIC DIELECTRIC: X7R AND X7SCERAMIC DIELECTRIC: Y5U AND Y5VCERAMIC DIELECTRIC: Z5UVishay Cera-MiteCeramic DC Disc, RFI and Safety CapacitorsCLASS 2 CERAMIC TYPECAPACITANCE CHANGE VS. FREQUENCY (TYPICAL)CAPACITANCE DEGREASE VS. DC VOLTAGE BIAS (TYPICAL)Ceramic DC Disc, RFI and Safety Capacitors Vishay Cera-MiteCAPACITANCE “AGING” OF CERAMIC CAPACITORSFollowing the final heat treatment, all class 2 ceramic capacitors reduce their capacitance value. According to logarithmic law, this is due to their special crystalline construction. This change is called “aging”. If the capacitors are heat treated (for example when soldering), the capacitance increases again to a higher value deaging, and the aging process begins again.Note:The level of this deaging is dependent on the temperature and the duration of the heat; an almost complete deaging is achieved at the upper category temperature in one hour. These conditions also form the basis for reference measurements when testing. The capacitance changeper time decade (aging constant) differs for the various types of ceramic, but typical values can be taken from the table below.CERAMIC MATERIAL X5F X7R X7S Y5U Y5V Z5U AGING KONSTANT k- 1.5 %- 2.0 %- 3.0 %- 2.0 %- 2.5 %- 2.8 %k = 100 • (C t1 - C t2)C t1 • log10 (t1/t2)C t2 = C t1 • (1 - k/100 • log10 [t1/t2])t1, t2 = measuring time point (h)C t1, C t2 = capacitance values for the times t1, t2 k = aging constant (%)REFERENCE MEASUREMENTDue to aging, it is necessary to quote an age for reference measurements which can be related to the capacitance with fixed tolerance. According to EN 130700, this time period is 1000 hours.If the shelf-life of the capacitor is known, the capacitance for t = 1000 h can be calculated with the aging constant.In order to avoid the influence of aging, it is important to deage the capacitors before stress-testing. The following procedure is adopted (see also EN 130700):Deaging at upper category temperature, 1 hourStorage for 24 hours at normal climate temperatureInitial measurementStressDeaging at upper category temperature, 1 hourStorage for 24 hours at normal climate temperatureFinal measurementVishay Cera-MiteCeramic DC Disc, RFI and Safety CapacitorsCOMPONENT CLIMATIC CATEGORYThe large number of possible combinations of tests and severities may be reduced by the selection of a few standard groupings according to IEC 60068-1First set: Two digits denoting the minimum ambient temperature of operation (Cold test)Second set: Three digits denoting the maximum ambient temperature (Dry heat test)Third set: Two digits denoting the number of days of thedamp heat steady state test (Ca)Category examples acc. T o IEC 60068-125/085/0425/085/2140/085/2155/125/2155/125/5665- 65 °C 55- 55 °C 40- 40 °C 25- 25 °C 10- 10 °C 000 °C 05+ 5 °C 155+ 155 °C 125+ 125 °C 110+ 110 °C 90+ 90 °C 85+ 85 °C 80+ 80 °C 75+ 75 °C 70+ 70 °C 65+ 65 °C 60+ 60 °C 55+ 55 °C5656 Days 2121 Days 1010 Days 04 4 Days00The component is not required to be exposed to damp heatCeramic DC Disc, RFI and Safety Capacitors Vishay Cera-MiteSTORAGEThe capacitors must not be stored in a corrosive atmosphere, where sulphide or chloride gas, acid, alkali or salt are present. Exposure of the components to moisture, should be avoided. The solderability of the leads is not affected by storage of up to 24 months (temperature + 10 °C to + 40 °C, relative humidity up to 60 % RH). Class 2 Ceramic Dielectric Capacitors are also subject to aging see previous page.SOLDERINGSOLDERING SPECIFICATIONSSoldering test for capacitors with wire leads: (according to IEC 60068-2-20, solder bath method)SOLDERABILITY RESISTANCE TO SOLDERING HEAT Soldering T emperature(235 ± 5) °C(260 ± 5) °CSoldering Duration(2 ± 0.5) s(10 ± 1) sDistance from Component Body≥ 2 mm≥ 5 mmSOLDERING RECOMMENDATIONSSoldering of the component should be achieved using a silver-bearing SN type solder. Ceramic capacitors are very sensitive to rapid changes in temperature (Thermal shock) therefore the solder heat resistance specification (see above table) should not sensitive to be exceeded. Subjecting the capacitor to excessive heating may result in thermal shocks that can crack the ceramic body. Similarly, excessive heating can cause the internal solder junction to melt.CLEANINGThe components should be cleaned immediately following the soldering operation with vapor degreasers.SOLVENT RESISTANCEThe coating and marking of the capacitors are resistant to the following test method:IEC 60068-2-45 (Method XA)MOUNTINGWe do not recommend modifying the lead terminals, e.g. bending or cropping. This action could break the coating or crack the ceramic insert. If however, the lead must be modified in any way, we recommend support of the lead with a clamping fixture next to the coating.CAUTIONWhen Sinusiodal or ripple voltage applied to DC Ceramic Disc Capacitors, be sure to maintain the Peak-to-peak value or the peak value of the sum of both AC + DC within the Rated voltage Limits. When the voltage is started to apply the circuit or it is stopped applying, an irregular voltage may be generated because of resonance effects. Be sure to use the capacitor during this transient periode within it’s rated voltage.When rectangular or Pulse Wave Voltage is applied to DC Ceramic Disc Capacitors,the Self-heating generated by the capacitor is higher than the sinusoidal application with the same frequency.The allowable voltage rating for the rectangular or pulse wave corresponds approximately with the allowable voltage of sinusoidal wave with the double fundamental frequency. The allowable voltage varies,depending on the voltage and the waveform. Diagrams of the limiting values are available for each Capacitor Series on request. The surface Temperature of the capacitors must not exceed the upper limit of it’s Rated Operating Temperature. During operation in a High frequency circuit or a Pulse signal circuit, the capacitor itself generate heat due to dielectric losses. Applied voltage should be the load such as self-generated heat within 20 °C on the condition of environmental temperature 25 °C.Note, that excessive heat may lead to deterioration of the capacitor’s characteristics and reliability.AOQ - AVERAGE OUTGOING QUALITYIn the final control all lots (100 % lot-by-lot) are tested on Sample Base.All possible defects are classified into Minor and Major Defects.They are defined as follows:MAJOR DEFECTSDefects from witch is to assume or known that they create dangerous situations for HumansDefects which may create considerable property damageDefects from which is to expect that the pertain equipment will fail.Defects which create essential reduction of the usability for the planned application.Lots with Major Defects always will be rejected.It is essential: Target = Zero DefectMINOR DEFECTSDefects which don’t create essential reduce the usability for the planned application.Defects which affect the usability, function or assembly of the pertain equipment slightlydefects which increase substantial the internal (Vishay’s) rejects.Minor Defects shall not exceed the acceptance of the required sampling plan otherwise the lot will be rejected.The AOQ is calculated on a quarterly basis for mechanical and electrical defects.All lots with major defects and all lots with more minor defects as accepted in the relevant sampling plan will be rejected. That will be set to the ratio with the number of tested parts.Actual the AOQ isAOQ mechanical:< 50 ppmAOQ electrical: < 150 ppmThese values are the End of Line Quality. The customer may expect lower AOQ levels.RELIABILITYBecause of controlled manufacturing processes the quality of the ceramic capacitors is maintained on a high level.The reliability data will be determined from the results of electrical endurance tests according the relevant national or international specification.The endurance tests are performed on the upper category temperature and with applied load according the relevant specification. The applied voltage is up to 1.5 times of rated voltage. It depends on the specification.As failure criterion is fixed:Short circuit during test, 2 times the required limits according the relevant specification.Base for reliability calculation is the international specification IEC 61709The failure rate of our ceramic capacitors isCD Capacitors Class 1 Ceramic Dielectric: 100 fitCD Capacitors Class 2 Ceramic Dielectric: 500 fitAC Line Rated Capacitors: 5 fitDetailed information is available on request.PRODUCTION FLOWCHARTWIRE LEAD OPTIONSRadial leaded capacitors may be ordered with various wire lead options by adding appropriate suffix code to the catalog part number.Example: 564R30GAD22 GJ (Suffix Code) specifies:#20 AWG wire; LS = 0.375"; Inside Crimp; Short Cut Lead Length.Notes• Popular wire lead form options are described above; consult factory for other available forms.• Practical consideration may limit wire options depending on capacitor size - verify special requirements with factory.100 V DC TO 1000 V DC CAPACITORS SUFFIX CODES FOR VARIOUS LEAD SPACING (LS) AND WIRE SIZE (AWG) VOLT CAPACITORSWire form Description Fig.Lead Length 0.200" (5.0)0.250" (6.3)0.300" (7.5)0.375" (9.5)0.400" (10.0)#22AWG #24AWG #22AWG #24AWG #22AWG #22AWG #22AWG Straight wire Fig.11Long 'LL'MA PA UB UA BK BJ BL Steeple wire Fig.12Long 'LL'Cut 'CL'CL PT CJ CH CA CK CB NB PK NK NG NC ND NE Step wire Fig.14Long 'LL'Cut 'CL'VD VK VB PQ VF VG VH PG PU PR PL PH PS PJ Inside crimpFig.15Long 'LL'Cut 'CL'JQ JT JC JF JL JS JP JAJDJKJYJRJJJB2 kV DC TO3 kV DC CAPACITORS SUFFIX CODES FOR VARIOUS LEAD SPACING (LS) AND WIRE SIZE (AWG) VOLT CAPACITORS Wire form Description Fig.Lead Length 0.250" (6.3)0.300" (7.5)0.375" (9.5)0.400" (10.0)0.500" (12.7)0.750" (19)#20AWG #22AWG #20AWG #22AWG #20AWG #22AWG #20AWG #22AWG #20AWG #22AWG #20AWG Straight wire Fig.11Long 'LL'AA UB AE BK AJ BJ AD BL AM BM AB Inline wire Fig.13Long 'LL'Cut 'CL'XW XY UC UE UG UJ UL UM UQ US -XX XZ DU UF UH UK UN UP UR UT -Inside crimpFig.15Long 'LL'Cut 'CL'GB JC GC JL GN JS GD JP GF JN -GEJKJHJRGJJJJGJBGMJM-WIRE INFORMATION#20 AWG 0.032" (0.81) Copper Wire #22 AWG 0.025" (0.64) Copper Wire#24 AWG0.020" (0.51) Copper Clad Steel WireLEAD LENGTH INFORMATION• Standard Long Lead “LL” Length = 1.250" (32 mm) minimum• Cut Lead “CL” Length may be user specified; if unspecified, Vishay Cera-Mite supplies 0.187" (4.8 mm) EIA standard • Cut Lead Lengths are measured from bottom of wire seating plane (wire support point on circuit board)• Minimum Cut Lead Lengths “CL min” are contained in wire figures 12 thru 15• Cut Lead Length Tolerance: + 0.031"/- 0.015" (0.8/- 0.4 mm)STANDARD LEAD CONFIGURATIONSStrai g ht Fi g. 11 Steeple Fi g. 12 Inline Fi g. 13Step Low Volta g e Fi g. 14 Inside Crimp Fi g. 15PACKAGING OPTIONSParts will be BULK packaged in cartons or plastic bags unless optional packaging is specified.Consult factory for other packaging options such as TAPED and REELED or AMMOPACK.TAPE AND REEL OPTIONSRadial leaded parts may be ordered with Tape and Reel packaging by adding appropriate suffix code to part number. Example: 562R5GAS10QR (Suffix C ode) specifies: #22 AWG wire; Straight Lead Form; LS = 5 mm; Tape and Reel per EIA 468B.TAPE AND REEL PACKAGINGPART NUMBER SUFFIXTAPE AND REEL SUFFIX CODES FOR VARIOUS WIRE FORMS & SIZEST & R FigureLS(mm)Max. DiscDiameter(in) (mm)T & RStandardFig.16Straight wireFigure 11Steeple wireFigure 12Inline wireFigure 13Step wireFigure 14Inside crimp wireFigure 15#20AWG#22AWG#24AWG#22AWG#24AWG#20AWG#22AWG#22AWG#24AWG#20AWG#22AWG#24AWGA 5.00.49012.4C-M QG QA QB TK WK XA ZA VC VQ RA RE RB EIA QH QR QD TR TX XB XN VZ VE RC RR LAB7.50.53013.5C-M QP QK---XG ZC--RP RK-EIA QS QF---XH XR--RX RL-C10.50.70818.0C-M QQ QM---XJ XS--RQ RM-EIA AP QX---XK XT--RJ RU-D7.50.70818.0C-M QW QN---XL XU--RW RN-EIA AQ QE---XM XV--RV RD-WIRE INFORMATION#20 AWG0.032" (0.81) Copper Wire#22 AWG0.025" (0.64) Copper Wire#24 AWG0.020" (0.51) Copper Clad Steel WireTAPE AND REEL OPTIONSFi g . AFi g . BFi g . CFi g . DLead Space LS 5.0 mm Pitch0.5" (12.7 mm)Available Series Disc Diameter 12.4 mm or less Series100 V DC to 3 kV DCLead Space LS 7.5 mm Pitch(15.0 mm)Available Series Disc Diameter 13.5 mm or less Series100 V DC to 3 kV DCand AC Rated CapsLead Space LS 10.0 mm Pitch1.0" (25.4 mm)Available Series Disc Diameter 18.0 mm or less Series100 kV DC to 6 kV DCand AC Rated CapsLead Space LS 7.5 mm Pitch30.0 mmAvailable Series Disc Diameter 18.0 mm or less Series100 V DC to 6 kV DC and AC Rated CapsPACKAGING OPTIONSReel PackagingAmmo PackagingTAPE AND REEL OPTIONSITEMCODE Fi g . A Fi g . B Fi g . C Fi g . D Dimensions (mm)Pitch of component P 12.715.025.430.0Pitch of sprocket hole P 012.7 ± 0.315.0 ± 0.312.7 ± 0.415.0 ± 0.4Lead spacingF 5.0 + 0.8/- 0.27.5 ± 1.010.0 ± 1.07.5 ± 1.0Length from hole center to component center P 2 6.35 ± 1.37.5 ± 1.5-7.5 ± 1.5 Length from hole center to component lead P 1 3.85 ± 0.73.75 ± 1.07.7 ± 1.5 3.75 ± 1.0Disc DiameterD See individual product specificationDeviation along tape, left/right ΔS0 ± 1.30 ±2.0Component alignment Δh 0 ±1.0Carrier Tape width W 18.0 ± 0.5Position of sprocket holeW 19.0 ± 0.5Height to component body (Lead Fig. 11)H 20.0 + 1.5/- 1.020.0 + 1.5/- 1.018.0 + 2.0/- 1.020.0 + 1.5/- 1.0Height to seating plane (Lead Fig. 12 to 15)H 16.0 ± 0.5Protrusion Length P 3 3.0 max.Diameter of Sprocket hole D 0 4.0 ± 0.2Total Tape thicknesst 10.6 ± 0.3Total thickness, Tape & Lead wire t 2 1.5 max.Portion to cutL 11.0 max.Hold down Tape width W 011.5 max.Hold down Tape positionW 21.5 ± 1.5Consult us for other packaging options,such as ammo pack cartons.ORDERING CODE CATALOGUE PART NUMBER DC CAPACITORS564R5GA D68VJSERIES RATED VOLTAGE CERAMIC CODE CAPACITANCE VALUE WIRE/TAPEOPTIONS DIVIDER VALUE561R All Class 1 Dielectricand 1000 V DC Precisionand 1 kV DC Low DF 562R General purpose100 V DC thru 1000 V DCClass 2 Dielectric565R Dual Parallel Discs564R High voltage2 kV DC thru 7.5 kV DC 615R High voltage10 kV DC thru 15 kV DC R' indicates anRoHS compliant component none= 100 V1= 1000 V2 = 2000 V3= 3000 V5 = 500 V10 = 1 kV DC20 = 2 kV DC30 = 3 kV DC60= 6 kV DC75 = 7.5 kV DC100 = 10 kV DC150 = 15 kV DCSee on theindividualDatasheets'Quad'= Q'T riple'= T'Double'= D'Single'= SNumber of zeros following theDecimal point of the Capacitancevaluee.g. 0.000068= 68 pF0.00068= 680 pF0.0068= 6800 pF0.068= 68 000 pFBasis is the Capacitancegiven in µFthe two digitsare thesignificantfigures of theCapacitance(Optional)ORDERING CODE CATALOGUE PART NUMBER AC LINE RATED CAPACITORS 440L S10AM-RSERIESCAPACITANCE VALUE WIRE/TAPEOPTIONSROHS DIVIDER VALUE440L X1/Y1Safety Approved 30LV X1/Y2Safety Approved 30LVSX1/Y2Safety Approved 25Y X1/Y2Safety Approved 125L X1/Y4Safety Approved 20VL X2EMI Filter'Quad'= Q'Triple'= T'Double'= D'Single'= SNumber of zeros following the Decimal point ofthe Capacitance valuee.g. 0.00001= 10 pF0.0001= 100 pF0.001= 1000 pF0.01= 10 000 pFBasis is the Capacitancegiven in µFthe two digitsare the significantfigures of theCapacitance(Optional)'R' indicatesan RoHScompliantcomponentCUSTOM DESIGNSVishay Cera-Mite’s most popular 100 Volt to 15 000 Volt values and constructions are shown as standard part numbers in this catalog. Many other values and lead styles are available. Other capacitance ranges and styles are available on request. Various wire lead forms and packaging options are detailed on the previous pages. Part numbers for custom capacitors consist of an 18-character designator assigned by our application engineering group. Vishay Cera-Mite will provide a certified outline drawing and complete part number covering custom options specified. Customer approval of the outline is usually requested to guarantee satisfaction. All performance characteristics shown in this catalog apply to the options unless otherwise stated on the outline drawing.Notes• Wire leaded DC rated, disc capacitors are marked with a code identifying the manufacturer, capacitance, tolerance, voltage, and type of ceramic.• Specially types such as AC rated are marked as described on the individual datasheets.ORDERING CODE CUSTOM PART PART NUMBER564R Y5PJR303EE680K SERIESTEMP.CHARACT.WIRE LEAD AND PACKAGING CODE RATED VOLTAGE COATINGMATERIAL BODY SIZECAPACITANCE VALUE TOL.561R All Class 1 Dielectricand 1000 V DC Precision and 1 kV DC Low DF 562R General purpose100 V DC thru 1000 V DC Class 2 Dielectric 565R Dual Parallel Discs 564R High voltage2 kV DC thru 7.5 kV DC 615R High voltage10 kV DC thru 15 kV DC R' indicates anRoHS compliant componentsee T able on page 4 and on individual datasheetssee T able on pages 14 to 16First two digits are significant numbers Last digit specifies the numbers of zeros (Voltage given in 'Volts')E = Epoxy A =PhenolicDisc diameter code LetterFirst two digits are significant numbers Last digit specifies thenumbersofzeros For values below 10 pF ,use Letter 'R'For values decimal point e.g. 2R2 =2.2 pFsee Table on page 4MARKING INFORMATIONCMY5R (OR C)01M1 KV MANUFACTURER IDENTIFICATION TEMPERATURE COEFFICIENT CAPACITANCECAPACITANCE TOLERANCE VOLTAGE“Cera-Mite ®” or the identification “CM”See chart on page 4Expresssed in pF or µF .Example: 680 = 680 pF 0047 = 0.0047 µFC = ± 0.25 pFD = ± 0.5 pF J = ± 5 %K = ± 10 %M = ± 20 %P = + 100 % to - 0 %Y = - 20 % to + 50 %Z = - 20 % to + 80 %Rating normally DC volts. AC voltage rating markedAC or ~;If no voltage is marked,part is 500 V DC。

英语日常用语——技术资料和图纸

英语日常用语——技术资料和图纸

英语日常用语——技术资料和图纸TECHNICAL DOCUMENTS AND DRAWINGS1 We completed this task according to the drawing number SD-76.我们按照图号SD-76的图纸完成了这项工作。

2 According to the technical standard (norm, rules of operation), the erection (alignment, testing )work is now getting on .安装(校准、试验)工作正在根据技术标准(规范、操作规程)进行。

3 This is a plot plan (general layout ,general arrangement, detail ,section, erection ,flow sheet, PID, assembly, civil, electrical, control and instrumentation, projection, piping, isometric ) drawing.这是一张平面布置(总平面、总布置、细部、剖面、安装、流程、带仪表控制点的管道、装配、土建、电气、自控和仪表、投影、配管、空视)图。

4 That is a general (front, rear, side, left, right, top, vertical, bottom, elevation, auxiliary, cut-away, birds eye) view.那是全视(前视、后视、侧视、左视、右视、顶视、俯视、底视、立视、辅助、内部剖视、鸟瞰)图。

5 How many drawings are there in the set?这套图纸有几张?6 Is this a copy for reproduction? 这是一份底图吗?7 What is the edition of this drawing? 这张图纸是第几版?8 Is this drawing in effect? 这张图纸有效吗?9 Is this a revised edition? 这是修订版吗?10 Will it to be revised yet? 这图还要修订吗?11 Are there some modifications (revisions) on the drawing?这张图上有些修改(修正)吗?12 The information to be placed in each title block of a drawing include: drawing number, drawing size, scale, weight, sheet number and number ofsheets, drawing title and signatures of persons preparing, checking and approving the drawing.每张图纸的图标栏内容包括:图号、图纸尺寸、比例、重量、张号和张数、图标、以及图纸的制图、校对、批准人的签字。

【5A文】 大型电子厂英文一般能力培训教材

【5A文】 大型电子厂英文一般能力培训教材

GG电子厂英文一般能力培训教材英文一般能力培训教材(02版)GG电子厂目录第一章常用词汇(适用对象:助理管理/工程师、管理/工程师B、管理/工程师A、高级管理/工程师、副课长、课长)Unit1公司/部门名称 (3)Unit2职位及产品名称 (5)Unit3工厂用词汇I (7)Unit4工厂用词汇II (8)Unit5工厂用词汇III................................................................................................7>9 Unit6公司简介 (10)第二章电话用语/信件(适用对象:助理管理/工程师、管理/工程师B、管理/工程师A、高级管理/工程师、副课长、课长)Unit7电话英语常用语 (11)Unit8写e-mail常用英语…………………………………………………1> (12)Unit9简报常用英语 (14)Unit10英文书信格式 (16)Unit11英文书信格式 (18)Unit12英文书信格式 (20)第三章会议/接待/打招呼/合约(适用对象:、管理/工程师A、高级管理/工程师、副课长、课长)Unit13会议 (21)Unit14开会通知 (22)Unit15接待 (24)Unit16打招呼 (26)Unit17合约 (27)第四章生意洽商/客户投诉/职场用语等(适用对象:管理/工程师A、高级管理/工程师、副课长、课长)Unit18报价与付款 (28)Unit19生意洽商 (30)Unit20客户投诉 (32)Unit21回复不合理投诉 (34)Unit22职场常用英语 (35)第五章商务英语(供阅读参考)Unit23商务英语1 (37)Unit24商务英语2 (39)Unit25商务英语3 (41)Unit26商务英语4 (44)第六章工厂用专业词汇(供阅读参考)Unit27通用/品质类 (46)Unit28模具工程类 (49)Unit29冲压/成型/组装类 (52)Unit30生产规格 (54)第一章常用词汇Unit1公司/部门名称1company公司1.1KinpoElectronics(China)Co.,LTD金宝电子(中国)有限公司2.Plant&amp;Div.&amp;Dept.&amp;Section厂&amp;处&amp;部&amp;课2.1Plantdirectoroffice厂长室2.2BusinessUnit.事业处2.3R&amp;DDiv.设计处2.4department部门3.MFG:manufacturing制造3.1AI:autoinsertion自动插件3.2SMT自动粘著3.3Assembly组装3.4Pre-forming加工4.Material物料4.1purchasing采购4.2ProductionControlCenter生管中心4.3W.H.:warehouse仓库4.5LocalProcurement陆购4.6Toolsmanagement模具管理4.7SourceDevelopment料源开发5.QA品保5.1VQA进料品质保证5.2QAEngineering品保工程5.3QASystem品保系统5.4PQC,FQC制程品管5.5Calibration,safety仪校,安规6.PE:productionengineering制造工程6.1AEAutomationengineering制工(机械工程) 6.2IE:industrialengineering工业工程6.3NPI技发6.4QTDept.品技部7.CustomBusiness关务8.Import&amp;EGport进出口9.HR:humanresources人力资源9.1Administration人事行政10.FactoryAffairs厂务10.1FactoryEngineering工务10.2GeneralAdminProcurement总务采购11.R&amp;D:Research&amp;Development设计11.1Electronic电子11.2Artworks美工11.3ME/Tools模具11.4Mechanical机械11.5Software软体12.Accounting会计13.Financial财务14.DocumentationCenter(databasecenter)资料中心15.responsibledepartment负责单位16.productionunit生产单位17.distributiondepartment分发单位Unit2职位/产品名称一.职位名称1.position职务2.ChairmanoftheBoard董事长3.President(AmE.),ManagingDirector(MD)总裁4.EGecutiveVice-President执行副总裁5.ManagingDirector行政董事6.EGecutiveManager,GeneralManager 总经理7.DeputyGeneralManager副总经理8.specialassistant特助9.SectionManager部门经理,科长10.deputymanager=vicemanager副理11.supervisor课长12.deputysupervisor,vicesupervisor副课长13.deputymanager=vicemanager=AssistantManager助理经理(副经理)14.Manager主任15.Supervisor主管16.eGecutive高中级管理人员17.clerk职员18.groupleader组长19.assistant助理20.HRManager人事经理21.secretary秘书22.operator作业员23.engineer工程师24.inspector检验员二.产品名称puterAccessories电脑类产品1.1PCmouse鼠标1.2printer打印机1.3digitalcamera数码相机1.4personaldigitalassistant个人数位助理器2.ElectronicConsumerProducts消费性电子产品2.1calculator电子计算器2.2electronicdictionary电子辞典2.3ElectronicOrganizer电子记事本2.4ElectronicDictionary电子辞典municationProducts通讯类产品3.1cellphone微型电话3.2GPSGlobalPositioningSystem卫星定位器3.3ADSL(AsymmetricalDigitalSubscriberLine)非对称数字用户环路Unit3工厂用词汇Icolor颜色1.black黑色2.blue蓝色3.brown棕色4.gold金色5.gray灰色6.green绿色7.orange橙色8.red红色9.silver银色10.violet(purple)紫色11.white白色12.yellow黄色二.Ver动词1.change改变2.pay付给3.check检查4.produce产生e来6.provide提供7.damage损伤8.receive收到9.find发现10.replace代替11.fiG修理12.send发出13.go去14.take采取,拿15.happen发生16.touch碰触17.improve改善18.wind缠绕19.insert插入20.issue发行21.make做,使三.Non名词1.action动作2.analysis分析3.condition条件4.data资料5.defect缺点6.settle处置7.engineer工程师8.failure失败9.file文件夹cationandTraining教育训练11.classification(sorting,organization)整理12.regulation(arrangement,tidiness)整顿13.cleanliness(sweeping,purity)清扫14.conservation(cleaning,cleanliness)清洁15.culture(discipline)教养16.save节约17.safety安全四.其它常用词1.model机种2.revision版本3.issueddate发行日期4.P/N品名,料号5.remark备注6.reportedby草拟7.checkedby审核8.approvedby核准9.proposalimprovement/creativesuggestion提案改善10.4MTH:Man,material,money,method,time,how人力,物力,财务,技术,时间(资源)11.6M:man,machine,material,method,measurement,message人,机,料,法,环,(资讯)12.FN(factorynotice):工厂变更通知13.ECN(engineeringchangenotice)工程变更通知14.Immediatedchange立即变更15.Runningchange旧料用完用新料16.oldrev.(旧版本)newrev.(新版本)17.drawingno/customer/alterationref(图号/客户/变更依据)Unit4工厂用词汇II一.Component零件1.bobbin线轴2.shield背板3.bridgediode桥式整流4.triode三极管5.cabletie束带6.tape胶布7.capactitor(Cap)电容8.screwtapping自攻螺丝9.case外壳10.screwmachine机械螺丝11.ceramiccapacitor陶瓷电容12.terminal端子13.chipcapacitor晶片电容14.transformer(G&#039;FMR)变压器15.chipresistor晶片电阻16.transistor电晶体17.choke线圈18.tube套管19.connector连接器20.varistor突波吸收器21.controlboard基板22.VR(variableresistance)可变电阻23.diode二极体24.washer垫片25.epoGy树脂26.zener齐纳27.fan风扇28.photocouple光藕合二极体29.FET场效电晶体30.regulator稳压器31.filter滤波器32.resistor电阻33.fuse保险丝34.ricer铆钉35.fuseclip保险丝底座36.screw螺丝37.fuseholder保险丝底座38.socket插座39.glue胶40.solderbar锡棒41.heatsink散热片42.spingwasher弹簧垫片43.IC集成电路44.stand-off支柱45.inductor电感46.starwasher星形垫片47.insulator绝缘片48.switch开关49.jumperwire跳线50.outputcable输出线bel标签52.outputwire输出线53.lockwasher接地唾形垫片54.PCB电路板55.NTC热敏电阻56.LED发光二极体nut螺丝帽57.tubberfoot脚垫58.TEFLON铁弗龙套管二.Process制程1.assembly组立2.method方法3.burn-in(B/I)崩应4.noise噪音5.fluG助焊剂6.pallet栈板7.functiontest功能测试8.paper纸张9.gravity 比重10.Hi-pottest耐高压测试11.insertion插件12.problem 问题13.ORT可靠度测试14.procedure程序15.packing包装16.product产品17.soldermachine锡炉18.production生产19.station站别20.record记录21.supplier/vendor厂商22.remark备注23.temperature 温度24.report 报告25.humidity湿度26.requirement 要求27.torque 扭距28.sample样品29.touch-up(T/U)补焊(二次作业)30.target 目标yout设计图32.trace(基板)线路33.location位置34.waybill运货单Unit5工厂用词汇III(品技类)1.ACCEPT允收2.KNOB开关钮3.REJECT拒绝,4.MYLARDOME圆形Mylar5.QUALITY品质6.BATTERYCOVER,电池盖7.LOWERCASE,下壳,8.BUZZER蜂鸣器9.UPPERCASE上壳,10.TOUCH接触11.WIRE皮线12.CARBON碳墨13.RIGHT正确14.SPRING弹簧15.LEFT左16.KEYPAD字键17.LCDFIGERLCD固定架BEL贴纸19.COVER盖子20.BLISTERCARD泡壳21.PLATE弹片22.INSTRUCTIONBOOK说明书23.SPONGE泡棉24.DISPLAYWINDOW 显示窗25.SOLARCELL太阳能电池26.RUBBERFOOT橡胶脚垫27.ON/OFFBUTTON开关钮28.PAPERPAD纸垫29.SPEED速度30.FREQUENCY频率31.DOT圆点32.BROKEN破33.GAP间隙34.STEP步骤35.FUNCTION功能36.KEYPAD字键37.SMALL小的、轻微的,38.CHANGE变更39.DATE日期40.RUNNING运行41.BIG,IMPORTANT大的、重要的42.SCREW螺丝43.SCRATCH刮伤44.PCSHEET面板45.SPEC规格46.HARDCASE护壳47.PUSH推行/推动48.SHAFT轴49.AUDIT查核50.PAPERHOLDER纸架51.CARTONBOG外箱或包装箱52.DESCRIPTIONBOOK说明书PUTER计算机54.INNERCARTON中箱55.RESETKEY重新启动键56.CHIPCAP贴片电容57.LOGO标志58.WARRANTY保证书59.MEMORY记忆60.RITINGLABEL贴纸样版61.CLEAR清除62.MARK标志、标记63.PRESSURE压力64.DOCUMENT文件65.MACHINE机器66.PRESSBUTTON按钮67.TEMPERATURECONTROLBOG温度控制箱68.CRACK破裂69.sharpnosepliers尖嘴钳70.touchup(T/U)手焊71.hardlesstester硬度计72.solderball锡球73.SHORT短路74.missingcomponent缺件75.wrongcomponent错件76.leadfree无铅77.throughhole穿孔点78.printerhead打字头.plate(NP)铭板80.chiponboard(COB)81.insufficientsolder锡量不足82.diagonalcuttingpliers斜口钳83.printcircuitboard(PCB)印刷电路板84.printcircuitboardassembly(PCBA)印刷电路板组装.Unit6公司简介panyHistoryIntroduction公司发展史简介??1995/05SurveyoflocationinChinaforfactory开始在中国大陆寻求厂址??1995/09 C ontractsignedwithlocalgovernment与当地政府签订合同??1995/09 F actoryconstructionbegan开始建厂??1996/01 L ayoutplanning&amp;equipmentssettingup规划并添置设备??1996/03 M assProductionStarted开始量产??1996/04 F irstTimeShipment首次出货??1997/05 Q ualifiedISO9002Certification获得ISO9002认证??1999/06 S urveyofotherlocationfornewfactory寻求新厂址??20XX/12 Hardwaresettingupcompletely完成硬件配置??20XX/05 GPSMassProduction&amp;ShippingGPS量产与出货??20XX/06 DSCMassProductionStartedDSC开始量产??20XX/07 FirstTimeDSCShipmentDSC首次出货??20XX/11 SettingupfacilitiesforHPproduction开始为HP产品的生产购置设备2.SpaceResource占地面积Floorspace-133,554M2??DORMITORY-44,485M2??Factory-89,069M2??Landspace-169,996M23.MajorCustomers主要客户??PhotoPrinter:HewlettPackard/Casio??DigitalStillCamera:Ricoh/Casio??GPS:Magellan??ADSL:DQT/Kinpo??PDA:Casio/Canon/HTW/TeGasInstruments??Calculator:Canon/Casio/Citizen/Sharp/TI/HPpany’sAddress公司地址KinpoElectronics(China)Co.,Ltd.金宝电子(中国)有限公司ShaTouarea,ChangAnTown,长安镇沙头管理区DongGuanCity,东莞市GuangDongProvince,广东省China.中国5.PostalNumber邮编:523866Tel:0769~5321555FaG:(0769)5328215第二章电话用语/信件Unit7电话英语1、请找Tom听电话→以下用法均可MayIspeakto(with)Tom?=I’d liketospeaktoTom,please.2、请问您是哪位→以下用法均可Who’s speaking?=Whoisthis,please?=MayIask who’s calling?3、请再说一次→以下用法均可Ibegyourpardon?=Pardonme?=Wouldyourepeatthat,please.4、请问您找谁?→以下用法均可Whowouldyouliketotalkto?=Withwhomdoyouwishtospeak?5、请稍候.→以下用法均可Wouldyouholdtheline,please?=Couldyouwaitforjustonemoment, please?Holdon,please.=Onemoment,please.=Justasecond,please6、解释不能接听电话的原因(1)、Heisnotin.=Heisout.他外出不在(2)、Heisawayfromhisdesk.=Heisnotathisdesk.他不在位子上。

高达SEED机体资料12-无限正义、强袭自由

高达SEED机体资料12-无限正义、强袭自由
(手部)可选武器:MA-M21KF高能量光束步枪×2;MA-M02G光束剑×2
外加装备武器:无
技术和历史记录(Technical and Historical Notes)
为了打开持续变得更混乱的扎夫特和地球联合之间的形势,由扎夫特开发的最后王牌。因为搭载了新型发动机,本机拥有数倍于ZGMF-X10A Freedom Gundam的战斗能力。关节的颜色变成金色是其特征。
制造方:扎夫特(Z.A.F.T)
所属方:扎夫特(Z.A.F.T)
尺寸:全长5.67米
重量:重3.02吨
动力提供:电池能量包
驾驶舱:驾驶员一名,位于驱干的标准驾驶舱
装备和设计特点:可变形作为ZGMF-X56S Impulse Gundam的驾驶舱
首次服役:C.E.73年10月2日
固定武器:MMI-GAU19 20mm机枪×2,固定在主机体;QF908对空飞弹发射器×2(AGM33 “Ladybird”诱导飞弹),可分离,固定在机翼下
著名机师:未知
细节图片:尾部模块METEOR改Freedom装备型
登场作品:Seed-MSV
原创设计者:Kunio Okawara
概述与技术资料(General and Technical Data)
中文译名:典礼用吉恩
类型:仪式典礼用MS
制造方:扎夫特(Z.A.F.T)
所属方:扎夫特(Z.A.F.T)
(手部)可选武器:MA-M02G “超级蝎虎座”光束剑×2,装备在臀侧;MA-M1911高能量光束步枪×1;RQM55“Shinging Edge”光束回旋镖
外加装备武器:无
技术和历史记录(Technical and Historical Notes)
和Strike Freedom一同由ZAFT开发的新型MS。因为搭载了新型发动机,拥有数倍于旧Justice的战斗能力。关节的颜色是银色。

制造业常用职位中英文对照

制造业常用职位中英文对照

制造业常用职位中英文对照•President 董事长[]•General Manager 总经理(GM)•[][]•Vice-President 副总经理/副董事长(V.P.) •[][]•Human Resource Manager人力资源经理•[][][]•Plant Manager 厂长[][]•Accounting Manager 会计部经理•[][]•Financial Manager 财务部经理[][]•Manufacturing Manager 制造部经理•[][]•Finance Manager 财务部经理[][]•Supervisor 主管[]•Administration Manager 行政经理•[][]•Secretary 秘书[]•Assistant 助理[]•Manufacturing Engineer 制造工程师(ME) •[][]•Marketing Representative 销售代表•[][]•Personnel Manager 人事部经理•[][]•Product Manager 生产部经理•[][]•Software Engineer 软件工程师•[][]•Mechanical Engineer 机构工程师(ME)•[][]•Electronic Engineer 电子工程师(EE)•[][]•Production Engineer 制造工程师(PE)•[][]•Quality Engineer 质量工程师(QE)•[][]•Industrial Engineer 工业工程师(IE)•[][]•PMC(Product Material Control) Manager 物料部经理•Production Manager 制造部经理•[][]••Production Control 生产控制员 (PC)•[][]•Material Control 物料控制员 (MC)•[][]•Cashier 出纳[]•Specialist 管理师/专员[]•Lecturer/Trainer/Instructor 讲师•[]/[]/[]•Internal Auditor 审核员•[][]•Receptionist 接待员[]•Technician 技术员[]•Operator 作业员[]制造企业常用英文简称(一)•5S : 5S管理:整理、整顿、清扫、清洁及素养•AVL : 认可的供货商清单(Approved Vendor List) •[][][]•BOM : 物料清单 (Bill Of Material)• [][][]•BPR : 企业流程再造 (Business Process Reengineering) [][][ri]•BSC : 平衡记分卡 (Balanced Scorecard)•[][]•BTF : 计划生产 (Build To Forecast)•[][][]•BTO : 订单生产 (Build To Order)•[][][]•CPM : 要径法 (Critical Path Method)•[][][]•CRM : 客户关系管理 (Customer Relationship)•[][]•EC : 电子商务 (Electronic Commerce)•[][]•ECRN : 工程规格更改通知(Engineer Change Request Notice) [][][][]•EMC : 电磁相容(Electric Magnetic Capability) •[][][]•ERP : 企业资源规划 (Enterprise Resource Planning) •[][][]•FQC : 成品质量管理 (Final Quality Control)•[][][]•IPQC: 制程质量管理 (In-Process Quality Control) •[][][][]•IQC : 进料质量管理 (Incoming Quality Control) •[][][]•ISO : 国际标准组织 (International Organization for Standardization)• [][][][]•JIT : 实时管理 (Just In Time)•[][][]•KM :知识管理 (Knowledge Management)•[][]•MO : 制令(Manufacture Order)•[][]•MPS : 主生产排程 (Master Production Schedule) •[][][]•MRP : 物料需求规划 (Material Requirement Planning) •[][][]•MRPII : 制造资源计划 (Manufacturing Resource Planning) [][][]•OEM : 委托代工 (Original Equipment Manufacture) •[][][]••ODM : 委托设计与制造 (Original Design & Manufacture) •[][][]制造企业常用英文简称(二)•OQC : 出货质量管理 (Out-going Quality Control) •[][][][]•PDCA : PDCA管理循环 (Plan-Do-Check-Action)•] [][][]•PDM : 产品数据管理系统 (Product Data Management) •[][][]•PERT : 计划评核术 (Program Evaluation and Review Technique)•[][][][][]•PO : 订单(Purchase Order)•[][]•PR : 采购申请Purchase Request•[][]•QA : 品质保证(Quality Assurance)•[][]••QC : 质量管理(Quality Control)•[][]•QCC : 品管圈 (Quality Control Circle)•[][][]•QE : 品质工程(Quality Engineering)•[][]•RMA : 退货验收Returned Material Approval •[][][]•SCM : 供应链管理 (Supply Chain Management) •[][][]•SO : 订单(Sales Order) [][]•SPC : 统计制程管制 (Statistic Process Control) •[][][]•TPM : 全面生产管理Total Production Management •[][][]•TQC : 全面质量管理 (Total Quality Control) •[][][]•TQM : 全面品质管理 (Total Quality Management) •[][][]WIP : 在制品 (Work In Process)[][][]PMC英文名称: Product Material Control[][][]中文名称:物料控制员相关:将订单转换成工单,准备并更新主生产计划,每日基于生产的能力及出货计划,查核物料状况,为相关部门准备采购需求计划,依据物料供应状况准备并更新日生产计划,研究作业注程找出生产瓶劲提能决方案确保生产须畅,查核产程库存,得出能解决方案以保持最少库存且不影响生产效率,准备并更新出货计划,维持最小库存并在供应商合作之全合作下协助明示 JIT 的运作,优化人力配置,使产程库存最小,合理化生产以提升生产效率,协助控制采购品质,避免不合理的物料采购,事先考虑以优化生产须序 PC英文名称: Product Control[] []中文名称:生产(计划)管理PE英文名称: Production Engineer[][]中文名称:生产工程师SMT英文名称: Surfaced Mounting Technology[t] [][]中文名称:表面贴装技术相关:电子组装技术。

中国国家标准英文翻译指南

中国国家标准英文翻译指南

中国国家标准英文翻译指南-- 中国国家标准英文翻译指南中国国家标准英文翻译指南出处:中国电力标准化网站作者:国家质量技术监督局国家质量技术监督局质技监局标函[2000]39号关于印发《国家标准英文版翻译指南》的通知国务院务有关部门,全国各专业标准化技术委员会:为适应我国加入世界贸易组织(WTO)和标准化活动对外交流的需要,及时准确地把我国国家标准翻译成英文版本,我局组织制定了《国家标准英文版翻译指南》,现予以公布。

自公布之日起实行。

二○○○年二月十三日主题词:国家标准规定通知抄送:中国标准出版社、中国标准研究中心国家质量技术监督局办公室2000年2月12日印发打字:王岷校对:张琳国家标准英文版翻译指南国家质量技术监督局标准化司二○○○年二月目次1 前言2 格式3 用词和用语4 引用标准化中心附录A:封面格式附录B:首页格式一、前言为适应我国加入世界贸易组织和我国对外开放的需要,我局从1997年起开始将一部分国家标准翻译成英文。

在翻译过程中,不少有关单位建议对翻译的格式和通用用语进行规范。

为此,我司于1999年初成立了《国家标准英文版翻译指南》编制工作组,开始指南的起草工作。

编制《国家标准英文英文版翻译指南》的目的是:1.对国家标准英文版标准中需要统一的格式进行规范2.对国家标准英文版标准中需要统一的语句和用词进行规范3.对与现行GB1.1及ISO/IEC导则要求有出入的老格式标准文本中有必要进行调整的内容进行规范。

本指南适用于将我国国家标准翻译成英文文本的标准化中心二、格式2.1 等同/修改(等效)采用国际标准的国家标准应使用原英文版本,并符合ISO/IEC指南21(1999版)的要求。

2.2 对于非等效采用国际标准的国家标准,在翻译时应尽可能与原英文版本格式保持一致。

2.3 对于非采用国际标准的国家标准,在翻译时应尽可能以相应国际标准作为格式参考。

2.4 封面和首页格式见附录A和附录B。

三、用词和用语3.1 封面封面用语的英文表述3.1.1 中华人民共和国国家标准National Standard of the People’s Republic of China3.1.2 国家质量技术监督局发布Issued by China State Bureau of Quality and Technical Supervision3.1.3 国家技术监督局发布Issued by China State Bureau of Technical Supervision3.1.4 国家标准局发布Issued by China State Bureau of Standards3.1.5 发布日期Issue date3.1.6 实施日期Implementation date3.1.7 等同采用IDT3.1.8 修改(等效)采用MOD3.1.9 非等效采用NEQ3.2 目次目次用语的英文表述3.2.1 目次contents3.2.2 附录annex3.2.3 参考文献bibliography3.2.4 索引index(es)3.2.5 图figure(s)3.2.6 表table(s)3.3 前言前言部分用语的英文表述3.3.1 前言Foreword3.3.2 本国家标准等同采用IEC(ISO) ××××标准:This national standard is identical to IEC(ISO) ××××3.3.3 本国家标准修改(等效)采用IEC(ISO) ××××标准:This national standard is modified in relation to IEC(ISO) ××××3.3.4 本国家标准非等效采用IEC(ISO) ××××标准:This national standard is not equivalent to IEC(ISO) ××××3.3.5 本国家标准附录××××是标准的附录(补充件)Annex ××××/Annexes ××××of this national standard is/are normative3.3.6 本国家标准附录××××是提示的附录(参考件)Annex ××××/annexes ××××of this national standard is/are informative3.3.7 本国家标准对先前版本技术内容作了下述重要修改There have been some significant changes in this nationals standard over its previous edition in the following technical aspects3.3.8 本国家标准与所采用国际标准的主要技术差异The main technical differences between the national standard and the international standard adopted3.3.9 本国家标准从实施日期起代替××××This national standard will replace ××××from the implementation date of this standard3.3.10 本国家标准由××××提出This national standard was proposed by ××××3.3.11 本国家标准由××××归口This national standard is under the jurisdiction of ××××3.3.12 本国家标准由××××起草This national standard was drafted by ××××3.4 引言3.4.1 引言introduction3.5 范围范围部分用语的英文表述:3.5.1 主题和范围subject and the aspect(s) covered3.5.2 本国家标准规定……的尺寸This national standard specifies the dimensions of ……3.5.3 本国家标准规定……的方法This national standard specifies a method of ……3.5.4 本国家标准规定……的性能This national standard specifies the characteristics of ……3.5.5 本国家标准规定……的系统This national standard establishes a system for ……3.5.6 本国家标准规定……的基本原理This national standard establishes general principles for3.5.7 本国家标准适用于……This national standard is applicable to ……3.6 引用标准引语的英文表述(根据中文文本从a, b中选取):a. 下列标准中所包含的条文,通过在本标准中引用而构成为本标准的条文。

guidance-technical-documentation-and-design-dossiers

guidance-technical-documentation-and-design-dossiers

Whereas the term “Technical Documentation” or “Technical File“ is used for medical devices of class I, class IIa, andclass IIb, the term “Design Dossier“ is used for class III products.术语“技术文档”或“技术文件”用于医疗设备的I类,IIA类和IIB类,术语“设计档案”用于第三类产品。

Technical Documentation is retained in the premises of the manufacturer or the Authorized Representative for potential review of Competent Authorities and Notified Bodies.技术文件保留在制造商或授权代表处,以备主管部门和公告机构审查。

Part B of the Technical File may be available at the manufacturer only, whereas Design Dossiers have to be submitted to the Notified Body for review prior to CE marking of the product技术文件的B部分可能仅在制造商提供,然而在产品标识"CE"之前,设计档案材料必须提交给认证机构(use form MDD Application for CE Conformity Assessment MED_F_03.15; http://www.tuev-sued.de/industry-and-consumer- products/download-center/applications).(使用MDD应用程序MED_F_03.15进行CE合格评估)We will assign a project coordinator who will entrust one or more further experts with the review of particular modules.我们将指派一个项目协调员,他将委托一个或多个进一步的专家对特定的模块进行评审。

IEC62132-1General_Information

IEC62132-1General_Information

THIS DOCUMENT IS STILL UNDER STUDY AND SUBJECT TO CHANGE. IT SHOULD NOT BE USED FOR REFERENCE PURPOSES. RECIPIENTS OF THIS DOCUMENT ARE INVITED TO SUBMIT, WITH THEIR COMMENTS, NOTIFICATION OF ANY RELEVANT PATENT RIGHTS OF WHICH THEY ARE AWARE AND TO PROVIDE SUPPORTING DOCUMENTATION.
8
8.1 8.2 8.3
TEST REPORT
General Immunity limits or levels Performance classes
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14 14 14 15 15 15 15
8.4 Interpretation of results 8.4.1 Comparison between IC(s) using the same test method 8.4.2 Comparison between different test methods 8.4.3 Correlation to module test methods
B.2 Board description - electrical B.2.1 Ground planes B.2.2 Package pins B.2.3 Via type B.2.4 Via distance B.2.5 Additional components B.2.6 Supply decoupling B.2.7 I/O load
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5.1 5.2 5.3 5.4

信息技术常用术语中英文对照表

信息技术常用术语中英文对照表

Hacker 黑客,最初是指发现网络系统安全漏洞并进行修补的人,而现在多指利用系统安全漏洞对网络进行攻击破坏或窃取资料的人HomePage 主页,通过万维网(Web)进行信息查询的起始信息页HTML Hypertext Markup Language超文本链接语言HTTP Hypertext Transfer Protocol超文本传输协议ICP Internet Content Provider Internet内容提供商ICQ I seek you网上寻呼Internet国际互联网,因特网internet 互联网,泛指由多个计算机网络相互连接而成的一个网络I Phone Internet Phone一种通过Internet进行语音通讯的技术IP电话利用Internet技术传输话音信号的一种电话IRC Internet Relay Chat Internet实时网上交谈系统ISP Internet Service Provider Internet服务提供商MUD Multi-User Dungeon多用户网络游戏NII National InformationInfrastructure国家信息基础结构,俗称信息高速公路POP Post Office Protocol邮局协议Proxy Server 代理服务器,一种代表客户机转送服务请求的服务器,它也可以通过在送出信息内容前对其进行审查,从而在因特网和专用网之间提供防火墙安全性PSP Platform Service Provider平台服务供应商Telnet远程登录UNINET中国联通互联网URL Uniform Resource Locator网站地址VST Virtual Space Teleconferencing虚拟空间会议Web环球网WWW World Wide Web万维网技术标准Big5台湾流行的汉字内码标准CMM Capacity Maturity Model 软件过程能力成熟度模型,一种评测软件开发能力与质量的方法DES Data Encryption Standard数据加密标准GB国家标准汉字内码GMT Greenwich Mean Time格林威治时间IEEE Institution of Electrical andElectronics电气和电子工程师学会(美国)ISO International StandardizationOrganization国际标准化组织ISO 9000一种质量管理标准JPEG Joint Photographic ExpertsGroup联合图象专家组规范,一种图象压缩标准MP3MPEGAudioLayer3一种音乐格式,它能够将CD品质的数字录音压缩成原来的1/12大小,令其容易存储和在网上传输MPEG Motion Picture Experts Group 一种活动图象和声音的压缩标准,其中MPEG1是最常用的,为VCD所采用,MPEG2则为DVD所采用Open System Interconnect 开放系统互连,用于各种型号计算机OSI Reference Model之间通讯的国际标准PCMCIA Personal Computer MemoryCard International Association个人计算机存储卡国际协会PnP Plug and Play即插即用PPP Peer-Peer Protocol端对端协议SMTP Simple Message TransferProtocol用于电子邮件的传输协议TCP/IP Transfer ControlProtocol/Internet Protocol传输控制协议/Internet协议,目前Internet上正使用着的、最流行的网际互联协议WAP Wireless Application Protocol 无线应用协议,使移动电话能访问Internet的协议X.25用于计算机接入分组交换网的标准X.400用于国际电子函件分布系统的标准X.500Internet上一种目录服务标准,用于查询检索信息方面多媒体AOD Audial-On-Demand音频点播CD Compact Disk光盘DAB数字音频广播DVB,DVB-T数字视频广播,地面数字视频广播DVD Digital Video Disk数字化视频光盘LD Laser Disc激光视盘VCD Video Compact Disk视频高密光盘VOD Video-On-Demand视频点播技术应用BOM Bill of Material 物料清单--指用数据格式来描述产品结构的文件BPI Business ProcessImprovement业务流程改进BPR Business ProcessReengineering企业流程再造CAD Computer Aided Design计算机辅助设计CAE Computer Aided Education计算机辅助教育CAI Computer Aided Instruction计算机辅助教育CAM Computer Aided Management计算机辅助管理CAPP Computer Aided Processplanning计算机工艺辅助设计CAQ computer Aided Quality计算机辅助质量管理CE Concurrent Engineering 并行工程--是对产品及其相关过程(包括制造过程和支持过程)进行并行、集成设计的一种系统化工作模式CIMS Computer IntegratedManufacture System计算机集成制造系统EAI Enterprise ApplicationIntegrated企业应用集成DSS Decision Support System 决策支持系统--是围绕着决策行动主体进行的支持管理人员进行非程序性决策的一种信息系统EAM Enterprise Asset Management企业资产管理EMS Electronic MailService/Express Mail Service电子邮件服务/邮政特快专递FMS Flexible Manufacturing System柔性制造系统GIS Geographic Information 地理信息系统SystemGT Group Technology 成组技术--成组技术的核心原理是把尺寸、形状、工艺相近似的零件组成一个零件组,按零件组制订工艺进行生产制造,这样就扩大了批量,减少了品种,便于采用高效率的生产方法,从而提高了劳动生产率。

品质专用中英文对照

品质专用中英文对照

品質人員名稱類QC quality control 品質管理人員FQC final quality control 終點品質管制人員IPQC in process quality control 制程中的品質管制人員OQC output quality control 最終出貨品質管制人員IQC incoming quality control 進料品質管制人員TQC total quality control 全面質量管理POC passage quality control 段檢人員QA quality assurance 質量保證人員OQA output quality assurance 出貨質量保證人員QE quality engineering 品質工程人員品質保證類FAI first article inspection 新品首件檢查FAA first article assurance 首件確認TVR tool verification report 模具確認報告3B 3B 模具正式投產前確認CP capability index 能力指數CPK capability index of process 模具製程能力參數SSQA standardized supplier quality 合格供應商品質評估OOBA out of box audit 開箱檢查QFD quality function deployment 品質機能展開FMEA failure model effectiveness analysis 失效模式分析 8 disciplines 8項回復內容FA final audit 最後一次稽核CAR corrective action request 改正行動要求corrective action report 改正行動報告FQC運作類AQL Acceptable Quality Level 運作類允收品質水準S/S Sample size 抽樣檢驗樣本大小ACC Accept 允收REE Reject 拒收CR Critical 極嚴重的MAJ Major 主要的MIN Minor 輕微的AOQ Average Output Quality 平均出廠品質AOQL Average Output Quality Level 平均出廠品質Q/R/S Quality/Reliability/Service 品質/可靠度服務MIL-STD Military-Standard 軍用標準S I-S IV Special I-Special IV 特殊抽樣水準等級P/N Part Number 料號L/N Lot Number 特采AOD Accept On Deviation 特采UAI Use As It 首件檢查報告FPIR First Piece Inspection Report 百萬分之一PPM Percent Per Million 批號制程統計品管專類SPC Statistical Process Control 統計製程管制SQC Statistical Quality Control 統計品質管制R Range 全距AR Averary Range 全距平均值UCL Upper Central Limit 管制上限LCL Lower Central Limit 管制下限MAX Maximum 最大值MIN Minimum 最小值GRR Gauge Reproducibility&Repeatability 量具之再制性及重測性判斷量可靠與否DIM Dimension 尺寸DIA Diameter 直徑FREQ Frequency 頻率N Number 樣品數其它品質術語類QCC Quality Control Circle 品質圈QIT Quality Improvement Team 品質改善小組PDCA Plan Do Check Action 計劃執行檢查總結ZD Zero Defect 零缺點QI Quality Improvement 品質改善QP Quality Policy 目標方針TQM Total Quality Management 全面品質管理MRB Material Reject Bill 退貨單LQL Limiting Quality Level 最低品質水準RMA Return Material Audit 退料認可QAN Quality Amelionrate Notice 品質改善活動ADM Absolute Dimension Measuremat 全尺寸測量QT Quality Target 品質目標7QCTools 7 Quality Controll Tools 品管七大手法通用之件類ECN Engineering Change Notes 工程變更通知(供應商)ECO Engineering Change Order 工程改動要求(客戶)PCN Process Change Notice 工序改動通知PMP Product Management Plan 生產管制計劃SIP Specification In Process 製程檢驗規格SOP Standard Operation Procedure 製造作業規範IS Inspection Specification 成品檢驗規範BOM Bill Of Material 物料清單PS Package Specification 包裝規範SPEC Specification 規格DWG Drawing 圖面系統文件類QC Quality System 品質系統ES Engineering Standarization 工程標準CGOO China General PCE龍華廠文件H Huston (美國)休斯敦C Compaq (美國)康伯公司C China 中國大陸A Assembly 組裝(廠)S Stamping 沖壓(廠)P Painting 烤漆(廠)I Intel 英特爾公司T TAIWAN 臺灣IWS International Workman Standard 工藝標準ISO International Standard Organization 國際標準化組織GS General Specification 一般規格CMCS C-China M-Manufact C-Compaq S-Stamping Compaq產品在龍華衝壓廠製造作業規範CQCA Q-Quality A-Assembly Compaq產品在龍華組裝廠品管作業規範CQCP P-Painting Compaq產品在龍華烤漆廠品管作業規範部類PMC Production & Material Control 生產和物料控制PPC Production Plan Control 生產計劃控制MC Material Control 物料控制ME Manafacture Engineering 製造工程部PE Project Engineering 產品工程部A/C Accountant Dept 會計部P/A Personal & Administration 人事行政部DC Document Center 資料中心QE Quality Engineering 品質工程(部)QA Quality Assurance 品質保證(處)QC Quality Control 品質管制(課)PD Product Department 生產部LAB Labratry 實驗室IE Industrial Engineering 工業工程R&D Research & Design 設計開發部P Painting 烤漆(廠)A Asssembly 組裝(廠)S Stamping 沖壓(廠)生產類PCS Pieces 個(根,塊等)PRS Pairs 雙(對等)CTN Carton 卡通箱PAL Pallet/skid 棧板PO Purchasing Order 采購訂單MO Manufacture Order 生產單D/C Date Code 生產日期碼ID/C Identification Code (供應商)識別碼SWR Special Work Request 特殊工作需求L/N Lot Number 批號P/N Part Number 料號其它OEM Original Equipment Manufacture 原設備製造PCE Personal Computer Enclosure 個人電腦外設PC Personal Computer 個人電腦CPU Central Processing Unit 中央處理器SECC SECC` 電解片SGCC SGCC 熱浸鍍鋅材料NHK North of Hongkong 中國大陸PRC People's Republic of China 中國大陸U.S.A the United States of America 美國A.S.A.P As Soon As Possible 盡可能快的E-MAIL Electrical-Mail 電子郵件N/A Not Applicable 不適用QTY Quantity 數量VS 以及REV Revision 版本JIT Just In Time 零庫存I/O Input/Output 輸入/輸出OK Ok 好NG Not Good 不行,不合格C=0 Critical=0 極嚴重不允許ESD Electry-static Discharge 靜電排放5S 希臘語整理,整頓,清掃,清潔,教養ATIN Attention 知會CC Carbon Copy 副本復印相關人員APP Approve 核準,認可,承認CHK Check 確認AM Ante Meridian 上午PM Post Meridian 下午CD Compact Disk 光碟CD-ROM Compact Disk Read-Only Memory 只讀光碟FDD Floppy Disk Drive 軟碟機HDD Hard Disk Drive 碟碟機REF Reference 僅供參考CONN Connector 連接器CAV Cavity 模穴CAD Computer Aid Design 計算機輔助設計ASS'Y Assembly 裝配,組裝MAT'S Material 材料IC Integrated Circuit 集成電路T/P True Position 真位度TYP Type 類型WDR Weekly Delivery Requitement 周出貨需求C?T Cycle Time 制程周期L/T Lead Time 前置時間(生產前準備時間)S/T Standard Time 標準時間P/M Product Market 產品市場3C Computer,Commumcation,Consumer electronic's 消費性電子5WIH When,Where,Who,What,Why,How to5M Man,Machine,Material,Method,Measurement4MIH Man,Materia,Money,Method,Time 人力,物力,財務,技術,時間(資源) SQA Strategy Quality Assurance 策略品質保證DQA Desigh Quality Assurance 設計品質保證MQA Manufacture Quality Assurance 製造品質保證SSQA Sales and service Quality Assurance 銷售及服務品質保證LRR Lot Rejeet Rate 批退率BS Brain storming 腦力激蕩EMI Electronic Magnetion Inspect 高磁測試FMI Frequency Modulatim Inspect 高頻測試B/M Boar/Molding(flat cable)C/P Connector of PCA/P AssemblySPS Switching power supply 電源箱DT Desk Top 臥式(機箱)MT Mini-Tower 立式(機箱)DVD Digital Vedio DiskVCD Vdeio Compact DiskLCD Liquid Crystal DisplayCAD Computer AID DesignCAM Computer AID ManufacturingCAE Computer AID EngineeringABIOS Achanced Basic in put/output system 先進的基本輸入/輸出系統CMOS Complemeruary Metoll Oxide Semiconductor 互補金屬氧化物半導體PDA Personal Digital Assistant 個人數字助理IC Integrated Circuit 集成電路ISA Industry Standard Architecture 工業標準體制結構MCA Micro Channel Architecture 微通道結構EISA Extended Industry Standard Architecture 擴充的工業標準結構SIMM Single in-line memory module 單項導通匯流組件DIMM Dual in-line Memory Module 雙項導通匯流組件LED Light-Emitting Diode 發光二級管FMEA Failure Mode Effectivenes 失效模式分析W/H Wire Harness 金屬線緒束集組件F/C Flat Calle 排線PCB Printed Circuit Board 印刷電路板CAR Correction Action Report 改善報告NG Not Good 不良WPR Weekly Delivery Requirement 周出貨要求PPM Parts Per Million 百萬分之一TPM Total Production Maintenance 全面生產保養MRP Material Requiremcnt Planning 物料需計劃OC Operation System 作業系統TBA To Be Design 待定,定缺D/C Drawing ChangeP/P Plans & ProceduneEMI Electrical-Music Industry 電子音樂工業RFI Read Frequency Input 讀頻輸入MMC Maximum Material ConditionMMS Maximum Material SizeLMC Least Material ConditionLMS Least Material Size。

企业职位大全

企业职位大全

1高层管理职位1.总经理(总裁)2.副总经理3.人力资源总监4.财务总监(CFO)5.营销总监6.市场总监(CMO)7.销售总监8.生产总监9.运营总监10.技术总监(CTO)11.总经理助理2人力资源管理职位1.人力资源经理2.人力资源助理3.人力资源专员4.招聘主管5.员工培训与发展主管6.培训师7.培训专员8.绩效考核主管9.薪资福利主管10.薪酬分析师11.人力资源信息系统经理12.员工记录经理3财务与会计职位1.财务经理2.财务助理3.预算主管4.财务成本控制主管5.应收账款主管7.资金主管8.投资主管9.融资主管10.财务分析师11.预算专员12.投资分析专员13.资本市场分析专员14.核算专员15.税务专员16.出纳员17.簿记员18.收银员4行政管理职位1.行政经理2.行政助理4.总经理秘书5.秘书6.翻译7.档案员8.前台9.行政事务管理专员10.物业主管11.法律事务主管12.法律事务助理13.法律顾问14.公司律师15.战略部主管5市场营销职位1.市场部经理2.市场助理3.客户开发主管4.客户维护主管5.客户关系主管6.市场调研主管7.市场研究专员8.市场策划主管9.市场拓展经理10.促销主管11.广告企划主管12.媒介推广专员13.公关主管14.公关助理15.客户代表16.美工17.产品主管18.产品助理6销售职位1.销售部经理2.销售助理3.大区经理4.办事处经理5.店面经理6.渠道经理7.销售代表8.销售统计员9.电话销售代表7生产职位1.厂长2.副厂长3.生产主管4.制造部经理5.工程技术部经理6.生产工程师7.工业工程师8.供应商管理工程师9.产品设备工程师10.车间主任11.生产调度员12.质量控制主管13.质检员14.质量安全技工8物流职位1.采购经理2.采购工程师3.采购专员4.物流经理5.物流规划专员6.材料管理专员7.仓储主管8.仓库管理员9.商品保管员10.货运主管11.商品储运员12.商品护运员13.理货员9技术职位1.技术主管2.技术支持经理3.研发主管4.产品规划主管5.产品开发工程师6.产品开发技术员7.产品质量工程师8.质量工程师10.安全员11.包装设计师12.材料工程师13.模具工程师14.机械工程师15.工艺工程师16.电气工程师17.电子工程师18.食品工程师19.环境检测工程师20.环境治理工程师21.通讯测试工程师22.通讯工程师23.硬件工程师24.部件工程师26.系统开发工程师27.计算机管理员28.软件工程师29.测试主管30.系统测试工程师31.软件测试工程师32.数据库工程师33.高级程序员34.系统应用工程师35.系统分析员36.系统操作员37.网络工程师38.网络管理工程师39.网络管理员40.网络安全工程师41.工程技术项目经理42.质量监督工程师43.质量监督员44.安全监督员45.检测员46.造价工程师47.建筑设计师48.土木建筑工程师49.结构设计工程师50.道路桥梁工程师51.园林工程师52.城镇规划设计工程师53.水利水电工程师54.给排水工程师55.暧通工程师56.网站主编10其他职位1.项目经理2.项目助理3.审计主管4.审计员5.统计分析专员6.管理顾问7.人力资源顾问8.行业顾问9.软件咨询顾问10.电子商务高级顾问11.体系认证咨询师12.房地产营销专家13.房地产经纪人14.健身教练15.大堂经理16.餐厅经理17.食品质量控制主管各类职位名称大全(中英文对照) MarketingandSales(市场与销售部分)Vice-PresidentofSales销售副总裁SeniorCustomerManager高级客户经理SalesManager销售经理RegionalSalesManager地区销售经理MerchandisingManager采购经理SalesAssistant销售助理WholesaleBuyer批发采购员Tele-Interviewer电话调查员RealEstateAppraiser房地产评估师MarketingConsultant市场顾问MarketingandSalesDirector市场与销售总监MarketResearchAnalyst市场调查分析员Manufacturer'sRepresentative厂家代表DirectorofSubsidiaryRights分公司权利总监SalesRepresentative销售代表AssistantCustomerExecutive客户管理助理MarketingIntern市场实习MarketingDirector市场总监InsuranceAgent保险代理人CustomerManager客户经理Vice-PresidentofMarketing市场副总裁RegionalCustomerManager地区客户经理SalesAdministrator销售主管TelemarketingDirector电话销售总监AdvertisingManager广告经理TravelAgent旅行代办员Salesperson销售员Telemarketer电话销售员SalesExecutive销售执行者MarketingAssistant市场助理RetailBuyer零售采购员RealEstateManager房地产经理RealEstateBroker房地产经纪人PurchasingAgent采购代理ProductDeveloper产品开发MarketingManager市场经理AdvertisingCoordinator广告协调员AdvertisingAssistant广告助理AdCopywriter(DirectMail)广告文撰写人CustomerRepresentative客户代表ComputersandMathematics(计算机部分) ManagerofNetworkAdministration网络管理经理MISManager电脑部经理ProjectManager项目经理TechnicalEngineer技术工程师DevelopmentalEngineer开发工程师SystemsProgrammer系统程序员Administrator局域网管理员OperationsAnalyst操作分析ComputerOperator电脑操作员ProductSupportManager产品支持经理ComputerOperationsSupervisor电脑操作主管DirectorofInFORMationServices信息服务主管SystemsEngineer系统工程师HardwareEngineer硬件工程师ApplicationsProgrammer应用软件程序员InFORMationAnalyst信息分析LANSystemsAnalyst系统分析Statistician统计员HumanResources(人力资源部分)DirectorofHumanResources人力资源总监AssistantPersonnelOfficer人事助理CompensationManager薪酬经理EmploymentConsultant招募顾问FacilityManager后勤经理JobPlacementOfficer人员配置专员LaborRelationsSpecialist劳动关系专员Recruiter招聘人员TrainingSpecialist培训专员Vice-PresidentofHumanResources人力资源副总裁AssistantVice-PresidentofHumanResources人力资源副总裁助理PersonnelManager职员经理BenefitsCoordinator员工福利协调员EmployerRelationsRepresentative员工关系代表PersonnelConsultant员工顾问TrainingCoordinator培训协调员ExecutiveandManagerial(管理部分)ChiefExecutiveOfficer(CEO)首席执行官DirectorofOperations运营总监Vice-President副总裁BranchManager部门经理RetailStoreManager零售店经理HMOProductManager产品经理OperationsManager操作经理AssistantVice-President副总裁助理FieldAssuranceCoordinator土地担保协调员ManagementConsultant管理顾问DistrictManager市区经理HospitalAdministrator医院管理Import/ExportManager进出口经理InsuranceClaimsController保险认领管理员ProgramManager程序管理经理InsuranceCoordinator保险协调员ProjectManager项目经理InventoryControlManager库存管理经理RegionalManager区域经理ChiefOperationsOfficer(COO)首席运营官GeneralManager总经理ExecutiveMarketingDirector市场行政总监Controller(International)国际监管FoodServiceManager食品服务经理ProductionManager生产经理Administrator医疗保险管理PropertyManager房地产经理ClaimsExaminer主考官Controller(General)管理员ServiceManager服务经理ManufacturingManager制造业经理VendingManager售买经理TelecommunicationsManager电信业经理TransportationManager运输经理WarehouseManager仓库经理AssistantStoreManager商店经理助理。

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1.1. General rulesAll exhibitors must abide by the site regulations including the closing hours of the exhibition. Exhibitors must not enter the exhibition halls before 12 noon on 18 September 2011.Please refer to the show schedule in the General Information, for the exhibition opening and closing time. Electricity will be connected and disconnected accordingly.We strongly advise against bringing children under the age of 12 to the show.The use of any means of transport (bikes, scooters, etc.) in the exhibition halls is strictly forbid-den.1.2. PricesAll prices specified in the exhibitor manual exclude VAT at 19.6 %.1.3. Fire regulationsSmoking inside the exhibition halls is strictly prohibited except in the designated areas.1.4. InsuranceThe exhibitors are insured by the organiser for civil liability, which means that they are insured for any damage or loss caused to third parties. The organiser accepts no financial or legal lia-bility for any form of risks involving the exhibitor’s personal belongings and exhibits. Exhibitors must take out their own insurance policy if they wish to insure against these risks.In the event of damage or loss, the exhibitor must inform the insurance company thereof within three days from the date on which they become aware of such damage or loss.1.5. Photography, video shooting and sound recordingNo photography, video recording, or sound recording is allowed in the exhibition halls.All forms of video or sound recordings of exhibition samples or booths (including sketches) are prohibited.In the event of breaches of the above, Messe Frankfurt France S.A.S. shall be entitled to confis-cate sketches as well as exposed or recorded material.The exhibitor is, however, entitled to make video and sound recordings or drawings of his own stand and exhibits during the fair.The exhibitor permits the organiser to take photos of any stand. The photos must be taken by the organiser himself or by the official fair photographer and will be used as information for visitors and for the promotional purposes of the Messe Frankfurt Group.1.1. General rulesAll exhibitors must abide by the site regulations including the closing hours of the exhibition.Exhibitors must not enter the exhibition halls before 12 noon on 18 September 2011.Please refer to the show schedule in the General Information, for the exhibition opening and closing time. Elec-tricity will be connected and disconnected accordingly.We strongly advise against bringing children under the age of 12 to the show.The use of any means of transport (bikes, scooters, etc.) in the exhibition halls is strictlyforbidden.1.2. PricesAll prices specified in the exhibitor manual exclude VAT at 19.6 %.1.3. Fire regulationsSmoking inside the exhibition halls is strictly prohibited except in the designated areas.1.4. InsuranceThe exhibitors are insured by the organiser for civil liability, which means that they are insured for any damage or loss caused to third parties. The organiser accepts no financial or legalliability for any form of risks involving the exhibitor’s personal belongings and exhibits.Exhibitors must take out their own insurance policy if they wish to insure against these risks.In the event of damage or loss, the exhibitor must inform the insurance company thereof within three days from the date on which they become aware of such damage or loss.1.5. Photography, video shooting and sound recordingNo photography, video recording, or sound recording is allowed in the exhibition halls.All forms of video or sound recordings of exhibition samples or booths (including sketches) are prohibited.In the event of breaches of the above, Messe Frankfurt France S.A.S. shall be entitled toconfiscate sketches as well as exposed or recorded material.The exhibitor is, however, entitled to make video and sound recordings or drawings of his own stand and exhi-bits during the fair.The exhibitor permits the organiser to take photos of any stand. The photos must be taken by the organiser himself or by the official fair photographer and will be used as information for visitors and for the promotional purposes of the Messe Frankfurt Group.11.6. Delivery and dismantlingThe organiser shall not accept any responsibility for the delivery and dispatching of exhibition material.Carriers may enter the exhibition halls between 7 am and 12 noon on 18 September 2011 (no entry for carriers after 12 noon) and between 8 am and 9:30 am on 19 September 2011. From 20 to 22 September 2011, deliveries may be made between 8:30 am and 9:30 am.On the last day of the exhibition, carriers will not be permitted to enter the exhibition halls before 4:30 pm. Removal of exhibition material starts at 4:30 pm on 22 September 2011. The organiser will not be liable for any loss or damage to exhibition or booth material left behind at the exhibition venue.During the dismantling, all objects left on the exhibition-site and not claimed from the Organiser’s Office before 6:30 pm will be destroyed one week after the end of the exhibition. Within that period, all objects claimed at the office of Messe Frankfurt France S.A.S. will be sent back to the exhibitor at his expense and risk.On the last day of the exhibition, exhibitors are not permitted to start dismantling their booth before 4:30 pm. Exit forms will not be delivered.1.7. NoiseThe noise level arising from presentations in the booth, etc. should be maintained below 30 dB. In the event of complaints by other exhibitors, the organiser has the right to prohibit any activities that cause noise or disturbance.1.8. CateringRegarding safety and health rules and regulations, exhibitors can only use the caterer approved by the operator of the exhibition venue.No other food supplier will be authorised to deliver any food to the exhibition ground. Elior is the approved caterer on-site.1.9. Exhibitors listingThe organiser will in no case be held liable for any omissions, reproduction errors, misprints or other which may occur in the lists of exhibitors that the organiser may be led to publish.As of 7 June 201122. Technical Information2.1. SecurityPlease note the following security regulations for booth decoration:• Materials used for curtains and hangings must be fire resistant, non-inflammable or hardly inflammable.• Elements for decoration must be made of materials that are either fire resistant or non-inflam-mable or must be treated to ensure they are fire-proof.• There are no requirements for exhibits in terms of fire reaction.2.2. Booth design*All booths will be designed by the official contractor.The exhibitors can close up to 50% maximum of the front side of their booth.Exhibitors with a corner booth will be allowed to close off the side of the booth for free, adding low panels:• 100 W x 160 H cm for fabrics and denim booth construction.• 100 W x 100 H cm for apparel sourcing construction.2.3. Booth equipment*No item included in the standard equipment can be exchanged for different items. Even if the exhibitor does not need all of those items, no refund will be given.2.4. Additional booth equipmentExhibitors wishing to add additional equipment (e.g. chairs or rods) and those who need addi-tional booth equipment for their modified booth layout (see § 2.6.) should refer to the Messe Frankfurt France exhibitor website, section «Your equipment».Please note the following deadlines:• Until 28 July 2011, additional booth equipment orders will be accepted.• From 29 July to 19 August 2011, a 30% charge will be added to the additional equipment invoice.• From 20 August 2011, onward, no further orders for additional booth equipment will be accepted.Cancellation of orders will only be accepted until 19 August 2011.Please note that changes made or additional equipment added to the booth layout by hand will not be considered. All orders must be made on the Messe Frankfurt France exhibitor website.Important: Requests for refunds for non-delivered equipment must be made immediately to the Technical Desk. Claims will not be accepted after the Technical Desk has closed (Monday 19 September 2011 at 11 am).2.5. On-site ordersThose exhibitors who miss the deadline of the 19 August 2011 will be able to order additional booth equipment on-site at the Additional Orders Desk on 18 September 2011 from 12 noon to 7 pm, and on 19 September 2011 from 8 am to 11 am.However, a 30% extra charge will be invoiced when placing the order.Important: cancellation of orders will not be accepted on-site.2.6. Booth alterations*Exhibitors wishing to remove or change the location of any standard facility (rod, chair, etc.) in their booth should contact the organiser before the following dates:• Any notifications concerning booth layout changes will be accepted until the 19 August 2011. • From 20 August 2011 onward, no more layouts will be sent to exhibitors and no requests for booth alteration can be considered.Only 2 booth layouts will be sent to you free of charge. Each additional layout: 80€ excl. tax. Only the booth structure (e.g. lights, rods or panels) is affected by the changes to the booth sketch. Therefore, furniture will not be shown on the sketch.Reminder: High booth panels cannot be removed:• 2.50 m H for fabrics booth construction.• 2.25 m H for denim and apparel sourcing booth construction.Please note that those rules marked with * do not apply to raw space exhibitors.2.7. Booth decorationAll decorative items must be placed inside the booth.Supports, decoration or swatches affixed to the low partition walls (1.60 m H for fabrics and denim booth construction, 1.00 m H for apparel sourcing booth construction) may not extend beyond 10 cm outside the booth.Exhibitors can only use their partition wall areas for their decoration.No decoration must be attached to the ceiling element.The pillars outside the booth cannot be used for decoration.No decoration will be permitted in the aisle and on the fascia and sign boards.Reminder: posters, other decorative items and traces of scotch tape must be removed after the fair.2.8. DamagesThe organiser guarantees that the booth panels will be delivered in good condition. Exhibitors are therefore liable for any damage caused to their booth structure. However, if damage is ascertained on arrival, this must immediately be reported to the Technical Desk.No nails, screws or staples may be driven into the wall elements. The use of self-adhesive posters adhered over the entire surface of the wall panels, foam adhesive tape and silver foil is prohibited.To avoid damage to the booth structure from decoration work, you are strongly advised to use the adhesive tape exclusively that will be handed out free of charge on the move-in day at the Welcome Desk. The use of any other adhesive tape can damage the booth panels.4。

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