NACE0.33M25V10X8TR13F中文资料

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罗密C系列重型CNC纵轴机头产品说明书

ROMI C SERIESHEAVY DUTY CNC LATHESROMI Industrial Complex, in Santa Bárbara d’Oeste - SP, BrazilROMI: Producing high quality technology since 1930.Since the beginning, Romi has been recognized for its focus on creating products and innovative solutions which has guaranteed its technological leadership among large manufacturers of machine tools. Romi’s industrial complex is among the most modern and productive sites in the fields of machine tools, plastic processing machines, and high quality cast iron parts.Continuous investments in Research & Development result in products with state-of-the-art technology.The technology applied to Romi machines offers highly reliable products, with high accuracy, efficiency and great flexibility for several types of machining processes.Romi R&D is focused on increasing competitiveness for its customers. Present throughout Brazil and in over 60 countries.Romi covers all domestic territory through its sale subsidiaries network fully prepared to support customers by supplying an extensive range of services from marketing to after sales assistance.The international market is covered by Romi’s subsidiaries which are located in the United States, Mexico, Europe, and by its many dealers located in strategic logistic centers around the globe that are capable of serving customers in 5 continents.23Flexibility for several levels of application with assured productivity.CNC lathes from ROMI C Series are machines with great flexibility for machining several types of parts, with great level of power, quick movements and machining accuracy.They are targeted on oil & gas, suggar mill, naval, steel mills and energy segments of heavy industries. Robust structure with monoblock cast iron bed and outlets for chips and coolant fluid.| ROMI C 1100H | ROMI C 1290H | ROMI C 1300H | ROMI C 1300HBB | ROMI C 1600H | ROMI C 1800H | ROMI C 2100H | ROMI C 2200H | ROMI C 2600H•Headstock ASA A2-20”•Spindle thru-hole: Ø 375 mm (14.8)•Swing over bed: 1,110 mm (44”) (ROMI C 1100H)1,330 mm (52”) (ROMI C 1290H)•Main motor: 72 hp / 53 kW•T ailstock with motorized displacement, manual driven quill withbuilt-in live center and compensation by plate springs with monitoringsystem by load sensors of the thrust force and manual lubrication•CNC Siemens 840D with high performance and reliability ROMI C 1100H / C 1290H45• Headstock ASA A2-20”, Ø 305 mm (12”) thru-hole• Headstock Flat Nose, Ø 575 mm (23”) thru-hole (ROMI C 1300HBB - Big Bore)• Swing over bed: 1,300 mm (51”) (ROMI C 1300H / C 1300HBB) 1,600 mm (63”) (ROMI C 1600H) • Main motor (30 min. rating): 114 hp / 84 kW • Tailstock with motorized displacement, manual driven quill with built-in live center and compensation by plate springs with monitoring system by load sensors of the thrust force • CNC Siemens 840D with high performance and reliability ROMI C 1300H / C 1600H / C 1300HBB6ROMI C 1800H / C 2100H• Headstock ASA A2-20”, Ø 305 mm (12”) thru-hole • Swing over bed: 1,800 mm (71”) (ROMI C 1800H)2,150 mm (85”) (ROMI C 2100H)• Main motor (30 min. rating): 114 hp / 84 kW• Tailstock with motorized displacement, manual driven quill with built-in live center and compensation by plate springs with monitoring system by load sensors of the thrust force • CNC Siemens 840D with high performance and reliability7ROMI C 2200H / C 2600H• Headstock ASA A2-20”, Ø 305 mm (12”) thru-hole • Swing over bed: 2,100 mm (83”) (ROMI C 2200H)2,580 mm (102”) (ROMI C 2600H)• Main motor (30 min. rating): 155 hp / 114 kW• Tailstock with motorized displacement, manual driven quill with built-in live center and compensation by plate springs with monitoring system by load sensors of the thrust force • CNC Siemens 840D with high performance and reliabilityROMI C 1100Hbed.BEDRobust monoblock bed made of gray cast iron. Offers great rigidity,absorbing high machining efforts and vibration, assuring stabilityand accuracy at full power operation. The bed is a base forcomponents supporting and it is fixed on the foundation by levellingand alignment elements.GuidesThey constitute a self-adjusting system, assuring permanent contactof cross slide over the bed.ROMI C 1300H Bed machining89ROMI C 2200H Bed machiningROMI C 2200H bedCast iron robust housing, internally ribbed to absorb high efforts of heavy machining operations. Spindle is held by Timken precision bearings. The high loading capacity of bearings provides rigidity and high vibration absorption under the most severe cutting conditions, obtaining parts with excellent geometric accuracy.It is powered by AC motor by pulleys and poly-V belt, with high torque and continuously variable speeds.Headstock lubrication systemEnsures that all components of the headstock are constantly lubricated with an ideal working temperature. The system has an air / oil heat exchanger with thermostat to ensure temperatures lower than 40 degrees. It has dosage system and digital flow sensors, beyond of magnetic elements and suction filter, in order to protect bearings and pump gears against the contamination with particles.ROMI C 1100H / C 1290HGears from the headstock transmission system with hardenedand ground teeth, designed to withstand the high efforts of themost severe working conditions.1011TAILSTOCKThe manually driven quill has a built-in live center with high precision bearings. It has a monitoring system by load sensors of the thrust force. Its displacement is driven by gearmotor and pinion/rack system.Tailstock displacement systemTailstock - ROMI C 2200H / C 2600H, with plataform for operator.Offers high load capacity, rigidity and vibration absorption.ROMI C 1100H / C 1290H TailstockLongitudinal saddleDriven by servo motor through a pre-loaded double pinion system(Redex) that operates on the bed precision racks (Güdel), withpositioning reading through linear scale (Heidenhain) (ROMI C 1800H /ROMI C 2100H / ROMI C 2200H / ROMI C 2600H / and ROMI C 1300H/ ROMI C 1600H from 6.5 to 12.5 m (256” to 492”) between centers).Driven by servo motor through precision recirculating ball screw(ROMI C 1300H / ROMI C 1600H with 3.5 m (138”) and 5 m (197”)between centers). It has guideways with low friction coefficient material that offers high sliding performance (ROMI C 1100H / C 1290H / C1300H / C 1600H / C 1300HBB; and ROMI C 1800H / C 2100H / C 2200H / C 2600H with bronze coating).1213RESTSSteady rest C type (optional)T able rest (optional)Equipped with rollers and manual diameter adjustment.It has a drag system via longitudinal saddle for its positioning.Steady rest U type (optional)It has 5 cartridges with rollers for diameter adjustment. The steady rest bodydisplacement is done by the longitudinal saddle.144 - station square manual turret4 - station square vertical turret, electrically drivenElectrical turret for driven tools with Y axis (optional)12 station tool disk VDI-60 for driven tools, 10 hp (7.5 kW) 2,500 rpm (max.).TURRETSTurrets (optionals)The heavy duty CNC lathes ROMI C Series are equipped with different robust turrets for several types of applications.BORING BARMilling Headstock with Y axis (optional) Spindle taper ISO-50, 16 hp / 12 kW, 2,500 rpm (max.)Milling Headstock (optional)Spindle taper ISO-50, 10 hp / 7.5 kW, 2,500 rpm (max.)Boring bar holderSystem with double support for thebar. Its robust structure offers highrigidity and vibration absorptionduring machining operations at fullpower.1516PLATFORMC axis (optional)Mechanical system withindependent servomotor, which is coupled to the machine spindle. Allows positioning the spindle at any angle, as well as perform interpolation operations in machining processes.PlatformCNC lathes ROMI C 1800H / ROMI C 2100H / ROMI C 2200H and ROMI C 2600H have aplatform for the operator, providing easy access to the operator‘s panel, turret workpiece and also for other machine setup operations. In order to guarantee operator safety, the platform is equipped with front cover, door viewer protection and electric locks.CNCTechnology, high performance and reliabilityCNC horizontal lathes from ROMI C Series are equipped with CNC Siemens Sinumerik 840D which,offers the user very ease programming system.CNC Siemens Sinumerik 840D offers 21.5” touch screen monitor, USB port and Ethernet interface for factory network, bringinga great flexibility for loading programs and parameters.Conversational programming offered is the programGUIDE CNC Siemens Sinumerik 840D programGUIDE facilitates programcreation thru the input of data in user-friendly screens and animated elements which helps in unequivocal data input. Programming is simplified thru cycles of drilling, boring, tapping and milling cycles and free-shape profile cuts.TOUCHSCREEN17(*) Other characteristics like distance between centers, maximum admissible weight beetween centers, power and rotation can be offered under request (**) Weight increase for each 1,500 mm (59”) bed segment = 2,500 kg (5,500 lbs) (ROMI C 1100H / C 1290H) Weight increase for each 1,500 mm (59”) bed segment = 2,500 kg (5,500 lbs) (ROMI C 1300H / C 1600H) Weight increase for each 1,500 mm (59”) bed segment = 4,000 kg (8,800 lbs) (ROMI C 1800H / C 2100H) Weight increase for each 2,000 mm (79”) bed segment = 6,000 kg (13,200 lbs) (ROMI C 2200H / C 2600H)1819• Articulated and sliding operationpanel (except ROMI C 1100H / C1290H)• Centralized lubrication system with line filter oil and level sensor (PDI)• Chip conveyor interface (except ROMI C 1100H / C 1290H)• Coolant system with motor pump 10 l/min, 2 bar, 0.75hp / 0.56kW (ROMI C 1300H / C 1600H / C 1800H / C 2100H / C 2200H / C 2600H)• Coolant system with two coolant pumps for choice 2 bar or 7 bar (ROMI C 1100H / 1290H)• 12-station horizontal electrical turret, VDI-60 for driven tools (tool holders and reduction sleeves not included) (ROMI C 1600H)• 3-jaw independent chuck, cast iron ASA A2-20” (flange not included): - Ø 630 mm, thru-hole Ø 252 mm (max. 500 rpm) ROMI C 1100H / 1290H - Ø 800 mm, thru-hole Ø 320 mm (max. 300 rpm) ROMI C 1100H / 1290H - Flange for 3-jaw universal chuck A2-20” Ø 630 ou Ø 800 mm• 4 jaw independent rear chuck steel body ASA A2-20”:- Ø 720 mm, thru-hole Ø 375 mm (max. 873 rpm) ROMI C 1100H• 4-jaw independent chuck, steel body ASA A2-20”:- Ø 700 mm (max. 873rpm) ROMI C 1100H / 1290H- Ø 720 mm, thru-hole Ø 375 mm (max. 873rpm) ROMI C 1100H / 1290H - Ø 800 mm (max. 764 rpm) ROMI C 1100H / 1290H / 1300H / 1600H / 1800H- Ø 900 mm (max. 679 rpm) ROMI C 1100H / 1290H- Ø 1000 mm (max. 611 rpm)ROMI C 1100H / 1290H / 1300H / 1600H / 1800H / 2100H / 2200H / 2600H- Ø 1100 mm (max. 509 rpm) ROMI C 1290H - Ø 1200 mm (max. 509 rpm) ROMI C 1300H / 1600H / 1800H / 2100H / 2200H / 2600H - Ø 1400 mm (max. 437 rpm) ROMI C 1800H / 2100H / 2200H / 2600H• Electrical installation for 380 V or 400V 50 / 60 Hz• Electrical panel with air conditionin g (except ROMI C 1100H / 1290H)• Ethernet interface • Fluorescent worklight• Geared headstock, with two speed ranges and continuous speed variation • Headstock coolant and lubrication system equipped with heat exchanger, sensors for temperature, pressure, flow and filter- Ø 1500 mm (max. 407 rpm) ROMI C 1300H / 1600H / 1800H / 2100H / 2200H / 2600H - Ø 1600 mm (max. 382 rpm)ROMI C 1800H / 2100H / 2200H / 2600H - Ø 1800 mm (max. 340 rpm) ROMI C 1800H / 2100H / 2200H / 2600H- Ø 2000 mm (max. 306 rpm) ROMI C 2200H / 2600H• 4-station square manual turret• 4-station vertical electrical turret (tool holders and reduction sleeves not included)• 8-station horizontal electrical turret for driven tools, VDI-50 (DIN 69880) (toolholders and reduction sleeves not included) (ROMI C 1100H / C 1290H)• 8-station horizontal electrical turret for driven tools, VDI-50 (DIN 69880) (tool holders and reduction sleeves not included)• 8-station horizontal electrical turret, VDI-50 (DIN 69880) (tool holders and reduction sleeves not included)• Air conditioning for electrical panel (recommended for environments with temperature higher than 38°C) (ROMI C 1100H / C 1290H)• Autotransformer for 200 to 250 VCA or 360 to 480 VCA, 50/60 Hz• Deep hole drilling support (bar not included): - Ø 160 mm (ROMI C 1100H / 1290H)- Ø 200 mm fixed over cross slide, with 3rd guide (ROMI C 1300H / 1600H)• Remote operation panel withhandwheel and JOG functions for axes • Set of anchor, screws and nuts for leveling and alignment • Set of instruction manuals• Set of wrenches for machine operation • CNC Siemens 840D, with 21.5” touch screen monitor• Splash guard with sliding doors • Standard colors: Textured epoxy enamel munsell blue 10B-3/4 and textured epoxy gray RAL 7035- Ø 200 mm fixed in square manual turret with vertical axis, with 3rd guide (ROMI C 1300H / C 1600H)- Ø 250 mm fixed over cross slide, with 3rd guide (ROMI C 1800H / 2100H / 2200H / 2600H)- Ø 250 mm fixed in square manual turret with vertical axis, with 3rd guide (ROMI C 1800H / 2100H / 2200H / 2600H)• C axis driven by independent servomotor and hydraulic brake• Chip conveyor hinged belt longitudinal (TCE)• Chip pan and coolant tank• Generic interface with miscellaneous functions (4 M codes)• Linear scale for Z axis• Main spindle indexing with 72 position (5 degrees) - ASA A2-20”• Oil Skimmer• Special painting according to Munsell or RAL Standards• Steady rest C type, with capacity: - Ø 300 to 800 mm (ROMI C 2600H)• Steady rest U type, with capacity: - Ø 230 to 550 mm (ROMI C 1100H) - Ø 200 to 635 mm (ROMI C 1290H)- Ø 230 to 600 mm (ROMI C 1300H / 1600H / 1300HBB)- Ø 380 to 750 mm (ROMI C 1600H)• Tailstock with manually operated quill, built-in center with plate springs compensation and supervision of applied force and lubrication • Pivoted operation panel (ROMI C 1100H / C 1290H )- Ø 275 to 800 mm (ROMI C 1800H / 2100H) - Ø 300 to 800 mm (ROMI C 2200H / 2600H)• Steady table rest, with capacity: - Ø 340 to 720 mm (ROMI C 1100H) - Ø 300 to 950 mm (ROMI C 1290H) - Ø 500 to 900 mm (ROMI C 1300H / C 1300HBB)- Ø 500 to 1,200 mm (ROMI C 1600H) - Ø 750 to 1,200 mm (ROMI C 1800H) - Ø 800 to 1,600 mm (ROMI C 2100H) - Ø 800 to 1,550 mm (ROMI C 2200H) - Ø 800 to 2,000 mm (ROMI C 2600H)• Table rest• Tailstock with hydraulically driven quill, built-in live center and displacement through carriage in place of standard • Y axis• Remote diagnosis interfaceNote: Other optional equipments under request.Drawings are not in scale.CE safety regulation compliance available only for the European Community or under request.Check availability and technical characteristics of the products to your country.ROMI BW Machine Tools Ltd 1845 Airport Exchange Blvd Erlanger KY – 41018 USA +1 (859) 647 7566*****************ROMI Itália SrlVia Morigi, 33 – 29020Gossolengo (PC) – Italy +39 0523 778 956*************************www.romiitalia.itBurkhardt+WeberFertigungssysteme GmbH Burkhardt+Weber-Strasse 5772760 Reutlingen, Germany + 49 7121 315-0***********************www.burkhardt-weber.deROMI Europa GmbHBurkhardt+Weber-Strasse 5772760 Reutlingen, Germany + 49 7121 315-604********************www.romi-europa.deROMI France SAS Parc de Genève, 240Rue Ferdinand Perrier 69800ST Priest+33 4 37 25 60 70*******************www.romifrance.fr ROMI Machines UK Limited Leigh RoadSwift Valley Industrial Estate Rugby CV21 1DS +44 1788 544221****************ROMI Maquinas España C/ Telemática, 9 - Poligono Industrial La Ferreria - 08110 Montcada I Reixac - Barcelona +34 93 719 4926************www.romi.esROMI en MéxicoCondominio Parque Arista, Calle Gral. Mariano Arista 54, bodega 19Col. Argentina Poniente, Miguel Hidalgo C.O. 11230, CDMX, México +521 55 9154 5851***************** ROMI S.A.Rod. SP 304, Km 141,5Santa Bárbara d’Oeste SP 13459 057 Brazil +55 (19) 3455 9000Latin America +55 (19) 3455 9642******************W W W.R O M I.C OMMexico Brazil United States Germany England FranceSpain ItalyGermany - B+WR O M I C S E R I E S / I N / A P / 092022 - I l l u s t r a t i v e p h o t o s - S p e c i f i c a t i o n s a r e s u b j e c t t o c h a n g e w i t h o u t p r i o r n o t i c e - P l e a s e r e c y c l e .。

FR10M中文资料

元器件交易网
MCC
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MCC
FR10A thru FR10M
Figure 1 Typical Forward Characteristics 20 10 6 4 2 Amps 1 .6 .4 .2 .1 .06 .04 .02 .01 .8 1.0 1.2 Volts Instantaneous Forward Current - Amperes versus Instantaneous Forward Voltage - Volts 1.4 1.6 1.8 0 Amps 12 10 25° C 8 6 4 2 Figure 2 Forward Derating Curve
Single Phase, Half Wave 60Hz Resistive or Inductive Load 0 50 75 100 ° C 125 150 175
Figure 3 Junction Capacitance 100 60 40 20 pF 10 6 4 2 1 .1 .2 .4 1 Volts 2 4 10 20 40 100 200 400 1000 T J =25° C
-1.0 1cm Set Time Base for 20/100ns/cm

• Operating Temperature: -55° to +150° C C • Storage Temperature: -55° to +150° C C MCC Part Number FR10A FR10B FR10D FR10G FR10J FR10K FR10M Maximum Recurrent Peak Reverse Voltage 50V 100V 200V 400V 600V 800V 1000V Maximum RMS Voltage 35V 70V 140V 280V 420V 560V 700V Maximum DC Blocking Voltage 50V 100V 200V 400V 600V 800V 1000V

NACE0.33K25V6.3X6.3TR13F中文资料

1®NIC COMPONENTS CORP. ww www www www Surface Mount Aluminum Electrolytic CapacitorsNACE SeriesFEATURES•CYLINDRICAL V-CHIP CONSTRUCTION• LOW COST, GENERAL PURPOSE, 2000 HOURS AT 85O C •NEW EXP ANDED CV RANGE (up to 6800µF)•ANTI-SOLVENT (2 MINUTES)•DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERINGCHARACTERISTICS*See standard products and case size table for items available in 10% toleranceRated Voltage Range 4.0 ~ 100Vdc Rate Capacitance Range 0.1 ~ 6,800µFOerating Temp. Range -40°C ~ +85°CCapacitance Tolerance ±20% (M), ±10%Max. Leakage Current After 2 Minutes @ 20°C0.01CV or 3µA whichever is greaterTan δ @120Hz/20°C W.V . (Vdc) 4.0 6.31016253550631003mm Dia.0.400.350.240.190.160.140.14--4 ~ 6.3mm Dia.0.350.260.200.160.140.120.100.100.108x6.5mm Dia.-0.250.260.200.160.140.12-0.108mm Dia. ~ upC<1000µF 0.400.300.240.200.160.140.120.120.10C<1500µF -0.310.250.21-0.15---C<2200µF -0.320.32-0.18----C<3300µF -0.34-0.24-----C<4700µF --0.36------C<6800µF -0.40-------Low Temperature StabilityImpedance Ratio @ 120HzW.V . (Vdc) 4.0 6.3101625355063100Z-25°C/Z+20°C 733222222Z-40°C/Z+20°C 1586443333Load Life Test85°C 2,000 HoursCapacitance Change Within ± 25% of initial measured valueTan δLess than 200% of specifi ed max. valueLeakage Current Less than specifi ed max. value NACE 101 M 16V 6.3x5.5 TR 13 FRoHS Compliant97% Sn (min.), 3% Bi (max.) 330mm (13”) Reel Tape & Reel Size in mm Working VoltageTolerance Code M=20%, K=10% Capacitance Code in µF , fi rst 2 digits are signifi cant Third digit is no. of zeros, “R” indicates decimal for values under 10µF SeriesPART NUMBER SYSTEMRoHSCompliantincludes all homogeneous materials *See Part Number System for Details PRECAUTIONSPlease review the notes on correct use, safety and precautions found on pages T10 & T11of NIC’s Electrolytic Capacitor catalog . Also found at /precautionsIf in doubt or uncertainty, please review your specifi c application - process details withNIC’s technical support personnel: tpmg@2MAXIMUM RIPPLE CURRENT O MAXIMUM ESRO Surface Mount Aluminum Electrolytic CapacitorsNACE SeriesSTANDARD PRODUCT AND CASE SIZE TABLE DφxL (mm)*Items available in optional 10% toleranceSurface Mount Aluminum Electrolytic Capacitors NACE Series+ -3。

拓贸隆产品参数

六类非屏蔽网线⏹类型：六类UTP电缆，所有性能均超过千兆以太网的性能要求。

⏹芯线规格：23 AWG实芯裸铜导体。

0.58mm线径。

⏹外皮：FR PVC，CM高防火级别，无铅外皮⏹标准：性能超过EIA/TIA-568-B和ISO/IEC11801六类/F级六类标准。

⏹带宽：≥250MHz（PSACR=0）。

考虑以后升级到万兆以太网的需要，系统性能测试≥600 MHz。

⏹特性阻抗：直流电阻：6.8Ω，特性阻抗：98-102Ω⏹认证：通过IEC6033－1、IEC60754认证标准，独立机构ETL/SEMKO测试和认证并具有ANSI-TIA/EIA 568 B.2-1-2002或EN50173CAT-6类最新的国际标准性能要求的证书。

⏹性能超过EIA/TIA-568-B 和ISO 6类标准，符合EN55022/B类对EMC的要求，SL薄型的外形尺寸,增加了插座端口密度⏹接线方式：T568B⏹接口模式：IDC KEYSTONE接口⏹直流电阻：0.3Ω⏹绝缘阻抗：不低于500MΩ⏹抗电强度：DC1000V（AC700V）1分钟无击穿和飞弧现象⏹插拔寿命：≥750次⏹接点阻抗：≤20mΩ⏹电流：1.5A⏹通用线序标签支持568A/568B端接线序材料：所有塑料材料符合UL94-V0⏹安装方式：与面板配套、简单、快速，电缆可以沿90度或180度方向进入和端接，可用于工作区语音、数据信息点⏹独立机构ETL/SEMKO测试和认证，并获CE认证⏹采用防尘罩设计，既有效防止灰尘的进入，又可以免接线工具，使用更加灵活方便六类24口配线架⏹性能超过EIA/TIA-568-B 和ISO 六类标准,增加了插座端口密度，外形紧凑，有通用线序标签清晰注于模块上，便于准确、快速地完成端接⏹接线方式：T568B⏹接口模式：IDC 卡接接口⏹直流电阻：0.3Ω⏹绝缘阻抗：不低于100MΩ⏹抗电强度：DC1000V（AC700V）1分钟无击穿和飞弧现象⏹插拔寿命：≥750次⏹接点阻抗：≤20mΩ⏹电流：1.5A⏹通用线序标签支持568A/568B端接线序材料：所有塑料材料符合UL94-V0⏹安装方式：与跳线配套、简单、快速，跳线可以沿90度方向进入和端接，自带简易理线架，方便快捷，节约时间。

Oracle SPARC Enterprise M3000 M4000 M5000 M8000 M9

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NCR RealPOS 80硬件用户手册说明书

NCR RealPOS 80 hardware user ManualNCR RealPOS 80Release 1.0Hardware User's GuideB005-0000-1440Issue Av Table of ContentsChapter 1: Product OverviewIntroduction...........................................................................................1-1 Cabinet.............................................................................................1-2Configurations................................................................................1-4Integrated Terminal...................................................................1-4Integrated Terminal w/Cash Drawer.....................................1-5Left/Right Configurability.......................................................1-6 Serial Number/Model Number Label...............................................1-7Features..................................................................................................1-8 Processor Board..............................................................................1-84-Port USB Daughter Card............................................................1-9ATX Riser Card...............................................................................1-9Front Control Panel......................................................................1-10Storage Media...............................................................................1-10Power Supply................................................................................1-11Operating Systems.......................................................................1-11UPS.................................................................................................1-11 Power Management............................................................................1-12 Definitions of the states involved...............................................1-13 Operator Displays...............................................................................1-17 5964 12.1-Inch Touch Screen.......................................................1-17Features.....................................................................................1-175942 12.1-INCH Color LCD.........................................................1-197452-K309/K404 9-Inch Monochrome CRT..............................1-207452-K419 15-Inch Color CRT.....................................................1-20NCR 5982 5-Inch LCD Display...................................................1-21 NCR 5953 12.1-Inch DynaKey...........................................................1-22viNCR 5952 10.4-Inch DynaKey...........................................................1-23NCR 5932 Keyboards.........................................................................1-24109-Key USB Keyboard...............................................................1-24Features.....................................................................................1-25115-Key PS/2 Big Ticket Keyboard............................................1-2668-Key PS/2 POS Keyboard........................................................1-27Features.....................................................................................1-27NCR 5972 2x20 Remote Customer Display.....................................1-31Features..........................................................................................1-31NCR 5973 2x20 International VFD Customer Display..................1-32Features..........................................................................................1-32Printers.................................................................................................1-33NCR 7158 Printer..........................................................................1-33NCR 7162 Printer..........................................................................1-34NCR 7194 Printer..........................................................................1-34NCR 7167 Printer..........................................................................1-35NCR 7197 Printer..........................................................................1-35System Configuration Diagrams......................................................1-36Chapter 2: Hardware InstallationIntroduction...........................................................................................2-1Installation Restrictions.................................................................2-1Installing the Integration Tray............................................................2-2Installing the Keyboard........................................................................2-3PS/2 Keyboard/Mouse Cable Connections...............................2-5Dual Port Keyboard/Mouse Installation................................2-5Mouse Installation Restriction..................................................2-5Installing the Integrated Operator Display.......................................2-6Operator Display Cable Connections........................................2-10Installing an NCR 5964 12.1-inch Touch LCD.....................2-10Installing a 5942 12.1-Inch LCD Monitor..............................2-13viiInstalling the Integrated Customer Display....................................2-14 Installing the Transaction Printer.....................................................2-16 Printer Cable Connections...........................................................2-18USB Installation........................................................................2-18RS-232 Installation w/Power from Powered USB..............2-19 Installing an NCR 5972 Remote Customer Display.......................2-20 Customer Display Cable Connections.......................................2-21 Installing an NCR 5973 Remote Customer Display.......................2-22 Customer Display Cable Connections.......................................2-23 Installing a 5953 DynaKey.................................................................2-24 Installing a 5952 DynaKey.................................................................2-25 Installing a Secondary CRT Display (Dual Display)......................2-26 Installing the Hardware...............................................................2-26Supported Configurations......................................................2-26Supported Configurations by Operating System................2-27Supported Hardware Configurations...................................2-27Installing the Displays.............................................................2-28Configuring the Software for Dual Display..............................2-29 Installing an NCR 5982 5-Inch Operator Display...........................2-30 Installing the PCI LCD Board (5952-K052)................................2-31Connecting the 5982 Display to the Terminal......................2-32 Installing a Cash Drawer...................................................................2-33 Installing a Second Cash Drawer...........................................2-33Chapter 3: SetupIntroduction...........................................................................................3-1 Entering Setup Using a Keyboard......................................................3-1 How to Select Menu Options..............................................................3-1 Restoring Factory Settings...................................................................3-2 Special DynaKey Keypad Mode.........................................................3-2 Normal DynaKey Keypad Operating Mode..............................3-4viiiDisabling Resources..............................................................................3-5BIOS Default Values.............................................................................3-5Main Menu......................................................................................3-5Advanced Menu.............................................................................3-8Security Menu...............................................................................3-12Power Menu..................................................................................3-12Boot Sequence...............................................................................3-12Chapter 4: Operating System RecoveryIntroduction...........................................................................................4-1Prerequisites....................................................................................4-1Connecting an External Backpack CD-ROM Drive...................4-2Updating Procedures.....................................................................4-3Completing the OS Installation (Windows 2000)..................4-5Completing the OS Installation (Windows NT 4.0)..............4-5Completing the OS Installation (Windows EXe)...................4-6Completing the OS Installation (DOS)....................................4-6Gold Disk Contents...............................................................................4-7NCR 7456/58 Windows 2000 Operating System RecoverySoftware (LPIN: D370-0536-0100).................................................4-7Installed Software:.....................................................................4-7Software Drivers.........................................................................4-8Special Settings...........................................................................4-8Recommendation.......................................................................4-9NCR 7456/58 Windows NT 4.0 Operating SystemRecovery Software (LPIN: D370-0564-0100)............................4-10Installed Software:...................................................................4-10Software Drivers.......................................................................4-10Special Settings.........................................................................4-11Recommendation.....................................................................4-12ix NCR RealPOS 80/80c Windows XPe Operating SystemRecovery Software (LPIN: D370-0570-0100).............................4-13Installed Software:...................................................................4-13Software Drivers.......................................................................4-13Special Settings.........................................................................4-14Recommendation.....................................................................4-14 OS Recovery from a Larger Disk Image..........................................4-15Chapter 5: BIOS Updating ProceduresIntroduction...........................................................................................5-1 Prerequisites....................................................................................5-1Connecting an External Backpack CD-ROM Drive...................5-2Updating Procedures.....................................................................5-3 BIOS Crisis Recovery............................................................................5-5 Recovery Procedures......................................................................5-6 Cable/Connector Pin-Out Information.............................................5-9Chapter 6: Memory DumpGeneral Memory Dump Information.................................................5-1 BIOS Requirements........................................................................5-1Disk Format.....................................................................................5-1Supported Operating Systems......................................................5-2Summary of Operating Systems..............................................5-3Prerequisites....................................................................................5-3Windows XP/2000.....................................................................5-4Windows NT...............................................................................5-5 DOS Memory Dump Specifics............................................................5-6 Dump Process Overview...............................................................5-6Restrictions and Limitations.........................................................5-6Performing the Memory Dump....................................................5-9Configuring the Terminal.........................................................5-9xDump Procedure........................................................................5-9Tunes/Tones.............................................................................5-10Moving the Files to Hard Disk and Reassembling..............5-12Flow Chart.................................................................................5-13Memory Dump Assembler..........................................................5-14Appendix A: Retail Keyboard Key Layouts68-Key Keyboard..................................................................................A-1DynaKey.........................................................................................A-4Special DynaKey Keypad Mode.............................................A-4Normal DynaKey Keypad Operating Mode.........................A-65932 USB Keyboard.......................................................................A-7 Appendix B: Feature KitsAppendix C: CablesPrinter Cables.......................................................................................C-1Scanner Cables......................................................................................C-37872 or 7875 Scanner/Scale (RS-232)..........................................C-37872 or 7875 Scanner/Scale (Powered USB)..............................C-37892 Scanner (Powered RS-232)..................................................C-37882 Scanner (Powered RS-232)..................................................C-47837 Scanner (Powered RS-232)..................................................C-4Display Cables......................................................................................C-5VGA Display, Mono......................................................................C-5VGA Display, Color......................................................................C-5CRT AC Power Extension............................................................C-55982 5-Inch LCD............................................................................C-65953 DynaKey................................................................................C-65953 DynaKey w/Insert...............................................................C-6Wedge Keyboard Y-Cable............................................................C-7xi5972 VFD Customer Display (Powered RS-232).......................C-7DVI to DVI for 5964.......................................................................C-7PS/2 - RS-232 & Power for 5964..................................................C-8Wedge Keyboard Adapter...........................................................C-812.1-Inch LCD Aux Power Cable................................................C-8Cash Drawer Cables............................................................................C-9 Dual Cash Drawer, Y-Cable.........................................................C-9Cash Drawer, Extension Cable....................................................C-9 Ethernet Communications Cable.......................................................C-9 Keyboard Cables................................................................................C-10 PS/2 Keyboard Extension..........................................................C-10PS/2 Y-Cable................................................................................C-10 Signature Capture/Electronic Payment Terminal Cable.............C-11 5945/5992 EPT (RS-232 w/Power)...........................................C-115942 12V Power Cable.................................................................C-11 IDE Cables...........................................................................................C-12 IDE Interface Cable (3-Connector)............................................C-12IDE Interface Cable (2-Connector)............................................C-12 Compact Flash Power Cable.............................................................C-12 Power Cables......................................................................................C-13 AC Power......................................................................................C-13Appendix D: Memory MapDOS Considerations............................................................................D-2 Non-TAPS DOS Environment.....................................................D-3TAPS DOS Environment..............................................................D-3This is a “Table of Contents preview” for quality assuranceThe full manual can be found at /estore/catalog/ We also offer free downloads, a free keyboard layout designer, cable diagrams, free help andsupport. : the biggest supplier of cash register and scale manuals on the net。

电感专业制造商 CMNR系列磁胶屏蔽功率电感器说明书

电感专业制造商 CMNR系列磁胶屏蔽功率电感器●EXTERNAL DIMENSIONS UNIT：mm（外形尺寸）Fig 1Fig 2Fig 3●　PART NUMBERING SYSTEM（品名系统）CMNR3015-4R7M T123451、SERIES NAME 品名 C代C.RD.，M指贴片端银系列，NR代表点磁胶屏蔽2、DIMENSIONS 尺寸外围*高度3、INDUCTANCE 电感值前两位为有效数字，第三位表示零的个数4、TOLERANCE CODE 公差 J：±5%，K：±10%，L：±15%，M：±20%，P：±25%，N：±30%5、PACKING CODE 包装方式 T：Tape&Reel(卷装) B：In Bulk● FEATURES（特性）Various high power inductors are superior to be high saturation for surface mounting.具有高功率、高饱和电流，低阻抗、小型化之特点● Operating Temp（操作温度）工作环境温度 -40℃～125℃● APPLICATIONS（用途）LED,VR,AR,Notebooks, desktop computers, servers, graphic cards cards，Telecomm base stationsPortable gaming devices, personal navigation systems, personal multimedia devicesFlat-screen TVs, blue-ray disc recorders, set top box, movie cameras,smart phone************************************************************************************ Design As Customers Requested Specifications可根据客户需求设计电感专业制造商 CMNR系列磁胶屏蔽功率电感器CMNR4020 TYPECMNR4030 TYPECMNR5040 TYPECMNR6028 TYPE※1: All test data is referenced to 20°C ambient;※2: Rated current: Isat or Irms, whichever is smaller;※3: Isat: DC current at which the inductance drops approximate 30% from its value without current;※4: Irms: DC current that causes the temperature rise (△T =40°C) from 20°C ambient.TYPICAL ELECTRICAL CHARACTERISTICS CMNR252012 SeriesTemperature vs. DC Current Characteristics Inductance vs. DC Current CharacteristicsTYPICAL ELECTRICAL CHARACTERISTICSCMNR3012 SeriesTemperature vs. DC Current Characteristics Inductance vs. DC Current CharacteristicsCMNR3015 SeriesTemperature vs. DC Current Characteristics Inductance vs. DC Current CharacteristicsCMNR4012 SeriesTemperature vs. DC Current Characteristics Inductance vs. DC Current CharacteristicsTYPICAL ELECTRICAL CHARACTERISTICSCMNR4020 SeriesTemperature vs. DC Current Characteristics Inductance vs. DC Current CharacteristicsCMNR4030 SeriesTemperature vs. DC Current Characteristics Inductance vs. DC Current CharacteristicsCMNR5020 SeriesTemperature vs. DC Current Characteristics Inductance vs. DC Current CharacteristicsCMNR6020 SeriesTemperature vs. DC Current Characteristics Inductance vs. DC Current CharacteristicsCMNR6028 SeriesTemperature vs. DC Current Characteristics Inductance vs. DC Current CharacteristicsCMNR8040 SeriesTemperature vs. DC Current Characteristics Inductance vs. DC Current Characteristics。

MEMORY存储芯片M25P80-VMW6TG中文规格书

SUMMARY DESCRIPTIONThe M25P80 is a 8 Mbit (1M x 8) Serial Flash Memory, with advanced write protection mecha-nisms, accessed by a high speed SPI-compatible bus.The memory can be programmed 1 to 256 bytes at a time, using the Page Program instruction.The memory is organized as 16 sectors, each con-taining 256 pages. Each page is 256 bytes wide.Thus, the whole memory can be viewed as con-sisting of 4096 pages, or 1,048,576 bytes.The whole memory can be erased using the Bulk Erase instruction, or a sector at a time, using the Sector Erase instruction.Table 1. Signal NamesNote: 1.There is an exposed die paddle on the underside of theMLP8 package. This is pulled, internally, to V SS , and must not be allowed to be connected to any other voltage or signal line on the PCB.2.See PACKAGE MECHANICAL section for package di-mensions, and how to identify pin-1.Note: 1.DU = Don’t Use2.See PACKAGE MECHANICAL section for package di-mensions, and how to identify pin-1.C Serial ClockD Serial Data Input QSerial Data Output SChip Select W Write Protect HOLD HoldV CC Supply Voltage V SSGroundINSTRUCTIONSAll instructions, addresses and data are shifted in and out of the device, most significant bit first. Serial Data Input (D) is sampled on the first rising edge of Serial Clock (C) after Chip Select (S) is driven Low. Then, the one-byte instruction code must be shifted in to the device, most significant bit first, on Serial Data Input (D), each bit being latched on the rising edges of Serial Clock (C). The instruction set is listed in Table 4..Every instruction sequence starts with a one-byte instruction code. Depending on the instruction, this might be followed by address bytes, or by data bytes, or by both or none.In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed (Fast_Read), Read Status Register (RDSR) or Release from Deep Power-down, and Read Electronic Signature (RES) instruction, the shifted-in instruction se-quence is followed by a data-out sequence. Chip Select (S) can be driven High after any bit of the data-out sequence is being shifted out.In the case of a Page Program (PP), Sector Erase (SE), Bulk Erase (BE), Write Status Register (WRSR), Write Enable (WREN), Write Disable (WRDI) or Deep Power-down (DP) instruction, Chip Select (S) must be driven High exactly at a byte boundary, otherwise the instruction is reject-ed, and is not executed. That is, Chip Select (S) must driven High when the number of clock pulses after Chip Select (S) being driven Low is an exact multiple of eight.All attempts to access the memory array during a Write Status Register cycle, Program cycle or Erase cycle are ignored, and the internal Write Status Register cycle, Program cycle or Erase cy-cle continues unaffected.Table 4. Instruction SetInstruction Description One-byte Instruction Code AddressBytesDummyBytesDataBytesWREN Write Enable0000 011006h0 0 0 WRDI Write Disable0000 010004h0 0 0 RDSR Read Status Register 0000 010105h0 0 1 to ∞WRSR Write Status Register 0000 000101h0 0 1 READ Read Data Bytes0000 001103h30 1 to ∞FAST_READ Read Data Bytes at Higher Speed0000 10110Bh31 1 to ∞PP Page Program0000 001002h30 1 to 256 SESectorErase11011000D8h300 BE Bulk Erase 1100 0111C7h0 0 0 DP Deep Power-down1011 1001B9h0 0 0RES Release from Deep Power-down,and Read Electronic Signature1010 1011ABh0 31to∞Release from Deep Power-down0 00Read Data Bytes at Higher Speed(FAST_READ)The device is first selected by driving Chip Select (S)Low. The instruction code for the Read Data Bytes at Higher Speed (FAST_READ) instruction is followed by a 3-byte address (A23-A0) and a dummy byte, each bit being latched-in during the rising edge of Serial Clock (C). Then the memory contents, at that address, is shifted out on Serial Data Output (Q), each bit being shifted out, at a maximum frequency f C, during the falling edge of Serial Clock (C).The instruction sequence is shown in Figure 14.. The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shift-ed out. The whole memory can, therefore, be read with a single Read Data Bytes at Higher Speed (FAST_READ) instruction. When the highest ad-dress is reached, the address counter rolls over to 000000h, allowing the read sequence to be contin-ued indefinitely.The Read Data Bytes at Higher Speed (FAST_READ) instruction is terminated by driving Chip Select (S) High. Chip Select (S) can be driv-en High at any time during data output. Any Read Data Bytes at Higher Speed (FAST_READ) in-struction, while an Erase, Program or Write cycle is in progress, is rejected without having any ef-fects on the cycle that is in progress.Figure 14. Read Data Bytes at Higher Speed (FAST_READ)Instruction Sequence and Data-OutM25P80Page Program (PP)The Page Program (PP) instruction allows bytes to be programmed in the memory (changing bits from 1 to 0). Before it can be accepted, a Write Enable (WREN) instruction must previously have been ex-ecuted. After the Write Enable (WREN) instruction has been decoded, the device sets the Write En-able Latch (WEL).The Page Program (PP) instruction is entered by driving Chip Select (S) Low, followed by the in-struction code, three address bytes and at least one data byte on Serial Data Input (D). If the 8 least significant address bits (A7-A0) are not all zero, all transmitted data that goes beyond the end of the current page are programmed from the start address of the same page (from the address whose 8 least significant bits (A7-A0) are all zero). Chip Select (S) must be driven Low for the entire duration of the sequence.The instruction sequence is shown in Figure 15.. If more than 256 bytes are sent to the device, pre-viously latched data are discarded and the last 256 data bytes are guaranteed to be programmed cor-rectly within the same page. If less than 256 Data bytes are sent to device, they are correctly pro-grammed at the requested addresses without hav-ing any effects on the other bytes of the same page.Chip Select (S) must be driven High after the eighth bit of the last data byte has been latched in, otherwise the Page Program (PP) instruction is not executed.As soon as Chip Select (S) is driven High, the self-timed Page Program cycle (whose duration is t PP) is initiated. While the Page Program cycle is in progress, the Status Register may be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Page Program cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset.A Page Program (PP) instruction applied to a page which is protected by the Block Protect (BP2, BP1, BP0) bits (see Table 3. and Table 2.) is not execut-ed.M25P80。

NUC微控制器产品系列说明书

112 µA/MHz @ 正常模式 1.5 µA @ 掉电模式
M251 Feature
。 Arm® Cortex®-M23 。运行速度可达 48 MHz
M252 Feature
。 USB 2.0 全速设备无需外挂晶振
M253 Feature
。 USB 2.0 全速设备无需外挂晶振
。高达五路 UART 。 CAN FD x1
2
Low Power
TrustZone
AEC-Q100
Market Trend
随着电子应用对低功耗或电池供电的需求日益增加，现今的应用必须尽量降低能源消耗，甚至在极端情况下，可能需要倚赖单颗电池来维持长达 15 至 20 年运转
低功耗应用情景包含手持式设备、居家、 AIoT、IIoT (工业物联网) 等应用情景，使用范围十分广泛
(Programmable Serial I/O) • USB 2.0 全速装置无需外挂晶振 • 独立的 RTC 电源 VBAT 管脚
Highlight
• 支持 1.8 V ~ 5.5 V 串行接口，可连接不同电压装置
*USCI: Universal Serial Control Interface Controller
C
1.8 3.3 5 M253
CU
3.3 5 M071
1.8 3.3 5 M252
U
3.3 5 M051
1.8 3.3 5 M251
3.3 5 Mini51
3.3 5 3.3 5
1.8 3.3 Nano100
M480 M460 M471 M453 M452 M451
E CU E CU
U C
U
Arm9™

各种贴片电容容值规格参数表

各种贴片电容容值表X7R贴片电容简述X7R贴片电容属于EIA规定的Class 2类材料的电容。

它的容量相对稳定。

X7R贴片电容特性具有较高的电容量稳定性，在-55℃～125℃工作温度范围内，温度特性为±15%。

层叠独石结构，具有高可靠性。

优良的焊接性和和耐焊性，适用于回流炉和波峰焊。

应用于隔直、耦合、旁路、鉴频等电路中。

X7R贴片电容容量范围厚度与符号对应表0201～1206 X7R贴片电容选型表1210～2225 X7R贴片电容选型表NPO COG 贴片电容容量规格表默认分类 2009-07-15 16:28 阅读354 评论1字号：大大中中小小NPO(COG)贴片电容属于Class 1温度补偿型电容。

它的容量稳定，几乎不随温度、电压、时间的变化而变化。

尤其适用于高频电子电路。

具有最高的电容量稳定性，在-55℃～125℃工作温度范围内,温度特性为：0±30ppm/℃(COG）、0±60ppm/℃(COH）。

层叠独石结构，具有高可靠性。

优良的焊接性和和耐焊性，适用于回流炉和波峰焊。

应用于各种高频电路,如:振荡、计时电路等。

我们把用来制造片式多层瓷介电容（MLCC）的陶瓷叫电容器瓷。

这里所说的瓷介就是用电容器瓷制成的陶瓷介质。

大家知道，陶瓷是一类质硬、性脆的无机烧结体。

就其显微结构而论，大都具有多晶多相结构。

其性能往往决定于其成份和结构。

当配方确定之后，能否达到预期的效果，关键取决于制造陶瓷粉料的工艺。

按其用途可以分为三类：①高频热补偿电容器瓷（UJ、SL）；②高频热稳定电容器瓷（NPO）；③低频高介电容器瓷（X7R、Y5V、Z5U）。

按温度系数分可以分为两类：①负温度系数电容器瓷（即高频热补偿电容器瓷）；②正温度系数电容器瓷（即平时我们常说的COG、X7R、Y5V瓷料）。

按工作频率可以分为三类：低频、高频、微波介质。

高频热补偿、热稳定电容器瓷是专供Ⅰ类瓷介电容器作介质用，其瓷料主要成分是MgTiO3、CaTiO3、SrTiO3和TiO2再加入适量的稀土类氧化物等配制而成。

场效应管参数大全2

型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2518-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大200 20 502SK2519-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大200 10 402SK2520-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大200 10 302SK2521-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大200 18 502SK2522-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大300 18 402SK2523-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 9 602SK2524-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 9 402SK2525-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 9 802SK2526-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 5 602SK2527-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 5 402SK2528-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 4 802SK2529HITACHI N-MOSFET,用于高速功率开关60 50 35 2SK2530SANYO N-MOSFET,用于高速开关250 2 20 2SK2532SANYO N-MOSFET,通用开关应用250 10 40 2SK2533SANYO N-MOSFET,用于高速开关250 2 20 2SK2534SANYO N-MOSFET,通用开关应用250 16 502SK2538PANASONIC N-MOSFET,用于高速开关、高频功率放大250 2 302SK2539PANASONIC N-MOSFET,用于高频功率放大、模拟开关152SK2541NEC N-MOSFET,用于高速开关502SK2542TOSHIBA N-MOSFET,用于高速高电压开关、开关整流500 8 802SK2543TOSHIBA N-MOSFET,用于高速高电压开关、开关整流500 8 402SK2544TOSHIBA N-MOSFET,用于高速高电压开关、开关整流600 6 802SK2545TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器驱动和电动机驱动600 6 402SK2549TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器驱动和电动机驱动16 22SK2550TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器驱动和电动机驱动50 45 1002SK2551TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器驱动和电动机驱动50 50 1502SK2553HITACHI N-MOSFET,用于高速功率开关60 50 75 2SK2553L HITACHI N-MOSFET,用于高速功率开关60 50 75 2SK2553S HITACHI N-MOSFET,用于高速功率开关60 50 75 2SK2554HITACHI N-MOSFET,用于高速功率开关60 75 150型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2559SHINDENGEN N-MOSFET,用于DC-DC转换、DC12-24V输入电源200 10 402SK2560SHINDENGEN N-MOSFET,用于DC-DC转换、DC12-24V输入电源200 20 602SK2561-01R FUJI N-MOSFET,功率放大,开关效应管600 9 802SK2562-01R FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大800 7 802SK2563SHINDENGEN N-MOSFET,用于AC 100-200V输入开关电源、换流、功率因素控制电路600 4 302SK2564SHINDENGEN N-MOSFET,用于AC 100-200V输入开关电源、换流、功率因素控制电路600 8 502SK2568HITACHI N-MOSFET,用于开关整流、DC-DC转换500 12 1002SK2569HITACHI N-MOSFET,用于低频功率开关502SK2570HITACHI N-MOSFET,用于低频功率开关202SK2570-01MR FUJI N-MOSFET,功率放大,开关效应管300 10 402SK2571PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源450 13 1002SK2571-01FUJI N-MOSFET,功率放大,开关效应管300 10 802SK2573PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源500 20 1002SK2573-01FUJI N-MOSFET,功率放大,开关效应管300 20 125 2SK2586HITACHI N-MOSFET,用于高速功率开关60 60 1252SK258H N-FET,高频放大（射频放大）,功率放大250 8 125 IRF2322SK2590HITACHI N-MOSFET,用于开关整流、DC-DC转换、电动机控制200 7 125502SK2592SANYO N-MOSFET,通用开关应用250 13 60 2SK2593PANASONIC N-MOSFET,用于低频放大、开关552SK2597NEC N-MOSFET,用于900MHz基站便携式电话功率放大60 15 2902SK2598TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动250 13 602SK2599TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动500 22SK259H N-FET,高频放大（射频放大）,功率放大350 5 125 IRF3232SK2601TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动500 10 1252SK2602TOSHIBA N-MOSFET,用于高速高电压开关、开关整流600 6 1252SK2603TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动800 3 1002SK2604TOSHIBA N-MOSFET,用于高速高电压开关、开关整流800 5 1252SK2605TOSHIBA N-MOSFET,用于高速高电压开关、开关整流800 5 452SK2606TOSHIBA N-MOSFET,用于DC-DC转换、继电器和电动机驱动800 8 852SK2607TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动800 9 150型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2608TOSHIBA N-MOSFET,用于高速高电压开关、开关整流900 3 1002SK260H N-FET,高频放大（射频放大）,功率放大400 5 125 IRF3222SK261N-FET,功率放大,音频(低频) IRF5122SK2610TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动900 5 1502SK2611TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动900 9 1502SK2613TOSHIBA N-MOSFET,用于开关调整、DC/DC转换和电动机驱动300 32 2002SK2614TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动50 20 402SK2615TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动60 22SK2616SANYO N-MOSFET,用于高速开关500 2 302SK2617ALS SANYO N-MOSFET,通用开关应用500 5 252SK2617LS SANYO N-MOSFET,通用开关应用500 4 252SK2618ALS SANYO N-MOSFET,通用开关应用500 302SK2618LS SANYO N-MOSFET,通用开关应用500 5 302SK262N-FET,功率放大,音频(低频) IRF613 2SK2623SANYO N-MOSFET,用于高速开关600 302SK2624ALS SANYO N-MOSFET,通用开关应用600 252SK2624FG SANYO N-MOSFET,通用开关应用600 252SK2624FS SANYO N-MOSFET,通用开关应用600 252SK2624LS SANYO N-MOSFET,用于高速开关600 3 252SK2625ALS SANYO N-MOSFET,通用开关应用600 5 302SK2625LS SANYO N-MOSFET,用于高速开关600 4 302SK2627SANYO N-MOSFET,用于高速开关600 5 402SK2628ALS SANYO N-MOSFET,通用开关应用600 7 352SK2628FG SANYO N-MOSFET,通用开关应用600 7 352SK2628FS SANYO N-MOSFET,通用开关应用600 7 352SK2628LS SANYO N-MOSFET,用于高速开关600 6 352SK263N-FET,功率放大,音频(低频) IRF613 2SK2631SANYO N-MOSFET,用于高速开关800 1 302SK2632LS SANYO N-MOSFET,通用开关应用800 252SK2638-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 10 50型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2639-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 10 1002SK264N-FET,功率放大,音频(低频) IRF6122SK2640-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 10 502SK2641-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 10 1002SK2642-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 15 502SK2643-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 15 1252SK2645-01MR FUJI N-MOSFET,用于开关600 9 502SK2646-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大800 4 802SK2647-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大800 4 402SK2648-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大800 9 1502SK2649-01R FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大800 9 1002SK2651-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 6 502SK2652-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 6 1252SK2653-01R FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 6 802SK2654-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 8 1502SK2655-01R FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 8 1002SK266TOSHIBA 停产,N-FET,电容话筒专用15 PN4119A2SK2661TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动500 5 752SK2662TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动500 5 352SK2663SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 1 102SK2664SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 3 502SK2665SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 3 502SK2666SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 3 302SK2667SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 3 652SK2668SHINDENGEN N-MOSFET,用于AC 240V输入开关电900 3 40源、高压电源、换流2SK2669SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 5 602SK2670SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 5 602SK2671SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 5 402SK2672SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 5 802SK2673SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 5 50型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2674SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 7 1002SK2675SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 7 552SK2676SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 10 1202SK2677SHINDENGEN N-MOSFET,用于AC 240V输入开关电源、高压电源、换流900 10 652SK2679TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动400 352SK2682LS SANYO N-MOSFET,用于高速开关250 13 35 2SK2684HITACHI N-MOSFET,用于高速功率开关30 30 50 2SK2684L HITACHI N-MOSFET,用于高速功率开关30 30 50 2SK2684S HITACHI N-MOSFET,用于高速功率开关30 30 502SK2685HITACHI GAAS N-MOSFET,用于UHF低噪声放大62SK2687-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换30 50 602SK2688-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大30 50 602SK2689-01MR FUJI N-MOSFET,用于开关30 50 402SK2690-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 80 1252SK2691-01R FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大60 70 1002SK2695-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换700 5 602SK2698TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动500 15 1502SK2699TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动600 12 1602SK270TOSHIBA 停产,用2SK389代替,N-FET,配对管,音频（低频）40 U4052SK2700TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动900 3 402SK2701SANKEN N-MOSFET 450 7 35 2SK2702SANKEN N-MOSFET 450 10 35 2SK2703SANKEN N-MOSFET 450 10 75 2SK2704SANKEN N-MOSFET 450 13 40 2SK2705SANKEN N-MOSFET 450 13 75 2SK2706SANKEN N-MOSFET 450 18 85 2SK2707SANKEN N-MOSFET 600 35 2SK2708SANKEN N-MOSFET 600 7 402SK2709SANKEN N-MOSFET 600 852SK271TOSHIBA 停产,用2SK405代替,N-FET,功率放大,音频（低频）140 8 120 2SK405型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2710SANKEN N-MOSFET 600 12 85 2SK2715ROHM N-MOSFET，用于开关500 2 202SK2717TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动900 5 452SK2718TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动900 402SK2719TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动900 3 1252SK272TOSHIBA 停产,用2SK405代替,N-FET,功率放大,音频（低频）140 8 120 2SK2712SK2723NEC N-MOSFET,用于大电流开关60 25 252SK2724NEC N-MOSFET,用于大电流开关60 35 302SK2725HITACHI N-MOSFET,用于高速功率开关500 5 302SK2726HITACHI N-MOSFET,用于高速功率开关500 7 302SK2727HITACHI N-MOSFET,用于高速功率开关500 10 1002SK2728HITACHI N-MOSFET,用于高速功率开关500 18 1502SK2729HITACHI N-MOSFET,用于高速功率开关500 20 1502SK273GaAs,微波,超高频8 MGF-1400 2SK2730HITACHI N-MOSFET,用于高速功率开关500 25 1752SK2731ROHM N-MOSFET，用于开关302SK2733TOSHIBA路器、DC-DC转换和电动机驱动900 1 602SK2734HITACHI N-MOSFET,用于高速功率开关30 52SK2735HITACHI N-MOSFET,用于高速功率开关30 20 202SK2735L HITACHI N-MOSFET,用于高速功率开关30 20 202SK2735S HITACHI N-MOSFET,用于高速功率开关30 20 202SK2736HITACHI N-MOSFET,用于高速功率开关30 30 252SK2737HITACHI N-MOSFET,用于高速功率开关30 45 302SK2738HITACHI N-MOSFET,用于高速功率开关60 40 302SK274GaAs,微波,超高频8 MGF-1402 2SK2740ROHM N-MOSFET，用于开关600 7 302SK2741TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动60 52SK2742TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动100 32SK2744TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动50 45 1252SK2745TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动50 50 150型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2746TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动800 7 1502SK2749TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动900 7 1502SK275GaAs,微波,超高频8 MGF-14122SK2750TOSHIBA路器、DC-DC转换和电动机驱动600 352SK2751PANASONIC N-JFET,用于低频阻抗转换、红外传感器402SK2751J ON N-JFET,用于低频放大器、恒流源和阻抗转换等402SK2753-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大120 50 1502SK2754-01L FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 10 802SK2754-01S FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 10 802SK2755-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 18 1252SK2756-01R FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 18 802SK2757-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 10 802SK2758-01L FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 10 802SK2758-01S FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 10 802SK2759-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 15 802SK276GaAs,微波,超高频 62SK2760-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大600 9 602SK2761-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大600 10 502SK2762-01L FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大800 4 802SK2762-01S FUJI N-MOSFET,用于开关整流、UPS电源、800 4 80DC-DC转换、一般功率放大2SK2763-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大800 4 1002SK2764-01R FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大800 4 802SK2765-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大800 7 1252SK2766-01R FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大800 7 802SK2767-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 802SK2768-01L FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 802SK2768-01S FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 802SK2769-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 402SK277N-MOSFET,功率场效应管350 7 100 BUZ632SK2770-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大900 100型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2771-01R FUJI N-MOSFET,用于开关900 9 100 2SK2775SANYO N-MOSFET,用于高速开关100 25 402SK2776TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动500 8 652SK2777TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动600 6 652SK2778SANKEN N-MOSFET 100 12 302SK2779SANKEN N-MOSFET 100 20 352SK278N-MOSFET,功率场效应管400 7 100 BUZ632SK2782TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动60 20 402SK2787LS SANYO N-MOSFET,通用开关应用450 8 40 2SK2788HITACHI N-MOSFET,用于高速功率开关60 2 12SK2789TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动100 27 602SK279GaAs,功率放大,微波,超高频8 1 MGF-1801 2SK2792ROHM N-MOSFET,用于开关600 4 302SK2793ROHM N-MOSFET,用于开关500 5 302SK2796HITACHI N-MOSFET,用于高速功率开关60 5 202SK2796L HITACHI N-MOSFET,用于高速功率开关60 5 202SK2796S HITACHI N-MOSFET,用于高速功率开关60 5 202SK2798SHINDENGEN N-MOSFET,用于AC 100V输入开关电源、高压电源、换流350 6 302SK2799SHINDENGEN N-MOSFET,用于AC 100V输入开关电源、高压电源、换流350 10 502SK280GaAs,功率放大,微波,超高频 5 NE13783 2SK2800HITACHI N-MOSFET,用于高速功率开关60 40 502SK2802HITACHI N-MOSFET,用于低频功率开关302SK2803SANKEN N-MOSFET 450 3 302SK2804SANKEN N-MOSFET 450 5 352SK2805SANKEN N-MOSFET 450 15 802SK2806-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大30 35 302SK2807-01L FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大30 35 302SK2807-01S FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大30 35 302SK2808-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大30 35 202SK2809-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大60 50 50第59页共120页型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK281GaAs,超高频,甚高频 5 NE218892SK2823TOSHIBA N-MOSFET,用于便携式仪表、高速开关、模拟开关202SK2824TOSHIBA N-MOSFET,用于便携式仪表、高速开关、模拟开关202SK2825TOSHIBA N-MOSFET,用于便携式仪表、高速开关、模拟开关202SK2826NEC N-MOSFET,用于大电流开关60 70 100 2SK2827-01FUJI N-MOSFET,用于开关600 9 602SK2828HITACHI N-MOSFET,高速功率开关,用于开关整流、DC-DC转换700 12 1752SK283N-FET,激励、驱动802SK2832-01FUJI N-MOSFET,用于开关60 50 80 2SK2833-R FUJI N-MOSFET,用于开关120 50 100 2SK2834-01FUJI N-MOSFET,用于开关600 9 802SK2835TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动200 52SK2836TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动600 12SK2837TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动500 20 1502SK2838TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动400 402SK2839TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动30 102SK283R3N-FET,激励、驱动80 2SK283R4N-FET,激励、驱动80 2SK283R5N-FET,激励、驱动80 2SK283R6N-FET,激励、驱动802SK2841TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动400 10 802SK2842TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动500 12 402SK2843TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动600 10 452SK2844TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动30 35 602SK2845TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动900 1 402SK2846TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动600 22SK2847TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动900 8 852SK2848SANKEN N-MOSFET 600 2 30 2SK2849-01L FUJI N-MOSFET,用于开关200 18 502SK2849-01S FUJI N-MOSFET,用于开关900 6 125型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2850-01FUJI N-MOSFET,用于开关200 18 50 2SK2851HITACHI N-MOSFET,高速功率开关60 52SK2854TOSHIBA N-MOSFET,用于UHF波段放大102SK2855TOSHIBA N-MOSFET,用于UHF波段放大10 12SK2856TOSHIBA N-MOSFET,用于UHF波段低噪声放大 32SK2858NEC N-MOSFET,用于高速开关302SK2859SANYO N-MOSFET,用于高速开关100 22SK286N-FET,功率放大,音频(低频) 60 8 1002SK2862TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动500 3 252SK2864SANYO N-MOSFET,用于高速开关200 20 502SK2865TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动600 2 202SK2866TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动600 10 1252SK2869HITACHI N-MOSFET,高速功率开关60 20 302SK2870-01L FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 8 502SK2870-01S FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 8 502SK2871-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 8 502SK2872-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 8 302SK2873-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大450 8 602SK2874-01L FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 6 502SK2874-01S FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 6 502SK2875-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 6 502SK2876-01MR FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 6 302SK2877-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 6 602SK2879-01FUJI N-MOSFET,用于开关整流、UPS电源、DC-DC转换、一般功率放大500 20 1502SK287K N-FET,高频放大(射频放大),功率放大,开关60 8 1002SK2882TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动150 18 452SK2883TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动800 8 752SK2884TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换800 5 1002SK2885HITACHI N-MOSFET,高速功率开关30 45 75 2SK2885L HITACHI N-MOSFET,高速功率开关30 45 75型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2885S HITACHI N-MOSFET,高速功率开关30 45 75 2SK2886TOSHIBA N-MOSFET,用于高速高电压开关、断路60 45 40器、DC-DC转换和电动机驱动2SK2887ROHM N-MOSFET,用于开关200 3 20 2SK2889ROHM N-MOSFET,用于开关600 10 1002SK288K N-FET,高频放大（射频放大）,功率放大,开关80 8 1002SK2890-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换30 50 502SK2891-01FUJI N-MOSFET,用于开关30 100 1252SK2892-01R FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换30 90 1002SK2893-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换30 100 1502SK2894-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换30 100 1252SK2895-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 45 602SK2896-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 45 602SK2897-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 45 402SK2898-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 100 1502SK2899-01R FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 100 1252SK289H N-FET,高频放大（射频放大）,功率放大,开关80 8 1002SK2900-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 45 602SK2901-01L FUJI N-MOSFET,用于开关60 45 60 2SK2901-01S FUJI N-MOSFET,用于开关60 45 602SK2902-01MR FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 45 402SK2903-01MR FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 50 502SK2904-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 80 1252SK2905-01R FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 70 1002SK2906-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 100 1502SK2907-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换60 100 1252SK2908-01FUJI N-MOSFET,用于电动机控制、一般功率放大、DC-DC转换600 9 602SK2909SANYO N-MOSFET,用于高速开关202SK290H N-FET,高频放大（射频放大）,功率放大,开关100 8 1002SK291HITACHI N-JFET,用于低频低噪声放大15 2SK2911SANYO N-MOSFET,用于高速开关100型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2912HITACHI N-MOSFET,高速功率开关60 40 50 2SK2912L HITACHI N-MOSFET,高速功率开关60 40 50 2SK2912S HITACHI N-MOSFET,高速功率开关60 40 502SK2914TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动250 202SK2915TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动600 16 1502SK2916TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动500 14 802SK2917TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动500 18 902SK2918-01FUJI N-MOSFET,用于开关200 20 80 2SK2919SANYO N-MOSFET,用于高速开关600 2 35 2SK292N-FET,调频,调谐202SK2920TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动200 5 202SK2922HITACHI N-MOSFET,高速功率开关10 3 2SK2925HITACHI N-MOSFET,高速功率开关60 10 20 2SK2925L HITACHI N-MOSFET,高速功率开关60 10 20 2SK2925S HITACHI N-MOSFET,高速功率开关60 10 20 2SK2926HITACHI N-MOSFET,高速功率开关60 15 25 2SK2926L HITACHI N-MOSFET,高速功率开关60 15 25 2SK2926S HITACHI N-MOSFET,高速功率开关60 15 25 2SK2927HITACHI N-MOSFET,高速功率开关60 10 30 2SK2928HITACHI N-MOSFET,高速功率开关60 15 40 2SK2929HITACHI N-MOSFET,高速功率开关60 25 50 2SK293N-FET,功率放大,音频(低频) 300 7 100 2SK2930HITACHI N-MOSFET,高速功率开关60 35 50 2SK2931HITACHI N-MOSFET,高速功率开关60 45 75 2SK2932HITACHI N-MOSFET,高速功率开关60 10 202SK2933HITACHI N-MOSFET,高速功率开关60 10 20 2SK2934HITACHI N-MOSFET,高速功率开关60 25 25 2SK2935HITACHI N-MOSFET,高速功率开关60 35 30 2SK2936HITACHI N-MOSFET,高速功率开关60 45 35 2SK2937HITACHI N-MOSFET,高速功率开关60 25 25型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2938HITACHI N-MOSFET,高速功率开关60 25 50 2SK2938L HITACHI N-MOSFET,高速功率开关60 25 50 2SK2938S HITACHI N-MOSFET,高速功率开关60 25 50 2SK2939HITACHI N-MOSFET,高速功率开关60 35 50 2SK2939L HITACHI N-MOSFET,高速功率开关60 35 50 2SK2939S HITACHI N-MOSFET,高速功率开关60 35 50 2SK293A N-FET,功率放大,音频(低频) 300 7 100 2SK294N-FET,功率放大,音频(低频) 80 5 30 2SK2940HITACHI N-MOSFET,高速功率开关60 45 75 2SK2940L HITACHI N-MOSFET,高速功率开关60 45 75 2SK2940S HITACHI N-MOSFET,高速功率开关60 45 75 2SK2941NEC N-MOSFET,用于大电流开关30 35 602SK2949TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动400 10 802SK295N-FET,功率放大,音频(低频) 100 5 302SK2951SANYO N-MOSFET,用于高速开关200 12SK2952TOSHIBA N-MOSFET,用于高速高电压开关、断路器400 402SK2953TOSHIBA N-MOSFET,用于高速高电压开关、断路器、DC-DC转换和电动机驱动600 15 902SK2954-MR FUJI N-MOSFET,用于开关100 30 50 2SK2955HITACHI N-MOSFET,高速功率开关60 45 100 2SK2956HITACHI N-MOSFET,高速功率开关30 50 35 2SK2957HITACHI N-MOSFET,高速功率开关30 50 75 2SK2957L HITACHI N-MOSFET,高速功率开关30 50 75 2SK2957S HITACHI N-MOSFET,高速功率开关30 50 75 2SK2958HITACHI N-MOSFET,高速功率开关30 75 100 2SK2958L HITACHI N-MOSFET,高速功率开关30 75 100 2SK2958S HITACHI N-MOSFET,高速功率开关30 75 100 2SK296N-FET,功率放大,音频(低频) 300 1 302SK2961TOSHIBA N-MOSFET,用于高速开关、继电器、电动机驱动、DC-DC转换60 22SK2962TOSHIBA N-MOSFET,用于高速大电流开关、断路器、DC-DC转换和电动机驱动100 12SK2963TOSHIBA N-MOSFET,用于高速开关、DC-DC转换、继电器和电动机驱动100 1型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK2964TOSHIBA N-MOSFET,用于高速大电流开关、断路器、DC-DC转换和电动机驱动30 22SK2965TOSHIBA整流、DC-DC转换和电动机驱动200 11 352SK2967TOSHIBA N-MOSFET,用于高速开关、DC-DC转换、继电器和电动机驱动250 30 1502SK2968TOSHIBA N-MOSFET,用于高速开关、DC-DC转换、继电器和电动机驱动900 10 1502SK2969SANYO N-MOSFET,用于高速开关302SK2972TOSHIBA N-MOSFET,用于高速高电压开关、开关整流500 10 402SK2973MITSUBISHI N-MOSFET,用于VHF/UHF功率放大器172SK2974MITSUBISHI N-MOSFET,用于VHF/UHF功率放大器17 102SK2975MITSUBISHI N-MOSFET,用于VHF/UHF功率放大器30 102SK2976SANYO N-MOSFET,DC-DC转换30 15 202SK2977LS SANYO N-MOSFET,DC-DC转换30 30 302SK2978HITACHI N-MOSFET,高速功率开关20 12SK298N-FET,功率放大,音频(低频) 400 8 100 BUP61 2SK2980HITACHI N-MOSFET,高速功率开关30 12SK2981NEC N-MOSFET,用于大电流开关30 20 202SK2983NEC N-MOSFET,用于大电流开关30 30 502SK2984NEC N-MOSFET,用于大电流开关30 40 602SK2985TOSHIBA N-MOSFET,用于大电流开关、DC-DC转换、继电器和电动机驱动60 45 452SK2986TOSHIBA N-MOSFET,用于大电流开关、DC-DC转换、继电器和电动机驱动60 55 1002SK2987TOSHIBA N-MOSFET,用于大电流开关、DC-DC转换、继电器和电动机驱动60 70 1502SK2989TOSHIBADC-DC转换和电动机驱动50 52SK299N-FET,功率放大,音频(低频) 450 8 100 BUZ462SK2991TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动500 5 502SK2992TOSHIBA N-MOSFET,用于高速大电流开关、断路器、DC-DC转换和电动机驱动200 12SK2993TOSHIBA N-MOSFET,用于高速大电流开关、断路器、DC-DC转换和电动机驱动250 20 1002SK2995TOSHIBA N-MOSFET,用于高速大电流开关、断路器、DC-DC转换和电动机驱动250 30 902SK2996TOSHIBA N-MOSFET,用于高速大电流开关、断路器、DC-DC转换和电动机驱动600 10 452SK2998TOSHIBA N-MOSFET,用于高速高压开关、断路器、DC-DC转换5002SK30TOSHIBA 停产,用2SK30ATM代替,N-FET,音频(低频)50 BF2442SK300SONY N-FET,高频放大（射频放大）,甚高频,视频15 2SK152型号PDF资料厂商特性用途极限电压Vm(V)极限电流Im(A)耗散功率(W)代换型号2SK30-0TOSHIBA 停产,用2SK30ATM代替,N-FET,音频(低频)502SK3000HITACHI N-MOSFET,低频功率开关40 12SK3004SANKEN N-MOSFET 250 18 35 2SK3009SHINDENGEN N-MOSFET,低频功率开关600 8 60 2SK301PANASONIC 硅N-JFET,用于低频放大、开关，55V/ 552SK3012SHINDENGEN N-MOSFET,用于AC 100-200V输入开关电源、换流、功率因素控制电路600 12 1252SK3013SHINDENGEN N-MOSFET,用于AC 100-200V输入开关电源、换流、功率因素控制电路600 16 702SK3017TOSHIBA N-MOSFET,用于高速高电压开关、DC-DC转换、继电器和电动机驱动900 902SK3018ROHM N-MOSFET,小开关，用于便携仪表302SK3019ROHM N-MOSFET,小开关，用于便携仪表302SK301A PANASONIC 硅N-JFET,用于AF放大、开关，55V/ 552SK302TOSHIBA N-MOSFET,用于FM调谐、VHF RF 放大20 TM0104N82SK3022PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源60 5 102SK3023PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源60 10 102SK3024PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源60 20 202SK3025PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源60 30 202SK3026PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源60 40 502SK3027PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源60 50 602SK3028PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源60 100 1002SK3029PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、100 5 10开关电源2SK303SANYO N-JFET,低频一般放大30 2SK3042SK3030PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源100 8 102SK3031PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源100 15 202SK3032PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源100 25 102SK3033PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源100 40 602SK3034PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源100 40 602SK3035PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源150 3 102SK3036PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源150 6 202SK3037PANASONIC N-MOSFET,用于不接触继电器、螺线管驱动电路、电动机驱动电路、控制仪器、开关电源150 10 202SK303J ON N-JFET,硅N沟道结型场效应管,用于电压计、传感器、模拟开关、麦克风、音频设备。

AVX钽电容简单规格认识及全部型

AVX
2000
PCS
71
贴片钽电容
钽电容
TAJB685K060RNJ
±10% 6.8UF 10V 10% 1210
AVX
2000
PCS
72
贴片钽电容
钽电容
TAJB685M060RNJ
±20% 6.8UF 10V 20% 1210
AVX
2000
PCS
73
贴片钽电容
钽电容
TAJB335K020RNJ
±10% 3.3UF 20V 10% 1210
AVX
2000
PCS
56
贴片钽电容
钽电容
TAJA225M006RNJ
±20% 2.2UF 6.3V 20% 1206
AVX
2000
PCS
57
贴片钽电容
钽电容
TAJA156M006RNJ
±20% 15UF 6.3V 20% 1206
AVX
2000
PCS
58
贴片钽电容
钽电容
TAJA335M066RNJ
±20% 3.3UF 16V 20% 1206
AVX
2000
PCS
59
贴片钽电容
钽电容
TAJA475M020RNJ
±20% 4.7UF 20V 20% 1206
AVX
2000
PCS
60
贴片钽电容
钽电容
TAJA225K025RNJ
±10% 2.2UF 25V 10% 1206
AVX
2000
PCS
61
贴片钽电容
钽电容
TAJA475K020RNJ
±10% 4.7UF 20V 10% 1206

N32G452xB xC xE 数据手册说明书

N32G452xB/xC/xE数据手册N32G452系列采用32 bit ARM Cortex-M4F内核，最高工作主频144MHz，支持浮点运算和DSP指令，集成多达512KB Flash,144KB SRAM，2x12bit 5Msps ADC，2x1Msps 12bit DAC，集成多路U(S)ART、I2C、SPI、QSPI、USB、CAN、1x SDIO通信接口，内置密码算法硬件加速引擎关键特性●内核CPU―32位ARM Cortex-M4 内核+ FPU，单周期硬件乘除法指令，支持DSP指令和MPU―内置8KB 指令Cache缓存，支持Flash加速单元执行程序0 等待―最高主频144MHz，180DMIPS●加密存储器―高达512KByte片内Flash，支持加密存储、多用户分区管理及数据保护，支持硬件ECC校验，10万次擦写次数，10年数据保持―144KByte片内SRAM（包含16KByte Retention RAM），Retention RAM支持硬件奇偶校验●时钟―HSE：4MHz~32MHz外部高速晶体―LSE：32.768KHz外部低速晶体―HSI：内部高速RC OSC 8MHz―LSI：内部低速RC OSC 40KHz―内置高速PLL―支持1路时钟输出，可配置为可配置系统时钟、HSE、HSI或PLL后分频输出●复位―支持上电/掉电/外部引脚复位―支持可编程的低电压检测及复位―支持看门狗复位●通信接口―7个U(S)ART接口, 最高速率达4.5 Mbps，其中3个USART接口（支持1xISO7816，1xIrDA，LIN），4个UART接口―3个SPI接口，速度高达36 MHz，其中2个支持I2S―1个QSPI接口，速率高达144 Mbps―4个I2C接口，速率高达1 MHz，主从模式可配，从机模式下支持双地址响应―1个USB2.0 Full speed Device接口―2个CAN 2.0A/B总线接口―1个SDIO接口，支持SD/MMC格式●高性能模拟接口―2个12bit 5Msps高速ADC，多种精度可配置，6bit 模式下采样率高达9Msps，多达18路外部单端输入通道，支持差分模式―2个12bit DAC，采样率1Msps―支持外部输入独立参考电压源―所有模拟接口支持1.8~3.6V全电压工作●最大支持97个支持复用功能的GPIOs，大多数GPIO支持5V耐压.●2个高速DMA控制器，每个控制器支持8通道，通道源地址及目的地址任意可配●RTC实时时钟，支持闰年万年历，闹钟事件，周期性唤醒,支持内外部时钟校准●定时计数器― 2 个16bit高级定时计数器，支持输入捕获、输出比较、PWM输出以及正交编码输入等功能，最高控制精度6.9nS。

MEMORY存储芯片N25Q032A13ESE40F中文规格书

Table 33: 1.35V R TT Effective Impedance (Continued)ODT SensitivityIf either the temperature or voltage changes after I/O calibration, then the tolerancelimits listed in Table 32 and Table 33 can be expected to widen according to Table 34and Table 35.Table 34: ODT Sensitivity DefinitionNote: 1.˂T = T - T(@ calibration), ˂V = V DDQ - V DDQ(@ calibration) and V DD = V DDQ.Table 35: ODT Temperature and Voltage SensitivityNote: 1.˂T = T - T(@ calibration), ˂V = V DDQ - V DDQ(@ calibration) and V DD = V DDQ.ODT Timing DefinitionsODT loading differs from that used in AC timing measurements. The reference load forODT timings is shown in Figure 24. Two parameters define when ODT turns on or offsynchronously, two define when ODT turns on or off asynchronously, and another de-fines when ODT turns on or off dynamically. Table 36 and Table 37 (page 63) outlineand provide definition and measurement references settings for each parameter.ODT turn-on time begins when the output leaves High-Z and ODT resistance begins toturn on. ODT turn-off time begins when the output leaves Low-Z and ODT resistancebegins to turn off.4Gb: x4, x8, x16 DDR3L SDRAM Electrical Characteristics and AC Operating ConditionsCommand and Address Setup, Hold, and DeratingThe total t IS (setup time) and t IH (hold time) required is calculated by adding the data sheet t IS (base) and t IH (base) values (see Table 60; values come from the ElectricalCharacteristics and AC Operating Conditions table) to the ǻt IS and ǻt IH derating values (see Table 61 (page 104), Table 62 (page 104) or Table 63 (page 104)) respectively. Ex-ample: t IS (total setup time) = t IS (base) + ǻt IS. For a valid transition, the input signal has to remain above/below V IH(AC)/V IL(AC) for some time t VAC (see Table 64 (page 105)).Although the total setup time for slow slew rates might be negative (for example, a valid input signal will not have reached V IH(AC)/V IL(AC) at the time of the rising clock transi-tion), a valid input signal is still required to complete the transition and to reachV IH(AC)/V IL(AC) (see Figure 15 (page 53) for input signal requirements). For slew rates that fall between the values listed in Table 61 (page 104) and Table 63 (page 104), the derat-ing values may be obtained by linear interpolation.Setup (t IS) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of V REF(DC) and the first crossing of V IH(AC)min . Setup (t IS) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of V REF(DC) and the first crossing of V IL(AC)max . If the actual signal is always earlier than the nominal slew rate line between the shaded V REF(DC)-to-AC region, use the nominal slew rate for derat-ing value (see Figure 34 (page 106)). If the actual signal is later than the nominal slew rate line anywhere between the shaded V REF(DC)-to-AC region, the slew rate of a tangent line to the actual signal from the AC level to the DC level is used for derating value (see Figure 36 (page 108)).Hold (t IH) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of V IL(DC)max and the first crossing of V REF(DC). Hold (t IH) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of V IH(DC)min and the first crossing of V REF(DC). If the actual signal is always later than the nominal slew rate line between the shaded DC-to-V REF(DC) region, use the nominal slew rate for derat-ing value (see Figure 35 (page 107)). If the actual signal is earlier than the nominal slew rate line anywhere between the shaded DC-to-V REF(DC) region, the slew rate of a tangent line to the actual signal from the DC level to the V REF(DC) level is used for derating value (see Figure 37 (page 109)).Table 60: DDR3L Command and Address Setup and Hold Values 1 V/ns Referenced – AC/DC-Based4Gb: x4, x8, x16 DDR3L SDRAMCommand and Address Setup, Hold, and Derating。

NACV330M250V10x10.8TR13F中文资料

16®NIC COMPONENTS CORP. www www www www .SMTmagnetics.comSurface Mount Aluminum Electrolytic CapacitorsNACV SeriesFEATURES•CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNT •HIGH VOLT AGE (160VDC AND 400VDC)•8 x10.8mm ~ 16 x17mm CASE SIZES •LONG LIFE (2000 HOURS A T +105O C)•DESIGNED FOR REFLOW SOLDERING CHARACTERISTICSDIMENSIONS (mm)CE MOUNT RoHSCompliantincludes all homogeneous materials *See Part Number System for DetailsNACV 100 M 200V 10x10.8 TR 13 FRoHS Compliant97% Sn (min.), 3% Bi (max.) 330mm (13”) Reel Tape & Reel Size in mm Working VoltageT olerance Code M=20%, K=10% Capacitance Code in µF , fi rst 2 digits are signifi cant Third digit is no. of zeros, “R” indicates decimal for values under 10mF SeriesPART NUMBER SYSTEM0.3mm max.D φL+ -IIWPABSTANDARD PRODUCTS AND CASE SIZES (mm)MAXIMUM RIPPLE CURRENT(mA rms AT 120Hz AND 105°C)MAXIMUM ESR (Ω AT 120Hz AND 20°C)Rated Voltage Range 160200250400Rated Capacitance Range 10 ~ 8210 ~ 68 3.3 ~ 47 2.2 ~ 22Operating Temperature Range-40 ~ +105°C Capacitance Tolerance ±20% (M)Max. Leakage Current After 2 Minutes0.03CV + 15µA 0.02CV + 25µAMax. Tan δ @ 120Hz0.200.200.200.25Low Temperature Stability(Impedance Ratio @ 120Hz)Z-25°C/Z+20°C 3336Z-40°C/Z+20°C66610High Temperature Load Life at 105°C2,000 hrs φD > 10mm 1,000 hrs φD = 8mm Capacitance Change Within ±25% of initial measured value Tan δLess than 200% of specifi ed value Leakage CurrentLess than the specifi ed valueCap. (µF)Working Voltage 1602002504002.2---253.3--31364.7--37386.8--444710576464572211211211211533137137150-47180180180-68215215--82235---Cap. (µF)Working Voltage 1602002504002.2---188.53.3--100.5125.74.7--70.688.26.8--48.861.01033.233.233.241.52215.115.115.118.83310.110.110.1-477.17.17.1-68 4.9 4.9--824.0---Cap. (µF)Code Working Voltage1602002504002.22R2---8x10.83.33R3--8x10.810x10.84.74R7--8x10.810x10.86.86R8--8x10.812.5x14101008x10.810x10.810x10.812.5x142222012.5x1412.5x1412.5x1416x173333012.5x1412.5x1416x17-4747016x1716x1716x17-6868016x1716x17--8282016x17---Case Size D φ±0.5L max.A±0.2B±0.2I±0.2W P±0.28x10.88.010.88.38.3 2.90.7~1.0 3.210x10.810.010.810.310.3 3.2 1.1~1.4 4.612.5x1412.514.012.812.8 4.5 1.1~1.4 4.616x1716.017.016.316.35.01.8~2.17.0PRECAUTIONSPlease review the notes on correct use, safety and precautions found on pages T10 & T11of NIC’s Electrolytic Capacitor catalog . Also found at /precautionsIf in doubt or uncertainty, please review your specifi c application - process details withNIC’s technical support personnel: tpmg@元器件交易网。