Test 5 (L9)

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质量、品质专业术语

质量、品质专业术语

品质专业术语AFR Annual Failure Rate 年度返修率ACC Acceptable 允收-质量AQL Acceptable Quality Level 品质允收水准。

ASQ American Society for Quality 美国品质协会AVL Approved Vendor List 合格供应商清单-质量APQP Advanced Product Quality Plan 产品质量先期策划BOM Bill Of Material 材料清单B/R Batch Run 量试-质量C/R CorrectiveAction 矫正措施CA Customer Service Department 客户服务部—质量CAR Corrective Action Request 矫正措施要求CCC China Compulsory Certificate 中国强制认证(安规)CE Communate Europpene(法语)欧盟CET Customer Experience Test 顾客体验测试CIP Continuous Improvement Program 持续改善项目CLCA Closed Loop Corrective Action 闭环纠正措施CPK Process Capability Index 工序能力指数CSA Canadian Standards Association 加拿大标准协会(安规)CQC China Quality Certification Center 中国质量认证中心CR Control Run 控制运行(特控量试)DFA Design For Assembly 设计的组装性DFM Design For Manufacturing 设计的制造性DFSS Design For Six Sigma 6标准差设计-质量DOE Design Of Experiments 实验设计DPPM Defect Parts Per Million 百万分之不良率DPMO Defects Per Million Opportunities 百万分之不良机会DVT Design Verification Test 设计验证测试% E%DAP Dead after Purchase 购买后损坏DOA Dead On Arrival 开箱损坏ECN Engineering Change Notice 工程变更通知ECR Engineering Change Requirment 工程变更需求ESD Electric Static Discharge 静电放电EVT Engineering Verification Test 工程验证测试EMS Electronic manufacture service 电子制造服务FA Failure Analysis 不良分析FAI First Article Inspection 首件检验FIFO First In First Out 先进先出FPYR First Pass YieldRate 直通率FMEA Failure Mode Effect Analysis 失效模式影响分析FQA Final Quality Assurance 最终品质保证IPQC In Process Quality Control 制程品质管制IQC Incoming Quality Control 进料品质管制IFIR Initial Field Incident Rate 初期市场不良率JQE Joint Quality Engineer 共同品质工程师.KPI Key Performance Indication 关键业绩指标LRR Lot Reject Rate 批退率LSL Low Specification Limit 规格下限MRB Material Review Board 材料审核会议MSA Measurement System Analysis 测量系统分析ME ManufacturingEngineering 制造工程NCM Non-ConformanceMaterial 不合格品N/A NoneAvailable 不合适,不适用NG No Good 不良品NPL Non-Production Loss 非生产漏失ORT On Reliability Test 可靠性测试OQC Outgoing Quality Control 出货品质管制OEM Original equipment manufacturer 原设备制造者ODM Original Design Manufacturer 原设计制造者OBA Out of Box Audit 开箱检查PCB Printed Circuit Board 印刷电路板PCN Process Change Notice 制程变更通知PPAP Production Part Approval Process 生产件批准程序P/N Part Number 料号P/O PurchaseOrder 采购单(定购单)) PD Production Department 生产部PE ProductEngineering 产品工程(部)PQA Process Quality Assurance 制程品质保证PPR Production PilotRun 生产试做;QA Quality Assurance 品质保证—质量QC Quality Control 品质管制QCC Quality Control Cycle 品管圈QE Quality Engineer 品质工程QFD Quality Function Deployment 品质机能展开QRE Quality Reliability Engineer 品质可靠度工程QS Quality System 品质系统_QSA Quality System Audit 品质系统稽核QPA Quality Process Audit 制程品质稽核REJ Reject 判退RMA Returned Material Authority 客退品职责RPN Risk PriorityNumber 风险优先数SQE Supplier Quality Engineer 供应商品质工程师SCAR Supplier Corrective Action Report 供应商纠正措施报告SA Sample Approval 标准作业指导书S/N Serial Number 序列号SPC Statistical ProcessControl 统计制程管制ST Shipment Ticket 出货单SIP Supplier Quality Report Card 检验标准指导书SOP Standard Operation Procedure 作业标准指导书TQC Total Quality Management 全面品质管理TQM Total Quality Control 全面品质管理TÜV technischer überwachungsverein (德语)技术监督协会(安规)USL Upper Specification Limit 规格上限UL Underwriters Lab 美国保险商实验室(安规)VQA Vendor Quality Assurance 供应商品质保证WIP Work In Process 在制品W/H Ware House 仓库Y/R Yield Rate 良率1. 认可的实验室accredited laboratory2。

双氯芬酸钠乳膏处方的优化及体外释放度考察

双氯芬酸钠乳膏处方的优化及体外释放度考察

双氯芬酸钠乳膏处方的优化及体外释放度考察赵晓军1,刘影2(1.锦州医科大学附属第三医院;2.锦州医科大学,辽宁锦州121000) 摘要:目的 采用正交设计法优化双氯芬酸钠乳膏处方,并考察双氯芬酸钠乳膏的体外释放度及对皮肤的刺激性㊂方法 以吐温80㊁十八醇㊁凡士林㊁羊毛脂的用量作为考察因素,以双氯芬酸钠乳膏的外观性状㊁离心试验㊁耐热及耐寒试验是否分层为指标,采用L9(34)正交设计法优化乳膏剂处方,并采用HPLC法测定乳膏在释放介质中的累积渗透量,通过皮肤刺激性试验考察双氯芬酸钠乳膏的安全性㊂结果 通过正交设计的直观分析和方差分析法得出最佳处方吐温80为0.5g,凡士林0.95g,羊毛脂1.0g,十八醇0.8g;双氯芬酸钠乳膏的累积渗透量随时间呈等速率增加,且对皮肤无刺激性㊂结论 正交设计法优选的双氯芬酸钠乳膏外观性状良好,质量稳定,且双氯芬酸钠乳膏的累积渗透量与时间呈良好的线性关系,安全可靠㊂关键词:双氯芬酸钠;乳膏;处方优化;体外释放中图分类号:R925 文献标志码:A 文章编号:2096-305X(2021)01-0010-04Formulation Optimization and in Vitro Release of Diclofenac Sodium CreamZhao Xiaojun1,Liu Ying2(1.The Third Affiliated Hospital of Jinzhou Medical University;2.Jinzhou Medical University,Jinzhou121000China)Abstract:Objective To optimize the formulation of diclofenac sodium cream with orthogonal design,and investigate the in vitro release of diclofenac sodium cream and its irritation to the skin.Methods Tween80,stearyl alcohol,Vaseline,and lanolin were taken as factors for investigation.The appearance of diclofenac sodium cream,centrifugal test,heat resistance and cold resist⁃ance test were used as indicators.L9(34)orthogonal design was used to optimize the formulation of diclofenac sodium cream.The cu⁃mulative penetration of the cream was determined by HPLC.The safety of diclofenac sodium cream was investigated by skin irritation test.Results The visual analysis of orthogonal design and analysis of variance showed that0.5g of Tween80,0.95g of Vaseline, 1.0g of Lanolin and0.8g of stearyl alcohol made the best formulation.The cumulative penetration of diclofenac sodium cream in⁃creased at a constant rate over time,without any irritation to the skin.Conclusion Diclofenac sodium cream optimized by orthogonal design has good appearance and stable quality.The cumulative penetration of diclofenac sodium cream has a good linear relationship with time,making the cream safe and reliable.Key words:diclofenac sodium;cream;formulation optimization;in vitro release 双氯芬酸钠属于非甾体类抗炎药,具有解热镇痛㊁抗炎的作用,其镇痛活性是吲哚美辛的6倍,阿司匹林的40倍㊂解热作用是吲哚美辛的2倍,阿司匹林的350倍㊂临床上用于缓解类风湿性关节炎㊁骨关节炎㊁痛风性关节炎,是疼痛发作期的常规用药㊂该药口服吸收快,半衰期短,达峰时间快,临床疗效好,但在水中溶解度较小,对胃肠道的刺激性较大,患者不易耐受,降低了双氯芬酸钠的药物疗效,限制了该药在治疗骨关节肿痛方面的广泛使用[1-2],本实验将双氯芬酸钠制成软膏剂局部外用给药㊂软膏剂可以避免口服药可能发生的肝首过效应及胃肠灭活,提高疗效;能够维持恒定的最佳血药浓度,减少胃肠给药的副作用;还可以延长作用时间,减少给药次数;通过改变给药面积调节给药剂量,减少个体内和个体间差异,患者可以自主用药也可以随时停药[3]㊂一般剂型一日多次给药后所产生的血药浓度峰谷波动性不易避免,即便是口服用的缓释剂型也排除不了胃肠道吸收部位的差异,而透皮给药制剂采用比较稳定的皮肤局部用药,在给药期间的吸收总量和速度不会出现明显01锦州医科大学学报J Jinzhou Medical University2021Feb.42(1) 基金项目:辽宁省教育厅科学研究项目,项目编号:JYTZCZR2020070㊂ 作者简介:赵晓军(1988),女,辽宁锦州人,初级药师,硕士学位,主要研究方向为固体新剂型㊂的改变㊂1 材 料1.1 仪器设备L-2000型高效液相色谱仪(日本日立分光公司);HLD型电子天平(上海力辰科技有限公司); 85-2WS型磁力搅拌器(上海沪析有限公司);电热鼓风干燥箱(易诚仪器设备有限公司);BCD-235WE3CX型美菱冰箱(合肥美菱股份有限公司);SN-LSC离心机(盐城市凯特实验仪器有限公司);微孔滤膜(深圳逗点生物科技有限公司);透皮渗透吸收仪(上海玉研科学仪器有限公司)㊂1.2 试剂双氯芬酸钠原料药(批号:20180927,广州杨叶生物科技有限公司);双氯芬酸钠对照品(批号:20180723,深圳恒丰万达医药科技有限公司);吐温80(江苏省海安石油化工厂)㊁十八醇(江苏省海安石油化工厂)㊁单硬脂酸甘油酯(天山药业);羊毛脂(天山药业)㊁凡士林(南昌白云药业有限公司)㊁甘油(天津市致远化学试剂公司)㊁山梨酸钾(天津市致远化学试剂公司);乙腈(深圳恒丰万达医药科技有限公司)㊁甲醇(深圳恒丰万达医药科技有限公司)㊁冰醋酸(河南凯帝荣誉出品)㊂1.3 动物小鼠㊁家兔均由锦州医科大学动物养殖处提供㊂2 实验过程2.1 乳膏剂的制备2.1.1 双氯芬酸钠乳膏剂的质量评估方法: (1)润滑无刺激㊁黏稠度适中㊁均匀且细腻㊁易于涂布;(2)耐热试验与耐寒试验:将双氯芬酸钠软膏剂放在乳膏盒中,在60℃的烘箱中放置6 h,-20℃的冰箱中放置24h,取出乳膏待恢复到室温,观察乳膏是否出现发硬㊁油水分层㊁合并与破裂等现象;(3)离心实验:取双氯芬酸钠乳膏剂适量放在离心管中,在5000r/min的速度下离心共25min,观察离心试验后的乳膏剂是否会出现水油分离的现象[4-5]㊂2.1.2 通过初步筛选,吐温80(A)㊁凡士林(B)㊁羊毛脂(C)㊁十八醇(D)是决定双氯芬酸钠乳膏剂稳定性的主要因素,将以上4个组分作为考察因素,每个因素设置3个水平[6-7],见表1㊂表1 正交设计因素与水平表水平因素A B C D10.40.551.00.820.50.751.50.930.60.952.01.0 按照正交设计表L9(34)进行试验,共构成9组配方,每个处方总量为10g,按照2.1.1项下双氯芬酸钠乳膏剂的质量评估方法进行评分,外观性状占10分,离心实验占10分,耐热耐寒试验占10分,正交试验设计结果见表2㊂表2 双氯芬酸钠乳膏处方的正交试验设计与结果编号A B C D分数1111121 2122219 3133321 4212322 5223124 6231227 7313222 8321323 9332124K161657169K273666568K369726766k120.3321.6723.6723k224.332221.6722.67k3232422.3322R42.3321 正交设计表中R值越大对试验结果影响越大, k值最大者为最佳因素,根据表2结果,通过直观分析可以看出各因素对双氯芬酸钠乳膏剂稳定性的影响顺序为吐温80>凡士林>羊毛脂>十八醇,即A >B>C>D,乳膏剂的最佳处方为A2㊁B3㊁C1㊁D1㊂通过方差分析得出因素A㊁B的P值<0.05,说明差异有统计学意义,因素C对试验结果有影响,因此A和B是主要的因素,C和D是次要的因素,最佳处方为A2㊁B3㊁C1㊁D1,见表3㊂2.1.3 防腐剂的选择:吐温80能与羟苯酯类㊁季铵盐类等络合进而抑制防腐剂的效能,使防腐剂失去活性,因此本实验选用山梨酸作为防腐剂,用量约为0.20%㊂2.1.4 透皮吸收促进剂的选择:良好的透皮促进剂应该对皮肤没有任何刺激作用,没有药理作用,11赵晓军,等:双氯芬酸钠乳膏处方的优化及体外释放度考察不致敏皮肤,物理化学性质均稳定,易溶于药物和材料,起效快,作用时间长㊂本实验选用月桂氮卓酮为促渗透剂,其有效浓度常在1%~6%范围内㊂表3 双氯芬酸钠乳膏剂的方差分析结果方差来源离差平方和自由度均方F值PA47.68223.8472.653<0.05 B17.8528.92526.154<0.05 C7.4023.709.803>0.10 D0.6520.3252.1.5 最终处方:经查阅文献[8-9]及市场上已有外用制剂双氯芬酸钠的含量为0.9%~1.3%,本处方将双氯芬酸钠含量定位1%,因此最终处方为双氯芬酸钠0.1g,硬脂酸0.7g,吐温80为0.5 g,十八醇0.8g,羊毛脂1.0g,凡士林0.95g,甘油1.0g,月桂氮卓酮0.5g,山梨酸钾0.02g,去离子水加至10g㊂2.1.6 软膏剂制备:按照2.1.5项下处方量将硬脂酸㊁十八醇㊁羊毛脂㊁凡士林㊁月桂氮卓酮加热到80℃熔化为油相,双氯芬酸钠㊁甘油㊁吐温80㊁山梨酸钾㊁去离子水加热到80℃溶化为水相,使油相和水相均完全溶解,然后将水相缓慢的加入到油相中,边加水相边搅拌,直到冷凝即得乳膏剂㊂2.1.7 验证试验:按最优处方制备双氯芬酸钠乳膏,按照2.1.1项的方法对乳膏剂进行稳定性考察,结果显示所制得的双氯芬酸钠乳膏剂符合质量要求㊂2.2 双氯芬酸钠乳膏剂的体外透皮实验2.2.1 色谱柱:C18柱(260mm×4.7mm);流动相:甲醇0.005mol/L磷酸二氢钾溶液(pH=3.8)(70∶30),检测波长280nm;取对照品溶液10μL注入液相色谱仪[10],见图1㊂2.2.2 制备标准曲线:精密称取双氯芬酸钠对照品10mg,置于50mL量瓶中使双氯芬酸钠溶解,用甲醇稀释至刻度㊂然后用甲醇分别稀释成浓度为0.24㊁0.4㊁0.8㊁2.4㊁4.8㊁7.2μg/mL的溶液,采用高效液相色谱法测定,双氯芬酸钠在此范围内线性方程为y=81345.1259x+21423.1893,r= 0.9999㊂2.2.3 仪器精密度试验:精密吸取储备液5.0 mL,配成浓度为5.0μg/mL的双氯芬酸钠溶液,重复进样3次,双氯芬酸钠峰面积的RSD为0.87%㊂图1 双氯芬酸钠对照品色谱图2.2.4 体外透皮试验:取小鼠将其断颈处死,用剪刀将小鼠腹部体毛剃净,再用硫化钠溶液脱掉剩余鼠毛,取腹部无损伤处皮肤,用0.9%的氯化钠溶液冲洗小鼠皮肤内表面,把处理好的小鼠皮肤放在扩散池上室和下室中间,角质层应朝向上方,甲醇作为接收液,取0.5g双氯芬酸钠乳膏均匀涂布于小鼠皮肤上,扩散池放在37℃水浴中搅拌,分别于2㊁4㊁6㊁8㊁10㊁12h取样,取样后同时补加同温度等体积的接受液[11-16]㊂样品用0.45μm 微孔滤膜过滤,取10μL样品注入高效液相色谱仪计算累积渗透量(Q),计算公式如下,见表4㊂表4 双氯芬酸钠乳膏剂的累积渗透量(Q)时间(h)累积渗透量(μg/cm2)123平均值(μg/cm2) 225.6426.5826.8926.37434.5335.5235.8235.29645.1844.8945.7345.27857.5658.2857.7357.861071.2670.8771.5471.221283.4784.2384.3984.03 以累积渗透量Q(μg/cm2)对时间(t)制作的曲线可知双氯芬酸钠乳膏剂的渗透量随时间的延长逐渐增大,且几乎等速率增加,回归方程为Q= 5.8383t+12.472,R2=0.9940,P<0.05,说明双氯芬酸钠乳膏剂具有很好的渗透性,见图2㊂2.3 双氯芬酸钠乳膏剂的皮肤刺激性试验取家兔16只,雌雄各半,给药前24h剃净背部脊椎两侧兔毛,分为完整皮肤组和破损皮肤组㊂其中8只完整皮肤组随机分成两组,即空白对照组㊁双氯芬酸钠乳膏组,分别将1g乳膏均匀涂抹21锦州医科大学学报 2021年2月,42(1)于背部脊椎两侧,另8只家兔用注射针在完整皮肤上划出数条划痕以渗血为宜,分组及给药方法同正常皮肤组,每8h给药1次,24h后用生理盐水清洗掉乳膏剂㊂分别于给药后1㊁24㊁48㊁72h时观察涂抹部位有无红斑和水肿等情况及恢复情况[17-20]㊂图2 双氯芬酸钠乳膏剂的释放曲线试验结果表明完整皮肤刺激试验中涂抹双氯芬酸钠乳膏与涂抹空白乳膏的家兔皮肤均未出现红斑和水肿,表明双氯芬酸钠乳膏无刺激性㊂破损皮肤刺激试验中在划痕区涂抹双氯芬酸钠乳膏和空白乳膏后,均未见红斑及水肿,同样表明双氯芬酸钠乳膏无刺激性㊂3 讨 论在实际应用中发现乳膏长期贮存后有时会出现破乳㊁分层㊁絮凝等不稳定现象,本实验采用正交设计法优化双氯芬酸钠乳膏处方,结果表明本处方可以有效避免乳膏剂的不稳定问题㊂吐温80为双氯芬酸钠乳膏的主乳化剂,其用量关系到乳膏制剂的稳定性和有效性;凡士林化学性质稳定,无刺激性,但仅能吸收5%的水,加入适量的羊毛脂可提高凡士林吸水性与渗透性,两者合用可以起到很好的保湿作用,十八醇既可作辅助乳化剂,又具有调节乳膏稠度的作用,提高软膏剂的稳定性能㊂常用的透皮吸收促进剂有表面活性剂㊁二甲基亚砜及其类似物㊁月桂氮卓酮等,表面活性剂类促进渗透效果差,连续应用后会引起红肿㊁干燥或粗糙化㊂二甲基亚砜长时间大量应用对皮肤有刺激性和恶臭,甚至引起肝损害和神经毒性等,通过透皮渗透实验表明选用月桂氮卓酮为促渗透剂效果良好㊂体外透皮渗透实验结果表明双氯芬酸钠软膏剂具有良好的渗透性能,且对完整皮肤及破损皮肤均无刺激性,进而更好的发挥临床作用㊂参考文献:[1] 乔明艳.国内双氯芬酸钠制剂开发概况[J].实用药物与临床,2010,13(5):379-380.[2] 苏娜,徐娜,唐尧.双氯芬酸钠致不良反应的文献分析[J].中国药业,2008,17(17):44-45.[3] 江敏瑜,闫丹,陈娇,等.三七跌打软膏的制备及体外透皮特性研究[J].中草药,2017,48(22):4639-4647. [4] 胡帅,刘建霞,刘光明,等.美洲大蠊提取物软膏剂制备[J].世界最新医学信息文摘,2019,19(66):325-326.[5] 赵梦冉,曹晓绵,王淑君.中药消炎软膏制备工艺优化[J].沈阳药科大学学报,2018,35(10):817-824. [6] 单冰冰,陈宽,李婷,等.正交设计优化双斛胶囊的总多糖水提取工艺[J].中国药房,2019,30(18):2508-2512.[7] 刘剑敏,唐静宜,程路,等.正交设计优化磷酸川芎嗪-冰片脂质体的制备工艺[J].中国药业,2019,28(11):44-47.[8] 王军.双氯芬酸钠巴布剂的制备及体外透皮研究[J].中国药师,2009,5(12):573-575.[9] 王梦雨,刘祖雄,陈鹰.复方双氯芬酸钠成膜凝胶的制备及质量控制[J].中国药师,2020,23(3):462-467. [10] 贾燕花,高磊,王晓青,等.HPLC法测定双氯芬酸钠凝胶中双氯芬酸钠的含量[J].实用药物与临床,2015,18(6):694-695.[11] 覃福洪,尹亮,祁欣.低频超声促进双氯芬酸钠经皮渗透的研究[J].中南药学,2017,15(8):1044-1048. [12] 施璐,柳晓凤,王宏,等.双氯芬酸钠温敏凝胶剂的制备及其体外释放研究[J].江汉大学学报,2018,46(6):538-542.[13] 何一鸣,张蜀,邓红,等.盐酸特比萘芬乳膏的释放度考察[J].中国新药杂志,2015,24(4):462-465. [14] 张旸,王庆伟,赵欢欢,等.复方根皮素乳膏中根皮素㊁藁本内酯体外透皮吸收研究[J].中国药师,2017,20(6):1038-1041.[15] 魏嘉宝,杨凡,谢加庭,等.光甘草定凝胶和乳膏剂的体外释药研究[J].中国药房,2018,29(17):2346-2350.[16] 黄天擎,何瑞曦,陈贺骏涛,等.丹皮酚泡囊乳膏的制备及其体外透皮吸收考察[J].安徽中医药大学学报,2016,35(3):79-83.[17] 苗杰,王爱武,杨柳,等.盐酸普萘洛尔乳膏的安全性考察[J].安徽盐医药,2014,18(6):1020-1023. [18] 向翠英,杨刚,杨冰,等.丁酸氯倍他松乳膏的家兔皮肤刺激性和豚鼠皮肤过敏性研究[J].中国药房,2020,31(3):330-334.[19] 杨小云,王素晓,黄贝贝.复方苦参水杨酸乳膏剂的制备及皮肤刺激性评价[J].时珍国医国药,2018,29(2):339-341.[20] 邓绍友,李丽,杨仁华,等.七参连湿疹膏对幼龄动物皮肤刺激性和过敏性的影响[J].云南医药,2019,40(4):345-351.收稿日期:2020-10-2231赵晓军,等:双氯芬酸钠乳膏处方的优化及体外释放度考察。

麦芽糊精在冰淇淋中增稠稳定作用的研究

麦芽糊精在冰淇淋中增稠稳定作用的研究
本研究所用麦芽糊精是玉米淀粉在α-淀粉酶的作用 下水解和支链化的产物,当 D E 值为 9 % ~1 2 % 时,一 部分聚合度较高的分子转化为聚合度较低的分子,可有 效阻止糊化淀粉重新有序排列,抑制淀粉老化作用的发 生[ 5 ] ,从而防止冰淇淋在冷冻贮存过程中硬缩及口感变
※工艺技术
食品科学
2006, Vol. 27, No. 11 235
表 1 L9(34)正交试验因素与水平 Table 1 Factors and levels of L9(34) orthogonal test
因素






麦芽糊精
麦芽糊精
羧甲基纤维素钠
单甘酯
DE 值
用量(%)
与明胶用量(%)
用量(%)

10
表 3 不同配方混合料及产品性能测定结果 Table 3 Results of performance on mixture material and
products with different formulations
试验 序号
1 2 3 4 5 6 7 8 9
5.0
0.0
0.1

15
7.0
0.4
0.3

20
9.0
0.8
0.5
1.3.2 生产工艺流程 麦芽糊精→调制糊精浆 ↓ 原辅料预处理→混合调配→杀菌→过滤→均质→冷
却→老化→凝冻→软质冰淇淋→灌装封口→速冻硬化→ 硬质冰淇淋→成品
1.3.3 操作要点
1.3.3.1 原辅料预处理及混合调配 将CMC-Na与明胶 按比例混合后再与其质量三倍的绵白糖混合均匀,加适 量水并经胶体磨处理后加入杀菌锅中,边搅拌边加热并 加入剩余绵白糖、果葡糖浆、全脂奶粉及单甘酯。

凯镭思互调仪操作手册(中英文)

凯镭思互调仪操作手册(中英文)

F
升级标题页添加Summitek/Triasx 商标和联系方式
22/06/09
(IR7317)
Updates. New state editor GUI. (IR7402)
G
升级,新版本的测试设置文件编辑器用户界面
(IR7402)
17/08/09
Authorisation 批准
PDS PDS PDS TN
B
removed.
17/04/08
升级1.3.2和1.3.5 删除USB窗口
Changes to section 1.5 by adding report number to the state
C
editor GUI.
16/05/08
升级1.5在测试设置文件编辑器中添加报告编号
Changes to AC specifications in section 1.2 and section
WA R N I N G- RF HAZARD 警告—射频危害
This equipment is designed for use in association with radio frequency (RF) radiating systems and is capable of producing up to 50W of RF power in the 800 to 2200 MHz region. Users are reminded that proper precautions must be taken to minimise exposure to these RF fields to the recommended limits. Please pay particular care to the following areas: 此设备设计用于无线电射频(RF)发射系统,能够在800至2200兆赫的射频区域内 产生高达50瓦的射频功率(RF)。用户应注意,必须采取适当的预防措施,尽量 减少暴露在射频区域里,保持在建议的范围内。请特别注意以下几个方面:

香菇液体菌种培养基及摇瓶培养条件优化

香菇液体菌种培养基及摇瓶培养条件优化

Edible and medicinal mushrooms2021,29(3):242~249香菇液体菌种培养基及摇瓶培养条件优化谢婷1何娟1张顺凯2焦海涛2边银丙1肖扬1*(1.华中农业大学应用真菌研究所,武汉430070;2.湖北森源生态股份有限公司,湖北宜昌444200)摘要建立液体菌种优质高效生产技术体系是香菇工厂化生产的重要保障。

以香菇‘森源16’为试验菌株,选择菌丝生物量、菌丝球密度和直径为主要评价指标,采用单因素和正交试验L9(34)优化香菇摇瓶液体发酵工艺。

结果:棉秆粉为最佳碳源,麸皮为最佳氮源;优化培养基配方为葡萄糖3g/100mL,棉秆粉1.5g/100mL,木屑粉1.5g/100mL,麸皮0.6g/100mL,KH2PO40.1g/100mL,MgSO4·7H2O0.05g/100mL;最优摇瓶发酵条件为装液量100mL/250mL,摇床转速170r/min,初始pH5.5,羧甲基纤维素钠0.20g/100mL,漆酶0.05g/100mL。

关键词香菇;液体菌种;培养基优化;摇瓶发酵;条件优化中图分类号:S646文献标识码:B文章编码:2095-0934(2021)03-242-08 Optimization of liquid spawn media and shake flask culture conditionsof Lentinula edodesXie Ting1He Juan1Zhang ShunKai2Jiao Haitao2Bian Yinbing1Xiao Yang1*(1.Institute of Applied Mycology,Huazhong Agricultural University,Wuhan,Hubei430070,China;2.Hubei SenyuanEcological Co.,Ltd.,Yichang,Hubei444200,China)Abstract The establishment of a high-quality and high-efficiency production technology system for liquid spawn is an important guarantee for the factory production of Lentinula edode s.In this study,Senyuan No.16was used as the test strain,and the mycelial biomass,mycelial ball density and diameter were used as the main evaluation indicators.Single factor test and orthogonal test L9(34)were used to optimize the liquid culture process of L.edodes in shaking flasks. Results showed that cotton stalk powder is the best carbon source and wheat bran is the best nitrogen source.The optimized medium formula is glucose3g/100mL,cotton stalk powder1.5g/100mL,wood chip powder1.5g/100mL, wheat bran0.6g/100mL,KH2PO40.1g/100mL and MgSO4·7H2O0.05g/100mL.The optimal culture conditions for shake flasks are100mL/250mL of liquid volume,170r/min of shaker speed,initial pH of5.5,sodium carboxymethyl cellulose0.25g/100mL,laccase0.05g/100mL.Key words Lentinula edode s;liquid spawn;medium optimization;shake flask culture香菇(Lentinula edodes)营养丰富,味道鲜美,被誉为“山珍之上品”,且具有抗病毒、免疫调节、健胃、助消化、抗炎症、抗菌和抗肿瘤等活性[1,2]。

斑马技术公司DS8108数字扫描仪产品参考指南说明书

斑马技术公司DS8108数字扫描仪产品参考指南说明书
Chapter 1: Getting Started Introduction .................................................................................................................................... 1-1 Interfaces ....................................................................................................................................... 1-2 Unpacking ...................................................................................................................................... 1-2 Setting Up the Digital Scanner ....................................................................................................... 1-3 Installing the Interface Cable .................................................................................................... 1-3 Removing the Interface Cable .................................................................................................. 1-4 Connecting Power (if required) ................................................................................................ 1-4 Configuring the Digital Scanner ............................................................................................... 1-4

5折交叉验证 训练集 测试集 验证集

5折交叉验证 训练集 测试集 验证集

5折交叉验证训练集测试集验证集下载提示:该文档是本店铺精心编制而成的,希望大家下载后,能够帮助大家解决实际问题。

文档下载后可定制修改,请根据实际需要进行调整和使用,谢谢!本店铺为大家提供各种类型的实用资料,如教育随笔、日记赏析、句子摘抄、古诗大全、经典美文、话题作文、工作总结、词语解析、文案摘录、其他资料等等,想了解不同资料格式和写法,敬请关注!Download tips: This document is carefully compiled by this editor. I hope that after you download it, it can help you solve practical problems. The document can be customized and modified after downloading, please adjust and use it according to actual needs, thank you! In addition, this shop provides you with various types of practical materials, such as educational essays, diary appreciation, sentence excerpts, ancient poems, classic articles, topic composition, work summary, word parsing, copy excerpts, other materials and so on, want to know different data formats and writing methods, please pay attention!5折交叉验证详解:优化模型训练的终极策略在机器学习中,为了评估和优化模型的性能,我们经常使用交叉验证技术。

基于正交试验的X80管线钢MIG焊工艺优化

基于正交试验的X80管线钢MIG焊工艺优化

Tab 3 Thermal and physical properties of X80 pipeline steel
温度 T /℃
20 100 200 400 800 1 200
比热容 c/(J·kg−1℃−1)
423 476 536 662 914 1 160
密度 ρ/(g·cm−3)
7.81 7.79 7.77 7.72 7.61 7.50
弹性模量 E/GP度 σ/MPa
641 623 597 550 100 15
热导率 λ/(W·m−1℃−1)
54.42 54.01 52.75 47.71 27.55
40
1.4 焊接热源及边界条件 焊接热源采用双椭球型热源,使用“生死单元”的方法加载到焊缝,热源在焊缝的移动通过时间步的增加
侯 阳1 ,李雪芝1 ,周建平1 ,王恪典1,2 †
(1. 新疆大学 机械工程学院,新疆 乌鲁木齐 830047;2. 西安交通大学 机械工程学院,陕西 西安 710049)
摘 要 :为优化X80管线钢MIG焊的工艺参数,对MIG焊过程中的电弧电压、焊接电流、焊接速度、坡口间隙四个工艺 参数进行了正交试验,以焊接接头应力峰值为评价指标,使用极差分析方法,获得了最优的工艺参数.借助ANSYS软件 对最优的工艺参数进行模拟计算,得到了应力峰值在接头处的分布情况.结果表明:极差分析法能有效获得最优工艺参 数,且焊接速度是接头处应力峰值的主要影响因素,其次为电弧电压、焊接电流、坡口间隙.研究结果为优化X80管线 钢焊接工艺、有效减小焊后应力峰值提供了参考. 关键词 : 正交试验;应力峰值;极差分析;数值模拟 DOI :10.13568/ki.651094.651316. 2020.04.23.0001 中图分类号:TG42 文献标识码:A 文章编号:2096-7675(2021)04-0507-06 引文格式:侯阳, 李雪芝, 周建平, 等.基于正交试验的X80管线钢MIG焊工艺优化[J]. 新疆大学学报(自然科学版) (中英文), 2021, 38(4): 507-512. 英文引文格式:HOU Y, LI X Z, ZHOU J P, et al.MIG welding process optimization of X80 pipeline steel based on orthogonal test[J].Journal of Xinjiang University(Natural Science Edition in Chinese and English), 2021, 38(4): 507-512.

ANSI-TIA-EIA-568-B.2-1 Cat.6 June 20 2002

ANSI-TIA-EIA-568-B.2-1 Cat.6 June 20 2002
Standards and Publn accordance with the American National Standards Institute (ANSI) patent policy. By such action, TIA/EIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication.
PUBLICATIONS or call Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956)
All rights reserved Printed in U.S.A.
PLEASE! DON'T VIOLATE
This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use.
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不老草黄酮提取工艺及其抗氧化功效研究

不老草黄酮提取工艺及其抗氧化功效研究

2021年第10期广东化工第48卷总第444期·51·不老草黄酮提取工艺及其抗氧化功效研究王丽华,胡露,魏瑞敬,张伟强,郭朝万*(广东丸美生物技术股份有限公司,广东广州510530)Extraction of Flavonoids from Boschniakia Rossica and Anti-oxidation in VitroWang Lihua,Hu Lu,Wei Ruijing,Zhang Weiqiang,Guo Chaowan*(Guangdong MARUBI Biotechnology Co.,Ltd.,Guangzhou510530,China)Abstract:Total flavonoids were prepared by ultrasonic-assisted extraction.On the basis of single factor experiment,orthogonal experiment methods to carry on the four factors three levels orthogonal optimization,the optimum extraction process conditions for the extraction solvent was50%ethanol,ultrasonic extraction time was1.5h,extraction temperature was70℃,and solid-liquid ratio was1︰60,ultrasonic power380w,crude extract concentration alcohol,the D4020 macroporous resin purificationwithflow rate of2mL/min,the sample weight2.09BV,analytical solution by60%ethanol.The extraction yield of total flavonoids reached(3.00±0.04)%and the content of flavonoids in lyophilized powder was(34.60±1.63)%.DPPH·scavenging test,ABTS+·scavenging test and FRAP total antioxidant activity were used to test the antioxidant activity of total flavonoids in T.brassica.The results showed that the DPPH·scavenging ability, ABTS+·scavenging ability and the reducing ability of potassium ferricyanide were gradually increased in a dose-dependent manner.The concentration for50%of maximal effect(EC50)was0.0404mg/mL for DPPH and0.97mg/mL for ABTS+·.The results showed that the extract had good antioxidant activity in vitro.The moisturizing and hygroscopic effects of the total flavonoids of brachium officinalis were tested by weighing method.The results showed that the total flavonoids of brachium officinalis had certain moisturizing effects.Keywords:Ultrasonic extraction;Boschniakia rossica;orthogonal experiment;Flavonoids;Antioxidant1前言不老草,又名草苁蓉,是草苁蓉属被子植物,属列当科,在民间传说能使人“长生不老”[1]。

scum数学题

scum数学题

Scrum是一个敏捷软件开发框架,它没有直接涉及到数学题。

但是,如果你想找到与Scrum相关的数学题,可能需要将Scrum的概念和数学问题结合起来。

以下是一个简单的例子:
题目:一个Scrum团队正在开发一个项目,他们计划在30天内完成。

他们每天的工作量是相同的,并且每天可以完成1/30的工作。

如果团队在10天内完成了1/5的工作,那么他们还需要多少天才能完成剩下的工作?
答案:首先,我们知道整个项目需要30天来完成。

每天完成的工作量是1/30。

团队在10天内完成了1/5的工作,这意味着他们已经完成了10 * (1/30) = 1/3的工作。

剩下的工作是2/5,所以他们还需要完成2/5 * 30 = 12天的工作。

这只是一个简单的数学题示例,你可以根据Scrum的概念和项目管理知识来设计更复杂的问题。

雅思听力历年真题试卷汇编15_真题-无答案

雅思听力历年真题试卷汇编15_真题-无答案

雅思(听力)历年真题试卷汇编15(总分80,考试时间90分钟)1.Complete the notes below.Write ONE WORD AND/OR A NUMBER for each answer.DRIVING SCHOOLExample AnswerLooking for driving lessons given during the: weekendsAddress: 【L1】______RoadDrive: the city center【L2】______above the cityTeacher&#39;s name: Allen 【L3】______Popular type of car on roads: 【L4】______Had better: practice during the 【L5】______Safety driving depends on: good 【L6】______Obtain: a driving 【L7】______Final test fee: 【L8】$______Duration of test: approx 【L9】______ minutesMore advice: keep a driving 【L10】______【点此下载音频文件】1. 【L1】2. 【L2】3. 【L3】4. 【L4】5. 【L5】6. 【L6】7. 【L7】8. 【L8】9. 【L9】10. 【L10】Complete the sentences below.Write ONE WORD AND/OR A NUMBER for each answer.Mount Rush more【点此下载音频文件】11. The government finally paid $______to complete the heads of four United States Presidents.12. The purpose of the construction of the president&#39;s heads is to develop______13. The carvings face______to experience maximum exposure to sunlight.14. In 1885, the mountain was renamed after a______15. It took______years to finish the project.Label the map below.Write the correct letter, A-E, next to questions 16-20.16. information centre17. refreshment centre18. gift shop19. workshop20. visitor centreChoose the correct letter, A, B or C.【点此下载音频文件】21. Why does the student want to study Tourism?A. good futureB. good payC. parents&#39;will22. What kind of skill will the student gain in the course?A. time-managementB. financial planningC. note-taking23. The student has the ability ofA. independence.B. communication.C. coping well with statistics.24. The teacher believes that the industry of tourism isA. shrinking.B. seeing a bright future.C. growing popular.25. How does the **pare the university course with polytechnics?A. There are summer schools.B. The course is structured in modules.C. The price is reasonable.What feature do the speakers identify for each of the following courses?Choose FIVE answers from the box and write the correct letters, A-G, next to questions 26-30.FeaturesA limited valueBusefulC relevant to careerD flexible admissionE intensiveF improving leadershipG self-control and time managementCourses26. Travel and Business27. Japanese28. Medical Care29. Computer30. Public RelationsComplete the notes below.Write NO MORE THAN TWO WORDS for each pany OutsourcingCase study - TCP Technologies:Manager: Manjeet Khanna Main target: to create a【L31】______ environmentGrading for staff: Every month grades are published on an 【L32】______ The cultural openness increased the quantity of incoming contracted opportunities. The cultural openness improved the level of 【L33】______ of **pany. The increased rate of staff satisfaction has led to growth of 32% in the 【L34】______Recent interview: A company is not one **prised of components, but a living **posed of cells. Manjeet&#39;s motto is 【L35】______Benefits of management style: The rate of staff turnover has been reduced. A 【L36】______ can be from any **pany. Grades are not used for 【L37】______Features of managing style: Personally, the manager wrote emails to respond to **plaints. **plaint form known as a 【L38】______ has access to all employees online. The manager can receive **plaints concerning air conditioning, food quality and 【L39】______ entitlement. A 【L40】______ on the **plaint was introduced in the new system.【点此下载音频文件】31. 【L31】32. 【L32】33. 【L33】34. 【L34】35. 【L35】36. 【L36】37. 【L37】38. 【L38】39. 【L39】40. 【L40】。

乐易突破英语五级单元测试卷3

乐易突破英语五级单元测试卷3

《乐易突破英语》第五册单元测试卷Unit 3Listening TestI.Listen and number(听音排序)(5分)最好的(L7)点菜(L7)和---一样(L8)理发店(L9)水族馆(L9)II.Listen and choose the best response to the sentence you hear(听录音,选择最佳答案)(10分)( ) 1. A. Apple B. Porridge. C. Pork.( ) 2. A. All right. B. Thank you. C. Yes, a bowl of beef noodles. ( ) 3. A. That’s good. B. Never mind. Practice makes perfect.C. A good idea.( ) 4. A. I was in my study. B. I don’t know. C. I can’t.( ) 5. A. Last year. B. Three times a month. C. In the pool.III.Listen and tell “true”(T) or “false”(F)(听录音判断对错)(10分)( ) 1. Bob Pearson has six children.( ) 2. Bob Pearson is a nice young man.( ) 3. Nikon is a Japanese girl.( ) 4. Bill and Mike are from England.( ) 5. Nikon and Lanlan like toy animals.Writing TestI.Write the words according to the sounds(根据音标写单词)(5分)1. I am not ___ [ˈhʌŋɡri].2. Which dress is the ___ [məust] beautiful one?3. He is a ___ [səkˈsesful]business man.4. How can I get to your ___ [əˈpɑ:tmənt], Jenny?5. She lives in a small ___ [taun].II.Fill in the blanks with the proper words(用所给词的适当形式填空)(10分)1.This fast food restaurant is much ___ (good) than any other restaurant.2.I have ___ (many) books than you.3.Bill is good at ___ (sing).4.Do you want to be a ___ (success) person?5.Miss Li is ___ (surprise) at this news.6.A: I can jump much ___ (far) than you.B: But Henry jumps the ___ (far) among the three of us.7. A: Where ___ (are) you just nowB: I ___ (am) in my bedroom.8. What ___ (do) you ___ (do) last night?9. She always ___ (send) me emails through MSN.10. I can speak Chinese as ___ (good) as you.III. Translations(英汉互译)(5分)1. from---to ___2.一千克猪肉___3. in my opinion___4.最高的建筑___5. as---as ___6.善于___7. a hardworking student___ 8. 怕狗___9. at the bar___ 10. 和---一样长___IV.Fill in the blanks(选词填空)(20分)1. Would you please say it _____? I can’t follow you.A. more slowB. much slowerC. more slowlyD. much slowly2. Does Mary run _____ than______ girl in her class?A. fast, anyB. faster, anyC. faster, any otherD. fast, any other3. Can you finish _____ pictures on time?A. to drawB. drawingC. drawD. draws4. Is there _____ in the room?A. anything newB. new anythingC. something newD. new something5. We’re going to have ______ hiking with this kind of ______.A. many funs, fruitsB. many fun, fruitsC. lots of fun, fruitD. a fun, fruit6. It takes my father 20 minutes ____ to work every day.A. goingB. goesC. goD. to go7. There’s ______ an En glish evening in our school.A. haveB. going to haveC. havingD. going to be8. ______ this farm?A. How do you thinkB. What do you thinkC. What do you likeD. How do you like9. That music ______ beautiful.A. looksB. soundsC. feelsD. hears10. A: Where ___ you just now?B: I ___ to the library.A. are; goB. are; amC. were; wentD. were; goV. Complete the sentences as required (按要求完成句子)(14 分)1. Mary eats junk food twice a week. (对划线部分提问)_____ _____ does Mary eat junk food?2. This hotel is the best one in our town. (改为同义句)This hotel is much ___ ___ any other _____ in our town.3. She is going to go fishing for vacation.(对划线部分提问)is she ___ ___ for vacation?4. Bill is 13, and Tom is 13, too. (改为同义句)Bill is ___ old ___ Tom.5. Jane is good at Math. (对划线部分提问)___ ___ is Jane good at?7.Tom is healthy. Jack is less healthy than Tom. (改为同义句)Jack is ___ ___ healthy ___Tom.plete the dialogue (将正确选项填到横线上,完成对话, 其中有两项是多余的)M: Hello, 1.J: Hello! May I speak to Linda, please?M: 2. Linda! A call for you.L: Thanks, Mike. Hi. 3. Who’s tha t?J: This is Jenny from Canada.L: Nice to hear you, Jenny. Can I help you?J: Sure. Please tell me about the weather like in New York. It’s mylearning task(学习课题).L: Oh, it’s great. 4.J: What do you like to do outdoors?L: 5. Everyone enjoys them.A. We have beautiful sunshine these days! It’s very warm.B. New York 22334328.C. I like in-line skating and cycling.D. This is Linda speaking.E. Different country different weather.F. Hold on, please.G. I like to make snowmen outside.VII.Reading (阅读理解)(8分)Henry Ford was the first person to build cars which were cheap, strong and fast. He was able to sell million models because he “mass-produced”them, that is, he made a great many cars of exactly the same type. Henry’s father hoped that his son would become a farmer, but the young man did not like the idea and he went Detroit(底特律)where he worked as a mechanic(机械师). By the age of 29, in 1892, he had built his first car. However, the first“mass-produced”car in the world, the famous “Model T”, did not appear until 1908, five years after Henry Ford had started his great Motor Company. This kind of car was so popular that it was unchanged for twenty years.判断正(T)、误(F):()1. The cars which Henry Ford built were cheap and fast.()2. The famous“Model T”appeared in 1892.()3. When Henry Ford was 29 years old, he finished his first car. ()4. Henry Ford’s father wanted him to be a farmer.()5. Henry Ford started his Motor Company in 1913.VIII. Writing. (根据提示写一篇短文)(8分)My best friend他(她):擅长英语学习努力英语口语比我好我们同龄比我高比我跑步快。

3GPP 5G基站(BS)R16版本一致性测试英文原版(3GPP TS 38.141-1)

3GPP 5G基站(BS)R16版本一致性测试英文原版(3GPP TS 38.141-1)

4.2.2
BS type 1-H.................................................................................................................................................. 26
4.3
Base station classes............................................................................................................................................27
1 Scope.......................................................................................................................................................13
All rights reserved. UMTS™ is a Trade Mark of ETSI registered for the benefit of its members 3GPP™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational Partners LTE™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational Partners GSM® and the GSM logo are registered and owned by the GSM Association

with significance levels of 5%

with significance levels of 5%

"With significance levels of 5%" 通常在统计学和数据分析的上下文中使用,指的是显著性水平为5%。

显著性水平(significance level)是用来描述在假设检验中,当原假设为真时,拒绝原假设所犯错误的概率。

显著性水平通常为0.05、0.01、0.001等,表示在95%、99%或99.9%的置信水平下进行判断。

在统计检验中,通常会设定一个显著性水平(如5%),并使用这个水平来判断观察到的数据是否具有统计显著性。

如果数据在5%的显著性水平下是显著的,那么就可以拒绝原假设,认为观察到的数据差异不是由随机误差引起的,而是具有实际意义。

例如,在医学研究中,研究人员可能会使用显著性水平为5%的统计检验来分析某种新药是否比安慰剂更有效。

如果数据在5%的显著性水平下是显著的,那么就可以认为这种新药比安慰剂更有效。

需要注意的是,显著性水平并不是一个概率,而是用来描述在假设检验中拒绝原假设所犯错误的概率。

因此,"with significance levels of 5%" 只是描述了显著性水平的值,而不是描述某个概率事件发生的概率。

某地区6张小型简单的配电柜电气施工图纸

某地区6张小型简单的配电柜电气施工图纸
AVCABLING ZONEBUSBAR%%UFRONT VIEWCHAMBER%%UTOP VIEW%%UEND VIEWE HOS KWOKF HON.T.SC K WONGG/F., 37 KAM PING STREET, NORTH POINT, HONG KONG.HYUNDAI-CCECCJOINT VENTUREPOLYCROWN ENGINEERING LTD.ELECTRICAL SUB-CONTRACTOR :電郵E-MAIL: keiyiphk@DRAWING NO.CT9/EE/S/LMCP/526/11LMCP SUPPLIER :香港北角錦屏街37號地下TEL.FAX電話傳真: (852) 2563 4211: (852) 2565 701023-10-01DATE ISSUEDMAIN-CONTRACTOR :CCCEFOR LOCAL MOTOR CONTROL PANELLAYOUT & CONTROL WIRING DIAGRAMTERMINAL 9 DEVELOPMENTKWAI CHUNG CONTAINER PORTCHECKEDLIMITED & ASIA CONTAINER HONG KONG INT'L TERMINAL MODERN TERMINAL LIMITED &DETAILSSCOTT WILSON - MAUNSELLREVISED AS PER SWM'S LETTER ER/74/1C/06827DRAWING TITLE :(SS2-01, SR1-03, NR1-01,SCALEDRAWNDESIGNEDPROJECT TITLE :CONSULTANTTERMINAL LIMITEDDATE12-07-02CLIENTANO.REVISIONAPPROVEDWITH IEC PUBLI

2024年9月青少年软件编程Python等级考试五级真题(含答案)

2024年9月青少年软件编程Python等级考试五级真题(含答案)

2024年9月青少年软件编程Python等级考试五级真题(含答案)一、单选题(共25题,共50分)。

1.以下哪个方法用于向字典中添加或修改键值对?()。

A. dict.append()B. dict.update()C. dict.remove()D. dict.insert()答案:B。

2.下列哪个操作不是字典类型的标准方法或属性?()。

A. dict.keys()B. dict.getall()C. dict.items()D. dict.values()答案:B。

3.集合类型中用于向集合中添加多个元素的方法是?()。

A. extend()B. Add()C. update()D. add()答案:C。

4.若有一个集合 s = {1, 2, 3, 4},要删除集合中的元素2,以下哪个操作是正确的?()。

A. s.remove(2)B. s.delete(2)C. s.pop()D. s.pop(2)答案:A。

5.下面程序运行结果是?()。

s=(1,2,3,4,[5,6])s[4][1]=7print(len(s))A. 2B. 5C. 6D. 4答案:B。

6.执行下面程序段输出结果?()。

>>>import math>>>math.gcd(16,24)A. 8B. 16C. 24D. 32答案:A。

7.执行下列程序语句,输出结果说法正确的?()。

>>>import random>>>random.randint(1,100)A. 输出结果为1到100的随机整数,包括1但不包括100。

B. 输出结果为1到100的随机整数,包括1和100。

C. 输出结果为1到100的随机整数,不包括1和100。

D. 输出结果为1到100的随机整数,不包括1但包括100。

答案:B。

8.在Python中,下列哪个选项是random库中用于生成随机浮点数的函数?()。

IPC-7351B & PCBL Land Pattern Naming Convention

IPC-7351B & PCBL Land Pattern Naming Convention

I P C-7351B N a m i n g C o n v e n t i o n f o r S t a n d a r d S M T L a n d P a t t e r n sSurface Mount Land PatternsComponent, Category Land Pattern Name Ball Grid Array’s...............................BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height BGA w/Dual Pitch.BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height BGA w/Staggered Pins..................BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height BGA Note: The C or N = Collapsing or Non-collapsing BallsCapacitors, Chip, Array, Concave..........................................................CAPCAV + Pitch P + Body Length X Body Width X Height - Pin Qty Capacitors, Chip, Array, Flat..................................................................CAPCAF + Pitch P + Body Length X Body Width X Height - Pin Qty Capacitors, Chip, Non-polarized.................................................................................................CAPC + Body Length + Body Width X Height Capacitors, Chip, Polarized.....................................................................................................CAPCP + Body Length + Body Width X Height Capacitors, Chip, Wire Rectangle........................................................................................CAPCWR + Body Length + Body Width X Height Capacitors, Molded, Non-polarized...........................................................................................CAPM + Body Length + Body Width X Height Capacitors, Molded, Polarized.................................................................................................CAPMP + Body Length + Body Width X Height Capacitors, Aluminum Electrolytic ............................................................................................................CAPAE + Base Body Size X Height Ceramic Flat Packages.....................................................................................................CFP127P + Lead Span Nominal X Height - Pin Qty Column Grid Array’s.....................................................CGA + Pitch P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty Crystals (2 leads)........................................................................................................................XTAL + Body Length X Body Width X Height Dual Flat No-lead..........................................................................................................DFN + Body Length X Body Width X Height – Pin Qty Diodes, Chip................................................................................................................................DIOC + Body Length + Body Width X Height Diodes, Molded...........................................................................................................................DIOM + Body Length + Body Width X Height Diodes, MELF................................................................................................................................DIOMELF + Body Length + Body Diameter Fuses, Molded............................................................................................................................FUSM + Body Length + Body Width X Height Inductors, Chip.............................................................................................................................INDC + Body Length + Body Width X Height Inductors, Molded........................................................................................................................INDM + Body Length + Body Width X Height Inductors, Precision Wire Wound................................................................................................INDP + Body Length + Body Width X Height Inductors, Chip, Array, Concave..............................................................INDCAV + Pitch P + Body Length X Body Width X Height - Pin Qty Inductors, Chip, Array, Flat......................................................................INDCAF + Pitch P + Body Length X Body Width X Height - Pin Qty Land Grid Array, Round Lead............................LGA + Pin Qty - Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height Land Grid Array, Square Lead........................LGAS + Pin Qty - Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height LED’s, Molded............................................................................................................................LEDM + Body Length + Body Width X Height Oscillators, Side Concave........................................................................OSCSC + Pitch P + Body Length X Body Width X Height - Pin Qty Oscillators, J-Lead.......................................................................................OSCJ + Pitch P + Body Length X Body Width X Height - Pin Qty Oscillators, L-Bend Lead.............................................................................OSCL + Pitch P + Body Length X Body Width X Height - Pin Qty Oscillators, Corner Concave....................................................................................................OSCCC + Body Length X Body Width X Height Plastic Leaded Chip Carriers..................................................PLCC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Plastic Leaded Chip Carrier Sockets Square.......................PLCCS + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Quad Flat Packages..................................................................QFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Ceramic Quad Flat Packages.................................................CQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Quad Flat No-lead................................................................QFN + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Pull-back Quad Flat No-lead..............................................PQFN + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Quad Leadless Ceramic Chip Carriers..........................................................LCC + Pitch P + Body Width X Body Length X Height - Pin Qty Quad Leadless Ceramic Chip Carriers (Pin 1 on Side)...............................LCCS + Pitch P + Body Width X Body Length X Height - Pin Qty Resistors, Chip...........................................................................................................................RESC + Body Length + Body Width X Height Resistors, Molded......................................................................................................................RESM + Body Length + Body Width X Height Resistors, MELF...........................................................................................................................RESMELF + Body Length + Body Diameter Resistors, Chip, Array, Concave............................................................RESCAV + Pitch P + Body Length X Body Width X Height - Pin Qty Resistors, Chip, Array, Convex, E-Version (Even Pin Size)...............RESCAXE + Pitch P + Body Length X Body Width X Height - Pin Qty Resistors, Chip, Array, Convex, S-Version (Side Pins Diff)................RESCAXS + Pitch P + Body Length X Body Width X Height - Pin Qty Resistors, Chip, Array, Flat.....................................................................RESCAF + Pitch P + Body Length X Body Width X Height - Pin Qty Small Outline Diodes, Flat Lead...................................................................................SODFL + Lead Span Nominal + Body Width X Height Small Outline IC, J-Leaded........................................................................................SOJ + Pitch P +Lead Span Nominal X Height - Pin Qty Small Outline Integrated Circuit, (50 mil Pitch SOIC)......................................................SOIC127P +Lead Span Nominal X Height - Pin Qty Small Outline Packages............................................................................................SOP + Pitch P +Lead Span Nominal X Height - Pin Qty Small Outline No-lead...........................................................SON + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Pull-back Small Outline No-lead.........................................PSON + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Small Outline Transistors, Flat Lead....................................................................SOTFL + Pitch P + Lead Span Nominal X Height - Pin Qty SOD (Example: SOD3717X135 = JEDEC SOD123)........................................................SOD + Lead Span Nominal + Body Width X Height SOT89 (JEDEC Standard Package).......................................................................................................................................................SOT89 SOT143 & SOT343 (JEDEC Standard Package)..............................................................................................................SOT143 & SOT343 SOT143 & SOT343 Reverse (JEDEC Standard Package)...........................................................................................SOT143R & SOT343R SOT23 & SOT223 Packages (Example: SOT230P700X180-4)...............................SOT + Pitch P + Lead Span Nominal X Height - Pin Qty TO (Generic DPAK - Example: TO228P970X238-3).................................................................TO + Pitch P + Lead Span X Height - Pin QtyI P C-7351B L a n d P a t t e r n N a m i n g C o n v e n t i o n N o t e s•All dimensions are in Metric Units•All Lead Span and Height numbers go two places past the decimal point and “include” trailing Zeros•All Lead Span and Body Sizes go two place before the decimal point and “remove” leading Zeros•All Chip Component Body Sizes are one place to each side of the decimal point•Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros N a m i n g C o n v e n t i o n S p e c i a l C h a r a c t e r U s e f o r L a n d P a t t e r n sThe _ (underscore) is the separator between pin Qty in Hidden & Deleted pin componentsThe – (dash) is used to separate the pin qty.The X (capital letter X) is used instead of the word “by” to separate two numbers such as height X width like “Quad Packages”.P C B L i b r a r i e s S u f f i x N a m i n g C o n v e n t i o n f o r L a n d P a t t e r n sCommon SMT Land Pattern to Describe Environment Use (This is the last character in every name)Note: This excludes the BGA component family as they only come in the Nominal Environment Condition •M.................Most Material Condition (Level A)•N..................Nominal Material Condition (Level B)•L.................Least Material Condition (Level C)Alternate Components that do not follow the JEDEC, EIA or IEC Standard•A..................Alternate Component (used primarily for SOP & QFP when Component Tolerance or Height is different) •B..................Second Alternate ComponentReverse Pin Order•-20RN..........20 pin part, Reverse Pin Order, Nominal EnvironmentHidden Pins•-20_24N......20 pin part in a 24 pin package. The pins are numbered 1 – 24 the hidden pins are skipped. The schematic symbol displays up to 24 pins.Deleted Pins•-24_20N......20 pin part in a 24 pin package. The pins are numbered 1 – 20. The schematic symbol displays 20 pins. JEDEC and EIA Standard parts that have several alternate packages•AA, AB, AC.JEDEC or EIA Component IdentifierGENERAL SUFFIXES_HS.........................HS = Land Pattern with Heat Sink attachment requiring additional holes or padsExample: TO254P1055X160_HS-6N_BEC......................BEC = Base, Emitter and Collector (Pin assignments used for three pin Transistors)Example: SOT95P280X160_BEC-3N_SGD......................SGD = Source, Gate and Drain (Pin assignments used for three pin Transistors)Example: SOT95P280X160_SGD-3N_213........................213 = Alternate pin assignments used for three pin TransistorsExample: SOT95P280X160_213-3NP C B L i b r a r i e s N a m i n g C o n v e n t i o n f o r N o n-S t a n d a r d S M T L a n d P a t t e r n s Surface Mount Land PatternsComponent, Category Land Pattern Name Amplifiers....................................................................................................................................................AMP_ Mfr.’s Part Number Batteries......................................................................................................................................................BAT_ Mfr.’s Part Number Capacitors, Variable..................................................................................................................................CAPV_Mfr.’s Part Number Capacitors, Chip, Array, Concave (Pins on 2 or 4 sides)..............................................................CAPCAV_Mfr Series No. - Pin Qty Capacitors, Chip, Array, Flat (Pins on 2 sides)..............................................................................CAPCAF_Mfr Series No. - Pin Qty Capacitors, Miscellaneous............................................................................................................................CAP_Mfr.’s Part Number Crystals......................................................................................................................................................XTAL_Mfr.’s Part Number Diodes, Miscellaneous...................................................................................................................................DIO_Mfr.’s Part Number Diodes, Bridge Rectifiers............................................................................................................................DIOB_Mfr.’s Part Number Ferrite Beads..................................................................................................................................................FB_Mfr.’s Part Number Fiducials......................................................................................................................................FID + Pad Size X Solder Mask Size Filters..............................................................................................................................................................FIL_Mfr.’s Part Number Fuses..........................................................................................................................................................FUSE_Mfr.’s Part Number Fuse, Resettable.....................................................................................................................................FUSER_Mfr.’s Part Number Inductors, Miscellaneous...............................................................................................................................IND_Mfr.’s Part Number Inductors, Chip, Array, Concave (Pins on 2 or 4 sides)..................................................................INDCAV_Mfr Series No. - Pin Qty Inductors, Chip, Array, Flat (Pins on 2 sides).................................................................................INDCAF_Mfr Series No. - Pin Qty Keypad.................................................................................................................................................KEYPAD_Mfr.’s Part Number LEDS............................................................................................................................................................LED_Mfr.’s Part Number LEDS, Chip...................................................................................................................................................LED_Mfr.’s Part Number Liquid Crystal Display...................................................................................................................................LCD_Mfr.’s Part Number Microphones..................................................................................................................................................MIC_Mfr.’s Part Number Opto Isolators............................................................................................................................................OPTO_Mfr.’s Part Number Oscillators......................................................................................................................................OSC_Mfr.’s Part Number - Pin Qty Quad Flat Packages w/Bumper Corners, Pin 1 Side.............BQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Quad Flat Packages w/Bumper Corners, 1 Center..............BQFPC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Resistors, Chip, Array, Concave (Pins on 2 or 4 sides).................................................................RESCAV_Mfr Series No. - Pin Qty Resistors, Chip, Array, Convex Type E (Pins on 2 sides)...........................................................RESCAXE_Mfr Series No. - Pin Qty Resistors, Chip, Array, Convex Type S (Pins on 2 sides)...........................................................RESCAXS_Mfr Series No. - Pin Qty Resistors, Chip, Array, Flat (Pins on 2 sides)................................................................................RESCAF_Mfr Series No. - Pin Qty Relays.....................................................................................................................................................RELAY_Mfr.’s Part Number Speakers....................................................................................................................................................SPKR_Mfr’s Part Number Switches........................................................................................................................................................SW_Mfr.’s Part Number Test Points, Round......................TP + Pad Size (1 place left of decimal and 2 places right of decimal, Example TP100 = 1.00mm) Test Points, Square...............................................................TPS + Pad Size (1 place left of decimal and 2 places right of decimal) Test Points, Rectangle....................................TP + Pad Length X Pad Width (1 place left of decimal and 2 places right of decimal) Thermistors.............................................................................................................................................THERM_Mfr.’s Part Number Transceivers.............................................................................................................................................XCVR_ Mfr.’s Part Number Transducers (IRDA’s)................................................................................................................................XDCR_Mfr.’s Part Number Transient Voltage S_Mfr.’s Part Number Transient Voltage Suppressors, SP_Mfr.’s Part Number Transistor Outlines, Custom....................................................................................................................TRANS_Mfr.’s Part Number Transformers.............................................................................................................................................XFMR_Mfr.’s Part Number Trimmers & Potentiometers........................................................................................................................TRIM_Mfr.’s Part Number Tuners.....................................................................................................................................................TUNER_Mfr.’s Part Number Varistors.......................................................................................................................................................VAR_Mfr.’s Part Number Voltage Controlled Oscillators.....................................................................................................................VCO_Mfr.’s Part Number Voltage Regulators, Custom......................................................................................................................VREG_Mfr.’s Part NumberI P C-7251N a m i n g C o n v e n t i o n f o r T h r o u g h-H o l e L a n d P a t t e r n sThe land pattern naming convention uses component dimensions to derive the land pattern name.The first 3 – 6 characters in the land pattern name describe the component family.The first number in the land pattern name refers to the Lead Spacing or hole to hole location to insert the component lead.All numbers that follow the Lead Spacing are component dimensions.These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers –P = Pitch for components with more than two leadsW = Maximum Lead Width (or Component Lead Diameter)L = Body Length for horizontal mountingD = Body Diameter for round component bodyT = Body Thickness for rectangular component bodyH = Height for vertically mounted componentsQ = Pin Quantity for components with more than two leadsR = Number of Rows for connectorsA, B & C = the fabrication complexity level as defined in the IPC-2221 and IPC-2222Notes:All component body values are in millimeters and go two places to the right of the decimal point and no leading zeros.All Complexity Levels used in the examples are “B”.Component, Category Land Pattern Name Capacitors, Non Polarized Axial Diameter Horizontal Mounting.........CAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: CAPAD800W52L600D150BCapacitors, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Capacitors, Non Polarized Axial Rectangular.........CAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: CAPAR800W52L600T50H70BCapacitors, Non Polarized Axial; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70Capacitors, Non Polarized Axial Diameter Vertical Mounting .........CAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: CAPADV300W52L600D150BCapacitors, Non Polarized Axial; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50mmCapacitors, Non Polarized Axial Rect. Vert. Mtg.CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height Example: CAPARV300W52L600T50H70BCapacitors, Non Polarized Axial Rect. Vertical; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70 Capacitors, Non Polarized Radial Diameter.......................................CAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height Example: CAPRD200W52D300H550BCapacitors, Non Polarized Radial Diameter; lead spacing 2.00; lead width 0.52; Body Diameter 3.00; Height 5.50Capacitors, Non Polarized Radial Rectangular.......CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: CAPRR200W52L50T70H550BCapacitors, Non Polarized Radial Rectangular; lead spacing 2.00; lead width 0.52; Body Length 0.50; Body thickness 0.70; Height 5.50 Capacitors, Non Polarized Radial Disk Button........CAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: CAPRB200W52L50T70H550BCapacitors, Non Polarized Radial Rectangular; lead spacing 2.00; lead width 0.52; Body Length 0.50; Body thickness 0.70; Height 5.50 Capacitors, Polarized Axial Diameter Horizontal Mounting................CAPPA + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: CAPPAD800W52L600D150BCapacitors, Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Capacitor, Polarized Radial Diameter.................................................CAPPR + Lead Spacing + W Lead Width + D Body Diameter + H Body Height Example: CAPPRD200W52D300H550BCapacitors, Polarized Radial Diameter; lead spacing 2.00; lead width 0.52; Body Diameter 3.00; Height 5.50Diodes, Axial Diameter Horizontal Mounting.......................................DIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: DIOAD800W52L600D150BCapacitors, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Diodes, Axial Diameter Vertical Mounting .........................................DIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: DIOADV300W52L600D150BCapacitors, Non Polarized Axial; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Dual-In-Line Packages...................................DIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty Example: DIP762W52P254L1905H508Q14BDual-In-Line Package: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14Component, Category Land Pattern Name Dual-In-Line Sockets....................................DIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty Example: DIPS762W52P254L1905H508Q14BDual-In-Line Package Socket: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14Headers, Vertical....... HDRV + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Component HeightExample: HDRV200W52P200R2L4400T400H900BHeader, Vertical: Lead Span 2.00; Lead Width 0.52; Pin Pitch 2.00; 2 Rows; Body Length 44.00; Body Thickness 4.00; Body Height 9.00 Headers, Right Angle...............HDRRA + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Component HeightExample: HDRRA200W52P200R2L4400T400H900BHeader, Vertical: Lead Span 2.00; Lead Width 0.52; Pin Pitch 2.00; 2 Rows; Body Length 44.00; Body Thickness 4.00; Body Height 9.00 Inductors, Axial Diameter Horizontal Mounting....................................INDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: INDAD800W52L600D150BInductors, Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Inductors, Axial Diameter Vertical Mounting .....................................INDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: INDADV300W52L600D150BInductors, Axial Diameter Vertical Mounting; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Jumpers, Wire...................................................................................................................................................JUMP + Lead Spacing + W Lead Width Example: JUMP500W52BJumper; Lead Spacing 5.00; Lead Width 0.52Mounting Holes Plated With Support Pad..........................................................................MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size Example: MTGP700H400Z520This is a Mounting hole for a #6-32 screw using a circular 7.00 land on the primary and secondary side of the board, a 4.00 diameter hole with the internal lands are smaller that the external and are also circular 5.20 in diameter.Mounting Holes Non-Plated With Support Pad................................................................MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size Example: MTGNP700H400Z520This is a Mounting hole for a #6-32 screw using a circular 7.00 land on the primary and secondary side of the board, a 4.00 diameter hole with the internal lands are smaller that the external and are also circular 5.20 in diameter.Mounting Holes Non-Plated Without Support Pad.....................MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size + K Keep-out Diameter Example: MTGNP100H400Z520K700This is a Mounting hole for a #6-32 screw using a circular 1mm land on the primary and secondary side of the board, a 4.00 diameter hole with the internal lands are smaller that the external and are also circular 5.20 in diameter and a 7.00 diameter keep-out.Mounting Holes Plated with 8 Vias .....................................................................MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size + 8 Vias Example: MTGP700H400Z520V8This is a Mounting hole for a #6-32 screw using a circular 7mm land on the primary and secondary side of the board, a 4mm diameter hole with the internal lands are smaller that the external and are also circular 5.2mm in diameter, with 8 vias.Pin Grid Array’s.............................PGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height Example: PGA84P254C10R10L2500X2500H300BPin Grid Array: Pin Qty 84; Pin Pitch 2.54; Columns 10; Rows 10; Body Length 25.00 X 25.00; Component Height 3.00Resistors, Axial Diameter Horizontal Mounting...................................RESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: RESAD800W52L600D150BResistors, Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Resistors, Axial Diameter Vertical Mounting ....................................RESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: RESADV300W52L600D150BResistors, Axial Diameter Vertical Mounting; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Resistors, Axial Rectangular Horizontal Mounting...RESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: RESAR800W52L600T50H70BResistors, Axial Rectangular; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70Test Points, Round Land......................................................................................................................................................................TP + Lead Width Example: TP52Test Points, Square Land..................................................................................................................................................................TPS + Lead Width Example: TPS52Test Points, Top Land Round & Bottom Land Square.....................................................................................................................TPRS + Lead Width Example: TPRS52 Wire....................................................................................................................................................................................................PAD + Wire Width Example: PAD52。

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Test 5 (L9)I. Choice1. Mark often attempts to escape ____ whenever he breaks traffic regulations.A. having been finedB. to have been finedC. to be finedD. being fined2. My wife said in her letter that she would appreciate ____ from you sometime.A. to have heardB. to hearC. for hearingD. hearing3. They are considering ____ before the prices go up.A. of buying the houseB. with buying the houseC. buying the houseD. to buy the house4. If I had remembered ____ the door, the things would not have been stolen.A. to lockB. lockingC. to have lockedD. having locked5.It is difficult to get used ____ in a tent after having a soft, comfortable bed to lie on.A. sleepB. to sleepingC. sleptD. to sleep6. ―Why were you so late for work today?‖―____ to the office was very slow this morning because of the traffic.‖A. DrivingB. I droveC. To driveD. That I drove7. Before ____ the house, you should get a surveyor ____ over it.A. buying, lookingB. having bought, to lookC. buying, to have lookedD. buying, to look8. We suggested ____ in hotels but the children were anxious ____ out.A. sleeping, to campB. sleeping, campingC. to sleep, to campD. to sleep, camping9. We will______ a discussion of the program until more members are present.A. deferB. postponeC. delayD. put off10. The ship _____down into the water.A. glidedB. slippedC. slidD. skim11.It ______ rain when you want to go out.A. guaranteesB. guaranteedC. is guaranteed toD. is guaranteed12. They ____ vast quantities of cakes between them.A. put awayB. put onC. put asideD. put across13.The liquor did not _______ me.A. agree onB. agree withC. agree toD. agree14. The poor woman is ________ begging.A. reduced toB. forced toC. reduced ofD. made to15. Because of the unexpected changes, they postponed ____ us an answer.A. givingB. have givenC. to giveD. to have given16. Every camera we sell comes with a two-year ____.A. guaranteeB. safetyC. confirmationD. conservation17. There are not many teachers who are strong ____ of traditional methods in Englsih teaching.A. sponsorsB. contributorsC. advocatesD. performers18. The unpleasnt taste ____ in his mouth for hours.A. prolongedB. waitedC. lingeredD. lengthened19. –Which ____ will you take to go to Taiyuan?–I’ll take the northern one. It’s shorter.A. wayB. pathC. courseD. route20. Arrogance and pride are similar in meaning, butthere is a ____ difference between them.A. decisiveB. thornyC. preciseD. subtleII Fill in the blanks with the proper form of the given words.1. A cool drink ________ me after my long walk. (fresh)2. That is the flat and rather __________ plains in the south. (feature)3. Your approval gives me much __________. (gratify)4. It will require a __________ effort to get the job done on time. (超人的)5. In the job market, you can expect the interview to be a structured event—each candidate will be asked the same ____________ questions. (事先确定的)III. Reading ComprehensionI am afraid to sleep. I have been afraid to sleep for the last few weeks. I am so tired that, finally, I do sleep, but only for a few minutes. It is not a bad dream that wakes me; it is the reality I took with me into sleep. I try to think of something else.Immediately, the woman in the marketplace comes into my mind.I was on my way to dinner last night when I saw her. She was selling skirts. She moved with the same ease and loveliness. I often saw in the women of Laos. Her long black hair was as hiny as the black silk of the skirts, she was selling. In her hair, she wore three silk ribbons, blue, green, and white. They reminded me of my childhood and how my girlfriends and I used to spend hours braiding ribbons into our hair.I don’t know, the word for ―ribbons‖, so I put my hand to my own hair and, with three fingers against my head, I looked at her ribbons and said ―Beautiful.‖She loowered her eyes and said nothing.i wasn’t sure if she understood me (I don't speak Laotian very well).I looked back down at the skirts. They had designs on them:squares and triangles and circles of pink and green silk. They were very pretty. I decided to buy one of those skirts, and I began to bargain with her over the price. It is the custom to bargain in Asia. In Laos bargaining is done in soft voices and easy moves with the sort of quiet peacefulness.She smiled, more with her eyes than with her lips. She was pleased by the few words I was able to say in her language, although they were mostly numbers, and she saw that I understood something about the soft playfulness of bargaining. We shook our heads in disagreement over the price, immediately, we made another offer and then another shake of the head. She was so pleased that unexpectedly, she accepted the last offer I made.but it was too soon. The price was too low. She was being too generous and wouldn’t make enough money. I moved quickly and picked up two more skirts and paid for all three at the price set; that way I was able to pay her three times as much before she had a chance to lower the price for the larger purchase. She smiled openly then, and, for the first time in months, my spirit lifted. I almost felt happy.The feeling stayed with me while she wrapped the skirts in a newspaper and handed them to me. When I left, though, the feeling left, too. It was as though it stayed behind in the marketplace.I felt tears in my throat. I wanted to cry. I didn’t, of course.I have learned to defend myself against what is hard; without knowing it, I have also learned to defend myself against what is soft and what should be easy.I get up, light a candle and want to liik at the skirts. They are still in the newspaper that the woman wrapped them in. I remove the paper, and raise the skirts up to look at them again before I pack them. Something falls to the floor. I reach down and feel something cool in my hand. I move close to the candlelight to see what I have. There are five long silk ribbons in my hand, all different colors. The woman in the marketplace! She has given these ribbons to me!There is no defense against a generous spirit, and this time I cry, and very hard, as if I could make up for all themonths that I didn’t cry.1.According to the writer, the woman in the marketplace ____.A. refused to speak to her.B. was pleasant and attractiveC. was selling skirts and ribbons.D. recognized her immediately.2.Which of the following is NOT correct?A. The writer was not used to bargaining.B. Peop;e om Asia always bargain when buying things.C. Bargaining in Laos was quiet and peaceful.D. The writer was ready to bargain with the woman.3.The writer assumed that the woman accepted the last offer mainly because the woman _____.A. thought that the last offer was reasonable.B. thought she could still make much money.C. was glad that the writer knew their way of bargaining.D. was tired of bargaining with the writer any more.4.Why did the writer finally decide to buy three skirts?A. The skirts were cheap and pretty.B. She liked the patterns on the skirtsC. She wanted to do something as dompensation.D. She was fed upwith further bargaining with the woman.5.When the writer left the marketplace, she wanted to cry, but did not because _____.A. she had learned to stay cool and unfeeling.B. she wa safraid to crying in public.C. she had learned to face difficulties bravelyD. she had to show in public that she was strong.6.Why did the writer cry eventually when she looked at the skirts again?A. She suddenly felt very sadB. She liked the ribbons so muchC. She was overcome by emotionD. She felt sorry for the womanKey to Test 5 (L9)I. Choice1~5 DDCAB 6~10 ADAAC 11~15 CABAA 16~20 ACCDDII. Proper form1. refreshed2. featureless3. gratification4. superhuman5. predeterminedIII. Reading Comprehension1~5 BACCA 6 C。

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