3-1625985-4中文资料

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1859535中文资料

1859535中文资料

Extract from the onlinecatalogEMSTBVA 2,5/ 4-G-5,08Order No.: 1859535The figure shows a 10-position version of the producthttp://eshop.phoenixcontact.de/phoenix/treeViewClick.do?UID=1859535Header, nominal current: 12 A, rated voltage: 200 V, pitch: 5.08 mm, no. of positions: 4, mounting: Press inhttp://Please note that the data givenhere has been taken from theonline catalog. For comprehensiveinformation and data, please referto the user documentation. TheGeneral Terms and Conditions ofUse apply to Internet downloads. Technical dataDimensions / positionsPitch 5.08 mmDimension a15.24 mmNumber of positions4Pin dimensions1,7 mmHole diameter 1.75 mmTechnical dataInsulating material group IIIaRated surge voltage (III/3) 4 kVRated surge voltage (III/2) 4 kVRated surge voltage (II/2) 4 kVRated voltage (III/2)320 VRated voltage (II/2)320 VConnection in acc. with standard EN-VDENominal current I N12 ANominal voltage U N200 VMaximum load current12 AInsulating material PBTInflammability class acc. to UL 94V0Certificates / ApprovalsCULNominal voltage U N300 VNominal current I N10 AULNominal voltage U N300 VNominal current I N10 ACertification CB, CUL, GOST, UL, VDE-PZIAccessoriesItem Designation DescriptionAssembly1877203EMSTB 2,5-SH Stamp holder, for upper and lower stamp1877229EMSTBVA 2,5-SS-2-5,08Stamp set, consisting of an upper and lower stamp, upper stamp:17 to 24-pos., lower stamp: 2 to 24-pos., pitch: 5.08 mm 1755477MSTB-BL Keying cap, for forming sections, plugs onto header pin, greeninsulating materialMarking0804293SK 5,08/3,8:FORTL.ZAHLEN Marker card, printed horizontally, self-adhesive, 12 identicaldecades marked 1-10, 11-20 etc. up to 91-(99)100, sufficient for120 terminal blocksPlug/Adapter1734401CR-MSTB Coding section, inserted into the recess in the header or theinverted plug, red insulating materialAdditional productsItem Designation DescriptionGeneral1872716A-ICV 2,5/ 4-G-5,08Header, nominal current: 12 A, rated voltage: 250 V, pitch: 5.08mm, no. of positions: 4, mounting: Mounting rail1873074FKC 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Spring-cage connection1902136FKCT 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Spring-cage connection1873977FKCVR 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Spring-cage connection1873676FKCVW 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Spring-cage connection1777303FRONT-MSTB 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Screwconnection1786420IC 2,5/ 4-G-5,08Header, nominal current: 12 A, rated voltage: 320 V, pitch: 5.08mm, number of positions: 4, mounting type: soldering 1785968ICV 2,5/ 4-G-5,08Header, nominal current: 12 A, rated voltage: 320 V, pitch: 5.08mm, number of positions: 4, mounting type: soldering 1757035MSTB 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Screwconnection1776155MSTB 2,5/ 4-STZ-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Screwconnection1808832MSTBC 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 320 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Crimpconnection1809527MSTBC 2,5/ 4-STZ-5,08Plug component, nominal current: 12 A, rated voltage: 320 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Crimpconnection1769036MSTBP 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Screwconnection1780002MSTBT 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Screwconnection1824146MSTBU 2,5/ 4-STD-5,08Plug component, nominal current: 12 A, rated voltage: 320 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Screwconnection1792265MVSTBR 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Screwconnection1792773MVSTBW 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Screwconnection1917927QC 0,75/ 4-ST-5,08Plug components, 5.08 mm pitch, color: green, no. of positions 4,dimension a 15.24 mm1883271QC 1/ 4-ST-5,08Plug, nominal current: 10 A, rated voltage: 500 V, pitch: 5.08mm, number of positions: 4, connection method: Insulationdisplacement connection QUICKON1826306SMSTB 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Screwconnection1853036TMSTBP 2,5/ 4-ST-5,08Plug component, nominal current: 12 A, rated voltage: 250 V,pitch: 5.08 mm, no. of positions: 4, type of connection: Screwconnection1873029ZFKK 1,5-ICV-5,08Modular terminal blocks with plug entry, cross section: 0.2 - 1.5mm², width: 5.1 mm, color: grayDrawingsDrilling diagramDimensioned drawingAddressPHOENIX CONTACT GmbH & Co. KGFlachsmarktstr. 832825 Blomberg,GermanyPhone +49 5235 3 00Fax +49 5235 3 41200http://www.phoenixcontact.de© 2008 Phoenix ContactTechnical modifications reserved;。

25136中文资料

25136中文资料
UL AWM 20668 CSA AWM I A/B II A/B FT1 300 VOLT
CHOOSE XTRA•GUARD® 2 FOR:
s s
s s
s
s s
Now Rated To 90°C! Unmatched Resistance to Oils, Fuels, Solvents, and Water Twice the Tensile Strength of PVC Three Times the Tear and Abrasion Resistance of PVC Superior Low-Temperature Flexibility to -20° C Ultraviolet Light Stability (jacket color black) SUPRASHIELD® - Twice as Effective as Foil Shielding
24 AWG (0,23mm2), 7/32 (7x0,20mm), Insulation Thickness: 0.010" (0,25mm) Jacket Thickness Nominal Diameter Part No. No. of Pairs. Inches mm Inches mm
25271 25272 25273 25274 25275 25276 25279 25279/11 25279/15 25279/19 1 2 3 4 5 6 9 11 15 19 0.032 0.032 0.032 0.032 0.032 0.032 0.032 0.032 0.032 0.032 0,81 0,81 0,81 0,81 0,81 0,81 0,81 0,81 0,81 0,81 0.18 0.23 0.25 0.28 0.30 0.31 0.36 0.38 0.43 0.46 4,6 5,8 6,5 7,0 7,5 8,0 9,1 9,7 10,8 11,8

MBR1645中文资料

MBR1645中文资料

MBR1635 - MBR1660MBR1635 - MBR1660 Rev. A©1999 Fairchild Semiconductor CorporationMBR1635 - MBR1660 Rev. ATRADEMARKSACEx™CoolFET™CROSSVOLT™E 2CMOS TM FACT™FACT Quiet Series™FAST ®FASTr™GTO™HiSeC™The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.As used herein:ISOPLANAR™MICROWIRE™POP™PowerTrench™QS™Quiet Series™SuperSOT™-3SuperSOT™-6SuperSOT™-8TinyLogic™1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant intothe body, or (b) support or sustain life, or (c) whosefailure to perform when properly used in accordancewith instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a lifesupport device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of TermsDatasheet Identification Product Status Definition Advance InformationPreliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.This datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.Formative or In DesignFirst ProductionFull ProductionNot In ProductionDISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.。

UL2556中文翻译

UL2556中文翻译

UL2556 2011译版通过UL UL安全标准的保护。

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保留所有权利。

本出版物的任何部分进行复制,存储在检索系统中,或任何形式的任何手段,电子,机械复印,录音,或以其他方式传播未经事先批准的UL。

UL安全标准的修订,不时发出。

一个是最新的UL安全标准只有当它采用了最近通过的修订。

UL提供本标准平方米²,没有任何形式的的担保,明示或暗示,包括但不限于对适销性或为任何目的的隐含担保。

在任何情况下,UL认证的任何特殊,偶然,必然,间接或类似的损害承担责任,包括利润损失,储蓄损失,数据丢失,或任何因使用或其他损害无法使用这个标准,即使UL或授权的UL代表的建议这种损害的可能性。

在任何情况下,UL的任何损害赔偿责任,不断超过支付的价格这个标准,无论索赔的形式。

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UL保留权利更改的格式,简报,文件类型和格式,交货方式和格式,和它的印刷版和电子标准,恕不另行通知。

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如果购买一个单用户版电子标准,本标准的一个副本可以存储在一台个人计算机的硬盘,或在一个单一的局域网的文件服务器或永久存储在这种方式的多用户电脑设备,这一标准只能由一个用户访问的时间和为没有多个并发访问的可能性。

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RT duroid 6035HTC 高性能材料说明书

RT duroid 6035HTC 高性能材料说明书

1 of 4产品数据安全说明书1.产品及企业标示化学品名称: RT/duroid ® 6035HTC 高性能材料 化学品类别: 含氟聚合类HMIS 等级:H 1 F 1 R 0 产品用途 印刷线路板应急电话: 860-774-9605(周一至周五8:00-17:00 ,美国东部时区)2.成分/组成信息此物质是作为 20CFR 1910.1200 和EC 中1907/2006 的“物品”来生产的,因此不受危害协会标准和新化学物质法规控制。

既然此物质不分解,在正常条件下使用也不分解成危害化学物,因此不需要物质安全数据说明书。

组分名称 CAS No.EINECS /ELINCSOSHA PEL ACGIH TLVEU Classification熔融石英 60676-86-0 262-373-8 80 mg/m 3%SiO 2未建立 根据67/548/EC 未分类二氧化钛 13463-67-7 236-675-5 15 mg/m 3(总尘)10 mg/m 3 根据67/548/EC 未分类聚乙烯 (PTFE)9002-84-0 NE NE NE 根据67/548/EC 未分类 氮化硼10043-11-5 NE15 mg/m 3(总尘)10 mg/m 3根据67/548/EC 未分类夹层(铜或者铝黄铜)铜 7440-50-8 231-159-6 1 mg/m 3 1 mg/m 3 根据67/548/EC 未分类根据OSHA 的危害通识标准29 CFR1910.1200或欧盟指令1999/45/ EC 号指令规定该材料不包含其他有害成分,并根据67/548/ EC 号指令物质不含有危害健康或环境的有害成分。

3. 危害识别材料分类: 无资料 标签要求: 无资料过度暴露影响: 正常处理不会产生。

当切割或其他操作可能产生粉尘。

超过分解温度下进行操作时可能会产生有毒烟雾。

吸入:灰尘可引起呼吸道刺激。

暴露在铜尘或者PTFE 分解产物下可能会引起肺部金属或者聚合物烟尘发热。

AO4459中文资料

AO4459中文资料

AO4459中⽂资料SymbolTyp Max 33406275R θJL 1824Maximum Junction-to-Lead CSteady-State°C/WThermal Characteristics ParameterUnits Maximum Junction-to-AmbientAt ≤ 10s R θJA °C/W Maximum Junction-to-Ambient ASteady-State °C/W AO4459AO4459SymbolMin TypMaxUnits BV DSS -30V -1T J =55°C-5I GSS ±100nA V GS(th)-1.5-1.85-2.5V I D(ON)-30A 3846T J =125°C53685872m ?g FS 11S V SD -0.78-1V I S-3.5A C iss 668830pF C oss 126pF C rss 92pF R g69?Q g (10V)12.716nC Q g (4.5V) 6.4nC Q gs 2nC Q gd 4nC t D(on)7.7ns t r 6.8ns t D(off)20ns t f 10ns t rr 2230ns Q rr15nCTHIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE.DYNAMIC PARAMETERS Maximum Body-Diode Continuous CurrentGate resistanceV GS =0V, V DS =0V, f=1MHzV GS =0V, V DS =-15V, f=1MHz Input Capacitance Output Capacitance Turn-On Rise Time Turn-Off DelayTime V GS =-10V, V DS =-15V, R L =2.5?, R GEN =3?Turn-Off Fall TimeTurn-On DelayTime SWITCHING PARAMETERSTotal Gate Charge (4.5V)Gate Source Charge Gate Drain Charge Total Gate Charge (10V)V GS =-10V, V DS =-15V, I D =-6.5Am ?V GS =-4.5V, I D =-5AI S =-1A,V GS =0V V DS =-5V, I D =-6.5AR DS(ON)Static Drain-Source On-ResistanceForward TransconductanceDiode Forward VoltageI DSS µA Gate Threshold Voltage V DS =V GS I D =-250µA V DS =-24V, V GS =0VV DS =0V, V GS =±20V Zero Gate Voltage Drain Current Gate-Body leakage current Electrical Characteristics (T J =25°C unless otherwise noted)STATIC PARAMETERS ParameterConditions Body Diode Reverse Recovery Time Body Diode Reverse Recovery ChargeI F =-6.5A, dI/dt=100A/µsDrain-Source Breakdown Voltage On state drain currentI D =-250µA, V GS =0V V GS =-10V, V DS =-5V V GS =-10V, I D =-6.5AReverse Transfer Capacitance I F =-6.5A, dI/dt=100A/µs A: The value of R θJA is measured with the device mounted on 1in 2FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.B: Repetitive rating, pulse width limited by junction temperature.C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.D. The static characteristics in Figures 1 to 6 are obtained using < 300µs pulses, duty cycle 0.5% max.E. These tests are performed with the device mounted on 1 in 2FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The SOA curve provides a single pulse rating. Rev0 Sept 2006AO4459AO4459。

金属材料对照表

金属材料对照表

T10
SK3,SK4
W2-91/2, W1-91/2
BW1B
T11 T12 T13
SK3 SK2 SK1
W1-101/2 W1-111/2 W2-13, W1-121/2 BW1C
T7A T8A C80W1(1.152 5) (VDEh) T8MnA C85WS(1.183 0) (VDEh) T9A T10A C105W1(1.15 45) (VDEh) T11A T12A T13A
(3)锰钒钢组 (4)铬钢组
42Mn2V 15Cr 20Cr
40Cr
SCr440 (SCr4)
5140
5140
5140
530A40,
530M40 45Cr SCr445 (SCr5) 5147, 5145 50Cr (5)铬硅钢组 (6)铬锰钢组 38CrSi 40CrSi 38CrMn 5150 5147, 5145 5150 5147, 5145 5150
60
S58C
080A62
65
1065
1065
1065
060A67,
080A67 70 1070 1070 1070 060A72, 070A72, 080A72 75 1074 1074 1074 060A78, 070A78, 080A78 80 1080 1080 1080 060A82, 080A83 85 1084 1084 1084 060A86, 080A86 项目 中国 GB,YB (2)较高含锰 量钢组 20Mn 15Mn 日本 JIS 德国 DIN(W-Nr.) 17Mn4(1.804 4) ASTM 1016, 1019 1021, 1022 25Mn 30Mn S28C S30C 1026 1030 美国 AISI 1016, 1019 1021, 1022 1026 1030 SAE 1016, 1019 1021, 1022 1026 1030 英国 BS 080A15, 080A17 080A20, 070M20 070M26 080A30, 080A32 35Mn 40Mn S35C S40C 40Mn4(1.503 8) 1037 1039, 1040 45Mn S45C 1043, 1046 50Mn S53C 1050, 1053 60Mn 65Mn 1561 1566 1037 1039, 1040 1043, 1046 1050, 1053 1037 1039, 1040 1043, 1046 1050, 1053 1561 1566 -1066 70Mn 1572 1572 080A52, 080M50 080A64 080A47 080A35 080A40

5364中文资料

5364中文资料

SMOKE DETECTOR WITH INTERCONNECTThe A5364CA is a low-current, CMOS circuit providing all of the required features for an ionization-type smoke detector. A networking capability allows as many as 125 units to be interconnected so that if any unit senses smoke, all units will sound an alarm. In addition,special features are incorporated to facilitate alignment and test of the finished smoke detector. This device is designed to comply with Underwriters Laboratories Specification UL217.The internal oscillator and timing circuitry keeps standby power to a minimum by powering down the device for 1.66 seconds and sensing smoke for only 10 ms. Every 24 on/off cycles, a check is made for low battery condition. By substituting other types of sensors, or a switch for the ionization detector, this very-low power device can be used in numerous other battery-operated safety/security applications.The A5364CA is supplied in a low-cost, 16-pin dual in-line plastic package. It is rated for continuous operation over the temperaturerange of 0°C to +50°C. Similar devices. with an internal timer to allow for a period of reduced sensitivity (“hush”), are available as the A5368CA.Always order by complete part number: A5364CA .Data Sheet 26110.7AFEATURESI Interconnect Up to 125 Detectors I Piezoelectric Horn DriverI Guard Outputs for Detector Input I Pulse Testing for Low Battery I Power-ON ResetI Internal Reverse Battery ProtectionI Built-In Hysteresis Reduces False Triggering ITemporal Horn Pattern53645364SMOKE DETECTOR WITHINTERCONNECT115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000Copyright © 1998, 1999 Allegro MicroSystems, Inc.9 VGUARD GUARD +V581110712691415165364SMOKE DETECTOR WITH INTERCONNECTTestLimitsCharacteristic Pin Test Conditions Min.Typ.Max.Units Supply Voltage Range 6Operating6.09.012V Detector Input Current 150 to 40% RH, V IN = 0 to 9.0 V ——±1.0pA Input Offset Voltage14-15Active Guard ——±100mV 16-15Active Guard ——±100mV 15-13Detect Comparator ——±50mV Hysteresis13No Alarm to Alarm 90130170mV Common Mode Range14-15Guard Amplifier 2.0—V DD - 0.5V 13-15Smoke Comparator 0.5—V DD - 2.0V Active Guard Impedance14to V SS —10—k Ω16to V SS —500—k Ω Oscillator Period12No Alarm 1.34 1.67 2.00s Alarm324048ms Oscillator Pulse Width 48.01012ms Low Voltage Threshold 6T A = 0 to 50°C7.2—7.8V Sensitivity Adj. Voltage 13V 13/V DD , pin 13 open circuit 48.55051.5% Horn Output Voltage10-11I OUT = 16 mA, V DD = 9.0 V —0.10.5V I OUT = 16 mA, V DD = 7.2 V ——0.9V I OUT = -16 mA, V DD = 9.0 V 8.58.8—V I OUT = -16 mA, V DD = 7.2 V6.3——V Horn Output ON Time10-11Alarm (see figure, time “A”)450500550ms Low Battery8.01012ms Horn Output OFF Time10-11Alarm (see figure, time “B”)450500550ms Alarm (see figure, time “C”)135015001650ms Low Battery324048s LED Output ON Current 5V DD = 7.2 V, V OUT = 1.0 V 10——mA LED Output ON Time 5No Local Alarm; Not Latched 8.01012ms LED Output OFF Time5No Alarm, In Standby324048sELECTRICAL CHARACTERISTICS at T A = +25°C, V DD = 9.0 V, V SS = 0 V, C 12 = 0.1 µF,R 7 = 8.2 M Ω (unless otherwise noted).Continued next page . . .NOTE 1:Negative current is defined as coming out of (sourcing) the specified device pin.NOTE 2:Alarm (Smoke) Condition is defined as V 15 < V 13; No Alarm (No Smoke) Condition as V 15 > V 13.5364SMOKE DETECTOR WITH INTERCONNECT115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000I/O Current2No Alarm, V I/O = V DD - 2.0 V 25—60µA Alarm, V I/O = V DD - 2.0 V-7.5——mA I/O Alarm Voltage 2External “Alarm” In 3.0——V I/O Delay 2“Alarm” Out— 3.0—s Supply Current6V DD = 9.0 V, No Alarm, No Loads — 5.09.0µA V DD = 12 V, No Alarm, No Loads——12µATestLimitsCharacteristic Pin Test Conditions Min.Typ.Max.Units ELECTRICAL CHARACTERISTICS (continued)CIRCUIT DESCRIPTIONThe A5364CA is a low-current CMOS circuit providing all of the required features for an ionization-type smoke detector.Oscillator. An internal oscillator operates with a period of 1.67 seconds during no-smoke conditions. Every 1.67 seconds,internal power is applied to the entire circuit and a check is made for smoke. Every 24clock cycles (40 seconds), the LED is pulsed and a check is made for low battery by comparing V DD to an internal reference.Because very-low currents are used in the device, the oscillator capacitor at pin 12should be a low-leakage type (PTFE, polysty-rene, or polypropylene).Detector Circuitry. When smoke isdetected, the resistor divider network that sets the sensitivity (smoke trip point) is altered to increase the sensitivity set voltage (pin 13) by typically 130 mV with no external connec-tions to pins 3 or 13. This provides hysteresis and reduces false triggering. An active guard is provided on both pins adjacent to the detector input (pin 15). The voltage at pins 14 and 16 will be within 100 mV of the input.This will keep surface leakage currents to a minimum and provide a method of measuring the input voltage without loading the ionization chamber. The active guard amplifier is not power strobed and thus provides constant protection from surface leakage currents. The detector input has internal diode protection against static damage.Alarm Circuitry. If smoke is detected, the oscillator period changes to 40 ms and the horn is enabled. The horn output is typically 0.5 s ON, 0.5 s OFF, 0.5 s ON, 0.5 s OFF, 0.5 s ON, 1.5 s OFF (temporal horn pattern). During the OFF time, smoke is checked and will inhibit further alarm output if smoke is not sensed. During smoke conditions the low battery alarm is inhibited and the LED is driven at a 1 Hz rate.Sensitivity Adjust. The detector sensitivity to smoke is set inter-nally by a voltage divider connected between V DD and V SS . Thesensitivity can be externally adjusted to the individual characteristics of the ionization chamber by connecting a resistor between pin 13 and V DD , or between pin 13 and V SS .Low Battery. The low battery threshold is set internally by a voltage divider connected between V DD and V SS . The threshold can be in-creased by connecting a resistor between pin 3 and V DD . The threshold can be decreased by connecting a resistor between pin 3 and V SS . The battery voltage level is checked every 40 seconds during the 10 mA,10 ms LED pulse. If an LED is not used, it should be replaced with an equivalent resistor (typically 500 Ω to 1000 Ω) such that the battery loading remains at 10 mA.NOTE 1:Negative current is defined as coming out of (sourcing) the specified device pin.NOTE 2:Alarm (Smoke) Condition is defined as V 15 < V 13; No Alarm (No Smoke) Condition as V 15 > V 13.5364SMOKE DETECTOR WITH INTERCONNECTV12OSC. CAPINTERNAL CLOCKLED SMOKE COMPARATORSMOKE CHAMBERHORNDwg. WC-003-3I/OI/O. A connection is provided at pin 2 to allow multiple smoke detectors to becommoned. If any single unit detects smoke (I/O is driven high), all connected units will sound their associated horns after a nominal 3second delay. The LED is suppressed when an alarm is signaled from an interconnected unit.Testing. On power up, all internal counters are reset. Internal test circuitry allows for low battery check by holding pins 8 and 12low during power up, then reducing V DD and monitoring HORN 1 (pin 10). All functional tests can be accelerated by driving pin 12with a 2 kHz square wave. The 10 ms strobe period must be maintained for proper opera-tion of the comparator circuitry.313TIMING DIAGRAM IN TYPICAL APPLICATION5364SMOKE DETECTOR WITHINTERCONNECT115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000I/O OPERATIONINTERNAL CLOCKHORNV2 IN I/OV2 OUT I/OINTERNAL CLOCKDwg. WC-004-2HORN5364SMOKE DETECTOR WITH INTERCONNECTDimensions in Inches(controlling dimensions)Dimensions in Millimeters(for reference only)NOTES:1.Lead thickness is measured at seating plane or below.2.Lead spacing tolerance is non-cumulative.3.Exact body and lead configuration at vendor’s option within limits shown.Dwg. MA-001-16A in1618Dwg. MA-001-16A mm16185364SMOKE DETECTOR WITHINTERCONNECT115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000The products described here are manufactured under one or more U.S. patents or U.S. patents pending.Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, ormanufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current.Allegro products are not authorized for use as critical components in life-support devices or systems without express written approval.The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsi-bility for its use; nor for any infringement of patents or other rights of third parties which may result from its use.SAFETY & SECURITY ICsPart Number FunctionA3054KU/SU Multiplexed two-wire Hall-effect sensorA5348CA Ionization-type smoke detector with interconnect, timer, and reverse-battery protection A5349CA Ionization-type smoke detector with interconnect and timer for ac line operation A5350CA Ionization-type smoke detector with interconnect and reverse-battery protection A5354CA Ionization-type smoke detector with interconnect and reverse-battery protection A5358CA Photoelectric-type smoke detector with interconnect and timerA5364CA Ionization-type smoke detector with interconnect, reverse-battery protection,and temporal horn patternA5368CAIonization-type smoke detector with interconnect, timer, reverse-battery protection,and temporal horn pattern。

链条产品常用材料中外钢号及化学成分对照表(2012年3月修订)

链条产品常用材料中外钢号及化学成分对照表(2012年3月修订)

≤0.035
≤0.20
≤0.20
DIN EN 10083-2 DIN EN 10083-2 DIN 17200(旧标准)
C40E (1.1186)
C40 (1.0511) 40Mn4(旧钢号) (1.1157)
0.37~ 0.44
0.37~ 0.44
0.36~ 0.44
≤0.40
≤0.40 0.25~ 0.50
ASTM A283/A283M-03
JIS G 3101
DIN EN 10025-2
Q235A
Grade D
SS400
(旧钢号:SS41)
S235JR (1.0038)
≤0.22 ≤0.35 ≤1.40
≤0.27
0.15~ 0.40
≤0.90
由供需双方协议规定
≤0.045 ≤0.050 ≤0.30 ≤0.035 ≤0.040 ≤0.050 ≤0.050
0.60~ 0.90
0.60~ 0.90
0.50~ 0.80
0.50~ 0.80
≤0.035 ≤0.040 ≤0.030 ≤0.030 ≤0.045
≤0.035 ≤0.050 ≤0.035 ≤0.035 ≤0.045
≤0.25
≤0.30 Cu≤0.25
≤0.20
≤0.20
≤0.40 ≤0.10 ≤0.40 Cr+Mo+Ni≤0.63
≤0.50 ≤0.20
Nb≤0.07,N≤0.012
ASTM A572/A572M-07
Grade 50 [345] ≤0.23 ≤0.4
或……
≤1.35 ≤0.040 ≤0.050
Si≤0.4 或 0.15~0.40

世界各国压铸铝合金成分牌号对照表

世界各国压铸铝合金成分牌号对照表
SG100A
A13600
9.0-10.0
1.3
0.6
0.35
0.40-0.60
0.50
0.50
0.15
0.25
余量
380.0
SC84B
A03800
7.5-9.5
2.0
3.0-4.0
0.50
0.10
0.50
3.0
0.35
0.50
余量
A380.0E
SC84A
A13800
7.5-9.5
1.3
3.0-4.0
Pb
Ti
Al
ADC1
<1.0
11.0-13.0
<0.3
<0.5
<1.3
<0.3
<0.5
<0.1
余量
ADC1C
A1-Sil2CuFe
<1.2
11.0-13.5
<0.3
<0.5
<1.3
<0.5
<0.3
<0.1
<0.2
<0.2
余量
ADC2
A1-Si12Fe
<0.10
11.0-13.5
<0.1
<0.1
<1.3
德国
AlSil0Mg
9.0-11.0
<0.10
0.20-0.50
<1.0
DIN1725
AI-Si-Cu系
中国
YL112
7.5-9.5
3.0-4.0
<0.30
<1.2
余量
GB/T15115-94

GE-CHINA材料对照表

GE-CHINA材料对照表

材料对照表(2006年G版)下面是简易的材料对照表,加“*”符号的是GE公司D50A152(L)确认又经EPE批准的材料,加“**”符号的是GE-EPE“SDR”认可的材料。

在使用时设计人员应优先使用本表,本表没有的才使用NB0191。

No. GE材料中国材料 GE材料中国材料1**AISI 304L **00Cr19Ni10薄板, 棒,管,*B4A2F(S34) *20中板,角钢2 **316 **00Cr17Ni14Mo2薄板*B4A2X1(S34) *20棒, 薄板3**B4A2X1(S34)**20g中厚板**316 **0Cr17Ni12Mo2薄板,钢丝,锻件,棒4**B4A5D(S13) **20锻件**316L **00Cr17Ni14Mo2钢管,中厚板,棒5 **F316L **00Cr17Ni14Mo2钢管**B4A10(S17) **Q345A409 **00Cr19Ni10薄板,中厚板**B4A26A(S12) **20棒, 薄板6 **AISI439 **304L薄板 **B4A26A(S12)**20g中厚板7 **AISI1020 **20薄板*B4A39A(S11) *20钢管8 **AISI9 **AISI 1018-1020 **20方钢, 棒 *B4A39B(S11) *20钢管C1015 **Q235A *B4A39C(S11) *20钢管10 **AISI11 ** GR B API 5L-04 **20管 *B4A39D(S11) *20钢管12 **Gr.32510 ASTM A47-99**20钢管,棒 *B4A39E(S11) *20钢管A47-1999 **20棒**B4A45A(S9) **Q345A,H型钢,角钢,中厚板13 **ASTM14 **TYPE S CLASS A ASTM A53-04 **20钢管 **B4A47C(S5) **Q345A中厚板A105-01 **30锻件 *B4A48A(S3) *20棒15 **ASTM16 **ASTM A106 **20钢管 **B4A51B(S4) **20精制管, 管17 ** B级ASTM A106 **20钢管 **B4A56A2(S3) **16MnR厚板18 **F304L ASTM A182-05 **00Cr19Ni10锻件,钢管**B4A57B1(S2) **20精制管19 **F316 ASTM A182-05**0Cr17Ni12Mo2锻件**B5F4C(S23) **42CrMoA棒20 ** WPB ASTM A234-04 **20锻件 **B5F5B3(S26) **45CrMoV A棒21 **ASTM A276-96 TYPE316 **0Cr17Ni12Mo2棒**B7A2C(S14) **0Cr18Ni9薄板**0Cr18Ni9钢管22 **Grade B ASTM A307-04**35棒 **B7A17B(S10)23 **TP304L ASTM A312-04**00Cr19Ni10钢管**B7A17B2(S10) **0Cr18Ni9钢管24 **FP316L ASTM A312-04**00Cr17Ni14Mo2钢管**B7A25B(S5) **0Cr18Ni10Ti薄板25 **ASTM A366M-91 **SC1(**08Al) 中厚板, 薄板**B7A31A3(S10) **0Cr18Ni9棒,中厚板26 **F304L ASTM A403-04 **00Cr19Ni10锻件**B7A34C2(S16) **0Cr18Ni9薄板27 **F316L ASTM A403-04 **00Cr17Ni14Mo2锻件**B7A44C2(S4) **00Cr19Ni10钢带28 ** CS A ASTM A1008M-04 **SC1(**08Al) 中厚板,薄板**B7A54A(S4) **0Cr18Ni9中厚板,管29 **B2M1C(S31) **ZG230-450 **B7A59B(S4) **00Cr19Ni10钢管30 *B4A2(S34) *20 *B7A62A(S4) *00Cr19Ni10中厚板31 *B4A2A(S34) *20棒 *B7A63A3(S3)*00Cr19Ni10中厚板,棒,管32 *B4A2A(S34)*Q235A薄板 *B7A68B(S9) *00Cr19Ni10薄板,中厚板33 **B4A2A(S34)**20g中厚板 **B7A68C2(S9) **00Cr19Ni10薄板34 *B4A2C(S34) *20 **B7A80A2(S4) **00Cr17Ni14Mo2薄板35 **B4A2C4(S34) **20g中厚板 *B7A82A3(S5) *0Cr17Ni12Mo2棒材料对照表(2006年G版)下面是简易的材料对照表,加“*”符号的是GE公司D50A152(L)确认又经EPE批准的材料,加“**”符号的是GE-EPE“SDR”认可的材料。

16235FAM资料

16235FAM资料

PACIFIC DISPLAY DEVICESLCD Component Data SheetModel Number: 1623516 Character by 2 LineAlphanumeric LCD AssemblyWith Embedded ControllerCONTENTSINFORMATION1. GENERALProductOverview 2 1.11.2 Part Numbering System 2Ratings 3 Maximum1.3Absolute1.4 Circuit Block Diagram 3Characteristics 3 Mechanical1.51.6 Input Signal Function 41.7 LCM Contrast Control and Bias 4Dimensions 5 LCD1.82. ELECTRICAL / OPTICAL CHARACTERISTICS2.1 DC Electrical Characteristics 62.2 AC Electrical Characteristics 6Characteristics 8 2.3Optical2.4 LED Backlight Characteristics 102.5 EL Panel Backlight Characteristics 103. OPERATING PRINCIPALS AND METHODS3.1 LCD Controller Display and Control Functions 113.2 Display Data RAM Address Map 134. RELIABILITY 145. PRECAUTIONS FOR USING LCD MODULES 15516 N. Diamond Bar Blvd – Suite 103 – Diamond Bar, CA – 917651. GENERAL INFORMATION1.1 Product Overview•16 Character x 2 line Alphanumeric Dot Matrix LCD Module•LCD Controller: Embedded S6A0069 or equivalent alpha-numeric controller •Multiplexing driving: 1/16 duty, 1/4 bias•Operating Mode: Super Twisted Nematic (STN) technology•LCD Module Service Life: 100,000 hours minimum1.2 Part Numbering System16235-xx-SL-F-ST-LED-GY-12¾•¾•••¾•••¾••¾••¾••••¾•(-6) 6 o’clock•(-12) 12 0’clock1.3 Absolute Maximum RatingsParameter Symbol Min Max UnitSupply voltage for logic V DD -0.3 7.0 V Supply voltage for LCD V DD – V0 -- V DD +0.3 V Input voltage VI -0.3 V DD +0.3 V Standard Operating temperature TOP (-ST) 0 50 ºC Standard Storage temperature TST (-ST) -10 60 ºC Extended Operating temperature TOP (-ET) -20 70 ºC Extended Storage temperature TST (-ET) -30 80 ºC Soldering Temp Tsolder 260 ºC1.4 Circuit Block Diagram1.5 Mechanical CharacteristicsItem Contents UnitModule size (W ×H ×T)85 x 35 x 14.2 Max (w/ LED Backlight) 85 x 35 x 10 Max (w/ ELP or No LED Backlight) mm Viewing area (W ×H)62.2 x 17.9 mm Character matrix (W ×H)5 x 8 dots Character size (W ×H)2.95 x 5.55 mm Dot size (W ×H)0.55 x 0.65 mm Dot pitch (W ×H)0.60 x 0.70 mmV OV DD E~1.6 Input Signal FunctionPin NO. Symbol Level Description1 VSS 0V Ground2 VDD 5.0V Supply voltage for logic3 VO --- Input voltage for LCD4 RS H/L H : Data signal, L : Instruction signal5 R/W H/L H : Read mode, L : Write mode6 EHH,→ L Chip enable signal7 DB0 H/L Data bit 08 DB1 H/L Data bit 19 DB2 H/L Data bit 210 DB3 H/L Data bit 311 DB4 H/L Data bit 412 DB5 H/L Data bit 513 DB6 H/L Data bit 614 DB7 H/L Data bit 7anodelight15 BLA 4.2V Backcathodelight16 BLK 0V Back1.7 LCM Contrast Control and Bias1.7 LCM Dimensions2. ELECTRICAL / OPTICAL CHARACTERISTICS2.1 DC Electrical Characteristics (V DD = +5V±10% , V SS = 0V, Ta = 25°C )UnitMin Typ Max Parameter SymbolConditionSupply voltage for logic V DD --- 4.5 5.0 5.5 VmA Supply current for logic I DD --- --- 1.38 30°C 4.7 5.0 5.3 V Operating voltage for LCD* V DD-V O25°C 4.4 4.7 5.0 V50°C 4.2 4.5 4.8 VV Input voltage ' H ' level V IH--- 2.2 --- VDDInput voltage ' L ' level V IL--- -0.3 --- 0.6 V *Note: -ET temp range will require up to 8V biasing and require a minimum external voltage supply of -3V @-20°C.2.2 AC Electrical Characteristics•Read ModeCharacteristic SymbolMin. Typ. Max. Unit TestpinE cycle time t C 500 --- --- ns EE rise time t r --- --- 25 ns EE fall time t f --- --- 25 ns EE pulse width t W 220 --- --- ns ER/W and RS set-up time t SU 40 --- --- ns R/W,RSR/W and RS hold time t h 10 --- --- ns R/W,RS Data output delay time t D --- --- 120 ns DB0 ~ DB7Data hold time t DH 20 --- --- ns DB0 ~ DB72.3 Optical Characteristics (V OP = 4.7V, Ta = 25°C )Item Symbol Condition Min Typ Max UnitResponse time Tr --- --- 250 380 msTf --- --- 200 300 ms Frame Frequency fFRM --- --- 64 --- Hz Contrast ratio Cr --- 3 4 7 ---θ1-40 -- 40 Deg Viewing angle range θ225° C-40 -- -40 Deg2.4 LED Backlight Characteristics■ Yellow-Green LED Operating Characteristics (5V - Array Lit)StandardItem Symbol Conditions Min. Typ. Max.UnitForward Voltage V f Ta =25 °C --- 4.2 4.6 VDC Forward Current I F Ta = 25 °C --- 120 220 mA Reverse Voltage V R Ta = 25 °C --- 8 --- V■ Life (Array or Edge Lit)StandardItem Conditions Min. Max.UnitLife Ta =25 °C 100,000 --- hrs2.5 EL Panel Backlight Characteristics■ Blue-Green EL Panel Operating Characteristics:StandardItem Conditions Min. Typ. Max.UnitCurrent Consumption 100VAC RMS, 400HzTa: 25°C--- 1.8 3.1 mAEL Drive Voltage --- --- 100 150 VAC RMS EL Drive Frequency --- --- 400 1000 HzOperating Temperature --- -35°C --- +50°C °C Storage Temperature --- -40°C --- +60°C °CLuminance 40 50 --- cd/m 2Luminance Half-Life 100VAC RMS, 400Hz Ta: 25°C 3500 --- --- Hrs*Note: half life is defined as Luminance being reduced by 50%3. OPERATING PRINCIPALS AND METHODES•Initializing by InstructionPower On| Wait for more than 15ms after VDD rises to 4.5V|RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 0 1 1 * * * * BF cannot be checked before this instruction. Function Set| Wait for more than 4.1ms|RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 0 1 1 * * * * BF cannot be checked before this instruction. Function Set| Wait for more than 100µs|RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 0 1 1 * * * * BF cannot be checked before this instruction. Function Set|| | | | BF can be checked after following instruction.When BF is not checked, the waiting time between instructions is longer than execution instruction time.|RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 0 1 1 N F * * Function Set (Specify the number of display lines and character font.) The number of display lines and character font cannot be changed afterwards.0 0 0 0 0 0 1 0 0 0 Display Off0 0 0 0 0 0 0 0 0 1 Display Clear 0 0 0 0 0 0 0 1 I/D S Entry Mode Set||ÈInitialization ends3.2 Display Data RAM Address MapLCD Character Location mapCharacters 1 2 3 4 5 6 7 8 9 1011 12 13 14 15 16 First line 00H 01H 02H 03H 04H05H06H07H08H09H0AH0BH 0CH 0DH 0EH0FH Second line 40H 41H 42H 43H 44H45H46H47H48H49H4AH4BH 4CH 4DH 4EH4FH4. RELIABILITYLCD Panel Service LifeDefinition of panel service life•100,000 hours minimum at 25° C ±10%•Contrast becomes 30% of initial value•Current consumption becomes three times higher than initial value •Remarkable alignment deterioration occurs in LCD cell layer•Unusual operation occurs in display functions5. PRECAUTIONS FOR USING LCD MODULESInstalling LCD ModulesThe hole in the printed circuit board is used to fix LCM as shown in the picture below. Attend to the following items when installing the LCM.1)Cover the surface with a transparent protective plate to protect the polarizer and LC cell.2)When assembling the LCM into other equipment, the spacer to the bit between the LCM and the fitting plateshould have enough height to avoid causing stress to the module surface, refer to the individual specifications formeasurements. The measurement tolerance should be ±0.1mm.Precaution for Handing LCD ModulesSince LCM has been assembled and adjusted with a high degree of precision, avoid applying excessive shocks to the module or making any alterations or modifications to it.1)Cover the surface with a transparent protective plate to protect the polarizer and LC cell.2)Do not alter, modify or change the shape of the tab on the metal frame.3)Do not make extra holes on the printed circuit board, modify its shape or change the positions of components tobe attached.4)Do not damage or modify the pattern writing on the printed circuit board.5)Absolutely do not modify the zebra rubber strip (conductive rubber) or heat seal connector.6)Except for soldering the interface, do not make any alterations or modifications with a soldering iron.7)Do not drop, bend or twist LCM.Electro-Static Discharge ControlSince this module uses a CMOS LSI, the same careful attention should be paid to electrostatic discharge as for an ordinary CMOS IC.1)Make certain that you are grounded when handing LCM.2)Before remove LCM from its packing case or incorporating it into a set, be sure the module and your body havethe same electric potential.3)When soldering the terminal of LCM, make certain the AC power source for the soldering iron does not leak.4)When using an electric screwdriver to attach LCM, the screwdriver should be of ground potentiality to minimizeas much as possible any transmission of electromagnetic waves produced sparks coming from the commutator ofthe motor.5)As far as possible make the electric potential of your work clothes and that of the work bench the groundpotential.6)To reduce the generation of static electricity be careful that the air in the work is not too dried. A relativehumidity of 50%-60% is recommended.Precaution for soldering to the LCM1)Observe the following when soldering lead wire, connector cable and etc. to the LCM.a)Soldering iron temperature : 280°C ± 10°C.b)Soldering time : 3-4 sec.2)Solder : eutectic solder.3)If soldering flux is used, be sure to remove any remaining flux after finishing to soldering operation. (This doesnot apply in the case of a non-halogen type of flux.) It is recommended that you protect the LCD surface with acover during soldering to prevent any damage due to flux spatters.4)When soldering the electroluminescent panel and PC board, the panel and board should not be detached morethan three times. This maximum number is determined by the temperature and time conditions mentioned above,though there may be some variance depending on the temperature of the soldering iron.5)When remove the electroluminescent panel from the PC board, be sure the solder has completely melted, thesoldered pad on the PC board could be damaged.Precautions for Operation1)Viewing angle varies with the change of liquid crystal driving voltage (VO). Adjust VO to show the best contrast.2)Driving the LCD in the voltage above the limit shortens its life.3)Response time is greatly delayed at temperature below the operating temperature range. However, this does notmean the LCD will be out of the order. It will recover when it returns to the specified temperature range.4)If the display area is pushed hard during operation, the display will become abnormal. However, it will return tonormal if it is turned off and then back on.5)Condensation on terminals can cause an electrochemical reaction disrupting the terminal circuit. Therefore, itmust be used under the relative condition of 40°C , 50% RH.6)When turning the power on, input each signal after the positive/negative voltage becomes stable.Safety•If the LCD panel breaks, be careful not to get the liquid crystal in your mouth. If the liquid crystal touches your skin or clothes, wash it off immediately using soap and plenty of water.Handling•The display panel is made of glass. Do not subject it to a mechanical shock by dropping it or impact.•If the display panel is damaged and the liquid crystal substance leaks out, be sure not to get any in your mouth. If the substance contacts your skin or clothes, wash it off using soap and water.•Do not apply excessive force to the display surface or the adjoining areas since this may cause the color tone to vary.•The polarizer covering the display surface of the LCD module is soft and easily scratched. Handle this polarizer carefully.•If the display surface becomes contaminated, breathe on the surface and gently wipe it with a soft dry cloth. If it is heavily contaminated, moisten cloth with one of the following solvents :o Isopropyl alcoholo Ethyl alcohol•Solvents other than those above-mentioned may damage the polarizer. Especially, do not use the following.o Watero Ketoneo Aromatic solvents•Exercise care to minimize corrosion of the electrode. Corrosion of the electrodes is accelerated by water droplets, moisture condensation or a current flow in a high-humidity environment.•Install the LCD Module by using the mounting holes. When mounting the LCD module make sure it is free of twisting, warping and distortion. In particular, do not forcibly pull or bend the I/O cable or the backlight cable.•Do not attempt to disassemble or process the LCD module.•NC terminal should be open. Do not connect anything.•If the logic circuit power is off, do not apply the input signals.•To prevent destruction of the elements by static electricity, be careful to maintain an optimum work environment.o Be sure to ground the body when handling the LCD modules.o Tools required for assembling, such as soldering irons, must be properly grounded.o To reduce the amount of static electricity generated, do not conduct assembling and other work under dry conditions.o The LCD module is coated with a film to protect the display surface. Exercise care when peeling off this protective film since static electricity may be generated.Storage•When storing the LCD modules, avoid exposure to direct sunlight or to the light of fluorescent lamps•Store the module in a dark place where the temperature is 25 o C ±10 o C and the humidity below 65% RH.•Do not store the module near organic solvents or corrosive gases.•Do not crush, shake, or jolt the module (including accessories).Cleaning•Do not wipe the polarizing plate with a dry cloth, as it may scratch the surface.•Wipe the module gently with soft cloth soaked with a petroleum benzene.•Do not use ketonic solvents (ketone and acetone) or aromatic solvents (toluene and xylene), as they may damage the polarizing plate.Others:•Liquid crystals solidify under low temperature (below the storage temperature range) leading to defective orientation or the generation of air bubbles (black or white). Air bubbles may also be generated if the module is subject to a low temperature.•If the LCD modules have been operating for a long time showing the same display patterns, the display patterns may remain on the screen as ghost images and a slight contrast irregularity may also appear. A normal operating status can be regained by suspending use for some time. It should be noted that this phenomenon does not adversely affect performance reliability.•To minimize the performance degradation of the LCD modules resulting from destruction caused by static electricity etc., exercise care to avoid holding the following sections when handling the modules.-Exposed area of the printed circuit board.-Terminal electrode sections.。

relap5输入卡介绍中文

relap5输入卡介绍中文

Relap5输入数据卡要求Relap5输入数据卡要求 (7)A-1 引言 (7)A-1.1 控制格式 (7)A-1.2 数据卡的编制 (7)A-1.3 题目卡 (7)A-1.4 注释卡 (7)A-1.5 数据卡 (8)A-1.6 继续卡 (8)A-1.7 终止卡 (9)A-1.8 序列展开格式 (9)A-1.9 上/下敏感性 (9)A-1.10 数据卡的要求 (9)A-1.11 输入错误扑捉 (9)A-2 各类控制卡片 (11)A-2.1 100卡片,问题类型和选择 (11)A-2.2 101卡,输入检查或运行选择 (11)A-2.3 102卡,单位选择 (11)A-2.4 103卡,再启动——输入文件控制卡 (12)A-2.5 104卡片,再启动——绘图文件控制卡 (12)A-2.6 105卡,CPU时间保留卡 (12)A-2.7 110卡,非凝结气体种类 (13)A-2.8 115卡,非凝结气体和金属种类质量份额 (13)A-2.8.1 Card 115,非凝结气初始质量份额 (13)A-2.8.2 Card 116,材料初始质量份额 (13)A-2.9 118卡,传热控制卡 (13)A-2.10 120-129卡,水力学系统控制卡 (13)A-2.11 140-147卡,自我初始化选择控制卡 (14)A-2.11.1 140卡,自我初始化控制卡 (14)A-2.11.2 141-142卡,自我初始化泵控制器和标识卡 (14)A-2.11.3 143-144卡,自我初始化蒸汽流动控制器标识卡 (14)A-2.11.4 145-146卡,自我初始化给水控制器标识卡 (15)A-2.11.5 147卡,压力和容积控制部件标识卡 (15)A-3 200-299卡时间步长控制卡 (16)A-3.1 200卡,初始时间值 (16)A-3.2 201-299卡,时间步长控制 (16)A-4 301-399卡片,小编辑要求 (17)A-4.1 常用量 (17)A-4.2 与部件有关的量 (17)A-4.3 与控制体有关的量 (18)A-4.4 与接管有关的量 (20)A-4.5 与热构件有关的量 (21)A-4.6 反应堆动力学量 (21)A-4.7 控制系统量 (21)A-4.8 扩大编辑绘图变量 (21)A-4.8.1 一般量 (22)A-4.8.2 与部件相关的量 (22)A-4.8.3 与控制体相关的量 (22)A-4.8.4 与接管相关的量 (23)A-4.8.5 与热构件相关的量 (24)A-4.8.6 与再淹没相关的量 (24)A-5 400-799卡片或20600000-206200000卡片 TRIP输入数据 (25)A-5.1 400卡,TRIP取消卡 (25)A-5.3 401-599卡或20600010-20610000卡,变量TRIP卡 (25)A-5.4 601-799卡或20620010-20620006卡逻辑TRIP卡 (26)A-5.5 600卡,终止前进TRIP卡 (26)A-6 801-999卡交互式输入数据 (27)A-7 CCCXXNN卡,水动力学部件 (28)A-7.1 CCC0000卡,部件名和类型 (28)A-7.2 单一控制体部件 (28)A-7.2.1 CCC0101至CCC0109卡,单一控制体几何卡 (28)A-7.2.2 CCC0200卡,单一控制体初始条件 (29)A-7.3 时间相关控制体部件 (30)A-7.3.1 CCC0101N至CCC0109卡,时间相关控制体几何卡 (30)A-7.3.2 CCC0200卡,时间相关控制体数据控制字码 (30)A-7.3.3 CCC0201至CCC0299卡,时间相关控制体数据卡 (31)A-7.4 单一接管部件 (32)A-7.4.1 CCC0101至CCC0109卡,单一接管几何卡 (32)A-7.4.2 CCC110卡,单一接管直径及CCFL数据卡 (33)A-7.4.3 CCC0201 卡单一接管的初始条件 (33)A7.5 时间相关接管部件 (33)A-7.5.1 CCC0101 卡,时间相关接管几何卡 (33)A-7.5.2 CCC0200卡,时间相半接管控字码 (34)A-7.5.3 CCC0201至CCC0299卡,时间相关接管数据卡 (34)A-7.6 管型或环型部件 (34)A-7.6.1 CCC0001卡,管型或环型部件信息卡 (34)A-7.6.2 CCC0101至CCC01999卡,管型或环型控制体面积 (35)A-7.6.3 CCC0201至CCC02999卡,管型或环型接管流通面积 (35)A-7.6.4 CCC0301至CCC03999卡,管型或环型控制体的长度 (35)A-7.6.5 CCC0401 至CCC0499卡,管型或环形控制体的容积 (35)A-7.6.6 CCC0501至CCC0599卡,管型或环形控制体(水平)角 (35)A-7.6.7 CCC0601至CCC0699卡,管型或环形控制体垂直角 (35)A-7.6.8 CCC0701至CCC0799卡,管型或环形控制体高度变化 (35)A-7.6.9 CCC0801至CCC0899卡,管型或环形控制体摩擦系数 (36)A-7.6.10 CCC0901至CCC0999卡,管型或环形控制体损失系数 (36)A-7.6.11 CCC1001至CCC1099卡,管型或环形控制体控制标识 (36)A-7.6.12 CCC1101至CCC1199卡,管型或环形接管控制标识 (36)A-7.6.13 CCC1201至CCC1299卡,管型或环形控制体初始条件 (37)A-7.6.14 CCC2001至CCC2099卡,管型或环形初始浓度 (38)A-7.6.15 CCC1300卡,管型或环形接管工况控制字码 (38)A-7.6.16 CCC1301至CCC1399卡,管型或环形接管初始条件 (38)A-7.6.17 CCC1401至CCC1499卡,管型或环形接管直径和CCFL数据卡 (38)A-7.7 分支、分离器,喷射混和器、透平或ECC混和器部件 (39)A-7.7.1 分支部件、分离器,喷射混和器、透平或ECC混和器信息卡 (40)A-7.7.2 CCC0101至CCC0109卡,分支分离器,喷射混合器,透平或ECC混合控制几何卡。

2354中文资料

2354中文资料
● Maximum primary power: 200 W @ 100 kHz
● Slot technology, Lizt wire recommended for proximity and skin effects reduction
● Mains insulation according to IEC60065 and IEC60950 safety standards
元器件交易网
Consumer Products
CONSUMER PRODUCTS
Pulse offers a complete range of Switch-Mode Transformers in various technologies (slot, layer and triple insulation wire) used for power supplies in television, set-top boxes, satellite receivers, DVD players, telephone chargers, and white goods. Pulse also offers a new range of specific magnetics for LCD TV power supplies and inverters to meet the growing, worldwide demand for flat-screen televisions. These innovative, components are manufactured in state-of-the-art, modern facilities. Switch-Mode Transformers, as well as new LCD components are produced in one of four different factories in China, depending on the technology. The products mentioned in this section serve as an overview of Pulse’s Consumer magnetics product line. For more information about Consumer products, contact Pulse Consumer Division Applications Engineering via e-mail at consumer@.

高效液相色谱测定食品中固绿的前处理方法对比研究

高效液相色谱测定食品中固绿的前处理方法对比研究

分析检测高效液相色谱测定食品中固绿的前处理方法对比研究许蕤竹(上海华测品标检测技术有限公司,上海 201114)摘 要:采用高效液相色谱法测定食品中人工合成色素固绿,对比了4种不同前处理方法,包括直接提取法、液-液萃取法、聚酰胺粉吸附法和固相萃取法。

分别对果汁、配制酒、糖果、蜜饯等不同基质进行测定,分析测定结果的准确度和精密度,并结合方法的便捷度和经济效益等,确定各种不同基质对应的最优前处理方法。

关键词:固绿;高效液相色谱;前处理;食品Comparative Study on Pretreatment Methods forDetermination of Fast Green FCF in Food by HighPerformance Liquid ChromatographyXU Ruizhu(Centre Testing International Group Co., Ltd., Shanghai 201114, China) Abstract: High performance liquid chromatography was used to determine the fast green FCF of artificial synthetic pigments in food. Four different pretreatment conditions were compared, including direct extraction method, liquid-liquid extraction method, polyamide powder adsorption method and solid phase extraction method. Prepare different matrices such as wine, candy, and candied fruit for determination, analyze the accuracy and precision of the measurement results, and combine the convenience and economic benefits of the method to determine the optimal pretreatment method for various matrices.Keywords: fast green FCF; high performance liquid chromatography; pretreatment; food人工合成色素在生产过程中可能带入有害物质,其本身过量使用也会对人体造成损害。

实验室标签-上海万格科学器材有限公司

实验室标签-上海万格科学器材有限公司

FreezerBondz可以耐受从液氮到高压的各种环境,清晰的条码标识让您的样本保持可追踪性,从而保护您的研究成果。

耐受常见的实验条件:例如液氮(-196℃)、超低温(-80℃)、高压锅,高温水槽和酒精擦拭等标签的尺寸适用于:冻存管,离心管,玻片,孔板,细管,培养皿和一般标识等FreezerBondz TM热转移打印标签应用型号应用环境尺寸标准包装匹配色带色带尺寸色带用量备注0.5-2ml 冻存管离心管THT-163-6421-3-80度25.4mm*9.53mm + D=9.53mm3K/Roll IP-R490260mm*300m1/7带瓶盖标THT-152-499-3液氮25.4mm*9.53mm3K/Roll IP-R490260mm*300mTHT-163-499-3液氮25.4mm*9.53mm + D=9.53mm3K/Roll IP-R490260mm*300mTHT-163-461-3低温直贴25.4mm*9.53mm + D=9.53mm3K/Roll IP-R430060mm*300m玻片THT-164-481-3防二甲苯22.86mm*22.86mm3K/Roll IP-R640060mm*300m IP300打印机专用实验室标准耗材选择表应用型号规格/寸尺0.5-2ml AT-163-LN耐-80度25mm*10mm+D=10mm25mm*10mm◆ 可打印各种实验室常规条码标签和低温条码标签◆ 300dpi打印头◆ 每次充电可打印3900张◆ 配套Label Mark打印软件,可通过USB连接打印二维码BMP71专用实验室标准耗材选择表◆ 可打印各种实验室常规标签和低温标签◆ 203dpi打印头◆ 预置有80种不同的图标◆ 可打印中文字符M21-750-499尺寸:19.05mm*4.88m应用环境:-80/液氮M21750499。

一种高电源抑制比带隙基准电压源的设计

一种高电源抑制比带隙基准电压源的设计

一种高电源抑制比带隙基准电压源的设计刘军儒,牛萍娟,高铁成(天津工业大学信息与通信工程学院,天津300160)摘要:采用共源共栅运算放大器作为驱动,设计了一种高电源抑制比和低温度系数的带隙基准电压源电路,并在TSMC 0.18μm CMOS 工艺下,采用HSPICE 进行了仿真.仿真结果表明:在-25~115℃温度范围内电路的温漂系数为9.69×10-6/℃,电源抑制比达到-100dB ,电源电压在2.5~4.5V 之间时输出电压V ref 的摆动为0.2mV ,是一种有效的基准电压实现方法.关键词:带隙基准电压源;电源抑制比;温度系数中图分类号:TN710.2曰TN86文献标志码:A文章编号:1671-024X (2010)02-0060-03Design of high PSRR bandgap voltage referenceLIU Jun-ru ,NIU Ping-juan ,GAO Tie-cheng(School of Information and Communication Engineering ,Tianjin Polytechnic University ,Tianjin 300160,China )Abstract :A bandgap voltage reference circuit is designed which has high power supply rejection ratio (PSRR )and lowtemperature coefficient.In the design ,the whole bandgap circuit has high PSRR through using Folded Cas -code Operational Amplifier as the next stage.Based on the TSMC 0.18μm CMOS model ,the simulation re -sults using HSPICE show that the temperature coefficient of the circuit is 9.69×10-6/℃between the tempera -ture range of -25-115℃and the PSRR is -100dB.The bandgap output voltage V ref swing is 0.2mV whenthe supply voltage is 2.5-4.5V.Therefore ,the design is an effective way to implement a bandgap voltage ref -erence.Key words :bandgap voltage reference ;PSRR ;temperature coefficient收稿日期:2009-10-23基金项目:国家863计划资助项目(2006AA03A154);天津市科技支撑计划项目(07ZCKFGX02100)作者简介:刘军儒(1985—),男,硕士研究生.通讯作者:牛萍娟(1973—),女,教授,硕士生导师.E-mail :Pjniu@第29卷第2期2010年4月天津工业大学学报JOURNAL OF TIANJIN POLYTECHNIC UNIVERSITYVol.29No.2April 2010模拟集成电路广泛地包含着带隙基准电压源,由于带隙基准电压源的输出电压与电源电压、工艺参数和温度的关系很小,因此带隙基准电压源一直是集成电路中的一个重要的基本模块[1].在模/数转换器、数/模转换器、偏置电路等集成电路设计中,对高电源抑制比、低温度系数的带隙基准电压源的设计十分关键.基于此,本文设计了一种高电源抑制比(PSRR )的带隙基准电压源.1带隙基准原理双极晶体管的基极-发射极电压V be 具有负温度系数,若两个双极晶体管工作在不相等的电流密度下,则它们的基极-发射极电压的差值ΔV be 就与绝对温度成正比.利用ΔV be 的正温度系数与V be 的负温度系数相互抵消,可以实现低温漂、高精度的基准电压[2].V out =V be +MV T (1)室温下,V be 的温度系数约为-1.5×10-3V/℃.而热电压V T (V T =k T/q ,k 为波耳兹曼常数)的温度系数为+0.087×10-3V/℃.当选择放大倍数M =17.2时,输出零温度系数的基准为:V out ≈1.25V (2)传统带隙电路结构如图1所示[3-4].其中Q 2的发射结面积是Q 1、Q 3的N 倍,A 为运算放大器,由于运算放大器的负反馈作用,a 、b 处的电压近似相等.因此可以得到:第2期V out =V be 3+(V be 1-V be 2)/R 1·R 2=(3)V be 3+(V T ln N /R 1)R 2选择合适的R 1、R 2和N ,理想情况下,输出电压与温度无关.2高电源抑制比带隙基准电压源设计的整体电路结构如图2所示.主要由运算放大器电路、核心电路、启动电路3部分组成.2.1带隙电压源的核心电路图2中的核心电路部分由PTAT 电流产生部分和V ref 输出组成,其特点是采用了共源共栅电流镜和两层pnp 管叠加结构,以提高电源抑制比和减小输入失调电压V os .如果采用一层pnp 管产生的PTAT 电流为:I PTAT =ΔV be /R 1=(V be1-V be2-V os )/R 1=(V T ln N -V os )/R 1(4)失调电压V os 将引起误差,如果用两层pnp 叠加结构,则有:I PTAT =ΔV be /R 1=(V be1+V be3-V be2-V be4-V os )/R 1=(2V T ln N -V os )/R 1(5)式中:N 为Q 1、Q 3与Q 2、Q 4的发射结面地之比.因此,失调电压的影响通过增大分子第一项的值而得以减小.所以有:V ref =V be5+R 2/R 1(2V T ln N -V os )(6)若选择R 2/R 1=5,N =8,就能得到零温度系数基准电压为:V ref ≈1.25V (7)2.2运算放大器电路运算放大器的输入级M 1、M 2和M 11采用差分放大器的电路结构.差分放大器只对差分信号进行放大,而对共模信号进行抑制,具有很强的抗干扰能力,并具有温漂小、级与级之间很容易直接耦合等优点[5].为了提高放大器的增益和电源抑制比,需要采用共源共栅结构.CMOS 共源共栅运算放大器通常有套筒和折叠两种结构形式.套筒结构具有频率特性好、功耗低等特点,然而在低电源电压下,其输出摆幅和共模输入范围难以达到预期要求.从应用角度出发,本文设计的运算放大器将在低电源电压下工作,要求尽可能快的速度、较大的输出摆幅和输入共模范围,因此采用了单级放大形式的折叠-共源共栅结构.由于PMOS 晶体管的跨导为NMOS 管的1/2~1/3,从而限制了运算放大电路的次极点频率.PMOS 管作为输入管在获得良好的直流增益的同时,还具有比NMOS 管好的1/f噪声特性,并能提高电源抑制比(PSRR )[6],因此采用PMOS 作为输入管.M 3~M 6组成共源共栅电流镜负载结构,以提高电源抑制比.M 12~M 19为电路各部分提供偏置.在任何的运放中都有失调电压V os 的存在,V os 严重影响V ref 的精确性,引入了较大的误差,设计中采用了高的放大倍数和细致的版图设计来减小失调电压带来的影响.为了减小电路的功耗损失,运算放大器选择较小的尾电流.2.3启动电路在与电源无关的偏置电路中,有一个很重要的问题是“简并”偏置点的存在.即当电源上电时,所有的晶体管均传输零电流,环路允许这样的状态存在.因此,必须加入启动电路,该电路在电源上电时能驱使电路摆脱“简并”偏置点[7].电路结构如图2所示,启动电路由M 20~M 24组成.在启动电路加入后,接通电源瞬间M 22~M 24饱和导通,M 20栅压被上拉为高电平而导通,从而将M 38的栅电压迅速拉低,运放电路与带隙基准电路部分进入正常工作状态.当整体电路正常工作后,M 21导通,M 20的栅压被下拉为低电平,M 20由导通变为截止,启动过程完成.3版图设计要求版图布局设计主要解决芯片中各个子模块的位置、芯片焊盘的分布和电源、信号走线的规则.芯片布图1带隙基准电压原理图Fig.1Schematics of band-gap voltage reference图2高电源抑制比电路图Fig.2Schematics of high PSRRM 15M 14M 13M 12M 16M 11M 4M 3M 2M 6M 30M 31M 32M 34M 36M 38M 24M 22M 39M 23M 19M 18M 17M 1M 9M 7M 5M 10M 8v a Q 1Q 2Q 3v b R 1R 2Q 4Q 5M 20NN M 21v refv ref M 37c 1M 33M 35V DD刘军儒,等:一种高电源抑制比带隙基准电压源的设计R 1AaM 1V out Q 2NbbaQ 1Q 3R 2M 2M 3v av b61——第29卷天津工业大学学报局设计首先需要考虑芯片中信号的流向,把具有输入、输出关系的模块尽量安排得相互靠近[8].其次还要考虑噪声和干扰,如对敏感电路的处理一般要做到远离敏感源.对于要求高度匹配的器件来说,在画版图时,一般采用添加冗余器件的方法来解决这个问题.要尽量避免走线穿过管子、电阻、电容等器件表面,否则将引进寄生电容.还要减小衬底和N 阱的寄生电阻,使寄生的三极管处于反向偏置状态,以避免闩锁效应.运放的差分输入管M 1、M 2应采用交叉对称结构,以减小制造过程中因为各种工艺误差而带来的偏差.4电路仿真结果用HSPICE 仿真工具,对所设计的基准电压源电路进行温度特性、电源抑制比性能仿真分析.电路工作在3.3V 的电源电压下,38℃时输出的基准电压V ref 为1.254V.输出的基准电压的温度特性曲线如图3所示.温度从-25℃变化到115℃,输出基准电压的变化为1.7mV ,温漂系数为9.69×10-6/℃.图4为带隙基准电源电压抑制比曲线,仿真时在电源电压V DD 上叠加一个幅度为1V 的交流小信号.从图4可以看出,整个电路在低频工作条件下有高的电源抑制比,在100Hz 内PSRR 小于-100dB.图5为取环境温度为25℃,电源电压V DD 在2.5~4.5V 范围内变化时测输出电压V ref 的变化,从仿真结果可以得到V ref 的摆动仅为0.2mV ,说明电路具有良好的电源电压稳定性.5结束语本文设计了一种采用0.18μm CMOS 工艺、电源电压为3.3V 的带隙基准电压源.常温时输出基准电压为1.25V ,在-25~+115℃的温度范围内,电路温漂系数为9.69×10-6/℃,电路具有高的电源抑制比,在低频下可达-100dB.该带隙基准电压源模块将被应用于DC/DC 转换器的电路设计,为系统提供参考电压.参考文献:[1]吴志明,黄颖,吕坚,等.高电源抑制比的CMOS 带隙基准电压源[J].电子科技大学学报,2008,37(3):453-456.[2]ALLEN P E ,HOLMBERG D R.CMOS Analog Circuit Design [M].北京:电子工业出版社,2002.[3]必查德·拉扎维.模拟CMOS 集成电路设计[M].陈贵灿,程军,张瑞智,等,译.西安:西安交通大学社,2002.[4]杨俊,卞兴中,王高峰.一种折叠共源共栅运算放大器的设计[J].现代电子技术,2006(18):28-29.[5]程春来,柴常春,唐重林.一种低压低功耗CMOS 折叠-共源共栅运算放大器的设计[J].中国集成电路,2007,100:40-44.[6]LEUNG K N ,MOK P K T ,LEUNG C Y.A 2-V 23uA 5.3ppm/℃curvature -compensated CMOS bang -gap reference [J].IEEEE Journal of Solid-State Circuits ,2003,38(3):651-654.[7]WU Jun ,TAN Yue-jin.Study on measure of complex networkinvulnerability[J].Journal of Systems Engineering ,2005,20(2):128-131.[8]THAM K M ,NAGARAJ K.A low supply voltage high PSRRvoltage reference in CMOS process[J].IEEE Sol Sta Circ ,1995,30(5):586-590.图3温度特性曲线Fig.3Temperature dependence of bandgap reference-40-20408010012020601.25431.25401.25371.25341.25311.25281.2525t /℃图5带隙基准输出电压随V DD 在2.5耀4.5V 范围内变化时的曲线Fig.5Output bandgap voltage reference in V DD 2.5-4.5V2.53.03.54.54.01.254401.254351.254301.254251.25420V DD /V 图4电源抑制比特性曲线Fig.4PSRR characteristic of band-gap reference0-20-40-60-80-100101k10k1M100kF /Hz10M62——。

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3-1625985-4 Product Details
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