TMS320F2809ZGMS中文资料

TMS320F2809,TMS320F2808,TMS320F2806 TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsData ManualLiterature Number:SPRS230JOctober2003–Revised September2007PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.ContentsTMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER 2003–REVISED SEPTEMBER 2007Revision History ...........................................................................................................................91F280x,F2801x,C280x DSPs . (11)1.1Features .....................................................................................................................111.2Getting Started (122)Introduction (13)2.1Pin Assignments ............................................................................................................152.2Signal Descriptions (213)Functional Overview (27)3.1Memory Maps ...............................................................................................................283.2Brief Descriptions ...........................................................................................................363.2.1C28x CPU .......................................................................................................363.2.2Memory Bus (Harvard Bus Architecture)....................................................................363.2.3Peripheral Bus ..................................................................................................363.2.4Real-Time JTAG and Analysis ................................................................................363.2.5Flash ..............................................................................................................373.2.6ROM ...............................................................................................................373.2.7M0,M1SARAMs ...............................................................................................373.2.8L0,L1,H0SARAMs ............................................................................................373.2.9Boot ROM ........................................................................................................373.2.10Security ..........................................................................................................393.2.11Peripheral Interrupt Expansion (PIE)Block ..................................................................403.2.12External Interrupts (XINT1,XINT2,XNMI)...................................................................403.2.13Oscillator and PLL ..............................................................................................403.2.14Watchdog ........................................................................................................403.2.15Peripheral Clocking .............................................................................................403.2.16Low-Power Modes ..............................................................................................403.2.17Peripheral Frames 0,1,2(PFn)..............................................................................413.2.18General-Purpose Input/Output (GPIO)Multiplexer .........................................................413.2.1932-Bit CPU-Timers (0,1,2)...................................................................................413.2.20Control Peripherals .............................................................................................413.2.21Serial Port Peripherals .........................................................................................423.3Register Map ................................................................................................................423.4Device Emulation Registers ...............................................................................................443.5Interrupts ....................................................................................................................443.5.1External Interrupts ..............................................................................................473.6System Control .............................................................................................................483.6.1OSC and PLL Block ............................................................................................493.6.2Watchdog Block .................................................................................................523.7Low-Power Modes Block (534)Peripherals (54)4.132-Bit CPU-Timers 0/1/2..................................................................................................544.2Enhanced PWM Modules (ePWM1/2/3/4/5/6)..........................................................................564.3Hi-Resolution PWM (HRPWM)...........................................................................................584.4Enhanced CAP Modules (eCAP1/2/3/4)................................................................................584.5Enhanced QEP Modules (eQEP1/2).....................................................................................614.6Enhanced Analog-to-Digital Converter (ADC)Module ................................................................634.6.1ADC Connections if the ADC Is Not Used ...................................................................664.6.2ADC Registers ...................................................................................................674.7Enhanced Controller Area Network (eCAN)Modules (eCAN-A and eCAN-B).....................................684.8Serial Communications Interface (SCI)Modules (SCI-A,SCI-B)....................................................73Contents 2Submit Documentation FeedbackTMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER2003–REVISED SEPTEMBER20074.9Serial Peripheral Interface(SPI)Modules(SPI-A,SPI-B,SPI-C,SPI-D) (76)4.10Inter-Integrated Circuit(I2C) (80)4.11GPIO MUX (82)5Device Support (86)5.1Device and Development Support Tool Nomenclature (86)5.2Documentation Support (88)6Electrical Specifications (91)6.1Absolute Maximum Ratings (91)6.2Recommended Operating Conditions (92)6.3Electrical Characteristics (92)6.4Current Consumption (93)6.4.1Reducing Current Consumption (97)6.4.2Current Consumption Graphs (98)6.5Emulator Connection Without Signal Buffering for the DSP (99)6.6Timing Parameter Symbology (100)6.6.1General Notes on Timing Parameters (100)6.6.2Test Load Circuit (101)6.6.3Device Clock Table (101)6.7Clock Requirements and Characteristics (103)6.8Power Sequencing (104)6.8.1Power Management and Supervisory Circuit Solutions (104)6.9General-Purpose Input/Output(GPIO) (107)6.9.1GPIO-Output Timing (107)6.9.2GPIO-Input Timing (108)6.9.3Sampling Window Width for Input Signals (109)6.9.4Low-Power Mode Wakeup Timing (110)6.10Enhanced Control Peripherals (113)6.10.1Enhanced Pulse Width Modulator(ePWM)Timing (113)6.10.2Trip-Zone Input Timing (113)6.10.3External Interrupt Timing (115)6.10.4I2C Electrical Specification and Timing (116)6.10.5Serial Peripheral Interface(SPI)Master Mode Timing (116)6.10.6SPI Slave Mode Timing (120)6.10.7On-Chip Analog-to-Digital Converter (123)6.11Detailed Descriptions (128)6.12Flash Timing (129)6.13ROM Timing(C280x only) (130)7Migrating From F280x Devices to C280x Devices (131)7.1Migration Issues (131)8Mechanical Data (132)Contents3TMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER2003–REVISED SEPTEMBER2007List of Figures2-1TMS320F2809,TMS320F2808100-Pin PZ LQFP(Top View) (16)2-2TMS320F2806100-Pin PZ LQFP(Top View) (17)2-3TMS320F2802,TMS320F2801,TMS320C2802,TMS320C2801100-Pin PZ LQFP(Top View) (18)2-4TMS320F2801x100-Pin PZ LQFP(Top View) (19)2-5TMS320F2809,TMS320F2808,TMS320F2806,TMS320F2802,TMS320F2801,TMS320F28016,TMS320F28015,TMS320C2802,TMS320C2801100-Ball GGM and ZGM MicroStar BGA™(Bottom View) (20)3-1Functional Block Diagram (27)3-2F2809Memory Map (28)3-3F2808Memory Map (29)3-4F2806Memory Map (30)3-5F2802,C2802Memory Map (31)3-6F2801,F28015,F28016,C2801Memory Map (32)3-7External and PIE Interrupt Sources (45)3-8Multiplexing of Interrupts Using the PIE Block (46)3-9Clock and Reset Domains (48)3-10OSC and PLL Block Diagram (49)3-11Using a3.3-V External Oscillator (50)3-12Using a1.8-V External Oscillator (50)3-13Using the Internal Oscillator (50)3-14Watchdog Module (52)4-1CPU-Timers (54)4-2CPU-Timer Interrupt Signals and Output Signal (55)4-3Multiple PWM Modules in a280x System (56)4-4ePWM Sub-Modules Showing Critical Internal Signal Interconnections (58)4-5eCAP Functional Block Diagram (59)4-6eQEP Functional Block Diagram (61)4-7Block Diagram of the ADC Module (64)4-8ADC Pin Connections With Internal Reference (65)4-9ADC Pin Connections With External Reference (66)4-10eCAN Block Diagram and Interface Circuit (69)4-11eCAN-A Memory Map (70)4-12eCAN-B Memory Map (71)4-13Serial Communications Interface(SCI)Module Block Diagram (75)4-14SPI Module Block Diagram(Slave Mode) (79)4-15I2C Peripheral Module Interfaces (81)4-16GPIO MUX Block Diagram (82)4-17Qualification Using Sampling Window (85)5-1Example of TMS320x280x Device Nomenclature (87)4Submit Documentation Feedback List of FiguresTMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER2003–REVISED SEPTEMBER2007 6-1Typical Operational Current Versus Frequency(F2808) (98)6-2Typical Operational Power Versus Frequency(F2808) (98)6-3Emulator Connection Without Signal Buffering for the DSP (99)6-4 3.3-V Test Load Circuit (101)6-5Clock Timing (104)6-6Power-on Reset (105)6-7Warm Reset (106)6-8Example of Effect of Writing Into PLLCR Register (107)6-9General-Purpose Output Timing (107)6-10Sampling Mode (108)6-11General-Purpose Input Timing (109)6-12IDLE Entry and Exit Timing (110)6-13STANDBY Entry and Exit Timing Diagram (111)6-14HALT Wake-Up Using GPIOn (112)6-15PWM Hi-Z Characteristics (113)6-16ADCSOCAO or ADCSOCBO Timing (115)6-17External Interrupt Timing (115)6-18SPI Master Mode External Timing(Clock Phase=0) (118)6-19SPI Master Mode External Timing(Clock Phase=1) (120)6-20SPI Slave Mode External Timing(Clock Phase=0) (121)6-21SPI Slave Mode External Timing(Clock Phase=1) (122)6-22ADC Power-Up Control Bit Timing (124)6-23ADC Analog Input Impedance Model (125)6-24Sequential Sampling Mode(Single-Channel)Timing (126)6-25Simultaneous Sampling Mode Timing (127)List of Figures5TMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER2003–REVISED SEPTEMBER2007List of Tables2-1Hardware Features(100-MHz Devices) (14)2-2Hardware Features(60-MHz Devices) (15)2-3Signal Descriptions (21)3-1Addresses of Flash Sectors in F2809 (33)3-2Addresses of Flash Sectors in F2808 (33)3-3Addresses of Flash Sectors in F2806,F2802 (33)3-4Addresses of Flash Sectors in F2801,F28015,F28016 (34)3-5Impact of Using the Code Security Module (34)3-6Wait-states (35)3-7Boot Mode Selection (38)3-8Peripheral Frame0Registers (43)3-9Peripheral Frame1Registers (43)3-10Peripheral Frame2Registers (44)3-11Device Emulation Registers (44)3-12PIE Peripheral Interrupts (46)3-13PIE Configuration and Control Registers (47)3-14External Interrupt Registers (47)3-15PLL,Clocking,Watchdog,and Low-Power Mode Registers (49)3-16PLLCR Register Bit Definitions (51)3-17Possible PLL Configuration Modes (51)3-18Low-Power Modes (53)4-1CPU-Timers0,1,2Configuration and Control Registers (55)4-2ePWM Control and Status Registers (57)4-3eCAP Control and Status Registers (59)4-4eQEP Control and Status Registers (62)4-5ADC Registers (67)4-6 3.3-V eCAN Transceivers (69)4-7CAN Register Map (72)4-8SCI-A Registers (74)4-9SCI-B Registers (74)4-10SPI-A Registers (77)4-11SPI-B Registers (77)4-12SPI-C Registers (78)4-13SPI-D Registers (78)4-14I2C-A Registers (81)4-15GPIO Registers (83)4-16F2808GPIO MUX Table (84)6-1TMS320F2809,TMS320F2808Current Consumption by Power-Supply Pins at100-MHz SYSCLKOUT (93)6-2TMS320F2806Current Consumption by Power-Supply Pins at100-MHz SYSCLKOUT (94)6Submit Documentation Feedback List of TablesTMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER2003–REVISED SEPTEMBER2007 6-3TMS320F2802,TMS320F2801Current Consumption by Power-Supply Pins at100-MHz SYSCLKOUT (95)6-4TMS320C2802,TMS320C2801Current Consumption by Power-Supply Pins at100-MHz SYSCLKOUT (96)6-5Typical Current Consumption by Various Peripherals(at100MHz) (97)6-6TMS320x280x Clock Table and Nomenclature(100-MHz Devices) (101)6-7TMS320x280x Clock Table and Nomenclature(60-MHz Devices) (102)6-8Input Clock Frequency (103)6-9XCLKIN Timing Requirements-PLL Enabled (103)6-10XCLKIN Timing Requirements-PLL Disabled (103)6-11XCLKOUT Switching Characteristics(PLL Bypassed or Enabled) (103)6-12Power Management and Supervisory Circuit Solutions (104)6-13Reset(XRS)Timing Requirements (106)6-14General-Purpose Output Switching Characteristics (107)6-15General-Purpose Input Timing Requirements (108)6-16IDLE Mode Timing Requirements (110)6-17IDLE Mode Switching Characteristics (110)6-18STANDBY Mode Timing Requirements (110)6-19STANDBY Mode Switching Characteristics (111)6-20HALT Mode Timing Requirements (111)6-21HALT Mode Switching Characteristics (112)6-22ePWM Timing Requirements (113)6-23ePWM Switching Characteristics (113)6-24Trip-Zone input Timing Requirements (113)6-25High Resolution PWM Characteristics at SYSCLKOUT=(60-100MHz) (114)6-26Enhanced Capture(eCAP)Timing Requirement (114)6-27eCAP Switching Characteristics (114)6-28Enhanced Quadrature Encoder Pulse(eQEP)Timing Requirements (114)6-29eQEP Switching Characteristics (114)6-30External ADC Start-of-Conversion Switching Characteristics (114)6-31External Interrupt Timing Requirements (115)6-32External Interrupt Switching Characteristics (115)6-33I2C Timing (116)6-34SPI Master Mode External Timing(Clock Phase=0) (117)6-35SPI Master Mode External Timing(Clock Phase=1) (119)6-36SPI Slave Mode External Timing(Clock Phase=0) (120)6-37SPI Slave Mode External Timing(Clock Phase=1) (121)6-38ADC Electrical Characteristics(over recommended operating conditions) (123)6-39ADC Power-Up Delays (124)6-40Current Consumption for Different ADC Configurations(at12.5-MHz ADCCLK) (124)6-41Sequential Sampling Mode Timing (126)6-42Simultaneous Sampling Mode Timing (127)6-43Flash Endurance (129)List of Tables7TMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER2003–REVISED SEPTEMBER20076-44Flash Parameters at100-MHz SYSCLKOUT (129)6-45Flash/OTP Access Timing (129)6-46Minimum Required Flash/OTP Wait-States at Different Frequencies (130)6-47ROM/OTP Access Timing (130)6-48ROM/ROM(OTP area)Minimum Required Wait-States at Different Frequencies (130)8-1F280x Thermal Model100-pin GGM Results (132)8-2F280x Thermal Model100-pin PZ Results (132)8-3C280x Thermal Model100-pin GGM Results (132)8-4C280x Thermal Model100-pin PZ Results (132)8-5F2809Thermal Model100-pin GGM Results (132)8-6F2809Thermal Model100-pin PZ Results (133)8Submit Documentation Feedback List of TablesRevision HistoryTMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER 2003–REVISED SEPTEMBER 2007NOTE:Page numbers for previous revisions may differ from page numbers in the current version.This data manual was revised from SPRS230I to SPRS230J.This document has been reviewed for technical accuracy;the technical content is up to date as of the specified release date with the following changes:Technical Changes Made for Revision JLocation Additions,Deletions,ChangesSection 2.1Modified first paragraph in section on pin assignmentsFigure 2-3Modified the TMS320F2802,TMS320F2801,TMS320C2802,TMS320C2801100-Pin PZ LQFP pinmapFigure 2-5Added 2801x devices to title of pinmap for GGM and ZGM packages Table 2-3Changed description of EPWM5A and EPWM6A Figure 3-5Added a note to the 2802memory map Figure 3-6Added a note to the 2801,2801x memory map Table 3-6Modified Wait-states table Table 3-6Modified section on ROMSection 3.2.10Deleted part of note in section on security Section 3.2.19Modified section on 32-bit CPU timersFigure 3-7Modified External and PIE Interrupt Sources figure and added two paragraphs following figure Figure 4-2Modified figureSection 4.3Deleted note in HRPWM sectionRevision History 9TMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER2003–REVISED SEPTEMBER200710Submit Documentation Feedback Revision History1F280x,F2801x,C280x DSPs1.1FeaturesTMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER 2003–REVISED SEPTEMBER 2007•High-Performance Static CMOS Technology •Enhanced Control Peripherals –100MHz (10-ns Cycle Time)–Up to 16PWM Outputs–60MHz (16.67-ns Cycle Time)–Up to 6HRPWM Outputs With 150ps MEP Resolution–Low-Power (1.8-V Core,3.3-V I/O)Design –Up to Four Capture Inputs•JTAG Boundary Scan Support (1)–Up to Two Quadrature Encoder Interfaces •High-Performance 32-Bit CPU (TMS320C28x)–Up to Six 32-bit/Six 16-bit Timers –16x 16and 32x 32MAC Operations •Serial Port Peripherals –16x 16Dual MAC–Up to 4SPI Modules–Harvard Bus Architecture –Up to 2SCI (UART)Modules –Atomic Operations–Up to 2CAN Modules–Fast Interrupt Response and Processing –One Inter-Integrated-Circuit (I2C)Bus –Unified Memory Programming Model •12-Bit ADC,16Channels–Code-Efficient (in C/C++and Assembly)–2x 8Channel Input Multiplexer •On-Chip Memory–Two Sample-and-Hold–F2809:128K X 16Flash,18K X 16SARAM –Single/Simultaneous Conversions F2808:64K X 16Flash,18K X 16SARAM F2806:32K X 16Flash,10K X 16SARAM –Fast Conversion Rate:F2802:32K X 16Flash,6K X 16SARAM 80ns -12.5MSPS (F2809only)F2801:16K X 16Flash,6K X 16SARAM 160ns -6.25MSPS (280x)F2801x:16K X 16Flash,6K X 16SARAM 267ns -3.75MSPS (F2801x)–1K x 16OTP ROM (Flash Devices Only)–Internal or External Reference –C2802:32K X 16ROM,6K X 16SARAM •Up to 35Individually Programmable,C2801:16K X 16ROM,6K X 16SARAM Multiplexed GPIO Pins With Input Filtering •Boot ROM (4K x 16)•Advanced Emulation Features–With Software Boot Modes (via SCI,SPI,–Analysis and Breakpoint Functions CAN,I2C,and Parallel I/O)–Real-Time Debug via Hardware –Standard Math Tables •Development Support Includes•Clock and System Control–ANSI C/C++Compiler/Assembler/Linker –Dynamic PLL Ratio Changes Supported –Code Composer Studio™IDE –On-Chip Oscillator–DSP/BIOS™–Watchdog Timer Module–Digital Motor Control and Digital Power •Any GPIO A Pin Can Be Connected to One of Software Librariesthe Three External Core Interrupts•Low-Power Modes and Power Savings•Peripheral Interrupt Expansion (PIE)Block –IDLE,STANDBY,HALT Modes Supported That Supports All 43Peripheral Interrupts –Disable Individual Peripheral Clocks •128-Bit Security Key/Lock•Package Options–Protects Flash/OTP/L0/L1Blocks–Thin Quad Flatpack (PZ)–Prevents Firmware Reverse Engineering –MicroStar BGA™(GGM,ZGM)•Three 32-Bit CPU Timers•Temperature Options:–A:-40C to 85C (PZ,GGM,ZGM)–S:-40C to 125C (PZ,GGM,ZGM)–Q:-40C to 125C (PZ)(1)IEEE Standard 1149.1-1990Standard Test Access Port and Boundary Scan ArchitecturePlease be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this document.Code Composer Studio,DSP/BIOS,MicroStar BGA,TMS320C28x,C28x,TMS320C2000are trademarks of Texas Instruments.eZdsp is a trademark of Spectrum Digital.PRODUCTION DATA information is current as of publication date.Copyright ©2003–2007,Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas Instruments standard warranty.Production processing does not necessarily include testing of all parameters.1.2Getting StartedTMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER 2003–REVISED SEPTEMBER 2007This section gives a brief overview of the steps to take when first developing for a C28x device.For more detail on each of these steps,see the following:•Getting Started With TMS320C28x™Digital Signal Controllers (literature number SPRAAM0).•C2000Getting Started Website (/c2000getstarted)Step 1.Acquire the appropriate development toolsThe quickest way to begin working with a C28x device is to acquire an eZdsp™kit for initial development,which,in one package,includes:•On-board JTAG emulation via USB or parallel port •Appropriate emulation driver•Code Composer Studio™IDE for eZdspOnce you have become familiar with the device and begin developing on your own hardware,purchase Code Composer Studio™IDE separately for software development and a JTAG emulation tool to get started on your project.Step 2.Download starter softwareTo simplify programming for C28x devices,it is recommended that users download and use the C/C++Header Files and Example(s)to begin developing software for the C28x devices and their various peripherals.After downloading the appropriate header file package for your device,refer to the following resources for step-by-step instructions on how to run the peripheral examples and use the header file structure for your own software•The Quick Start Readme in the /doc directory to run your first application.•Programming TMS320x28xx and 28xxx Peripherals in C/C++Application Report (literature number SPRAA85)Step 3.Download flash programming softwareMany C28x devices include on-chip flash memory and tools that allow you to program the flash with your software IP.•Flash Tools:C28x Flash Tools•TMS320F281x Flash Programming Solutions (literature number SPRB169)•Running an Application from Internal Flash Memory on the TMS320F28xx DSP (literature number SPRA958)Step 4.Move on to more advanced topicsFor more application software and other advanced topics,visit the TI website at or /c2000getstarted .12F280x,F2801x,C280x DSPs Submit Documentation Feedback2IntroductionTMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801 TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER2003–REVISED SEPTEMBER2007The TMS320F2809,TMS320F2808,TMS320F2806,TMS320F2802,TMS320F2801,TMS320F28015, TMS320F28016,TMS320C2802,and TMS320C2801,devices,members of the TMS320C28x™DSP generation,are highly integrated,high-performance solutions for demanding control applications.Throughout this document,TMS320F2809,TMS320F2808,TMS320F2806,TMS320F2802, TMS320F2801,TMS320C2802,TMS320C2801,TMS320F28015,and TMS32028016are abbreviated as F2809,F2808,F2806,F2802,F2801,F28015,F28016,C2802,and C2801,respectively.TMS320F28015 and TMS320F28016are abbreviated as F2801x.Table2-1provides a summary of features for each device.Submit Documentation Feedback Introduction13TMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER2003–REVISED SEPTEMBER2007Table2-1.Hardware Features(100-MHz Devices)FEATURE F2809F2808F2806F2802F2801Instruction cycle(at100MHz)10ns10ns10ns10ns10ns18K18K10K6K6K Single-access RAM(SARAM)(16-bit word)(L0,L1,M0,M1,(L0,L1,M0,M1,(L0,L1,M0,M1)(L0,M0,M1)(L0,M0,M1)H0)H0)3.3-V on-chip flash(16-bit word)128K64K32K32K16KOn-chip ROM(16-bit word)–––––Code security for on-chip flash/SARAM/OTP blocks Yes Yes Yes Yes YesBoot ROM(4K X16)Yes Yes Yes Yes YesOne-time programmable(OTP)ROM1K1K1K1K1K(16-bit word)PWM outputs ePWM1/2/3/4/5/6ePWM1/2/3/4/5/6ePWM1/2/3/4/5/6ePWM1/2/3ePWM1/2/3ePWM1A/2A/3A/ePWM1A/2A/ePWM1A/2A/HRPWM channels ePWM1A/2A/3A ePWM1A/2A/3A4A/5A/6A3A/4A3A/4A32-bit CAPTURE inputs or auxiliary PWM outputs eCAP1/2/3/4eCAP1/2/3/4eCAP1/2/3/4eCAP1/2eCAP1/232-bit QEP channels(four inputs/channel)eQEP1/2eQEP1/2eQEP1/2eQEP1eQEP1 Watchdog timer Yes Yes Yes Yes Yes12-Bit,16-channel ADC conversion time80ns160ns160ns160ns160ns32-Bit CPU timers33333Serial Peripheral Interface(SPI)SPI-A/B/C/D SPI-A/B/C/D SPI-A/B/C/D SPI-A/B SPI-A/B Serial Communications Interface(SCI)SCI-A/B SCI-A/B SCI-A/B SCI-A SCI-A Enhanced Controller Area Network(eCAN)eCAN-A/B eCAN-A/B eCAN-A eCAN-A eCAN-A Inter-Integrated Circuit(I2C)I2C-A I2C-A I2C-A I2C-A I2C-A Digital I/O pins(shared)3535353535 External interrupts33333 Supply voltage 1.8-V Core,3.3-V I/O Yes Yes Yes Yes Yes100-Pin PZ Yes Yes Yes Yes Yes Packaging100-Ball GGM,ZGM Yes Yes Yes Yes YesA:-40°C to85°C(PZ,GGM,ZGM)(PZ,GGM,ZGM)(PZ,GGM,ZGM)(PZ,GGM,ZGM)(PZ,GGM,ZGM) Temperature options S:-40°C to125°C(PZ,GGM,ZGM)(PZ,GGM,ZGM)(PZ,GGM,ZGM)(PZ,GGM,ZGM)(PZ,GGM,ZGM) Q:-40°C to125°C(PZ)(PZ)(PZ)(PZ)(PZ) Product status(1)TMS TMS TMS TMS TMS (1)See Section5.1,Device and Development Support Nomenclature for descriptions of device stages.14Introduction2.1Pin AssignmentsTMS320F2809,TMS320F2808,TMS320F2806TMS320F2802,TMS320F2801 TMS320C2802,TMS320C2801,and TMS320F2801x DSPsSPRS230J–OCTOBER2003–REVISED SEPTEMBER2007 Table2-2.Hardware Features(60-MHz Devices)FEATURE F2802-60F2801-60F28016F28015Instruction cycle(at60MHz)16.67ns16.67ns16.67ns16.67ns6K6K6K6KSingle-access RAM(SARAM)(16-bit word)(L0,M0,M1)(L0,M0,M1)(L0,M0,M1)(L0,M0,M1)3.3-V on-chip flash(16-bit word)32K16K16K16KOn-chip ROM(16-bit word)––––Code security for on-chip flash/SARAM/OTPYes Yes Yes YesblocksBoot ROM(4K X16)Yes Yes Yes YesOne-time programmable(OTP)ROM1K1K1K1K(16-bit word)PWM outputs ePWM1/2/3ePWM1/2/3ePWM1/2/3/4ePWM1/2/3/4 HRPWM channels ePWM1A/2A/3A ePWM1A/2A/3A ePWM1A/2A/3A/4A ePWM1A/2A/3A/4A32-bit CAPTURE inputs or auxiliary PWMeCAP1/2eCAP1/2eCAP1/2eCAP1/2 outputs32-bit QEP channels(four inputs/channel)eQEP1eQEP1--Watchdog timer Yes Yes Yes YesNo.of channels1616161612-Bit ADC MSPS 3.75 3.75 3.75 3.75Conversion time267ns267ns267ns267ns32-Bit CPU timers3333Serial Peripheral Interface(SPI)SPI-A/B SPI-A/B SPI-A SPI-ASerial Communications Interface(SCI)SCI-A SCI-A SCI-A SCI-A Enhanced Controller Area Network(eCAN)eCAN-A eCAN-A eCAN-A-Inter-Integrated Circuit(I2C)I2C-A I2C-A I2C-A I2C-ADigital I/O pins(shared)35353535External interrupts33331.8-V Core, 1.8-V Core, 1.8-V Core, 1.8-V Core, Supply voltage3.3-V I/O 3.3-V I/O 3.3-V I/O 3.3-V I/O100-Pin PZ Yes Yes Yes Yes Packaging100-Ball GGM,ZGM Yes Yes Yes YesA:-40°C to85°C(PZ,GGM,ZGM)(PZ,GGM,ZGM)(PZ,GGM,ZGM)(PZ,GGM,ZGM) Temperature options S:-40°C to125°C(PZ GGM,ZGM)(PZ,GGM,ZGM)(PZ,GGM,ZGM)(PZ,GGM,ZGM) Q:-40°C to125°C(PZ)(PZ)(PZ)(PZ)Product status(1)TMS TMS TMS TMS(1)See Section5.1,Device and Development Support Nomenclature for descriptions of device stages.The TMS320F2809,TMS320F2808,TMS320F2806,TMS320F2802,TMS320F2801,TMS320C2802, TMS320C2801,TMS320F28015,and TMS320F28016100-pin PZ low-profile quad flatpack(LQFP)pin assignments are shown in Figure2-1,Figure2-2,Figure2-3,and Figure2-4.The100-ball GGM and ZGM ball grid array(BGA)terminal assignments are shown in Figure2-5.Table2-3describes the function(s)of each pin.Submit Documentation Feedback Introduction15。