3296-P-102中文资料

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TESCOM中文样本

Cv = 1.3
• 可提供高精度的外部
PSIG
取压
• 平衡主阀设计增加了阀座寿命
26-1200 系列: 高流量
• 与上述 26-1100 类似
6,000 PSIG (414 Bar) 100-6,000 PSIG
更大的流量范围
Cv = 3.3 Cv =6.0 Cv = 12.0
0-1200, 0-1800
PSIG
铝 316 不锈钢
BB-5 系列: 袖珍型，两级减压
• 重量轻，设计紧凑
6,000 PSIG (414 Bar)
• 级间安全泄放接口
• 活塞感应，使用寿命长
• 无排放功能
0-80, 0-140,
Cv = 0.Байду номын сангаас6
0-220, 0-700,
0-1200 PSIG
• 设计紧凑
(414 Bar)
Cv = 0.24
• 挡块限制最大出口压力
• 入口及出口压力表接口为标配
• 标配无排放功能
黄铜 300 不锈钢 316 不锈钢
26-1000 多用途
26-1000 系列: 多用途
• 出口压力范围可
6,000 , 10,000 PSIG
现场调节
(414, 690 Bar)
• 多种接口选择
• 可选入口压力达
20,000 PSIG (1379 Bar)
• 大手柄设计，扭矩低
压力设定快速
• 标配带自排放功能
5-500, 5-800, 10-1500, 15-2500, 25-4000, 50-6000, 200-10,000 PSIG
Cv = 0.02 Cv = 0.06 Cv = 0.12 Cv = 0.3

RJGT102 数据手册说明书

RJGT102 V3.02数据手册武汉瑞纳捷电子技术有限公司—Wuhan RunJet Electronic technologyco. Ltd特性高性能防复制加密芯片提供看门狗定时器和对外复位功能SHA-256加密认证提供用于写入用户自定义的EEPROM单元遵循标准I²C总线协议可锁定的64位用户ID号2.97V～3.63V的工作电压可以对密钥和每个数据存储区单独加写保护独立看门狗定时器，溢出周期用户可自定义POR（Power On Reset）上电复位延迟时间由厂家编程支持低功耗模式应用汽车导航，车载DVD，汽车定位，汽车监控，行车记录仪手机，通信模块，路由器，对讲机监控设备，IP Cmarera，NVR/DVRRJGT102-Datasheet2 / 49订购信息型号功能封装引脚RJGT102WDP8 看门狗复位、加密保护SOP-8LRJGT102P8 加密保护SOP-8LRJGT102WDT6 看门狗复位、加密保护SOT23-6LRJGT102T6 加密保护SOT23-6LRJGT102-Datasheet3 / 49目录特性 (2)应用 (2)订购信息 (3)目录 (4)1.简介 (7)1.1特性 (7)1.1.1 安全性 (7)1.1.2 存储器 (7)1.1.3 外部设备特性 (7)1.1.4 特殊功能 (7)1.1.5 工作电压 (7)1.1.6 封装 (8)1.2RJGT102架构图 (9)1.3引脚配置 (10)1.3.1 SOP-8L引脚配置 (10)1.3.2 SOT23-6L引脚配置 (11)2. EEPROM和寄存器 (12)2.1数据存储区 (12)2.2密钥存储区 (13)2.3控制存储区 (14)2.4其他寄存器定义 (15)3. I/O端口 (17)3.1ESD保护电路 (17)3.2I/O类型 (18)3.2.1 时钟输入端口（SCL） (18)RJGT102-Datasheet4 / 493.2.2 双向端口（SDA） (18)3.3SDA和SCL I/O级特性 (19)4. I²C接口 (21)4.1I²C总线总体特征 (21)4.2低功耗待机模式 (21)4.3I²C总线位传输 (22)4.3.1 起始位与停止位 (22)4.3.2 数据有效性 (22)4.4I²C数据传输 (23)4.4.1 I²C字节格式 (23)4.4.2 应答 (23)4.5时钟的同步 (24)4.6I²C总线寻址 (25)4.6.1 7位地址格式 (25)4.6.2 7位地址寻址 (25)4.7数据传输 (26)4.8I²C总线特性 (27)5. 初始化 (29)5.1初始化波形 (29)6. UID的使用 (30)6.1UID使用特点 (30)6.2寄存器的具体使用 (30)7. 加密认证 (32)7.1SHA-256认证 (32)7.2SHA-256输入与输出格式 (32)8. 上电复位设计 (33)RJGT102-Datasheet5 / 498.1WDOG工作模式 (33)8.2复位管脚输出 (33)8.3功能描述 (33)8.3.1看门狗定时器 (33)8.3.2复位输出 (34)8.3.3寄存器描述 (35)9. 操作命令 (36)9.1初始化命令 (36)9.2主机认证命令 (37)9.3更新密钥命令 (37)9.4读/写命令 (37)10. 认证方案 (38)10.1认证方案流程 (38)10.2认证方案一 (39)10.3认证方案二 (40)10.4认证方案三 (41)11. 电气特性 (43)11.1最大额定参数 (43)11.2推荐工作条件 (43)11.3DC特性 (44)11.4模拟IP参数 (44)12. 封装尺寸 (46)12.1SOP-8L (46)12.2SOT23-6L (48)RJGT102-Datasheet6 / 491.简介RJGT102在单个芯片内集成了176Byte的EEPROM，128Byte寄存器页，8Byte密钥，8Byte 的用户ID/Serial Number，和16Byte的控制信息。

NCP102低压降差线性电源控制器说明书

NCP102SNT1G.NCP102MBGEVBNCP102Low Dropout Linear Regulator ControllerThe NCP102 is a low dropout linear regulator controller for applications requiring high-current and ultra low dropout voltages. The use of an external N-Channel MOSFET allows the user to adapt the device to a multitude of applications depending on system requirements for current and dropout voltage.An extremely accurate 0.8 V (±2%) reference allows the implementation of sub 1 V voltage supplies. The reference is guaranteed over the complete supply and temperature ranges.Other features of the NCP102 are a dedicated enable input, internally compensated error amplifier and an adjustable soft-start. A minimum drive capability of ±5 mA provides fast transient response. The drive current is internally limited to protect the controller in case of an external MOSFET failure. The NCP102 is packaged in a space saving TSOP-6.Features•ă4.5 V to 13.5 V Supply V oltage Range•ă0.8 V (±2%) V oltage Reference (Temperature and Process)•ăProgrammable Regulator Output V oltage Down to 0.8 V•ăDrive Current Capability of > ±5ĂmA•ăMLCC and POSCAP Compatible•ăProgrammable Soft-Start•ăEnable Active High•ăSpace Saving TSOP-6 Package•ăRoHS Compliant Pb-Free PackageApplications•ăDesktop and Laptops•ăComputer Peripherals such as Graphics Cards•ăSub 1 V Power SuppliesPIN CONNECTIONS13SOFT-SEN2FB4V CC6(Top View)Device Package Shipping†ORDERING INFORMATION5DRVTSOP-6(SOT23-6)SN SUFFIXCASE 318GMARKINGDIAGRAM102AYW GG102= Device CodeA= Assembly LocationY= YearW= Work WeekG= Pb-Free Package16GND†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.NCP102SNT1G TSOP-6(Pb-Free)3000/Tape & Reel(Note: Microdot may be in either location)Figure 2. Representative Block DiagramPIN FUNCTION DESCRIPTIONPin Symbol Name Description1EN Enable Input (Active High). Pull the EN pin below 0.8 V to disable the regulator and enter the standbymode operation.2GND Ground3FB Inverting input of the error amplifier. The output voltage is sampled by means of a resistor divider and ap‐plied to this pin for regulation.4SOFT-S Programmable soft-start. An internal current source charges the capacitor connected to this pin. The soft-start period ends once the voltage of the soft-start capacitor reaches 0.8 V.5DRV Gate drive for external N-Channel MOSFET. It is also the buffered output of the error amplifier.6V CC Power supply voltage input. Operating voltage range is from 4.5 to 13.5 V. A decoupling capacitor to GND should be used. A minimum of 0.1 m F is recommended.MAXIMUM RATINGS (T A = 25°C, unless otherwise noted)Rating Symbol Value UnitMain Supply Input Voltage Main Supply Input Current V CCI CC-0.3 to 15100VmAEnable Voltage Enable Current V ENI EN-0.3 to 9.75100VmASoft-Start Voltage Soft-Start Current V SOFT-SI SOFT-S-0.3 to 9.75100VmADrive Voltage Drive Current V DRVI DRV-0.3 to 9.75100VmAFeedback Voltage Feedback Current V FBI FB-0.3 to 9.75100VmAThermal Resistance, Junction-to-Ambient ą(0.36 sq in Printed Circuit Copper Clad)ą(1.0 sq in Printed Circuit Copper Clad)R q JA230200°C/WPower Dissipation (T A = 25°C, 2 oz Cu, 0.36 sq in Printed Circuit Copper Clad)P D0.4W Storage Temperature Range T stg-65 to 150°C Operating Junction Temperature Range T J-40 to 125°C Reflow Temperature 10 seconds T reflow260°C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1.This device series contains ESD protection and exceeds the following tests:Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22-A114Machine Model (MM) ±200 V per JEDEC standard: JESD22-A115tch-up current maximum rating: ±100 mA per JEDEC standard: JESD78.ELECTRICAL CHARACTERISTICS (V CC = 12 V, V EN = 1 V, V DRV = V FB, V SS = open, C CC = 0.1 m F. For typical values T J = 25°C. For min/max values, T J = -40°C to 125°C, unless otherwise noted)Parameter Condition Min Typ Max Unit POWER SUPPLYSupply Voltage V CC 4.5-13.5VSupply Current V CC = 5 VV CC = 12 V I CC1I CC2--1.41.83.23.2mAV CC Startup Voltage V CC increasing V CC(on) 4.0 4.2 4.5V V CC Turn Off Voltage V CC decreasing V CC(off) 3.8 4.0 4.4V V CC Hysteresis V CC(on) - V CC(off)V CC(hys)0.100.240.30VStandby Current V EN = 0 V, V CC = 5 VV EN = 0 V, V CC = 12 V I CC(off1)I CC(off2)--0.30.480.81.5mAERROR AMPLIFIERInput Bias Current V FB = 1.0 V I FB-1.0- 1.0m A Open Loop DC Gain (Note 3)A v5570-dB Unity Gain Bandwidth V FB = V DRV BW-0.7-MHz Power Supply Rejection Ratio (NoteĂ3)V CC = 12 V, 100 Hz PSRR50--dB DRIVESink Current V DRV = 6 V, V FB = 1 VV DRV = 2.5 V, V CC = 5 VV FB = 1 V I DRV(SNK1)I DRV(SNK2)5.05.0----mASource Current V DRV = 6 V, V FB = 0.6 VV DRV = 2.5 V, V CC = 5 V,V FB = 0.6 V I DRV(SRC1)I DRV(SRC2)5.05.0----mAOutput Voltage Low StateHigh StateI DRV = 5 mA, V FB = 1 VI DRV = 5 mA, V FB = 0.6 V,V CC = 9.5 VV DRV(low)V DRV(high)-9.0--0.5-VDrive Current Under Fault Conditions ąT J = 25°CV DRV = 0 V, V FB = 0.6 VV DRV = open, V FB = 0.6 VI DRV(MAX1)I DRV(MAX2)----4540mASOFT-STARTSource Current V SOFT-S = 1 V I SOFT-S 3.5 4.5 6.2m A ENABLESource Current I EN 5.01015m A Input Threshold VoltageOn State Off State V EN IncreasingV EN DecreasingV EN(on)V EN(off)0.70.660.80.770.90.88VThreshold Voltage Hysteresis V EN(on) - V EN(off)V EN(hys)-35-mV REFERENCEReference Voltage V CC = 5 V, V CC = 12 V V REF0.7840.80.816V 3.Guaranteed by design.TYPICAL CHARACTERISTICST J , JUNCTION TEMPERATURE (°C)I C C , S U P P L Y C U R R E N T (m A )4.04.14.24.34.44.53.63.73.83.9T J , JUNCTION TEMPERATURE (°C)V C C , S U P P L Y V O L T A G E (V )-20-10010203040506080f, FREQUENCY (kHz)A V O L , O P E N L O O P V O L T A G E G A I N (dB )T J , JUNCTION TEMPERATURE (°C)PHASE (°)020*********T J , JUNCTION TEMPERATURE (°C)I D R V (M A X ), M A X I M U M D R I V E C U R R E N T (m A )Figure 3. Supply Current vs. JunctionTemperatureFigure 4. Supply Voltage Thresholds vs.Junction TemperatureFigure 5. Error Amplifier Open Loop VoltageGain/Phase vs. FrequencyFigure 6. Drive Sink Current vs. JunctionTemperatureFigure 7. Drive Source Current vs. JunctionTemperature Figure 8. Drive Current Under Fault Conditionsvs. Junction Temperature-50-250255075100125150-50-2502550751001251500.1101001000-50-25255075100125150-50-25255075100125150180********36-36-72-108-144-180I D R V (S N K ), D R I V E S I N K C U R R E N T (m A )1030507090T J , JUNCTION TEMPERATURE (°C)0513182530-50-25255075100125150I D R V (S R C ), D R I V E S O U R C E C U R R E N T (m A )3101520 3.5170028238TYPICAL CHARACTERISTICST J , JUNCTION TEMPERATURE (°C)V E N , E N A B L E T H R E S H O L D V O L T A G E (V )T J , JUNCTION TEMPERATURE (°C)Figure 9. Soft-Start Charge Current vs.Junction TemperatureFigure 10. Enable Threshold Voltages vs.Junction TemperatureFigure 11. Reference Voltage vs. JunctionTemperature-50-250255075100125150-50-25255075100125150V R E F , R E F E R E N C E V O L T A G E (V )T J , JUNCTION TEMPERATURE (°C)0246810-50-25255075100125150I S O F T -S , S O F T -S T A R T C H A R G E (m A )13579DETAILED OPERATING DESCRIPTIONThe NCP102 is a low dropout linear regulator controller for applications requiring high-current and ultra low dropout voltages. The use of an external N-Channel MOSFET allows the user to adapt the device to a multitude of applications depending on system requirements for current and dropout voltage.An extremely accurate 0.8 V (±2%) reference allows the implementation of sub 1 V voltage supplies. The reference is guaranteed over the complete supply and temperature ranges.Other features of the NCP102 are a dedicated enable input, internally compensated error amplifier and an adjustable soft-start. A minimum drive capability of ±5 mA provides fast transient response. The drive current is internally limited to protect the controller in case of an external MOSFET failure. The NCP102 is packaged in a space saving TSOP-6.SUPPLY VOLTAGEThe NCP102 supply voltage range is between 4.5 V and 13.5 V. The controller is enabled once the supply voltage exceeds its minimum supply threshold, typically 4.5 V. The minimum operating voltage is reduced to 4.2 V (typical) once the controller is enabled to provide noise immunity.A bypass capacitor is required on the V CC pin to provide charge storage during power up and transient events. A minimum of 0.1 m F is recommended.DRIVE OUTPUTA powerful error amplifier (EA) capable of driving an external MOSFET is built into the NCP102. The output of the error amplifier is connected to the DRV pin. It has a minimum drive current capability of ±5 mA providing a fast transient response.The EA is biased directly from V CC. The DRV voltage follows V CC up and it is internally clamped to 9.75 V (typ.). This allows the use of external MOSFETs with a maximum gate voltage of 12 V.The DRV current is provided directly from V CC. Therefore, the V CC capacitor should be large enough to maintain a constant V CC during power up and transients. Otherwise, the supply voltage may collapse reaching the controller undervoltage lockout threshold.INTERNAL REFERENCEThe internal 0.8 V reference facilitates the implementation of sub 1 V supplies required in modern computing equipment. The internal reference is trimmed during manufacturing to obtain better than ±2% accuracy over the complete operating range.The output voltage, V out, is programmed using a resistor divider (R1 and R2) as shown in Figure 1.The resistor divider senses the output voltage and compares it to the internal 0.8 V reference.Equation 1 relates the output voltage to the internal reference voltage and external resistors R1 and R2.V out+V REF@ǒR1)R2R2Ǔ(eq. 1)ERROR AMPLIFIERThe NCP102 has a wide bandwidth error amplifier. It allows the user to implement a wide bandwidth feedback loop resulting in better transient response and lower system cost. It requires the user to compensate the system. A narrow bandwidth error amplifier usually does not require external compensation but it requires more output capacitance to meet typical transient requirements.The output of the error amplifier is available for frequency compensation. A capacitor (C COMP) can be placed between the DRV and FB pins. In most cases the resistor is not needed. The uncompensated error amplifier dominant pole is approximately 1.65 Hz. Any external capacitance between the DRV and FB pins reduces the dominant pole frequency due to the Miller multiplication effect. Equation 2relates the dominant pole frequency to C COMP.fpole+6.7016@C COMPā*0.846(eq. 2)EXTERNAL ENABLEThe EN input allows the NCP102 to be remotely enabled. An internal 10 m A (typ.) current source pulls up the EN voltage. The EN pin is internally pulled to V CC or 9.5 V, whichever is lower.The controller is enabled once the EN pin voltage exceeds 0.8 V (typ.). The controller is disabled by pulling down on the EN pin. Figure 12 shows the relationship between enable and soft-start.Figure 12. Relationship Between Enable andSoft-StartVSOFT-SThe EN pin can be connected to V CC if the enable feature is not used. If connected to V CC and V CC is higher than 9.5 V a resistor in series should be used to limit the current into the EN pin as the pin is internally clamped to 9.5 V. A minimum of 40 k W is recommended.SOFT-STARTSoft-start reduces inrush current and overshoot of the output voltage. The adjustable soft-start built into the NCP102 allows the user to select the optimum soft-start time for the application. The soft-start time is set with a capacitor from the SOFT-S pin to ground.Soft-start is achieved by controlling the slope of the DRV voltage based on the slope of the soft-start capacitor voltage,C SOFT-S. The capacitor is charged to V CC with a constant4.5 m A (typ.) current source, I SOFT-S. This results in a linear charge of the soft-start capacitor and thus the output voltage. The soft-start period, t SOFT-S, ends once the capacitor voltage reaches 0.8 V (typ). The soft-start capacitor is calculated using Equation 3.tSOFT*S +ǒc SOFT*S@0.8ISOFT*SǓ(eq. 3)The soft-start capacitor is internally pulled to GND when V CC is not within its operating range or the controller is disabled using the EN pin.POWER SEQUENCINGPower sequencing can be easily implemented using the SOFT-S and EN pins. This is achieved by directly connecting the SOFT-S pin of the master controller to the EN pin of the slave controller. If V CC is above 9.5 V a resistor divider is required to limit the voltage on the EN pin because the pin is internally clamped to 9.5 V. Figure 13 shows the timing waveforms of the master and slave controllers.Figure 13. Power-up Sequencing WaveformsV out (slave)Soft-Start (slave)Soft-Start (master)V out (master)Power sequencing will affect the soft-start time calculated using Equation 3 because the soft-start capacitor charge current is now increased by the enable charge current. The soft-start time is calculated using Equation 3 by replacing I SOFT-S with the sum of I EN and I SOFT-S. APPLICATION INFORMATIONON Semiconductor provides an electronic design tool, a demonstration board and an application note to facilitate design using the NCP102 and to reduce development cycle time. All the tools can be downloaded at . The electronic design tool allows the user to easily determine most of the system parameters of a linear regulator. The tool also evaluates the frequency response of the system. The demonstration board is designed to generate a 1.2ĂV/3 A voltage supply from a 1.8 V supply. The circuit schematic is shown in Figure 14 and the regulator design is described in Application Note AND8303.V Figure 14. Circuit SchematicPACKAGE DIMENSIONSTSOP-6CASE 318G-02ISSUE MDIM MIN MAX MIN MAX INCHESMILLIMETERS A 0.11420.12202.90 3.10B 0.05120.06691.30 1.70C 0.03540.04330.90 1.10D 0.00980.01970.250.50G 0.03350.04130.85 1.05H 0.00050.00400.0130.100J 0.00400.01020.100.26K 0.00790.02360.200.60L 0.04930.06101.25 1.55M 0 10 0 10 S 0.09850.11812.503.00____NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.4.DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.*For additional information on our Pb-Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATIONThe products described herein (NCP102), may be covered by one or more of the following U.S. patents: 7,307,476. There may be other patents pending.NCP102SNT1G.NCP102MBGEVB。

RTU002P02T106中文资料

Absolute maximum ratings (Ta=25°C)
Parameter Drain-source voltage Gate-source voltage Drain current
Total power dissipation Channel temperature Range of storage temperature
Appendix1-Rev1.1
∗1 Pw≤10µs, Duty cycle≤1% ∗2 Each terminal mounted on a recommended land
Continuous Pulsed
Symbol VDSS VGSS ID IDP ∗1 PD ∗2 Tch Tstg
Limits −20 ±12 ±0.25 ±0.5 0.2 150 −55 to +150
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design.

电源类资料03-电阻类资料汇编

1、常用贴片电阻功率、电压、电流及温度系数常用贴片电阻功率、电压、电流及温度系数厚膜贴片电阻:型号尺寸额定功率（W ）最工作电压(V) 最高过载电压(V)阻值组织范围精度温度系数（ppm/℃）零欧姆跳线电流(A)0402 1/32 2550 10～1M 1 0603 1/16 50 100 1 0805 1/10 150 300 2 1206 1/8 200 400 2 1210 1/4 200 400 1～10M2 2010 1/2 200400 10～10M2 FCR 通用品2512 1 200 400 0～2.2M±1%±5%±100 ±20020603 1/16 501000805 1/10 150 300FPR 高精度品 1206 1/8 200400100～100K±0.1%±0.25%±0.5%±50——1206 1/4 80016002010 1/2 1500 3000FVR 高压品 2512 1 2000 4000100K～1M±5%±200 ——温度系数：P(或C):±50、D: ±100、L: ± 200、M:±300、无标示:其他。

精度：B: ±0.1%、C: ±0.25%、D: ±0.5、F: ±1%、J: ±5、K:±10、M: ±20%、0:跳线。

零欧姆跳线电阻值：50M ωmax使用温度范围－55℃～＋125℃，额定温度＋70℃功率衰减曲线：当使用环境温度70℃以上时，额定功率将如上图之曲线衰减注：上述资料摘自珠海汇理源电子科技有限公司产品目录。

2、精度为1％的金属膜电阻的标称值精度为1％的金属膜电阻，以欧姆为单位的标称值10 33 100 332 1K 3.32K 10.5K 34K 107K 357K10.2 33.2 102 340 1.02K 3.4K 10.7K 34.8K 110K 360K10.5 34 105 348 1.05K 3.48K 11K 35.7K 113K 365K10.7 34.8 107 350 1.07K 3.57K 11.3K 36K 115K 374K11 35.7 110 357 1.1K 3.6K 11.5K 36.5K 118K 383K11.3 36 113 360 1.13K 3.65K 11.8K 37.4K 120K 390K11.5 36.5 115 365 1.15K 3.74K 12K 38.3K 121K 392K11.8 37.4 118 374 1.18K 3.83K 12.1K 39K 124K 402K12 38.3 120 383 1.2K 3.9K 12.4K 39.2K 127K 412K12.1 39 121 390 1.21K 3.92K 12.7K 40.2K 130K 422K12.4 39.2 124 392 1.24K 4.02K 13K 41.2K 133K 430K12.7 40.2 127 402 1.27K 4.12K 13.3K 42.2K 137K 432K13 41.2 130 412 1.3K 4.22K 13.7K 43K 140K 442K13.3 42.2 133 422 1.33K 4.32K 14K 43.2K 143K 453K13.7 43 137 430 1.37K 4.42K 14.3K 44.2K 147K 464K14 43.2 140 432 1.4K 4.53K 14.7K 45.3K 150K 470K14.3 44.2 143 442 1.43K 4.64K 15K 46.4K 154K 475K14.7 45.3 147 453 1.47K 4.7K 15.4K 47K 158K 487K15 46.4 150 464 1.5K 4.75K 15.8K 47.5K 160K 499K15.4 47 154 470 1.54K 4.87K 16K 48.7K 162K 511K15.8 47.5 158 475 1.58K 4.99K 16.2K 49.9K 165K 523K16 48.7 160 487 1.6K 5.1K 16.5K 51K 169K 536K16.2 49.9 162 499 1.62K 5.11K 16.9K 51.1K 174K 549K16.5 51 165 510 1.65K 5.23K 17.4K 52.3K 178K 560K16.9 51.1 169 511 1.69K 5.36K 17.8K 53.6K 180K 562K17.4 52.3 174 523 1.74K 5.49K 18K 54.9K 182K 576K17.8 53.6 178 536 1.78K 5.6K 18.2K 56K 187K 590K18 54.9 180 549 1.8K 5.62K 18.7K 56.2K 191K 604K18.2 56 182 560 1.82K 5.76K 19.1K 57.6K 196K 619K18.7 56.2 187 562 1.87K 5.9K 19.6K 59K 200K 620K19.1 57.6 191 565 1.91K 6.04K 20K 60.4K 205K 634K19.6 59 196 578 1.96K 6.19K 20.5K 61.9K 210K 649K20 60.4 200 590 2K 6.2K 21K 62K 215K 665K20.5 61.9 205 604 2.05K 6.34K 21.5K 63.4K 220K 680K21 62 210 619 2.1K 6.49K 22K 64.9K 221K 681K21.5 63.4 215 620 2.15K 6.65K 22.1K 66.5K 226K 698K22 64.9 220 634 2.2K 6.8K 22.6K 68K 232K 715K22.1 66.5 221 649 2.21K 6.81K 23.2K 68.1K 237K 732K22.6 68 226 665 2.26K 6.98K 23.7K 69.8K 240K 750K23.2 68.1 232 680 2.32K 7.15K 24K 71.5K 243K 768K23.7 69.8 237 681 2.37 7.32K 24.3K 73.2K 249K 787K24 71.5 240 698 2.4K 7.5K 24.9K 75K 255K 806K24.3 73.2 243 715 2.43K 7.68K 25.5K 76.8K 261K 820K24.7 75 249 732 2.49K 7.87K 26.1K 78.7K 267K 825K24.9 75.5 255 750 2.55K 8.06K 26.7K 80.6K 270K 845K25.5 76.8 261 768 2.61K 8.2K 27K 82K 274K 866K26.1 78.7 267 787 2.67K 8.25K 27.4K 82.5K 280K 887K26.7 80.6 270 806 2.7K 8.45K 28K 84.5K 287K 909K27 82 274 820 2.74K 8.66K 28.7K 86.6K 294K 910K27.4 82.5 280 825 2.8K 8.8K 29.4K 88.7K 300K 931K28 84.5 287 845 2.87K 8.87K 30K 90.9K 301K 953K28.7 86.6 294 866 2.94K 9.09K 30.1K 91K 309K 976K29.4 88.7 300 887 3.0K 9.1K 30.9K 93.1K 316K 1.0M30 90.9 301 909 3.01K 9.31K 31.6K 95.3K 324K 1.5M30.1 91 309 910 3.09K 9.53K 32.4K 97.6K 330K 2.2M30.9 93.1 316 931 3.16K 9.76K 33K 100K 332K31.6 95.3 324 953 3.24K 10K 33.2K 102K 340K32.4 97.6 330 976 3.3K 10.2K 33.6K 105K 348K色环电阻精度标示：棕:±1%、红:±2、绿: ±0.5%、蓝: ±0.2%、紫:±0.1%、白:+5~-20%、无色:20%、银:±10%、金:±5%。

MAX3292中文资料

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
0.2
V
VOC
Figure 1, R = 27Ω
VCC / 2
3
V
∆VOC
Figure 1, R = 27Ω (Note 5)
元器件交易网
RS-485/RS-422 Transceivers with Preemphasis for High-Speed, Long-Distance Communication MAX3291/MAX3292
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC, VCCD) .................................................+6V Control Input Voltage (RE, DE, PEE, PSET, DI) .................................................-0.3V to (VCC + 0.3V) Driver Output Voltage (Y, Z) ................................-7.5V to +12.5V Receiver Input Voltage (A, B)..............................-7.5V to +12.5V Receiver Output Voltage (RO)....................-0.3V to (VCC + 0.3V) Continuous Power Dissipation (TA = +70°C) 14-Pin SO (derate 8.7mW/°C above +70°C).................695mW 14-Pin Plastic DIP (derate 10.0mW/°C above +70°C) ..800mW Operating Temperature Ranges MAX329_C_ D......................................................0°C to +70°C MAX329_E_ D ...................................................-40°C to +85°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10sec) .............................+300°C

BY329-1000中文资料

Philips Semiconductors Product specificationRectifier diodes BY329 seriesfast, soft-recoveryFEATURESSYMBOL QUICK REFERENCE DATA• Low forward volt drop • Fast switching• Soft recovery characteristic• High thermal cycling performance • Low thermal resistanceGENERAL DESCRIPTIONPINNINGSOD59 (TO220AC)Glass-passivated double diffused PIN DESCRIPTION rectifier diodes featuring low forward voltage drop,fast reverse 1cathode recovery and soft recovery characteristic.The devices are 2anode intended for use in TV receivers,monitors and switched mode power tabcathodesupplies.The BY329series is supplied in the conventional leaded SOD59(TO220AC)package.LIMITING VALUESLimiting values in accordance with the Absolute Maximum System (IEC 134).SYMBOL PARAMETERCONDITIONSMIN.MAX.UNIT BY329-800-1000-1200V RSM Peak non-repetitive reverse -80010001200V voltageV RRM Peak repetitive reverse voltage -80010001200V V RWM Crest working reverse voltage -6008001000V I F(AV)Average forward current 1square wave; δ = 0.5;-8A T mb ≤ 122 ˚Csinusoidal; a = 1.57;-7A T mb ≤ 125 ˚CI F(RMS)RMS forward current-11A I FRM Repetitive peak forward current t = 25 µs; δ = 0.5;-16A T mb ≤ 122 ˚CI FSMNon-repetitive peak forward t = 10 ms -75A current.t = 8.3 ms-82Asinusoidal; T j = 150 ˚C prior to surge; with reapplied V RWM(max)I 2t I 2t for fusing t = 10 ms -28A 2s T stg Storage temperature-40150˚C T jOperating junction temperature-150˚C1tab21 Neglecting switching and reverse current losses.Philips Semiconductors Product specificationRectifier diodes BY329 seriesfast, soft-recoveryTHERMAL RESISTANCESSYMBOL PARAMETERCONDITIONSMIN.TYP.MAX.UNIT R th j-mb Thermal resistance junction to -- 2.0K/W mounting baseR th j-aThermal resistance junction to in free air.-60-K/WambientSTATIC CHARACTERISTICST j = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNIT V F Forward voltage I F = 20 A- 1.5 1.85V I RReverse currentV R = V RWM ; T j = 125 ˚C-0.11.0mADYNAMIC CHARACTERISTICST j = 25 ˚C unless otherwise stated SYMBOL PARAMETERCONDITIONSMIN.TYP.MAX.UNIT t rr Reverse recovery time I F = 1 A; V R > 30 V; -dI F /dt = 50 A/µs -100135ns Q sReverse recovery chargeI F = 2 A; V R > 30 V; -dI F /dt = 20 A/µs -0.50.7µC dI R /dtMaximum slope of the reverse I F = 2 A; -dI F /dt = 20 A/µs-5060A/µsrecovery currentPhilips Semiconductors Product specificationRectifier diodes BY329 seriesfast, soft-recoveryPhilips Semiconductors Product specificationRectifier diodes BY329 seriesfast, soft-recoveryPhilips Semiconductors Product specificationRectifier diodes BY329 seriesfast, soft-recoveryMECHANICAL DATANotes1. Refer to mounting instructions for TO220 envelopes.2. Epoxy meets UL94 V0 at 1/8".Philips Semiconductors Product specification Rectifier diodes BY329 series fast, soft-recoveryDEFINITIONSData sheet statusObjective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.Limiting valuesLimiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections ofthis specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application informationWhere application information is given, it is advisory and does not form part of the specification.© Philips Electronics N.V. 1998All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.。

Yokogawa CN32Pt、CN16Pt和CN8Pt系列温度、过程和拉伸控制器产品说明书

Temperature, Process and Strain ControllersIndustry Leading Performance...and Easy to UseCN32Pt, CN16Pt, andCN8Pt SeriesU H igh Performance, Extremely Versatile U E asy and Intuitive to Use U C omes with 2 to 6Programmable Control/Alarm/Retransmission Outputs: Choice of DC Pulse, Solid State Relays, Mechanical Relays, Analog Voltage and Current, Isolated Analog and DC Pulse U H igh Accuracy Inputs and Outputs U B right 3-Color (RED , GREEN , and AMBER ) 9 Segment LED, 4 or 6 Digit Display with Wide Viewing Angle U F ull Autotune PID with Fuzzy Logic Adaptive Control U U p to 99 Programs with 16 Ramps and Soaks Including Ramp/Soak EventsU R amp and Soak Program Chaining for Virtually Unlimited Program Flexibility U U niversal Inputs for Thermocouples, RTD’s, Thermistors, andProcess Voltage/Current, and Strain U N o Jumpers to Set, Totally Firmware Configurable U A utomated Configuration Recognition, “Smart” Menu Flow U U p to 20 Samples per Second with 24-Bit ADC U S tandard USB, Optional Ethernet and RS232/RS485 with MODBUS ® Serial Communications U B uilt-In ExcitationFirmware Selectable at 5V, 10V, 12V, and 24V U F ull Scale Positive and Negative Readings U N EMA 4 (IP65) Front Bezel (1⁄32 and 1⁄16 DIN) or NEMA 1 (1⁄8 DIN)CN16DPt Series shown actual 8EPt Series shown actual size.U A nalog Remote Setpoint for Cascaded Control U R emote Latch Reset, Remote Ramp and Soak StartCN32Pt Series shown actual size.The PLATINUM Series family of microprocessor-based PID controllers offer unparalleledflexibility in process measurement. While extremely powerful and versatile, great care has gone into designing a product that is very easy to set-up and use. The automatic hardware configuration recognition eliminates the need for jumpers and allows the firmware to automatically simplify itself, eliminating all menu options that do not apply to a specific configuration. Offered in 1⁄32, 1⁄16, and 1⁄8 DIN sizes, the 1⁄16 and 1⁄8 DIN models can be configured with dual displays. Models are available with single and dual 4 digit displays or single 6 digit display.Each unit allows the user to select the input type from 9thermocouple types (J, K, T, E,R, S, B, C, and N), Pt RTDs (100, 500, or 1000 Ω, with either 385, 392, or 3916 curve), thermistors (2250 Ω, 5K Ω, and 10K Ω), DC voltage, or DC current, and strain and bridge inputs. The voltage or current inputs are bipolar and fully scalable to virtually all engineering units, with a selectable decimal point that is perfect for use with pressure, flow, or other process input. Control can be achieved byusing the on/off or PID heat/cool control strategy. PID control canbe optimized with an auto-tune feature; and in addition, a fuzzy logic adaptive tuning mode allows the PID algorithm to be continuously optimized. The instrument offersup to 16 ramp and soak segments per ramp and soak program, with auxiliary event actions available with each segment. Up to 99 saved programs which can be chained to create up to 1584 discreet segments. Multiple alarms can be configured for above, below, hi/lo, and band triggering using either absolute or deviation alarm trigger points.The PLATINUM Series device features a large, three-color, programmable display withthe capability to change color and/or change the state of designated outputs every time an Alarm is triggered. Various configurations of mechanical relay, SSR, dc pulse, and analog voltage or current outputs are available. Up to 6 programmable outputs, including isolated and non-isolated, are best in class. Every unit comes standardwith USB communications for firmware updates, configuration management, and data transfer. Optional ethernet (1⁄16 DIN and 1⁄8 DIN models only) and RS232/ RS485 serial communications are also available. The Analog Output is fully scalable and may be configured as a proportional controller or as retransmission to follow your display. The universal power supply accepts 90 to 240 Vac. The low voltage power option accepts 24 Vac or 12 to 36 Vdc.Cascade ControlThe remote setpoint feature of the PLATINUM Series Controllers can be used in a variety of applications where setpoints can be sent to the controllers from remote devices such as manual pots, transmitters, computers, etc. This feature can also be used to set-up a “cascade control” system, where the remote setpoint input is generated by another controller. Figure 1 below shows a generic diagram of a cascade control system and Figure 2 shows a typical example, in this case a heat exchanger application. Cascade control schemes can provide tighter control of a process when you have two linked variables, one of which has a much slower (typically 4X or more) response than the other. The slower responding variable is used as the input to the primary or master controller, and the faster responding variable is used as the input to the secondary or slave controller. The output of the primary controller is scaled to be used as the setpoint for the secondary controller.For the heat exchanger application (shown in Figure 2) the primary goal of the application is to control the temperature of the effluent. Therefore the desired effluent temperature becomes the setpoint for the primary controller, which isa temperature controller (TC). The process input for the temperature controller is the measured temperature of the effluent (TT). The output of the temperature controller is the flow setpoint for the secondary controller, which is a flow controller (FC). The process input for the secondary (flow) controller is the flow rate of the steam that is used to heat the process flow through the heat exchanger (FT). The output of the secondary (flow) controller is a control signal for the proportional valve controlling the flow of the steam. By isolating the slowly changing effluent temperature control loop from the rapidly changing flow control loop, a more predictable, robust, and tighter control scheme results.Additional features usually found only on more expensive controllers make this the most powerful product in its class. Some of these additional standard features are: remote setpoint for cascaded control set-ups, high-high/low-low alarm functionality, external latch reset, external ramp and soak program initiation, combination heat/cool control mode, configuration save and transfer, and configuration password protection.Embedded Ethernet and Serial Communications Optional “embedded ethernet” on the 1⁄16 and 1⁄8 DIN models allow the units to connect directly to an Ethernet network and transmit data in standard TCP/IP packets, or serve Web pages over a LANor the Internet. Optional serial communications are also available configurable as RS232 or RS485, with straightforward ASCII commands or MODBUS®. All three types of communications interfaces (USB, Ethernet, and Serial) can be installed and active simultaneously.Ramp and Soak: Up to 99 saved ramp and soak programs, up to 8 ramp and 8 soak segments with individually selectable events per program, chainableRamp and Soak Segment Times: 00.00 to 99.59 (HH:MM) or 00.00 to 99.59 (MM:SS)OUTPUTSAnalog: Non-isolated, programmable for control or retransmission; voltage output 0 to 10V output; 500Ω min; accuracy 0.1%1; current output 0 to 20 mA output; 500Ω max; accuracy 0.1%1, 2; step response time 100 ms3DC Pulse: Non-Isolated; 10 Vdc at20 mASPST Relay: Single pole, single throw mechanical relay, 250 Vac or 30 Vdc at 3 A (resistive load)SPDT Relay: Single pole, double throw mechanical relay, 250 Vac or 30 Vdc at 3 A (resistive load)SSR: 20 to 265 Vac at 0.05 to 0.5 A (resistive load); continuousIsolated DC Pulse4: 1.5 kV isolation4;10 Vdc at 20 mAIsolated Analog4: 1.5 kV isolation4, programmable for control or retransmission; voltage output 0 to 10V output; 500Ω min; accuracy 0.1%1; current output 0 to 20 mA output; 500Ωmax; accuracy 0.1%1, 2; step response time 100 ms31 At 25°C.2 Output scaling required for stated accuracy; refer to platinum current output application note.3 Filter setting of 1.4 Isolated outputs not individually isolated. COMMUNICATIONS(USB Standard, Optional Serial and Ethernet) Connection:USB: Female micro-USB Ethernet: Standard RJ45Serial: Screw terminalsUSB: USB 2.0 host or device Ethernet Standards Compliance: IEEE 802.3 10/100 Base-T auto-switching, TCP/IP, ARP, HTTPGET Serial: Software selectable RS232or RS485; programmable 1200 to 115.2 K baudProtocols: OMEGA ASCII, MODBUS®ASCII/RTUISOLATIONApprovals: UL, cUL, CEPower to Input/Output: 2300 Vac per 1 min test; 1500 Vac per 1 min test (low voltage/power option)Power to Relays/SSR Outputs:2300 Vac per 1 min testRelays/SSR to Relay/SSR Outputs: 2300 Vac per 1 min testRS232/RS485 to Inputs/Outputs:500 Vac per 1 min test GENERALDisplay: 4-digit, 9-segment LEDCN32Pt, CN16Pt and CN16DPt: 10.2 mm (0.40")CN8Pt: 21 mm (0.83")C N8EPt(6-Digit Display):21 mm (0.83")CN8DPt (Dual Display): 21 mm (0.83") and 10.2 mm (0.40") Dimensions:CN8Pt Series:48 H x 96 W x 127 mm D(1.89 x 3.78 x 5")CN16Pt Series:48 H x 48 W x 127 mm D(1.89 x 1.89 x 5")CN32Pt Series:25.4 H x 48 W x 127 mm D(1.0 x 1.89 x 5")Panel Cutout:CN8Pt Series: 45 H x 92 mm W (1.772 x 3.622"), 1⁄8 DINCN16Pt Series: 45 mm (1.772")square, 1⁄16 DINCN32Pt Series: 22.5 H x 45 mm W (0.886 x 1.772"), 1⁄32 DIN Environmental Conditions:0 to 50°C (32 to 122°F), 90% RH non-condensingExternal Fuse Required:Time-Delay, UL 248-14 Listed: 100 mA/250 V; 400 mA/250 V (low voltage option)Time-Lag, IEC 127-3 Recognized: 100 mA/250 V; 400 mA/250 V (low voltage option)Line Voltage/Power: 90 to 240 Vac±10%, 50 to 400 Hz*, 110 to 375 Vdc, equivalent voltage*No CE compliance above 60 Hz.CN8Pt, CN16Pt, CN32Pt Models: 4 W powerCN8DPt, CN8EPt, CN16DPtM odels: 5 W powerLow Voltage/PowerOption: External power source must meet Safety Agency Approvals; units can be powered safely with 24 Vac power, but no certification for CE/UL is claimedCN8Pt, CN16Pt, CN32Pt Models: 12 to 36 Vdc, 3 W powerCN8DPt, CN8EPt, CN16DPtM odels: 20 to 36 Vdc, 4 W power Protection:CN32Pt, CN16Pt, CN16DPt Models: NEMA 4X (IP65) front bezelCN8Pt, CN8DPt, CN8EPt Models: NEMA 1 front bezelWeight:CN8Pt Models: 295 g (0.65 lb)CN16Pt Models: 159 g (0.35 lb) CN32Pt Models: 127 g (0.28 lb)S pecificationsINPUTSI nput Types: Thermocouple, RTD, thermistor, analog voltage, analog current, strainCurrent Input: 4 to 20 mA, 0 to24 mA scalableVoltage Input: -100 to 100 mV,-1 to 1 V, -10 to 10 Vdc scalable Thermocouple Input (ITS 90):K, J, T, E, R, S, B, C, NRTD Input (ITS 90): 100/500/1000 ΩPt sensor, 2-, 3- or 4-wire; 0.00385, 0.00392 (100 Ω only), or 0.003916 (100 Ω only) curvesThermistor Input: 2252 Ω, 5K Ω, 10K ΩStrain Input: ±50 mV, ±100 mV Configuration: Differential Polarity: BipolarResolution: 0.1° temperature;10 µV processInput Impedances:P rocess/Strain: 10M Ω for±100 mV, 1M Ω for other voltage rangesProcess Current: 5 ΩThermocouple: 10K Ω max Auxiliary Input (Remote Setpoint): 3.5K Ω for 0 to 10V, 50K Ω for0 to 1V, 50 Ω for current Temperature Stability:RTD: 0.04°C/°CThermocouple @ 25°C (77°F):0.05°C/°C (cold junction compensation) Process/Strain: 50 ppm/°CA/D Conversion: 24-bit sigma delta Reading Rate: 20 samples per second Digital Filter: Programmable from 0.05 seconds (filter = 1) to6.4 seconds (filter = 128)CMRR: 120 dBExcitation: Firmware selectable (no jumpers to set) to 5, 10, 12,and 24 Vdc @ 25 mASetpoint Adjustment: 4 digit (-9999 to +9999 counts, 6 digit (-99999 to+999999 counts)Warm-Up to Rated Accuracy: 30 mins CONTROL MODESAction: Reverse (heat), direct (cool), or heat/coolAuto-Tune: Operator initiated from front panelAdaptive Tune: User selectable; fuzzy logic continuous PID tuning optimizationControl Modes: ON/OFF or the following time/amplitude proportional control modes; selectable manual or auto PID, proportional, proportional with integral, proportional with derivativeCycle Time: 0.1 to 199 secondsRanges and Accuracies for Supported InputsNote: All available CN32Pt output combinations shown, but only representative CN16Pt and CN8Pt combinations shown.Ordering Examples: CN32Pt-330-DC, 1⁄32 DIN temperature/process controller with two single pole double throw relays and 12 to 36 Vdc power supply. CN16DPt-145-EIP, 1⁄16 DIN dual display temperature/process controller with a single pole/single throw relay, DC pulse output, analog ouput, and embedded ethernet web server. CN8Pt-144-006, 1⁄8 DIN temperature/process controller with single pole/single throw relay, two DC pulse outputs, and one isolated analog output.Note: Not every option is available on 1⁄16 and 1⁄31 DIN models.。

BY329X中文资料

Rectifier diodes BY329X seriesfast, soft-recoveryGENERAL DESCRIPTIONQUICK REFERENCE DATAGlass-passivated double diffused SYMBOL PARAMETERMAX.MAX.MAX.UNIT rectifier diodes in a full pack plastic envelope featuring low forward BY329X-800-1000-1200voltage drop,fast reverse recovery V RRM Repetitive peak reverse 80010001200V and soft recovery characteristic.The voltagedevices are intended for use in TV I F(AV)Average forward current 888A receivers,monitors and switched I FSM Non-repetitive peak 656565A mode power supplies.forward currentt rrReverse recovery time145145145nsPINNING - SOD113PIN CONFIGURATIONSYMBOLLIMITING VALUESLimiting values in accordance with the Absolute Maximum System (IEC 134).SYMBOL PARAMETERCONDITIONSMIN.MAX.UNIT -800-1000-1200V RSM Non-repetitive peak reverse -80010001200V voltageV RRM Repetitive peak reverse voltage -80010001200V V RWM Crest working reverse voltage -6008001000V I F(AV)Average forward current 1square wave; δ = 0.5;-8A T hs ≤ 83 ˚Csinusoidal; a = 1.57;-7A T hs ≤ 90 ˚C I F(RMS)RMS forward current-11A I FRM Repetitive peak forward current t = 25 µs; δ = 0.5;-16A T hs ≤ 83 ˚CI FSMNon-repetitive peak forward t = 10 ms -65A current.t = 8.3 ms-71Asinusoidal; T j = 150 ˚C prior to surge; with reapplied V RWM(max)I 2t I 2t for fusing t = 10 ms -28A 2s T stg Storage temperature-40150˚C T jOperating junction temperature-150˚C1 Neglecting switching and reverse current losses.ISOLATION LIMITING VALUE & CHARACTERISTICT hs = 25 ˚C unless otherwise specified SYMBOL PARAMETERCONDITIONSMIN.TYP.MAX.UNIT V isol R.M.S. isolation voltage from f = 50-60 Hz; sinusoidal -2500V both terminals to external waveform;heatsinkR.H. ≤ 65% ; clean and dustfreeC isolCapacitance from both terminals f = 1 MHz -10-pFto external heatsinkTHERMAL RESISTANCESSYMBOL PARAMETERCONDITIONSMIN.TYP.MAX.UNIT R th j-hs Thermal resistance junction to with heatsink compound -- 4.8K/W heatsinkwithout heatsink compound -- 5.9K/W R th j-aThermal resistance junction to in free air.-55-K/WambientSTATIC CHARACTERISTICST j = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNIT V F Forward voltage I F = 20 A- 1.5 1.85V I RReverse currentV R = V RWM ; T j = 125 ˚C-0.11.0mADYNAMIC CHARACTERISTICST j = 25 ˚C unless otherwise stated SYMBOL PARAMETERCONDITIONSMIN.TYP.MAX.UNIT t rr Reverse recovery time I F = 1 A; V R > 30 V; -dI F /dt = 50 A/µs -125145ns Q sReverse recovery chargeI F = 2 A; V R > 30 V; -dI F /dt = 20 A/µs -0.50.7µC dI R /dtMaximum slope of the reverse I F = 2 A; -dI F /dt = 20 A/µs-5060A/µsrecovery currentMECHANICAL DATANotes1. Refer to mounting instructions for F-pack envelopes.2. Epoxy meets UL94 V0 at 1/8".DEFINITIONSData sheet statusObjective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.Limiting valuesLimiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application informationWhere application information is given, it is advisory and does not form part of the specification.© Philips Electronics N.V. 1996All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.。

BY329-1500S,127;中文规格书,Datasheet资料

Philips Semiconductors Product specificationDamper diode BY329-1500, BY329-1500Sfast, high-voltageFEATURESSYMBOL QUICK REFERENCE DATA• Low forward volt drop • Fast switching• Soft recovery characteristic• High thermal cycling performance • Low thermal resistanceGENERAL DESCRIPTIONPINNINGSOD59 (TO220AC)Glass-passivated double diffused PIN DESCRIPTION rectifier diode featuring low forward voltage drop,fast reverse recovery 1cathode and soft recovery characteristic.The device is intended for use in TV 2anode receivers and PC monitors.tabcathodeThe BY329series is supplied in the conventional leaded SOD59(TO220AC)package.LIMITING VALUESLimiting values accordance with the Absolute Maximum System (IEC 134).SYMBOL PARAMETER CONDITIONSMIN.MAX.UNIT V RSM Peak non-repetitive peak -1500V reverse voltageV RRM Peak repetitive reverse -1500V voltageV RWM Crest working reverse voltage -1300V BY329-1500-1500S I F(peak)Peak working forward current f = 16 kHz -6-A f = 70 kHz --6A I FRM Peak repetitive forward t = 25 µs; δ = 0.5;-14A currentT mb ≤ 123 ˚CI F(RMS)RMS forward current-11A I FSM Peak non-repetitive forward t = 10 ms-75A currentsinusoidal; T j = 150 ˚C prior to surge; with reapplied V RWM(max)T stg Storage temperature -40150˚C T jOperating junction -150˚CtemperatureTHERMAL RESISTANCESSYMBOL PARAMETER CONDITIONSMIN.TYP.MAX.UNIT R th j-mb Thermal resistance junction to -- 2.0K/W mounting baseR th j-aThermal resistance junction to in free air -60-K/Wambient1tab2Philips Semiconductors Product specificationDamper diode BY329-1500, BY329-1500Sfast, high-voltageSTATIC CHARACTERISTICST j = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONSTYP.MAX.UNIT BY32915001500S 15001500SV F Forward voltage I F = 6.5 A1.1 1.3 1.45 1.6V I F = 6.5 A; T j = 125 ˚C 1.05 1.2 1.35 1.5V I RReverse currentV R = 1300 V-250-250µA V R = 1300 V; T j = 125 ˚C-1-1mADYNAMIC CHARACTERISTICST j = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONSTYP.MAX.UNITBY32915001500S15001500S t rr Reverse recovery time I F = 1 A; V R ≥ 30 V;0.180.130.230.16µs dI F /dt = 50A/µsQ s Reverse recovery chargeI F = 2 A; -dI F /dt = 20 A/µs 1.60.7 2.00.95µC V fr Peak forward recovery voltage I F = 6.5A; dI F /dt = 50A/µs 17233040V t frForward recovery timeI F = 6.5A; dI F /dt = 50A/µs210220300320nsPhilips Semiconductors Product specificationDamper diode BY329-1500, BY329-1500Sfast, high-voltagePhilips Semiconductors Product specificationDamper diode BY329-1500, BY329-1500Sfast, high-voltageMECHANICAL DATANotes1. Refer to mounting instructions for TO220 envelopes.2. Epoxy meets UL94 V0 at 1/8".Philips Semiconductors Product specification Damper diode BY329-1500, BY329-1500S fast, high-voltageDEFINITIONSData sheet statusObjective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.Limiting valuesLimiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections ofthis specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application informationWhere application information is given, it is advisory and does not form part of the specification.© Philips Electronics N.V. 1998All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.分销商库存信息: NXPBY329-1500S,127。

MBM29F160TE-70PFTN中文资料

DS05-20879-2EFUJITSU SEMICONDUCTORDATA SHEETFLASH MEMORYCMOS16M (2M × 8/1M × 16) BITMBM29F160TE/BE -55/-70/-90s GENERAL DESCRIPTIONThe MBM29F160TE/BE is a 16M-bit, 5.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29F160TE/BE is offered in a 48-pin TSOP (I) package. The device is designed to be programmed in-system with the standard system 5.0 V V CC supply. 12.0 V V PP is not required for write or erase operations. The device can also be reprogrammed in standard EPROM programmers.The standard MBM29F160TE/BE offers access times of 55 ns, 70 ns and 90 ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention the device has separate chip enable (CE), write enable (WE), and output enable (OE) controls.The MBM29F160TE/BE is pin and command set compatible with JEDEC standard E 2PROMs. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from 12.0 V Flash or EPROM devices.(Continued)s PRODUCT LINE UPMBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90(Continued)The MBM29F160TE/BE is programmed by executing the program command sequence. This will invoke the Embedded Program TM* Algorithm which is an internal algorithm that automatically times the program pulse widths and verifies proper cell margins. Typically, each sector can be programmed and verified in about 0.5 seconds. Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase TM* Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margins.Any individual sector is typically erased and verified in 1.0 second. (If already preprogrammed.)The device also features a sector erase architecture. The sector mode allows each sector to be erased and reprogrammed without affecting other sectors. The MBM29F160TE/BE is erased when shipped from the factory.The device features single 5.0 V power supply operation for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. A low V CC detector automatically inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7, by the Toggle Bit feature on DQ6, or the RY/BY output pin. Once the end of a program or erase cycle has been comleted, the device internally resets to the read mode.The MBM29F160TE/BE also has a hardware RESET pin. When this pin is driven low, execution of any Embedded Program Algorithm or Embedded Erase Algorithm is terminated. The internal state machine is then reset to the read mode. The RESET pin may be tied to the system reset circuitry. Therefore, if a system reset occurs during the Embedded Program Algorithm or Embedded Erase Algorithm, the device is automatically reset to the read mode and will have erroneous data stored in the address locations being programmed or erased. These locations need re-writing after the Reset. Resetting the device enables the system’s microprocessor to read the boot-up firmware from the Flash memory.Fujitsu’s Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability, and cost effectiveness. The MBM29F160TE/BE memory electrically erases all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed one byte/word at a time using the EPROM programming mechanism of hot electron injection.* : Embedded Erase TM and Embedded Program TM are trademarks of Advanced Micro Devices, Inc.2MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90s FEATURES•0.23 µm Process Technology•Single 5.0 V read, program and eraseMinimizes system level power requirements•Compatible with JEDEC-standard commandsUses same software commands as E2PROMs•Compatible with JEDEC-standard world-wide pinouts48-pin TSOP (I) (Package suffix: TN-Normal Bend Type, TR-Reversed Bend Type)•Minimum 100,000 program/erase cycles•High performance55 ns maximum access time•Sector erase architectureOne 8K word, two 4K words, one 16K word, and thirty-one 32K words sectors in word modeOne 16K byte, two 8K bytes, one 32K byte, and thirty-one 64K bytes sectors in byte modeAny combination of sectors can be concurrently erased. Also supports full chip erase•Boot Code Sector ArchitectureT = Top sectorB = Bottom sector•Embedded Erase AlgorithmsAutomatically pre-programs and erases the chip or any sector•Embedded Program AlgorithmsAutomatically programs and verifies data at specified address•Data Polling and Toggle Bit feature for detection of program or erase cycle completion•Ready/Busy output (RY/BY)Hardware method for detection of program or erase cycle completion•Low V CC write inhibit ≤ 4.2 V•Erase Suspend/ResumeSuspends the erase operation to allow a read data and/or program in another sector within the same devic •Hardware RESET pinResets internal state machine to the read mode•Sector protectionHardware method disables any combination of sectors from program or erase operations•Temporary sector unprotectionTemporary sector unprotection via the RESET pin•In accordance with CFI (Common Flash Memory Interface)•WP Input pin (Hardware Protect)At V IL, allows protection of boot sectors, regardless of sector protection/unprotection statusAt V IH, allows removal of boot sector protectionAt open, allows removal of boot sector protection (MBM29F160TE/BE)3MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90 s PIN ASSIGNMENT4MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90 s BLOCK DIAGRAM5MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90s FLEXIBLE SECTOR-ERASE ARCHITECTURE•One 8K word, two 4K words, one 16K word, and thirty-one 32K words sectors in word mode.•One 16K byte, two 8K bytes, one 32K byte, and thirty-one 64K bytes sectors in byte mode.•Individual-sector, multiple-sector, or bulk-erase capability.•Individual or multiple-sector protection is user definable.Sector Sector Size(× 8) Address Range(× 16) Address Range SA064 Kbytes or 32 Kwords00000H to 0FFFFH00000H to 07FFFH SA164 Kbytes or 32 Kwords10000H to 1FFFFH08000H to 0FFFFH SA264 Kbytes or 32 Kwords20000H to 2FFFFH10000H to 17FFFH SA364 Kbytes or 32 Kwords30000H to 3FFFFH18000H to 1FFFFH SA464 Kbytes or 32 Kwords40000H to 4FFFFH20000H to 27FFFH SA564 Kbytes or 32 Kwords50000H to 5FFFFH28000H to 2FFFFH SA664 Kbytes or 32 Kwords60000H to 6FFFFH30000H to 37FFFH SA764 Kbytes or 32 Kwords70000H to 7FFFFH38000H to 3FFFFH SA864 Kbytes or 32 Kwords80000H to 8FFFFH40000H to 47FFFH SA964 Kbytes or 32 Kwords90000H to 9FFFFH48000H to 4FFFFH SA1064 Kbytes or 32 Kwords A0000H to AFFFFH50000H to 57FFFH SA1164 Kbytes or 32 Kwords B0000H to BFFFFH58000H to 5FFFFH SA1264 Kbytes or 32 Kwords C0000H to CFFFFH60000H to 67FFFH SA1364 Kbytes or 32 Kwords D0000H to DFFFFH68000H to 6FFFFH SA1464 Kbytes or 32 Kwords E0000H to EFFFFH70000H to 77FFFH SA1564 Kbytes or 32 Kwords F0000H to FFFFFH78000H to 7FFFFH SA1664 Kbytes or 32 Kwords100000H to 10FFFFH80000H to 87FFFH SA1764 Kbytes or 32 Kwords110000H to 11FFFFH88000H to 8FFFFH SA1864 Kbytes or 32 Kwords120000H to 12FFFFH90000H to 97FFFH SA1964 Kbytes or 32 Kwords130000H to 13FFFFH98000H to 9FFFFH SA2064 Kbytes or 32 Kwords140000H to 14FFFFH A0000H to A7FFFH SA2164 Kbytes or 32 Kwords150000H to 15FFFFH A8000H to AFFFFH SA2264 Kbytes or 32 Kwords160000H to 16FFFFH B0000H to B7FFFH SA2364 Kbytes or 32 Kwords170000H to 17FFFFH B8000H to BFFFFH SA2464 Kbytes or 32 Kwords180000H to 18FFFFH C0000H to C7FFFH SA2564 Kbytes or 32 Kwords190000H to 19FFFFH C8000H to CFFFFH SA2664 Kbytes or 32 Kwords1A0000H to 1AFFFFH D0000H to D7FFFH SA2764 Kbytes or 32 Kwords1B0000H to 1BFFFFH D8000H to DFFFFH SA2864 Kbytes or 32 Kwords1C0000H to 1CFFFFH E0000H to E7FFFH SA2964 Kbytes or 32 Kwords1D0000H to 1DFFFFH E8000H to EFFFFH SA3064 Kbytes or 32 Kwords1E0000H to 1EFFFFH F0000H to F7FFFH SA3132 Kbytes or 16 Kwords1F0000H to 1F7FFFH F8000H to FBFFFH SA328 Kbytes or 4 Kwords1F8000H to 1F9FFFH FC000H to FCFFFH SA338 Kbytes or 4 Kwords1FA000H to 1FBFFFH FD000H to FDFFFH SA3416 Kbytes or 8 Kwords1FC000H to 1FFFFFH FE000H to FFFFFHMBM29F160TE Top Boot Sector Architecture6MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90Sector Sector Size(× 8) Address Range(× 16) Address RangeSA016 Kbytes or 8 Kwords00000H to 03FFFH00000H to 01FFFHSA18 Kbytes or 4 Kwords04000H to 05FFFH02000H to 02FFFHSA28 Kbytes or 4 Kwords06000H to 07FFFH03000H to 03FFFHSA332 Kbytes or 16 Kwords08000H to 0FFFFH04000H to 07FFFHSA464 Kbytes or 32 Kwords10000H to 1FFFFH08000H to 0FFFFHSA564 Kbytes or 32 Kwords20000H to 2FFFFH10000H to 17FFFHSA664 Kbytes or 32 Kwords30000H to 3FFFFH18000H to 1FFFFHSA764 Kbytes or 32 Kwords40000H to 4FFFFH20000H to 27FFFHSA864 Kbytes or 32 Kwords50000H to 5FFFFH28000H to 2FFFFHSA964 Kbytes or 32 Kwords60000H to 6FFFFH30000H to 37FFFHSA1064 Kbytes or 32 Kwords70000H to 7FFFFH38000H to 3FFFFHSA1164 Kbytes or 32 Kwords80000H to 8FFFFH40000H to 47FFFHSA1264 Kbytes or 32 Kwords90000H to 9FFFFH48000H to 4FFFFHSA1364 Kbytes or 32 Kwords A0000H to AFFFFH50000H to 57FFFHSA1464 Kbytes or 32 Kwords B0000H to BFFFFH58000H to 5FFFFHSA1564 Kbytes or 32 Kwords C0000H to CFFFFH60000H to 67FFFHSA1664 Kbytes or 32 Kwords D0000H to DFFFFH68000H to 6FFFFHSA1764 Kbytes or 32 Kwords E0000H to EFFFFH70000H to 77FFFHSA1864 Kbytes or 32 Kwords F0000H to FFFFFH78000H to 7FFFFHSA1964 Kbytes or 32 Kwords100000H to 10FFFFH80000H to 87FFFHSA2064 Kbytes or 32 Kwords110000H to 11FFFFH88000H to 8FFFFHSA2164 Kbytes or 32 Kwords120000H to 12FFFFH90000H to 97FFFHSA2264 Kbytes or 32 Kwords130000H to 13FFFFH98000H to 9FFFFHSA2364 Kbytes or 32 Kwords140000H to 14FFFFH A0000H to A7FFFHSA2464 Kbytes or 32 Kwords150000H to 15FFFFH A8000H to AFFFFHSA2564 Kbytes or 32 Kwords160000H to 16FFFFH B0000H to B7FFFHSA2664 Kbytes or 32 Kwords170000H to 17FFFFH B8000H to BFFFFHSA2764 Kbytes or 32 Kwords180000H to 18FFFFH C0000H to C7FFFHSA2864 Kbytes or 32 Kwords190000H to 19FFFFH C8000H to CFFFFHSA2964 Kbytes or 32 Kwords1A0000H to 1AFFFFH D0000H to D7FFFHSA3064 Kbytes or 32 Kwords1B0000H to 1BFFFFH D8000H to DFFFFHSA3164 Kbytes or 32 Kwords1C0000H to 1CFFFFH E0000H to E7FFFHSA3264 Kbytes or 32 Kwords1D0000H to 1DFFFFH E8000H to EFFFFHSA3364 Kbytes or 32 Kwords1E0000H to 1EFFFFH F0000H to F7FFFHSA3464 Kbytes or 32 Kwords1F0000H to 1FFFFFH F8000H to FFFFFHMBM29F160BE Bottom Boot Sector Architecture7MBM29F160TE -55/-70/-90/MBM29F160BE -55/-70/-908s LOGIC SYMBOLLTable 1 MBM29L V160TE/BE Pin Configuration PinFunctionA -1, A 0 to A 19Address Inputs DQ 0 to DQ 15Data Inputs/Outputs CE Chip Enable OE Output Enable WE Write Enable RY/BY Ready/Busy OutputRESET Hardware Reset Pin/T emporary Sector Unprotection BYTE Selects 8-bit or 16-bit mode N.C.Pin Not Connected Internally V SS Device GroundV CCDevice Power SupplyMBM29F160TE -55/-70/-90/MBM29F160BE -55/-70/-909s DEVICE BUS OPERATIONSLegend: L = V IL , H = V IH , X = V IL or V IH . = pulse input. See DC Characteristics for voltage levels.Notes:1.Manufacturer and device codes may also be accessed via a command register write sequence. SeeTable 7.2.Refer to the section on Sector Protection.3.WE can be V IL if OE is V IL , OE at V IH initiates the write operations.4.V CC =5.0 V ±10%Table 2 MBM29F160TE/BE User Bus Operation (BYTE = V IH )OperationCE OE WE A 0A 1A 6A 9DQ 0 to DQ 15RESET WP Auto-Select Manufacture Code (1)L L H L L L V ID Code H X Auto-Select Device Code (1)L L H H L L V ID Code H X Read (3)L L H A 0A 1A 6A 9D OUT H X Standby H X X X X X X HIGH-Z H X Output Disable L H H X X X X HIGH-Z H X Write (Program/Erase)L H LA 0A 1A 6A 9D IN H X Enable Sector Protection (2), (4)L V ID L H L V ID X H X Verify Sector Protection (2), (4)L L H L H L V ID Code H X Temporary Sector Unprotection X X X X X X X X V ID X Reset (Hardware)/Standby X X X X X X X HIGH-Z L X Boot Block Write ProtectionXXX XXXXXXLTable 3 MBM29F160TE/BE User Bus Operation (BYTE = V IL )OperationCE OE WE DQ 15/A -1A 0A 1A 6A 9DQ 0 to DQ 7RESET WP Auto-Select Manufacture Code (1)L L H L L L L V ID Code H X Auto-Select Device Code (1)L L H L H L L V ID Code H X Read (3)L L H A -1A 0A 1A 6A 9D OUT H X Standby H X X X X X X X HIGH-Z H X Output Disable L H H X X X X X HIGH-Z H X Write (Program/Erase)L H LA -1A 0A 1A 6A 9D IN H X Enable Sector Protection (2), (4)L V ID L L H L V ID X H X Verify Sector Protection (2), (4)L L H L L H L V ID Code H X Temporary Sector Unprotection X X X X X X X X X V ID X Reset (Hardware)/Standby X X X X X X X X HIGH-Z L X Boot Block Write ProtectionXXXXXXXXXXLMBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90s FUNCTIONAL DESCRIPTIONRead ModeThe MBM29F160TE/BE has two control functions which must be satisfied in order to obtain data at the outputs.CE is the power control and should be used for a device selection. OE is the output control and should be used to gate data to the output pins if a device is selected.Address access time (t ACC) is equal to the delay from stable addresses to valid output data. The chip enable access time (t CE) is the delay from stable addresses and stable CE to valid data at the output pins. The output enable access time is the delay from the falling edge of OE to valid data at the output pins. (Assuming the addresses have been stable for at least t ACC - t OE time.) When reading out a data without changing addresses after power-u, it is necessary to input hardware reset or change CE pin from "H" tp "L".Standby ModeThere are two ways to implement the standby mode on the MBM29F160TE/BE devices. One is by using both the CE and RESET pins; the other via the RESET pin only.When using both pins, a CMOS standby mode is achieved with CE and RESET inputs both held at V CC ±0.3 V.Under this condition the current consumed is less than 5 µA max. During Embedded Algorithm operation, V CC Active current (I CC2) is required even CE = “H”. The device can be read with standard access time (t CE) from either of these standby modes.When using the RESET pin only, a CMOS standby mode is achieved with the RESET input held at V SS ±0.3 V (CE = “H” or “L”). Under this condition the current consumed is less than 5 µA max. Once the RESET pin is taken high, the device requires t RH of wake up time before outputs are valid for read access.In the standby mode, the outputs are in the high-impedance state, independent of the OE input.Output DisableIf the OE input is at a logic high level (V IH), output from the device is disabled. This will cause the output pins to be in a high-impedance state.AutoselectThe Autoselect mode allows the reading out of a binary code from the device and will identify its manufacturer and type. The intent is to allow programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The Autoselect command may also be used to check the status of write-protected sectors. (See Tables 4.1 and 4.2.) This mode is functional over the entire temperature range of the device.To activate this mode, the programming equipment must force V ID (11.5 V to 12.5 V) on address pin A9. Two identifier bytes may then be sequenced from the devices outputs by toggling address A0 from V IL to V IH. All addresses are DON’T CARES except A0, A1, and A6 (A-1). (See Table 2 or Table 3.)The manufacturer and device codes may also be read via the command register, for instances when the MBM29F160TE/BE is erased or programmed in a system without access to high voltage on the A9 pin. The command sequence is illustrated in Table 6, Command Definitions.Byte 0 (A0 = V IL) represents the manufacture’s code (Fujitsu = 04H) and byte 1 (A0 = V IH) represents the device identifier code (MBM29F160TE = D2H and MBM29F160BE = D8H for x 8 mode; MBM29F160TE = 22D2H and MBM29F160BE = 22D8H for x 16 mode). These two bytes/words are given in the Table 4.1 and 4.2. All identifiers for manufactures and device will exhibit odd parity with DQ7 defined as the parity bit. In order to read the proper device codes when executing the Autoselect, A1 must be V IL. (See Tables 4.1 and 4.2.)10MBM29F160TE -55/-70/-90/MBM29F160BE -55/-70/-90*1:A -1 is for Byte mode.*2:Outputs 01H at protected sector addresses and outputs 00H at unprotected sector addresses.(B): Byte mode (W): Word modeTable 4.1 MBM29F160TE/BE Sector Protection Verify Autoselect Code TypeA 12 to A 19A 6A 1A 0A -1*1Code (HEX)Manufacture’s CodeXV IL V IL V IL V IL 04H Device CodeMBM29F160TEByte XV ILV ILV IHV IL D2H Word X 22D2H MBM29F160BEByte X V IL V IL V IH V IL D8H WordX 22D8H Sector Protection Sector AddressesV ILV IHV ILV IL01H*2Table 4.2 Expanded Autoselect Code TableTypeCode DQ 15DQ 14DQ 13DQ 12DQ 11DQ 10DQ 9DQ 8DQ 7DQ 6DQ 5DQ 4DQ 3DQ 2DQ 1DQ 0Manufacture’s Code04H A -1/0000000000000100Device CodeMBM29F160TE(B)D2H A -1HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 11010010(W)22D2H 01111010010MBM29F160BE(B)D8H A -1HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 11001000(W)22D8H010001011001000Sector Protection 01H A -1/01MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90Table 5 Sector Address Tables (MBM29F160TE)SectorAddress A19A18A17A16A15A14A13A12(× 8) Address Range(× 16) Address Range SA000000X X X00000H to 0FFFFH00000H to 07FFFH SA100001X X X10000H to 1FFFFH08000H to 0FFFFH SA200010X X X20000H to 2FFFFH10000H to 17FFFH SA300011X X X30000H to 3FFFFH18000H to 1FFFFH SA400100X X X40000H to 4FFFFH20000H to 27FFFH SA500101X X X50000H to 5FFFFH28000H to 2FFFFH SA600110X X X60000H to 6FFFFH30000H to 37FFFH SA700111X X X70000H to 7FFFFH38000H to 3FFFFH SA801000X X X80000H to 8FFFFH40000H to 47FFFH SA901001X X X90000H to 9FFFFH48000H to 4FFFFH SA1001010X X X A0000H to AFFFFH50000H to 57FFFH SA1101011X X X B0000H to BFFFFH58000H to 5FFFFH SA1201100X X X C0000H to CFFFFH60000H to 67FFFH SA1301101X X X D0000H to DFFFFH68000H to 6FFFFH SA1401110X X X E0000H to EFFFFH70000H to 77FFFH SA1501111X X X F0000H to FFFFFH78000H to 7FFFFH SA1610000X X X100000H to 10FFFFH80000H to 87FFFH SA1710001X X X110000H to 11FFFFH88000H to 8FFFFH SA1810010X X X120000H to 12FFFFH90000H to 97FFFH SA1910011X X X130000H to 13FFFFH98000H to 9FFFFH SA2010100X X X140000H to 14FFFFH A0000H to A7FFFH SA2110101X X X150000H to 15FFFFH A8000H to AFFFFH SA2210110X X X160000H to 16FFFFH B0000H to B7FFFH SA2310111X X X170000H to 17FFFFH B8000H to BFFFFH SA2411000X X X180000H to 18FFFFH C0000H to C7FFFH SA2511001X X X190000H to 19FFFFH C8000H to CFFFFH SA2611010X X X1A0000H to 1AFFFFH D0000H to D7FFFH SA2711011X X X1B0000H to 1BFFFFH D8000H to DFFFFH SA2811100X X X1C0000H to 1CFFFFH E0000H to E7FFFH SA2911101X X X1D0000H to 1DFFFFH E8000H to EFFFFH SA3011110X X X1E0000H to 1EFFFFH F0000H to F7FFFH SA31111110X X1F0000H to1F7FFFH F8000H to FBFFFH SA32111111001F8000H to1F9FFFH FC000H to FCFFFH SA33111111011FA000H to1FBFFFH FD000H to FDFFFHMBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90Table 6 Sector Address Tables (MBM29F160BE)SectorAddress A19A18A17A16A15A14A13A12(× 8) Address Range(× 16) Address Range SA00000000X00000H to 03FFFH00000H to 01FFFH SA10000001004000H to 05FFFH02000H to 02FFFH SA20000001106000H to 07FFFH03000H to 03FFFH SA30000010X08000H to 0FFFFH04000H to 07FFFH SA400001X X X10000H to 1FFFFH08000H to 0FFFFH SA500010X X X20000H to 2FFFFH10000H to 17FFFH SA600011X X X30000H to 3FFFFH18000H to 1FFFFH SA700100X X X40000H to 4FFFFH20000H to 27FFFH SA800101X X X50000H to 5FFFFH28000H to 2FFFFH SA900110X X X60000H to 6FFFFH30000H to 37FFFH SA1000111X X X70000H to 7FFFFH38000H to 3FFFFH SA1101000X X X80000H to 8FFFFH40000H to 47FFFH SA1201001X X X90000H to 9FFFFH48000H to 4FFFFH SA1301010X X X A0000H to AFFFFH50000H to 57FFFH SA1401011X X X B0000H to BFFFFH58000H to 5FFFFH SA1501100X X X C0000H to CFFFFH60000H to 67FFFH SA1601101X X X D0000H to DFFFFH68000H to 6FFFFH SA1701110X X X E0000H to EFFFFH70000H to 77FFFH SA1801111X X X F0000H to FFFFFH78000H to 7FFFFH SA1910000X X X100000H to 1FFFFFH80000H to 87FFFH SA2010001X X X110000H to 11FFFFH88000H to 8FFFFH SA2110010X X X120000H to 12FFFFH90000H to 97FFFH SA2210011X X X130000H to 13FFFFH98000H to 9FFFFH SA2310100X X X140000H to 14FFFFH A0000H to A7FFFH SA2410101X X X150000H to 15FFFFH A8000H to 8FFFFH SA2510110X X X160000H to 16FFFFH B0000H to B7FFFH SA2610111X X X170000H to 17FFFFH B8000H to BFFFFH SA2711000X X X180000H to 18FFFFH C0000H to C7FFFH SA2811001X X X190000H to 19FFFFH C8000H to CFFFFH SA2911010X X X1A0000H to 1AFFFFH D0000H to D7FFFH SA3011011X X X1B0000H to 1BFFFFH D8000H to DFFFFH SA3111100X X X1C0000H to 1CFFFFH E0000H to E7FFFH SA3211101X X X1D0000H to 1DFFFFH E8000H to EFFFFH SA3311110X X X1E0000H to 1EFFFFH F0000H to F7FFFHMBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90WriteDevice erasure and programming are accomplished via the command register. The command register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device.The command register itself does not occupy any addressable memory location. The register is latch used to store the commands, along with the address and data information needed to execute the command. The command register is written by bringing WE to V IL, while CE is at V IL and OE is at V IH. Addresses are latched on the falling edge of CE or WE, whichever occurs later, while data is latched on the rising edge of CE or WE pulse, whichever occurs first. Standard microprocessor write timings are used.Refer to AC Write Characteristics and the Erase/Programming Waveforms for specific timing parameters. Write Protect (WP)The write Protect function provides a hardware method of protecting certain boot sectors without using V ID.If the system asserts V IL on the WP pin, the device disables program and erase functions in the "outermost" 16K byte boot sectors independently of whether this sector was protected or unprotected using the method described in "Sector / Sector Block Protection and Unprotection". The outmost 16K byte boot sector is the sector containing the lowest addresses in a bottom-boot-configured devices, or the sector containing the highest addresses in a top-boot-configured device.If the system asserts V IH on the WP pin, the devices reverts to whether the outmost 16K byte boot sector was last set to be protected or unprotected. That is, sector protection or unprotection for this sector depends on whether it was last protected or unprotected using the method describe in "Sector / Sector Block Protection and Unprotection".Sector ProtectionThe MBM29F160TE/BE features hardware sector protection. This feature will disable both program and erase operations in any number of sectors (0 through 34). The sector protection feature is enabled using programming equipment at the user’s site. The device is shipped with all sectors unprotected.To activate this mode, the programming equipment must force V ID on address pin A9 and control pin OE, (suggest V ID = 11.5V), CE = V IL, and A6 = V IL. The sector addresses (A19, A18, A17, A16, A15, A14, A13, and A12) should be set to the sector to be protected. Tables 5 and 6 define the sector address for each of the thirty five (35) individual sectors. Programming of the protection circuitry begins on the falling edge of the WE pulse and is terminated with the rising edge of the same. Sector addresses must be held constant during the WE pulse. See figures 16 and 24 for sector protection waveforms and algorithm.To verify programming of the protection circuitry, the programming equipment must force V ID on address pin A9 with CE and OE at V IL and WE at V IH. Scanning the sector addresses (A19, A18, A17, A16, A15, A14, A13, and A12) while (A6, A1, A0) = (0, 1, 0) will produce a logical “1” code at device output DQ0 for a protected sector. Otherwise the devices will read 00H for unprotected sector. In this mode, the lower order addresses, except for A0, A1, and A6 are DON’T CARES. Address locations with A1 = V IL are reserved for Autoselect manufacturer and device codes. A-1 requires to apply to V IL in byte mode.It is also possible to determine if a sector is protected in the system by writing an Autoselect command. Performinga read operation at the address location XX02H, where the higher order addresses pins (A19, A18, A17, A16, A15,A14, A13, and A12) represents the sector address will produce a logical “1” at DQ0 for a protected sector. See Tables 4.1 and 4.2 for Autoselect codes.Temporary Sector UnprotectionThis feature allows temporary unprotection of previously protected sectors of the MBM29F160TE/BE devices in order to change data. The Sector Unprotection mode is activated by setting the RESET pin to high voltage(12 V). During this mode, formerly protected sectors can be programmed or erased by selecting the sectorMBM29F160TE -55/-70/-90/MBM29F160BE -55/-70/-90Notes:1.Address bits A 11 to A 19 = X = “H” or “L” for all address commands except or Program Address (PA) andSector Address (SA).2.Bus operations are defined in Tables 2 and3.3.RA =Address of the memory location to be read.PA =Address of the memory location to be programmed. Addresses are latched on the falling edge ofthe WE pulse.SA =Address of the sector to be erased. The combination of A 19, A 18, A 17, A 16, A 15, A 14, A 13, and A 12 willuniquely select any sector.4.RD =Data read from location RA during read operation.PD =Data to be programmed at location PA. Data is latched on the rising edge of WE.5.The system should generate the following address patterns:Word Mode: 555H or 2AAH to addresses A 0 to A 10Byte Mode: AAAH or 555H to addresses A -1 to A 106.Both Read/Reset commands are functionally equivalent, resetting the device to the read mode.Table 7 MBM29F160TE/BE Standard Command DefinitionsCommand Sequence (Notes 1, 2, 3, 5)Bus Write Cycles Req'dFirst Bus Write Cycle Second Bus Write Cycle Third Bus Write Cycle Fourth Bus Read/Write Cycle Fifth Bus Write Cycle Sixth Bus Write Cycle Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data Read/Reset (Note 6)Word/Byte 1XXXH F0H RA RD ————————Read/Reset (Note 6)Word 3555H AAH 2AAH 55H 555H F0H RA RD ————Byte AAAH 555H AAAH Autoselect Word 3555H AAH 2AAH 55H 555H 90H ——————Byte AAAH 555H AAAH Byte/Word Program (Notes 3, 4)Word 4555H AAH 2AAH 55H 555H A0H PA PD ————Byte AAAH 555H AAAH Chip EraseWord 6555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H 555H 10H Byte AAAH 555H AAAH AAAH 555H AAH Sector Erase (Note 3)Word 6555H AAH2AAH 55H555H 80H555H AAH2AAH 55HSA30HByte AAAH555HAAAHAAAH555HSector Erase Suspend Word /Byte 1Erase can be suspended during sector erase with addr. ("H" or "L"). Data (B0H)Sector Erase ResumeWord /Byte1Erase can be resumed after suspend with addr. ("H" or "L"). Data (30H)。

JMC129JNP-102资料

•Ÿ
Feature
•E •E •E
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High inductance variable shielded type. Can be used as DC-DC converter transformer. RoHS Compliance
Dimensions (mm)
0.7•0.1 Óƒ }
12.5•0.5 Óƒ }源自Please refer to the sales offices on our website for a representative near you
7.0•0.2 }
7.0•0.2 }
1/1
元器件交易网
IFT COILS < Pin Type: MC-129 Series>
15.5•0.5 }
1.0 + 3.5-0.5
7.0•0.2 }
MC-129J
0.7•0.1 Óƒ }
13.1•0.5 Óƒ }
MAX.19
1.0 + 3.5-0.5
7.0•0.2 }
•– MC-129JA •–
Dimension does not include solder used on coil. Pin pitch should be measured at the root of terminal.
Type: MC-129J, MC-129JA
•Ÿ
Connection (Bottom View)
MC-129J
‡B ‡A S ‡@ ‡E ‡C
MC-129JA
‡B S ‡A ‡C
‡D
S
S ‡@ ‡E
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TSOP32236资料

TSOP322..Document Number 82228Rev. 1.2, 31-Jan-05Vishay Semiconductors1IR Receiver Modules for Remote Control SystemsDescriptionThe TSOP322.. - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.The demodulated output signal can directly be decoded by a microprocessor. TSOP322.. is the stan-dard IR remote control receiver series for 3 V supply voltage, supporting all major transmission codes.Features•Photo detector and preamplifier in one package•Internal filter for PCM frequency•Improved shielding against electrical fielddisturbance•TTL and CMOS compatibility •Output active low•Supply voltage: 2.7 V to 5.5 V•Improved immunity against ambient lightMechanical DataPinning:1 = OUT,2 = V S ,3 = GNDParts TableBlock DiagramApplication CircuitPartCarrier Frequency TSOP3223030 kHz TSOP3223333 kHz TSOP3223636 kHz TSOP3223736.7 kHz TSOP3223838 kHz TSOP3224040 kHz TSOP3225656 kHz 2Document Number 82228Rev. 1.2, 31-Jan-05TSOP322..Vishay Semiconductors Absolute Maximum RatingsAbsolute Maximum RatingsT amb = 25°C, unless otherwise specifiedElectrical and Optical CharacteristicsT amb = 25°C, unless otherwise specifiedParameterTest conditionSymbol Value Unit Supply Voltage (Pin 2)V S - 0.3 to + 6.0V Supply Current (Pin 2)I S 3mA Output Voltage (Pin 1)V O - 0.3 to (V S + 0.3)V Output Current (Pin 1)I O 10mA Junction Temperature T j 100°C Storage T emperature Range T stg - 25 to + 85°C Operating Temperature Range T amb - 25 to + 85°C Power Consumption (T amb ≤ 85°C)P tot 30mW Soldering Temperaturet ≤ 10 s, 1 mm from case T sd260°CParameterTest conditionSymbol Min Typ.Max Unit Supply Current (Pin 2)E v = 0I SD 0.71.2 1.5mA E v = 40 klx, sunlightI SH 1.3mA Supply Voltage V S 2.75.5V Transmission DistanceE v = 0, test signal see fig.1,IR diode TSAL6200, IF = 250 mAd35mOutput Voltage Low (Pin 1)I OSL = 0.5 mA, E e = 0.7 mW/m 2,test signal see fig. 1V OSL 250mV Minimum Irradiance (30 - 40 kHz)V S = 3 VPulse width tolerance:t pi - 5/f o < t po < t pi + 6/f o ,test signal see fig.1E e min0.20.4mW/m 2Minimum Irradiance (56 kHz)V S = 3 VPulse width tolerance:t pi - 5/f o < t po < t pi + 6/f o ,test signal see fig.1E e min0.30.5mW/m 2Minimum Irradiance (30 - 40 kHz)V S = 5 VPulse width tolerance:t pi - 5/f o < t po < t pi + 6/f o ,test signal see fig.1E e min0.350.5mW/m 2Minimum Irradiance (56 kHz)V S = 5 VPulse width tolerance:t pi - 5/f o < t po < t pi + 6/f o ,test signal see fig.1E e min0.450.6mW/m 2Maximum Irradiance t pi - 5/f o < t po < t pi + 6/f o ,test signal see fig. 1E e max 30W/m 2DirectivityAngle of half transmission distance ϕ1/2± 45degTSOP322..Document Number 82228Rev. 1.2, 31-Jan-05Vishay Semiconductors3Typical Characteristics (Tamb = 25 °C unless otherwise specified)Figure 1. Output Function Figure 2. Pulse Length and Sensitivity in Dark Ambient Figure 3. Output Function E eV O V O V O )0.00.10.20.30.40.50.60.70.80.91.00.11.010.0100.01000.010000.0E e – Irradiance ( m W/m 2 )16908t– O u t p u t P u l s e W i dt h ( m s )p o E eV O V O V O LFigure 4. Output Pulse DiagramFigure 5. Frequency Dependence of ResponsivityFigure 6. Sensitivity in Bright AmbientT ,T – O u t p u t P u l s e W i d t h ( m s )0.00.10.20.30.40.50.60.70.80.91.00.11.010.0100.01000.010000.0E e – Irradiance ( m W/m 2 )16909o n o f f 0.70.91.11.3f/f 0 – R elati v e F re q uenc y169250.00.51.01.52.02.53.03.54.00.010.101.0010.00100.00E – Am bient DC Irradiance (W/m 2)16911E – T h r e s h o l d I r r a d i a n c e ( m W /m )em i n 2 4Document Number 82228Rev. 1.2, 31-Jan-05TSOP322..Vishay SemiconductorsFigure 7. Sensitivity vs. Supply Voltage Disturbances Figure 8. Sensitivity vs. Electric Field Disturbances Figure 9. Max. Envelope Duty Cycle vs. Burstlength0.11.010.0100.01000.0D V s RM S – AC Volta g e on DC Suppl y Volta g e (mV )16912E – T h r e s h o l d I r r a d i a n c e ( m W /m )0.00.40.81.21.60.00.40.81.22.0E –F ield Stren g t h o f Distur b ance ( kV /m )2.094 81471.6em i n 20.00.10.20.30.40.50.60.70.8020406080100120Burst L en g th ( num b er o f c y cles / b urst )16913M a x . E n v e l o p e D u t y C y c l eFigure 10. Sensitivity vs. Ambient TemperatureFigure 11. Relative Spectral Sensitivity vs. WavelengthFigure 12. Directivity–30–150153045607590T am b – Am b ient T emperature ( q C )16918E – T h r e s h o l d I r r a d i a n c e ( m W /m )em i n 275085095010501150λ-W a v elen g t h (nm )16919S ()-R e l a t i v e S p e c t r a l S e n s i t i v i t yλr e l 96 12223p20.40.200.20.40.60.60.90q 30q10q 20q40q50q 60q 70q 80q1.00.80.7d rel – Relative Transmission DistanceDocument Number 82228 Rev. 1.2, 5The circuit of the TSOP322.. is designed in that way that unexpected output pulses due to noise or distur-bance signals are avoided. A bandpass filter, an inte-grator stage and an automatic gain control are used to suppress such disturbances.The distinguishing mark between data signal and dis-turbance signal are carrier frequency, burst length and duty cycle.The data signal should fulfill the following conditions:• Carrier frequency should be close to center fre-quency of the bandpass (e.g. 38 kHz).• Burst length should be 10 cycles/burst or longer.• After each burst which is between 10 cycles and 70 cycles a gap time of at least 14 cycles is necessary.• For each burst which is longer than 1.8 ms a corre-sponding gap time is necessary at some time in the data stream. This gap time should be at least 4 times longer than the burst.• Up to 800 short bursts per second can be received continuously.Some examples for suitable data format are: NEC Code (repetitive pulse), NEC Code (repetitive data), Toshiba Micom Format, Sharp Code, RC5 Code, RC6 Code, R-2000 Code, Sony Code.When a disturbance signal is applied to the TSOP322.. it can still receive the data signal. How-ever the sensitivity is reduced to that level that no unexpected pulses will occur.Some examples for such disturbance signals which are suppressed by the TSOP322.. are:• DC light (e.g. from tungsten bulb or sunlight)Figure14. IR Signal from Fluorescent Lamp with low Modulation Figure15. IR Signal from Fluorescent Lamp with high Modulation 05101520Time ( ms )1692005101520Time ( ms )16921IRSignal 6Document Number 82228Rev. 1.2, 31-Jan-05TSOP322..Vishay Semiconductors Package Dimensions in mmTSOP322..Document Number 82228Rev. 1.2, 31-Jan-05Vishay Semiconductors7Ozone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution andoperatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personaldamage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyTelephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423Legal Disclaimer NoticeVishay Document Number: Revision: 08-Apr-051NoticeSpecifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.。