RMB6S中文资料
MB6S_datasheet
FEATURES
~
• Component in accordance to RoHS 2002/95/EC
• High surge current capability
~ • Meets MSL level 1, per J-STD-020, LF maximum
Device marking code 2 4 6
Maximum repetitive peak reverse voltage VRRM 200 400 600 V
current (Fig. 1)
Peak forward surge current 8.3 ms single half
IFSM 35 A
~ • Saves space on printed circuit boards
• Ideal for automated placement
~
• UL recognition, file number E54214
Notes:
(1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3 mm) pads
(2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20 mm) mounted on 0.05 x 0.05" (1.3 x 1.3 mm) solder pad
MAXIMUM RATINGS (T = 25 °C unless otherwise noted)
A
mb6s详细参数信息MB6S中文资料(精)
MB1S - MB8SMB1S-MB8S, Rev. Aã1999 Fairchild Semiconductor CorporationMB1S-MB8S, Rev. ATRADEMARKSACEx™CoolFET™CROSSVOLT™E 2CMOS TM FACT™FACT Quiet Series™FAST ®FASTr™GTO™HiSeC™The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:ISOPLANAR™MICROWIRE™POP™PowerTrench™QS™Quiet Series™SuperSOT™-3SuperSOT™-6SuperSOT™-8TinyLogic™1. Life support devices or systems are devices or systems which, (a are intended for surgical implant intothe body, or (b support or sustain life, or (c whosefailure to perform when properly used in accordancewith instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a lifesupport device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of TermsDatasheet Identification Product Status Definition Advance InformationPreliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.This datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.Formative or In DesignFirst ProductionFull ProductionNot In ProductionDISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.w w w . u n i t - i c .c o m。
贴片整流桥MB2S MB4S MB6S MB10S ASEMI 0.5A-0.8A 50V-1000V
MB05S thru MB10S0.5 A Single-Phase Glass Passivated Bridge RectifiersRectifier Reverse Voltage 50 to 1000VMaximum Ratings & Thermal CharacteristicsRating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.For Capacitive load derate current by 20%.Parameter Symbol unit Maximum repetitive peak reverse voltage Maximum RMS bridge input voltage Maximum DC blocking voltageMaximum average forward rectifiedoutput current at T A =40 C (*3) Peak forward surge current single sine-wave superimposed on rated load (JEDEC Method)Rating for fusing ( t<8.3ms)Typical thermal resistance per element (1)Typical junction capacitance per element (2) Operating junction and storage temperature rangeElectrical CharacteristicsRating at 25 C ambient temperature unless otherwise specified. Resistive or Inductive load, 60Hz.V RRM V RMS V DC I F(AV)I t 2I FSM R eJA T J ,T STG501002004008001000600357014028042056070050100200400600800100030110-55 to + 150V V V A A C /WA 2sec 0.525.0p FC j FeaturesMechanical DataThe plastic material used carries Underwriters Laboratory flammability recognition 94V-0 Surge overload ratings to 30 amperesHigh temperature soldering guaranteed 265 C/10seconds at 5 lbs (2.3kg) tensionCase: Molded plasticTerminals: Plated leads solderable per MIL-STD-202, Method 208Mounting Position: AnyWeight: 0.0044 ounce, 0.125 grams (approx)Ideal for surface mount applicationPolarity: Marked on body 10MB05S MB1S MB2S MB4S MB6S MB8S MB10S Notes: (1)Thermal resistance from Junction to Ambemt on P .C.board mounting. (2)Measured at 2.0MHz and applied reverse voltage of 4.0 volts. (3)R-load o n aluminum substrate TA=25 C.Dimensions in millimeters(1mm =0.0394")Component Index, file number E142814MINI-DIPC0.8*Rating and Characteristic Curves MB05S thru MB10SFig. 2 Maximum Non-repetitive Peak Forward Surge CurrentFig. 3 Typical Instantaneous Forward CharacteristicsFig. 4 Typical ReversFig. 5 Typical Junction Capacitance( TA=25 C Unless otherwise noted )P e a kF o r w a r d S u r g e C u r r e n t ,A m p e r e sI n s t a n t a n e o u s F o r w a r d C u r r e n t ,A m p e r e sI n s t a n t a n e o u s R e v e r s e C u r r e n t ,A m p e r e sC a p a c i t a n c e , p FNumber of Cycles at 60HzInstantaneous Forward Voltage, VoltsPercent of Rated Peak Reverse Voltage, %Reverse Voltage, Volts204050601101000.40.60.8 1.0 1.2 1.41.0100204060801001201401001 1.52101003010010010Fig. 1 Derating Curve forOutput Rectified CurrentA v e r a g e F o r w a r d O u t p u t C u r r e n t , A m p e r e s0.26010040801201401.00.40.60.8Ambient Temperature, C。
MURS360B超快速电源二极管数据手册说明书
MURS360BUltrafast power diodeRev.02 - 1 August 2018Product data sheet1. General descriptionUltrafast power diode in a SMB surface-mountable plastic package.2. Features and benefits• Low on-state loss• Low leakage current• Low thermal resistance• Surface-mountable package• Reduces switching losses in associated MOSFET or IGBT3. Applications• Buck and Boost converter• Discontinuous Current Mode (DCM) Power Factor Correction (PFC)• Inverter freewheeling and protection diode4. Quick reference data5. Pinning information6. Ordering information7. Marking8. Limiting values Table 5. Limiting values9. Thermal characteristics10. Characteristics11. Package outline12. Legal informationData sheet status[1lease consult the most recently issued document before initiating or completing a design.[2]The term 'short data sheet' is explained in section "Definitions".[3]The product status of device(s) described in this document may havechanged since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL .DefinitionsDraft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contai n detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local WeE n Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between WeEn Semiconductors and its customer, unless WeEn Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the WeEn Semiconductors productis deemed to offer functions and qualities beyond those described in the Product data sheet.DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, WeEn Semiconductors does notgive any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors takes no responsibility for the content in this document if provided by an information source outside of WeEn Semiconductors.In no event shall WeEn Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.Notwithstanding any damages that customer might incur for any reason whatsoever, WeEn Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of WeEn Semiconductors.Right to make changes — WeEn Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use — WeEn Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-criticalor safety-critical systems or equipment, nor in applications where failureor malfunction of an WeEn Semiconductors product can reasonablybe expected to result in personal injury, death or severe property o r environmental damage. WeEn Semiconductors and its suppliers accept no liability for inclusion and/or use of WeEn Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at th e customer’s own risk.Quick reference data — The Quick reference data is an extract of th e product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. WeEn Semiconductors makesno representation or warranty that such applications will be suitable for the specified use without further testing or modification.Customers are responsible for the design and operation of their applications and products using WeEn Semiconductors products, and WeEn Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the WeEn Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.WeEn Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using WeEn Semiconductors products in order to avoid a default of the applicationsand the products or of the application or use by customer’s third party customer(s). WeEn does not accept any liability in this respect.Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.Non-automotive qualified products — Unless this data sheet expressl y states that this specific WeEn Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualifie d nor tested in accordance with automotive testing or application requirements. WeEn Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without WeEn Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond WeEn Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies WeEn Semiconductors forany liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond WeEn Semiconductors’ standard warranty and WeEn Semiconductors’ product specifications.]PTranslations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.TrademarksNotice: All referenced brands, product names, service names and trademarks are the property of their respective owners.13. Contents1. General description (1)2. Features and benefits (1)3. Applications (1)4. Quick reference data (1)5. Pinning information (2)6. Ordering information (2)7. Marking (2)8. Limiting values (3)9. Thermal characteristics (5)10. Characteristics (6)11. Package outline (7)12. Legal information (8)13. Contents (10)© WeEn Semiconductors Co., Ltd. 2018. All rights reservedFor more information, please visit: Forsalesofficeaddresses,pleasesendanemailto:**************************** Date of release: 1 August 2018。
博布里克洗手间设备产品技术数据表说明书
The illustrations and descriptions herein are applicable to production as of the date of this T echnical Data Sheet. Revised 9/07 Printed in U.S.A. The manufacturer reserves the right to, and does from time to time, make changes and improvements in designs and dimensions. © 2007 by Bobrick Washroom Equipment, Inc.The illustrations and descriptions herein are applicable to production as of the date of this T echnical Data Sheet.1040 Revised 9/07 Printed in U.S.A.The manufacturer reserves the right to, and does from time to time, make changes and improvements in designs and dimensions.© 2007 by Bobrick Washroom Equipment, Inc.maTerialS:Stiles — 1'' (25mm) finished thickness: 3-ply, 45-lb (20.4-kg) density, resin-impregnated particle board is bonded to each side of 11-gauge (3.2mm) sheet steel that serves as reinforcing core; surfaces and edges are .050'' (1.3mm) thick, high-pressure plastic laminate with colored face sheets and matte finish. Leveling device: 3/8'' x 7/8'' (10 x 22mm) steel bar is welded to sheet-steel core of stile, forming a single structural unit; furnished with 3/8'' (10mm) diameter threaded rods, hex nuts, lock washers, flat washers, expansion shields, and shoe retainers. Shoe: 18-8 S, type-304, 22-gauge (0.8mm) stainless steel with satin finish; 4'' (102mm) high.Panels and doors — 1'' (25mm) finished thickness: 3-ply, 45-lb (20.4-kg) density, resin-impregnated particle board; surfaces and edges are .050'' (1.3mm) thick, high-pressure plastic laminate with colored face sheets and matte finish.Posts (for 1043 Series screens only) — 1-1/4'' (32mm) square tubing; 18-8 S, type-304, 18-gauge (1.2mm) stainless steel with satin finish. Floor and ceiling connections are constructed of 18-8 S, type-304, heavy-gauge stainless steel. Furnished in 10-ft (305-cm) lengths; to be cut in field to job specifications.Headrail (for 1042 Series only) — Extruded anodized aluminum with satin finish. Enclosed construction with sloping top. Face has raised grip-resistant edge.Designer's Notes: Headrails with integral curtain tracks and hooks are available for compartments without doors. Vinyl curtains are available as an optional ac-cessory. Benches are available as an optional accessory for dressing compartments: 1'' (25mm) thick laminated plastic, 10'' (25cm) deep, 18'' or 24'' (46 or 61cm) wide; furnished with two stainless steel support brackets.Wall Posts — 1" x 1-1/2" (25 x 38mm) tubing. 18-8 S, type-304, 16-gauge (1.6mm) stainless steel with satin finish. 58" (147cm) high, pre-drilled for door hard-ware.Commercial Hardware (standard) — Hinges, door latches, door keepers, clothes hooks, and mounting brackets are constructed of 18-8 S, type-304, heavy-gauge stainless steel with satin finish. Threaded inserts are factory installed for securing hinges on inswing doors and furnished for outswing doors. T-nuts are factory installed for securing door latch. Theft-resistant, stainless steel pin-head, torx screws are furnished for door hardware and all mounting brackets. Black rubber bumper on the door latch serves as door bumper for inswing door. Balanced hinge is adjustable to hold door of unoccupied toilet compartment partially open or fully closed. Toilet compartment door is locked from inside by sliding door latch into keeper. A locked compartment may be opened from outside by lifting door to disengage latch from keeper. Track of door latch prevents inswing door from swinging out beyond stile; on outswing door, the door keeper prevents it from swinging in beyond stile.Continuous Hardware (.65 option) — Hinges, door latches, door keepers, clothes hook, U-channels, door stop plates and angle brackets are constructed of 18-8 S, type-304, heavy-gauge stainless steel with satin finish; one-piece, full-height hinge is 16 gauge (1.6mm); one-piece door keepers shall be is 11 gauge (3.2mm); one-piece full-height U-channels and angle brackets are 18 gauge (1.2mm). U-channels secure panels to stiles, and angle brackets secure panels and stiles to walls. Door latch slides on a shock-resistant nylon track. A locked compartment may be opened from outside by lifting door to disengage latch from keeper. Two doorstops prevent door from being kicked out by vandals. Theft-resistant, stainless steel pin-head, torx screws are furnished for door hardware, U-channels, and angle brackets. Doors are equipped with a self-closing hinge. Threaded inserts are factory installed to secure door hinge, latch, and doorstops. To specify continuous hardware, add suffix .65 to series number. Example: specify 1042.65 for overhead-braced partitions furnished with continuous hardware, including factory-installed threaded inserts for door hardware attachment.inSTallaTion:Bobrick installation instructions are packed with each shipment and are available also in advance on request.notes:1. Where water from showers or hose-down cleaning comes in contact with partitions, Bobrick 1080 Series water-resistant, solid phenolic partitions are recom-mended.2. Ceiling-hung partitions require structural members (not furnished by Bobrick) in ceiling. For suggested types of ceiling support systems, see Bobrick Advisory Bulletin TB-32.3. Wall backing is required to secure the mounting brackets of panels, stiles, and wall posts. For suggested wall backing, see Bobrick Advisory Bulletin TB-46.4. Floor-anchored stiles are furnished with expansion anchors and threaded rods. The expansion anchors require minimum 2" (50mm) penetration into minimum 3" (75mm) thick structural concrete.5. Bobrick stainless steel partition-mounted washroom accessories are available for mounting in panels between two compartments. See current Bobrick Catalog for description of accessories. Cutouts in panels can be pre-cut for Bobrick models at factory if location and size of all cutouts and Bobrick model numbers are furnished at time of order.guaranTee: Bobrick toilet partitions are guaranteed to be free from defects in material and workmanship for a period of one year from date of purchase. Any products returned to Bobrick under this guarantee will be repaired or replaced at no charge. SpeciFicaTion:Laminated plastic ____________________ (insert one: toilet partitions, dressing compartments, urinal screens, entrance screens) shall be _______________ (insert one: floor-anchored, overhead-braced, ceiling-hung, wall-hung, post-to-ceiling). Stiles, panels and doors shall have a finished thickness of 1'' (25mm). Core of panels and doors shall be 3-ply, 45-lb (20.4-kg) density, resin-impregnated particle board. Stiles shall have 3-ply, 45-lb (20.4-kg) density, resin-impregnated particle board bonded to each side of 11-gauge (3.2mm) sheet steel that serves as reinforcing core. Stiles shall have leveling device that is welded to the sheet-steel core and concealed by a one-piece, type-304, satin-finish stainless steel shoe that is 4'' (102mm) high. Surfaces and edges shall be .050'' (1.3mm) thick, high-pressure plastic laminate with colored face sheets and matte finish; bonding shall be done using adhesives especially formulated to prevent delamination from moisture and heat normally existing in public washrooms. Stiles, panels and doors shall be __________ (insert color name and number from current Bobrick Catalog). Headrails for overhead-braced compartments shall be anodized aluminum with satin finish. c All door hardware and mounting brackets shall be type-304 stainless steel with satin finish. No door hardware or mounting brackets shall be exposed on exterior of compartments, except on outswing doors. Threaded inserts shall be factory installed for securing hinges on inswing doors and furnished for outswing doors. T-nuts shall be factory installed for securing door latches. Theft-resistant, stainless steel pin-head, torx screws shall be furnished for door hardware and all mounting brackets. A coat hook shall be furnished for each door. Hinges shall be adjustable to hold doors of unoccupied compartments partially open or fully closed, and shall allow a locked compartment to be opened from outside by lifting door to disengage latch from keeper.c To specify continuous hardware, replace end of specifications paragraph with: .65 option All door hardware, U-channels, and angle brackets shall be type-304 stainless steel with satin finish: one-piece, full-height hinges shall be 16 gauge (1.6mm); one-piece door keepers shall be 11 gauge (3.2mm); one-piece, full- height U-channels and single brackets shall be 18 gauge (1.2mm). U-channels shall be furnished to secure panels to stiles, and angle brackets furnished to secure panels and stiles to walls. Two doorstops shall be furnished for each door to prevent it from being kicked out by vandals. Theft-resistant, stainless steel pin-head, torx screws shall be furnished for door hardware, U-channels, and angle brackets. Hinges shall allow locked compartment to be opened in emergency from outside by lifting door to disengage latch from keeper. Doors shall be equipped with a self-closing hinge. Threaded inserts shall be factory installed to secure all door hinges, latches, and doorstops. Manufacturer's service and parts manual shall be provided to the building owner/manager upon request.______________________ (insert one: toilet Partitions, dressing Compartments, Urinal Screens, entrance Screens) shall be _______________ Series (insert series number) of Bobrick Washroom equipment, inc., Clifton Park, new York; Jackson, tennessee; Los Angeles, California; Bobrick Washroom equipment Company, Scarborough, ontario; Bobrick Washroom equipment Pty. Ltd., Australia; and Bobrick Washroom equipment Limited, United Kingdom.。
MB6S中文资料_数据手册_参数
TA = 25°C
Reverse Current At Rated DC Blocking
IR
10 µA TA = 25°C
Voltage
Typical Junction Capacitance
CJ
25pF Measured at
1.0MHz, VR=4.0V
Note1. Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
0.8Amp Single Phase Glass Passivated Bridge Rectifier 50 to 1000 Volts
Maximum Ratings
• Operating Temperature: -55°C to +150°C • Storage Temperature: -55°C to +150°C
Maximum RMS
Voltage
35V 70V 140V 280V 420V 560V 700V
Maximum DC
Blocking Voltage
50V
100V 200V 400V 600V 800V 1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
.050 .014
6.40 0.45 2.30 0.10 0.53 1.40 ----
1.02 0.15
6.91 0.75 2.70 0.20 0.58 1.65 5.08
1.27 0.35
UMW R
UMW MB05S-MB10S
MB1S-TP;MB4S-TP;MB6S-TP;MB2S-TP;MB10S-TP;中文规格书,Datasheet资料
MB05S THRU MB10S0.5 Amp Single Phase Glass Passivated Bridge Rectifier 50 to 1000 VoltsFeaturesMechanical DataRevision: B 2012/02/17 omp onents 20736 Marilla Street Chatsworth! "# $ % ! "#• Glass Passivated Diode Construction• High Temperature Soldering Guaranteed:260 C/10 Second • Saves Space On Printed Circuit Boardwww.mccsemi .com1 of 3Micro Commercial Components• Lead Free Finish/RoHS Compliant (NOTE 1)("P" Suffix oh t t p ://o n e i c .c o m /MB05S thru MB10SInstantaneous Forward Current - Amperes versus Instantaneous Forward Voltage - VoltsVoltsFigure 2Typical Reverse Characteristics Revision: B 2012/02/17Peak Forward Surge Current - Amperes versus Number Of Cycles At 50Hz - CyclesTMMicro Commercial Componentswww.mccsemi .com2 of 3Figure 1. Derating Curve for Output Rectified Current/Revision: B 2012/02/17Micro Commercial Componentswww.mccsemi .com3 of 3Ordering InformationDevice Packing(Part Number)-TP Tape&Reel;3Kpcs /Reel***IMPORTANT NOTICE***Micro Commercial Components Corp. reserve s the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages.***LIFE SUPPORT***MCC's products are not authorized for use as critical components in life support devices or systems without the express writtenapproval of Micro Commercial Components Corporation.***CUSTOMER AWARENESS***Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on our web page cited below . Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine parts, have full traceability, meet MCC's quality standards for handling and storage. MCC will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. MCC is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors./分销商库存信息:MICRO-COMMERICAL-COMB1S-TP MB4S-TP MB6S-TP MB2S-TP MB10S-TP MB8S-TP。
MBRS260T3G;MBRS260T3;中文规格书,Datasheet资料
January, 2012 − Rev. 6
1
Publication Order Number: MBRS260T3/D
/
MBRS260T3G, NRVBS260T3G
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Ambient (Note 2) 1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. Symbol RqJL RqJA Value 24 80 Unit C/W
1.0E+00
50% 20% 10% 5.0%
1.0E−01
1.0E−02 2.0%
1.0E−03 1.0%
Rtjl(t) = Rtjl*r(t)
1.0E−04
0.00001
0.0001
0.001
0.01
0.1 t, TIME (s)
1.0
10
100
1000
Figure 8. Thermal Response − Junction to Ambient
This device employs the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes.
SER2010-202MLB中文资料
Dimensions
are
in
inches mm
Packaging SER2009 200 per 13″ reel; Plastic tape: 44 mm wide, 0.4 mm thick, 4 mm pocket spacing, 9.25 pocket depth SER2010 200 per 13″ reel; Plastic tape: 44 mm wide, 0.4 mm thick, 4 mm pocket spacing, 10.5 pocket depth SER2011 170 per 13″ reel; Plastic tape: 44 mm wide, 0.4 mm thick, 4 mm pocket spacing, 11.6 pocket depth SER2012 150 per 13″ reel; Plastic tape: 44 mm wide, 0.4 mm thick, 4 mm pocket spacing, 13.0 pocket depth SER2013 150 per 13″ reel; Plastic tape: 44 mm wide, 0.5 mm thick, 4 mm pocket spacing, 14.0 pocket depth SER2014 125 per 13″ reel; Plastic tape: 44 mm wide, 0.5 mm thick, 4 mm pocket spacing, 15.0 pocket depth
Mean Time Between Failures (MTBF) 26,315,789 hours
PCB washing Only pure water or alcohol recommended
Eaton Moeller Series xPole - eRB6 M RCBO 产品数据手册说明书
Eaton 153208Eaton Moeller series xPole - eRB6/M RCBO - residual-current circuit breaker with overcurrent protection. Electronic RCD/MCB, 40A, 30mA, MCB char. curve: C, 1p, RCCB trip char.: AC, MEGeneral specificationsEaton Moeller series xPole - eRB6/M RCBO - residual-current circuit breaker with overcurrent protection1532084015081499755216 mm 72 mm 17.5 mm 0.18 kg RoHS conform CEeRB6-40/1/C/003-MEProduct NameCatalog Number EANProduct Length/Depth Product Height Product Width Product Weight Compliances Certifications Model Code40 AIs the panel builder's responsibility. The specifications for the switchgear must be observed.Meets the product standard's requirements.Is the panel builder's responsibility. The specifications for the switchgear must be observed.3Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.0 kA50/60 HzIs the panel builder's responsibility.10.03 A40 °C0 W69.5 mm1 mm²eaton-xpole-erb6-rcbo-catalog-ca019049en-en-us.pdfeaton-xpole-erb6-au-rcbo-catalog-ca019052en-en-us.pdfDA-DC-03_eRBIL019095ZUeaton-xpole-combined-mcb-rcd-device-rcbo-packaging-manual-multilingual.pdfMA120500735.pdfRated operational current for specified heat dissipation (In) 10.11 Short-circuit rating10.4 Clearances and creepage distances10.12 Electromagnetic compatibilityCurrent limiting class10.2.5 Lifting10.2.3.1 Verification of thermal stability of enclosures Rated short-circuit breaking capacity (EN 60947-2) Frequency rating10.8 Connections for external conductorsNumber of poles (total)Fault current ratingAmbient operating temperature - maxHeat dissipation per pole, current-dependentBuilt-in depthConnectable conductor cross section (solid-core) - min 10.9.3 Impulse withstand voltage Catalogues Certification reports Installation instructionsIs the panel builder's responsibility.Number of polesSingle-poleAmbient operating temperature - min-25 °C10.6 Incorporation of switching devices and componentsDoes not apply, since the entire switchgear needs to be evaluated.10.5 Protection against electric shockDoes not apply, since the entire switchgear needs to be evaluated.Equipment heat dissipation, current-dependent14.7 W10.13 Mechanical functionThe device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.2.6 Mechanical impactDoes not apply, since the entire switchgear needs to be evaluated.10.9.4 Testing of enclosures made of insulating materialIs the panel builder's responsibility.Static heat dissipation, non-current-dependent0 WApplicationSwitchgear for residential and commercial applications10.3 Degree of protection of assembliesDoes not apply, since the entire switchgear needs to be evaluated.Voltage typeACNumber of poles (protected)1Leakage current typeACRated short-circuit breaking capacity (EN 61009-1)6 kAOperating ambient temperature - min-25 °CHeat dissipation capacity0 WRelease characteristicCWidth in number of modular spacings1Power loss14.7 W10.2.3.2 Verification of resistance of insulating materials to normal heatMeets the product standard's requirements.10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effectsMeets the product standard's requirements.Rated short-circuit breaking capacity (EN 61009)6 kAOperating ambient temperature - max40 °CVoltage rating240 V - 240 V10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Connectable conductor cross section (solid-core) - max25 mm²Degree of protectionIP20Overvoltage categoryIIIPollution degree210.7 Internal electrical circuits and connectionsIs the panel builder's responsibility.Connectable conductor cross section (multi-wired) - min1 mm²Rated impulse withstand voltage (Uimp)4 kV10.10 Temperature riseThe panel builder is responsible for the temperature risecalculation. Eaton will provide heat dissipation data for the devices.Basic functionCombined RCD/MCB devicesRated current40 AConnectable conductor cross section (multi-wired) - max 25 mm²TypeRCBO10.2.2 Corrosion resistanceMeets the product standard's requirements.Surge current capacity0.25 kA10.2.4 Resistance to ultra-violet (UV) radiationMeets the product standard's requirements.10.2.7 InscriptionsMeets the product standard's requirements.Rated short-circuit breaking capacity (IEC 60947-2)0 kADisconnection characteristicUndelayedProduct applicationSwitchgear for residential and commercial applicationsRated operational voltage (Ue) - max240 VRated insulation voltage (Ui)500 VEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All rights reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmedia。
MB2S MB4S MB6S MB8S MB10S 芯片数据手册说明书
Features◆ Plastic package has Underwriters Laboratory FlammabilityClassification 94V-0◆ Glass passivated chip junctions ◆ High surge overload rating:35A peak ◆Saves space on printed circuit boards◆ High temperature soldering guaranteed:260℃/10 seconds ◆ Add suffix "E" for Halogen Free◆ Halogen-free according to IEC 61249-2-21 definitionMechanical Data◆Case:Molded plastic body over passivated junctions ◆ Terminals: plated leads solderable per MIL-STD-750,Method 2026◆ Mounting Position:Any ◆Weight:0.078 oz.,0.22gMaximum Ratings & Electrical Characteristics(T A =25℃ unless otherwise noted)ParameterSymbol MB2S MB4S MB6S MB8S MB10S Unit Maximum repetitive peak reverse voltage V RRM 2004006008001000V Maximum RMS voltage V RMS 140280420560700V Maximum DC blocking voltageV DC2004006008001000VMaximum Average forward output current (see Fig.1) on glass-epoxy P.C.B on aluminum substratePeak forward surge current 8.3 MS single HALF sine-wav superimposed on rated load (JEDEC Method)A350.5(1)0.8(2)A I F(AV)I FSM p p ()Rating for fusig (t<8.3ms)I 2t A 2sec Maximum instantaneous forward voltage drop per leg at 0.4AMaximum DC reverse current at TA=25℃rated DC blocking voltage per leg TA=125℃R 1.00V585(1)VFμAIR5100θJA R θJA R θJLCj pF Operating junction and storage temperature rangeT J,T STG℃Notes:1. On glass epoxy P.C.B. mounted on 0.05×0.05"(1.3×1.3mm) pads-55 to +15020(1)70(2)℃/W Typical junction capacitance per at 4.0V,1.0MHz 13Typical thermal resistance per leg2. On aluminum substrate P.C.B.whth an area of 0.8×0.8"（20×20mm ）mounted on 0.05×0.05"(1.3×1.3mm) solder padRatings and Characteristics Curves(TA = 25℃ unless otherwise noted)Figure 1.Derating Curve for Output Rectified Current Figure 4.Typical Reverse Leakage Characteristics Per LegFigure 5.Typical Junction Capacitance Per Leg Figure 2.Maximum Non-Repetitive Peak ForwardSurge Current Per LegFigure 3.Typical Forward Voltage Characteristics Per LegMarking。
CR6PM中文资料
GATE TRIGGER CURRENT VS.
JUNCTION TEMPERATURE
103
7
TYPICAL EXAMPLE
5
3 2
102 7 5
3 2
101 7 5
3 2
100 –40 –20 0 20 40 60 80 100 120 140160
JUNCTION TEMPERATURE (°C)
100 (%)
CASE TEMPERATURE (°C)
TRANSIENT THERMAL IMPEDANCE (°C/W)
MITSUBISHI SEMICONDUCTOR 〈THYRISTOR〉
CR6PM
MEDIUM POWER USE INSULATED TYPE, GLASS PASSIVATION TYPE
Conditions Commercial frequency, sine half wave, 180° conduction, Tc=85°C 60Hz sine half wave 1 full cycle, peak value, non-repetitive Value corresponding to 1 cycle of half wave 60Hz, surge on-state current
3 2
102 7 5
3 2
101 7 5
3 2
100
0
1
2
3
4
5
ON-STATE VOLTAGE (V)
RATED SURGE ON-STATE CURRENT 200 180 160 140 120 100
80 60 40 20
0 100 2 3 4 5 7 101 2 3 4 5 7 102
RBS6000设备详细介绍&IDB数据的制作(中文)
分布式基站RBS6601
• MU接口介绍 支持直流-48v输入，内建风扇以及控制单元。
分布式基站RBS6601
• RRU
射频单元RRUS01负责射频信号的处理 射频性能 • 4载频 • 输出功率 4X15W或4X20W（IPM） • 接收灵敏度 -113dBm 尺寸 & 重量 • 尺寸: 600 x 350 x 112 mm • 重量: 20 kg 电源 • 输入电压: -48 VDC or AC 环境 • 温度范围: -40º to +55 º C C
分布式基站RBS6601
• RRUS外部接口介绍
RBS6601典型配置
• RBS6601目前最大支持24TRX容量，将来 支持48TRX，通过TG同步，可以实现多个 RBS6601的级联，以支持更大配置的容量 。 1个RBS6601采用RRUS01的典型配置：
单频段S8/8/8。例如：900MHz或者1800MHz。 双频段S4/4/4(900MHz)+S4/4/4(1800MHz)。
1435m
冷却系统 数字单元
射频单元
电源模块 传输模块
600X400m
室内宏站RBS6201
• 单机柜支持目前最大48TRX，将来可以支 持96TRX，有效缓解机房空间压力。 例如： S8/8/8(900MHz)+S8/8/8(1800MHz)的配置
– RBS6201使用1个机柜，占地面积0.24m2 – RBS2206使用6个机柜，占地面积1.44m2
• IBD数据制作实例 RBS6201 S444配置 RBS6201 S888配置 RBS6601 S444配置 RBS6601 S888配置
Embit s.r.l EMB-LR1276S 数据手册说明书
EMB-LR1276S DatasheetEmbit s.r.l.Revision Date Author Comments0.12018-10-05Embit-MDD Initial release0.52018-10-09Embit-MDD Preliminary version0.72019-01-21Embit-MDD Preliminary version updated0.82019-02-08Embit-MDD Test results added0.92019-02-15Embit-MDD Footprint modified0.952019-04-29Embit-MDD Typical application circuit modified1.02019-05-01Embit-MDD Final release1.12019-09-19Embit-MDD Typical application circuit added- modem1 Introduction (4)1.1 Specifications (4)1.2 Applications (5)2 Description (5)2.1 Block Diagram (5)2.2 SAMR34 (6)2.3 Antenna (6)2.4 Firmware (6)2.5 Development tools (7)3 Size and footprints (8)3.1 Size (8)3.2 Suggested footprint (9)3.3 External Antenna Connection (9)3.4 Notes (10)4 Connections (10)4.1 Pin Out Description (10)4.2 SERCOM Pins (12)5 Typical Application Circuit (13)5.1 Micro-embedded approach (13)5.2 Modem approach (14)6 Electrical characteristics (15)6.1 Absolute Maximum Ratings (15)6.2 Operating Conditions (15)6.3 Power Consumption (15)6.4 RF Characteristic (16)7 Ordering Information (16)8 References (17)9 Disclaimer of liability (17)9.1 Handling Precautions (17)9.2 Limitations (17)9.3 Disclaimer of Liability (17)9.4 Trademarks (18)EMB-LR1276S is the new sub-1GHz Embit’s wireless module that supports the LoRaWAN TM long range wireless protocol. It comes in a very small form factor (11.5 x 11.5 mm) and integrates all the costumers needs to develop complete and secure solutions.It is based on the new SAMR34Microchip SiP,an ultra low power microcontroller combined with a UHF transceiver communication interface.The EMB-LR1276S can be configured as an embedded micro system or a simple data modem for low power applications in the 868MHz and 915MHz radio bands.It is equipped with up to256KB of Flash and up to40KB of SRAM.The transceiver supports LoRa and FSK modulation.The EMB-LR1276S can communicate with other devices through a wide range of serial interfaces: UART, I2C, SPI, Full-Speed USB 2.0, digital and analog I/O ports.The module has an extremely reduced power consumption (less than1 μA in Sleep Mode) which makes it a perfect solution to implement long life battery powered devices.It features a higher power efficiency in transmission with a maximum output power of +14dBm (or +18dBm with PA Boost).The EMB-LR1276S integrates two crystals, one at 32MHz and one at 32KHz and a Crypto Uinit(ATECC608A)to protect the communication between module and external interfaces. The module integrates as well a U.FL connector to easily connect a 50 Ω antenna.•Operating Voltage: from 1.8V to 3.3V•MCU: ARM Cortx M0+ CPU running up to 48MHz•up to 256 KB of Flash•up to 32 KB of SRAM•8 KB low-power RAM with battery backup retention•Two Pin Serial Wire Debug(SWD)Programming,Test and Debug Interfaces•RF Output Power: up to +14dBm (+18dBm with PA Boost)•Sensitivity: down to -136dBm•LoRa Technology and FSK modulation•Peripherals: 12-Channel DMAC, Three 16-bit Timer/Counters, 32-bit RTC, Watchdog Timer (WDT), CRC-32 Generator, Full-Speed USB 2.0, up to four Serial Communication interfaces(configurable as UART,I2C,SPI, LIN), one 12-bit ADC with up to 8 channels, up to 17 GPIOs •32MHz crystal for RF reference and 32kHz crystal for RTC•Footprint: 32-pins LGA•Crypto Unit to protect communication (ATECC608A)•U.FL connector and Ground-Signal-Ground pads•Dimensions: 11.50 x 11.50 x 2 mm•Temperature Range: -40°C to +85°CThe device can be used in several applications where LoRa end-devices are needed, such as:•Internet Of Things (IOT)•Automated Meter Reading•Smart Cities•Home and Building Automation•Wireless Alarm and Security System•Machine to Machine (M2M)•Industrial Monitoring and Control•Long Range Irrigation System.The EMB-LR1276S block diagram:Figure 1. EMB-LR1276S block diagram.The SAMR34 [1] is an ultra low-power microcontroller that uses the 32-bit ARM Cortex-M0+ processor at max. 48MHz with up to 256 KB of Flash and up to 40 KB of SRAM. It is equipped with a UHF transceiver that supports LoRa and FSK modulations able to work from frequencies or 137 MHz to 1020 MHz. It can reach up to +18dBm without external amplification. Operational frequency bands and power limits are defined by local regulations and the LoRa Alliance [2].It integrates sophisticated power management technologies,such as power domain gating, SleepWalking, ultra low-power peripherals and more, with two software-selectable sleep modes: Idle and Standby.The Flash program memory can be reprogrammed in-system through the Serial Wire Debug (SWD) interface, which can be used also for on-chip debugging of application code. There is a boot loader as well that runs in the device and can use any communication interface to download and upgrade the application program in the Flash memory.The MCU includes several peripherals such as: three 16-bit Timer Counters, 32-bit Real Time Counter, Watchdog Timer, Full-Speed USB 2.0, up to four Serial Communication Interfaces (SERCOM), one 12-bit ADC with up to 8 channels. The transceiver feature the LoRa long range modem that provides ultra-long range spread spectrum communication and high interference immunity whilst minimizing current consumption.It can achieve a sensitivity of -136dBm in LoRaWAN TM protocol compliant modes. The transmit section offers two integrated power amplifiers for both high efficiency with +14dBm output power, or +18dBm for highest power, depending on the regional regulations. The high sensitivity combined with the integrated power amplifier yields industry leading link budget, making it optimal for any application requiring long range and link robustness.LoRa also provides significant advantages in both blocking and selectivity capabilities over all conventional modulation techniques,improving the traditional design compromises between coverage,interference immunity and energy consumption.The EMB-LR1276S offers two antenna options:•External antenna connection (optional): 50 Ω single-ended U.FL connector •Ground-Signal-Ground(GSG)LGA pads:for connection to antenna mounted on the host boardNote: Please refer to the section “Ordering Information”.The EMB-LR1276S has an embedded Microchip LoRaWAN TM protocol stack, extended with Embit additional features; moreover, a serial bootloader can be provided to upgrade the device without any additional hardware needed.To work with the EMB-LR1276S module,the following software tools are suggested:•Atmel Studio 7.0 IDE (minimum version)•Atmel-ICE debugger and programmer(or any other programmer/debugger supporting Microchip SAMR34 microcontroller).To quickly get started with Embit modules, Embit also provides ready-to-use firmware for EMB-LR1276S that allow the module to act like a simple modem over UART. Through AT-like binary commands it is possible to send/receive data over-the-air and to develop complex applications without the need of writing custom firmware. The protocol and the firmware implementing such feature are called “EBI” (Embit Binary Interface) [3].For more information about EMB-LR1276S firmware development and“EBI”usage please refer to the documentation, software and hardware tools available on Embit website (www.embit.eu).The mechanical dimensions of the EMB-LR1276S are11.5 x 11.5 mm. The thickness is 2 mm.The module has a total of 32 pins (8 on each of the four edges) with 1 mm pitch and 0.5 x 0.5 mm as dimensions. The positioning is shown in the image below.Figure 2. EMB-LR1276S size and pinout (Top View).The EMB-LR1276S suggested footprint consists in 32 LGA pads 0.65 x 0.65 mm in dimensions positioned as following (all sizes are in mm):The antenna output of the module is matched to 50 Ω. By using a 50 Ω antenna,no additional matching is required. Connection with antenna should be as short as possible, and must represent a characteristic impedance of 50 Ω. A grounded coplanar waveguide is suggested to minimize the interaction with the external environment.Figure 3. Recommended land pattern (Top View).•The area underneath the module must be kept free of components (both top and bottom layers) and must be covered with solder resist.•The PCB top layer underneath the module must be free of nets, power planes and vias. The bottom layer shall provide ground plane.•The power supply of the module must be as clean as possible; it must be decoupled placing ceramic capacitor as near as possible at the Vcc pins.•Noisy electronic components (such as switching power supply) must be placed as far as possible and adequately decoupled.•The ground pins of the module shall be connected to a solid ground plane.•Taking no account these recommendations may affect the radio performances.The table below gives the description of the pin out of the EMB-LR1276S module.Figure 4. EMB-LR1276S Pinout.Table 1: EMB-LR1276S pin out.Sercom0 pins:Table 2: Sercom0 pins.Sercom2 pins:Table 3: Sercom2 pins.Sercom3 pins:Table 4: Sercom3 pins.Sercom5 pins:Table 5: Sercom5 pins.Sercom pins supporting I2C:Table 6: Sercom pins supporting I2C.Please note that for I2C bus the function for pins SercomX_Pad[0] is SDA and for SercomX_Pad[1] is SCL.A basic application circuit for using EMB-LR1276S in a micro-embedded approach is shown below.The EMB-LR1276S allows for a minimal number of external components (this decreases the system costs).A LED indicator (LED1) and a push button (SW1) are used to provide a minimal user interface. The SWD programming / debugging interface, generally speaking, should be routed to a connector on the host board for in-circuit programming.In addition, a simple supply section based on a 3.3V LDO (IC1) stabilizing the input voltage VIN and a simple reset circuitry are shown. In particular, the reset circuitry allows to:1. program the MCU of the EMB-LR1276S (thanks to the weak pull-up to VCC);2. mannually reset the MCU, if needed (thanks to SW2).Moreover, if L1 is mounted the device can switch between Switching and Linear mode (it can be done by software on the fly). If not mounted only Linear mode is available.Figure 5.Micro-embedded typical application circuit.A basic application circuit for usingEMB-LR1276S in a modem approach is shown below. The UART lines needs to be connected to the external host.Notes:•An EMI filter bead is suggested to filter the Vcc power supply.•The external supply shall include protection from spikes, short circuits and it requires adequate decoupling.•Voltage glitches on Vcc supply may cause reset or malfunctioning of the microcontroller.•Slow voltage ramp on Vcc or RESET# may cause malfunctioning of the microcotroller.•Do not reset or turn off the power of the module while writing to the flash,otherwise memory corruption may occur.Figure 6. Modem approach typical application circuit.Table 7: Absolute Maximum Ratings.Table 8: Operating conditions.Table 9: Power consumption.EMB-LR1276S RF characteristics (Vcc = 3.3V, 25°C, EU Band):Table 10: RF characteristic.Table 11: Ordering part numbers. Related products:Table 12: EMB-1276S related products.References[1] Microchip, SAMR34/R35 Low Power LoRa Sub-GHz SiP Datasheet[2] LoRa Alliance, LoRaWAN TM Specification v.1.0.2[3] Embit, Embit Binary Interface – LoRa specific documentation v.1.0.1[4] Embit, EMB-LR1276S-Dev Board User Guide rev. 2.1The user must read carefully all the documentation available before using the product. In particular, care must be taken in order to comply with the regulations (e.g., power limits, duty cycle limits, etc.).This product is an ESD sensitive device. Handling precautionsshould be carefully observed.Every operation involving a modification on the internal components of the module will void the warranty.The information provided in this and other documents associated to the product might contain technical inaccuracies as well as typing errors. Regulations might also vary in time. Updates to these documents are performed periodically and the information provided in these manuals might change without notice. The user is required to ensure that the documentation is updated and the information contained is valid. Embit reserves the right to change any of the technical/functional specifications as well as to discontinue manufacture or support of any of its products without any written announcement.Disclaimer of liabilityEmbit is a registered trademark owned by Embit s.r.l.All other trademarks, registered trademarks and product names are the sole proprietary of their respective owners.。
Mobile Merchandiser MM4, MM6 安装与使用说明书
Warranty claims must be received in writing by BKI within one (1) year from date of installation or within one (1) year and three (3) months from data of shipment from the factory, whichever comes first.
Introduction .............................................................................................................................................................. 2 Safety Precautions................................................................................................................................................. 2 Safety Signs and Messages.............................................................................................................................. 2 Safe Work Practices.......................................................................................................................................... 3 Safety Labels..................................................................................................................................................... 4
贴片桥椎MB6S
Dimensions in inches and (millimeters)MB2S - MB10SSingle Phase 0.8 AMPS. Glass Passivated Bridge RectifiersMBSMAX .028(0.70).043(1.10)FeaturesUL Recognized File # E-96005 Ideal for printed circuit boardReliable low cost construction utilizing molded plastic techniqueHigh surge current capabilityHigh temperature soldering guaranteed:260 o C / 10 seconds at 5 lbs., (2.3 kg ) tensionSmall size, simple installationLeads solderable per MIL-STD-202 Method 208Maximum Ratings and Electrical CharacteristicsRating at 25 o C ambient temperature unless otherwise specified.Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%Type NumberSymbol MB2S MB4S MB6S MB8S MB10S UnitsMaximum Recurrent Peak Reverse Voltage V RRM 200 400 600 8001000 V Maximum RMS Voltage V RMS 140 280 420 560 700 VMaximum DC Blocking VoltageV DC 200 400 600 800 1000 V Maximum Average Forward Rectified Current On glass-epoxy P.C.B. On aluminum substrate I (AV)0.5 0.8APeak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method )I FSM 35 AMaximum Instantaneous Forward Voltage @ 0.4AV F 1.0 V Maximum DC Reverse Current @ T A =25 oC at Rated DC Blocking Voltage @ T A =125 o C I R5.0 100 uA uATypical Junction Capacitance Per Leg Cj13 pFTypical Thermal Resistance Per Leg R θJA 85 oC/WOperating Temperature Range T J-55 to +150 oCStorage Temperature RangeT STG -55 to +150 oCNote: 1. Measured at 1.0MHz and Applied Reverse Voltage of 4.0 Volts D.C.RATINGSANDCHARACTERISTICCURVES(MB2STHRU MB10S)FIG.1-DERATING CURVE FOR OUTPUT RECTIFIEDCURRENT60160NUMBER OF CYCLESFIG.3-MAXIMUM NON-REPETITIVE PEAK FORWARDFIG.5-TYPICAL FORWARD VOLTAGEI N S T A N TA N E O U S F O R W A R DC U R R E N T .(A )FIG.2-TYPICAL REVERSE LEAKAGECHARACTERISTICS PER LEGI N S T A N T A N E O U S R E V E R S E C U R R E N T .(A )m L E A K A G E 14010080200510.01101INSTANTANEOUS FORWARD VOLTAGE.(V)PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)AMBIENT TEMPERATURE.(C)P E A K F O R W A R D S U R G E C U R R E N T .(A )A V E R A G E F O R W A R D C U R R E N T .(A )R E C T I F I E D 1015202530351000.10.0140120FIG.4-TYPICAL JUNCTION CAPACTITANCEREVERSE VOLTAGE.(V)0.11101002000510152530J U N C T I O N C A P A C I T A N C E ()p FFactory Address: Taiguan Industrial zone, Yanjinyu Dongjin Rode No.1, XinXiang, HeNan, ChinaD A Y A----。
BL75R06SM 8K位EEPROM非接触加密存储卡
停止
-5Total 7 Pages
8/16/2006
BL75R06SM 8K 位 EEPROM 非接触加 密存储卡
存储器操作 操作 读 写 加
减
转移 恢复
描述 读块 写块 块中的内容加上一个值，并把结果保存到一 个临时的数据寄存器中 块中的内容减去一个值，并把结果保存到一 个临时的数据寄存器中 将临时寄存器中的内容写到指定的值块中 块中的内容移到临时的数据寄存器中
扇区
块
15
3
2
1
0
14
3
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1
0
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…
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块内字节
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
密钥 A
存取位
密钥 B
密钥 A
存取位
密钥 B
描述
扇区 Trailer 15 数据 数据 数据
扇区 Trailer 14 数据 数据 数据
密钥 A 密钥 A
存取位 存取位
BL75R06SM 8K 位 EEPROM 非接触加 密存储卡
一、概述
BL75R06SM 非接触加密存储卡芯片由射频通讯接口、安全控制单元和8K 位EEPROM 组成。读写距离10cm。主要适用于各种证件、电子钱包、自动收费系统和公共交通自 动售检票系统等领域。该芯片支持ISO14443 TypeA 射频接口，支持PHILIPS 标准读卡 机芯片。
二、产品特点
1 、RF 接口（ISO/IEC 14443 Type A）
芯片无需电池，数据和电源能量的提供通过无线传输 操作距离：最大达到 10 厘米（取决于天线） 操作频率： 13.56MHz 数据传输速率：106kbit/s 高数据完整性：16 位 CRC 校验，奇偶校验，位编码，位计数 典型交易时间：小于 100ms（包括备份管理时间）
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Dimensions in inches and (millimeters)
Version: B07
RMB2S - RMB6S
0.8Amps Miniature Glass Passivated
Fast Recovery Surface Mount Bridge Rectifiers
MAX .028(0.70).043(1.10)
MBS
Features
Ideal for printed circuit board
Reliable low cost construction utilizing molded plastic technique
High surge current capability
High temperature soldering guaranteed:
260 o C / 10 seconds at 5 lbs., (2.3 kg) tension
Small size, simple installation
Pure tin plated terminal, Lead free.
Leads solderable per MIL-STD-202 Method 208 Maximum Ratings and Electrical Characteristics
Rating at 25 o C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%
Type Number
Symbol RMB2S RMB4S RMB6S Units Maximum Recurrent Peak Reverse Voltage V RRM 200 400 600 V Maximum RMS Voltage V RMS 140 280 420 V Maximum DC Blocking Voltage
V DC 200 400 600 V
Maximum Average Forward Rectified Current On glass-epoxy P.C.B. On aluminum substrate I (AV) 0.5 0.8
A Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method )
I FSM 30 A Maximum Instantaneous Forward Voltage @ 0.4A
V F 1.0 V
Maximum DC Reverse Current @ T A =25 o C at Rated DC Blocking Voltage @ T A =125 o C
I R
5.0 100 uA uA
Maximum Reverse Recovery Time at (Note 1) Trr 150 nS Typical Junction Capacitance Per Leg C j
13 pF
Typical Thermal Resistance Per Leg R θJA 85 o
C /W
Operating Temperature Range T J -55 to +150 o
C
Storage Temperature Range T STG -55 to +150 o
C Note: Reverse Recovery Test Conditions: I F =0.5A, I R =1.0A, I RR =0.25A
RATINGS AND CHARACTERISTIC CURVES (RMB2S THRU RMB6S)
FIG.6-REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM
50W
NONINDUCTIVE
1W NON
INDUCTIVE
OSCILLOSCOPE (NOTE 1)
PULSE
GENERATOR (NOTE 2)
DUT
(+)50Vdc (approx)(-)
NOTES:1.Rise Time=7ns max.Input Impedance=
1megohm 22pf
2.Rise Time=10ns max.Sourse Impedance=
50ohms
(-)
(+)
10W
NONINDUCTIVE
-1.0A
0+0.5A
FOR Version:B07
FIG.1-DERATING CURVE FOR OUTPUT RECTIFIED
A V E R A G E F O R W A R D R E C T I F I E D C U R R E
N T .(A )
INSTANTANEOUS FORWARD VOLTAGE.(V)
J U N C T I O N C A P A C I T A N C E .(p F )
REVERSE VOLTAGE.(V)
FIG.2-TYPICAL REVERSE LEAKAGE
P E A K F O R W A R D S U R G E C U R R E N T .(A )。