贴片压敏电阻0603封装参数型号规格书大全

18
45
ESD0402-5R5E220
5.5
45
0402
ESD0402-140E330
14
45
ESD0402-5R5E500
5.5
45
ESD0402-120E101
12
40
ESD0402-120E131
12
40
ESD0402-140E161
14
35
ESD0402-9R0E181
9
30
ESD0402-5R5E481
varistor voltage shall be within 10%.
The temperature cycle of specified Step
Temperature
Period
temperature shall be repeated five times and 1
-40±3℃
30min±3
2010 UN Gorp.
9
Packaging Specification
Carrier tape transparent cover tape should be heat-sealed to carry the products, and the reel should be used to reel the carrier tape.
3
125±2℃
30min±3
mechanical damage shall be examined.
4 Room Temperature 1~2hours
After being continuously applied the maximum allowable voltage at 85℃ for High Temperature Load 1000hours, the specimen shall be stored at room temperature and humidity for one or
Voltage DC
Voltage 8/20uS 1A
VDC
VC(MAX)
ESD0402-5R5E0R2
5.5
250
ESD0402-5R5E0R8
5.5
250
ESD0402-240E2R5
24
250
ESD0402-120E5R0
12
60
ESD0402-5R5E100
5.5
50
ESD0402-180E150
Maximum ESD
IEC61000-4-2
Contact Discharge Voltage: 8 KV
Air Gap Discharge Voltage: 15 KV
2010 UN Gorp.
2
ESD Wave Form
SEVERITY LEVEL 1 2 3 4
AIRDIRCHARGE DIRECT ISCHARGE
The specimen should be subjected to -40℃, without load for 1000 hours and then
Low Temperature Storage stored at room temperature for one two hours. The change of varistor voltage shall be
1005(0402) 1608(0603) 2012(0805) 3216(1206) 3225(1210) 4532(1812) 5650(2220) 8050/08CH(3220)
1.00±0.15 1.60±0.20 2.00±0.20 3.20±0.20 3.20±0.20 4.50±0.30 5.60±0.30 8.0±0.30
Suitable for ESD protection Bidirectional clamping, high energy Good slderability Wide Operating temperature range from -55℃-125℃
W H
L L1
Size
Model Length(L) Width(W) High(H)
ESD 0603 - 5R5 E 0R2
2010 UN Gorp.
Capacitance value
0R2 0.2pF
2R5 2.5pF
121 120pF
ESD Solutions Suppressor series
Maximum continuous working voltage
5R5 5.5V
Reflow Soldering When reflow soldering, the device is placed a solder paste on the substrate ,as the solder paste is heated, it
re-flows and solders the unite to board. When using a reflow process ,care should be taken to ensure that the MLCV is not subjected to an thermal gradient steeper than 4 degrees per second; the ideal gradient being 2degrees per second. During the soldering process, preheating to within 100 degrees of the soldier’s peak temperature is essential to minimize thermal shock. The following is typical profile.
5.5
40
※ More Working Voltage range 5.5V～30V.
Peak Current 8/20uS
Ip 0.05 0.05
1 1 1 1 5 5 10 20 20 20 20 20 0.1 0.1 1 1 1 5 5 5
Capacitance
@ 1KHz pF 0.2 0.8 2.5 5 10 15 22 33 50 100 130 160 180 480 0.2 0.8 2.5 5 10 22 33 50
5.5
16
ESD0603-180E0R2
18
250
ESD0603-180E0R8
18
250
ESD0603-240E2R5
24
250
ESD0603-180E5R0
18
60
0603
5R5E100
5.5
50
ESD0603-5R5E220
5.5
45
ESD0603-140E330
14
45
ESD0603-5R5E500
within 10%.
2010 UN Gorp.
8
Soldering Recommendation The principal techniques used for the soldering of components in surface mount technology are infrared reflow
Temperature Cycle
then stored at room temperature and humidity for one two hours. The change of varistor voltage shall be within 10%and
2 Room Temperature 1~2hours
hours, the change of varistor voltage shall be within 10%.
Damp Heat Load/ Humidity Load
The specimen should be subjected to 40℃,90 to 95%RH environment, and the maximum allowable voltage applied for 1000 hours, then stored at room temperature and humidity for one or two hours. The change of varistor voltage shall be within 10%.
MULTILAYER CHIP VARISTOR
Features
Series size from 0402 to 2220,08CH Working Voltage from 2V to 470V dc Fast response time (<0.5ns) Low leakage current High surge current ability
The specimen shall be subjected to 125℃ for 1000 hours in a thermostatic bath without
High Temperature Storage load and then stored at room temperature and humidity for 1 to 2 hours. The change of
and wave soldering. wave Soldering
When wave soldering. The MLCV is attach to the circuit board by means of an adhesive. The assembly is then place on a conveyor and run though the soldering process to contact the wave. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock., a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. The following is the typical profiles.
240 24V
Chip size
0402(1005) 1.0×0.5mm
0603(1608) 1.6×0.8mm
Series name
1
ELECTRICAL CHARACTERISTICS
DEVICE RATING AND SPECIFICATIONS
Working
Clamping
Part Number
type
1005 1608 2012 3216 3225 4532 5650
A0 ±0.10
B0 ±0.10
K0 ±0.10
0.50±0.15 0.80±0.20 1.20±0.20 1.60±0.20 2.50±0.20 3.20±0.20 5.00±0.30 5.00±0.30
0.70max 0.90max 1.30max 1.60max 2.50max 3.20max 4.50max
4.50max
ESD Solutions Suppressor Series
The adhesion of the heat-sealed cover tape shall be 40﹢20/﹣15 grams.
Both the head and the end portion of taping shall be empty for reel package and SMT auto-pickup machine. And a normal paper tape shall be connected in the head of taping for the operator handle.
2 kV
2 kV
4 kV
4 kV
8 kV
6 kV
15 kV
8 kV
IEC61000-4-2 Compliant ESD Current Pulse Waveform
IEC61000-4-2 Standards Enviromental Reliability Test
Characteristic
Test method and description