MEASURING METHOD AND MEASURING DEVICE EMPLOYED THE
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专利名称：MEASURING METHOD AND MEASURING DEVICE EMPLOYED THEREFOR
发明人：KITAHARA KUNINORI
申请号：JP14822879
申请日：19791115
公开号：JPS5670446A
公开日：
19810612
专利内容由知识产权出版社提供
摘要：PURPOSE:To measure the electrical characteristics of a semiconductor wafer and the like easily and precisely by applying a light to the central part of a point of measurement, taking out an electric signal from the periphery of this central part and thereby reducing the resistance of contact with a probe. CONSTITUTION:The probe 1 made of tungsten or the like is provided with a hole in the shape of such a slender pipe as an injector needle, and a optical fiber 2 is inserted into this hole. By this constitution, the central part of the point of measurement of the wafer 4 is irradiated through the intermediary of the optical fiber 2, and when the probe 1 contacts with the periphery of the irradiated part, the contact resistance of the probe 1 is lowered by the light, whereby the electrical characteristics of the wafer 4, such as resistance, are measured easily and precisely.
申请人：FUJITSU LTD
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