METHOD OF FILM LAMINATING
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专利名称：METHOD OF FILM LAMINATING 发明人：KATO, Takeyoshi
申请号：JP2001007181
申请日：20010822
公开号：WO02/017695P1
公开日：
20020228
专利内容由知识产权出版社提供
摘要：A method of film laminating which comprises superposing an adhesive film comprising a substrate and a resin composition layer on a circuit board so that the resin composition layer is in contact with at least the pattern-bearing part thereof, pressing the adhesive film against the circuit board with a laminating apparatus having a press plate made of a heat-resistant rubber, and then pressing the resultant structure with a laminating apparatus having a press plate made of a metal; and the method of film laminating in which the adhesive film comprising a base film and formed thereon a resin composition layer having a melt viscosity at 120°C of 10,000 to 100,000 Pa s is superposed on the circuit board so that the resin composition layer overlies at least the circuit pattern part thereof, and the adhesive film is laminated to the circuit board with a press plate and a caul plate which has a modulus at 120°C of 1 to 500 MPa and is disposed between the press plate and the base film of the adhesive film. Thus, a multilayered circuit board is obtained which is excellent in buried-layer state and surface smoothness.
申请人：KATO, Takeyoshi
地址：JP,JP
国籍：JP,JP
代理机构：OISHI, Haruhito 更多信息请下载全文后查看