SNJ54AHCT08FK中文资料

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SN74HC08DRG4中文资料

SN74HC08DRG4中文资料

• Typical tpd = 8 ns • ±4-mA Output Drive at 5 V
• Low Power Consumption, 20-µA Max ICC
• Low Input Current of 1 µA Max
SN54HC04...J OR W PACKAGE SN74HC04...D, DB, N, NS, OR PW PACKAGE
元器件交易网

SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007
FEATURES
• Wide Operating Voltage Range of 2 V to 6 V • Outputs Can Drive Up To 10 LSTTL Loads
TA –40°C to 85°C –55°C to 125°C
PDIP – N SOIC – D
SOP – NS SSOP – DB
TSSOP – PW CDIP – J CFP – W LCCC –FK
ORDERING INFORMATION
PACKAGE (1)
ODERABLE PART NUMBER
(TOP VIEW)
SN54HC04...FK PACKAGE (TOP VIEW)
4B
VCC
NC
1A
1B
1A 1 1B 2 1Y 3 2A 4 2B 5 2Y 6 GND 7
14 VCC 13 4B 12 4A 11 4Y 10 3B 9 3A 8 3Y
3 2 1 20 19

SN54AHCT541中文资料

SN54AHCT541中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9685801Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9685801QRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 5962-9685801QSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN74AHCT541DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74AHCT541DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT541NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT541NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHCT541PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74AHCT541PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54AHCT541FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AHCT541J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54AHCT541W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SNJ54LS14FK中文资料

SNJ54LS14FK中文资料

InputV T OutputPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9665801Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9665801QCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9665801QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC 5962-9665801VCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9665801VDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC JM38510/31302BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN5414J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS14J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSN7414D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414DE4ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414DRE4ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7414N3OBSOLETE PDIP N14TBD Call TI Call TISN7414NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414NSRE4ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14DBR ACTIVE SSOP DB142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14DBRE4ACTIVE SSOP DB142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS14N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS14NE4ACTIVE PDIP N1425TBD Call TI Call TISN74LS14NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5414J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5414W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS14FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS14J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS14W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

华宝空调红外遥控编码资料

华宝空调红外遥控编码资料

华宝空调红外遥控编码资料简介华宝空调是一款广泛使用的家用空调品牌,它提供了方便的红外遥控功能,使得用户可以轻松控制空调的各种设置。

本文将介绍华宝空调红外遥控编码资料,包括红外遥控编码的原理、常用编码格式、编码数据的解析和使用方法等。

红外遥控编码原理红外遥控编码是通过发送特定的红外脉冲信号来实现对设备的控制。

华宝空调红外遥控编码原理基于脉冲宽度调制(PWM)技术,即通过调整脉冲信号的宽度来表示不同的控制指令。

常用编码格式华宝空调红外遥控编码使用了一种常见的编码格式,即NEC编码格式。

NEC编码格式是一种广泛应用于红外遥控领域的标准编码格式,它使用了32位二进制数据表示一个完整的红外遥控指令。

NEC编码格式的具体结构如下: - Header:8位数据,用于表示一个遥控指令的开始。

- Address:8位数据,用于表示遥控器的地址。

- Command:8位数据,用于表示具体的遥控指令。

- Inverted Command:8位数据,用于表示Command的反码。

编码数据的解析要解析华宝空调红外遥控编码数据,可以按照以下步骤进行: 1. 接收红外遥控编码数据。

2. 解析Header,判断是否为一个完整的红外遥控指令。

3. 解析Address,获取遥控器的地址。

4. 解析Command,获取具体的遥控指令。

5. 对Command进行处理,执行相应的操作。

使用方法要使用华宝空调红外遥控编码,可以按照以下步骤进行: 1. 获取红外遥控编码数据。

2. 解析编码数据,获取遥控指令。

3. 根据遥控指令,执行相应的操作,如调整温度、风速、模式等。

下面是一个示例代码,演示如何使用华宝空调红外遥控编码进行温度调节:# 导入红外遥控库import infrared_remote_control as irc# 获取红外遥控编码数据data = irc.get_infrared_data()# 解析编码数据header = irc.parse_header(data)address = irc.parse_address(data)command = irc.parse_command(data)# 判断遥控指令类型if command == "temperature_up":# 温度增加temperature = irc.get_current_temperature()irc.set_temperature(temperature + 1)elif command == "temperature_down":# 温度减少temperature = irc.get_current_temperature()irc.set_temperature(temperature - 1)else:# 其他指令pass总结华宝空调红外遥控编码资料介绍了红外遥控编码的原理、常用编码格式、编码数据的解析和使用方法。

SN54LS649JT中文资料

SN54LS649JT中文资料

Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor does TI warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.Copyright © 1996, Texas Instruments IncorporatedTexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

CD54HC08中文资料

CD54HC08中文资料

M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
1
元器件交易网 CD54HC08, CD74HC08, CD54HCT08, CD74HCT08
Pinout Functional Diagram
CD54HC08, CD54HCT08, (CERDIP) CD74HC08
(PDIP, SOIC, TSSOP) CD74HCT08 (PDIP, SOIC) TOP VIEW
7ns
at
VCC
=
5V,
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads

SMCJ54CA中文资料

SMCJ54CA中文资料
@ TA = 25°C unless otherwise specified Symbol PPK IFSM VF Tj, TSTG Value 1500 200 3.5 -55 to +150 Unit W A V °C
B
Dim A B C D
SMC Min 5.59 6.60 2.75 0.15 7.75 0.10 0.76 2.00 Max 6.22 7.11 3.18 0.31 8.13 0.20 1.52 2.62
元器件交易网
SMCJ5.0(C)A - SMCJ170(C)A
1500W SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR Features
· · · · · · · 1500W Peak Pulse Power Dissipation 5.0V - 170V Standoff Voltages Glass Passivated Die Construction Uni- and Bi-Directional Versions Available Excellent Clamping Capability Fast Response Time Plastic Case Material has UL Flammability Classification Rating 94V-0 Case: SMC, Transfer Molded Epoxy Terminals: Solderable per MIL-STD-202, Method 208 Polarity Indicator: Cathode Band (Note: Bi-directional devices have no polarity indicator.) Marking: Date Code and Marking Code See Page 3 Weight: 0.21 grams (approx.)

jsfddn5qhafgc规格书

jsfddn5qhafgc规格书

jsfddn5qhafgc规格书
JSFDDN5QHAFGC规格书是一款非常实用的设备,它能够应用于多种场合,如工厂、医院、商场等。

下面我们来详细了解一下这款产品的规格和功能。

首先,JSFDDN5QHAFGC规格书的尺寸为100x80x50mm,重量为150g,非常轻便,方便携带和安装。

它的外壳采用优质的ABS材料制成,具有很强的耐用性和防护性,可以很好地保护内部元件。

其次,JSFDDN5QHAFGC规格书具有多种功能。

它支持各种类型的传感器,如温度、湿度、气压、光线等传感器,可以监测环境的各种参数,并将数据实时传输到云端,方便用户进行远程监测和控制。

同时,它还可以进行语音播报,支持多种语言和音量调节,可以很好地满足用户的需求。

除此之外,JSFDDN5QHAFGC规格书还具有丰富的接口,如USB、WiFi、Ethernet等接口,可以方便地连接其他设备或网络,实现更
多的功能和应用。

同时,它还支持多种操作系统,如Android、iOS、Windows等,可以很好地适应不同的环境和需求。

总的来说,JSFDDN5QHAFGC规格书是一款非常实用和多功能的设备,它可以广泛应用于各种场合,如工业、医疗、商业等领域。

通过它的监测和控制,可以实现环境的优化和智能化,提高工作效率和生产效益。

如果你想了解更多关于JSFDDN5QHAFGC规格书的信息,欢迎访问我们的官网或联系我们的客服。

- 1 -。

煤矿机电设备检修质量标准

煤矿机电设备检修质量标准

煤矿机电设备检修质量标准目录I。

固定设备1。

通用部分-—------—--———-———--———--———-————-——-—--——------—--—-—-————-———-—--——-——-----——--—-—-———--—-———-—-12.主要提升机-———--—-——-—-—---—----————--———-—-----—————--——-——-—-——--———-————————--—-———----—---——--———-—-—73。

一般绞车-——---—---—-—-—-———————-———-—--—--—-——--——-----——---—-—--—-——-—--—-——--—-----————---——-——---———-—114。

主要扇风机—-—---------—---------——-———---——-—-——-—-———-—-—-—————-—---———————--—-———-——---—-———-——-——————135。

水泵——---——---——————-—-——--—--—-——-—-————-—-———-—-———————-——————-—----———-------—-————--————--——-—-———--———156.空气压缩机——--——--——--—-—---———----————-—----—---——-—-——--—-———-—-----——--—--—--——-—--—----——--——--—---—177。

锅炉----—-----——-——-———--—-—-—---——--—--—--———----————-———-—-——-——--————----—--—---—-——-—----—---————---———20II。

运输设备1.通用部分-—----—---—-—--———---——---—---——-——---—-———--—-—---——-——-----———-——---—----——-—-—---—---—-——--—-—242。

SNJ54LS123FK中文资料

SNJ54LS123FK中文资料

PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.1POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 752657 POST OFFICE BOX 655303 • DALLAS, TEXAS 752658POST OFFICE BOX 655303 • DALLAS, TEXAS 752659 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-7603901VEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 5962-7603901VFAACTIVE CFP W 161None Call TI Level-NC-NC-NC 7603901EA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 7603901FA ACTIVE CFP W 161None Call TI Level-NC-NC-NC JM38510/01203BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401B2A ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC JM38510/31401BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401BFAACTIVE CFP W 161None Call TI Level-NC-NC-NC SN54122J OBSOLETE CDIP J 14None Call TI Call TISN54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN74122N OBSOLETE PDIP N 14None Call TI Call TISN74123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS122D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS122N3OBSOLETE PDIP N 14None Call TI Call TISN74LS122NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123D ACTIVE SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123DR ACTIVE SOIC D 162500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123J OBSOLETE CDIP J 16None Call TI Call TISN74LS123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS123NSR ACTIVE SO NS 162000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SNJ54122J OBSOLETE CDIP J 14None Call TI Call TISNJ54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54123W ACTIVE CFP W 161None Call TI Level-NC-NC-NC SNJ54LS123FK ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC SNJ54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54LS123WACTIVECFPW161NoneCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.PACKAGE OPTION ADDENDUM28-Feb-2005Addendum-Page 1元器件交易网OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.PACKAGE OPTION ADDENDUM 28-Feb-2005Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

遥控器资料查询

遥控器资料查询

M50431-101SP TMP47C433AN M50453/431-101SP M50453/431-101SP M50453/431-101SP PCA84C440/504/640/641 PCA84C440/504/640/641 PCA84C440/504/640/641 TMP47C432/433/434AN TMP47C432/433/434AN M50436-560SP PCA84C440/504/640/641 M34300N4-012 TMP47C432/433/434AN M50436-560SP M50453/431-101SP TMP47C432/433/434AN M34300N4-012 M50453/431-101SP
127
长虹
K8B
TC901C K9D
TC9012 SAA3010T SAA3010
131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176
遥控器IC型号 遥控器 型号 20142 D6600 D6600 D6600 D6600 D6600
电视机CPU型号 型号 电视机
TC-9028-021 SAA3010 SAA3010 SAA3010 SAA3010
LUKS-5140-M2
SAA3010 SAA3010
TC9012-011
TC9012-011
TMP47C433AN TMP47C433AN TMP47C433AN-3849 TMP47C433AN TMP47C433AN TMP47C433AN TMP47C433AN TMP47C433AN M50436-560SP M50436-560SP PCM84C640/CH05001

BAT54A中文资料

BAT54A中文资料

CJ
-
7.6
10
trr
-
-
5.0
Unit Volts Vdc
uAdc pF nS
REV. : 0
Zowie Technology Corporation
Zowie Technology Corporation
BAT54
820
+10 V
2k 100uH IF 0.1uF
FIGURE 1. RECOVERY TIME EQUIVALENT TEST CIRCUIT
Rating Reverse Voltage Forward Power Dissipation @ TA=25oC Derate above 25oC Operating Junction Temperature Range Storage Temperature Range
Symbol VR
PF
2. Input pulse is adjusted so IR(peak) is equal to 10mA. 3. tp » trr
iR(REC) = 1mA
OUTPUT PULSE (IF = I R = 10 mA; measured
at iR(REC) = 1mA
FIGURE 2. FORWARD VOLTAGE
-
0.22
0.24
-
0.29
0.32
VF
-
0.35
0.40
-
0.41
0.50
-
0.52
1.0
Reverse Leakage ( VR=25 Vdc )
IR
-
0.5
2.0
Diode Capacitance ( VR=1.0, f=1.0MHZ )

HSJ08电机驱动芯片数据手册_V1.2

HSJ08电机驱动芯片数据手册_V1.2


AGND
过热保护电路
6 AGND
VDD 4
VDD



OUTA 8


PGND VDD



OUTB 5


PGND
7 PGND
INB
OUTA
OUTB
L
Z
Z
L
H
L
H
L
H
H
L
L
输入信号
INA L INB
正转
H
L
反转
L
H
刹车
H
L
H
待机
功能 待机 正转 反转 刹车
马达两端电压 VDD
0(VOUTA-VOUTB )
逻辑电源 VCC 对地电容 C2 必须至少需要 4.7uF,实际应用时不需要靠近芯片单独添加一个电容,可以与其 它控制芯片(RX2、MCU)等共用。如果 VCC 对地没有任何电容,当电路因过载进入过热保护模式后,电路可 能会进入锁定状态。进入锁定状态后,必须重新改变一次输入信号的状态,电路才能恢复正常。只要 VCC 对地有超过 4.7uF 电容,电路就不会出现锁定状态。
12节锂电池供电的马达驱动订购信息产品型号hsj08封装sop8工作温度2085rev1220140216hsj08引脚排列引脚定义vccoutainapgndinbagndvddoutb引脚名称vccinainbvddoutbagndpgndouta输入输出引脚功能描述逻辑控制电源端正转逻辑输入反转逻辑输入功率电源端反转输出逻辑控制电路接地端输出功率管接地端正转输出功能框图vccvccvddina125k电平转换电路agndvccpgndoutainb125kpgndvdd电平转换电路agndoutbpgnd逻辑真值表ina功能待机反转刹车典型波形示意图ina输入信号inb待机马达两端电压vdd0voutavoutbvddrev1220140216hsj08绝对最大额定值ta25参数最大逻辑控制电源电压最大功率电源电压最大外加输出端电压最大外加输入电压最大峰值输出电流最大功耗结到环境热阻工作温度范围储存温度焊接温度esd注注

中文四版-SMC样本

中文四版-SMC样本
带锁 销钉式 带耐强磁场的磁性开关 带耐强磁场的磁性开关 带耐强磁场的磁性开关 紧凑型 基本型 带气缓冲 双出杆型 滑动装置·内置液压缓冲器 伺服气缸 磁偶式 磁偶式·滑尺型/球轴承 磁偶式·直接安装型
2.5, 4
CAT.C06-02A
6, 10, 15
CAT.C06-02A
6, 10, 16
CAT.C04-01A
错误内容 产品规格变更
改正日期 06年8月
型号表示错误,易造成选型错误 06年8月
螺纹表示错误,易造成选型错误 06年8月
注解错误,易造成选型错误
07年11月
产品尺寸错误,易造成选型错误 07年8月
内容更新
07年11月
内容更新
07年11月
产品尺寸错误,易造成选型错误 磁性开关变更 词汇更正、录入错误
CAT.ES20-152B CAT.ES20-177A CAT.E256A CAT.ES20-179B CAT.E216B CAT.ES20-95B CAT.ES20-157B P-1991-6 CAT.ES20-160A CAT.E204A CAT.ES20-159A CAT.ES20-159A CAT.ES20-159A CAT.ES20-147A
9
f
B1
h+
□C
ZZ + + 行程
□B
A KF N H
S + 行程 ZZ + 行程
N M
(mm)
缸径 行程范围 (mm)
A AL □B B1 □C D E F G H1
J
(mm) 无防护套 带防护套
无防护套
带防护套
K KA M MM N P S
H ZZ e f h

SN54LS685FK中文资料

SN54LS685FK中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)84151012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 8415101RA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 8415101RA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 8415101SA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC 8415101SA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC 84152012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 8415201RA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 8415201SA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC 84153012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 8415301RA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 8415301SA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN54LS682J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54LS682J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54LS684J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54LS688J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN74LS682DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS682N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS682NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS682NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS682NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS682NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LS684DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS684DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS684DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS684DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS684N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS684NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS684NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS686DW OBSOLETE SOIC DW24TBD Call TI Call TISN74LS686NT OBSOLETE PDIP NT24TBD Call TI Call TISN74LS687NT OBSOLETE PDIP NT24TBD Call TI Call TISN74LS687NT OBSOLETE PDIP NT24TBD Call TI Call TISN74LS688DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS688DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS688DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS688DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS688N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS688N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS688NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS688NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS688NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54LS682FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS682FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS682J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS682J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS682W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SNJ54LS682W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SNJ54LS684FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS684J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS684W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SNJ54LS688FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS688J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS688W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SNJ54F00W中文资料

SNJ54F00W中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9757701Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9757701QCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9757701QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC JM38510/33001B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC JM38510/33001BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC JM38510/33001BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC JM38510/33301B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SN54F00J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSN74F00D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F00DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F00DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F00DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F00N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74F00N3OBSOLETE PDIP N14TBD Call TI Call TISN74F00NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74F00NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F00NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54F00FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCSNJ54F00J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54F00W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SNJ5407FK中文资料

SNJ5407FK中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)JM38510/00803BCA ACTIVE CDIP J141None Call TI Level-NC-NC-NC JM38510/00803BDA ACTIVE CFP W141None Call TI Level-NC-NC-NC SN5407J ACTIVE CDIP J141None Call TI Level-NC-NC-NC SN5417J ACTIVE CDIP J141None Call TI Level-NC-NC-NCSN7407D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7407DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7407J OBSOLETE CDIP J14None Call TI Call TISN7407N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7407N3OBSOLETE PDIP N14None Call TI Call TISN7407NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7417D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7417DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7417N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7417N3OBSOLETE PDIP N14None Call TI Call TISN7417NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSNJ5407FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NCSNJ5407J ACTIVE CDIP J141None Call TI Level-NC-NC-NCSNJ5407W ACTIVE CFP W141None Call TI Level-NC-NC-NCSNJ5417J ACTIVE CDIP J141None Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

杰斐锋洗衣机电子部件清单说明书

杰斐锋洗衣机电子部件清单说明书

Number Per Unit
1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 2 1 1 1 1 1 1
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Description
Top Sign Display Top Enclosure Fan 3" Plastic 2U-Y6914 J4R 120V MTR KIT Motor-240V Wire Housing Motor Cushion Topliner Magnetic Catch Magnet Cup-Magnet Bushing SB-375 Kettle Cover Assembly Blade Agitator Spring Latch Socket Cover Tab Kettle Latch Assembly Hair Pin Guide Cover Lamp (130V Tuff Bond, 50 W) Lamp (230V) Not Available Hinge Bracket Shaft-Agitator Pull Door Door and Hinge Assembly Hair Pin Pin Hinge Plated Bracket Hinge Right Collar-Agitator Body Bracket Hinge Left Lower Door Element 50W 120V Element 50W 240V Wire Cover Corner Post Left Bottom Corner Post Right Lead-In Cord Lead-In Cord 230V
Some items are included for illustrative purposes only and in certain instances may not be available.
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PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9682101Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9682101QCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9682101QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC 5962-9682101VCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9682101VDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSN74AHCT08D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74AHCT08DBLE OBSOLETE SSOP DB14TBD Call TI Call TISN74AHCT08DBR ACTIVE SSOP DB142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74AHCT08DGVR ACTIVE TVSOP DGV142000Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74AHCT08DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74AHCT08N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT08NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74AHCT08NSRG4ACTIVE SO NS142000TBD Call TI Call TISN74AHCT08PW ACTIVE TSSOP PW1490Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74AHCT08PWLE OBSOLETE TSSOP PW14TBD Call TI Call TISN74AHCT08PWR ACTIVE TSSOP PW142000Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74AHCT08RGYR ACTIVE QFN RGY141000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SNJ54AHCT08FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AHCT08J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54AHCT08W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

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