品质系统常见英文

品质系统常见英文简介
1.QC : quality control 质量管理
2.IQC : incoming quality control 进料质量管理
3.OQC : output quality control 出货质量管理
4.PQC : process quality control 制程质量管理也称IPQC : in process quality control
5. AQL : acceptable quality level 允收标准
6.CQA: customer quality assurance 客户品质保证
7. MA : major defect 主要缺点8. MI : minor defect 次要缺点
9. CR :critical defect 关键缺点10. SMT : surface mounting technology表面粘贴技术
11. SMD :surface mounting device 表面粘贴程序 SMC : surface mounting component 表面粘贴组件
12.ECN : engineering change notice 工程变更通知
13.DCN : design change notice 设计变更通知14.PCB : printed circuit board 印刷电路板
15.PCBA : printed circuit board assembly装配印刷电路板
16. BOM : bill of material 材料清单
17. BIOS : basically input and output system基本输入输出系统
18. MIL-STD-105E : 美国陆军标准,也称单次抽样计划.
19. ISO : international standard organization 国际标准化组织
20. DRAM: 内存条21.Polarity : 电性22. Icicles : 锡尖23. Non-wetting : 空焊24. Short circuit : 短路25. Missing component : 缺件
26. Wrong component :错件27 . Excess component :多件
28. Insufficient solder :锡少29 . Excessive solder :锡多
30. Solder residue: 锡渣31. Solder ball : 锡球32. Tombstone : 墓碑33 . Sideward：侧立34. Component damage :零件破损35. Gold finger:金手指
36. SOP : standard operation process 标准操作流程
37. SIP : standard inspection process 标准检验流程
38 .The good and not good segregation :良品和不良品区分
39. OBW : on board writer 熸录BIOS 40 . Simple random sampling : 简单随机抽样41. Histogram : 直方图42 . Standard deviation : 标准差
43. CIP : Continuous improvement program 持续改善计划
44. SPC : Statistical process control 制程统制45 . Sub-contractors : 分包商
46. SQE: Supplier quality engineering 47. Sampling sample :抽样计划
48. Loader : 治具49 . QTS: Quality tracking system 质量追查系统
50. Debug : 调试51 . Spare parts: 备用品
52. Inventory report for : 库存表53 . Manpower/Tact estimation 工时预算
54. Calibration : 校验55 . S/N :serial number 序号
56. Corrugated pad : 波纹垫57 .Takeout tray: 内包装盒
58. Outer box : 外包装箱 59. Vericode : 检验码
60. Sum of square : 平方和61 . Range : 全距
62. Conductive bag : 保护袋63 . Preventive maintenance :预防性维护
64. Base unit : 基体65 . Fixture : 制具
66. Probe : 探针67 . Host probe : 主探针
68. Golden card : 样本卡69 . Diagnostics program : 诊断程序
70. Frame : 屏面71 . Lint-free gloves : 静电手套
72 .Wrist wrap : 静电手环73 . Target value : 目标值
74. Related department : 相关部门75. lifted solder 浮焊
76.plug hole孔塞77. Wrong direction 极性反
ponent damage or broken 零件破损79.Unmeleted solder熔锡不良
80.flux residue松香未拭81.wrong label or upside down label贴反
82. mixed parts机种混装83. poor solder mask绿漆不良
84. oxidize 零件氧化85.stand off height浮高
86. IC reverse IC反向87.supervisor课长
88. Forman组长89. WI=work instruction作业指导
90. B.P.V: 非擦除状态91. Internal notification: 内部联络单
92. QP :Quality policy质量政策93. QT: Quality target 品质目标
94. Trend:推移图95.Paret柏拉图
96. UCL: Upper control limit管制上限97.LCL:Lower control limit管制下限
98. CL: Center line中心线99.R.T.Y: Rolled throughout yield直通率
100. PPM: Parts per million 不良率101.DPU: Defects per unit 单位不良率
102.Resistor: 电阻103.Capacitor:电容
104. Resistor array : 排阻105. Capacitor array: 排容
106. DIODE: 二极管107.SOT: 三极管
108. Crystal:震荡器109. Fuse:保险丝
110.Bead: 电感111.Connector:联结器
112.ADM: Administration Department行政单位 113. CE: Component Engineering 零件工程
114CSD :Customer Service Department客户服务部15. ID: Industrial Design工业设计
116.IE: Industrial Engineering工业工程 117. IR: Industrial Relationship工业关系
118. ME: Mechanical Engineering机构工程
119. MIS :Management Information System信息部120. MM: Material Management资材
121. PCC: Project Coordination/Control专案协调控制
122. PD: Production Department生产部
123. PE: Product Engineering产品工程 124. PM: Product Manager产品经理
125. PMC: Production Material Control生产物料管理
126. PSC: Project Support & Control产品协调 127.Magnesium Alloy:镁合金
128. Metal Shearing:裁剪129.CEM:Contract Electronics Manufacturing电子制造服务企业EMS: Electronics Manufacturing Services
130. ERP: Enterprise Resource Planning 企业资源规划
SCM+CRM+ERP+EAI=Network direct TM links procurement, production, Logistics and sales 采购,生产,后勤管理及市场营销的融合
EAI: Enterprise application Integration 企业应用系统整合
CRM: Customer Relationship Planning 客户服务规划
SCM : Supply chain management 供应链管理
131. OJT: On job training 在职培训 132.Access Time: 光盘搜寻时间
133. B2CEC:Business to consumer electronic commerce 企业对消费者的电子商务
B2BEC:Business to business electronic Commerce 企业间的电子商务
L:Copper Clad Laminate 铜箔基板135. Intranet: 企业内部通讯网路
136. ISP: Internet Service Provider网络服务提供者 ICP: Internet Content Provider 网络内容提供者
137. GSM: Global System for Mobile Communication 泛欧数字式行动电话系统
GPS: 全球卫星定位系统138. Home Page: 网络首页139.Video Clip:影像文件
140. HTML:超文标记语言141.Domainname: 网域名称
142. IP: 网络网域通讯协议地址143.Notebook:笔记型计算机
144. VR: Virtual Reality虚拟实境
145. WAP: Wireless Application Protocol无线应用软件协议
146. LAN : Local area network局域网络WWW: World Wide Web世域
网WAN: Wide Area Network 广域网络
147. 3C: Computer, Communication, Consumer electronic 计算机, 通讯, 消费性电子三大产品的整合
rmation Supplier Highway:信息高速公路 149.UPS:Uninterrupted power system
不断电系统
150.Processed material: 流程性材料151.Entity/Item:实体
152.Quality loop:质量环153.Quality losses: 质量损失154.Corrective action:纠正措
施
155. Preventive action:预防措施
156.PDCA:Plan/Do/Check/Action计划/实施/检查/处理 157. Integrated circuits(IC):集成电路
158.Application program: 应用程序 159.Utilities:实用程序
160.Auxiliary storage/Second storage:;辅助存储器 161.Silicon chip:硅片
162Diskette drive:软驱163.Display screen/Monitor:显示器 164.Foreground:前面
165.Montherboard:母板166.Mermory board: 内存板167.Slot:插槽
168.Bus:Data-bus/address-bus/Control bus: 总线/数据总线/地址总线/控制总线
169.Plotter:绘图170.MPC:Multimedia personal computer多媒体
171.Oscillator:振荡器172.Automatic teller terminal:自动终端(出纳)机
173.Joystick port:控制端口 174.VGA: Video Graphics Array显示卡
175.Resolution:分辨率176.Register:寄存器
177.ISA: Industry Standard Architecture: 工业标准结构 178.EISA: Extended Industry Architecture
179.Adapter: 适配器180.Peripheral:外部设备
181.Faxmodem:调制解调器 181.NIC:Network interface card网络接口卡
182. SCSI: Small computer system interface
183. VESA: Video Electronic Standards Association
184. SIMM: Single in-line memory module 单排座存储器模块(内存条)
185.Casing:外箱186.Aluminum:铝质187.Ceramic: 陶瓷的188.Platter:圆盘片
189.Actuator:调节器190.Spindle:轴心191.Actuation arm: 存取臂
192.Default code: 缺省代码193.Auxiliary port:辅助端口
194. Carriage return : 回车195.Linefeed:换行
196. ASCII: American Standard Code for Information Interchange
197. Video analog: 视频模拟
198. TTL: Transistor- Transistor logic晶体管-晶体管逻辑电路
199.Three-prong plug:三芯电插头200.Female connector:连接插座
201.Floppy disk:软盘202.Output level: 输出电平
203.Vertical/Horizontal synchronization: 场/行同步204.H(Horizontal)-Phase:行相位
patible:兼容机206.Hardware Expansion Card: 硬件扩充卡
207.Buffer:缓冲
208.CRM:Customer relationship Management 客户关系管理
209.WIP: Work in process半成品 210.Waiver:特别采用
211.CXO系列—CEO Chief Executive Office首 COO :Chief Operating Office
CFO Chief Finance Officer CBO Chief Business Officer
CTO Chief Technology Officer CIO Chief Information Officer
CGO Chief Government Officer
212. NASDAQ: 纳斯达克证券市场NASDAQ Automated Quotation system 213.VC: Venture Capital 风险投资
214. PDA: Personal Date Assistant个人数字助理PLA: Personal Information Assistant个人信息助理
215. PPAP: Advanced Product Quality Planning and Control Plan 生产性零组件核准程序
216. FMEA: Potential Failure Mode and Effects Analysis 失效模式与效应分析217. MSA: Measurement Systems Analysis 量测系统分析
218. QAS: Quality System Assessment 质量系统评鉴
219. Cusum: 累计总合图220. Overall Equipment Effectiveness设备移动率
221. Benchmarking: 竞争标杆 Analysis of motion/Ergonomics动作分析/人体工程学
222. Roka Yoke 防错法MCR: machine capability ratio 机器利用
率
223. Mistake Proofing 防呆法Taguchi methods田口式方法
224, Vertical integration垂直整合Surveillance定期追踪审查
225. EMS: Electronics Manufacturing Supply-chain
226.Cause & Effects charts特性要因图227. Scatter: 散布图Fool-Proof System防呆系统
228 VE: Value Engineering 价值工程；QFD: Quality Function Development 质量机能展开
229. Arrow Chart 箭头图法Affiliate Chart亲和图法
230. PDPC: Process Decision Program Chart System Chart系统图法
231. Relation Chart 关边图法 Matrix Chart矩阵图法
232. Matrix Data Analysis 矩阵数据分析法
234. Brain-storm 脑风暴法JIT: Just In Time:及时性生产模拟
235. Deming Prize: 戴明奖Prototype技术试作
236. BPM: Business Process Management .业务流程管MBO目标管理
237. MBP:方针管理FTA:故障树分析QSCV: 服务质量
238. IPPB: Information 情况planning策划Programming规划 Budget预算239. EQ: Emotion Quotient:情商IQ: Intelligence Quotient:智商
240. Implied Needs:隐含要求Specified Requirement:规定要求
241. Probation:观察期Incoming Product released for urgent production 紧急放行242.Advanced quality planning 先进的质量策划
243. AOQ: Average Outgoing Quality 平均检出质量
AOQL: Average Outgoing Quality Limit 平均检出质量界限
244.Approved Supplier List 经核准认可的供应商名单
245.Attribute date 特征Benchmarking 基准点Calibration 校准
246.Capable process 工序能力Capability Index 工序能力指数Capability ratio 工序能力率
247.CHANGE CYCLE TIME 修改的时间周期 Continuous improvement 持续改进248. Control plans 控制策划Cost of quality 质量成本
249. Cycle time reduction 减少周期时间
250. Design of experiments 实验设计 Deviation / Substitution 偏差/ 置换251. ESD: Electrostatic discharge 静电释放
252. EH&S: Environmental, Health, and Safely 环境,健康.安全
253. ESS: Environmental Stress Screening 环境应力筛选
254. FMEA: Failure Mode Effect Analysis 失误模式效应分析
255. First Article approval 产品的首次论证256. First pass yield 一次性通过的成品率257. First sample inspection 第一次样品检验
258. FMECA: Failure mode effect and critically analysis 失误模式,效应及后果分析259. Gauge control 测量仪器控制
260. GR&R: Gauge repeatability and reproducibility 测量仪器重复性和再现性
261. HALT: Highly Accelerated Life Test 高加速寿命试验
262. HAST: Highly Accelerated Stress Test 高加速应力试验
263. IN-CONTROL PROCESS 受控制工序264. INDUSTRIAL AVERAGE 工业平均数265. JIT (just in time) manufacturing (实时)制程
266. Key characteristic 关健特征267. Key component 关健构件
268. Life Testing 寿命试验 269. Lot traceability 批量可追溯性
270. Material review board 原材料审查部门MCR: machine capability ratio 机械能力率271. NONCONFORMANCE 不符合272. OUT-OF-CONTROL PROCESS 失控工序273. Pilot Application 试产(试用) 274. PPM: Parts per million 百万分之一
275. Preventive VS detection 预防与探测 Preventive maintenance 预防维护
276. Process capability index 工序能力指数277. Process control 工序控制
278. Process improvement 工序改进279. Process simplification 过程简化
280. Quality Clinic Process Chart (QCPC) 质量诊断过程图
281. Quality information system 质量资料体系282. Quality manual 质量手册
283. Quality plan 质量计划284. Quality planning 质量策划
285. Quality policy 质量方针286. Quality system 质量体系
287. Reliability 可靠性RUN Chart 趋势表288. Skill Matrix 技能表
289. Statistical quality control (SQC) 统计质量控制
290. Teamwork 团队工作291. Total quality management 全面质量管理
292. Variable data 变量数据 293. Variation 影响变量
294. Value Analysis 价值分析 295. Visual Factory 形象化工厂
296. Survey Instructions 调查指引297. Profile 概况298. Improvement Plan 改进计划299. Evaluation 评估 300. implementation 实施301. Compliance 符合
302. Supplier Audit Report 供方审核报告303. Site Audit 现场审核
304. Typical agenda 典型的议事日程
305. Internal and external failure costs 内部和外部的失误成本
306. Failure rate percentage 失误百分率
307. Productivity (output / input) 生产率(产出/投入)
308. Customer complaints 客户投诉
309. Customer satisfaction indices 客户满意度指数
310. Root cause analysis of failures 失误根原分析。